SMD full-color LED lamp bead lead welding device

Abstract

The application discloses a kind of SMD full-color LED lamp bead lead welding devices, it includes conveying guide rail, reflow soldering mechanism, the front and rear of the conveying guide rail respectively is equipped with the control guide rail being arranged in parallel with it, control guide rail is installed with the elevator being moved controllably, the output end of the elevator top is fixed with the crossbar being parallel with conveying guide rail, multiple tin paste coating mechanisms being arranged in parallel and spanning conveying guide rail are installed between the two sides of the crossbar, the reflow soldering mechanism is arranged at the right side of tin paste coating mechanism, and the tin paste coating mechanism includes the drying device being arranged in middle portion and being used for drying tin paste layer, coating assembly being arranged at the two sides of drying device and being used for coating tin paste layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED lamp bead processing, in particular to a SMD full-color LED lamp bead lead welding device. BACKGROUND

[0002] The SMD full-color LED lamp bead is a kind of LED assembly, which is manufactured by using surface mount technology (SMT), so it is also called SMD LED lamp bead. In the process of SMD full-color LED lamp bead lead welding, the SMD LED lamp bead is first placed on the designed position of the circuit board and accurately attached by using the automatic mounting machine for SMT technology. Then, the SMD LED lamp bead lead is aligned with the solder pad on the circuit board, and the SMD LED lamp bead is welded by high-temperature melting welding iron or hot air gun, so as to be firmly fixed on the circuit board.

[0003] At present, when the SMD full-color LED lamp bead lead is welded by using the reflow soldering method, the melting of the tin paste will cause the position deviation of the full-color LED lamp bead lead. This is because the current tin paste layer generally adopts the full-coating lead method, so that in the welding process, the surface tension of the tin paste will cause the deformation of the welding point, which is easy to drive the lead, thereby causing the position deviation of the LED lamp bead lead. In addition, during the melting of the tin paste, the tin paste attached to the lead is uneven, which causes the welding to be not firm, and the problems such as open welding or short circuit are easy to occur.

[0004] Therefore, the skilled person in the art provides a SMD full-color LED lamp bead lead welding device to solve the problems raised in the background art. SUMMARY

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a SMD full-color LED lamp bead lead welding device, which comprises a conveying guide rail, a reflow soldering mechanism, the front and back of the conveying guide rail are respectively provided with a control guide rail arranged in parallel therewith, a lifter capable of being controlled to move is installed on the control guide rail, a crossbar parallel to the conveying guide rail is fixed to the top output end of the lifter, a plurality of tin paste coating mechanisms arranged in parallel and crossing the conveying guide rail are installed between the two sides of the crossbar, the reflow soldering mechanism is arranged on the right side of the tin paste coating mechanism, and the tin paste coating mechanism comprises a drying device arranged in the middle and used for drying the tin paste layer, and a coating assembly arranged on both sides of the drying device and used for coating the tin paste layer.

[0006] Further, as a preferred, a positioning strip hole is formed in the crossbar, and a mountain-shaped clamp is detachably and slidably assembled on the positioning strip hole.

[0007] Further, as a preferred, the middle part of the mountain-shaped clamp can penetrate the positioning bar hole, and a connecting groove for connecting the connecting sheet is arranged, the connecting sheet is used for connecting the tin paste coating mechanism, and the elastic clamping pieces of the upper and lower ends of the mountain-shaped clamp are clamped and fixed on the upper and lower lever surfaces of the lever, respectively.

[0008] Further, as a preferred, the coating assembly comprises a connecting seat fixed on the lever, a first telescopic rod and a second telescopic rod are arranged on the connecting seat in parallel, an output end of the first telescopic rod is fixed with a horizontal rod one which crosses the conveying guide rail, a plurality of scraping assembly are arranged on the horizontal rod one, an output end of the second telescopic rod is fixed with a horizontal rod two which is parallel to the horizontal rod one, a stop assembly corresponding to the scraping assembly is arranged on the horizontal rod two, and a horizontal rod three parallel to the horizontal rod one is arranged on the connecting seat, a hanging rod corresponding to the scraping assembly is arranged on the horizontal rod three, and a tin paste supply box and a surrounding mold box are arranged on the upper and lower ends of the hanging rod and are connected.

[0009] Further, as a preferred, a plurality of surrounding plates are fixed on one side of the surrounding mold box to form a surrounding mold frame, a surrounding grid opening corresponding to the lead is formed in the surrounding grid frame, the surrounding grid opening and the lead form a C-shaped groove, and an extrusion cavity is arranged in the surrounding mold box, and a side wall of the surrounding mold box close to the surrounding plate is provided with a discharge slot communicating with the extrusion cavity.

[0010] Further, as a preferred, the side wall of the surrounding mold box where the discharge slot is arranged is arranged in an outwardly expanding and inclined structure.

[0011] Further, as a preferred, the scraping assembly comprises a second lifting rod fixed with the horizontal rod one, a second arm rod fixed with the second lifting rod and crossing the lead, a second rotator arranged on the end of the second arm rod, a second shaft rod parallel to the second arm rod arranged on the second rotator, and a scraping plate corresponding to the number of leads arranged on the second shaft rod.

[0012] Further, as a preferred, the scraping plate comprises a second scraping plate sleeved on the second shaft rod and connected by a reset torsional spring, the width of the second scraping plate is equal to the width of the lead, and a first scraping plate is arranged on both sides of the second scraping plate.

[0013] Further, as a preferred, the stop assembly comprises a first lifting rod fixed with the horizontal rod two, a first arm rod fixed with the first lifting rod and crossing the lead, a first rotator arranged on the end of the first arm rod, a first shaft rod parallel to the first arm rod arranged on the first rotator, and a baffle arranged on both sides of the first shaft rod.

[0014] Further, as a preferred, the drying device comprises a heating box crossing the conveying guide rail, a flow guide pipe and a cylindrical cover are arranged on the upper and lower ends of the heating box, respectively, and an air outlet is arranged on the wall of the flow guide pipe and communicates with the cylindrical cover.

[0015] Compared with the prior art, the SMD full-color LED lamp bead lead welding device has the following beneficial effects:

[0016] The tin paste coating assembly is arranged to coat the tin paste layer around the lead, and the tin paste layer is coated multiple times to form a groove structure in one layer, thereby improving the thickness, heat resistance and stability of the welding point, and the height of the groove structure is higher than the height of the lead, so that the impact resistance of the welding point is improved, thereby reducing the volatility of the welding point when impacted, avoiding loosening and falling off in a vibrating environment, and increasing the fullness and stability of the tin paste layer. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a structure schematic diagram of the SMD full-color LED lamp bead lead welding device;

[0018] Figure 2 It is a structure schematic diagram of the SMD full-color LED lamp bead lead welding device;

[0019] Figure 3 It is a structure schematic diagram of the SMD full-color LED lamp bead lead welding device;

[0020] Figure 4 It is a structure schematic diagram of the SMD full-color LED lamp bead lead welding device;

[0021] Figure 5 It is a structure schematic diagram of the SMD full-color LED lamp bead lead welding device;

[0022] Figure 6 It is a structure schematic diagram of the SMD full-color LED lamp bead lead welding device;

[0023] Figure 7 It is a structure schematic diagram of the SMD full-color LED lamp bead lead welding device;

[0024] Figure 8 It is a structure schematic diagram of the SMD full-color LED lamp bead lead welding device;

[0025] Fig. 1, conveying guide rail; 2, control guide rail; 3, lifter; 4, crossbar; 5, solder paste coating mechanism; 6, reflow soldering mechanism; 41, positioning strip hole; 42, mountain-shaped clamp; 43, connecting sheet; 411, elastic clamp sheet; 412, connecting groove; 51, drying device; 52, coating assembly; 511, heating box; 512, flow guide pipe; 513, air outlet; 514, bell-shaped cover; 521, connecting seat; 522, telescopic rod one; 523, telescopic rod two; 524, crossbar one; 525, crossbar two; 526, crossbar three; 7, stop assembly; 8, scraping coating assembly; 9, surrounding coating mold box; 5261, boom; 5262, solder paste supply box; 71, lifting rod one; 72, arm rod one; 73, rotator one; 74, shaft rod one; 75, baffle; 81, lifting rod two; 82, arm rod two; 83, rotator two; 84, shaft rod two; 85, scraper; 851, scraper one; 852, scraper two; 853, reset torsional spring; 91, extrusion cavity; 92, discharge gap; 93, partition plate. DETAILED DESCRIPTION

[0026] REFERENCE Figures 1-8 The present application provides a technical solution: a SMD full-color LED lamp bead lead welding device, which comprises a conveying guide rail 1 and a reflow soldering mechanism 6, the front and back of the conveying guide rail 1 are respectively provided with control guide rails 2 arranged in parallel, a lifter 3 capable of being controlled to move is installed on the control guide rail 2, a crossbar 4 parallel to the conveying guide rail 1 is fixed to the top output end of the lifter 3, a plurality of solder paste coating mechanisms 5 arranged in parallel and crossing the conveying guide rail 1 are installed between the two sides of the crossbar 4, the reflow soldering mechanism 6 is arranged on the right side of the solder paste coating mechanism 5, and the solder paste coating mechanism 5 comprises a drying device 51 arranged in the middle and used for drying a solder paste layer and a coating assembly 52 arranged on both sides of the drying device 51 and used for coating the solder paste layer.

[0027] In this embodiment, during the packaging process of the SMD full-color LED lamp bead, a thin solder paste layer is pre-coated on the lamp panel used for packaging the SMD full-color LED lamp bead, which is used for the initial fixation of the SMD full-color LED lamp bead lead, and the SMD full-color LED lamp bead lead is placed on the upper surface of the thin solder paste layer, and the coating area of the thin solder paste layer is the maximum area formed by the lead. Figure 1 The structure of the packaged lamp panel on the left side of the conveying guide rail 1 is shown in the schematic view.

[0028] In this embodiment, the positioning strip hole 41 is arranged in the connecting rod 4, and a mountain-shaped clamp 42 is detachably and slidably assembled on the positioning strip hole 41; the middle part of the mountain-shaped clamp 42 can penetrate the positioning strip hole 41, and a connecting groove 412 for connecting a connecting sheet 43 is arranged in the mountain-shaped clamp 42, the connecting sheet 43 is used for connecting the tin paste coating mechanism 5, and the elastic clamping sheets 411 at the upper and lower ends of the mountain-shaped clamp 42 can be clamped and fixed on the upper and lower rod surfaces of the connecting rod 4, respectively; that is, the tin paste coating mechanism 5 can be easily moved by detaching the elastic clamping sheets from the connecting rod, so that the interval between the left and right lamp bead lines on the lamp panel can be quickly adjusted, and the connecting strip is used for connecting the drying device and the coating assembly at both ends of the connecting rod.

[0029] In this embodiment, the coating assembly 52 includes a connecting seat 521 fixed on the connecting rod 4, the connecting seat 521 is provided with a plurality of parallel arranged telescopic rods 522 and 523, the output end of the telescopic rod 522 is fixed with a horizontal rod 524 which crosses the conveying guide rail, a plurality of scraping coating assemblies 8 are arranged on the horizontal rod 524, the output end of the telescopic rod 523 is parallel to the horizontal rod 524, and a horizontal rod 525 is arranged on the output end of the telescopic rod 523, a plurality of stop assemblies 7 corresponding to the scraping coating assemblies 8 are arranged on the horizontal rod 525, and a horizontal rod 526 parallel to the horizontal rod 524 is arranged on the connecting seat 521, a plurality of hanging rods 5261 corresponding to the scraping coating assemblies 8 are arranged on the horizontal rod 526, and a tin paste supply box 5262 and a surrounding mold box 9 are arranged on the upper and lower ends of the hanging rod 5261, respectively; that is, the coating assembly is designed to coat the tin paste layer around the lead in a surrounding manner, and the tin paste layer is coated in a plurality of times, and a groove structure with a laminated structure is formed, so that the thickness, heat resistance and stability of the welding point are improved, the height of the groove structure is higher than the height of the lead, and the impact resistance of the welding point is improved, so that the fluctuation of the welding point when impacted is reduced, the falling and falling of the welding point in the vibration environment are avoided, and the fullness and stability of the tin paste layer are improved; in addition, the groove structure can well protect the lead and improve the fixing effect of the lead, and can prevent the lead from being affected by excessive heat and force in the reflow soldering process, so that the welding quality and reliability are improved.

[0030] In this embodiment, a plurality of partition plates 93 are fixed on one side of the surrounding mold box 9 to form a surrounding mold frame, a surrounding gate corresponding to the lead is formed in the surrounding mold frame, and a C-shaped groove is formed between the surrounding gate and the lead (combined with the surrounding gate and the lead in the following description). Figure 6The surrounding cover die box 9 is provided with an extrusion cavity 91, and the side wall of the surrounding cover die box 9 is provided with a discharging gap 92 which is in communication with the extrusion cavity 91. That is, according to the number n of the surrounding lead wires required by a group of surrounding cover die boxes, the number of the surrounding partitions on one side of the surrounding cover die box is set to n+1, so that each lead wire is provided with a C-shaped groove. The solder paste is supplied to the extrusion cavity through the solder paste supply box, and then discharged from the discharging gap to one end of the C-shaped groove. As a preferred embodiment, before the solder paste is coated, the volume m of the solder paste to be coated in the C-shaped groove is divided into m1+m2+...+mx, and x is set to 3 in the structure, that is, the solder paste is coated three times. The volume of the solder paste layer can also be slightly changed each time, for example, the volume of the solder paste coated near the center can be set to be larger, so that the solder paste can flow more fully when it is melted, and then wrapped around the lead wire.

[0031] In the embodiment, the side wall of the surrounding cover die box 9 where the discharging gap 92 is located is provided with an outwardly expanding inclined structure.

[0032] In the embodiment, the scraping assembly 8 includes a lifting rod two 81 which is fixedly connected with the horizontal rod two 524, the lower end of the lifting rod two 81 is fixedly connected with an arm rod two 82 which crosses the lead wire, the end of the arm rod two 82 is provided with a rotating device two 83, the rotating device two 83 is provided with a shaft rod two 84 which is parallel to the arm rod two 84, and the shaft rod two 84 is provided with a scraping plate 85 which corresponds to the number of the lead wires. The scraping plate 85 includes a scraping plate two 852 which is sleeved on the shaft rod two 84 and connected with the shaft rod two 84 through a reset torsion spring 853, the width of the scraping plate two 852 is equal to the width of the lead wire, and the scraping plate two 852 is provided with a scraping plate one 851 on both sides. The blocking assembly 7 includes a lifting rod one 71 which is fixedly connected with the horizontal rod two 525, the lower end of the lifting rod one 71 is fixedly connected with an arm rod one 72 which crosses the lead wire, the end of the arm rod one 72 is provided with a rotating device one 73, the rotating device one 73 is provided with a shaft rod one 74 which is parallel to the arm rod one 74, and the shaft rod one 74 is provided with a blocking plate 75 which is located on both sides of the lead wire. When the scraping assembly scrapes and spreads the discharged solder paste in the C-shaped groove, the scraping plate two, the scraping plate one and the blocking plate can uniformly spread the solder paste layer in the C-shaped groove when the thickness of the solder paste layer is lower than the thickness of the lead wire.

[0033] Specifically, the scraping assembly 8 and the blocking assembly 7 are combined with the surrounding cover die box 9. Figure 6 , 7As shown, after the tin paste is discharged from the discharge gap, the second lifting rod control arm lever is moved upward as a whole, the first telescopic rod control lifting rod is moved right as a whole, the scraper is located at the top of the inclined side wall of the surrounding mold box, and then the second lifting rod control arm lever is moved downward to the upper surface of the required tin paste layer thickness, and then the first telescopic rod control lifting rod is moved left to the baffle, thereby completing one forward (left) scraping of the tin paste layer. Then, the second lifting rod control arm lever is moved upward, the first lifting rod control arm lever is moved upward, the first rotary device 73 controls the baffle to rotate to the side of the scraper, and then the first lifting rod control arm lever is moved downward, so that the baffle scrapes the tin paste remaining on the surface of the scraper downward. The first rotary device controls the baffle to reset, and then the second lifting rod and the first telescopic rod control the scraper to scrape the tin paste in the opposite direction (right) to complete the scraping of the tin paste layer.

[0034] In this embodiment, the drying device 51 includes a heating box 511 across the conveying guide rail 1, and a flow guide pipe 512 and a bell-shaped cover 514 are installed at the upper and lower ends of the heating box 511, respectively. The flow guide pipe 512 has an exhaust port 513 communicated with the bell-shaped cover 514. That is, after each tin paste layer is coated, a drying process is performed to make the tin paste layer harden to some extent, so that the next tin paste layer cannot be fully adhered to the previous tin paste layer, thereby causing peeling or separation. Specifically, when drying is required, the bell-shaped cover can be controlled to be above the tin paste layer by controlling the guide rail and the lifter.

[0035] In specific implementation, the following steps are included:

[0036] S1: According to the lead form of the SMD full-color LED lamp bead lead, a corresponding surrounding mold box is prepared, and the positions of the stop assembly and the scraping assembly are adjusted.

[0037] S2: The number of tin paste layers and the tin paste volume of the corresponding layer are set, and the scraping times required for each coating are obtained by experiment.

[0038] S3: after each coating of the tin paste layer, sequentially drying treatment is performed, and the drying time corresponding to each tin paste layer is obtained by experiment in advance;

[0039] S4: after the coating of the multi-layer tin paste layer is completed, the reflow soldering mechanism is sent to perform reflow soldering treatment.

[0040] The above is only a preferred specific embodiment of the application, but the protection scope of the application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the application within the technical range disclosed by the application, which should be covered in the protection scope of the application.

Claims

1. A SMD full-color LED bead lead wire soldering device, comprising a conveyor rail (1) and a reflow soldering mechanism (6), characterized in that, The conveying guide rail (1) is provided with a control guide rail (2) on both sides, and a lifter (3) that can be adjusted and moved is installed on the control guide rail (2). The top output end of the lifter (3) is fixed with a connecting rod (4) parallel to the conveying guide rail (1). Multiple solder paste coating mechanisms (5) are installed between the connecting rods (4) on both sides and span the conveying guide rail (1). The reflow soldering mechanism (6) is located on the right side of the solder paste coating mechanism (5). The solder paste coating mechanism (5) includes a drying device (51) located in the middle for drying the solder paste layer and a coating assembly (52) located on both sides of the drying device (51) for coating the solder paste layer. The coating assembly (52) includes a connecting seat (521) fixed to the support rod (4). Parallel telescopic rods one (522) and two telescopic rods two (523) are respectively mounted on the connecting seat (521). A crossbar one (524) spanning the conveyor rail is fixed to the output end of the telescopic rod one (522). Multiple scraping components (8) are mounted on the crossbar one (524). The output end of the telescopic rod two (523) is connected to the crossbar one. Parallel crossbar two (525), on which a stop component (7) corresponding to the scraping component (8) is installed, and on the connecting seat (521) a crossbar three (526) parallel to the crossbar one is also installed, on which a hanging rod (5261) corresponding to the scraping component (8) is installed, and on the upper and lower ends of the hanging rod (5261) a solder paste supply box (5262) ​​and a covering mold box (9) are respectively installed and connected; The scraping assembly (8) includes a lifting rod (81) that is fixed to the crossbar (524), and a second arm (82) that spans the lead wire is fixed at its lower end. A second rotator (83) is installed at the end of the second arm (82), and a second shaft (84) that is parallel to the second arm is installed on the second rotator (83). A scraper (85) corresponding to the number of lead wires is installed on the second shaft (84). The covering mold box (9) is fixed with multiple partition plates (93) to form a covering mold frame. The covering mold frame forms a covering grid corresponding to the lead wire. The covering grid and the lead wire form a C-shaped groove. The covering mold box (9) is provided with an extrusion cavity (91). The side wall of the covering mold box (9) facing the partition plate is provided with a discharge slot (92) communicating with the extrusion cavity (91). The scraper (85) includes a scraper second (852) sleeved on and connected to the shaft second (84) via a reset torsion spring (853). The width of the scraper second (852) is equal to the width of the lead wire, and scraper first (851) is provided on both sides of the scraper second (852). The stop assembly (7) includes a lifting rod (71) that is fixed to the crossbar (525), and an arm (72) that spans the lead wire is fixed at its lower end. A rotator (73) is installed at the end of the arm (72), and a shaft (74) parallel to the arm is installed on the rotator (73). Baffles (75) located on both sides of the lead wire are installed on the shaft (74).

2. The SMD full-color LED bead lead wire soldering device according to claim 1, characterized in that, The support rod (4) has a positioning strip hole (41), and a mountain-shaped clamp (42) is detachably and slidably mounted on the positioning strip hole (41).

3. The SMD full-color LED bead lead wire soldering device according to claim 2, characterized in that, The mountain-shaped clamp (42) can pass through the positioning strip hole (41) in the middle and has a connecting groove (412) for connecting the connecting piece (43). The connecting piece (43) is used to connect and install the solder paste coating mechanism (5). The elastic clips (411) at the upper and lower ends of the mountain-shaped clamp (42) can be respectively clamped and fixed on the upper and lower rod surfaces of the connecting rod (4).

4. The SMD full-color LED bead lead wire soldering device according to claim 1, characterized in that, The side wall of the enclosure mold box (9) located at the discharge slot (92) is set with an outwardly sloping structure.

5. The SMD full-color LED bead lead wire soldering device according to claim 1, characterized in that, The drying device (51) includes a heating box (511) spanning the conveyor rail (1), with a guide pipe (512) and a dome cover (514) installed at its upper and lower ends respectively. An exhaust port (513) communicating with the dome cover (514) is provided on the wall of the guide pipe (512).

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