A memory alloy spring type adaptive temperature thermal management structure

Abstract

The present invention discloses a memory alloy spring-type adaptive temperature thermal management structure, in which a heat-insulating metal plate is arranged parallel to a device housing; the first end of a support tube is fixedly connected to a side surface of the device housing facing the heat-insulating metal plate via a flange, the middle portion is gap-fitted with a through-hole of the heat-insulating metal plate, and the second end is located on a side of the heat-insulating metal plate facing away from the device housing; a heat-insulating spring is telescopically sleeved on the outer circumference of the support tube, one end is crimped between the support tube and the device housing via a flange, and the other end is fixedly connected to the heat-insulating metal plate; a memory alloy spring is located within the support tube, one end is fixedly connected to the inner wall of the second end portion of the support tube, and the other end is fixedly connected to the heat-insulating metal plate, for achieving separation or bonding between the device housing and the heat-insulating metal plate. The above-mentioned thermal management structure can achieve adaptive heat preservation and heat dissipation integration through the memory alloy spring, thereby improving the stability and safety of working devices in extreme environments with complex temperature changes.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal management, and in particular to a memory alloy spring type self-adaptive temperature thermal management structure. Background Art

[0002] Heat dissipation is essential for the safe operation of devices and structures containing liquids. However, in special environments, when the ambient temperature fluctuates, that is, when the external ambient temperature is too low, devices operating at extremely low temperatures need to prevent the external low temperature from freezing the lubrication, oil circuits, and oil of the device, thereby damaging the equipment. At the same time, device operation at room temperature requires a certain amount of heat dissipation to ensure safe operation and avoid the risk of heat accumulation. Therefore, a thermal management control structure that responds to environmental changes is necessary to protect the normal operation of the machine in extreme temperature fluctuations and achieve an integrated structure for heat dissipation and insulation.

[0003] Antifreeze designs for automotive fuel tanks almost always employ methods such as direct, complete insulation wrapping or direct heating by adding heating pipes inside the tank. Completely wrapping with insulation materials is impractical when the tank needs to dissipate heat externally, creating a risk of explosion due to heat buildup. Adding heating pipes to the tank requires a significant amount of additional energy, which is difficult to maintain when the engine is stopped. Existing insulation or heating structures perform a single function and fail to dissipate heat during insulation, creating a risk of heat buildup. Therefore, achieving low-temperature insulation and high-temperature heat dissipation capabilities within or outside the tank is essential. This structural design also requires electronic components to dissipate heat when needed and maintain heat when insulation is required. This delays the tank's freezing resistance in extreme cold weather and improves the viscosity of diesel fuel to cope with increasingly complex operating environments.

[0004] The existing thermal insulation structure cannot meet the changes in ambient temperature. Therefore, a new and effective adaptive structure is needed to achieve integrated insulation and heat dissipation to ensure the stability and safety of working devices in extreme environments with complex temperature changes. Summary of the Invention

[0005] In view of this, the present invention provides a memory alloy spring type adaptive temperature thermal management structure, which can achieve adaptive thermal insulation and heat dissipation integration through memory alloy springs, thereby improving the stability and safety of working devices in extreme environments with complex temperature changes.

[0006] The present invention adopts the following specific technical solutions:

[0007] A memory alloy spring type self-adaptive temperature thermal management structure, the thermal management structure comprising a device housing, a heat-insulating metal plate, a support tube, a memory alloy spring, and thermal insulation;

[0008] The heat-insulating metal plate is arranged parallel to the device housing and is provided with a through hole penetrating the thickness thereof and a groove opening toward one side of the device housing; the grooves are distributed around the through hole;

[0009] The first end of the support tube is fixedly connected to the surface of the device housing facing the thermal insulation metal plate through a flange, the middle portion is gap-fitted with the through hole of the thermal insulation metal plate, and the second end is located on the side of the thermal insulation metal plate facing away from the device housing;

[0010] The heat insulator is telescopically sleeved on the outer circumference of the support tube, one end of which is pressed between the support tube and the device housing through the flange, and the other end is fixedly connected to the heat-insulating metal plate;

[0011] The memory alloy spring is located in the support tube, with one end fixedly connected to the inner wall of the second end of the support tube and the other end fixedly connected to the thermal insulation metal plate, and is used to automatically expand and contract according to the ambient temperature to achieve separation or adhesion of the device housing and the thermal insulation metal plate;

[0012] When the heat-insulating metal plate is in close contact with the device housing, the memory alloy spring is in an extended state, the heat insulator is in a contracted state, and the flange and the heat insulator are both accommodated in the groove. At this time, the device housing conducts heat through direct contact with the heat-insulating metal plate, thereby achieving heat dissipation of the device;

[0013] When the thermal insulation metal plate is separated from the device housing, the memory alloy spring is in a contracted state and the thermal insulation is in an extended state. At this time, the device housing increases thermal resistance by separating from the thermal insulation metal plate to form an air interlayer, thereby achieving device insulation.

[0014] Furthermore, the memory alloy spring is made of chromium-nickel alloy material.

[0015] Furthermore, the self-adaptive ambient temperature working range of the memory alloy spring is 5°C-45°C.

[0016] Furthermore, the flange is fixedly connected to the device housing by bolts.

[0017] Furthermore, one end of the memory alloy spring is fixedly connected to the support tube through a first metal sheet, and the other end is fixedly connected to the heat-insulating metal plate through a second metal sheet.

[0018] Furthermore, the first metal sheet, the memory alloy spring and the support tube are fixed by welding;

[0019] The second metal sheet is fixed to the memory alloy spring by welding, and the second metal sheet is fixed to the heat-insulating metal plate by bolts.

[0020] Furthermore, the support tube is provided with a window extending along the expansion and contraction direction of the memory alloy spring;

[0021] The window is used to allow the second metal sheet to extend outside the support tube.

[0022] Furthermore, soft glue is filled between the heat insulation, the device housing and the heat-insulating metal plate to achieve sealing.

[0023] Furthermore, the support tube is a cylindrical structure with openings at both ends;

[0024] The through hole is a circular hole;

[0025] The groove is a circular groove.

[0026] Furthermore, the heat-insulating metal plate is made of aluminum plate.

[0027] Beneficial effects:

[0028] The memory alloy spring type self-adaptive temperature thermal management structure of the present invention utilizes the memory alloy spring to adapt to changes in ambient temperature and drive the thermal insulation metal plate fixed to one end thereof to move when it expands and contracts, thereby causing the device housing and the thermal insulation metal plate to fit or separate to form an air interlayer, and the spacing of the air interlayer can be changed according to changes in ambient temperature to achieve an integrated heat dissipation and thermal insulation structure; when the ambient temperature is high, the memory alloy spring extends, the thermal insulation metal plate approaches the device housing, and the spacing of the air interlayer between the device housing and the thermal insulation metal plate gradually decreases to fit, and the device housing and the thermal insulation metal plate are in direct contact for heat conduction At this time, the device is in a heat dissipation state; when the ambient temperature is low, the memory alloy spring contracts, and the insulation metal plate moves away from the device housing. The distance between the device housing and the insulation metal plate gradually increases, and the air interlayer in the interval is in a closed space, avoiding convective heat transfer, and the heat transfer performance is greatly reduced. At this time, it is in a heat preservation state, and as the distance increases within a certain range, its thermal resistance increases and the heat preservation time becomes longer, realizing the integration of heat preservation and heat dissipation functions, and the support structure of the memory alloy spring is simple, and no additional energy is required to drive it. The deformation temperature of the memory alloy spring is taken from the ambient temperature change. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the three-dimensional structure of the memory alloy spring type self-adaptive temperature thermal management structure of the present invention;

[0030] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure of the medium memory alloy spring type adaptive temperature thermal management structure;

[0031] Figure 3 for Figure 1 Schematic diagram of the structure of the medium memory alloy spring type adaptive temperature thermal management structure in the heat dissipation state;

[0032] Figure 4 for Figure 1 Schematic diagram of the structure of the medium memory alloy spring type adaptive temperature thermal management structure in the heat preservation state;

[0033] Figure 5 A simplified heat transfer model of a fuel tank adopting the memory alloy spring type adaptive temperature thermal management structure of the present invention;

[0034] Figure 6 This is a graph showing the change of oil temperature in the oil tank over time under air interlayers of different thicknesses.

[0035] Among them, 1-device housing, 2-insulation metal plate, 3-support cylinder, 5-memory alloy spring, 5-metal sheet, 6-insulation, 7-oil, 8-tank shell, 9-air interlayer DETAILED DESCRIPTION

[0036] The present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0037] This embodiment provides a memory alloy spring type adaptive temperature thermal management structure, such as Figure 1 and Figure 2 As shown in the structure, the thermal management structure includes a device housing 1, a heat-insulating metal plate 2, a support tube 3, a memory alloy spring 5, and a heat insulation 6; Figure 5 As shown, when the device is a fuel tank, the device housing 1 is a fuel tank shell 8; the heat-insulating metal plate 2 can be an aluminum plate, a copper plate, etc. The aluminum plate has the advantages of good thermal conductivity, strong structural hardness and lighter weight than other metals; the support tube 3 can be Figure 2 A cylindrical structure with openings at both ends;

[0038] The heat-insulating metal plate 2 is arranged parallel to the device housing 1 and is provided with a through hole penetrating the thickness thereof and a groove opening toward one side of the device housing 1; the grooves are distributed around the through hole; the through hole may be a circular hole; and the grooves are circular grooves;

[0039] The first end of the support tube 3 is fixedly connected to the surface of the device housing 1 facing the thermal insulation metal plate 2 through a flange, the middle portion is gap-fitted with the through-hole of the thermal insulation metal plate 2, and the second end is located on the side of the thermal insulation metal plate 2 facing away from the device housing 1; the flange can be fixedly connected to the device housing 1 by bolts;

[0040] The heat insulator 6 is telescopically mounted on the outer periphery of the support tube 3, with one end pressed between the support tube 3 and the device housing 1 through a flange, and the other end fixedly connected to the heat-insulating metal plate 2;

[0041] The memory alloy spring 5 is located in the support tube 3, with one end fixedly connected to the inner wall of the second end of the support tube 3, and the other end fixedly connected to the heat-insulating metal plate 2, and is used for self-expansion and expansion according to the ambient temperature to realize the separation or bonding of the device housing 1 and the heat-insulating metal plate 2; the memory alloy spring 5 can be made of chromium-nickel alloy material, and can be selected as thermal expansion and contraction type or thermal contraction and expansion and contraction type according to the ambient temperature and function; the adaptive ambient temperature working range of the memory alloy spring 5 can be 5℃-45℃, such as: self-expansion and expansion at around 5℃, 15℃, 25℃, 30℃, and 55℃; or various temperatures are mixed in the integrated memory alloy spring 5 to realize self-expansion and expansion, such as the memory alloy spring 5 with 5℃ and 15℃ each accounting for half, which can make the gap between two different spacings when self-expansion and expansion according to the ambient temperature change, thereby increasing the rationality of heat dissipation or heat preservation time;

[0042] The top and bottom ends of the memory alloy spring 5 are connected to the support tube 3 and the heat-insulating metal plate 2 respectively through metal sheets 5. The metal sheets 5 include a first metal sheet and a second metal sheet. Figure 2 、 Figure 3 and Figure 5 As shown in the structure, one end of the memory alloy spring 5 is fixedly connected to the support tube 3 through a first metal sheet, and the first metal sheet is fixed to the memory alloy spring 5 and the support tube 3 by welding; the other end of the memory alloy spring 5 is fixedly connected to the heat-insulating metal plate 2 through a second metal sheet, and the second metal sheet is fixed to the memory alloy spring 5 by welding, and the second metal sheet is fixed to the heat-insulating metal plate 2 by bolts; the first metal sheet and the second metal sheet are both made of metal sheet 5;

[0043] like Figure 3 As shown, when the thermal insulation metal plate 2 is tightly fitted to the device housing 1, the memory alloy spring 5 is in an extended state, the thermal insulation 6 is in a contracted state, and the flange and the thermal insulation 6 are both accommodated in the groove. At this time, the device housing 1 conducts heat through direct contact with the thermal insulation metal plate 2 to achieve device heat dissipation;

[0044] like Figure 2 and Figure 5 As shown, when the thermal insulation metal plate 2 is separated from the device housing 1, the memory alloy spring 5 is in a contracted state and the thermal insulation 6 is in an extended state. At this time, the device housing 1 increases the thermal resistance by separating from the thermal insulation metal plate 2 to form an air interlayer 9, thereby achieving device insulation.

[0045] The above-mentioned memory alloy spring type adaptive temperature thermal management structure is provided with an insulating metal plate 2 parallel to the device housing 1, and the insulating metal plate 2 is movably supported on the outside of the device housing 1 by the support tube 3 and the memory alloy spring 5 in the support tube 3, and the air interlayer 9 between the device housing 1 and the insulating metal plate 2 is separated from the external environment by the thermal insulation 6; the memory alloy spring 5 can adapt to the change of ambient temperature and drive the insulating metal plate 2 fixed to one end thereof to move when it expands and contracts, thereby causing the device housing 1 and the insulating metal plate 2 to fit or separate to form an air interlayer 9, and the spacing of the air interlayer 9 can be changed according to the change of ambient temperature to realize an integrated structure of heat dissipation and thermal insulation; when the ambient temperature is high, the memory alloy spring 5 extends, and the insulating metal plate 2 moves toward the device housing 1 When the distance between the air interlayer 9 between the device housing 1 and the insulating metal plate 2 gradually decreases to a point where they fit together, the device housing 1 and the insulating metal plate 2 are in direct contact for heat conduction, and the device is now in a heat dissipation state; when the ambient temperature is low, the memory alloy spring 5 contracts, and the insulating metal plate 2 moves away from the device housing 1. The distance between the device housing 1 and the insulating metal plate 2 gradually increases, and the air interlayer 9 at the interval is in a closed space, avoiding convective heat exchange, and the heat transfer performance is greatly reduced. At this time, it is in a heat preservation state, and as the distance increases within a certain range, its thermal resistance increases and the heat preservation time becomes longer, thereby realizing the integration of heat preservation and heat dissipation functions, and the supporting structure of the memory alloy spring 5 is simple, and no additional energy is required to drive it. The deformation temperature of the memory alloy spring 5 is taken from the ambient temperature change.

[0046] In a specific embodiment, Figure 1 、 Figure 2 、 Figure 3 and Figure 5 As shown, the support tube 3 is provided with a window extending along the extension and contraction direction of the memory alloy spring 5; the window is used to allow the second metal sheet to extend to the outside of the support tube 3, and the window can be adapted to the size of the second metal sheet, so that the second metal sheet can be guided through the window and slide along the extension direction of the support tube 3.

[0047] In order to improve the heat insulation effect, the insulation 6 and the device housing 1 and the heat-insulating metal plate 2 can be sealed by filling with soft glue.

[0048] The following is an example of heat preservation and heat dissipation management using a car fuel tank with the above-mentioned thermal management structure. The thermal management structure uses a memory alloy spring 5 with a temperature range of about 20°C and a thermal expansion and contraction type. The original length of the memory alloy spring 5 is 20mm and the deformation length is 10mm. When the ambient temperature of the car is higher than 20°C, the fuel tank will also be at the same ambient temperature. The memory alloy spring 5 will be in an extended state. At this time, the heat-insulating metal plate 2 and the fuel tank shell 8 will be in a fitted state. At this time, the fuel tank is in a heat dissipation state, such as Figure 3As shown, the heat-insulating metal plate 2 is fitted with the fuel tank shell 8. When the ambient temperature of the car is lower than 20°C, the fuel tank will also be at the same ambient temperature, and the memory alloy spring 5 will be in a contracted state. At this time, the heat-insulating metal plate 2 and the fuel tank shell are in a spaced state, and the fuel tank is in a heat-insulating state. Figure 5 As shown, the insulating metal plate 2 is separated from the fuel tank shell, forming an air layer 9, which increases thermal resistance. The oil 7 in the fuel tank will be greatly protected from freezing in extremely cold environments, and the fuel tank will not be exposed to the risk of heat accumulation in tropical areas.

[0049] When calculating the thermal insulation performance of a regular cubic fuel tank equipped with an adaptive thermal management structure, Figure 5 The figure shows the heat transfer principle of the simplified side of the oil tank. The thermal conductivity λ1 of the oil tank shell 8 and the thermal conductivity λ2 of the insulation metal plate 2 are extremely large, both about 237W / mK, so their thermal resistance and thickness are negligible. The initial temperature of the inner oil is T I is 25℃, the outside ambient temperature T0 is -35℃, and the convection heat transfer coefficient h inside the tank is I 100W / m 2 K, the external convection heat transfer coefficient h0 is 5W / m 2 K, the thickness of the air layer 9 is H air , the thermal conductivity k of the air interlayer 9 air is 0.0267W / mK, and the density of the inner oil 7 is ρ I 850kg / m 3 , specific heat capacity C p It is 2100J / kgK.

[0050] Assuming that the heat conduction process in which the internal temperature field changes with time is called one-dimensional unsteady-state heat conduction and there is no internal heat source, the lumped parameter method can be used to obtain the expression of the change of internal temperature with time:

[0051]

[0052] Solving the above equation, we can get the change of the inner oil temperature T with time τ:

[0053]

[0054] In the above formula, h I is the convection heat transfer coefficient inside the tank; A air T is the heat dissipation area of ​​the insulation metal plate 2 in contact with the environment; o is the ambient temperature; T I is the initial temperature of the oil inside the tank; ρ I is the density of the oil 7 inside the tank; V I is the volume of oil 7 inside the tank; C pis the specific heat capacity of the oil 7; τ is the time parameter.

[0055] When the fuel tank is equipped with an adaptive thermal management structure, its heat conduction is a three-layer heat conduction model consisting of the fuel tank shell 8, the air interlayer 9, and the thermal insulation metal plate 2. When the fuel tank shell 8 and the thermal insulation metal plate 2 are attached together, it becomes a two-layer model. When the calculation is simplified by using the unit volume oil model, the relationship between the thermal insulation performance and time is as follows Figure 6 The temperature variation curves of the oil 7 over time under different thicknesses of the air interlayer 9 show that the use of the memory alloy spring-type adaptive temperature thermal management structure significantly improves the tank's slow-freezing performance for the oil 7, and the effect becomes better with increasing thickness of the air interlayer 9. This shows that the application of this thermal management structure is very effective.

[0056] In summary, the above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A memory alloy spring type adaptive temperature thermal management structure, characterized in that: It includes a device shell, a heat-insulating metal plate, a support tube, a memory alloy spring and a heat-insulating component; The heat-insulating metal plate is arranged parallel to the device housing and is provided with a through hole penetrating the thickness thereof and a groove opening toward one side of the device housing; the grooves are distributed around the through hole; The first end of the support tube is fixedly connected to the surface of the device housing facing the thermal insulation metal plate through a flange, the middle portion of the support tube is gap-fitted with the through-hole of the thermal insulation metal plate, and the second end of the support tube is located on the side of the thermal insulation metal plate facing away from the device housing; The heat insulating member is telescopically sleeved on the outer circumference of the support tube, one end of the heat insulating member is pressed between the support tube and the device housing through the flange, and the other end of the heat insulating member is fixedly connected to the heat-insulating metal plate; Soft glue is filled between the thermal insulation member, the device housing and the thermal insulation metal plate to achieve sealing; The memory alloy spring is located in the support tube, one end of the memory alloy spring is fixedly connected to the inner wall of the second end of the support tube via a first metal sheet, and the other end of the memory alloy spring is fixedly connected to the thermal insulation metal plate via a second metal sheet. The memory alloy spring is used to automatically expand and contract according to the ambient temperature to achieve separation or adhesion between the device housing and the thermal insulation metal plate; When the heat-insulating metal plate is in close contact with the device housing, the memory alloy spring is in an extended state, the heat-insulating member is in a contracted state, and both the flange and the heat-insulating member are accommodated in the groove. At this time, the device housing conducts heat through direct contact with the heat-insulating metal plate, thereby achieving heat dissipation of the device. When the thermal insulation metal plate is separated from the device housing, the memory alloy spring is in a contracted state and the thermal insulation component is in an extended state. At this time, the device housing increases thermal resistance by separating from the thermal insulation metal plate to form an air interlayer, thereby achieving device insulation.

2. The thermal management structure according to claim 1, wherein: The memory alloy spring is made of chromium-nickel alloy material.

3. The thermal management structure according to claim 1, wherein: The self-adaptive ambient temperature working range of the memory alloy spring is 5°C to 45°C.

4. The thermal management structure according to claim 1, wherein: The flange is fixedly connected to the device housing by bolts.

5. The thermal management structure according to claim 1, wherein: The first metal sheet is fixed to the memory alloy spring and the support tube by welding; The second metal sheet is fixed to the memory alloy spring by welding, and the second metal sheet is fixed to the heat-insulating metal plate by bolts.

6. The thermal management structure according to claim 5, wherein: The support tube is provided with a window extending along the expansion and contraction direction of the memory alloy spring; The window is used to allow the second metal sheet to extend outside the support tube.

7. The thermal management structure according to any one of claims 1 to 6, wherein: The support cylinder is a cylindrical structure with openings at both ends; The through hole is a circular hole; The groove is a circular groove.

8. The thermal management structure according to any one of claims 1 to 6, wherein: The heat-insulating metal plate is an aluminum plate.

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