A device and method for rapid detection and correction of mos transistors

Abstract

The application relates to a device and method for rapid detection and correction of MOS tubes. The device comprises a support seat, a conveying belt mechanism, a mechanical hand mechanism, a detection mechanism, a device groove and a controller. The conveying surface of the conveying belt mechanism is located above the support seat and is used for directional conveying of the MOS tubes along the Y-axis. The mechanical hand mechanism is used for grabbing the MOS tubes and moving along the X, Y and Z axes. The detection mechanism comprises a detection base, a lower shaping plate, an upper shaping plate, a first linear actuator, a shell, a voltage acquisition module and an image acquisition module. The device groove is used for storing the MOS tubes which pass the pin shape detection and voltage detection. The controller is used for conveying the MOS tubes between the conveying belt mechanism, the detection mechanism and the device groove by the mechanical hand mechanism, acquiring the overhead image and voltage information of the MOS tube located on the lower shaping plate, and analyzing whether the voltage detection and pin shape detection of the MOS tube are qualified. The device significantly improves the detection precision and efficiency, and improves the correction efficiency and yield.

Description

Technical Field

[0001] The present invention relates to the technical field of MOS tube quality inspection, and in particular to a device and method for rapid detection and correction of MOS tubes. Background Art

[0002] MOS tubes can deform during use due to heat and external stress, affecting work efficiency and the overall operating state of the device. Currently, manual inspection is typically used for the inspection and correction of MOS tubes. This has the disadvantages of long inspection times, inconsistent standards, and high costs. Furthermore, the inspection of the MOS tube's state and shape can easily cause secondary damage to the MOS tube's casing and pins. The required inspection process is also relatively complex, prone to false detection and missed detection, which seriously reduces inspection efficiency. Summary of the Invention

[0003] Based on this, it is necessary to address the technical problems of low efficiency and poor effect in manual detection and correction of MOS tubes in the existing technology. The present invention provides a device and method for rapid detection and correction of MOS tubes.

[0004] The invention discloses a device for rapid detection and correction of MOS tubes, comprising a support seat, a conveyor belt mechanism, a manipulator mechanism, a detection mechanism, a device slot and a controller.

[0005] The length, width, and height of the support base are defined as the X, Y, and Z axes, respectively.

[0006] The conveying surface of the conveyor belt mechanism is located above the support seat and is used to convey the MOS tube in a direction along the Y-axis.

[0007] The robot mechanism is used to grab the MOS tube and move along the X, Y, and Z axes.

[0008] The detection mechanism includes a detection base, a lower shaping plate, an upper shaping plate, a first linear actuator, a housing, a voltage acquisition module, and an image acquisition module. The detection base is fixedly connected to the support base and is located on the side of the conveyor mechanism away from the manipulator mechanism. The lower shaping plate is fixedly connected to the detection base. The bottom of the housing is fixed to the upper shaping plate, and the piston end of the first linear actuator is fixed to the top of the housing and can drive the upper shaping plate to move linearly along the Z axis directly above the lower shaping plate. A continuous through hole is provided on the bottom of the housing and the upper shaping plate, and the extension direction of the through hole is perpendicular to the XY plane. The voltage acquisition module is arranged in the housing, and the voltage acquisition module includes a second linear actuator, a PIN needle, and a voltage acquisition circuit. The PIN needle corresponds to the number of pins of the MOS tube and is electrically connected to the voltage acquisition circuit. The piston end of the second linear actuator is fixed to the PIN needle and can drive the PIN needle to move linearly along the Z axis and extend from the bottom of the through hole. When the upper shaping plate is pressed against the lower shaping plate, the two engage and form a shaping channel for accommodating the pins of the MOS tube, and the shaping channel is connected to the bottom of the through hole. When the PIN pin contacts the MOS tube pin in the limiting channel, the voltage acquisition circuit is used to collect the voltage U between the gate and source of the MOS tube. GS , the voltage U between the drain and source DS The image acquisition module is fixedly connected to the manipulator mechanism and is used to acquire a top view image of the MOS tube.

[0009] The device slot is used to store MOS tubes that have passed both pin shape detection and voltage detection.

[0010] The controller is used to: a) control the robotic arm mechanism to transport the MOS tube between the conveyor mechanism, the inspection mechanism, and the device slot; b) obtain a top-view image and voltage information of the MOS tube located on the lower shaping plate to analyze whether the MOS tube has passed voltage and pin shape testing.

[0011] The present invention also discloses a method for rapid detection and correction of MOS transistors, which is applied to the above-mentioned device for rapid detection and correction of MOS transistors. The method comprises the following steps:

[0012] 1. Control the robot mechanism to grab the MOS tube to be tested from the predetermined position on the conveyor mechanism and place it on the test base, and keep the pins of the MOS tube on the lower plastic plate, and then reset the robot mechanism to the initial position.

[0013] Second, control the first linear actuator to drive the upper shaping plate to move downward until the pins on the lower shaping plate are pressed into the shaping channel, thereby completing the extrusion shaping of the MOS tube pins.

[0014] 3. Control the second linear actuator to drive the PIN needle to move downward along the through hole until it contacts the pin of the MOS tube to be tested, thereby collecting the voltage U between the gate and source of the MOS tubeGS , the voltage U between the drain and source DS , and then reset the first linear actuator and the second linear actuator to their initial positions.

[0015] 4. Control the manipulator mechanism to move the voltage acquisition module to the top of the lower shaping plate, collect the top view image of the MOS tube to be tested, and use image recognition technology to complete the shape detection of the MOS tube pins.

[0016] 5. When the shape test of the MOS tube pin to be tested fails, return to step 2 to repeat the extrusion and shaping.

[0017] 6. When the shape of the pin of the MOS tube to be inspected passes the inspection, the manipulator mechanism is controlled to grab the MOS tube and place it in the device slot.

[0018] As a further improvement to the above solution, in step five, if the MOS tube to be inspected still fails to meet both voltage and shape test requirements after repeated correction three times, the unqualified MOS tube will be grabbed and placed on a conveyor mechanism for directionally transported to the next process.

[0019] Compared with the prior art, the technical solution disclosed in the present invention has the following beneficial effects:

[0020] 1. This device uses a shape-based voltage method, with the controller and various actuators working together to rapidly detect and correct the status and performance of MOS tubes. This multi-parameter testing method significantly improves detection accuracy and efficiency. By optimizing the detection structure, the pin shape is reshaped during each voltage test without affecting MOS tube products with qualified pin shapes, further improving correction efficiency and yield rate.

[0021] 2. The present invention rapidly moves MOS tubes to designated positions through the continuous movement of a manipulator mechanism. A status detection module rapidly detects the MOS tube's status, and a servo press rapidly corrects the MOS tube once it is in place. This, combined with the logic feedback of the logic control module and the control of an industrial computer, reduces human intervention and enables fully automated processing for rapid MOS tube detection, correction, and classification. Simultaneously, the logic control module in the controller receives the MOS tube's voltage and visual signals, processes the signals, and determines the next action for the industrial computer, creating a closed logic loop process that reduces process steps and time, while also improving MOS tube utilization without excessive energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the three-dimensional structure of the device for rapid detection and correction of MOS tubes in Example 1 of the present invention;

[0023] Figure 2 for Figure 1 Main view of the device for rapid detection and correction of MOS tubes;

[0024] Figure 3 for Figure 1 A partial enlarged view of the middle suction cup assembly;

[0025] Figure 4 for Figure 1 Schematic diagram of the three-dimensional structure of the first linear actuator, housing and upper shaping plate;

[0026] Figure 5 for Figure 1 Schematic diagram of the partial three-dimensional structure of the detection mechanism and the manipulator mechanism on the support base;

[0027] Figure 6 for Figure 1 Schematic diagram of the relative structure of the upper and lower shaping plates when separated;

[0028] Figure 7 for Figure 6 Schematic diagram of the relative structure of the upper and middle shaping plates and the lower shaping plates when occluding;

[0029] Figure 8 for Figure 7 Enlarged view of point A in the middle;

[0030] Figure 9 for Figure 7 Schematic diagram of the perspective structure of the upper and lower shaping plates when occluding;

[0031] Figure 10 for Figure 4 Schematic diagram of the internal structure of the middle shell;

[0032] Figure 11 Schematic diagram of the relative positions of the detection base and the device slot from a top view in Example 1 of the present invention;

[0033] Figure 12 This is a logic block diagram of the method for rapid detection and correction of MOS transistors in Example 2 of the present invention;

[0034] Figure 13 Schematic diagram of the three-dimensional structure of the device for rapid detection and correction of MOS tubes in Example 3 of the present invention;

[0035] Figure 14 for Figure 13 A schematic diagram of the three-dimensional structure of the device for rapid detection and correction of MOS tubes from another perspective;

[0036] Figure 15 for Figure 13 A schematic diagram of the three-dimensional structure of the relative positions of the middle device slot and the fixed base;

[0037] Figure 16 for Figure 15 Schematic diagram of the three-dimensional structure of the device slot;

[0038] Figure 17 for Figure 15 Schematic diagram of the three-dimensional structure of the fixed base;

[0039] Figure 18 for Figure 14 A perspective structural diagram of the pin protector when encapsulating the MOS tube pin;

[0040] Figure 19 for Figure 18 Schematic diagram of the three-dimensional structure of the pin protector;

[0041] Figure 20 for Figure 13 Schematic diagram of the three-dimensional structure of the middle suction cup assembly when adsorbing the pin protector;

[0042] Figure 21 This is a side view of the MOS tube in Example 3 of the present invention when the package end is tilted;

[0043] Figure 22 Schematic top view of the device slot and the fixed base forming different routes in Example 3 of the present invention;

[0044] Figure 23 This is a flow chart of a method for rapid detection and correction of MOS transistors in Example 4 of the present invention;

[0045] Figure 24 This is a logic block diagram of the method for rapid detection and correction of MOS transistors in Example 4 of the present invention. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0047] It should be noted that when a component is referred to as being "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component. When a component is considered to be "fixed to" another component, it may be directly fixed to the other component or there may be a central component.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0049] Example 1

[0050] See also Figures 1 to 5 This embodiment provides a device for rapid detection and correction of MOS tubes, including: a support base 1, a conveyor belt mechanism (not shown), a manipulator mechanism 7, a detection mechanism 4, a device slot 8 and a controller (not shown).

[0051] The length, width and height of the support base 1 are defined as the X, Y and Z axes. In this embodiment, the first base plate 81 can be fixedly connected to the middle of the upper surface of the support base 1, and the second base plate 82 can be fixedly connected to one side of the upper surface of the support base 1.

[0052] The conveyor belt mechanism's conveying surface is located above the support base 1 and is used to convey the MOS tubes in a directional manner along the Y-axis. In some embodiments, the conveyor belt mechanism can also be controlled by a controller, and the spacing of the MOS tubes on the conveyor belt can be consistent. Whenever a MOS tube reaches a predetermined position, the conveyor belt mechanism pauses to facilitate the robot mechanism 7 to grab it.

[0053] The manipulator mechanism 7 is used to grab the MOS tube and move along the X, Y, and Z axes. The manipulator mechanism 7 includes a three-dimensional movable platform 71, a suction cup assembly 72, and may also include a rotation drive assembly (not shown). The three-dimensional movable platform 71 is fixedly mounted on the support base 1, and the suction cup assembly 72 is mounted on the end movable end of the three-dimensional movable platform 71, thereby driving the suction cup assembly 72 to move along the X, Y, and Z axes. The suction cup assembly 72 is used to adsorb the package end of the MOS tube. The rotation drive assembly is mounted on the end movable end of the three-dimensional platform and is used to drive the suction cup in the suction cup assembly 72 to rotate, and the rotation axis is parallel to the Z axis. Specifically, the rotation drive assembly may include a DC servo motor 721 and a planetary gear reducer 722. The output shaft of the DC servo motor 721 is transmission-connected to the planetary gear reducer 722, and the output shaft of the planetary gear reducer 722 is coaxially fixed to the suction cup. An air suction hole may also be provided on the suction cup for connecting to an air pump through a hose.

[0054] Specifically, the support base 1 is provided with a first motor transmission device and a Y-axis guide rail, the movable end of the Y-axis guide rail is provided with a second motor transmission device and a Z-axis guide rail, the movable end of the Z-axis guide rail is provided with a third motor transmission device and an X-axis guide rail, the movable end of the X-axis guide rail can be connected to a suction cup mounting frame by bolts, and a suction cup assembly 72 is provided on the suction cup mounting frame for adsorbing MOS tubes. The industrial computer controls the first motor transmission device, the second motor transmission device and the third motor transmission device to drive the suction cup mounting frame to move and drive the MOS tube on the suction cup to move in the X, Y and Z axis directions, and the industrial computer controls the adsorption action of the suction cup. The suction cup assembly

[0055] Please combine Figures 6 to 10 The detection mechanism 4 includes a detection base 401, a lower shaping plate 402, an upper shaping plate 403, a first linear actuator 404, a housing 405, a voltage acquisition module 42 and an image acquisition module 43.

[0056] The detection base 401 is fixedly connected to the support base 1 and is located on the side of the conveyor mechanism facing away from the robot mechanism 7. The lower shaping plate 402 is fixedly connected to the detection base 401. The bottom of the housing 405 is fixed to the upper shaping plate 403. The piston end of the first linear actuator 404 is fixed to the top of the housing 405 and can drive the upper shaping plate 403 to move linearly along the Z axis directly above the lower shaping plate 402.

[0057] Among them, when the upper shaping plate 403 is pressed against the lower shaping plate 402, the two are engaged and form a shaping channel 400 for accommodating the pins of the MOS tube. Moreover, three "V"-shaped grooves arranged in an array are provided on the relative inner sides of the upper shaping plate 403 and the lower shaping plate 402, and the shaping channel 400 is located at the root of the groove. In this way, when the MOS tube is just placed on the detection base 401, if its pins are of qualified shape, they will fall directly into the root of the groove of the lower shaping plate 402, otherwise the pins will be partially tilted and extend into the groove. In the process of forming the shaping channel 400, due to the squeezing effect of the upper shaping plate 403, the pin part located in the groove will also be eventually squeezed into the shaping channel 400, and the extension direction of the shaping channel 400 is parallel to the X-axis, that is, the direction of qualified correction. Since the pins are plastic metal structures, they will produce a certain degree of deformation after being squeezed, thereby achieving shape correction. It should be noted here that if the pins have a particularly qualified shape, they will directly fall into the root of the channel of the lower shaping plate 402 and will rarely or even not be squeezed during the process of forming the shaping channel 400 .

[0058] The bottom of the housing 405 and the upper shaping plate 403 are provided with continuous through-holes 50, extending perpendicularly to the XY plane. After the shaping channel 400 is formed, the through-holes 50 are in communication with the shaping channel 400. A voltage acquisition module 42 is disposed within the housing 405 and includes a second linear actuator 4202, a PIN pin 4201, and a voltage acquisition circuit. In this embodiment, the number of through-holes 50 and PIN pins 4201 corresponds to the number of pins on the MOS transistor, both being three, and each PIN pin is electrically connected to the voltage acquisition circuit. The piston end of the second linear actuator 4202 is fixed to the PIN pin 4201, capable of driving the PIN pin 4201 to move linearly along the Z axis and extend from the bottom of the through-hole 50.

[0059] The first linear actuator 404 and the second linear actuator 4202 can both be selected from a servo press, an electric push rod, a cylinder, a hydraulic push rod, etc.

[0060] When the PIN pin 4201 contacts the MOS tube pin in the limit channel, the voltage acquisition circuit is used to collect the voltage U between the gate and source of the MOS tube. GS , the voltage U between the drain and source DS The image acquisition module 43 is fixedly connected to the manipulator mechanism 7 and is used to acquire a top view image of the MOS tube.

[0061] It should be noted that the lower shaping plate 402 , the upper shaping plate 403 and the housing 405 are all made of insulating materials to avoid short circuits when power is supplied and to complete voltage detection.

[0062] Please combine Figure 11 , Figure 9 The symbol "v" represents a conveyor belt. Device slot 8 is used to store MOS transistors that have passed both pin shape and voltage testing. In this embodiment, the centerline connecting the testing base 401 and device slot 8 can be parallel to the X-axis. The testing base 401 is fixedly mounted on the first base plate 81. The device slot 8 and the manipulator mechanism 7 are fixedly mounted on the second base plate 82.

[0063] In order to facilitate the installation and adjustment of the detection base 401, the manipulator mechanism 7 and the device slot 8 position, a plurality of waist-shaped grooves 80 can be provided on the first base plate 81 and the second base plate 82, and the extension direction of the waist-shaped grooves 80 is parallel to the Y-axis. The support seat 1 is provided with a plurality of grooves 11 parallel to each other, and the cross-section of the groove 11 is an inverted "T" shape, and the extension direction is parallel to the Y-axis. Bolts are provided in the grooves 11, and the waist-shaped grooves 80 on the first base plate 81 and the second base plate 82 are fixed to the support seat 1 by bolts. In this way, the first base plate 81 and the second base plate 82 can be arranged on different grooves 11 according to the range of motion of the manipulator and the width of the conveyor belt, so as to adjust the distance between the two along the X direction, and the two can also be aligned on the Y axis through the waist-shaped groove 80 structure (adjustment is to loosen the bolts and let the waist-shaped groove 80 slide along the Y-axis direction).

[0064] Device slot 8 can be in the shape of a square tube extending perpendicular to the horizontal plane, with its bottom extending through second base plate 82 and support base 1. The bottom of device slot 8 can also extend into a storage box 9 for storing qualified MOS transistors. In this way, device slot 8 serves as a transmission channel, transferring qualified MOS transistors after inspection or correction to storage box 9.

[0065] In this embodiment, the image acquisition module 43 is fixedly mounted on the movable end of the three-dimensional stage. When the suction cup assembly 72 is directly above the conveyor mechanism, the image acquisition module 43 captures a top-down image of the MOS transistor to be inspected on the conveyor surface. The controller is further configured to use an image recognition algorithm based on this top-down image to obtain the real-time placement angle of the MOS transistor in the image, calculate the difference between the real-time placement angle and a preset placement angle, and control the rotation drive assembly to rotate the suction cup based on the difference when the suction cup assembly 72 grasps the MOS transistor to be inspected, thereby positioning the MOS transistor to the preset placement angle.

[0066] After completing the above-mentioned MOS tube voltage acquisition and shape correction, the image acquisition module 43 can be used to collect a top view image of the MOS tube again to perform shape detection on its pins. Specifically, when analyzing the top view image of the MOS tube, deep learning technology can be used to recognize the image. The reason why the present invention performs press-fit correction on the pins of the MOS tube is that during use, due to the effects of heat and external stress, the pins are prone to deformation, slightly tilting upward or downward (similar to the angle of attack of an airplane), and even a single pin may produce multiple sections of deformation (in an "S" shape), which is not conducive to the working efficiency of the MOS tube and the working state of the entire machine. Therefore, when applying the above-mentioned image recognition technology, a large number of overhead image sets of MOS tubes can be captured. The angle of attack in each image is known and varies. Different angles of attack can lead to subtle differences in the pin areas in the overhead images. By dividing the MOS tube overhead image set into a training set, a test set, and a validation set according to a certain ratio, a neural network model commonly used in the field of image recognition is pre-built. The training set is used to train the model and determine its parameters. The validation set is used to determine the network model structure and adjust the model's hyperparameters. The test set is used to test the model's generalization ability. This completes the training of the MOS tube overhead image recognition model. In subsequent practical use, by inputting real-time MOS tube overhead images into the trained recognition model, the angle of attack value of the MOS tube pin can be output. By comparing the angle of attack value with a preset angle of attack qualification threshold, it is determined whether the MOS tube shape detection has passed. Specific deep learning and image recognition technologies are widely used and mature, and are not the key points of the present invention. The principles will not be elaborated here.

[0067] The controller is used to: a) control the manipulator mechanism 7 to transport the MOS transistor between the conveyor mechanism, the inspection mechanism 4, and the device slot 8; b) obtain a top-view image and voltage information of the MOS transistor located on the lower shaping plate 402, and use this information to analyze whether the MOS transistor has passed the voltage test and the pin shape test. The specific inspection and correction process will be described in Example 2.

[0068] Example 2

[0069] See also Figure 12 This embodiment provides a method for rapid detection and correction of MOS transistors, which is applied to the device for rapid detection and correction of MOS transistors in Example 1. The method includes the following steps:

[0070] 1. Control the robot mechanism 7 to grab the MOS tube to be tested from the predetermined position on the conveyor mechanism and place it on the testing base 401, and keep the pins of the MOS tube on the lower shaping plate 402, and then reset the robot mechanism 7 to the initial position.

[0071] Second, the first linear actuator 404 is controlled to drive the upper shaping plate 403 to move downward until the pins on the lower shaping plate 402 are pressed into the shaping channel 400 , thereby completing the extrusion shaping of the MOS tube pins.

[0072] 3. Control the second linear actuator 4202 to drive the PIN needle 4201 to move downward along the through hole 50 until it contacts the pin of the MOS tube to be tested, thereby collecting the voltage U between the gate and source of the MOS tube GS , the voltage U between the drain and source DS , and then reset the first linear actuator 404 and the second linear actuator 4202 to their initial positions.

[0073] Fourth, control the manipulator mechanism 7 to move the voltage acquisition module 42 to the top of the lower shaping plate 402, collect the top view image of the MOS tube to be inspected, and use image recognition technology to complete the shape detection of the MOS tube pins.

[0074] 5. When the shape test of the MOS tube pin to be tested fails, return to step 2 to repeat the extrusion and shaping.

[0075] If the MOS transistor under inspection still fails to meet both the voltage and shape test requirements after three repetitions of the correction, the unqualified MOS transistor is captured and placed on a conveyor mechanism for directional transport to the next process. Of course, in other embodiments, the upper limit of the number of repetitions of the correction can also be adaptively adjusted based on the actual model and performance of the MOS transistor.

[0076] 6. When the shape of the pin of the MOS transistor to be inspected passes the inspection, the manipulator mechanism 7 is controlled to grab the MOS transistor and place it in the device slot 8.

[0077] At this point, the screening of qualified / unqualified MOS tubes on the conveyor belt mechanism is completed.

[0078] Example 3

[0079] See also Figures 13 to 17 This embodiment provides a device for rapid inspection and correction of MOS transistors. Unlike the device in Example 1, this embodiment primarily inspects the shape and overall electrical performance of the MOS tube package end and corrects the package end shape. It can be deployed after the inspection and correction process of Example 1 to achieve more comprehensive inspection and correction of MOS transistors. The device in this embodiment includes: a support base 1, a pin protector 2, a storage mechanism 3, an inspection mechanism 4, a correction mechanism 5, a manipulator mechanism 7, and a controller (not shown). It may also include a first base plate 81 and a second base plate 82.

[0080] The length, width and height of the support base 1 are defined as the X, Y and Z axes. In this embodiment, the first base plate 81 can be fixedly connected to the middle of the upper surface of the support base 1, and the second base plate 82 can be fixedly connected to one side of the upper surface of the support base 1.

[0081] See also Figure 18 and Figure 19 The pin protector 2 is used to load the pin end 61 of the MOS tube. Two sets of contacts 21 are provided on the outside of the pin protector 2, which are electrically connected to the internal pin end 61. The shape of the pin protector 2 can be "Π"-shaped, and the number of pin protectors 2 corresponds to the number of MOS tubes. In this embodiment, the pin protector 2 can be composed of a pair of detachable shells, one corner of which is provided with a chamfer, and the two sets of contacts 21 are distributed on two narrow surfaces connected to the chamfer. The pin protector 2 can accommodate the pin end 61 of the MOS tube, protect the pin of the MOS tube, and fix the initial position of the MOS tube so that the MOS tube is in a horizontal position.

[0082] The storage mechanism 3 includes device slot 1 31, device slot 2 32, and device slot 3 33. These slots (also referred to as device slots A, B, and C) are arranged in a straight line along the Y-axis on the support base 1 and are used to horizontally store the pin protectors 2 for the MOS transistors to be tested, qualified MOS transistors, and unqualified MOS transistors, respectively. In this embodiment, the three device slots can be arranged together with the manipulator mechanism 7 on the second base plate 82 to achieve securement with the support base 1. The three device slots can have the same shape and size, and each slot can accommodate multiple pin protectors 2, i.e., multiple MOS transistors.

[0083] The detection mechanism 4 includes a fixed base 41 , a voltage acquisition module 42 and an image acquisition module 43 .

[0084] The fixed base 1 41 can be fixedly mounted on the first base plate 81. The fixed base 1 41 is provided with a detection station 411 (i.e., station A). The voltage acquisition module 42 includes a gate-source voltage detection contact 421 and a drain-source voltage detection contact 422 fixed on the fixed base 1 41. The two contacts correspond to the two sets of contacts 21 on the pin protector 2 and are used to collect the voltage U between the gate and source of the MOS tube. GS , and the voltage U between the drain and source DS The image acquisition module 43 may be a machine vision camera, which is disposed directly above the inspection station 411 and is used to acquire a top view image of the MOS tube on the inspection station 411 .

[0085] The correction mechanism 5 includes a shaping component 51 and a second fixing base 52 .

[0086] The fixed base 2 52 can also be fixedly mounted on the first base plate 81, and the shaping component 51 includes a lower shaping plate 511, an upper shaping plate 512, a telescopic member 513 and a pressure collection module 514. The lower shaping plate 511 (its upper surface is station B) is fixedly mounted on the fixed base 2 52. The telescopic member 513 can adopt a servo press, which is mainly composed of a servo motor and a transmission screw and completes the action. The servo press is located above the fixed base 2 52 and is fixed relative to the support base 1, and the telescopic direction of the piston end is parallel to the Z axis. The upper shaping plate 512 is fixed on the piston end of the telescopic member 513, and the upper shaping plate 512 coincides with the center of the groove 5101 on the Z axis.

[0087] As the piston end extends, driving the upper shaping plate 512 toward the lower shaping plate 511, the package end 62 of the MOS transistor to be corrected, located on the lower shaping plate 511, is pressed together. A pressure acquisition module 514, located between the upper shaping plate 512 and the piston end, can utilize a sensitive pressure sensor to collect the pressure between the two.

[0088] The lower and upper molding plates 511 and 512 are each provided with a boss 510 on their inner sides, where they lie adjacent to each other. The boss 510 has a groove 5101 that matches the MOS transistor. When the upper molding plate 512 is pressed against the lower molding plate 511, the grooves 5101 of the two plates precisely enclose the package end 62 of the MOS transistor. The degree of press fit can be adjusted by varying the pressure.

[0089] See also Figure 20 The manipulator mechanism 7 is used to grasp the pin protector 2, drive the MOS transistor along the X, Y, and Z axes, and place it in the device slot or fixed base. In this embodiment, the manipulator mechanism 7 includes a three-dimensional movable platform 71 and a suction cup assembly 72. The three-dimensional movable platform 71 is fixedly mounted on the support base 1, and the suction cup assembly 72 is mounted on the movable end of the three-dimensional movable platform 71, thereby driving the suction cup assembly 72 along the X, Y, and Z axes. The suction cup assembly 72 is used to absorb the pin protector 2 to achieve the grasping action. The three-dimensional movable platform 71 can be fixedly mounted on the second base plate 82. Specifically, the second base plate 82 is provided with a first motor transmission device and a Y-axis guide rail, the movable end of the Y-axis guide rail is installed with a second motor transmission device and a Z-axis guide rail, the movable end of the Z-axis guide rail is installed with a third motor transmission device and an X-axis guide rail, the movable end of the X-axis guide rail can be connected to a suction cup mounting frame by bolts, and the suction cup mounting frame is provided with a plurality of vacuum suction cups for adsorbing the pin protector 2 equipped with a MOS tube, the first motor transmission device, the second motor transmission device and the third motor transmission device are controlled by an industrial computer to drive the suction cup mounting frame to move and drive the pin protector 2 on the suction cup to move in the X, Y and Z axis directions, and the industrial computer controls the adsorption action of the suction cup.

[0090] The controller is used to: a) control the manipulator mechanism 7 to transfer the MOS transistor between the device slot and the fixed base. b) control the inspection mechanism 4 to collect voltage and image information from the MOS transistor to be inspected, and sequentially analyze whether the MOS transistor voltage test and the package end 62 shape test pass. c) control the correction mechanism 5 to press-fit and correct the package end 62 of the MOS transistor that fails the shape test, while maintaining the collected pressure value within a preset safety pressure threshold.

[0091] See also Figure 21 When analyzing the top-view image of the MOS transistor, deep learning technology can be used to identify the image. This embodiment performs press-fit correction on the package end 62 of the MOS transistor because, during use, due to heat and external stress, the package end 62 can easily deform, such as slightly tilting the fins upward or loosely fitting the package shell. This can negatively impact the operating efficiency of the MOS transistor and the overall operating state of the device. Therefore, by using the same techniques as described for pin shape detection in Example 1, deep learning and image recognition technology can be used to perform shape detection on the package end 62. This will not be further elaborated here.

[0092] In this embodiment, the first fixed base 41 and the second fixed base 52 are arranged in a straight line along the Y-axis direction and are fixedly connected to the support base 1 .

[0093] See also Figure 22 The line connecting the tops of fixed base 1 41 and fixed base 2 52 constitutes the primary conveying route. Fixed base 1 41 and device slot 1 31 overlap in the X-axis direction, and the line connecting the two constitutes secondary conveying route 1 (route A). The midpoint of the primary conveying route and the line connecting the tops of device slot 2 32 constitute secondary conveying route 2 (route B). Fixed base 2 52 and device slot 3 3 overlap in the X-axis direction, and the line connecting the two constitutes secondary conveying route 3 (route C). The manipulator mechanism 7 performs conveying motion along the primary conveying route and the three secondary conveying routes.

[0094] In the specific process of conveying by the manipulator mechanism 7, the frequency of passing through the primary conveying route is relatively high, while the frequency of passing through the other three secondary conveying routes is relatively low. The specific conveying routes during the detection and correction of MOS transistors will be described in detail in the combined method of embodiment 2 and will not be repeated here.

[0095] In summary, compared with traditional detection methods, the device provided in this embodiment uses an image combined with voltage method for detection, and realizes rapid detection and correction of the state of the MOS tube package end through the coordinated work of the controller and various actuators. This multi-parameter testing method significantly improves the detection accuracy and efficiency. In addition, during the detection and correction process, the MOS tube pin end is encapsulated by a pin protector, and the MOS tube pin is electrically connected to the outer contact, so that the MOS tube can still be effectively detected under the premise of being well protected. The inter-electrode voltage is guided to be pressed and corrected in the correct position. At the same time, by collecting pressure information in real time during the correction process and collaboratively controlling the pressing force, it is possible to achieve corresponding reasonable pressure for MOS tubes with different deformations, thereby improving the correction efficiency and yield rate.

[0096] 2. The present invention rapidly moves MOS tubes to designated positions through the continuous movement of a manipulator mechanism. A status detection module rapidly detects the MOS tube's status, and a servo press rapidly corrects the MOS tube once it is in place. This, combined with the logic feedback of the logic control module and the control of an industrial computer, reduces human intervention and enables fully automated processing for rapid MOS tube detection, correction, and classification. Simultaneously, the logic control module in the controller receives the MOS tube's voltage and visual signals, processes the signals, and determines the next action for the industrial computer, creating a closed logic loop process that reduces process steps and time, while also improving MOS tube utilization without excessive energy consumption.

[0097] Example 4

[0098] See also Figure 23 and Figure 24 This embodiment provides a method for rapid detection and correction of MOS transistors, which can be applied to the device for rapid detection and correction of MOS transistors in Example 3. The method for rapid detection and correction of MOS transistors includes the following steps, namely steps S1 to S8.

[0099] S1. After calibrating the electrodes of the MOS tube to be tested, install its pin ends 61 into the pin protector 2, thereby stacking multiple layers of pin protectors 2 in the device slot 31, and keep the contacts 21 on the pin protectors 2 aligned with the voltage detection contacts on the fixed base 41.

[0100] S2. The industrial computer controls the manipulator mechanism 7 to move the suction cup assembly 72 above the device slot 31. The suction cup assembly 72 then grasps the topmost pin protector 2 containing the MOS tube to be inspected in the device slot 31. The manipulator mechanism 7 then moves along route A, transfers the current pin protector 2 to the inspection station 411 of the fixed base 41, and presses it downward. The suction cup assembly 72 releases the object to be inspected, and the manipulator mechanism 7 moves the suction cup assembly 72 along route A above the device slot 31 to reset and wait.

[0101] S3. The industrial computer controls the voltage acquisition module 42 to acquire the voltage U between the gate and source of the current MOS tube GS , the voltage U between the drain and source DS ,The logic control module receives the information and decides the next action and feeds back to the industrial ,computer.

[0102] Among them, the voltage U GS and U DS Compare with the corresponding preset voltage qualification threshold to determine whether the current MOS tube voltage detection is qualified.

[0103] S4. If the current MOS transistor voltage test fails, the industrial computer controls the robot mechanism 7 to move along route A to above the fixed base 1 41 , grab the pin protector 2 of the current MOS transistor, transfer it along the main route and route C, and place it in the device slot 3 33 . The robot then returns to step S2 to test the next MOS transistor to be tested.

[0104] S5. If the current MOS transistor voltage test passes, the image acquisition module 43 is controlled to capture a top-view image of the current MOS transistor. The logic control module receives this information, determines the next action, and feeds back to the industrial computer. The top-view image is used to determine whether the current MOS transistor shape test passes. The determination principle is described in Example 1.

[0105] S6. If the current MOS transistor passes the shape test, the industrial computer controls the manipulator mechanism 7 to grab the pin protector 2 of the current MOS transistor that has passed the voltage and shape tests, move it along the main route and route B, and place it in the device slot 2 32. The manipulator then returns to step S2 to test the next MOS transistor to be tested.

[0106] S7. If the current MOS transistor fails the shape test, the industrial computer controls the robot mechanism 7 to grab the pin protector 2 of the current MOS transistor that passed the voltage test but failed the shape test, moves it along the main route, and places it at the center of the lower shaping plate 511 on the second fixed base 52. The robot mechanism 7 then presses down tightly to ensure that the object to be inspected fits tightly against the lower shaping plate 511. The suction cup assembly 72 releases the object to be inspected, and the robot mechanism 7 moves along route C to move the suction cup assembly 72 back to the top of the device slot C and wait.

[0107] S8. The industrial computer controls the servo press to extend and move the piston downward to press the package end 62 of the current MOS transistor. The sensitive pressure sensor provides real-time pressure information to the logic control module. The logic control module receives this information, determines the correction time and frequency, and then feeds back to the industrial computer. Throughout this process, the collected pressure value is maintained below the preset safety pressure threshold. After the correction is complete, the process returns to step S3 to retest the current MOS transistor.

[0108] If the MOS transistor still fails to meet both voltage and shape test requirements after repeated correction for the third time, the unqualified MOS transistor will be transferred and placed in the device slot 33. Accordingly, the preset safety pressure threshold during the three MOS transistor shape corrections can be gradually increased.

[0109] In some embodiments, different reasonable pressures can be applied to MOS tubes at different angles of attack based on the identified different angles of attack. Specifically, a table of angle of attack values ​​and pressure values ​​can be fitted based on a large number of previous experiments to improve correction efficiency and yield.

[0110] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0111] The above-described embodiments merely illustrate several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A device for rapid detection and correction of MOS tubes, characterized in that: include: Support base (1), defining the length, width and height directions of the support base (1) as X, Y and Z axes respectively; A conveyor belt mechanism, the conveying surface of which is located above the support seat (1) and is used for conveying the MOS tube in a direction along the Y-axis; A manipulator mechanism (7) is used to grab the MOS tube and move along the X, Y, and Z axes; A detection mechanism (4) comprising a detection base (401), a lower shaping plate (402), an upper shaping plate (403), a first linear actuator (404), a housing (405), a voltage acquisition module (42) and an image acquisition module (43); the detection base (401) is fixedly connected to the support base (1) and is located on the side of the conveyor mechanism away from the manipulator mechanism (7); the lower shaping plate (402) is fixedly connected to the detection base (401); the bottom of the housing (405) is fixed to the upper shaping plate (403), the piston end of the first linear actuator (404) is fixed to the top of the housing (405), and can drive the upper shaping plate (403) to move linearly along the Z axis just above the lower shaping plate (402); a continuous through hole (50) is opened on the bottom of the housing (405) and the upper shaping plate (403), and the extension direction of the through hole (50) is perpendicular to the XY plane; the voltage acquisition module (42) ) is arranged in the housing (405), the voltage acquisition module (42) includes a second linear actuator (4202), a PIN needle (4201) and a voltage acquisition circuit; the number of the PIN needle (4201) corresponds to the number of the pins of the MOS tube and is electrically connected to the voltage acquisition circuit; the piston end of the second linear actuator (4202) is fixed to the PIN needle (4201), and can drive the PIN needle (4201) to move linearly along the Z axis and extend from the bottom of the through hole (50); wherein, when the upper shaping plate (403) is pressed against the lower shaping plate (402), the two are engaged and form a shaping channel (400) for accommodating the pins of the MOS tube, and the shaping channel (400) is communicated with the bottom of the through hole (50); when the PIN needle (4201) contacts the MOS tube pin in the shaping channel (400), the voltage acquisition circuit is used to collect the voltage U between the gate and the source of the MOS tube. GS , the voltage U between the drain and source DS The image acquisition module (43) is fixedly connected to the manipulator mechanism (7) and is used to acquire a top view image of the MOS tube; A device slot (8) for storing MOS tubes that have passed both pin shape testing and voltage testing; and A controller is used to: a. control a manipulator mechanism (7) to transfer the MOS tube between the conveyor mechanism, the detection mechanism (4) and the device slot (8); b. obtain a top view image and voltage information of the MOS tube located on the lower fixed shaping plate (402), thereby analyzing whether the voltage detection and pin shape detection of the MOS tube are qualified.

2. The device for rapid detection and correction of MOS tubes according to claim 1, characterized in that: The upper shaping plate (403) and the lower shaping plate (402) are both provided with array-arranged "V"-shaped channels on their opposite inner sides, and the shaping channel (400) is located at the root of the channel.

3. The device for rapid detection and correction of MOS tubes according to claim 1, characterized in that: The lower shaping plate (402), the upper shaping plate (403) and the housing (405) are all made of insulating material.

4. The device for rapid detection and correction of MOS tubes according to claim 1, characterized in that: The manipulator mechanism (7) comprises a three-dimensional movable platform (71) and a suction cup assembly (72); the three-dimensional movable platform (71) is fixedly mounted on the support base (1), and the suction cup assembly (72) is mounted on the end movable end of the three-dimensional movable platform (71), thereby driving the suction cup assembly (72) to move along the X, Y, and Z axes; the suction cup assembly (72) is used to absorb the package end of the MOS tube.

5. The device for rapid detection and correction of MOS tubes according to claim 4, characterized in that: The image acquisition module (43) is fixedly mounted on the end movable end of the three-dimensional carrier; the manipulator mechanism (7) further comprises a rotation drive assembly; the rotation drive assembly is mounted on the end movable end of the three-dimensional carrier and is used to drive the suction cup in the suction cup assembly (72) to rotate, and the rotation axis is parallel to the Z axis; Wherein, when the suction cup assembly (72) is located directly above the conveyor belt mechanism, the image acquisition module (43) acquires a top view image of the MOS tube to be detected on the conveying surface, and the controller is further used to obtain the real-time placement angle of the MOS tube in the image using an image recognition algorithm based on the top view image, and calculate the difference between the real-time placement angle and a preset placement angle, and control the rotation drive assembly to rotate the suction cup according to the difference when the suction cup assembly (72) grabs the MOS tube to be detected, thereby making the MOS tube to be detected reach the preset placement angle.

6. The device for rapid detection and correction of MOS tubes according to claim 1, characterized in that: The center line connecting the detection base (401) and the device slot (8) is parallel to the X-axis.

7. The device for rapid detection and correction of MOS transistors according to claim 1, characterized in that: The support base (1) is fixedly connected in sequence along the X-axis direction with a first base plate (81) and a second base plate (82) which are independent of each other; wherein the detection base (401) is fixedly mounted on the first base plate (81); and the device slot (8) and the manipulator mechanism (7) are fixedly mounted on the second base plate (82).

8. The device for rapid detection and correction of MOS tubes according to claim 7, characterized in that: The first base plate (81) and the second base plate (82) are both provided with a plurality of waist-shaped grooves (80), and the extension direction of the waist-shaped grooves (80) is parallel to the Y axis; the support seat (1) is provided with a plurality of grooves (11) parallel to each other, and the cross section of the grooves (11) is in an inverted "T" shape, and the extension direction is parallel to the Y axis; bolts are provided in the grooves (11), and the waist-shaped grooves (80) on the first base plate (81) and the second base plate (82) are fixed to the support seat (1) by bolts.

9. A method for rapid detection and correction of MOS tubes, characterized in that: The method is applied to the device for rapid detection and correction of MOS tubes as claimed in any one of claims 1 to 8; the method comprises the following steps:

1. Controlling the manipulator mechanism (7) to grab the MOS tube to be tested from a predetermined position on the conveyor mechanism and place it on the testing base (401), while keeping the pins of the MOS tube located on the lower shaping plate (402), and then resetting the manipulator mechanism (7) to the initial position; Second, controlling the first linear actuator (404) to drive the upper shaping plate (403) to move downward until the pins on the lower shaping plate (402) are pressed into the shaping channel (400), thereby completing the extrusion shaping of the MOS tube pins; 3. Control the second linear actuator (4202) to drive the PIN needle (4201) to move downward along the through hole (50) until it contacts the pin of the MOS tube to be detected, thereby collecting the voltage U between the gate and source of the MOS tube GS , the voltage U between the drain and source DS , then resetting the first linear actuator (404) and the second linear actuator (4202) to their initial positions; 4. Controlling the manipulator mechanism (7) to move the image acquisition module (43) to the top of the lower shaping plate (402), acquiring a top view image of the MOS tube to be inspected, and completing the shape inspection of the MOS tube pins using image recognition technology; 5. When the shape test of the MOS tube pin to be tested fails, return to step 2 to repeat the extrusion and shaping; 6. When the shape of the pin of the MOS tube to be inspected passes the inspection, the manipulator mechanism (7) is controlled to grab the MOS tube and place it in the device slot (8).

10. The method for rapid detection and correction of MOS transistors according to claim 9, characterized in that: In step five, if the MOS transistor to be inspected still fails to meet both voltage and shape inspection requirements after repeated correction three times, the unqualified MOS transistor is captured and placed on the conveyor mechanism for directionally transporting to the next process.

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