A Fault Diagnosis Method for Chemical Mechanical Polishing System
By obtaining the detection data of the gas-liquid tank and setting counters and timers to determine the fault status, combining the limit mechanism and protective sleeve to simplify maintenance, the problem of inaccurate recording of gas-liquid tank fault information is solved, and the fault diagnosis and maintenance efficiency of the chemical mechanical polishing system is improved.
Patent Information
- Application Number
- CN202310382394.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-04-12
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2043-04-12
AI Technical Summary
In the prior art, the fault information of the gas-liquid tank cannot be accurately recorded, resulting in inaccurate summary of the fault information of the chemical mechanical polishing system, affecting the system operation determination.
By obtaining the detection data of the gas-liquid tank, including the opening status duration, the number of faults and time, using the counter and timer to determine the operating status of the gas-liquid tank, setting a preset threshold time to determine the fault status, and simplifying the maintenance process of the gas-liquid tank through the limiting mechanism and protective sleeve.
Accurate recording of the location and number of gas-liquid tank failures is achieved, the reliability and maintenance efficiency of fault judgment are improved, manpower investment is reduced, and the system operation status evaluation is optimized.
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Figure CN116499723B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a fault diagnosis method for a chemical mechanical polishing system. Background Art
[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in driving the transformation and upgrading of the manufacturing industry towards digitalization and intelligentization. Chips are the carriers of integrated circuits. Chip manufacturing involves a series of processes, including integrated circuit design, wafer fabrication, wafer processing, electrical measurement, sawing, packaging, and testing. Chemical mechanical polishing (CMP) is one of the five core processes in wafer manufacturing.
[0003] Chemical Mechanical Polishing (CMP) is an ultra-precision surface finishing technology for global flattening. CMP typically involves attaching a wafer to the bottom surface of a carrier head, with the side of the wafer with the deposited layer resting against the top surface of a polishing pad. Driven by a drive assembly, the carrier head rotates in the same direction as the polishing pad, applying a downward force to the wafer. Polishing fluid is applied to the top surface of the polishing pad and distributed between the wafer and the pad, completing the CMP process through a combination of chemical and mechanical forces.
[0004] The chemical mechanical polishing system includes a polishing unit and a cleaning unit. In order to ensure the normal operation of the polishing unit and the cleaning unit, it is generally necessary to configure them with multiple gas and liquid tanks.
[0005] In the prior art, the gas-liquid box is arranged at the bottom of the machine in a pull-out manner. If a gas-liquid box fails, it is necessary to pull the gas-liquid box out to facilitate maintenance personnel to carry out inspection and repair.
[0006] Due to the large number of gas and liquid tanks, existing paper documents cannot accurately record information such as the location and time of failure of the gas and liquid tanks. This is not conducive to automatically summarizing the fault information of the CMP system and comprehensively judging the operation status of the CMP system. Summary of the Invention
[0007] An embodiment of the present invention provides a fault diagnosis method for a chemical mechanical polishing system, aiming to solve at least one of the technical problems existing in the prior art.
[0008] A first aspect of an embodiment of the present invention provides a fault diagnosis method for a chemical mechanical polishing system, comprising:
[0009] Obtain test data;
[0010] determining an operating state of the gas-liquid tank according to the detection data;
[0011] The detection data includes the duration that the gas-liquid box is in an open state; if the duration that the gas-liquid box is open is greater than or equal to a preset threshold time, the gas-liquid box is in a faulty state; if the duration that the gas-liquid box is open is less than the preset threshold time, the gas-liquid box is not faulty.
[0012] In some embodiments, the detection data includes the number of failures of the gas-liquid box, which is obtained using a counter; if the gas-liquid box fails, the count value of the counter is accumulated.
[0013] In some embodiments, the detection data further includes the failure time of the gas-liquid tank, which is obtained using a timer.
[0014] In some embodiments, the failure time of the gas-liquid tank is detected and acquired by a first timer and a second timer.
[0015] In some embodiments, if the gas-liquid tank fails, the first timer records the accumulated value of the gas-liquid tank failure time, and the second timer records the maximum value of the gas-liquid tank failure time.
[0016] In some embodiments, if the fault time recorded by the second timer is greater than the saved time in the second timer, the saved time in the second timer is updated.
[0017] In some embodiments, if the mean failure time of the gas-liquid tank is greater than 1.5 times the preset threshold time, the preset threshold time is updated.
[0018] In some embodiments, the detection data further includes a fault location and a longest fault time of the gas-liquid tank.
[0019] A second aspect of an embodiment of the present invention provides a control device, comprising a memory, a processor, and an application stored in the memory and executable on the processor, wherein when the processor executes the application, the steps of the fault diagnosis method for the chemical mechanical polishing system as described above are implemented.
[0020] A third aspect of an embodiment of the present invention provides a computer-readable storage medium storing an application program. When the application program is executed by a processor, the steps of the method for diagnosing a fault in a chemical mechanical polishing system as described above are implemented.
[0021] The beneficial effects of the present invention include:
[0022] a. Use a counter to obtain the fault location and fault frequency of the gas and liquid tank to fully understand the operation status of the gas and liquid circuit of the CMP system;
[0023] b. Use a timer to obtain the fault time of the gas-liquid tank and compare it to obtain the longest fault time. Update the preset threshold time as needed to optimize the determination of the gas-liquid tank fault status. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings, which are only exemplary and do not limit the scope of protection of the present invention, wherein:
[0025] Figure 1 This is a flow chart of a chemical mechanical polishing system fault diagnosis method provided by one embodiment of the present invention;
[0026] Figure 2 is a schematic diagram of a chemical mechanical polishing system provided by one embodiment of the present invention;
[0027] Figure 3 Schematic diagram of a gas-liquid box corresponding to a chemical mechanical polishing system provided in one embodiment of the present invention;
[0028] Figure 4 is a flow chart of a chemical mechanical polishing system fault diagnosis method provided by another embodiment of the present invention;
[0029] Figure 5 is a schematic diagram of a gas-liquid box provided in one embodiment of the present invention;
[0030] Figure 6 is a schematic diagram of a limiting mechanism provided by an embodiment of the present invention in an open state;
[0031] Figure 7 is a schematic diagram of a support rod provided by an embodiment of the present invention;
[0032] Figure 8 is a schematic diagram of a protective cover provided by an embodiment of the present invention;
[0033] Figure 9 Schematic diagram of a gas-liquid box located outside a CMP machine according to an embodiment of the present invention;
[0034] Figure 10 Schematic diagram of a control device provided by an embodiment of the present invention. DETAILED DESCRIPTION
[0035] The technical solutions of the present invention are described in detail below in conjunction with specific embodiments and the accompanying drawings. The embodiments described herein are specific embodiments of the present invention and are used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary and should not be understood as limiting the embodiments of the present invention and the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the contents disclosed in the claims of this application and its specification, including technical solutions that adopt any obvious replacements and modifications to the embodiments described herein.
[0036] The drawings in this specification are schematic diagrams that assist in illustrating the concepts of the present invention and schematically illustrate the shapes of the various components and their interrelationships. It should be understood that in order to clearly illustrate the structures of the various components of the embodiments of the present invention, the drawings are not drawn to the same scale, and the same reference numerals are used to represent the same parts in the drawings.
[0037] In the present invention, "Chemical Mechanical Polishing (CMP)" is also called "Chemical Mechanical Planarization (CMP)", and the wafer (Wafer, W) is also called substrate (Substrate), and their meanings and actual functions are equivalent.
[0038] A flow chart of a fault diagnosis method for a chemical mechanical polishing system provided by an embodiment of the present invention is as follows: Figure 1 As shown, a fault diagnosis method for a chemical mechanical polishing system includes:
[0039] Obtain test data;
[0040] The operating state of the gas-liquid tank is determined according to the detection data.
[0041] The detection data includes the duration that the gas-liquid box is in the open state.
[0042] If the duration of the gas-liquid box being open is greater than or equal to a preset threshold time, the gas-liquid box is in a fault state;
[0043] If the duration of the opening of the gas-liquid box is less than the preset threshold time, the gas-liquid box has not failed.
[0044] Figure 2 This is a schematic diagram of a chemical mechanical polishing system provided by an embodiment of the present invention. The chemical mechanical polishing system is equipped with multiple retractable gas and liquid tanks, which are arranged below the CMP system to ensure the normal operation of the polishing unit and the cleaning unit. It can be understood that Figure 2Only four sets of gas-liquid tanks are schematically shown in the figure. The number of gas-liquid tanks can also be other numbers. That is, the designer can configure an appropriate number of gas-liquid tanks according to the architecture and production capacity of the CMP system.
[0045] During daily use of the CMP system, operators may need to open the gas-liquid tank for a short period of time, such as for daily inspections. In this case, if the duration of the gas-liquid tank being open is less than a preset threshold time, the gas-liquid tank is not faulty.
[0046] As an embodiment of the present invention, the detection data includes the number of failures of the gas-liquid box, which is obtained using a counter, such as Figure 3 If it is determined that the gas-liquid box fails, the count value of the counter is accumulated to obtain the number of failures of the corresponding gas-liquid box and evaluate the operating status of the CMP system.
[0047] In the present invention, the detection data also includes the failure time of the gas-liquid tank, which is obtained using a timer. Figure 3 In the embodiment, the gas-liquid box is equipped with at least two timers, namely a first timer and a second timer. The failure time of the gas-liquid box is detected and obtained by the first timer and the second timer.
[0048] In one embodiment of the present invention, if the gas-liquid tank fails, a first timer records the cumulative failure time, and a second timer records the maximum failure time. Specifically, the first timer is used to record the total failure time of the gas-liquid tank, while the second timer is used to record the maximum failure time of the gas-liquid tank.
[0049] Figure 4 If the fault time recorded by the second timer is greater than the stored time in the second timer, the stored time in the second timer is updated. The stored time is the fault time stored in the second timer. That is, the fault time stored in the second timer is the longest fault time that the gas-liquid tank has experienced. Therefore, when a fault occurs in the gas-liquid tank, the stored fault time must be compared to determine whether the second timer needs to be updated.
[0050] As an embodiment of the present invention, if the average failure time of the gas-liquid tank is greater than 1.5 times the preset threshold time, the preset threshold time is updated, such as Figure 3 Specifically, it is necessary to appropriately extend the time of the preset threshold value to improve the reliability of the gas-liquid tank fault determination.
[0051] In the present invention, the preset threshold corresponding to each gas-liquid tank may be different, so as to improve the accuracy of gas-liquid tank fault determination.
[0052] Furthermore, the mean time between failures of the gas-liquid tank is calculated as follows: the time of the first timer is divided by the number of times of the counter.
[0053] In some embodiments, a manual counter can be configured for the gas-liquid box; if a fault occurs in the gas-liquid box and the fault handling efficiency is high, and the continuous opening time of the gas-liquid box is less than the preset threshold time, the fault status of the gas-liquid box can be recorded by manual operation through the manual counter.
[0054] Specifically, a manual counter is configured for the gas-liquid tank of the CMP machine to comprehensively and accurately record the number of gas-liquid tank failures when the gas-liquid tank failure time is relatively short, to prevent the omission of the number of gas-liquid tank failures due to unreasonable preset threshold settings.
[0055] As an embodiment of the present invention, the detection data also includes the fault location and the longest fault time of the gas-liquid box. Specifically, the counter is configured with a corresponding address number, and the location of the gas-liquid box with the fault is determined by the address number.
[0056] Furthermore, as described above, the longest fault time can be obtained through the second timer, so as to fully understand the operation status of the gas and liquid circuits of the CMP system.
[0057] In some embodiments, a fault display device may be provided for the CMP machine to display the fault location, number of faults, and maximum fault time of the gas-liquid tank in real time, so as to assess whether the operation of the CMP machine deviates from the normal operation state and timely monitor the operation state of the CMP machine.
[0058] Figure 5 Schematic diagram of a gas-liquid box 100 provided in one embodiment of the present invention. The gas-liquid box 100 includes a gas-liquid box body 30. The gas-liquid box body 30 is a shell structure, and various control valves are configured inside to achieve gas and liquid control of the CMP machine.
[0059] Furthermore, the gas-liquid box 100 includes a handle 10 and a gas-liquid pipeline 20, wherein the handle 10 is provided at the front end of the gas-liquid box body 30, and the gas-liquid pipeline 20 is provided at the rear end of the gas-liquid box body 30. In some embodiments, there is at least one handle 10 to facilitate pulling and pulling by the operator.
[0060] To ensure smooth extension and retraction of the gas-liquid tank 100 and facilitate routine maintenance and inspection by operators, at least a portion of the gas-liquid pipeline 20 is provided with a corrugated section. This allows the gas-liquid pipeline 20 to be extended to a certain extent, allowing the gas-liquid tank body 30 to be at least partially positioned outside the CMP machine. Specifically, the corrugated section is provided along one end of the gas-liquid pipeline 20, allowing the gas-liquid tank 100 to be adaptively extended to the outside of the CMP machine.
[0061] Because the bellows have a certain degree of resilience, when an operator pulls the gas-liquid box 100 toward the outside of the CMP machine, the bellows of the gas-liquid line 200 generate a reverse force, causing the gas-liquid box 100 to move toward the inside of the CMP machine. Therefore, during routine maintenance of the gas-liquid box 100, one operator is required to assist in pulling the gas-liquid box body 30 toward the outside of the CMP machine and maintaining it there, while another operator performs inspection and maintenance on the gas-liquid box 100.
[0062] In the existing technology, this operation method requires the cooperation of two people and cannot be completed by one person. To a certain extent, it affects the maintenance and repair efficiency of the gas and liquid circuits of the machine, and invisibly increases the use cost of the CMP machine.
[0063] In order to solve the above-mentioned technical problems, the gas-liquid box body 30 provided by the present invention is internally provided with a limiting mechanism 40, such as Figure 6 As shown, the gas-liquid box body 30 is kept outside the CMP machine.
[0064] Figure 6 In the embodiment shown, the limiting mechanism 40 includes a support rod 41 and a limiting column 42. The support rod 41 is hinged to the inner wall of the gas-liquid box body 30, and the limiting column 42 is vertically arranged on the inner wall of the gas-liquid box body 30. In addition, the limiting column 42 is located in the radial direction of the swing of the support rod 41 around the hinge point, so as to limit the swing range of the limiting column 42 and prevent the swing of the support rod 41 around the hinge point from affecting the devices arranged inside the gas-liquid box 100.
[0065] Furthermore, the support rods 41 are provided in pairs. After the support rods 41 swing about the hinge point, the other ends of the support rods 41 move toward the outside of the gas-liquid tank body 30, allowing the other ends of the support rods 41 to abut against the outer wall of the CMP machine. In other words, the force exerted by the CMP machine on the gas-liquid tank 100 through the support rods 41 is equal in magnitude and opposite in direction to the force exerted by the gas-liquid pipeline 20 on the gas-liquid tank 100, thereby maintaining the gas-liquid tank 100 outside the CMP machine.
[0066] As an embodiment of the present invention, one end of the support rod 41 is provided with a mounting hole 41a. Figure 7 As shown, the support rod 41 is hinged to the inner side of the gas-liquid box body 30 through the mounting hole 41a. It is understood that the length of the support rod 41 should be less than the longitudinal dimension of the gas-liquid box body 30 so that the support rod 41 can be hingedly arranged inside the gas-liquid box 100.
[0067] When the end of the support rod 41 abuts against the outside of the CMP machine, the support rod 41 is in hard contact with the CMP machine, and the support rod 41 may scratch the surface of the CMP machine and affect its appearance.
[0068] In order to solve the above-mentioned technical problems, a protective cover 41b can be provided at the end of the support rod 41, such as Figure 7 As shown, protective cover 41b is made of a flexible non-metallic material, such as polyurethane, allowing support rod 41 equipped with protective cover 41b to flexibly contact the CMP machine. During maintenance and inspection of gas-liquid tank 100, support rod 41 flexibly contacts the CMP machine to prevent limiter mechanism 40 from scratching the outside of the CMP machine.
[0069] As one aspect of this embodiment, the protective sleeve 41b is a tubular structure with a single end open, such as Figure 8 As shown, the interior of the protective sleeve 41b is provided with an internal thread so as to be detachably mounted on the end of the support rod 41. Accordingly, the outer side of the support rod 41 is provided with an external thread, and the protective sleeve 41b is connected to the outer side of the support rod 41 through the thread.
[0070] Furthermore, the wall thickness of the protective sleeve 41b is 2-5 mm, and the end of the protective sleeve 41b is rounded so that the support rod 41 with the protective sleeve 41b can flexibly abut against the outer side of the CMP machine.
[0071] As one aspect of this embodiment, the length of the protective sleeve 41b is 5-10 mm; accordingly, the length of the internal thread configured for the protective sleeve 41b is about 2 / 3 of the length of the protective sleeve 41b to ensure the reliability of the fixation of the protective sleeve 41b.
[0072] As a variation of this embodiment, the protective sleeve 41b can also be snapped onto the end of the support rod 41. Specifically, the end of the support rod 41 can be provided with a rough outer surface instead of a thread. The protective sleeve 41b is made of a non-metallic material with a certain degree of elasticity. The elasticity of the protective sleeve 41b itself and the roughness of the end of the support rod 41 ensure that the protective sleeve 41b is securely fixed to the end of the support rod 41. In some embodiments, the outer circumference of the end of the support rod 41 can be sandblasted to increase the friction between the support rod 41 and the protective sleeve 41b, thereby preventing the protective sleeve 41b from falling off the end of the support rod 41 and affecting the effectiveness of the protective sleeve 41b.
[0073] Figure 9 This is a schematic diagram of a gas-liquid box 100 provided in an embodiment of the present invention, which is partially located outside the CMP machine. In this embodiment, the limiting mechanism 40 of the gas-liquid box 100 is Figure 6 The illustrated gas-liquid box body 30 is defined outside the CMP table.
[0074] When the operator performs maintenance and repair on the gas-liquid box 100 of the CMP machine, the operator can first pull the gas-liquid box 100 outward, and then move the support rod 41 ( Figure 6The support rod 41 (shown) swings about the hinge point, positioning the other end of the support rod 41 outside the gas-liquid tank body 30. The end of the support rod 41 abuts the outer wall of the CMP machine, indicating that the gas-liquid tank 100 is in the open position. This means that a single operator, using the limit mechanism 40, can perform maintenance and inspection of the gas-liquid tank 100 without the assistance of other operators, reducing the number of personnel required for maintenance and inspection, and improving the efficiency of gas-liquid tank maintenance and inspection.
[0075] Figure 10 FIG2 is a schematic diagram of an embodiment of a control device provided by the present invention. In this embodiment, the control device includes a processor, a memory, and an application program stored in the memory and executable on the processor. When the processor executes the application program, the steps of each embodiment of the method for diagnosing a fault in a chemical mechanical polishing system are implemented. Alternatively, when the processor executes the application program, the functions of each module / unit described in each embodiment of the system are implemented.
[0076] A processor may be a single processing unit or multiple processing units, all of which may include a single or multiple computing units or multiple cores. A processor may be implemented as one or more microprocessors, microcomputers, microcontrollers, digital signal processors, central processing units, state machines, logic circuits, and / or any device that manipulates signals based on operational instructions. Among other capabilities, a processor may be configured to retrieve and execute computer-readable instructions stored in a memory, mass storage device, or other computer-readable medium, such as program code for an application, program code for other programs, and the like.
[0077] Memory and mass storage devices are examples of computer-readable storage media for storing instructions that are executed by a processor to implement the various functions described above. For example, memory can generally include both volatile memory and non-volatile memory (e.g., RAM, ROM, etc.). In addition, mass storage devices can generally include hard drives, solid-state drives, removable media, including external and removable drives, memory cards, flash memory, floppy disks, optical disks (e.g., CDs, DVDs), storage arrays, network attached storage, storage area networks, etc. Memory and mass storage devices can all be collectively referred to as memory or computer-readable storage media, and can be non-transitory media that can store computer-readable, processor-executable program instructions as computer program code, which can be executed by a processor as a specific machine configured to implement the operations and functions described in the examples herein.
[0078] A plurality of programs may be stored on a mass storage device. These programs include one or more application programs, other programs, and program data, and they may be loaded into memory for execution. Examples of such application programs or program modules may include, for example, computer program logic (e.g., computer program code or instructions) for implementing the following components / functions: Figure 1 The fault diagnosis method shown (including any suitable steps of the method), and / or other embodiments described herein.
[0079] The embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores an application program, and when the application program is executed by a processor, the following is achieved: Figure 1 The application program may be stored in a computer-readable storage medium, and when executed by a processor, the application program may implement the steps of each of the above method embodiments.
[0080] Furthermore, the application includes application code, which may be in source code form, object code form, executable file, or some intermediate form. The computer-readable medium may include any entity or device capable of carrying the application code, a recording medium, a USB flash drive, a mobile hard drive, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunications signal, and a software distribution medium.
[0081] Figure 10 In the embodiment of the present invention, one or more communication interfaces are used to exchange data with other devices, such as through a network, a direct connection, etc. Such communication interfaces can be one or more of the following: any type of network interface (e.g., a network interface card (NIC)), a wired or wireless (such as an IEEE 802.11 wireless LAN (WLAN)) wireless interface, a Worldwide Interoperability for Microwave Access (Wi-MAX) interface, an Ethernet interface, a Universal Serial Bus (USB) interface, a cellular network interface, a Bluetooth™ interface, a Near Field Communication (NFC) interface, etc. The communication interface can facilitate communication within a variety of network and protocol types, including wired networks (e.g., LAN, cable, etc.) and wireless networks (e.g., WLAN, cellular, satellite, etc.), the Internet, etc. The communication interface can also provide communication with external storage devices (not shown) such as storage arrays, network attached storage, storage area networks, etc.
[0082] As used in the present invention, "computer-readable media" includes at least two types of computer-readable media, namely, computer-readable storage media and communication media.
[0083] Computer-readable storage media includes volatile and non-volatile, removable and non-removable media implemented by any method or technology for storing information, such as computer-readable instructions, data structures, program modules, or other data. Computer-readable storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory, or other memory technology, CD-ROM, digital versatile disks (DVDs), or other optical storage devices, magnetic cassettes, magnetic tape, magnetic disk storage devices, or other magnetic storage devices, or any other non-transmission medium that can be used to store information for access by an electronic device. In contrast, communication media can embody computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism. Computer-readable storage media, as defined herein, does not include communication media.
[0084] Furthermore, the memory may include both an internal storage unit of the control device and an external storage device. The memory is used to store application programs and other programs and data required by the control device. The memory may also be used to temporarily store data that has been output or is about to be output.
[0085] In some examples, the control device may include a display device such as a monitor for displaying information and images to the user. Other I / O devices may be devices that receive various inputs from the user and provide various outputs to the user, and may include touch input devices, gesture input devices, cameras, keyboards, remote controls, mice, printers, audio input / output devices, etc.
[0086] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
[0087] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.
Claims
1. A fault diagnosis method for a chemical mechanical polishing system, applied to the fault management of a gas-liquid tank, characterized in that: include: Obtain test data; determining an operating state of the gas-liquid tank according to the detection data; The detection data includes the duration of time the gas-liquid box is in the open state; If the duration of the gas-liquid box being open is greater than or equal to the preset threshold time, the gas-liquid box is in a fault state; if the duration of the gas-liquid box being open is less than the preset threshold time, the gas-liquid box is not in a fault state; The detection data also includes the failure time of the gas-liquid box, which is obtained using a timer; the failure time of the gas-liquid box is detected and obtained by a first timer and a second timer; if the gas-liquid box fails, the first timer records the accumulated value of the failure time of the gas-liquid box, and the second timer records the maximum value of the failure time of the gas-liquid box; if the failure time recorded by the second timer is greater than the saved time in the second timer, the saved time in the second timer is updated.
2. The fault diagnosis method of the chemical mechanical polishing system according to claim 1, wherein: The detection data includes the number of failures of the gas-liquid box, which is obtained using a counter; if the gas-liquid box fails, the count value of the counter is accumulated.
3. The fault diagnosis method of the chemical mechanical polishing system according to claim 1, wherein: If the average failure time of the gas-liquid tank is greater than 1.5 times the preset threshold time, the preset threshold time is updated.
4. The fault diagnosis method of the chemical mechanical polishing system according to claim 3, wherein: The detection data also includes the fault location and the longest fault time of the gas-liquid tank.
5. A control device, characterized in that: The method comprises a memory, a processor, and an application program stored in the memory and executable on the processor. When the processor executes the application program, the steps of the fault diagnosis method for a chemical mechanical polishing system according to any one of claims 1 to 4 are implemented.
6. A computer-readable storage medium, characterized in that The computer-readable storage medium stores an application program, and when the application program is executed by a processor, the steps of the fault diagnosis method for a chemical mechanical polishing system according to any one of claims 1 to 4 are implemented.
Citation Information
Patent Citations
Fault diagnosis optimization method, device and system and storage medium
CN111273176A