A method, apparatus and substrate for printing a circuit board without brush marks

Abstract

The embodiment of the present application provides a kind of circuit board printing method of brush mark, equipment and substrate, method includes the substrate with hole is carried out electroplating treatment, to the substrate after electroplating is carried out circuit production processing;The substrate provided with circuit is carried out anti-soldering super roughing pretreatment, the substrate after super roughing pretreatment is handled by ink first hole processing, first hole processing includes substrate is handled by ink coating and scraping flat processing;The substrate is handled by ink second hole processing, second hole processing includes substrate is handled by ink coating, the ink of the substrate after second hole processing is handled first baking treatment, substrate is handled by pressing flat, substrate is exposed, developed, second baking and UV treatment, obtain the substrate after printing.In the technical scheme of the present embodiment, in the anti-soldering processing, carry out second hole processing, ensure effective hole and can make that the surface of substrate is free of brush mark, solve the problem of appearance defect.

Description

Technical Field

[0001] The embodiments of the present invention relate to, but are not limited to, the field of chip testing, and particularly to a method, apparatus and substrate for printing circuit boards without brush marks. Background Technology

[0002] In the traditional electroplating + pre-plugging + circuit + solder mask process, the pre-plugging step requires multiple plugging of holes on the circuit board and the holes need to be coated. After the board is formed, air bubbles / voids are generated in the holes. Moreover, after multiple brushing and polishing in the pre-plugging step, brush marks are generated, resulting in poor appearance. Summary of the Invention

[0003] This invention provides a method, apparatus, and substrate for printing circuit boards without brush scratches, which can ensure that there are no air bubbles in the holes of the substrate and no brush scratches on the surface of the substrate, thus solving the problem of poor appearance.

[0004] To achieve the above objectives, the technical solution of this invention is implemented as follows:

[0005] In a first aspect, embodiments of the present invention provide a method for printing circuit boards without brush marks, the method comprising:

[0006] The substrate with holes is electroplated to obtain the electroplated substrate.

[0007] The electroplated substrate is subjected to circuit fabrication processing to obtain a substrate with circuits.

[0008] The substrate with the circuitry is subjected to a solder resist roughening pretreatment to obtain a substrate after roughening pretreatment.

[0009] The substrate after the ultra-roughening pretreatment is subjected to a first hole-filling process by applying ink to the substrate after the ultra-roughening pretreatment to obtain a substrate after the first hole-filling process. The first hole-filling process includes applying ink to the substrate after the ultra-roughening pretreatment and scraping the applied ink.

[0010] The substrate that has undergone the first hole-filling treatment is subjected to a second hole-filling treatment using the ink to obtain a substrate after the second hole-filling treatment. The second hole-filling treatment includes applying ink to the substrate after the first hole-filling treatment.

[0011] The ink on the substrate after the second hole-plugging treatment is subjected to a first baking treatment to obtain a substrate after ink curing treatment;

[0012] The substrate after ink curing is flattened to obtain a flattened substrate.

[0013] The flattened substrate is then exposed, developed, baked a second time, and UV treated to obtain the printed substrate.

[0014] In some optional embodiments, the step of performing circuit fabrication processing on the electroplated substrate to obtain a substrate with circuits includes:

[0015] The electroplated substrate is subjected to a third baking process to obtain a substrate after the third baking process.

[0016] The substrate after the third baking process is subjected to an outer layer circuit roughening process to obtain a roughened substrate.

[0017] The roughened substrate is subjected to outer layer circuit exposure treatment to obtain an exposed substrate.

[0018] The exposed substrate is subjected to outer layer DES processing to obtain a substrate with DES-processed lines.

[0019] In some optional embodiments, after performing outer layer DES processing on the exposed substrate to obtain a DES-processed substrate with lines, the method includes:

[0020] The substrate with the circuitry is subjected to AOI inspection to determine whether the circuitry on the substrate meets the preset circuitry requirements.

[0021] In some optional embodiments, the thickness of the electroplated substrate is greater than 0.2 mm, the diameter of the hole is less than 60 μm, and the aspect ratio of the diameter of the hole to the thickness of the substrate is 1:2.5.

[0022] In some optional embodiments, before electroplating the substrate with holes to obtain the electroplated substrate, the method further includes:

[0023] Obtain preset line information, including the location information of holes;

[0024] The substrate is punched according to the location information of the holes to obtain a substrate with holes.

[0025] In some optional embodiments, the step of flattening the substrate after ink curing to obtain a flattened substrate includes:

[0026] The substrate after ink curing is subjected to a first flattening process by a metal pressure plate to obtain a substrate after the first flattening process.

[0027] The substrate after the first flattening treatment is subjected to a second flattening treatment using a silicone pressure plate to obtain a flattened substrate.

[0028] In some optional embodiments, the ink performs a first via-plugging treatment on the substrate after the ultra-roughening pretreatment to obtain a substrate after the first via-plugging treatment, including:

[0029] A base plate is placed on the first side of the substrate after the pre-roughening treatment to cover all the holes in the substrate;

[0030] The second side of the substrate after the ultra-roughening pretreatment is coated with ink to fill the holes.

[0031] The extrusion unit is controlled to move towards the second surface, and the ink in the hole is extruded by the extrusion unit to expel the air in the hole. The extrusion unit includes a panel and protrusions on the panel corresponding to the holes on the substrate. The diameter of the protrusions is smaller than the diameter of the holes.

[0032] The extrusion unit is controlled to leave the substrate and a second ink coating process is performed on the second side of the substrate to obtain a substrate after the second ink coating process.

[0033] The substrate after the second ink coating process is subjected to ink scraping treatment to obtain the substrate after the first hole plugging treatment.

[0034] In some optional embodiments, the control extrusion unit moves toward the second surface, and the extrusion unit extrudes the ink in the holes to expel air from the holes, including:

[0035] Obtain the first height information and the thickness information of the substrate;

[0036] The second height information of the first photoelectric positioning unit is determined based on the first height information and the thickness information of the substrate, so that the first photoelectric positioning unit can be used to detect whether the protrusion of the extrusion unit reaches the second surface;

[0037] The third height information of the second photoelectric positioning unit is determined based on the preset first buffer distance information and the second height information, so that the second photoelectric positioning unit can be used to detect whether the protrusion of the extrusion unit reaches above the second surface;

[0038] The pressing unit connected to the extrusion unit is controlled to move downward at a first speed, so as to control the extrusion unit to move towards the second surface at the first speed;

[0039] When the second photoelectric positioning unit detects the protrusion, it controls the pressing unit to descend to the second speed, so as to control the squeezing unit to move toward the second surface at the second speed;

[0040] When the first photoelectric positioning unit detects the protrusion, the pressing unit is controlled to continue moving for a first preset time and then stop, so that the protrusion enters the hole corresponding to the protrusion, so that the extrusion unit can expel the ink in the hole and squeeze it to remove the air in the hole.

[0041] In a second aspect, embodiments of the present invention also provide a circuit board printing apparatus, a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the brushless abrasion-free circuit board printing method described in the first aspect.

[0042] Thirdly, embodiments of the present invention also provide a substrate, which is obtained by printing using the brushless abrasion-free circuit board printing method as described in the first aspect.

[0043] This invention provides a method, apparatus, and substrate for printing circuit boards without brush marks. The method includes electroplating a substrate with holes to obtain an electroplated substrate; performing circuit fabrication on the electroplated substrate to obtain a substrate with circuits; performing a solder resist roughening pretreatment on the substrate with circuits to obtain a roughened substrate; performing a first via-filling treatment on the roughened substrate with ink to obtain a first-via-filled substrate, the first via-filling treatment including applying ink to the roughened substrate and smoothing the applied ink; performing a second via-filling treatment on the first-via-filled substrate with ink to obtain a second-via-filled substrate, the second via-filling treatment including applying ink to the first-via-filled substrate; performing a first baking treatment on the ink on the second-via-filled substrate to obtain an ink-cured substrate; performing a flattening treatment on the ink-cured substrate to obtain a flattened substrate; and performing exposure, development, a second baking, and UV treatment on the flattened substrate to obtain a printed substrate. In the technical solution of this embodiment, the substrate after the ultra-roughening pretreatment is first coated with ink, and then the coated ink is scraped flat. The ink can fill the holes once. Then, the substrate after the first hole filling treatment is subjected to a second hole filling treatment. In this step, only the ink coating treatment is required, and the scraping treatment is not required. The second hole filling treatment can ensure that the holes of the substrate are filled and the surface of the substrate is free of brush scratches, which can solve the problem of poor appearance. Then, the substrate after the ink curing treatment is vacuum flattened, which can make the surface of the substrate smoother and further improve the flatness of the substrate. Attached Figure Description

[0044] Figure 1 A schematic diagram of a circuit board printing equipment provided in an embodiment of the present invention;

[0045] Figure 2 A flowchart of a method for printing circuit boards without brush marks provided in an embodiment of the present invention;

[0046] Figure 3 A flowchart of a method for printing a circuit board without brush marks according to an embodiment of the present invention;

[0047] Figure 4 A flowchart of a method for printing a circuit board without brush marks, provided in another embodiment of the present invention;

[0048] Figure 5 A flowchart of a method for printing a circuit board without brush marks, provided in another embodiment of the present invention. Detailed Implementation

[0049] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0050] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, or the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0051] In the traditional electroplating + pre-plugging + circuit + solder mask process, the pre-plugging step requires multiple plugging of holes on the circuit board and the holes need to be coated. After the board is formed, air bubbles / voids are generated in the holes. Moreover, after multiple brushing and polishing in the pre-plugging step, brush marks are generated, resulting in poor appearance.

[0052] To address the aforementioned problems, this embodiment provides a method, apparatus, and substrate for printing circuit boards without brush scratches. The method includes electroplating a substrate with holes to obtain an electroplated substrate; performing circuit fabrication on the electroplated substrate to obtain a substrate with circuits; performing a solder resist roughening pretreatment on the substrate with circuits to obtain a substrate with roughening pretreatment; and performing a first via-filling treatment on the substrate with roughening pretreatment using ink to obtain a substrate with first via-filling treatment. The first via-filling treatment includes... The substrate after the first hole-filling treatment is subjected to ink coating and the coated ink is smoothed. The substrate after the first hole-filling treatment is subjected to a second hole-filling treatment with ink to obtain a substrate after the second hole-filling treatment. The second hole-filling treatment includes ink coating on the substrate after the first hole-filling treatment. The ink on the substrate after the second hole-filling treatment is subjected to a first baking treatment to obtain a substrate after ink curing treatment. The substrate after ink curing treatment is subjected to vacuum flattening treatment to obtain a flattened substrate. The flattened substrate is subjected to exposure, development, second baking and UV treatment to obtain a printed substrate. In the technical solution of this embodiment, the substrate after the ultra-roughening pretreatment is first coated with ink, and then the coated ink is scraped flat. The ink can fill the holes once. Then, the substrate after the first hole filling treatment is subjected to a second hole filling treatment. In this step, only the ink coating treatment is required, and the scraping treatment is not required. The second hole filling treatment can ensure that the holes of the substrate are filled and the surface of the substrate is free of brush scratches, which can solve the problem of poor appearance. Then, the substrate after the ink curing treatment is vacuum flattened, which can make the surface of the substrate smoother and further improve the flatness of the substrate.

[0053] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0054] like Figure 1 As shown, Figure 1 This is a schematic diagram of a circuit board printing apparatus for performing a brushless abrasion-free circuit board printing method according to an embodiment of the present invention.

[0055] exist Figure 1 In this example, the circuit board printing equipment 100 is equipped with a processor 110 and a memory 120, wherein the processor 110 and the memory 120 can be connected via a bus or other means. Figure 1 Taking the example of a connection between China and Israel via a bus.

[0056] Memory 120, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory 120 may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory 120 may optionally include memory remotely located relative to processor 110.

[0057] The circuit board printing equipment may also include a drilling module, an electroplating module, a vacuum ink stirring module, a hole plugging module, a baking module, a vacuum flattening module, and exposure, development, and UV processing modules. The hole plugging module includes a first photoelectric positioning unit, a second photoelectric positioning unit, a pressing unit, a base plate, and an extrusion unit, etc. Each module in the circuit board printing equipment is electrically connected to the processor 110.

[0058] Those skilled in the art will understand that the circuit board printing equipment 100 can be applied to 5G communication network systems and subsequent mobile communication network systems, etc., and this embodiment does not specifically limit it.

[0059] It will be understood by those skilled in the art that Figure 1 The circuit board printing equipment 100 shown does not constitute a limitation on the embodiments of the present invention. It may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0060] Based on the aforementioned circuit board printing equipment, wherein the system platform architecture can be a controller set in the chip aging test equipment, various embodiments of the brushless abrasion-free circuit board printing method of the present invention are proposed below to solve the problems in the above embodiments.

[0061] like Figure 2 As shown, Figure 2 This is a flowchart of a method for printing a circuit board without brush marks according to an embodiment of the present invention. The method for printing a circuit board without brush marks according to the embodiment of the present invention is applied to a circuit board printing equipment. The method for printing a circuit board without brush marks may include, but is not limited to, steps S100 and S200.

[0062] Step S100: Electroplating is performed on the substrate with holes to obtain the electroplated substrate.

[0063] Specifically, the substrate to be processed is placed on the machine, its position is adjusted and fixed, and then the preset circuit information, including the position information of the holes, is obtained. Based on the position information of the holes, the substrate is drilled to obtain a substrate with holes. Then, the substrate with holes is electroplated to obtain an electroplated substrate.

[0064] It should be noted that the equipment used for drilling the substrate can be a laser drill or a drill bit. This embodiment does not specifically limit the equipment used, and the appropriate equipment can be selected based on the thickness of the substrate and the process requirements.

[0065] Step S200: Perform circuit fabrication processing on the electroplated substrate to obtain a substrate with circuits.

[0066] Specifically, the electroplated substrate undergoes circuit fabrication processing. First, the electroplated substrate undergoes a third baking process to obtain a substrate with the third baking process. Then, the substrate with the third baking process undergoes an outer layer line roughening process to obtain a roughened substrate. Next, the roughened substrate undergoes an outer layer line exposure process to obtain an exposed substrate. Finally, the exposed substrate undergoes outer layer line DES processing to obtain a DES-processed substrate with circuitry. It should be noted that, typically, after the DES processing, the substrate with circuitry also needs to undergo AOI inspection to ensure that the circuitry on the substrate meets the preset circuitry requirements.

[0067] It should be noted that the circuit can be made on one side or both sides, and this embodiment does not make a specific limitation on it.

[0068] Understandably, the electroplated substrate can be baked after pre-drying. When the electroplated substrate enters the oven, the blower should be turned on and the top exhaust vent should be opened to facilitate air circulation and expel humid air from the oven. The oven temperature and baking time will vary depending on the type of plating. The baking temperature of the electroplated substrate can be higher, but it should not be too high. Otherwise, if there are unwashed salt marks on the plating surface, scorching and discoloration will occur, which are difficult to clean. It is usually controlled at 100-120℃, and the baking time is about 10 minutes.

[0069] Understandably, DES processing involves continuous production of developing, etching, and stripping, which are key steps in circuit formation. Developing uses chemical methods to remove the unexposed dry film, exposing the copper to be etched. Etching uses chemical methods to etch away the copper exposed in the developing stage. Stripping uses strong alkali to remove the remaining dry film on the board surface, exposing the desired circuitry. After these three steps, a substrate with circuitry is obtained.

[0070] It should be noted that AOI (Automated Optical Inspection) processing uses imaging technology to output the reflected light intensity of a substrate with circuitry as a quantitative grayscale value. By comparing this grayscale value with that of a standard image, defects are analyzed, determined, and classified. AOI inspection mainly consists of four stages: image acquisition (optical scanning and data collection), data processing (data classification and conversion), image analysis (feature extraction and template comparison), and defect reporting (defect size and type classification, etc.). Through AOI inspection, problems such as open circuits, scratches, voids, and protrusions can be detected on substrates with circuitry.

[0071] Step S300: Perform solder resist roughening pretreatment on the substrate with circuits to obtain the substrate after roughening pretreatment.

[0072] Specifically, after obtaining the substrate with the circuitry, a solder resist roughening pretreatment is performed on the substrate to increase its surface roughness, thereby improving surface adhesion and ink bonding. It should be noted that the solder resist roughening pretreatment can be mechanical or chemical. Mechanical methods include grinding, brushing, and sandblasting, while chemical methods typically involve immersing the substrate with the circuitry in a roughening solution.

[0073] Step S400: The substrate after the ultra-roughening pretreatment is subjected to a first hole-filling treatment by ink to obtain a substrate after the first hole-filling treatment. The first hole-filling treatment includes applying ink to the substrate after the ultra-roughening pretreatment and scraping the applied ink.

[0074] Specifically, before the via plugging process, ink needs to be prepared. To prevent air bubbles from appearing in the ink after the plugging process, it is necessary to first ensure that the ink is free of air bubbles. The ink is stirred using a vacuum mixer, and then the ink obtained through vacuum stirring is used to perform the first via plugging process on the substrate after the ultra-roughening pretreatment. The substrate after ultra-roughening pretreatment is first coated with ink, and then the coated ink is smoothed to obtain the substrate after the first via plugging process. During the ink coating process, the ink flows from the substrate surface into the holes, thus plugging the vias. It should be noted that in addition to using a vacuum mixer to stir the ink, other non-vacuum methods can also be used to process the ink, and this embodiment does not specifically limit them.

[0075] Step S500: Perform a second hole-plugging process on the substrate that has undergone the first hole-plugging process using ink to obtain a substrate after the second hole-plugging process. The second hole-plugging process includes applying ink to the substrate after the first hole-plugging process.

[0076] Specifically, after completing the first via-filling process, a second via-filling process is required, using ink to coat the substrate. This second process only requires applying ink to the substrate; no smoothing process is needed. This second process ensures that the holes on the substrate are completely filled, resulting in a brush-scratched surface free of scratches and resolving aesthetic issues. Subsequently, vacuum flattening is performed on the substrate after ink curing to further smooth the surface and improve its flatness. It should be noted that the number of ink applications in the second via-filling process can be adjusted according to actual conditions.

[0077] In step S600, the ink on the substrate after the second hole-plugging treatment is subjected to a first baking treatment to obtain a substrate after ink curing treatment.

[0078] Specifically, after completing the secondary hole-filling process, the holes can be well plugged. At this time, the ink on the substrate after the second hole-filling process is subjected to the first baking process. The first baking process is a pre-baking process, which is used to dry the solvent in the solder resist ink and harden the ink for exposure. After the pre-baking process, the substrate after ink curing can be obtained.

[0079] Step S700: Flatten the substrate after ink curing to obtain a flattened substrate.

[0080] Specifically, if the ink on the substrate after pre-baking and curing is not fully cured, the substrate after ink curing is flattened to improve the flatness of the ink surface and effectively reduce the potential air bubble problem that may occur when the ink is fully cured later. It should be noted that the flattening process can be vacuum flattening or non-vacuum flattening; this embodiment does not specifically limit it.

[0081] In step S800, the flattened substrate is exposed, developed, baked a second time, and UV treated to obtain the printed substrate.

[0082] Specifically, the flattened substrate is exposed, developed, baked a second time, and UV treated to complete the solder resist process, which exposes the areas that need to be soldered and completely cures the ink to obtain the printed substrate.

[0083] In some optional embodiments, the ink is obtained by vacuum stirring, which ensures that the bubble problem is not due to the ink itself. Then, the ink obtained by vacuum stirring is used to perform a first hole-filling treatment on the substrate after the ultra-roughening pretreatment. The substrate after the ultra-roughening pretreatment is first coated with ink, and then the coated ink is smoothed. The ink can complete the hole filling once. Then, the substrate after the first hole-filling treatment is subjected to a second hole-filling treatment. In this step, only the ink coating treatment is required, and the smoothing treatment is not required. The second hole-filling treatment can ensure that the holes of the substrate are filled and the surface of the substrate is free of brush scratches, which can solve the problem of poor appearance. Finally, the substrate after the ink curing treatment is vacuum flattened, which can make the substrate surface smoother and further improve the flatness of the substrate.

[0084] In some optional embodiments, when the thickness of the electroplated substrate is greater than 0.2 mm, the diameter of the holes is less than 60 μm, and the aspect ratio of the hole diameter to the substrate thickness is 1:2.5, the substrate with holes is electroplated to obtain an electroplated substrate; the electroplated substrate is then subjected to circuit fabrication processing to obtain a substrate with circuits; the substrate with circuits is subjected to solder resist roughening pretreatment to obtain a substrate with roughening pretreatment; and ink obtained by vacuum stirring is used to perform a first hole-filling treatment on the substrate with roughening pretreatment to obtain a substrate with first hole-filling treatment. The first hole-filling treatment includes... The substrate after roughening pretreatment undergoes ink coating and ink smoothing. Ink obtained through vacuum stirring is used to perform a second hole-filling treatment on the substrate after the first hole-filling treatment, resulting in a substrate with the second hole-filling treatment. The second hole-filling treatment includes ink coating on the substrate after the first hole-filling treatment. The ink on the substrate after the second hole-filling treatment undergoes a first baking treatment, resulting in a substrate with ink curing. The substrate with ink curing undergoes vacuum flattening, resulting in a flattened substrate. The flattened substrate undergoes exposure, development, a second baking, and UV treatment to obtain the printed substrate. In this embodiment, two different hole-filling treatments ensure that the holes on the substrate are completely filled, and the substrate surface is free of brush scratches, solving the problem of poor appearance. Then, by performing vacuum flattening on the substrate after ink curing, the substrate surface becomes even smoother, further improving the flatness of the substrate.

[0085] like Figure 3 As shown, Figure 3 This is a flowchart of a method for printing a circuit board without brush marks, according to another embodiment of the present invention. Step S700 of this method may include, but is not limited to, steps S310 and S320.

[0086] Step S310: The substrate after ink curing is subjected to a first flattening process by a metal pressure plate to obtain a substrate after the first vacuum flattening process.

[0087] Step S320: The substrate after the first flattening treatment is subjected to a second flattening treatment using a silicone pressure plate to obtain a flattened substrate.

[0088] Specifically, the substrate after ink curing is first flattened using a metal platen to obtain a first flattened substrate. Then, a silicone platen is used to flatten the first flattened substrate to obtain a second flattened substrate. The metal platen is usually made of stainless steel and does not have resilience. The pressure used for the first flattening of the substrate after ink curing using the metal platen is set as the first pressure. Since the silicone material of the silicone platen has a certain degree of resilience, a second pressure greater than the first pressure is needed when flattening the substrate to ensure the flattening effect and reduce the problem of ink bubbles. To increase the second pressure, an air tank can be added to the pressure arm to increase its capacity.

[0089] like Figure 4 As shown, Figure 4 This is a flowchart of a method for printing a circuit board without brush marks, provided in another embodiment of the present invention. Step S400 of this method for printing a circuit board without brush marks may include, but is not limited to, steps S410, S420, S430, S440, and S450.

[0090] Step S410: Place a base plate on the first side of the substrate after the ultra-roughening pretreatment to cover all the holes in the substrate.

[0091] Step S420: Apply ink to the second side of the substrate after the ultra-roughening pretreatment to fill the holes with ink.

[0092] Step S430: Control the extrusion unit to move to the second surface. The extrusion unit extrudes the ink in the hole to expel the air in the hole. The extrusion unit includes a panel and protrusions on the panel corresponding to the holes on the substrate. The diameter of the protrusions is smaller than the diameter of the holes.

[0093] Step S440: Control the extrusion unit to leave the substrate and perform a second ink coating process on the second side of the substrate to obtain a substrate after the second ink coating process.

[0094] Step S450: Perform ink smoothing treatment on the substrate after the second ink coating treatment to obtain the substrate after the first hole plugging treatment.

[0095] In some optional embodiments, a base plate is placed on the first side of the substrate after the ultra-roughening pretreatment to cover one side opening of all the holes in the substrate. Then, ink obtained by vacuum stirring is applied to the second side of the substrate after the ultra-roughening pretreatment to fill the holes. After the holes are filled with ink, an extrusion unit is moved to the second side to expel the ink in the holes and remove air. The extrusion unit includes a panel and protrusions on the panel corresponding to the holes on the substrate. The diameter of the protrusions is smaller than the diameter of the holes. The protrusions in the extrusion unit expel the ink in the holes corresponding to the protrusions, causing some of the ink to overflow and thus removing air from the holes. Then, the extrusion unit is moved away from the substrate and a second ink coating is applied to the second side of the substrate. The second ink coating ensures that the holes are filled with ink, resulting in a substrate after the second ink coating. The substrate after the second ink coating is then subjected to an ink smoothing process to obtain a substrate after the first hole-filling process. The extrusion unit effectively prevents air bubbles from forming in the holes during the ink filling process.

[0096] It should be noted that the diameter of the protrusion can be set to 75%-90% of the diameter of the hole. For example, the diameter of the protrusion is 85% of the diameter of the hole, or the diameter of the protrusion is 90% of the diameter of the hole. This embodiment does not impose a specific limitation on it, and it can be set according to the actual situation.

[0097] like Figure 5 As shown, Figure 5 This is a flowchart of a method for printing a circuit board without brush marks, provided in another embodiment of the present invention. Step S430 of this method for printing a circuit board without brush marks may include, but is not limited to, steps S510, S520, S530, S540, S550, and S560.

[0098] Step S510: Obtain the first height information and thickness information of the substrate;

[0099] Step S520: Determine the second height information of the first photoelectric positioning unit based on the first height information and the thickness information of the substrate, so that the first photoelectric positioning unit can be used to detect whether the protrusion of the extrusion unit reaches the second surface;

[0100] Step S530: Determine the third height information of the second photoelectric positioning unit based on the preset first buffer distance information and second height information, so that the second photoelectric positioning unit can be used to detect whether the protrusion of the extrusion unit reaches the top of the second surface.

[0101] Step S540: Control the pressing unit connected to the extrusion unit to move downward at a first speed, so as to control the extrusion unit to move towards the second surface at a first speed;

[0102] In step S550, when the second photoelectric positioning unit detects the protruding post, the pressing unit is controlled to descend to the second speed so as to control the extrusion unit to move towards the second surface at the second speed.

[0103] In step S560, when the first photoelectric positioning unit detects the protrusion, the pressing unit is controlled to continue moving for a first preset time and then stop, so that the protrusion enters the hole corresponding to the protrusion, so that the ink in the hole is squeezed by the extrusion unit to expel the air in the hole.

[0104] Specifically, when the ink in the holes on the substrate has been filled, to prevent air bubbles from forming during the filling process, an extrusion unit is used to expel the ink from the holes. First, the first height information and thickness information of the substrate are acquired. Then, based on these information, the second height information of the first photoelectric positioning unit is determined, enabling the first photoelectric positioning unit to detect whether the protrusion of the extrusion unit reaches the second surface. Specifically, if the protrusion descends to the height of the second surface, the first photoelectric positioning unit generates a detection signal. The height of the second surface is equal to the first height information plus the thickness information. Then, based on the preset first buffer distance information and the second height information, the third height information of the second photoelectric positioning unit is determined, enabling the second photoelectric positioning unit to detect whether the protrusion of the extrusion unit reaches the second surface. The electric positioning unit can detect whether the protrusion of the extrusion unit has reached the top of the second surface. The third height information is the second height information plus the first buffer distance information. After determining and adjusting the positions of the first photoelectric positioning unit and the second photoelectric positioning unit, the pressing unit connected to the extrusion unit can be controlled to move downward at a first speed to control the extrusion unit to move towards the second surface at a first speed. Then, when the second photoelectric positioning unit detects the protrusion, the pressing unit is controlled to descend to a second speed to control the extrusion unit to move towards the second surface at a second speed. Then, when the first photoelectric positioning unit detects the protrusion, the pressing unit is controlled to continue moving for a first preset time and then stop, so that the protrusion enters the hole corresponding to the protrusion, so that the ink in the hole is squeezed by the extrusion unit to expel the air in the hole. In this embodiment, by controlling the downward movement of the pressing unit at a first speed, the extrusion unit can quickly reach the third height information. Then, to accurately extrude the ink in the hole, the downward speed needs to be adjusted to a second speed lower than the first speed. After the first photoelectric positioning unit detects the protrusion, the pressing unit continues to move for a first preset time and then stops. This allows for precise control of the depth to which the protrusion enters the hole, thereby effectively extruding the ink. It should be noted that, after the first photoelectric positioning unit detects the protrusion, a third speed, even lower than the second speed, can be further adjusted according to actual conditions to improve precision control.

[0105] In addition, one embodiment of the present invention provides a circuit board printing apparatus, the apparatus including: a memory, a processor, and a computer program stored in the memory and executable on the processor.

[0106] The processor and memory can be connected via a bus or other means.

[0107] It should be noted that the computer in this embodiment may correspond to including, for example, the following: Figure 1 The memory and processor in the illustrated embodiment can constitute Figure 1 The system architecture platform shown in the embodiment is part of the same inventive concept, and therefore has the same implementation principle and beneficial effects, which will not be described in detail here.

[0108] The non-transient software program and instructions required to implement the brushless abrasion-free circuit board printing method of the above embodiments are stored in memory. When executed by a processor, the brushless abrasion-free circuit board printing method of the above embodiments is executed, for example, the method described above is executed. Figure 2 Method steps S100 to S800 Figure 3 Method steps S310 to S320 in the text Figure 4 Method steps S510 to S550 in the text Figure 4 Method steps S510 to S560.

[0109] In addition, one embodiment of the present invention provides a substrate that is printed by a brushless abrasion-free circuit board printing method as described in the above embodiments. This substrate can produce the beneficial effects achieved in the above embodiments, which will not be described in detail here.

[0110] Furthermore, one embodiment of the present invention provides a computer-readable storage medium storing computer-executable instructions that, when used to execute the brushless abrasion-free circuit board printing method of the controller described above, for example, to perform the above-described... Figure 2 Method steps S100 to S800 Figure 3 Method steps S310 to S320 in the text Figure 4 Method steps S510 to S550 in the text Figure 4 Method steps S510 to S560.

[0111] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0112] The above provides a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of the present invention.

Claims

1. A method for printing circuit boards without brush marks, characterized in that, The method includes: The substrate with holes is electroplated to obtain the electroplated substrate. The electroplated substrate is subjected to circuit fabrication processing to obtain a substrate with circuits. The substrate with the circuitry is subjected to a solder resist roughening pretreatment to obtain a substrate after roughening pretreatment. The substrate after the ultra-roughening pretreatment is subjected to a first hole-filling process by applying ink to the substrate after the ultra-roughening pretreatment, and the substrate after the first hole-filling process is obtained. The first hole-filling process includes applying ink to the substrate after the ultra-roughening pretreatment and scraping the applied ink. The substrate that has undergone the first hole-filling treatment is subjected to a second hole-filling treatment using the ink to obtain a substrate after the second hole-filling treatment. The second hole-filling treatment includes applying ink to the substrate after the first hole-filling treatment. A base plate is placed on the first side of the substrate after the pre-roughening treatment to cover all the holes in the substrate; The second side of the substrate after the ultra-roughening pretreatment is coated with ink to fill the holes. Obtain the first height information and the thickness information of the substrate; The second height information of the first photoelectric positioning unit is determined based on the first height information and the thickness information of the substrate, so that the first photoelectric positioning unit can be used to detect whether the protrusion of the extrusion unit reaches the second surface; The third height information of the second photoelectric positioning unit is determined based on the preset first buffer distance information and the second height information, so that the second photoelectric positioning unit can be used to detect whether the protrusion of the extrusion unit reaches above the second surface; The pressing unit connected to the extrusion unit is controlled to move downward at a first speed, so as to control the extrusion unit to move towards the second surface at the first speed; When the second photoelectric positioning unit detects the protrusion, it controls the pressing unit to descend to the second speed, so as to control the squeezing unit to move toward the second surface at the second speed; When the first photoelectric positioning unit detects the protrusion, the pressing unit is controlled to continue moving for a first preset time and then stop, so that the protrusion enters the hole corresponding to the protrusion, so that the extrusion unit can expel the ink in the hole by squeezing the extrusion unit to expel the air in the hole. The extrusion unit includes a panel and a protrusion disposed on the panel corresponding to the hole on the substrate. The diameter of the protrusion is smaller than the diameter of the hole. The extrusion unit is controlled to leave the substrate and a second ink coating process is performed on the second side of the substrate to obtain a substrate after the second ink coating process. The substrate after the second ink coating process is subjected to an ink scraping process to obtain the substrate after the first hole plugging process. The substrate after ink curing is flattened to obtain a flattened substrate. The flattened substrate is then exposed, developed, baked a second time, and UV treated to obtain the printed substrate.

2. The method according to claim 1, characterized in that, The step of processing the electroplated substrate to obtain a substrate with circuitry includes: The electroplated substrate is subjected to a third baking process to obtain a substrate after the third baking process. The substrate after the third baking process is subjected to an outer layer circuit roughening process to obtain a roughened substrate. The roughened substrate is subjected to outer layer circuit exposure treatment to obtain an exposed substrate. The exposed substrate is subjected to outer layer DES processing to obtain a substrate with DES-processed lines.

3. The method according to claim 2, characterized in that, After performing outer layer line DES processing on the exposed substrate to obtain a DES-processed substrate with lines, the method includes: The substrate with the circuitry is subjected to AOI inspection to determine whether the circuitry on the substrate meets the preset circuitry requirements.

4. The method according to claim 1, characterized in that, The thickness of the electroplated substrate is greater than 0.2 mm, the diameter of the hole is less than 60 μm, and the aspect ratio of the diameter of the hole to the thickness of the substrate is 1:2.

5.

5. The method according to claim 1, characterized in that, Before electroplating the substrate with holes to obtain the electroplated substrate, the method further includes: Obtain preset line information, including the location information of holes; The substrate is punched according to the location information of the holes to obtain a substrate with holes.

6. The method according to claim 1, characterized in that, The step of flattening the substrate after ink curing to obtain a flattened substrate includes: The substrate after ink curing is subjected to a first flattening process by a metal pressure plate to obtain a substrate after the first flattening process. The substrate after the first flattening treatment is subjected to a second flattening treatment using a silicone pressure plate to obtain a flattened substrate.

7. A circuit board printing equipment, characterized in that, The invention includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the brushless abrasion-free circuit board printing method according to any one of claims 1 to 6.

8. A substrate, characterized in that, The substrate is printed by the brushless abrasion-free circuit board printing method as described in any one of claims 1 to 6.

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