Copper-embedding method for high-frequency copper-embedded circuit board and high-frequency copper-embedded circuit board

Abstract

The application provides a copper-embedding method of a high-frequency copper-embedded circuit board and the high-frequency copper-embedded circuit board. The copper-embedding method of the high-frequency copper-embedded circuit board comprises the following steps: providing a multilayer laminated board, a copper-embedding groove is formed on the surface of the multilayer laminated board; embedding a heat dissipation mechanism in the copper-embedding groove; and performing a tin spraying operation on the multilayer laminated board. The heat dissipation mechanism comprises a heat dissipation copper block and a plurality of elastic abutting components, the plurality of elastic abutting components are connected to the heat dissipation copper block, the plurality of elastic abutting components are uniformly and spacedly arranged along the circumference of the heat dissipation copper block, and one end of each elastic abutting component protrudes from the outside of the heat dissipation copper block and abuts against the inner circumferential wall of the copper-embedding groove, so that the heat dissipation copper block is embedded in the copper-embedding groove. In this way, the step of manually screening the heat dissipation copper block is omitted, and the embedding efficiency of the heat dissipation copper block is improved.

Description

Technical Field

[0001] This invention relates to the technical field of circuit boards, and in particular to a method for embedding copper in a high-frequency copper-embedded circuit board and the high-frequency copper-embedded circuit board itself. Background Technology

[0002] As electronic products become smaller, printed circuit boards (PCBs) are also shrinking in size, and circuit designs are becoming increasingly dense. Due to the increased power density of components, PCBs generate excessive heat, which affects component lifespan, causes aging, and can even lead to component failure.

[0003] For electronic components that generate a lot of heat, it is not enough to dissipate the heat simply through a single board carrier. Therefore, heat dissipation copper blocks are usually embedded in the printed circuit board to improve the heat dissipation efficiency of the printed circuit board.

[0004] Conventional heat sinks come in various sizes. When the heat sink is too small, it cannot be securely embedded in the mounting hole; when the heat sink is too large, forcibly embedding it can lead to hole bursting and internal resin cracking. To avoid these problems, suitable heat sinks need to be manually selected and test-fitted, but this results in low efficiency in embedding the heat sinks. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for embedding copper in a high-frequency copper-embedded circuit board, thereby avoiding manual screening of heat dissipation copper blocks and improving the efficiency of embedding heat dissipation copper blocks, as well as the high-frequency copper-embedded circuit board itself.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] A method for embedding copper in a high-frequency copper-embedded circuit board includes:

[0008] A multilayer laminate is provided, wherein a copper embedding groove is formed on the surface of the multilayer laminate;

[0009] The heat dissipation mechanism is embedded in the copper trough;

[0010] The multilayer laminate is subjected to a tin-plating operation;

[0011] The heat dissipation mechanism includes a heat dissipation copper block and multiple elastic abutment components. The multiple elastic abutment components are all connected to the heat dissipation copper block and are evenly spaced along the circumference of the heat dissipation copper block. One end of each elastic abutment component protrudes from the outside of the heat dissipation copper block and elastically abuts against the inner circumferential wall of the copper embedding groove, so that the heat dissipation copper block is embedded in the copper embedding groove.

[0012] In one embodiment, the outer surface of the heat dissipation copper block is provided with a plurality of mounting holes, and the plurality of mounting holes are respectively provided with a plurality of elastic abutment components, each of the elastic abutment components including:

[0013] The mounting sleeve is fixedly connected to the corresponding mounting hole, and the mounting sleeve forms a receiving groove.

[0014] The elastic element is located within the corresponding receiving groove;

[0015] An abutment member is located within a corresponding receiving groove, and the two ends of the elastic element of each elastic abutment component abut against the groove wall of the corresponding receiving groove and the corresponding abutment member, respectively; and

[0016] A limiting sleeve is fixedly fitted onto one end of the corresponding mounting sleeve and is correspondingly positioned to the opening of the corresponding receiving groove. Each of the elastic abutment components has a limiting sleeve with an extension hole communicating with the corresponding receiving groove. The abutting member of each elastic abutment component abuts against the corresponding limiting sleeve and passes through the corresponding extension hole, so that the abutting member of each elastic abutment component is still located outside the heat dissipation copper block and is used to abut against the inner peripheral wall of the copper immersion tank.

[0017] In one embodiment, the elastic element of each of the elastic abutment components is a spring.

[0018] In one embodiment, a driving hole is provided on the upper side of the heat dissipation copper block, and the driving hole is connected to each of the mounting holes;

[0019] The heat dissipation mechanism further includes a pressing component, which is located inside the driving hole and slidably sleeved with the heat dissipation copper block. The pressing component and the heat dissipation copper block are interference-fitted. The first end of the pressing component has a plurality of sequentially connected pushing inclined surfaces. The end of the mounting sleeve of each elastic abutment component away from the limiting sleeve has a force-bearing inclined surface. The plurality of pushing inclined surfaces are in one-to-one correspondence with the force-bearing inclined surfaces of the mounting sleeves of the plurality of elastic abutment components. When the pressing component is pressed, each pushing inclined surface pushes the corresponding mounting sleeve to move outward toward the heat dissipation copper block.

[0020] In one embodiment, the pressing assembly includes a push rod and a pressing part. The push rod is located inside the drive hole and is slidably sleeved with the heat dissipation copper block. The push rod and the heat dissipation copper block are interference-fitted. A plurality of push inclined surfaces are provided at the first end of the push rod. The pressing part protrudes and is fixedly connected to the second end of the push rod. The pressing part abuts against the heat dissipation copper block when the abutting members of each of the elastic abutting components abut against the inner wall of the copper trough.

[0021] In one embodiment, a groove is formed on the upper side of the heat dissipation copper block, and the driving hole is formed on the inner wall of the groove; the pressing part is received in the groove.

[0022] In one embodiment, the thickness of the pressing portion is less than the depth of the sink.

[0023] In one embodiment, the mounting sleeves of each of the resilient abutment components are in a transition fit with the heat dissipation copper block.

[0024] In one embodiment, the step of performing a soldering operation on the multilayer laminate includes:

[0025] The multilayer laminate is subjected to a single tin-plating process.

[0026] The multilayer laminate is subjected to a secondary tin-plating process.

[0027] A high-frequency copper-embedded circuit board is prepared by the copper embedding method of the high-frequency copper-embedded circuit board described in any of the above embodiments.

[0028] Compared with the prior art, the present invention has at least the following advantages:

[0029] During the embedding of the heat dissipation mechanism into the copper trough, the protruding portions of each elastic abutment component abut against the edge of the copper trough, causing these portions to elastically deform and contract, thus preventing them from obstructing the copper slag from entering the copper trough. As the heat dissipation mechanism continues to embed into the copper trough, the protruding portions of each elastic abutment component slide against the inner circumferential wall of the copper trough. Once the heat dissipation mechanism is fully embedded in the copper trough, the protruding portions of each elastic abutment component abut against the inner circumferential wall of the trough, allowing the copper slag to expand and contract. The heat dissipation mechanism is embedded in the copper trough. Since one end of each elastic abutment component protrudes from the outside of the heat dissipation copper block and elastically abuts against the inner circumferential wall of the copper trough, the size of the heat dissipation copper block is smaller than the size of the copper trough. That is, there is a gap between the heat dissipation copper block and the wall of the copper trough after it is embedded in the copper trough. Furthermore, since each elastic abutment component will elastically deform and shrink during the process of embedding the heat dissipation mechanism into the copper trough, the size of the heat dissipation copper block has a negligible impact on the embedding of the copper trough. Therefore, the step of manually selecting the heat dissipation copper block is eliminated, and the efficiency of embedding the heat dissipation copper block is improved. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 A flowchart illustrating the steps of a method for embedding copper in a high-frequency copper-embedded circuit board according to an embodiment;

[0032] Figure 2 This is a schematic diagram of the structure of a high-frequency copper-embedded circuit board according to an embodiment;

[0033] Figure 3 This is a schematic diagram of the structure of a high-frequency copper-embedded circuit board according to another embodiment;

[0034] Figure 4 for Figure 3 A partial structural schematic diagram of a high-frequency copper-embedded circuit board is shown.

[0035] Figure 5 for Figure 3 The diagram shows a high-frequency copper-embedded circuit board in another state. Detailed Implementation

[0036] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0037] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0039] This application provides a method for embedding copper in a high-frequency copper-embedded circuit board, comprising: providing a multilayer laminate, wherein a copper embedding groove is formed on the surface of the multilayer laminate; embedding a heat dissipation mechanism in the copper embedding groove; and performing a tin-spraying operation on the multilayer laminate; wherein the heat dissipation mechanism includes a heat dissipation copper block and a plurality of elastic abutment components, the plurality of elastic abutment components are all connected to the heat dissipation copper block, the plurality of elastic abutment components are evenly spaced along the circumference of the heat dissipation copper block, and one end of each elastic abutment component protrudes from the outer side of the heat dissipation copper block and abuts against the inner peripheral wall of the copper embedding groove, so that the heat dissipation copper block is embedded in the copper embedding groove.

[0040] In the aforementioned method for embedding copper in a high-frequency copper-embedded circuit board, during the embedding of the heat dissipation mechanism into the copper embedding groove, the protruding portions of each elastic abutment component abut against the edge of the copper-embedded groove. This causes the protruding portions of each elastic abutment component to elastically deform and contract, preventing them from obstructing the copper-embedded heat dissipation component from entering the copper embedding groove. As the heat dissipation mechanism continues to embed into the copper embedding groove, the protruding portions of each elastic abutment component slide against the inner circumferential wall of the copper embedding groove. When the heat dissipation mechanism is fully embedded in the copper embedding groove, the protruding portions of each elastic abutment component abut against the inner circumferential wall of the copper embedding groove. The inner circumferential wall of the through slot allows the heat dissipation mechanism to be embedded in the copper trough. Since one end of each elastic abutment component protrudes from the outside of the heat dissipation copper block and elastically abuts against the inner circumferential wall of the copper trough, the size of the heat dissipation copper block is smaller than the size of the copper trough. That is, there is a gap between the heat dissipation copper block and the wall of the copper trough after it is embedded. Furthermore, since each elastic abutment component will elastically deform and shrink during the process of embedding the heat dissipation mechanism into the copper trough, the size of the heat dissipation copper block has a negligible impact on the embedding of the copper trough. Therefore, the step of manually selecting the heat dissipation copper block is eliminated, and the efficiency of embedding the heat dissipation copper block is improved.

[0041] To better understand the technical solution and beneficial effects of this application, the following detailed description is provided in conjunction with specific embodiments:

[0042] like Figures 1 to 3 As shown, a method for embedding copper in a high-frequency copper-embedded circuit board includes:

[0043] S100: Provides a multilayer laminate 100, the surface of which is formed with a copper embedding groove 101.

[0044] In this embodiment, the multilayer laminate 100 is a multilayer laminate 100 that has been coated with solder resist.

[0045] S300: The heat dissipation mechanism 200 is embedded in the copper trough 101. The heat dissipation mechanism 200 includes a heat dissipation copper block 210 and a plurality of elastic abutment components 220. The plurality of elastic abutment components 220 are all connected to the heat dissipation copper block 210. The plurality of elastic abutment components 220 are evenly spaced along the circumference of the heat dissipation copper block 210. One end of each elastic abutment component 220 protrudes from the outer side of the heat dissipation copper block 210 and elastically abuts against the inner peripheral wall of the copper trough 101, so that the heat dissipation copper block 210 is embedded in the copper trough 101.

[0046] In this embodiment, the size of the heat dissipation copper block 210 is smaller than the size of the copper immersion tank 101, that is, there is a gap between the heat dissipation copper block 210 and the wall of the copper immersion tank 101 after the copper immersion copper block 210 is embedded in the copper immersion tank 101. During the process of embedding the heat dissipation mechanism 200 into the copper trough 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 abut against the edge of the copper trough 101, causing the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 to elastically deform and contract, so as to avoid the elastic abutment components 220 obstructing the heat dissipation copper block 210 from entering the copper trough 101; as the heat dissipation mechanism 200 continues to embed into the copper trough 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 slide against the inner peripheral wall of the copper trough 101. After the heat dissipation mechanism 200 enters the copper trough 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 elastically abut against the inner peripheral wall of the buried channel, so that the heat dissipation copper block 210 is embedded in the copper trough 101, thereby improving the heat dissipation effect of the multilayer board, that is, improving the heat dissipation effect of the circuit board subsequently manufactured.

[0047] S500: Perform tin plating on the multilayer laminate 100.

[0048] In this embodiment, after the multilayer laminate 100 is tin-plated, the pads on the surface of the multilayer laminate 100 will be coated with a tin layer, which can effectively isolate the pads from the air, prevent the pads from oxidizing, and ensure the conductivity and solderability of the circuit board. Furthermore, after the heat dissipation mechanism 200 is embedded in the copper immersion tank 101, there is a gap between the heat dissipation mechanism 200 and the tank wall of the copper immersion tank 101. After the multilayer laminate 100 is tin-plated, the tin layer will fill the gap between the heat dissipation mechanism 200 and the tank wall of the copper immersion tank 101, so that the heat dissipation mechanism 200 is firmly embedded in the copper immersion tank 101, avoiding the problem of the heat dissipation mechanism 200 falling off, and ensuring better heat dissipation effect of the subsequently manufactured circuit board.

[0049] In the aforementioned method for embedding copper in a high-frequency copper-embedded circuit board, during the process of the heat dissipation mechanism 200 being embedded into the copper embedding groove 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 abut against the edge of the copper embedding groove 101, causing the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 to elastically deform and contract, thereby preventing the elastic abutment components 220 from obstructing the heat dissipation copper block 210 from entering the copper embedding groove 101. As the heat dissipation mechanism 200 continues to be embedded into the copper embedding groove 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 slide against the inner peripheral wall of the copper embedding groove 101. After the heat dissipation mechanism 200 is fully embedded into the copper embedding groove 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210... The heat dissipation mechanism 200 is embedded in the copper trough 101 by abutting against the inner peripheral wall of the copper trough 210. Since one end of each elastic abutting component 220 protrudes from the outside of the heat dissipation copper block 210 and elastically abuts against the inner peripheral wall of the copper trough 101, the size of the heat dissipation copper block 210 is smaller than the size of the copper trough 101. That is, there is a gap between the heat dissipation copper block 210 and the wall of the copper trough 101 after it is embedded in the copper trough 101. Furthermore, since each elastic abutting component 220 will elastically deform and shrink during the process of embedding the heat dissipation mechanism 200 into the copper trough 101, the size of the heat dissipation copper block 210 has a negligible impact on the embedding of the copper trough. Therefore, the step of manually selecting the heat dissipation copper block 210 is eliminated, and the efficiency of embedding the heat dissipation copper block 210 is improved.

[0050] like Figure 3 and Figure 4 As shown, in one embodiment, the outer surface of the heat dissipation copper block 210 is provided with a plurality of mounting holes 211, and the plurality of mounting holes 211 are respectively provided with a plurality of elastic abutment components 220. Each elastic abutment component 220 includes a mounting sleeve 221, an elastic element 222, an abutment element 223, and a limiting sleeve 224. The mounting sleeve 221 of each elastic abutment component 220 is fixedly connected to the corresponding mounting hole 211, and the mounting sleeve 221 of each elastic abutment component 220 is formed with The receiving groove 2211, the elastic element 222 of each elastic abutment component 220 is located in the corresponding receiving groove 2211, the abutment element 223 of each elastic abutment component 220 is located in the corresponding receiving groove 2211, and the two ends of the elastic element 222 of each elastic abutment component 220 abut against the groove wall of the corresponding receiving groove 2211 and the corresponding abutment element 223, so that the abutment element 223 of each elastic abutment component 220 is elastically connected to the mounting sleeve 221 through the corresponding elastic element 222.

[0051] like Figure 3 and Figure 4As shown, further, the limiting sleeve 224 of each elastic abutment component 220 is fixedly sleeved on one end of the corresponding mounting sleeve 221 and is correspondingly set with the opening of the corresponding receiving groove 2211. The limiting sleeve 224 of each elastic abutment component 220 has an extension hole 2241 that communicates with the corresponding receiving groove 2211. The abutting member 223 of each elastic abutment component 220 abuts against the corresponding limiting sleeve 224 and passes through the corresponding extension hole 2241, so that the abutting member 223 of each elastic abutment component 220 is also located outside the heat dissipation copper block 210 and is used to abut against the inner peripheral wall of the copper immersion tank 101.

[0052] like Figure 3 As shown, in this embodiment, when the abutting member 223 of each elastic abutting component 220 abuts against the edge and inner peripheral wall of the copper immersion tank 101, the abutting member 223 of each elastic abutting component 220 compresses the corresponding elastic member 222 and moves in the direction of the corresponding elastic member 222. Since the abutting member 223 of each elastic abutting component 220 abuts against the corresponding limiting sleeve 224, it prevents the abutting member 223 of each elastic abutting component 220 from being ejected from the corresponding mounting sleeve 221 by the corresponding elastic member 222, ensuring that the abutting member 223 of each elastic abutting component 220 can be used to abut against the inner peripheral wall of the copper immersion tank 101.

[0053] like Figure 3 As shown, in one embodiment, the elastic element 222 of each elastic abutment component 220 is a spring, so that the elastic element 222 of each elastic abutment component 220 is elastic. Of course, in other embodiments, the elastic element 222 of each elastic abutment component 220 may also be a rubber element, a silicone element, or other existing elastic element 222.

[0054] like Figure 4 As shown, in one embodiment, the abutment 223 of each elastic abutment component 220 has a limiting portion 2231 protruding from one end of the abutment member 223 adjacent to the corresponding elastic member 222. The limiting portion 2231 of the abutment member 223 of each elastic abutment component 220 abuts against the corresponding limiting sleeve 224 to prevent the abutment member 223 of each elastic abutment component 220 from disengaging from the corresponding mounting sleeve 221.

[0055] like Figure 3As shown, in one embodiment, a driving hole 212 is provided on the upper side of the heat dissipation copper block 210, and the driving hole 212 is connected to each mounting hole 211. Further, the heat dissipation mechanism 200 also includes a pressing component 230, which is located within the driving hole 212 and slidably sleeved with the heat dissipation copper block 210. The pressing component 230 and the heat dissipation copper block 210 are in an interference fit. The first end of the pressing component 230 has a plurality of sequentially connected pushing inclined surfaces 2301. The end of the mounting sleeve 221 of each elastic abutment component 220 away from the limiting sleeve 224 has a force-bearing inclined surface 2211. The plurality of pushing inclined surfaces 2301 correspond one-to-one with the mounting sleeves 221 of the plurality of elastic abutment components 220. The force-bearing inclined surface 2211 of 21 and the pushing inclined surface 2301 push the corresponding mounting sleeve 221 to move outward of the heat dissipation copper block 210 when pressing the pressing component 230, so that the contact force between the contact piece 223 of each elastic contact component 220 and the inner wall of the copper trough 101 is increased, thereby improving the connection stability between the contact piece 223 of each elastic contact component 220 and the multilayer press plate 100, thereby improving the positional stability of the heat dissipation mechanism 200, and ensuring that the heat dissipation mechanism 200 can dissipate heat from the multilayer press plate 100.

[0056] like Figure 3 As shown, in this embodiment, since the pressing component 230 and the heat dissipation copper block 210 are interference fit, the pressing component 230 will be subjected to the clamping force of the heat dissipation copper block 210. After pressing the pressing component 230, due to the clamping force of the heat dissipation copper block 210, the pressing component 230 will not reset, so that the pressing component 230 hinders the reset of the mounting sleeve 221 of each elastic abutment component 220, thereby enabling the heat dissipation mechanism 200 to continuously maintain a relatively stable state.

[0057] It should be noted that when the contact force between the abutting parts 223 of each elastic abutting component 220 and the inner peripheral wall of the copper trough 101 increases to a certain extent, bursting and cracking problems will occur. Therefore, the pressing depth of the pressing component 230 needs to be maintained at a preset value to adjust the contact force of the abutting parts 223 of each elastic abutting component 220 to an appropriate value, thereby avoiding bursting and cracking problems. It can be understood that the preset value of the pressing depth can be obtained through a limited number of tests, and will not be described in detail again.

[0058] like Figure 3As shown, in one embodiment, the pressing assembly 230 includes a push rod 231 and a pressing part 232. The push rod 231 is located inside the drive hole 212 and is slidably sleeved with the heat dissipation copper block 210. The push rod 231 and the heat dissipation copper block 210 are interference-fitted. Multiple push ramps 2301 are provided at the first end of the push rod 231. The pressing part 232 protrudes and is fixedly connected to the second end of the push rod 231. The pressing part 232 abuts against the heat dissipation copper block 210 when the abutting members 223 of each elastic abutting assembly 220 abut against the inner wall of the copper trough 101. In this embodiment, since the pressing part 232 protrudes from the push rod 231, the pressing area of ​​the pressing assembly 230 is increased, improving the convenience of pressing.

[0059] like Figure 5 As shown, in one embodiment, a groove 213 is provided on the upper side of the heat dissipation copper block 210, a driving hole 212 is formed in the inner wall of the groove 213, and the pressing part 232 is received in the groove 213, which avoids the pressing part 232 from protruding out of the multilayer press plate 100 and improves the flatness of the multilayer press plate 100.

[0060] like Figure 5 As shown, in one embodiment, the thickness of the pressing part 232 is less than the depth of the groove 213, so that the pressing part 232 is completely housed within the heat dissipation copper block 210.

[0061] like Figure 5 As shown, in one embodiment, the mounting sleeve 221 of each elastic abutment component 220 and the heat dissipation copper block 210 are in a transitional fit, which reduces the connection strength between the mounting sleeve 221 of each elastic abutment component 220 and the heat dissipation copper block 210. This makes it easier for the pressing component 230 to push each mounting sleeve 221 to slide, that is, each pushing inclined surface 2301 can more easily push the corresponding mounting sleeve 221 to slide, improving the convenience of pressing the pressing component 230. It can be understood that because the mounting sleeve 221 of each elastic abutment component 220 and the heat dissipation copper block 210 are in a transitional fit, the mounting sleeve 221 of each elastic abutment component 220 will not move without external force.

[0062] In one embodiment, the step of performing a tin-plating operation on the multilayer laminate 100 includes: performing a first tin-plating process on the multilayer laminate 100; and performing a second tin-plating process on the multilayer laminate 100.

[0063] In one embodiment, the abutment 223 of each elastic abutment 223, the corresponding elastic element 222 and the corresponding mounting sleeve 221 are all copper structures to improve the heat conduction effect of the heat dissipation mechanism 200, thereby improving the heat dissipation effect of the heat dissipation mechanism 200.

[0064] In one embodiment, after the step of providing the multilayer laminate 100 and forming a copper embedding groove 101 on the surface of the multilayer laminate 100, and before the step of embedding the heat dissipation mechanism 200 in the copper embedding groove 101, the copper embedding method for the high-frequency copper-embedded circuit board further includes: providing a molding plate and stacking the multilayer laminate 100 on the molding plate. In this embodiment, the surface of the molding plate that contacts the multilayer laminate 100 is flat. When the heat dissipation copper block 210 is embedded in the position that contacts the molding plate, the movement of the heat dissipation copper block 210 is stopped, which prevents the heat dissipation copper block 210 from protruding from the side of the multilayer laminate 100 adjacent to the molding plate, thereby improving the flatness of the multilayer laminate 100.

[0065] like Figure 5 As shown, in one embodiment, the outer surface of the heat dissipation copper block 210 is provided with a plurality of clamping slots 214, which are evenly spaced along the outer side of the heat dissipation copper block 210. In this embodiment, when the heat dissipation mechanism 200 is embedded in the copper embedding groove 101, firstly, the multiple jaws of the clamp extend into the multiple clamping slots 214 one by one, then the clamp retracts and clamps the heat dissipation copper block 210, and then the heat dissipation mechanism 200 is moved by clamping to embed the heat dissipation mechanism 200 into the copper embedding groove 101.

[0066] like Figure 5 As shown, each clamping slot 214 extends to the top surface and outer side surface of the heat dissipation copper block 210. In this embodiment, when the clamping claws abut against the inner wall of each clamping slot 214, the heat dissipation mechanism 200 can be pushed into the copper embedding groove 101, which improves the convenience and efficiency of embedding the heat dissipation mechanism 200.

[0067] like Figure 4 and Figure 5 As shown, in one embodiment, an arc-shaped guide surface 2232 is formed at the lower edge of the abutment member 223 of each elastic abutment component 220. In this embodiment, during the process of installing the heat dissipation mechanism 200 into the copper immersion tank 101, the arc-shaped guide surface 2232 of the abutment member 223 of each elastic abutment component 220 contacts the edge of the copper immersion tank 101. Since the size of each abutment member 223 at the arc-shaped guide surface 2232 is small, each abutment member 223 can easily enter the copper immersion tank 101, thereby making it easier for the heat dissipation mechanism 200 to enter the copper immersion tank 101 and improving the embedding efficiency of the heat dissipation mechanism 200.

[0068] It is understandable that when the multilayer laminate 100 is tin-plated, the powder will impact the heat dissipation mechanism 200, causing the heat dissipation mechanism 200 to shift or even detach from the multilayer laminate 100.

[0069] Therefore, as Figure 5As shown, in one embodiment, the copper trough 101 includes a large embedded hole 1011 and a small embedded hole 1012 that are connected to each other. The inner diameter of the large embedded hole 1011 is larger than the inner diameter of the small embedded hole 1012, so that the inner wall of the large embedded hole 1011 and the inner wall of the small embedded hole 1012 together form a stepped surface. The abutting member 223 of each elastic abutting component 220 is located in the large embedded hole 1011 and abuts against the two inner walls adjacent to the large embedded hole 1011. That is, the abutting member 223 of each elastic abutting component 220 is clamped on the two adjacent inner walls of the large embedded hole 1011, so that the inner wall of the large embedded hole 1011 blocks the heat dissipation mechanism 200 from shifting to one side of the multilayer laminated plate 100.

[0070] like Figure 5 As shown, further, during the process of the heat dissipation mechanism 200 being embedded in the copper trough 101, the abutting members 223 of each elastic abutting component 220 abut against the edge of the embedded large hole 1011, causing the abutting members 223 of each elastic abutting component 220 to compress the elastic member 222 and contract, so as to avoid the abutting members 223 of each elastic abutting component 220 obstructing the heat dissipation copper block 210 from entering the copper trough 101; when the abutting members 223 of each elastic abutting component 220 slide to the edge of the embedded large hole 1011, the abutting members 223 of each elastic abutting component 220 slide against the edge of the embedded large hole 1011. When the position corresponding to 011 is reached, the abutment 223 of each elastic abutment component 220 moves outward under the push of the corresponding elastic element 222, so that the abutment 223 of each elastic abutment component 220 is located on the inner wall of the embedded large hole 1011 adjacent to the embedded small hole 1012, thereby causing the stepped surface blocking heat dissipation mechanism 200 to move to the side adjacent to the embedded small hole 1012. At this time, the installation of the heat dissipation mechanism 200 is completed, that is, the heat dissipation mechanism 200 is completely embedded in the copper trough 101.

[0071] like Figure 5 As shown, further, when performing tin plating on the multilayer laminate 100, the tin plating operation can be performed first on the side adjacent to the embedded large hole 1011. At this time, due to the limiting effect of the stepped surface, the impact force of the tin plating cannot cause the heat dissipation mechanism 200 to shift. After the tin plating operation on this side is completed, the tin layer fixes the heat dissipation mechanism 200. Then, the tin plating operation is performed on the other side of the multilayer laminate 100. Since the tin layer has fixed the heat dissipation mechanism 200, the impact force of the tin plating cannot move the heat dissipation mechanism 200. In this way, by setting the embedded large hole 1011 and embedded small hole 1012, the impact force of tin plating is avoided from having an adverse effect on the heat dissipation mechanism 200.

[0072] Further, the step of providing a multilayer laminate 100, wherein a copper embedding groove 101 is formed on the surface of the multilayer laminate 100 includes: providing the multilayer laminate 100 and drilling a hole in a first side of the multilayer laminate 100 to form a small embedded hole 1012 in the first side of the multilayer laminate 100; drilling a hole in a second side of the multilayer laminate 100 to form a large embedded hole 1011 in the second side of the multilayer laminate 100, wherein the inner diameter of the large embedded hole 1011 is larger than the inner diameter of the small embedded hole 1012, the inner wall of the large embedded hole 1011 and the inner wall of the small embedded hole 1012 together form the copper embedding groove 101, and the inner wall of the large embedded hole 1011 and the inner wall of the small embedded hole 1012 together form a stepped surface.

[0073] Of course, since the abutting parts 223 of each elastic abutting component 220 are elastically connected to the corresponding mounting sleeve 221 through the corresponding elastic element 222, that is, the abutting parts 223 of each elastic abutting component 220 can shrink by compressing the corresponding elastic element 222, if the soldering rate of the side of the multilayer laminated plate 100 adjacent to the embedded large hole 1011 is not properly adjusted, resulting in an excessive soldering rate, the abutting parts 223 of each elastic abutting component 220 will shrink, thereby causing the impact force of the soldering to displace the heat dissipation mechanism 200.

[0074] To suppress the adverse effects of improper solder spraying rate adjustment, such as Figure 5 As shown, in one embodiment, the abutment 223 of each elastic abutment component 220 is in contact with the inner wall of the embedded large hole 1011 adjacent to the embedded small hole 1012, which increases the contact area between the abutment 223 of each elastic abutment component 220 and the inner wall of the embedded large hole 1011, thereby increasing the connection strength between the abutment 223 of each elastic abutment component 220 and the inner wall of the embedded large hole 1011 and suppressing the adverse effects caused by improper adjustment of the solder spraying rate.

[0075] like Figure 5 As shown, furthermore, the abutment 223 of each elastic abutment component 220 is also in contact with the inner peripheral wall of the embedded large hole 1011, which increases the contact area between the abutment 223 of each elastic abutment component 220 and the inner wall of the embedded large hole 1011, further increasing the connection strength between the abutment 223 of each elastic abutment component 220 and the inner wall of the embedded large hole 1011, further suppressing the adverse effects caused by improper adjustment of the solder spraying rate, and also dispersing the force on the inner wall of the embedded large hole 1011, suppressing the problems of bursting holes and internal resin cracks in the multilayer laminate 100.

[0076] like Figure 5As shown, further, the inner peripheral wall of the embedded small hole 1012 is parallel to the inner peripheral wall of the embedded large hole 1011. In this embodiment, when the heat dissipation mechanism 200 is embedded in the embedded small hole 1012, the abutting member 223 of each elastic abutting component 220 is in contact with the embedded small hole 1012, dispersing the force on the inner wall of the embedded small hole 1012 and suppressing the problems of bursting holes and internal resin cracks in the multilayer laminate 100.

[0077] It is understandable that burrs are more likely to exist at the junction of the embedded large hole 1011 and the embedded small hole 1012. If the abutment 223 of each elastic abutment component 220 slides over the burrs, since the abutment 223 of each elastic abutment component 220 is a rigid copper structure, there is a risk that the abutment 223 of each elastic abutment component 220 will tear the burrs, which will lead to the tearing of the inner wall of the embedded small hole 1012 and the embedded large hole 1011. That is, there will be burst holes and internal resin cracks in the multilayer laminate 100, which will lead to the deterioration of the circuit board performance.

[0078] To avoid the risk of tearing burrs, in one embodiment, the abutment 223 of each elastic abutment component 220 is covered with a heat-dissipating silicone layer, and the thickness of the heat-dissipating silicone layer on the abutment 223 of each elastic abutment component 220 is uniform, so that the heat-dissipating silicone layer does not change the original shape of each abutment 223. The abutment 223 of each elastic abutment component 220 abuts against the inner wall of the embedded large hole 1011 and the inner wall of the embedded small hole 1012 through the corresponding heat-dissipating silicone layer. In this embodiment, when installing the heat dissipation mechanism 200, the heat-dissipating silicone layer directly contacts the burrs. Since the heat-dissipating silicone layer is an elastic structure, when the heat-dissipating silicone layer flexibly contacts the burrs, it avoids tearing the burrs, thereby avoiding the problems of bursting holes and internal resin cracks caused by burrs. Moreover, the heat-dissipating silicone layer has high heat dissipation performance. By directly contacting the inner wall of the embedded copper tank 101, the heat dissipation effect of the heat dissipation mechanism 200 is improved.

[0079] This application also provides a high-frequency copper-embedded circuit board, which is prepared by the copper embedding method of the high-frequency copper-embedded circuit board described in any of the above embodiments.

[0080] Compared with the prior art, the present invention has at least the following advantages:

[0081] During the process of the heat dissipation mechanism 200 being embedded in the copper trough 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 abut against the edge of the copper trough 101, causing the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 to elastically deform and contract, so as to prevent the elastic abutment components 220 from obstructing the heat dissipation copper block 210 from entering the copper trough 101; as the heat dissipation mechanism 200 continues to be embedded in the copper trough 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 slide against the inner peripheral wall of the copper trough 101; when the heat dissipation mechanism 200 is fully embedded in the copper trough 101, the portions of each elastic abutment component 220 protruding from the heat dissipation copper block 210 abut against the inner peripheral wall of the copper trough 101. The inner peripheral wall allows the heat dissipation mechanism 200 to be embedded in the copper trough 101. Since one end of each elastic abutment component 220 protrudes from the outside of the heat dissipation copper block 210 and elastically abuts against the inner peripheral wall of the copper trough 101, the size of the heat dissipation copper block 210 is smaller than the size of the copper trough 101. That is, there is a gap between the heat dissipation copper block 210 and the wall of the copper trough 101 after it is embedded in the copper trough 101. Furthermore, since each elastic abutment component 220 will elastically deform and shrink during the process of the heat dissipation mechanism 200 being embedded in the copper trough 101, the size of the heat dissipation copper block 210 has a negligible impact on the embedding of the copper trough. Therefore, the step of manually selecting the heat dissipation copper block 210 is eliminated, and the efficiency of embedding the heat dissipation copper block 210 is improved.

[0082] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various elastic modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for embedding copper in a high frequency copper-embedded wiring board, characterized by, The application relates to a heat dissipation mechanism for a multi-layer pressboard. The application provides a multi-layer pressboard, a press mold flat plate, and a heat dissipation mechanism. The heat dissipation mechanism is embedded in the copper-embedded groove. The multi-layer pressboard is subjected to a tin spraying operation. The heat dissipation mechanism comprises a heat dissipation copper block and a plurality of elastic abutting components. The plurality of elastic abutting components are uniformly and spacedly arranged along the circumference of the heat dissipation copper block. One end of each elastic abutting component protrudes from the outer side of the heat dissipation copper block and elastically abuts against the inner circumferential wall of the copper-embedded groove. The outer side of the heat dissipation copper block is provided with a plurality of mounting holes. Each elastic abutting component comprises a mounting sleeve, an elastic member, an abutting member and a limiting sleeve.

2. The method of claim 1, wherein the copper plating is performed by electroless plating. The mounting sleeve is fixedly connected in the corresponding mounting hole.

3. The method of claim 1, wherein the copper is embedded by a method of electroplating copper on the high frequency copper-inlaid wiring board. The mounting sleeve is formed with a receiving groove. The elastic member is located in the corresponding receiving groove. The abutting member is located in the corresponding receiving groove. The two ends of the elastic member of each elastic abutting component abut against the groove wall of the corresponding receiving groove and the corresponding abutting member. The limiting sleeve is fixedly sleeved at one end of the corresponding mounting sleeve and is arranged corresponding to the opening of the corresponding receiving groove. The limiting sleeve of each elastic abutting component is provided with a protruding hole communicating with the corresponding receiving groove. The abutting member of each elastic abutting component abuts against the corresponding limiting sleeve and penetrates through the corresponding protruding hole. The abutting member of each elastic abutting component is located outside the heat dissipation copper block and is used for abutting against the inner circumferential wall of the copper-embedded groove. The abutting member of each elastic abutting component is provided with a limiting portion adjacent to one end of the corresponding elastic member. The limiting portion of the abutting member of each elastic abutting component abuts against the corresponding limiting sleeve. The copper-embedded groove comprises a copper-embedded large hole and a copper-embedded small hole. The inner diameter of the copper-embedded large hole is larger than that of the copper-embedded small hole. The inner wall of the copper-embedded large hole and the inner wall of the copper-embedded small hole jointly form a stepped surface. The abutting member of each elastic abutting component is located in the copper-embedded large hole and abuts against the two inner walls adjacent to the copper-embedded large hole. The elastic member of each elastic abutting component is a spring. The upper side of the heat dissipation copper block is provided with a driving hole. The driving hole communicates with each mounting hole. The heat dissipation mechanism further comprises a pressing assembly. The pressing assembly is located in the driving hole and is in sliding sleeve connection with the heat dissipation copper block. The pressing assembly is in interference fit with the heat dissipation copper block. The first end of the pressing assembly is formed with a plurality of sequentially connected pushing inclined surfaces. The end of the mounting sleeve of each elastic abutting component, which is away from the limiting sleeve, is formed with a stress inclined surface. The plurality of pushing inclined surfaces are one-to-one corresponding to the stress inclined surfaces of the mounting sleeves of the plurality of elastic abutting components. Each pushing inclined surface pushes the corresponding mounting sleeve to move to the outer side of the heat dissipation copper block when the pressing assembly is pressed.

4. The method of claim 3, wherein the copper is buried by electroplating copper on the copper clad laminate after the copper clad laminate is subjected to the high frequency copper plating process. The pressing assembly comprises a pushing rod and a pressing part, the pushing rod is located in the driving hole and is in sliding fit with the heat dissipation copper block, the pushing rod is in interference fit with the heat dissipation copper block, a plurality of pushing inclined surfaces are arranged at the first end of the pushing rod, the pressing part is protruded and fixedly connected to the second end of the pushing rod, and the pressing part is in abutment with the heat dissipation copper block when the abutting piece of each elastic abutting assembly is in abutment with the inner wall of the buried copper groove.

5. The method of claim 4, wherein the copper is embedded by a method comprising: The upper side of the heat dissipation copper block is provided with a sink, and the driving hole is formed in the inner wall of the sink; and the pressing part is accommodated in the sink.

6. The method of claim 5, wherein the copper is embedded by a method comprising: The thickness of the pressing part is less than the depth of the sink.

7. The method of claim 3, wherein the copper is buried by electroplating copper on the copper clad laminate board. The mounting sleeve of each elastic abutting assembly is in transition fit with the heat dissipation copper block.

8. The method of claim 1, wherein the copper damascene process is a high frequency copper inlaid wiring board. The steps of the tin spraying operation on the multilayer press-bonded plate comprise: The multilayer press-bonded plate is subjected to one-time tin spraying treatment. The multilayer press-bonded plate is subjected to two-time tin spraying treatment.

9. A high frequency copper-inlaid wiring board, characterized by, The buried copper method of the high-frequency copper-embedded circuit board is prepared by using the method according to any one of claims 1 to 8. The thickness of the pressing part is less than the depth of the sink. The mounting sleeve of each elastic abutting assembly is in transition fit with the heat dissipation copper block. The steps of the tin spraying operation on the multilayer press-bonded plate comprise: The multilayer press-bonded plate is subjected to one-time tin spraying treatment. The multilayer press-bonded plate is subjected to two-time tin spraying treatment. The buried copper method of the high-frequency copper-embedded circuit board is prepared by using the method according to any one of claims 1 to 8.

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