Fixing method and jig for wafer cutting

By using a fixture and liquid paraffin to fix the wafer, the problem of sharp corners caused by positional displacement during wafer dicing was solved, achieving a low-cost solution for stable dicing and reusability.

CN116533395BActive Publication Date: 2026-05-29SUZHOU JINGFANG OPTOELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SUZHOU JINGFANG OPTOELECTRONICS TECH CO LTD
Filing Date
2023-05-22
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

During the wafer dicing process, the wafer is prone to positional displacement due to the cutting force caused by the linear movement of the dicing blade, resulting in sharp corners in the diced product.

Method used

The wafer is fixed using a fixture and a liquid fixing material (such as paraffin wax). The wafer's functional areas are completely covered in liquid, and the fixing material is cured before cutting to stabilize the wafer's position. Cutting is then performed using the cured fixing material and fixture.

Benefits of technology

It effectively reduces the positional displacement of the wafer caused by the force of the cutting blade during the dicing process, avoids the generation of abnormal sharp corners, and the fixture and materials can be reused, resulting in lower costs.

✦ Generated by Eureka AI based on patent content.

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    Figure CN116533395B_ABST
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Abstract

The present application discloses a fixing method and a fixture for wafer cutting, which comprises the following steps: providing a fixing fixture, the fixing fixture has an opening and a receiving cavity, a plurality of bearing components are arranged on the periphery of the opening; filling a fixing material in a liquid state into the receiving cavity, so that the surface of the fixing material filled in the receiving cavity does not exceed the side of the bearing component away from the receiving cavity; providing a wafer to be cut; placing the wafer to be cut on the bearing component, the first surface of the wafer faces the fixing material, and the functional area part is immersed in the fixing material; and solidifying the fixing material. The functional area of the wafer is completely covered by the fixing material in a liquid state, and the wafer is cut after the fixing material is solidified. The solidified fixing material can not only protect the functional area of the wafer, but also reduce the influence of the cutting blade force on the wafer during the cutting process, and reduce the possibility of abnormal sharp corners caused by the position deviation of the wafer.
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