Wafer appearance automatic detection device

Abstract

The application provides a wafer appearance automatic detection device, which comprises a detection base, a rotating unit, a detection unit, a control track, a control assembly and the like. The detection unit can detect the thickness and scratches on the surface of the wafer. The control assembly is arranged to control the wafer to be turned over by 180 degrees during the detection process, so that the back of the wafer can be detected, and the continuous detection process is realized. The scratches and thickness of the two surfaces of the wafer can be detected at one time, and the wafer detection efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer detection, in particular to a wafer appearance automatic detection device. BACKGROUND

[0002] According to the application scene in the wafer factory, the silicon wafer can be divided into a normal wafer and a control wafer and a blocking wafer, the normal wafer is directly used for semiconductor processing, and the control wafer and the blocking wafer are mainly used for monitoring and testing the silicon wafer.

[0003] The main function of the blocking wafer is to maintain the stability of the machine, the main application scene is used for the chemical and physical reaction stage of the normal wafer, the blocking wafer is used to isolate the place with poor process conditions and fill the position left by the insufficient product, so that the reaction gas and the processed silicon wafer are uniformly contacted and uniformly heated, and a high-quality thin film is deposited or grown, and the blocking wafer is needed for each process to pursue normal product, resulting in a large amount of blocking wafer, and the demand is expanding with the process.

[0004] The source of the blocking wafer is mainly a new wafer and a regenerated wafer, wafer regeneration is to recycle the used blocking wafer or control wafer, and the oxide film, metal particle residues and the like generated on the surface of the blocking wafer and the control wafer due to testing are removed through chemical soaking, physical grinding and other treatment methods, so that they can have the functions of testing and stabilizing the stability of the machine.

[0005] Because the application scene of the blocking wafer is complex, the characteristics of some blocking wafers cannot meet the requirements, so the appearance and characteristics of the blocking wafer need to be inspected and measured before wafer regeneration, and the existing measurement and inspection process has the following problems, (1) appearance inspection, the appearance state of the surface is completely manually inspected by personnel, there are mistakes, omissions and inaccurate judgments, the detection consistency is poor, (2) after the appearance inspection is finished, the product still needs to be sent to the measurement machine for testing the thickness and other characteristics, the appearance inspection and the characteristic measurement are divided into two processes, which not only has low work efficiency, but also is easy to break and has large and complex work load. SUMMARY

[0006] In view of the above problems, the present application provides a wafer appearance automatic detection device, which can detect the scratches and thickness of the two sides of the wafer at one time, and improves the wafer detection efficiency.

[0007] To solve the above problems, the technical scheme adopted by the present application is:

[0008] A wafer appearance automatic detection device, comprising:

[0009] a detection base,

[0010] a rotating unit installed on the upper end of the detection base, used for limiting the wafer and controlling the wafer to rotate around its own axis on the horizontal plane;

[0011] a detection unit arranged on the upper end of the rotating unit and facing the wafer;

[0012] a control track comprising a plurality of guide rods, the guide rods forming a driving track therebetween, the driving track comprising a staggered track and a turnover track arranged in sequence from top to bottom, the staggered track being arranged vertically, and the turnover track being arranged obliquely towards the outside;

[0013] a control assembly comprising a control body and a control end, the control body being arranged in the driving track and being capable of moving linearly along the staggered track and the turnover track, wherein the control assembly moves into the staggered track, and the control body and the control end are staggered to control the turnover of the wafer.

[0014] Preferably, the rotating unit comprises two groups of symmetrically arranged rotating assemblies, the two groups of rotating assemblies having a spacing therebetween, the rotating assembly comprising a rotating mounting frame, and rotating control wheels being rotatably connected to both sides of the rotating mounting frame.

[0015] Preferably, the control assembly comprises a sliding control cylinder, the outer wall of the sliding control cylinder being fixedly connected with a driving control rod arranged in the driving track, the sliding control cylinder being internally provided with a rotating control cylinder capable of sliding thereagainst, the outer wall of the rotating control cylinder being provided with a control protrusion, the inner wall of the sliding control cylinder being provided with an arc-shaped control groove matched with the control protrusion, the side wall of the rotating unit being fixedly connected with a positioning frame, and the end of the rotating control cylinder being coupled with the positioning frame through a one-way rotating element.

[0016] Preferably, the inner wall of the rotating control cylinder is slidably connected with a tensioning control rod, the tensioning control rod and the rotating control cylinder being elastically connected through an elastic element, and a tensioning assembly being arranged between the control track and the tensioning control rod.

[0017] Preferably, the tensioning assembly comprises a tensioning control disc, the surface of the control track being fixedly connected with a tensioning control wheel matched with the tensioning control disc, and the upper end of the staggered track being communicated with a passing track for the driving control rod to pass through.

[0018] Preferably, the detection unit comprises an L-shaped detection mounting frame, the inner wall of the detection mounting frame being mounted with a detection element, the outer wall of the detection mounting frame being fixedly connected with a limiting block, and the side wall of the limiting block being provided with a limiting hole for inserting a limiting rod.

[0019] Preferably, the detection device further comprises a driving device, wherein the control assembly is driven to move linearly along the control track by the driving device.

[0020] Preferably, the driving device comprises two steering wheels located on both sides of the control track, a driving wheel is mounted on the side wall of the control track, a driving rope is wound on the surface of the driving wheel, and the two ends of the driving rope are wound around the steering wheels and fixedly connected with both sides of the control assembly.

[0021] The beneficial effects of the present application are:

[0022] Through the cooperation of the control track and the control assembly, the wafer can be rotated to realize automatic overturning of the wafer through the detection unit, continuous detection of the two side surfaces of the wafer, and one-time detection of the two side surfaces and thickness of the wafer, thereby greatly improving the efficiency of wafer detection; through the tensioning assembly and the track, the positions of the two rotating assemblies can be automatically controlled to be staggered by a predetermined distance, thereby canceling the limiting of the wafer, cooperating with the mechanical hand, and realizing continuous feeding and discharging of the wafer. The overall device detection process is an automatic continuous process, and the detection efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a three-dimensional structural schematic diagram of the present application;

[0024] Figure 2 It is a front view structural schematic diagram of the present application;

[0025] Figure 3 It is a top view structural schematic diagram of the present application;

[0026] Figure 4 It is a side view structural schematic diagram of the present application;

[0027] Figure 5 It is an enlarged structural schematic diagram of A of the present application;

[0028] Figure 6 It is an exploded structural schematic diagram of the control assembly of the present application.

[0029] In the figure: 100, wafer; 200, detection unit; 210, detection mounting frame; 220, limiting block; 221, limiting hole; 300, detection base; 400, control track; 410, guide rod; 420, driving track; 421, through track; 422, staggered track; 423, overturning track; 500, driving device; 510, steering wheel; 520, driving wheel; 530, driving rope; 600, control assembly; 610, positioning frame; 620, one-way rotating element; 630, tensioning control rod; 640, elastic element; 650, rotating control cylinder; 651, control protrusion; 660, sliding control cylinder; 661, arc-shaped control groove; 662, driving control rod; 700, tensioning assembly; 710, tensioning control disc; 720, tensioning control wheel; 800, rotating unit; 810, rotating assembly; 811, rotating mounting frame; 812, rotating control wheel. Embodiments

[0030] The application is further illustrated below in conjunction with the accompanying drawings and embodiments.

[0031] With reference to Figures 1-6 A wafer appearance automatic detection device comprises a detection base 300, a rotating unit 800, a detection unit 200, a control track 400, a control assembly 600 and the like components. The detection unit 200 can detect the thickness and scratches on the surface of the wafer 100. The control assembly 600 can control the wafer 100 to flip 180° during the detection process to detect the back surface of the wafer 100, thereby realizing a continuous detection process.

[0032] The detection base 300 is concave at the middle position and has a U-shaped overall cross section, which can allow the wafer 100 to pass through and flip.

[0033] The rotating unit 800 is installed on the upper end of the detection base 300 and is used to limit the wafer 100 and control the wafer 100 to rotate around its own axis on the horizontal plane. The detection unit 200 is in a constant position, and the wafer 100 is rotated to pass through the side of the detection unit 200, thereby realizing continuous detection of the surface of the detection unit 200.

[0034] The detection unit 200 is arranged on the upper end of the rotating unit 800 and faces the wafer 100. The detection unit 200 can perform imaging analysis on the surface of the detection unit 200 and can perform camera shooting processing on the surface of the wafer 100 to detect the scratches and thickness of the wafer 100 through camera shooting, so as to judge the good product of the wafer 100 and realize an automatic detection process.

[0035] The control track 400 comprises a plurality of guide rods 410, and a driving track 420 is formed between two adjacent guide rods 410. The driving track 420 comprises a staggered track 422 and a flipping track 423 arranged in sequence from top to bottom. The staggered track 422 is vertically arranged, and the flipping track 423 is arranged obliquely towards the outside.

[0036] The control assembly 600 comprises a control body and a control end, the control body is arranged in the driving track 420 and can move linearly along the staggered track 422 and the overturning track 423, wherein the control assembly 600 moves into the staggered track 422, the control body and the control end are staggered to control the wafer 100 to overturn, the control assembly 600 can move along the driving track 420, the control assembly 600 moves in the staggered track 422, the wafer 100 can be moved downward and staggered with the detection unit 200 at the upper end, when the control assembly 600 moves into the overturning track 423, since the overturning track 423 is arranged to be inclined outward, the control assembly 600 can drive the wafer 100 to overturn 180°, so as to control the wafer 100 to overturn and realize the detection of the other side of the wafer 100.

[0037] Specifically refer to the accompanying drawings Figure 3 The rotating unit 800 comprises two groups of symmetrical rotating assemblies 810, the two groups of rotating assemblies 810 have a spacing therebetween, the rotating assembly 810 comprises a rotating mounting frame 811, the rotating mounting frame 811 is rotatably connected with a rotating control wheel 812 on both sides, the rotating control wheel 812 is controlled to rotate through an electric control device, so as to realize the driving control of the wafer 100, so as to control the wafer 100 to rotate around the axis thereof and realize the driving control process; through the arrangement of the two groups of rotating assemblies 810 of the rotating unit 800, the wafer 100 can be clamped and limited from both sides, through the control of the two rotating assemblies 810 to move outward, the wafer 100 can be opened by a predetermined distance to be staggered with the wafer 100, so as to realize the driving control process.

[0038] Specifically refer to the accompanying drawings Figure 5 and the accompanying drawings Figure 6Wherein the control assembly 600 comprises a sliding control cylinder 660, the outer wall of the sliding control cylinder 660 is fixedly connected with a driving control rod 662 located in the driving track 420, the driving control rod 662 can move linearly along the direction of the driving track 420, is limited in the driving track 420, and the surface of the driving control rod 662 is rotatably provided with a roller to reduce friction; the inside of the sliding control cylinder 660 is provided with a rotating control cylinder 650 which slides with respect to the sliding control cylinder 660, the outer wall of the rotating control cylinder 650 is provided with a control protrusion 651, the inner wall of the sliding control cylinder 660 is provided with an arc-shaped control groove 661 matched with the control protrusion 651, the side wall of the rotating unit 800 is fixedly connected with a positioning frame 610, and the end of the rotating control cylinder 650 is connected with the positioning frame 610 through a one-way rotating element 620, wherein the sliding control cylinder 660 moves along the direction of the driving track 420, the position is relatively unchanged, it can slide along the driving track 420, after sliding to the turnover track 423 section, at this time, since the turnover track 423 is inclinedly arranged towards the outside, the sliding control cylinder 660 and the rotating control cylinder 650 can be controlled to slide staggered, under the limitation of the control protrusion 651 and the arc-shaped control groove 661, the rotating control cylinder 650 rotates, and then the positioning frame 610 at the end and the wafer 100 rotate 180°, realizing the rotating control process.

[0039] The inner wall of the rotating control cylinder 650 is slidably connected with a tensioning control rod 630, the tensioning control rod 630 and the rotating control cylinder 650 are elastically connected through an elastic element 640, which can be a spring, a tensioning assembly 700 is arranged between the control track 400 and the tensioning control rod 630, through the arrangement of the elastic element 640, the two rotating units 810 can be in the state of approaching and abutting each other in normal state, so as to realize the clamping and limiting of the wafer 100; through the arrangement of the tensioning assembly 700, when the rotating unit 800 moves upward to a predetermined position, the two tensioning control discs 710 of the rotating unit 800 can be staggered by a predetermined distance at this time, so as to release the limiting of the wafer 100, so as to complete the feeding and discharging process of the wafer 100 with the feeding and discharging mechanical arm on one side.

[0040] As a preferred tension control mode; wherein the tension assembly 700 comprises a tension control disc 710, the control rail 400 is fixedly connected with a tension control wheel 720 matched with the tension control disc 710, the through rail 421 is communicated with the upper end of the staggered rail 422 for the driving control rod 662 to pass through, the control assembly 600 is moved upwards and moves into the through rail 421, at this time the tension control disc 710 can gradually approach the upper tension control wheel 720, the tension control wheel 720 is located outside the tension control disc 710, the tension control wheel 720 can extrude the inclined tension control disc 710 to move outward, realizing the tension control process; it should be noted here that the tension control disc 710 is in the form of a disc, and the tension control wheel 720 can control the tension control disc 710 when the control assembly 600 rotates to any position.

[0041] Specifically refer to the attached Figure 4 The detection unit 200 comprises an L-shaped detection mounting bracket 210, a detection element is installed on the inner wall of the detection mounting bracket 210, a limiting block 220 is fixedly connected to the outer wall of the detection mounting bracket 210, a limiting hole 221 for inserting a limiting rod is arranged on the side wall of the limiting block 220, and the limiting rod is bent at the end and inserted into the through rail 421. When the control assembly 600 moves upwards, the detection unit 200 can be driven as a whole to move upwards by the limiting rod, so as to avoid interference and collision between the wafer 100 and the detection unit 200. Under normal circumstances, the detection unit 200 can be in a constant position to realize the shape detection of the surface of the wafer 100. By being arranged in the L-shaped form, the wafer 100 can be detected from the top and the side to realize the scratch detection of the two side surfaces of the wafer 100 and the thickness detection of the side wall, thereby realizing the detection process.

[0042] The detection device further comprises a driving device 500, wherein the driving device 500 drives the control assembly 600 to move linearly along the control rail 400, so as to control the control assembly 600 to be in different positions of the driving rail 420, thereby realizing the driving process.

[0043] Specifically refer to the attached Figure 2As a preferred driving mode; wherein the driving device 500 comprises two steering wheels 510 located on both sides of the control track 400, the driving wheels 520 are installed on the side wall of the control track 400, the driving ropes 530 are wound on the surface of the driving wheels 520, the two ends of the driving ropes 530 are wound through the steering wheels 510 and are fixedly connected with the two sides of the control assembly 600, the driving wheels 520 are controlled to rotate through the electric control device, the control assembly 600 can be pulled to different positions through the driving ropes 530, the driving control is realized, and the two steering wheels 510 located on both sides can reverse the driving ropes 530 and limit the driving ropes 530, so that the driving ropes 530 can stably control the control assembly 600.

[0044] In order to improve the driving friction of the driving rope and prevent the occurrence of the slip phenomenon, the driving wheel 520 can be selected as a chain wheel, and a chain matched with the chain wheel is connected to the middle position of the driving rope 530, so that the driving rope 530 can be stably controlled, and the movement of the control assembly 600 to the predetermined position is ensured.

[0045] The working principle of the application is as follows: in the detection process, the wafer 100 is controlled to rotate around its own axis by the rotating unit 800, the scratch detection and thickness detection of the surface of the wafer 100 are realized by the detection unit 200 on one side, so as to judge the probability of the wafer 100, and the detection of the wafer 100 is realized.

[0046] After the detection of one side of the wafer 100 is completed, the control assembly 600 moves downwardly and moves into the turnover track 423, the rotating unit 800 and the wafer 100 are controlled to turn over 180°, the turnover control is realized by controlling the rotating unit 800 to turn over, the back surface of the wafer 100 faces the detection unit 200 side, the scratch detection of the back surface is realized, and the detection requirement is met.

[0047] Specifically, in the turnover process, the sliding control cylinder 660 moves outwardly along the turnover track 423, can be staggered with the rotating control cylinder 650, can make the rotating control cylinder 650 rotate 180°, specifically, the first position in the arc-shaped control groove 661 corresponds to the tail position, can control the rotating control cylinder 650 to turn over 180°, realize the driving control process; in addition, the one-way rotating element 620 can control the one-way rotation of the positioning frame 610 at the tail end, that is, when the control assembly 600 moves towards the bottom end in the turnover track 423, the wafer 100 is controlled to turn over, and in the return process of the control assembly 600, the positioning frame 610 and the wafer 100 and other assemblies will not rotate under the limiting of the one-way rotating element 620, the one-way rotating element 620 can be selected as a one-way bearing, and the rotating control mode is well known, and will not be repeated here.

[0048] The above merely describes preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer appearance automatic detection device characterized by comprising: The utility model relates to a wafer detection device, including: a detection base (300), a rotating unit (800) mounted on the upper end of the detection base (300) for limiting a wafer (100) and controlling the wafer (100) to rotate around its own axis in a horizontal plane, a detection unit (200) arranged on the upper end of the rotating unit (800) and facing the wafer (100), a control track (400) including a plurality of guide rods (410), the guide rods (410) forming a driving track (420) therebetween, the driving track (420) including a staggered track (422) and a turnover track (423) arranged in sequence from top to bottom, the staggered track (422) being arranged vertically, and the turnover track (423) being arranged obliquely towards the outside, a control assembly (600) including a control body and a control end, the control body being arranged in the driving track (420) and being capable of moving linearly along the staggered track (422) and the turnover track (423), wherein the control assembly (600) moves into the staggered track (422), and the control body and the control end are staggered to control the wafer (100) to turn over.

2. The apparatus according to claim 1, wherein The rotating unit (800) includes two groups of symmetrically arranged rotating assemblies (810), the two groups of rotating assemblies (810) having a spacing therebetween, and each rotating assembly (810) includes a rotating mounting bracket (811), both sides of the rotating mounting bracket (811) being rotationally connected with rotating control wheels (812).

3. The apparatus according to claim 2, wherein The control assembly (600) includes a sliding control cylinder (660), the outer wall of the sliding control cylinder (660) being fixedly connected with a driving control rod (662) arranged in the driving track (420), the inside of the sliding control cylinder (660) being provided with a rotating control cylinder (650) sliding thereagainst, the outer wall of the rotating control cylinder (650) being provided with a control protrusion (651), the inner wall of the sliding control cylinder (660) being provided with an arc-shaped control groove (661) matching the control protrusion (651), the side wall of the rotating unit (800) being fixedly connected with a positioning bracket (610), and the end of the rotating control cylinder (650) being coupled with the positioning bracket (610) through a one-way rotating element (620).

4. The apparatus according to claim 3, wherein The inside of the rotating control cylinder (650) is slidably connected with a tensioning control rod (630), the tensioning control rod (630) and the rotating control cylinder (650) being elastically connected through an elastic element (640), and the control track (400) and the tensioning control rod (630) are provided with a tensioning assembly (700).

5. The apparatus according to claim 4, wherein The tensioning assembly (700) includes a tensioning control disc (710), the surface of the control track (400) is fixedly connected with a tensioning control wheel (720) matching the tensioning control disc (710), and the upper end of the staggered track (422) is communicated with a passing track (421) for the driving control rod (662) to pass through.

6. The apparatus according to claim 1, wherein The detection unit (200) comprises an L-shaped detection mounting bracket (210), a detection element is mounted on the inner wall of the detection mounting bracket (210), a limiting block (220) is fixedly connected to the outer wall of the detection mounting bracket (210), and a limiting hole (221) for inserting a limiting rod is arranged on the side wall of the limiting block (220).

7. The apparatus according to claim 1, wherein The detection device further comprises a driving device (500), wherein the driving device (500) drives the control assembly (600) to move linearly along the control track (400).

8. The apparatus according to claim 7, wherein The driving device (500) comprises two steering wheels (510) located on both sides of the control track (400), a driving wheel (520) is mounted on the side wall of the control track (400), a driving rope (530) is wound on the surface of the driving wheel (520), and the two ends of the driving rope (530) pass through the steering wheels (510) and are fixedly connected to the two sides of the control assembly (600).

Images