Polishing pad, method for manufacturing the same, and method for manufacturing a polishing processed article, and polishing pad, method for manufacturing the same, and method for manufacturing a polishing processed article

Abstract

The present application provides a polishing pad or the like that can impart good planarity to a polishing object and has excellent affinity with slurry. That is, a polishing pad or the like is provided that includes a resin sheet having fine pores, wherein, in a fine pore distribution of the resin sheet measured by a mercury intrusion method by setting a contact angle to 130° and a mercury surface tension to 485 dyn / cm, a cumulative pore volume V in a range of a fine pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more and 1.00 cm 3 / g or less, and a density of the resin sheet is 0.3 g / cm 3 / g or more and 0.9 g / cm 3 / g or less.

Description

TECHNICAL FIELD

[0001] The present application relates to a polishing pad, a manufacturing method thereof, and a manufacturing method of a polishing processed object, and a polishing pad, a manufacturing method thereof, and a manufacturing method of a polishing processed object. BACKGROUND

[0002] (First Background Art)

[0003] Conventionally, for optical materials such as lenses, parallel plane plates, and mirrors, semiconductor wafers, semiconductor devices, substrates for hard disks, metals, and ceramic materials, polishing processing using a polishing pad is performed.

[0004] In polishing processing, various polishing pads have been developed in order to improve the flatness on the polished surface of a polished object and the polishing rate of polishing processing. For example, in Patent Literature 1, a polishing pad having pores having a first void volume and pores having a second void volume is disclosed.

[0005] (Second Background Art)

[0006] Conventionally, for optical materials such as lenses, parallel plane plates, and mirrors, semiconductor wafers, semiconductor devices, substrates for hard disks, metals, and ceramic materials, polishing processing using a polishing pad is performed.

[0007] In polishing processing, various polishing pads have been developed in order to improve the flatness on the polished surface of a polished object and the polishing rate of polishing processing. For example, in Patent Literature 2, a polishing pad is disclosed, which is characterized by being a non-porous molded body of a thermoplastic polyurethane, and in the thermoplastic polyurethane, a maximum value of a tangent of a loss angle in a range of -70°C to -50°C is 4.00 x 10 -2 In Patent Literature 2, it is disclosed that by polishing processing using such a polishing pad, the generation of burrs at the corners of recesses formed on the polishing surface can be suppressed.

[0008] In Patent Literature 3, a polishing pad is disclosed, which is a polishing pad having a polishing layer formed of a polyurethane resin foam body having fine bubbles, the polyurethane resin foam body containing a polyurethane resin having an Asker D hardness of 20 to 60 degrees and a specific abrasion parameter within a prescribed range, and further, the number of bubbles is 200 / mm 2 or less, and the average bubble diameter is 50 μm or less. In Patent Literature 3, it is disclosed that such a polishing pad is less likely to generate scratches on the surface of a polished material, has excellent finish, and has a larger polishing rate than existing polishing pads.

[0009] In Patent Document 4, a polishing pad for chemical mechanical polishing, which includes a porous foam body having an average pore diameter of 50 μm or less, and 75% or more of the pores having a pore diameter within 20 μm of the average pore diameter, is disclosed. In the polishing pad, the porous foam body includes a thermoplastic polyurethane as a polymer resin; and the thermoplastic polyurethane is a thermoplastic polyurethane having prescribed properties. In Patent Document 4, it is disclosed that such a polishing pad can impart excellent planarity to a polishing surface of a polished object.

[0010] In Patent Document 5, a polishing pad is disclosed, which is characterized by being a polishing pad of a foam body using a polyurethane-based thermoplastic elastomer having a prescribed hardness, the density of the foam body being 0.2 to 1.3 g / cm 3 , the average cell diameter being 1 to 10 μm, and the number of cells being 1 x 10 7 / cm 3 or more. In Patent Document 5, it is disclosed that such a polishing pad can maintain a good foamed state, and can impart excellent planarity to a polishing surface of a polished object.

[0011] (3rd Background Art)

[0012] Generally, for optical materials such as lenses, parallel plane plates, and mirrors, semiconductor wafer materials such as SiC disks, crystals, metals, stone, wood, resin materials, and ceramic materials, lapping processing, polishing processing, and polishing are performed, and a polishing pad is used in the polishing processing.

[0013] As a technique related to polishing processing, for example, in Patent Document 6, a polishing processing system is disclosed, which has a table plate, a polymer material, and a slurry having abrasive particles, the polymer material being mounted to the table plate, and the density of the polymer material being in a range of about 0.7 g / cm 3 to about 3.0 g / cm 3 . In Patent Document 6, it is considered that by using a polishing processing using such a polymer material, processing can be performed at a high removal rate for a long period of time, and defects resulting from the processing are few.

[0014] Prior Art Documents

[0015] Patent Documents

[0016] Patent Document 1: Japanese Patent No. 5248861

[0017] Patent Document 2: Japanese Patent No. 6518680

[0018] Patent Document 3: Japanese Laid-Open Patent No. 2014-111296

[0019] Patent Literature 4: Japanese Patent No. 4624781

[0020] Patent Literature 5: Japanese Patent No. 3649385

[0021] Patent Literature 6: Japanese Patent Application Laid-Open No. 2018-524193 SUMMARY

[0022] PROBLEMS TO BE SOLVED BY THE INVENTION

[0023] (1st Problem)

[0024] According to the relationship with the 1st background technology, generally, foaming in a polishing pad obtained by a molding method has a large influence on polishing characteristics. For example, the less the foaming of the polishing pad, the more the flatness of a polished object is improved, and the polishing rate is reduced due to the slurry holding property and the surface smoothing, and the dishing property is also reduced. Conversely, the more the foaming, especially the connected pores, the more the flatness of the polished object is deteriorated, and the polishing rate and the dishing property have a tendency to be improved. On the other hand, according to the polishing pad described in Patent Literature 1, since, for example, the 1st region having an average pore diameter of 50 μm or less and the 2nd region having an average pore diameter of 1 μm to 20 μm are provided, the void structure is different in the plurality of regions, and thus there is a tendency that the polishing becomes non-uniform.

[0025] The present application has been made in view of the above-described problems, and a 1st object thereof is to provide a polishing pad capable of imparting a good flatness to a polished object and excellent in affinity with a slurry, a manufacturing method thereof, and a manufacturing method of a polished object.

[0026] (2nd Problem)

[0027] According to the relationship with the 2nd background technology, generally, in a polishing process in which a high flatness is required, in order to make the sinking of the polishing pad moderate, it is preferable to use a high-density polishing pad. On the other hand, the high-density polishing pad has a tendency that the affinity with a slurry used in the polishing process is poor. The affinity with the slurry in the polishing pad is important from the viewpoint of improving the polishing rate and the flatness of the polished object.

[0028] The present inventors have made a detailed study on the existing polishing pads represented by the polishing pads described in Patent Literatures 2 to 5, and as a result, it has been found that the existing polishing pads are at least insufficient in the affinity with the slurry, or insufficient in the flatness of the polished object.

[0029] For example, in the case of the non-porous polishing pad disclosed in Patent Literature 2, the slurry is not easily permeated into the polishing pad, and thus the affinity with the slurry is insufficient. In addition, in the case of the polishing pads disclosed in Patent Literatures 3 to 5, since they have a low density, the polished object is not imparted with sufficient flatness, and in addition, the affinity with the slurry is also insufficient.

[0030] The present invention was made in view of the above-mentioned problems, and its second object is to provide a grinding pad that can impart good flatness to the workpiece and has excellent affinity with the slurry, a method for manufacturing the pad, and a method for manufacturing the workpiece to be ground.

[0031] (Topic 3)

[0032] Based on the relationship with the third background technology, the following requirements apply to resin sheets used in polishing processes involving free abrasive grains (slurry). Specifically, polishing processes often use slurries containing high-hardness abrasive grains (especially ultra-abrasive grains), such as diamond. In recent years, to reduce the cost of fine grinding, it has also been necessary to suppress excessive scratching during polishing. As a countermeasure to these requirements, adjusting the density of the resin sheet can be considered. For example, when using a low-density resin sheet, the abrasive grains are easily retained within the foam of the resin sheet, which tends to suppress the strong contact between the abrasive grains and the workpiece, thus preventing scratching. On the other hand, simply reducing the density tends to lead to surface smoothing degradation due to pore collapse during prolonged use. Therefore, a brittle resin sheet is required, which allows for the expectation of a striking finish (so-called finishability) and / or self-regeneration of a new surface through wear without affecting physical properties. From this perspective, the technology described in Patent Document 6 has room for improvement.

[0033] The present invention was made in view of the above-mentioned problems, and its third object is to provide a polishing pad with excellent finishing properties and a surface that is not easily smoothed, a method for manufacturing the same, and a method for manufacturing polished workpieces.

[0034] (Topic 4)

[0035] Based on the relationship with the third background technology, there are requirements for resin sheets used in polishing processes containing free abrasive grains (slurry). Specifically, polishing processes often use slurries containing expensive abrasive grains, such as diamond, and there is a need for resin sheets that can reduce the amount of such slurry used. In other words, there is a need for resin sheets that can efficiently utilize small amounts of slurry. As a countermeasure to this requirement, adjusting the density of the resin sheet can be considered, but simply increasing the density tends to reduce the utilization efficiency of the liquid components of the slurry. On the other hand, when using low-density resin sheets with foaming, abrasive grains tend to enter the foam, reducing the utilization efficiency of the abrasive grain components. From this perspective, the technology described in Patent Document 6 has room for improvement.

[0036] The present invention was made in view of the above-mentioned problems, and its fourth object is to provide a polishing pad with excellent liquid retention properties and abrasive retention properties (hereinafter, they are sometimes collectively referred to as "slurry affinity"), a method for manufacturing the pad, and a method for manufacturing the polished workpiece.

[0037] Methods for solving problems

[0038] The inventors of this application conducted in-depth research to solve the first problem and discovered that the first problem could be solved using resin sheets with specified physical properties, thus completing the present invention.

[0039] That is, the present invention includes the following methods. [1]

[0041] Abrasive pads are abrasive pads made of resin sheets with fine pores.

[0042] In the pore distribution of the aforementioned resin sheet, measured by mercury intrusion porosimetry with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V within the range of pore diameters from 0.010 μm to 1.0 μm is 0.21 cm³. 3 / g or more 1.00cm 3 / g or less

[0043] The density of the aforementioned resin sheet is 0.3 g / cm³. 3 Above 0.9g / cm 3 the following. [2]

[0045] The abrasive pad as described in [1], wherein in the aforementioned pore distribution of the aforementioned resin sheet, the aforementioned cumulative pore volume V is 50% or more relative to the cumulative pore volume V0 in the range of pore diameters from 0.010 μm to 360 μm. [3]

[0047] The abrasive pad as described in [1] or [2], wherein the average aperture diameter measured with apertures of 10 μm or more in the aforementioned resin sheet is 50 μm or more and 200 μm or less. [4]

[0049] The abrasive pad as described in any one of [1] to [3], wherein, in the aforementioned pore distribution of the aforementioned resin sheet, the peak position of the maximum peak in the range of pore diameters from 0.010 μm to 360 μm is within the range of pore diameters from 0.010 μm to 1.0 μm. [5]

[0051] The polishing pad according to any one of [1] to [4], wherein the resin sheet has a microphase separation structure. [6]

[0053] The polishing pad according to any one of [1] to [5], wherein the resin sheet contains polyurethane. [7]

[0055] A method for manufacturing the polishing pad according to any one of [1] to [6], the method comprising the steps of:

[0056] curing a mixture of at least one prepolymer and at least two curing agents, thereby obtaining a resin sheet having a microphase separation structure. [8]

[0058] The method for manufacturing the polishing pad according to [7], wherein the curing agent contains a first curing agent having an NH2 equivalent of 100 or more and 300 or less, and a second curing agent having an OH equivalent of 1000 or more and 2000 or less. [9]

[0060] A method for manufacturing a polished article, the method comprising the step of polishing a polished article using the polishing pad according to any one of [1] to [6] in the presence of a polishing slurry.

[0061] The inventors of the present application have conducted intensive studies in order to solve the second problem, and as a result, have found that the second problem can be solved by using a resin sheet having a prescribed property, thereby completing the present application.

[0062] That is, the present application includes the following modes.

[0063] [2-1]

[0064] A polishing pad that is a polishing pad provided with a resin sheet having fine pores,

[0065] In a fine pore distribution of the resin sheet measured by a mercury porosimetry by setting a contact angle to 130° and a mercury surface tension to 485 dyn / cm, a cumulative fine pore volume V in a range of a fine pore diameter of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 3 / g or less,

[0066] A density of the resin sheet is 0.9 g / cm 3 or more and 1.3 g / cm 3 or less.

[0067] [2-2]

[0068] The polishing pad according to any one of [2-1] to [2-7], wherein, in the pore size distribution of the aforementioned resin sheet, the cumulative pore volume V in the range of 0.050 μm or more and less than 0.100 μm is 0.000 cm3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less. 3 / g or less.

[0069] [2-3]

[0070] The polishing pad according to any one of [2-1] or [2-2], wherein, in the pore size distribution of the aforementioned resin sheet, the proportion of the aforementioned cumulative pore volume V with respect to the cumulative pore volume Vo in the range of 0.100 μm or more and 360 μm or less is 50% or more.

[0071] [2-4]

[0072] The polishing pad according to any one of [2-1] to [2-3], wherein, in the pore size distribution of the aforementioned resin sheet, the proportion of the aforementioned cumulative pore volume V with respect to the cumulative pore volume Vo' in the range of 0.050 μm or more and 360 μm or less is 50% or more.

[0073] [2-5]

[0074] The polishing pad according to any one of [2-1] to [2-4], wherein, in the pore size distribution of the aforementioned resin sheet, the peak position of the largest peak in the range of 0.100 μm or more and 360 μm or less is in the range of 0.100 μm or more and 10.0 μm or less.

[0075] [2-6]

[0076] The polishing pad according to any one of [2-1] to [2-5], wherein, in the pore size distribution of the aforementioned resin sheet, the peak position of the largest peak in the range of 0.050 μm or more and 360 μm or less is in the range of 0.050 μm or more and 10.0 μm or less.

[0077] [2-7]

[0078] The polishing pad according to any one of [2-1] to [2-6], wherein, in the pore size distribution of the aforementioned resin sheet, the cumulative pore volume Vo in the range of 0.100 μm or more and 360 μm or less is 0.040 cm3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less. 3 / g or less.

[0079] [2-8]

[0080] The polishing pad according to any one of [2-1] to [2-7], wherein, in the distribution of the fine pores of the resin sheet, a cumulative pore volume V0' in a range of 0.050 μm or more and 360 μm or less in pore diameter is 0.040 cm 3 / g or more and 0.200 cm 3 / g or less.

[0081] [2-9]

[0082] The polishing pad according to any one of [2-1] to [2-8], wherein the resin sheet has a microphase separation structure.

[0083] [2-10]

[0084] The polishing pad according to any one of [2-1] to [2-9], wherein the resin sheet contains a polyurethane.

[0085] [2-11]

[0086] A polishing pad which is a polishing pad provided with a resin sheet having fine pores,

[0087] In the distribution of the fine pores of the resin sheet measured by a mercury porosimetry with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, a cumulative pore volume V" in a range of 0.050 μm or more and 10.0 μm or less in pore diameter is 0.020 cm 3 / g or more and 0.140 cm 3 / g or less,

[0088] The density of the resin sheet is 0.9 g / cm 3 or more and 1.3 g / cm 3 or less.

[0089] [2-12]

[0090] A method for manufacturing a polishing pad according to any one of [2-1] to [2-11], the method comprising the steps of:

[0091] curing a mixed solution of at least one prepolymer and at least two curing agents, thereby obtaining a resin sheet having a microphase separation structure.

[0092] [2-13]

[0093] The method for manufacturing a polishing pad according to [2-12], wherein the curing agent contains a first curing agent having an NH2 equivalent of 100 or more and 300 or less, a second curing agent having an OH equivalent of 200 or more and 500 or less, and a third curing agent having an OH equivalent of 1000 or more and 2000 or less.

[0094] [2-14]

[0095] A method for manufacturing a polishing object, including a polishing step of polishing a polishing object using the polishing pad according to any one of [2-1] to [2-11] in the presence of a polishing slurry.

[0096] The inventors of the present application have conducted intensive studies in order to solve the third problem, and as a result, have found that the third problem can be solved by using a resin sheet having a prescribed property, thereby completing the present application.

[0097] That is, the present application includes the following modes.

[0098] [3-1]

[0099] A polishing pad that is a polishing pad provided with a resin sheet having fine pores,

[0100] In the fine pore distribution of the aforementioned resin sheet measured by a mercury porosimetry by setting a contact angle to 130° and a mercury surface tension to 485 dyn / cm, a cumulative pore volume V in a range of a fine pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more and 1.00 cm 3 / g or less,

[0101] The density of the aforementioned resin sheet is 0.3 g / cm 3 or more and 0.9 g / cm 3 or less.

[0102] [3-2]

[0103] The polishing pad according to [3-1], wherein in the aforementioned fine pore distribution of the aforementioned resin sheet, a proportion of the aforementioned cumulative pore volume V with respect to a cumulative pore volume Vo in a range of a fine pore diameter of 0.010 μm or more and 360 μm or less is 50% or more.

[0104] [3-3]

[0105] The polishing pad according to [3-1] or [3-2], wherein an average opening diameter determined by taking as an object an opening of 10 μm or more in the aforementioned resin sheet is 50 μm or more and 200 μm or less.

[0106] [3-4]

[0107] The polishing pad according to any one of [3-1] to [3-3], wherein in the aforementioned fine pore distribution of the aforementioned resin sheet, a peak position of a maximum peak in a range of a fine pore diameter of 0.010 μm or more and 360 μm or less is in a range of a fine pore diameter of 0.010 μm or more and 1.0 μm or less.

[0108] [3-5]

[0109] The polishing pad according to any one of [3-1] to [3-4], wherein the aforementioned resin sheet has a microphase separation structure.

[0110] [3-6]

[0111] The polishing pad according to any one of [3-1] to [3-5], wherein the aforementioned resin sheet contains polyurethane.

[0112] [3-7]

[0113] A method for manufacturing the polishing pad according to any one of [3-1] to [3-6], the method comprising the following steps:

[0114] A mixture of at least one prepolymer and at least two curing agents is cured, thereby obtaining a resin sheet having a microphase separation structure.

[0115] [3-8]

[0116] The method for manufacturing the polishing pad according to [3-7], wherein the aforementioned curing agent contains a first curing agent having an NH2 equivalent weight of 100 or more and 300 or less, and a second curing agent having an OH equivalent weight of 1000 or more and 2000 or less.

[0117] [3-9]

[0118] A method for manufacturing a polished article, the method having a polishing step of polishing a workpiece using the polishing pad according to any one of [3-1] to [3-6] in the presence of a slurry.

[0119] The present inventors have conducted intensive studies in order to solve the fourth problem, and as a result, have found that the fourth problem can be solved by using a resin sheet having a prescribed property, thereby completing the present application.

[0120] That is, the present application includes the following modes.

[0121] [4-1]

[0122] A polishing pad that is a polishing pad provided with a resin sheet having fine pores,

[0123] In a fine pore distribution of the aforementioned resin sheet measured by a mercury porosimetry by setting a contact angle to 130° and a mercury surface tension to 485 dyn / cm, a cumulative fine pore volume V in a range of a fine pore diameter of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 3 / g or less,

[0124] A density of the aforementioned resin sheet is 0.9 g / cm3 The above 1.3 g / cm 3 The following.

[0125] [4-2]

[0126] The polishing pad according to [4-1], wherein, in the aforementioned pore distribution of the aforementioned resin sheet, the cumulative pore volume V' in the range of the pore diameter of 0.050 μm or more and less than 0.100 μm is 0.000 cm 3 / g or more 0.120 cm 3 / g or less.

[0127] [4-3]

[0128] The polishing pad according to [4-1] or [4-2], wherein, in the aforementioned pore distribution of the aforementioned resin sheet, the proportion of the aforementioned cumulative pore volume V with respect to the cumulative pore volume Vo in the range of the pore diameter of 0.100 μm or more and 360 μm or less is 50% or more.

[0129] [4-4]

[0130] The polishing pad according to any one of [4-1] to [4-3], wherein, in the aforementioned pore distribution of the aforementioned resin sheet, the proportion of the aforementioned cumulative pore volume V with respect to the cumulative pore volume Vo' in the range of the pore diameter of 0.050 μm or more and 360 μm or less is 50% or more.

[0131] [4-5]

[0132] The polishing pad according to any one of [4-1] to [4-4], wherein, in the aforementioned pore distribution of the aforementioned resin sheet, the peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less is in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less.

[0133] [4-6]

[0134] The polishing pad according to any one of [4-1] to [4-5], wherein, in the aforementioned pore distribution of the aforementioned resin sheet, the peak position of the largest peak in the range of the pore diameter of 0.050 μm or more and 360 μm or less is in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less.

[0135] [4-7]

[0136] The polishing pad according to any one of [4-1] to [4-6], wherein, in the aforementioned pore distribution of the aforementioned resin sheet, the cumulative pore volume Vo in the range of the pore diameter of 0.100 μm or more and 360 μm or less is 0.040 cm 30.120 cm / g or more 3 0.020 cm / g or less.

[0137] [4-8]

[0138] The polishing pad according to any one of [4-1] to [4-7], wherein, in the distribution of the fine pores of the aforementioned resin sheet, a cumulative fine pore volume V0' in a range of 0.050 pm or more and 360 pm or less in diameter of the fine pores is 0.040 cm 3 0.200 cm / g or more 3 0.020 cm / g or less.

[0139] [4-9]

[0140] The polishing pad according to any one of [4-1] to [4-8], wherein the aforementioned resin sheet has a microphase separation structure.

[0141] [4-10]

[0142] The polishing pad according to any one of [4-1] to [4-9], wherein the aforementioned resin sheet contains a polyurethane.

[0143] [4-11]

[0144] A polishing pad that is a polishing pad provided with a resin sheet having fine pores,

[0145] In the distribution of the fine pores of the aforementioned resin sheet measured by a mercury porosimetry with a contact angle of 130° and a surface tension of mercury of 485 dyn / cm, a cumulative fine pore volume V" in a range of 0.050 pm or more and 10.0 pm or less in diameter of the fine pores is 0.020 cm 3 0.140 cm / g or more 3 0.020 cm / g or less,

[0146] A density of the aforementioned resin sheet is 0.9 g / cm 3 1.3 g / cm or more 3 or less.

[0147] [4-12]

[0148] A method for manufacturing a polishing pad according to any one of [4-1] to [4-11], the method for manufacturing comprising the following steps:

[0149] A mixture of at least one prepolymer and at least two curing agents is cured, thereby obtaining a resin sheet having a microphase separation structure.

[0150] [4-13]

[0151] The method for manufacturing the polishing pad as described in [4-12], wherein the aforementioned curing agent contains a first curing agent having an NH2 equivalent weight of 100 or more and 300 or less, a second curing agent having an OH equivalent weight of 200 or more and 500 or less, and a third curing agent having an OH equivalent weight of 1000 or more and 2000 or less.

[0152] [4-14]

[0153] The method for manufacturing a polished article, comprising a polishing step of polishing a workpiece using the polishing pad described in any one of [4-1] to [4-11] in the presence of slurry.

[0154] Effects of the Invention

[0155] (Effects corresponding to the first problem)

[0156] According to the present application, it is possible to provide a polishing pad capable of imparting good planarity to a workpiece and excellent affinity with slurry, a method for manufacturing the same, and a method for manufacturing a polished article.

[0157] (Effects corresponding to the second problem)

[0158] According to the present application, it is possible to provide a polishing pad capable of imparting good planarity to a workpiece and excellent affinity with slurry, a method for manufacturing the same, and a method for manufacturing a polished article.

[0159] (Effects corresponding to the third problem)

[0160] According to the present application, it is possible to provide a polishing pad excellent in dressing property and less likely to be smoothed, a method for manufacturing the same, and a method for manufacturing a polished article.

[0161] (Effects corresponding to the fourth problem)

[0162] According to the present application, it is possible to provide a polishing pad excellent in both liquid retention property and abrasive grain retention property of slurry, a method for manufacturing the same, and a method for manufacturing a polished article. BRIEF DESCRIPTION OF DRAWINGS

[0163] (Chart corresponding to the first embodiment)

[0164] [ Figure 1-1 ] Figure 1-1 The measurement result of the cumulative pore volume (pore distribution) of the resin sheet of Example 1 based on the mercury porosimetry.

[0165] [ Figure 1-2 ] Figure 1-2 The SEM image obtained by observing the surface of the resin sheet of Example 1 at 500 times using a scanning electron microscope.

[0166] [Figure 1-3 ] Figure 1-3 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope. Figure 1-3 (B) is a figure in which a portion in which a microphase separation structure (a helical icosahedron structure) is observed in (A) is enclosed with a broken line. Figure 1-3 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0167] [ Figure 1-4 ] Figure 1-4 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0168] [ Figure 1-5 ] Figure 1-5 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0169] [ Figure 1-6 ] Figure 1-6 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0170] [ Figure 1-7 ] Figure 1-7 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0171] (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0172] [ Figure 2-1 ] Figure 2-1 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0173] [ Figure 2-2 ] Figure 2-2 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope. Figure 2-2 (B) is a figure in which a portion in which a microphase separation structure (a helical icosahedron structure) is observed in (A) is enclosed with a broken line. Figure 2-2 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0174] [ Figure 2-3 ] Figure 2-3 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0175] [ Figure 2-4 ] Figure 2-4 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000 times with a scanning electron microscope.

[0176] [Figure 2-5 ] Figure 2-5 SEM image obtained by observing the surface of the resin sheet of Comparative Example 1 at 500x using a scanning electron microscope.

[0177] (Corresponding to FIG. 4)

[0178] [ Figure 3-1 ] Figure 3-1 Measurement result of the cumulative pore volume (pore distribution) based on the mercury porosimetry of the resin sheet of Example 1.

[0179] [ Figure 3-2 ] Figure 3-2 SEM image obtained by observing the surface of the resin sheet of Example 1 at 500x using a scanning electron microscope.

[0180] [ Figure 3-3 ] Figure 3-3 (A) is an SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000x using a scanning electron microscope. Figure 3-3 (B) is a figure in which a portion in which a microphase separation structure (screwed icosahedron structure) is observed in (A) is surrounded with a dotted line. Figure 3-3 (A) is an SEM image obtained by observing the surface of the resin sheet of Example 1 at 2000x using a scanning electron microscope.

[0181] [ Figure 3-4 ] Figure 3-4 Measurement result of the cumulative pore volume (pore distribution) based on the mercury porosimetry of the resin sheet of Example 2.

[0182] [ Figure 3-5 ] Figure 3-5 SEM image obtained by observing the surface of the resin sheet of Example 2 at 500x using a scanning electron microscope.

[0183] [ Figure 3-6 ] Figure 3-6 Measurement result of the cumulative pore volume (pore distribution) based on the mercury porosimetry of the resin sheet of Comparative Example 1.

[0184] [ Figure 3-7 ] Figure 3-7 SEM image obtained by observing the surface of the resin sheet of Comparative Example 1 at 500x using a scanning electron microscope.

[0185] (Corresponding to FIG. 4)

[0186] [ Figure 4-1 ] Figure 4-1 Measurement result of the cumulative pore volume (pore distribution) based on the mercury porosimetry of the resin sheet of Example 1.

[0187] [ Figure 4-2 ] Figure 4-2(A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 500x using a scanning electron microscope. Figure 4-2 (B) is a SEM image obtained by observing the surface of the resin sheet of Example 2 at 500x using a scanning electron microscope. Figure 4-2 (A) is a SEM image obtained by observing the surface of the resin sheet of Example 1 at 500x using a scanning electron microscope.

[0188] [ Figure 4-3 ] Figure 4-3 (B) is a SEM image obtained by observing the surface of the resin sheet of Example 2 at 500x using a scanning electron microscope.

[0189] [ Figure 4-4 ] Figure 4-4 (B) is a SEM image obtained by observing the surface of the resin sheet of Example 2 at 500x using a scanning electron microscope.

[0190] [ Figure 4-5 ] Figure 4-5 (B) is a SEM image obtained by observing the surface of the resin sheet of Example 2 at 500x using a scanning electron microscope. DETAILED DESCRIPTION

[0191] Hereinafter, with respect to an embodiment of the present application (hereinafter, referred to as "the present embodiment"), a detailed description will be given in the order of <1st Embodiment>, <2nd Embodiment>, <3rd Embodiment> and <4th Embodiment>, but the present application is not limited thereto, and various modifications can be made within the scope of the gist thereof.

[0192] <1st Embodiment>

[0193] Here, a detailed description will be given of the 1st Mode (in the present specification, also referred to as "the 1st Embodiment") to which the present embodiment pertains. Note that the terms and symbols used in the <1st Embodiment> are used independently of the contents of the <2nd Embodiment>, <3rd Embodiment> and <4th Embodiment> described later.

[0194] (Polishing Pad)

[0195] The polishing pad of the present embodiment (hereinafter, "the present embodiment" in the <1st Embodiment> means the 1st Embodiment, unless otherwise specified) is a polishing pad provided with a resin sheet having a fine pore, and in the fine pore distribution of the aforementioned resin sheet measured by a mercury porosimetry with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V in the range of a fine pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more and 1.00 cm 3 / g or less, and the density of the aforementioned resin sheet is 0.3 g / cm 3 or more and 0.9 g / cm 3The following describes how the abrasive pad of this embodiment, being constructed as described above, can impart good flatness to the workpiece being abraded and exhibits excellent affinity with the slurry.

[0196] The abrasive pad of this embodiment is not particularly limited as long as it contains the resin sheet as described in this embodiment. The abrasive pad may also have a composition other than the resin sheet. Examples of compositions other than the resin sheet in the abrasive pad include conventionally known abrasive layers, buffer layers, and adhesive layers.

[0197] The abrasive pad of this embodiment preferably has the aforementioned resin sheet as an abrasive layer. "Having a resin sheet as an abrasive layer" means that at least one surface of the abrasive pad of this embodiment corresponds to the surface of the resin sheet in this embodiment, and this surface of the resin sheet becomes the abrasive surface that is pressed against the workpiece during abrasion in this embodiment. Therefore, the abrasive pad of this embodiment preferably has at least one side composed of the resin sheet in this embodiment. Alternatively, the abrasive pad of this embodiment may also be formed solely of the resin sheet in this embodiment.

[0198] For the polishing pad of this embodiment, groove processing, embossing processing, and / or hole processing (punching processing) can be performed on the polishing surface as needed, and light-transmitting parts can also be provided. The shape of groove processing and embossing processing is not particularly limited, for example, grid type, concentric circle type, and radial type.

[0199] (Resin sheet)

[0200] (density)

[0201] The density of the resin sheet in this embodiment is 0.3 g / cm³. 3 Above 0.9g / cm 3 The following applies. If the density of the resin sheet in this embodiment is 0.3 g / cm³. 3 Therefore, the abrasive pad becomes less prone to deformation under pressure, and thus, during the abrasive process, the force exerted by the abrasive pad on the workpiece becomes uniform in the direction of the abrasive surface. As a result, in abrasive processes using an abrasive pad with such a resin sheet, the abrasive surface of the workpiece can be made flatter. It should be noted that in this embodiment, "flat abrasive surface of the workpiece" means that the abraded surface of the workpiece is flatter as a whole. In other words, it can be described as having good overall flatness. From the same perspective, the density of the resin sheet in this embodiment is preferably 0.4 g / cm³. 3 The above, more preferably 0.45 g / cm 3 above.

[0202] On the other hand, if the density of the resin sheet in this embodiment is 0.9 g / cm³ 3The following resin sheet has a tendency to have a lower hardness, and in polishing processing using a polishing pad having such a resin sheet, there is a tendency to be able to suppress the generation of scratches.

[0203] The density of the resin sheet in the present embodiment can be measured using a method known in the past, for example, the mass and volume of a resin sheet piece are measured using a general method, and the density can be calculated from the obtained values. In addition, as a method of controlling the density of the resin sheet, there is no particular limitation, for example, a polishing pad can be obtained using the manufacturing method of the polishing pad of the present embodiment described later. In particular, in the manufacturing process of the resin sheet in the present embodiment, in the case where the amount of the foaming agent is reduced, there is a tendency for the density of the resin sheet to be higher.

[0204] (Pore distribution of resin sheet)

[0205] (Accumulative pore volume V)

[0206] The resin sheet in the present embodiment has pores, and in the pore distribution of the aforementioned resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the accumulative pore volume V in the range of a pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more and 1.00 cm 3 / g or less.

[0207] Note that, in the present embodiment, the so-called "pore distribution" means the pore distribution measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, unless otherwise specified. The mercury intrusion method is a method capable of measuring the pore distribution on the surface of a measurement sample by filling mercury into the pores on the surface of the measurement sample while scanning the applied pressure. Therefore, in the case where the pore distribution is measured for a foamed material by the mercury intrusion method, the pore distribution thereof mainly reflects the pore distribution of the connected bubbles (also generally referred to as "continuous bubbles"), and the contribution of the pore distribution of the independent bubbles is small.

[0208] With regard to the polishing pad of the present embodiment, the inventors of the present application found that, in the pore distribution measured by the mercury intrusion method, when the accumulative pore volume V in the range of a pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more, the affinity of the polishing pad to the slurry becomes sufficiently good. It is inferred that this is because, when the accumulative pore volume V is 0.21 cm 3 / g or more, the connected pores having a pore diameter of 0.010 μm or more and 1.0 μm or less are distributed throughout the resin sheet, and at the time of polishing processing, the slurry becomes uniformly permeated into the inside of the resin sheet via the connected pores. However, since the cumulative pore volume V is 0.21 cm 3 The reason why the affinity of the polishing pad to the slurry becomes sufficiently good when the cumulative pore volume V is 0.30 cm

[0209] From the viewpoint of further improving the affinity to the slurry, in the resin sheet of the present embodiment, the cumulative pore volume V is preferably 0.30 cm 3 / g or more, and more preferably 0.40 cm 3 / g or more.

[0210] In the resin sheet of the present embodiment, the cumulative pore volume V is 1.00 cm 3 / g or less. By making the cumulative pore volume V 1.00 cm 3 / g or less, there is a tendency that the density of the resin sheet easily becomes within the above range, and in polishing processing using a polishing pad provided with such a resin sheet, it is possible to make the polished surface of the object to be polished more flat. From the same viewpoint, the cumulative pore volume V is preferably 0.90 cm 3 / g or less.

[0211] If the cumulative pore volume V is within a range of 0.21 cm 3 / g or more and 1.00 cm 3 / g or less, the dressing property of the resin sheet becomes excellent. Note that, by "dressing" or "dressing processing", it means processing of making the surface roughness of the polishing surface of the polishing pad uniform, or making the flatness uniform, using a dressing tool (for example, a diamond dresser or sandpaper) in which abrasive grains or the like are fixed, before polishing the object to be polished. Also, by "excellent dressing property", it means that sufficient dressing processing can be performed by processing under comparatively easy conditions. By "polishing surface", it means the surface of the polishing pad which contacts or is supposed to contact the object to be polished at the time of polishing the object to be polished using the polishing pad.

[0212] (Ratio of cumulative pore volume V to cumulative pore volume Vo)

[0213] In the polishing pad of the present embodiment, the ratio of the cumulative pore volume V in the range of 0.010 μm or more and 1.0 μm or less in pore diameter to the cumulative pore volume V0 in the range of 0.010 μm or more and 360 μm or less in pore diameter is preferably 50% or more in the pore distribution of the resin sheet from the viewpoint of further improving the balance between the flatness imparted to the object to be polished and the affinity with the slurry. In other words, the ratio of the cumulative pore volume V to the cumulative pore volume V0 (V / V0) is preferably 0.50 or more. According to such a manner, the proportion of the pores of the resin sheet having a relatively small pore diameter increases, and thus the density equivalent to that of the conventional product can be maintained, and the number of connected air bubbles within the resin sheet is increased.

[0214] From the same viewpoint, the ratio of the cumulative pore volume V to the cumulative pore volume V0 is more preferably 60% or more, further preferably 65% or more, and further more preferably 70% or more. The upper limit of the ratio of the cumulative pore volume V to the cumulative pore volume V0 is not particularly limited, and the ratio of the cumulative pore volume V to the cumulative pore volume V0 can be 100% or less, 99% or less, 95% or less, 90% or less, 85% or less, or 80% or less.

[0215] (Maximum peak position)

[0216] In the pore distribution of the resin sheet in the present embodiment, the maximum peak position in the range of 0.010 μm or more and 360 μm or less in pore diameter is preferably in the range of 0.010 μm or more and 1.0 μm or less. Generally, in the mercury porosimetry, the pore distribution is measured as the cumulative pore volume from the largest pore diameter of the measurement range. Therefore, the "maximum peak position in the range of 0.010 μm or more and 360 μm or less in pore diameter" means the position (pore diameter) of the maximum peak of the Log differential pore volume distribution (dV / d(log D)) calculated from the pore distribution obtained by the mercury porosimetry. In addition, the maximum peak means the maximum point in the case where a plurality of maximum points exist in the range of 0.010 μm or more and 360 μm or less in pore diameter.

[0217] By having the peak position of the largest peak in the range of the pore diameter of 0.010 μm or more and 360 μm or less within the range of the pore diameter of 0.010 μm or more and 1.0 μm or less, the resin sheet has pores distributed more uniformly in the range of 0.010 μm or more and 1.0 μm or less, and thus has a tendency that the affinity of the polishing pad to the slurry and the dishing are further improved. From the viewpoint of further improving the affinity of the polishing pad to the slurry and the dishing, the peak position of the largest peak in the range of the pore diameter of 0.010 μm or more and 360 μm or less is more preferably within the range of the pore diameter of 0.010 μm or more and 0.5 μm or less, further preferably within the range of the pore diameter of 0.030 μm or more and 0.5 μm or less, and more further preferably within the range of the pore diameter of 0.050 μm or more and 0.5 μm or less.

[0218] From the same viewpoint, the position of the largest peak in the range of 1.0 μm or more and 360 μm or less is more preferably within the range of the pore diameter of 50 μm or more and 200 μm or less.

[0219] (Number of peaks and peak height)

[0220] In the Log differential pore volume distribution of the resin sheet in the present embodiment, the number of peaks in the range of the pore diameter of 0.010 μm or more and 360 μm or less is preferably 2 or more and 4 or less, more preferably 2, and further preferably 1 in the range of 0.010 μm or more and 1.0 μm or less and 1 in the range of 1.0 μm or more and 360 μm or less. By having the number of peaks within the above range, pores are distributed more uniformly, and thus there is a tendency that the affinity of the polishing pad to the slurry and the dishing are further improved.

[0221] From the same viewpoint, in the Log differential pore volume distribution, the maximum peak height in the range of the pore diameter of 0.010 μm or more and 1.0 μm or less is preferably 2 times or more, more preferably 2.5 times or more, and further preferably 3 times or more, as compared with the maximum peak height in the range of the pore diameter of 1.0 μm or more and 360 μm or less.

[0222] (Cumulative pore volume V0)

[0223] In the pore distribution of the resin sheet in the present embodiment, the cumulative pore volume V0 in the range of the pore diameter of 0.010 μm or more and 360 μm or less is preferably 0.1 cm 3 / g or more and 2.0 cm 3 / g or less, more preferably 0.4 cm 3 / g or more and 2.0 cm 3 / g or less, further preferably 0.5 cm 3 / g or more and 1.5 cm 3more preferably 0.6 cm 3 more preferably 1.2 cm 3 more preferably 0.6 cm. By making the cumulative pore volume Vo within the above range, there is a tendency for further improvement in the balance between flatness imparted to the object being polished and affinity with the slurry.

[0224] In the present embodiment, the cumulative pore volume V and the cumulative pore volume Vo are calculated from the pore distribution measured by the mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, and the measurement conditions of the mercury intrusion method can be the method described in the Examples. In addition, the method of controlling the values of the cumulative pore volume V, the cumulative pore volume Vo, the ratio of the cumulative pore volume V to the cumulative pore volume Vo, the peak position of the largest peak, the number of peaks, and the peak height is not particularly limited, and for example, the polishing pad can be obtained by using the manufacturing method of the polishing pad of the present embodiment described later.

[0225] (Structure of the resin sheet)

[0226] The resin sheet in the present embodiment preferably has a microphase separation structure. In the present embodiment, the "microphase separation structure" refers to a phase separation structure formed via microphase separation. In addition, in the present embodiment, the "microphase separation" refers to phase separation in which a microstructure pattern (typically, micrometer order) is periodically repeated in at least one dimension in a macroscopically uniform object. The microphase separation can be generated by, for example, using the preferred manufacturing conditions in the manufacturing method of the polishing pad of the present embodiment described later. As typical examples of the microphase separation structure, although not limited to the following structures, there can be mentioned a spherical structure (island-in-sea structure), a cylindrical structure, a lamellar structure, and a three-dimensional network structure. The microphase separation structure in the present embodiment preferably includes a cylindrical structure, a lamellar structure, and a three-dimensional network structure, and more preferably a three-dimensional network structure.

[0227] In the present embodiment, the three-dimensional network structure refers to a structure in which a network in a net shape is formed in three dimensions. As the three-dimensional network structure resulting from microphase separation, there can also be a structure including a single-helical icosahedron structure and / or a double (multiple) helical icosahedron structure. In the present embodiment, the single-helical icosahedron structure typically refers to a network structure in which a unit cell is formed by combining fine wire structures in which 2 three-way junctions are twisted into pairs, and the unit cell is periodically repeated, and the double (multiple) helical icosahedron structure refers to a structure in which 2 or more single-helical icosahedron structures are combined into a box.

[0228] The cross section of the resin sheet having a continuous foaming structure derived from the injection of a foaming agent or a non-reactive gas of the past has a tendency to observe a substantially spherical foaming cross section and a resin flat portion (i.e., sea-island structure formed of a sea of resin and islands of voids). On the other hand, in the case where the resin sheet of the present embodiment has a double (multiple) gyroid icosahedron structure, in the cross section thereof, typically, there is a tendency to observe a structure in which two or more resins have occurred phase separation in a mottled manner in the micron order. In addition, in the case where the resin sheet of the present embodiment has a single gyroid icosahedron structure, in the cross section thereof, typically, an amorphous void cross section and a resin skeleton / resin skeleton cross section are observed. In the case where the resin skeleton portion is sufficiently larger than the void, the resin skeleton portion is not always observed and is substantially observed as a sea of resin, and even in this case, the voids of the resin sheet of the present embodiment are formed in a three-dimensional network so as to be in communication with each other.

[0229] Note that, in observing the cross section of the resin sheet of the present embodiment, there is a case where the boundary between the two features of the mottled pattern of two or more resins and the amorphous void cross section and the resin skeleton / resin skeleton cross section, i.e., the double (multiple) gyroid icosahedron structure and the single gyroid icosahedron structure, cannot be clearly distinguished, and in this case, it can be evaluated as containing at least one of the single gyroid icosahedron structure and the double (multiple) gyroid icosahedron structure.

[0230] In the case where the resin sheet of the present embodiment has a single gyroid icosahedron structure and / or a double (multiple) gyroid icosahedron structure, typically, in the Log differential fine pore volume distribution, a sharp peak (maximum value) is also measured in the range of a fine pore diameter of 0.010 μm or more and 10.0 μm or less.

[0231] The resin sheet of the present embodiment can contain two or more phases having different compositions. In the present embodiment, the "composition" of a phase includes both the resin as a main component of the phase and the components other than the main component contained in the phase, and further, the blending ratio thereof is also taken into consideration. Therefore, the microphase separation structure possessed by the resin sheet of the present embodiment can contain two or more phases different from each other in at least any one of the resin as a main component of the phase and the components other than the main component contained in the phase, and typically, can contain two or more phases different from each other in at least one or more of the structure, the average molecular weight, and the functional group of the resin as a main component of the phase.

[0232] As an example of the two phases having different compositions, the following cases can be given: a case where the kind of resin constituting the phases is different between one phase and the other phase; a case where the content of the additive contained is different between one phase and the other phase; and a case where the resin sheet is formed of an AB block polymer, and one phase is a phase in which A blocks are the main component, and the other phase is a phase in which B blocks are the main component.

[0233] As a typical example of the microphase separation structure including two phases having different compositions from each other, the following cases can be given: a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by a prepolymer different from the prepolymer in the first phase and the curing agent in the first phase; a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by the prepolymer in the first phase and a curing agent different from the curing agent in the first phase; and a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by a prepolymer different from the prepolymer in the first phase and a curing agent different from the curing agent in the first phase; and the like.

[0234] The resin sheet in the present embodiment can have a void due to microphase separation. The void can also be said to be a void constituting the microphase separation structure, and as a specific example thereof, although not limited to the following void, a void divided by a resin skeleton providing a gyroid structure can be given. Note that in the present embodiment, the void can be a void from a fine hole, or a void from a communication hole formed by communication of a plurality of fine holes.

[0235] The resin sheet having the microphase separation structure in the present embodiment can be obtained, for example, by the manufacturing method of the polishing pad of the present embodiment described later. In addition, that the resin sheet has the microphase separation structure can be confirmed by observation with a scanning electron microscope (SEM) at a magnification of about 300 times to about 3000 times.

[0236] Note that, regarding the resin sheet having the microphase separation structure including two or more phases having different compositions or having the aforementioned void, observation can be performed by an optical method such as an optical microscope and a phase contrast microscope, a method using an electron microscope such as a scanning electron microscope and a transmission electron microscope, a method using scattering of particles such as light scattering, neutron ray small-angle scattering, and X-ray small-angle scattering, an X-ray diffraction method, a fluorescence method, and a pulsed NMR measurement method.

[0237] (Average opening diameter of resin sheet)

[0238] The average opening diameter of the resin sheet in the present embodiment is not particularly limited, but is preferably 50 μm or more and 300 μm or less, more preferably 50 μm or more and 200 μm or less, when measured with respect to openings of 10 μm or more.

[0239] The average opening diameter can be measured, for example, by the method described in the Examples described later. In addition, the average opening diameter can be adjusted to the above range by, for example, the type and / or amount of the blowing agent and the cell stabilizer.

[0240] (Average thickness of resin sheet)

[0241] The average thickness of the resin sheet in the present embodiment is not particularly limited, but is preferably 0.5 mm or more and 10.0 mm or less, more preferably 0.6 mm or more and 8.0 mm or less, further preferably 0.7 mm or more and 5.0 mm or less.

[0242] (Physical properties of resin sheet)

[0243] The compression rate of the resin sheet in the present embodiment is not particularly limited, but is preferably 0.1% or more and 5.0% or less, more preferably 0.3% or more and 3.0% or less. Note that the compression rate of the resin sheet can be calculated according to Japanese Industrial Standards (JIS L 1021) using a SHOP PER-type thickness tester (pressing surface: circular shape with a diameter of 1 cm). Specifically, the thickness to after application of an initial load for 30 seconds from a no-load state (to) can be measured, and then the thickness ti after application of a final pressure for 30 seconds from the state of to can be measured, and the compression rate can be calculated from the following equation. Note that the initial load is 100 g / cm 2 , and the final pressure is 1120 g / cm 2 .

[0244] Compression rate (%) = 100 x (to - ti) / to

[0245] The compressive elastic modulus of the resin sheet in the present embodiment is not particularly limited, but is preferably 70% or more and 100% or less, and more preferably 75% or more and 95% or less. Note that the compressive elastic modulus of the resin sheet can be found in accordance with Japanese Industrial Standards (JIS L 1021) using a SHOPPER-type thickness tester (pressing surface: circular shape with a diameter of 1 cm). Specifically, the thickness t0 after 30 seconds from the application of an initial load from a no-load state can be measured, next, the thickness t1 after 30 seconds from the application of a final pressure from the thickness t0 state can be measured, and further, the thickness t0' after 30 seconds from the re-application of the initial load from the thickness t1 state after the removal of all loads and the placement for 5 minutes (to become a no-load state) can be measured, whereby it is calculated from the following formula. Note that the initial load is 100 g / cm 2 , and the final pressure is 1120 g / cm 2 .

[0246] Compressive ratio (%) = 100 x (t0' - t1) / (t0 - t1)

[0247] The Shore D hardness of the resin sheet in the present embodiment is not particularly limited, but is preferably 10 or more and 70 or less, and more preferably 20 or more and 60 or less. Note that the Shore D hardness of the resin sheet can be found in accordance with Japanese Industrial Standards (JIS K7311) using a D-type hardness tester.

[0248] (Material of the resin sheet)

[0249] The material of the resin sheet in the present embodiment is not particularly limited. As the material of the resin sheet, for example, a polyurethane resin can be given. As the polyurethane resin, there is no particular limitation, and for example, a polyester-based polyurethane resin, a polyether-based polyurethane resin, and a polycarbonate-based polyurethane resin can be given. These can be used alone or in combination with two or more.

[0250] Among these, the material of the resin sheet in the present embodiment preferably contains at least either one of a polyester-based polyurethane resin and a polyether-based polyurethane resin. It is particularly preferable to contain a polyurethane resin described below as a cured product of a mixed solution containing a urethane prepolymer and at least two curing agents in the manufacturing method of the polishing pad of the present embodiment. By using such a resin, there is a tendency that the density and the fine pore distribution can be easily brought within the above-described range.

[0251] In addition, the resin sheet in the present embodiment can contain components from additives in addition to the resin components. As such additives, for example, defoaming agents, catalysts, foaming agents, foam stabilizers, abrasive grains, dyes, pigments, solid microparticles, flame retardants, hydrophilizing agents, hydrophobizing agents, light-resistant agents, antioxidants, and antistatic agents, and the like described later in the manufacturing method of the polishing pad of the present embodiment can be cited.

[0252] [Manufacturing method of polishing pad]

[0253] The manufacturing method of the polishing pad of the present embodiment includes a step of curing a mixed solution of at least one prepolymer and at least two curing agents, thereby obtaining a resin sheet having a microphase separation structure. According to such a method, the polishing pad of the present embodiment can be easily manufactured. Hereinafter, each step of the manufacturing method of the polishing pad will be described in detail.

[0254] (Mixing step)

[0255] The manufacturing method of the polishing pad of the present embodiment can include a mixing step of preparing a mixed solution of at least one prepolymer and at least two curing agents. By using at least two curing agents in the mixing step, a resin sheet having a microphase separation structure can be obtained in a molding step after the mixing step. In particular, by using two or more curing agents to form a microphase separation structure, it is easier to control the curing reaction and the shape of the microphase separation structure compared to the case where two or more prepolymers are used to form a microphase separation structure.

[0256] In the mixing step, for example, at least one prepolymer heated to 30°C to 90°C and at least two curing agents can be put into a temperature-adjustable jacketed mixer, and stirred at 30°C to 130°C. At this time, as necessary, the mixed solution can be received in a tank with a stirrer and a jacket, and allowed to mature. The stirring time is appropriately adjusted depending on the number of teeth, the rotation speed, the gap, and the like of the mixer, and is, for example, 0.1 seconds to 60 seconds.

[0257] (Curing agent)

[0258] The curing agent used in the mixing step is not particularly limited, and for example, a compound containing an amino group and a compound containing a hydroxyl group can be given. As the compound containing an amino group, there is no particular limitation, and for example, 4,4'-methylenebis(2-chloroaniline) (MOCA), ethylenediamine, propylenediamine, hexamethylenediamine, isophorone diamine, dicyclohexylmethane-4,4'-diamine, 4-methyl-2,6-bis(methylthio)-1,3-benzenediamine, 2-methyl-4,6-bis(methylthio)-1,3-benzenediamine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 2,2-bis[3-(isopropylamino)-4-hydroxyphenyl]propane, 2,2-bis[3-(1-methylpropylamino)-4-hydroxyphenyl]propane, 2,2-bis[3-(1-methylpentylamino)-4-hydroxyphenyl]propane, 2,2-bis(3,5-diamino-4-hydroxyphenyl)propane, 2,6-diamino-4-methylphenol, trimethylenediamine bis-4-aminobenzoate, and polytetramethyleneoxy-di-p-aminobenzoate, and the like can be given. As the compound containing an amino group, 4,4'-methylenebis(2-chloroaniline) is preferred.

[0259] As the compound containing a hydroxyl group, there is no particular limitation, and for example, ethylene glycol, propylene glycol, diethylene glycol, trimethylene glycol, tetraethylene glycol, triethylene glycol, dipropylene glycol, 1,4-butanediol, 1,3-butanediol, 2,3-butanediol, 1,2-butanediol, 3-methyl-1,2-butanediol, 1,2-pentanediol, 1,4-pentanediol, 2,4-pentanediol, 2,3-dimethyltrimethylene glycol, tetramethylene glycol, 3-methyl-4,3-pentanediol, 3-methyl-4,5-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,6-hexanediol, 1,5-hexanediol, 1,4-hexanediol, 2,5-hexanediol, 1,4-cyclohexanedimethanol, neopentyl glycol, glycerol, trimethylolpropane, trimethylolethane, trimethylolmethane, polybutylene glycol, polyethylene glycol, and polypropylene glycol, and the like can be given. From the viewpoint of controlling the reaction, as the compound containing a hydroxyl group, a compound having 2 functions (diol) is more preferably used than a compound having 3 or more functions. In addition, as the compound containing a hydroxyl group, polybutylene glycol is more preferred.

[0260] Note that the above curing agent can be used in combination with two or more. The combination of the curing agent is not particularly limited, but a combination described later is preferred.

[0261] The active hydrogen equivalent weight (e.g., NH2 equivalent weight and OH equivalent weight) of the curing agent is not particularly limited, and can be, for example, 50 or more and 5000 or less, 100 or more and 4000 or less, or 130 or more and 3000 or less. In addition, the OH equivalent weight of the curing agent as a compound containing a hydroxyl group can be 100 or more and 5000 or less, 200 or more and 4000 or less, or 300 or more and 3000 or less. The NH2 equivalent weight of the curing agent as a compound containing an amino group can be 50 or more and 2000 or less, 75 or more and 1000 or less, or 100 or more and 300 or less.

[0262] In the mixing step, at least two kinds of curing agents can be used. As a combination of curing agents, it is preferable to use curing agents that are low in compatibility with each other, and / or different in reactivity, and / or different in active hydrogen equivalent weight. According to such a manner, there is a tendency that a microphase separation structure can be obtained more reliably. As an example of a combination of curing agents that are different in reactivity, for example, a combination of curing agents that are different in active hydrogen group can be given, and more specifically, for example, a combination of a compound containing an amino group and a compound containing a hydroxyl group can be given.

[0263] In the case where two or more kinds of curing agents having the same active hydrogen group are used, that is, in the case where two or more kinds of compounds containing a hydroxyl group are used, or in the case where two or more kinds of compounds containing an amino group are used, it is preferable that the two or more kinds of curing agents include two kinds of curing agents that are different in active hydrogen equivalent weight by 500 or more and 2000 or less. It is more preferable that the two or more kinds of curing agents include a curing agent having an active hydrogen equivalent weight of 200 or more and 500 or less, and a curing agent having an active hydrogen equivalent weight of 1000 or more and 2000 or less.

[0264] In the case where two or more kinds of curing agents having the same active hydrogen group are used, and the two or more kinds of curing agents include two kinds of curing agents that are different in active hydrogen equivalent weight by 500 or more and 2000 or less, the ratio of the amount of use of the curing agent having a small active hydrogen equivalent weight to the amount of use of the curing agent having a large active hydrogen equivalent weight, "curing agent having a small active hydrogen equivalent weight : curing agent having a large active hydrogen equivalent weight", is preferably 1:1 to 1:15, and more preferably 1:1 to 1:10, in terms of the number ratio of active hydrogen groups.

[0265] In the case where two or more curing agents having the same active hydrogen group are used, and the two or more curing agents include a curing agent having an active hydrogen equivalent weight of 200 or more and less than 500, and a curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000, the ratio of the amount of use of the curing agent having an active hydrogen equivalent weight of 200 or more and less than 500 to the amount of use of the curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000, "curing agent having an active hydrogen equivalent weight of 200 or more and less than 500 : curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000", is preferably 1 : 1 to 1 : 15 in terms of the number ratio of active hydrogen groups, and more preferably 1 : 1 to 1 : 10.

[0266] As a specific preferred combination of the curing agents, at least two kinds of the curing agents preferably include a compound containing an amino group and a compound containing a hydroxyl group. At least two kinds of the curing agents more preferably include one kind of a compound containing an amino group and two or more kinds of a compound containing a hydroxyl group, or two or more kinds of a compound containing an amino group and one kind of a compound containing a hydroxyl group. At least two kinds of the curing agents further preferably include one kind of a compound containing an amino group and two or more kinds of a compound containing a hydroxyl group.

[0267] In the case where at least two kinds of the curing agents include a compound containing an amino group and a compound containing a hydroxyl group, the difference between the NH2 equivalent weight of the compound containing an amino group and the OH equivalent weight of the compound containing a hydroxyl group is not particularly limited, but the OH equivalent weight of the compound containing a hydroxyl group is preferably large, and more preferably the OH equivalent weight of the compound containing a hydroxyl group is 100 or more and less than 2000 larger than the NH2 equivalent weight of the compound containing an amino group.

[0268] In the case where at least two kinds of the curing agents include a compound containing an amino group and a compound containing a hydroxyl group, the proportion of the amount of use of the curing agent as the compound containing an amino group with respect to the total amount of use of the curing agents is preferably 35% or more and less than 95%, and more preferably 40% or more and less than 90% in terms of the number ratio of functional groups.

[0269] As an example of the combination of the preferred curing agent, at least two curing agents include a first curing agent (a compound containing an amino group) having an NH2 equivalent of 100 or more and 300 or less, and a second curing agent (a compound containing a hydroxyl group) having an OH equivalent of 1000 or more and 2000 or less. The ratio of the use amount of the first curing agent to the use amount of the second curing agent is not particularly limited, and the use amount of the first curing agent is preferably 35% or more and 98% or less, more preferably 35% or more and 95% or less, and further preferably 40% or more and 90% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent. The use amount of the second curing agent is preferably 2% or more and 60% or less, more preferably 3% or more and 60% or less, and further preferably 5% or more and 50% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent. In addition, the use amount of the first curing agent is preferably 10% or more and 90% or less, more preferably 15% or more and 80% or less, in terms of mass, relative to the entire use amount of the curing agent. The use amount of the second curing agent is preferably 10% or more and 50% or less, more preferably 15% or more and 40% or less, in terms of mass, relative to the entire use amount of the curing agent.

[0270] Generally, the total of the use amounts of the curing agents is regulated by an R value, which is the equivalent ratio of the active hydrogen groups (amino and hydroxyl groups) present in the curing agents when the number of functional groups possessed by the prepolymer is taken as 1. The total of the use amounts of the curing agents is preferably adjusted so that the R value is 0.7 or more and 1.3 or less. The R value is more preferably 0.8 or more and 1.2 or less.

[0271] Note that, by using the above-described preferred combination of the curing agents in an appropriate use amount, it is possible to more reliably obtain a resin sheet having a cumulative pore volume V of 0.21 cm 3 / g or more and 1.00 cm 3 / g or less and / or a resin sheet having a microphase separation structure. Note that, as the combination of the curing agents, two or more curing agents having low compatibility with each other, two or more curing agents having different reactivity from each other, and / or curing agents having different active hydrogen equivalent weights can be used. Even in the case where a resin sheet having a clear microphase separation structure is not obtained by using such a combination, by implementing adjustment such as changing the types of the curing agents in a manner in which the compatibility with each other is higher, changing the curing agents in a manner in which the reactivity of each other is similar, and / or changing the curing agents in a manner in which the active hydrogen equivalent weights of each other are similar, there is a tendency to obtain a resin sheet having a microphase separation structure.

[0272] (prepolymer)

[0273] As the prepolymer used in the mixing step, there is no particular limitation, and for example, a urethane prepolymer can be given. As the urethane prepolymer, for example, an adduct of hexamethylene diisocyanate with glycerol; an adduct of 2,4-toluene diisocyanate with hydroquinone; an adduct of 2,4-toluene diisocyanate with poly(oxytetramethylene) glycol with diethylene glycol; an adduct of toluene diisocyanate with glycerol; an adduct of toluene diisocyanate with trimethylolpropane; an adduct of xylylene diisocyanate with trimethylolpropane; an adduct of hexamethylene diisocyanate with trimethylolpropane; and an adduct of isocyanuric acid with hexamethylene diisocyanate can be given. In addition, a compound containing an isocyanate group prepared by the reaction of a polyisocyanate compound with a polyhydric alcohol compound other than these, various urethane prepolymers commercially available can also be used.

[0274] As the polyisocyanate compound used for preparing the compound containing an isocyanate group, there is no particular limitation as long as it has 2 or more isocyanate groups in the molecule. For example, as a diisocyanate compound having 2 isocyanate groups in the molecule, m-phenylene diisocyanate, p-phenylene diisocyanate, 2,6-toluene diisocyanate (2,6-TDI), 2,4-toluene diisocyanate (2,4-TDI), naphthalene-1,4-diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), 4,4'-methylenebis(cyclohexyl isocyanate) (hydrogenated MDI), 3,3'-dimethoxy-4,4'-diphenyl diisocyanate, 3,3'-dimethyl diphenylmethane-4,4'-diisocyanate, xylylene-1,4-diisocyanate, 4,4'-diphenylpropane diisocyanate, trimethylene diisocyanate, hexamethylene diisocyanate, propylene-1,2-diisocyanate, butylene-1,2-diisocyanate, cyclohexylene-1,2-diisocyanate, cyclohexylene-1,4-diisocyanate, p-phenylene diisothiocyanate, xylylene-1,4-diisothiocyanate, and ethylene diisothiocyanate can be given.

[0275] These polyisocyanate compounds can be used alone or in combination of 2 or more. As the polyisocyanate compound, a diisocyanate compound is preferred, and 2,4-TDI and 2,6-TDI, MDI are more preferred.

[0276] As the polyol compound used for preparing a compound containing an isocyanate group, for example, there can be mentioned glycol compounds such as ethylene glycol, diethylene glycol (DEG), butylene glycol, and the like; triol compounds and the like; polyether polyol compounds such as polypropylene glycol (PPG) and poly(oxytetramethylene) glycol (PTMG); polyester polyol compounds such as a reaction product of ethylene glycol and adipic acid, a reaction product of butylene glycol and adipic acid, and the like; polycarbonate polyol compounds; and polycaprolactone polyol compounds. In addition, a 3-functional propylene glycol obtained by adding ethylene oxide can also be used. The polyol compound can be used alone or in combination with two or more kinds.

[0277] The NCO equivalent of the urethane prepolymer is preferably 150 or greater and 700 or less, more preferably 200 or greater and 600 or less, and further preferably 200 or greater and 500 or less. The "NCO equivalent" is a value indicating the molecular weight of the urethane prepolymer per 1 NCO group, calculated by "(mass parts of the polyisocyanate compound + mass parts of the polyol compound) / [(number of functional groups per 1 molecule of the polyisocyanate compound x mass parts of the polyisocyanate compound / molecular weight of the polyisocyanate compound) - (number of functional groups per 1 molecule of the polyol compound x mass parts of the polyol compound / molecular weight of the polyol compound)]".

[0278] In the mixing step, at least one prepolymer can be used. The prepolymer can also be used in combination with two or more kinds of the above-described prepolymer, but it is preferable to use one kind alone. According to such a manner, there is a tendency that it is easy to control the curing reaction and it is possible to easily control the shape of the microphase separation structure. As the prepolymer, it is preferable to use a urethane prepolymer in which toluene diisocyanate is used as a main component alone.

[0279] The amount of the prepolymer used is not particularly limited, and it is preferable to be 30 parts by mass or greater and 80 parts by mass or less, and more preferably 40 parts by mass or greater and 75 parts by mass or less, relative to the entire mixed solution.

[0280] (Additives)

[0281] In the mixing step, components other than the prepolymer and the curing agent can also be mixed as additives. As the additives, there can be mentioned solvents (diluents) such as polypropylene glycol; antifoaming agents such as silicone-based antifoaming agents; catalysts; blowing agents such as water and hollow microparticles; foam stabilizers such as silicone-based foam stabilizers; and fillers (abrasive particles) such as cerium oxide; dyes; pigments; solid microparticles; flame retardants; hydrophilizing agents; hydrophobizing agents; light-resistant agents; antioxidants; antistatic agents, and the like. From the viewpoint of making the density of the obtained resin sheet 0.3 g / cm 3 0.9 g / cm 3 From the above viewpoint, it is preferable to add a blowing agent in order to adjust the density, and it is more preferable to adjust the amount of the blowing agent added.

[0282] In the mixing step, the reaction rate of the curing reaction can be controlled by adjusting the type and amount of the catalyst added, thereby controlling the microphase separation structure formed.

[0283] (Forming step)

[0284] The forming step is a step of obtaining a resin sheet having a microphase separation structure by curing the mixed solution obtained as described above. In the forming step, for example, the mixed solution obtained in the mixing step can be cast into a mold frame that has been preheated to 30°C to 150°C, and heated at around 30°C to 150°C for 10 minutes to 5 hours or so. Thus, the prepolymer reacts with the curing agent to form a resin, and the mixed solution described above is cured. Alternatively, the mixed solution can be further heated in an oven at around 50°C to 180°C for 10 minutes to 10 hours or so, thereby performing secondary curing. In the manufacturing method of the polishing pad of the present embodiment, since the mixed solution is the mixed solution described above, a resin block having a microphase separation structure can be obtained.

[0285] Note that the reaction temperature at the time of curing the mixed solution in the forming step can be appropriately adjusted depending on the type, blending ratio, etc. of the prepolymer, curing agent, and additives used, and by adjusting the reaction temperature, there is a tendency that the reaction rate of the curing reaction can be controlled, thereby controlling the microphase separation structure formed.

[0286] In the forming step, a resin sheet having a microphase separation structure is obtained by cutting a resin block obtained as described above to an appropriate thickness. The obtained resin sheet can be aged at 30°C to 150°C for 1 hour to 24 hours or so.

[0287] For the resin sheet obtained as described above, for example, a double-sided tape is attached to one side, and the resin sheet is cut into a predetermined shape, preferably a circular plate shape, to complete the polishing pad of the present embodiment. As the double-sided tape, there is no particular limitation, and any of the double-sided tapes known in the art can be arbitrarily selected and used.

[0288] In addition, the polishing pad of the present embodiment can be a single-layer structure formed of only the resin sheet, or can be formed of a plurality of layers in which another layer (a cushion layer or a substrate layer) is attached to one side of the resin sheet. In the case of having a multi-layer structure, the plurality of layers can be adhered and fixed to each other with pressure as needed using a double-sided tape, an adhesive, or the like. As the double-sided tape and the adhesive that can be used, there is no particular limitation, and any of the double-sided tapes and adhesives known in the art can be arbitrarily selected and used.

[0289] Furthermore, for the abrasive pad of this embodiment, groove processing, embossing processing, and / or hole processing (punching processing) can be performed on the surface as needed. The shape of groove processing and embossing processing is not particularly limited; for example, grid-shaped, concentric circle-shaped, radial, and other shapes can be cited.

[0290] Furthermore, for the polishing pad, the surface and / or back surface of the resin sheet can also be finished (ground). The resin sheet in the polishing pad manufacturing method of this embodiment has interconnected fine pores, thus exhibiting excellent finishability and allowing for easy finishing. As for the finishing process, there are no particular limitations; it can be performed using known methods such as grinding based on a diamond dresser.

[0291] [Method for manufacturing ground and polished materials]

[0292] The method for manufacturing a ground workpiece according to this embodiment includes the following grinding step: grinding a workpiece using the aforementioned grinding pad in the presence of a grinding slurry to obtain a ground workpiece. The grinding step can be a single grinding (coarse grinding), a fine grinding, or a combination of both.

[0293] In the method for manufacturing a workpiece for grinding according to this embodiment, while supplying the grinding slurry, the workpiece to be ground is pressed towards the grinding pad on a holding platform, and the holding platform and the grinding platform are rotated relative to each other. Thus, the working surface of the workpiece is ground using the grinding pad through chemical mechanical grinding. The holding platform and the grinding platform can rotate in the same direction at different rotational speeds, or they can rotate in different directions. Furthermore, the workpiece can also be ground while moving (rotating) inside the frame during the grinding process.

[0294] Grinding slurries can contain water, oxidants such as hydrogen peroxide, chemical components such as acid and alkali components, additives, and abrasive particles (grinding particles; for example, SiC, SiO2, Al2O3, and CeO2) depending on the material being ground and the grinding conditions.

[0295] Furthermore, there are no particular limitations on the material to be ground; examples include optical materials such as lenses, parallel planar plates and mirrors, semiconductor wafers, semiconductor devices, hard disk substrates, metals, and ceramics.

[0296] <Second Implementation Method>

[0297] Here, the second embodiment (also referred to as "the second embodiment" in this specification) involved in this implementation will be described in detail. It should be noted that the terms and symbols used in the <second embodiment> are used independently of the content of the <first embodiment>, <third embodiment> and <fourth embodiment> described later.

[0298] (Grinding pad)

[0299] The grinding pad of the present embodiment (hereinafter, "the present embodiment" in the "2nd embodiment" means the 2nd embodiment unless otherwise specified) is provided with a resin sheet having fine pores, and in a fine pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, a cumulative pore volume V in a range of a fine pore diameter of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 3 / g or less, and a density of the resin sheet is 0.9 g / cm 3 / g or more and 1.3 g / cm 3 or less. The grinding pad of the present embodiment is able to impart good planarity to a workpiece and has excellent affinity with slurry because of being configured as described above.

[0300] In addition, the grinding pad of the present embodiment can be specified as described below from the viewpoint of a cumulative pore volume V' described later. That is, the grinding pad of the present embodiment is provided with a resin sheet having fine pores, and in a fine pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, a cumulative pore volume V" in a range of a fine pore diameter of 0.050 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.140 cm 3 / g or less, and a density of the resin sheet is 0.9 g / cm 3 / g or more and 1.3 g / cm 3 or less. The grinding pad of the present embodiment specified as described above is also able to impart good planarity to a workpiece and has excellent affinity with slurry.

[0301] The grinding pad of the present embodiment is not particularly limited as long as it is provided with the resin sheet in the present embodiment, and the grinding pad can have a configuration other than the resin sheet. As the configuration other than the resin sheet in the grinding pad, a grinding layer, a cushion layer, and an adhesive layer, and the like known in the past can be given.

[0302] Note that, in the present embodiment, the "resin sheet in the present embodiment" includes both of the following: "a resin sheet which is a resin sheet having fine pores, and in a fine pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, a cumulative pore volume V in a range of a fine pore diameter of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 30.9 g / cm3or more, and less than 1.3 g / cm3 3 0.9 g / cm3or more, and less than 1.3 g / cm3 3 0.9 g / cm3or more, and less than 1.3 g / cm3 3 0.9 g / cm3or more, and less than 1.3 g / cm3 3 0.9 g / cm3or more, and less than 1.3 g / cm3 3 0.9 g / cm3or more, and less than 1.3 g / cm3 3 0.9 g / cm3or more, and less than 1.3 g / cm3

[0303] The polishing pad of the present embodiment preferably has the above-described resin sheet as a polishing layer. By "having the resin sheet as a polishing layer" is meant that at least one surface of the polishing pad of the present embodiment corresponds to the surface of the resin sheet in the present embodiment, and the surface of the resin sheet becomes a polishing surface that is pressed against a work to be polished at the time of polishing in the present embodiment. Therefore, the polishing pad of the present embodiment is preferably composed of the resin sheet in the present embodiment on at least one side. In addition, the polishing pad of the present embodiment can be formed only of the resin sheet in the present embodiment.

[0304] For the polishing pad of the present embodiment, the polishing surface can be subjected to groove processing, emboss processing, and / or hole processing (punching processing) as needed, and can be provided with a light-transmitting portion. The shape of the groove processing and the emboss processing is not particularly limited, and shapes such as a lattice shape, a concentric circle shape, and a radial shape can be given as examples.

[0305] (Resin Sheet)

[0306] (Density)

[0307] The density of the resin sheet in the present embodiment is 0.9 g / cm3 3 0.9 g / cm3or more, and less than 1.3 g / cm3 3 0.9 g / cm3or more, and less than 1.3 g / cm3 3 If the density of the resin sheet in the present embodiment is 0.9 g / cm3

[0308] From the same viewpoint, the density of the resin sheet in the present embodiment is preferably greater than 0.9 g / cm 3 , more preferably 1.0 g / cm 3 , further preferably 1.1 g / cm 3 or more. Note that, the density of the resin sheet being greater than 0.9 g / cm 3 means that the density of the resin is 0.91 g / cm 3 or more, measured to two significant digits.

[0309] If the density of the resin sheet in the present embodiment is 1.3 g / cm 3 or more, there is a tendency for the hardness of the resin sheet to decrease, and in polishing processing using a polishing pad provided with such a resin sheet, there is a tendency for the generation of scratches to be suppressed.

[0310] The density of the resin sheet in the present embodiment can be measured using a method known in the art, for example, by measuring the mass and volume of a piece of the resin sheet using a general method, and calculating the density from the values obtained. Also, the method of controlling the density of the resin sheet is not particularly limited, and for example, a polishing pad can be obtained using the manufacturing method of the polishing pad in the present embodiment described later. In particular, in the manufacturing process of the resin sheet in the present embodiment, the density of the resin sheet can be increased by reducing the amount of foaming agent, or by not using a foaming agent.

[0311] (Pore distribution of resin sheet)

[0312] (Cumulative pore volume V)

[0313] The resin sheet in the present embodiment has pores, and in the pore distribution measured by a mercury intrusion method in which the contact angle is set to 130° and the mercury surface tension is set to 485 dyn / cm, the cumulative pore volume V in the range of pore diameters of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 3 / g or less.

[0314] Note that, hereinafter, in the present embodiment, the "pore distribution" means the pore distribution measured by a mercury intrusion method in which the contact angle is set to 130° and the mercury surface tension is set to 485 dyn / cm, unless otherwise specified. The mercury intrusion method is a method in which the pore distribution on the surface of a measurement sample can be measured by filling mercury into the pores on the surface of the measurement sample while scanning the applied pressure. Therefore, in the case where the pore distribution is measured for a foamed material using a mercury intrusion method, the pore distribution of the foamed material mainly reflects the pore distribution of the connected bubbles (also generally referred to as "continuous bubbles"), and the contribution of the pore distribution of the independent bubbles is small.

[0315] With respect to the polishing pad of the present embodiment, the present inventors found that, in the fine pore distribution measured by mercury porosimetry, when the cumulative pore volume V in the range of fine pore diameters of 0.100 pm or more and 10.0 pm or less is 0.020 cm 3 / g or more, the affinity of the polishing pad to the slurry becomes sufficiently good. It is inferred that this is because, when the cumulative pore volume V is 0.020 cm 3 / g or more, the connected pores having a fine pore diameter of 0.100 pm or more and 10.0 pm or less become distributed in the entire resin sheet, and, at the time of polishing processing, the slurry becomes uniformly permeated into the inside of the resin sheet via the connected pores. However, the reason why the cumulative pore volume V of 0.020 cm 3 / g or more makes the affinity of the polishing pad to the slurry sufficiently good is not limited to the above reason.

[0316] From the viewpoint of further improving the affinity to the slurry, in the resin sheet in the present embodiment, the above cumulative pore volume V is preferably 0.030 cm 3 / g or more, more preferably 0.040 cm 3 / g or more, further preferably 0.050 cm 3 / g or more. In addition, if the cumulative pore volume V is in the above range, the resin sheet becomes excellent in dressing even if it is high in density. Note that, by “dressing” or “dressing processing”, it means processing of making the surface roughness of the polishing surface of the polishing pad uniform or making the flatness uniform, using a dressing tool (for example, a diamond dresser or sandpaper) on which abrasive grains or the like are fixed, before polishing the object to be polished. In addition, by “excellent in dressing”, it means that sufficient dressing processing can be performed by processing under comparatively easy conditions. By “polishing surface”, it means the surface of the polishing pad that contacts or is supposed to contact the object to be polished at the time of polishing the object to be polished using the polishing pad.

[0317] In the resin sheet in the present embodiment, the above cumulative pore volume V is 0.100 cm 3 / g or less. By making the cumulative pore volume V 0.100 cm 3 / g or less, there is a tendency that the density of the resin sheet easily becomes in the above range, and, in polishing processing using a polishing pad provided with such a resin sheet, it is possible to make the polished surface of the object to be polished more flat. From the same viewpoint, the cumulative pore volume V is preferably 0.090 cm 3 / g or less, more preferably 0.080 cm 3 / g or less.

[0318] (Cumulative Pore Volume V')

[0319] In the pore distribution of the resin sheet in the present embodiment, the cumulative pore volume V' in the range of the pore diameter of 0.050 μm or more and less than 0.100 μm is typically 0.000 cm 3 / g or more and 0.120 cm 3 / g or less, from the viewpoint of further improving the balance of the flatness imparted to the object to be polished and the affinity with the slurry, it is preferable that the cumulative pore volume V be 0.000 cm 3 / g or more and 0.100 cm 3 / g or less, more preferably 0.000 cm 3 / g or more and 0.080 cm 3 / g or less.

[0320] From the above viewpoint, it can be provided that the polishing pad of the present embodiment is provided with a resin sheet having pores, in the pore distribution of the resin sheet measured by the mercury intrusion method by setting the contact angle to 130° and the mercury surface tension to 485 dyn / cm, the cumulative pore volume V" in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.140 cm 3 / g or less, the density of the resin sheet is 0.9 g / cm 3 or more and 1.3 g / cm 3 or less. Note that the cumulative pore volume V" in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less in the present embodiment can be provided as the sum of the cumulative pore volume V and the cumulative pore volume V' in the present embodiment, from the viewpoint of further improving the balance of the flatness imparted to the object to be polished and the affinity with the slurry, it is 0.020 cm 3 / g or more and 0.140 cm 3 / g or less, preferably 0.030 cm 3 / g or more and 0.130 cm 3 / g or less, more preferably 0.050 cm 3 / g or more and 0.120 cm 3 / g or less.

[0321] (Ratio of cumulative pore volume V to cumulative pore volume Vo)

[0322] In the polishing pad of the present embodiment, from the viewpoint of further improving the balance between the flatness imparted to the object to be polished and the affinity with the slurry, in the fine pore distribution of the resin sheet, the ratio of the cumulative pore volume V in the range of the fine pore diameter of 0.100 μm or more and 10.0 μm or less with respect to the cumulative pore volume V0 in the range of the fine pore diameter of 0.100 μm or more and 360 μm or less is preferably 50% or more. In other words, the ratio of the cumulative pore volume V to the cumulative pore volume V0 (V / V0) is preferably 0.50 or more. According to such a manner, the proportion of the fine pores of the resin sheet having a relatively small fine pore diameter increases, and thus, it is possible to maintain the density at a high density and to make the number of connected air bubbles within the resin sheet more.

[0323] From the same viewpoint, the ratio of the cumulative pore volume V with respect to the cumulative pore volume V0 is more preferably 60% or more, further preferably 65% or more, and further more preferably 70% or more. The upper limit of the ratio of the cumulative pore volume V with respect to the cumulative pore volume V0 is not particularly limited, and the ratio of the cumulative pore volume V with respect to the cumulative pore volume V0 can be 100% or less, 99% or less, 95% or less, 90% or less, or 80% or less.

[0324] In addition, in the fine pore distribution of the resin sheet in the present embodiment, from the same viewpoint as described above, the ratio of the cumulative pore volume V with respect to the cumulative pore volume V0' in the range of the fine pore diameter of 0.050 μm or more and 360 μm or less (V / V0') is preferably 50% or more, more preferably 60% or more, further preferably 65% or more, and further more preferably 70% or more. In addition, V / V0' can be 100% or less, 99% or less, 95% or less, 90% or less, or 80% or less.

[0325] (Maximum peak position)

[0326] In the pore distribution of the resin sheet in the present embodiment, the peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less is preferably in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less. Generally, in the mercury porosimetry, the pore distribution is measured as the cumulative pore volume from the largest pore diameter of the measurement range. Therefore, the "peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less" means the position (pore diameter) of the largest peak of the Log differential pore volume distribution (dV / d(log D)) calculated from the pore distribution obtained by the mercury porosimetry. In addition, the largest peak means the maximum point of the maximum value in the case where a plurality of maximum points exist in the range of the pore diameter of 0.100 μm or more and 360 μm or less.

[0327] By making the peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less be in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less, the resin sheet has pores that are more uniformly distributed in the range of 0.100 μm or more and 10.0 μm or less, and thus there is a tendency that the affinity of the polishing pad for the slurry and the dishing property are further improved. From the viewpoint of further improving the affinity of the polishing pad for the slurry and the dishing property, the peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less is more preferably in the range of the pore diameter of 0.500 μm or more and 5.00 μm or less.

[0328] In addition, in the pore distribution of the resin sheet in the present embodiment, the peak position of the largest peak in the range of the pore diameter of 0.050 μm or more and 360 μm or less is preferably in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less, and more preferably in the range of the pore diameter of 0.050 μm or more and 5.00 μm or less.

[0329] (Number of peaks and peak height)

[0330] In the pore distribution of the resin sheet in the present embodiment, the number of peaks in the range of the pore diameter of 0.100 μm or more and 360 μm or less is preferably 1 or more and 3 or less, more preferably 1 or more and 2 or less, and further preferably 1. By making the number of peaks be in the above range, the resin sheet has pores that are more uniformly distributed, and thus there is a tendency that the affinity of the polishing pad for the slurry and the dishing property are further improved.

[0331] From the same viewpoint, in the case where two or more peaks exist in the range of the pore diameter of 0.100 μm or more and 360 μm or less, the peak height of the largest peak is preferably 2 times or more, more preferably 5 times or more, and further preferably 10 times or more, as compared with the peak height of the second largest peak.

[0332] (cumulative pore volume V0)

[0333] In the pore distribution of the resin sheet in the present embodiment, the cumulative pore volume V0 in the range of the pore diameter of 0.100 μm or more and 360 μm or less is preferably 0.040 cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. By making the cumulative pore volume V0 in the above range, there is a tendency that the balance of the flatness imparted to the object to be polished and the affinity with the slurry is further improved.

[0334] In addition, in the pore distribution of the resin sheet in the present embodiment, the cumulative pore volume V0' in the range of the pore diameter of 0.050 μm or more and 360 μm or less can be defined as the sum of the cumulative pore volume V0 and the cumulative pore volume V' in the present embodiment, and from the same viewpoint as described above, it is preferably 0.040 cm3 / g or more and 0.200 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.180 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.160 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less. 3 / cm3 / g or more and 0.120 cm3 / g or less, more preferably 0.050 cm3 / g or more and 0.110 cm3 / g or less, further preferably 0.060 cm3 / g or more and 0.100 cm3 / g or less.

[0335] In the present embodiment, the values of the cumulative pore volume V, the cumulative pore volume V', the cumulative pore volume V", the cumulative pore volume V0, the peak position of the maximum peak of the cumulative pore volume V0', the number of peaks, and the peak height are calculated from the pore distribution measured by the mercury intrusion method with the contact angle of 130° and the mercury surface tension of 485 dyn / cm, and the measurement conditions of the mercury intrusion method can be more specifically described with reference to the method described in the Examples. In addition, as a method of controlling the values of the cumulative pore volume V, the cumulative pore volume V', the cumulative pore volume V", the cumulative pore volume V0, the peak position of the maximum peak of the cumulative pore volume V0', the number of peaks, and the peak height, there is no particular limitation, and for example, it is sufficient to obtain the polishing pad by the manufacturing method of the polishing pad of the present embodiment described later.

[0336] (structure of resin sheet)

[0337] The resin sheet in the present embodiment preferably has a microphase separation structure. In the present embodiment, the "microphase separation structure" refers to a phase separation structure formed via microphase separation. In addition, in the present embodiment, the "microphase separation" refers to phase separation in which a micro (typically, micrometer order) structure pattern is generated in a macroscopically uniform object in a periodic repetition of at least one dimension. The microphase separation can be generated by, for example, using the preferred manufacturing conditions in the manufacturing method of the polishing pad of the present embodiment described later. As typical examples of the microphase separation structure, although not limited to the following structures, mention can be made of a spherical structure (island-in-sea structure), a cylindrical structure, a lamellar structure, and a three-dimensional network structure. The microphase separation structure in the present embodiment preferably includes a cylindrical structure, a lamellar structure, and a three-dimensional network structure, and more preferably a three-dimensional network structure.

[0338] In the present embodiment, the three-dimensional network structure refers to a structure in which a network in a three-dimensional direction is formed. As the three-dimensional network structure resulting from microphase separation, a structure including a single-helical icosahedron structure and / or a double (multiple) helical icosahedron structure can also be used. In the present embodiment, the single-helical icosahedron structure typically refers to a network structure in which a unit cell is formed by combining thin wire structures in which 2 three-way junctions are paired, and the unit cell is periodically repeated, and the double (multiple) helical icosahedron structure refers to a structure in which 2 or more single-helical icosahedron structures are combined into a box.

[0339] The cross section of a resin sheet having a continuous foaming structure resulting from the injection of a foaming agent, a non-reactive gas, or the like in the past tends to have a roughly spherical foaming cross section and a resin flat portion (i.e., an island-in-sea structure in which a sea of resin and islands of voids are formed). On the other hand, in the case where the resin sheet in the present embodiment has a double (multiple) helical icosahedron structure, in the cross section thereof, typically, a structure in which 2 or more resins have undergone phase separation in a mottled manner with a micrometer order is observed. In addition, in the case where the resin sheet in the present embodiment has a single-helical icosahedron structure, in the cross section thereof, typically, an amorphous void cross section and a resin skeleton / resin skeleton cross section are observed. In the case where the resin skeleton portion is sufficiently larger than the void, the resin skeleton portion can not be observed and a sea of resin is substantially observed. Even in this case, the voids of the resin sheet in the present embodiment are formed in a three-dimensional network so as to be in communication with each other.

[0340] Note that, when observing the cross section of the resin sheet in the present embodiment, there are cases where the two or more kinds of resins are observed to have mottled patterns, and the two features of the indefinite void cross section and the resin skeleton / resin skeleton cross section, i.e., the boundary between the double (multiple) gyroid structure and the single gyroid structure, cannot be clearly distinguished, in which case, it can be evaluated as including at least one of the single gyroid structure and the double (multiple) gyroid structure.

[0341] In the case where the resin sheet in the present embodiment has the single gyroid structure and / or the double (multiple) gyroid structure, typically, a sharp peak (maximum value) is measured in the Log differential fine pore volume distribution in the range of the fine pore diameter of 0.100 μm or more and 10.0 μm or less.

[0342] Hereinafter, the preferred structures observed in the polishing pad of the present embodiment are described in detail, but with the proviso that all of them are structures derived from microphase separation.

[0343] The resin sheet in the present embodiment can include two or more phases having different compositions. In the present embodiment, the "composition" of the phase includes both the resin as the main component of the phase and the components other than the main component included in the phase, and further, the blending ratio thereof is also taken into consideration. Therefore, the microphase-separated structure possessed by the resin sheet in the present embodiment can include two or more phases different from each other in at least any one of the resin as the main component of the phase and the components other than the main component included in the phase, and typically, can include two or more phases different from each other in at least one or more of the structure, the average molecular weight, and the functional group of the resin as the main component of the phase.

[0344] As examples of the two phases having different compositions, for example, the following cases can be given: a case where the kind of the resin constituting the phase is different between one phase and the other phase; a case where the content of the additive contained is different between one phase and the other phase; and a case where the resin sheet is formed of an AB block polymer, and one phase is a phase having an A block as the main component, and the other phase is a phase having a B block as the main component.

[0345] As typical examples of the microphase separation structure including two phases different in composition from each other, there are, for example, a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by a prepolymer different from the prepolymer in the first phase and the curing agent in the first phase; a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by the prepolymer in the first phase and a curing agent different from the curing agent in the first phase; and a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by a prepolymer different from the prepolymer in the first phase and a curing agent different from the curing agent in the first phase; and the like.

[0346] The resin sheet in the present embodiment can have a void due to microphase separation. The void can also be said to be a void constituting the microphase separation structure, and as a specific example thereof, although not limited to the following void, there is, for example, a void divided by a resin skeleton providing a gyroid structure. Note that in the present embodiment, the void can be a void from a fine hole, or a void from a communication hole formed by communication of a plurality of fine holes.

[0347] The resin sheet having the microphase separation structure in the present embodiment can be obtained, for example, by the manufacturing method of the polishing pad of the present embodiment described later. In addition, that the resin sheet has the microphase separation structure can be confirmed by observation with a scanning electron microscope (SEM) at a magnification of about 300 times to about 3000 times.

[0348] Note that, regarding the resin sheet having the microphase separation structure including two or more phases different in composition, or having the aforementioned void, observation can be performed by an optical method such as an optical microscope and a phase contrast microscope, a method using an electron microscope such as a scanning electron microscope and a transmission electron microscope, a method using scattering of particles such as light scattering, neutron small-angle scattering, and X-ray small-angle scattering, an X-ray diffraction method, a fluorescence method, and a pulsed NMR measurement method.

[0349] (Average thickness of resin sheet)

[0350] The average thickness of the resin sheet in the present embodiment is not particularly limited, but is preferably 0.5 mm or more and 10.0 mm or less, more preferably 0.6 mm or more and 8.0 mm or less, and further preferably 0.7 mm or more and 5.0 mm or less.

[0351] (Physical properties of resin sheet)

[0352] The compression rate of the resin sheet in the present embodiment is not particularly limited, but is preferably 0.1% or more and 10.0% or less, and more preferably 0.5% or more and 5.0% or less. Note that the compression rate of the resin sheet can be found in accordance with Japanese Industrial Standards (JIS L 1021) using a SH OPPER-type thickness tester (pressing surface: circular shape with a diameter of 1 cm). Specifically, the thickness t0 after 30 seconds from the application of an initial load from a no-load state can be measured, and next, the thickness t1 after 30 seconds from the application of a final pressure from the thickness t0 can be measured, whereby the following formula is used for calculation. Note that the initial load is 100 g / cm 2 , and the final pressure is 1120 g / cm 2 .

[0353] Compression rate (%) = 100 x (t0 - t1) / t0

[0354] The compression elastic modulus of the resin sheet in the present embodiment is not particularly limited, but is preferably 65% or more and 98% or less, and more preferably 70% or more and 95% or less. Note that the compression elastic modulus of the resin sheet can be found in accordance with Japanese Industrial Standards (JIS L 1021) using a SH OPPER-type thickness tester (pressing surface: circular shape with a diameter of 1 cm). Specifically, the thickness t0 after 30 seconds from the application of an initial load from a no-load state can be measured, and next, the thickness t1 after 30 seconds from the application of a final pressure from the thickness t0 can be measured, and further, the thickness t0' after 30 seconds from the application of an initial load again from a no-load state after the removal of all the load from the thickness t1 and the standing for 5 minutes can be measured, whereby the following formula is used for calculation. Note that the initial load is 100 g / cm 2 , and the final pressure is 1120 g / cm 2 .

[0355] Compression elastic modulus (%) = 100 x (t0' - t1) / (t0 - t1)

[0356] The Shore D hardness of the resin sheet in the present embodiment is not particularly limited, but is preferably 30 or more and 90 or less, and more preferably 40 or more and 80 or less. Note that the Shore D hardness of the resin sheet can be found in accordance with Japanese Industrial Standards (JIS K7311) using a D-type hardness tester.

[0357] (Material of the resin sheet)

[0358] The material of the resin sheet in the present embodiment is not particularly limited. As the material of the resin sheet, for example, a polyurethane resin can be given. As the polyurethane resin, there is no particular limitation, and for example, a polyester-based polyurethane resin, a polyether-based polyurethane resin, and a polycarbonate-based polyurethane resin can be given. They can be used alone or in combination with two or more.

[0359] Among them, the material of the resin sheet in the present embodiment preferably contains at least either one of a polyester-based polyurethane resin and a polyether-based polyurethane resin. It is particularly preferable to contain a polyurethane resin described later in the manufacturing method of the polishing pad of the present embodiment as a cured product of a mixed solution containing a urethane prepolymer and at least two curing agents. By using such a resin, there is a tendency that it is easy to make the density and the fine pore distribution within the above range.

[0360] In addition, the resin sheet in the present embodiment can contain a component from an additive in addition to the resin component. As such an additive, for example, a defoaming agent, a catalyst, a foaming agent, a foam stabilizer, a polishing grain, a dye, a pigment, a solid particle, a flame retardant, a hydrophilic agent, a hydrophobic agent, a light-resistant agent, an antioxidant, and an antistatic agent, and the like described later in the manufacturing method of the polishing pad of the present embodiment can be given.

[0361] [Manufacturing method of polishing pad]

[0362] The manufacturing method of the polishing pad of the present embodiment includes a step of curing a mixed solution of at least one prepolymer and at least two curing agents, thereby obtaining a resin sheet having a microphase separation structure. According to such a method, the polishing pad of the present embodiment can be easily manufactured. Hereinafter, each step of the manufacturing method of the polishing pad will be described in detail.

[0363] (Mixing step)

[0364] The manufacturing method of the polishing pad of the present embodiment can include a mixing step of preparing a mixed solution of at least one prepolymer and at least two curing agents. By using at least two curing agents in the mixing step, a resin sheet having a microphase separation structure can be obtained in a molding step after the mixing step. In particular, by using two or more curing agents to form a microphase separation structure, there is a tendency that it is easy to control the curing reaction and the shape of the microphase separation structure compared to the case where two or more prepolymers are used to form a microphase separation structure.

[0365] In the mixing step, for example, at least one prepolymer heated to 30°C to 90°C and at least two curing agents can be put into a temperature-adjustable mixing machine with a jacket, and stirring can be performed at 30°C to 130°C. At this time, if necessary, the mixture can be received in a tank with a stirrer and a jacket, and allowed to mature. The stirring time is appropriately adjusted according to the number of teeth, the rotation speed, the gap, and the like of the mixing machine, and is, for example, 0.1 seconds to 60 seconds.

[0366] (Curing agent)

[0367] The curing agent used in the mixing step is not particularly limited, and, for example, a compound containing an amino group and a compound containing a hydroxyl group can be mentioned. The compound containing an amino group is not particularly limited, and, for example, 4,4'-methylenebis(2-chloroaniline) (MOCA), ethylenediamine, propylenediamine, hexamethylenediamine, isophorone diamine, dicyclohexylmethane-4,4'-diamine, 4-methyl-2,6-bis(methylthio)-1,3-benzenediamine, 2-methyl-4,6-bis(methylthio)-1,3-benzenediamine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 2,2-bis[3-(isopropylamino)-4-hydroxyphenyl]propane, 2,2-bis[3-(1-methylpropylamino)-4-hydroxyphenyl]propane, 2,2-bis[3-(1-methylpentylamino)-4-hydroxyphenyl]propane, 2,2-bis(3,5-diamino-4-hydroxyphenyl)propane, 2,6-diamino-4-methylphenol, trimethylethylenebis-4-aminobenzoate, and polytetramethyleneoxy-di-p-aminobenzoate, and the like can be mentioned. As the compound containing an amino group, 4,4'-methylenebis(2-chloroaniline) is preferred.

[0368] The compound containing a hydroxyl group is not particularly limited, and, for example, ethylene glycol, propylene glycol, diethylene glycol, trimethylene glycol, tetraethylene glycol, triethylene glycol, dipropylene glycol, 1,4-butanediol, 1,3-butanediol, 2,3-butanediol, 1,2-butanediol, 3-methyl-1,2-butanediol, 1,2-pentanediol, 1,4-pentanediol, 2,4-pentanediol, 2,3-dimethyltrimethylene glycol, tetramethylene glycol, 3-methyl-4,3-pentanediol, 3-methyl-4,5-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,6-hexanediol, 1,5-hexanediol, 1,4-hexanediol, 2,5-hexanediol, 1,4-cyclohexanedimethanol, neopentyl glycol, glycerol, trimethylolpropane, trimethylolethane, trimethylolmethane, polybutylene glycol, polyethylene glycol, and polypropylene glycol, and the like can be mentioned. From the viewpoint of controlling the reaction, as the compound containing a hydroxyl group, a compound having 2 functions (diol) is more preferably used than a compound having 3 or more functions. In addition, as the compound containing a hydroxyl group, polybutylene glycol is more preferred.

[0369] Note that two or more of the above curing agents can be used in combination. The combination of the curing agents is not particularly limited, but is preferably a combination described later.

[0370] The active hydrogen equivalent weight (e.g., NH2 equivalent weight and OH equivalent weight) of the curing agent is not particularly limited, and can be, for example, 50 or more and 5000 or less, 100 or more and 4000 or less, or 130 or more and 3000 or less. In addition, the OH equivalent weight of the curing agent that is a compound containing a hydroxyl group can be 100 or more and 5000 or less, 200 or more and 4000 or less, or 300 or more and 3000 or less. The NH2 equivalent weight of the curing agent that is a compound containing an amino group can be 50 or more and 2000 or less, 75 or more and 1000 or less, or 100 or more and 300 or less.

[0371] In the mixing step, at least two kinds of curing agents can be used. As the combination of the curing agents, it is preferable to use curing agents that are low in compatibility with each other, and / or different in reactivity, and / or different in active hydrogen equivalent weight. According to such a manner, there is a tendency that a microphase separation structure can be obtained more reliably. As an example of the combination of the curing agents that are different in reactivity, for example, a combination of curing agents that are different in active hydrogen group can be given, and more specifically, for example, a combination of a compound containing an amino group and a compound containing a hydroxyl group can be given.

[0372] In the case where two or more kinds of curing agents having the same active hydrogen group are used, that is, in the case where two or more kinds of compounds containing a hydroxyl group are used, or in the case where two or more kinds of compounds containing an amino group are used, it is preferable that the two or more kinds of curing agents include two kinds of curing agents that are different in active hydrogen equivalent weight by 500 or more and 2000 or less. It is more preferable that the two or more kinds of curing agents include a curing agent that is 200 or more and 500 or less in active hydrogen equivalent weight, and a curing agent that is 1000 or more and 2000 or less in active hydrogen equivalent weight.

[0373] In the case where two or more kinds of curing agents having the same active hydrogen group are used, and the two or more kinds of curing agents include two kinds of curing agents that are different in active hydrogen equivalent weight by 500 or more and 2000 or less, the ratio of the amount of use of the curing agent that is small in active hydrogen equivalent weight to the amount of use of the curing agent that is large in active hydrogen equivalent weight, "curing agent small in active hydrogen equivalent weight : curing agent large in active hydrogen equivalent weight", is preferably 1:1 to 15:1, and more preferably 1:1 to 10:1, in terms of the number ratio of the active hydrogen groups.

[0374] In the case where two or more curing agents having the same active hydrogen group are used, and the two or more curing agents include a curing agent having an active hydrogen equivalent weight of 200 or more and less than 500, and a curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000, the ratio of the amount of use of the curing agent having an active hydrogen equivalent weight of 200 or more and less than 500 to the amount of use of the curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000, "curing agent having an active hydrogen equivalent weight of 200 or more and less than 500 : curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000", is preferably 1 : 1 to 15 : 1, more preferably 1 : 1 to 10 : 1, in terms of the number ratio of active hydrogen groups.

[0375] As a specific preferred combination of the curing agents, at least two curing agents preferably include a compound containing an amino group and a compound containing a hydroxyl group. At least two curing agents more preferably include one compound containing an amino group and two or more compounds containing a hydroxyl group, or two or more compounds containing an amino group and one compound containing a hydroxyl group. At least two curing agents further preferably include one compound containing an amino group and two or more compounds containing a hydroxyl group.

[0376] In the case where at least two curing agents include a compound containing an amino group and a compound containing a hydroxyl group, the difference between the NH2 equivalent weight of the compound containing an amino group and the OH equivalent weight of the compound containing a hydroxyl group is not particularly limited, but the OH equivalent weight of the compound containing a hydroxyl group is preferably large, and more preferably the OH equivalent weight of the compound containing a hydroxyl group is 100 or more and less than 2000 larger than the NH2 equivalent weight of the compound containing an amino group.

[0377] In the case where at least two curing agents include a compound containing an amino group and a compound containing a hydroxyl group, the proportion of the amount of use of the curing agent as the compound containing an amino group with respect to the entire amount of use of the curing agents is preferably 35% or more and less than 95%, more preferably 40% or more and less than 90%, in terms of the number ratio of functional groups.

[0378] As an example of the combination of the preferred curing agent, for example, at least two kinds of the curing agent include a first curing agent (a compound containing an amino group) having an NH2 equivalent of 100 or more and 300 or less, a second curing agent (a compound containing a hydroxyl group) having an OH equivalent of 200 or more and 600 or less, and a third curing agent (a compound containing a hydroxyl group) having an OH equivalent of 1000 or more and 2000 or less. The ratio of the use amount of the first curing agent, the use amount of the second curing agent, and the use amount of the third curing agent is not particularly limited, and the use amount of the first curing agent is preferably 30% or more and 95% or less, more preferably 40% or more and 90% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent. The use amount of the second curing agent is preferably 1% or more and 70% or less, more preferably 5% or more and 60% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent. The use amount of the third curing agent is preferably 3% or more and 60% or less, more preferably 5% or more and 50% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent.

[0379] Generally, the total of the use amounts of the curing agent is regulated by an R value, which is the equivalent ratio of the active hydrogen groups (amino and hydroxyl groups) present in the curing agent when the number of functional groups possessed by the prepolymer is taken as 1. The total of the use amounts of the curing agent is preferably adjusted so that the R value becomes 0.7 or more and 1.3 or less. The R value is more preferably 0.8 or more and 1.2 or less.

[0380] Note that, by using the above-described preferred combination of the curing agent in an appropriate use amount, it is possible to more reliably obtain a resin sheet having a cumulative pore volume V of 0.020 cm 3 / g or more and 0.100 cm 3 / g or less and / or a resin sheet having a microphase separation structure. Note that, as the combination of the curing agent, two or more kinds of curing agents having low compatibility with each other, two or more kinds of curing agents having different reactivity from each other, and / or curing agents having different active hydrogen equivalent weights can be used. Even in the case where a resin sheet having a clear microphase separation structure is not obtained by using such a combination, by implementing adjustment such as changing the kinds of the curing agents in a manner that the compatibility with each other becomes higher, changing the curing agents in a manner that the reactivity with each other becomes similar, and / or changing the curing agents in a manner that the active hydrogen equivalent weights with each other become close, there is a tendency that a resin sheet having a microphase separation structure can be obtained.

[0381] (prepolymer)

[0382] As the prepolymer used in the mixing step, there is no particular limitation, and for example, a urethane prepolymer can be given. As the urethane prepolymer, for example, an adduct of hexamethylene diisocyanate with glyceryl triol; an adduct of 2,4-tolylene diisocyanate with hydroquinone; an adduct of 2,4-tolylene diisocyanate with poly(oxytetramethylene) glycol with diethylene glycol; an adduct of toluene diisocyanate with glyceryl triol; an adduct of toluene diisocyanate with trimethylolpropane; an adduct of xylylene diisocyanate with trimethylolpropane; an adduct of hexamethylene diisocyanate with trimethylolpropane; and an adduct of isocyanuric acid with hexamethylene diisocyanate can be given. In addition, a compound containing an isocyanate group prepared by the reaction of a polyisocyanate compound with a polyhydric alcohol compound other than these, various urethane prepolymers commercially available can also be used.

[0383] As the polyisocyanate compound used for preparing the compound containing an isocyanate group, there is no particular limitation as long as it has 2 or more isocyanate groups in the molecule. For example, as the diisocyanate compound having 2 isocyanate groups in the molecule, m-phenylene diisocyanate, p-phenylene diisocyanate, 2,6-tolylene diisocyanate (2,6-TDI), 2,4-tolylene diisocyanate (2,4-TDI), naphthalene-1,4-diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), 4,4'-methylenebis(cyclohexyl isocyanate) (hydrogenated MDI), 3,3'-dimethoxy-4,4'-diphenyl diisocyanate, 3,3'-dimethyl diphenylmethane-4,4'-diisocyanate, xylylene-1,4-diisocyanate, 4,4'-diphenylpropane diisocyanate, trimethylene diisocyanate, hexamethylene diisocyanate, propylene-1,2-diisocyanate, butylene-1,2-diisocyanate, cyclohexylene-1,2-diisocyanate, cyclohexylene-1,4-diisocyanate, p-phenylene diisothiocyanate, xylylene-1,4-diisothiocyanate, and ethylene diisothiocyanate can be given.

[0384] These polyisocyanate compounds can be used alone or in combination of 2 or more. As the polyisocyanate compound, a diisocyanate compound is preferred, and 2,4-TDI and 2,6-TDI, MDI are more preferred.

[0385] As the polyol compound used for preparing the compound containing an isocyanate group, for example, there can be mentioned glycol compounds such as ethylene glycol, diethylene glycol (DEG), butylene glycol, and the like; triol compounds and the like; polyether polyol compounds such as polypropylene glycol (PPG) and poly(oxytetramethylene) glycol (PTMG); polyester polyol compounds such as a reaction product of ethylene glycol and adipic acid, a reaction product of butylene glycol and adipic acid, and the like; polycarbonate polyol compounds; and polycaprolactone polyol compounds. In addition, a 3-functional propylene glycol obtained by adding ethylene oxide can also be used. The polyol compound can be used alone or in combination with two or more kinds.

[0386] The NCO equivalent of the urethane prepolymer is preferably 150 or greater and 700 or less, more preferably 200 or greater and 600 or less, and further preferably 200 or greater and 500 or less. The "NCO equivalent" is a value indicating the molecular weight of the urethane prepolymer per 1 NCO group, which is calculated by "(mass parts of the polyisocyanate compound + mass parts of the polyol compound) / [(number of functional groups per 1 molecule of the polyisocyanate compound x mass parts of the polyisocyanate compound / molecular weight of the polyisocyanate compound) - (number of functional groups per 1 molecule of the polyol compound x mass parts of the polyol compound / molecular weight of the polyol compound)]".

[0387] In the mixing step, at least one prepolymer can be used. The prepolymer can also be used in combination with two or more kinds of the above-described prepolymer, but it is preferable to use one kind alone. According to such a manner, there is a tendency that it is easy to control the curing reaction and it is possible to easily control the shape of the microphase separation structure. As the prepolymer, it is preferable to use a urethane prepolymer in which toluene diisocyanate is used as a main component alone.

[0388] The amount of the prepolymer used is not particularly limited, and it is preferable to be 30 parts by mass or greater and 80 parts by mass or less, and more preferably 40 parts by mass or greater and 75 parts by mass or less, relative to the entire mixed solution.

[0389] (Additives)

[0390] In the mixing step, a component other than the prepolymer and the curing agent can also be mixed as an additive. As the additive, there can be mentioned a solvent (diluent) such as polypropylene glycol; an antifoaming agent such as a silicone-based antifoaming agent; a catalyst; a blowing agent such as water and hollow microparticles; a foam stabilizer such as a silicone-based foam stabilizer; and a filler (abrasive particles) such as cerium oxide; a dye; a pigment; a solid microparticle; a flame retardant; a hydrophilizing agent; a hydrophobizing agent; a light resistance agent; an antioxidant; an antistatic agent, and the like. From the viewpoint of making the density of the obtained resin sheet 0.9 g / cm 3 1.3 g / cm 3 From the viewpoint of the above, it is preferable not to add a blowing agent or to add it in a small amount, and more preferably a defoaming agent is used.

[0391] In the mixing step, by adjusting the kind and amount of the catalyst to be added, the reaction rate of the curing reaction can be controlled, and thus the microphase separation structure formed can be controlled.

[0392] (Molding step)

[0393] The molding step is a step of obtaining a resin sheet having a microphase separation structure by curing the mixed solution obtained in the mixing step. In the molding step, for example, the mixed solution obtained in the mixing step can be cast into a mold frame that has been preheated to 30°C to 150°C, and heated at 30°C to 150°C for 10 minutes to 5 hours. Thus, the prepolymer reacts with the curing agent to form a resin, and thus the mixed solution is cured. Alternatively, the mixed solution can be further heated in an oven at 50°C to 180°C for 10 minutes to 12 hours, and thus cured twice. In the manufacturing method of the polishing pad of the present embodiment, since the mixed solution is the mixed solution described above, a resin block having a microphase separation structure can be obtained.

[0394] Note that the reaction temperature at the time of curing the mixed solution in the molding step can be appropriately adjusted depending on the kind of the prepolymer, the curing agent, and the additive, the mixing ratio, and the like, and by adjusting the reaction temperature, there is a tendency that the reaction rate of the curing reaction can be controlled, and thus the microphase separation structure formed can be controlled.

[0395] In the molding step, a resin sheet having a microphase separation structure is obtained by cutting a resin block obtained as described above to an appropriate thickness. The obtained resin sheet can be aged at 30°C to 150°C for 1 hour to 24 hours.

[0396] For the resin sheet obtained as described above, for example, a double-sided tape is attached to one surface, and the resin sheet is cut into a predetermined shape, preferably a circular plate shape, and thus a polishing pad of the present embodiment is completed. As the double-sided tape, there is no particular limitation, and any of the double-sided tapes known in the art can be arbitrarily selected and used.

[0397] Alternatively, the polishing pad of the present embodiment can be a single-layer structure formed of only the resin sheet, or can be formed of a plurality of layers in which another layer (a cushion layer or a substrate layer) is attached to one surface of the resin sheet. In the case of having a plurality of layers, the plurality of layers can be adhered and fixed to each other with pressure as needed using a double-sided tape, an adhesive, or the like. As the double-sided tape and the adhesive that can be used, there is no particular limitation, and any of the double-sided tapes and the adhesives known in the art can be arbitrarily selected and used.

[0398] Further, for the polishing pad of the present embodiment, as needed, groove processing, embossing processing, and / or hole processing (punching processing) can be performed on the surface. The shape of the groove processing and the embossing processing is not particularly limited, and, for example, shapes such as a lattice type, a concentric circle type, a radial type, and the like can be given.

[0399] In addition, for the polishing pad, the surface and / or the back surface of the resin sheet can also be subjected to finishing (lapping treatment). The resin sheet in the manufacturing method of the polishing pad of the present embodiment, although being high in density, has connected fine pores, and thus is excellent in finishing property, and can be subjected to finishing treatment under easy conditions. The finishing treatment is not particularly limited, and can be performed by a known method such as lapping based on a diamond finisher.

[0400] [Manufacturing method of polished article]

[0401] The manufacturing method of the polished article of the present embodiment has a polishing step of polishing a polished object using the above-described polishing pad in the presence of a polishing slurry, to obtain a polished article. The polishing step can be one-time polishing (rough polishing), or can be fine polishing, or can have both of these.

[0402] In the manufacturing method of the polished article of the present embodiment, while the polishing slurry is supplied, the holding platform and the polishing platform are relatively rotated with the polished object being pressed toward the polishing pad on the holding platform, whereby the polishing surface of the polished object is polished by chemical mechanical polishing using the polishing pad. The holding platform and the polishing platform can be rotated in the same direction at different rotation speeds from each other, or can be rotated in different directions. In addition, for the polished object, in the polishing process, the polished object can be moved (rotated) on the inner side of the frame portion while being polished.

[0403] The polishing slurry can include, depending on the polished object, the polishing conditions, and the like, water, an oxidizing agent typified by hydrogen peroxide, an acid component, an alkali component, and the like, a chemical component, an additive, and a polishing grain (polishing particle; for example, SiC, SiO2, Al2O3, and CeO2).

[0404] In addition, the polished object is not particularly limited, and, for example, optical materials such as lenses, parallel plane plates, and mirrors, semiconductor wafers, semiconductor devices, substrates for hard disks, metals, and ceramic materials, and the like can be given.

[0405] [3rd Embodiment]

[0406] Here, the third embodiment (in the present specification, also referred to as "the third embodiment") relating to the present embodiment is described in detail. Note that the terms and symbols used in the third embodiment are used independently of the contents of the first embodiment, the second embodiment, and the fourth embodiment described later.

[0407] (Polishing pad)

[0408] The polishing pad of the present embodiment (hereinafter, "the present embodiment" in the third embodiment means the third embodiment, unless otherwise specified) is a polishing pad provided with a resin sheet having fine pores, in a fine pore distribution of the aforementioned resin sheet measured by a mercury intrusion method by setting a contact angle to 130° and a mercury surface tension to 485 dyn / cm, a cumulative pore volume V in a range of a fine pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more and 1.00 cm 3 / g or less, and a density of the aforementioned resin sheet is 0.3 g / cm 3 or more and 0.9 g / cm 3 or less. The polishing pad of the present embodiment is excellent in dressing property because it is configured as described above, and the surface is not easily smoothed.

[0409] The polishing pad of the present embodiment is not particularly limited as long as it is provided with the resin sheet of the present embodiment, and the polishing pad can have a configuration other than the resin sheet. As the configuration other than the resin sheet in the polishing pad, a polishing layer, a cushion layer, and an adhesive layer, and the like known in the past can be given.

[0410] The polishing pad of the present embodiment preferably has the aforementioned resin sheet as a polishing layer. By "having the resin sheet as a polishing layer", it means that at least one surface of the polishing pad of the present embodiment corresponds to a surface of the resin sheet of the present embodiment, and the surface of the resin sheet becomes a polishing surface that is pressed against a work in polishing processing of the present embodiment. Therefore, the polishing pad of the present embodiment is preferably composed of the resin sheet of the present embodiment on at least one side. In addition, the polishing pad of the present embodiment can be formed only of the resin sheet of the present embodiment.

[0411] For the polishing pad of the present embodiment, a groove processing, an embossing processing, and / or a hole processing (punching processing) can be performed on the polishing surface as needed, and a light-transmitting portion can be provided. The shape of the groove processing and the embossing processing is not particularly limited, and shapes such as a lattice type, a concentric circle type, and a radial type can be given.

[0412] (Resin sheet)

[0413] (Density)

[0414] The density of the resin sheet in the present embodiment is 0.3 g / cm 3 The density of the resin sheet in the present embodiment is 0.3 g / cm 3 The density of the resin sheet in the present embodiment is 0.3 g / cm 3 If the density of the resin sheet in the present embodiment is 0.3 g / cm 3 or more, and more preferably 0.45 g / cm 3 or more.

[0415] On the other hand, if the density of the resin sheet in the present embodiment is 0.9 g / cm 3 or more, the occurrence of scratches can be suppressed. In addition, there is a tendency that the hardness of the resin sheet becomes low, and from this viewpoint, there is also a tendency that the occurrence of scratches can be suppressed.

[0416] The density of the resin sheet in the present embodiment can be measured using a method known in the art, for example, the mass and the volume of the resin sheet are measured using a general method, and the density can be calculated from the obtained values. In addition, the method for controlling the density of the resin sheet is not particularly limited, and for example, the polishing pad can be obtained using the manufacturing method of the polishing pad in the present embodiment described later. In particular, in the manufacturing process of the resin sheet in the present embodiment, if the amount of the foaming agent is reduced, there is a tendency that the density of the resin sheet becomes high.

[0417] (Pore distribution of resin sheet)

[0418] (Cumulative pore volume V)

[0419] The resin sheet in the present embodiment has pores, and in the pore distribution of the aforementioned resin sheet measured by the mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V in the range of the pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more and 1.00 cm 3 / g or less.

[0420] Note that, in the present embodiment, the so-called "pore distribution" means a pore distribution measured by a mercury porosimetry with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, unless otherwise specified. The mercury porosimetry is a method capable of measuring a pore distribution on a surface of a measurement sample by filling mercury into pores on the surface of the measurement sample while scanning an applied pressure. Therefore, in a case where a pore distribution is measured by the mercury porosimetry with respect to a foamed material, the pore distribution mainly reflects a pore distribution of connected bubbles (also generally referred to as "continuous bubbles"), and a contribution of a pore distribution of independent bubbles is small.

[0421] With respect to the polishing pad of the present embodiment, the inventors of the present application found that, in a pore distribution measured by the mercury porosimetry, when a cumulative pore volume V in a range of a pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more, the affinity of the polishing pad to the slurry becomes sufficiently good. It is inferred that this is because, when the cumulative pore volume V is 0.21 cm 3 / g or more, connected bubbles having a pore diameter of 0.010 μm or more and 1.0 μm or less are distributed in the entire resin sheet, and, at the time of polishing processing, the slurry becomes uniformly permeated into the inside of the resin sheet via the connected bubbles. However, the reason why the affinity of the polishing pad to the slurry becomes sufficiently good when the cumulative pore volume V is 0.21 cm 3 / g or more is not limited to the above reason.

[0422] From the viewpoint of further improving the affinity to the slurry, in the resin sheet of the present embodiment, the above cumulative pore volume V is preferably 0.30 cm 3 / g or more, and more preferably 0.40 cm 3 / g or more.

[0423] In the resin sheet of the present embodiment, the above cumulative pore volume V is 1.00 cm 3 / g or less. By making the cumulative pore volume V 1.00 cm 3 / g or less, there is a tendency that the density of the resin sheet easily becomes in the above range, and, in polishing processing using a polishing pad provided with such a resin sheet, it is possible to make the surface of a workpiece more flat. From the same viewpoint, the cumulative pore volume V is preferably 0.90 cm 3 / g or less.

[0424] If the cumulative pore volume V is 0.21 cm 3 / g or more and 1.00 cm 3When the ratio of the cumulative pore volume V in the range of 0.010 μm or more and 1.0 μm or less to the cumulative pore volume V0 in the range of 0.010 μm or more and 360 μm or less is 50% or more, the finishing property of the resin sheet becomes excellent. Note that, by "finishing" or "finishing treatment", a treatment is meant in which, before polishing processing of a workpiece, a finishing tool (e.g., a diamond dresser or sandpaper) in which abrasive grains or the like are fixed is used to make the surface roughness of the polishing surface of a polishing pad uniform, or to make the flatness uniform. Further, by "excellent finishing property", it is meant that sufficient finishing treatment can be performed by a treatment under comparatively easy conditions. By "polishing surface", a surface is meant that is in contact with a workpiece, or a surface that is supposed to be in contact, when a polishing pad is used to polish a workpiece.

[0425] (Ratio of cumulative pore volume V to cumulative pore volume V0)

[0426] In the polishing pad of the present embodiment, from the viewpoint of further improving the balance of flatness imparted to a workpiece and affinity with slurry, in the pore distribution of the resin sheet, the ratio of the cumulative pore volume V in the range of 0.010 μm or more and 1.0 μm or less to the cumulative pore volume V0 in the range of 0.010 μm or more and 360 μm or less is preferably 50% or more. In other words, the ratio of the cumulative pore volume V to the cumulative pore volume V0 (V / V0) is preferably 0.50 or more. According to this manner, the proportion of pores having a relatively small pore diameter in the resin sheet increases, and thus, the density can be maintained at the same level as that of conventional products, and the number of connected air bubbles in the resin sheet is increased.

[0427] From the same viewpoint, the ratio of the cumulative pore volume V to the cumulative pore volume V0 is more preferably 60% or more, further preferably 65% or more, and further more preferably 70% or more. The upper limit of the ratio of the cumulative pore volume V to the cumulative pore volume V0 is not particularly limited, and the ratio of the cumulative pore volume V to the cumulative pore volume V0 can be 100% or less, 99% or less, 95% or less, 90% or less, 85% or less, or 80% or less.

[0428] (peak position of largest peak)

[0429] In the fine pore distribution of the resin sheet in the present embodiment, the peak position of the largest peak in the range of fine pore diameters of 0.010 μm or more and 360 μm or less is preferably in the range of fine pore diameters of 0.010 μm or more and 1.0 μm or less. In general, in the mercury porosimetry, the fine pore distribution is measured as the cumulative fine pore volume from the largest fine pore diameter of the measurement range. Therefore, the "peak position of the largest peak in the range of fine pore diameters of 0.010 μm or more and 360 μm or less" means the position (fine pore diameter) of the largest peak of the Log differential fine pore volume distribution (dV / d(log D)) calculated from the fine pore distribution obtained by the mercury porosimetry. In addition, the largest peak means the maximum point of the maximum value in the case where a plurality of maximum points exist in the range of fine pore diameters of 0.010 μm or more and 360 μm or less.

[0430] By making the peak position of the largest peak in the range of fine pore diameters of 0.010 μm or more and 360 μm or less in the range of fine pore diameters of 0.010 μm or more and 1.0 μm or less, the resin sheet has fine pores that are more uniformly distributed in the range of 0.010 μm or more and 1.0 μm or less, and thus has a tendency that the affinity of the polishing pad to the slurry and the dishing property are further improved. From the viewpoint of further improving the affinity of the polishing pad to the slurry and the dishing property, it is more preferable that the range of fine pore diameters be 0.010 μm or more and 0.5 μm or less, further preferably 0.030 μm or more and 0.5 μm or less, and still further preferably 0.050 μm or more and 0.5 μm or less.

[0431] From the same viewpoint, the position of the largest peak in the range of 1.0 μm or more and 360 μm or less is more preferably in the range of fine pore diameters of 50 μm or more and 200 μm or less.

[0432] (Number of peaks and peak height)

[0433] In the Log differential fine pore volume distribution of the resin sheet in the present embodiment, the number of peaks in the range of fine pore diameters of 0.010 μm or more and 360 μm or less is preferably 2 or more and 4 or less, more preferably 2, and further preferably 1 in the range of 0.010 μm or more and 1.0 μm or less and 1 in the range of 1.0 μm or more and 360 μm or less. By making the number of peaks in the above range, the resin sheet has fine pores that are more uniformly distributed, and thus has a tendency that the affinity of the polishing pad to the slurry and the dishing property are further improved.

[0434] From the same viewpoint, in the Log differential pore volume distribution, the maximum peak height in the range of pore diameters of 0.010 μm or more and 1.0 μm or less is preferably 2 times or more, more preferably 2.5 times or more, and further preferably 3 times or more, as compared with the maximum peak height in the range of pore diameters of 1.0 μm or more and 360 μm or less.

[0435] (cumulative pore volume V0)

[0436] In the pore distribution of the resin sheet in the present embodiment, the cumulative pore volume V0 in the range of pore diameters of 0.010 μm or more and 360 μm or less is preferably 0.1 cm3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. 3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. 3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. 3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. 3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. 3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. 3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. 3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. 3 / g or more and 2.0 cm3 / g or less, more preferably 0.2 cm3 / g or more and 1.5 cm3 / g or less, and further preferably 0.3 cm3 / g or more and 1.0 cm3 / g or less. By making the cumulative pore volume V0 in the above range, there is a tendency that the balance between the flatness imparted to the workpiece and the affinity with the slurry is further improved.

[0437] In the present embodiment, the cumulative pore volume V and the cumulative pore volume V0 are calculated from the pore distribution measured by the mercury porosimetry with the contact angle set to 130° and the mercury surface tension set to 485 dyn / cm, and the measurement conditions of the mercury porosimetry in more detail can be referred to the method described in the Examples. In addition, as a method of controlling the values of the cumulative pore volume V, the cumulative pore volume V0, the ratio of the cumulative pore volume V to the cumulative pore volume V0, the peak position of the maximum peak, the number of peaks, and the peak height, there is no particular limitation, and for example, it is sufficient that the polishing pad is obtained by the manufacturing method of the polishing pad of the present embodiment described later.

[0438] (structure of the resin sheet)

[0439] The resin sheet in the present embodiment preferably has a microphase separation structure. In the present embodiment, the "microphase separation structure" refers to a phase separation structure formed via microphase separation. In addition, in the present embodiment, the "microphase separation" refers to phase separation in which a micro (typically, micrometer order) structure pattern is generated in a macroscopically uniform object in a periodic repetition of at least one dimension. The microphase separation can be generated by, for example, using the preferred manufacturing conditions in the manufacturing method of the polishing pad of the present embodiment described later. As typical examples of the microphase separation structure, although not limited to the following structures, mention can be made of a spherical structure (island-in-sea structure), a cylindrical structure, a lamellar structure, and a three-dimensional network structure. The microphase separation structure in the present embodiment preferably includes a cylindrical structure, a lamellar structure, and a three-dimensional network structure, and more preferably a three-dimensional network structure.

[0440] In the present embodiment, the three-dimensional network structure refers to a structure in which a network in a three-dimensional direction is formed. As the three-dimensional network structure resulting from microphase separation, a structure including a single-helical icosahedron structure and / or a double (multiple) helical icosahedron structure can also be used. In the present embodiment, the single-helical icosahedron structure typically refers to a network structure in which a unit cell is formed by combining thin wire structures in which 2 three-way junctions are paired, and the unit cell is periodically repeated, and the double (multiple) helical icosahedron structure refers to a structure in which 2 or more single-helical icosahedron structures are combined into a box.

[0441] The cross section of a resin sheet having a continuous foaming structure resulting from the injection of a foaming agent or a non-reactive gas of the related art has a tendency to observe a substantially spherical foaming cross section and a resin flat portion (i.e., an island-in-sea structure formed by the sea of resin and the islands of voids). On the other hand, in the case where the resin sheet in the present embodiment has a double (multiple) helical icosahedron structure, in the cross section thereof, typically, there is a tendency to observe a structure in which 2 or more resins have undergone phase separation in a mottled manner with a micrometer order. In addition, in the case where the resin sheet in the present embodiment has a single-helical icosahedron structure, in the cross section thereof, typically, an indefinite void cross section and a resin skeleton / resin skeleton cross section are observed. In the case where the resin skeleton portion is sufficiently larger than the void, the resin skeleton portion can not be observed and the sea of resin is substantially observed, and even in this case, the voids of the resin sheet in the present embodiment are formed in a three-dimensional network so as to be in communication with each other.

[0442] It should be noted that when observing the cross-section of the resin sheet in this embodiment, there are also cases where the two characteristics of two or more resins, such as the mottled pattern, the irregular void cross-section, and the resin skeleton / resin skeleton cross-section, are not clearly distinguishable, i.e., the boundary between the double (multiple) helical icosahedral structure and the single helical icosahedral structure cannot be clearly distinguished. In this case, it can be evaluated as including at least one of the single helical icosahedral structure and the double (multiple) helical icosahedral structure.

[0443] In this embodiment, when the resin sheet has a single-helical icosahedral structure and / or a double (multiple)-helical icosahedral structure, typically, sharp peaks (maximum values) are measured in the range of pore diameters from 0.010 μm to 10.0 μm in the Log differential pore volume distribution.

[0444] The resin sheet in this embodiment may comprise two or more phases with different compositions. In this embodiment, the "composition" of a phase includes both the resin as the main component of the phase and the components contained in the phase other than the main component, and further considers their proportions. Therefore, the microphase separation structure of the resin sheet in this embodiment may comprise two or more phases, in which at least one of the resin as the main component of the phase and the components contained in the phase other than the main component are different from each other. Typically, it may comprise two or more phases, in which the resin as the main component of the phase has at least one different structure, average molecular weight, and functional groups.

[0445] Examples of two phases with different compositions include: the different types of resins constituting the phases in one phase and the different amounts of additives in one phase and the different amounts of additives in another phase; and the resin sheet formed from an AB block polymer, where one phase is mainly composed of A blocks and the other phase is mainly composed of B blocks.

[0446] As a typical example of a microphase-separated structure comprising two phases that are different from each other, the following cases can be cited: the first phase is a phase formed by curing a specified prepolymer and a specified curing agent, and the second phase is a phase formed by curing a prepolymer different from the prepolymer in the first phase and a curing agent in the first phase; the first phase is a phase formed by curing a specified prepolymer and a specified curing agent, and the second phase is a phase formed by curing a prepolymer in the first phase and a curing agent different from the curing agent in the first phase; and the first phase is a phase formed by curing a specified prepolymer and a specified curing agent, and the second phase is a phase formed by curing a prepolymer different from the prepolymer in the first phase and a curing agent different from the curing agent in the first phase; and so on.

[0447] The resin sheet in the present embodiment can have voids due to microphase separation. The voids can also be said to be voids constituting the microphase separation structure, and as specific examples thereof, although not limited to the following, voids divided by resin skeletons providing a gyroid structure, and the like can be given. Note that in the present embodiment, the voids can be voids from fine pores, or voids from communication pores formed by communication of a plurality of fine pores.

[0448] The resin sheet having a microphase separation structure in the present embodiment can be obtained, for example, using the method for manufacturing the polishing pad of the present embodiment described later. In addition, that the resin sheet has a microphase separation structure can be confirmed by observation using a scanning electron microscope (SEM) at a magnification of about 300 times to about 3000 times.

[0449] Note that, regarding the resin sheet having a microphase separation structure including two or more phases having different compositions or having the aforementioned voids, observation can be performed using optical methods such as an optical microscope and a phase contrast microscope, methods using electron microscopes such as a scanning electron microscope and a transmission electron microscope, methods using scattering of particles such as light scattering, neutron small-angle scattering, and X-ray small-angle scattering, X-ray diffraction, fluorescence, and pulsed NMR measurement, and the like.

[0450] (Average pore diameter of resin sheet)

[0451] The average pore diameter of the resin sheet in the present embodiment, which is measured with 10 μm or more pores as the target, is not particularly limited, but is preferably 50 μm or more and 300 μm or less, more preferably 50 μm or more and 200 μm or less.

[0452] The average pore diameter can be measured, for example, using the method described in the examples described later. In addition, the average pore diameter can be adjusted to the above range by, for example, the type and / or amount of the blowing agent and the foam stabilizer.

[0453] (Average thickness of resin sheet)

[0454] The average thickness of the resin sheet in the present embodiment is not particularly limited, but is preferably 0.5 mm or more and 10.0 mm or less, more preferably 0.6 mm or more and 8.0 mm or less, and further preferably 0.7 mm or more and 5.0 mm or less.

[0455] (Physical properties of resin sheet)

[0456] The compression ratio of the resin sheet in this embodiment is not particularly limited, but is preferably 0.1% to 5.0%, more preferably 0.3% to 3.0%. It should be noted that the compression ratio of the resin sheet can be determined according to Japanese Industrial Standard (JIS L 1021) using a SHOP PER type thickness gauge (pressure surface: a circle with a diameter of 1 cm). Specifically, the thickness t0 can be measured after applying an initial load for 30 seconds from a state of no load, and then the thickness t1 can be measured after applying a final pressure for 30 seconds from the state of thickness t0. The compression ratio can then be calculated using the following formula. It should be noted that the initial load is 100 g / cm³. 2 The final pressure was 1120 g / cm. 2 .

[0457] Compression ratio (%) = 100 × (t0 - t1) / t0

[0458] The compressive modulus of the resin sheet in this embodiment is not particularly limited, but is preferably 70% to 100%, more preferably 75% to 95%. It should be noted that the compressive modulus of the resin sheet can be determined according to Japanese Industrial Standard (JIS L 1021) using a SHOPPER-type thickness gauge (pressure surface: a circle with a diameter of 1 cm). Specifically, the thickness t0 can be measured after applying an initial load for 30 seconds from a state of no load; next, the thickness t1 can be measured after applying a final pressure for 30 seconds from the state of thickness t0; furthermore, the thickness t0' can be measured after removing all the load from the state of thickness t1 and letting it rest for 5 minutes (becoming a state of no load), and then applying the initial load again for 30 seconds. The thickness t0' can then be calculated using the following formula. It should be noted that the initial load is 100 g / cm³. 2 The final pressure was 1120 g / cm. 2 .

[0459] Compression ratio (%) = 100 × (t0' - t1) / (t0 - t1)

[0460] The Shore D hardness of the resin sheet in this embodiment is not particularly limited, but it is preferably 10 to 70, and more preferably 20 to 60. It should be noted that the Shore D hardness of the resin sheet can be determined using a D-type hardness tester according to the Japanese Industrial Standard (JIS K7311).

[0461] (Materials for resin sheets)

[0462] The material of the resin sheet in the present embodiment is not particularly limited. As the material of the resin sheet, for example, a polyurethane resin can be given. As the polyurethane resin, there is no particular limitation, and for example, a polyester-based polyurethane resin, a polyether-based polyurethane resin, and a polycarbonate-based polyurethane resin can be given. They can be used alone or in combination with two or more.

[0463] Among them, the material of the resin sheet in the present embodiment preferably contains at least either one of a polyester-based polyurethane resin and a polyether-based polyurethane resin. It is particularly preferable to contain a polyurethane resin described later in the manufacturing method of the polishing pad of the present embodiment as a cured product of a mixed solution containing a urethane prepolymer and at least two curing agents. By using such a resin, there is a tendency that it is easy to make the density and the fine pore distribution within the above range.

[0464] In addition, the resin sheet in the present embodiment can contain a component from an additive in addition to the resin component. As such an additive, for example, a defoaming agent, a catalyst, a foaming agent, a foam stabilizer, a polishing grain, a dye, a pigment, a solid particle, a flame retardant, a hydrophilic agent, a hydrophobic agent, a light-resistant agent, an antioxidant, and an antistatic agent, and the like described later in the manufacturing method of the polishing pad of the present embodiment can be given.

[0465] [Manufacturing method of polishing pad]

[0466] The manufacturing method of the polishing pad of the present embodiment includes a step of curing a mixed solution of at least one prepolymer and at least two curing agents, thereby obtaining a resin sheet having a microphase separation structure. According to such a method, the polishing pad of the present embodiment can be easily manufactured. Hereinafter, each step of the manufacturing method of the polishing pad will be described in detail.

[0467] (Mixing step)

[0468] The manufacturing method of the polishing pad of the present embodiment can include a mixing step of preparing a mixed solution of at least one prepolymer and at least two curing agents. By using at least two curing agents in the mixing step, a resin sheet having a microphase separation structure can be obtained in a molding step after the mixing step. In particular, by using two or more curing agents to form a microphase separation structure, there is a tendency that it is easy to control the curing reaction and the shape of the microphase separation structure compared to the case where two or more prepolymers are used to form a microphase separation structure.

[0469] In the mixing step, for example, at least one prepolymer heated to 30°C to 90°C and at least two curing agents can be put into a temperature-adjustable mixing machine with a jacket, and stirring can be performed at 30°C to 130°C. At this time, if necessary, the mixture can be received in a tank with a stirrer and a jacket, and allowed to mature. The stirring time is appropriately adjusted according to the number of teeth, the rotation speed, the gap, and the like of the mixing machine, and is, for example, 0.1 seconds to 60 seconds.

[0470] (Curing agent)

[0471] The curing agent used in the mixing step is not particularly limited, and, for example, a compound containing an amino group and a compound containing a hydroxyl group can be mentioned. The compound containing an amino group is not particularly limited, and, for example, 4,4'-methylenebis(2-chloroaniline) (MOCA), ethylenediamine, propylenediamine, hexamethylenediamine, isophorone diamine, dicyclohexylmethane-4,4'-diamine, 4-methyl-2,6-bis(methylthio)-1,3-benzenediamine, 2-methyl-4,6-bis(methylthio)-1,3-benzenediamine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 2,2-bis[3-(isopropylamino)-4-hydroxyphenyl]propane, 2,2-bis[3-(1-methylpropylamino)-4-hydroxyphenyl]propane, 2,2-bis[3-(1-methylpentylamino)-4-hydroxyphenyl]propane, 2,2-bis(3,5-diamino-4-hydroxyphenyl)propane, 2,6-diamino-4-methylphenol, trimethylethylenebis-4-aminobenzoate, and polytetramethyleneoxy-di-p-aminobenzoate, and the like can be mentioned. As the compound containing an amino group, 4,4'-methylenebis(2-chloroaniline) is preferred.

[0472] The compound containing a hydroxyl group is not particularly limited, and, for example, ethylene glycol, propylene glycol, diethylene glycol, trimethylene glycol, tetraethylene glycol, triethylene glycol, dipropylene glycol, 1,4-butanediol, 1,3-butanediol, 2,3-butanediol, 1,2-butanediol, 3-methyl-1,2-butanediol, 1,2-pentanediol, 1,4-pentanediol, 2,4-pentanediol, 2,3-dimethyltrimethylene glycol, tetramethylene glycol, 3-methyl-4,3-pentanediol, 3-methyl-4,5-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,6-hexanediol, 1,5-hexanediol, 1,4-hexanediol, 2,5-hexanediol, 1,4-cyclohexanedimethanol, neopentyl glycol, glycerol, trimethylolpropane, trimethylolethane, trimethylolmethane, polybutylene glycol, polyethylene glycol, and polypropylene glycol, and the like can be mentioned. From the viewpoint of controlling the reaction, as the compound containing a hydroxyl group, a compound having 2 functions (diol) is more preferably used than a compound having 3 or more functions. In addition, as the compound containing a hydroxyl group, polybutylene glycol is more preferred.

[0473] Note that two or more of the above curing agents can be used in combination. The combination of the curing agents is not particularly limited, but is preferably a combination described later.

[0474] The active hydrogen equivalent weight (e.g., NH2 equivalent weight and OH equivalent weight) of the curing agent is not particularly limited, and can be, for example, 50 or more and 5000 or less, 100 or more and 4000 or less, or 130 or more and 3000 or less. In addition, the OH equivalent weight of the curing agent that is a compound containing a hydroxyl group can be 100 or more and 5000 or less, 200 or more and 4000 or less, or 300 or more and 3000 or less. The NH2 equivalent weight of the curing agent that is a compound containing an amino group can be 50 or more and 2000 or less, 75 or more and 1000 or less, or 100 or more and 300 or less.

[0475] In the mixing step, at least two kinds of curing agents can be used. As the combination of the curing agents, it is preferable to use curing agents that are low in compatibility with each other, and / or different in reactivity, and / or different in active hydrogen equivalent weight. According to such a manner, there is a tendency that a microphase separation structure can be obtained more reliably. As an example of the combination of the curing agents that are different in reactivity, for example, a combination of curing agents that are different in active hydrogen group can be given, and more specifically, for example, a combination of a compound containing an amino group and a compound containing a hydroxyl group can be given.

[0476] In the case where two or more kinds of curing agents having the same active hydrogen group are used, that is, in the case where two or more kinds of compounds containing a hydroxyl group are used, or in the case where two or more kinds of compounds containing an amino group are used, it is preferable that the two or more kinds of curing agents include two kinds of curing agents that are different in active hydrogen equivalent weight by 500 or more and 2000 or less. It is more preferable that the two or more kinds of curing agents include a curing agent that is 200 or more and 500 or less in active hydrogen equivalent weight, and a curing agent that is 1000 or more and 2000 or less in active hydrogen equivalent weight.

[0477] In the case where two or more kinds of curing agents having the same active hydrogen group are used, and the two or more kinds of curing agents include two kinds of curing agents that are different in active hydrogen equivalent weight by 500 or more and 2000 or less, the ratio of the amount of use of the curing agent that is small in active hydrogen equivalent weight to the amount of use of the curing agent that is large in active hydrogen equivalent weight, "curing agent small in active hydrogen equivalent weight : curing agent large in active hydrogen equivalent weight", is preferably 1:1 to 1:15, and more preferably 1:1 to 1:10, in terms of the number ratio of the active hydrogen groups.

[0478] In the case where two or more curing agents having the same active hydrogen group are used, and the two or more curing agents include a curing agent having an active hydrogen equivalent weight of 200 or more and less than 500, and a curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000, the ratio of the amount of use of the curing agent having an active hydrogen equivalent weight of 200 or more and less than 500 to the amount of use of the curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000, "curing agent having an active hydrogen equivalent weight of 200 or more and less than 500 : curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000", is preferably 1 : 1 to 1 : 15 in terms of the number ratio of active hydrogen groups, and more preferably 1 : 1 to 1 : 10.

[0479] As a specific preferred combination of the curing agents, at least two kinds of the curing agents preferably include a compound containing an amino group and a compound containing a hydroxyl group. At least two kinds of the curing agents more preferably include one kind of a compound containing an amino group and two or more kinds of a compound containing a hydroxyl group, or two or more kinds of a compound containing an amino group and one kind of a compound containing a hydroxyl group. At least two kinds of the curing agents further preferably include one kind of a compound containing an amino group and two or more kinds of a compound containing a hydroxyl group.

[0480] In the case where at least two kinds of the curing agents include a compound containing an amino group and a compound containing a hydroxyl group, the difference between the NH2 equivalent weight of the compound containing an amino group and the OH equivalent weight of the compound containing a hydroxyl group is not particularly limited, but the OH equivalent weight of the compound containing a hydroxyl group is preferably large, and more preferably the OH equivalent weight of the compound containing a hydroxyl group is 100 or more and less than 2000 larger than the NH2 equivalent weight of the compound containing an amino group.

[0481] In the case where at least two kinds of the curing agents include a compound containing an amino group and a compound containing a hydroxyl group, the proportion of the amount of use of the curing agent as the compound containing an amino group with respect to the total amount of use of the curing agents is preferably 35% or more and less than 95%, and more preferably 40% or more and less than 90% in terms of the number ratio of functional groups.

[0482] As an example of the combination of the preferred curing agent, at least two curing agents include a first curing agent (a compound containing an amino group) having an NH2 equivalent of 100 or more and 300 or less, and a second curing agent (a compound containing a hydroxyl group) having an OH equivalent of 1000 or more and 2000 or less. The ratio of the use amount of the first curing agent to the use amount of the second curing agent is not particularly limited, and the use amount of the first curing agent is preferably 35% or more and 98% or less, more preferably 35% or more and 95% or less, and further preferably 40% or more and 90% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent. The use amount of the second curing agent is preferably 2% or more and 60% or less, more preferably 3% or more and 60% or less, and further preferably 5% or more and 50% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent. In addition, the use amount of the first curing agent is preferably 10% or more and 90% or less, more preferably 15% or more and 80% or less, in terms of mass, relative to the entire use amount of the curing agent. The use amount of the second curing agent is preferably 10% or more and 50% or less, more preferably 15% or more and 40% or less, in terms of mass, relative to the entire use amount of the curing agent.

[0483] Generally, the total of the use amounts of the curing agents is regulated by an R value, which is the equivalent ratio of the active hydrogen groups (amino groups and hydroxyl groups) present in the curing agents when the number of functional groups possessed by the prepolymer is taken as 1. The total of the use amounts of the curing agents is preferably adjusted so that the R value is 0.7 or more and 1.3 or less. The R value is more preferably 0.8 or more and 1.2 or less.

[0484] Note that, by using the above-described preferred combination of the curing agents in an appropriate use amount, it is possible to more reliably obtain a resin sheet having a cumulative pore volume V of 0.21 cm 3 / g or more and 1.00 cm 3 / g or less, and / or a resin sheet having a microphase separation structure. Note that, as the combination of the curing agents, two or more curing agents having low compatibility with each other, two or more curing agents having different reactivity from each other, and / or curing agents having different active hydrogen equivalent weights can be used. Even in the case where a resin sheet having a clear microphase separation structure is not obtained by using such a combination, by implementing adjustment such as changing the types of the curing agents in a manner in which the compatibility with each other is higher, changing the curing agents in a manner in which the reactivity of each other is similar, and / or changing the curing agents in a manner in which the active hydrogen equivalent weights of each other are similar, there is a tendency to obtain a resin sheet having a microphase separation structure.

[0485] (prepolymer)

[0486] As the prepolymer used in the mixing step, there is no particular limitation, and for example, a urethane prepolymer can be given. As the urethane prepolymer, for example, an adduct of hexamethylene diisocyanate with glyceryl triol; an adduct of 2,4-tolylene diisocyanate with hydroquinone; an adduct of 2,4-tolylene diisocyanate with poly(oxytetramethylene) glycol with diethylene glycol; an adduct of toluene diisocyanate with glyceryl triol; an adduct of toluene diisocyanate with trimethylolpropane; an adduct of xylylene diisocyanate with trimethylolpropane; an adduct of hexamethylene diisocyanate with trimethylolpropane; and an adduct of isocyanuric acid with hexamethylene diisocyanate can be given. In addition, a compound containing an isocyanate group prepared by the reaction of a polyisocyanate compound with a polyhydric alcohol compound other than these, various urethane prepolymers commercially available can also be used.

[0487] As the polyisocyanate compound used for preparing the compound containing an isocyanate group, there is no particular limitation as long as it has 2 or more isocyanate groups in the molecule. For example, as a diisocyanate compound having 2 isocyanate groups in the molecule, m-phenylene diisocyanate, p-phenylene diisocyanate, 2,6-tolylene diisocyanate (2,6-TDI), 2,4-tolylene diisocyanate (2,4-TDI), naphthalene-1,4-diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), 4,4'-methylenebis(cyclohexyl isocyanate) (hydrogenated MDI), 3,3'-dimethoxy-4,4'-diphenyl diisocyanate, 3,3'-dimethyl diphenylmethane-4,4'-diisocyanate, xylylene-1,4-diisocyanate, 4,4'-diphenylpropane diisocyanate, trimethylene diisocyanate, hexamethylene diisocyanate, propylene-1,2-diisocyanate, butylene-1,2-diisocyanate, cyclohexylene-1,2-diisocyanate, cyclohexylene-1,4-diisocyanate, p-phenylene diisothiocyanate, xylylene-1,4-diisothiocyanate, and ethylene diisothiocyanate can be given.

[0488] These polyisocyanate compounds can be used alone or in combination of 2 or more. As the polyisocyanate compound, a diisocyanate compound is preferred, and 2,4-TDI and 2,6-TDI, MDI are more preferred.

[0489] As the polyol compound used for preparing a compound containing an isocyanate group, for example, there can be mentioned glycol compounds such as ethylene glycol, diethylene glycol (DEG), butylene glycol, and the like; triol compounds and the like; polyether polyol compounds such as polypropylene glycol (PPG) and poly(oxytetramethylene) glycol (PTMG); polyester polyol compounds such as a reaction product of ethylene glycol and adipic acid, a reaction product of butylene glycol and adipic acid, and the like; polycarbonate polyol compounds; and polycaprolactone polyol compounds. In addition, a 3-functional propylene glycol obtained by adding ethylene oxide can also be used. The polyol compound can be used alone or in combination with two or more kinds.

[0490] The NCO equivalent of the urethane prepolymer is preferably 150 or greater and 700 or less, more preferably 200 or greater and 600 or less, and further preferably 200 or greater and 500 or less. The "NCO equivalent" is a value indicating the molecular weight of the urethane prepolymer per 1 NCO group, calculated by "(mass parts of the polyisocyanate compound + mass parts of the polyol compound) / [(number of functional groups per 1 molecule of the polyisocyanate compound x mass parts of the polyisocyanate compound / molecular weight of the polyisocyanate compound) - (number of functional groups per 1 molecule of the polyol compound x mass parts of the polyol compound / molecular weight of the polyol compound)]".

[0491] In the mixing step, at least one prepolymer can be used. The prepolymer can also be used in combination with two or more kinds of the above-described prepolymer, but it is preferable to use one kind alone. According to such a manner, there is a tendency that it is easy to control the curing reaction and it is possible to easily control the shape of the microphase separation structure. As the prepolymer, it is preferable to use a urethane prepolymer in which toluene diisocyanate is used as a main component alone.

[0492] The amount of use of the prepolymer is not particularly limited, and it is preferable to be 30 parts by mass or greater and 80 parts by mass or less, and more preferably 40 parts by mass or greater and 75 parts by mass or less, relative to the entire mixed solution.

[0493] (Additives)

[0494] In the mixing step, a component other than the prepolymer and the curing agent can also be mixed as an additive. As the additive, there can be mentioned a solvent (diluent) such as polypropylene glycol; an antifoaming agent such as a silicone-based antifoaming agent; a catalyst; a blowing agent such as water and hollow microparticles; a foam stabilizer such as a silicone-based foam stabilizer; and a filler (abrasive particles) such as cerium oxide; a dye; a pigment; a solid microparticle; a flame retardant; a hydrophilizing agent; a hydrophobizing agent; a light resistance agent; an antioxidant; an antistatic agent, and the like. From the viewpoint of making the density of the obtained resin sheet 0.3 g / cm 3 0.9 g / cm 3 From the above viewpoint, it is preferable to add a blowing agent in order to adjust the density, and it is more preferable to adjust the amount of addition of the blowing agent.

[0495] In the mixing step, by adjusting the kind and amount of the catalyst to be added, the reaction rate of the curing reaction can be controlled, and thus the microphase separation structure formed can be controlled.

[0496] (Forming step)

[0497] The forming step is a step of obtaining a resin sheet having a microphase separation structure by curing the mixed solution obtained as described above. In the forming step, for example, the mixed solution obtained in the mixing step can be cast into a mold frame that has been preheated to 30°C to 150°C, and heated at 30°C to 150°C for 10 minutes to 5 hours or so. Thus, the prepolymer reacts with the curing agent to form a resin, and thus the mixed solution is cured. Alternatively, the mixed solution can be further heated in an oven at 50°C to 180°C for 10 minutes to 10 hours or so, and thus cured twice. In the method of manufacturing the polishing pad of the present embodiment, since the mixed solution is the mixed solution described above, a resin block having a microphase separation structure can be obtained.

[0498] Note that the reaction temperature at the time of curing the mixed solution in the forming step can be appropriately adjusted depending on the kind of the prepolymer, the curing agent, and the additive to be used, the mixing ratio, and the like. By adjusting the reaction temperature, there is a tendency that the reaction rate of the curing reaction can be controlled, and thus the microphase separation structure formed can be controlled.

[0499] In the forming step, a resin sheet having a microphase separation structure is obtained by cutting a resin block obtained as described above to an appropriate thickness. The obtained resin sheet can be aged at 30°C to 150°C for 1 hour to 24 hours or so.

[0500] For the resin sheet obtained as described above, for example, a double-sided tape is attached to one surface, and the resin sheet is cut into a predetermined shape, preferably a circular plate shape, and thus a polishing pad of the present embodiment is completed. As the double-sided tape, there is no particular limitation, and any of the double-sided tapes known in the art can be arbitrarily selected and used.

[0501] Alternatively, the polishing pad of the present embodiment can be a single-layer structure formed of only the resin sheet, or can be formed of a plurality of layers in which another layer (a cushion layer or a substrate layer) is attached to one surface of the resin sheet. In the case of having a plurality of layers, the plurality of layers can be adhered and fixed to each other with pressure as needed using a double-sided tape, an adhesive, or the like. As the double-sided tape and the adhesive that can be used, there is no particular limitation, and any of the double-sided tapes and the adhesives known in the art can be arbitrarily selected and used.

[0502] Further, for the polishing pad of the present embodiment, as needed, groove processing, embossing processing, and / or hole processing (punching processing) can be performed on the surface. The shape of the groove processing and the embossing processing is not particularly limited, and, for example, shapes such as a lattice type, a concentric circle type, a radial type, and the like can be given.

[0503] In addition, for the polishing pad, finishing (lapping treatment) can also be performed on the surface and / or the back of the resin sheet. The resin sheet in the manufacturing method of the polishing pad of the present embodiment, although being high in density, has connected fine pores, and thus is excellent in finishing property, and can be subjected to finishing treatment under easy conditions. As the finishing treatment, there is no particular limitation, and can be finished by a known method such as lapping based on a diamond finisher.

[0504] [Manufacturing method of a polishing processed object]

[0505] The manufacturing method of the polishing processed object of the present embodiment has a polishing step of polishing a processed object using the above-described polishing pad in the presence of slurry, to obtain a polishing processed object.

[0506] In the manufacturing method of the polishing processed object of the present embodiment, while the slurry is supplied, the holding platform and the polishing platform are relatively rotated with the processed object being pressed toward the polishing pad side on the holding platform, whereby the processed surface of the processed object is subjected to the polishing pad to perform polishing processing. The holding platform and the polishing platform can be rotated in the same direction at different rotation speeds from each other, or can be rotated in different directions. In addition, for the processed object, in the polishing processing, the polishing processing can be performed while moving (rotating) on the inside of the frame portion.

[0507] The slurry can contain a liquid component such as water, oil, an additive, and a polishing grain (abrasive particle; for example, diamond, SiC, B4C, and AI2O3), and the like, according to the processed object, polishing conditions, and the like.

[0508] In addition, as the processed object, there is no particular limitation, and, for example, optical materials such as lenses, parallel plane plates, and mirrors, semiconductor wafer materials such as SiC disks, crystals, metals, stone materials, wood materials, resin materials, and ceramic materials, and the like can be given.

[0509] <4th Embodiment>

[0510] Here, the 4th mode (in the present specification, also referred to as "4th embodiment") related to the present embodiment is described in detail. Note that the terms and symbols used in the <4th embodiment> are used independently of the contents of the <1st embodiment>, the <2nd embodiment>, and the <3rd embodiment> described later.

[0511] (Polishing pad)

[0512] The polishing pad of the present embodiment (hereinafter, "the present embodiment" in the <4th embodiment> means the 4th embodiment unless otherwise specified) is provided with a resin sheet having fine pores, and in a fine pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle set to 130° and a mercury surface tension set to 485 dyn / cm, a cumulative pore volume V in a range of fine pore diameters of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 3 / g or less, the density of the resin sheet is 0.9 g / cm 3 or more and 1.3 g / cm 3 or less. The polishing pad of the present embodiment is excellent in both the liquid retention performance and the abrasive grain retention performance of the slurry while maintaining a high density, because it is configured as described above.

[0513] In addition, the polishing pad of the present embodiment can be specified as described below from the viewpoint of a cumulative pore volume V' described later. That is, the polishing pad of the present embodiment is provided with a resin sheet having fine pores, and in a fine pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle set to 130° and a mercury surface tension set to 485 dyn / cm, a cumulative pore volume V" in a range of fine pore diameters of 0.050 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.140 cm 3 / g or less, the density of the resin sheet is 0.9 g / cm 3 or more and 1.3 g / cm 3 or less. The polishing pad of the present embodiment specified as described above can also impart good planarity to a workpiece, and is excellent in affinity with a slurry.

[0514] The polishing pad of the present embodiment is not particularly limited as long as it is provided with the resin sheet of the present embodiment, and the polishing pad can have a configuration other than the resin sheet. As the configuration other than the resin sheet in the polishing pad, a polishing layer, a cushion layer, and an adhesive layer, and the like known in the past can be given.

[0515] Note that, in the present embodiment, the "resin sheet of the present embodiment" includes both of the following: "a resin sheet which is a resin sheet having fine pores, and in a fine pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle set to 130° and a mercury surface tension set to 485 dyn / cm, a cumulative pore volume V in a range of fine pore diameters of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 3 / g or less, the density of the resin sheet is 0.9 g / cm 3 or more and 1.3 g / cm3 The following "and, "the resin sheet is a resin sheet having fine pores, in a fine pore distribution of the resin sheet measured by a mercury intrusion method in which a mercury surface tension is set to 485 dyn / cm, a cumulative fine pore volume V in a range of a fine pore diameter of 0.050 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.140 cm 3 / g or more and 0.140 cm 3 / g or more and 0.140 cm 3 / g or more and 0.140 cm

[0516] The polishing pad of the present embodiment preferably has the above-described resin sheet as a polishing layer. By "having the resin sheet as a polishing layer" is meant that at least one surface of the polishing pad of the present embodiment corresponds to a surface of the resin sheet in the present embodiment, and the surface of the resin sheet becomes a polishing surface that is pressed against a workpiece during polishing processing in the present embodiment. Therefore, the polishing pad of the present embodiment is preferably composed of the resin sheet in the present embodiment on at least one side. In addition, the polishing pad of the present embodiment can be formed only of the resin sheet in the present embodiment.

[0517] For the polishing pad of the present embodiment, a groove process, an emboss process, and / or a hole process (punching process) can be performed on the polishing surface as needed, and a light-transmitting portion can be provided. The shape of the groove process and the emboss process is not particularly limited, and shapes such as a lattice type, a concentric circle type, and a radial type can be given as examples.

[0518] (Resin Sheet)

[0519] (Density)

[0520] The density of the resin sheet in the present embodiment is 0.9 g / cm 3 or more and 1.3 g / cm 3 or more and 1.3 g / cm 3 If the density of the resin sheet in the present embodiment is 0.9 g / cm or more, that is, if the resin sheet is high in density, it is possible to suppress the case where abrasive grains migrate into the resin sheet during polishing processing without contributing to polishing. In addition, the polishing pad becomes less likely to deform with respect to pressure, and thus the force imparted to the workpiece by the polishing pad during polishing processing becomes uniform in the polishing surface direction. As a result, in polishing processing using a polishing pad provided with such a resin sheet, it is possible to make the surface of the workpiece even flatter. Note that, in the present embodiment, by "the surface of the workpiece is flat" is meant that the surface of the workpiece that has been polished is flatter as a whole. In other words, the flatness of the whole is good.

[0521] From the same viewpoint, the density of the resin sheet in the present embodiment is preferably greater than 0.9 g / cm3 More preferably, 1.0 g / cm3 3 More preferably, 1.1 g / cm3 3 More preferably, 1.1 g / cm3 3 Note that, the density of the resin sheet is greater than 0.9 g / cm3 3 More preferably, 1.1 g / cm3

[0522] If the density of the resin sheet in the present embodiment is 1.3 g / cm3 3 or less, the liquid retention performance of the slurry is improved. In addition, there is a tendency that the hardness of the resin sheet becomes low, and in polishing processing using a polishing pad provided with such a resin sheet, there is a tendency that the generation of scratches can be suppressed.

[0523] The density of the resin sheet in the present embodiment can be measured using a method known in the past, for example, the mass and the volume of the resin sheet are measured using a general method, and the density is calculated from the obtained values. In addition, as a method of controlling the density of the resin sheet, there is no particular limitation, and for example, a polishing pad can be obtained using the manufacturing method of the polishing pad in the present embodiment described later. In particular, in the manufacturing process of the resin sheet in the present embodiment, by reducing the amount of the foaming agent or not using the foaming agent, the density of the resin sheet can be improved.

[0524] (Pore distribution of resin sheet)

[0525] (Cumulative pore volume V)

[0526] The resin sheet in the present embodiment has pores, and in the pore distribution measured by a mercury intrusion method in which the contact angle is set to 130° and the mercury surface tension is set to 485 dyn / cm, the cumulative pore volume V in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less is 0.020 cm3 / g or more and 0.100 cm3 / g or less. 3 3 More preferably, 1.1 g / cm3

[0527] Note that, in the present embodiment, unless otherwise specified, the "pore distribution" means the pore distribution measured by a mercury intrusion method in which the contact angle is set to 130° and the mercury surface tension is set to 485 dyn / cm. The mercury intrusion method is a method in which the pore distribution on the surface of a measurement sample can be measured by filling mercury into the pores on the surface of the measurement sample while scanning the applied pressure. Therefore, in the case where the pore distribution is measured for a foamed material by the mercury intrusion method, the pore distribution of the foamed material mainly reflects the pore distribution of the connected bubbles (also generally referred to as "continuous bubbles"), and the contribution of the pore distribution of the independent bubbles is small.

[0528] ​With respect to the polishing pad of the present embodiment, the present inventors found that, in the fine pore distribution measured by the mercury porosimetry, when the cumulative pore volume V in the range of the fine pore diameter of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more, the abrasive grain retention performance of the polishing pad becomes sufficiently good. It is inferred that this is because, when the cumulative pore volume V is 0.020 cm 3 / g or more, the connected pores having the fine pore diameter of 0.100 μm or more and 10.0 μm or less are distributed in the entire resin sheet, the concavo-convex due to the connected pores is formed on the surface of the resin sheet, and thus, at the time of polishing processing, the concavo-convex contributes to the retention of the abrasive grains, and a small amount of slurry can be efficiently used. However, the reason why the affinity of the polishing pad to the slurry becomes sufficiently good when the cumulative pore volume V is 0.020 cm 3 / g or more is not limited to the above reason.

[0529] From the viewpoint of further improving the abrasive grain retention performance, in the resin sheet of the present embodiment, the above cumulative pore volume V is preferably 0.030 cm 3 / g or more, more preferably 0.040 cm 3 / g or more, further preferably 0.050 cm 3 / g or more. In addition, if the cumulative pore volume V is in the above range, the resin sheet becomes excellent in the dressing even if it is high in density. Note that, by "dressing" or "dressing treatment", it means a treatment of making the surface roughness of the polishing surface of the polishing pad uniform or making the flatness uniform, using a dressing tool (for example, a diamond dresser or an abrasive paper) in which abrasive grains or the like are fixed, before polishing a work. In addition, by "excellent in the dressing", it means that the dressing treatment can be performed by a treatment under a comparatively easy condition. By "polishing surface", it means a surface of the polishing pad which contacts or is supposed to contact a work at the time of polishing processing of the work using the polishing pad.

[0530] In the resin sheet of the present embodiment, the above cumulative pore volume V is 0.100 cm 3 / g or less. By making the cumulative pore volume V 0.100 cm 3 / g or less, there is a tendency that the density of the resin sheet easily becomes in the above range, and in polishing processing using a polishing pad provided with such a resin sheet, the surface of a work can be made more flat. From the same viewpoint, the cumulative pore volume V is preferably 0.090 cm 3 / g or less, more preferably 0.080 cm 3 / g or less.

[0531] (Cumulative Pore Volume V')

[0532] In the pore distribution of the resin sheet in the present embodiment, the cumulative pore volume V' in the range of the pore diameter of 0.050 μm or more and less than 0.100 μm is typically 0.000 cm3 / g or more and 0.120 cm3 / g or less 3 / g or more and 0.120 cm3 / g or less 3 / g or less, it is preferable to be 0.000 cm3 / g from the viewpoint of further improving the balance of the flatness imparted to the work and the affinity with the slurry 3 / g or more and 0.100 cm3 / g or less 3 / g or less, it is more preferable to be 0.000 cm3 / g 3 / g or more and 0.080 cm3 / g or less 3 / g or less.

[0533] From the above viewpoint, it can be provided that the polishing pad of the present embodiment is provided with the resin sheet having pores, and in the pore distribution of the resin sheet measured by the mercury porosimetry by setting the contact angle to 130° and the mercury surface tension to 485 dyn / cm, the cumulative pore volume V" in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less is 0.020 cm3 / g or more and 0.140 cm3 / g or less 3 / g or more and 0.140 cm3 / g or less 3 / g or less, the density of the resin sheet is 0.9 g / cm3or more and 1.3 g / cm3or less 3 / g or more and 1.3 g / cm3or less 3 / g or less. Note that the cumulative pore volume V" in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less in the present embodiment can be provided as the sum of the cumulative pore volume V and the cumulative pore volume V' in the present embodiment, and from the viewpoint of further improving the balance of the flatness imparted to the work and the affinity with the slurry, it is 0.020 cm3 / g or more and 0.140 cm3 / g or less 3 / g or more and 0.140 cm3 / g or less 3 / g or less, it is preferable to be 0.030 cm3 / g 3 / g or more and 0.130 cm3 / g or less 3 / g or less, it is more preferable to be 0.050 cm3 / g 3 / g or more and 0.120 cm3 / g or less 3 / g or less.

[0534] (Ratio of cumulative pore volume V to cumulative pore volume Vo)

[0535] In the polishing pad of the present embodiment, from the viewpoint of further improving the balance of flatness imparted to the work and affinity with the slurry, in the fine pore distribution of the resin sheet, the ratio of the cumulative pore volume V in the range of 0.100 μm or more and 10.0 μm or less in the fine pore diameter to the cumulative pore volume V0 in the range of 0.100 μm or more and 360 μm or less in the fine pore diameter is preferably 50% or more. In other words, the ratio of the cumulative pore volume V to the cumulative pore volume V0 (V / V0) is preferably 0.50 or more. According to such a manner, the proportion of the fine pores of the resin sheet having a relatively small fine pore diameter increases, and thus it is possible to maintain the density at a high density and make the number of connected air bubbles within the resin sheet more.

[0536] From the same viewpoint, the ratio of the cumulative pore volume V to the cumulative pore volume V0 is more preferably 60% or more, further preferably 65% or more, and further more preferably 70% or more. The upper limit of the ratio of the cumulative pore volume V to the cumulative pore volume V0 is not particularly limited, and the ratio of the cumulative pore volume V to the cumulative pore volume V0 can be 100% or less, 99% or less, 95% or less, 90% or less, or 80% or less.

[0537] In addition, in the fine pore distribution of the resin sheet in the present embodiment, from the same viewpoint as described above, the ratio of the cumulative pore volume V to the cumulative pore volume V0' in the range of 0.050 μm or more and 360 μm or less in the fine pore diameter is preferably 50% or more, more preferably 60% or more, further preferably 65% or more, and further more preferably 70% or more. In addition, V / V0' can be 100% or less, 99% or less, 95% or less, 90% or less, or 80% or less.

[0538] (Maximum peak position)

[0539] In the pore distribution of the resin sheet in the present embodiment, the peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less is preferably in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less. Generally, in the mercury porosimetry, the pore distribution is measured as the cumulative pore volume from the largest pore diameter of the measurement range. Therefore, the "peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less" means the position (pore diameter) of the largest peak of the Log differential pore volume distribution (dV / d(log D)) calculated from the pore distribution obtained by the mercury porosimetry. In addition, the largest peak means the maximum point of the maximum value in the case where a plurality of maximum points exist in the range of the pore diameter of 0.100 μm or more and 360 μm or less.

[0540] By making the peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less be in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less, the resin sheet has pores that are more uniformly distributed in the range of 0.100 μm or more and 10.0 μm or less, and thus there is a tendency that the affinity of the polishing pad for the slurry and the dishing property are further improved. From the viewpoint of further improving the affinity of the polishing pad for the slurry and the dishing property, the peak position of the largest peak in the range of the pore diameter of 0.100 μm or more and 360 μm or less is more preferably in the range of the pore diameter of 0.500 μm or more and 5.00 μm or less.

[0541] In addition, in the pore distribution of the resin sheet in the present embodiment, the peak position of the largest peak in the range of the pore diameter of 0.050 μm or more and 360 μm or less is preferably in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less, and more preferably in the range of the pore diameter of 0.050 μm or more and 5.00 μm or less.

[0542] (Number of peaks and peak height)

[0543] In the pore distribution of the resin sheet in the present embodiment, the number of peaks in the range of the pore diameter of 0.100 μm or more and 360 μm or less is preferably 1 or more and 3 or less, more preferably 1 or more and 2 or less, and further preferably 1. By making the number of peaks be in the above range, the resin sheet has pores that are more uniformly distributed, and thus there is a tendency that the affinity of the polishing pad for the slurry and the dishing property are further improved.

[0544] From the same viewpoint, in the case where two or more peaks exist in the range of the pore diameter of 0.100 μm or more and 360 μm or less, the peak height of the largest peak is preferably 2 times or more, more preferably 5 times or more, and further preferably 10 times or more, as compared with the peak height of the second largest peak.

[0545] (Cumulative pore volume V0)

[0546] In the pore distribution of the resin sheet in this embodiment, the cumulative pore volume V0 within the range of pore diameters from 0.100 μm to 360 μm is preferably 0.040 cm³. 3 / g or more 0.120cm 3 / g or less, more preferably 0.050cm 3 / g or more 0.110cm 3 Below / g, more preferably 0.060cm 3 / g or more 0.100cm 3 / g or less. By keeping the cumulative pore volume V0 within the above range, there is a tendency to further improve the flatness imparted to the workpiece and the uniformity of its affinity with the slurry.

[0547] Furthermore, in the pore distribution of the resin sheet in this embodiment, the cumulative pore volume V0' within the range of pore diameters from 0.050 μm to 360 μm can be defined as the sum of the cumulative pore volume V0 and the cumulative pore volume V' in this embodiment. From the same perspective as above, 0.040 cm is preferred. 3 / g or more 0.200cm 3 / g or less, more preferably 0.050cm 3 / g or more 0.180cm 3 Below / g, more preferably 0.060cm 3 / g or more 0.160cm 3 / g or less.

[0548] In this embodiment, the peak position, number of peaks, and peak height of the maximum peak of the cumulative pore volume V, cumulative pore volume V', cumulative pore volume V", cumulative pore volume V0, and cumulative pore volume V0' are calculated from the pore distribution measured by mercury intrusion porosimetry with a contact angle of 130° and a mercury surface tension of 485 dyn / cm. More detailed measurement conditions for mercury intrusion porosimetry can be found in the method described in the embodiment. Furthermore, there are no particular limitations on the method for controlling the peak position, number of peaks, and peak height of the maximum peak of the cumulative pore volume V, cumulative pore volume V', cumulative pore volume V", cumulative pore volume V0, and cumulative pore volume V0'. For example, the polishing pad can be obtained using the polishing pad manufacturing method of this embodiment described later.

[0549] (Structure of resin sheet)

[0550] The resin sheet in the present embodiment preferably has a microphase separation structure. In the present embodiment, the "microphase separation structure" refers to a phase separation structure formed via microphase separation. In addition, in the present embodiment, the "microphase separation" refers to phase separation in which a micro (typically, micrometer order) structure pattern is generated in a macroscopically uniform object in a periodic repetition of at least one dimension. The microphase separation can be generated by, for example, using the preferred manufacturing conditions in the manufacturing method of the polishing pad of the present embodiment described later. As typical examples of the microphase separation structure, although not limited to the following structures, mention can be made of a spherical structure (island-in-sea structure), a cylindrical structure, a lamellar structure, and a three-dimensional network structure. The microphase separation structure in the present embodiment preferably includes a cylindrical structure, a lamellar structure, and a three-dimensional network structure, and more preferably a three-dimensional network structure.

[0551] In the present embodiment, the three-dimensional network structure refers to a structure in which a network in a three-dimensional direction is formed. As the three-dimensional network structure resulting from microphase separation, a structure including a single-helical icosahedron structure and / or a double (multiple) helical icosahedron structure can also be used. In the present embodiment, the single-helical icosahedron structure typically refers to a network structure in which a unit cell is formed by combining thin wire structures in which 2 three-way junctions are paired, and the unit cell is periodically repeated, and the double (multiple) helical icosahedron structure refers to a structure in which 2 or more single-helical icosahedron structures are combined into a box.

[0552] The cross section of a resin sheet having a continuous foaming structure resulting from the injection of a foaming agent or a non-reactive gas of the related art has a tendency to observe a substantially spherical foaming cross section and a resin flat portion (i.e., an island-in-sea structure formed by the sea of resin and the islands of voids). On the other hand, in the case where the resin sheet in the present embodiment has a double (multiple) helical icosahedron structure, in the cross section thereof, typically, there is a tendency to observe a structure in which 2 or more resins have undergone phase separation in a mottled manner with a micrometer order. In addition, in the case where the resin sheet in the present embodiment has a single-helical icosahedron structure, in the cross section thereof, typically, an indefinite void cross section and a resin skeleton / resin skeleton cross section are observed. In the case where the resin skeleton portion is sufficiently larger than the void, the resin skeleton portion can not be observed and the sea of resin is substantially observed. Even in this case, the voids of the resin sheet in the present embodiment are formed in a three-dimensional network so as to be in communication with each other.

[0553] Note that, when observing the cross section of the resin sheet in the present embodiment, there are cases where the two or more kinds of resins are observed to have mottled patterns, and the two features of the indefinite void cross section and the resin skeleton / resin skeleton cross section, i.e., the boundary between the double (multiple) gyroid structure and the single gyroid structure, cannot be clearly distinguished, in which case, it can be evaluated as including at least one of the single gyroid structure and the double (multiple) gyroid structure.

[0554] In the case where the resin sheet in the present embodiment has the single gyroid structure and / or the double (multiple) gyroid structure, typically, in the Log differential fine pore volume distribution, a sharp peak (maximum value) is measured in the range of the fine pore diameter of 0.100 μm or more and 10.0 μm or less.

[0555] Hereinafter, the preferred structures observed in the polishing pad of the present embodiment are described in detail, but with the proviso that all of them are structures derived from microphase separation.

[0556] The resin sheet in the present embodiment can include two or more phases having different compositions. In the present embodiment, the "composition" of the phase includes both the resin as the main component of the phase and the components other than the main component included in the phase, and further, the blending ratio thereof is also taken into consideration. Therefore, the microphase-separated structure possessed by the resin sheet in the present embodiment can include two or more phases different from each other in at least any one of the resin as the main component of the phase and the components other than the main component included in the phase, and typically, can include two or more phases different from each other in at least one or more of the structure, the average molecular weight, and the functional group of the resin as the main component of the phase.

[0557] As examples of the two phases having different compositions, for example, the following cases can be given: a case where the kind of the resin constituting the phase is different between one phase and the other phase; a case where the content of the additive contained is different between one phase and the other phase; and a case where the resin sheet is formed of an AB block polymer, and one phase is a phase having an A block as the main component, and the other phase is a phase having a B block as the main component.

[0558] As typical examples of the microphase separation structure including two phases different in composition from each other, there are, for example, a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by a prepolymer different from the prepolymer in the first phase and the curing agent in the first phase; a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by the prepolymer in the first phase and a curing agent different from the curing agent in the first phase; and a case where the first phase is a phase cured by a prescribed prepolymer and a prescribed curing agent, and the second phase is a phase cured by a prepolymer different from the prepolymer in the first phase and a curing agent different from the curing agent in the first phase; and the like.

[0559] The resin sheet in the present embodiment can have a void due to microphase separation. The void can also be said to be a void constituting the microphase separation structure, and as a specific example thereof, although not limited to the following void, there is, for example, a void divided by a resin skeleton providing a gyroid structure. Note that in the present embodiment, the void can be a void from a fine hole, or a void from a communication hole formed by communication of a plurality of fine holes.

[0560] The resin sheet having the microphase separation structure in the present embodiment can be obtained, for example, by the manufacturing method of the polishing pad in the present embodiment described later. In addition, that the resin sheet has the microphase separation structure can be confirmed by observation with a scanning electron microscope (SEM) at a magnification of about 300 times to about 3000 times.

[0561] Note that, regarding the resin sheet having the microphase separation structure including two or more phases different in composition, or having the aforementioned void, observation can be performed by an optical method such as an optical microscope and a phase contrast microscope, a method using an electron microscope such as a scanning electron microscope and a transmission electron microscope, a method using scattering of particles such as light scattering, neutron small-angle scattering, and X-ray small-angle scattering, an X-ray diffraction method, a fluorescence method, and a pulsed NMR measurement method.

[0562] (Average thickness of resin sheet)

[0563] The average thickness of the resin sheet in the present embodiment is not particularly limited, but is preferably 0.5 mm or more and 10.0 mm or less, more preferably 0.6 mm or more and 8.0 mm or less, and further preferably 0.7 mm or more and 5.0 mm or less.

[0564] (Physical properties of resin sheet)

[0565] The compression rate of the resin sheet in the present embodiment is not particularly limited, but is preferably 0.1% or more and 10.0% or less, and more preferably 0.5% or more and 5.0% or less. Note that the compression rate of the resin sheet can be found in accordance with Japanese Industrial Standards (JIS L 1021) using a SH OPPER-type thickness tester (pressing surface: circular shape with a diameter of 1 cm). Specifically, the thickness t0 after 30 seconds from the application of an initial load from a no-load state can be measured, and next, the thickness t1 after 30 seconds from the application of a final pressure from the thickness t0 can be measured, and thus, the following equation is used. Note that the initial load is 100 g / cm 2 , and the final pressure is 1120 g / cm 2 .

[0566] Compression rate (%) = 100 x (t0 - t1) / t0

[0567] The compression elastic modulus of the resin sheet in the present embodiment is not particularly limited, but is preferably 65% or more and 98% or less, and more preferably 70% or more and 95% or less. Note that the compression elastic modulus of the resin sheet can be found in accordance with Japanese Industrial Standards (JIS L 1021) using a SH OPPER-type thickness tester (pressing surface: circular shape with a diameter of 1 cm). Specifically, the thickness t0 after 30 seconds from the application of an initial load from a no-load state can be measured, and next, the thickness t1 after 30 seconds from the application of a final pressure from the thickness t0 can be measured, and further, the thickness t0' after 30 seconds from the application of an initial load again from a no-load state after the removal of all the load from the thickness t1 and the standing for 5 minutes can be measured, and thus, the following equation is used. Note that the initial load is 100 g / cm 2 , and the final pressure is 1120 g / cm 2 .

[0568] Compression elastic modulus (%) = 100 x (t0' - t1) / (t0 - t1)

[0569] The Shore D hardness of the resin sheet in the present embodiment is not particularly limited, but is preferably 30 or more and 90 or less, and more preferably 40 or more and 80 or less. Note that the Shore D hardness of the resin sheet can be found in accordance with Japanese Industrial Standards (JIS K7311) using a D-type hardness tester.

[0570] (Material of the resin sheet)

[0571] The material of the resin sheet in the present embodiment is not particularly limited. As the material of the resin sheet, for example, a polyurethane resin can be given. As the polyurethane resin, there is no particular limitation, and for example, a polyester-based polyurethane resin, a polyether-based polyurethane resin, and a polycarbonate-based polyurethane resin can be given. They can be used alone or in combination with two or more.

[0572] Among them, the material of the resin sheet in the present embodiment preferably contains at least either one of a polyester-based polyurethane resin and a polyether-based polyurethane resin. It is particularly preferable to contain a polyurethane resin described later in the manufacturing method of the polishing pad of the present embodiment as a cured product of a mixed solution containing a urethane prepolymer and at least two curing agents. By using such a resin, there is a tendency that it is easy to make the density and the fine pore distribution within the above range.

[0573] In addition, the resin sheet in the present embodiment can contain a component from an additive in addition to the resin component. As such an additive, for example, a defoaming agent, a catalyst, a foaming agent, a foam stabilizer, a polishing grain, a dye, a pigment, a solid particle, a flame retardant, a hydrophilic agent, a hydrophobic agent, a light-resistant agent, an antioxidant, and an antistatic agent, and the like described later in the manufacturing method of the polishing pad of the present embodiment can be given.

[0574] [Manufacturing method of polishing pad]

[0575] The manufacturing method of the polishing pad of the present embodiment includes a step of curing a mixed solution of at least one prepolymer and at least two curing agents, thereby obtaining a resin sheet having a microphase separation structure. According to such a method, the polishing pad of the present embodiment can be easily manufactured. Hereinafter, each step of the manufacturing method of the polishing pad will be described in detail.

[0576] (Mixing step)

[0577] The manufacturing method of the polishing pad of the present embodiment can include a mixing step of preparing a mixed solution of at least one prepolymer and at least two curing agents. By using at least two curing agents in the mixing step, a resin sheet having a microphase separation structure can be obtained in a molding step after the mixing step. In particular, by using two or more curing agents to form a microphase separation structure, there is a tendency that it is easy to control the curing reaction and the shape of the microphase separation structure compared to the case where two or more prepolymers are used to form a microphase separation structure.

[0578] In the mixing step, for example, at least one prepolymer heated to 30°C to 90°C and at least two curing agents are put into a temperature-adjustable mixing machine with a jacket, and stirring is performed at 30°C to 130°C. At this time, if necessary, the mixture can also be received in a tank with a stirrer and a jacket, and allowed to mature. The stirring time is suitably adjusted according to the number of teeth, rotation speed, gap, and the like of the mixing machine, and is, for example, 0.1 seconds to 60 seconds.

[0579] (Curing agent)

[0580] The curing agent used in the mixing step is not particularly limited, and, for example, compounds containing an amino group and compounds containing a hydroxyl group can be given. The compound containing an amino group is not particularly limited, and, for example, 4,4'-methylenebis(2-chloroaniline) (MOCA), ethylenediamine, propylenediamine, hexamethylenediamine, isophorone diamine, dicyclohexylmethane-4,4'-diamine, 4-methyl-2,6-bis(methylthio)-1,3-benzenediamine, 2-methyl-4,6-bis(methylthio)-1,3-benzenediamine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 2,2-bis[3-(isopropylamino)-4-hydroxyphenyl]propane, 2,2-bis[3-(1-methylpropylamino)-4-hydroxyphenyl]propane, 2,2-bis[3-(1-methylpentylamino)-4-hydroxyphenyl]propane, 2,2-bis(3,5-diamino-4-hydroxyphenyl)propane, 2,6-diamino-4-methylphenol, trimethylethylenebis-4-aminobenzoate, and polytetramethyleneoxy-di-p-aminobenzoate, and the like can be given. The compound containing an amino group is preferably 4,4'-methylenebis(2-chloroaniline).

[0581] The compound containing a hydroxyl group is not particularly limited, and, for example, ethylene glycol, propylene glycol, diethylene glycol, trimethylene glycol, tetraethylene glycol, triethylene glycol, dipropylene glycol, 1,4-butanediol, 1,3-butanediol, 2,3-butanediol, 1,2-butanediol, 3-methyl-1,2-butanediol, 1,2-pentanediol, 1,4-pentanediol, 2,4-pentanediol, 2,3-dimethyltrimethylene glycol, tetramethylene glycol, 3-methyl-4,3-pentanediol, 3-methyl-4,5-pentanediol, 2,2,4-trimethyl-1,3-pentanediol, 1,6-hexanediol, 1,5-hexanediol, 1,4-hexanediol, 2,5-hexanediol, 1,4-cyclohexanedimethanol, neopentyl glycol, glycerol, trimethylolpropane, trihydroxyethylmethane, trimethylolmethane, polybutylene glycol, polyethylene glycol, and polypropylene glycol, and the like can be given. From the viewpoint of controlling the reaction, as the compound containing a hydroxyl group, a compound having 2 functions (diol) is more preferably used than a compound having 3 or more functions. In addition, as the compound containing a hydroxyl group, polybutylene glycol is more preferable.

[0582] Note that two or more of the above curing agents can be used in combination. The combination of the curing agents is not particularly limited, but is preferably a combination described later.

[0583] The active hydrogen equivalent weight (e.g., NH2 equivalent weight and OH equivalent weight) of the curing agent is not particularly limited, and can be, for example, 50 or more and 5000 or less, 100 or more and 4000 or less, or 130 or more and 3000 or less. In addition, the OH equivalent weight of the curing agent that is a compound containing a hydroxyl group can be 100 or more and 5000 or less, 200 or more and 4000 or less, or 300 or more and 3000 or less. The NH2 equivalent weight of the curing agent that is a compound containing an amino group can be 50 or more and 2000 or less, 75 or more and 1000 or less, or 100 or more and 300 or less.

[0584] In the mixing step, at least two curing agents can be used. As the combination of the curing agents, it is preferable to use curing agents that are low in compatibility with each other, and / or different in reactivity, and / or different in active hydrogen equivalent weight. According to such a manner, there is a tendency that a microphase separation structure can be obtained more reliably. As an example of the combination of the curing agents that are different in reactivity, for example, a combination of curing agents that are different in active hydrogen group can be given, and more specifically, for example, a combination of a compound containing an amino group and a compound containing a hydroxyl group can be given.

[0585] In the case where two or more curing agents having the same active hydrogen group are used, that is, in the case where two or more compounds containing a hydroxyl group are used, or in the case where two or more compounds containing an amino group are used, it is preferable that the two or more curing agents include two curing agents that are different in active hydrogen equivalent weight by 500 or more and 2000 or less. It is more preferable that the two or more curing agents include a curing agent that is 200 or more and 500 or less in active hydrogen equivalent weight, and a curing agent that is 1000 or more and 2000 or less in active hydrogen equivalent weight.

[0586] In the case where two or more curing agents having the same active hydrogen group are used, and the two or more curing agents include two curing agents that are different in active hydrogen equivalent weight by 500 or more and 2000 or less, the ratio of the amount of use of the curing agent that is small in active hydrogen equivalent weight to the amount of use of the curing agent that is large in active hydrogen equivalent weight, "curing agent small in active hydrogen equivalent weight : curing agent large in active hydrogen equivalent weight", is preferably 1:1 to 15:1, and more preferably 1:1 to 10:1, in terms of the number ratio of the active hydrogen groups.

[0587] In the case where two or more curing agents having the same active hydrogen group are used, and the two or more curing agents include a curing agent having an active hydrogen equivalent weight of 200 or more and less than 500, and a curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000, the ratio of the amount of use of the curing agent having an active hydrogen equivalent weight of 200 or more and less than 500 to the amount of use of the curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000, "curing agent having an active hydrogen equivalent weight of 200 or more and less than 500 : curing agent having an active hydrogen equivalent weight of 1000 or more and less than 2000", is preferably 1 : 1 to 15 : 1, more preferably 1 : 1 to 10 : 1, in terms of the number ratio of active hydrogen groups.

[0588] As a specific preferred combination of the curing agents, the at least two curing agents preferably include a compound containing an amino group and a compound containing a hydroxyl group. The at least two curing agents more preferably include one compound containing an amino group and two or more compounds containing a hydroxyl group, or two or more compounds containing an amino group and one compound containing a hydroxyl group. The at least two curing agents further preferably include one compound containing an amino group and two or more compounds containing a hydroxyl group.

[0589] In the case where the at least two curing agents include a compound containing an amino group and a compound containing a hydroxyl group, the difference between the NH2 equivalent weight of the compound containing an amino group and the OH equivalent weight of the compound containing a hydroxyl group is not particularly limited, but the OH equivalent weight of the compound containing a hydroxyl group is preferably large, and more preferably the OH equivalent weight of the compound containing a hydroxyl group is 100 or more and less than 2000 larger than the NH2 equivalent weight of the compound containing an amino group.

[0590] In the case where the at least two curing agents include a compound containing an amino group and a compound containing a hydroxyl group, the proportion of the amount of use of the curing agent as the compound containing an amino group with respect to the total amount of use of the curing agents is preferably 35% or more and less than 95%, more preferably 40% or more and less than 90%, in terms of the number ratio of functional groups.

[0591] As an example of the combination of the preferred curing agent, for example, at least two kinds of the curing agent include a first curing agent (a compound containing an amino group) having an NH2 equivalent of 100 or more and 300 or less, a second curing agent (a compound containing a hydroxyl group) having an OH equivalent of 200 or more and 600 or less, and a third curing agent (a compound containing a hydroxyl group) having an OH equivalent of 1000 or more and 2000 or less. The ratio of the use amount of the first curing agent, the use amount of the second curing agent, and the use amount of the third curing agent is not particularly limited, and the use amount of the first curing agent is preferably 30% or more and 95% or less, more preferably 40% or more and 90% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent. The use amount of the second curing agent is preferably 1% or more and 70% or less, more preferably 5% or more and 60% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent. The use amount of the third curing agent is preferably 3% or more and 60% or less, more preferably 5% or more and 50% or less, in terms of the number of functional groups, relative to the entire use amount of the curing agent.

[0592] Generally, the total of the use amounts of the curing agent is regulated by an R value, which is the equivalent ratio of the active hydrogen groups (amino and hydroxyl groups) present in the curing agent when the number of functional groups possessed by the prepolymer is taken as 1. The total of the use amounts of the curing agent is preferably adjusted so that the R value becomes 0.7 or more and 1.3 or less. The R value is more preferably 0.8 or more and 1.2 or less.

[0593] Note that, by using the above-described preferred combination of the curing agent in an appropriate use amount, it is possible to more reliably obtain a resin sheet having a cumulative pore volume V of 0.020 cm 3 / g or more and 0.100 cm 3 / g or less and / or a resin sheet having a microphase separation structure. Note that, as the combination of the curing agent, two or more kinds of curing agents having low compatibility with each other, two or more kinds of curing agents having different reactivity from each other, and / or curing agents having different active hydrogen equivalent weights can be used. Even in the case where a resin sheet having a clear microphase separation structure is not obtained by using such a combination, by implementing adjustment such as changing the kinds of the curing agents in a manner that the compatibility with each other becomes higher, changing the curing agents in a manner that the reactivity with each other becomes similar, and / or changing the curing agents in a manner that the active hydrogen equivalent weights with each other become close, there is a tendency that a resin sheet having a microphase separation structure can be obtained.

[0594] (prepolymer)

[0595] As the prepolymer used in the mixing step, there is no particular limitation, and for example, a urethane prepolymer can be given. As the urethane prepolymer, for example, an adduct of hexamethylene diisocyanate with glyceryl triol; an adduct of 2,4-tolylene diisocyanate with hydroquinone; an adduct of 2,4-tolylene diisocyanate with poly(oxytetramethylene) glycol with diethylene glycol; an adduct of toluene diisocyanate with glyceryl triol; an adduct of toluene diisocyanate with trimethylolpropane; an adduct of xylylene diisocyanate with trimethylolpropane; an adduct of hexamethylene diisocyanate with trimethylolpropane; and an adduct of isocyanuric acid with hexamethylene diisocyanate can be given. In addition, a compound containing an isocyanate group prepared by the reaction of a polyisocyanate compound with a polyhydric alcohol compound other than these, various urethane prepolymers commercially available can also be used.

[0596] As the polyisocyanate compound used for preparing the compound containing an isocyanate group, there is no particular limitation as long as it has 2 or more isocyanate groups in the molecule. For example, as the diisocyanate compound having 2 isocyanate groups in the molecule, m-phenylene diisocyanate, p-phenylene diisocyanate, 2,6-tolylene diisocyanate (2,6-TDI), 2,4-tolylene diisocyanate (2,4-TDI), naphthalene-1,4-diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), 4,4'-methylenebis(cyclohexyl isocyanate) (hydrogenated MDI), 3,3'-dimethoxy-4,4'-diphenyl diisocyanate, 3,3'-dimethyl diphenylmethane-4,4'-diisocyanate, xylylene-1,4-diisocyanate, 4,4'-diphenylpropane diisocyanate, trimethylene diisocyanate, hexamethylene diisocyanate, propylene-1,2-diisocyanate, butylene-1,2-diisocyanate, cyclohexylene-1,2-diisocyanate, cyclohexylene-1,4-diisocyanate, p-phenylene diisothiocyanate, xylylene-1,4-diisothiocyanate, and ethylene diisothiocyanate can be given.

[0597] These polyisocyanate compounds can be used alone or in combination of 2 or more. As the polyisocyanate compound, a diisocyanate compound is preferred, and 2,4-TDI and 2,6-TDI, MDI are more preferred.

[0598] As the polyol compound used for preparing a compound containing an isocyanate group, for example, there can be mentioned glycol compounds such as ethylene glycol, diethylene glycol (DEG), butylene glycol, and the like; triol compounds and the like; polyether polyol compounds such as polypropylene glycol (PPG) and poly(oxytetramethylene) glycol (PTMG); polyester polyol compounds such as a reaction product of ethylene glycol and adipic acid, a reaction product of butylene glycol and adipic acid, and the like; polycarbonate polyol compounds; and polycaprolactone polyol compounds. In addition, a 3-functional propylene glycol obtained by adding ethylene oxide can also be used. The polyol compound can be used alone or in combination with two or more kinds.

[0599] The NCO equivalent of the urethane prepolymer is preferably 150 or greater and 700 or less, more preferably 200 or greater and 600 or less, and further preferably 200 or greater and 500 or less. The "NCO equivalent" is a value indicating the molecular weight of the urethane prepolymer per 1 NCO group, calculated by "(mass parts of the polyisocyanate compound + mass parts of the polyol compound) / [(number of functional groups per 1 molecule of the polyisocyanate compound x mass parts of the polyisocyanate compound / molecular weight of the polyisocyanate compound) - (number of functional groups per 1 molecule of the polyol compound x mass parts of the polyol compound / molecular weight of the polyol compound)]".

[0600] In the mixing step, at least one prepolymer can be used. The prepolymer can also be used in combination with two or more kinds of the above-described prepolymer, but it is preferable to use one kind alone. According to such a manner, there is a tendency that it is easy to control the curing reaction and it is possible to easily control the shape of the microphase separation structure. As the prepolymer, it is preferable to use a urethane prepolymer in which toluene diisocyanate is used as a main component alone.

[0601] The amount of the prepolymer used is not particularly limited, and it is preferable to be 30 parts by mass or greater and 80 parts by mass or less, and more preferably 40 parts by mass or greater and 75 parts by mass or less, relative to the entire mixed solution.

[0602] (Additives)

[0603] In the mixing step, a component other than the prepolymer and the curing agent can also be mixed as an additive. As the additive, there can be mentioned a solvent (diluent) such as polypropylene glycol; an antifoaming agent such as a silicone-based antifoaming agent; a catalyst; a blowing agent such as water and hollow microparticles; a foam stabilizer such as a silicone-based foam stabilizer; and a filler (abrasive particles) such as cerium oxide; a dye; a pigment; a solid microparticle; a flame retardant; a hydrophilizing agent; a hydrophobizing agent; a light resistance agent; an antioxidant; an antistatic agent, and the like. From the viewpoint of making the density of the obtained resin sheet 0.9 g / cm 3 1.3 g / cm 3 From the viewpoint of the above, it is preferable not to add a blowing agent or to add it in a small amount, and more preferably a defoaming agent is used.

[0604] In the mixing step, by adjusting the kind and amount of the catalyst to be added, the reaction rate of the curing reaction can be controlled, and thus the microphase separation structure formed can be controlled.

[0605] (Molding step)

[0606] The molding step is a step of obtaining a resin sheet having a microphase separation structure by curing the mixed solution obtained in the mixing step. In the molding step, for example, the mixed solution obtained in the mixing step can be cast into a mold frame that has been preheated to 30°C to 150°C, and heated at 30°C to 150°C for 10 minutes to 5 hours. Thus, the prepolymer reacts with the curing agent to form a resin, and thus the mixed solution is cured. Alternatively, the mixed solution can be further heated in an oven at 50°C to 180°C for 10 minutes to 12 hours, and thus cured twice. In the method of manufacturing the polishing pad of the present embodiment, since the mixed solution is the mixed solution described above, a resin block having a microphase separation structure can be obtained.

[0607] Note that the reaction temperature at the time of curing the mixed solution in the molding step can be appropriately adjusted depending on the kind of the prepolymer, the curing agent, and the additive, the mixing ratio, and the like, and by adjusting the reaction temperature, there is a tendency that the reaction rate of the curing reaction can be controlled, and thus the microphase separation structure formed can be controlled.

[0608] In the molding step, a resin sheet having a microphase separation structure is obtained by cutting a resin block obtained as described above to an appropriate thickness. The obtained resin sheet can be aged at 30°C to 150°C for 1 hour to 24 hours.

[0609] For the resin sheet obtained as described above, for example, a double-sided tape is attached to one surface, and the resin sheet is cut into a predetermined shape, preferably a circular plate shape, and thus a polishing pad of the present embodiment is completed. As the double-sided tape, there is no particular limitation, and any of the double-sided tapes known in the art can be arbitrarily selected and used.

[0610] Alternatively, the polishing pad of the present embodiment can be a single-layer structure formed of only the resin sheet, or can be a multi-layer structure in which another layer (a cushion layer or a substrate layer) is attached to one surface of the resin sheet. In the case of having a multi-layer structure, the layers can be adhered and fixed to each other with pressure as needed using a double-sided tape, an adhesive, or the like. As the double-sided tape and the adhesive that can be used, there is no particular limitation, and any of the double-sided tapes and the adhesives known in the art can be arbitrarily selected and used.

[0611] Further, for the polishing pad of the present embodiment, as needed, groove processing, embossing processing, and / or hole processing (punching processing) can be performed on the surface. The shape of the groove processing and the embossing processing is not particularly limited, and, for example, shapes such as a lattice type, a concentric circle type, a radial type, and the like can be cited.

[0612] In addition, for the polishing pad, the surface and / or the back surface of the resin sheet can also be subjected to finishing (lapping treatment). The resin sheet in the manufacturing method of the polishing pad of the present embodiment, although being high in density, has connected fine pores, and thus is excellent in finishing property, and can be subjected to the finishing treatment under easy conditions. The finishing treatment is not particularly limited, and can be performed by a known method such as lapping based on a diamond finisher.

[0613] [Manufacturing method of a polishing processed object]

[0614] The manufacturing method of the polishing processed object of the present embodiment has a polishing step of polishing a processed object using the above-described polishing pad in the presence of a slurry, to obtain a polishing processed object.

[0615] In the manufacturing method of the polishing processed object of the present embodiment, while the slurry is supplied, the holding platform and the polishing platform are relatively rotated with the processed object being pressed toward the polishing pad side on the holding platform, whereby the processed surface of the processed object is subjected to the polishing pad to perform polishing processing. The holding platform and the polishing platform can be rotated in the same direction at different rotational speeds from each other, or can be rotated in different directions. In addition, for the processed object, in the polishing processing, the processed object can be moved (rotated) on the inner side of the frame portion while being subjected to the polishing processing.

[0616] The slurry can include water, an oxidizing agent typified by hydrogen peroxide, an acid component, an alkali component, and the like, a chemical component, an additive, and a polishing grain (abrasive particle; for example, diamond, SiC, B4C, and AI2O3), and the like, according to the processed object, polishing conditions, and the like.

[0617] In addition, the processed object is not particularly limited, and, for example, optical materials such as lenses, parallel plane plates, and mirrors, semiconductor wafer materials such as SiC disks, crystals, metals, stone materials, wood materials, resin materials, and ceramic materials, and the like can be cited.

[0618] Example

[0619] Hereinafter, the present embodiment will be described more specifically using examples and comparative examples. The present embodiment is not limited by the following examples in any way.

[0620] Note that, hereinafter, examples and comparative examples corresponding to the <1st embodiment> will be described as <Example Group 1>, examples and comparative examples corresponding to the <2nd embodiment> will be described as <Example Group 2>, examples and comparative examples corresponding to the <3rd embodiment> will be described as <Example Group 3>, and examples and comparative examples corresponding to the <4th embodiment> will be described as <Example Group 4>, respectively.

[0621] <Example Group 1>

[0622] Each evaluation method in the examples and comparative examples is described below.

[0623] [Measurement of cumulative pore volume (pore distribution) based on mercury porosimetry]

[0624] The cumulative pore volume (pore distribution) of the resin sheet was measured by mercury porosimetry. A 10 mm square sample piece was cut out from the resin sheet having a thickness of 2 mm, and used for the measurement. The measurement of the cumulative pore volume was performed using a product name "Auto Pore III" manufactured by Micromeritics Inc. under conditions where the contact angle was 130° and the mercury surface tension was 485 dyn / cm. The mercury pressure was scanned from 0.5 psia to 30000 psia, whereby the cumulative pore volume from a pore diameter of 360 μm to a pore diameter of 0.005 μm was obtained. The pore distribution was obtained using a data processing software for a porosimeter (manufactured by Shimadzu Corporation, product name "POREPLOT-PCW"). Note that, as for each measurement result, the pore distribution from a pore diameter of 360 μm to a pore diameter of 0.010 μm was shown.

[0625] [Observation of resin sheet]

[0626] As to whether the resin sheet had a microphase separation structure or not, it was confirmed by observation based on a scanning electron microscope (SEM). The magnification of the SEM observation was set to about 300 to 3000 times.

[0627] [Measurement of average opening diameter]

[0628] A range of about 1.3 mm square on the surface of the polishing pad was observed at 175 times magnification using a microscope (VH-6300, manufactured by KEYENCE), the obtained image was subjected to a binaryzation process using an image processing software (Image Analyzer V20LAB Ver. 1.3, manufactured by Nikon), the number of bubbles was confirmed, the equivalent circle diameters were obtained from the areas of the respective openings, and their average value was taken as the average opening diameter (μm). At this time, the cut-off value (lower limit) of the opening diameter was set to 10 μm, whereby the average opening diameter was obtained as the average value of the opening diameters of 10 μm or more.

[0629] [Example 1-1]

[0630] An urethane prepolymer having 2,4-toluene diisocyanate (TDI) as a main component and an NCO equivalent of 407 was prepared. In 61.83 parts by mass of the urethane prepolymer, 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent of 134) 15.18 parts by mass, and polypropylene glycol (OH equivalent of 1345) 5.65 parts by mass were mixed. To this, further, silicone-based foam stabilizer (manufactured by Dow Corning Toray Co., Ltd., product name "SH193") 0.15 parts by mass, catalyst (manufactured by TOSOH Corporation, product name "TOYOCAT ET") 0.03 parts by mass, water 0.16 parts by mass as a blowing agent, and calcium carbonate filler 17 parts by mass as abrasive grains were added, whereby a mixed liquid which was a precursor of a resin sheet was obtained. The R value of the mixed liquid was 0.9.

[0631] The obtained mixed liquid was cast into a mold frame which had been preheated to 50°C, and 1-time curing was performed at 50°C for 15 minutes. The block-shaped molded article which had been formed was taken out of the mold frame, and 2-time curing was performed in an oven at 120°C for 8 hours, whereby a urethane resin block was obtained. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed, whereby a resin sheet having a thickness of 2.0 mm was obtained.

[0632] The density was calculated from the volume and the weight of the sample cut out from the resin sheet, and as a result, the density of the obtained resin sheet was 0.55 g / cm 3 The results of the measurement of the fine pore distribution are shown in Figure 1-1 . In addition, the cumulative pore volume V in the range of the pore diameter of 0.010 μm or more and 1.0 μm or less, the cumulative pore volume V0 in the range of the pore diameter of 0.010 μm or more and 360 μm or less, the ratio V / V0, the average opening diameter, and the peak position of the largest peak in the range of the pore diameter of 0.010 μm or more and 360 μm or less, which were calculated from the fine pore distribution, are shown in Table 1.

[0633] In addition, the surface of the resin sheet was observed with a scanning electron microscope, and as a result, a microphase separation structure (three-dimensional network structure) was confirmed. An example of the SEM image is shown in Figure 1-2 (500 times) and Figure 1-3 (A) (2000 times). As surrounded by a broken line in Figure 1-3 (B), especially in the upper left portion of the figure, a void cross section and a resin skeleton / resin skeleton cross section having indefinite shapes were confirmed, and therefore it was evaluated as having at least a single helical icosahedron structure.

[0634] [Example 1-2]

[0635] An urethane prepolymer having 2,4-toluene diisocyanate (TDI) as a main component and an NCO equivalent of 382 was prepared. In 55.26 parts by mass of the urethane prepolymer, 4,4'-methylenebis(2-chloroaniline) (MOCA) having an NH2 equivalent of 134 was mixed at 15.27 parts by mass, and polytetramethylene glycol having an OH equivalent of 972 was mixed at 7.04 parts by mass, and polypropylene glycol having an OH equivalent of 1345 was mixed at 4.24 parts by mass. To this, further, silicone-based foam stabilizer (manufactured by Dow Corning Toray Co., Ltd., product name "SH193") was added at 0.11 parts by mass, catalyst (manufactured by TOSOH Corporation, product name "TOYOCAT ET") was added at 0.03 parts by mass, water as a blowing agent was added at 0.05 parts by mass, and calcium carbonate filler as an abrasive grain was added at 18 parts by mass, whereby a mixed solution which was a precursor of a resin sheet was obtained. The R value of the mixed solution was 0.9.

[0636] The obtained mixed solution was cast into a mold frame which had been preheated to 50°C, and once cured under conditions of 15 minutes and 50°C. The block-shaped molded article which had been formed was taken out of the mold frame, and twice cured under conditions of 8 hours and 120°C in an oven, whereby an urethane resin block was obtained. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed, and a resin sheet having a thickness of 2.0 mm was obtained.

[0637] The density was calculated from the volume and the weight of the sample cut out from the resin sheet, and as a result, the density of the obtained resin sheet was 0.89 g / cm 3 The results of the measurement of the fine pore distribution are shown in Figure 1-4 . In addition, the cumulative pore volume V in the range of the pore diameter of 0.010 μm or more and 1.0 μm or less, the cumulative pore volume V0 in the range of the pore diameter of 0.010 μm or more and 360 μm or less, the ratio V / V0, the average opening diameter, and the peak position of the largest peak in the range of the pore diameter of 0.010 μm or more and 360 μm or less, which were calculated from the fine pore distribution, are shown in Table 1. In addition, an example of the SEM image is shown in Figure 1-5 .

[0638] [Comparative Example 1-1]

[0639] In 61.59 parts by mass of the same urethane prepolymer as in Example 1-1, 9.24 parts by mass of 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent weight: 134) and 9.24 parts by mass of crude MOCA (NH2 equivalent weight: 189) were mixed. To this, 0.18 parts by mass of silicone-based foam stabilizer (manufactured by Dow Corning Toray Co., Ltd., product name "SH193"), 2.58 parts by mass of polyether (OH equivalent weight: 1007) as a diluent, 0.04 parts by mass of a catalyst (manufactured by TOSOH Corporation, product name "TOYOCAT ET"), 0.13 parts by mass of water as a blowing agent, and 17 parts by mass of calcium carbonate filler as an abrasive grain were further added, whereby a mixed solution which was a precursor of a resin sheet was obtained. The R value of the mixed solution was 0.9.

[0640] The obtained mixed solution was cast into a mold frame which had been preheated to 50°C, and cured once at 50°C for 15 minutes. The block-shaped molded article thus formed was taken out of the mold frame, and cured twice in an oven at 120°C for 8 hours, to obtain a urethane resin block. After the obtained urethane resin block was allowed to cool to 25°C, a slicing process was performed, to obtain a resin sheet having a thickness of 2.0 mm.

[0641] The density was calculated from the volume and the weight of the sample cut out from the resin sheet, and as a result, the density of the obtained resin sheet was 0.53 g / cm 3 The results of the measurement of the fine pore distribution are shown in Figure 1-6 In addition, the cumulative pore volume V in the range of the pore diameter of 0.010 μm or more and 1.0 μm or less, the cumulative pore volume V0 in the range of the pore diameter of 0.010 μm or more and 360 μm or less, the ratio V / V0, the average opening diameter, and the peak position of the largest peak in the range of the pore diameter of 0.010 μm or more and 360 μm or less, which were calculated from the fine pore distribution, are shown in Table 1.

[0642] In addition, the surface of the resin sheet of Comparative Example 1-1 was observed with a scanning electron microscope, and as a result, no microphase separation structure was confirmed. An example of the SEM image is shown in Figure 1-7 In Comparative Example 1-1, it is considered that the desired curing reaction did not proceed due to the insufficient amount of use of the curing agent having an OH equivalent weight of 1000 or more and 2000 or less, and no microphase separation was generated.

[0643] [Table 1]

[0644]

[0645] The position of the largest peak in the range of 1.0 μm or more and 360 μm or less in Comparative Example 1-1 was 129 μm, and the height thereof was 0.40 cm.3 The position of the maximum peak in the range of pore diameters of 0.010 μm or more and 360 μm or less was 0.0822 μm, and the height thereof was 1.65 cm / g. 3

[0646] It was confirmed from the above measurement results that the resin sheet of Example 1-1 contained both voids derived from the blowing agent and voids derived from the microphase-separated structure, and the latter voids were interconnected throughout the entire polishing pad.

[0647] The position of the maximum peak in the range of 1.0 μm or more and 360 μm or less in Example 1-2 was 77 μm, and the height thereof was 0.075 cm / g. 3 The position of the maximum peak in the range of pore diameters of 0.010 μm or more and 360 μm or less was 0.0411 μm, and the height thereof was 0.447 cm / g. 3

[0648] It was confirmed from the above measurement results that the resin sheet of Example 1-2 contained both voids derived from the blowing agent and voids derived from the microphase-separated structure, and the latter voids were interconnected throughout the entire polishing pad.

[0649] Using the polishing pads of Example 1-1 and Example 1-2, a polishing test and an evaluation test of affinity to slurry were performed. As a control, using the polishing pad of Comparative Example 1-1, a polishing test and an evaluation test of affinity to slurry were performed under the same conditions. As a result, it was found that the polishing pads of Example 1-1 and Example 1-2 were able to impart good planarity to the object to be polished, and had excellent affinity to slurry, as compared with the polishing pad of Comparative Example 1-1.

[0650] <Example Group 2>

[0651] Each evaluation method in Examples and Comparative Examples is described below.

[0652] [Measurement of Cumulative Pore Volume (Pore Distribution) Based on Mercury

[0653] ​​The cumulative pore volume (pore distribution) of the resin sheet was measured by a mercury intrusion method. A 10 mm square sample piece was cut out from a resin sheet having a thickness of 2 mm, and used for the measurement. The measurement of the cumulative pore volume was performed using an "Auto Pore III" manufactured by Micromeritics Inc. under conditions where the contact angle was 130° and the mercury surface tension was 485 dyn / cm. The mercury pressure was scanned from 0.5 psia to 30,000 psia, whereby the cumulative pore volume from a pore diameter of 360 μm to a pore diameter of 0.005 μm was obtained. The pore distribution was obtained using a data processing software for a porosimeter ("POREPLOT-PCW" manufactured by Shimadzu Corporation). Note that, for each measurement result, the pore distribution from a pore diameter of 360 μm to a pore diameter of 0.100 μm was shown.

[0654] [Observation of Resin Sheet]

[0655] As to whether the resin sheet had a microphase separation structure, it was confirmed by observation based on a scanning electron microscope (SEM). The magnification of the SEM observation was set to about 300 to 3,000 times.

[0656] [Example 2-1]

[0657] A urethane prepolymer having an NCO equivalent of 407 was prepared, using 2,4-toluene diisocyanate (TDI) as a main component.

[0658] To 48.7 parts by mass of the above-described urethane prepolymer, 14.1 parts by mass of 4,4'-methylenebis(2-chloroaniline) (MOCA) having an NH2 equivalent of 134, 5.7 parts by mass of polytetramethylene glycol having an OH equivalent of 325, and 11.3 parts by mass of polypropylene glycol having an OH equivalent of 1345 were mixed. Further, to the above-described mixture, 0.25 parts by mass of a silicone-based defoaming agent ("71 additive" manufactured by DOW CORNING), 0.01 parts by mass of a catalyst ("TOYO CAT ET" manufactured by TOSOH Corporation), and 20.0 parts by mass of a ceria filler as an abrasive grain were added, whereby a mixture liquid which was a precursor of a resin sheet was obtained. The R value of the mixture liquid was 1.1.

[0659] The obtained mixture liquid was cast into a mold frame which had been preheated to 50°C, and subjected to one-time curing at 50°C for 15 minutes. The formed block-shaped molded article was taken out of the mold frame, and subjected to two-time curing at 120°C for 8 hours in an oven, whereby a urethane resin block was obtained. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed, whereby a resin sheet having a thickness of 2.0 mm was obtained.

[0660] The density of the obtained resin sheet was 1.2 g / cm 3 , the Shore D hardness was 54 degrees, the compression rate was 0.8%, and the compression elastic modulus was 85%. The results of the measurement of the fine pore distribution are shown in Table 1. Figure 2-1 In addition, the cumulative pore volume V in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less, the cumulative pore volume V' in the range of the pore diameter of 0.050 μm or more and less than 0.100 μm, and the cumulative pore volume Vo in the range of the pore diameter of 0.100 μm or more and 360 μm or less, which were calculated from the fine pore distribution, are shown in Table 1.

[0661] In addition, the surface of the resin sheet was observed with a scanning electron microscope, and as a result, a microphase separation structure (three-dimensional network structure) was confirmed. Specifically, a structure in which at least two kinds of resins having different compositions were entangled in a mottled manner was observed, and it was evaluated as having at least a double helical icosahedron structure. More specifically, one example of the SEM image is shown in Figure 2-2 (A). As shown by the dotted line in Figure 2-2 (B), the microphase separation structure was confirmed at a plurality of positions.

[0662] [Example 2-2]

[0663] The urethane prepolymer 54.0 parts by mass, 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent: 134) 9.6 parts by mass, polytetramethylene glycol (OH equivalent: 325) 22.9 parts by mass, polypropylene glycol (OH equivalent: 1345) 13.2 parts by mass, silicone-based defoaming agent (DOW CORNING Co., Ltd., product name "71 additive") 0.33 parts by mass, and catalyst (TOSOH Co., Ltd., product name "TOYOCAT ET") 0.01 parts by mass, which were the same as in Example 2-1, were mixed to obtain a mixed solution which was a precursor of a resin sheet. Note that the R value of the mixed solution was 0.9.

[0664] The obtained mixed solution was cast into a mold frame which had been preheated to 70°C, and cured once at 70°C for 10 minutes. The block-shaped molded article thus formed was taken out of the mold frame, and cured twice in an oven at 120°C for 15 minutes to obtain a urethane resin block. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed to obtain a resin sheet having a thickness of 2.0 mm.

[0665] The density of the obtained resin sheet was 1.1 g / cm 3, the Shore D hardness was 64 degrees, the compression rate was 1.3%, and the compression elastic modulus was 80%. The cumulative pore volume V, the cumulative pore volume V' in the range of pore diameters of 0.050 μm or more and less than 0.100 μm, the cumulative pore volume Vo, and the ratio of V / Vo of the obtained resin sheet were 0.020 cm 3 / g or more 0.100 cm 3 / g or less, 0.000 cm 3 / g or more 0.120 cm 3 / g or less, 0.040 cm 3 / g or more 0.120 cm 3 / g or less, and 50% or more. The surface of the resin sheet was observed using a scanning electron microscope, and as a result, the structure of the sea portion of the resin and the island portion of the voids was not observed, and the resin sheet was evaluated as having at least a single helical icosahedral structure. An example of the SEM image is shown in Figure 2-3 .

[0666] [Comparative Example 2-1]

[0667] A first urethane prepolymer (NCO equivalent 400) in which 2,4-toluene diisocyanate (TDI) was used as a main component, and a second urethane prepolymer (NCO equivalent 200) in which hexamethylene diisocyanate was used as a main component were prepared.

[0668] In 51.6 parts by mass of the first urethane prepolymer and 17.2 parts by mass of the second urethane prepolymer, 23.3 parts by mass of 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent 134) and 4.7 parts by mass of polytetramethylene glycol (OH equivalent 500) were mixed. Further, to the above mixture, 1.39 parts by mass of polyether as a diluent, 1.67 parts by mass of a silicone-based defoaming agent (manufactured by DOW CORNING, product name "71 additive"), 0.04 parts by mass of a catalyst (manufactured by TOSOH, product name "TOYOCAT ET"), 0.07 parts by mass of water as a blowing agent, and 0.10 parts by mass of a silicone-based foam stabilizer (manufactured by Dow Corning Toray Co., Ltd., product name "SH193") were added, whereby a mixture which was a precursor of a resin sheet was obtained. The R value of the mixture was 0.9.

[0669] The obtained mixture was cast into a mold frame which had been preheated to 50°C, and once cured under conditions of 15 minutes and 50°C. The block-shaped molded product thus formed was taken out of the mold frame, and twice cured under conditions of 8 hours and 120°C in an oven, whereby a urethane resin block was obtained. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed, and a resin sheet having a thickness of 2.0 mm was obtained.

[0670] The density of the obtained resin sheet was 1.1 g / cm3 3 , the Shore D hardness was 69 degrees, the compression rate was 1.1%, and the compression elastic modulus was 90%. The measurement results of the fine pore distribution are shown in Table 1. Figure 2-4 In addition, the cumulative pore volume V in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less, the cumulative pore volume V0 in the range of the pore diameter of 0.100 μm or more and 360 μm or less, and the ratio V / V0 obtained from the fine pore distribution are shown in Table 1.

[0671] In addition, the surface of the resin sheet was observed by a scanning electron microscope, and as a result, the microphase separation structure was not confirmed. An example of the SEM image is shown in Table 1. Figure 2-5 In Comparative Example 2-1, it is considered that the desired curing reaction was not performed due to the shortage of the curing agent having an OH equivalent of 1000 or more and 2000 or less, and the microphase separation was not generated.

[0672] [Table 2]

[0673]

[0674] Using the polishing pads of Examples 2-1 to 2-2, the polishing test and the evaluation test of the affinity to slurry were performed. As a control, using the polishing pad of Comparative Example 2-1, the polishing test and the evaluation test of the affinity to slurry were performed under the same conditions. As a result, it was found that the polishing pads of Examples 2-1 to 2-2 could impart good planarity to the object to be polished, and the affinity to slurry was excellent, as compared with the polishing pad of Comparative Example 2-1.

[0675] <Example Group 3>

[0676] Each evaluation method in the examples and comparative examples is described below.

[0677] [Measurement of Cumulative Pore Volume (Fine Pore Distribution) Based on Mercury Press Method]

[0678] The cumulative pore volume (pore distribution) of the resin sheet was measured by a mercury intrusion method. A 10 mm square sample piece was cut out from a resin sheet having a thickness of 2 mm, and used for the measurement. The measurement of the cumulative pore volume was performed using an "Auto Pore III" manufactured by Micromeritics, Inc. under conditions where the contact angle was 130° and the mercury surface tension was 485 dyn / cm. The mercury pressure was scanned from 0.5 psia to 30000 psia, whereby the cumulative pore volume from a pore diameter of 360 μm to a pore diameter of 0.005 μm was obtained. The pore distribution was obtained using a data processing software for a porosimeter ("POREPLOT-PCW" manufactured by Shimadzu Corporation). Note that, as for each measurement result, the pore distribution from a pore diameter of 360 μm to a pore diameter of 0.010 μm was shown.

[0679] [Observation of Resin Sheet]

[0680] As to whether the resin sheet had a microphase separation structure, it was confirmed by observation based on a scanning electron microscope (SEM). The magnification of the SEM observation was set to about 300 to 3000 times.

[0681] [Measurement of Average Pore Diameter]

[0682] The surface of the polishing pad was observed at a magnification of 175 times using a microscope (VH-6300, manufactured by KEYENCE), and the obtained image was subjected to a binary processing using an image processing software (Image Analyzer V20LAB Ver. 1.3, manufactured by Nikon). The number of bubbles was confirmed, and the equivalent circle diameter was obtained from the area of each pore. The average value thereof was taken as the average pore diameter (μm). At this time, the cut-off value (lower limit) of the pore diameter was set to 10 μm, and thus the average pore diameter was obtained as the average value of the pore diameter of 10 μm or more.

[0683] [Example 3-1]

[0684] A urethane prepolymer with an NCO equivalent of 407 and 2,4-toluene diisocyanate (TDI) as the main component was prepared. 61.83 parts by weight of this urethane prepolymer were mixed with 15.18 parts by weight of 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent of 134) and 5.65 parts by weight of polypropylene glycol (OH equivalent of 1345). Further additions were made of 0.15 parts by weight of a silicone-based foam stabilizer (manufactured by Dow Corning Toray Co., Ltd., product name "SH193"), 0.03 parts by weight of a catalyst (manufactured by TOSOH Co., Ltd., product name "TOYOCAT ET"), 0.16 parts by weight of water as a foaming agent, and 17 parts by weight of calcium carbonate filler as abrasive particles, thus obtaining a mixture that serves as a precursor for resin sheets. The R-value of the mixture was 0.9.

[0685] The obtained mixture was poured into a mold preheated to 50°C and cured once at 50°C for 15 minutes. The resulting block was removed from the mold and cured twice in an oven at 120°C for 8 hours to obtain a urethane resin block. After the urethane resin block was cooled to 25°C, it was sliced ​​to obtain resin sheets with a thickness of 2.0 mm.

[0686] The density was calculated from the volume and weight of the sample cut from the resin sheet. The resulting density of the resin sheet was 0.55 g / cm³. 3 The results of the pore distribution measurement are shown in... Figure 3-1 In addition, Table 1 shows the peak positions of the maximum peaks in the range of pore diameters from 0.010 μm to 1.0 μm, from pore diameters from 0.010 μm to 360 μm, the ratio V / V0, the average aperture diameter, and the pore diameter from 0.010 μm to 360 μm, which are determined by the pore distribution.

[0687] Furthermore, scanning electron microscopy (SEM) was used to observe the surface of the resin sheet, confirming the presence of a microphase-separated structure (three-dimensional network structure). An example of a SEM image is shown below. Figure 3-2 (500 times) and Figure 3-3 (A)(2000 times). For example, in Figure 3-3 As shown in (B) enclosed by dashed lines, especially in the upper left part of the figure, it is confirmed to have an amorphous void cross section and a resin skeleton / resin skeleton cross section, and is therefore evaluated as having at least a single-helical icosahedral structure.

[0688] [Example 3-2]

[0689] An urethane prepolymer having 2,4-toluene diisocyanate (TDI) as a main component and an NCO equivalent of 382 was prepared. In 55.26 parts by mass of the urethane prepolymer, 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent of 134) 15.27 parts by mass, and polytetramethylene glycol (OH equivalent of 972) 7.04 parts by mass, and polypropylene glycol (OH equivalent of 1345) 4.24 parts by mass were mixed. To this, further, silicone-based foam stabilizer (manufactured by Dow Corning Toray Co., Ltd., product name "SH193") 0.11 parts by mass, catalyst (manufactured by TOSOH Corporation, product name "TOYOCAT ET") 0.03 parts by mass, water as a blowing agent 0.05 parts by mass, and calcium carbonate filler as abrasive grains 18 parts by mass were added, whereby a mixed solution which was a precursor of a resin sheet was obtained. The R value of the mixed solution was 0.9.

[0690] The obtained mixed solution was cast into a mold frame which had been preheated to 50°C, and cured once at 50°C for 15 minutes. The block-shaped molded article formed was taken out of the mold frame, and cured twice in an oven at 120°C for 8 hours, to obtain an urethane resin block. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed, to obtain a resin sheet having a thickness of 2.0 mm.

[0691] The density was calculated from the volume and the weight of the sample cut out from the resin sheet, and as a result, the density of the obtained resin sheet was 0.89 g / cm 3 The results of the measurement of the fine pore distribution are shown in Figure 3-4 . In addition, the cumulative pore volume V in the range of the pore diameter of 0.010 μm or more and 1.0 μm or less, the cumulative pore volume V0 in the range of the pore diameter of 0.010 μm or more and 360 μm or less, the ratio V / V0, the average opening diameter, and the peak position of the largest peak in the range of the pore diameter of 0.010 μm or more and 360 μm or less, which were calculated from the fine pore distribution, are shown in Table 1. In addition, an example of the SEM image is shown in Figure 3-5 .

[0692] [Comparative Example 3-1]

[0693] In 61.59 parts by mass of the same urethane prepolymer as in Example 3-1, 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent weight: 134) 9.24 parts by mass, and crude MOCA (NH2 equivalent weight: 189) 9.24 parts by mass were mixed. To this, further, silicone-based foam stabilizer (manufactured by Dow Corning Toray Co., Ltd., product name "SH193") 0.18 parts by mass, polyether (OH equivalent weight: 1007) 2.58 parts by mass as a diluent, catalyst (manufactured by TOSOH Corporation, product name "TOYOCAT ET") 0.04 parts by mass, water 0.13 parts by mass as a blowing agent, and calcium carbonate filler 17 parts by mass as abrasive grains were added, whereby a mixed solution which was a precursor of a resin sheet was obtained. The R value of the mixed solution was 0.9.

[0694] The obtained mixed solution was cast into a mold frame which had been preheated to 50°C, and cured once at 50°C for 15 minutes. The block-shaped molded article thus formed was taken out of the mold frame, and cured twice in an oven at 120°C for 8 hours, to obtain a urethane resin block. After the obtained urethane resin block was allowed to cool to 25°C, a slicing process was performed, to obtain a resin sheet having a thickness of 2.0 mm.

[0695] The density was calculated from the volume and the weight of the sample cut out from the resin sheet, and as a result, the density of the obtained resin sheet was 0.53 g / cm 3 The results of the measurement of the fine pore distribution are shown in Figure 3-6 In addition, the cumulative pore volume V in the range of the pore diameter of 0.010 μm or more and 1.0 μm or less, the cumulative pore volume V0 in the range of the pore diameter of 0.010 μm or more and 360 μm or less, the ratio V / V0, the average opening diameter, and the peak position of the largest peak in the range of the pore diameter of 0.010 μm or more and 360 μm or less, which were calculated from the fine pore distribution, are shown in Table 1.

[0696] In addition, the surface of the resin sheet of Comparative Example 3-1 was observed with a scanning electron microscope, and as a result, no microphase separation structure was confirmed. An example of the SEM image is shown in Figure 3-7 In Comparative Example 3-1, it is considered that the desired curing reaction did not proceed due to the insufficient amount of use of the curing agent having an OH equivalent weight of 1000 or more and 2000 or less, and no microphase separation was generated.

[0697] [Table 3]

[0698]

[0699] The position of the largest peak in the range of 1.0 μm or more and 360 μm or less in Comparative Example 3-1 was 129 μm, and the height thereof was 0.40 cm.3 / g. In addition, the position of the maximum peak in the range of pore diameters of 0.010 μm or more and 360 μm or less was 0.0822 μm, and the height thereof was 1.65 cm 3 / g.

[0700] From the above measurement results, it was confirmed that the resin sheet of Example 3-1 contained both voids derived from the blowing agent and voids derived from the microphase-separated structure, and the latter voids were interconnected throughout the polishing pad as a whole.

[0701] The position of the maximum peak in the range of 1.0 μm or more and 360 μm or less in Example 3-2 was 77 μm, and the height thereof was 0.075 cm 3 / g. In addition, the position of the maximum peak in the range of pore diameters of 0.010 μm or more and 360 μm or less was 0.0411 μm, and the height thereof was 0.447 cm 3 / g.

[0702] From the above measurement results, it was confirmed that the resin sheet of Example 3-2 contained both voids derived from the blowing agent and voids derived from the microphase-separated structure, and the latter voids were interconnected throughout the polishing pad as a whole.

[0703] Using the polishing pads of Example 3-1 and Example 3-2, polishing processing tests and evaluation tests of affinity with slurry were performed. As a control, using the polishing pad of Comparative Example 3-1, polishing processing tests and evaluation tests of affinity with slurry were performed under the same conditions. As a result, it was found that the polishing pads of Example 3-1 and Example 3-2 were able to impart good planarity to the workpiece, and had excellent affinity with slurry, as compared with the polishing pad of Comparative Example 3-1.

[0704] <Example Group 4>

[0705] Each evaluation method in Examples and Comparative Examples is described below.

[0706] [Measurement of cumulative pore volume (pore distribution) based on mercury intrusion method]

[0707] The cumulative pore volume (pore distribution) of the resin sheet was measured by a mercury intrusion method. A 10 mm square sample piece was cut out from a resin sheet having a thickness of 2 mm, and used for the measurement. The measurement of the cumulative pore volume was performed using an "Auto Pore III" manufactured by Micromeritics Inc. under conditions where the contact angle was 130° and the mercury surface tension was 485 dyn / cm. The mercury pressure was scanned from 0.5 psia to 30000 psia, whereby the cumulative pore volume from a pore diameter of 360 μm to a pore diameter of 0.005 μm was obtained. The pore distribution was obtained using a data processing software for a porosimeter ("POREPLOT-PCW" manufactured by Shimadzu Corporation). Note that, for each measurement result, the pore distribution from a pore diameter of 360 μm to a pore diameter of 0.100 μm was shown.

[0708] [Observation of Resin Sheet]

[0709] As to whether the resin sheet had a microphase separation structure, it was confirmed by observation based on a scanning electron microscope (SEM). The magnification of the SEM observation was set to about 300 to 3000 times.

[0710] [Example 4-1]

[0711] A urethane prepolymer having an NCO equivalent of 407 was prepared, using 2,4-toluene diisocyanate (TDI) as a main component.

[0712] To 48.7 parts by mass of the above-described urethane prepolymer, 14.1 parts by mass of 4,4'-methylenebis(2-chloroaniline) (MOCA) having an NH2 equivalent of 134, 5.7 parts by mass of polytetramethylene glycol having an OH equivalent of 325, and 11.3 parts by mass of polypropylene glycol having an OH equivalent of 1345 were mixed. Further, to the above-described mixture, 0.25 parts by mass of a silicone-based defoaming agent ("71 additive" manufactured by DOW CORNING), 0.01 parts by mass of a catalyst ("TOYO CAT ET" manufactured by TOSOH Corporation), and 20.0 parts by mass of a ceria filler as an abrasive grain were added, whereby a mixture liquid which was a precursor of a resin sheet was obtained. The R value of the mixture liquid was 1.1.

[0713] The obtained mixture liquid was cast into a mold frame which had been preheated to 50°C, and subjected to one-time curing at 50°C for 15 minutes. The formed block-shaped molded article was taken out of the mold frame, and subjected to two-time curing at 120°C for 8 hours in an oven, whereby a urethane resin block was obtained. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed, whereby a resin sheet having a thickness of 2.0 mm was obtained.

[0714] The density of the obtained resin sheet was 1.2 g / cm 3 , the Shore D hardness was 54 degrees, the compression rate was 0.8%, and the compression elastic modulus was 85%. The results of the measurement of the fine pore distribution are shown in Table 1. Figure 4-1 In addition, the cumulative pore volume V in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less, the cumulative pore volume V' in the range of the pore diameter of 0.050 μm or more and less than 0.100 μm, and the cumulative pore volume Vo in the range of the pore diameter of 0.100 μm or more and 360 μm or less, which were calculated from the fine pore distribution, are shown in Table 1.

[0715] In addition, the surface of the resin sheet was observed with a scanning electron microscope, and as a result, a microphase separation structure (three-dimensional network structure) was confirmed. Specifically, a structure in which at least two kinds of resins having different compositions were entangled in a mottled manner was observed, and it was evaluated as having at least a double helical icosahedron structure. More specifically, one example of the SEM image is shown in Figure 4-2 (A). As shown by the dotted line in Figure 4-2 (B), the microphase separation structure was confirmed at a plurality of positions.

[0716] [Example 4-2]

[0717] The same urethane prepolymer 54.0 parts by mass, 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent weight: 134) 9.6 parts by mass, polytetramethylene glycol (OH equivalent weight: 325) 22.9 parts by mass, polypropylene glycol (OH equivalent weight: 1345) 13.2 parts by mass, silicone-based defoaming agent (DOW CORNING Co., Ltd., product name "71 additive") 0.33 parts by mass, and catalyst (TOSOH Co., Ltd., product name "TOYOCAT ET") 0.01 parts by mass were mixed to obtain a mixed solution which was a precursor of a resin sheet. Note that the R value of the mixed solution was 0.9.

[0718] The obtained mixed solution was cast into a mold frame which had been preheated to 70°C, and cured once under conditions of 10 minutes and 70°C. The block-shaped molded article thus formed was taken out of the mold frame, and cured twice in an oven under conditions of 15 minutes and 120°C to obtain a urethane resin block. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed to obtain a resin sheet having a thickness of 2.0 mm.

[0719] The density of the obtained resin sheet was 1.1 g / cm 3, the Shore D hardness was 64 degrees, the compression rate was 1.3%, and the compression elastic modulus was 80%. The cumulative pore volume V, the cumulative pore volume V' in the range of pore diameters of 0.050 μm or more and less than 0.100 μm, the cumulative pore volume Vo, and the ratio of V / Vo of the obtained resin sheet were 0.020 cm 3 / g or more 0.100 cm 3 / g or less, 0.000 cm 3 / g or more 0.120 cm 3 / g or less, 0.040 cm 3 / g or more 0.120 cm 3 / g or less, and 50% or more. The surface of the resin sheet was observed using a scanning electron microscope, and as a result, the structure of the sea portion of the resin and the island portion of the voids was not observed, and the resin sheet was evaluated as having at least a single helical icosahedral structure. An example of the SEM image is shown in Figure 4-3 .

[0720] [Comparative Example 4-1]

[0721] A first urethane prepolymer (NCO equivalent 400) in which 2,4-toluene diisocyanate (TDI) was used as a main component, and a second urethane prepolymer (NCO equivalent 200) in which hexamethylene diisocyanate was used as a main component were prepared.

[0722] In 51.6 parts by mass of the first urethane prepolymer and 17.2 parts by mass of the second urethane prepolymer, 23.3 parts by mass of 4,4'-methylenebis(2-chloroaniline) (MOCA) (NH2 equivalent 134) and 4.7 parts by mass of polytetramethylene glycol (OH equivalent 500) were mixed. Further, to the above mixture, 1.39 parts by mass of polyether as a diluent, 1.67 parts by mass of a silicone-based defoaming agent (manufactured by DOW CORNING, product name "71 additive"), 0.04 parts by mass of a catalyst (manufactured by TOSOH, product name "TOYOCAT ET"), 0.07 parts by mass of water as a blowing agent, and 0.10 parts by mass of a silicone-based foam stabilizer (manufactured by Dow Corning Toray Co., Ltd., product name "SH193") were added, whereby a mixture which was a precursor of a resin sheet was obtained. The R value of the mixture was 0.9.

[0723] The obtained mixture was cast into a mold frame preheated to 50°C, and cured once at 50°C for 15 minutes. The block-shaped molded product thus formed was taken out of the mold frame, and cured twice at 120°C for 8 hours in an oven, whereby a urethane resin block was obtained. After the obtained urethane resin block was left to cool to 25°C, a slicing process was performed, and a resin sheet having a thickness of 2.0 mm was obtained.

[0724] The density of the obtained resin sheet was 1.1 g / cm3 3 , the Shore D hardness was 69 degrees, the compression rate was 1.1%, and the compression elastic modulus was 90%. The measurement results of the fine pore distribution are shown in Table 1. Figure 4-4 In addition, the cumulative pore volume V in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less, the cumulative pore volume V0 in the range of the pore diameter of 0.100 μm or more and 360 μm or less, and the ratio V / V0 obtained from the fine pore distribution are shown in Table 1.

[0725] In addition, the surface of the resin sheet was observed using a scanning electron microscope, and as a result, the microphase separation structure was not confirmed. An example of the SEM image is shown in Figure 4-5 In Comparative Example 4-1, it is considered that the desired curing reaction was not performed due to the shortage of the curing agent having an OH equivalent of 1000 or more and 2000 or less, and the microphase separation was not generated.

[0726] [Table 4]

[0727]

[0728] Using the polishing pads of Examples 4-1 to 4-2, polishing processing tests and evaluation tests of the affinity with slurry were performed. As a control, using the polishing pad of Comparative Example 4-1, polishing processing tests and evaluation tests of the affinity with slurry were performed under the same conditions. As a result, it was found that the polishing pads of Examples 4-1 to 4-2 could impart good planarity to the workpiece, and the affinity with slurry was excellent, compared with the polishing pad of Comparative Example 4-1.

[0729] This application is based on Japanese Patent Applications (Japanese Patent Application Nos. 2020-216946, 2020-216988, 2020-216952, and 2020-217005 filed on December 25, 2020, and Japanese Patent Application Nos. 2021-205117, 2021-205047, 2021-205119, and 2021-205051 filed on December 17, 2021), which are incorporated herein by reference in their entirety.

[0730] Industrial Applicability

[0731] The polishing pad according to the first embodiment of the present application has industrial applicability as a polishing pad used in polishing (particularly, chemical mechanical polishing (CMP)) of materials such as optical materials (lenses, parallel plane plates, and mirrors), semiconductor wafers, semiconductor devices, substrates for hard disks, metals, and ceramics.

[0732] The second embodiment of the present application relates to a polishing pad having industrial applicability as a polishing pad used in polishing (particularly, chemical mechanical polishing (CMP)) of materials such as optical materials of lenses, parallel plane plates, and mirrors, semiconductor wafer materials of SiC disks, crystalline bodies, metals, stone materials, wood materials, resin materials, and ceramic materials.

[0733] The third embodiment of the present application relates to a polishing pad having industrial applicability as a polishing pad used in polishing processing of materials such as optical materials of lenses, parallel plane plates, and mirrors, semiconductor wafer materials of SiC disks, crystalline bodies, metals, stone materials, wood materials, resin materials, and ceramic materials.

[0734] The fourth embodiment of the present application relates to a polishing pad having industrial applicability as a polishing pad used in polishing processing of materials such as optical materials of lenses, parallel plane plates, and mirrors, semiconductor wafer materials of SiC disks, crystalline bodies, metals, stone materials, wood materials, resin materials, and ceramic materials.

Claims

1. A polishing pad which is a polishing pad provided with a resin sheet having fine pores, In the pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V in the range of a pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more and 1.00 cm 3 / g or less, The density of the resin sheet is 0.3 g / cm 3 Above 0.9 g / cm 3 Below.

2. The polishing pad of claim 1, wherein, In the fine pore distribution of the resin sheet, the proportion of the cumulative pore volume V with respect to the cumulative pore volume Vo in the range of 0.010 μm or more and 360 μm or less of the pore diameter is 50% or more.

3. The polishing pad of claim 1 or 2, wherein, The average opening diameter determined with 10 μm or more of the openings in the resin sheet is 50 μm or more and 200 μm or less.

4. The polishing pad of any of claims 1-3, wherein, In the fine pore distribution of the resin sheet, the peak position of the largest peak in the range of 0.010 μm or more and 360 μm or less of the pore diameter is in the range of 0.010 μm or more and 1.0 μm or less of the pore diameter.

5. The polishing pad of any of claims 1-4, wherein, The resin sheet has a microphase separation structure.

6. The polishing pad of any of claims 1-5, wherein, The resin sheet contains a polyurethane.

7. A manufacturing method of a polishing pad which is a method of manufacturing the polishing pad described in any one of claims 1 to 6, the manufacturing method comprising the following steps: The mixture of at least one prepolymer and at least two curing agents is cured, whereby a resin sheet having a microphase separation structure is obtained.

8. The method of claim 7, wherein the abrasive pad is formed by a process comprising: The curing agent contains a first curing agent having an NH2 equivalent of 100 or more and 300 or less, and a second curing agent having an OH equivalent of 1000 or more and 2000 or less.

9. A manufacturing method of a polished article which has the following polishing step: a polishing step of polishing a polished article using the polishing pad described in any one of claims 1 to 6 in the presence of a polishing slurry.

10. A polishing pad which is a polishing pad provided with a resin sheet having fine pores, In the pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 3 / g or less, The density of the resin sheet is 0.9 g / cm 3 Above 1.3 g / cm 3 Below.

11. The polishing pad of claim 10, wherein, In the fine pore distribution of the resin sheet, the cumulative fine pore volume V' in the range of fine pore diameters of 0.050 μm or more and less than 0.100 μm is 0.000 cm3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less.

12. The polishing pad of claim 10 or 11, wherein, In the fine pore distribution of the resin sheet, the proportion of the cumulative pore volume V with respect to the cumulative pore volume Vo in the range of 0.100 μm or more and 360 μm or less of the pore diameter is 50% or more.

13. The polishing pad of any of claims 10-12, wherein, In the fine pore distribution of the resin sheet, the proportion of the cumulative pore volume V with respect to the cumulative pore volume Vo in the range of 0.050 μm or more and 360 μm or less of the pore diameter is 50% or more.

14. The polishing pad of any of claims 10-13, wherein, In the fine pore distribution of the resin sheet, the peak position of the largest peak in the range of 0.100 μm or more and 360 μm or less of the pore diameter is in the range of 0.100 μm or more and 10.0 μm or less of the pore diameter.

15. The polishing pad of any of claims 10-14, wherein, In the fine pore distribution of the resin sheet, the peak position of the largest peak in the range of 0.050 μm or more and 360 μm or less of the pore diameter is in the range of 0.050 μm or more and 10.0 μm or less of the pore diameter.

16. The polishing pad of any of claims 10-15, wherein, In the fine pore distribution of the resin sheet, the cumulative fine pore volume V0 in the range of fine pore diameters of 0.100 μm or more and 360 μm or less is 0.040 cm3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less.

17. The polishing pad of any of claims 10-16, wherein, In the fine pore distribution of the resin sheet, the cumulative fine pore volume V0' in the range of the fine pore diameter of 0.050 μm or more and 360 μm or less is 0.040 cm 3 / g or more and 0.200 cm 3 / g or less.

18. The polishing pad of any of claims 10-17, wherein, The resin sheet has a microphase separation structure.

19. The polishing pad of any of claims 10-18, wherein, The resin sheet contains a polyurethane.

20. A polishing pad which is a polishing pad provided with a resin sheet having fine pores, In the pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V" in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.140 cm 3 / g or less, The density of the resin sheet is 0.9 g / cm 3 Above 1.3 g / cm 3 Below.

21. A manufacturing method of a polishing pad which is a method of manufacturing the polishing pad described in any one of claims 10 to 20, the manufacturing method comprising the following steps: The mixture of at least one prepolymer and at least two curing agents is cured, whereby a resin sheet having a microphase separation structure is obtained.

22. The method of claim 21, wherein the abrasive pad is formed by a process comprising: The curing agent includes a first curing agent having an NH2 equivalent weight of 100 or more and 300 or less, a second curing agent having an OH equivalent weight of 200 or more and 500 or less, and a third curing agent having an OH equivalent weight of 1000 or more and 2000 or less.

23. A manufacturing method of a polished article, comprising: polishing a workpiece using the polishing pad according to any one of claims 10 to 20 in the presence of a polishing slurry.

24. A polishing pad comprising a resin sheet having fine pores, In the pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V in the range of a pore diameter of 0.010 μm or more and 1.0 μm or less is 0.21 cm 3 / g or more and 1.00 cm 3 / g or less, The density of the resin sheet is 0.3 g / cm 3 Above 0.9 g / cm 3 Below.

25. The polishing pad of claim 24, wherein, In the fine pore distribution of the resin sheet, a proportion of the cumulative pore volume V with respect to a cumulative pore volume Vo in a range of 0.010 μm or more and 360 μm or less of the pore diameter is 50% or more.

26. The polishing pad of claim 24 or 25, wherein, An average opening diameter of openings of 10 μm or more in the resin sheet is 50 μm or more and 200 μm or less.

27. The polishing pad of any of claims 24-26, wherein, In the fine pore distribution of the resin sheet, a peak position of a maximum peak in a range of 0.010 μm or more and 360 μm or less of the pore diameter is in a range of 0.010 μm or more and 1.0 μm or less of the pore diameter.

28. The polishing pad of any of claims 24-27, wherein, The resin sheet has a microphase separation structure.

29. The polishing pad of any of claims 24-28, wherein, The resin sheet includes polyurethane.

30. A manufacturing method of a polishing pad according to any one of claims 24 to 29, the manufacturing method comprising: curing a mixture of at least one prepolymer and at least two curing agents, thereby obtaining a resin sheet having a microphase separation structure.

31. The method of fabricating a polishing pad of claim 30, wherein, The curing agent includes a first curing agent having an NH2 equivalent weight of 100 or more and 300 or less, and a second curing agent having an OH equivalent weight of 1000 or more and 2000 or less.

32. A manufacturing method of a polished article, comprising: polishing a workpiece using the polishing pad according to any one of claims 24 to 29 in the presence of a slurry.

33. A polishing pad comprising a resin sheet having fine pores, In the pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V in the range of the pore diameter of 0.100 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.100 cm 3 / g or less, The density of the resin sheet is 0.9 g / cm 3 Above 1.3 g / cm 3 Below.

34. The polishing pad of claim 33, wherein, In the fine pore distribution of the resin sheet, the cumulative fine pore volume V' in the range of fine pore diameters of 0.050 μm or more and less than 0.100 μm is 0.000 cm3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less.

35. The polishing pad of claim 33 or 34, wherein, In the fine pore distribution of the resin sheet, a proportion of the cumulative pore volume V with respect to a cumulative pore volume Vo in a range of 0.100 μm or more and 360 μm or less of the pore diameter is 50% or more.

36. The polishing pad of any of claims 33-35, wherein, In the fine pore distribution of the resin sheet, a proportion of the cumulative pore volume V with respect to a cumulative pore volume Vo' in a range of 0.050 μm or more and 360 μm or less of the pore diameter is 50% or more.

37. The polishing pad of any of claims 33-36, wherein, In the fine pore distribution of the resin sheet, a peak position of a maximum peak in a range of 0.100 μm or more and 360 μm or less of the pore diameter is in a range of 0.100 μm or more and 10.0 μm or less of the pore diameter.

38. The polishing pad of any of claims 33-37, wherein, In the fine pore distribution of the resin sheet, a peak position of a maximum peak in a range of 0.050 μm or more and 360 μm or less of the pore diameter is in a range of 0.050 μm or more and 10.0 μm or less of the pore diameter.

39. The polishing pad of any of claims 33-38, wherein, In the fine pore distribution of the resin sheet, the cumulative fine pore volume V0 in the range of fine pore diameters of 0.100 μm or more and 360 μm or less is 0.040 cm3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less. 3 / g or more and 0.120 cm3 / g or less.

40. The polishing pad of any of claims 33-39, wherein, In the fine pore distribution of the resin sheet, the cumulative fine pore volume V0' in the range of the fine pore diameter of 0.050 μm or more and 360 μm or less is 0.040 cm 3 / g or more and 0.200 cm 3 / g or less.

41. The polishing pad of any of claims 33-40, wherein, The resin sheet has a microphase separation structure.

42. The polishing pad of any of claims 33-41, wherein, The resin sheet includes polyurethane.

43. A polishing pad comprising a resin sheet having fine pores, In the pore distribution of the resin sheet measured by a mercury intrusion method with a contact angle of 130° and a mercury surface tension of 485 dyn / cm, the cumulative pore volume V" in the range of the pore diameter of 0.050 μm or more and 10.0 μm or less is 0.020 cm 3 / g or more and 0.140 cm 3 / g or less, The density of the resin sheet is 0.9 g / cm 3 Above 1.3 g / cm 3 Below.

44. A method for manufacturing the polishing pad according to any one of claims 33 to 43, the method comprising the steps of: curing a mixture of at least one prepolymer and at least two curing agents, thereby obtaining a resin sheet having a microphase separation structure.

45. The method of fabricating a polishing pad as recited in claim 44, wherein, the curing agent includes a first curing agent having an NH2 equivalent weight of 100 or more and 300 or less, a second curing agent having an OH equivalent weight of 200 or more and 500 or less, and a third curing agent having an OH equivalent weight of 1000 or more and 2000 or less.

46. A method for manufacturing a polished article, the method including a polishing step of polishing a workpiece using the polishing pad according to any one of claims 33 to 43 in the presence of a slurry.

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