Method, device and retaining wall structure printing method for backlight panel

Abstract

The present application discloses a method, device, and retaining wall structure for printing a retaining wall structure of a backlight panel. The method obtains the specification parameters of the light-emitting chip on the backlight panel and determines the light-emitting unit based on the specification parameters; determines the size parameters of the retaining wall structure based on the distance and specification parameters between any two adjacent light-emitting units; calculates the printing parameters of the metal layer and the printing parameters of the silicone layer based on the size parameters of each retaining wall structure, and controls the first printing nozzle to print according to the printing parameters of the metal layer, and controls the second printing nozzle to print according to the printing parameters of the silicone layer. By specifying the printing method so that the center of the retaining wall structure is the metal layer, that is, the center of gravity of the entire structure is lowered, the retaining wall collapse phenomenon can be avoided during the curing and heating process; secondly, the angle between the side wall of the silicone layer of the printed retaining wall structure and the substrate surface of the backlight panel is greater than 100 degrees, which can reduce the absorptivity of the retaining wall structure and increase the reflectivity, thereby improving the light output efficiency of the backlight panel.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and in particular relates to a method and device for printing a retaining wall structure of a backlight panel, and a retaining wall structure. Background Art

[0002] The miniaturization and high-definition of light-emitting units have become an overall trend in the current display industry. Mini-LED televisions are already available on the market, but modern demands such as wearable micro-watches and VR glasses require even smaller and more precise display units, giving rise to Micro-LED technology with even smaller light-emitting units. Micro-LED technology can reduce the size of light-emitting diode chips to micrometers, making them a light-emitting array. Compared to the currently widely used LEDs, Micro-LED offers advantages such as higher brightness and lower power consumption. It is clear that both Mini-LED and Micro-LED will become inevitable paths for the development of the display industry.

[0003] Direct-write 3D printing is a new additive manufacturing technology based on a high-precision motion platform, high-precision nozzles, high-precision motion control, and compatible materials. Its wide processing range (1μm to 1000μm) and flexible processing methods are well-suited for Mini-LED and Micro-LED displays. To improve the visual impact of color shift on the panel, direct-write 3D printing technology provides a packaging structure with a surrounding retaining wall filled with diffusion adhesive. This structure can make the color attenuation of different color light-emitting chips as consistent as possible at a wide viewing angle. The panel is then covered with a black film to achieve a completely black panel effect.

[0004] However, in actual applications, the retaining wall material needs to be black or gray to ensure that the structure under the film cannot be seen after the black film is applied. However, the black and gray materials have a strong ability to absorb light, resulting in the luminance of the same power under this structure being much lower than that of the bare crystal board; secondly, the retaining wall material is mainly made of organic materials such as silicone or epoxy, and it needs to go through a high-temperature curing stage during the production of the retaining wall. However, during the high-temperature process, the material undergoes a polymerization reaction (curing from liquid to solid). Since there is an LED on one side of the retaining wall and nothing on the other side, when the heat convection on both sides of the retaining wall is inconsistent, it is easy for a retaining wall with a very short width but a very high height to tilt to one side during the curing process, thereby damaging the retaining wall structure. Summary of the Invention

[0005] This application aims to solve the problem that the retaining wall material mentioned above needs to be black or gray to ensure that the structure under the film cannot be seen after the black film is applied. However, the black and gray materials have a strong ability to absorb light, resulting in the luminance of the same power under this structure being much lower than that of the bare crystal board; secondly, the retaining wall material is mainly made of organic materials such as silicone or epoxy, and needs to undergo a high-temperature curing stage during the process of making the retaining wall. However, during the high-temperature process, the material undergoes a polymerization reaction (curing from liquid to solid). Since there is an LED on one side of the retaining wall and nothing on the other side, when the heat convection on both sides of the retaining wall is inconsistent, it is easy for a retaining wall with a very short width but a very high height to tilt to one side during the curing process, which in turn causes damage to the retaining wall structure and other technical defects. A method, device and retaining wall structure for printing a retaining wall structure of a backlight panel are proposed, and its technical solution is as follows:

[0006] In a first aspect, an embodiment of the present application provides a method for printing a retaining wall structure of a backlight panel, comprising:

[0007] Obtaining specification parameters of a light-emitting chip on the backlight panel, and determining at least two light-emitting units according to the specification parameters of the light-emitting chip; wherein the light-emitting unit includes at least one light-emitting chip;

[0008] Determining size parameters of at least two retaining wall structures based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip;

[0009] The printing parameters of the metal layer and the printing parameters of the silicone layer are calculated respectively according to the size parameters of each retaining wall structure, and the first printing nozzle is controlled to perform printing according to the printing parameters of the metal layer, and the second printing nozzle is controlled to perform printing according to the printing parameters of the silicone layer; wherein, the retaining wall structure includes a metal layer and a silicone layer, the silicone layer is completely wrapped around the surface of the metal layer, and the inner diameter of the needle of the first printing nozzle is different from the inner diameter of the needle of the second printing nozzle.

[0010] In an optional solution of the first aspect, before obtaining the specification parameters of the light-emitting chip on the backlight panel, the method further includes:

[0011] The backlight plate is fixed on the suction cup, and at least two marking points on the substrate surface of the backlight plate are identified based on the top camera;

[0012] Determining whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to the movement direction of the first printing nozzle, or the calibration line corresponds to the movement direction of the second printing nozzle;

[0013] When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line;

[0014] Obtain the specifications of the light-emitting chip on the backlight panel, including:

[0015] When it is detected that the connecting line is parallel to the calibration line, the specification parameters of the light-emitting chip on the backlight panel are obtained.

[0016] In another optional solution of the first aspect, the specification parameters of the light-emitting chip include light-emitting color;

[0017] Determining at least two light-emitting units according to the specification parameters of the light-emitting chip includes:

[0018] When it is detected that the light emitting colors of at least two light emitting chips are inconsistent, a set of light emitting chips with inconsistent light emitting colors is used as a light emitting unit; or

[0019] When it is detected that the light-emitting colors of each light-emitting chip are consistent, each light-emitting chip is regarded as a light-emitting unit.

[0020] In another optional solution of the first aspect, the specification parameters of the light-emitting chip further include length and height;

[0021] Based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip, the size parameters of at least two retaining wall structures are determined, including:

[0022] Based on the distance between any two adjacent light-emitting units and a preset minimum width, the bottom width of each retaining wall structure is determined; wherein the distance between each retaining wall structure and two adjacent light-emitting units remains consistent;

[0023] Based on the length of the light-emitting chip and a preset first ratio, the bottom length of each retaining wall structure is calculated, and the coordinates of the bottom vertex of each retaining wall structure are converted according to the coordinates of the marking point on the backlight panel, the bottom width of the retaining wall structure, and the bottom length of the retaining wall structure; wherein the bottom length of the retaining wall structure is greater than the length of the light-emitting chip;

[0024] Based on the height of the light-emitting chip and the preset second ratio, the height of each retaining wall structure is calculated, and the height and bottom vertex coordinates of each retaining wall structure are used as size parameters.

[0025] In another optional solution of the first aspect, the printing parameters of the metal layer and the printing parameters of the silicone layer are calculated based on the size parameters of each retaining wall structure, including:

[0026] Determining the printing heights of m sub-metal layers based on the height of the light-emitting chip; wherein the printing height of each sub-metal layer remains consistent, the sum of the printing heights of all sub-metal layers is greater than or equal to the height of the light-emitting chip, and m is a positive integer greater than 2;

[0027] The bottom vertex coordinates of each sub-metal layer are converted based on the bottom vertex coordinates of each retaining wall structure, and a printing path corresponding to each sub-metal layer is generated based on the printing height, bottom vertex coordinates, and the preset needle inner diameter of each sub-metal layer; wherein the bottom vertex coordinates of each sub-metal layer remain consistent;

[0028] The printing path corresponding to each sub-metal layer and the preset needle inner diameter are used as the printing parameters of the metal layer;

[0029] The printing parameters of the silicone layer are determined according to the height of each retaining wall structure, the coordinates of the bottom vertex of each retaining wall structure, the printing height of each sub-metal layer, and the coordinates of the bottom vertex of each sub-metal layer.

[0030] In another optional solution of the first aspect, the printing parameters of the silicone layer are determined based on the height of each retaining wall structure, the coordinates of the bottom vertex of each retaining wall structure, the printing height of each sub-metal layer, and the coordinates of the bottom vertex of each sub-metal layer, including:

[0031] Determining the printing heights of the m sub-silicone layers based on the printing heights of the m sub-metal layers; wherein the printing height of each sub-metal layer is consistent with the printing height of each sub-silicone layer;

[0032] Calculate the bottom vertex coordinates and corresponding bottom width of the i-th sub-silicone layer based on the bottom vertex coordinates of the i-1th sub-silicone layer and a preset third ratio; wherein the bottom vertex coordinates of the first sub-silicone layer are determined based on the bottom vertex coordinates of the retaining wall structure and the bottom vertex coordinates of the sub-metal layer, where i is a positive integer greater than 1 and less than or equal to m;

[0033] The corresponding needle inner diameter is calculated according to the bottom width of the i-th sub-silicone layer, and the printing path corresponding to the i-th sub-silicone layer is generated according to the printing height, bottom vertex coordinates and needle inner diameter of the i-th sub-silicone layer;

[0034] The printing height of the m+1th sub-silicone layer is calculated based on the height of each retaining wall structure and the printing height of the m sub-silicone layers. The printing path of the m+1th sub-silicone layer is generated based on the printing height of the m+1th sub-silicone layer, the coordinates of the bottom vertex of the mth sub-silicone layer, and the inner diameter of the needle of the mth sub-silicone layer.

[0035] The printing paths of the m+1 sub-silicone layers are used as the printing parameters of the silicone layer.

[0036] In another optional solution of the first aspect, controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, includes:

[0037] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and printing the nth sub-metal layer according to the printing path of the nth sub-metal layer; wherein n is a positive integer less than or equal to m-1;

[0038] Controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the nth sub-silicone layer, and printing the nth sub-silicone layer according to the printing path of the nth sub-silicone layer;

[0039] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and printing the n+1th sub-metal layer according to the printing path of the n+1th sub-metal layer;

[0040] The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the n+1th sub-silicone layer, and the n+1th sub-silicone layer is printed according to the printing path of the n+1th sub-silicone layer.

[0041] In another optional solution of the first aspect, controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, further comprising:

[0042] When n+1 is equal to m, the inner diameter of the needle of the third printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the m+1th sub-silicone layer, and the m+1th sub-silicone layer is printed according to the printing path of the m+1th sub-silicone layer.

[0043] In another optional solution of the first aspect, before controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0044] The first printing nozzle is controlled to move to a preset height, and the second printing nozzle is controlled to move to a preset height.

[0045] In another optional solution of the first aspect, before controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0046] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and controlling the first printing nozzle to move to a designated area for printing;

[0047] The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the first sub-silicone layer, and the second printing nozzle is controlled to move to the designated area for printing.

[0048] In another optional solution of the first aspect, after controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0049] Move the backlight plate with the printed retaining wall structure from the suction cup to the designated curing area;

[0050] The backlight panel printed with the retaining wall structure is cured in the designated curing area.

[0051] In a second aspect, an embodiment of the present application provides a device for printing a retaining wall structure of a backlight panel, comprising:

[0052] a unit determination module, configured to obtain specification parameters of a light-emitting chip on the backlight panel and determine at least two light-emitting units according to the specification parameters of the light-emitting chip; wherein a light-emitting unit includes at least one light-emitting chip;

[0053] a parameter determination module, configured to determine size parameters of at least two retaining wall structures based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip;

[0054] A retaining wall printing module is used to calculate the printing parameters of the metal layer and the printing parameters of the silicone layer according to the dimensional parameters of each retaining wall structure, and control the first printing nozzle to print according to the printing parameters of the metal layer, and control the second printing nozzle to print according to the printing parameters of the silicone layer; wherein the retaining wall structure includes a metal layer and a silicone layer, the silicone layer is completely wrapped around the surface of the metal layer, and the inner diameter of the needle of the first printing nozzle is different from the inner diameter of the needle of the second printing nozzle.

[0055] In a third aspect, an embodiment of the present application provides a backlight panel retaining wall structure, comprising a backlight panel and at least two retaining wall structures disposed on a substrate of the backlight panel;

[0056] At least two light-emitting units are provided on the backlight panel, each light-emitting unit includes at least one light-emitting chip, each retaining wall structure is provided between any two adjacent light-emitting units, and the distance between each retaining wall structure and the two adjacent light-emitting units remains consistent;

[0057] Each retaining wall structure includes a metal layer and a silicone layer. The silicone layer completely wraps around the surface of the metal layer. The angle between the side of the silicone layer and the substrate surface of the backlight panel is greater than 100 degrees.

[0058] In an optional solution of the third aspect, the silica gel layer contains nano-silver flakes with a solid content within a preset solid content range to enhance the reflectivity of the silica gel layer.

[0059] In a fourth aspect, an embodiment of the present application further provides a device for printing a retaining wall structure of a backlight panel, comprising a processor and a memory;

[0060] The processor is connected to the memory;

[0061] a memory for storing executable program code;

[0062] The processor runs the program corresponding to the executable program code by reading the executable program code stored in the memory, so as to implement the backlight panel retaining wall structure printing method provided by the first aspect of the embodiment of the present application or any one of the implementation methods of the first aspect.

[0063] In a fourth aspect, the present application provides a computer storage medium storing a computer program, wherein the computer program includes program instructions. When the program instructions are executed by a processor, the method for printing the retaining wall structure of the backlight panel provided in the first aspect of the embodiment of the present application or any one of the implementation methods of the first aspect can be implemented.

[0064] Beneficial effects:

[0065] During the printing of the retaining wall structure of the backlight panel, the specification parameters of the light-emitting chip on the backlight panel are obtained, and at least two light-emitting units are determined based on the specification parameters of the light-emitting chip; the size parameters of at least two retaining wall structures are determined based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip; the printing parameters of the metal layer and the printing parameters of the silicone layer are calculated respectively according to the size parameters of each retaining wall structure, and the first printing nozzle is controlled to perform printing according to the printing parameters of the metal layer, and the second printing nozzle is controlled to perform printing according to the printing parameters of the silicone layer. By controlling the printing nozzle to print out the metal layer and the silicone layer of the retaining wall structure respectively, the center of the retaining wall structure is the metal layer, that is, the center of gravity of the overall structure is lowered, which can avoid the collapse of the retaining wall during the curing and heating process; secondly, the metal layer in the retaining wall structure has good ductility and a certain strength, which can reduce the generation of air holes when the black film is vacuum adsorbed and laminated in the subsequent process, and also increase the mechanical strength of one side of the panel light board to prevent the LED light-emitting chip from falling off after accidental impact, resulting in bad pixels on the screen; secondly, the angle between the side wall of the silicone layer of the printed retaining wall structure and the substrate surface of the backlight panel is greater than 100 degrees, which can reduce the absorption rate of the retaining wall structure and increase the reflectivity, thereby improving the light output efficiency of the backlight panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0067] Figure 1 An overall flow chart of a method for printing a retaining wall structure of a backlight panel provided in an embodiment of the present application;

[0068] Figure 2 A schematic diagram of a printing process of a retaining wall structure of a backlight panel provided in an embodiment of the present application;

[0069] Figure 3 A schematic diagram of a retaining wall structure of a backlight panel provided in an embodiment of the present application;

[0070] Figure 4 A schematic diagram of a change curve of adding nano-silver flakes provided in an embodiment of the present application;

[0071] Figure 5 A schematic diagram of the printing effect of a retaining wall structure of a backlight panel provided in an embodiment of the present application;

[0072] Figure 6 A schematic diagram of the light emitting effect of a retaining wall structure of a backlight panel provided in an embodiment of the present application;

[0073] Figure 7 A schematic diagram of the curing heating effect of a retaining wall structure of an existing backlight panel provided in an embodiment of the present application;

[0074] Figure 8 A schematic structural diagram of a backlight panel retaining wall structure printing device provided in an embodiment of the present application;

[0075] Figure 9 A schematic structural diagram of another backlight panel retaining wall structure printing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0076] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0077] In the following introduction, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The following introduction provides multiple embodiments of the present application. Different embodiments can be replaced or combined, so the present application can also be considered to include all possible combinations of the same and / or different embodiments described. Therefore, if one embodiment includes features A, B, and C, and another embodiment includes features B and D, then the present application should also be considered to include embodiments containing one or more of all other possible combinations of A, B, C, and D, even though the embodiment may not be clearly described in the following text.

[0078] The following description provides examples and does not limit the scope, applicability, or examples set forth in the claims. Changes may be made to the function and arrangement of the elements described without departing from the scope of the present application. Various examples may appropriately omit, replace, or add various processes or components. For example, the described method may be performed in an order different from the order described, and various steps may be added, omitted, or combined. In addition, features described in some examples may be combined in other examples.

[0079] See also Figure 1 , Figure 1 The figure shows an overall flow chart of a method for printing a retaining wall structure of a backlight panel provided in an embodiment of the present application.

[0080] like Figure 1 As shown, the method for printing the retaining wall structure of the backlight plate may include at least the following steps:

[0081] Step 102: Obtain specification parameters of the light-emitting chip on the backlight panel, and determine at least two light-emitting units according to the specification parameters of the light-emitting chip.

[0082] In an embodiment of the present application, the method for printing the retaining wall structure of the backlight panel can be, but is not limited to, applied to a control terminal on a controllable motion platform, which can include at least a marble suction cup (controllable rotation) for fixing the backlight panel, a top camera arranged above the marble suction cup, a gantry for controlling one or more first printing nozzles, a gantry for controlling one or more second printing nozzles, and a laser ranging sensor for measuring the height of the printing nozzle and the height of the backlight panel. Among them, one or more first printing nozzles can be used to print the metal layer in the retaining wall structure on the substrate surface of the backlight panel, and the metal material corresponding to the first printing nozzle can be, but is not limited to, silver paste or copper paste, and the viscosity of the metal material can be controlled to be 20w cP ~ 100w cP. It can be understood that the inner diameter of the needle of the first printing nozzle here can be, but is not limited to, set between 5μm and 100μm to meet different printing requirements. One or more second print nozzles can be used to print the silicone layer in the retaining wall structure on the substrate surface of the backlight panel. The material corresponding to the second print nozzle can specifically be a silicone material, and the viscosity of the silicone material is defined according to the desired aspect ratio of the silicone layer. For example, but not limited to, when the desired aspect ratio of the silicone layer is a, the corresponding silicone material viscosity can be controlled to be 2a. It is understood that the material viscosity corresponding to the second print nozzle here can be set, but not limited to, between 10w cP and 100w cP to meet different printing requirements.

[0083] It should be noted that in the embodiment of the present application, the silicone layer printed by the second printing nozzle is completely wrapped around the surface of the metal layer printed by the first printing nozzle, and in the printing process of the retaining wall structure, a layer-by-layer printing method can be used, but is not limited to it, that is, the metal layer can be divided into multiple sub-metal layers, and the silicone layer can also be divided into multiple sub-silicone layers, and the first printing nozzle is first controlled to print the first sub-metal layer, and then the second printing nozzle is controlled to print the first sub-silicone layer, and then the first printing nozzle is controlled to print the second sub-metal layer, and then the second printing nozzle is controlled to print the second sub-silicone layer, until the printing of the last sub-metal layer and the printing of the last sub-silicone layer are completed. In addition, in order to ensure that the center of gravity of the retaining wall structure is low, the bottom area of ​​each printed sub-silicone layer is smaller than the bottom area of ​​the previous sub-silicone layer, so that the side view of the silicone layer finally formed is close to a trapezoidal shape. This method can also ensure that the angle between the side wall of the silicone layer and the substrate surface of the backlight panel is greater than 100 degrees, which can reduce the absorption rate of the retaining wall structure and increase the reflectivity, thereby improving the light output efficiency of the backlight panel.

[0084] Specifically, in the process of printing the retaining wall structure of the backlight panel, the specification parameters of the light-emitting chip on the backlight panel can be obtained. The specification parameters of the light-emitting chip (which can also be understood as a light-emitting diode) on the backlight panel can include but are not limited to the size parameters, color and arrangement parameters of all light-emitting chips of each light-emitting chip, wherein the size parameters of the light-emitting chip can be specifically the length, width and height of the light-emitting chip, and the height can be understood as the distance between the upper surface of the light-emitting chip and the surface of the substrate; the arrangement parameters of all light-emitting chips can be specifically the distance between any two adjacent light-emitting chips and the position relationship of each light-emitting chip on the surface of the substrate, and the position relationship of each light-emitting chip on the surface of the substrate can be understood as the distance between the center point of each light-emitting chip and the edge of the backlight panel, or the relative coordinates of the four vertices of each light-emitting chip on the surface of the substrate, and here the position of each light-emitting chip on the surface of the substrate is relatively fixed.

[0085] It can be understood that in the embodiment of the present application, the method of obtaining the specification parameters of the light-emitting chip on the backlight panel can be, but is not limited to, based on a visual algorithm, obtained by identifying and processing the substrate surface image of the backlight panel captured by the top camera, or directly by the user inputting the specification parameters corresponding to the backlight panel, which is not limited to this here.

[0086] Furthermore, after obtaining the specification parameters of the light-emitting chip on the backlight panel, at least two light-emitting units can be determined based on the specification parameters of the light-emitting chip, wherein the number and size parameters of the light-emitting chips included in each light-emitting unit are consistent. For example, when it is detected that the backlight panel includes the same number of red light-emitting chips, green light-emitting chips and blue light-emitting chips (the size parameters of each light-emitting chip are consistent), each light-emitting unit may specifically include a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip, and the red light-emitting chip and the green light-emitting chip are two adjacent light-emitting chips, and the green light-emitting chip and the blue light-emitting chip are two adjacent light-emitting chips; or when it is detected that the backlight panel includes light-emitting chips with consistent colors (the size parameters of each light-emitting chip are consistent), each light-emitting unit may specifically be one light-emitting chip. It should be noted that in the embodiment of the present application, the size corresponding to the light-emitting unit is consistent with the minimum rectangular frame that can enclose all the light-emitting chips contained therein. In other words, when the light-emitting unit is specifically a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip arranged in sequence, the vertices of the light-emitting unit may be the upper left vertex and the lower left vertex of the red light-emitting chip and the upper right vertex and the lower right vertex of the blue light-emitting chip; or when the light-emitting unit is specifically a light-emitting chip, the vertices of the light-emitting unit may correspond to the four vertices of the light-emitting chip.

[0087] As an option in the embodiment of the present application, before obtaining the specification parameters of the light-emitting chip on the backlight panel, the method further includes:

[0088] The backlight plate is fixed on the suction cup, and at least two marking points on the substrate surface of the backlight plate are identified based on the top camera;

[0089] Determining whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to the movement direction of the first printing nozzle, or the calibration line corresponds to the movement direction of the second printing nozzle;

[0090] When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line;

[0091] Obtain the specifications of the light-emitting chip on the backlight panel, including:

[0092] When it is detected that the connecting line is parallel to the calibration line, the specification parameters of the light-emitting chip on the backlight panel are obtained.

[0093] To ensure the effectiveness and accuracy of the retaining wall structure during printing, the angle between the line formed by any two adjacent marking points on the backlight plate and the calibration line can be used to determine whether the backlight plate needs to be rotated. This ensures that during printing of the retaining wall structure, the print nozzle remains parallel to the long side of the backlight plate along the direction of horizontal movement of the plane, and parallel to the wide side of the backlight plate along the direction of vertical movement of the plane. The calibration line can be a line segment parallel to the direction of horizontal movement of the plane, and a line segment parallel to the direction of vertical movement of the plane, and the line segment parallel to the direction of horizontal movement of the plane and the line segment parallel to the direction of vertical movement of the plane are perpendicular to each other.

[0094] Specifically, the bottom of the substrate of the backlight panel can be adsorbed on the suction cup, and the top camera can be controlled to move to the top of the backlight panel to capture the surface of the substrate of the backlight panel, and at least two marking points on the surface of the substrate of the backlight panel can be identified in the captured image through a visual algorithm. It can be understood that in the embodiment of the present application, at least two marking points are pre-set on the surface of the substrate of the backlight panel, and the position of each marking point on the surface of the substrate of the backlight panel is relatively fixed. For example, a marking point is set at each of the four vertices of the backlight panel, and the line connecting any two adjacent marking points can be kept parallel to the long side or the wide side of the substrate of the backlight panel.

[0095] Then, after identifying all the marking points on the substrate surface of the backlight panel, any two adjacent marking points can be connected by a line, and it can be determined whether the angle between the connecting line and any calibration line is 0 degrees. Possibly, when it is detected that the angle between the connecting line and any calibration line is 0 degrees, it indicates that the connecting line formed by the any two adjacent marking points is parallel to any calibration line. Possibly, when it is detected that the angle between the connecting line and any calibration line is not 0 degrees, it indicates that the connecting line formed by the any two adjacent marking points is not parallel to any calibration line, and the suction cup can be controlled to rotate according to the angle between the connecting line and any calibration line until the angle between the connecting line and any calibration line is 0 degrees.

[0096] It can be understood that in the embodiment of the present application, after detecting that the connecting line is parallel to the calibration line, the vertex coordinates of each light-emitting chip can be determined based on the spatial rectangular coordinate system corresponding to the backlight panel and the position relationship of the marking point in the spatial rectangular coordinate system, and then the vertex coordinates of each light-emitting unit can also be determined to facilitate the subsequent determination of the printing path.

[0097] Step 104: Determine size parameters of at least two retaining wall structures based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip.

[0098] Specifically, after determining at least two light-emitting units according to the specification parameters of the light-emitting chip, the bottom width of each retaining wall structure and the horizontal coordinate position corresponding to the bottom vertex can be determined based on the distance between any two adjacent light-emitting units and the preset minimum width, wherein the distance between any two adjacent light-emitting units can be but is not limited to the distance between the lower right vertex of the previous light-emitting unit and the lower left vertex of the next light-emitting unit. The vertex coordinates of the light-emitting unit can refer to the above-mentioned embodiment and will not be repeated here, and the preset minimum width can be understood as the width corresponding to the retaining wall structure being at least greater than the minimum width. It can be understood that in order to ensure that the distance between the retaining wall structure and the two adjacent light-emitting units remains consistent, the center position can be determined based on the distance between the two adjacent light-emitting units, and the distance between the center position and the two adjacent light-emitting units is consistent (or the two adjacent light-emitting units are centrally symmetrical based on the center position). Then, the bottom width of the retaining wall structure can be determined in combination with the preset minimum width. Here, the bottom width of the retaining wall structure can be but is not limited to twice the minimum width, and the horizontal coordinate position corresponding to the bottom vertex of the retaining wall structure is converted through the determined center position. For example, when the horizontal coordinate of the center position can be expressed as x and the bottom width of the retaining wall structure can be expressed as h, the horizontal coordinates of the four vertices of the bottom surface of the retaining wall structure can be expressed as (xh / 2) and (x+h / 2), respectively.

[0099] It should be noted that in the embodiment of the present application, any position on the backlight panel has a fixed coordinate correspondence with the marking point, that is, the coordinates corresponding to the center position can be determined based on the coordinates of the marking point in the spatial rectangular coordinate system corresponding to the backlight panel.

[0100] Furthermore, after determining the bottom width of each retaining wall structure and the horizontal coordinate position corresponding to the bottom vertex, the bottom length of each retaining wall structure can be obtained based on the length of the light-emitting chip and the preset first ratio, but is not limited to calculating the product between the length of the light-emitting chip and the preset first ratio. The vertical coordinate position corresponding to the bottom vertex of each retaining wall structure can be calculated in combination with the center position mentioned above. For example, when the vertical coordinate of the center position can be expressed as y and the bottom length of the retaining wall structure can be expressed as b, the vertical and horizontal coordinates of the four vertices of the bottom surface of the retaining wall structure can be expressed as (yb / 2) and (y+b / 2), respectively. It can be understood that, in combination with the above-mentioned example that the horizontal coordinates of the four vertices of the bottom surface of the retaining wall structure can be expressed as (xh / 2) and (x+h / 2), respectively, the coordinates of the four vertices of the bottom surface of the retaining wall structure can be determined to be (xh / 2, yb / 2), (xh / 2, y+b / 2), (x+h / 2, yb / 2), and (x+h / 2, y+b / 2), respectively.

[0101] It should be noted that, in order to ensure a better reflection effect, in the embodiment of the present application, the bottom length of the retaining wall structure is greater than the length of the light-emitting chip, that is, the preset first ratio mentioned above can be a constant greater than 1.

[0102] Furthermore, after determining the coordinates of the four vertices of the bottom surface of each retaining wall structure, the corresponding height of each retaining wall structure can be calculated based on the height of the light-emitting chip and the preset second ratio, but is not limited to calculating the product of the height of the light-emitting chip and the preset second ratio. Similarly, to ensure a better reflection effect, in the embodiment of the present application, the height of the retaining wall structure is greater than the height of the light-emitting chip, that is, the preset second ratio mentioned above can be a constant greater than 1.

[0103] Furthermore, after obtaining the corresponding bottom vertex coordinates and height of each retaining wall structure in turn, the corresponding bottom vertex coordinates and height of each retaining wall structure can be used as size parameters to facilitate subsequent calculation of the printing path corresponding to each retaining wall structure.

[0104] Step 106: Calculate the printing parameters of the metal layer and the silicone layer according to the size parameters of each retaining wall structure, and control the first printing nozzle to print according to the printing parameters of the metal layer, and control the second printing nozzle to print according to the printing parameters of the silicone layer.

[0105] Specifically, after determining the dimensional parameters of each retaining wall structure, the printing parameters of the metal layer can be calculated by first determining the printing heights of m sub-metal layers based on the height of the light-emitting chip. The sum of the printing heights of the m sub-metal layers is greater than or equal to the height of the light-emitting chip. During the printing of the metal layer, a stacking printing method is used to stack the sub-metal layers to form the metal layer. m is a positive integer greater than 2, and the height of the light-emitting chip is a multiple of m.

[0106] Furthermore, the bottom vertex coordinates of each sub-metal layer can be calculated based on the bottom vertex coordinates of each retaining wall structure. A fixed correspondence exists between the bottom position of the sub-metal layer and the bottom surface of the retaining wall structure. For example, but not limited to, the bottom midpoint coordinates can be first obtained based on the bottom vertex coordinates of each retaining wall structure, and then the bottom vertex coordinates of each sub-metal layer can be calculated based on the fixed correspondence and the bottom midpoint coordinates. The bottom vertex coordinates and printing height of each sub-metal layer remain consistent, that is, the printing path corresponding to each sub-metal layer remains consistent, to ensure the stability of the entire metal layer.

[0107] Furthermore, after obtaining the printing height and bottom vertex coordinates of each sub-metal layer, a printing path corresponding to each sub-metal layer can be generated in combination with a preset needle inner diameter. The preset needle inner diameter can be used to set the needle inner diameter corresponding to the first printing nozzle of the printed metal layer, and in the process of generating the printing path corresponding to each sub-metal layer, it can be but not limited to first determining the initial printing position and the end printing position based on the bottom vertex coordinates of each sub-metal layer and the preset needle inner diameter, and then automatically generating a printing path based on the initial printing position and the end printing position. The printing path can be understood as a connecting line from the initial printing position to the end printing position, and there is no intersection on the connecting line. The movement direction of the printing nozzle corresponding to the connecting line includes a direction parallel to the long side of the backlight panel and a direction parallel to the wide side of the backlight panel. Next, the printing time corresponding to each position on the printing path when the first printing nozzle moves along the printing path under the specified printing pressure can be determined based on the printing height of each sub-metal layer. Then, the printing path corresponding to each sub-metal layer and the printing time corresponding to each position on the printing path can be used as the printing parameters for the first printing nozzle to print each sub-metal layer, and the first printing nozzle can be controlled to print each sub-metal layer according to the printing path corresponding to each sub-metal layer and the printing time corresponding to each position on the printing path.

[0108] Furthermore, in the process of calculating the printing parameters of the silicone layer, the printing heights of the corresponding m sub-silicone layers can be determined based on the printing heights of the m sub-metal layers mentioned above. In the embodiment of the present application, it is possible but not limited to setting the printing height of each sub-silicone layer to be consistent with the printing height of each sub-metal layer. That is, when the retaining wall structure is printed in the order of printing one sub-metal layer and then printing one sub-silicone layer, it can be ensured that after the sub-metal layer and the sub-silicone layer of the same layer are printed, the sum of the heights of the currently printed multiple sub-metal layers is consistent with the heights of the printed multiple sub-silicone layers.

[0109] Furthermore, the bottom vertex coordinates of the i-th sub-silicone layer can be calculated based on the bottom vertex coordinates of the i-1th sub-silicone layer and a preset third ratio. In the process of obtaining the bottom vertex coordinates of the i-th sub-silicone layer, it is possible but not limited to first determining the bottom center position coordinates of the i-1th sub-silicone layer based on the bottom vertex coordinates of the i-1th sub-silicone layer, and then combining the distance between the bottom vertex coordinates and the center position coordinates of the i-1th sub-silicone layer and the preset third ratio to calculate the distance between the bottom center position coordinates of the i-th sub-silicone layer and the bottom vertex coordinates of the i-th sub-silicone layer. Here, the bottom center position coordinates of the i-th sub-silicone layer are consistent with the bottom center position coordinates of the i-1th sub-silicone layer, and then combining the distance between the bottom center position coordinates of the i-th sub-silicone layer and the bottom vertex coordinates of the i-th sub-silicone layer and the bottom center position coordinates of the i-th sub-silicone layer to convert the bottom vertex coordinates of the i-th sub-silicone layer. It is understood that in the embodiment of the present application, the coordinates of the bottom center of the i-1th sub-silicone layer are consistent with the coordinates of the bottom center position of the i-th sub-silicone layer, and the bottom shape of the i-1th sub-silicone layer is similar to the bottom shape of the i-th sub-silicone layer. In order to ensure the overall stability of the silicone layer and avoid the collapse of the retaining wall, the bottom area of ​​the i-1th sub-silicone layer is larger than the bottom area of ​​the i-th sub-silicone layer, so that after printing the i-th sub-silicone layer, the side view shape (or cross-sectional shape) corresponding to the first i sub-silicone layers is approximately trapezoidal. Here, i is a positive integer, and i is less than or equal to m.

[0110] It should be noted that in order to ensure that the silicone layer can be completely wrapped around the surface of the metal layer in the embodiment of the present application, the bottom shape of each sub-metal layer can be but is not limited to a rectangle, and the bottom shape of each sub-silicone layer can be but is not limited to a U-shaped structure, and the hollow shape in the U-shaped structure is the bottom shape of the sub-metal layer.

[0111] It should be noted that, when calculating the bottom vertex coordinates of the first sub-silicone layer, the bottom vertex coordinates of the retaining wall structure can be used as the bottom vertex coordinates of the first sub-silicone layer, but are not limited to being used.

[0112] Furthermore, after obtaining the bottom vertex coordinates of the i-th sub-silicone layer, the corresponding bottom width can be obtained based on, but not limited to, the vertex coordinates whose ordinates remain consistent with any two, and the inner diameter of the needle corresponding to the second printing nozzle when printing the i-th sub-silicone layer can be converted based on, but not limited to, the bottom width of the i-th sub-silicone layer. In other words, when the second printing nozzle prints the i-th sub-silicone layer, it is necessary to control the inner diameter of the needle to be consistent with the inner diameter of the needle corresponding to the i-th sub-silicone layer, and the inner diameter of the needle corresponding to the i-1 sub-silicone layer is greater than the inner diameter of the needle corresponding to the i-th sub-silicone layer. Of course, in the embodiment of the present application, it can also be ensured that the inner diameter of the needle corresponding to each sub-silicone layer remains consistent, which is not limited to this.

[0113] Furthermore, after obtaining the bottom vertex coordinates of the i-th sub-silicone layer and the corresponding inner diameter of the needle, the initial printing position and the end printing position can be determined based on the bottom vertex coordinates of the i-th sub-silicone layer and the corresponding inner diameter of the needle, but is not limited to, and then the printing path is automatically generated based on the initial printing position and the end printing position. The printing path can be understood as a connecting line from the initial printing position to the end printing position, and there is no intersection in the connecting line. The movement direction of the printing nozzle corresponding to the connecting line includes a direction parallel to the long side of the backlight panel and a direction parallel to the wide side of the backlight panel. Next, the printing time corresponding to each position on the printing path when the second printing nozzle moves along the printing path under the specified printing pressure can be determined based on the printing height of the i-th sub-silicone layer. Then, the printing path corresponding to the i-th sub-silicone layer and the printing time corresponding to each position on the printing path can be used as the printing parameters for the second printing nozzle to print the i-th sub-silicone layer, and the second printing nozzle can be controlled to print the i-th sub-silicone layer according to the printing path corresponding to the i-th sub-silicone layer and the printing time corresponding to each position on the printing path.

[0114] Furthermore, in order to ensure a better light-emitting effect of the retaining wall structure, after determining the printing parameters of the mth sub-silicone layer, the difference between the height of the retaining wall structure and the sum of the heights of the m sub-silicone layers can be used as the printing height of the m+1th sub-silicone layer, but is not limited to. The m+1 sub-silicone layer can be understood as a capping silicone layer to cover the top of the metal layer, and the printing path of the m+1th sub-silicone layer and the printing time corresponding to each position on the printing path can be generated according to the printing height of the m+1th sub-silicone layer, the bottom vertex coordinates of the mth sub-silicone layer and the inner diameter of the needle of the mth sub-silicone layer, so that after controlling the second printing nozzle to complete the printing process of the mth sub-silicone layer, the m+1th sub-silicone layer can be printed according to the printing path of the m+1th sub-silicone layer and the printing time corresponding to each position on the printing path.

[0115] As another optional embodiment of the present application, controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, includes:

[0116] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and printing the nth sub-metal layer according to the printing path of the nth sub-metal layer; wherein n is a positive integer less than or equal to m-1;

[0117] Controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the nth sub-silicone layer, and printing the nth sub-silicone layer according to the printing path of the nth sub-silicone layer;

[0118] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and printing the n+1th sub-metal layer according to the printing path of the n+1th sub-metal layer;

[0119] The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the n+1th sub-silicone layer, and the n+1th sub-silicone layer is printed according to the printing path of the n+1th sub-silicone layer.

[0120] See here Figure 2 A schematic diagram of the printing process of a retaining wall structure of a backlight panel provided by an embodiment of the present application is shown. Specifically, in the process of printing the retaining wall structure, it is possible but not limited to first controlling the inner diameter of the needle of the first printing nozzle to be consistent with the preset inner diameter of the needle, and printing the first sub-metal layer according to the printing path of the first sub-metal layer; then controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the first sub-silicone layer, and printing the first sub-silicone layer according to the printing path of the first sub-silicone layer; then controlling the first printing nozzle to print the second sub-metal layer according to the printing path of the second sub-metal layer; then controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the second sub-silicone layer, and printing the second sub-silicone layer according to the printing path of the second sub-silicone layer; until controlling the first printing nozzle to print the mth sub-metal layer according to the printing path of the mth sub-metal layer; then controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the mth sub-silicone layer, and printing the mth sub-silicone layer according to the printing path of the mth sub-silicone layer. Then, after completing the printing process of the mth sub-metal layer and the sub-silicone layer, it is possible but not limited to controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the n+1th sub-silicone layer, and printing the n+1th sub-silicone layer according to the printing path of the n+1th sub-silicone layer.

[0121] It can be understood that in the embodiment of the present application, when printing the n+1th sub-silicone layer, the inner diameter of the needle of the third printing nozzle can be controlled to be consistent with the inner diameter of the needle corresponding to the m+1th sub-silicone layer, and the m+1th sub-silicone layer can be printed according to the printing path of the m+1th sub-silicone layer to improve the overall efficiency of printing the silicone layer.

[0122] In the embodiment of the present application, to further enhance the reflectivity of the retaining wall structure, nanosilver flakes, a highly reflective material, can be added to the silicone material. Specifically, the silicone layer is printed using a combination of silicone and nanosilver flakes. It is understood that the solid content of the nanosilver flakes in the silicone material can be within a predetermined solid content range, which can be, but is not limited to, 2wt% to 30wt%. Furthermore, when the solid content of the nanosilver flakes is 5wt% to 10wt% of the silicone material, the silicone layer exhibits relatively high reflectivity and brightness.

[0123] See here Figure 3 , Figure 3 FIG. 1 shows a schematic diagram of a retaining wall structure of a backlight panel provided in an embodiment of the present application. Figure 3 As shown, the retaining wall structure includes silica gel 31, silver paste 32 and nano silver flakes 33. The silica gel 31 contains a plurality of nano silver flakes 33, which can effectively improve the reflectivity and brightness of the retaining wall structure and reduce the transmittance, thereby improving the light extraction efficiency of the entire backlight panel. Of course, you can also refer to Figure 4 The schematic diagram of the change curve of adding nano silver flakes provided in the embodiment of the present application is shown. Figure 4 As shown, the upper schematic diagram in the schematic diagram of the change curve shows the brightness comparison curve between the retaining wall structure without adding nanosilver flakes and the retaining wall structure with adding nanosilver flakes. It can be seen that the brightness of the retaining wall structure with adding nanosilver flakes is significantly higher than the brightness of the retaining wall structure without adding nanosilver flakes; the middle schematic diagram in the schematic diagram of the change curve shows the reflectivity comparison curve between the retaining wall structure without adding nanosilver flakes and the retaining wall structure with adding nanosilver flakes. It can be seen that the reflectivity of the retaining wall structure with adding nanosilver flakes is significantly higher than the reflectivity of the retaining wall structure without adding nanosilver flakes; the lower schematic diagram in the schematic diagram of the change curve shows the transmittance comparison curve between the retaining wall structure without adding nanosilver flakes and the retaining wall structure with adding nanosilver flakes. It can be seen that the transmittance of the retaining wall structure with adding nanosilver flakes is significantly lower than the transmittance of the retaining wall structure without adding nanosilver flakes.

[0124] Also see here Figure 5 The schematic diagram of the printing effect of the retaining wall structure of a backlight plate provided by the embodiment of the present application is shown as follows: Figure 5As shown, the upper part shows the retaining wall structure formed in the process of printing the retaining wall structure in the prior art, wherein 51 is the substrate, 52 is the retaining wall structure, 53 is the light-emitting chip, and 54 is the encapsulation glue. The angle between the side of the retaining wall structure and the surface of the substrate is 90 degrees, and the overall center of gravity is high, which makes the retaining wall prone to collapse during the temperature rise and curing process. The lower part shows the retaining wall structure formed in the process of printing the retaining wall structure in the embodiment of the present application, wherein 51 is the substrate, 52 is the retaining wall structure, 53 is the light-emitting chip, and 54 is the encapsulation glue. The angle between the side of the retaining wall structure and the surface of the substrate is greater than 100 degrees. The structure with a metal center can lower the center of gravity of the entire retaining wall, thereby effectively avoiding the collapse of the retaining wall.

[0125] In addition, see Figure 6 The schematic diagram of the light emitting effect of the retaining wall structure of the backlight panel provided by the embodiment of the present application is shown as follows: Figure 6 As shown, 61 is the incident light, 62 is the reflected light, 63 is the transmitted light, 64 is the absorbed light, and 65 is the medium (which can also be understood as a retaining wall structure). It should be noted that when light passes through a certain medium, part of it is reflected, part of it is absorbed, and part of it is emitted through the medium. The light intensity of these three parts compared to the original incident light intensity can be expressed as follows:

[0126] 1 = R% reflectivity + A% absorptivity + T% transmittance

[0127] When the medium is black or gray, the thicker the medium, the smaller the transmittance and the greater the absorptivity.

[0128] In other words, in the technical field corresponding to the embodiments of this application, if the reflectivity of the retaining wall structure is higher, the light emitted from the side of the light-emitting chip will be less lost due to dielectric problems, and the overall light extraction efficiency of the backlight panel will be improved. The retaining wall structure mentioned in the embodiments of this application has an angle between its side and the substrate surface greater than 100 degrees. Compared with the existing retaining wall structure with an angle of 90 degrees, this increases the light reflected upward, the black part is thinner, and the absorption rate is reduced. At the same time, due to the presence of metal silver or copper in the middle, the reflectivity is increased and the transmittance is reduced, thereby improving the overall light extraction efficiency.

[0129] As another optional embodiment of the present application, before controlling the first printing nozzle to print according to the printing parameters of the metal layer and controlling the second printing nozzle to print according to the printing parameters of the silicone layer, the method further includes:

[0130] The first printing nozzle is controlled to move to a preset height, and the second printing nozzle is controlled to move to a preset height.

[0131] Specifically, before controlling the print nozzle to perform printing, you can, but are not limited to, load silver paste or copper paste into the material tube connected to the first print nozzle, load silicone material into the material tube connected to the second print nozzle, and control the first print nozzle and the second print nozzle to automatically descend to a set height, respectively, to ensure that the printed material has a better morphology when attached to the substrate.

[0132] It can be understood that in the process of controlling the printing nozzle to move from the sth retaining wall structure to the s+1th retaining wall structure, the first printing nozzle and the second printing nozzle can be kept moving along the specified path, and the first printing nozzle and the second printing nozzle can be controlled to be in a stopped discharging state until they are in the s+1th retaining wall structure and then restored to the discharging state, so as to effectively save costs and print out effective morphologies.

[0133] As another optional embodiment of the present application, before controlling the first printing nozzle to print according to the printing parameters of the metal layer and controlling the second printing nozzle to print according to the printing parameters of the silicone layer, the method further includes:

[0134] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and controlling the first printing nozzle to move to a designated area for printing;

[0135] The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the first sub-silicone layer, and the second printing nozzle is controlled to move to the designated area for printing.

[0136] Specifically, before controlling the printing nozzle to perform printing, it is also possible but not limited to controlling the first printing nozzle and the second printing nozzle to discharge a certain amount of material in the discharge area so that the subsequently discharged material tends to be in a stable state.

[0137] As another optional embodiment of the present application, after controlling the first printing nozzle to print according to the printing parameters of the metal layer and controlling the second printing nozzle to print according to the printing parameters of the silicone layer, the method further includes:

[0138] Move the backlight plate with the printed retaining wall structure from the suction cup to the designated curing area;

[0139] The backlight panel printed with the retaining wall structure is cured in the designated curing area.

[0140] See here Figure 7 The schematic diagram of the curing heating effect of an existing backlight panel retaining wall structure provided by the embodiment of the present application is shown. Direct-write printing materials are mostly materials that require post-curing treatment, and the curing methods are mostly heat curing or light curing, among which heat curing is the main curing method for the backlight panel retaining wall material. Figure 7As shown, in the existing solution, after the retaining wall structure is heated and cured, one side of the retaining wall is very close to the light-emitting chip, while the other side does not have a light-emitting chip. During heating, the two sides of the retaining wall are heated unevenly. This uneven heating of the two sides of the retaining wall leads to inconsistent viscosity changes on both sides of the retaining wall, and the retaining wall collapses. However, in the embodiments of the present application, the angle between the side of the retaining wall structure and the substrate surface is greater than 100 degrees. Combined with the metal structure in the center, the center of gravity of the entire retaining wall is lowered, thereby effectively preventing the retaining wall collapse.

[0141] In the embodiment of the present application, the metal layer in the retaining wall structure can be but is not limited to metallic silver or metallic copper. Among them, metallic silver has good ductility and a certain strength. As a filling layer in the new retaining wall structure, it can reduce the generation of air holes during the vacuum adsorption of the black film in the subsequent process, and also increase the mechanical strength of one side of the panel light board to prevent the LED light-emitting chip from falling off after accidental impact, resulting in bad pixels on the screen.

[0142] In addition, an embodiment of the present application also provides a retaining wall structure of a backlight panel, comprising a backlight panel and at least two retaining wall structures arranged on the substrate of the backlight panel; at least two light-emitting units are arranged on the backlight panel, each light-emitting unit includes at least one light-emitting chip, each retaining wall structure is arranged between any two adjacent light-emitting units, and the distance between each retaining wall structure and the two adjacent light-emitting units remains consistent; each retaining wall structure includes a metal layer and a silicone layer, the silicone layer is completely wrapped around the surface of the metal layer, and the angle between the side of the silicone layer and the surface of the substrate of the backlight panel is greater than 100 degrees.

[0143] See also Figure 8 , Figure 8 A schematic structural diagram of a backlight panel retaining wall structure printing device provided in an embodiment of the present application is shown.

[0144] like Figure 8 As shown, the backlight panel retaining wall structure printing device may include at least a unit determination module 801, a parameter determination module 802, and a retaining wall printing module 803, wherein:

[0145] The unit determination module 801 is used to obtain the specification parameters of the light-emitting chip on the backlight panel and determine at least two light-emitting units according to the specification parameters of the light-emitting chip; wherein the light-emitting unit includes at least one light-emitting chip;

[0146] A parameter determination module 802 is configured to determine size parameters of at least two retaining wall structures based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip;

[0147] The retaining wall printing module 803 is used to calculate the printing parameters of the metal layer and the printing parameters of the silicone layer according to the dimensional parameters of each retaining wall structure, and control the first printing nozzle to perform printing according to the printing parameters of the metal layer, and control the second printing nozzle to perform printing according to the printing parameters of the silicone layer; wherein, the retaining wall structure includes a metal layer and a silicone layer, the silicone layer is completely wrapped around the surface of the metal layer, and the inner diameter of the needle of the first printing nozzle is different from the inner diameter of the needle of the second printing nozzle.

[0148] In some possible embodiments, before obtaining the specification parameters of the light-emitting chip on the backlight panel, the method further includes:

[0149] The backlight plate is fixed on the suction cup, and at least two marking points on the substrate surface of the backlight plate are identified based on the top camera;

[0150] Determining whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to the movement direction of the first printing nozzle, or the calibration line corresponds to the movement direction of the second printing nozzle;

[0151] When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line;

[0152] Obtain the specifications of the light-emitting chip on the backlight panel, including:

[0153] When it is detected that the connecting line is parallel to the calibration line, the specification parameters of the light-emitting chip on the backlight panel are obtained.

[0154] In some possible embodiments, the specification parameters of the light emitting chip include light emitting color;

[0155] Determining at least two light-emitting units according to the specification parameters of the light-emitting chip includes:

[0156] When it is detected that the light emitting colors of at least two light emitting chips are inconsistent, a set of light emitting chips with inconsistent light emitting colors is used as a light emitting unit; or

[0157] When it is detected that the light-emitting colors of each light-emitting chip are consistent, each light-emitting chip is regarded as a light-emitting unit.

[0158] In some possible embodiments, the specification parameters of the light emitting chip also include length and height;

[0159] Based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip, the size parameters of at least two retaining wall structures are determined, including:

[0160] Based on the distance between any two adjacent light-emitting units and a preset minimum width, the bottom width of each retaining wall structure is determined; wherein the distance between each retaining wall structure and two adjacent light-emitting units remains consistent;

[0161] Based on the length of the light-emitting chip and a preset first ratio, the bottom length of each retaining wall structure is calculated, and the coordinates of the bottom vertex of each retaining wall structure are converted according to the coordinates of the marking point on the backlight panel, the bottom width of the retaining wall structure, and the bottom length of the retaining wall structure; wherein the bottom length of the retaining wall structure is greater than the length of the light-emitting chip;

[0162] Based on the height of the light-emitting chip and the preset second ratio, the height of each retaining wall structure is calculated, and the height and bottom vertex coordinates of each retaining wall structure are used as size parameters.

[0163] In some possible embodiments, the printing parameters of the metal layer and the printing parameters of the silicone layer are calculated based on the size parameters of each retaining wall structure, including:

[0164] Determining the printing heights of m sub-metal layers according to the height of the light-emitting chip; wherein the printing height of each sub-metal layer remains consistent, the sum of the printing heights of all sub-metal layers remains consistent with the height of the light-emitting chip, and m is a positive integer greater than 2;

[0165] The bottom vertex coordinates of each sub-metal layer are converted based on the bottom vertex coordinates of each retaining wall structure, and a printing path corresponding to each sub-metal layer is generated based on the printing height, bottom vertex coordinates, and the preset needle inner diameter of each sub-metal layer; wherein the bottom vertex coordinates of each sub-metal layer remain consistent;

[0166] The printing path corresponding to each sub-metal layer and the preset needle inner diameter are used as the printing parameters of the metal layer;

[0167] The printing parameters of the silicone layer are determined according to the height of each retaining wall structure, the coordinates of the bottom vertex of each retaining wall structure, the printing height of each sub-metal layer, and the coordinates of the bottom vertex of each sub-metal layer.

[0168] In some possible embodiments, the printing parameters of the silicone layer are determined based on the height of each retaining wall structure, the coordinates of the bottom vertex of each retaining wall structure, the printing height of each sub-metal layer, and the coordinates of the bottom vertex of each sub-metal layer, including:

[0169] Determining the printing heights of the m sub-silicone layers based on the printing heights of the m sub-metal layers; wherein the printing height of each sub-metal layer is consistent with the printing height of each sub-silicone layer;

[0170] Calculate the bottom vertex coordinates and corresponding bottom width of the i-th sub-silicone layer based on the bottom vertex coordinates of the i-1th sub-silicone layer and a preset third ratio; wherein the bottom vertex coordinates of the first sub-silicone layer are determined based on the bottom vertex coordinates of the retaining wall structure and the bottom vertex coordinates of the sub-metal layer, where i is a positive integer greater than 1 and less than or equal to m;

[0171] The corresponding needle inner diameter is calculated according to the bottom width of the i-th sub-silicone layer, and the printing path corresponding to the i-th sub-silicone layer is generated according to the printing height, bottom vertex coordinates and needle inner diameter of the i-th sub-silicone layer;

[0172] The printing height of the m+1th sub-silicone layer is calculated based on the height of each retaining wall structure and the printing height of the m sub-silicone layers. The printing path of the m+1th sub-silicone layer is generated based on the printing height of the m+1th sub-silicone layer, the coordinates of the bottom vertex of the mth sub-silicone layer, and the inner diameter of the needle of the mth sub-silicone layer.

[0173] The printing paths of the m+1 sub-silicone layers are used as the printing parameters of the silicone layer.

[0174] In some possible embodiments, controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, includes:

[0175] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and printing the nth sub-metal layer according to the printing path of the nth sub-metal layer; wherein n is a positive integer less than or equal to m-1;

[0176] Controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the nth sub-silicone layer, and printing the nth sub-silicone layer according to the printing path of the nth sub-silicone layer;

[0177] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and printing the n+1th sub-metal layer according to the printing path of the n+1th sub-metal layer;

[0178] The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the n+1th sub-silicone layer, and the n+1th sub-silicone layer is printed according to the printing path of the n+1th sub-silicone layer.

[0179] In some possible embodiments, controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, further includes:

[0180] When n+1 is equal to m, the inner diameter of the needle of the third printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the m+1th sub-silicone layer, and the m+1th sub-silicone layer is printed according to the printing path of the m+1th sub-silicone layer.

[0181] In some possible embodiments, before controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0182] The first printing nozzle is controlled to move to a preset height, and the second printing nozzle is controlled to move to a preset height.

[0183] In some possible embodiments, before controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0184] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and controlling the first printing nozzle to move to a designated area for printing;

[0185] The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the first sub-silicone layer, and the second printing nozzle is controlled to move to the designated area for printing.

[0186] In some possible embodiments, after controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0187] Move the backlight plate with the printed retaining wall structure from the suction cup to the designated curing area;

[0188] The backlight panel printed with the retaining wall structure is cured in the designated curing area.

[0189] See also Figure 9 , Figure 9 A schematic structural diagram of another backlight panel retaining wall structure printing device provided in an embodiment of the present application is shown.

[0190] like Figure 9 As shown, the backlight panel retaining wall structure printing device 900 may include: at least one processor 901 , at least one network interface 904 , a user interface 903 , a memory 905 and at least one communication bus 902 .

[0191] The communication bus 902 may be used to implement connection and communication among the above components.

[0192] The user interface 903 may include buttons, and the optional user interface may also include a standard wired interface or a wireless interface.

[0193] The network interface 904 may include, but is not limited to, a Bluetooth module, an NFC module, a Wi-Fi module, and the like.

[0194] Among them, the processor 901 may include one or more processing cores. The processor 901 uses various interfaces and lines to connect the various parts of the backlight panel retaining wall structure printing device 900, and executes various functions and processes data of the routing backlight panel retaining wall structure printing device 900 by running or executing instructions, programs, code sets or instruction sets stored in the memory 905, and calling data stored in the memory 905. Optionally, the processor 901 can be implemented in at least one hardware form of DSP, FPGA, and PLA. The processor 901 can integrate one or a combination of CPU, GPU, modem, etc. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; and the modem is used to handle wireless communications. It is understandable that the above-mentioned modem may not be integrated into the processor 901, but may be implemented separately through a chip.

[0195] Among them, the memory 905 may include RAM and may also include ROM. Optionally, the memory 905 includes a non-transitory computer-readable medium. The memory 905 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 905 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 905 may also be optionally at least one storage device located away from the aforementioned processor 901. As Figure 9 As shown, the memory 905 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a backlight panel retaining wall structure printing application.

[0196] Specifically, the processor 901 may be configured to call the backlight panel retaining wall structure printing application stored in the memory 905 and specifically perform the following operations:

[0197] Obtaining specification parameters of a light-emitting chip on the backlight panel, and determining at least two light-emitting units according to the specification parameters of the light-emitting chip; wherein the light-emitting unit includes at least one light-emitting chip;

[0198] Determining size parameters of at least two retaining wall structures based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip;

[0199] The printing parameters of the metal layer and the printing parameters of the silicone layer are calculated respectively according to the size parameters of each retaining wall structure, and the first printing nozzle is controlled to perform printing according to the printing parameters of the metal layer, and the second printing nozzle is controlled to perform printing according to the printing parameters of the silicone layer; wherein, the retaining wall structure includes a metal layer and a silicone layer, the silicone layer is completely wrapped around the surface of the metal layer, and the inner diameter of the needle of the first printing nozzle is different from the inner diameter of the needle of the second printing nozzle.

[0200] In some possible embodiments, before obtaining the specification parameters of the light-emitting chip on the backlight panel, the method further includes:

[0201] The backlight plate is fixed on the suction cup, and at least two marking points on the substrate surface of the backlight plate are identified based on the top camera;

[0202] Determining whether a line formed by any two adjacent marking points is parallel to a calibration line; wherein the calibration line corresponds to the movement direction of the first printing nozzle, or the calibration line corresponds to the movement direction of the second printing nozzle;

[0203] When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line;

[0204] Obtain the specifications of the light-emitting chip on the backlight panel, including:

[0205] When it is detected that the connecting line is parallel to the calibration line, the specification parameters of the light-emitting chip on the backlight panel are obtained.

[0206] In some possible embodiments, the specification parameters of the light emitting chip include light emitting color;

[0207] Determining at least two light-emitting units according to the specification parameters of the light-emitting chip includes:

[0208] When it is detected that the light emitting colors of at least two light emitting chips are inconsistent, a set of light emitting chips with inconsistent light emitting colors is used as a light emitting unit; or

[0209] When it is detected that the light-emitting colors of each light-emitting chip are consistent, each light-emitting chip is regarded as a light-emitting unit.

[0210] In some possible embodiments, the specification parameters of the light emitting chip also include length and height;

[0211] Based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip, the size parameters of at least two retaining wall structures are determined, including:

[0212] Based on the distance between any two adjacent light-emitting units and a preset minimum width, the bottom width of each retaining wall structure is determined; wherein the distance between each retaining wall structure and two adjacent light-emitting units remains consistent;

[0213] Based on the length of the light-emitting chip and a preset first ratio, the bottom length of each retaining wall structure is calculated, and the coordinates of the bottom vertex of each retaining wall structure are converted according to the coordinates of the marking point on the backlight panel, the bottom width of the retaining wall structure, and the bottom length of the retaining wall structure; wherein the bottom length of the retaining wall structure is greater than the length of the light-emitting chip;

[0214] Based on the height of the light-emitting chip and the preset second ratio, the height of each retaining wall structure is calculated, and the height and bottom vertex coordinates of each retaining wall structure are used as size parameters.

[0215] In some possible embodiments, the printing parameters of the metal layer and the printing parameters of the silicone layer are calculated based on the size parameters of each retaining wall structure, including:

[0216] Determining the printing heights of m sub-metal layers according to the height of the light-emitting chip; wherein the printing height of each sub-metal layer remains consistent, the sum of the printing heights of all sub-metal layers remains consistent with the height of the light-emitting chip, and m is a positive integer greater than 2;

[0217] The bottom vertex coordinates of each sub-metal layer are converted based on the bottom vertex coordinates of each retaining wall structure, and a printing path corresponding to each sub-metal layer is generated based on the printing height, bottom vertex coordinates, and the preset needle inner diameter of each sub-metal layer; wherein the bottom vertex coordinates of each sub-metal layer remain consistent;

[0218] The printing path corresponding to each sub-metal layer and the preset needle inner diameter are used as the printing parameters of the metal layer;

[0219] The printing parameters of the silicone layer are determined according to the height of each retaining wall structure, the coordinates of the bottom vertex of each retaining wall structure, the printing height of each sub-metal layer, and the coordinates of the bottom vertex of each sub-metal layer.

[0220] In some possible embodiments, the printing parameters of the silicone layer are determined based on the height of each retaining wall structure, the coordinates of the bottom vertex of each retaining wall structure, the printing height of each sub-metal layer, and the coordinates of the bottom vertex of each sub-metal layer, including:

[0221] Determining the printing heights of the m sub-silicone layers based on the printing heights of the m sub-metal layers; wherein the printing height of each sub-metal layer is consistent with the printing height of each sub-silicone layer;

[0222] Calculate the bottom vertex coordinates and corresponding bottom width of the i-th sub-silicone layer based on the bottom vertex coordinates of the i-1th sub-silicone layer and a preset third ratio; wherein the bottom vertex coordinates of the first sub-silicone layer are determined based on the bottom vertex coordinates of the retaining wall structure and the bottom vertex coordinates of the sub-metal layer, where i is a positive integer greater than 1 and less than or equal to m;

[0223] The corresponding needle inner diameter is calculated according to the bottom width of the i-th sub-silicone layer, and the printing path corresponding to the i-th sub-silicone layer is generated according to the printing height, bottom vertex coordinates and needle inner diameter of the i-th sub-silicone layer;

[0224] The printing height of the m+1th sub-silicone layer is calculated based on the height of each retaining wall structure and the printing height of the m sub-silicone layers. The printing path of the m+1th sub-silicone layer is generated based on the printing height of the m+1th sub-silicone layer, the coordinates of the bottom vertex of the mth sub-silicone layer, and the inner diameter of the needle of the mth sub-silicone layer.

[0225] The printing paths of the m+1 sub-silicone layers are used as the printing parameters of the silicone layer.

[0226] In some possible embodiments, controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, includes:

[0227] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and printing the nth sub-metal layer according to the printing path of the nth sub-metal layer; wherein n is a positive integer less than or equal to m-1;

[0228] Controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the nth sub-silicone layer, and printing the nth sub-silicone layer according to the printing path of the nth sub-silicone layer;

[0229] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and printing the n+1th sub-metal layer according to the printing path of the n+1th sub-metal layer;

[0230] The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the n+1th sub-silicone layer, and the n+1th sub-silicone layer is printed according to the printing path of the n+1th sub-silicone layer.

[0231] In some possible embodiments, controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, further includes:

[0232] When n+1 is equal to m, the inner diameter of the needle of the third printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the m+1th sub-silicone layer, and the m+1th sub-silicone layer is printed according to the printing path of the m+1th sub-silicone layer.

[0233] In some possible embodiments, before controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0234] The first printing nozzle is controlled to move to a preset height, and the second printing nozzle is controlled to move to a preset height.

[0235] In some possible embodiments, before controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0236] Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and controlling the first printing nozzle to move to a designated area for printing;

[0237] The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the first sub-silicone layer, and the second printing nozzle is controlled to move to the designated area for printing.

[0238] In some possible embodiments, after controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes:

[0239] Move the backlight plate with the printed retaining wall structure from the suction cup to the designated curing area;

[0240] The backlight panel printed with the retaining wall structure is cured in the designated curing area.

Claims

1. A method for printing a retaining wall structure of a backlight plate, characterized in that: include: Obtaining specification parameters of a light-emitting chip on a backlight panel, and determining at least two light-emitting units according to the specification parameters of the light-emitting chip; wherein the light-emitting unit includes at least one light-emitting chip; Determining size parameters of at least two retaining wall structures based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip; The printing parameters of the metal layer and the printing parameters of the silicone layer are calculated respectively according to the size parameters of each retaining wall structure, and the first printing nozzle is controlled to perform printing according to the printing parameters of the metal layer, and the second printing nozzle is controlled to perform printing according to the printing parameters of the silicone layer; wherein, the retaining wall structure includes a metal layer and a silicone layer, the silicone layer is completely wrapped around the surface of the metal layer, the inner diameter of the needle of the first printing nozzle is different from the inner diameter of the needle of the second printing nozzle; the silicone layer is divided into multiple sub-silicone layers, and the bottom area of ​​each sub-silicone layer is smaller than the bottom area of ​​the previous sub-silicone layer, so that the side view of the silicone layer is close to a trapezoidal shape, thereby lowering the center of gravity of the retaining wall structure.

2. The method according to claim 1, characterized in that Before obtaining the specification parameters of the light-emitting chip on the backlight panel, the method further includes: Fixing the backlight plate on the suction cup, and identifying at least two marking points on the substrate surface of the backlight plate based on the top camera; Determining whether a line formed by any two adjacent marking points is parallel to a calibration line, wherein the calibration line corresponds to a moving direction of the first printing nozzle, or the calibration line corresponds to a moving direction of the second printing nozzle; When it is detected that the connecting line is not parallel to the calibration line, the suction cup is rotated based on the angle between the connecting line and the calibration line until the connecting line is parallel to the calibration line; The obtaining of the specification parameters of the light-emitting chip on the backlight panel includes: When it is detected that the connecting line is parallel to the calibration line, the specification parameters of the light-emitting chip on the backlight panel are obtained.

3. The method according to claim 1, characterized in that The specification parameters of the light-emitting chip include light-emitting color; The step of determining at least two light-emitting units according to the specification parameters of the light-emitting chip includes: When it is detected that the light emitting colors of at least two of the light emitting chips are inconsistent, a set of the light emitting chips with inconsistent light emitting colors is used as a light emitting unit; or When it is detected that the light-emitting colors of each of the light-emitting chips are consistent, each of the light-emitting chips is used as a light-emitting unit.

4. The method according to claim 2, characterized in that The specification parameters of the light emitting chip also include length and height; The determining of the size parameters of at least two retaining wall structures based on the distance between any two adjacent light-emitting units and the specification parameters of the light-emitting chip includes: Based on the distance between any two adjacent light-emitting units and a preset minimum width, the bottom width of each retaining wall structure is determined; wherein the distance between each retaining wall structure and two adjacent light-emitting units remains consistent; Based on the length of the light-emitting chip and a preset first ratio, the bottom length of each retaining wall structure is calculated, and the bottom vertex coordinates of each retaining wall structure are converted according to the coordinates of the marking point on the backlight panel, the bottom width of the retaining wall structure, and the bottom length of the retaining wall structure; wherein the bottom length of the retaining wall structure is greater than the length of the light-emitting chip; Based on the height of the light-emitting chip and the preset second ratio, the height of each retaining wall structure is calculated, and the height and bottom vertex coordinates of each retaining wall structure are used as size parameters.

5. The method according to claim 4, characterized in that The method of calculating the printing parameters of the metal layer and the printing parameters of the silicone layer according to the size parameters of each retaining wall structure includes: Determining the printing heights of m sub-metal layers according to the height of the light-emitting chip; wherein the printing height of each sub-metal layer remains consistent, the sum of the printing heights of all the sub-metal layers is greater than or equal to the height of the light-emitting chip, and m is a positive integer greater than 2; The bottom vertex coordinates of each sub-metal layer are converted according to the bottom vertex coordinates of each retaining wall structure, and a printing path corresponding to each sub-metal layer is generated according to the printing height, bottom vertex coordinates, and a preset needle inner diameter of each sub-metal layer; wherein the bottom vertex coordinates of each sub-metal layer remain consistent; Using the printing path corresponding to each of the sub-metal layers and the preset needle inner diameter as printing parameters for the metal layer; The printing parameters of the silicone layer are determined according to the height of each retaining wall structure, the coordinates of the bottom vertex of each retaining wall structure, the printing height of each sub-metal layer, and the coordinates of the bottom vertex of each sub-metal layer.

6. The method according to claim 5, characterized in that Determining the printing parameters of the silicone layer according to the height of each retaining wall structure, the bottom vertex coordinates of each retaining wall structure, the printing height of each sub-metal layer, and the bottom vertex coordinates of each sub-metal layer includes: Determining the printing heights of the m sub-silicone layers according to the printing heights of the m sub-metal layers; wherein the printing height of each sub-metal layer is consistent with the printing height of each sub-silicone layer; Calculate the bottom vertex coordinates and corresponding bottom width of the i-th sub-silicone layer based on the bottom vertex coordinates of the i-1th sub-silicone layer and a preset third ratio; wherein the bottom vertex coordinates of the first sub-silicone layer are determined based on the bottom vertex coordinates of the retaining wall structure and the bottom vertex coordinates of the sub-metal layer, and i is a positive integer greater than 1 and less than or equal to m; Calculate the corresponding needle inner diameter according to the bottom width of the i-th sub-silicone layer, and generate a printing path corresponding to the i-th sub-silicone layer according to the printing height, bottom vertex coordinates and needle inner diameter of the i-th sub-silicone layer; Calculate the printing height of the m+1th sub-silicone layer based on the height of each retaining wall structure and the printing height of the m sub-silicone layers, and generate a printing path for the m+1th sub-silicone layer based on the printing height of the m+1th sub-silicone layer, the coordinates of the bottom vertex of the mth sub-silicone layer, and the inner diameter of the needle of the mth sub-silicone layer; The printing paths of the m+1 sub-silicone layers are used as the printing parameters of the silicone layer.

7. The method according to claim 6, characterized in that The controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and the controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, include: Controlling the inner diameter of the needle of the first printing nozzle to be consistent with the preset inner diameter of the needle, and printing the nth sub-metal layer according to the printing path of the nth sub-metal layer; wherein n is a positive integer less than or equal to m-1; Controlling the inner diameter of the needle of the second printing nozzle to be consistent with the inner diameter of the needle corresponding to the nth sub-silicone layer, and printing the nth sub-silicone layer according to the printing path of the nth sub-silicone layer; Controlling the inner diameter of the needle of the first printing nozzle to be consistent with the preset inner diameter of the needle, and printing the n+1th sub-metal layer according to the printing path of the n+1th sub-metal layer; The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the n+1th sub-silicone layer, and the n+1th sub-silicone layer is printed according to the printing path of the n+1th sub-silicone layer.

8. The method according to claim 7, characterized in that The controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer, and the controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, further includes: When n+1 is equal to m, the inner diameter of the needle of the third printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the m+1th sub-silicone layer, and the m+1th sub-silicone layer is printed according to the printing path of the m+1th sub-silicone layer.

9. The method according to claim 1, characterized in that Before controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes: The first printing nozzle is controlled to move to a preset height, and the second printing nozzle is controlled to move to the preset height.

10. The method according to claim 7, characterized in that Before controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes: Controlling the inner diameter of the needle of the first printing nozzle to be consistent with a preset inner diameter of the needle, and controlling the first printing nozzle to move to a designated area for printing; The inner diameter of the needle of the second printing nozzle is controlled to be consistent with the inner diameter of the needle corresponding to the first sub-silicone layer, and the second printing nozzle is controlled to move to the designated area for printing.

11. The method according to claim 2, characterized in that After controlling the first printing nozzle to perform printing according to the printing parameters of the metal layer and controlling the second printing nozzle to perform printing according to the printing parameters of the silicone layer, the method further includes: Moving the backlight panel printed with the retaining wall structure from the suction cup to a designated curing area; The backlight panel printed with the retaining wall structure is cured in the designated curing area.

12. A backlight panel retaining wall structure printing device, characterized in that: include: a unit determination module, configured to obtain specification parameters of a light-emitting chip on a backlight panel and determine at least two light-emitting units according to the specification parameters of the light-emitting chip; wherein the light-emitting unit includes at least one light-emitting chip; a parameter determination module, configured to determine size parameters of at least two retaining wall structures based on a distance between any two adjacent light-emitting units and specification parameters of the light-emitting chip; A retaining wall printing module is used to calculate the printing parameters of the metal layer and the printing parameters of the silicone layer according to the dimensional parameters of each retaining wall structure, and control the first printing nozzle to perform printing according to the printing parameters of the metal layer, and control the second printing nozzle to perform printing according to the printing parameters of the silicone layer; wherein the retaining wall structure includes a metal layer and a silicone layer, the silicone layer is completely wrapped around the surface of the metal layer, the inner diameter of the needle of the first printing nozzle is different from the inner diameter of the needle of the second printing nozzle; the silicone layer is divided into multiple sub-silicone layers, and the bottom area of ​​each sub-silicone layer is smaller than the bottom area of ​​the previous sub-silicone layer, so that the side view of the silicone layer is close to a trapezoidal shape, thereby lowering the center of gravity of the retaining wall structure.

13. A retaining wall structure of a backlight panel, characterized in that: It includes a backlight panel and at least two retaining wall structures arranged on a substrate of the backlight panel; At least two light-emitting units are provided on the backlight panel, each of the light-emitting units includes at least one light-emitting chip, each of the retaining wall structures is provided between any two adjacent light-emitting units, and the distance between each retaining wall structure and the two adjacent light-emitting units remains consistent; Each of the retaining wall structures includes a metal layer and a silicone layer, the silicone layer is completely wrapped around the surface of the metal layer, the angle between the side of the silicone layer and the substrate surface of the backlight panel is greater than 100 degrees, and the silicone layer is divided into multiple sub-silicone layers, and the bottom area of ​​each sub-silicone layer is smaller than the bottom area of ​​the previous sub-silicone layer, so that the side view of the silicone layer is close to a trapezoidal shape, thereby lowering the center of gravity of the retaining wall structure.

14. The structure according to claim 13, characterized in that The silica gel layer contains nano silver sheets with a solid content within a preset solid content range to enhance the reflectivity of the silica gel layer.

Images