A printing method and device for backlight plate reflective layer

Abstract

The present application discloses a printing method and device for a backlight plate reflective layer, the method comprising obtaining the specification parameters of the backlight plate, and generating an enclosure path according to the specification parameters of the backlight plate; controlling a first dispensing valve to perform printing processing according to the enclosure path to form an enclosure layer on the substrate surface of the backlight plate; pressing the enclosure layer formed on the substrate surface of the backlight plate onto a reference substrate to form a channel between the substrate surface of the backlight plate and the surface of the reference substrate; controlling a second dispensing valve to inject a second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight plate. Compared with the traditional screen printing process, this solution effectively avoids the phenomenon of LED being submerged due to too small a GAP and LED light shadow due to too large a GAP value by first printing an enclosure layer on the substrate surface, and at the same time, it can also ensure the surface accuracy of the reflective layer, thereby effectively improving the reflectivity.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and in particular relates to a printing method and device for a backlight plate reflective layer. Background Art

[0002] With the increasing popularity of semiconductor technology, the processing accuracy of semiconductors has become more mature. Compared with traditional LED products, Mini-LED backlight display screens have advantages such as high dynamic contrast and high color gamut. The products can meet consumers' demand for excellent picture quality of LCD display screens. Generally, in order to increase the reflection efficiency of the light-emitting diode (also known as LED) backlight panel in the semiconductor, a backlight reflection layer can be made on the circuit of the light-emitting diode backlight panel.

[0003] In the prior art, the process of making the backlight reflective layer is mostly a screen printing process, that is, the reflective layer is screen printed on the unbonded backlight panel, and then the light emitting diode is bonded. However, although this screen printing process is simple and mature, it still has the following defects:

[0004] 1) The screen printing process needs to be carried out before the LED die bonding process. During the ink curing process, the glass substrate will be warped as a whole, which will cause great trouble to the subsequent die bonding process;

[0005] 2) The accuracy that can be achieved by the screen printing process is low. If the GAP between the reflective layer and the LED is too small, the LED may be submerged. If the GAP value is too large, the subsequent lighting process will find that the LED light shadow phenomenon is unqualified;

[0006] 3) When producing large-size products, the screen printing screen needs to be enlarged, which will inevitably lead to lower precision and increase the defect of opening position deviation;

[0007] 4) Each model of display panel requires a new screen printing screen, which will increase production costs and affect overall efficiency.

[0008] Secondly, some comparative documents have disclosed the use of a jet valve or a piezoelectric valve printing method to print the reflective layer, but this printing method cannot control the morphology of the reflective layer and cannot guarantee the accuracy and cost control during the printing process. Summary of the invention

[0009] In order to solve the above-mentioned technical defects that the screen printing process needs to be carried out before the LED die bonding process, the overall warping of the glass substrate will occur during the ink curing process, and the low precision and increased production cost, a method for printing a backlight reflective layer is proposed, including:

[0010] Obtaining specification parameters of the backlight panel, and generating an enclosure path according to the specification parameters of the backlight panel; wherein at least two light emitting diodes are arranged on the substrate surface of the backlight panel;

[0011] Controlling the first dispensing valve to perform printing processing according to the enclosure path to form an enclosure layer on the surface of the substrate of the backlight plate; wherein the material corresponding to the enclosure layer is a first viscosity material, and the height of the enclosure layer is greater than the height of each light-emitting diode;

[0012] The barrier layer formed on the substrate surface of the backlight plate is pressed onto the reference substrate to form a channel between the substrate surface of the backlight plate and the surface of the reference substrate; wherein the surface of the reference substrate is coated with a sacrificial layer, and the material corresponding to the sacrificial layer is incompatible with the first viscosity material;

[0013] The second dispensing valve is controlled to inject a second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel; wherein the viscosity of the second viscosity material is lower than that of the first viscosity material, and the second viscosity material is incompatible with the material corresponding to the sacrificial layer.

[0014] In an optional solution of the first aspect, before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the method further includes:

[0015] The vacuum plasma equipment is set based on preset working parameters, and the set vacuum plasma equipment is controlled to pre-process the backlight plate and the reference substrate respectively.

[0016] In another optional solution of the first aspect, after controlling the set vacuum plasma equipment to pre-process the backlight plate and the reference substrate respectively, before pressing the barrier layer formed on the substrate surface of the backlight plate onto the reference substrate, the method further includes:

[0017] Performing coating treatment on the pre-treated reference substrate so that a sacrificial layer is coated on the surface of the reference substrate;

[0018] The reference substrate coated with the sacrificial layer is dried.

[0019] In another optional solution of the first aspect, before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the method further includes:

[0020] The backlight plate is fixed on the suction cup, and at least two marking points on the substrate surface of the backlight plate are identified based on the top camera;

[0021] Determine whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to a moving direction of the first dispensing valve;

[0022] When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line;

[0023] When it is detected that the connecting line is parallel to the calibration line, the position of each marking point in the preset spatial rectangular coordinate system is determined;

[0024] Generate enclosure paths based on the backlight panel's specifications, including:

[0025] Generate the enclosure path based on the specifications of the backlight panel and the position of each marking point.

[0026] In yet another optional solution of the first aspect, the specification parameters of the backlight panel include the size parameters of each light emitting diode, the distance parameters of all light emitting diodes, and the size parameters of the substrate;

[0027] Generate the enclosure path based on the specifications of the backlight panel and the position of each marking point, including:

[0028] According to the position of each marking point and the size parameters of each light-emitting diode, the printing path of the enclosure layer corresponding to each light-emitting diode is converted;

[0029] According to the size parameters and the calibrated height of each light-emitting diode, the printing volume of the enclosure layer corresponding to each light-emitting diode is obtained; wherein the calibrated height is the height of the enclosure layer;

[0030] Determine the printing time of the barrier layer corresponding to each light emitting diode under a preset glue output amount based on the printing volume of the barrier layer corresponding to each light emitting diode;

[0031] Generate a first path according to the enclosure layer printing path corresponding to each light emitting diode, the enclosure layer printing time, and the distance parameters of all light emitting diodes;

[0032] According to the position of each marking point and the size parameters of the substrate, the printing path of the enclosure layer corresponding to the substrate is converted;

[0033] According to the size parameters and the calibrated height of the substrate, the printing volume of the enclosure layer corresponding to the substrate is obtained;

[0034] Determine, based on the printing volume of the enclosure layer corresponding to the substrate, the printing time of the enclosure layer corresponding to the substrate under a preset glue output amount;

[0035] Generate a second path according to the barrier layer printing path corresponding to the substrate and the barrier layer printing time;

[0036] The first path and the second path are used as enclosure paths.

[0037] In yet another optional solution of the first aspect, the specification parameters of the backlight panel further include a size parameter of each marking point;

[0038] Before using the first path and the second path as enclosure paths, the method further includes:

[0039] According to the position of each marking point and the size parameters of each marking point, the printing path of the enclosure layer corresponding to each marking point is converted;

[0040] According to the size parameters and the calibrated height of each marking point, the printing volume of the enclosure layer corresponding to each marking point is obtained;

[0041] Determine the printing time of the barrier layer corresponding to each marking point under a preset glue output amount based on the printing volume of the barrier layer corresponding to each marking point;

[0042] Generate a third path according to the enclosure layer printing path corresponding to each marking point and the enclosure layer printing time;

[0043] The first path and the second path are used as enclosure paths, including:

[0044] The first path, the second path and the third path are used as enclosure paths.

[0045] In another optional solution of the first aspect, before controlling the first dispensing valve to perform printing processing according to the enclosure path, the method further includes:

[0046] Controlling the laser distance measuring sensor to scan the backlight plate to obtain the surface height of the substrate of the backlight plate;

[0047] Measuring the current height of the first dispensing valve, and obtaining the target height according to the difference between the current height and the substrate surface height and the preset printing height;

[0048] The first dispensing valve is controlled to move vertically downward based on the target height, so that the height between the first dispensing valve and the substrate surface of the backlight plate is a preset printing height.

[0049] In another optional solution of the first aspect, controlling the second dispensing valve to inject the second viscosity material into the channel includes:

[0050] Determine the printing volume of the reflective layer according to the printing volume of the enclosure layer corresponding to the substrate, the printing volume of the enclosure layer corresponding to each light-emitting diode, and the printing volume of the enclosure layer corresponding to each marking point;

[0051] Determine the printing time of the reflective layer at a preset glue output amount based on the printing volume of the reflective layer;

[0052] The second dispensing valve is controlled to inject the second viscosity material into the channel according to the printing time of the reflective layer.

[0053] In another optional solution of the first aspect, controlling the second dispensing valve to inject the second viscosity material into the channel according to the printing time of the reflective layer includes:

[0054] A symmetrically arranged feed hole and exhaust hole are provided on the enclosure layer corresponding to the substrate;

[0055] The second dispensing valve is controlled to inject the second viscosity material from the feed hole into the channel according to the printing time of the reflective layer, and the vacuum exhaust device is controlled to extract the air in the channel from the exhaust hole according to the preset working time; wherein the preset working time is less than the printing time of the reflective layer.

[0056] In yet another optional solution of the first aspect, the reference substrate is provided with a heating resistance wire;

[0057] After controlling the second dispensing valve to inject the second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel, the method further includes:

[0058] The heating resistance wire is controlled to heat the channel according to a preset first heating time, so that the temperature in the channel is within a preset first range.

[0059] In another optional solution of the first aspect, after controlling the heating resistance wire to heat the channel according to the preset first heating time so that the temperature in the channel is within the preset first interval, the method further includes:

[0060] Controlling the heating resistance wire to heat the channel according to a preset second heating time, so that the temperature in the channel is within a preset second range;

[0061] The substrate surface of the backlight plate is cleaned, and the cleaned substrate surface of the backlight plate is dried.

[0062] In a second aspect, an embodiment of the present application provides a printing device for a backlight plate reflective layer, comprising:

[0063] A path generation module, used to obtain the specification parameters of the backlight panel and generate the enclosure path according to the specification parameters of the backlight panel; wherein at least two light emitting diodes are arranged on the substrate surface of the backlight panel;

[0064] A first printing module is used to control the first dispensing valve to perform printing processing according to the enclosure path to form an enclosure layer on the substrate surface of the backlight plate; wherein the material corresponding to the enclosure layer is a first viscosity material, and the height of the enclosure layer is greater than the height of each light-emitting diode;

[0065] A channel generation module is used to cover the barrier layer formed on the substrate surface of the backlight plate onto the reference substrate, so as to form a channel between the substrate surface of the backlight plate and the surface of the reference substrate; wherein the surface of the reference substrate is coated with a sacrificial layer, and the material corresponding to the sacrificial layer is incompatible with the first viscosity material;

[0066] The second printing module is used to control the second dispensing valve to inject a second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel; wherein the viscosity of the second viscosity material is lower than that of the first viscosity material, and the second viscosity material is insoluble in the material corresponding to the sacrificial layer.

[0067] In a third aspect, an embodiment of the present application further provides a printing device for a backlight plate reflective layer, including a processor and a memory;

[0068] The processor is connected to the memory;

[0069] A memory for storing executable program codes;

[0070] The processor runs the program corresponding to the executable program code by reading the executable program code stored in the memory, so as to implement the printing method of the backlight plate reflective layer provided by the first aspect of the embodiment of the present application or any implementation method of the first aspect.

[0071] In a fourth aspect, the present application provides a computer storage medium, which stores a computer program. The computer program includes program instructions. When the program instructions are executed by a processor, the method for printing a backlight panel reflective layer provided in the first aspect of the embodiment of the present application or any one of the implementation methods of the first aspect can be implemented.

[0072] Beneficial effects:

[0073] In the process of printing the reflective layer on the backlight panel, the specification parameters of the backlight panel are obtained, and a blocking path is generated according to the specification parameters of the backlight panel; the first dispensing valve is controlled to perform printing according to the blocking path to form a blocking layer on the substrate surface of the backlight panel; the blocking layer formed on the substrate surface of the backlight panel is pressed onto the reference substrate to form a channel between the substrate surface of the backlight panel and the surface of the reference substrate; the second dispensing valve is controlled to inject a second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel. Compared with the traditional screen printing process, this solution effectively avoids the LED being submerged due to a too small GAP and the LED light shadow due to a too large GAP value by first printing a barrier layer on the surface of the substrate. At the same time, it can ensure that the surface accuracy of the reflective layer can reach 1-2μm, thereby effectively improving the reflectivity. In addition, the sacrificial layer used in this solution is a thermal decomposition material, and the purpose of removing the sacrificial layer can be achieved by controlling the temperature. The solvent of the reflective layer material used in this solution uses a reactive solvent to avoid the substrate from being broken due to the generation of gas during the curing process, and can also effectively prevent impurities in the air from mixing into the reflective layer material.

[0074] Secondly, compared with the piezoelectric valve printing scheme, the opening morphology of the piezoelectric valve printing scheme mainly depends on the surface tension between the substrate and the material, and is prone to crater-like morphology; the opening morphology of the printing scheme is less affected by the surface tension between the substrate and the material, and will not have a crater-like morphology;

[0075] On the other hand, compared with the piezoelectric valve printing solution, which requires frequent replacement of accessories such as nozzle seat O-rings, flood plugs and other consumables, and the nozzle and striker also need to be replaced after reaching a certain service life, which is not only complicated to operate but also costly, this printing solution does not require frequent replacement of accessories and has a relatively low cost of use;

[0076] On the other hand, the opening accuracy of this solution mainly depends on the direct writing printing accuracy, which can currently achieve ±10μm accuracy. The accuracy of the piezoelectric valve printing solution mainly depends on the piezoelectric valve printing accuracy, which is currently ±50μm, while the current MiniLED patch accuracy is ±20μm, which also shows that the fault tolerance of this printing solution is higher than that of the piezoelectric valve printing solution.

[0077] On the other hand, since the piezoelectric valve printing is done by printing straight lines to form a surface, it is inevitable that wavy sawtooth morphology will appear on the printed edge, which is unacceptable for some products with high morphology requirements. This printing solution uses direct writing printing on the four sides and a filling solution in the middle, so similar wavy sawtooth morphology will not appear;

[0078] On the other hand, when using a piezoelectric valve, it is necessary to install a piezoelectric valve controller and lay cables such as power lines, signal lines, and data lines. The overall system is relatively complex. This solution does not require a controller, and has relatively fewer cables, making the overall system simple.

[0079] On the other hand, the film thickness of this scheme can be infinitely adjusted by the height of the enclosure of direct writing printing. The piezoelectric valve printing scheme controls the film thickness by controlling the single-point printing flow of the piezoelectric valve. However, the single-point printing flow of the piezoelectric valve will change with the temperature of the piezoelectric ceramic, and the fluctuation range is large, which is not easy to achieve infinite adjustment.

[0080] On the other hand, this printing solution has a larger acceptable range for the adhesion and leveling of the filling material, a wider range of material selection options and a relatively lower difficulty in material configuration. The piezoelectric valve printing solution has higher requirements for material viscosity and leveling, because the material viscosity will directly determine the flow rate of the piezoelectric valve printing, and the leveling will directly determine the printed morphology. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0082] Figure 1 An overall flow chart of a method for printing a backlight plate reflective layer provided in an embodiment of the present application;

[0083] Figure 2 A schematic plan view of a substrate of a backlight panel provided in an embodiment of the present application;

[0084] Figure 3 A schematic diagram of obtaining a target height of a first dispensing valve provided in an embodiment of the present application;

[0085] Figure 4 A schematic plan view of a substrate of another backlight panel provided in an embodiment of the present application;

[0086] Figure 5 A schematic diagram of the printing effect of a backlight reflective layer provided in an embodiment of the present application;

[0087] Figure 6 A schematic plan view of a reference substrate provided in an embodiment of the present application;

[0088] Figure 7 A schematic plan view of another reference substrate provided in an embodiment of the present application;

[0089] Figure 8A schematic diagram of a temperature-time variation curve of a sacrificial layer provided in an embodiment of the present application;

[0090] Fig. 9 A schematic diagram of the structure of a printing device for a backlight reflective layer provided in an embodiment of the present application;

[0091] Fig.10 A schematic structural diagram of another device for printing a backlight reflective layer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0092] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0093] In the following introduction, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The following introduction provides multiple embodiments of the present application, and different embodiments can be replaced or combined, so the present application can also be considered to include all possible combinations of the same and / or different embodiments recorded. Therefore, if one embodiment includes features A, B, and C, and another embodiment includes features B and D, then the present application should also be considered to include embodiments containing one or more of all other possible combinations of A, B, C, and D, although the embodiment may not be clearly recorded in the following text.

[0094] The following description provides examples and does not limit the scope, applicability or examples set forth in the claims. Changes may be made to the functions and arrangements of the elements described without departing from the scope of the present application. Various processes or components may be appropriately omitted, substituted or added to each example. For example, the described method may be performed in an order different from the order described, and various steps may be added, omitted or combined. In addition, features described in some examples may be combined in other examples.

[0095] See also Figure 1 , Figure 1 An overall flow chart of a method for printing a backlight plate reflective layer provided in an embodiment of the present application is shown.

[0096] like Figure 1 As shown, the printing method of the backlight plate reflective layer may at least include the following steps:

[0097] Step 102: Obtain specification parameters of the backlight panel, and generate an enclosure path according to the specification parameters of the backlight panel.

[0098] In an embodiment of the present application, the printing method of the backlight panel reflective layer can be but is not limited to being applied to a control terminal on a controllable motion platform, which control platform may at least include a marble suction cup (rotatable) for fixing the backlight panel, a top camera arranged above the marble suction cup, a gantry for controlling one or more first dispensing valves, a gantry for controlling one or more second dispensing valves, and a laser ranging sensor for measuring the height of the dispensing valve and the height of the backlight panel. Among them, one or more first dispensing valves can be used to print a blocking layer on the substrate surface of the backlight panel. The blocking layer can be but is not limited to being arranged around each light-emitting diode of the backlight panel, around the substrate and around each marking point, so as to respectively block each light-emitting diode, block the substrate surface and block each marking point. The type of the first dispensing valve can be but is not limited to a pneumatic dispensing valve, a piezoelectric injection valve or a pneumatic needle valve, etc., which can dispense glue in a quantitative manner; one or more second dispensing valves can be used to inject a viscosity material corresponding to the reflective layer into the channel formed by the blocking layer and the reference substrate, so that the portion of the backlight panel where the blocking layer is removed forms a reflective layer. The type of the second dispensing valve can be but is not limited to a pneumatic dispensing valve, a piezoelectric injection valve or a pneumatic needle valve, etc., which can dispense glue in a quantitative manner. It is understandable that, under the action of external force, the reference substrate can be pressed against the backlight plate formed with the enclosure layer, the upper surface of the enclosure layer is in full contact with the surface of the reference substrate, and a sacrificial layer is also coated on the surface of the reference substrate to effectively prevent the enclosure layer from deforming during the extrusion process and to prevent a gap from appearing between the enclosure layer and the sacrificial layer. Here, the material corresponding to the sacrificial layer is dissimilar and incompatible with the material corresponding to the enclosure layer, and the material corresponding to the reflective layer injected into the channel is also dissimilar and incompatible with the material corresponding to the sacrificial layer.

[0099] As a preferred embodiment, in the embodiment of the present application, the material corresponding to the enclosing layer is a first viscosity material, which may be a high-viscosity white oily material with a viscosity range of 100,000-300,000 cps, and the added solvents are all reactive solvents, so that the substrate of the backlight panel will not be broken due to the generation of gas when solidified in a confined space; the material corresponding to the reflective layer is a second viscosity material, which may be a white oily material with a viscosity range of 100-400 cps, and the added solvents are also reactive solvents, so that the substrate of the backlight panel will not be broken due to the generation of gas when solidified in a confined space; the material corresponding to the sacrificial layer may be a thermally decomposable material that is dissimilar and incompatible with the first viscosity material and the second viscosity material, for example but not limited to, it may not decompose when the ambient temperature is 150 degrees, and it may decompose rapidly when the ambient temperature rises to 160 to 200 degrees, so as to ensure that the sacrificial layer of the reflective layer will not decompose during the curing process, thereby improving the printing quality of the reflective layer.

[0100] It should be noted that the substrate surface of the backlight plate for printing the reflective layer in the embodiment of the present application may be provided with light-emitting diodes arranged in an m*n array and at least two marking points (m and n are both positive integers), and the length, width and height of each light-emitting diode are the same, and the distance between any two adjacent light-emitting diodes in the same row is the same, and the distance between any two adjacent light-emitting diodes in the same column is also the same. Here, the relative position relationship between each marking point and each light-emitting diode is fixed, that is, after determining the position of each marking point, the position of each light-emitting diode can be converted according to the position of each marking point.

[0101] See here Figure 2 A schematic plan view of a substrate of a backlight panel provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, the substrate surface of the backlight panel may be provided with light-emitting diodes (i.e., light-emitting LEDs) arranged in an m*n array, and a marking point (i.e., a mark point) is provided at the upper left corner of the substrate in the figure. It is understandable that the number of light-emitting diodes and the number of marking points shown in the figure are only exemplary and are not actually limited thereto.

[0102] Specifically, in the process of printing the reflective layer on the backlight plate, the specification parameters of the backlight plate can be obtained. The specification parameters of the backlight plate can include, but are not limited to, the size parameters of each light-emitting diode, the distance parameters of all light-emitting diodes, and the size parameters of the substrate, wherein the size parameters of each light-emitting diode can be specifically the length, width, and height of each light-emitting diode, and the height can be understood as the distance between the upper surface of the light-emitting diode and the surface of the substrate; the distance parameters of all light-emitting diodes can be specifically the distance between any two adjacent light-emitting diodes; the size parameters of the substrate can be specifically the length, width, and height of the substrate, and the height of the substrate can also be understood as the thickness of the substrate. Of course, the specification parameters of the backlight plate can also include the positional relationship of each light-emitting diode on the backlight plate and the arrangement of the light-emitting diodes. The positional relationship of each light-emitting diode on the backlight plate can be understood as the distance between the center point (or edge) of each light-emitting diode and the edge of the backlight plate, and of course it can also be understood as the coordinates of the center point (or four vertices) of each light-emitting diode in the rectangular coordinate system of the plane where the backlight plate is located, which is not limited here.

[0103] It can be understood that the method for the control terminal here to obtain the specification parameters of the backlight panel can be but not limited to being based on a visual algorithm, by identifying and processing the substrate surface image of the backlight panel captured by the top camera, or directly by the user inputting the specification parameters of the backlight panel. This is not limited to this here, and compared with the traditional screen printing process, the embodiment of the present application can be applicable to backlight panels of different specifications, thereby reducing production costs and improving printing efficiency.

[0104] Furthermore, after obtaining the specification parameters of the backlight panel, an enclosure path can be generated according to the specification parameters of the backlight panel. The enclosure path may include but is not limited to an enclosure path corresponding to the enclosure layer for printing each light-emitting diode and an enclosure path corresponding to the enclosure layer of the printed substrate. It can be understood that the position of the substrate surface of the backlight panel excluding all light-emitting diodes is the printing position of the reflective layer, that is, the area enclosed by the enclosure layer of the substrate excluding the area enclosed by the enclosure layer of all light-emitting diodes is the printing area of ​​the reflective layer.

[0105] As an option of the embodiment of the present application, before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the method further includes:

[0106] The vacuum plasma equipment is set based on preset working parameters, and the set vacuum plasma equipment is controlled to pre-process the backlight plate and the reference substrate respectively.

[0107] In order to better improve the substrate surface tension of the backlight panel and clean the substrate surface of the backlight panel and the reference substrate respectively, before printing the reflective layer on the backlight panel, the vacuum plasma device can be set based on preset working parameters, such as but not limited to setting the working power of the vacuum plasma device to a specified power and the working time to a specified working time, and the backlight panel and the reference substrate are placed in the set vacuum plasma device for pretreatment. The pretreatment method can be to treat the substrate surface of the backlight panel and the reference substrate respectively with oxygen in a vacuum environment, so that the substrate surface of the backlight panel and the reference substrate have more hydrogen bonds while removing impurities, thereby increasing the surface tension of the backlight panel; or to treat the substrate surface of the backlight panel and the reference substrate with argon in a vacuum environment, so that the substrate surface of the backlight panel and the reference substrate are roughened while removing impurities, thereby increasing the surface tension of the backlight panel and the reference substrate.

[0108] It can be understood that in the embodiment of the present application, the surface tension of the backlight panel substrate and the surface of the reference substrate can be made consistent by pre-processing the backlight panel and the reference substrate, for example but not limited to controlling the surface tension of the backlight panel substrate and the surface tension of the reference substrate to be greater than 50N•m.

[0109] As another option of the embodiment of the present application, after controlling the set vacuum plasma equipment to pre-process the backlight plate and the reference substrate respectively, before pressing the enclosure layer formed on the substrate surface of the backlight plate onto the reference substrate, it also includes:

[0110] Performing coating treatment on the pre-treated reference substrate so that a sacrificial layer is coated on the surface of the reference substrate;

[0111] The reference substrate coated with the sacrificial layer is dried.

[0112] In order to ensure the printing effect of the subsequent reflective layer, after the reference substrate is pre-treated, one side surface of the reference substrate can also be coated based on but not limited to the coating process in the art to coat the material corresponding to the sacrificial layer on the reference substrate, so that the subsequently formed surrounding layer can be completely in contact with the sacrificial layer on the reference substrate during the process of covering the reference substrate (that is, there is no gap between the surrounding layer and the surface of the reference substrate).

[0113] Next, after coating the surface of the reference substrate with the material corresponding to the sacrificial layer, the reference substrate may be placed in a drying oven for drying by, but is not limited to, controlling the manipulator to form a sacrificial layer on the surface of the reference substrate. It is understood that in the embodiment of the present application, the reference substrate may be a glass substrate, and since the sacrificial layer is a thermally decomposable material, it is necessary to ensure that the set drying temperature of the drying oven is lower than the decomposition temperature of the sacrificial layer.

[0114] As another option of the embodiment of the present application, before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the method further includes:

[0115] The backlight plate is fixed on the suction cup, and at least two marking points on the substrate surface of the backlight plate are identified based on the top camera;

[0116] Determine whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to a moving direction of the first dispensing valve;

[0117] When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line;

[0118] When it is detected that the connecting line is parallel to the calibration line, the position of each marking point in the preset spatial rectangular coordinate system is determined;

[0119] Generate enclosure paths based on the backlight panel's specifications, including:

[0120] Generate the enclosure path based on the specifications of the backlight panel and the position of each marking point.

[0121] In order to ensure the effectiveness and accuracy of the enclosure path, the angle between the line formed by any two adjacent marking points on the backlight plate and the calibration line can be used to determine whether the backlight plate needs to be rotated, thereby ensuring that during the printing of the enclosure layer, the first dispensing valve remains parallel to the long side of the backlight plate along the direction of the horizontal movement of the plane, and remains parallel to the wide side of the backlight plate along the direction of the longitudinal movement of the plane. Among them, the calibration line can be a line segment parallel to the direction of the horizontal movement of the plane, and a line segment parallel to the direction of the longitudinal movement of the plane, and the line segment parallel to the direction of the horizontal movement of the plane and the line segment parallel to the direction of the longitudinal movement of the plane are perpendicular to each other.

[0122] Specifically, the bottom of the substrate of the backlight panel can be adsorbed on the suction cup, and the top camera can be controlled to move to the top of the backlight panel to shoot the substrate surface of the backlight panel, and at least two marking points on the substrate surface of the backlight panel can be identified in the captured image through a visual algorithm. It can be understood that in the embodiment of the present application, at least two marking points are pre-set on the substrate surface of the backlight panel, and the position of each marking point on the substrate surface of the backlight panel is relatively fixed. For example, a marking point is set at each of the four vertices of the backlight panel, and the line between any two adjacent marking points can be kept parallel to the long side or wide side of the substrate of the backlight panel.

[0123] Next, after identifying all the marking points on the substrate surface of the backlight panel, any two adjacent marking points can be connected by lines, and it can be determined whether the angle between the connecting line and any calibration line is 0 degrees. Possibly, when it is detected that the angle between the connecting line and any calibration line is 0 degrees, it indicates that the connecting line formed by any two adjacent marking points is parallel to any calibration line, and then the position coordinates of each marking point in the preset spatial rectangular coordinate system can be determined in combination with the preset spatial rectangular coordinate system. Among them, the preset spatial rectangular coordinate system can be established based on, but not limited to, the plane where the motion platform is located, for example, but not limited to, using the center of the suction cup or any vertex as the origin of the coordinate system to establish the corresponding spatial rectangular coordinate system, which is not limited here.

[0124] Possibly, when it is detected that the angle between the connecting line and any calibration line is not 0 degrees, it indicates that the connecting line formed by any two adjacent marking points is not parallel to any calibration line. The suction cup can be controlled to rotate according to the angle between the connecting line and any calibration line until the angle between the connecting line and any calibration line is 0 degrees, and then the position coordinates of each marking point in the preset spatial rectangular coordinate system can be determined in combination with the preset spatial rectangular coordinate system.

[0125] Then, after obtaining the position of each marking point, the enclosure path can be generated according to the specification parameters of the backlight panel and the position of each marking point. Since the relative position of each marking point and each light-emitting diode on the backlight panel is fixed, after determining the position of each marking point in the preset spatial rectangular coordinate system, the position of each light-emitting diode in the preset spatial rectangular coordinate system can be converted according to the position of any marking point and the position relationship of each light-emitting diode on the backlight panel.

[0126] As another option of the embodiment of the present application, the specification parameters of the backlight panel include the size parameters of each light-emitting diode, the distance parameters of all light-emitting diodes, and the size parameters of the substrate;

[0127] Generate the enclosure path based on the specifications of the backlight panel and the position of each marking point, including:

[0128] According to the position of each marking point and the size parameters of each light-emitting diode, the printing path of the enclosure layer corresponding to each light-emitting diode is converted;

[0129] According to the size parameters and the calibrated height of each light-emitting diode, the printing volume of the enclosure layer corresponding to each light-emitting diode is obtained; wherein the calibrated height is the height of the enclosure layer;

[0130] Determine the printing time of the barrier layer corresponding to each light emitting diode under a preset glue output amount based on the printing volume of the barrier layer corresponding to each light emitting diode;

[0131] Generate a first path according to the enclosure layer printing path corresponding to each light emitting diode, the enclosure layer printing time, and the distance parameters of all light emitting diodes;

[0132] According to the position of each marking point and the size parameters of the substrate, the printing path of the enclosure layer corresponding to the substrate is converted;

[0133] According to the size parameters and the calibrated height of the substrate, the printing volume of the enclosure layer corresponding to the substrate is obtained;

[0134] Determine, based on the printing volume of the enclosure layer corresponding to the substrate, the printing time of the enclosure layer corresponding to the substrate under a preset glue output amount;

[0135] Generate a second path according to the barrier layer printing path corresponding to the substrate and the barrier layer printing time;

[0136] The first path and the second path are used as enclosure paths.

[0137] In the process of generating the enclosure path, a first path corresponding to the enclosure layer for printing each light-emitting diode may be generated according to the size parameters of each light-emitting diode and the distance parameters of all light-emitting diodes, and then a second path corresponding to the enclosure layer for printing the substrate may be generated according to the size parameters of the substrate, so that when the first dispensing valve prints the enclosure layer on the substrate surface of the backlight panel, the enclosure layer of each light-emitting diode may be first printed according to the first path, and then the enclosure layer of the substrate may be printed according to the second path. Of course, in the embodiment of the present application, the second path corresponding to the enclosure layer for printing the substrate may be first generated according to the size parameters of the substrate, and then the first path corresponding to the enclosure layer for printing each light-emitting diode may be generated according to the size parameters of each light-emitting diode and the distance parameters of all light-emitting diodes. The order of precedence is not limited here.

[0138] Specifically, the enclosure layer printing path corresponding to each light-emitting diode can be converted according to the position of each marking point, the size parameters of each light-emitting diode, and the relative position relationship between each light-emitting diode and the marking point. Among them, the enclosure layer printing path corresponding to each light-emitting diode can be understood as the path formed along the edge of each light-emitting diode, which can be, but not limited to, first converting the vertex position of each light-emitting diode according to the position of each marking point, the size parameters of each light-emitting diode, and the relative position relationship between each light-emitting diode and the marking point, and then determining the corresponding enclosure printing path according to the vertex position of each light-emitting diode. For example, the enclosure layer printing path corresponding to each light-emitting diode can correspond to the path formed by moving along the edge from the upper left vertex of each light-emitting diode and passing through the lower left vertex, the lower right vertex, the upper right vertex in turn and returning to the upper left vertex.

[0139] Next, the length of the enclosure layer corresponding to each LED can be converted in combination with the length of each LED and the preset ratio. The length of the enclosure layer can be specifically the product of the length of each LED and the preset ratio. The preset ratio can be a constant greater than 1. Similarly, the width of the enclosure layer corresponding to each LED can be converted in combination with the width of each LED and the preset ratio. The width of the enclosure layer can be specifically the product of the width of each LED and the preset ratio.

[0140] Next, after respectively converting the length and width of the enclosure layer corresponding to each LED, the product of the calibrated height (i.e., the specified enclosure layer height) and the enclosure layer length and enclosure layer width can be combined, and the volume of the LED calculated according to the size parameters of each LED can be subtracted to obtain the printing volume of the enclosure layer corresponding to each LED. It can be understood that in order to ensure the printing effect of the reflective layer, the calibrated height here is greater than the height of each LED.

[0141] Next, after calculating the printing volume of the enclosure layer corresponding to each light-emitting diode, since the glue output of the first dispensing valve is a known quantity, the printing time required for the first dispensing valve to print the enclosure layer corresponding to each light-emitting diode can be obtained by calculating the ratio between the printing volume of the enclosure layer corresponding to each light-emitting diode and the preset glue output.

[0142] Next, after obtaining the enclosure layer printing path and enclosure layer printing time corresponding to each LED, the distance parameters of all LEDs (that is, the distance between any two adjacent LEDs) can be combined to obtain the first path for printing the enclosure layer of all LEDs. It can be understood that when the first dispensing valve is on the enclosure layer printing path of the LED, it can be in a normal working state; when the first dispensing valve is on the path between any two adjacent LEDs, it can be in a stopped working state.

[0143] Next, the vertex position of the substrate can be converted according to the position of each marking point and the size parameters of the substrate, and then the corresponding enclosure printing path can be determined according to the vertex position of the substrate. For example, the enclosure layer printing path corresponding to the substrate can correspond to the path formed by moving along the edge from the upper left vertex of the substrate and passing through the lower left vertex, lower right vertex, upper right vertex and returning to the upper left vertex.

[0144] Next, the length of the enclosure layer corresponding to the substrate can be converted based on the length of the substrate and the preset ratio mentioned above. The length of the enclosure layer can be specifically the product of the length of the substrate and the preset ratio. The preset ratio can be a constant greater than 1. Similarly, the width of the enclosure layer corresponding to the substrate can be converted based on the width of the substrate and the preset ratio. The width of the enclosure layer can be specifically the product of the width of the substrate and the preset ratio.

[0145] Next, after respectively converting the enclosure layer length and enclosure layer width corresponding to the substrate, the product of the calibrated height (that is, the specified enclosure layer height) and the enclosure layer length and enclosure layer width can be combined, and the substrate volume calculated according to the size parameters of the substrate can be subtracted to obtain the enclosure layer printing volume corresponding to the substrate.

[0146] Next, after calculating the printing volume of the retaining layer corresponding to the substrate, since the glue output of the first dispensing valve is a known quantity, the printing time required for the first dispensing valve to print the retaining layer corresponding to the substrate can be obtained by calculating the ratio between the printing volume of the retaining layer corresponding to the substrate and the preset glue output. It can be understood that after respectively calculating the printing path and printing time of the retaining layer corresponding to the substrate, a second path for printing the retaining layer of the substrate can be obtained. Among them, the first dispensing valve can be in a normal state when printing the retaining layer of the substrate along the second path.

[0147] Next, after obtaining the first path for printing the enclosure layer of all light-emitting diodes and the second path for printing the enclosure layer of the substrate, the first path and the second path can be integrated and used as the enclosure path. The way to integrate the first path and the second path can be, but is not limited to, arranging the first path and the second path in chronological order, for example, the first path corresponds to the time from t0 to t1, and the second path corresponds to the time from t1 to t2.

[0148] As another option of the embodiment of the present application, the specification parameters of the backlight panel also include the size parameters of each marking point;

[0149] Before using the first path and the second path as enclosure paths, the method further includes:

[0150] According to the position of each marking point and the size parameters of each marking point, the printing path of the enclosure layer corresponding to each marking point is converted;

[0151] According to the size parameters and the calibrated height of each marking point, the printing volume of the enclosure layer corresponding to each marking point is obtained;

[0152] Determine the printing time of the barrier layer corresponding to each marking point under a preset glue output amount based on the printing volume of the barrier layer corresponding to each marking point;

[0153] Generate a third path according to the enclosure layer printing path corresponding to each marking point and the enclosure layer printing time;

[0154] The first path and the second path are used as enclosure paths, including:

[0155] The first path, the second path and the third path are used as enclosure paths.

[0156] Since the subsequent preparation process may still need to use the marking point, in the embodiment of the present application, a barrier layer can also be printed on the marking point to avoid covering the marking point during the printing of the reflective layer.

[0157] Specifically, since the shape of the marking point is generally circular, the size parameter of the marking point can generally be the radius or diameter of the marking point. Based on this, the vertex position of the rectangular enclosure layer used to enclose each marking point can be converted according to the size parameter of each marking point and the preset ratio mentioned above, and the corresponding enclosure printing path corresponding to each marking point can be determined according to the vertex position of each rectangular enclosure layer. For example, it can correspond to the path formed by moving from the upper left vertex of each rectangular enclosure layer along the edge and passing through the lower left vertex, lower right vertex, upper right vertex in sequence and returning to the upper left vertex. It can be understood that the rectangular enclosure layer here can also be a circular enclosure layer, which is not limited to this.

[0158] Next, the printing volume of the enclosure layer corresponding to each marking point can be obtained by combining the product of the length, width and calibrated height (that is, the specified enclosure layer height) of each rectangular enclosure layer and subtracting the volume of the marking point calculated according to the size parameters of each marking point.

[0159] Next, after calculating the printing volume of the barrier layer corresponding to each marking point, since the glue output of the first dispensing valve is a known quantity, the printing time required for the first dispensing valve to print the barrier layer corresponding to each marking point can be obtained by calculating the ratio between the printing volume of the barrier layer corresponding to each marking point and the preset glue output. It is understandable that after respectively calculating the printing path and printing time of the barrier layer corresponding to each marking point, the distance between any two marking points can be combined to obtain a third path for printing the barrier layer of each marking point. It is understandable that when the first dispensing valve is on the printing path of the barrier layer of the marking point, it can be in a normal working state; when the first dispensing valve is on the path between any two adjacent marking points, it can be in a stopped working state.

[0160] Next, after obtaining the third path for printing the enclosure layer of each marking point, the enclosure path can be obtained by combining the first path, the second path and the third path mentioned above, which will not be described in detail here.

[0161] As another option of the embodiment of the present application, before controlling the first dispensing valve to perform printing processing according to the enclosure path, it also includes:

[0162] Controlling the laser distance measuring sensor to scan the backlight plate to obtain the surface height of the substrate of the backlight plate;

[0163] Measuring the current height of the first dispensing valve, and obtaining the target height according to the difference between the current height and the substrate surface height and the preset printing height;

[0164] The first dispensing valve is controlled to move vertically downward based on the target height, so that the height between the first dispensing valve and the substrate surface of the backlight plate is a preset printing height.

[0165] In order to achieve a better printing effect of the first dispensing valve, before controlling the first dispensing valve to print according to the enclosure path, the laser distance sensor can be controlled to scan the backlight plate to obtain the substrate surface height of the backlight plate, where the substrate surface height of the backlight plate can be understood as the distance between the substrate surface of the backlight plate and the horizontal plane; then, the current height of the first dispensing valve can be obtained, where the current height of the first dispensing valve can be understood as the distance between the dispensing head of the first dispensing valve and the horizontal plane; then, the target height can be obtained by calculating the difference between the current height of the first dispensing valve and the substrate surface height and the preset printing height. The preset printing height can be understood as the distance between the dispensing head of the first dispensing valve and the substrate surface under ideal conditions.

[0166] See here Figure 3 A schematic diagram of obtaining a target height of a first dispensing valve provided in an embodiment of the present application is shown, such as Figure 3 As shown, the substrate surface height of the backlight panel can correspond to H1, the current height of the first dispensing valve can correspond to H2, the preset printing height can correspond to h1, and the target height H3 can be expressed as:

[0167] H3=H2-H1-h1

[0168] pass Figure 3 It can also be seen that the preset printing height is greater than the distance between the upper surface of the light-emitting diode and the surface of the substrate (ie, the height of the light-emitting diode).

[0169] Then, after the target height is obtained, the first dispensing valve can be controlled to move vertically downward, and the moving distance is the target height, so that the height between the first dispensing valve and the substrate surface of the backlight plate is the preset printing height.

[0170] It should be noted that in the embodiment of the present application, the height of the enclosure layer of each light-emitting diode, the height of the enclosure layer of the substrate, and the height of the enclosure layer of each marking point are all kept consistent.

[0171] Step 104 , controlling the first dispensing valve to perform printing processing according to the enclosure path to form an enclosure layer on the surface of the substrate of the backlight panel.

[0172] Specifically, after the enclosure path is generated, the first dispensing valve can be controlled to perform enclosure layer printing processing on the substrate surface of the backlight panel according to the path movement direction in the enclosure path and the printing time required by the first dispensing valve when printing the enclosure layer, so that an enclosure layer is formed around each light-emitting diode, a enclosure layer is formed around the substrate, and an enclosure layer is formed around each marking point. Here, taking the first path for printing the enclosure layer of all light-emitting diodes as an example, the first dispensing valve can be controlled to first move to the starting point of the printing path corresponding to the first light-emitting diode in the first path, and in the process of moving along the printing path corresponding to the first light-emitting diode, the first dispensing valve is controlled to be in a normal working state, and when the glue discharge time reaches the printing time, the first dispensing valve has returned to the starting point of the printing path; then, the first dispensing valve can be controlled to move from the starting point of the printing path corresponding to the first light-emitting diode to the starting point of the printing path corresponding to the second light-emitting diode. The movement process can control the first dispensing valve to be in a stopped working state, and after the first dispensing valve reaches the starting point of the printing path corresponding to the second light-emitting diode, the above operation is repeated until the enclosure layer of all light-emitting diodes is printed. It is understandable that after printing the enclosure layer of all light-emitting diodes, the first dispensing valve can be controlled to print the enclosure layer of the substrate in sequence along the second path, and to print the enclosure layer of each marking point along the third path.

[0173] See here Figure 4 A schematic plan view of a substrate of another backlight panel provided in an embodiment of the present application is shown. Figure 4 As shown, the substrate surface of the backlight panel is printed with a barrier layer for each light-emitting diode, a barrier layer for each marking point, and a barrier layer for the substrate, and all the barrier layers are rectangular in shape. It is understandable that a plurality of glue inlet holes are provided below the barrier layer of the substrate, so that the second dispensing valve can inject the second viscosity material into the space surrounded by the barrier layer of the substrate; a plurality of exhaust holes are also provided above the barrier layer of the substrate, so that while the second dispensing valve is controlled to inject the second viscosity material into the space surrounded by the barrier layer of the substrate, the vacuum exhaust device can be controlled to extract the air in the channel from the exhaust holes according to the preset working time. It should be noted that the preset working time here is less than the printing time of the reflective layer to prevent the second viscosity material from being extracted and contaminating the equipment during the exhaust.

[0174] Step 106 : Press the barrier layer formed on the surface of the substrate of the backlight plate onto the reference substrate to form a channel between the surface of the substrate of the backlight plate and the surface of the reference substrate.

[0175] Specifically, after the barrier layer is printed on the substrate surface of the backlight panel, the backlight panel printed with the barrier layer can be transferred to a curing furnace by controlling the robot arm, but is not limited to, to cure the barrier layer. When the barrier layer is cured, the curing furnace can be controlled to work for 1 hour and the working temperature can be set to 150 degrees.

[0176] Furthermore, after the enclosure layer is cured, the enclosure layer can be pressed onto the reference substrate, and a channel can be formed between the substrate surface of the backlight panel and the surface of the reference substrate by uniformly applying pressure to the enclosure layer. The channel can be understood as the space formed by the enclosure layer corresponding to the substrate on the backlight panel, the substrate surface of the backlight panel, and the surface of the reference substrate, and in order to ensure that the reflective layer can be injected into the space, an opening can be provided on the enclosure layer corresponding to the substrate, that is, the space and the opening provided on the enclosure layer corresponding to the substrate together constitute the channel. It can be understood that the height of the channel is the height of the enclosure layer, and the enclosure layers of all light-emitting diodes and the enclosure layers of all marking points are also included in the channel.

[0177] Of course, in the embodiment of the present application, the reference substrate may also be pressed onto the surrounding layer so as to form a channel between the substrate surface of the backlight panel and the surface of the reference substrate by applying uniform pressure to the reference substrate.

[0178] Step 108 : Control the second dispensing valve to inject the second viscosity material into the channel to form a reflective layer on the surface of the substrate of the backlight panel.

[0179] Specifically, when controlling the second dispensing valve to inject the second viscosity material into the channel, the printing volume of the reflective layer can be determined according to the printing volume of the surrounding layer corresponding to the substrate, the printing volume of the surrounding layer corresponding to each light-emitting diode, and the printing volume of the surrounding layer corresponding to each marking point. The method can be to calculate the difference between the printing volume of the surrounding layer corresponding to the substrate and the printing volume of the surrounding layer corresponding to each light-emitting diode and the printing volume of the surrounding layer corresponding to each marking point.

[0180] Furthermore, after calculating the printing volume of the reflective layer, since the glue output of the second dispensing valve is a known quantity, the printing time of the reflective layer can be obtained by, but not limited to, calculating the ratio of the printing volume of the reflective layer to the preset glue output, so as to control the second dispensing valve to inject the second viscosity material into the channel according to the printing time of the reflective layer. Among them, the second dispensing valve can, but not limited to, inject the second viscosity material into the channel through the feed hole set on the enclosure layer corresponding to the substrate, and at the same time, it can also control the vacuum exhaust device to extract the air in the channel from the exhaust hole according to the preset working time, which not only effectively prevents a large number of bubbles from being generated between the substrates during the injection of the second viscosity material, but also prevents the second viscosity material from being extracted and polluting the equipment during the exhaust by setting the preset working time to be less than the printing time of the reflective layer.

[0181] It should be noted that after completing the printing process of the reflective layer, the robot arm can also be controlled to use a dust-free cloth to wipe the surface of the feed hole and the exhaust hole mentioned above, and can but is not limited to controlling the third dispensing valve to inject the first viscosity material corresponding to the surrounding layer into the feed hole and the exhaust hole to achieve sealing of the feed hole and the exhaust hole.

[0182] See here Figure 5 A schematic diagram of the printing effect of a backlight reflective layer provided in an embodiment of the present application is shown. Figure 5 As shown, three second dispensing valves can be provided to respectively inject the second viscosity material into the channel from the feed hole according to the above-mentioned reflective layer printing time, so that the second viscosity material is diffused on the substrate surface of the backlight panel.

[0183] As another option of the embodiment of the present application, the reference substrate is provided with a heating resistance wire;

[0184] After controlling the second dispensing valve to inject the second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel, the method further includes:

[0185] The heating resistance wire is controlled to heat the channel according to a preset first heating time, so that the temperature in the channel is within a preset first range.

[0186] In order to improve the curing efficiency of the reflective layer, the reflective layer can also be heated by a heating resistor wire arranged on the reference substrate so that the temperature in the channel is in a preset first range. The preset first range can be, but is not limited to, set to 150 degrees, and the heating time can be set to one hour.

[0187] See here Figure 6 A schematic plan view of a reference substrate provided in an embodiment of the present application is shown and Figure 7 A schematic plan view of another reference substrate provided in an embodiment of the present application is shown, such as Figure 6 as well as Figure 7 As shown, the front side of the reference substrate may be coated with a sacrificial layer, and the back side of the reference substrate may be provided with a plurality of groups of controlled heating resistors. The heating switches corresponding to the heating resistors may be turned on by, but not limited to, the control terminal, and the temperature in the channel may be controlled to be 150 degrees by adjusting the heating power, and the heating time may be set to one hour.

[0188] As another optional embodiment of the present application, after controlling the heating resistance wire to heat the channel according to the preset first heating time so that the temperature in the channel is within the preset first interval, the method further includes:

[0189] Controlling the heating resistance wire to heat the channel according to a preset second heating time, so that the temperature in the channel is within a preset second range;

[0190] The substrate surface of the backlight plate is cleaned, and the cleaned substrate surface of the backlight plate is dried.

[0191] Specifically, after the reflective layer is heated, the heat decomposition characteristics of the sacrificial layer material can be used to control the heating resistance wire to heat the channel according to the preset second heating time, so that the temperature in the channel is in the preset second interval, wherein the temperature in the preset second interval can decompose the sacrificial layer on the surface of the reference substrate, thereby forming a gap between the enclosure layer on the backlight plate and the surface of the reference substrate (that is, the backlight plate and the reference substrate change from a contact state to a separation state). The preset second interval can be, but is not limited to, 160 degrees to 200 degrees, and the heating time can be set to 5 minutes to 20 minutes.

[0192] See here Figure 8 The temperature-time curve diagram of a sacrificial layer provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, in the temperature-time variation curve of the sacrificial layer, the horizontal axis corresponds to time and the vertical axis corresponds to temperature. It can be seen that between 0 minutes and 60 minutes, the heating temperature of the sacrificial layer quickly rises to 150 degrees and remains at 150 degrees, which corresponds to the curing treatment stage of the reflective layer; between 60 minutes and 70 minutes, the heating temperature of the sacrificial layer quickly rises from 150 degrees to 160 degrees and remains at 160 degrees, which corresponds to the thermal decomposition stage of the sacrificial layer.

[0193] Next, after the sacrificial layer on the surface of the reference substrate is decomposed, the backlight panel can be transferred to a cleaning mechanism by a robot but is not limited to being rinsed with deionized water on the substrate surface, and then transferred to a drying furnace by the robot for drying to obtain a more precise reflective layer.

[0194] See also Fig. 9 , Fig. 9 A schematic structural diagram of a printing device for a backlight plate reflective layer provided in an embodiment of the present application is shown.

[0195] like Fig. 9 As shown, the printing device of the backlight plate reflective layer may at least include a path generation module 901, a first printing module 902, a channel generation module 903 and a second printing module 904, wherein:

[0196] The path generation module 901 is used to obtain the specification parameters of the backlight panel and generate the enclosure path according to the specification parameters of the backlight panel; wherein at least two light emitting diodes are arranged on the substrate surface of the backlight panel;

[0197] The first printing module 902 is used to control the first dispensing valve to perform printing processing according to the enclosure path to form an enclosure layer on the substrate surface of the backlight plate; wherein the material corresponding to the enclosure layer is a first viscosity material, and the height of the enclosure layer is greater than the height of each light-emitting diode;

[0198] The channel generation module 903 is used to cover the barrier layer formed on the substrate surface of the backlight plate onto the reference substrate, so as to form a channel between the substrate surface of the backlight plate and the surface of the reference substrate; wherein the surface of the reference substrate is coated with a sacrificial layer, and the material corresponding to the sacrificial layer is incompatible with the first viscosity material;

[0199] The second printing module 904 is used to control the second dispensing valve to inject the second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel; wherein the viscosity of the second viscosity material is lower than that of the first viscosity material, and the second viscosity material is insoluble in the material corresponding to the sacrificial layer.

[0200] In some possible embodiments, the device further includes:

[0201] Before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the vacuum plasma equipment is set based on the preset working parameters, and the set vacuum plasma equipment is controlled to pre-process the backlight panel and the reference substrate respectively.

[0202] In some possible embodiments, the device further includes:

[0203] After the set vacuum plasma equipment is controlled to pre-treat the backlight plate and the reference substrate respectively, the barrier layer formed on the substrate surface of the backlight plate is pressed in front of the reference substrate, and the pre-treated reference substrate is coated so that the surface of the reference substrate is coated with a sacrificial layer;

[0204] The reference substrate coated with the sacrificial layer is dried.

[0205] In some possible embodiments, the device further includes:

[0206] Before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, fixing the backlight panel on the suction cup, and identifying at least two marking points on the substrate surface of the backlight panel based on the top camera;

[0207] Determine whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to a moving direction of the first dispensing valve;

[0208] When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line;

[0209] When it is detected that the connecting line is parallel to the calibration line, the position of each marking point in the preset spatial rectangular coordinate system is determined;

[0210] Generate enclosure paths based on the backlight panel's specifications, including:

[0211] Generate the enclosure path based on the specifications of the backlight panel and the position of each marking point.

[0212] In some possible embodiments, the specification parameters of the backlight panel include the size parameter of each light emitting diode, the distance parameter of all light emitting diodes, and the size parameter of the substrate;

[0213] The path generation module is used to:

[0214] According to the position of each marking point and the size parameters of each light-emitting diode, the printing path of the enclosure layer corresponding to each light-emitting diode is converted;

[0215] According to the size parameters and the calibrated height of each light-emitting diode, the printing volume of the enclosure layer corresponding to each light-emitting diode is obtained; wherein the calibrated height is the height of the enclosure layer;

[0216] Determine the printing time of the barrier layer corresponding to each light emitting diode under a preset glue output amount based on the printing volume of the barrier layer corresponding to each light emitting diode;

[0217] Generate a first path according to the enclosure layer printing path corresponding to each light emitting diode, the enclosure layer printing time, and the distance parameters of all light emitting diodes;

[0218] According to the position of each marking point and the size parameters of the substrate, the printing path of the enclosure layer corresponding to the substrate is converted;

[0219] According to the size parameters and the calibrated height of the substrate, the printing volume of the enclosure layer corresponding to the substrate is obtained;

[0220] Determine, based on the printing volume of the enclosure layer corresponding to the substrate, the printing time of the enclosure layer corresponding to the substrate under a preset glue output amount;

[0221] Generate a second path according to the barrier layer printing path corresponding to the substrate and the barrier layer printing time;

[0222] The first path and the second path are used as enclosure paths.

[0223] In some possible embodiments, the specification parameters of the backlight panel also include the size parameters of each marking point;

[0224] The path generation module is used to:

[0225] According to the position of each marking point and the size parameters of each marking point, the printing path of the enclosure layer corresponding to each marking point is converted;

[0226] According to the size parameters and the calibrated height of each marking point, the printing volume of the enclosure layer corresponding to each marking point is obtained;

[0227] Determine the printing time of the barrier layer corresponding to each marking point under a preset glue output amount based on the printing volume of the barrier layer corresponding to each marking point;

[0228] Generate a third path according to the enclosure layer printing path corresponding to each marking point and the enclosure layer printing time;

[0229] The first path and the second path are used as enclosure paths, including:

[0230] The first path, the second path and the third path are used as enclosure paths.

[0231] In some possible embodiments, the device further includes:

[0232] Before controlling the first dispensing valve to perform printing processing according to the enclosure path, controlling the laser distance measuring sensor to scan the backlight plate to obtain the height of the substrate surface of the backlight plate;

[0233] Measuring the current height of the first dispensing valve, and obtaining the target height according to the difference between the current height and the substrate surface height and the preset printing height;

[0234] The first dispensing valve is controlled to move vertically downward based on the target height, so that the height between the first dispensing valve and the substrate surface of the backlight plate is a preset printing height.

[0235] In some possible embodiments, the second printing module is used to:

[0236] Determine the printing volume of the reflective layer according to the printing volume of the enclosure layer corresponding to the substrate, the printing volume of the enclosure layer corresponding to each light-emitting diode, and the printing volume of the enclosure layer corresponding to each marking point;

[0237] Determine the printing time of the reflective layer at a preset glue output amount based on the printing volume of the reflective layer;

[0238] The second dispensing valve is controlled to inject the second viscosity material into the channel according to the printing time of the reflective layer.

[0239] In some possible embodiments, the second printing module is used to:

[0240] A symmetrically arranged feed hole and exhaust hole are provided on the enclosure layer corresponding to the substrate;

[0241] The second dispensing valve is controlled to inject the second viscosity material from the feed hole into the channel according to the printing time of the reflective layer, and the vacuum exhaust device is controlled to extract the air in the channel from the exhaust hole according to the preset working time; wherein the preset working time is less than the printing time of the reflective layer.

[0242] In some possible embodiments, the reference substrate is provided with a heating resistance wire;

[0243] The device also includes:

[0244] After controlling the second dispensing valve to inject the second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel, the heating resistor is controlled to heat the channel according to the preset first heating time so that the temperature in the channel is in a preset first range.

[0245] In some possible embodiments, the device further includes:

[0246] After controlling the heating resistance wire to heat the channel according to a preset first heating time so that the temperature in the channel is within a preset first interval, controlling the heating resistance wire to heat the channel according to a preset second heating time so that the temperature in the channel is within a preset second interval;

[0247] The substrate surface of the backlight plate is cleaned, and the cleaned substrate surface of the backlight plate is dried.

[0248] Those skilled in the art can clearly understand that the technical solutions of the embodiments of the present application can be implemented with the help of software and / or hardware. The "unit" and "module" in this specification refer to software and / or hardware that can independently complete or cooperate with other components to complete specific functions, where the hardware can be, for example, a field programmable gate array (FPGA), an integrated circuit (IC), etc.

[0249] See also Fig.10 , Fig.10 A schematic structural diagram of another printing device for a backlight plate reflective layer provided in an embodiment of the present application is shown.

[0250] like Fig.10 As shown, the printing device 1000 for the backlight plate reflective layer may include: at least one processor 1001 , at least one network interface 1004 , a user interface 1003 , a memory 1005 and at least one communication bus 1002 .

[0251] The communication bus 1002 may be used to realize the connection and communication among the above-mentioned components.

[0252] The user interface 1003 may include buttons, and the optional user interface may also include a standard wired interface or a wireless interface.

[0253] The network interface 1004 may include, but is not limited to, a Bluetooth module, an NFC module, a Wi-Fi module, etc.

[0254] Among them, the processor 1001 may include one or more processing cores. The processor 1001 uses various interfaces and lines to connect various parts in the printing device 1000 of the backlight plate reflective layer, and executes various functions and processes data of the printing device 1000 of the routing backlight plate reflective layer by running or executing instructions, programs, code sets or instruction sets stored in the memory 1005, and calling data stored in the memory 1005. Optionally, the processor 1001 can be implemented in at least one hardware form of DSP, FPGA, and PLA. The processor 1001 can integrate one or a combination of CPU, GPU, modem, etc. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 1001, and it can be implemented separately through a chip.

[0255] Among them, the memory 1005 may include RAM and may also include ROM. Optionally, the memory 1005 includes a non-transitory computer-readable medium. The memory 1005 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 1005 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 1005 may optionally be at least one storage device located away from the aforementioned processor 1001. As Fig.10 As shown, the memory 1005 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a printing application for the backlight reflective layer.

[0256] Specifically, the processor 1001 may be used to call the printing application for the backlight plate reflective layer stored in the memory 1005, and specifically perform the following operations:

[0257] Obtaining specification parameters of the backlight panel, and generating an enclosure path according to the specification parameters of the backlight panel; wherein at least two light emitting diodes are arranged on the substrate surface of the backlight panel;

[0258] Controlling the first dispensing valve to perform printing processing according to the enclosure path to form an enclosure layer on the surface of the substrate of the backlight plate; wherein the material corresponding to the enclosure layer is a first viscosity material, and the height of the enclosure layer is greater than the height of each light-emitting diode;

[0259] The barrier layer formed on the substrate surface of the backlight plate is pressed onto the reference substrate to form a channel between the substrate surface of the backlight plate and the surface of the reference substrate; wherein the surface of the reference substrate is coated with a sacrificial layer, and the material corresponding to the sacrificial layer is incompatible with the first viscosity material;

[0260] The second dispensing valve is controlled to inject a second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel; wherein the viscosity of the second viscosity material is lower than that of the first viscosity material, and the second viscosity material is incompatible with the material corresponding to the sacrificial layer.

[0261] In some possible embodiments, before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the method further includes:

[0262] The vacuum plasma equipment is set based on preset working parameters, and the set vacuum plasma equipment is controlled to pre-process the backlight plate and the reference substrate respectively.

[0263] In some possible embodiments, after controlling the set vacuum plasma equipment to pre-process the backlight plate and the reference substrate respectively, before pressing the barrier layer formed on the substrate surface of the backlight plate onto the reference substrate, the method further includes:

[0264] Performing coating treatment on the pre-treated reference substrate so that a sacrificial layer is coated on the surface of the reference substrate;

[0265] The reference substrate coated with the sacrificial layer is dried.

[0266] In some possible embodiments, before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the method further includes:

[0267] The backlight plate is fixed on the suction cup, and at least two marking points on the substrate surface of the backlight plate are identified based on the top camera;

[0268] Determine whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to a moving direction of the first dispensing valve;

[0269] When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line;

[0270] When it is detected that the connecting line is parallel to the calibration line, the position of each marking point in the preset spatial rectangular coordinate system is determined;

[0271] Generate enclosure paths based on the backlight panel's specifications, including:

[0272] Generate the enclosure path based on the specifications of the backlight panel and the position of each marking point.

[0273] In some possible embodiments, the specification parameters of the backlight panel include the size parameter of each light emitting diode, the distance parameter of all light emitting diodes, and the size parameter of the substrate;

[0274] Generate the enclosure path based on the specifications of the backlight panel and the position of each marking point, including:

[0275] According to the position of each marking point and the size parameters of each light-emitting diode, the printing path of the enclosure layer corresponding to each light-emitting diode is converted;

[0276] According to the size parameters and the calibrated height of each light-emitting diode, the printing volume of the enclosure layer corresponding to each light-emitting diode is obtained; wherein the calibrated height is the height of the enclosure layer;

[0277] Determine the printing time of the barrier layer corresponding to each light emitting diode under a preset glue output amount based on the printing volume of the barrier layer corresponding to each light emitting diode;

[0278] Generate a first path according to the enclosure layer printing path corresponding to each light emitting diode, the enclosure layer printing time, and the distance parameters of all light emitting diodes;

[0279] According to the position of each marking point and the size parameters of the substrate, the printing path of the enclosure layer corresponding to the substrate is converted;

[0280] According to the size parameters and the calibrated height of the substrate, the printing volume of the enclosure layer corresponding to the substrate is obtained;

[0281] Determine, based on the printing volume of the enclosure layer corresponding to the substrate, the printing time of the enclosure layer corresponding to the substrate under a preset glue output amount;

[0282] Generate a second path according to the barrier layer printing path corresponding to the substrate and the barrier layer printing time;

[0283] The first path and the second path are used as enclosure paths.

[0284] In some possible embodiments, the specification parameters of the backlight panel also include the size parameters of each marking point;

[0285] Before using the first path and the second path as enclosure paths, the method further includes:

[0286] According to the position of each marking point and the size parameters of each marking point, the printing path of the enclosure layer corresponding to each marking point is converted;

[0287] According to the size parameters and the calibrated height of each marking point, the printing volume of the enclosure layer corresponding to each marking point is obtained;

[0288] Determine the printing time of the barrier layer corresponding to each marking point under a preset glue output amount based on the printing volume of the barrier layer corresponding to each marking point;

[0289] Generate a third path according to the enclosure layer printing path corresponding to each marking point and the enclosure layer printing time;

[0290] The first path and the second path are used as enclosure paths, including:

[0291] The first path, the second path and the third path are used as enclosure paths.

[0292] In some possible embodiments, before controlling the first dispensing valve to perform printing processing according to the enclosure path, the method further includes:

[0293] Controlling the laser distance measuring sensor to scan the backlight plate to obtain the surface height of the substrate of the backlight plate;

[0294] Measuring the current height of the first dispensing valve, and obtaining the target height according to the difference between the current height and the substrate surface height and the preset printing height;

[0295] The first dispensing valve is controlled to move vertically downward based on the target height, so that the height between the first dispensing valve and the substrate surface of the backlight plate is a preset printing height.

[0296] In some possible embodiments, controlling the second dispensing valve to inject the second viscosity material into the channel includes:

[0297] Determine the printing volume of the reflective layer according to the printing volume of the enclosure layer corresponding to the substrate, the printing volume of the enclosure layer corresponding to each light-emitting diode, and the printing volume of the enclosure layer corresponding to each marking point;

[0298] Determine the printing time of the reflective layer at a preset glue output amount based on the printing volume of the reflective layer;

[0299] The second dispensing valve is controlled to inject the second viscosity material into the channel according to the printing time of the reflective layer.

[0300] In some possible embodiments, controlling the second dispensing valve to inject the second viscosity material into the channel according to the printing time of the reflective layer includes:

[0301] A symmetrically arranged feed hole and exhaust hole are provided on the enclosure layer corresponding to the substrate;

[0302] The second dispensing valve is controlled to inject the second viscosity material from the feed hole into the channel according to the printing time of the reflective layer, and the vacuum exhaust device is controlled to extract the air in the channel from the exhaust hole according to the preset working time; wherein the preset working time is less than the printing time of the reflective layer.

[0303] In some possible embodiments, the reference substrate is provided with a heating resistance wire;

[0304] After controlling the second dispensing valve to inject the second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel, the method further includes:

[0305] The heating resistance wire is controlled to heat the channel according to a preset first heating time, so that the temperature in the channel is within a preset first range.

[0306] In some possible embodiments, after controlling the heating resistance wire to heat the channel according to the preset first heating time so that the temperature in the channel is within the preset first interval, the method further includes:

[0307] Controlling the heating resistance wire to heat the channel according to a preset second heating time, so that the temperature in the channel is within a preset second range;

[0308] The substrate surface of the backlight plate is cleaned, and the cleaned substrate surface of the backlight plate is dried.

[0309] The present application also provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the steps of the above method are implemented. The computer-readable storage medium may include, but is not limited to, any type of disk, including a floppy disk, an optical disk, a DVD, a CD-ROM, a micro drive, and a magneto-optical disk, a ROM, a RAM, an EPROM, an EEPROM, a DRAM, a VRAM, a flash memory device, a magnetic card or an optical card, a nanosystem (including a molecular memory IC), or any type of medium or device suitable for storing instructions and / or data.

[0310] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0311] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0312] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0313] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0314] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0315] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a memory, including a number of instructions to enable a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned memory includes: U disk, read-only memory (ROM), random access memory (RAM), mobile hard disk, disk or optical disk and other media that can store program codes.

[0316] A person skilled in the art may understand that all or part of the steps in the various methods of the above embodiments may be completed by entering a program to instruct related hardware. The program may be stored in a computer-readable memory, and the memory may include: a flash drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0317] The above are only exemplary embodiments of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the specification and practicing the disclosure here, those skilled in the art will easily think of the implementation scheme of the present disclosure. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the technical field that are not recorded in the present disclosure. The description and examples are only regarded as exemplary, and the scope and spirit of the present disclosure are defined by the claims.

Claims

1. A method for printing a backlight plate reflective layer, characterized in that: include: Acquire the specification parameters of the backlight panel, and generate the enclosure path according to the specification parameters of the backlight panel; wherein at least two light emitting diodes are arranged on the substrate surface of the backlight panel; Controlling the first dispensing valve to perform printing processing according to the enclosure path to form an enclosure layer on the surface of the substrate of the backlight panel; wherein the material corresponding to the enclosure layer is a first viscosity material, and the height of the enclosure layer is greater than the height of each of the light-emitting diodes; The barrier layer formed on the substrate surface of the backlight panel is pressed onto the reference substrate to form a channel between the substrate surface of the backlight panel and the surface of the reference substrate; wherein the surface of the reference substrate is coated with a sacrificial layer, the material corresponding to the sacrificial layer is incompatible with the first viscosity material, and the reference substrate is provided with a heating resistance wire; Controlling the second dispensing valve to inject a second viscosity material into the channel to form a reflective layer on the substrate surface of the backlight panel; wherein the viscosity of the second viscosity material is lower than that of the first viscosity material, and the second viscosity material is incompatible with the material corresponding to the sacrificial layer; The heating resistance wire is controlled to heat the channel according to a preset first heating time, so that the temperature in the channel is within a preset first range.

2. The method according to claim 1, characterized in that Before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the method further includes: The vacuum plasma equipment is set based on preset working parameters, and the vacuum plasma equipment is controlled to pre-process the backlight panel and the reference substrate respectively.

3. The method according to claim 2, characterized in that After the vacuum plasma equipment pre-processes the backlight plate and the reference substrate respectively after the control is set, before the barrier layer formed on the substrate surface of the backlight plate is pressed onto the reference substrate, the method further includes: Performing coating treatment on the pre-treated reference substrate so that a sacrificial layer is coated on the surface of the reference substrate; The reference substrate coated with the sacrificial layer is dried.

4. The method according to claim 1, characterized in that Before obtaining the specification parameters of the backlight panel and generating the enclosure path according to the specification parameters of the backlight panel, the method further includes: The backlight plate is fixed on the suction cup, and at least two marking points on the substrate surface of the backlight plate are identified based on the top camera; Determine whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to a moving direction of the first dispensing valve; When it is detected that the connecting line is not parallel to the calibration line, based on the angle between the connecting line and the calibration line, the suction cup is rotated until the connecting line is parallel to the calibration line; When it is detected that the connecting line is parallel to the calibration line, determining the position of each of the marking points in a preset spatial rectangular coordinate system; The generating of the enclosure path according to the specification parameters of the backlight panel includes: An enclosure path is generated according to the specification parameters of the backlight panel and the position of each of the marking points.

5. The method according to claim 4, characterized in that The specification parameters of the backlight panel include the size parameters of each light-emitting diode, the distance parameters of all the light-emitting diodes and the size parameters of the substrate; The generating of the enclosure path according to the specification parameters of the backlight panel and the position of each of the marking points includes: According to the position of each of the marking points and the size parameters of each of the light-emitting diodes, a printing path of the enclosure layer corresponding to each of the light-emitting diodes is calculated; According to the size parameters and the calibrated height of each light-emitting diode, the printing volume of the enclosure layer corresponding to each light-emitting diode is obtained; wherein the calibrated height is the height of the enclosure layer; Determine, based on the printing volume of the enclosure layer corresponding to each of the light-emitting diodes, the printing time of the enclosure layer corresponding to each of the light-emitting diodes under a preset glue output amount; Generate a first path according to the enclosure layer printing path corresponding to each of the light emitting diodes, the enclosure layer printing time, and the distance parameters of all the light emitting diodes; According to the position of each of the marking points and the size parameters of the substrate, a printing path of the enclosure layer corresponding to the substrate is calculated; According to the size parameters of the substrate and the calibrated height, a printing volume of the enclosure layer corresponding to the substrate is obtained; Determining, based on the printing volume of the barrier layer corresponding to the substrate, the printing time of the barrier layer corresponding to the substrate at the preset glue output amount; Generate a second path according to the barrier layer printing path and barrier layer printing time corresponding to the substrate; The first path and the second path are used as enclosure paths.

6. The method according to claim 5, characterized in that The specification parameters of the backlight panel also include the size parameters of each of the marking points; Before using the first path and the second path as enclosure paths, the method further includes: According to the position of each of the marking points and the size parameters of each of the marking points, a printing path of the enclosure layer corresponding to each of the marking points is calculated; According to the size parameters of each of the marking points and the calibrated height, a printing volume of the enclosure layer corresponding to each of the marking points is obtained; Determine, based on the printing volume of the enclosure layer corresponding to each of the marking points, the printing time of the enclosure layer corresponding to each of the marking points under the preset glue output amount; Generate a third path according to the enclosure layer printing path and the enclosure layer printing time corresponding to each of the marking points; The using the first path and the second path as enclosure paths includes: The first path, the second path and the third path are used as enclosure paths.

7. The method according to claim 1, characterized in that Before controlling the first dispensing valve to perform printing processing according to the enclosure path, the method further includes: Controlling the laser distance measuring sensor to scan the backlight plate to obtain the height of the substrate surface of the backlight plate; Measuring a current height of the first dispensing valve, and obtaining a target height according to a difference between the current height and the substrate surface height and a preset printing height; The first dispensing valve is controlled to move vertically downward based on the target height, so that the height between the first dispensing valve and the substrate surface of the backlight plate is the preset printing height.

8. The method according to claim 6, characterized in that The controlling the second dispensing valve to inject the second viscosity material into the channel comprises: Determine the printing volume of the reflective layer according to the printing volume of the enclosure layer corresponding to the substrate, the printing volume of the enclosure layer corresponding to each of the light-emitting diodes, and the printing volume of the enclosure layer corresponding to each of the marking points; Determining, based on the printing volume of the reflective layer, the printing time of the reflective layer at the preset glue output amount; The second dispensing valve is controlled to inject the second viscosity material into the channel according to the printing time of the reflective layer.

9. The method according to claim 8, characterized in that The controlling the second dispensing valve to inject the second viscosity material into the channel according to the printing time of the reflective layer comprises: A symmetrically arranged feed hole and exhaust hole are provided on the enclosure layer corresponding to the substrate; The second dispensing valve is controlled to inject the second viscosity material from the feed hole into the channel according to the printing time of the reflective layer, and the vacuum exhaust device is controlled to extract the air in the channel from the exhaust hole according to the preset working time; wherein the preset working time is less than the printing time of the reflective layer.

10. The method according to claim 1, characterized in that After controlling the heating resistance wire to heat the channel according to the preset first heating time so that the temperature in the channel is within the preset first interval, the method further includes: Controlling the heating resistance wire to heat the channel according to a preset second heating time, so that the temperature in the channel is within a preset second range; The substrate surface of the backlight plate is cleaned, and the cleaned substrate surface of the backlight plate is dried.

11. A printing device for a backlight plate reflective layer, characterized in that: include: A path generation module, used for acquiring specification parameters of a backlight panel, and generating an enclosure path according to the specification parameters of the backlight panel; wherein at least two light emitting diodes are arranged on a substrate surface of the backlight panel; A first printing module, used to control the first dispensing valve to perform printing processing according to the enclosure path, so as to form an enclosure layer on the surface of the substrate of the backlight plate; wherein the material corresponding to the enclosure layer is a first viscosity material, and the height of the enclosure layer is greater than the height of each of the light-emitting diodes; A channel generation module is used to cover the barrier layer formed on the substrate surface of the backlight panel onto the reference substrate, so as to form a channel between the substrate surface of the backlight panel and the surface of the reference substrate; wherein the surface of the reference substrate is coated with a sacrificial layer, the material corresponding to the sacrificial layer is incompatible with the first viscosity material, and the reference substrate is provided with a heating resistance wire; A second printing module, used to control a second dispensing valve to inject a second viscosity material into the channel to form a reflective layer on the surface of the substrate of the backlight plate; wherein the viscosity of the second viscosity material is lower than that of the first viscosity material, and the second viscosity material is incompatible with the material corresponding to the sacrificial layer; The heating resistance wire is controlled to heat the channel according to a preset first heating time, so that the temperature in the channel is within a preset first range.

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