An optical module pin cap assembly device
By designing an optical module pin cap assembly device and using automated equipment for the transportation, testing, and installation of electronic components, the problems of low efficiency and unstable quality caused by manual operation were solved, and efficient and accurate optical module assembly was achieved.
Patent Information
- Application Number
- CN202310538040.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-05-13
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2043-05-13
AI Technical Summary
In the existing technology, the testing and assembly of circuit boards and electronic components of optical modules mainly rely on manual operation, which results in a large workload, long time consumption and easy errors, affecting production efficiency and quality.
Design a device for assembling optical module pin caps, including a material picking component, a clamping mechanism, an electric slide table, and a detection device, to realize the automated transportation, detection, and installation of electronic components. The material picking component consists of an mounting block, a slide rail, a suction nozzle, and a negative pressure fan. The clamping mechanism consists of a sliding block, a suction nozzle, a separation component, etc., and works in conjunction with the detection device for automated operation.
It improves the efficiency and quality of optical module assembly, reduces human error rate, achieves efficient electronic component screening and assembly, and has high automation and high precision.
Smart Images

Figure CN116586933B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of optical module production, and in particular to an optical module pin cap assembling device. BACKGROUND
[0002] The optical module is a carrier for transmission between a switch and equipment, is more efficient and secure than a transceiver, and has a wide application in the field of signal transmission.
[0003] A related art optical module 1 is designed, referring to Figure 1 comprises a circuit board 11 and a plurality of electronic components 12, the electronic component 12 comprises an end portion 121 and four pins 122 connected to the bottom wall of the end portion 121, the diameter of the end portion 121 away from one end of the pin 122 is smaller than the diameter close to one end of the pin 122, the circuit board 11 is provided with a plurality of insertion holes 111 along the thickness direction, the pin 122 of the electronic component 12 passes through the insertion hole 111, and the end portion 121 of the electronic component 12 abuts against the surface of the circuit board 111; the process of installing the electronic component 12 and the circuit board 111 is called cap, in the process of installing the electronic component 12 and the circuit board 11, the quality of the electronic component 12 is detected in advance, and the four pins 122 of the same electronic component 12 need to be separated before the pin 122 passes through the insertion hole 111, so as to avoid the folding of the pin 122, so as to ensure the assembly quality of the optical module 1.
[0004] In view of the related art in the above, the detection and assembly of the circuit board 11 and the electronic component 12 in the prior art are usually performed manually, and the number of electronic components 12 required to be installed on the same circuit board 11 is large, the labor amount of the detection, installation and other processes of the electronic component 12 is large, the manual assembly takes a long time, and errors are prone to occur, which affects the production efficiency and production quality of the optical module 1, and therefore needs to be improved. SUMMARY
[0005] In order to improve the assembly efficiency and assembly quality of the circuit board and the electronic component, the application provides an optical module pin cap assembling device.
[0006] The optical module pin cap assembling device provided by the application adopts the following technical scheme:
[0007] The utility model provides a kind of optical module pin cap assembly device, including workbench, the workbench surface is provided with electronic piece carrier and circuit board carrier, temporary placement table is arranged between the electronic piece carrier and circuit board carrier, the workbench surface is further provided with electric slide, the electric slide is slidably connected with material taking assembly and clamping mechanism, the material taking assembly is used to transport electronic piece from electronic piece carrier to temporary placement table, the clamping mechanism is used to clamp electronic piece after being installed on the surface of circuit board from temporary placement table, the workbench surface is provided with detection device for quality detection of the electronic piece on the surface of temporary placement table.
[0008] By adopting the above technical scheme, before the installation process is carried out, a plurality of electronic components are placed in the electronic component carrier, the electronic components are taken out from the electronic component carrier by the operation of the material taking assembly, and are transported along the direction of the electric slide, so that the electronic components are placed on the surface of the temporary placement table. After detection by the detection device, the electronic components that meet the quality requirements will be further clamped by the clamping mechanism and transported towards the circuit board carrier. The clamping mechanism will separate the pins of the electronic components, so as to avoid excessive gathering of the pins of the electronic components. After separation, the clamping mechanism will install the electronic components with separated pins on the surface of the circuit board carrier, so that the pins can be inserted into the insertion holes to complete the cap installation process. The material taking assembly, clamping mechanism, electric slide and detection device provided in the utility model have high automation capability, and can replace manual transportation, detection and installation of electronic components. The problem of increasing manual error rate after long-time continuous work due to large number of electronic components is solved, and the efficiency of optical module assembly is improved.
[0009] Preferably, the material taking assembly includes a mounting block, a first slide rail, a bearing plate, a first drive, a first suction nozzle and a first negative pressure fan. The mounting block is slidably connected to the electric slide. The first slide rail is connected to the side wall of the mounting block. The first slide rail is arranged in the vertical direction. The bearing plate is slidably connected to the first slide rail. The first drive is arranged on the side wall of the mounting block. The first drive drives the bearing plate to move along the length direction of the first slide rail. The first suction nozzle is arranged on the side wall of the bearing plate. The first negative pressure fan is arranged on the side wall of the mounting block. The first negative pressure fan is in communication with the first suction nozzle through a hose.
[0010] By adopting the technical scheme, the first driving member is started, the first driving member drives the bearing plate and the first suction nozzle to move along the length direction of the first sliding rail, so that the first suction nozzle can be moved above the electronic component platform, the first negative pressure fan is started, the air inside the first suction nozzle is sucked away through the hose, so that a negative pressure is generated inside the first suction nozzle, at this time, the end of the electronic component can be sucked into the first suction nozzle, when the mounting block slides on the electric sliding table, the first suction nozzle and the electronic component inside the first suction nozzle can be driven to move towards the temporary placement table, for inspection by the detection device; the material taking assembly is arranged, automatic material taking and conveying of the electronic component can be realized, assembly of the electronic component is more orderly and normative, and high convenience and practicality are achieved.
[0011] Preferably, the clamping mechanism comprises a sliding block, a second sliding rail, a working plate, a second driving member, a second suction nozzle, a second negative pressure fan and a separation assembly, the sliding block is slidingly connected to the electric sliding table, the second sliding rail is arranged on the side wall of the sliding block, the second sliding rail is arranged in the vertical direction, the working plate is slidingly connected to the second sliding rail, the second driving member is connected to the side wall of the sliding block, the second driving member drives the working plate to slide along the length direction of the second sliding rail, the second suction nozzle is arranged on the side wall of the working plate, the second negative pressure fan is arranged on the surface of the side wall of the sliding block, the second negative pressure fan is communicated with the second suction nozzle through the hose, and the separation assembly is arranged on the side wall of the sliding block.
[0012] By adopting the technical scheme, the sliding block slides towards the temporary placement table through the electric sliding table, the second driving member is started, so that the second suction nozzle can be close to the temporary placement table, the second negative pressure fan is started to suck away the air inside the second suction nozzle, so that a negative pressure environment is formed in the second suction nozzle, so that the end of the electronic component is sucked into the second suction nozzle; after the adsorption is completed, the sliding block moves towards the direction of the circuit board platform through the electric sliding table, the separated pins of the sucked electronic component are separated through the separation assembly, the separated pins of the clamped electronic component are aligned with the plug-in holes of the circuit board after the pin separation is completed, and the cap process of the electronic component is completed. The clamping mechanism arranged in the application can convey, install and separate the pins of the electronic component before installation, compared with manual operation, the efficiency is higher and the failure rate is smaller, so that the working efficiency and the assembly quality of the optical module can be effectively improved.
[0013] Preferably, the separating assembly comprises a fixed block, a power piece, two clamping heads, a lifting piece, a connecting plate, two moving cylinders and two tooth-shaped separating parts, the clamping head, the moving cylinder and the tooth-shaped separating part are one-to-one corresponding; the fixed block is connected to the side wall of the workbench, the two clamping heads are slidably connected to the fixed block, the power piece is connected to the fixed block, the power piece drives the two clamping heads to move in the opposite or similar direction, the second suction nozzle is located between the two clamping heads, the lifting piece is arranged on the bottom wall of the sliding block, the connecting plate is connected to the lifting piece, the lifting piece drives the connecting plate to lift, one of the moving cylinders is connected to the bottom wall of one end of the connecting plate, the other moving cylinder is connected to the bottom wall of the other end of the connecting plate, the moving rods of the two moving cylinders are arranged towards the corresponding clamping head, and the tooth-shaped separating part is connected to the end wall of the piston rod of the corresponding moving cylinder.
[0014] By adopting the above technical scheme, when the second suction nozzle sucks the electronic component, the pins of the electronic component are still exposed to the second suction nozzle. The power piece is started, the power piece drives the two clamping heads to move towards each other, and the pins of the electronic component are located between the two clamping heads, and the end of the electronic component abuts against the top wall of the clamping head. The moving piece is started, the corresponding tooth-shaped separating part is driven to move towards the corresponding clamping head, the end of the tooth-shaped separating part is a tooth-shaped opening for the pins to enter, when the two tooth-shaped separating parts are close, the four pins of the electronic component can be clamped into different tooth-shaped openings. The lifting piece is started, the connecting plate and the tooth-shaped separating part are moved in the vertical direction, so that the four pins of the electronic component can be separated from each other to avoid gathering and affecting the normal operation of the electronic component. Since the electronic component has a small volume, manual separation of the pins requires a long time. By arranging the separating assembly in the clamping mechanism, the pins of the electronic component can be separated while the electronic component is transported, further saving assembly time and improving the assembly efficiency and quality of the optical module.
[0015] Preferably, the workbench surface is provided with two groups of linear modules, the movement direction of the linear module is perpendicular to the movement direction of the electric sliding table, the electronic component carrier is slidably connected to one group of linear modules, and the circuit board carrier is slidably connected to the other group of linear modules.
[0016] By adopting the above technical scheme, the linear module is arranged, and under the drive of the electric sliding table, the first sliding rail or the second sliding rail, the first suction nozzle relative to the electronic component carrier and the second suction nozzle relative to the circuit board carrier can realize movement in three directions of XYZ axis, improving the flexibility of the present application. The activity range of the first suction nozzle and the second suction nozzle is increased, the number of electronic components that can be placed on the electronic component carrier and the size of the circuit board are also increased, so that the optical module pin cap assembly device of the present application can have more extensive applicability.
[0017] Preferably, the temporary placement table comprises a driving motor and a placement disc, the driving motor is arranged on the surface of the workbench, the placement disc is connected with the output shaft of the driving motor, and the placement disc is provided with a placement hole penetrating through in the thickness direction for the pin of the electronic component to pass through.
[0018] By adopting the above technical scheme, the driving motor drives the placement disc to rotate, so that the electronic component placed by the material taking assembly can rotate towards the direction of the detection device, and after detection, it can rotate towards the direction of the clamping mechanism, so that the transportation and detection process of the electronic component are more orderly, and the working efficiency of the assembling device is improved.
[0019] Preferably, the detection device comprises a detector, a camera, a fixing frame and a reflecting mirror, the detector is arranged on the surface of the workbench, the camera is connected to one end of the detector away from the workbench, the camera is controlled by the detector, the lens of the camera is arranged towards the direction of the placement disc, the fixing frame is arranged on the surface of the workbench, the fixing frame is located between the detector and the temporary placement table, the reflecting mirror is connected with the fixing frame, and the reflecting mirror reflects the picture of the bottom wall of the placement disc to the lens of the camera.
[0020] By adopting the above technical scheme, the lens of the camera is arranged towards the surface of the placement disc, so that the camera can take a picture of the end part of the electronic component exposed outside the placement hole, and through the picture reflection of the reflecting mirror, the camera can also obtain the picture of the pin of the electronic component located below the placement disc. By transmitting the picture to the detector, the detector will detect the electronic component on the surface of the temporary placement table through the related parameters of the qualified electronic component pre-set in the controller, so as to ensure the quality of the electronic component assembled with the circuit board, and compared with the manual visual observation method, this detection method has higher accuracy.
[0021] Preferably, a plurality of placement holes are arranged, the diameter of the placement hole is greater than the diameter of the end part of the electronic component, each placement hole is provided with a supporting assembly, and the supporting assembly is used to prevent the electronic component from falling off from the placement hole; the side of the temporary placement table close to the electronic component loading table is provided with a first waste groove, the first waste groove is used to place the electronic component with the end part capable of passing through the supporting assembly, and the side of the temporary placement table close to the circuit board loading table is provided with a second waste groove, and the second waste groove is used to place the electronic component that does not pass the detection of the detection device.
[0022] Through the above technical scheme, when the material taking assembly transports the electronic component to the temporary placing table, the pin of the electronic component is placed against the placing hole, and the end of the electronic component will not pass through the supporting assembly due to the blocking of the supporting assembly to wait for the detection of the detection device, if the end of the electronic component is far away from the standard, the end of the electronic component will fall off from the supporting assembly and enter the first waste groove; the electronic component that has passed the detection and is determined to be unqualified will be rotated to above the second waste groove with the placing disc, and after the supporting assembly is started, the placing hole is fully exposed, and the unqualified electronic component will also pass through the placing hole and enter the second waste groove, so that efficient screening of the electronic component is realized, and high convenience and practicality are achieved.
[0023] Preferably, the supporting assembly comprises two limiting blocks, two guide columns, two reset members, a separation air bag and an inflator, the limiting block, the guide column and the reset member are one-to-one corresponding; the placing hole is provided with a gap slot for embedding and sliding of the limiting block, the guide column is connected to the side of the corresponding limiting block away from the other limiting block, the inner wall of the gap slot is provided with a limiting hole for inserting and sliding of the guide column, the reset member is connected with the corresponding limiting block, the reset member drives the two limiting blocks to move towards each other, the side walls of the two limiting blocks approaching each other are provided with separation grooves, one end of the separation air bag is arranged in one side separation groove, the other end is arranged in the other side separation groove, the inflator is arranged on the surface of the placing disc, and the inflator is communicated with the separation air bag.
[0024] Through the above technical scheme, the inflator is started to inflate towards the inside of the separation air bag, the separation air bag is inflated, so as to push the two limiting blocks away from each other, at this time, the limiting block slides along the gap slot, the guide column is inserted into the limiting hole, and the reset member is compressed to accumulate elastic potential energy, as the distance between the two limiting blocks becomes larger, the placing hole is exposed, and the unqualified electronic component also falls off from the placing hole and enters the second waste groove, so that automatic screening of the electronic component with unqualified quality is realized, the efficiency of the detection process is improved, the accuracy of detection is ensured, and the assembly quality of the optical module is improved.
[0025] Preferably, the first waste groove is provided with a first guide surface, the second waste groove is provided with a second guide surface, and the height of the bottom wall of the first guide surface and the second guide surface close to the end of the temporary placing table is higher than the height of the bottom wall away from the end of the temporary placing table.
[0026] By adopting the above technical scheme, the first guide surface and the second guide surface are respectively arranged on the bottom walls of the first waste tank and the second waste tank, so that after the unqualified electronic components are recovered by the first waste tank and the second waste tank, the electronic components can slide in the direction of the first guide surface or the second guide surface, thereby moving away from the temporary placement table. The electronic components entering the first waste tank or the second waste tank are all located below the temporary placement table, which is easy to fall off from the first waste tank or the second waste tank, causing the electronic components to accumulate and affecting the normal rotation of the placement disc. The problem is effectively improved, and the device has high practicability and safety.
[0027] In summary, the present application has at least one of the following beneficial technical effects:
[0028] 1. The present application has high automation capability by setting the material taking assembly, the clamping mechanism, the electric sliding table and the detection device, which can replace manual transportation, detection and installation of electronic components. The problem of rising manual error rate after long-time continuous work due to large number of electronic components, affecting the efficiency and quality of optical module assembly is improved, and the efficiency of optical module assembly is improved.
[0029] 2. The support assembly, the detection device and the temporary placement table are matched with each other, so that the optical module pin cap assembly device of the present application can efficiently screen unqualified electronic components. Compared with manual detection, the device has higher convenience and accuracy, which helps to save working time and improve assembly efficiency and assembly quality. BRIEF DESCRIPTION OF DRAWINGS
[0030] Figure 1 is a structure diagram of an optical module in the related art.
[0031] Figure 2 is a structure diagram of an optical module pin cap assembly device of embodiment 1 of the present application.
[0032] Figure 3 is Figure 2 is a local enlarged view of A in
[0033] Figure 4 is Figure 2 is a local enlarged view of B in
[0034] Figure 5 is a structure diagram of a temporary placement table of embodiment 2 of the present application.
[0035] Figure 6 is a structure diagram of a support assembly of embodiment 2 of the present application.
[0036] Explanation of reference signs: 1, optical module; 11, circuit board; 111, plug hole; 12, electronic component; 121, end; 122, pin; 2, workbench; 21, electric sliding table; 22, detection device; 221, detector; 222, camera; 223, fixing frame; 224, refracting mirror; 23, linear module; 3, electronic component platform; 4, circuit board platform; 5, temporary placement table; 51, driving motor; 52, placement disc; 521, placement hole; 522, position-giving groove; 523, limiting hole; 53, first waste groove; 531, first guide surface; 54, second waste groove; 541, second guide surface; 6, material taking assembly; 61, mounting block; 62, first sliding rail; 63, bearing plate; 64, first driving piece; 65, first suction nozzle; 66, first negative pressure fan; 7, clamping mechanism; 71, sliding block; 72, second sliding rail; 73, work plate; 74, second driving piece; 75, second suction nozzle; 76, second negative pressure fan; 77, separating assembly; 771, fixing block; 772, power piece; 773, clamping head; 774, lifting piece; 775, connecting plate; 776, moving cylinder; 777, tooth-shaped separating part; 8, supporting assembly; 81, limiting block; 811, separating groove; 82, guide column; 83, reset piece; 84, separating air bag; 85, inflator. DETAILED DESCRIPTION
[0037] The following will be described in detail in combination with the accompanying drawings. Figures 1-6 The present application is further described in detail.
[0038] Example 1
[0039] The embodiment of the present application discloses an optical module pin cap assembly device. Referring to Figure 1 and Figure 2 , including a workbench 2, the surface of the workbench 2 is provided with an electronic component platform 3 and a circuit board platform 4, and the surface of the workbench 2 is also provided with two groups of parallel linear modules 23, the electronic component platform 3 and the circuit board platform 4 correspond to a group of linear modules 23 respectively, and the electronic component platform 3 and the circuit board platform 4 are respectively slidingly connected to the corresponding linear modules 23, in the embodiment, the linear modules 23 are electric cylinders, which can drive the electronic component platform 3 or the circuit board platform 4 to move in a linear direction; a plurality of plug-in grooves for inserting the pins 122 of the electronic component 12 are formed on the surface of the electronic component platform 3, when assembling the electronic component 12 and the circuit board 11, the electronic component 12 is pre-discharged on the electronic component platform 3, and the circuit board 11 is placed on the surface of the circuit board platform 4, and then waiting for assembly.
[0040] Referring to Figure 2 and Figure 3, the workbench 2 surface is further provided with an electric sliding table 21, the electric sliding table 21 is arranged from the electronic component carrier 3 direction to the circuit board carrier 4 direction, the length direction of the electric sliding table 21 is perpendicular to the length direction of the linear module 23. The workbench 2 surface is further provided with a temporary placement table 5, the temporary placement table 5 is located between the electronic component carrier 3 and the circuit board carrier 4, the temporary placement table 5 includes a driving motor 51 and a placement disc 52, the driving motor 51 is connected to the surface of the workbench 2 through bolts, the output shaft of the driving motor 51 is arranged in the direction away from the workbench 2, the placement disc 52 is connected with the output shaft of the driving motor 51 through the key connection, the placement disc 52 is penetrated along the thickness direction and is provided with a plurality of placement holes 521 for the pins 122 of the electronic component 12, and the plurality of placement holes 521 are uniformly distributed along the circumferential direction of the surface of the placement disc 52. In the embodiment, the placement disc 52 is coaxially arranged with the output shaft of the driving motor 51, so that the placement disc 52 can stably operate, and the diameter of the placement hole 521 is smaller than the diameter of the end 121 of the electronic component 12, so that the electronic component 12 can be conveniently clamped.
[0041] Referring to Figure 2 and Figure 3 , the workbench 2 surface is provided with a detection device 22, the detection device 22 is used for quality detection of the electronic component 12 on the surface of the temporary placement table 5, the detection device 22 includes a detector 221, a camera 222, a fixing frame 223 and a refractor 224, the detector 221 is arranged on the surface of the workbench 2, the internal controller of the detector 221 stores various parameters of the standard electronic component 12, the camera 222 is controlled by the detector 221, the camera 222 is connected to one end of the detector 221 away from the workbench 2, the lens of the camera 222 is arranged in the direction of the placement disc 52, so that the image of the electronic component 12 exposed to the surface of the placement disc 52 and the end 121 of the electronic component 12 can be shot and transmitted to the detector 221 for detection; the fixing frame 223 is arranged on the surface of the workbench 2 by welding, and the fixing frame 223 is located between the detector 221 and the temporary placement table 5, in the embodiment, one side of the fixing frame is inclined, the refractor 224 is connected to the inclined side of the fixing frame 223 by adhesion, and through the specific angle of the fixing frame 223 and the refractor 224, the picture at the bottom of the placement disc 52 can be reflected to the lens of the camera 222, so that the camera 222 can image and send to the detector 221, so as to detect the electronic component 12 more comprehensively, compared with the detection method of artificial naked eye, the detection device 22 has higher convenience and accuracy, which helps to improve the working efficiency of the assembly device.
[0042] Referring to Figure 1 and Figure 3The first waste groove 53 is arranged on the side of the temporary placement table 5 close to the electronic component loading table 3, and is used for placing the electronic component 12 whose end portion 121 can pass through the placement hole 521. The second waste groove 54 is arranged on the side of the temporary placement table 5 close to the circuit board loading table 4, and is used for placing the electronic component 12 that is not detected by the detection device 22. In the embodiment, the first waste groove 53 and the second waste groove 54 are connected to the surface of the workbench 2 by welding. The length direction of the first waste groove 53 and the second waste groove 54 is consistent with the straight line module 23. The first waste groove 53 is provided with a first guide surface 531 on the bottom wall. The second waste groove 54 is provided with a second guide surface 541 on the bottom wall. The height of the bottom wall of the first guide surface 531 and the second guide surface 541 close to one end of the temporary placement table 5 is higher than the height of the bottom wall away from one end of the temporary placement table 5, so that the electronic component 12 entering the first waste groove 53 and the second waste groove 54 can slide smoothly, thereby effectively improving the accumulation of waste components.
[0043] Referring to Figure 2 The electric sliding table 21 is slidably connected with a material taking assembly 6, which is used for transporting the electronic component 12 from the electronic component loading table 3 to the temporary placement table 5. The material taking assembly 6 comprises a mounting block 61, two first slide rails 62 parallel to each other, a bearing plate 63, a first driving member 64, a first suction nozzle 65 and a first negative pressure fan 66.
[0044] Referring to Figure 2 The mounting block 61 is slidably connected with the electric sliding table 21. The two first slide rails 62 are connected with the side wall of the mounting block 61 facing the electronic component loading table 3 by bolts. The two first slide rails 62 are arranged in a vertical direction. The bearing plate 63 is slidably connected with the first slide rails 62. The first driving member 64 is arranged on the side wall of the mounting block 61. In the embodiment, the first driving member 64 is a pneumatic cylinder. The piston rod of the first driving member 64 is connected with the side wall of the bearing plate 63 by bolts, so as to push the bearing plate 63 to move along the length direction of the first slide rails 62. The first suction nozzle 65 is arranged on the side wall of the bearing plate 63 facing the electronic component loading table 3. The first negative pressure fan 66 is connected with the side wall of the mounting block 61 by bolts. The first negative pressure fan 66 is communicated with the first suction nozzle 65 through a hose, so as to extract the air in the first suction nozzle 65 to form a negative pressure environment. After passing through the straight line module 23 and being driven by the first driving member 64, the electronic component 12 on the electronic component loading table 3 is sucked, thereby realizing the transportation of the electronic component 12. The material taking assembly 6 has high automation ability, which can effectively improve the efficiency of the electronic component 12 and the transportation order.
[0045] Referring to Figure 2 and Figure 4The end of the electric sliding table 21 away from the taking-out assembly 6 is also slidingly connected with a clamping mechanism 7, for further transporting the electronic component 12 which has passed the detection and meets the standards, and separating the four pins 122 of the electronic component 12 for mounting on the circuit board 11. The clamping mechanism 7 comprises a sliding block 71, two second sliding rails 72 parallel to each other, a working plate 73, a second driving member 74, a second suction nozzle 75, a second negative pressure fan 76 and a separating assembly 77.
[0046] With reference to Figure 2 and Figure 4 The sliding block 71 is slidingly connected to the electric sliding table 21, the two second sliding rails 72 are bolted to the side wall of the sliding block 71 and are arranged in the vertical direction, the working plate 73 is slidingly connected to the second sliding rails 72, and the second driving member 74 is bolted to the side wall of the sliding block 71. In this embodiment, the second driving member 74 is a pneumatic cylinder, and the piston rod of the second driving member 74 is bolted to the side wall of the working plate 73, so as to drive the working plate 73 to move along the length direction of the second sliding rails 72, so that the working plate 73 is close to or away from the placing table of the circuit board 11; the second suction nozzle 75 is bolted to the side wall of the working plate 73 facing the circuit board placing table 4, and the second negative pressure fan 76 is bolted to the surface of the side wall of the sliding block 71. The air outlet of the second negative pressure fan 76 is communicated with the second suction nozzle 75 through a hose, so as to suck the air in the second suction nozzle 75 and form a negative pressure environment, so as to adsorb and transport the end 121 of the electronic component 12.
[0047] With reference to Figure 2 and Figure 4 The separating assembly 77 is arranged on the side wall of the sliding block 71, for separating the four pins 122 of the electronic component 12 from each other. The separating assembly 77 comprises a fixed block 771, a power member 772, two clamping heads 773, a lifting member 774, a connecting plate 775, two moving cylinders 776 and two tooth-shaped separating parts 777, wherein the clamping head 773, the moving cylinder 776 and the tooth-shaped separating part 777 are arranged one by one.
[0048] With reference to Figure 2 and Figure 4The fixed block 771 is connected to the side wall of the work plate 73 facing the circuit board support 4 by bolts, both clamping heads 773 are in sliding connection with the fixed block 771, and the power member 772 is connected with the fixed block 771. In the embodiment, the power member 772 is a pneumatic element, such as a pneumatic cylinder, which drives the two clamping heads 773 to move towards each other or away from each other by air pressure. The second suction nozzle 75 is located between the two clamping heads 773. The end of the clamping head 773 close to the circuit board support 4 is provided with a semicircular groove, and the semicircular grooves of the two clamping heads 773 are spliced together to form a complete hole. The diameter of the hole is smaller than the diameter of the end 121 of the standard electronic component 12, so that the electronic component 12 can be clamped. After the second suction nozzle 75 completes the adsorption of the electronic component 12, the power member 772 drives the clamping heads 773 to move relative to each other, thereby clamping the end 121 of the electronic component 12.
[0049] Referring to Figure 2 and Figure 4 The lifting member 774 is arranged on the bottom wall of the sliding block 71. In the embodiment, the lifting member 774 is a pneumatic cylinder. The pneumatic cylinder of the lifting member 774 is arranged towards the workbench 2. The connecting plate 775 is connected to the end wall of the piston rod of the lifting member 774 by welding, so that the lifting member 774 can drive the connecting plate 775 to lift. Two moving cylinders 776 are arranged at one end of the connecting plate 775 and are connected to the bottom wall of the connecting plate 775 by bolts. The piston rod of the moving cylinder 776 is arranged towards the corresponding clamping head 773. The tooth-shaped separation part 777 is connected to the end wall of the piston rod of the corresponding moving cylinder 776 by bolts. The end wall of the tooth-shaped separation part 777 is provided with a plurality of tooth-shaped openings for the pins 122 of the electronic component 12 to extend into. When the two tooth-shaped separation parts 777 are close to each other, the plurality of pins 122 are separated from each other. The connecting plate 775 and the tooth-shaped separation part 777 are lifted by the lifting member 774 to further separate the pins 122. After the separation is completed, the pins 122 of the electronic component 12 are inserted into the plug-in hole 111 of the circuit board 11 through the second sliding rail 72.
[0050] The implementation principle of the electronic component pin cap assembly device in the embodiment is as follows: the electronic component 12 is placed in the electronic component support 3. The taking component 6 takes the electronic component 12 from the electronic component support 3 and transports it along the direction of the electric sliding table 21, so that the electronic component 12 is placed on the surface of the temporary placement table 5 for quality detection. After the detection is qualified, the electronic component 12 will be further clamped by the clamping mechanism 7 and transported towards the circuit board support 4. The separation component 77 of the clamping mechanism 7 separates the pins 122 of the electronic component 12 to avoid excessive gathering of the pins 122 of the electronic component 12. After the separation is completed, the clamping mechanism 7 aligns the pins 122 with the plug-in hole 111 of the circuit board 11 to complete the cap of the circuit board 11 and the electronic component 12.
[0051] The application sets the material taking assembly 6, the clamping mechanism 7, the electric sliding table 21 and the detection device 22 and the like, all have higher automation capacity, can replace the manual operation of the electronic part 12, and the detection and installation are more efficient and accurate, improve the assembly efficiency and the assembly quality of the optical module 1.
[0052] Embodiment 2:
[0053] The difference between the embodiment 2 and the embodiment 1 of the application is that:
[0054] With reference to Figure 5 and Figure 6 , the diameter of the placement hole 521 is greater than the diameter of the end 121 of the standard electronic part 12, and each surface of the placement hole 521 is provided with a supporting assembly 8, and the supporting assembly 8 comprises two limiting blocks 81, two guide columns 82, two reset members 83, two separation air bags 84 and an inflator 85, wherein the limiting block 81, the guide column 82 and the reset member 83 are one-to-one corresponding.
[0055] With reference to Figure 5 and Figure 6 , the surface of the placement hole 521 is provided with a gap slot 522 for embedding and sliding of the limiting block 81, and the placement hole 521 is located in the middle of the gap slot 522, in the embodiment, the limiting block 81 is arc-shaped, and the inner diameter of the two limiting blocks 81 after splicing is less than the diameter of the end 121 of the standard electronic part 12, and the electronic part 12 with the end 121 smaller than the inner diameter of the limiting block 81 will directly pass through the supporting assembly 8 into the first waste groove 53.
[0056] With reference to Figure 5 and Figure 6 , the guide column 82 is integrally formed on the side of the corresponding limiting block 81 away from the other limiting block 81, and the inner wall of the gap slot 522 is provided with a limiting hole 523 for embedding and sliding of the guide column 82, in the embodiment, the reset member 83 is a spring, the reset member 83 is sleeved on the outer wall of the guide column 82, one end of the reset member 83 is connected to the corresponding limiting block 81 through gluing, and the other end is connected to the inner wall of the gap slot 522 through gluing, when the guide column 82 is inserted into the limiting hole 523, the reset member 83 will accumulate elastic potential energy, so that the two limiting blocks 81 have a tendency to move towards each other.
[0057] With reference to Figure 5 and Figure 6The two end side walls of the limiting block 81 are provided with separation grooves 811, and the two separation grooves 811 correspond to one separation air bag 84. When the two limiting blocks 81 abut against each other, the separation grooves 811 of the two limiting blocks 81 are communicated. One end of the separation air bag 84 is connected to the inner wall of one separation groove 811 by adhesive, and the other end is connected to the inner wall of the other separation groove 811 by adhesive. The inflator 85 is connected to the surface of the placing disc 52 by bolts and is communicated with the separation air bag 84. In this embodiment, the separation air bag 84 is a corrugated tube. When the inflator 85 inflates the separation air bag 84, the separation air bag 84 will be inflated and push the two limiting blocks 81 in the direction away from each other.
[0058] The implementation principle of the optical module pin cap assembly device in Embodiment 2 of the present application is as follows: the inflator 85 is started to inflate the separation air bag 84. The separation air bag 84 is inflated, thereby pushing the two limiting blocks 81 in the direction away from each other. As the distance between the two limiting blocks 81 increases, the placing hole 521 is exposed, and the unqualified electronic component 12 falls from the placing hole 521 and enters the second waste groove 54, thereby realizing automatic screening of the electronic component 12 that does not meet the quality requirements, improving the efficiency of the detection process, ensuring the accuracy of the detection, and improving the assembly quality of the optical module 1.
[0059] The above are preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, equivalent changes made on the basis of the structure, shape, and principle of the present application should be covered within the protection scope of the present application.
Claims
1. An optical module pin header cap assembly apparatus, characterized by: The utility model provides a kind of electronic component mounting device, including workbench (2), the workbench (2) surface is provided with electronic piece carrier (3) and circuit board carrier (4), temporary placement table (5) is arranged between the electronic piece carrier (3) and circuit board carrier (4), the workbench (2) surface is further provided with electric sliding table (21), the electric sliding table (21) is slidably connected with material taking assembly (6) and clamping mechanism (7), the material taking assembly (6) is used to transport electronic component (12) from electronic piece carrier (3) to temporary placement table (5), the clamping mechanism (7) is used to install electronic component (12) on the surface of circuit board (11) after clamping from temporary placement table (5), the workbench (2) surface is provided with detection device (22) for quality detection of the surface of temporary placement table (5) electronic component (12); The clamping mechanism (7) includes sliding block (71), second sliding rail (72), working plate (73), second driving part (74), second suction nozzle (75), second negative pressure fan (76) and separation assembly (77), the sliding block (71) is slidably connected to electric sliding table (21), the second sliding rail (72) is arranged on the side wall of sliding block (71), the second sliding rail (72) is arranged from vertical direction, the working plate (73) is slidably connected to second sliding rail (72), the second driving part (74) is connected to the side wall of sliding block (71), the second driving part (74) drives working plate (73) to slide along the length direction of second sliding rail (72), the second suction nozzle (75) is arranged on the side wall of working plate (73), the second negative pressure fan (76) is arranged on the surface of the side wall of sliding block (71), the second negative pressure fan (76) is communicated with second suction nozzle (75) by hose, the separation assembly (77) is arranged on the side wall of sliding block (71), and the separation assembly (77) is used to separate the pin (122) of electronic component (12). The separating assembly (77) comprises a fixing block (771), a power member (772), two clamping heads (773), a lifting member (774), a connecting plate (775), two moving cylinders (776) and two tooth-shaped separating parts (777), the clamping head (773), the moving cylinder (776) and the tooth-shaped separating part (777) correspond to each other in one-to-one manner; the fixing block (771) is connected to the side wall of the working plate (73), the two clamping heads (773) are both in sliding connection with the fixing block (771), the power member (772) is connected with the fixing block (771), the power member (772) drives the two clamping heads (773) to move in the opposite or similar direction, the second suction nozzle (75) is located between the two clamping heads (773), the lifting member (774) is arranged on the bottom wall of the sliding block (71), the connecting plate (775) is connected with the lifting member (774), the lifting member (774) drives the connecting plate (775) to lift, one of the moving cylinders (776) is connected to the bottom wall of one end of the connecting plate (775), the other moving cylinder (776) is connected to the bottom wall of the other end of the connecting plate (775), the movable rods of the two moving cylinders (776) are arranged towards the corresponding clamping head (773), and the tooth-shaped separating part (777) is connected to the end wall of the piston rod of the corresponding moving cylinder (776).
2. The optical module pin cap assembly apparatus of claim 1, wherein: The material taking assembly (6) comprises a mounting block (61), a first sliding rail (62), a bearing plate (63), a first driving member (64), a first suction nozzle (65) and a first negative pressure fan (66), the mounting block (61) is in sliding connection with the electric sliding table (21), the first sliding rail (62) is connected to the side wall of the mounting block (61), the first sliding rail (62) is arranged in the vertical direction, the bearing plate (63) is in sliding connection with the first sliding rail (62), the first driving member (64) is arranged on the side wall of the mounting block (61), the first driving member (64) drives the bearing plate (63) to move along the length direction of the first sliding rail (62), the first suction nozzle (65) is arranged on the side wall of the bearing plate (63), and the first negative pressure fan (66) is arranged on the side wall of the mounting block (61). The first negative pressure fan (66) is in communication with the first suction nozzle (65) through a hose.
3. The optical module pin cap assembly apparatus of claim 1, wherein: The surface of the working table (2) is provided with two groups of linear modules (23), the movement direction of the linear module (23) is perpendicular to the movement direction of the electric sliding table (21), the electronic component carrier (3) is in sliding connection with one group of linear modules (23), and the circuit board carrier (4) is in sliding connection with the other group of linear modules (23).
4. The optical module pin cap assembly apparatus of claim 1, wherein: The temporary placing table (5) comprises a driving motor (51) and a placing disc (52), the driving motor (51) is arranged on the surface of the working table (2), the placing disc (52) is connected with the output shaft of the driving motor (51), and the placing disc (52) is provided with a placing hole (521) penetrating through in the thickness direction and used for the pin (122) of the electronic component (12) to pass through.
5. The optical module pin cap assembly apparatus of claim 4, wherein: The detection device (22) comprises a detector (221), a camera (222), a fixing frame (223) and a refracting mirror (224), the detector (221) is arranged on the surface of the workbench (2), the camera (222) is connected to the end of the detector (221) away from the workbench (2), the camera (222) is controlled by the detector (221), the lens of the camera (222) is arranged towards the direction of the placing disc (52), the fixing frame (223) is arranged on the surface of the workbench (2), the fixing frame (223) is located between the detector (221) and the temporary placing table (5), the refracting mirror (224) is connected with the fixing frame (223), and the refracting mirror (224) reflects the image of the bottom wall of the placing disc (52) to the lens of the camera (222).
6. The optical module pin cap assembly apparatus of claim 4, wherein: The placing hole (521) is provided with a plurality of placing holes (521), the diameter of the placing hole (521) is greater than the diameter of the end portion (121) of the electronic component (12), each placing hole (521) is provided with a supporting assembly (8), and the supporting assembly (8) is used for preventing the electronic component (12) from falling off from the placing hole (521); the first waste groove (53) is arranged on the side of the temporary placing table (5) close to the electronic component loading table (3), the first waste groove (53) is used for placing the electronic component (12) with the end portion (121) capable of penetrating the supporting assembly (8), and the second waste groove (54) is arranged on the side of the temporary placing table (5) close to the circuit board loading table (4), and the second waste groove (54) is used for placing the electronic component (12) that fails to pass the detection of the detection device (22).
7. An optical module pin cap assembly apparatus according to claim 6, wherein: The supporting assembly (8) comprises two limiting blocks (81), two guide columns (82), two reset members (83), a separation air bag (84) and an inflator (85), the limiting block (81), the guide column (82) and the reset member (83) are one-to-one corresponding; the placing hole (521) is provided with a gap groove (522) on the surface for embedding and sliding of the limiting block (81), the guide column (82) is connected to the side of the corresponding limiting block (81) away from the other limiting block (81), the inner wall of the gap groove (522) is provided with a limiting hole (523) for inserting and sliding of the guide column (82), the reset member (83) is connected with the corresponding limiting block (81), the reset member (83) drives the two limiting blocks (81) to move towards each other, the side walls of the two limiting blocks (81) are provided with separation grooves (811), one end of the separation air bag (84) is arranged in one side separation groove (811), the other end is arranged in the other side separation groove (811), and the inflator (85) is arranged on the surface of the placing disc (52).
8. The optical module pin cap assembly apparatus of claim 6, wherein: The first waste groove (53) is provided with a first guide surface (531) on the bottom wall, and the second waste groove (54) is provided with a second guide surface (541) on the bottom wall, wherein the height of the bottom wall near one end of the temporary placement table (5) of the first guide surface (531) and the second guide surface (541) is higher than the height of the bottom wall away from one end of the temporary placement table (5).
Citation Information
Patent Citations
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