A plating apparatus and method for gallium-nickel alloy target preparation

Abstract

The application discloses a kind of for gallium-nickel alloy target preparation electroplating device and method.The device of the application includes electroplating tank;Stirring unit, including servo motor, motor drive shaft, conductive slip ring and coaxial device, conductive slip ring includes conductive slip ring body and conductive slip ring inner shaft, anode wire and cathode wire are equipped on conductive slip ring body;Anode unit, including the anode fixed plate of transverse fixed anode and anode bracket connecting shaft, anode is connected with anode wire, anode fixed plate is rotatably installed in electroplating tank under the drive of anode bracket connecting shaft;Cathode unit, including the cathode target support of transverse fixed cathode target piece and target electrode guide rod, cathode target piece is connected with cathode wire, cathode target support includes cathode target support body, cathode target support body is rotatably installed in electroplating tank under the drive of target electrode guide rod.The device of the application can realize the preparation of non-circular and large-area Ga-Ni alloy target, ensure the uniformity of electric field, to prepare Ga-Ni alloy target with higher Ga content.

Description

Technical Field

[0001] This invention relates to an electroplating apparatus and method for preparing Ga-Ni alloy targets, mainly used in the production of Ge-68, and belongs to the field of positron emission tomography (PET) technology. Background Technology

[0002] Ge-68 has a half-life of 270.95 days, while Ga-68 (with a half-life of 68.95 minutes), produced through decay, is a commonly used positron emission tomography (PET) nuclide. In recent years, the application of Ga-68 has developed rapidly. It can be labeled with various peptides such as DOTA and PSMA for the diagnosis of various diseases, largely compensating for the shortcomings of other positron emission tomographic nuclides such as F-18, C-11, N-15, and O-13 in the diagnosis of certain diseases.

[0003] Currently, Ge-68 production primarily involves irradiating Nb-encapsulated Ga targets, Ga oxides, and Ga-Ni alloy targets. Firstly, the preparation process for Ga targets encapsulated in Nb capsules is relatively complex. Furthermore, under prolonged and high-current proton beam irradiation, the chemical reactivity of Ga increases, gradually corroding the Nb capsule and leading to target breakage. Secondly, Ga oxide targets, due to their poor electrical and thermal conductivity, also cannot withstand prolonged and high-current irradiation. In comparison, Ga-Ni targets have a simpler preparation process and better electrical and thermal conductivity, enabling them to withstand high-current and prolonged irradiation. However, although the introduction of Ni (which may introduce some impurity nuclides) does not affect the separation and purification of Ge-68. Currently, the Obninsk Cyclone Accelerator Company in Russia has successfully produced Ge-68 by irradiating a Ga-Ni alloy target with a proton beam current of up to 600 µA. In 2019, literature reported that Brookhaven National Laboratory in the United States prepared a high-performance Ga-Ni alloy target for the irradiation production of Ge-68. This demonstrates that Ga-Ni alloy targets have good prospects for large-scale application in the production of Ge-68. Ga-Ni alloy targets may become a substitute for Nb-encapsulated metals. nat Ga target or nat Ga oxide targets, becoming 68 A new trend in Ge irradiation production.

[0004] Currently, Ga-Ni alloy targets are mainly prepared using either high-temperature melting or electroplating. High-temperature melting involves sintering and melting metallic Ga and Ni in a specific ratio under high temperature and inert gas conditions. This method is not only demanding in terms of equipment but also complex to operate. More importantly, Ga-Ni alloy targets prepared using this method still contain a small amount of unreacted metallic Ga, which can damage the target during irradiation. Therefore, electroplating has become the optimal choice for preparing Ga-Ni alloy targets. In 1994, TRIUMF in Canada reported the successful preparation of Ga-Ni alloy targets using electroplating and their application in proton beam irradiation at a current intensity of 160 µA. In 2013, R. Adam-Rebeles et al. reported that Ga-Ni alloy targets prepared by electroplating were bombarded with a proton beam at a current of 300 µA for 21 days, yielding Ge-68 with a density of 4.7 Ci. In 2011, a patent application from China's Atomic High-Tech Co., Ltd. disclosed a vertical electroplating apparatus with a constant-temperature water bath and stirring for the preparation of Ga-Ni alloy targets. The preparation of Ga-Ni alloy targets typically involves heating and stirring, placing high demands on the electroplating apparatus. Furthermore, the influence of factors such as the shape and area of ​​the substrate during target preparation must be considered. For example, existing Ga-Ni alloy target electroplating apparatuses are all vertical, and their stirring devices cannot adequately guarantee the uniformity of the electric field during electroplating, potentially leading to a decrease in the density and uniformity of the target layer. Therefore, designing a high-performance Ga-Ni alloy target electroplating apparatus is a crucial step in achieving Ge-68 production. Summary of the Invention

[0005] The purpose of this invention is to provide an electroplating apparatus and method for preparing gallium-nickel alloy targets. The apparatus is a horizontal heating electroplating apparatus of dual-electrode rotation or single-electrode rotation, mainly used for the preparation of gallium-nickel alloy targets produced by Ge-68. The design of the apparatus ensures the uniformity of the electric field during the electroplating process, which is beneficial for preparing Ga-Ni alloy targets with higher Ga content.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides an electroplating apparatus for preparing gallium-nickel alloy targets, comprising:

[0008] An electroplating tank, including an electroplating tank body, wherein the electroplating tank body is covered with heating elements.

[0009] A stirring unit includes a servo motor, a motor drive shaft, a conductive slip ring, and a coaxial device. The conductive slip ring includes a conductive slip ring body and a conductive slip ring inner shaft. The conductive slip ring body is provided with an anode wire and a cathode wire. The conductive slip ring body is sleeved on the outside of the motor drive shaft. The conductive slip ring inner shaft is sleeved between the motor drive shaft and the conductive slip ring body. The coaxial device is sleeved on the outside of the motor drive shaft and located above the conductive slip ring body.

[0010] An anode unit includes an anode fixing plate with an anode fixed laterally and an anode support plate connecting shaft. The anode is connected to an anode wire on the conductive slip ring body. The anode support plate connecting shaft is installed inside the inner shaft of the conductive slip ring and its lower end is fixed on the anode fixing plate. The anode fixing plate is rotatably installed laterally in the electroplating tank body under the drive of the anode support plate connecting shaft.

[0011] The cathode unit includes a cathode target holder with a cathode target fixed laterally and a target electrode guide rod. The cathode target is connected to a cathode wire on the conductive slip ring body. The cathode target holder includes a cathode target holder body. The target electrode guide rod is installed on the inner side of the inner shaft of the conductive slip ring. The cathode target holder body is rotatably mounted laterally in the electroplating tank body under the drive of the target electrode guide rod.

[0012] The electroplating apparatus for preparing gallium-nickel alloy targets described above includes a cathode unit further comprising a cathode target support bracket and a cathode target support connecting rod. The lower end of the target electrode guide rod is fixed on the cathode target support bracket. The cathode target support bracket is connected to the cathode target support body via cathode target support connecting rods on both sides. The cathode target is connected to the cathode wire on the conductive slip ring body via the cathode target support bracket, the cathode target support connecting rods at both ends, and the target electrode guide rod.

[0013] The cathode target holder body is provided with a cathode wiring hole, and the cathode target is connected to the cathode wire on the conductive slip ring body through a screw in the cathode wiring hole.

[0014] The electroplating apparatus described above for preparing gallium-nickel alloy targets has a through hole on the cathode target support hanger for the anode support plate connecting shaft to pass through, and the anode fixing plate is located below the cathode target support hanger and above the cathode target support.

[0015] The anode fixing plate is provided with an anode wire hole, and the anode is connected to the anode wire on the conductive slip ring body by a wire passing through the anode wire hole and the anode support plate connecting shaft in sequence;

[0016] The anode fixing plate is movable up and down and fixed to the cathode target support rod.

[0017] In the electroplating apparatus described above for preparing gallium-nickel alloy targets, the target electrode guide rod is located outside the connecting shaft of the anode support plate;

[0018] The anode support plate connecting shaft has external threads and is configured to rotate the anode support plate connecting shaft to move the anode fixing plate up and down.

[0019] The electroplating apparatus for preparing gallium-nickel alloy targets described above further includes an electroplating tank cover plate. The top of the side wall of the electroplating tank body is provided with a groove for placing a sealing rubber ring. The electroplating tank cover plate is sealed to the electroplating tank body through the rubber ring.

[0020] The electroplating tank cover plate is provided with a through hole for the anode support plate connecting shaft and the target electrode guide rod to pass through, and a rotating sealing ring that fits the bottom surface of the electroplating tank cover plate is provided outside the target electrode guide rod.

[0021] The electroplating tank cover plate is provided with ventilation holes.

[0022] The electroplating apparatus for preparing gallium-nickel alloy targets described above further includes an electroplating tank fixing device. The electroplating tank fixing device includes an upper retaining ring located above the electroplating tank body and a lower retaining ring located below the electroplating tank body. The upper retaining ring and the lower retaining ring are supported by a plurality of electroplating tank supports arranged around the electroplating tank body.

[0023] In the electroplating apparatus described above for preparing gallium-nickel alloy targets, a motor bracket is provided below the servo motor, and the motor bracket is supported by a motor bracket support rod installed on a retaining ring on the electroplating tank;

[0024] The conductive slip ring also includes a conductive slip ring anti-rotation plate and a conductive slip ring anti-rotation plate fixing plate. The conductive slip ring anti-rotation plate is located between the coaxial device and the conductive slip ring body. The conductive slip ring anti-rotation plate fixing plate fixes the conductive slip ring anti-rotation plate on the motor bracket support rod.

[0025] The electroplating apparatus described above for preparing gallium-nickel alloy targets has a groove on the cathode target holder body for placing the cathode target.

[0026] The cathode target holder also includes a target holder cover plate that is sealed to the cathode target holder body. The target holder cover plate is provided with a groove for placing a fluororubber ring. The fluororubber ring is used to seal the cathode target. The cathode target holder body is provided with a cathode target sealing screw hole.

[0027] The cathode target holder also includes a cathode target holder protective sleeve disposed outside the cathode target holder body, and a groove is provided at the bottom of the electroplating tank body, and a concentric shaft matching the groove is provided below the cathode target holder protective sleeve;

[0028] The anode and the anode fixing plate are not circular in shape; for example, the anode is rectangular and the anode fixing plate is cross-shaped.

[0029] The cathode target is non-circular in shape, such as rectangular.

[0030] In this invention, the shape referred to refers to the shape of the cross-section.

[0031] In a second aspect, the present invention provides a method for preparing a gallium-nickel alloy target, comprising the following steps: pouring a plating solution into an electroplating tank in an electroplating apparatus for preparing a gallium-nickel alloy target as described in any of the above claims; turning on an external power supply and a control unit; setting the current value, heating temperature, stirring speed, and electroplating time; rotating and stirring the positive electrode and the cathode target during electroplating; and obtaining a gallium-nickel alloy target on the surface of the cathode target after electroplating.

[0032] Preferably, the plating solution has the following composition: Ga 3+ with Ni 2+ The molar ratio is (1~5):1.

[0033] Preferably, the current value is 500~1500 mA.

[0034] Preferably, the heating temperature is 30~50℃.

[0035] Preferably, the stirring speed is 10~1000 rpm.

[0036] Thirdly, the present invention provides a method for producing Ge-68, comprising the following steps: irradiating a gallium-nickel alloy target prepared by an electroplating apparatus for preparing gallium-nickel alloy targets as described above, or irradiating a gallium-nickel alloy target prepared by the method for preparing gallium-nickel alloy targets as described above, to obtain Ge-68.

[0037] The present invention has the following advantages due to the adoption of the above technical solutions:

[0038] 1. The present invention provides a dual-electrode rotating horizontal electroplating apparatus for preparing Ga-Ni alloys. The apparatus has a clear design concept and is simple to operate, and can realize the preparation of non-circular and large-area Ga-Ni alloy targets.

[0039] 2. The electroplating apparatus of the present invention can ensure the uniformity of the electric field during the electroplating process, which is beneficial to the preparation of Ga-Ni alloy targets with higher Ga content and to increase the yield of Ge-68. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the overall structure of an electroplating apparatus (dual-electrode rotary electroplating apparatus) for preparing gallium-nickel alloy targets according to an embodiment of the present invention.

[0041] Figure 2 This is a cross-sectional view of an electroplating apparatus (dual-electrode rotary electroplating apparatus) for preparing gallium-nickel alloy targets according to an embodiment of the present invention.

[0042] Figure 3 for Figure 2 A magnified view of a portion of the stirring unit.

[0043] Figure 4 for Figure 3 A schematic diagram of the structure of the conductive slip ring.

[0044] Figure 5 This is a cross-sectional view of the anode and cathode units in an electroplating apparatus (dual-electrode rotary electroplating apparatus) for preparing gallium-nickel alloy targets according to an embodiment of the present invention.

[0045] Figure 6 for Figure 2 A partially enlarged view of the anode unit.

[0046] Figure 7 This is a cross-sectional view of the cathode unit in an electroplating apparatus (dual-electrode rotary electroplating apparatus) for preparing gallium-nickel alloy targets according to an embodiment of the present invention.

[0047] Figure 8 This is a schematic diagram of the electrode unit in an electroplating apparatus (dual-electrode rotary electroplating apparatus) for preparing gallium-nickel alloy targets according to an embodiment of the present invention.

[0048] Figure 9 This is a cross-sectional view of the electroplating tank in an electroplating apparatus (dual-electrode rotary electroplating apparatus) for preparing gallium-nickel alloy targets according to an embodiment of the present invention.

[0049] Figure 10 This is a cross-sectional view of the cathode target holder in an electroplating apparatus (dual-electrode rotary electroplating apparatus) for preparing gallium-nickel alloy targets according to an embodiment of the present invention.

[0050] Figure 11 The image shows the appearance and external connections of an electroplating apparatus (dual-electrode rotary electroplating apparatus) for preparing gallium-nickel alloy targets according to an embodiment of the present invention.

[0051] The markings in the diagram are as follows:

[0052] 101-Electroplating tank body; 102-Heating element; 103-Electroplating tank cover plate; 104-Upper retaining ring of electroplating tank; 105-Lower retaining ring of electroplating tank; 106-Electroplating tank support; 107-Ventilation hole; 108-Upper groove of electroplating tank; 109-Bottom groove of electroplating tank;

[0053] 111-Servo motor; 112-Motor drive shaft; 113-Conductive slip ring; 114-Coaxial cable; 115-Motor bracket; 116-Motor bracket support rod;

[0054] 1131-Conductive slip ring body; 1132-Inner shaft of conductive slip ring; 1133-Anti-rotation plate of conductive slip ring; 1134-Fixing plate of anti-rotation plate of conductive slip ring; 1135-Anode wire; 1136-Cathode wire;

[0055] 121-Anode fixing plate; 122-Anode support plate connecting shaft; 123-Anode; 124-Anode fixing clamp;

[0056] 131-Cathode target holder; 132-Target electrode guide rod; 133-Cathode target holder hanger; 134-Cathode target holder connecting rod; 135-Cathode wiring hole; 136-Cathode target; 137-Concentric shaft; 138-Rotary sealing ring;

[0057] 1311-Cathode target holder body; 1312-Target holder cover plate; 1313-Cathode target sealing screw hole; 1314-Cathode target holder protective sleeve; 1315-Target holder cover plate sealing groove. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0059] In the description of this invention, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the system or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the use of terms such as "first," "second," etc., to define components is merely for the convenience of distinguishing the aforementioned components; unless otherwise stated, these terms have no special meaning and should not be construed as indicating or implying relative importance.

[0060] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "assembly," "setup," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0061] The electroplating apparatus for preparing gallium-nickel alloy targets provided in the embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0062] Example 1: Electroplating apparatus for preparing gallium-nickel alloy targets

[0063] This embodiment provides a dual-electrode rotating horizontal electroplating apparatus for preparing Ga-Ni alloy targets. This apparatus is mainly used for preparing rectangular Ga-Ni alloy targets.

[0064] like Figure 1 and Figure 2 As shown, the electroplating apparatus for preparing gallium-nickel alloy targets provided in this embodiment includes an electroplating tank, a stirring unit, an anode unit, and a cathode unit.

[0065] An electroplating tank includes an electroplating tank body 101, and a heating element 102 is wrapped around the outside of the electroplating tank body 101. The electroplating tank body 101 is made of a corrosion-resistant non-metallic material, preferably polytetrafluoroethylene in this embodiment. The heating element 102 is used to heat and keep the plating solution at a constant temperature during the electroplating process. Its material is a corrosion-resistant material, preferably silicone rubber heating element in this embodiment.

[0066] Stirring unit, such as Figure 3 He Ru Figure 4 As shown, the system includes a servo motor 111, a motor drive shaft 112, a conductive slip ring 113, and a coaxial connector 114. The conductive slip ring 113 includes a conductive slip ring body 1131 and a conductive slip ring inner shaft 1132. An anode wire 1135 and a cathode wire 1136 are connected to the conductive slip ring body 1131. The conductive slip ring body 1131 is sleeved on the outside of the motor drive shaft 112, and the conductive slip ring inner shaft 1132 is sleeved between the motor drive shaft 112 and the conductive slip ring body 1131. The coaxial connector 114 is sleeved on the outside of the motor drive shaft 112 and located above the conductive slip ring body 1131. The coaxial connector 114 is preferably a cross-shaped bearing. The stirring unit 110 is used to connect the anode, cathode, and external control unit, and simultaneously realizes dual-electrode rotation stirring, ensuring stirring and stirring speed adjustment during the electroplating process, and further ensuring the uniformity of the electric field during the electroplating process.

[0067] Anode unit 120, such as Figure 5 and Figure 6 As shown, the system includes an anode fixing plate 121 (preferably platinum metal) with an anode 123 fixed laterally, an anode support plate connecting shaft 122, and an anode fixing clamp 124. The anode fixing clamp 124 clamps the anode 123 onto the anode fixing plate 121 in the opposite direction. The anode 123 is connected to the anode wire 1135 on the conductive slip ring body 1131. The anode support plate connecting shaft 122 is installed inside the motor drive shaft 112 and its lower end is fixed to the anode fixing plate 121. The anode fixing plate 121 is rotatably mounted laterally inside the electroplating tank body 101 under the drive of the anode support plate connecting shaft 122. The anode support plate connecting shaft 122 is made of a corrosion-resistant, non-metallic material, preferably polytetrafluoroethylene (PTFE) in this embodiment. The anode fixing plate 121 is not circular in shape, preferably cross-shaped in this embodiment, and is made of a corrosion-resistant, non-metallic material, preferably polytetrafluoroethylene (PTFE) in this embodiment. The anode 123 is not circular in shape, but is preferably rectangular in this embodiment. It is made of an inert metal material, and is preferably a platinum sheet electrode with a purity greater than 99.99%.

[0068] Cathode unit 130, such as Figure 5 , Figure 7 and Figure 8 As shown, the device includes a cathode target holder 131 with a cathode target 136 fixed laterally and a target electrode guide rod 132. The cathode target 136 is connected to the cathode wire 1136 on the conductive slip ring body 1131. The cathode target holder includes a cathode target holder body 1311. The target electrode guide rod 132 is installed inside the inner shaft 1132 of the conductive slip ring to realize the circuit connection of the cathode unit. The cathode target holder body 1311 is rotatably installed laterally in the electroplating tank body 101 under the drive of the target electrode guide rod 132. The target electrode guide rod 132 is made of a metal material that is not easily corroded, such as titanium. The cathode target holder 131 is made of a high-purity metal material, preferably copper in this embodiment. The cathode target is not circular in shape; in this embodiment, the cathode target is preferably rectangular in shape and made of a high-purity metal material, such as tantalum, copper, gold, etc. The electroplating area is preferably 18 cm². 2 .

[0069] In the above embodiments, preferably, as shown in the example Figure 8 As shown, the cathode unit 130 also includes a cathode target holder hanger 133 and a cathode target holder connecting rod 134. The lower end of the target electrode guide rod 132 is fixed on the cathode target holder hanger 133. The cathode target holder hanger 133 is connected to the cathode target holder body 1311 through the cathode target holder connecting rods 134 on both sides. The cathode target is connected to the cathode wire 1136 on the conductive slip ring body 1131 through the cathode target holder hanger 133, the cathode target holder connecting rods 134 at both ends and the target electrode guide rod 132. The cathode target holder connecting rod 134 is made of a corrosion-resistant and conductive material, such as titanium or tantalum.

[0070] More preferably, such as Figure 7 As shown, the cathode target holder body 1311 is provided with a cathode wiring hole 135, and the cathode target 136 is connected to the cathode wire on the conductive slip ring body 1131 through the screw in the cathode wiring hole 135.

[0071] In the above embodiments, preferably, as shown in the example Figure 5 and Figure 8 As shown, the cathode target support hanger 133 is provided with a through hole for the anode support plate connecting shaft 122 to pass through, and the anode fixing plate 121 is located below the cathode target support hanger 133 and above the cathode target support 131.

[0072] The anode fixing plate 121 is provided with an anode wire hole. The anode is connected to the anode wire on the conductive slip ring body 1131 by a wire passing through the anode wire hole and the anode support plate connecting shaft 122 in sequence. The wire connecting the anode is made of corrosion-resistant metal material, such as platinum wire. In this embodiment, the platinum sheet electrode is connected to the anode wire of the conductive slip ring body 1131 by platinum wire and copper wire passing through the anode support plate connecting shaft 122.

[0073] The anode fixing plate 121 is fixed to the cathode target support rod 132 in a way that allows it to move up and down.

[0074] In the above embodiments, preferably, as shown in the example Figure 2 As shown, the target electrode guide rod 132 is located outside the anode support plate connecting shaft 122. The anode support plate connecting shaft 122 has external threads and is configured to rotate the anode support plate connecting shaft 122 to move the anode fixing plate 121 up and down, which facilitates the connection of the cathode unit's wires to the external circuit and the adjustment of the anode and cathode spacing.

[0075] In the above embodiments, preferably, as shown in the example Figure 1 and Figure 9 As shown, the electroplating tank also includes an electroplating tank cover plate 103, which is made of corrosion-resistant non-metallic material. The top of the side wall of the electroplating tank body 101 is provided with a groove for placing a sealing rubber ring. The electroplating tank upper edge groove 108 is provided. The electroplating tank cover plate 103 is sealed to the electroplating tank body 101 through the rubber ring.

[0076] like Figure 1 , Figure 2 As shown, the electroplating tank cover plate 103 has a through hole for the anode support plate connecting shaft 122 and the target electrode guide rod 132 to pass through. A rotating sealing ring 138 is provided outside the target electrode guide rod 132, fitting against the bottom surface of the electroplating tank cover plate, to ensure that the solution does not evaporate from the rotating gap during the rotation of the target electrode guide rod. In this embodiment, the sealing ring preferably has an inner diameter of 17 mm, an outer diameter of 28 mm, and a thickness of 7 mm. The electroplating tank cover plate 103 is provided with a vent hole 107.

[0077] In the above embodiments, preferably, as shown in the example Figure 1 As shown, the electroplating tank 100 also includes an electroplating tank fixing device, which includes an upper retaining ring 104 located above the electroplating tank body and a lower retaining ring 105 located below the electroplating tank body. The upper retaining ring 104 and the lower retaining ring 105 are supported by a plurality of electroplating tank supports 106 arranged around the electroplating tank body. The upper and lower retaining rings are used for fixing and sealing the electroplating tank and are made of a metal material with high hardness. In this embodiment, 304 stainless steel is preferred.

[0078] More preferably, such as Figure 1 As shown, a motor bracket 115 is provided below the servo motor 111. The motor bracket 115 is supported by a motor bracket support rod 116 installed on the retaining ring 104 in the electroplating tank. The motor bracket 115 and the motor bracket support rod 116 are used to support the servo motor 111. The material is a metal material with high hardness. In this embodiment, it is preferably made of 304 stainless steel.

[0079] More preferably, such as Figure 1 and Figure 2 As shown, the conductive slip ring 113 also includes a conductive slip ring anti-rotation plate 1133 and a conductive slip ring anti-rotation plate fixing plate 1134. The conductive slip ring anti-rotation plate 1133 is located between the coaxial connector 114 and the conductive slip ring body 1131. The conductive slip ring anti-rotation plate fixing plate 1134 fixes the conductive slip ring anti-rotation plate 1133 to the motor bracket support rod 116. The function of the conductive slip ring anti-rotation plate is to fix the stator position of the conductive slip ring and prevent the wires from getting tangled.

[0080] In the above embodiments, preferably, as shown in the example Figure 7 and Figure 10 As shown, a groove is provided in the middle of the cathode target holder body 1311 for placing the cathode target 136.

[0081] The cathode target holder also includes a target holder cover plate 1312 that is sealed to the cathode target holder body 1311. The cover plate is made of corrosion-resistant non-metallic material, preferably polytetrafluoroethylene in this embodiment. The target holder cover plate 1312 is provided with a groove for placing a fluororubber ring, and the fluororubber ring is used to seal the cathode target 136. The cathode target holder body 1311 is provided with a cathode target sealing screw hole 1313.

[0082] The cathode target holder 131 also includes a cathode target holder protective sleeve 1314 disposed outside the cathode target holder body. The protective sleeve is made of corrosion-resistant non-metallic material. In this embodiment, polytetrafluoroethylene is preferred to ensure that the cathode target holder does not participate in electroplating.

[0083] The bottom of the electroplating tank body is provided with a groove 109. The bottom groove of the electroplating tank is provided with a concentric shaft 137 matching the groove below the cathode target support protective sleeve 1314 to ensure the normal operation of the dual electrodes.

[0084] The working principle of the electroplating apparatus for preparing gallium-nickel alloy targets of the present invention is as follows: servo motor 111 is used to connect the external control unit and the electroplating apparatus to realize stirring during the electroplating process; coaxial cable 114 is used for torque transmission; conductive slip ring 113 mainly transmits current signals to the rotating parts; motor drive shaft 112 transmits the torque of servo motor 111 to target electrode guide rod 132; target electrode guide rod 132 connects the cathode target holder hanger to drive the anode unit and cathode unit to realize stirring during the electroplating process; driven by the target electrode guide rod, the cathode target holder hanger 133 and the cathode target holder connecting rods 134 on both sides are driven to rotate laterally, further driving the cathode target holder 136 and anode fixing plate 121 to rotate laterally. Since the cathode and anode are set to rotate simultaneously with the cathode target holder 136 and anode fixing plate 121, the electric field distribution of the cathode and anode will not change due to their non-circular shape during rotation, thus ensuring the uniformity of the electric field during the electroplating process. Therefore, it is possible to prepare non-circular and large-area Ga-Ni alloy targets.

[0085] Example 2: Preparation of gallium-nickel alloy target

[0086] This embodiment provides a method for preparing a gallium-nickel alloy target, including the following steps: Figure 8 As shown, the plating solution is poured into the electroplating tank of the electroplating apparatus used for preparing gallium-nickel alloy targets in Example 1. The external power supply and control unit are turned on, and the current value, stirring speed and electroplating time are set. The positive and negative targets are rotated and stirred during electroplating. After electroplating, a gallium-nickel alloy target is obtained on the surface of the negative target. The specific steps are as follows:

[0087] Step 1: Pour a certain volume of plating solution into the electroplating tank (the liquid level should not exceed the anode fixing plate). Then, install the stirring unit (except for servo motor 1), the anode unit, and the cathode unit as described above. After completion, place them in the electroplating tank and seal the retaining ring on the electroplating tank with nuts. Connect the servo motor to the lower stirring unit via a coaxial connector and fix it to the motor bracket with nuts. Connect the servo motor to the external control unit, which controls the stirring and adjustment of the stirring speed. Connect the positive terminal of the external power supply to the anode wire and the cathode wire. Figure 1 , 4 As shown in Figure 6.

[0088] Step 2: Turn on the external power supply and control unit, set the current value, heating temperature, stirring speed and electroplating time, and then turn on the power to perform electroplating.

[0089] In the above embodiments, optionally, the composition of the plating solution is as follows: Ga 3+ with Ni 2+ The molar ratio is 1:1 to 5:1.

[0090] In the above embodiments, the current value can optionally be set as follows: 500~1500 mA.

[0091] In the above embodiments, optionally, the heating temperature is 30~50℃.

[0092] In the above embodiments, preferably, the stirring speed is 10~1000 rpm.

[0093] The dual-electrode rotating horizontal electroplating apparatus in this embodiment can produce plating thicknesses up to 120 mg cm. –2 The Ga-Ni alloy target was prepared with a dense, non-dendritic target layer, suitable for accelerator irradiation. The Ga content in the prepared Ga-Ni alloy target can reach over 70%.

[0094] Example 3: Production of Ge-68

[0095] This embodiment provides a method for producing Ge-68, comprising the following steps: irradiating a gallium-nickel alloy target prepared by the electroplating apparatus used in Example 1 for preparing gallium-nickel alloy targets with an accelerator, or irradiating a gallium-nickel alloy target prepared by the method for preparing gallium-nickel alloy targets in Example 2 with an accelerator, to obtain Ge-68.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electroplating apparatus for preparing gallium-nickel alloy targets, characterized in that, include: An electroplating tank, including an electroplating tank body, wherein the electroplating tank body is covered with heating elements. A stirring unit includes a servo motor, a motor drive shaft, a conductive slip ring, and a coaxial device. The conductive slip ring includes a conductive slip ring body and a conductive slip ring inner shaft. The conductive slip ring body is provided with an anode wire and a cathode wire. The conductive slip ring body is sleeved on the outside of the motor drive shaft. The conductive slip ring inner shaft is sleeved between the motor drive shaft and the conductive slip ring body. The coaxial device is sleeved on the outside of the motor drive shaft and located above the conductive slip ring body. An anode unit includes an anode fixing plate with an anode fixed laterally and an anode support plate connecting shaft. The anode is connected to an anode wire on the conductive slip ring body. The anode support plate connecting shaft is installed inside the inner shaft of the conductive slip ring and its lower end is fixed on the anode fixing plate. The anode fixing plate is rotatably installed laterally in the electroplating tank body under the drive of the anode support plate connecting shaft. The cathode unit includes a cathode target holder with a cathode target fixed laterally and a target electrode guide rod. The cathode target is connected to a cathode wire on the conductive slip ring body. The cathode target holder includes a cathode target holder body. The target electrode guide rod is installed on the inner side of the inner shaft of the conductive slip ring. The cathode target holder body is rotatably installed laterally in the electroplating tank body under the drive of the target electrode guide rod. The cathode unit also includes a cathode target support bracket and a cathode target support connecting rod. The lower end of the target electrode guide rod is fixed on the cathode target support bracket. The cathode target support bracket is connected to the cathode target support body through the cathode target support connecting rods on both sides. The cathode target is connected to the cathode wire on the conductive slip ring body through the cathode target support bracket, the cathode target support connecting rods at both ends, and the target electrode guide rod. The anode fixing plate is movable up and down and fixed on the cathode target support rod; The anode and the anode fixing plate are non-circular in shape; The cathode target is non-circular in shape.

2. The electroplating apparatus for preparing gallium-nickel alloy targets according to claim 1, characterized in that: The cathode target holder body is provided with a cathode wiring hole, and the cathode target is connected to the cathode wire on the conductive slip ring body through a screw in the cathode wiring hole.

3. The electroplating apparatus for preparing gallium-nickel alloy targets according to claim 2, characterized in that: The cathode target support hanger is provided with a through hole for the anode support plate connecting shaft to pass through, and the anode fixing plate is located below the cathode target support hanger and above the cathode target support; The anode fixing plate is provided with an anode wire hole, and the anode is connected to the anode wire on the conductive slip ring body by a wire passing through the anode wire hole and the anode support plate connecting shaft in sequence.

4. The electroplating apparatus for preparing gallium-nickel alloy targets according to claim 3, characterized in that: The target electrode guide rod is located outside the anode support plate connecting shaft; The anode support plate connecting shaft has external threads and is configured to rotate the anode support plate connecting shaft to move the anode fixing plate up and down.

5. The electroplating apparatus for preparing gallium-nickel alloy targets according to any one of claims 1-4, characterized in that: The electroplating tank also includes an electroplating tank cover plate. The top of the side wall of the electroplating tank body is provided with a groove for placing a sealing rubber ring. The electroplating tank cover plate is sealed to the electroplating tank body through the rubber ring. The electroplating tank cover plate is provided with a through hole for the anode support plate connecting shaft and the target electrode guide rod to pass through, and a rotating sealing ring that fits the bottom surface of the electroplating tank cover plate is provided outside the target electrode guide rod. The electroplating tank cover plate is provided with ventilation holes.

6. The electroplating apparatus for preparing gallium-nickel alloy targets according to any one of claims 1-4, characterized in that: The electroplating tank also includes an electroplating tank fixing device, which includes an upper retaining ring located above the electroplating tank body and a lower retaining ring located below the electroplating tank body. The upper retaining ring and the lower retaining ring are supported by a plurality of electroplating tank supports arranged around the electroplating tank body.

7. The electroplating apparatus for preparing gallium-nickel alloy targets according to claim 6, characterized in that: The servo motor is provided with a motor bracket below it, and the motor bracket is supported by a motor bracket support rod installed on a retaining ring on the electroplating tank; The conductive slip ring also includes a conductive slip ring anti-rotation plate and a conductive slip ring anti-rotation plate fixing plate. The conductive slip ring anti-rotation plate is located between the coaxial device and the conductive slip ring body. The conductive slip ring anti-rotation plate fixing plate fixes the conductive slip ring anti-rotation plate on the motor bracket support rod.

8. The electroplating apparatus for preparing gallium-nickel alloy targets according to any one of claims 1-4, characterized in that: The cathode target holder body is provided with a groove for placing the cathode target; The cathode target holder also includes a target holder cover plate that is sealed to the cathode target holder body. The target holder cover plate is provided with a groove for placing a fluororubber ring. The fluororubber ring is used to seal the cathode target. The cathode target holder body is provided with a cathode target sealing screw hole. The cathode target holder also includes a cathode target holder protective sleeve disposed outside the cathode target holder body. The bottom of the electroplating tank body is provided with a groove, and a concentric shaft matching the groove is provided below the cathode target holder protective sleeve.

9. A method for preparing a gallium-nickel alloy target, comprising the following steps: pouring a plating solution into an electroplating tank in an electroplating apparatus for preparing a gallium-nickel alloy target as described in any one of claims 1-8; turning on an external power supply and a control unit; setting a current value, a heating temperature, a stirring speed, and an electroplating time; rotating and stirring the anode and the cathode target simultaneously during electroplating; and obtaining a gallium-nickel alloy target on the surface of the cathode target after electroplating.

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