Cooling platform and lighting equipment

Abstract

The embodiment of the present application discloses a heat dissipation platform and lighting equipment, which includes: a shell, the shell is hollow, a fluid medium is contained in the shell, and one side surface of the shell is used to connect a heating module; multiple heat pipes, one end of the heat pipe passes through the other side surface of the shell and extends into the shell, one end of the heat pipe contacts the fluid medium to transfer the heat in the fluid medium to the heat pipe, and an air cooling component, the air cooling component is used to blow air to the multiple heat pipes to take away the heat in the multiple heat pipes. In the present application, the fluid medium directly absorbs the heat of the heating module and then releases the heat through the heat pipe and the air cooling component, which can avoid the thermal shock caused by the high-power heating module emitting a large amount of heat in a short time. At the same time, one end of the heat pipe directly contacts the fluid medium to dissipate heat, which reduces thermal resistance, can improve heat dissipation efficiency, and thus can improve heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation platform and lighting equipment. Background Art

[0002] With the vigorous development of the electronics industry, the power consumption of various electronics industries is getting bigger and bigger, and their thermal power consumption and power density are also increasing. For high-power products with high power density, traditional air cooling cannot solve the heat dissipation problem of high power density due to the limited carrying capacity of heat pipes; and traditional water cooling cannot have sufficient thermal capacity and increase the volume flow rate large enough to solve the heat dissipation problem of high power density and high power due to the small size of traditional water cooling heads.

[0003] That is, the heat dissipation effect of the heat dissipation platform in the prior art on the heat generating module with higher power density is poor. Summary of the invention

[0004] The embodiments of the present application provide a heat dissipation platform and a lighting device, aiming to solve the problem that the heat dissipation effect of the heat dissipation platform on a heating module with a higher power density in the prior art is poor.

[0005] In order to solve the above problems, in a first aspect, the present application provides a heat dissipation platform, the heat dissipation platform comprising:

[0006] A shell, wherein the shell is hollow and contains a fluid medium, and a side surface of the shell is used to connect a heating module;

[0007] A plurality of heat pipes, one end of each heat pipe passes through the other side surface of the shell and extends into the shell, and one end of each heat pipe contacts the fluid medium to transfer heat in the fluid medium to the heat pipe.

[0008] An air cooling component is used to blow air toward the plurality of heat pipes to take away the heat in the plurality of heat pipes.

[0009] Optionally, the shell includes a bottom shell and an upper cover, the bottom shell and the upper cover are enclosed to form the shell, one end of the heat pipe passes through a side surface of the upper cover away from the bottom shell and extends into the interior of the shell, and the side surface of the bottom shell away from the upper cover is used to connect the heating module.

[0010] Optionally, a groove is formed on a surface of the bottom shell away from the upper cover, a heat dissipation base plate is provided in the groove, the heat dissipation base plate fills the groove, and a surface of the heat dissipation base plate away from the upper cover is connected to a heating module.

[0011] Optionally, a plurality of heat dissipation columns are protruding from a surface of the heat dissipation base plate on one side facing the upper cover, and the plurality of heat dissipation columns are arranged in an array.

[0012] Optionally, the heat dissipation platform includes a driving pump, which is located on a side of the heat dissipation column away from the heat dissipation base plate, and is used to extract the cooled fluid medium from the side away from the heat dissipation column and release it to one side of the heat dissipation column.

[0013] Optionally, the air cooling assembly includes an air cooling cover and multiple fans, the air cooling cover is fixed on the shell, the side wall of the air cooling cover is provided with a heat dissipation grille, the multiple fans are fixed on the air cooling cover, the multiple heat pipes are located in the air cooling cover, and the multiple fans blow air to the multiple heat pipes to take away heat from the heat dissipation grille.

[0014] Optionally, the heat dissipation platform includes a plurality of heat sinks, the plurality of heat sinks are located in the air-cooled outer cover, the plurality of heat sinks are arranged at intervals, the plurality of heat sinks are stacked in sequence on the other side surface of the shell, and the other ends of the plurality of heat pipes pass through the plurality of heat sinks in sequence.

[0015] Optionally, the air cooling component includes an air guide, the air guide includes a plurality of air guide plates, the plurality of air guide plates are enclosed to form a plurality of air guide inlets, the plurality of air guide inlets correspond one-to-one to the plurality of fans, and the wind blown out by the plurality of fans is blown toward the plurality of heat pipes through the air guide inlets.

[0016] Optionally, an elastic pressure relief member is provided on a side of the upper cover facing the bottom shell, and the elastic pressure relief member contracts when the pressure in the shell increases, and expands when the pressure in the shell decreases.

[0017] To solve the above problems, in a second aspect, the present application provides a lighting device, wherein the lighting device comprises the heat dissipation platform described in any one of the above items.

[0018] The beneficial effects of the present application are as follows: Different from the prior art, the present application provides a heat dissipation platform, which includes: a shell, the shell is hollow, a fluid medium is contained in the shell, and one side surface of the shell is used to connect a heating module; a plurality of heat pipes, one end of the heat pipe passes through the other side surface of the shell and extends into the shell, one end of the heat pipe contacts the fluid medium to transfer the heat in the fluid medium to the heat pipe, and an air cooling component is used to blow air to the plurality of heat pipes to take away the heat in the plurality of heat pipes. The present application sets a shell to contain the fluid medium, the fluid medium absorbs the heat emitted by the heating module, the heat pipe extends into the fluid medium to absorb the heat of the fluid medium, and then the air cooling component blows the heat away from the heat pipe, because the specific heat capacity of the fluid medium is large, the heat of the heating module is directly absorbed by the fluid medium and then released through the heat pipe and the air cooling component, which can avoid the thermal shock caused by the high-power heating module emitting a large amount of heat in a short time, and at the same time, one end of the heat pipe directly contacts the fluid medium to dissipate heat, which reduces the thermal resistance, can improve the heat dissipation efficiency, and thus can improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a schematic diagram of the overall structure of an embodiment of a heat dissipation platform provided in an embodiment of the present application;

[0021] Figure 2 is a schematic diagram of an exploded structure of an embodiment of a heat dissipation platform provided in an embodiment of the present application;

[0022] Figure 3 is a schematic cross-sectional structural diagram of an embodiment of a heat dissipation platform provided in an embodiment of the present application;

[0023] Figure 4 It is a schematic diagram of an exploded structure inside a shell in an embodiment of a heat dissipation platform provided by an embodiment of the present application;

[0024] Figure 5 is a schematic diagram of the cross-sectional structure inside a shell in an embodiment of a heat dissipation platform provided in an embodiment of the present application;

[0025] Figure 6 is a schematic structural diagram of multiple heat sinks in an embodiment of a heat dissipation platform provided in an embodiment of the present application;

[0026] Figure 7This is a schematic structural diagram of a heat dissipation base plate and a heat dissipation column in an embodiment of a heat dissipation platform provided in an embodiment of the present application;

[0027] Figure 8 is a schematic structural diagram of a protective cover in an embodiment of a heat dissipation platform provided in an embodiment of the present application;

[0028] Fig. 9 is a schematic diagram of the structure of a heat pipe in an embodiment of a heat dissipation platform provided in an embodiment of the present application;

[0029] Fig.10 It is a heat conduction schematic diagram of a heat dissipation platform provided in an embodiment of the present application.

[0030] Among them, the reference numerals of the various components in the figure are as follows:

[0031] Heat dissipation platform 10; shell 12; bottom shell 121; upper cover 122; elastic pressure relief member 161; protective cover 162; drive pump 163; heat dissipation column 164; heat dissipation bottom plate 165; pressure relief through hole 166; groove 123; air cooling component 11; fan 111; air guide 112; air guide plate 1122; air guide port 1121; air cooling cover 114; heat dissipation grille 115; heat sink 13; heat pipe 15; straight section 151; curved section 152; insertion section 153; heating module 20. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0034] In this application, the word "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described in this application as "exemplary" is not necessarily to be construed as being preferred or advantageous over other embodiments. The following description is given to enable any technician in the field to implement and use the present application. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present application can be implemented without using these specific details. In other instances, well-known structures and processes will not be elaborated in detail to avoid obscuring the description of the present application with unnecessary details. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in the present application.

[0035] The embodiment of the present application provides a heat dissipation platform, which includes: a shell, the shell is hollow, a fluid medium is contained in the shell, and one side surface of the shell is used to connect a heating module; multiple heat pipes, one end of the heat pipe passes through the other side surface of the shell and extends into the shell, one end of the heat pipe contacts the fluid medium to transfer the heat in the fluid medium to the heat pipe, and an air cooling component, which is used to blow air to the multiple heat pipes to take away the heat in the multiple heat pipes. The following is a detailed description of each.

[0036] Combination Figure 1-Figure 7 In the embodiment of the present application, the heat dissipation platform 10 includes a shell 12 , an air cooling component 11 and a plurality of heat pipes 15 .

[0037] In the embodiment of the present application, the shell 12 is hollow, and a fluid medium is contained in the shell 12. One side surface of the shell 12 is used to connect the heating module 20. One end of the heat pipe 15 passes through the other side surface of the shell 12 and extends into the shell 12. One end of the heat pipe 15 contacts the fluid medium to transfer the heat in the fluid medium to the heat pipe 15. The air cooling component 11 is used to blow air to the multiple heat pipes 15 to take away the heat of the fluid medium in the multiple heat pipes 15. The present application sets a shell to contain the fluid medium, the fluid medium absorbs the heat emitted by the heating module, the heat pipe extends into the fluid medium to absorb the heat of the fluid medium, and then the air cooling component blows the heat away from the heat pipe. Due to the large specific heat capacity of the fluid medium, the heat of the heating module is directly absorbed by the fluid medium and then released through the heat pipe and the air cooling component, which can avoid the thermal shock caused by the high-power heating module emitting a large amount of heat in a short time. At the same time, one end of the heat pipe is in direct contact with the fluid medium for heat dissipation, which reduces the thermal resistance and improves the heat dissipation efficiency.

[0038] The heating module 20 may be a component in a lamp or other electronic device. In one embodiment, the heating module 20 may be a COB (Chip On Board) light source, which is a component in which an LED chip is directly attached to a mirror metal substrate with high reflectivity. When the COB light source is used, it will generate a lot of heat, so it needs to be cooled.

[0039] Heat pipe technology is a heat transfer element called "heat pipe" invented by George Grover of Los Alamos National Laboratory in the United States in 1963. It makes full use of the principle of heat conduction and the rapid heat transfer properties of phase change media. It transfers the heat of the heating object to the outside of the heat source quickly through the heat pipe. Its thermal conductivity exceeds that of any known metal. Heat conduction through heat pipes can improve heat dissipation efficiency.

[0040] One end of the heat pipe 15 is the evaporation end, and the other end of the heat pipe 15 is the condensation end. The heat pipe 15 is sealed and filled with a liquid with a low boiling point and is easily volatile. When the evaporation end of the heat pipe 15 is heated, the liquid in the heat pipe 15 is rapidly vaporized, and the vapor flows to the condensation end of the heat pipe 15 under the power of heat diffusion, and condenses at the condensation end of the heat pipe 15 to release heat, and the liquid flows back to the evaporation end of the heat pipe 15, completing a cycle. The liquid in the heat pipe 15 is isolated from the fluid medium in the shell 12. The fluid medium in the shell 12 circulates in the shell 12 and does not enter the heat pipe 15. The liquid in the heat pipe 15 circulates in the heat pipe 15 and enters the shell 12. Only heat is exchanged between the liquid in the heat pipe 15 and the fluid medium in the shell 12.

[0041] The fluid medium may be coolant or water, which is set according to specific circumstances.

[0042] In the embodiment of the present application, the shell 12 includes a bottom shell 121 and an upper cover 122, and the bottom shell 121 and the upper cover 122 are enclosed to form the shell 12, and one end of the heat pipe 15 passes through the side surface of the upper cover 122 away from the bottom shell 121 and extends into the inside of the shell 12, and the side surface of the bottom shell 121 away from the upper cover 122 is used to connect the heating module 20. In one embodiment, the bottom shell 121 and the upper cover 122 can be connected by a flange. In another embodiment, the bottom shell 121 and the upper cover 122 can also be integrally formed. The connection method of the bottom shell 121 and the upper cover 122 can be set according to the specific situation. The manufacturing materials of the bottom shell 121 and the upper cover 122 can be the same or different. For example, the bottom shell 121 and the upper cover 122 are both made of copper, or they can be made of aluminum, or the bottom shell 121 is made of copper and the upper cover 122 is made of aluminum, which can be set according to the specific situation.

[0043] In the embodiment of the present application, a groove 123 is provided on the surface of the side of the bottom shell 121 away from the upper cover 122, and a heat dissipation base plate 165 is provided in the groove 123. The heat dissipation base plate 165 fills the groove 123, and the heat dissipation base plate 165 is connected to the heating module 20 on the surface of the side away from the upper cover 122. Preferably, the thermal conductivity of the heat dissipation base plate 165 is higher than that of the bottom shell 121. The materials used to make the heat dissipation base plate 165 and the bottom shell 121 can be the same or different. For example, the heat dissipation base plate 165 and the bottom shell 121 are both made of copper, or both can be made of aluminum, or the heat dissipation base plate 165 is made of copper and the bottom shell 121 is made of aluminum, which can be set according to the specific situation. When the heat dissipation base plate 165 is made of copper and the bottom shell 121 is made of aluminum, the heat dissipation base plate 165 and the bottom shell 121 are connected by welding or copper plugging process. When the heat dissipation base plate 165 and the bottom shell 121 are made of the same material, the heat dissipation base plate 165 and the bottom shell 121 can be integrally formed. The heat dissipation base plate 165 has a higher thermal conductivity than the bottom shell 121 , and can allow the heat of the heating module 20 to quickly enter the fluid medium.

[0044] In the embodiment of the present application, a plurality of heat dissipation columns 164 are convexly provided on the surface of the heat dissipation base plate 165 facing the upper cover 122, and the plurality of heat dissipation columns 164 are arranged in an array. Specifically, the heat dissipation columns 164 can be made of copper, and the heat can be quickly dissipated into the fluid medium through the plurality of heat dissipation columns 164.

[0045] In the embodiment of the present application, the heat dissipation platform 10 includes a driving pump 163, which is located on a side of the heat dissipation column 164 away from the heat dissipation base plate 165, and the driving pump 163 is used to extract the cooled fluid medium from the side away from the heat dissipation column 164 and release it to one side of the heat dissipation column 164. The driving pump 163 is arranged at a distance from the heat dissipation column 164. Specifically, a bracket is provided on the driving pump 163, and the bracket is detachably connected to the bottom shell 121 or the upper cover 122 to fix the driving pump 163 on the housing 12. The bracket on the driving pump 163 can be connected to the bottom shell 121 or the upper cover 122 by screwing, clamping, etc.

[0046] Specifically, the driving pump 163 can be an axial flow pump or other types of pumps, which can be set according to the specific situation. A pump is a machine that transports fluids or pressurizes fluids. It transfers the mechanical energy of the prime mover or other external energy to the liquid to increase the energy of the liquid. Pumps are mainly used to transport liquids such as water, oil, acid and alkali liquids, emulsions, suspensions and liquid metals, and can also transport liquid-gas mixtures and liquids containing suspended solids. Pumps can usually be divided into three categories according to their working principles: positive displacement pumps, dynamic pumps and other types of pumps. In addition to classification by working principle, they can also be classified and named according to other methods. For example, according to the driving method, they can be divided into electric pumps and water turbine pumps, etc.; according to the structure, they can be divided into single-stage pumps and multi-stage pumps; according to the purpose, they can be divided into boiler feed pumps and metering pumps, etc.; according to the nature of the transported liquid, they can be divided into water pumps, oil pumps and mud pumps, etc. According to whether there is an axial structure, it can be divided into linear pumps and traditional pumps. Water pumps can only transport logistics with fluids as the medium, and cannot transport solids. The driving pump 163 of the present application is an axial flow pump. On the one hand, the axial flow pump has a larger fluid outlet area and a larger flow rate compared to other types of pumps, thereby accelerating the circulation of the fluid medium in the shell 12 and improving the heat dissipation efficiency; on the other hand, the axial flow pump is more suitable for use in long-term potential fluid media than other types of pumps, which can greatly simplify the installation method and reduce the installation area.

[0047] In the embodiment of the present application, the air cooling assembly 11 includes an air cooling cover 114 and multiple fans 111. The air cooling cover 114 is fixed on the shell 12. The side wall of the air cooling cover 114 is provided with a heat dissipation grille 115. The multiple fans 111 are fixed on the air cooling cover 114. The multiple heat pipes 15 are located in the air cooling cover 114. The multiple fans 111 blow air to the multiple heat pipes 15 to take away the heat from the heat dissipation grille 115.

[0048] In the embodiment of the present application, the heat dissipation platform 10 includes a plurality of heat dissipation fins 13, the plurality of heat dissipation fins 13 are located in the air-cooling outer cover 114, the plurality of heat dissipation fins 13 are arranged at intervals, the plurality of heat dissipation fins 13 are sequentially stacked on the other side surface of the housing 12, and the other ends of the plurality of heat pipes 15 sequentially pass through the plurality of heat dissipation fins 13. The plurality of heat dissipation fins 13 can absorb the heat of the heat pipes 15, increase the heat dissipation area, and thus improve the heat dissipation efficiency of the heat dissipation platform 10.

[0049] In the embodiment of the present application, the air cooling assembly 11 includes an air guide 112, and the air guide 112 includes a plurality of air guide plates 1122. The plurality of air guide plates 1122 enclose a plurality of air guide inlets 1121, and the plurality of air guide inlets 1121 correspond to the plurality of fans 111 one by one. The air blown out by the plurality of fans 111 passes through the air guide inlets 1121 and blows toward the plurality of heat pipes 15. The air guide inlets 1121 can be provided to guide the air blown out by the fans 111 toward the plurality of heat pipes 15, thereby preventing the air blown out by the fans 111 from escaping, thereby improving the heat dissipation efficiency.

[0050] In the embodiment of the present application, an elastic pressure relief member 161 is provided on the side of the upper cover 122 facing the bottom shell 121. The elastic pressure relief member 161 contracts when the pressure in the shell 12 increases, and expands when the pressure in the shell 12 decreases. This can prevent the shell 12 from being overly pressurized.

[0051] In a specific embodiment, the elastic pressure relief member 161 is made of rubber, and a hollow cavity is provided inside the elastic pressure relief member 161 , and gas is contained in the hollow cavity.

[0052] Further, combined with Figure 8 A protective cover 162 is provided on the side of the upper cover 122 facing the bottom plate and bottom shell 121. The protective cover 162 is buckled on the upper cover 122. A receiving cavity is formed between the protective cover 162 and the upper cover 122. The elastic pressure relief member 161 is received in the receiving cavity. A plurality of pressure relief through holes 166 are provided on the side wall of the protective cover 162. The fluid medium enters the receiving cavity between the protective cover 162 and the upper cover 122 through the pressure relief through holes 166 to generate pressure on the elastic pressure relief member 161.

[0053] For further information, see Fig. 9 The heat pipe 15 includes a straight section 151, a curved section 152 and an insertion section 153 which are connected in sequence. The curved section 152 may be S-shaped. The straight sections 151 of the plurality of heat pipes 15 are parallel to each other and arranged in an array. The insertion section 153 is inserted into the upper cover 122, and the straight section 151 passes through a plurality of heat sinks 13. Setting the curved section 152 can increase the spacing between the straight sections 151 of the plurality of heat pipes 15 when the volume of the housing 12 is constant, thereby improving the heat dissipation effect.

[0054] For further information, see Fig.10 The heat dissipation principle of the heat dissipation platform 10 of the present application is as follows:

[0055] The heat module 20 emits heat, which is conducted to the heat dissipation base plate 165, and then the heat is conducted to the fluid medium through the heat dissipation column 164 on the heat dissipation base plate 165. Due to the existence of the driving pump 163, the driving pump 163 extracts the cooled cold fluid medium from the bottom of the upper cover 122 and releases it to one side of the heat dissipation column 164. The hot fluid medium heated by the heat dissipation column 164 is impacted by the cold fluid medium and flows between the driving pump 163 and the upper cover 122. After the hot fluid medium reaches between the driving pump 163 and the upper cover 122, the heat of the hot fluid medium is taken away by the multiple heat pipes 15 on the upper cover 122 to become the cold fluid medium. The cold fluid medium enters the driving pump 163 for circulation and heat dissipation, which accelerates the convection heat exchange and quickly conducts the heat to the heat pipe 15, and then conducts it to the multiple heat sinks 13 through the heat pipe 15. The multiple fans 111 blow enough wind to the multiple heat sinks 13 to take away the heat.

[0056] Compared with traditional air-cooling or water-cooling structures, the present application maximizes the reduction of thermal resistance on the heat conduction path due to direct contact between the heat pipe 15 and the fluid medium, making the cooling effect more obvious. Moreover, since the shell 12 contains the fluid medium, the fluid medium with a large heat capacity can effectively absorb thermal shock, and the axial flow water pump is combined to enhance convection, so that the heat dissipation platform can withstand heat sources with higher power density. For high-power heat sources, the size of the shell 12 can be changed, the number of heat pipes and the area of ​​the heat sink can be increased or decreased, so as to effectively be compatible with heat sources at various powers and maintain stable performance.

[0057] The present application also provides a lighting device, which includes any of the above-mentioned heat dissipation platforms 10, and the heat dissipation base plate 165 of the heat dissipation platform 10 is connected to the heating module of the electronic device to dissipate heat from the heating module of the electronic device. The heating module can specifically be a COB (Chip On Board) light source, which is a component that directly attaches an LED chip to a mirror metal substrate with high reflectivity. When the COB light source is used, it will generate a lot of heat, so it needs to be dissipated.

[0058] Different from the prior art, the present application provides a heat dissipation platform, which includes: a shell, the shell is hollow, a fluid medium is contained in the shell, and one side surface of the shell is used to connect a heating module; multiple heat pipes, one end of the heat pipe passes through the other side surface of the shell and extends into the shell, one end of the heat pipe contacts the fluid medium to transfer the heat in the fluid medium to the heat pipe, and an air cooling component, the air cooling component is used to blow air to the multiple heat pipes to take away the heat in the multiple heat pipes. The present application sets a shell to contain the fluid medium, the fluid medium absorbs the heat emitted by the heating module, the heat pipe extends into the fluid medium to absorb the heat of the fluid medium, and then the air cooling component blows the heat away from the heat pipe. Due to the large specific heat capacity of the fluid medium, the heat of the heating module is directly absorbed by the fluid medium and then released through the heat pipe and the air cooling component, which can avoid the thermal shock caused by the high-power heating module emitting a large amount of heat in a short time. At the same time, one end of the heat pipe directly contacts the fluid medium to dissipate heat, which reduces the thermal resistance, can improve the heat dissipation efficiency, and thus can improve the heat dissipation effect.

[0059] In specific implementation, the above units or structures can be implemented as independent entities, or can be arbitrarily combined to be implemented as the same or several entities. The specific implementation of the above units or structures can refer to the previous method embodiments, which will not be repeated here.

[0060] The above is a detailed introduction to a heat dissipation platform and lighting equipment provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific embodiments and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A heat dissipation platform (10), characterized in that: The heat dissipation platform (10) comprises: A shell (12), the shell (12) being hollow, containing a fluid medium, and a side surface of the shell (12) being used for connecting a heating module (20); a plurality of heat pipes (15), one end of each heat pipe (15) passing through the other side surface of the shell (12) and extending into the interior of the shell (12), one end of each heat pipe (15) contacting the fluid medium so as to transfer heat in the fluid medium to the heat pipe (15), An air cooling component (11), the air cooling component (11) being used to blow air toward the plurality of heat pipes (15) to remove heat from the plurality of heat pipes (15); Wherein, the housing (12) comprises a bottom housing (121) and an upper cover (122), and the bottom housing (121) and the upper cover (122) are enclosed to form the housing (12); A groove (123) is provided on a surface of a side of the bottom shell (121) away from the upper cover (122), a heat dissipation bottom plate (165) is provided in the groove (123), and the heat dissipation bottom plate (165) fills the groove (123); A plurality of heat dissipation columns (164) are protrudingly provided on a surface of the heat dissipation bottom plate (165) facing the upper cover (122); The heat dissipation platform (10) comprises a driving pump (163), the driving pump (163) being located on a side of the heat dissipation column (164) away from the heat dissipation base plate (165), the driving pump (163) being used to extract the cooled fluid medium from the side away from the heat dissipation column (164) and release it to one side of the heat dissipation column (164); An elastic pressure relief member (161) is provided on a side of the upper cover (122) facing the bottom shell (121); the elastic pressure relief member (161) contracts when the pressure in the shell (12) increases, and expands when the pressure in the shell (12) decreases.

2. The heat dissipation platform (10) according to claim 1, characterized in that: One end of the heat pipe (15) passes through a side surface of the upper cover (122) away from the bottom shell (121) and extends into the interior of the housing (12); a side surface of the bottom shell (121) away from the upper cover (122) is used for connecting to a heating module (20).

3. The heat dissipation platform (10) according to claim 2, characterized in that: A surface of the heat dissipation base plate (165) on one side away from the upper cover (122) is connected to a heating module (20).

4. The heat dissipation platform (10) according to claim 3, characterized in that: The plurality of heat dissipation columns (164) are arranged in an array.

5. The heat dissipation platform (10) according to any one of claims 2 to 4, characterized in that: The air cooling component (11) comprises an air cooling outer cover (114) and a plurality of fans (111); the air cooling outer cover (114) is fixed on the shell (12); a heat dissipation grille (115) is provided on a side wall of the air cooling outer cover (114); the plurality of fans (111) are fixed on the air cooling outer cover (114); the plurality of heat pipes (15) are located in the air cooling outer cover (114); and the plurality of fans (111) blow air toward the plurality of heat pipes (15) to remove heat from the heat dissipation grille (115).

6. The heat dissipation platform (10) according to claim 5, characterized in that: The heat dissipation platform (10) comprises a plurality of heat dissipation fins (13), the plurality of heat dissipation fins (13) are located in the air-cooling outer cover (114), the plurality of heat dissipation fins (13) are arranged at intervals, the plurality of heat dissipation fins (13) are stacked in sequence on the other side surface of the shell (12), and the other ends of the plurality of heat pipes (15) pass through the plurality of heat dissipation fins (13) in sequence.

7. The heat dissipation platform (10) according to claim 5, characterized in that: The air cooling component (11) comprises an air deflector (112), the air deflector (112) comprises a plurality of air deflector plates (1122), the plurality of air deflector plates (1122) enclose a plurality of air deflector inlets (1121), the plurality of air deflector inlets (1121) correspond one-to-one to the plurality of fans (111), and the air blown out by the plurality of fans (111) passes through the air deflector inlets (1121) and blows toward the plurality of heat pipes (15).

8. A lighting device, characterized in that: The lighting device comprises the heat dissipation platform according to any one of claims 1 to 7.

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