Flexible processing device and method for photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials

Abstract

The present invention provides a flexible processing device and method for photoelectrochemical mechanical polishing of complex curved surface components of brittle materials. The device includes a polishing machine chassis, a light source, a polishing liquid pool, an electrolysis device and a support head. The light source is used to directly irradiate the polishing liquid pool during the polishing process. The polishing liquid pool is filled with polishing liquid inside, and a plurality of polishing brushes are fixed on the inner wall. The electrolysis device is connected to the polishing liquid pool, and the light source, the polishing liquid and the electrolysis device form a photoelectrolytic cell. The support head is connected with a threaded column, and a counterweight disk and a carrier disk are connected below the threaded column. The counterweight disk is placed on the carrier disk, and the support head is used to realize the rotary motion of the threaded column, the carrier disk and the counterweight disk. The complex curved surface component is fixed below the carrier disk and placed in the polishing liquid. The polishing brush uses the combined action of photoelectrochemical oxidation and mechanical friction in the photoelectrolytic cell to polish the complex curved surface component. The present invention can process complex curved surface components, and has the advantages of high polishing efficiency, environmental protection and simple operation.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing devices, and more particularly, to a flexible processing device and method for photoelectrochemical mechanical polishing of complex curved surface elements of hard and brittle materials. Background Art

[0002] Semiconductors, as upstream basic materials of the industry, are involved in all aspects of our lives. Common semiconductor materials include: silicon (Si), germanium (Ge), zinc sulfide (ZnS), silicon carbide (SiC), etc. These semiconductor materials have small thermal expansion coefficients, high temperature resistance, and good light transmittance. Due to their stable chemical properties and excellent physical properties, they are made into planar elements and complex curved surface elements and applied to high-tech cutting-edge fields such as nuclear energy and aerospace. When silicon carbide, etc. are used as elements, high surface integrity, high surface accuracy, and processing quality are required. In addition, a roughness reaching the nanometer level is an important indicator of industry standards.

[0003] There are many ways to achieve the processing of semiconductor hard and brittle materials, such as traditional grinding, chemical mechanical grinding (CMG), ion beam polishing (IBF), chemical mechanical polishing (CMP), etc. Traditional grinding is inexpensive. However, due to the hard and brittle characteristics of silicon carbide, etc., defects such as surface burns, microcracks, and densification damage will be caused; Chemical mechanical grinding can achieve subsurface damage-free processing of hard and brittle materials under certain conditions, but the material removal rate is low, and the grinding tool wears quickly; Chemical mechanical polishing is the mainstream technology currently used in production. The polishing fluid it uses is inexpensive and meets the requirements of industrial production to the greatest extent. However, chemical mechanical polishing mostly uses strong alkalis such as NaOH and KOH to adjust the pH of the polishing fluid, which harms the environment and the health of operators.

[0004] In addition, existing polishing technologies mostly use polishing pads made of materials such as polyurethane and abrasive leather for polishing. These polishing pads can effectively reduce the subsurface damage on the surface of the workpiece and reduce the surface roughness. However, this polishing method is only suitable for the processing of elements with relatively flat surfaces. For complex curved surface workpieces, the above processing methods are difficult to achieve an ideal polishing effect, affecting the surface accuracy and surface quality of the workpiece. Therefore, it is urgent to seek a green and environmentally friendly polishing method for processing complex curved surface elements that also takes into account the processing quality. Summary of the Invention

[0005] In view of the above technical problems of the traditional chemical mechanical polishing technology that it is difficult to process complex curved surfaces, has low processing efficiency, and the polishing fluid pollutes the environment, a flexible processing device and method for photoelectrochemical mechanical polishing of complex curved surface elements of hard and brittle materials are provided.

[0006] The technical means adopted by the present invention are as follows:

[0007] A flexible processing device for photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials, characterized in that it includes: a polishing machine chassis, a light source, a polishing liquid pool, an electrolysis device and a support head installed on the polishing machine chassis. The light source is used to directly irradiate the polishing liquid pool during the polishing process; the polishing liquid pool is filled with polishing liquid, and a plurality of polishing brushes are fixed on the inner wall; the electrolysis device is connected to the polishing liquid pool, and the light source, the polishing liquid and the electrolysis device form a photoelectrolytic cell; the support head is connected with a threaded column, and a counterweight disk and a carrier disk are connected below the threaded column. The counterweight disk is placed above the carrier disk, and the support head is used to realize the rotary motion of the threaded column, the carrier disk and the counterweight disk; the complex curved surface component is fixed below the carrier disk and placed in the polishing liquid; the polishing brushes use the combined action of photoelectrochemical oxidation and mechanical friction in the photoelectrolytic cell to polish the complex curved surface component.

[0008] Further, the electrolysis device includes an electrolysis power source, a wire I, a wire II, an electrode and a conductive slip ring. The electrode is fixed on the inner wall of the polishing liquid pool through an electrode fixing ring and immersed in the polishing liquid; the conductive slip ring is made of a conductive material and fixed on the convex platform at the bottom of the support head. The part of the support head connected to the conductive slip ring is made of a conductive material, and the rest is made of an insulating material;

[0009] One end of the wire II is connected to the positive pole of the electrolysis power source, and the other end is wound and fixed outside the conductive slip ring. One end of the wire I is connected to the negative pole of the electrolysis power source, and the other end is connected to the electrode arranged inside the polishing liquid pool to form a circuit; the electrode and the electrode fixing ring are lower than the liquid level of the polishing liquid; the light source, the polishing liquid layer and the electrode form a photoelectrolytic cell.

[0010] Further, a rotating main shaft is arranged inside the support head, and the rotating main shaft is driven by a motor to perform rotary motion. The rotating main shaft is connected to the threaded column; the inside of the support head is of an annular structure, and the support head remains stationary when the rotating main shaft moves;

[0011] Threaded through holes are provided at the centers of the counterweight disk and the carrier disk for threaded connection with the threaded column; the support head, the threaded column and the carrier disk are all made of conductive materials; the diameter of the carrier disk is larger than the sum of the cross-sectional projection areas of the complex curved surface components.

[0012] Further, the liquid level of the polishing liquid is higher than the polishing brushes and the complex curved surface components. The polishing brushes are located directly below the complex curved surface components and in contact with them; during the polishing process, the polishing brushes and the complex curved surface components move relatively, generating a relative speed for material removal.

[0013] Further, the polishing brush is an electric flexible polishing brush, which is a bendable flexible structure made of electrically insulating material, connected with a motor, and driven by the motor to make the electric flexible polishing brush rotate automatically, and the angle is adjusted according to the polishing requirements; each electric flexible polishing brush is composed of countless brush clusters, and the material thereof is nylon wire.

[0014] Further, the polishing liquid is a green environmental protection chemical polishing liquid, and the components thereof include: abrasive grains, catalyst, oxidant, pH regulator, complexing agent, deionized water, the abrasive grains are cerium oxide of 20nm, the catalyst is titanium oxide of 100nm, the oxidant is H2O2, the pH regulator is triethanolamine, and the complexing agent is sorbitol; the pH value of the polishing liquid is 9-11.

[0015] Further, a thermometer is also provided on the polishing liquid pool.

[0016] Further, the light source is a xenon lamp light source, which is used to generate ultraviolet rays to irradiate the polishing liquid; the light intensity of the xenon lamp light source is 0.15W / cm 2 ~2W / cm 2 。

[0017] Further, it also includes a polishing liquid inlet, a polishing liquid outlet and a cabinet, the polishing liquid inlet is connected with the polishing liquid pool, one end of the polishing liquid outlet is connected with the polishing liquid pool, and the other end is connected with the cabinet, and the cabinet is installed on the polishing machine cabinet.

[0018] The present invention also provides a processing method for a flexible processing device for photoelectrochemical mechanical polishing of a hard and brittle material complex curved surface element, including the following steps:

[0019] Step 1: Place the electrode in the electrode fixing ring;

[0020] Step 2: Wind the wires of the electrolytic power supply around the conductive slip ring and the electrode respectively;

[0021] Step 3: Add the polishing liquid to the polishing liquid inlet, and stop injecting the polishing liquid until the polishing liquid submerges the electric flexible polishing brush;

[0022] Step 4: Fix the complex curved surface element on the carrier plate;

[0023] Step 5: Fix the carrier plate and the counterweight plate on the threaded column through threaded connection, wherein the counterweight plate is placed above the carrier plate;

[0024] Step 6: Fix the threaded column on the support head through threaded connection;

[0025] Step 7: Start the electric flexible polishing brush;

[0026] Step 8: Start the thermometer;

[0027] Step 9: Start the xenon light source and adjust the light intensity of the xenon light source to 0.15 W / cm 2 ~2 W / cm 2 ; At the same time, turn on the electrolysis power supply;

[0028] Step 10: Start the flexible machining device for polishing, adjust the polishing rotation speed and flow rate, and start polishing;

[0029] Step 11: The motor of the flexible machining device drives the complex curved surface component to make a rotary motion, and the electric flexible polishing brush makes a rotary motion in the opposite direction to the complex curved surface component, generating a relative speed to remove the reaction layer.

[0030] Compared with the prior art, the present invention has the following advantages:

[0031] 1. The flexible machining device and method for photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials provided by the present invention have high polishing efficiency: The photocatalytic light source directly irradiates the polishing liquid, enabling the catalyst to react with the oxidant to generate more hydroxyl groups, increasing the rate of chemical corrosion, reducing the reaction time, and improving the polishing efficiency.

[0032] 2. The flexible machining device and method for photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials provided by the present invention are green and environmentally friendly: Photoelectrocatalysis is adopted, which can reduce the usage amount of the oxidant; in addition, the pH regulators in the polishing liquid adopted by the present invention are all weak bases, which are green and environmentally friendly and harmless to operators.

[0033] 3. The flexible machining device and method for photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials provided by the present invention can machine complex curved surface components: A multifunctional field is introduced, and an electric flexible polishing brush is used to polish the complex curved surface components, solving the problems that traditional polishing techniques are difficult to machine complex curved surface components and have low polishing accuracy.

[0034] 4. The flexible machining device and method for photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials provided by the present invention are easy to operate: By changing the mass of the counterweight disk, the applied pressure can be changed, and the light intensity, the rotation speed and rotation angle of the polishing brush, the quality and type of the solution can all be changed according to actual needs.

[0035] In summary, applying the technical solution of the present invention can solve the problems that traditional chemical mechanical polishing techniques are difficult to machine complex curved surfaces, have low processing efficiency, and the polishing liquid pollutes the environment.

[0036] For the above reasons, the present invention can be widely promoted in fields such as polishing. Description of the Drawings

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0038] Figure 1 It is the front view of a flexible machining device for the photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials according to the present invention.

[0039] Figure 2 It is the top view of a flexible machining device for the photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials according to the present invention.

[0040] Figure 3 It is the half-sectional view of a flexible machining device for the photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials according to the present invention.

[0041] Figure 4 It is the schematic diagram of the complex curved surface component of a flexible machining device for the photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials according to the present invention.

[0042] Figure 5 It is the schematic diagram of the electric flexible polishing brush of a flexible machining device for the photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials according to the present invention.

[0043] Figure 6 It is the left view of a flexible machining device for the photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials according to the present invention.

[0044] Figure 7 It is the axonometric view of a flexible machining device for the photoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials according to the present invention.

[0045] In the figure: 1. Xenon lamp light source; 2. Temperature measuring instrument; 3. Screw Ⅰ; 4. Polishing liquid inlet; 5. Screw Ⅱ; 6. Electrolysis power supply; 7. Wire Ⅰ; 8. Polishing machine chassis; 9. Support head; 10. Conductive slip ring; 11. Polishing liquid pool; 12. Polishing liquid outlet; 13. Chassis cabinet; 14. Threaded column; 15. Counterweight disk; 16. Carrying disk; 17. Complex curved surface component; 18. Electrode; 19. Electrode fixing ring; 20. Wire Ⅱ; 21. Electric flexible polishing brush. Detailed implementation manners

[0046] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. The following will describe the present invention in detail with reference to the drawings and in combination with the embodiments.

[0047] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only a part rather than all of the embodiments of the present invention. The following description of at least one exemplary embodiment is actually illustrative only and in no way limits the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention.

[0048] It should be noted that the terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the exemplary embodiments of the present invention. As used herein, unless the context clearly dictates otherwise, the singular forms are also intended to include the plural forms. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they specify the presence of the stated features, steps, operations, devices, components, and / or combinations thereof.

[0049] Unless otherwise specifically stated, the relative arrangements of the components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be clear that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods and devices should be regarded as part of the authorized specification. In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0050] In the description of the present invention, it should be understood that the orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom", etc. generally indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the scope of protection of the present invention. The orientation terms "inner, outer" refer to the inside and outside relative to the contour of each component itself.

[0051] For ease of description, spatial relative terms, such as "above", "over", "on the upper surface", "upper", etc., may be used herein to describe the spatial positional relationship of one device or feature shown in the figures with respect to other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "over" other devices or structures will then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above" can include both orientations of "above" and "below". The device may also be oriented in other different ways (rotated 90 degrees or at other orientations), and the corresponding explanations for the spatial relative descriptions used herein will be made accordingly.

[0052] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without further statement, the above terms have no special meaning and thus should not be construed as limiting the scope of protection of the present invention.

[0053] The present invention introduces a multi-functional field in view of the problems of the prior art, and researches and designs a flexible processing device for the photoelectrochemical mechanical polishing of complex curved surfaces of hard and brittle materials. The photoelectrochemical mechanical polishing described in the present invention refers to, on the basis of the existing chemical mechanical polishing, changing the polishing pad to an electric flexible brush, introducing ultraviolet irradiation into the polishing liquid, and adopting an electrolysis-assisted polishing method to polish complex curved surfaces, which can not only take into account the advantages of green environmental protection of photocatalysis but also the characteristics of lower surface roughness of chemical mechanical polishing. This equipment mainly solves the problems of traditional chemical mechanical polishing technology, such as difficulty in processing complex curved surfaces, low processing efficiency, and environmental pollution by polishing liquid.

[0054] The flexible processing device for the photoelectrochemical mechanical polishing of complex curved surfaces of semiconductor hard and brittle material components includes:

[0055] A polishing liquid pool, which contains polishing liquid inside. The wall of the polishing liquid pool is fixed with an electric flexible polishing brush, and the electric flexible polishing brush is also fixed inside the polishing liquid pool, which can change the polishing angle according to actual requirements to achieve the polishing of complex curved surface components; the liquid level of the polishing liquid is higher than the complex curved surface component;

[0056] A xenon light source, which is used to supply light. During the polishing process, the light source directly irradiates the polishing liquid pool;

[0057] The electrolytic power supply is connected with two wires. One wire extends from the positive pole of the electrolytic power supply and winds around and is fixed outside the conductive slip ring. The conductive slip ring is used to fix one end of the power supply wire and conduct electricity to the complex curved surface component. The other wire extends from the negative pole of the electrolytic power supply and is connected to the electrode inside the polishing liquid pool to form a circuit. The electrode inside the polishing liquid pool is fixed by the electrode fixing ring with screws to form an electrolytic cell. The electrode and the electrode fixing ring are arranged on the inner wall of the polishing liquid pool. The electrode is fixed inside the electrode fixing ring. The electrode and the electrode fixing ring are lower than the liquid level of the polishing liquid, and the electrode material is platinum.

[0058] The carrier plate is connected to the threaded column through threads and is used to fix the complex curved surface component for polishing. The complex curved surface component of the semiconductor hard and brittle material is fixed on the carrier plate by screws. The diameter of the carrier plate is larger than the sum of the cross-sectional projection areas of the complex curved surface components.

[0059] The counterweight plate is connected to the threaded column through threads, and the change of the applied pressure is completed by changing its mass. The counterweight plate is placed on the carrier plate.

[0060] The threaded column is connected to the support head through threads and is used to connect the support head, the carrier plate and the counterweight plate. That is, the counterweight plate and the carrier plate are threadedly connected to the threaded column, and the carrier plate and the counterweight plate are threadedly connected to the support head through the threaded column. The carrier plate and the threaded column are made of conductive materials.

[0061] The support head has a rotating main shaft embedded inside. The motor drives the rotating main shaft to perform a rotary motion, and the rotating main shaft drives the threaded column, the carrier plate and the counterweight plate to perform a rotary motion. The inside of the support head is of an annular structure. The rotating main shaft moves but the support head remains stationary. There is a conductive slip ring threadedly connected and fixed to the convex platform at the bottom of the support head.

[0062] The thermometer is fixed on the polishing liquid pool box by screws to detect the temperature change during the polishing process in real time and explore the mechanism of improving the chemical mechanical polishing rate by photocatalysis.

[0063] The polishing liquid layer, the electrode and the complex curved surface component form a photoelectrolytic cell. During the polishing process, the electric flexible polishing brush and all surfaces of the complex curved surface component utilize the combined action of photoelectrochemical oxidation and mechanical friction in the photoelectrochemical polishing liquid pool to realize the polishing of the complex curved surface component of the semiconductor hard and brittle material. The polishing brush and the complex curved surface component have relative motion, generating a relative speed for material removal.

[0064] Preferably, each of the electric flexible polishing brushes is a bendable flexible structure made of electrically insulating material and can be adjusted in angle according to polishing requirements. Specifically, the brush head of the electric flexible polishing brush has a structure with countless tufts of hair, and the brush head changes the polishing angle according to the polishing time to achieve polishing of complex curved surfaces. The electric flexible polishing brush is fixed to the wall of the polishing liquid pool by screws. The liquid level of the polishing liquid is higher than the polishing brush. The polishing brush is located directly below the complex curved surface component and contacts it, and the driving motor makes it perform a self-rotating motion. The material of the electric flexible polishing brush is nylon wire. The materials of traditional polishing pads are mostly polyurethane polishing pads, abrasive leather polishing pads, and fluff polishing pads. The material of the polyurethane polishing pad is cured polyurethane foam, and its surface has a structure of hollow holes of different sizes. This polishing pad has a large hardness, and obvious scratches exist on the surface of the semiconductor crystal after polishing; the fluff polishing pad has a small hardness, but the material removal rate is low during polishing. The nylon wire flexible polishing brush has a large hardness, elasticity, deformability, and each tuft of hair has a small volume, which can perform fine polishing on complex curved surfaces and improve the polishing efficiency and surface quality.

[0065] Preferably, the polishing liquid is a green environmental protection chemical polishing liquid, and the chemical polishing liquid includes cerium oxide abrasive grains. The specific components of the green polishing liquid are as follows: the abrasive grains are 20nm cerium oxide, the catalyst is 100nm titanium oxide, the oxidant is H2O2, the pH regulator is triethanolamine, the complexing agent is sorbitol, and the deionized water. The pH value of the polishing liquid is 9 - 11, and the pH is adjusted by the green environmental protection component triethanolamine.

[0066] Preferably, the xenon light source is a photocatalytic light source, and the light intensity is 0.15W / cm 2 ~2W / cm 2 。

[0067] Preferably, the xenon light source is fixed to the polishing machine chassis by screws. After the titanium oxide abrasive grains of the catalyst in the polishing liquid are irradiated by the light source, the electrons in the valence band are excited and transition to the conduction band to form free electrons, and at the same time, positively charged holes are formed in the valence band. The positively charged holes can react with the H2O2 molecules and hydroxide ions (OH-) adsorbed on the surface of the catalyst particles in the polishing liquid to generate highly oxidizing hydroxyl radicals. A large number of hydroxyl radicals oxidize and reduce the atoms on the polished surface of the component, improving the polishing efficiency and polishing accuracy.

[0068] Preferably, the counterweight disk and the carrier disk are provided with threaded through holes at the center for threaded connection with the threaded column. The support head, the threaded column, and the carrier disk are all made of conductive materials.

[0069] Preferably, the electrolytic power supply is an external power supply, which is a DC power supply, and the current range is 0 - 10A.

[0070] Preferably, during the polishing process, the polishing rotational speed of the complex curved surface element is 80 - 200 rpm, the polishing pressure is 50 kPa, and the polishing time is 15 min.

[0071] Preferably, the total contact area of the complex curved surface element is smaller than the area of the carrier plate.

[0072] Preferably, the slip ring is made of a conductive material. To prevent wire entanglement, a slip ring is selected for fixation and lead wire. The slip ring is fixed to the support head by threads, and the wire is wound outside the slip ring and fixed with tape. A circuit is formed through the support head, threaded post, and carrier plate for conduction, without direct contact with the workpiece, reducing the risk of wire entanglement.

[0073] Preferably, only the connecting part of the support head to the slip ring is made of a conductive material, and the rest is made of an insulating material.

[0074] The key points of the present invention are: 1. A processing device integrating photoelectrocatalysis and chemical mechanical polishing; 2. Processing complex curved surface elements of hard and brittle materials; 3. An immersion type flexible polishing device without a polishing pad.

[0075] Example 1

[0076] A flexible processing device for photoelectrochemical mechanical polishing of complex curved surface elements of hard and brittle materials, comprising: xenon light source 1, temperature measuring instrument 2, screw Ⅰ 3, polishing liquid inlet 4, screw Ⅱ 5, electrolytic power supply 6, wire Ⅰ 7, polishing machine chassis 8, support head 9, slip ring 10, polishing liquid pool 11, polishing liquid outlet 12, chassis cabinet 13, threaded post 14, counterweight plate 15, carrier plate 16, complex curved surface element 17, electrode 18, electrode fixing ring 19, wire Ⅱ 20, and electric flexible polishing brush 21.

[0077] See Figure 1 , the polishing liquid enters the polishing liquid pool 11 through the polishing liquid inlet 4, and is discharged through the polishing liquid outlet 12 after polishing, and the waste liquid is taken out from the chassis cabinet 13.

[0078] The xenon light source 1 is fixedly installed on the polishing machine chassis 8 by the screw Ⅱ 5, and the xenon light source lens directly irradiates the polishing liquid directly above the polishing liquid pool 11.

[0079] The temperature measuring instrument 2 is fixed on the polishing liquid pool box 11 by the screw Ⅰ 3 to monitor the temperature change during the photoelectrochemical mechanical polishing process in real time.

[0080] The electrolytic power supply 6 is placed on the polishing machine chassis 8, and the wire Ⅰ 7 and the wire Ⅱ 20 are respectively connected to the electrode 18 and the slip ring 10.

[0081] See Figure 2, The complex curved surface element 17 is fixed on the carrier plate 16, and the applied pressure is changed by changing the number and weight of the counterweight plates 15; the carrier plate 16 and the counterweight plates 15 are connected to the threaded posts 14 by threads; the threaded posts 14 are connected to the support head 9 of the polishing head boss by threads, and a driving motor drives the rotating main shaft inside the support head 9 to drive the threaded posts 14 to rotate, but is stopped externally.

[0082] The conductive slip ring 10 is fixed outside the support head 9 by threaded connection for conducting electricity, and the wire II 20 is wound outside the conductive slip ring 10 and conducts electricity through the support head 9, the threaded posts 14, and the carrier plate 16 without directly contacting the complex curved surface element 17, reducing the risk of winding of the wire II 20.

[0083] The polishing liquid layer, the electrode, and the complex curved surface element form an optoelectrochemical cell.

[0084] See Figure 3 , The electric flexible polishing brush 21 is fixed on the inner wall of the polishing liquid pool 11, the liquid level of the polishing liquid is higher than the polishing brush, the polishing brush is located directly below the complex curved surface element 17 and contacts it, and a driving motor makes it perform a self-rotating motion, and the polishing angle can be changed according to time, and the relative speed generated with the element enables the material to be fully removed.

[0085] The electrode fixing ring 19 is fixed on the inner wall of the polishing liquid pool 11, and the electrode 18 is fixed on the inner wall of the polishing liquid pool 11 through the electrode fixing ring 19 and immersed in the polishing liquid.

[0086] See Figure 4 , It is a schematic diagram of the complex curved surface element 17.

[0087] See Figure 5 , It is a schematic diagram of one of the electric flexible polishing brushes 21. The electric flexible polishing brush has numerous small tufts of hair, each small tuft of hair forms a certain angle with the polishing brush, and the overall angle of each polishing brush can also be changed according to adjustment.

[0088] The present invention also provides a processing method for a flexible processing device for optoelectrochemical mechanical polishing of a complex curved surface element of a hard and brittle material, including the following steps:

[0089] Step 1: Place the electrode 18 in the electrode fixing ring 19;

[0090] Step 2: Wind the wires of the electrolytic power supply 6 around the conductive slip ring 10 and the electrode 18 respectively;

[0091] Step 3: Add polishing liquid to the polishing liquid inlet 4 of the polishing machine (flexible processing device), and stop injecting the polishing liquid when the polishing liquid submerges the electric flexible polishing brush 21;

[0092] Step 4: Fix the complex curved surface element 17 on the carrier plate 16;

[0093] Step Five: Fix the carrier plate 16 and the counterweight plate 15 on the threaded column 14 through threaded connection. Among them, the counterweight plate 15 is placed above the carrier plate 16;

[0094] Step Six: Fix the threaded column 14 on the support head 9 through threaded connection;

[0095] Step Seven: Start the electric flexible polishing brush 21;

[0096] Step Eight: Start the thermometer 2;

[0097] Step Nine: Start the xenon light source 1, and adjust the light intensity of the xenon light source 1 to 0.15 W / cm 2 ~2 W / cm 2 ; At the same time, turn on the electrolytic power supply 6;

[0098] Step Ten: Start the polishing machine for polishing, adjust the polishing speed and flow rate, and start polishing;

[0099] Step Eleven: The motor of the polishing machine drives the complex polishing element (complex curved surface element 17) to make a rotary motion, and the electric flexible polishing brush 21 makes a rotary motion in the opposite direction to the complex polishing element, generating a relative speed to remove the reaction layer.

[0100] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A flexible processing device for optoelectrochemical mechanical polishing of complex curved surface components of hard and brittle materials, characterized in that, Including: A polishing machine chassis (8), a light source, a polishing liquid pool (11), an electrolysis device, and a support head (9) installed on the polishing machine chassis (8). The light source is used to directly irradiate the polishing liquid pool (11) during the polishing process. The polishing liquid pool (11) contains polishing liquid inside, and a plurality of polishing brushes are fixed on the inner wall. The electrolysis device is connected to the polishing liquid pool (11). The light source, the polishing liquid, and the electrolysis device form a photoelectrolytic cell. The support head (9) is connected with a threaded column (14). A counterweight disk (15) and a carrier disk (16) are connected below the threaded column (14). The counterweight disk (15) is placed on top of the carrier disk (16). The support head (9) is used to realize the rotary motion of the threaded column (14), the carrier disk (16), and the counterweight disk (15). A complex curved surface element (17) is fixed below the carrier disk (16) and placed in the polishing liquid. The polishing brushes polish the complex curved surface element (17) by the combined action of photoelectrochemical oxidation and mechanical friction in the photoelectrolytic cell. The electrolysis device includes an electrolysis power supply (6), a wire I (7), a wire II (20), an electrode (18), an electrode fixing ring (19), and a conductive slip ring (10). The electrode fixing ring (19) is fixed on the inner wall of the polishing liquid pool (11). The electrode (18) is fixed on the inner wall of the polishing liquid pool (11) through the electrode fixing ring (19) and immersed in the polishing liquid. The conductive slip ring (10) is made of a conductive material and fixed on the convex platform at the bottom of the support head (9). The part of the support head (9) connected to the conductive slip ring (10) is made of a conductive material, and the rest is made of an insulating material. One end of the wire II (20) is connected to the positive pole of the electrolysis power supply (6), and the other end is fixedly wound around the outside of the conductive slip ring (10). One end of the wire I (7) is connected to the negative pole of the electrolysis power supply (6), and the other end is connected to the electrode (18) arranged inside the polishing liquid pool (11) to form a circuit. The electrode (18) and the electrode fixing ring (19) are lower than the liquid level of the polishing liquid. The light source, the polishing liquid layer, and the electrode (18) form a photoelectrolytic cell.

2. The flexible machining device for photoelectrochemical mechanical polishing of complex curved surface elements of hard and brittle materials according to claim 1, characterized in that, A rotating main shaft is arranged inside the support head (9), and the rotating main shaft is driven by a motor to perform rotary motion. The rotating main shaft is connected to the threaded column (14). The inside of the support head (9) is of an annular structure, and the support head (9) remains stationary when the rotating main shaft moves. Threaded through holes are provided at the centers of the counterweight disk (15) and the carrier disk (16) for threaded connection with the threaded column (14).

3. The flexible machining device for photoelectrochemical mechanical polishing of a complex curved surface element of a brittle material according to claim 1, wherein The liquid level of the polishing liquid is higher than the polishing brushes and the complex curved surface element (17). The polishing brushes are located directly below the complex curved surface element (17) and in contact with it. During the polishing process, relative motion occurs between the polishing brushes and the complex curved surface element (17), generating a relative speed for material removal.

4. The flexible machining device for photoelectrochemical mechanical polishing of hard and brittle material complex curved surface components according to claim 1 or 3, characterized in that The polishing brush is an electric flexible polishing brush (21), which is a bendable flexible structure made of electrically insulating material and connected with a motor. The motor drives the electric flexible polishing brush (21) to rotate automatically, and the angle is adjusted according to the polishing requirements. Each electric flexible polishing brush (21) consists of countless brush clusters made of nylon filaments.

5. The flexible machining device for photoelectrochemical mechanical polishing of complex curved surface elements of hard and brittle materials according to claim 1 or 3, characterized in that, The polishing liquid is a green environmental protection chemical polishing liquid, and its components include: abrasive grains, catalyst, oxidant, pH regulator, complexing agent, deionized water. The abrasive grains are 20 nm cerium oxide, the catalyst is 100 nm titanium oxide, the oxidant is H2O2, the pH regulator is triethanolamine, and the complexing agent is sorbitol. The pH value of the polishing liquid is 9 - 11.

6. The flexible machining device for photoelectrochemical mechanical polishing of complex curved surface elements of brittle materials according to claim 1, characterized in that, A thermometer (2) is also provided on the polishing liquid pool (11).

7. The flexible machining device for photoelectrochemical mechanical polishing of complex curved surface components of brittle materials according to claim 1, characterized in that, The light source is a xenon lamp light source, which is used to generate ultraviolet rays to irradiate the polishing liquid; the light intensity of the xenon lamp light source is 0.15 W / cm 2 ~2 W / cm 2 .

8. The flexible machining device for photoelectrochemical mechanical polishing of complex curved surface elements of brittle materials according to claim 1, characterized in that, It also includes a polishing liquid inlet (4), a polishing liquid outlet (12) and a chassis cabinet (13). The polishing liquid inlet (4) is connected with the polishing liquid pool (11). One end of the polishing liquid outlet (12) is connected with the polishing liquid pool (11), and the other end is connected with the chassis cabinet (13). The chassis cabinet (13) is installed on the polishing machine chassis (8).

9. A processing method of a flexible processing device for photoelectrochemical mechanical polishing of a complex curved surface element of a hard and brittle material according to any one of claims 1-8, characterized in that, It includes the following steps: Step 1: Place the electrode (18) in the electrode fixing ring (19). Step 2: Wind the wires of the electrolytic power supply (6) around the conductive slip ring (10) and the electrode (18) respectively. Step 3: Add the polishing liquid to the polishing liquid inlet (4), and stop injecting the polishing liquid until the polishing liquid submerges the electric flexible polishing brush (21). Step 4: Fix the complex curved surface element (17) on the carrier plate (16). Step 5: Fix the carrier plate (16) and the counterweight plate (15) on the threaded column (14) by threaded connection. Among them, the counterweight plate (15) is placed above the carrier plate (16). Step 6: Fix the threaded column (14) on the support head (9) by threaded connection. Step 7: Start the electric flexible polishing brush (21). Step 8: Start the thermometer (2). Step 9: Start the xenon light source (1), and adjust the light intensity of the xenon light source (1) to 0.15 W / cm 2 ~2 W / cm 2 ; At the same time, turn on the electrolysis power supply (6); Step 10: Start the flexible processing device for polishing, adjust the polishing speed and flow rate, and start polishing. Step 11: The motor of the flexible processing device drives the complex curved surface element (17) to make a rotary motion, and the electric flexible polishing brush (21) makes a rotary motion in the opposite direction to the complex curved surface element (17), generating a relative speed to remove the reaction layer.

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