A heat dissipation fin, a thermosyphon heat sink and a multi-dimensional heat dissipation device

Abstract

This invention discloses a heat dissipation fin, a thermosiphon radiator, and a multi-dimensional heat dissipation device, relating to the field of electronic heat dissipation technology. The heat dissipation fin includes: a shell, an air inlet and a liquid outlet disposed on the shell, and a gas-liquid cavity disposed within the shell; wherein: the air inlet connects the gas-liquid cavity to a receiving cavity within the heat dissipation substrate of the thermosiphon radiator; the liquid outlet connects the gas-liquid cavity and the receiving cavity; the height of the air inlet in the vertical direction is higher than the height of the liquid outlet; the gas-liquid cavity includes: a first guide portion for guiding gas flow and communicating with the air inlet; a second guide portion for guiding liquid flow and communicating with the liquid outlet; and a connecting portion communicating with both the first and second guide portions; the angles between the first guide portion and the connecting portion, and between the connecting portion and the second guide portion, are both obtuse angles. This invention can improve the problem of poor working fluid flow in the prior art and can improve the heat dissipation performance of the radiator.

Description

Technical Field

[0001] This invention relates to the field of electronic heat dissipation technology, and more specifically, to a heat dissipation fin. In addition, it also relates to a thermosiphon radiator including the above-mentioned heat dissipation fin and a multi-dimensional heat dissipation device. Background Technology

[0002] To meet the heat dissipation requirements of high-power electronic devices, related technologies use heat sinks based on the thermosiphon principle. Such heat sinks include a heat dissipation substrate and heat dissipation fins connected to the heat dissipation substrate. Both the heat dissipation substrate and the heat dissipation fins are provided with cavities, and the cavities of the two are connected. When dissipating heat from electronic devices, the phase change working fluid circulates between the two cavities. In this way, heat dissipation of electronic devices is achieved based on phase change heat transfer.

[0003] In the process of realizing this invention, the inventors discovered at least the following problems in the prior art:

[0004] The lack of a working fluid guiding structure in the heat sink fins results in significant resistance to the flow of the working fluid, leading to poor flow and thus affecting the heat dissipation performance of the radiator.

[0005] In conclusion, how to solve the problem of poor working fluid flow in order to improve the heat dissipation performance of radiators is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0006] In view of this, the purpose of the present invention is to provide a heat dissipation fin that can improve the problem of poor working fluid flow in the prior art, so as to improve the heat dissipation performance of the radiator.

[0007] Another object of the present invention is to provide a thermosiphon radiator including the above-mentioned heat dissipation fins and a multi-dimensional heat dissipation device.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] In a first aspect, the present invention provides a multi-dimensional heat dissipation device for base station communication, applied to a thermosiphon radiator, wherein the heat dissipation fins include:

[0010] A housing, an air inlet and a liquid outlet disposed on the housing; and

[0011] A gas-liquid cavity is disposed within the housing;

[0012] Wherein: the air inlet is used to connect the gas-liquid cavity with the receiving cavity in the heat dissipation substrate of the thermosiphon radiator, so that the gas in the receiving cavity can flow into the gas-liquid cavity;

[0013] The liquid outlet is used to connect the gas-liquid cavity and the receiving cavity, so that the liquid in the gas-liquid cavity can flow into the receiving cavity;

[0014] The height of the air inlet in the vertical direction is higher than the height of the liquid outlet;

[0015] The gas-liquid chamber includes:

[0016] The first guide section is used to guide the gas flow and is connected to the air inlet;

[0017] The second guide section is used to guide the flow of liquid and is connected to the liquid outlet;

[0018] A connecting portion, which is connected to the first flow guide portion and the second flow guide portion respectively;

[0019] The angle between the first guide portion and the connecting portion, and the angle between the connecting portion and the second guide portion are both obtuse angles.

[0020] In one possible implementation, the air inlet is provided with a third guide section for guiding gas flow;

[0021] The outlet is provided with a fourth guide section for guiding the flow of liquid.

[0022] In one possible implementation, the gas-liquid cavity is provided with a plurality of first support members, the opposite ends of which are respectively connected to the shell; the first support members are provided with guide surfaces.

[0023] In one possible implementation, the housing is provided with at least two of the air inlets;

[0024] Alternatively, the housing may be provided with an air inlet and a liquid outlet.

[0025] In one possible implementation, the air inlet and the liquid outlet are located on the same side.

[0026] In a second aspect, the present invention provides a thermosiphon radiator, the thermosiphon radiator comprising:

[0027] A heat dissipation substrate has an internal receiving cavity for containing a phase change working fluid.

[0028] Heat dissipation fins, which are connected to the heat dissipation substrate;

[0029] Wherein: the heat dissipation fins are the heat dissipation fins described in any one of the first aspects; the receiving cavity is connected to the air inlet and the liquid outlet respectively.

[0030] In one possible implementation, the receiving cavity is provided with a plurality of second support members, and the opposite ends of the second support members are respectively connected to the heat dissipation substrate;

[0031] Multiple second support members are staggered.

[0032] Thirdly, the present invention provides a multi-dimensional heat dissipation device, the multi-dimensional heat dissipation device comprising:

[0033] The heat dissipation substrate and heat dissipation fins as described in any of the second aspects; and

[0034] An auxiliary heat dissipation component is disposed on the side of the heat dissipation fins that is away from the heat dissipation substrate;

[0035] Wherein: the auxiliary heat dissipation component has an auxiliary heat dissipation cavity inside, and the auxiliary heat dissipation cavity is connected to the receiving cavity.

[0036] In one possible implementation, the auxiliary heat sink includes:

[0037] The bottom plate and the cover plate are interconnected to form the auxiliary heat dissipation cavity;

[0038] and a gas inlet disposed on the base plate or the cover plate, the gas inlet being used to connect the receiving cavity and the auxiliary heat dissipation cavity;

[0039] A liquid outlet is provided on the base plate or the cover plate, and the liquid outlet is used to connect the auxiliary heat dissipation cavity and the receiving cavity.

[0040] In one possible implementation, the gas inlet and the liquid outlet are distributed on opposite sides;

[0041] The auxiliary heat dissipation cavity is provided with a guide slope. The first side of the guide slope is distributed towards the gas inlet, and the second side of the guide slope is distributed towards the liquid outlet. The first side and the second side are distributed at an obtuse angle.

[0042] In one possible implementation, the auxiliary heat dissipation cavity is further provided with a plurality of third support members, one end of the third support member being connected to the base plate and the other end of the third support member being connected to the cover plate;

[0043] The multiple third support members are staggered.

[0044] In one possible implementation, the third support member is provided with a through gas channel, and the bottom plate and the cover plate are provided with through holes at the positions of each of the third support members, and the gas channel communicates with the corresponding through holes to form a complete gas flow channel.

[0045] In one possible implementation, the gas inlet is connected to the containment cavity via an air inlet pipe, and the liquid outlet is connected to the containment cavity via a liquid return pipe.

[0046] In one possible implementation, there is one gas inlet and one air intake pipe;

[0047] Alternatively, there may be at least two gas inlets and at least two air intake pipes, with multiple air intake pipes distributed in parallel.

[0048] In one possible implementation, the heat dissipation substrate, the heat dissipation fins, and the auxiliary heat dissipation components are integrally brazed after assembly.

[0049] The heat dissipation fins, thermosiphon radiator, and multi-dimensional heat dissipation device provided by this invention have at least the following advantages:

[0050] When using the heat dissipation fins provided by the present invention, the gaseous working medium can enter the air inlet of the heat dissipation fins through the receiving cavity in the heat dissipation substrate of the thermosiphon radiator. The gaseous working medium then enters the gas-liquid cavity of the shell along the first guide part and the connecting part to undergo phase change heat transfer. Then, the liquid working medium can pass through the connecting part and the second guide part in sequence, and under the guidance of the second guide part, enter the receiving cavity in the heat dissipation substrate of the thermosiphon radiator from the liquid outlet.

[0051] Since one end of the first guide section is connected to the air inlet and the other end of the first guide section is connected to the connecting section, and the angle between the first guide section and the connecting section is an obtuse angle, that is, the first guide section is inclined, it plays a guiding role for the gaseous working medium. Therefore, the process of the gaseous working medium flowing into the air inlet and then flowing along the first guide section to the connecting section is smoother, so the gaseous working medium can flow into the gas-liquid cavity more quickly under the guidance of the first guide section.

[0052] Since one end of the second guide section is connected to the liquid outlet and the other end of the second guide section is connected to the connecting section, and the angle between the connecting section and the second guide section is an obtuse angle, that is, the second guide section is inclined, the liquid working medium can flow down the slope into the receiving cavity in the heat dissipation substrate, which plays a guiding role for the liquid working medium. Therefore, the process of the liquid working medium flowing along the connecting section to the second guide section and then to the liquid outlet is smoother. Thus, the liquid working medium can flow more quickly along the second guide section to the liquid outlet and finally flow back to the receiving cavity in the heat dissipation substrate more quickly.

[0053] Therefore, the heat dissipation fins provided by the present invention, by setting a first flow guide, achieve the purpose of allowing the gaseous working fluid to flow into the gas-liquid cavity more quickly, and by setting a second flow guide, achieve the purpose of allowing the liquid working fluid to flow out of the gas-liquid cavity more quickly. The working fluid flows more smoothly, thereby improving the heat dissipation performance of the heat dissipation fins, and thus improving the heat dissipation performance of the radiator.

[0054] In summary, the heat dissipation fins provided by this invention can improve the problem of poor working fluid flow in the prior art, thereby improving the heat dissipation performance of the radiator.

[0055] Furthermore, the thermosiphon radiator and multi-dimensional heat dissipation device provided by the present invention include the aforementioned heat dissipation fins, which have the same advantages as the aforementioned heat dissipation fins, and will not be repeated here. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0057] Figure 1 This is a schematic diagram of the structure of the heat dissipation fins provided by the present invention;

[0058] Figure 2 An exploded view of the multi-dimensional heat dissipation device provided by the present invention;

[0059] Figure 3 A side view of the multi-dimensional heat dissipation device after assembly;

[0060] Figure 4 This is a front view of the heat sink substrate;

[0061] Figure 5 The main view of the auxiliary heat sink component.

[0062] Figures 1-5 middle:

[0063] 1 is a heat dissipation substrate, 11 is a receiving cavity, 12 is a second support member, 2 is a heat dissipation fin, 20 is a shell, 21 is an air inlet, 211 is a third flow guide, 22 is a first flow guide, 23 is a second flow guide, 24 is a connecting part, 25 is a liquid outlet, 251 is a fourth flow guide, 26 is a gas-liquid cavity, 27 is a first support member, 3 is a heat source, 4 is an auxiliary heat dissipation component, 41 is an auxiliary heat dissipation cavity, 42 is a base plate, 43 is a cover plate, 44 is a gas inlet, 45 is a liquid outlet, 46 is a guide slope, 47 is a third support member, 5 is an air inlet pipe, and 6 is a liquid return pipe. Detailed Implementation

[0064] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0065] The core of this invention is to provide a heat dissipation fin that can improve the problem of poor working fluid flow in the prior art, thereby enhancing the heat dissipation performance of the radiator. Another core aspect of this invention is to provide a thermosiphon radiator including the aforementioned heat dissipation fins and a multi-dimensional heat dissipation device.

[0066] Please refer to Figures 1 to 5 ,in, Figure 1 This is a schematic diagram of the structure of the heat dissipation fins provided by the present invention; Figure 2 An exploded view of the multi-dimensional heat dissipation device provided by the present invention; Figure 3 A side view of the multi-dimensional heat dissipation device after assembly; Figure 4 This is a front view of the heat sink substrate; Figure 5 The main view of the auxiliary heat sink component.

[0067] This specific embodiment provides a heat dissipation fin for use in a thermosiphon radiator. The heat dissipation fin includes:

[0068] Housing 20, with an air inlet 21 and a liquid outlet 25 disposed on the housing 20; and

[0069] Gas-liquid cavity 26 is disposed within housing 20;

[0070] Wherein: the air inlet 21 is used to connect the gas-liquid chamber 26 with the receiving cavity 11 in the heat dissipation base plate 1 of the thermosiphon radiator, so that the gas in the receiving cavity 11 can flow into the gas-liquid chamber 26.

[0071] The liquid outlet 25 is used to connect the gas-liquid chamber 26 and the receiving chamber 11 so that the liquid in the gas-liquid chamber 26 can flow into the receiving chamber 11.

[0072] The height of the air inlet 21 in the vertical direction is higher than the height of the liquid outlet 25;

[0073] The gas-liquid chamber 26 includes:

[0074] The first guide section 22 is used to guide the gas flow and is connected to the air inlet 21;

[0075] The second guide section 23 is used to guide the flow of liquid and is connected to the liquid outlet 25;

[0076] The connecting part 24 is connected to the first guide part 22 and the second guide part 23 respectively;

[0077] The angle between the first guide section 22 and the connecting section 24, and the angle between the connecting section 24 and the second guide section 23 are both obtuse angles.

[0078] When using the heat dissipation fins provided by the present invention, the heat dissipation fins are connected to the heat dissipation base plate 1 of the thermosiphon radiator. The thermosiphon radiator is generally placed vertically. The gaseous working fluid can enter the air inlet 21 of the heat dissipation fins through the receiving cavity 11 in the heat dissipation base plate 1 of the thermosiphon radiator. The gaseous working fluid then enters the gas-liquid cavity 26 of the housing 20 along the first guide part 22 and the connecting part 24 to undergo phase change heat transfer. Then, the liquid working fluid can pass through the connecting part 24 and the second guide part 23 in sequence, and under the guidance of the second guide part 23, enter the receiving cavity 11 in the heat dissipation base plate 1 of the thermosiphon radiator from the liquid outlet 25.

[0079] Since one end of the first guide section 22 is connected to the air inlet 21 and the other end of the first guide section 22 is connected to the connecting section 24, and the angle between the first guide section 22 and the connecting section 24 is an obtuse angle, that is, the first guide section 22 is inclined and plays a guiding role for the gaseous working medium. Therefore, the process of the gaseous working medium flowing into the air inlet 21 and then flowing along the first guide section 22 to the connecting section 24 is smoother. Thus, the gaseous working medium can flow into the gas-liquid chamber 26 more quickly under the guiding effect of the first guide section 22.

[0080] Since one end of the second guide section 23 is connected to the liquid outlet 25 and the other end of the second guide section 23 is connected to the connecting section 24, and the angle between the connecting section 24 and the second guide section 23 is an obtuse angle, that is, the second guide section 23 is inclined, the liquid working medium can flow down the slope into the receiving cavity 11 in the heat dissipation substrate 1, which plays a guiding role for the liquid working medium. Therefore, the process of the liquid working medium flowing along the connecting section 24 to the second guide section 23 and then to the liquid outlet 25 is smoother. Thus, the liquid working medium can flow more quickly along the second guide section 23 to the liquid outlet 25, and finally flow back to the receiving cavity 11 in the heat dissipation substrate 1 more quickly.

[0081] Therefore, the heat dissipation fins provided by the present invention, by setting the first flow guide 22, achieve the purpose of allowing the gaseous working fluid to flow into the gas-liquid cavity 23 more quickly, and by setting the second flow guide 23, achieve the purpose of allowing the liquid working fluid to flow out of the gas-liquid cavity 26 more quickly. The working fluid flows more smoothly, thereby improving the heat dissipation performance of the heat dissipation fins, and thus improving the heat dissipation performance of the radiator.

[0082] In summary, the heat dissipation fins provided by this invention can improve the problem of poor working fluid flow in the prior art, thereby improving the heat dissipation performance of the radiator.

[0083] In one embodiment, the air inlet 21 is provided with a third guide section 211 for guiding the flow of gas (i.e., gaseous working fluid); the liquid outlet 25 is provided with a fourth guide section 251 for guiding the flow of liquid (i.e., liquid working fluid). By providing the third guide section 211, the gaseous working fluid can enter the gas-liquid chamber 26 more smoothly, and by providing the fourth guide section 251, the liquid working fluid can flow out of the gas-liquid chamber 26 more smoothly.

[0084] In one embodiment, the gas-liquid cavity 26 is provided with a plurality of first support members 27, and the opposite ends of the first support members 27 are respectively connected to the housing 20, thereby providing support for the housing 20.

[0085] The first support member 27 is provided with a guide surface.

[0086] It should be noted that the first support member 27 can be set as a quadrilateral column. The guide surface of the first support member 27 can reduce the vaporization resistance of the working fluid, so that the vaporization rate and liquefaction rate of the working fluid are close to the balance, and it is also convenient to stamp the first support member 27.

[0087] Furthermore, the first support member 27 can be set as a regular square column, and the regular square column is set at an inclination of 45°. After the gaseous working fluid enters the gas-liquid chamber, it can be divided into two by the regular square column. The two working fluids contact the regular square column for heat exchange, which further improves the heat dissipation efficiency and effect of the device.

[0088] It should be noted that the multiple first support members 27 of the gas-liquid cavity 26 can be staggered, making the flow of the working fluid in the gas-liquid cavity 26 more intricate. The working fluid can flow more fully across the surface of the first support member 27, thereby increasing the heat exchange area and enabling the working fluid to transfer heat more fully, thus ensuring smoother exchange between the gaseous and liquid working fluids and more sufficient heat dissipation.

[0089] In one embodiment, the housing 20 is provided with at least two air inlets 21;

[0090] Alternatively, the housing 20 may be provided with an air inlet 21 and a liquid outlet 25.

[0091] It should be noted that at least two air inlets 21 can be provided at the upper part of the gas-liquid chamber 26, and one liquid outlet 25 can be provided at the lower part of the gas-liquid chamber 26. Because the working fluid vaporizes at high pressure and at a high rate, providing at least two air inlets 21 at the upper part of the gas-liquid chamber 26 can effectively reduce the resistance during operation. Subsequently, depending on the characteristics of the equipment, three or more air inlets 21 can be designed to prevent the product from burning dry due to excessive resistance during working fluid vaporization.

[0092] It should be further explained that the distance between the air inlet 21 and the liquid outlet 25 is set relatively large, rather than being close to each other. This is to create a large potential and pressure difference between the gas and liquid working fluids, allowing the liquid working fluid to flow under sufficient pressure and preventing it from vaporizing and entering the heat dissipation fins 4 from the liquid outlet 25, thus avoiding backflow obstruction. For example, the distance between the liquid outlet 25 and the adjacent air inlet 21 needs to be greater than the depth of the liquid surface to ensure that the liquid working fluid does not directly enter the air inlet 21, guaranteeing the smooth phase change of the working fluid.

[0093] In one embodiment, the air inlet 21 and the liquid outlet 25 are located on the same side. That is, the cross-section of the gas-liquid chamber 26 is trapezoidal, and its structure is as follows: Figure 1 As shown in the figure, the arrows indicate the direction of the working fluid flow.

[0094] In addition to the heat dissipation fins described above, the present invention also provides a thermosiphon radiator including the aforementioned heat dissipation fins, the thermosiphon radiator comprising:

[0095] The heat dissipation substrate 1 has a receiving cavity 11 inside, which is used to receive the phase change working fluid.

[0096] Heat dissipation fins 2 are connected to the heat dissipation substrate 1;

[0097] Wherein: heat dissipation fin 2 is any of the above heat dissipation fins; the receiving cavity 11 is connected to the air inlet 21 and the liquid outlet 25 respectively.

[0098] In one embodiment, the receiving cavity 11 is provided with a plurality of second support members 12, and the opposite ends of the second support members 12 are respectively connected to the heat dissipation substrate 1; the plurality of second support members 12 are staggered.

[0099] It should be noted that the second support member 12 can be configured as a rhomboid prism, a regular hexagonal prism, or an elliptical prism, with multiple second support members 12 within the receiving cavity 11 distributed in a staggered manner. Here, the elliptical prism is an irregular elliptical prism, which is an elliptical prism with the same dimensions as the rhomboid prism; that is, it can be understood as rounding the four sharp corners of the rhomboid prism to obtain an irregular elliptical prism. Furthermore, configuring the second support member 12 as a rhomboid prism, a regular hexagonal prism, or an elliptical prism is to better reduce the vaporization resistance of the working fluid, allowing the working fluid to flow fully through the sidewalls of the second support member 12 for heat exchange.

[0100] It should also be noted that the second support member 12 is staggered, which makes the flow channel of the working fluid more intricate and allows the working fluid to flow more fully across the surface of the second support member 12, thereby increasing the heat exchange area. This allows the working fluid to transfer heat more fully, thus ensuring smoother exchange between the gaseous and liquid working fluids and more sufficient heat dissipation.

[0101] In addition to the aforementioned thermosiphon radiator, the present invention also provides a multi-dimensional heat dissipation device including the aforementioned thermosiphon radiator, the multi-dimensional heat dissipation device comprising:

[0102] The heat dissipation substrate 1 and heat dissipation fins 2 of any one of the above; and

[0103] Auxiliary heat dissipation component 4 is disposed on the side of heat dissipation fin 2 away from heat dissipation substrate 1;

[0104] Among them, the auxiliary heat sink 4 has an auxiliary heat sink cavity 41 inside, and the auxiliary heat sink cavity 41 is connected to the receiving cavity 11.

[0105] It should be noted that the multi-dimensional heat dissipation device is generally placed vertically when in use. By setting an auxiliary heat dissipation component 4 on one side of the heat dissipation fin 2, the multi-dimensional heat dissipation device can operate in both horizontal and vertical directions to dissipate heat simultaneously, thus achieving multi-dimensional heat dissipation. This multi-dimensional heat dissipation method has great development prospects in the future.

[0106] It should also be noted that only one layer of auxiliary heat sink 4 can be set, but if the device space is sufficient or the power consumption increases, the auxiliary heat sink 4 can be set as a multi-layer stacked structure, and each auxiliary heat sink 4 can be interconnected to achieve multi-loop and multi-dimensional simultaneous heat exchange, effectively improving the heat dissipation effect of the device. Moreover, the receiving cavity 11 and the auxiliary heat sink 41 can be set as structures of different shapes, and the two can be interconnected, so that the working fluid in the receiving cavity 11 can not only enter the heat sink fins, but also enter the auxiliary heat sink 41 for phase change heat exchange, effectively ensuring and improving the heat dissipation effect of the device.

[0107] In one embodiment, the auxiliary heat sink 4 includes:

[0108] The base plate 42 and cover plate 43, which are interconnected to form the auxiliary heat dissipation cavity 41; and

[0109] Gas inlet 44 is provided on base plate 42 or cover plate 43. Gas inlet 44 is used to connect receiving cavity 11 and auxiliary heat dissipation cavity 41.

[0110] A liquid outlet 45 is provided on the base plate 42 or the cover plate 43. The liquid outlet 45 is used to connect the auxiliary heat dissipation cavity 41 and the receiving cavity 11.

[0111] It should be noted that since most of the gaseous working fluid is in the upper part of the auxiliary heat dissipation cavity 41, the gas inlet 44 can be located at the top of the auxiliary heat dissipation cavity 41, and the liquid outlet 45 can be located at the bottom of the auxiliary heat dissipation cavity 41.

[0112] In one embodiment, the gas inlet 44 and the liquid outlet 45 are distributed on opposite sides; a guide slope 46 is provided inside the auxiliary heat dissipation cavity 41, with the first side of the guide slope 46 facing the gas inlet 44 and the second side facing the liquid outlet 45, forming an obtuse angle between the first and second sides. That is, the guide slope 46 can be provided inside the auxiliary heat dissipation cavity 41 to guide the flow of the working fluid, making the phase change of the working fluid smoother. The arrows in the various figures indicate the direction of the working fluid flow.

[0113] In one embodiment, the auxiliary heat dissipation cavity 41 is further provided with a plurality of third support members 47. One end of the third support member 47 is connected to the base plate 42, and the other end of the third support member 47 is connected to the cover plate 43, so as to facilitate the batch processing and manufacturing of the third support members 47 in the auxiliary heat dissipation cavity 41.

[0114] Multiple third support members 47 are staggered to make the flow process of the working fluid in the auxiliary heat dissipation cavity 41 more complex. The working fluid can flow more fully across the surface of the third support member 47 to increase the heat exchange area, thereby making the working fluid transfer heat more fully and ensuring smoother exchange between gaseous and liquid working fluids and more sufficient heat dissipation.

[0115] In one embodiment, the third support member 47 is provided with a through gas channel, and the bottom plate 42 and the cover plate 43 are provided with through holes at the positions of each third support member 47. The gas channel and the corresponding through hole are connected to form a complete gas flow channel, through which air can circulate.

[0116] It should be noted that the hot air between the heat dissipation fins can flow out through the aforementioned gas channels, forming concentrated convection, accelerating air exchange, and further improving heat dissipation performance.

[0117] In one embodiment, the gas inlet 44 is connected to the receiving cavity 11 via the air inlet pipe 5, and the liquid outlet 45 is connected to the receiving cavity 11 via the liquid return pipe 6.

[0118] It should be noted that at least two slots for accommodating heat dissipation fins 2 can be provided on the heat dissipation substrate 1, so that multiple heat dissipation fins 2 can be arranged sequentially on the heat dissipation substrate 1, and the heat dissipation fins 2 can be evenly spaced to facilitate batch processing. In addition, an air inlet pipe 5 and a liquid return pipe 6 can be provided at the spacing between adjacent heat dissipation fins 2.

[0119] For example, an air inlet pipe 5 and a liquid return pipe 6 can be respectively provided between the two outermost heat dissipation fins 2 and the adjacent heat dissipation fins 2, so that the air inlet pipe 5 and the liquid return pipe 6 are located at both ends of the heat dissipation substrate 1, thereby extending the flow path of the phase change working fluid in the top plate cavity and further improving the heat dissipation effect of the device. Of course, other options can be made for the positions of the air inlet pipe 5 and the liquid return pipe 6 according to the actual situation and actual needs.

[0120] In one embodiment, there is one gas inlet 44 and one air inlet pipe 5; or there are at least two gas inlets 44 and two air inlet pipes 5, with multiple air inlet pipes 5 distributed in parallel. Since the working fluid vaporizes at high pressure and at a high rate, providing one or more air inlet pipes 5 between the receiving cavity 11 and the auxiliary heat dissipation cavity 41 helps to reduce the resistance during the operation of the working fluid.

[0121] In one embodiment, the heat dissipation substrate 1, heat dissipation fins 2, and auxiliary heat dissipation components 4 are integrally brazed after assembly.

[0122] It should be noted that multiple heat dissipation fins 2 can be inserted onto the heat dissipation substrate 1, and then the auxiliary heat dissipation component 4 can be fixed together with the heat dissipation fins 2. After all components are assembled, that is, after the heat dissipation substrate 1, heat dissipation fins 2, and auxiliary heat dissipation component 4 are assembled, an integral structure is formed. This integral structure is then brazed in a tunnel furnace to form an integrated brazed structural component, i.e., integral brazed molding. The heat from the heat dissipation fins 2 can be directly conducted to the auxiliary heat dissipation cavity 41, greatly improving the heat exchange efficiency of the heat dissipation fins 2. Simultaneously, the auxiliary heat dissipation cavity 41 is connected to the receiving cavity 11 via the air inlet pipe 5 and the liquid return pipe 6. This arrangement enables multi-dimensional heat dissipation of the receiving cavity 11, the heat dissipation fins 2, and the auxiliary heat dissipation cavity 41, effectively improving the heat dissipation efficiency of the device.

[0123] To further illustrate the usage of this device, an example will be given below. A heat source 3 can be placed on one side of the heat dissipation substrate 1, for example, the heat source 3 can be attached to the side of the heat dissipation substrate 1 opposite to the heat dissipation fins 2.

[0124] When the heat source 3 is powered on, it generates heat. The phase change working fluid in the housing cavity 11 absorbs the heat from the heat source 3 and vaporizes into a gaseous working fluid. The gaseous working fluid enters the air inlet 21 of the heat dissipation fin 2 from the housing cavity 11. The gaseous working fluid then enters the gas-liquid cavity 26 along the first guide section 22 to undergo phase change heat transfer. Afterward, the liquid working fluid can pass through the connecting section 24 and the second guide section 23 in sequence, and under the guidance of the second guide section 23, it flows back to the housing cavity 11 from the liquid outlet 25.

[0125] It should be noted that the large distance between the air inlet 21 and the liquid outlet 25 creates a large potential difference and pressure difference between the gas and liquid working fluids, allowing the liquid working fluid to flow under sufficient pressure difference and preventing the liquid working fluid from vaporizing and entering the heat dissipation fins 2 from the liquid outlet 25, thus preventing backflow obstruction.

[0126] Similarly, after the heat source 3 is powered on, a portion of the gaseous working fluid will simultaneously enter the auxiliary heat dissipation chamber 41 from the inlet pipe 5. Under the guidance of the sloped structure, the liquid working fluid will enter the receiving chamber 11 from the return pipe 6. The working principle of this device is as follows: Figure 3 As shown in the figure, the arrows indicate the direction of the working fluid flow. Since the support members (i.e., heat dissipation columns) in the receiving cavity 11 and the auxiliary heat dissipation cavity 41 are staggered and the support member structures in each cavity are different, the flow channels formed by both can effectively achieve uniform heat exchange of the working fluid.

[0127] In addition, the base plate 42 and the cover plate 43 are connected to form an auxiliary heat dissipation cavity 41, and the auxiliary heat dissipation cavity 41 can be set as a hollow cavity, which not only forms a good chimney effect, allowing hot air to be concentrated and convection, but also has a phase change working fluid inside the auxiliary heat dissipation cavity 41, so that in addition to the heat conduction of the heat dissipation fins 2, the auxiliary heat dissipation cavity 41 itself can also undergo heat change through the phase change of the working fluid.

[0128] Furthermore, the support structures (i.e., heat dissipation columns) of the receiving cavity 11, auxiliary heat dissipation cavity 41, and gas-liquid cavity 26 have special structures, designed based on the principle of working fluid phase change. The slope structure and guiding structure inside each cavity have a very large guiding and drainage effect. Each cavity can form intricate heat exchange at different angles, and the receiving cavity 11 and auxiliary heat dissipation cavity 41 are directly connected, with both cavities simultaneously triggering phase change heat exchange. Therefore, the multi-dimensional heat dissipation method of this device has great future development prospects and can effectively meet the heat dissipation needs of future high-power communication equipment.

[0129] It should be noted that the first guide portion 22 and the second guide portion 23, the first side and the second side, the first support member 27 and the second support member 12 and the third support member 47 mentioned in this application are only distinguished by their different positions and do not have any order of precedence.

[0130] In addition, it should be noted that the orientation or positional relationship of the "entering and exiting" indications in this application is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the purpose of simplifying the description and making it easier to understand, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0131] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. Any combination of all embodiments provided by this invention is within the scope of protection of this invention and will not be elaborated upon here.

[0132] The heat dissipation fins, thermosiphon radiator, and multi-dimensional heat dissipation device provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this invention.

Claims

1. A heat dissipation fin, applied to a thermosiphon radiator, characterized in that, The heat dissipation fins include: A housing (20), an air inlet (21) and a liquid outlet (25) disposed on the housing (20); and A gas-liquid cavity (26) is disposed within the housing (20); Wherein: the air inlet (21) is used to connect the gas-liquid cavity (26) with the receiving cavity (11) in the heat dissipation base plate (1) of the thermosiphon radiator, so that the gas in the receiving cavity (11) can flow into the gas-liquid cavity (26); The outlet (25) is used to connect the gas-liquid chamber (26) and the receiving chamber (11) so that the liquid in the gas-liquid chamber (26) can flow into the receiving chamber (11); The height of the air inlet (21) in the vertical direction is higher than the height of the liquid outlet (25); The gas-liquid chamber (26) includes: The first guide section (22) is used to guide the flow of gas and is connected to the air inlet (21); The second guide section (23) is used to guide the flow of liquid and is connected to the liquid outlet (25); The connecting part (24) is connected to the first guide part (22) and the second guide part (23) respectively; The angle between the first guide portion (22) and the connecting portion (24) and the angle between the connecting portion (24) and the second guide portion (23) are both obtuse angles.

2. The heat dissipation fins according to claim 1, characterized in that, The air inlet (21) is provided with a third guide section (211) for guiding the flow of gas; The outlet (25) is provided with a fourth guide section (251) for guiding the flow of liquid.

3. The heat dissipation fins according to claim 1, characterized in that, The gas-liquid cavity (26) is provided with a plurality of first support members (27), and the opposite ends of the first support members (27) are respectively connected to the shell (20); The first support member (27) is provided with a guide surface.

4. The heat dissipation fins according to claim 1, characterized in that, The housing (20) is provided with at least two air inlets (21); Alternatively, the housing (20) may be provided with an air inlet (21) and a liquid outlet (25).

5. The heat dissipation fins according to claim 1, characterized in that, The air inlet (21) and the liquid outlet (25) are located on the same side.

6. A thermosiphon radiator, characterized in that, include: A heat dissipation substrate (1) has a receiving cavity (11) inside, which is used to receive a phase change working fluid; Heat dissipation fins (2) are connected to the heat dissipation substrate (1); Wherein: the heat dissipation fins (2) are the heat dissipation fins as described in any one of claims 1-5; the receiving cavity (11) is connected to the air inlet (21) and the liquid outlet (25) respectively.

7. The thermosiphon radiator according to claim 6, characterized in that, The receiving cavity (11) is provided with a plurality of second support members (12), and the opposite ends of the second support members (12) are respectively connected to the heat dissipation substrate (1); Multiple second support members (12) are staggered.

8. A multi-dimensional heat dissipation device, characterized in that, include: The heat dissipation substrate (1) and heat dissipation fins (2) as described in any one of claims 6-7; and An auxiliary heat dissipation component (4) is disposed on the side of the heat dissipation fins (2) away from the heat dissipation substrate (1); Wherein: the auxiliary heat dissipation component (4) is provided with an auxiliary heat dissipation cavity (41), and the auxiliary heat dissipation cavity (41) is connected to the receiving cavity (11).

9. The multi-dimensional heat dissipation device according to claim 8, characterized in that, The auxiliary heat sink (4) includes: The bottom plate (42) and the cover plate (43) that are interconnected to form the auxiliary heat dissipation cavity (41); and A gas inlet (44) is provided on the base plate (42) or the cover plate (43), and the gas inlet (44) is used to connect the receiving cavity (11) and the auxiliary heat dissipation cavity (41); A liquid outlet (45) is provided on the base plate (42) or the cover plate (43), and the liquid outlet (45) is used to connect the auxiliary heat dissipation cavity (41) and the receiving cavity (11).

10. The multi-dimensional heat dissipation device according to claim 9, characterized in that, The gas inlet (44) and the liquid outlet (45) are distributed on opposite sides; The auxiliary heat dissipation cavity (41) is provided with a guide slope (46). The first side of the guide slope (46) is distributed towards the gas inlet (44), and the second side of the guide slope (46) is distributed towards the liquid outlet (45). The first side and the second side are distributed at an obtuse angle.

11. The multi-dimensional heat dissipation device according to claim 9, characterized in that, The auxiliary heat dissipation cavity (41) is also provided with a plurality of third support members (47), one end of the third support member (47) is connected to the base plate (42), and the other end of the third support member (47) is connected to the cover plate (43); The multiple third support members (47) are staggered.

12. The multi-dimensional heat dissipation device according to claim 11, characterized in that, The third support member (47) is provided with a through gas channel, and the bottom plate (42) and the cover plate (43) are provided with through holes at the positions corresponding to each of the third support members (47). The gas channel and the corresponding through hole are connected to form a complete gas flow channel.

13. The multi-dimensional heat dissipation device according to any one of claims 9 to 12, characterized in that, The gas inlet (44) is connected to the receiving cavity (11) via an air inlet pipe (5), and the liquid outlet (45) is connected to the receiving cavity (11) via a liquid return pipe (3).

14. The multi-dimensional heat dissipation device according to claim 13, characterized in that, The number of gas inlets (44) and air intake pipes (5) is one each; Alternatively, the number of gas inlets (44) and air intake pipes (5) may both be at least two, with multiple air intake pipes (5) distributed in parallel.

15. The multi-dimensional heat dissipation device according to any one of claims 8 to 12, characterized in that, The heat dissipation substrate (1), the heat dissipation fins (2), and the auxiliary heat dissipation component (4) are integrally brazed after assembly.

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