Wafer cleaning apparatus, chemical mechanical polishing machine table and cleaning method

Abstract

The application discloses a wafer cleaning device, a chemical mechanical polishing machine table and a cleaning method. The wafer cleaning device comprises a rolling brush, a rolling brush driving device, and a body and a first protrusion and a second protrusion arranged on the surface of the body. The rolling brush driving device is used for driving the rolling brush to rotate around the central axis of the rolling brush. Wherein, the first protrusion is a cylindrical protrusion; the second protrusion is a needle-shaped protrusion; the wafer can be placed between the two rolling brushes, and the wafer surface is in contact with the cylindrical protrusion and the needle-shaped protrusion. In the embodiment of the application, a plurality of needle-shaped protrusion structures are arranged at the gap of the cylindrical protrusion, the contact area of the whole rolling brush and the wafer surface is increased, and the utilization rate of the chemical cleaning liquid is improved. At the same time, the tip of the needle-shaped protrusion can effectively wipe off the fine particles on the wafer surface, so that a more excellent decontamination effect is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a wafer cleaning device, a chemical mechanical polishing machine and a cleaning method. BACKGROUND

[0002] Complementary metal-oxide semiconductor image sensor (CMOS Image Sensor, CIS) is to improve the integration of semiconductor devices through multi-layer wiring process in the manufacture of optical image in very large scale integrated circuit. However, the application of high aspect ratio deposition filling process and multi-layer interconnection technology makes the wafer surface appear large fluctuation, which leads to focusing difficulty in subsequent photolithography process, and reduces the control ability of line width and pattern. Therefore, the planarization treatment of wafer surface becomes particularly important. Chemical mechanical polishing (CMP) as a kind of global planarization technology can effectively remove the excess material on the wafer surface. The polishing of wafer is mainly realized by providing chemical reaction and uniform mechanical force under the joint action of polishing liquid, polishing head and polishing pad. After polishing, a large amount of polishing particles, polishing products (polishing pad debris, metal ions, oxides, etc.) and organic matter will be left on the wafer surface. If such residues accumulate on the wafer surface without reasonable removal, it will cause scratches, device short circuit and other problems, and reduce the yield of products.

[0003] Based on the above problems, the polished wafer will be cleaned by chemical cleaning liquid and rolling brush in the cleaning device to remove the residues on the wafer surface. However, the rolling brush used in the prior art has the defects of small contact area with the wafer surface, relatively fixed position, easy contamination of the surface of the rolling brush, large gap between the cylindrical protrusions and low removal rate of nano-level particles. In the wafer cleaning process, it is easy to cause incomplete removal of residues, uneven wear of rolling brush, short service life, serious waste of chemical cleaning liquid and deionized water, and other problems. The rolling brush with stripe-shaped protrusions in the prior art can effectively increase the contact area with the wafer, but has the problem of uneven contact stress. There is also a rolling brush with a polymer having a hydrogen bonding group on the surface, but it needs to be supplemented with a complex chemical cleaning liquid to effectively remove the contamination on the surface of the rolling brush. In addition, some existing machines use sponge brushes for secondary removal of small particles based on the rolling brush scrubbing, which not only increases the complexity of the machine mechanism, but also makes the CMP process cumbersome. SUMMARY

[0004] Based on the deficiencies and defects of the prior art, the present application provides a wafer cleaning device, a chemical mechanical polishing machine and a cleaning method. In one aspect, the present application provides a wafer cleaning device, comprising: a roller brush comprising a body and first and second protrusions arranged on the surface of the body; a roller brush driving device; the roller brush driving device is used to drive the roller brush to rotate around the central axis of the roller brush.

[0005] In some embodiments, the first protrusion is a cylindrical protrusion; the second protrusion is a needle-shaped protrusion; the wafer can be placed between the two roller brushes, and the surface of the wafer is in contact with the cylindrical protrusion and the needle-shaped protrusion.

[0006] In some embodiments, the wafer cleaning device further comprises: a circulating liquid supply device; a liquid supply pipe; the circulating liquid supply device is connected to the liquid supply pipe and forms a liquid supply circulation loop; wherein a part of the liquid supply pipe is arranged inside the roller brush; the circulating liquid supply device can adjust at least one parameter of the liquid flow, temperature or pressure in the liquid supply pipe.

[0007] In some embodiments, the wafer cleaning device further comprises: a plug-in fixing member for fixing the liquid supply pipe; wherein the plug-in fixing member is used to extract or extend into the liquid supply pipe during replacement of the roller brush.

[0008] In some embodiments, the liquid supply pipe is a U-shaped return pipe or a straight-through pipe; the liquid supply pipe is in a fixed state during liquid passage and does not rotate with the roller brush; the surface of the liquid supply pipe is provided with through holes; the distance between the through holes is 1-6 mm; the diameter of the through holes is 0.5-3 mm.

[0009] In some embodiments, the liquid supply pipe comprises at least two sections of liquid supply pipe; wherein a part of at least one section of the liquid supply pipe is arranged inside the roller brush.

[0010] In some embodiments, the wafer cleaning device further comprises: a wafer driving device; the wafer driving device rotates the wafer and moves it along a direction parallel to the central axis of the roller brush.

[0011] In some embodiments, the wafer driving device comprises a driving wheel and a driven wheel for rotating the wafer; the driving wheel and the driven wheel rotate the wafer.

[0012] In some embodiments, the wafer can be cleaned by at least one of the following movements: rotation of the roller brush, rotation of the wafer or movement of the wafer along a direction parallel to the central axis of the roller brush.

[0013] In some embodiments, the length of the roller brush is 1-2 times the diameter of the wafer.

[0014] In some embodiments, the body is a solidified polymer with a porosity of no less than 80%; the body has a cylindrical channel in the center for deionized water and chemical cleaning solution to flow through; the sidewall of the body is provided with a plurality of holes that are all connected to the cylindrical channel.

[0015] In some embodiments, the cylindrical protrusions are uniformly distributed on the surface of the body; the interval between the cylindrical protrusions is 3-9 mm; the surface of the cylindrical protrusions has a through hole that is connected to the hole of the body.

[0016] In some embodiments, the needle-shaped protrusions are uniformly distributed around each cylindrical protrusion; the taper angle of the needle-shaped protrusions is 1-20 degrees; the height of the needle-shaped protrusions exceeds the upper surface of the cylindrical protrusions by 0-5 mm; the number ratio of the needle-shaped protrusions to the cylindrical protrusions is no less than 2.

[0017] In some embodiments, the body, the cylindrical protrusions and the needle-shaped protrusions are prepared by an integral forming process; the integral forming process is one of 3D printing, injection molding, molding process or transfer molding process.

[0018] In some embodiments, the surface of the rolling brush has a hydrophilic group; the hydrophilic group is at least one of hydroxyl, sulfonic acid group, carboxylic acid group, phosphoric acid group, betaine group or amino group.

[0019] In some embodiments, the upper surface of the cylindrical protrusion is a hydrophilic surface with a static water contact angle of less than 30 degrees; the outer surface of the body, the cylindrical surface of the cylindrical protrusion and the surface of the needle-shaped protrusion are hydrophobic surfaces with a static water contact angle of more than 120 degrees.

[0020] In some embodiments, the preparation method of the hydrophobic surface is one of low-temperature chemical vapor deposition, one-step immersion method, dip coating or electrostatic spraying; the hydrophobic surface has at least one of fluorocarbon group, silane, alkyl group, ester group, hydrocarbon group with more than 5 carbon atoms or nitro group.

[0021] In some embodiments, the hydrophilic surface is obtained after the rolling brush is subjected to overall hydrophobic treatment, the top end of the cylindrical protrusion is cut off to expose the surface of the porous matrix that is not subjected to hydrophobic treatment; after the top end of the cylindrical protrusion is cut off, the height of the cylindrical protrusion meets the preset size.

[0022] In another aspect, the present application provides a chemical mechanical polishing machine table comprising the wafer cleaning device.

[0023] In another aspect, the present application provides a method for cleaning a wafer by using the wafer cleaning device, characterized in that the method comprises the processes of wafer transmission, wafer cleaning and wafer transmission.

[0024] In some embodiments, the wafer transmission-in process is to place the wafer onto the wafer driving device by an external mechanical arm.

[0025] In some embodiments, the wafer cleaning process is to uniformly supply liquid into the inside of the rolling brush by the liquid supply pipe; the upper surface of the cylindrical protrusion and the needle-shaped protrusion are in uniform contact with the surface of the wafer during the wafer cleaning process; the rolling brush rotates under the driving of the rolling brush driving device during the wafer cleaning process; the wafer rotates under the driving of the driving wheel and the driven wheel of the wafer driving device during the wafer cleaning process; the wafer moves along the parallel direction of the central axis of the rolling brush under the driving of the wafer driving device during the wafer cleaning process; the liquid supply of the liquid supply pipe, the rotation of the rolling brush, the rotation of the wafer and the movement of the wafer are synchronously performed during the wafer cleaning process; and the liquid supplied in the liquid supply pipe is at least one of deionized water and chemical cleaning liquid.

[0026] In some embodiments, the wafer transmission-out process is to move the wafer from the wafer driving device by an external mechanical arm.

[0027] Compared with the prior art, the technical scheme of the embodiment of the present application has the following beneficial effects:

[0028] (1) The embodiment of the present application discards the traditional method of directly supplying liquid to the rolling brush body, and adopts the liquid supply pipe arranged in the inside of the rolling brush to supply liquid, thereby solving the problem of uneven water outflow of the protrusions on the surface of the rolling brush caused by the difference in liquid flow in the inside of the rolling brush in the prior art. Through the liquid supply of the liquid supply pipe, the same liquid supply amount can be obtained at any position in the inside of the rolling brush, and the uniform liquid outflow of the protrusion parts is ensured.

[0029] (2) In the embodiment of the present application, a plurality of needle-shaped protrusion structures are arranged at the gap of the cylindrical protrusion, the contact area of the whole rolling brush with the surface of the wafer is increased, and the utilization rate of the chemical cleaning liquid is improved. At the same time, the tip of the needle-shaped protrusion can effectively wipe off the fine particles on the surface of the wafer, so that a more excellent dirt removal effect is achieved.

[0030] (3) In the embodiment of the present application, the contact surface of the cylindrical protrusion and the wafer is a hydrophilic surface, which is beneficial to the uniform spreading of the cleaning liquid on the surface of the cylindrical protrusion to form a liquid film and contact with the wafer. The existence of the liquid film not only can improve the cleaning performance of the particles, but also can effectively avoid the contamination of the particles on the surface of the rolling brush.

[0031] (4) In addition to the top surface of the cylindrical protrusion being a hydrophilic surface, the outer surface of the rolling brush in the embodiment of the present application is a hydrophobic surface. By using the low adhesion and self-cleaning property of the hydrophobic surface, the adhesion of the cleaning residues on the surface of the rolling brush can be reduced, so that the service life and cleaning reliability of the rolling brush are improved.

[0032] (5) On the basis of the existing rotating brush and wafer rotation, the wafer cleaning in the embodiment of the present application increases the lateral movement of the wafer, i.e. moving along the direction parallel to the central axis of the rotating brush. This measure can make the rotating brush wear evenly, prolong the service life of the rotating brush and reduce the damage to the wafer during cleaning. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 A structure schematic diagram of a wafer cleaning device in the embodiment of the present application;

[0034] Figure 2 A structure schematic diagram of a rotating brush in the embodiment of the present application;

[0035] Figure 3 A position structure schematic diagram of the rotating brush and the U-shaped return pipe in the embodiment of the present application;

[0036] Figure 4 A position structure schematic diagram of the rotating brush and the straight-through pipe in the embodiment of the present application;

[0037] Figure 5 A water drop wetting state of the hydrophilic surface at the top of the cylindrical protrusion of the rotating brush in the embodiment of the present application;

[0038] Figure 6 A water drop wetting state of the hydrophobic surface of the rotating brush in the embodiment of the present application;

[0039] Wherein: 100-wafer cleaning device, 10-box, 20-pull-out type fixing part, 30-liquid supply pipe, 31-U-shaped return pipe, 32-straight-through pipe, 40-circulating liquid supply device, 50-wafer driving device, 51-driving wheel, 52-driven wheel, 60-rotating brush driving device, 70-rotating brush, 71-first protrusion, 72-second protrusion, 73-body, 74-cylindrical hole, 80-wafer, 90-deionized water. DETAILED DESCRIPTION

[0040] As described above, the rotating brush with the stripe-shaped protrusion in the prior art can effectively increase the contact area with the wafer, but has the problem of uneven contact stress, and the rotating brush with the polymer having the hydrogen bonding group on the surface, but needs to be supplemented with a complex chemical cleaning liquid to effectively remove the contamination on the surface of the rotating brush. In addition, some existing machines use a sponge brush for secondary removal of small particles on the basis of the rotating brush scrubbing, which not only increases the complexity of the machine mechanism and makes the CMP process cumbersome.

[0041] To address the aforementioned problems, this invention abandons the traditional method of directly supplying liquid to the roller brush body. Instead, it employs a liquid infusion pipe located inside the roller brush for liquid supply, thus resolving the issue of uneven water output from raised areas on the roller brush surface caused by differences in liquid flow rate within the roller brush in the prior art. Through the liquid infusion pipe, the same liquid supply can be obtained at any location inside the roller brush, ensuring uniform liquid output from raised areas.

[0042] In this embodiment of the invention, multiple needle-like protrusions are provided at the gaps between the cylindrical protrusions, increasing the overall contact area between the roller brush and the wafer surface, and improving the utilization rate of the chemical cleaning solution. Simultaneously, the tips of the needle-like protrusions can effectively remove fine particles from the wafer surface, thereby achieving a superior cleaning effect.

[0043] In this embodiment of the invention, the contact surface between the cylindrical protrusion and the wafer is a hydrophilic surface. This facilitates the uniform spread of the cleaning solution on the cylindrical protrusion surface, forming a liquid film that contacts the wafer. The presence of this liquid film not only improves the cleaning performance of the particles but also effectively prevents particle contamination on the roller brush surface. Except for the top surface of the cylindrical protrusion, which is hydrophilic, the outer surface of the roller brush in this invention is hydrophobic. Utilizing the low adhesion and self-cleaning properties of the hydrophobic surface, the adhesion of cleaning residues on the roller brush surface can be reduced, thereby improving the service life and cleaning reliability of the roller brush. Based on existing roller brush rotation and wafer rotation, the wafer cleaning in this invention adds lateral movement of the wafer, i.e., movement along a direction parallel to the central axis of the roller brush. This measure allows for uniform wear of the roller brush, extending its service life and reducing damage to the wafer during the cleaning process.

[0044] To make the above-mentioned objectives, features and beneficial effects of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0045] refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a wafer cleaning device 100 according to an embodiment of the present invention.

[0046] like Figure 1 As shown, the wafer cleaning apparatus 100 may include a roller brush 70 and a roller brush drive device 60. The roller brush drive device 60 is used to drive the roller brush 70 to rotate about the central axis of the roller brush 70.

[0047] Furthermore, the wafer cleaning apparatus 100 may include a circulating liquid supply device 40 and a liquid delivery pipe 30. The circulating liquid supply device 40 is connected to the liquid delivery pipe 30 and forms a liquid supply circulation loop. A portion of the liquid delivery pipe 30 is placed inside the roller brush 70. The circulating liquid supply device 40 is capable of adjusting at least one parameter of the liquid flow rate, temperature, or pressure in the liquid delivery pipe 30.

[0048] Further, the wafer cleaning device 100 can comprise a plug-in fixing member 20 for fixing the infusion tube 30. The plug-in fixing member 20 is used to pull out or extend into the infusion tube 30 during replacement of the roller brush 70.

[0049] Further, the wafer cleaning device 100 can comprise a wafer driving device 50. The wafer driving device 50 rotates the wafer 80 and moves the wafer 80 along a direction parallel to the central axis of the roller brush 70. Optionally, the wafer driving device 50 can comprise a driving wheel 51 and a driven wheel 52 for rotating the wafer 80.

[0050] Further, the wafer cleaning device 100 can comprise a box body 10.

[0051] In the embodiments of the present application, referring to Figures 2 to 4 , the roller brush 70 can comprise a body 73 and a first protrusion 71 and a second protrusion 72 arranged on the surface of the body 73.

[0052] In a specific embodiment, the body 73 is a solidified polymer with a porosity not less than 80%. The body 73 has a cylindrical channel 74 in the center for the flow of deionized water and chemical cleaning solution. The sidewall of the body 73 is provided with a plurality of micro-holes (not shown in the figure) that can be connected to the cylindrical channel 74.

[0053] In a specific embodiment, the first protrusion 71 can be a cylindrical protrusion; the second protrusion 72 can be a needle-shaped protrusion. The wafer 80 can be placed between the two roller brushes 70. The surface of the wafer 80 can be in contact with the cylindrical protrusions and the needle-shaped protrusions. The cylindrical protrusions are uniformly distributed on the surface of the body 73. The spacing between the cylindrical protrusions is 3 to 9 mm. The surface of the cylindrical protrusion has a through hole that is connected to the cylindrical channel 74 of the body.

[0054] Specifically, the needle-shaped protrusions can be uniformly distributed around each cylindrical protrusion; the taper angle of the needle-shaped protrusion is 1 to 20 degrees; the height of the needle-shaped protrusion exceeds the upper surface of the cylindrical protrusion by 0 to 5 mm; the number ratio of the needle-shaped protrusions to the cylindrical protrusions is not less than 2.

[0055] Specifically, the surface of the roller brush 70 has a hydrophilic group. The hydrophilic group is at least one of a hydroxyl group, a sulfonic acid group, a carboxylic acid group, a phosphoric acid group, a betaine group, or an amino group.

[0056] Specifically, the upper surface of the cylindrical protrusion can be a hydrophilic surface with a static water contact angle less than 30 degrees. Referring to Figure 5 , the wetting state of the water droplet 90 on the hydrophilic surface of the top end of the cylindrical protrusion of the roller brush 70. The outer surface of the body 73, the cylindrical surface of the cylindrical protrusion, and the surface of the needle-shaped protrusion are hydrophobic surfaces with a static water contact angle greater than 120 degrees. Referring to Figure 6, the wetting state of the hydrophobic surface of the roller brush 70 by water droplets 90.

[0057] Specifically, the method for preparing the hydrophobic surface is one of low-temperature chemical vapor deposition, one-step immersion method, dip-coating or electrostatic spraying. The hydrophobic surface has at least one of fluorocarbon group, silane group, alkyl group, ester group, hydrocarbon group with more than 5 carbon atoms or nitro group.

[0058] Specifically, the hydrophilic surface is obtained after cutting the top of the cylindrical protrusion to expose the non-hydrophobic porous substrate surface after the roller brush 70 is subjected to the overall hydrophobic treatment. After cutting the top of the cylindrical protrusion, the height of the cylindrical protrusion satisfies the preset size.

[0059] Specifically, the body 73, the cylindrical protrusion and the needle-like protrusion can be prepared by an integral molding process. The integral molding process can be one of 3D printing, injection molding, molding process or transfer molding process.

[0060] Specifically, the length of the roller brush 70 is 1 to 2 times the diameter of the wafer 80.

[0061] In a specific embodiment, referring to Figure 3 and Figure 4 , the infusion tube 30 can be a U-shaped return tube 31 (as shown in Figure 3 ) or a straight-through tube 32 (as shown in Figure 4 ). The infusion tube 30 is in a fixed state during the liquid infusion process and does not rotate with the roller brush 70.

[0062] In a specific embodiment, the surface of the infusion tube 30 can be provided with through holes at equal intervals. When the deionized water passes through the infusion tube 30, the deionized water can flow into the cylindrical hole 74 through the through holes. The distance between the through holes can be 1 to 6 mm. The diameter of the through holes can be 0.5 to 3 mm.

[0063] In a specific embodiment, the infusion tube 30 includes at least two sections of infusion tube; wherein at least one section of the infusion tube is placed inside the roller brush 70.

[0064] In a specific embodiment, the wafer 80 can be cleaned by at least one of the rotation of the roller brush 70, the rotation of the wafer 80 or the movement of the wafer 80 along the direction parallel to the central axis of the roller brush 70.

[0065] The present application provides a method for cleaning a wafer by the wafer cleaning device 100 as shown in Figure 1 , including the processes of wafer feeding in, wafer cleaning and wafer feeding out.

[0066] In a specific embodiment, the wafer feeding in process is to place the wafer 80 on the wafer driving device 50 by an external mechanical hand.

[0067] Specifically, the wafer cleaning process is that the liquid supply device 40 supplies liquid to the inside of the brush roll 70 through the liquid supply pipe 30.

[0068] Specifically, the wafer cleaning process is that the cylindrical convex upper surface and the needle-shaped convex of the brush roll 70 are in uniform contact with the surface of the wafer 80. During the wafer cleaning process, the brush roll 70 rotates under the drive of the brush roll driving device 60. During the wafer cleaning process, the wafer 80 rotates under the drive of the driving wheel 51 and the driven wheel 52 of the wafer driving device 50. During the wafer cleaning process, the wafer 80 moves in parallel with the central axis of the brush roll 70 under the drive of the wafer driving device 50. During the wafer cleaning process, the liquid supply of the liquid supply pipe 30, the rotation of the brush roll 70, the rotation of the wafer 80 and the movement of the wafer 80 are synchronized. The liquid supplied in the liquid supply pipe 30 is at least one of deionized water and chemical cleaning liquid.

[0069] Specifically, the wafer transmission process is that the wafer 80 is moved out of the wafer driving device 50 by the external mechanical arm.

[0070] Although the present application has been disclosed as above, the present application is not limited to the above. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, and the protection scope of the present application should be defined by the scope of the claims.

Claims

1. A wafer cleaning apparatus, characterized by comprising: The application relates to a wafer cleaning device, which comprises: a rolling brush, which comprises a body and first and second protrusions arranged on the surface of the body; a rolling brush driving device; the rolling brush driving device is used for driving the rolling brush to rotate around the central axis of the rolling brush; the first protrusion is a cylindrical protrusion; the second protrusion is a needle-shaped protrusion; a wafer can be arranged between the two rolling brushes, and the surface of the wafer is in contact with the cylindrical protrusion and the needle-shaped protrusion; the upper surface of the cylindrical protrusion is a hydrophilic surface, and the static water contact angle of the surface is less than 30 degrees; the outer surface of the body, the cylindrical surface of the cylindrical protrusion and the surface of the needle-shaped protrusion are hydrophobic surfaces, and the static water contact angle of the surfaces is greater than 120 degrees.

2. The wafer cleaning apparatus of claim 1, wherein The application further comprises: a circulating liquid supply device; a liquid supply pipe; the circulating liquid supply device is connected with the liquid supply pipe and forms a liquid supply circulating loop; wherein a part of the liquid supply pipe is arranged inside the rolling brush; the circulating liquid supply device can adjust at least one parameter of the liquid flow, temperature or pressure in the liquid supply pipe.

3. The wafer cleaning apparatus of claim 2, wherein The application further comprises: a plug-in fixing member used for fixing the liquid supply pipe; wherein the plug-in fixing member is used for drawing out or inserting into the liquid supply pipe during replacement of the rolling brush.

4. The wafer cleaning device according to claim 3, wherein: the liquid supply pipe is a U-shaped return pipe or a straight-through pipe; the liquid supply pipe is in a fixed state during liquid passing and does not rotate with the rolling brush; the surface of the liquid supply pipe is provided with through holes; the spacing between the through holes is 1-6 mm; and the aperture of the through holes is 0.5-3 mm.

5. The wafer cleaning device according to claim 4, wherein: the liquid supply pipe comprises at least two sections of liquid supply pipes; and at least one section of the liquid supply pipe is arranged inside the rolling brush.

6. The wafer cleaning apparatus of claim 4, wherein The application further comprises: a wafer driving device; the wafer driving device drives the wafer to rotate and move along the direction parallel to the central axis of the rolling brush.

7. The wafer cleaning device according to claim 6, wherein: the wafer driving device comprises a driving wheel and a driven wheel for driving the wafer to rotate; the driving wheel and the driven wheel drive the wafer to rotate.

8. The wafer cleaning device according to claim 7, wherein: the wafer can be cleaned through at least one of the following motions: rotation of the rolling brush, rotation of the wafer or movement of the wafer along the direction parallel to the central axis of the rolling brush.

9. The wafer cleaning apparatus of claim 1, wherein the length of the rolling brush is 1-2 times the diameter of the wafer.

10. The wafer cleaning apparatus of claim 1, wherein the body is a solidified polymer with a porosity of not less than 80%; the central part of the body is provided with a cylindrical channel for passing deionized water and chemical cleaning liquid; and the side wall of the body is provided with a plurality of holes which are all connected to the cylindrical channel.

11. The wafer cleaning apparatus of claim 1, wherein the cylindrical protrusions are uniformly distributed on the surface of the body; the spacing between the cylindrical protrusions is 3-9 mm; the surface of the cylindrical protrusions is provided with through holes which are connected to the holes of the body.

12. The wafer cleaning apparatus of claim 1, wherein the needle-shaped protrusions are uniformly distributed around each cylindrical protrusion; the taper angle of the needle-shaped protrusions is 1-20 degrees; the height of the needle-shaped protrusions exceeds the upper surface of the cylindrical protrusions by 0-5 mm; and the number ratio of the needle-shaped protrusions to the cylindrical protrusions is not less than 2.

13. The wafer cleaning apparatus of claim 1, wherein The body, the cylindrical protrusion and the needle-shaped protrusion are prepared by an integral molding process; the integral molding process is one of 3D printing, injection molding, molding process or transfer molding process.

14. The wafer cleaning apparatus of claim 1, wherein The surface of the rolling brush has hydrophilic groups; the hydrophilic groups are at least one of hydroxyl, sulfonic acid group, carboxylic acid group, phosphoric acid group, betaine group or amino group.

15. The wafer cleaning apparatus of claim 1, wherein The preparation method of the hydrophobic surface is one of low-temperature chemical vapor deposition, one-step immersion method, dip coating or electrostatic spraying; the hydrophobic surface has at least one of fluorocarbon group, silane, alkyl group, ester group, hydrocarbon group with more than 5 carbon atoms or nitro group.

16. The wafer cleaning apparatus of claim 15, wherein The hydrophilic surface is obtained after the whole hydrophobic treatment of the rolling brush, the cutting of the top of the cylindrical protrusion and the exposure of the surface of the porous substrate which is not hydrophobic treated; after the cutting of the top of the cylindrical protrusion, the height of the cylindrical protrusion meets the preset size.

17. A chemical mechanical polisher, comprising: The wafer cleaning device comprises a wafer cleaning device according to any one of claims 1 to 16.

18. A method of cleaning a wafer by a wafer cleaning apparatus, the method comprising: rotating the wafer about a first axis; rotating the wafer about a second axis; and rotating the wafer about a third axis. The wafer cleaning device comprises: The wafer cleaning device comprises: The wafer cleaning device comprises: The rolling brush comprises a body and first and second protrusions arranged on the surface of the body; The rolling brush driving device is used to drive the rolling brush to rotate around the central axis of the rolling brush; The first protrusion is a cylindrical protrusion; the second protrusion is a needle-shaped protrusion; a wafer can be placed between the two rolling brushes, and the surface of the wafer is in contact with the cylindrical protrusion and the needle-shaped protrusion; The upper surface of the cylindrical protrusion is a hydrophilic surface, and the static water contact angle of the surface is less than 30 degrees; the outer surface of the body, the cylindrical surface of the cylindrical protrusion and the surface of the needle-shaped protrusion are hydrophobic surfaces, and the static water contact angle of the surfaces is greater than 120 degrees.

19. The method of claim 18, wherein, The rolling brush driving device further comprises a circulating liquid supply device and a liquid delivery pipe; The circulating liquid supply device is connected with the liquid delivery pipe and forms a liquid supply circulating loop; The liquid delivery pipe is partially arranged inside the rolling brush; the circulating liquid supply device can adjust at least one parameter of the liquid flow, temperature or pressure in the liquid delivery pipe.

20. The method of claim 19, wherein, The rolling brush driving device further comprises a plug-in fixing part for fixing the liquid delivery pipe; the plug-in fixing part is used to pull out or insert into the liquid delivery pipe during replacement of the rolling brush.

21. The method of claim 20, wherein, The liquid delivery pipe is a U-shaped return pipe or a straight-through pipe; the liquid delivery pipe is in a fixed state during liquid delivery and does not rotate with the rolling brush; the surface of the liquid delivery pipe is provided with through holes; the distance between the through holes is 1 to 6 mm; the diameter of the through holes is 0.5 to 3 mm.

22. The method of claim 21, wherein, The rolling brush driving device further comprises that the liquid delivery pipe comprises at least two sections of liquid delivery pipe; at least one section of the liquid delivery pipe is arranged inside the rolling brush.

23. The method of claim 22, wherein, The rolling brush driving device further comprises a wafer driving device; the wafer driving device rotates and moves the wafer along the direction parallel to the central axis of the rolling brush.

24. The method of claim 23, wherein, The wafer driving device comprises a driving wheel and a driven wheel for rotating the wafer.

25. The method of claim 24, wherein: The wafer feeding process is to place the wafer on the wafer driving device by an external mechanical hand.

26. The method of claim 25, wherein, the wafer cleaning process is that the circulating liquid supply device supplies liquid to the inside of the rolling brush through the liquid supply pipe uniformly; the wafer cleaning process is that the upper surface of the cylindrical protrusion and the needle-shaped protrusion are in uniform contact with the surface of the wafer; the wafer cleaning process is that the rolling brush rotates under the driving of the rolling brush driving device; the wafer cleaning process is that the wafer rotates under the driving of the driving wheel and the driven wheel of the wafer driving device; the wafer cleaning process is that the wafer moves in parallel along the central axis of the rolling brush under the driving of the wafer driving device; the wafer cleaning process is that the liquid supply of the liquid supply pipe, the rotation of the rolling brush, the rotation of the wafer and the movement of the wafer are synchronous; the liquid supplied in the liquid supply pipe is at least one of deionized water and chemical cleaning liquid.

27. The method of claim 26, wherein, the wafer transmission process is that the wafer is moved out of the wafer driving device by the external mechanical arm.

Images