High-frequency module, filter device, and communication device

Abstract

The present invention provides a high-frequency module capable of ensuring isolation between a first filter and a second filter capable of simultaneous communication. The high-frequency module (1) comprises a mounting substrate (16), a first filter (4F), a second filter (4G), and a third filter (4B). The mounting substrate (16) has a first main surface (161) and a second main surface facing each other. The first filter (4F) and the second filter (4G) are capable of simultaneous communication, and the third filter (4B) is not used for simultaneous communication using the first filter (4F) and the second filter (4G). The first filter (4F), the second filter (4G), and the third filter (4B) are mounted on the first main surface (161) of the mounting substrate (16). The first substrate of the first filter (4F), the second substrate of the second filter (4G), and the third substrate of the third filter (4B) are shared with each other. When viewed from above in the thickness direction of the mounting substrate (16), the third filter (4B) is arranged between the first filter (4F) and the second filter (4G).

Description

Technical Field

[0001] The present invention relates to a high-frequency module, a filter device, and a communication device, and more particularly to a high-frequency module including a first filter, a second filter, and a third filter, a filter device including the first filter, the second filter, and the third filter, and a communication device including the high-frequency module. Background Art

[0002] The multiplexer (high-frequency module) described in Patent Document 1 includes a common substrate and a plurality of elastic wave filters. The plurality of elastic wave filters are respectively arranged on the common substrate.

[0003] Patent Document 1: Japanese Patent Application No. 2019-533954

[0004] In the multiplexer described in Patent Document 1, two of the multiple elastic wave filters used for simultaneous communication may be arranged adjacent to each other. In this case, isolation between the two elastic wave filters may not be ensured during simultaneous communication using the two elastic wave filters. Summary of the Invention

[0005] An object of the present invention is to provide a high-frequency module, a filter device, and a communication device capable of ensuring isolation between a first filter and a second filter used in simultaneous communication.

[0006] A high-frequency module according to one embodiment of the present invention includes a mounting substrate, a first filter, a second filter, and a third filter. The mounting substrate has a first principal surface and a second principal surface that are opposed to each other. The first filter includes the first substrate and has a first passband, which includes at least a portion of the first frequency band. The second filter includes the second substrate and has a second passband, which includes at least a portion of the second frequency band. The third filter includes the third substrate and has a third passband, which includes at least a portion of the third frequency band. The first filter and the second filter are capable of communicating simultaneously, and the third filter is not used for simultaneous communication with the first and second filters. The first, second, and third filters are mounted on the first principal surface of the mounting substrate. The first substrate of the first filter, the second substrate of the second filter, and the third substrate of the third filter are shared by each other. When viewed from above in the thickness direction of the mounting substrate, the third filter is arranged between the first filter and the second filter.

[0007] A filtering device according to one embodiment of the present invention comprises a first filter, a second filter and a third filter. The first filter includes a first substrate and has a first passband, and the first passband includes at least a portion of the first frequency band. The second filter includes a second substrate and has a second passband, and the second passband includes at least a portion of the second frequency band. The third filter includes a third substrate and has a third passband, and the third passband includes at least a portion of the third frequency band. The first filter and the second filter can communicate simultaneously, and the third filter is not used for simultaneous communication using the first filter and the second filter. The first substrate of the first filter, the second substrate of the second filter and the third substrate of the third filter are shared by each other. When viewed from above in the thickness direction of the first substrate, the third filter is arranged between the first filter and the second filter.

[0008] A communication device according to one embodiment of the present invention includes the high-frequency module and a signal processing circuit. The signal processing circuit is connected to the high-frequency module and performs signal processing on the high-frequency signal.

[0009] According to the present invention, there is an advantage in that isolation between the first filter and the second filter used in simultaneous communication can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a block diagram of a high-frequency module and a communication device according to an embodiment.

[0011] Figure 2 is a cross-sectional view of the high-frequency module.

[0012] Figure 3 This is a top view of the four-way filter mounted on the high-frequency module.

[0013] Figure 4 This is a top view of the other four filters mounted on the high-frequency module.

[0014] Figure 5 4 is a top view of the high-frequency module.

[0015] Figure 6 This is a plan view showing a portion of a high-frequency module according to Modification 1 of the embodiment.

[0016] Figure 7 This is a plan view showing a portion of a high-frequency module according to a second modification of the embodiment. DETAILED DESCRIPTION

[0017] In the following embodiments, etc., reference is made to Figures 1 to 7 These are schematic diagrams, and the sizes and thickness ratios of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0018] (Implementation Method)

[0019] (1) Summary

[0020] like Figure 2 、 Figure 3 as well as Figure 5 As shown, the high-frequency module 1 according to the embodiment of the present invention includes a mounting substrate 16, a reception filter 4F (first filter), a reception filter 4G (second filter), and a reception filter 4B (third filter). The reception filter 4F has a passband (first passband) that includes at least a portion of Band 1 (first frequency band). The reception filter 4G has a passband (second passband) that includes at least a portion of Band 3 (second frequency band). The reception filter 4B has a passband (third passband) that includes at least a portion of Band 66 (third frequency band). The reception filters 4F and 4G are capable of simultaneous communication. The reception filter 4B is not used for simultaneous communication using the reception filters 4F and 4G. The piezoelectric substrate 43 (first substrate) of the reception filter 4F, the piezoelectric substrate 43 (second substrate) of the reception filter 4G, and the piezoelectric substrate 43 (third substrate) of the reception filter 4G are shared. When viewed from above in the thickness direction D1 of the mounting substrate 16, the reception filter 4B is positioned between the reception filters 4F and 4G.

[0021] According to this configuration, the reception filter 4B not used for simultaneous communication is arranged between the reception filters 4F and 4G capable of simultaneous communication. Therefore, during simultaneous communication using the reception filters 4F and 4G, the reception filter 4B can ensure isolation between the reception filters 4F and 4G.

[0022] In addition, the so-called "simultaneous communication" refers to the use of multiple communication frequency bands to communicate at the same time. In other words, it refers to the use of multiple filters (multiple receive filters or multiple transmit filters) corresponding to different communication frequency bands to communicate. The so-called "communication" refers to receiving or sending. Therefore, the so-called "simultaneous communication" refers to simultaneous reception or simultaneous transmission. Therefore, the so-called "simultaneous reception" refers to the use of multiple communication frequency bands to receive at the same time, and the so-called "simultaneous transmission" refers to the use of multiple communication frequency bands to transmit at the same time. In addition, "simultaneous communication" includes "simultaneous transmission and reception". The so-called "simultaneous transmission and reception" refers to the simultaneous transmission and reception. The "transmission" in "simultaneous transmission and reception" can be transmission using a single communication frequency band or simultaneous transmission using multiple communication frequency bands. In addition, the "reception" in "simultaneous transmission and reception" can be reception using a single communication frequency band or simultaneous reception using multiple communication frequency bands.

[0023] (2) Detailed description

[0024] Below, refer to Figures 1 to 5 The high-frequency module 1 and the communication device 100 according to the embodiment will be described in detail.

[0025] (2-1) Structure of communication device

[0026] like Figure 1 As shown, the communication device 100 is a communication device having a high-frequency module 1. The communication device 100 is, for example, a mobile terminal (such as a smartphone), but is not limited thereto, and may also be, for example, a wearable terminal (such as a smart watch). The high-frequency module 1 is, for example, a module that can support the 4G (fourth generation mobile communication) standard and the 5G (fifth generation mobile communication) standard. The 4G standard is, for example, the 3GPP (Third Generation Partnership Project) LTE standard (LTE: Long Term Evolution). The 5G standard is, for example, 5G NR (New Radio). The high-frequency module 1 is a module that can support carrier aggregation and dual connectivity.

[0027] The communication device 100 includes, in addition to the high-frequency module 1 , a signal processing circuit 20 and one or more (one in the illustrated example) antennas 40 .

[0028] High-frequency module 1 is configured to amplify a received signal (high-frequency signal) received by antenna 40 and output it to signal processing circuit 20. High-frequency module 1 is controlled, for example, by signal processing circuit 20. In this embodiment, high-frequency module 1 includes a signal processing function for a receiving system that amplifies a received signal received by antenna 40 and outputs it to signal processing circuit 20. However, high-frequency module 1 may also include a signal processing function for a transmitting system that amplifies a transmit signal from signal processing circuit 20 and outputs it to antenna 40.

[0029] The signal processing circuit 20 is connected to the high-frequency module 1 and processes the received signal from the high-frequency module 1. Furthermore, if the high-frequency module 1 includes a signal processing function for the transmission system, the signal processing circuit 20 processes the transmission signal output to the high-frequency module 1. The signal processing circuit 20 includes an RF signal processing circuit 21 and a baseband signal processing circuit 22.

[0030] The RF signal processing circuit 21, such as an RFIC (Radio Frequency Integrated Circuit), processes high-frequency signals (received signals). For example, the RF signal processing circuit 21 performs signal processing such as down-conversion on the received signal received from the high-frequency module 1 and outputs it to the baseband signal processing circuit 22. Furthermore, if the high-frequency module 1 includes a signal processing function for the transmission system, the RF signal processing circuit 21 performs signal processing such as up-conversion on the transmit signal output from the baseband signal processing circuit 22 and outputs it to the high-frequency module 1.

[0031] The baseband signal processing circuit 22 is, for example, a BBIC (Baseband Integrated Circuit). The baseband signal processing circuit 22 outputs the received signal from the RF signal processing circuit 21 to the outside. This output signal (received signal) is, for example, used as an image signal for image display or as an audio signal for communication. Furthermore, if the high-frequency module 1 includes a signal processing function for the transmission system, the baseband signal processing circuit 22 generates a transmission signal based on the externally input baseband signal (e.g., an audio signal or an image signal) and outputs the generated transmission signal to the RF signal processing circuit 21.

[0032] (2-2) Circuit structure of high-frequency module

[0033] The high-frequency module 1 is, for example, a receiving system module that receives received signals. However, the high-frequency module 1 may be a transmitting system module that transmits transmitted signals, or a transceiver system module that both transmits transmitted signals and receives received signals.

[0034] like Figure 1 As shown, the high-frequency module 1 transmits high-frequency signals (eg, received signals) between the signal processing circuit 20 and the antenna 40 .

[0035] High-frequency module 1 includes an antenna switch 3, reception filters 4A to 4J, low-noise amplifiers 5A to 5J, and switches 6A to 6J. Furthermore, high-frequency module 1 includes a matching circuit 8, matching circuits 9A to 9G, characteristic adjustment circuits 10A to 10C, matching circuits 11A to 11J, a controller 13, and a plurality of (six in the illustrated example) external connection terminals 12. Furthermore, high-frequency module 1 includes a plurality of signal paths R0 to R37.

[0036] The high-frequency module 1 also includes a mounting substrate. The aforementioned components (antenna switch 3, reception filters 4A to 4J, low-noise amplifiers 5A to 5J, switches 6A to 6J, matching circuit 8, matching circuits 9A to 9G, characteristic adjustment circuits 10A to 10C, matching circuits 11A to 11J, external connection terminals 12, and controller 13) are provided on the mounting substrate.

[0037] (2-2-1) External connection terminals

[0038] The multiple external connection terminals 12 include an antenna terminal 12A, one or more (e.g., four) signal output terminals 12B to 12E (signal terminals), and an input terminal 12F. Antenna terminal 12A is connected to antenna 40. Signal output terminals 12B to 12E output received signals processed by high-frequency module 1 to signal processing circuit 20 and are connected to the input portion of signal processing circuit 20. Input terminal 12F receives control signals from signal processing circuit 20 and is connected to the output portion of signal processing circuit 20.

[0039] (2-2-2) Signal Path

[0040] Signal paths R0 through R37 form a signal path R50 that connects antenna terminal 12A, which receives received signals, and multiple signal output terminals 12B through 12E, which output received signals. In other words, signal paths R0 through R37 are part of signal path R50. Signal path R50 is the path through which signals passing through antenna terminal 12A flow.

[0041] Signal path R0 connects antenna terminal 12A to common terminal 3a of antenna switch 3. Matching circuit 8 is provided in signal path R0. Signal path R1 connects selection terminal 3b of antenna switch 3 to branch point N1. Matching circuit 9A is provided in signal path R1. Signal path R2 connects branch points N1 and N7. A reception filter 4A and matching circuit 11D are provided in signal path R2. Signal paths R3 and R4 are connected in parallel between branch points N7 and N15. A low-noise amplifier 5D is provided in signal path R3. A switch 6D is provided in signal path R4. Signal path R5 connects branch point N15 to signal output terminal 12C.

[0042] Signal path R6 connects branch points N1 and N4. A reception filter 4B and a matching circuit 11A are provided in signal path R6. Signal paths R7 and R8 are connected in parallel between branch points N4 and N14. A low-noise amplifier 5A is provided in signal path R7. A switch 6A is provided in signal path R8. Signal path R9 connects branch point N14 and signal output terminal 12B. Signal path R10 connects selection terminal 3c of antenna switch 3 and branch point N12. A reception filter 4C, a matching circuit 9B, a characteristics adjustment circuit 10A, and a matching circuit 11I are provided in signal path R10. Signal paths R11 and R12 are connected in parallel between branch points N12 and N17. A low-noise amplifier 5I is provided in signal path R11. A switch 6I is provided in signal path R12. The signal path R13 is a signal path connecting the branch point N17 and the signal output terminal 12E.

[0043] Signal path R14 connects the selection terminal 3d of the antenna switch 3 and the branch point N11. Signal path R14 includes a reception filter 4D, a matching circuit 9C, and a matching circuit 11H. Signal paths R15 and R16 are connected in parallel between branch points N11 and N16. A low-noise amplifier 5H is provided in signal path R15. A switch 6H is provided in signal path R16. Signal path R17 connects branch point N16 and signal output terminal 12D. Signal path R18 connects the selection terminal 3e of the antenna switch 3 and the branch point N10. Signal path R18 includes a reception filter 4E, a matching circuit 9D, a characteristics adjustment circuit 10B, and a matching circuit 11G. Signal paths R19 and R20 are connected in parallel between branch points N10 and N16. A low-noise amplifier 5G is provided in signal path R19. A switch 6G is provided in signal path R20.

[0044] Signal path R21 connects the selection terminal 3f of antenna switch 3 and branch point N2. Signal path R22 connects branch points N2 and N5. A reception filter 4F and a matching circuit 11B are provided in signal path R22. Signal paths R23 and R24 are connected in parallel between branch points N5 and N14. A low-noise amplifier 5B is provided in signal path R23. A switch 6B is provided in signal path R24. Signal path R25 connects branch points N2 and N8. A reception filter 4G, a matching circuit 9E, and a matching circuit 11E are provided in signal path R25. Signal paths R26 and R27 connect in parallel between branch points N8 and N15. A low-noise amplifier 5E is provided in signal path R26. A switch 6E is provided in signal path R27.

[0045] Signal path R28 connects the selection terminal 3g of the antenna switch 3 with the branch point N13. Signal path R28 includes a reception filter 4H, a matching circuit 9F, a characteristics adjustment circuit 10C, and a matching circuit 11J. Signal paths R29 and R30 are connected in parallel between branch points N13 and N17. A low-noise amplifier 5J is provided in signal path R29. A switch 6J is provided in signal path R30. Signal path R31 connects the selection terminal 3h of the antenna switch 3 with the branch point N3. A matching circuit 9G is provided in signal path R31. Signal path R32 connects the branch points N3 and N6. A reception filter 4I and a matching circuit 11C are provided in signal path R32. Signal paths R33 and R34 are connected in parallel between branch points N6 and N14. A low-noise amplifier 5C is provided in signal path R33. A switch 6C is provided in signal path R34.

[0046] Signal path R35 connects branch points N3 and N9. A receive filter 4J and a matching circuit 11F are provided in signal path R35. Signal paths R36 and R37 are connected in parallel between branch points N9 and N15. A low-noise amplifier 5F is provided in signal path R36. A switch 6F is provided in signal path R37.

[0047] In this embodiment, as described later, reception filter 4A passes signals in the Band 25 frequency band, reception filter 4B passes signals in the Band 66 frequency band, and reception filter 4C passes signals in the Band 30 frequency band. Furthermore, reception filter 4D passes signals in the Band 7 frequency band, reception filter 4E passes signals in the Band 41 frequency band, and reception filter 4F passes signals in the Band 1 frequency band. Furthermore, reception filter 4G passes signals in the Band 3 frequency band, and reception filter 4H passes signals in the Band 40 frequency band. Furthermore, reception filter 4I passes signals in the Band 34 frequency band, and reception filter 4J passes signals in the Band 39 frequency band. In this embodiment, Band 25 and the like are communication frequency bands usable in the 4G standard and the like.

[0048] Therefore, signal path R1 connected to antenna switch 3 corresponds to Band 25 and Band 66, signal path R10 corresponds to Band 30, and signal path R14 corresponds to Band 7. Furthermore, signal path R18 corresponds to Band 41, signal path R21 corresponds to Band 1 and Band 3, signal path R28 corresponds to Band 40, and signal path R31 corresponds to Band 34 and Band 39.

[0049] Furthermore, since the reception filter 4A and the low-noise amplifier 5D are used in communications using Band 25, Band 25, the reception filter 4A, and the low-noise amplifier 5D correspond to each other. Similarly, Band 66, the reception filter 4B, and the low-noise amplifier 5A correspond to each other. Similarly, Band 30, the reception filter 4C, and the low-noise amplifier 51 correspond to each other. Similarly, Band 7, the reception filter 4D, and the low-noise amplifier 5H correspond to each other. Similarly, Band 41, the reception filter 4E, and the low-noise amplifier 5G correspond to each other. Similarly, Band 1, the reception filter 4F, and the low-noise amplifier 5B correspond to each other. Similarly, Band 3, the reception filter 4G, and the low-noise amplifier 5E correspond to each other. Similarly, Band 40, the reception filter 4H, and the low-noise amplifier 5J correspond to each other. Similarly, Band 34, the reception filter 41, and the low-noise amplifier 5C correspond to each other. Similarly, Band 39, the reception filter 4J, and the low-noise amplifier 5F correspond to each other.

[0050] (2-2-3) Antenna Switch

[0051] The antenna switch 3 selects one or more signal paths corresponding to the communication frequency band for receiving signals from multiple signal paths R1, R10, R14, R18, R21, R28, and R31, and connects the selected signal paths to the signal path R0 connected to the antenna terminal 12A.

[0052] The antenna switch 3 is, for example, a switch IC (Integrated Circuit). The antenna switch 3 has one or more (for example, one) common terminal 3a and one or more (seven in the illustrated example) selection terminals 3b to 3h. Common terminal 3a is connected to antenna terminal 12A via signal path R0. Selection terminals 3b to 3h are connected to signal paths R1, R10, R14, R18, R21, R28, and R31, respectively. That is, selection terminals 3b to 3h are connected to signal output terminals 12B to 12E via signal paths R1 to R37. Selection terminal 3b is connected to the inputs of reception filters 4A and 4B. Selection terminals 3c to 3e are connected to the inputs of reception filters 4C, 4D, and 4E, respectively. Selection terminal 3f is connected to the inputs of reception filters 4F and 4G. Selection terminal 3g is connected to the input of reception filter 4H. Selection terminal 3h is connected to the inputs of reception filters 4I and 4J. Antenna switch 3 switches the terminal connected (conducted) to common terminal 3a from among multiple select terminals 3b to 3h. Specifically, antenna switch 3 selectively connects (conducts) multiple receive filters 4A to 4J to antenna terminal 12A. In other words, antenna switch 3 connects (conducts) at least one of multiple receive filters 4A to 4J to antenna terminal 12A.

[0053] In this embodiment, for example, during simultaneous reception using reception filter 4F (first filter) and reception filter 4G (second filter), reception filter 4B (third filter) is not used. In this case, during simultaneous communication using reception filters 4F and 4G, antenna switch 3 simultaneously connects select terminal 3f (first select terminal, second select terminal) connected to reception filters 4F and 4G and common terminal 3a, while select terminal 3b (third select terminal) connected to reception filter 4B and common terminal 3a are not connected simultaneously. Furthermore, during communication using reception filter 4B, select terminal 3b connected to reception filter 4B and common terminal 3a are connected, while select terminal 3f connected to reception filters 4F and 4G and common terminal 3a are not connected simultaneously.

[0054] The antenna switch 3 selects one or more (e.g., two) of the seven selection terminals 3b to 3h in response to a control signal from the controller 13, and connects (conducts) the selected selection terminals to the common terminal 3a. Specifically, the antenna switch 3 selects one or more (e.g., two) signal paths for receiving a received signal from the plurality of signal paths R1, R10, R14, R18, R21, R28, and R31, and connects them to the signal path R0.

[0055] (2-2-4) Receiving Filter

[0056] Receiving filters 4A-4J are provided in signal paths R2, R6, R10, R14, R18, R22, R25, R28, R32, and R35, respectively. Receiving filters 4A-4J pass signals flowing through signal paths R2, R6, R10, R14, R18, R22, R25, R28, R32, and R35 (i.e., signal path R50), respectively. Receiving filters 4A-4J have passbands that include at least a portion of different communication frequency bands. More specifically, receiving filter 4A has a passband that includes at least a portion of Band 25. Filter 4B has a passband that includes at least a portion of Band 66. Filter 4C has a passband that includes at least a portion of Band 30. Filter 4D has a passband that includes at least a portion of Band 7. Filter 4E has a passband that includes at least a portion of Band 41. Furthermore, filter 4F has a passband that includes at least a portion of Band 1. Filter 4G has a passband that includes at least a portion of Band 3. Filter 4H has a passband that includes at least a portion of Band 40. Filter 4I has a passband that includes at least a portion of Band 34. Filter 4J has a passband that includes at least a portion of Band 39.

[0057] Here, Band 66 has a frequency band of 2110-2200 MHz. Band 1 has a frequency band of 2110-2170 MHz. Band 34 has a frequency band of 2010-2025 MHz. Band 25 has a frequency band of 1930-1995 MHz. Band 3 has a frequency band of 1805-1880 MHz. Band 39 has a frequency band of 1880-1920 MHz. Band 41 has a frequency band of 2496-2690 MHz. Band 7 has a frequency band of 2620-2690 MHz. Band 30 has a frequency band of 2350-2360 MHz. Band 40 has a frequency band of 2300-2370 MHz.

[0058] Reception filters 4A to 4J have inputs and outputs. The inputs of reception filters 4A to 4J are connected to the selection terminals 3b to 3h of antenna switch 3, respectively, while the outputs of reception filters 4A to 4J are connected to matching circuits 11A to 11J, respectively. Reception filters 4A to 4J limit the received signals input to their inputs to signals within the aforementioned communication band, and output them from their outputs.

[0059] Receiving filters 4A to 4J are, for example, elastic wave filters. Examples of such filters are surface acoustic wave (SAW) filters that utilize surface acoustic waves. Furthermore, receiving filters 4A to 4J are not limited to SAW filters; they may also be BAW (bulk acoustic wave) filters, for example.

[0060] (2-2-5) Low Noise Amplifier

[0061] Low-noise amplifiers 5A-5J are provided in signal paths R7, R23, R33, R3, R26, R36, R19, R15, R11, and R29, respectively. Each low-noise amplifier 5A-5J has an input portion for receiving received signals and an output portion for outputting received signals. The input portions of low-noise amplifiers 5A-5J are connected to matching circuits 11A-11J, while the output portions of low-noise amplifiers 5A-5J are connected to signal output terminals 12B-12E. Low-noise amplifiers 5A-5J amplify the received signals input to their input portions and output them from their output portions. Low-noise amplifiers 5A-5J are controlled by control signals from controller 13.

[0062] (2-2-6) Switch

[0063] Switches 6A to 6J are provided in signal paths R8 , R24 , R34 , R4 , R27 , R37 , R20 , R16 , R12 , and R30 , respectively, to switch the signal paths between conductive and non-conductive. Switches 6A to 6J are, for example, integrated circuits (ICs) and are controlled by controller 13 .

[0064] Switch 6A switches the function of receive filter 4B between active and inactive. In other words, switch 6A switches receive filter 4B between selection and non-selection. More specifically, when switch 6A is in the non-conductive state, the output signal of receive filter 4B is amplified by low-noise amplifier 5A and output from signal output terminal 12B. Therefore, the function of low-noise amplifier 5A is enabled, and the function of receive filter 4B is enabled. On the other hand, when switch 6A is in the conductive state, the output signal of receive filter 4B passes through signal path R8 (i.e., is not amplified by low-noise amplifier 5A) and is output from signal output terminal 12B. Consequently, the function of low-noise amplifier 5A is disabled, and the function of receive filter 4B is disabled.

[0065] Similarly, switch 6B switches the function of reception filter 4F between valid and invalid. Switch 6C switches the function of reception filter 4I between valid and invalid. Switch 6D switches the function of reception filter 4A between valid and invalid. Switch 6E switches the function of reception filter 4G between valid and invalid. Switch 6F switches the function of reception filter 4J between valid and invalid. Switch 6G switches the function of reception filter 4E between valid and invalid. Switch 6H switches the function of reception filter 4D between valid and invalid. Switch 6I switches the function of reception filter 4C between valid and invalid. Switch 6J switches the function of reception filter 4H between valid and invalid.

[0066] If multiple receive filters (e.g., 4A and 4B) correspond to the signal path (e.g., R1) selected by antenna switch 3, at least one of the multiple receive filters (e.g., 4A and 4B) is selected by switches (e.g., 6A and 6D). If only one receive filter (e.g., 4D) corresponds to the signal path (e.g., R10) selected by antenna switch 3, it is always selected by switch (e.g., 6I).

[0067] (2-2-7) Matching Circuit

[0068] The matching circuit 8 is provided in the signal path R0 . The matching circuit 8 is a circuit for achieving impedance matching between the antenna 40 and the antenna switch 3 , and is connected between the antenna 40 and the antenna switch 3 .

[0069] Matching circuit 9A is a circuit for achieving impedance matching between antenna switch 3 and reception filters 4A and 4B. It is located along signal path R1 and is therefore positioned between select terminal 3b of antenna switch 3 and reception filters 4A and 4B. Matching circuits 9B through 9D are circuits for achieving impedance matching between antenna switch 3 and reception filters 4C through 4E, respectively. Matching circuits 9B through 9D are located between select terminals 3c through 3e of antenna switch 3 and reception filters 4C through 4E, respectively, along signal paths R10, R14, and R18. Matching circuit 9E is a circuit for achieving impedance matching between antenna switch 3 and reception filter 4G, and is located between reception filter 4G and branch point N2 along signal path R25. Matching circuit 9F is a circuit for achieving impedance matching between antenna switch 3 and reception filter 4H, and is located between select terminal 3g of antenna switch 3 and reception filter 4H along signal path R28. The matching circuit 9G is a circuit for achieving impedance matching between the antenna switch 3 and the reception filters 4I and 4J, and is provided in the signal path R31 so as to be provided between the selection terminal 3h of the antenna switch 3 and the reception filters 4I and 4J.

[0070] Matching circuits 11A to 11E are circuits for achieving impedance matching between low-noise amplifiers 5A to 5E and receive filters 4B, 4F, 4I, 4A, and 4G, respectively. Matching circuits 11A to 11E are provided on signal paths R6, R22, R32, R2, and R25, respectively, between receive filters 4B, 4F, 4I, 4A, and 4G and branch points N4 to N8. Thus, matching circuits 11A to 11E are provided between low-noise amplifiers 5A to 5E and receive filters 4B, 4F, 4I, 4A, and 4G, respectively. Matching circuits 11F to 11J are circuits for achieving impedance matching between low-noise amplifiers 5F to 5J and receive filters 4J, 4E, 4D, 4C, and 4H, respectively. Matching circuits 11F to 11J are provided on signal paths R35, R18, R14, R10, and R28, respectively, between receive filters 4J, 4E, 4D, 4C, and 4H and branch points N9 to N13. Consequently, matching circuits 11F to 11J are provided between low-noise amplifiers 5F to 5J and receive filters 4J, 4E, 4D, 4C, and 4H, respectively.

[0071] Matching circuits 11A to 11J each include an inductor, for example. These inductors are connected in series with, for example, signal paths R6, R22, R32, R2, R25, R35, R18, R14, R10, and R28, respectively. These inductors may be electronic components mounted on a mounting substrate or may be formed within a conductive pattern portion of the mounting substrate.

[0072] (2-2-8) Characteristics Adjustment Circuit

[0073] The characteristic adjustment circuits 10A to 10C are connected between the reception filters 4C, 4E, and 4H and the ground layer of the mounting substrate, respectively, and are circuits for adjusting the characteristics of the reception filters 4C, 4E, and 4H to desired characteristics.

[0074] (2-2-9) Controller

[0075] The controller 13 is a control device that controls the electronic components (antenna switch 3, low-noise amplifiers 5A to 5J, and switches 6A to 6J) based on control signals from the signal processing circuit 20. The controller 13 is electrically connected to the above-mentioned electronic components. In addition, the controller 13 is connected to the output portion of the signal processing circuit 20 via the input terminal 12F. The controller 13 controls the above-mentioned electronic components based on the control signal input from the signal processing circuit 20 to the input terminal 12F.

[0076] (2-3) Operation of the communication device

[0077] Reference Figure 1 The operation of the communication device 100 will be described. In the following description, an operation is exemplified in the case where a reception signal is received in two communication frequency bands (for example, Band 41 and Band 40).

[0078] Antenna switch 3 selects signal paths R18 and R10 corresponding to Bands 41 and 40, and connects selected signal paths R18 and R28 to signal path R0. Switches 6G and 6I are non-conductive, enabling the functions of reception filters 4E and 4H corresponding to Bands 41 and 40.

[0079] In this state, when a received signal is received via antenna 40, it flows from antenna 40 through signal path R0, antenna switch 3, and signal paths R18, R19, and R17. While flowing through signal paths R18, R19, and R17, the received signal is processed by receive filter 4E and low-noise amplifier 5G. The processed received signal is then output from signal output terminal 12D to signal processing circuit 20. Furthermore, the received signal branches from signal path R0 through antenna switch 3 and flows through signal paths R28, R29, and R13. While flowing through signal paths R28, R29, and R13, the received signal is processed by receive filter 4H and low-noise amplifier 5I. The processed received signal is then output from signal output terminal 12E to signal processing circuit 20.

[0080] (2-4) Combination of Communication Bands Used in Simultaneous Reception

[0081] The following describes the combinations of communication frequency bands used for simultaneous reception in this embodiment. In addition to the combination of Band 41 and Band 40 illustrated in the above operation description, the combinations of communication frequency bands used for simultaneous reception in this embodiment also include a combination of Band 1 and Band 3, a combination of Band 66 and Band 25, and a combination of Band 7 and Band 40.

[0082] Furthermore, the combination of communication frequency bands used for simultaneous reception is not limited to the above-mentioned combination, and may be a combination specified in the 3GPP standard as capable of carrier aggregation.

[0083] (2-5) Structure of high-frequency module

[0084] Reference Figure 2 The structure of the high-frequency module 1 will be described. Figure 2 yes Figure 5 The X1-X1 cross-sectional view of Figure 2 As shown, the high-frequency module 1 includes a mounting substrate 16 and a plurality of electronic components.

[0085] The mounting substrate 16 is a substrate for mounting a plurality of electronic components and has, for example, a rectangular plate shape. The mounting substrate 16 has a first principal surface 161 and a second principal surface 162 that face each other in the thickness direction D1 of the mounting substrate 16 .

[0086] Mounting substrate 16 is, for example, a multilayer substrate including multiple dielectric layers and multiple conductive layers. The multiple dielectric layers and the multiple conductive layers are stacked in thickness direction D1 of mounting substrate 16. The multiple conductive layers are formed into a predetermined pattern for each layer. The multiple conductive layers include a ground layer. Mounting substrate 16 is, for example, an LTCC (Low Temperature Co-fired Ceramics) substrate. Mounting substrate 16 is not limited to an LTCC substrate and may also be, for example, a printed wiring board, an HTCC (High Temperature Co-fired Ceramics) substrate, or a resin multilayer substrate.

[0087] In the following description, the thickness direction D1 of the mounting substrate 16 may be described as the first direction D1. In addition, a direction perpendicular to the first direction (for example, a direction parallel to one of the two pairs of opposite sides of the first main surface 161 of the mounting substrate 16) is described as the second direction D2. In addition, a direction perpendicular to both the first direction D1 and the second direction D2 (for example, a direction parallel to the other of the two pairs of opposite sides of the first main surface 161) is described as the third direction D3 (see Figure 5 ).

[0088] A plurality of electronic components are mounted on the first principal surface 161 or the second principal surface 162 of the mounting substrate 16. In this specification, etc., "mounting" includes placing the electronic components on the first principal surface 161 or the second principal surface 162 of the mounting substrate 16 (mechanical connection) and electrically connecting the electronic components to (appropriate conductor portions of) the mounting substrate 16.

[0089] The plurality of electronic components include a matching circuit 8, matching circuits 9A to 9G, characteristic adjustment circuits 10A to 10C, matching circuits 11A to 11J, low noise amplifiers 5A to 5J, an IC chip 17, and a four-way filter 18 (a first array filter, see Figure 5 ), four-way filter 19 (second array filter, refer to Figure 5 ), dual-channel filter 23 (refer to Figure 5 ). On the first main surface 161 of the mounting substrate 16, the matching circuit 8, matching circuits 9A to 9G, characteristic adjustment circuits 10A to 10C, matching circuits 11A to 11J, low noise amplifiers 5A to 5J, two four-way filters 18 and 19, and a two-way filter 23 are mounted. On the second main surface 162 of the mounting substrate 16, the IC chip 17 and the external connection terminals 12 are mounted. Figure 2 In FIG. 1 , only the four-way filter 18 and the two-way filter 23 are shown on the first principal surface 161 of the mounting substrate 16 , and only the IC chip 17 is shown on the second principal surface 162 of the mounting substrate 16 .

[0090] The IC chip 17 is an integrated circuit element that includes the antenna switch 3 , the low-noise amplifiers 5A to 5J, the switches 6A to 6J, and the controller 13 on a single chip.

[0091] Four-way filters 18 and 19 are filters that integrate four of the multiple receive filters 4A to 4J onto a single substrate (a shared substrate). Four-way filters 18 and 19 each constitute a filtering device. In four-way filter 18, four filters 4A, 4B, 4F, and 4G corresponding to four communication frequency bands (e.g., Band 1, Band 66, Band 3, and Band 25) are integrated onto a single substrate. In four-way filter 19, four filters 4H, 4C, 4D, and 4E corresponding to four communication frequency bands (e.g., Band 40, Band 30, Band 7, and Band 41) are integrated onto a single substrate. Four-way filters 18 and 19 are mounted on the first principal surface 161 of mounting substrate 16. Therefore, the four receive filters 4H, 4C, 4D, and 4E within four-way filter 18 and the four receive filters 4H, 4C, 4D, and 4E within four-way filter 19 are also mounted on the first principal surface 161 of mounting substrate 16.

[0092] In this embodiment, the piezoelectric substrates of the four receiving filters 4A, 4B, 4F, and 4G constituting the four-way filter 18 are shared by a single substrate (common substrate). More specifically, when the receiving filters 4A, 4B, 4F, and 4G are SAW filters, Figure 2 and Figure 3 As shown, the receiving filters 4A, 4B, 4F, and 4G have a piezoelectric substrate 43 and IDT electrodes 44A, 44B, 44F, and 44G. The IDT electrodes 44A, 44B, 44F, and 44G are provided on the main surface of one side (mounting substrate 16 side) of the piezoelectric substrate 43. The piezoelectric substrates 43 (first to fourth substrates) of the four receiving filters 4A, 4B, 4F, and 4G are shared by being composed of one substrate (common substrate). Similarly, in the four-way filter 19, the piezoelectric substrate 43 of the four receiving filters 4C, 4D, 4E, and 4H is shared. In more detail, in the case where the receiving filters 4C, 4D, 4E, and 4H are SAW filters, as shown in FIG. Figure 4 As shown, the reception filters 4C, 4D, 4E, and 4H include a piezoelectric substrate 43 and IDT electrodes 44C, 44D, 44E, and 44H.

[0093] The dual-path filter 23 is a filter that integrates two receive filters 4I and 4J (for example, receive filters 4I and 4J corresponding to Band 34 and Band 39) onto a single substrate. Since the dual-path filter 23 is mounted on the first principal surface 161 of the mounting substrate 16, the two receive filters 4I and 4J are also mounted on the first principal surface 161 of the mounting substrate 16. In the dual-path filter 23, similar to the four-path filters 18 and 19, the two receive filters 4I and 4J each have a piezoelectric substrate 43 and IDT electrodes 44I and 44J. The receive filters 4I and 4J share a common piezoelectric substrate 43. Alternatively, the two receive filters 4I and 4J may be configured separately from each other.

[0094] In this embodiment, reception filters used for simultaneous reception are provided in the two four-way filters 18 and 19. Meanwhile, a reception filter not used for simultaneous reception (or a reception filter used for simultaneous reception but with fewer combinations of simultaneous reception than the reception filter used for simultaneous reception) is provided in the two-way filter 23.

[0095] (2-6) Configuration of the receiving filter within the four-way filter

[0096] Reference Figure 3The configuration of the receive filters 4A, 4B, 4F, and 4G of the four-way filter 18 will now be described. In this embodiment, the four receive filters 4A, 4B, 4F, and 4G are configured so that when two or more (e.g., two) of the four receive filters are used for simultaneous reception, isolation between the two receive filters is ensured. In the following description, the combination of communication frequency bands used for simultaneous reception is simply referred to as a "combination."

[0097] In the four-way filter 18, the four receiving filters 4A, 4G, 4B, and 4F are arranged in a row. At this time, when viewed from the thickness direction D1 of the mounting substrate 16 (i.e., the thickness direction of the piezoelectric substrate 43), the four receiving filters 4A, 4B, 4F, and 4G are arranged so that the receiving filters corresponding to the communication frequency bands included in the same combination (i.e., the receiving filters used in simultaneous reception) are not adjacent. In more detail, between the receiving filters corresponding to the communication frequency bands included in the same combination, receiving filters corresponding to the communication frequency bands not included in the above-mentioned same combination (i.e., receiving filters not used for the above-mentioned simultaneous reception) are arranged. Thus, when using two communication frequency bands included in the same combination for simultaneous reception, it is possible to ensure isolation between the two receiving filters corresponding to the two communication frequency bands (i.e., the receiving filters used in simultaneous reception).

[0098] Specifically, in the quad filter 18, the receive filters 4F and 4G correspond to two communication frequency bands (Band 1 and Band 3) included in the same combination. Furthermore, the receive filters 4B and 4A correspond to two communication frequency bands (Band 66 and Band 25) included in the same combination. The combination of Band 1 and Band 3 is different from the combination of Band 66 and Band 25.

[0099] In this relationship, when viewed from above in the thickness direction of the mounting substrate 16, the reception filter 4B (third filter) is arranged between the reception filters 4F and 4G (first filter and second filter). In addition, when viewed from above in the thickness direction of the mounting substrate 16, the reception filter 4G or the reception filter 4F (between the reception filters 4A and 4B (fourth filter and third filter)) is arranged between the reception filters 4A and 4B (fourth filter and third filter). Figure 3 More specifically, the four receive filters 4A, 4G, 4B, and 4F are arranged in the order of, for example, the receive filter 4F, the receive filter 4B, the receive filter 4G, and the receive filter 4A, from one side (right side) toward the other side (left side) in the longitudinal direction (second direction D2) of the piezoelectric substrate 43.

[0100] In this embodiment, "arranging electronic component C between two electronic components A and B" is defined as: when viewed from above in the thickness direction D1 of mounting substrate 16, a line segment connecting a point within the region of electronic component A with a point within the region of electronic component B overlaps with the region of electronic component C. Based on this, "arranging a reception filter (e.g., 4B) between reception filters (e.g., 4F and 4G)" means that, when viewed from above in the thickness direction D1 of mounting substrate 16, a line segment connecting a point within the region of reception filter 4F with a point within the region of reception filter 4G overlaps with the region of reception filter 4B. Furthermore, the "region of electronic component (e.g., A)" is the smallest rectangular region encompassing the entirety of electronic component A. If electronic components A, B, and C are reception filters 4F, 4G, and 4B, respectively, the regions of electronic components A, B, and C are the smallest rectangular regions encompassing the entirety of IDT electrodes 44F, 44G, and 44B of reception filters 4F, 4G, and 4B, respectively.

[0101] The input portion 45 of each of the four receive filters 4A, 4G, 4B, and 4F is located on the back surface (main surface facing the mounting substrate 16) of the piezoelectric substrate 43, and is arranged on the same side (one side in the short-side direction (third direction D3) of the piezoelectric substrate 43). The output portion 46 of each of the four receive filters 4A, 4G, 4B, and 4F is located on the same side (the other side in the short-side direction (third direction D3) of the piezoelectric substrate 43).

[0102] Next, refer to Figure 4 The configuration of the receive filters 4H, 4C, 4D, and 4E of the four-way filter 19 will be described. In the four-way filter 19, receive filters 4E and 4H correspond to two communication frequency bands (Band 41 and Band 40) included in the same combination. Furthermore, receive filters 4D and 4H correspond to two communication frequency bands (Band 7 and Band 40) included in the same combination. The combination of Band 41 and Band 40 is different from the combination of Band 7 and Band 40. In this relationship, receive filters 4D and 4C are arranged between receive filters 4H and 4E. Furthermore, receive filter 4C is arranged between receive filters 4H and 4D. More specifically, the four receive filters 4H, 4C, 4D, and 4E are arranged from one side (right side) toward the other side (left side) of the longitudinal direction (second direction D2) of the piezoelectric substrate 43, for example, in the order of receive filter 4E, receive filter 4D, receive filter 4C, and receive filter 4H.

[0103] The input portion 45 of each of the four receive filters 4H, 4C, 4D, and 4E is located on the back surface (main surface facing the mounting substrate 16) of the piezoelectric substrate 43, and is arranged on the same side (one side in the short-side direction (third direction D3) of the piezoelectric substrate 43). The output portion 46 of each of the four receive filters 4H, 4C, 4D, and 4E is located on the same side (the other side in the short-side direction (third direction D3) of the piezoelectric substrate 43).

[0104] (2-7) Arrangement of electronic components in high-frequency modules

[0105] Reference Figure 5 Next, the arrangement of electronic components on first principal surface 161 of mounting substrate 16 will be described. As described above, two four-way filters 18 and 19, two-way filter 23, and matching circuits 11A to 11J are mounted on first principal surface 161 of mounting substrate 16. The following description will explain the arrangement of these electronic components.

[0106] The two four-way filters 18 and 19 are arranged with a distance between them. More specifically, the two four-way filters 18 and 19 are arranged so that the long sides (second direction D2) of their piezoelectric substrates 43 are parallel to each other. Furthermore, the two four-way filters 18 and 19 are arranged with a distance between them along the short sides (third direction D3) of their piezoelectric substrates 43.

[0107] Furthermore, when viewed in plan from the thickness direction D1 of the mounting substrate 16, the antenna switch 3 is disposed between the two four-way filters 18 and 19. The antenna switch 3 is mounted on the second main surface 162 of the mounting substrate 16. More specifically, when viewed in plan from the thickness direction D1 of the mounting substrate 16, the antenna switch 3 is disposed, for example, between the two receive filters 4F and 4E.

[0108] Specifically, when viewed from above in the thickness direction D1 of the mounting substrate 16, of the four reception filters 4A, 4G, 4B, and 4F of the four-way filter 18, reception filter 4F is closest to the antenna switch 3. This minimizes the distance between reception filter 4F and the antenna switch 3, making the signal path between reception filter 4F and the antenna switch 3 as short as possible. Similarly, when viewed from above in the thickness direction D1 of the mounting substrate 16, of the four reception filters 4H, 4C, 4D, and 4E of the four-way filter 19, reception filter 4E is closest to the antenna switch 3. This minimizes the distance between reception filter 4E and the antenna switch 3, making the signal path between reception filter 4E and the antenna switch 3 as short as possible.

[0109] In each of the four receive filters 4A, 4G, 4B, and 4F of the four-way filter 18, when viewed in plan from the thickness direction D1 of the mounting substrate 16, the input portion 45 is located on the antenna switch 3 side, and the output portion 46 is located on the side opposite to the antenna switch 3 side, in the third direction D3. In other words, in each of the four receive filters 4A, 4G, 4B, and 4F of the four-way filter 18, when viewed in plan from the thickness direction D1 of the mounting substrate 16, the input portion 45 is closer to the antenna switch 3 than the output portion 46. That is, the distance between the input portion 45 and the antenna switch 3 is smaller than the distance between the output portion 46 and the antenna switch 3. Similarly, in each of the four receive filters 4H, 4C, 4D, and 4E of the four-way filter 19, when viewed in plan from the thickness direction D1 of the mounting substrate 16, the input portion 45 is located on the antenna switch 3 side, and the output portion 46 is located on the side opposite to the antenna switch 3 side, in the third direction D3. In other words, in each of the four reception filters 4H, 4C, 4D, and 4E of the four-way filter 19 , the input portion 45 is closer to the antenna switch 3 than the output portion 46 when viewed in plan from the thickness direction D1 of the mounting substrate 16 .

[0110] When viewed from above along the thickness direction D1 of the mounting substrate 16, the two-way filter 23 is positioned farther from the antenna switch 3 than the four-way filters 18 and 19. For example, the two-way filter 23 is positioned on one side of the four-way filter 18 in the longitudinal direction (second direction D2), opposite the antenna switch 3. In this embodiment, the four-way filters 18 and 19 are provided with reception filters used for simultaneous reception, while the two-way filter 23 is provided with a reception filter not used for simultaneous reception. Therefore, the two-way filter 23 is positioned farther from the antenna switch 3 than the four-way filters 18 and 19. In other words, the four-way filters 18 and 19 are positioned closer to the antenna switch 3 than the two-way filter 23.

[0111] In each of the two receive filters 4I and 4J of the dual-path filter 23, the input portion 45 is arranged on the antenna switch 3 side, and the output portion 46 is arranged on the side opposite to the antenna switch 3 side in the third direction D3. In other words, in each of the two receive filters 4I and 4J of the dual-path filter 23, when viewed in plan from the thickness direction D1 of the mounting substrate 16, the input portion 45 is closer to the antenna switch 3 than the output portion 46.

[0112] Matching circuits 11A to 11F are arranged on the output portion 46 side of each of the four-way filter 18 and the two-way filter 23. Matching circuits 11A to 11F are arranged in a row along the direction (second direction D2) in which the four-way filter 18 and the two-way filter 23 are arranged. In this arrangement, matching circuits 11A to 11F are positioned adjacent to the corresponding receive filters 4B, 4F, 4I, 4A, 4G, and 4J, respectively. More specifically, matching circuits 11A, 11B, and 11F are positioned adjacent to the corresponding receive filters 4B, 4F, and 4J, respectively, in the third direction D3. Matching circuits 11C, 11D, and 11E are positioned offset in the second direction D2 from positions adjacent to the corresponding receive filters 4I, 4A, and 4G, respectively, in the third direction D3.

[0113] More specifically, in this embodiment, the center frequencies of the communication bands (Band 66, Band 1, Band 34) corresponding to the three matching circuits 11A to 11C are close to each other. Therefore, the outputs of the three matching circuits 11A to 11C are bundled together and connected at the branch point N14 (see FIG. Figure 1 ). Therefore, the three matching circuits 11A to 11C are arranged adjacent to each other. Similarly, since the center frequencies of the communication bands (Band 25, Band 3, Band 39) corresponding to the three matching circuits 11D to 11F are close to each other, the outputs of the three matching circuits 11D to 11F are bundled together and connected at the branch point N15 (see Figure 1 ) Therefore, the three matching circuits 11D to 11F are arranged adjacent to each other.

[0114] On the other hand, reception filter 4B, one of reception filters 4A and 4B, is positioned next to reception filter 4F, but is not used for simultaneous reception using reception filter 4F. Reception filter 4B is a reception filter whose corresponding communication band, among reception filters 4A and 4B, has a center frequency close to the center frequency of the communication band (Band 1) corresponding to reception filter 4F. In other words, the first difference is the difference between the center frequency of the communication band (Band 1) corresponding to reception filter 4F and the center frequency of the communication band (Band 66) corresponding to reception filter 4B. Furthermore, the second difference is the difference between the center frequency of the communication band (Band 1) corresponding to reception filter 4F and the center frequency of the communication band (Band 25) corresponding to reception filter 4A. In this case, the first difference is smaller than the second difference. Thus, reception filter 4B is positioned next to reception filter 4F. This allows reception filters 4F and 4B to be positioned adjacent to matching circuits 11A and 11B, respectively, for adjacent matching circuits 11A and 11B.

[0115] Matching circuits 11G to 11J are arranged on the output portion 46 side of the four-way filter 19. Matching circuits 11G to 11J are arranged in a row along the longitudinal direction (second direction D2) of the four-way filter 19. In this arrangement, matching circuits 11G to 11J are positioned adjacent to corresponding reception filters 4E, 4D, 4C, and 4H in the third direction D3.

[0116] More specifically, in this embodiment, the center frequencies of the communication bands (Band 41, Band 7) corresponding to the two matching circuits 11G and 11H are close to each other. Therefore, the outputs of the two matching circuits 11G and 11H are tied together and connected at the branch point N17 (see Figure 1 ). Therefore, the two matching circuits 11G and 11H are arranged adjacent to each other. Similarly, since the center frequencies of the communication bands (Band 30 and Band 40) corresponding to the two matching circuits 11I and 11J are close to each other, the outputs of the two matching circuits 11I and 11J are tied together and connected at the branch point N17 (see Figure 1 ). Therefore, the two matching circuits 11I and 11J are arranged adjacent to each other.

[0117] On the other hand, a reception filter 4D is arranged next to reception filter 4E, which is not used for simultaneous reception using reception filter 4E. Reception filter 4D is the reception filter whose corresponding communication band's center frequency is closest to the center frequency of the communication band (Band 1) corresponding to reception filter 4E among the three reception filters 4D, 4C, and 4H. Thus, reception filter 4D is arranged next to reception filter 4E. This allows reception filters 4E and 4D to be positioned adjacent to low-noise amplifiers 5G and 5H, respectively, which are adjacent to each other. Furthermore, in this embodiment, a reception filter 4C is arranged next to reception filter 4H, which is not used for simultaneous reception using reception filter 4H. Reception filter 4C is the reception filter whose corresponding communication band's center frequency is closest to the center frequency of the communication band (Band 40) corresponding to reception filter 4H among the three reception filters 4C, 4D, and 4E. Thus, reception filter 4C is arranged next to reception filter 4H. Thus, with respect to the matching circuits 11J and 11I that are adjacent to each other, the reception filters 4H and 4C can be arranged adjacent to the matching circuits 11J and 11I, respectively.

[0118] (3) Main effects

[0119] As described above, the high-frequency module 1 of this embodiment includes a mounting substrate 16, a reception filter 4F (first filter), a reception filter 4G (second filter), and a reception filter 4B (third filter). The reception filter 4F has a passband (first passband) that includes at least a portion of Band 1 (first frequency band). The reception filter 4G has a passband (second passband) that includes at least a portion of Band 3 (second frequency band). The reception filter 4B has a passband (third passband) that includes at least a portion of Band 66 (third frequency band). The reception filters 4F and 4G are capable of simultaneous communication. The reception filter 4B is not used for simultaneous communication using the reception filters 4F and 4G. The piezoelectric substrate 43 (first substrate) of the reception filter 4F, the piezoelectric substrate 43 (second substrate) of the reception filter 4G, and the piezoelectric substrate 43 (third substrate) of the reception filter 4G are shared. When viewed from above in the thickness direction D1 of the mounting substrate 16, the reception filter 4B is positioned between the reception filters 4F and 4G.

[0120] Furthermore, when viewed from above along the thickness direction D1 of the mounting substrate 16, of the four receive filters 4A, 4G, 4B, and 4F of the four-way filter 18, receive filter 4F is closest to the antenna switch 3. This minimizes the signal path between receive filter 4F and the antenna switch 3. Consequently, the bundling effect of receive filter 5F on the communication band of receive filter 4G performing simultaneous reception (i.e., the loss (bundling loss) incurred when receiving filters 4F and 4G used for simultaneous reception are simultaneously connected to antenna terminal 12A) can be minimized. For example, when performing simultaneous reception of Bands 40 and 41, the effect on Band 40 is smaller because the signal path corresponding to Band 41 is shorter. Similarly, of the four receive filters 4H, 4C, 4D, and 4E of the four-way filter 19, receive filter 4E is closest to the antenna switch 3 when viewed from above along the thickness direction D1 of the mounting substrate 16. This minimizes the signal path between receive filter 4E and the antenna switch 3. As a result, the bundling effect of the reception filter 5E on the communication band of the reception filter 4C performing simultaneous reception (i.e., the loss (bundling loss) generated when the reception filters 4E and 4C used for simultaneous reception are simultaneously connected to the antenna terminal 12A) can be minimized.

[0121] According to this configuration, the reception filter 4B not used for simultaneous communication is arranged between the reception filters 4F and 4G capable of simultaneous communication. Therefore, during simultaneous communication using the reception filters 4F and 4G, the reception filter 4B can ensure isolation between the reception filters 4F and 4G.

[0122] (4) Methods other than high-frequency modules and communication devices

[0123] In the above embodiment, the high frequency module 1 and the communication device 100 are exemplified as the mode of the present invention, but the present invention can also be implemented as a filter device. In this case, Figure 2 、 Figure 3 as well as Figure 5 As shown, the filtering device includes a receiving filter 4F (first filter), a receiving filter 4G (second filter), and a receiving filter 4B (third filter). The receiving filter 4F has a passband (first passband) that includes at least a portion of Band 1 (first frequency band). The receiving filter 4G has a passband (second passband) that includes at least a portion of Band 3 (second frequency band). The receiving filter 4B has a passband (third passband) that includes at least a portion of Band 66 (third frequency band). The receiving filters 4F and 4G can communicate simultaneously. The receiving filter 4B is not used for simultaneous communication using the receiving filters 4F and 4G. The piezoelectric substrate 43 (first substrate) of the receiving filter 4F, the piezoelectric substrate 43 (second substrate) of the receiving filter 4G, and the piezoelectric substrate 43 (third substrate) of the receiving filter 4G are shared with each other. When viewed from above in the thickness direction of the first substrate (43) (the thickness direction D1 of the mounting substrate 16), the receiving filter 4B is arranged between the receiving filters 4F and 4G.

[0124] According to this configuration, the reception filter 4B not used for simultaneous communication is arranged between the reception filters 4F and 4G capable of simultaneous communication. Therefore, during simultaneous communication using the reception filters 4F and 4G, the reception filter 4B can ensure isolation between the reception filters 4F and 4G.

[0125] (5) Modification

[0126] In the following description, the same components as those in the above embodiment are denoted by the same reference numerals and their description is omitted, and the description will be focused on the parts that are different from the above embodiment.

[0127] (5-1) Modification 1

[0128] In the above embodiment, the reception filter 4F of the four reception filters 4A, 4B, 4F, and 4G of the four-way filter 18 is arranged closest to the antenna switch when viewed from above in the thickness direction D1 of the mounting substrate 16. Figure 6As shown in FIG. 1 , a combination of receive filters used for simultaneous reception using a plurality (e.g., two) of the four receive filters 4A, 4B, 4F, and 4G is considered. In this case, the receive filter included in the most combinations of filters that enable simultaneous communication using two or more of the four receive filters 4A, 4B, 4F, and 4G is defined as the most combined filter P1.

[0129] exist Figure 6 In the example of , it is assumed that among the four reception filters 4A, 4B, 4F, and 4G (a plurality of filters) of the four-way filter 18, for example, the reception filters 4A and 4B are used for simultaneous reception, and the reception filters 4A and 4F are used for other simultaneous reception. Figure 6 In this example, for example, assume that reception filters 4B and 4F are not used for simultaneous reception with each other, and reception filter 4G is not used for simultaneous reception with other reception filters 4A, 4B, and 4F. In this case, among the combinations of reception filters used for simultaneous reception, reception filter 4A is included in two combinations, the most common combination among the four reception filters 4A, 4B, 4F, and 4G. Therefore, reception filter 4A is the most common combination filter P1. In this variation, reception filter 4A, reception filter 4B, and reception filter 4G correspond to the first filter, second filter, and third filter, respectively, as described in the claims. The combination of reception filters used for simultaneous reception illustrated in this variation is merely an example and is not limited to the combinations described above.

[0130] In this modification, if Figure 6 As shown, when viewed from above along the thickness direction D1 of the mounting substrate 16, the filter with the most combinations, P1, among the four receive filters 4A, 4B, 4F, and 4G is positioned closest to the antenna switch 3. In other words, when viewed from above along the thickness direction D1 of the mounting substrate 16, the distance T1 between each of the four filters 4A, 4B, 4F, and 4G and the antenna switch 3 is the shortest among the distances T1 to T4 between the filter 4A, 4B, 4F, and 4G. The filter with the most combinations, P1, has the highest frequency for communication among the four receive filters 4A, 4B, 4F, and 4G. This modification minimizes the signal path between the filter with the most combinations, P1 (the receive filter with the highest frequency for communication), and the antenna switch 3.

[0131] In this variation, the distance (e.g., T1) between the reception filter (e.g., 4A) and the antenna switch 3 when viewed from above in the thickness direction D1 of the mounting substrate 16 refers to the distance between the center of the reception filter 4A and the center of the antenna switch 3 when viewed from above in the thickness direction D1 of the mounting substrate 16. Alternatively, the distance (e.g., T1) between the reception filter (e.g., 4A) and the antenna switch 3 when viewed from above in the thickness direction D1 of the mounting substrate 16 may refer to the distance between the input portion of the reception filter 4A and the select terminal of the antenna switch 3 connected to the input portion when viewed from above in the thickness direction D1 of the mounting substrate 16. The "center" refers to the center of gravity of the outer shape of the electronic component (e.g., the reception filter and antenna switch) when viewed from above.

[0132] (5-2) Modification 2

[0133] In modification 1, if Figure 7 As shown, the maximum combination filter P1 may be arranged so that at least a portion overlaps the antenna switch 3 when viewed from the thickness direction D1 of the mounting substrate 16. This further shortens the distance between the maximum combination filter P1 and the antenna switch 3.

[0134] (5-3) Other Modifications

[0135] In the above embodiment, four receive filters are integrated into a quad filter 18, 19. However, instead of the quad filters 18, 19, an array filter integrating three receive filters or an array filter integrating five or more receive filters may be used.

[0136] In addition, in the above-mentioned embodiment, simultaneous reception using two communication frequency bands is assumed, but simultaneous reception using three or more communication frequency bands may also be assumed.

[0137] In addition, the high-frequency module 1 of the above-mentioned embodiment only includes a transmission filter and a reception filter. However, the high-frequency module 1 of the above-mentioned embodiment may also include only a transmission filter and a reception filter, or may include a reception filter and a transmission filter. That is, in the above-mentioned embodiment, simultaneous reception is illustrated as an example of simultaneous communication, but simultaneous transmission may be performed as simultaneous communication, or transmission and reception may be performed simultaneously. In addition, as in the above-mentioned embodiment, in the reception filter, the input portion and the input portion of the output portion thereof are connected to the selection terminal of the antenna switch 3. However, in the case where the high-frequency module 1 includes a transmission filter, in the transmission filter, the input portion and the output portion thereof are connected to the selection terminal of the antenna switch 3.

[0138] (6) Method

[0139] In this specification, the following aspects are invented.

[0140] A high-frequency module (1) of the first embodiment includes a mounting substrate (16), a first filter (e.g., 4F), a second filter (e.g., 4G), and a third filter (e.g., 4B). The mounting substrate (16) has a first main surface (161) and a second main surface (162) facing each other. The first filter (e.g., 4F) includes a first substrate (43) and has a first passband, which includes at least a portion of a first frequency band (e.g., Band 1). The second filter (e.g., 4G) includes a second substrate (43) and has a second passband, which includes at least a portion of a second frequency band (e.g., Band 3). The third filter (e.g., 4B) includes a third substrate (43) and has a third passband, which includes at least a portion of a third frequency band (e.g., Band 66). The first filter (e.g., 4F) and the second filter (e.g., 4G) can communicate simultaneously, and the third filter (e.g., 4B) is not used to communicate simultaneously with the first filter (e.g., 4F) and the second filter (e.g., 4G). A first filter (e.g., 4F), a second filter (e.g., 4G), and a third filter (e.g., 4B) are mounted on a first main surface (161) of a mounting substrate (16). The first substrate (43) of the first filter (e.g., 4F), the second substrate (43) of the second filter (e.g., 4G), and the third substrate (43) of the third filter (e.g., 4B) are shared by each other. When viewed from above in the thickness direction (D1) of the mounting substrate (16), the third filter (e.g., 4B) is arranged between the first filter (e.g., 4F) and the second filter (e.g., 4G).

[0141] According to this structure, a third filter (e.g., 4B), which is not used for simultaneous communication, is arranged between a first filter (e.g., 4F) and a second filter (e.g., 4G), which are capable of simultaneous communication. Therefore, during simultaneous communication using the first filter (e.g., 4F) and the second filter (e.g., 4G), isolation between the first filter (e.g., 4F) and the second filter (e.g., 4G) is ensured by the third filter (e.g., 4B).

[0142] The high-frequency module (1) of the second embodiment is further provided with a switch (3) in the first embodiment. The switch (3) connects at least one of the first filter (e.g., 4F), the second filter (e.g., 4G), and the third filter (e.g., 4B) to the antenna terminal (12A).

[0143] According to this structure, the present invention can be applied to a structure including a switch (3).

[0144] In a third-type high-frequency module (1), in the second type, the switch (3) includes a common terminal (3a), a first selection terminal (e.g., 3f), a second selection terminal (e.g., 3f), and a third selection terminal (e.g., 3b). The common terminal (3a) is connected to the antenna terminal (12A). The first selection terminal (e.g., 3f) is connected to the first filter (e.g., 4F). The second selection terminal (e.g., 3f) is connected to the second filter (e.g., 4G). The third selection terminal (e.g., 3b) is connected to the third filter (e.g., 4B). In simultaneous communication using the first filter (e.g., 4F) and the second filter (e.g., 4G), the switch (3) connects the first selection terminal (e.g., 3f) and the second selection terminal (e.g., 3f) to the common terminal (3a), and does not connect the third selection terminal (e.g., 3b) to the common terminal (3a). In communication using the third filter (eg, 4B), the third selection terminal (eg, 3b) and the common terminal (3a) are connected, and the first selection terminal (eg, 3f) and the second selection terminal (eg, 3f) are not connected to the common terminal (3a).

[0145] According to this structure, it is possible to switch, by means of the switch (3), between simultaneous communication using the first filter (for example, 4F) and the second filter (for example, 4G) and communication using the third filter (for example, 4B).

[0146] In a high-frequency module (1) of a fourth embodiment, in the second embodiment or the third embodiment, a first filter (e.g., 4F), a second filter (e.g., 4G), and a third filter (e.g., 4B) each have an input portion and an output portion. The input portion inputs a signal. The output portion outputs a signal. When viewed from above in the thickness direction (D1) of the mounting substrate (16), in each of the first filter (e.g., 4F), the second filter (e.g., 4G), and the third filter (e.g., 4B), the input portion (45) is closer to the switch (3) than the output portion (46).

[0147] According to this structure, the signal path between the input unit (45) and the switch (3) can be shortened.

[0148] The high-frequency module (1) of the fifth embodiment comprises a plurality of filters including a first filter (e.g., 4A), a second filter (e.g., 4B), and a third filter (e.g., 4G) in any one of the second to fourth embodiments. The plurality of filters are mounted on a first main surface (161) of a mounting substrate (16). A switch (3) is mounted on a second main surface (162) of the mounting substrate (16). The combination of filters that includes the most combined filters in a combination of filters capable of simultaneous communication using two or more filters among the plurality of filters (e.g., 4A, 4B, 4G, 4F) is referred to as the most combined filter (P1). When viewed from above in the thickness direction (D1) of the mounting substrate (16), the distance between the most combined filter (P1) and the switch (3) among the distances (e.g., T1 to T4) between each of the plurality of filters and the switch (3) is the shortest (e.g., T1).

[0149] According to this structure, the signal path between the maximum combination filter (P1) and the switch (3) can be shortened.

[0150] In the high-frequency module (1) of the sixth aspect, in the fifth aspect, when viewed from above in the thickness direction (D1) of the mounting substrate (16), at most the combined filter (P1) and the switch (3) overlap with each other.

[0151] According to this structure, the signal path between the maximum combination filter (P1) and the switch (3) can be shortened.

[0152] The high-frequency module (1) of the seventh embodiment further comprises a fourth filter (e.g., 4A) in any one of the second to sixth embodiments, the fourth filter including a fourth substrate (43) and having a fourth passband including at least a portion of a fourth frequency band (e.g., Band 25). The third filter (e.g., 4B) and the fourth filter (e.g., 4A) are capable of communicating simultaneously. The fourth filter (e.g., 4A) is mounted on the first principal surface (161) of the mounting substrate (16). The fourth substrate (43) of the fourth filter (e.g., 4A) is shared with the third substrate (43) of the third filter. When viewed from above in the thickness direction (D1) of the mounting substrate (16), the first filter (e.g., 4F) or the second filter (e.g., 4G) is arranged between the third filter (e.g., 4B) and the fourth filter (e.g., 4A).

[0153] According to this structure, when simultaneous communication is performed using a third filter (e.g., 4B) and a fourth filter (e.g., 4A), isolation between the third filter (e.g., 4B) and the fourth filter (e.g., 4A) can be ensured through the first filter (e.g., 4F) or the second filter (e.g., 4G).

[0154] In the high-frequency module (1) of the eighth embodiment, in the seventh embodiment, the difference between the center frequency of the first frequency band (e.g., Band 1) and the center frequency of the third frequency band (e.g., Band 66) is smaller than the difference between the center frequency of the first frequency band (e.g., Band 1) and the center frequency of the fourth frequency band (e.g., Band 25).

[0155] According to this structure, the first filter (e.g., 4F) and the third filter (e.g., 4B) with similar center frequencies can be arranged adjacent to each other. When an amplifier (e.g., 5B, 5A, 5E, 5D) is connected to each of the first to fourth filters (e.g., 4F, 4G, 4B, 4A), the amplifiers (e.g., 5B, 5A) connected to the first filter (e.g., 4F) and the third filter (e.g., 4B) with similar center frequencies are arranged close to each other. Therefore, by also arranging the first filter (e.g., 4F) and the third filter (e.g., 4B) close to each other (adjacent) as described above, the amplifiers (e.g., 5B, 5A) of the first filter (e.g., 4F) and the third filter (e.g., 4B) can be arranged together near the first filter (e.g., 4F) and the third filter (e.g., 4B). As a result, the signal paths between the first filter (e.g., 4F) and the third filter (e.g., 4B) and the amplifiers (e.g., 5B, 5A) of the first filter (e.g., 4F) and the third filter (e.g., 4B) can be shortened.

[0156] The high-frequency module (1) of the ninth aspect comprises a first array filter (18) and a second array filter (19) in the seventh aspect or the eighth aspect. The first array filter (18) comprises a first filter (e.g., 4F), a second filter (e.g., 4G), a third filter (e.g., 4B), and a fourth filter (e.g., 4A). The second array filter (19) comprises three or more filters other than the first filter (e.g., 4F), the second filter (e.g., 4G), the third filter (e.g., 4B), and the fourth filter (e.g., 4A). When viewed from above in the thickness direction (D1) of the mounting substrate (16), a switch (3) is arranged between the first array filter (18) and the second array filter (19).

[0157] According to this structure, in a structure having two array filters (a first array filter (18) and a second array filter (19)), the above-mentioned effect can be exerted on at least one array filter (the first array filter (18)).

[0158] In the high-frequency module (1) of the tenth aspect, in any one of the first to ninth aspects, the combination of the first frequency band and the second frequency band is Band 1 and Band 3, or Band 40 and Band 41.

[0159] According to this configuration, the present invention can be applied when the combination of the first frequency band and the second frequency band is Band 1 and Band 3, or Band 40 and Band 7.

[0160] The filter device of the eleventh embodiment includes a first filter (e.g., 4F), a second filter (e.g., 4G), and a third filter (e.g., 4B). The first filter (e.g., 4F) includes a first substrate (43) and has a first passband, the first passband including at least a portion of a first frequency band (e.g., Band 1). The second filter (e.g., 4G) includes a second substrate (43) and has a second passband, the second passband including at least a portion of a second frequency band (e.g., Band 3). The third filter (e.g., 4B) includes a third substrate (43) and has a third passband, the third passband including at least a portion of a third frequency band (e.g., Band 66). The first filter (e.g., 4F) and the second filter (e.g., 4G) are used for simultaneous communication, and the third filter (e.g., 4B) is not used for simultaneous communication with the first filter (e.g., 4F) and the second filter (e.g., 4G). The first substrate (43) of the first filter (e.g., 4F), the second substrate (43) of the second filter (e.g., 4G), and the third substrate (43) of the third filter (e.g., 4B) are shared by each other. When viewed from above in the thickness direction (D1) of the first substrate (43), a third filter (for example, 4B) is arranged between the first filter (for example, 4F) and the second filter (for example, 4G).

[0161] According to this structure, a third filter (e.g., 4B), which is not used for simultaneous communication, is arranged between the first filter (e.g., 4F) and the second filter (e.g., 4G) used for simultaneous communication. Therefore, during simultaneous communication using the first filter (e.g., 4F) and the second filter (e.g., 4G), isolation between the first filter (e.g., 4F) and the second filter (e.g., 4G) can be ensured by the third filter (e.g., 4B).

[0162] A communication device (100) according to a twelfth aspect comprises a high-frequency module according to any one of the first to tenth aspects and a signal processing circuit. The signal processing circuit is connected to the high-frequency module and performs signal processing on the high-frequency signal.

[0163] According to this configuration, it is possible to provide a communication device including a high-frequency module, which has the above-described operational effects.

[0164] Description of Reference Numerals

[0165] 1…high-frequency module; 3…antenna switch (switch); 3a…common terminal; 3b–3h…selection terminal; 4A…receive filter (first filter, fourth filter); 4B…receive filter (second filter, third filter); 4C, 4D, 4E…receive filter; 4F…receive filter (first filter); 4G…receive filter (second filter, third filter); 4H–4J…receive filter; 5A–5J…low-noise amplifier (amplifier); 6A–6J…switch; 8, 9A–9G, 11A–11J…matching circuit; 10A–10C…characteristic adjustment circuit; 12…external connection terminal; 12A…antenna terminal; 12B–12E…signal output terminal; 12F… Input terminal; 13…controller; 16…mounting substrate; 17…IC chip; 18…four-way filter (first array filter); 19…four-way filter (second array filter); 20…signal processing circuit; 21…RF signal processing circuit; 22…baseband signal processing circuit; 23…dual-way filter; 37…signal path; 40…antenna; 43…piezoelectric substrate (first substrate, second substrate, third substrate); 44A~44I…IDT electrodes; 45…input part; 46…output part; 100…communication device; 161…first main surface; 162…second main surface; N1~N17…branching point; P1…maximum combination filter; R0~R37, R50…signal path; T1~T4…distance.

Claims

1. A high-frequency module comprising: A mounting substrate having a first main surface and a second main surface facing each other; a first filter comprising a first substrate and having a first passband, wherein the first passband includes at least a portion of a first frequency band; a second filter comprising a second substrate and having a second passband, wherein the second passband includes at least a portion of the second frequency band; and a third filter comprising a third substrate and having a third passband, wherein the third passband includes at least a portion of a third frequency band; The first filter and the second filter are capable of communicating simultaneously. The third filter is not used to communicate with the first filter and the second filter at the same time. The first filter, the second filter, and the third filter are mounted on the first main surface of the mounting substrate. The first substrate of the first filter, the second substrate of the second filter, and the third substrate of the third filter are shared by each other. The third filter is arranged between the first filter and the second filter when viewed in plan from the thickness direction of the mounting substrate.

2. The high-frequency module according to claim 1, wherein The invention further includes a switch that connects at least one of the first filter, the second filter, and the third filter to an antenna terminal.

3. The high-frequency module according to claim 2, wherein: The switch has: A common terminal connected to the antenna terminal; A first selection terminal connected to the first filter; A second selection terminal connected to the second filter; as well as The third selection terminal is connected to the third filter. During simultaneous communication using the first filter and the second filter, the switch connects the first selection terminal to the common terminal and the second selection terminal to the common terminal, and does not connect the third selection terminal to the common terminal. During communication using the third filter, the switch connects the third selection terminal and the common terminal, and does not connect the first selection terminal and the common terminal, and does not connect the second selection terminal and the common terminal.

4. The high-frequency module according to claim 2 or 3, wherein: The first filter, the second filter, and the third filter respectively have: an input unit for inputting a signal; and Output section, output signal, In each of the first filter, the second filter, and the third filter, the input portion is closer to the switch than the output portion when viewed in plan from the thickness direction of the mounting substrate.

5. The high-frequency module according to any one of claims 2 to 4, wherein A plurality of filters are provided, wherein the plurality of filters are mounted on the first main surface of the mounting substrate, and include the first filter, the second filter, and the third filter. The switch is mounted on the second main surface of the mounting substrate. Among combinations of filters used in simultaneous communication using two or more filters among the plurality of filters, the filter included in the most combinations is defined as the most combined filter, When viewed in plan from the thickness direction of the mounting substrate, the distance between each of the plurality of filters and the switch is the shortest between the filter with the most combinations and the switch. The high-frequency module according to claim 5 , wherein: The maximum combination filter and the switch overlap with each other when viewed in plan from the thickness direction of the mounting substrate.

7. The high-frequency module according to any one of claims 2 to 6, wherein further comprising a fourth filter, the fourth filter including a fourth substrate and having a fourth passband, the fourth passband including at least a portion of a fourth frequency band, The third filter and the fourth filter can communicate simultaneously. The fourth filter is mounted on the first main surface of the mounting substrate. The fourth substrate of the fourth filter is shared with the third substrate of the third filter. The first filter or the second filter is arranged between the third filter and the fourth filter when viewed in plan from the thickness direction of the mounting substrate.

8. The high-frequency module according to claim 7, wherein: A difference between a center frequency of the first frequency band and a center frequency of the third frequency band is smaller than a difference between the center frequency of the first frequency band and a center frequency of the fourth frequency band.

9. The high-frequency module according to claim 7 or 8, wherein: have: A first array filter comprising the first filter, the second filter, the third filter, and the fourth filter; and The second array filter includes three or more filters other than the first filter, the second filter, the third filter, and the fourth filter. The switch is arranged between the first array filter and the second array filter when viewed in plan from the thickness direction of the mounting substrate.

10. The high-frequency module according to any one of claims 1 to 9, wherein The combination of the first frequency band and the second frequency band is Band 1 and Band 3, or Band 40 and Band 7.

11. A filtering device comprising: a first filter comprising a first substrate and having a first passband, wherein the first passband includes at least a portion of a first frequency band; a second filter comprising a second substrate and having a second passband, wherein the second passband includes at least a portion of the second frequency band; and a third filter comprising a third substrate and having a third passband, wherein the third passband includes at least a portion of a third frequency band; The first filter and the second filter are capable of communicating simultaneously. The third filter is not used to communicate with the first filter and the second filter at the same time. The first substrate of the first filter, the second substrate of the second filter, and the third substrate of the third filter are shared by each other. The third filter is arranged between the first filter and the second filter when viewed in plan from the thickness direction of the first substrate.

12. A communication device comprising: The high-frequency module according to any one of claims 1 to 10; and The signal processing circuit is connected to the high-frequency module and processes the high-frequency signal.

Images