A cooling device and cooling method suitable for electronic devices with high heat flux density.

Abstract

This invention discloses a cooling device suitable for high heat flux density electronic devices, comprising a thermoelectric conversion device and a rapid cooling device disposed on both sides of the high heat flux density electronic device. The thermoelectric conversion device includes a semiconductor thermoelectric generator, a finned plate, a temperature sensor, and a fan sequentially attached from the heat source side, and the semiconductor thermoelectric generator, finned plate, temperature sensor, and fan are installed in a first chamber. The rapid cooling device includes a liquid cooling plate attached to the non-heat source side, and the liquid cooling plate is installed in a second chamber. The second chamber also houses a battery, a liquid pump, and a controller. The battery is connected to the semiconductor thermoelectric generator, fan, liquid pump, controller, and an external power supply system. The inlet of the liquid cooling plate is connected to the outlet of the liquid pump. The controller is connected to the fan, temperature sensor, and liquid pump. This solution can avoid coolant leakage caused by thermal shock to the connectors of electronic devices due to the alternating hot and cold temperatures of the coolant.

Description

Technical Field

[0001] This invention relates to cooling systems for electronic devices, and more specifically to a cooling device and cooling method suitable for electronic devices with high heat flux density. Background Technology

[0002] With the development of technology, the miniaturization and multifunctionality of electronic devices have placed higher demands on their heat dissipation. Currently, the main methods for cooling electronic devices fall into the following four categories:

[0003] The first type involves directly cooling the device by placing heat-conducting materials or cooling equipment on its exterior. This type of technology is suitable for electronic devices that are relatively thin (e.g., mobile phones) and generate little heat, primarily balancing heat dissipation and size. For example, in the prior art disclosed in CN111372422B, a multi-layer array jet microchannel cold plate with various depths and widths and high precision is fabricated by combining microchannel and jet cooling technologies. This improves upon existing manufacturing methods such as wire EDM, laser cutting, precision milling, chemical etching, and photolithography, which suffer from high cost and low precision. The array microchannel cold plate disclosed in this technology has advantages such as good heat exchange effect, uniform temperature distribution, and high precision.

[0004] For example, in the prior art with publication number CN109553908A, graphene and conventional fillers are used together as thermally conductive fillers to prepare graphene composite thermally conductive binders, which are used as thermally conductive interface materials directly or in combination with the substrate for heat dissipation of electronic devices.

[0005] The second category involves cooling the surface of electronic devices using heat pipe technology. However, firstly, the heat dissipation capacity of heat pipe heat exchange technology is limited, and secondly, the thermal resistance of heat pipe heat exchange is relatively large.

[0006] In the prior art disclosed in CN110505791A, a phase change heat dissipation agent is set up so that it evaporates at the hot end, condenses at the cold end, and flows back to the hot end to continue evaporating. Heat is dissipated through a heat pipe to reduce the overall weight of the heat dissipation device.

[0007] For example, in the prior art with publication number CN112799485A, heat is absorbed by a heat pipe to reduce the core temperature of the heat source of the electronic device, and the cold end of the heat pipe generates cooling through a semiconductor-assisted heat pump.

[0008] The third type involves creating miniature fluid channels inside the heat-conducting plate on the outside of the electronic device through etching or other methods, and then cooling the device with a cooling medium within the channels. However, this approach has two drawbacks: firstly, the thermal conductivity is still limited; secondly, the cooling capacity of the channels within the heat-conducting plate is limited, resulting in lower heat exchange.

[0009] As in the prior art disclosed in CN110146956B, micro-water pools are etched inside the PCB board, and heat from inside the optical module is conducted through a graphene heat dissipation film and then dissipated through copper heat-conducting pillars. However, firstly, the graphene heat dissipation film is made of single-layer graphene, which is not easy to form; secondly, this technical solution involves etching flow channels inside the board and exchanging heat through pure water at about 5°C placed inside. It is mainly suitable for integrated heat dissipation of embedded circuit boards with small heat dissipation, but not suitable for high heat density electronic devices with large heat dissipation.

[0010] The fourth type involves using air or water cooling to cool the surface of electronic devices made of thermally conductive materials. However, this type of solution generally suffers from problems such as thermal shock at the joints caused by the alternating hot and cold temperatures of the liquid, leading to leaks.

[0011] As in the prior art disclosed in CN110278694A, a heat-conducting device is used to transfer the heat of the electronic device to a graphite sheet, which then dissipates the heat, thus mitigating the problem of increased thickness caused by adding a heat sink and fan to the electronic device for heat dissipation. However, this technical solution is mainly suitable for thinner electronic devices, and it is also unsuitable for high-heat-density electronic devices with large heat dissipation.

[0012] The prior art published under CN105658018B also has leakage issues.

[0013] In summary, existing technologies for cooling high heat flux density electronic devices mainly face the following problems:

[0014] 1. Most of the publicly available technologies are applicable to electronic devices with relatively small heat dissipation, and they generally balance heat dissipation and size, taking into account weight reduction and portability. In the few existing technologies applicable to large heat dissipation, refrigerants are generally used to remove heat from the electronic device. These technologies often face the problem that the alternating hot and cold temperatures of the coolant can cause thermal shock to the connectors of the electronic device, leading to leakage.

[0015] 2. Among the publicly available technologies, there are few cooling systems that treat the same electronic device differently depending on the amount of heat dissipation. Summary of the Invention

[0016] Objectives of the Invention: One objective of the present invention is to provide a cooling device suitable for high heat flux density electronic devices that can prevent coolant leakage caused by thermal shock to the connectors of electronic devices after the coolant undergoes alternating hot and cold temperatures; another objective of the present invention is to provide a cooling method suitable for high heat flux density electronic devices, which can select different operating modes according to the heat dissipation.

[0017] Technical Solution: The cooling device of the present invention includes a thermoelectric conversion device and a rapid cooling device disposed on both sides of a high heat flux density electronic device; the thermoelectric conversion device includes a semiconductor thermoelectric generator, a finned plate, a temperature sensor, and a fan sequentially attached from the heat source side, the semiconductor thermoelectric generator, the finned plate, the temperature sensor, and the fan being installed in a first chamber; the rapid cooling device includes a liquid cooling plate attached to the non-heat source side, the liquid cooling plate being installed in a second chamber; the second chamber also houses a battery, a liquid pump, and a controller, wherein the battery is connected to the semiconductor thermoelectric generator, the fan, the liquid pump, the controller, and an external power supply system; the inlet of the liquid cooling plate is connected to the outlet of the liquid pump; the controller is connected to the fan, the temperature sensor, and the liquid pump.

[0018] The outlet of the liquid cooling plate is connected to the inlet of an external refrigerant storage tank, and the outlet of the external refrigerant storage tank is connected to the inlet of the liquid pump, thereby forming a liquid cooling cycle.

[0019] The first chamber includes a first outer shell and a second outer shell that are fitted together. The second chamber includes a third outer shell and a fourth outer shell that are fitted together. Both the second and fourth outer shells have a hollow structure to improve heat dissipation.

[0020] The first outer shell has a step on one side adjacent to the semiconductor thermoelectric generator for fixing the semiconductor thermoelectric generator, and a step on the other side for fixing the finned plate, so as to achieve a stable connection between the semiconductor thermoelectric generator and the finned plate.

[0021] The liquid cooling plate has a meandering reflux channel inside. After the refrigerant enters the liquid cooling plate, it flows along the reflux channel and carries away the heat.

[0022] The present invention also includes a cooling method suitable for high heat flux density electronic devices, the cooling method being applied to a cooling device suitable for high heat flux density electronic devices, the cooling method comprising the following steps:

[0023] S1: Set two critical temperature values ​​for the heat source: the first heat source temperature T 1min Second heat source temperature T 1max , among which, T 1min <T 1max The actual measured temperature is recorded as T;

[0024] S2: The controller monitors the actual measured temperature T on the heating side of the heat source through a temperature sensor and compares the actual measured temperature T with the first heat source temperature T. 1min The temperature of the second heat source, T 1max The controller compares the results and controls the operation of the liquid pump and fan accordingly, thus entering different operating modes.

[0025] Rapid cooling mode: When the controller detects that the actual measured temperature T on the heat source side is greater than T0 via the temperature sensor. 1max At this time, the controller activates the liquid pump to introduce refrigerant into the liquid cooling plate, cooling the non-heating side of the heat source.

[0026] Thermal storage mode: When the controller detects that the actual temperature T on the heating side of the heat source is less than T through the temperature sensor... 1max And greater than T 1min When the controller turns on the fan, the thermoelectric generator uses the temperature difference between the heat source and the ambient temperature to generate electricity, which is then transmitted to the battery.

[0027] Cooling mode: When the controller detects that the actual temperature T on the heat source side is less than or equal to T through the temperature sensor. 1min When the controller shuts off the fan, the device dissipates heat to the surrounding air through natural convection.

[0028] Beneficial effects: Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0029] (1) When the temperature of the heating surface of the high heat flux density electronic device is low, the system stops operating and the electronic device dissipates heat to the air. When the temperature of the high heat flux density electronic device reaches the heat storage temperature (i.e., T1min < T < T1max), the heat storage system is turned on, and the fan is turned on through the controller 4. The thermoelectric generator uses the temperature difference between the heating side of the heat source and the ambient temperature to generate electricity and transmits the electrical energy to the battery through the wire. If the temperature difference between the fan 11 (i.e., room temperature) and the heat source temperature is less than the power generation temperature, that is, the temperature difference is insufficient to start the thermoelectric generator to generate current, the battery 5 supplies power to the fan, the thermoelectric cooler, and the water pump through the external power supply system. When the temperature of the high heat flux density electronic device rises, the present invention recovers the heat energy of the device through the thermoelectric generator.

[0030] (2) When the temperature of a high heat flux density electronic device is too high and reaches the rapid cooling temperature, the non-heating side of the high heat flux density electronic device is cooled by driving a semiconductor cooling chip. Ethylene glycol is used to cool the device through a liquid cooling plate. Compared with the method of directly liquid cooling the heating side of the high heat flux density electronic device, it has less impact on the high heat flux density electronic device and effectively improves the problem of thermal shock to the connector of the electronic device after the cooling liquid heat alternation, which leads to leakage. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the cooling device.

[0032] Figure 2 This is an exploded view of the cooling device components;

[0033] Figure 3 This is a schematic diagram of the liquid cooling plate structure;

[0034] Figure 4 This is a schematic diagram illustrating the working principle of the cooling device.

[0035] Figure 5 This is a flowchart illustrating the cooling method. Detailed Implementation

[0036] The technical solution of the present invention will now be described in detail with reference to specific embodiments and accompanying drawings.

[0037] like Figure 1 and Figure 2 As shown, the cooling device of the present invention includes a thermoelectric conversion device and a rapid cooling device, which are disposed on both sides of the high heat flux density electronic device 1 (i.e., heat source) to be cooled. The thermoelectric conversion device is attached to the heat-generating side of the heat source, and the rapid cooling device is attached to the non-heat-generating side of the heat source. The thermoelectric conversion device includes a semiconductor thermoelectric generator 9, a finned plate 10, a temperature sensor, and a fan 11, which are sequentially attached from the heat-generating side of the heat source. The semiconductor thermoelectric generator 9, the finned plate 10, the temperature sensor, and the fan 11 are installed in a first chamber. The first chamber includes a first outer shell 8 and a second outer shell 12, which are fitted together to form the first chamber. The rapid cooling device includes a liquid cooling plate 6 attached to the non-heat-generating side of the heat source. The liquid cooling plate 6 is installed in a second chamber, which also houses a battery 5, a liquid pump 3, and a controller 4. The second chamber includes a third outer shell 7 and a fourth outer shell 2, which are fitted together to form the second chamber. To improve heat dissipation, both the second outer shell 12 and the fourth outer shell 2 have a hollow structure. In this design, the first outer shell 8 has a rectangular frame structure, and the finned plate 10 has a rectangular shape. One side of the finned plate 10 is attached to the thermoelectric generator 9, and the other side dissipates heat through the finned plate 10. Optional materials for the finned plate 10 include aluminum and copper. The specific installation method for the thermoelectric generator 9 and the finned plate 10 is as follows: a step for fixing the thermoelectric generator 9 is provided on one side of the first outer shell 8 adjacent to the thermoelectric generator 9, and a step for fixing the finned plate 10 is provided on the other side. Fixing plates are provided on the upper surfaces of the second outer shell 12 and the fourth outer shell 2. During equipment installation, the heat source and cooling device are secured by fastening the fixing plates that pass through the upper surfaces of the second outer shell 12 and the fourth outer shell 2.

[0038] The specific structure of the semiconductor thermoelectric generator 9: The semiconductor thermoelectric generator 9 is generally rectangular. In principle, its hot side area should cover the heating side area of ​​the heat source as much as possible. If the heat on the heating side of the heat source is uniform, the semiconductor thermoelectric generator 9 should cover all heating side areas of the heat source. If the heat on the heating side of the heat source is concentrated in a certain area, such as the middle / upper / lower part of the side, the hot side area of ​​the semiconductor thermoelectric generator 9 should cover the concentrated area.

[0039] The operating temperature of the thermoelectric generator 9 should be selected based on the highest temperature achievable by the heating surface area of ​​the heat source and the lowest temperature of the operating area of ​​the device. For example, if the heating surface area of ​​the heat source can reach a maximum temperature of 90℃, and the lowest temperature of the operating area of ​​the device is -10℃, then the operating temperature range of the thermoelectric generator 9 can be selected as 35-110℃. Because the ceramic surface of the thermoelectric generator 9 is very brittle, extra care should be taken during installation or tightening to prevent ceramic breakage. When tightening the connection surfaces, a soft connecting material can be used to ensure more even load distribution and reduce pressure and stress. Silicone grease can also be used to reduce the thermal resistance of the mounting interface.

[0040] The first outer casing 8 has a rectangular frame structure. A step is provided on one side adjacent to the thermoelectric generator 9 for fixing the thermoelectric generator 9, and a step is provided on the other side for fixing the finned plate 10. The first outer casing 8 is used to fix the thermoelectric generator 9 and the finned plate 10, ensuring good contact between them during operation so that heat can be dissipated through the finned plate 10. The fixing effect also prevents relative displacement due to vibration of the entire device. The first outer casing 8 is not limited to the rectangular frame structure described in this invention; it can also be a top-bottom or left-right outer frame, fixed to the thermoelectric generator 9 and the finned plate 10 by connecting screws or welding. Optional materials for the first outer casing 8 include aluminum, copper, stainless steel, acrylic, or plastic.

[0041] like Figure 3 As shown, the liquid cooling plate 6 has a rectangular shape and a meandering return channel inside. Pagoda-shaped caps are welded to the inlet and outlet of the channel. After the refrigerant enters the liquid cooling plate 6, it flows along the return channel, carrying away heat.

[0042] like Figure 4As shown, the battery 5 is connected to the thermoelectric generator 9, fan 11, liquid pump 3, controller 4, and external power supply system. Specifically, the power cord of the thermoelectric generator 9 is connected to the first input power interface of the battery 5, the power cord of the fan 11 is connected to the first output power interface of the battery 5, the input power of the controller 4 is connected to the second output power interface of the battery 5 via a wire, the power cord of the liquid pump 3 is connected to the second output power interface of the battery 5, and the second input power interface of the battery 5 is connected to the external power supply system. The inlet of the liquid cooling plate 6 is connected to the outlet of the liquid pump 3; the outlet of the liquid cooling plate 6 is connected to the inlet of the external refrigerant tank, and the outlet of the external refrigerant tank is connected to the inlet of the liquid pump 3, thus forming a liquid cooling cycle. The controller 4 is connected to the fan 11, temperature sensor, and liquid pump 3. Specifically, the first control signal of the controller 4 is connected to the liquid pump 3 via a wire, the control signal of the temperature sensor is connected to the controller 4 via a wire, and the second control signal of the controller 4 is connected to the fan 11 via a wire.

[0043] The present invention also includes a cooling method suitable for high heat flux density electronic devices, which can be applied to the above-mentioned cooling devices, and the cooling method includes the following steps:

[0044] S1: Set two critical temperature values ​​for the heat source: the first heat source temperature T 1min Second heat source temperature T 1max , among which, T 1min <T 1max The actual measured temperature is recorded as T;

[0045] S2: Controller 4 monitors the actual measured temperature T on the heating side of the heat source through a temperature sensor, and compares the actual measured temperature T with the first heat source temperature T. 1min The temperature of the second heat source, T 1max The controller 4 compares the results and controls the operation of the liquid pump 3 and the fan 11 to enter different working modes.

[0046] Rapid cooling mode: When the controller 4 detects through the temperature sensor that the actual measured temperature T on the heating side of the heat source is greater than T... 1max At this time, controller 4 controls liquid pump 3 to turn on, introducing refrigerant into liquid cooling plate 6 to cool the non-heating side of the heat source. In this scheme, ethylene glycol is used as the refrigerant, but other refrigerants can also be used.

[0047] Thermal storage mode: When the controller 4 detects through the temperature sensor that the actual temperature T on the heating side of the heat source is less than T... 1max And greater than T 1min When the controller 4 controls the fan 11 to turn on, the semiconductor thermoelectric generator 9 generates electricity by utilizing the temperature difference between the heat source heating side and the ambient temperature, and transmits the electrical energy to the battery 5 through the wire.

[0048] Cooling mode: When the controller 4 detects that the actual temperature T on the heat source side is less than or equal to T through the temperature sensor. 1min When the controller 4 turns off the fan 11, the device dissipates heat to the surrounding air through natural convection.

[0049] like Figure 5 As shown, the working process of the cooling device of the present invention is as follows:

[0050] Step 1: Begin;

[0051] Step 2: Set the temperature T of the first heat source 1min The temperature of the second heat source, T 1max And the actual measured temperature T, where T 1min <T 1max ;

[0052] Step 3: Determine T 1max Check if ≤T is true; if yes, proceed to step four; otherwise, proceed to step five.

[0053] Step 4: Turn on pump 3 and proceed to step 3;

[0054] Step 5: Determine T 1min <T 1max Is it true? If yes, proceed to step six; otherwise, proceed to step seven.

[0055] Step Six: Turn on fan 11 and proceed to Step Five;

[0056] Step 7: Determine if T < T 1min If the condition is met, proceed to step eight; otherwise, proceed to step nine.

[0057] Step 8: Turn off fan 11 and proceed to step 7;

[0058] Step Nine: End.

Claims

1. A cooling device suitable for electronic devices with high heat flux density, characterized in that: It includes a thermoelectric conversion device and a quenching device installed on both sides of a high heat flux density electronic device (1); The thermoelectric conversion device includes a semiconductor thermoelectric generator (9), a finned plate (10), a temperature sensor and a fan (11) sequentially attached from the heat source heating side. The semiconductor thermoelectric generator (9), the finned plate (10), the temperature sensor and the fan (11) are installed in the first chamber. The rapid cooling device includes a liquid cooling plate (6) fitted to the non-heating side of the heat source, and the liquid cooling plate (6) is installed in the second chamber. The second chamber is also equipped with a storage battery (5), a liquid pump (3) and a controller (4). The storage battery (5) is connected to the semiconductor thermoelectric generator (9), the fan (11), the liquid pump (3), the controller (4) and the external power supply system, respectively. The inlet of the liquid cooling plate (6) is connected to the outlet of the liquid pump (3). The controller (4) is connected to the fan (11), the temperature sensor and the liquid pump (3), respectively.

2. The cooling device for high heat flux density electronic devices according to claim 1, characterized in that: The outlet of the liquid cooling plate (6) is connected to the inlet of the external refrigerant storage tank, and the outlet of the external refrigerant storage tank is connected to the inlet of the liquid pump (3).

3. The cooling device for high heat flux density electronic devices according to claim 1, characterized in that: The first chamber includes a first outer shell (8) and a second outer shell (12) that are fitted together. The second chamber includes a third outer shell (7) and a fourth outer shell (2) that are fitted together. Both the second outer shell (12) and the fourth outer shell (2) have a hollow structure.

4. The cooling device for high heat flux density electronic devices according to claim 3, characterized in that: The first outer shell (8) has a step on one side adjacent to the semiconductor thermoelectric generator (9) for fixing the semiconductor thermoelectric generator (9), and a step on the other side for fixing the fin plate (10).

5. The cooling device for high heat flux density electronic devices according to claim 1, characterized in that: The liquid cooling plate (6) has a meandering reflux channel inside.

6. A cooling method suitable for electronic devices with high heat flux density, characterized in that, The cooling method is applied to the cooling apparatus of claim 1 for electronic devices with high heat flux density, and the cooling method includes the following steps: S1: Set two critical temperature values ​​for the heat source: the first heat source temperature T 1min Second heat source temperature T 1max , among which, T 1min <T 1max The actual measured temperature is recorded as T; S2: The controller (4) monitors the actual measured temperature T on the heating side of the heat source through a temperature sensor, and compares the actual measured temperature T with the first heat source temperature T. 1min The temperature of the second heat source, T 1max By comparing the results, the controller (4) controls the operation of the liquid pump (3) and the fan (11) to enter different working modes.

7. The cooling method for high heat flux density electronic devices according to claim 6, characterized in that, Rapid cooling mode: When the controller (4) detects that the actual measured temperature T on the heat source side is greater than T through the temperature sensor. 1max At that time, the controller (4) controls the liquid pump (3) to open and introduce refrigerant into the liquid cooling plate (6) to cool the non-heating side of the heat source.

8. The cooling method for high heat flux density electronic devices according to claim 6, characterized in that, Thermal storage mode: When the controller (4) detects through the temperature sensor that the actual temperature T on the heating side of the heat source is less than T 1max And greater than T 1min When the controller (4) controls the fan (11) to turn on, the semiconductor thermoelectric generator (9) generates electricity by utilizing the temperature difference between the heat source heating side and the ambient temperature, and transmits the electrical energy to the battery (5).

9. The cooling method for high heat flux density electronic devices according to claim 6, characterized in that, Heat dissipation mode: When the controller (4) detects that the actual temperature T on the heat source side is less than or equal to T through the temperature sensor. 1min When the controller (4) controls the fan (11) to turn off, the device dissipates heat to the surrounding air through natural convection.

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