A method for manufacturing a conductive film and a conductive film

Abstract

The application provides a preparation method of a conductive film and the conductive film, and the preparation method comprises the following steps: taking a film base material; winding the film base material in a first film coating equipment to perform first evaporation, and evaporating a first metal layer on the surface of the film base material; performing roughening treatment on the surface of the film base material with the first metal layer; winding the film base material after the roughening treatment in a second film coating equipment to perform second evaporation, and evaporating a second metal layer on the first metal layer. In the embodiment of the application, the film after the first evaporation is subjected to the roughening treatment, and when the film base material with the first metal layer enters the second film coating equipment, the first metal layer can be prevented from slipping and contacting a steel roll, so that the film is prevented from being wrinkled and being easily perforated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thin film preparation, and particularly relates to a preparation method of conductive thin film and conductive thin film. BACKGROUND

[0002] The conductive metal thin film is a kind of material with multiple good properties, and has been widely used in batteries as positive current collector or negative current collector. With the development of vacuum coating technology, the production process of flexible conductive material is gradually replaced by traditional electroplating, coating and chemical treatment method, which reduces the pollution produced by traditional process method, and has the advantages of high purity of plating layer, good adhesion and good uniformity. There are two types of coating equipment on the market, one is a paste roller type evaporation equipment, and the other is a suspension type evaporation equipment.

[0003] However, in the prior art, whether the thin film is produced by using the paste roller type coating or the suspension type coating, the roller system used is a smooth steel rod, so the thin film is easy to slip during the film running process, resulting in wrinkles or even perforation of the thin film. SUMMARY

[0004] Therefore, the purpose of the embodiments of the present application is to provide a preparation method of conductive thin film and conductive thin film, so as to solve the technical problem that the thin film substrate is easy to slip during the film running process in the prior art, resulting in wrinkles or even perforation of the thin film.

[0005] To achieve the above purpose, the embodiments of the present application provide a preparation method of conductive thin film, which comprises:

[0006] Taking a thin film substrate;

[0007] Winding the thin film substrate in a first coating equipment for first evaporation, and evaporating a first metal layer on the surface of the thin film substrate;

[0008] Roughening the surface of the thin film substrate with the first metal layer;

[0009] Winding the roughened thin film substrate in a second coating equipment for second evaporation, and evaporating a second metal layer on the first metal layer.

[0010] In some possible embodiments, before the winding of the thin film substrate in the first coating equipment for the first evaporation, the method further comprises:

[0011] Roughening the surface of the thin film substrate or setting a bonding layer on the thin film substrate.

[0012] In some possible implementation manners, the roller system in the first coating device and the second coating device adopts a sponge roller, a rubber roller or a suction roller.

[0013] In some possible implementation manners, the first evaporation of the thin film substrate is performed in the first coating device by using a suspension coating method, and the second evaporation of the thin film substrate is performed in the second coating device by using a kiss roll coating method.

[0014] In some possible implementation manners, the evaporation boat is used as an evaporation source in the suspension coating method, the film running speed of the thin film substrate is 100 m / min to 400 m / min, and the wire feeding speed of the evaporation boat is 300 mm / min to 500 mm / min.

[0015] In some possible implementation manners, the crucible is used as an evaporation source in the kiss roll coating method, and the film running speed of the thin film substrate is 70 m / min to 100 m / min.

[0016] In some possible implementation manners, the first evaporation of the thin film substrate is performed in the first coating device by using a kiss roll coating method, and the second evaporation of the thin film substrate is performed in the second coating device by using a suspension coating method.

[0017] In some possible implementation manners, the crucible is used as an evaporation source in the first coating device, and the film running speed of the thin film substrate is 70 m / min to 100 m / min.

[0018] In some possible implementation manners, the evaporation boat is used as an evaporation source in the second coating device, the film running speed of the thin film substrate is 100 m / min to 400 m / min, and the wire feeding speed of the evaporation boat is 300 mm / min to 500 mm / min.

[0019] In the second aspect, the embodiments of the present application further provide a conductive film, characterized in that the holes on the conductive film satisfy the conditions that the 100 um pinhole frequency is less than or equal to 0.2 and the 500 um pinhole frequency is less than or equal to 0.2, and the elongation rate satisfies the conditions that the longitudinal elongation rate is greater than or equal to 50%, and the transverse elongation rate is greater than or equal to 40%, or the holes on the conductive film satisfy the conditions that the 100 um pinhole frequency (ea / m2) is less than or equal to 0.1 and the 500 um pinhole frequency (ea / m2) is less than or equal to 0.2, and the elongation rate satisfies the conditions that the longitudinal elongation rate is greater than or equal to 55%, and the transverse elongation rate is greater than or equal to 36%.

[0020] The technical effects of the above technical solutions are as follows:

[0021] The embodiment of the present application provides a preparation method of a conductive film and the conductive film, and the preparation method comprises the following steps: taking a film substrate; winding the film substrate in a first film coating equipment to perform first evaporation, and evaporating a first metal layer on the surface of the film substrate; performing roughening treatment on the surface of the film substrate with the first metal layer; winding the film substrate after the roughening treatment in a second film coating equipment to perform second evaporation, and evaporating a second metal layer on the first metal layer. In the embodiment of the present application, the film after the first evaporation is subjected to roughening treatment, and when the film substrate with the first metal layer enters the second film coating equipment, the first metal layer can be prevented from slipping and contacting a steel roll, so that the film is wrinkled and a hole is easily formed in the film. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0023] Figure 1 is a flow chart of a preparation method of a conductive film according to an embodiment of the present application;

[0024] Figure 2 is a structural schematic diagram of a suspension type film coating equipment according to an embodiment of the present application;

[0025] Figure 3 is a structural schematic diagram of a paste roller type film coating equipment according to an embodiment of the present application.

[0026] Legend of the drawings:

[0027] 21, first unwinding device; 22, first winding device; 23, evaporation boat; 24, passing roller; 25, first tension roller; 26, first cooling roller; 27, main roller;

[0028] 31, second unwinding device; 32, second winding device; 33, second cooling roller; 34, flattening roller; 35, second tension roller; 36, crucible. DETAILED DESCRIPTION

[0029] Features and exemplary embodiments of various aspects of the present application will be described below in detail. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one of ordinary skill in the art that the present application can be practiced without some or all of these specific details. In other instances, well known structures and functions have not been described in detail in order to avoid obscuring the present application. In the following description of the embodiments, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one of ordinary skill in the art that the present application can be practiced without some or all of these specific details. In other instances, well known structures and functions are not shown or described in detail in order to avoid obscuring the present application. The following detailed description is merely illustrative and is not intended to limit the present application. Rather, the scope of the present application is defined by the appended claims, along with their equivalents.

[0030] Embodiment One

[0031] Figure 1 A flow chart of a method for preparing a conductive thin film according to an embodiment of the present application is shown in FIG. 1, which includes the following steps: Figure 1

[0032] Step Sll, taking the thin film substrate;

[0033] Step S12, unwinding the thin film substrate in a first film plating device to perform a first evaporation, and evaporating a first metal layer on the surface of the thin film substrate;

[0034] Step S13, roughening the surface of the thin film substrate with the first metal layer evaporated thereon;

[0035] Step S14, unwinding the thin film substrate after the roughening in a second film plating device to perform a second evaporation, and evaporating a second metal layer on the first metal layer.

[0036] ​Specifically, first, the original film, i.e. the film substrate, is taken and then is unwound in the first film coating equipment to perform the first evaporation, the film substrate is first coated with a first layer of metal in the first film coating equipment, and then the surface of the film substrate coated with the first layer of metal is roughened, for example, by using a corona treatment method or a chemical treatment method. The corona treatment method is that the film passes between two electrodes with high voltage, the high voltage ionizes the air between the electrodes, and the electronic current between the electrodes forms an oxidation polarization base on the surface of the film, so that the film surface is polarized. The chemical treatment method is that the film is first degreased by passing through tetrahydrogen carbon, and then is treated in a solution of concentrated sulfuric acid 88%, potassium dichromate (K2Cr207) 4.4% or chromic acid 7.1% for several minutes, and then is washed with water and dried in the air to obtain the treated film, and then the treated film is put into the second film coating equipment or still in the first film coating equipment to perform the second evaporation. Since the current film substrate is coated with the first layer of metal and then is put into the second film coating equipment, the first layer of metal on the surface of the film substrate is easy to slip with the steel roll of the second film coating equipment, and the slipping will cause the film substrate to wrinkle and be easy to be perforated to have holes, etc. Therefore, the roughening treatment is performed to prevent the film substrate from slipping and being perforated.

[0037] In some embodiments, before the film substrate is unwound in the first film coating equipment to perform the first evaporation, the surface of the film substrate is also roughened, or the roll system in the first film coating equipment and the second film coating equipment is treated by using sponge rolls, rubber rolls or adsorption rolls.

[0038] Specifically, in order to avoid the problem of slipping when the film substrate directly contacts the steel roll in the first film coating equipment, the surface of the film substrate is also roughened to prevent the film substrate from slipping in the first film coating equipment, and to improve the adhesion between the first layer of metal and the film substrate. Of course, at this time, the roll system in the first film coating equipment and the second film coating equipment can be treated, because the rolls in the current vacuum film coating equipment are all metal steel rolls, and the surface of the steel roll is smooth, which is also easy to make the film substrate slip. Therefore, the steel roll in the first film coating equipment and the second film coating equipment can be converted into sponge rolls, rubber rolls or adsorption rolls, etc.

[0039] In some embodiments, the film substrate is first evaporated in the first film coating equipment by using a suspension type film coating method, and then is evaporated in the second film coating equipment by using a paste roll type film coating method.

[0040] Specifically, in the embodiments of the present application, the film substrate is first evaporated by using a suspension type film coating method, and then is evaporated by using a paste roll type film coating method. By using this double control mode, the problems of edge curling and edge bulging can be solved, the film holes can be reduced, and the extensibility of the film can be improved.

[0041] In the prior art, if only the suspended coating method is used for coating, since the suspended coating has poor cooling effect, the coating speed is increased to reduce the heating of the film surface to avoid hole burning, so the suspended coating itself has a relatively fast film speed, and the metal layer deposited by one coating is relatively thin. If evaporation is performed below the cooling roller, string bubbles and convex points are easily formed on the film surface. In addition, the temperature of the cooling liquid is -30 degrees, and the cooling and heating time out of the warehouse is long, and the energy consumption is large. Therefore, if only the suspended coating method is used for coating, since the cooling effect is poor, many holes are formed, and the performance in terms of product elongation is poor. If the paste roller coating method is completely used, since the edges of the film blocked by the baffle are not coated with metal, the heating is poor, and since it is high temperature in the evaporation environment, the edges will definitely be drummed and warped, affecting the product quality. In the embodiment, high film speed and low wire feeding are used during suspended coating, and only one pass of production is performed, the film layer is thin after one coating, the heat on the film surface is low, and the holes formed are small holes with extremely small number. When the paste roller coating method is used, the evaporation amount is large and the cooling effect is good, and the micro-holes generated by the suspended coating can also be repaired during the paste roller coating process. In addition, the suspended coating has a small evaporation amount, does not need to use a baffle, and the entire width can be coated with a layer of metal (such as aluminum), the film surface is uniformly heated, and drumming and warping of the edges is not easy to occur. In addition, in the prior art, if only the paste roller coating method is used for coating, since the cooling roller is above the evaporation zone, the length of the roller is greater than the width of the film, and the excess part is easy to accumulate aluminum. If the baffle size is too small, the film edge will easily form a warped edge after contacting the aluminum area of the roller, and if the baffle size is too large, the heating is uneven and drumming of the edge is easily formed.

[0042] The film coating method of the present application uses a suspension coating method in the first evaporation, and the evaporation area is wider than the width of the film, so that the entire width of the film is coated with metal, such as aluminum, to enhance the heat resistance of the film surface. Because the film substrate can withstand higher temperatures after being coated with aluminum, it is then transferred to a second coating device for roll coating. After suspension coating, the entire width of the film surface is coated with an aluminum film, and when suspension coating is performed again, the edge position is less likely to deform and shrink due to the aluminum layer. Therefore, the edge can be reduced. Roll coating will always have an edge because the roll means that the film is attached to the roll, and then coated. Since the film is attached to the roll, the roll must be wider than the film, otherwise part of the film will be suspended, resulting in unqualified film tension and other properties. Since the width of the roll is greater than the width of the film, the excess part of the roll is not in contact with the film. If there is no edge, the evaporated metal will accumulate on the excess roll. To solve this problem, an edge, which is a device that can block the excess roll, is used. Of course, the edge must cover the edge of the film, because if it does not cover the edge, the part of the roll that is not covered will be coated with metal. In the present embodiment, the film substrate is first coated by suspension coating. After being coated with aluminum, the film substrate not only increases the heat resistance of the film substrate, but also has better heat conduction than the pure film. Therefore, during suspension coating, even if aluminum vapor evaporates to the edge position, it can be quickly cooled to avoid the risk of edge bulging and edge warping. In addition, the roll coating method is used in the second evaporation. At this time, the film surface is completely wrapped around the roll surface. The roll is filled with cooling liquid at a certain temperature, and the crucible evaporation method is used to reduce the risk of aluminum splashing. Even with a large evaporation amount, roll coating can quickly cool the film surface to avoid the problem of film surface burning holes. It can also increase the elongation of the film product.

[0043] Furthermore, if suspension and roll coating are used simultaneously in the same device, the product hole problem cannot be solved because suspension and roll coating share the same evaporation source. Once there is a problem, it cannot be corrected, which greatly reduces production efficiency. The production method of the present application can adjust the running speed of the first coating device to control the production speed. After the film product is produced, the film can be easily checked and corrected when the coating product has a problem because the film is processed separately. Mixed coating in the same device is limited by the edge, and if production is continued after the edge is produced, it is easy to cause the film roll to relax, resulting in wrinkles on the film surface and causing the film to be scrapped.

[0044] In some embodiments, the evaporation boat is used as the evaporation source in the suspended coating method, the film substrate has a film running speed of 100-400 m / min, and the evaporation boat has a wire feeding speed of 300-500 mm / min. In the roll coating method, the crucible is used as the evaporation source, and the film substrate has a film running speed of 70-100 m / min.

[0045] In the present embodiment, the first coating device can include a unwinding device, an evaporation zone and a winding device, and the evaporation zone is provided with an evaporation boat. In the present embodiment, the crucible cannot be used because the crucible has a large capacity, while the evaporation boat has a moderate capacity. The use of the evaporation boat can further reduce the holes in the film. Because there is no cooling roller above the suspended coating area at this time, the use of the evaporation boat needs to be matched with the film running speed to reduce the damage of the evaporated metal to the film. In the first coating device, the film substrate has a film speed of 100-400 m / min, and the wire feeding speed is 300-500 mm / min. In the second coating device, the same winding device, evaporation zone and winding device are also provided, and the evaporation zone is mainly provided with a crucible. The crucible is mainly used because it can evaporate a large amount of metal at one time, which can quickly thicken the metal on the film. At this time, there is no need to worry about the problem of film heating. At this time, the film running speed is 70-100 m / min. It is found through experiments that the use of the above wire feeding speed matched with the film running speed and the evaporation device using the evaporation boat in the first coating device, and the use of the above film running speed in the second coating device can greatly improve the holes and elongation rate on the film substrate compared with the use of the suspended type and the roll type alone, and the use of the suspended type and the roll type in one cavity. The present application tests two samples. The present application tests the combination of the suspended type and the roll type. The suspended film has a running speed of 100 m / min, and the wire feeding speed is 300 mm / min. The roll film has a running speed of 70 m / min. The test results are shown in Table 1. The product film produced through the above process simultaneously satisfies 100 um pinhole frequency (ea / m2) ≤0.2, 500 um pinhole frequency (ea / m2) ≤0.2, elongation rate simultaneously satisfies elongation MD≥50%, TD≥40%, MD is the longitudinal elongation rate, and TD is the transverse elongation rate. It can be seen that the film product produced by the method of first evaporating by the suspended coating method and then evaporating by the roll coating method not only has fewer holes, but also has greatly increased elongation.

[0046] Table 1:

[0047]

[0048]

[0049] Through the test, it is known that the thin film product produced by the method provided in the embodiment has a lower hole probability and greatly improved elongation, thereby improving the production quality of the thin film.

[0050] In some embodiments, before the first evaporation of the thin film substrate in the first coating device by using the suspension coating method, the method further comprises: pretreating the thin film substrate to form a bonding layer on the thin film substrate. Since the connection between the polymer material and the metal is through molecular bond, the combination of the two molecular bonds is relatively poor. By using the metal oxide as the primer, the problem of poor bonding force between the polymer and the metal due to direct contact is solved. Therefore, in the embodiment, a bonding force improving layer is arranged on the thin film. At this time, the bonding force improving layer can be a metal oxide layer or an alloy layer or other metal capable of improving the bonding force between the metal and the thin film substrate during the evaporation process.

[0051] In some embodiments, the first evaporation of the thin film substrate is performed in the first coating device by using the paste roller coating method, and the second evaporation of the thin film substrate is performed in the second coating device by using the suspension coating method.

[0052] In the embodiment, the crucible is used as the evaporation source in the first coating device, and the film running speed of the thin film substrate is 70 m / min to 100 m / min. The evaporation boat is used as the evaporation source in the second coating device, and the film running speed of the thin film substrate is 100 m / min to 400 m / min, and the wire feeding speed of the evaporation boat is 300 mm / min to 500 mm / min.

[0053] In the embodiment, the first coating device is the paste roller coating, and the evaporation zone adopts the crucible evaporation method. Since the cooling effect is good in the paste roller coating, the crucible evaporation can be used in the embodiment to improve the coating efficiency. At this time, the film running speed of the thin film substrate can be 70 m / min to 100 m / min. Of course, since the crucible is used at this time, the wire feeding mechanism is not needed. By using the above combination, that is, the film running speed and the crucible, the film surface holes caused by splashing aluminum can be avoided as much as possible.

[0054] In the prior art, the film is plated by the pasting roller plating method. Since the cooling roller is above the evaporation zone and the length of the roller is greater than the width of the film, the extra part is prone to accumulate aluminum. If the size of the baffle is too small, the film edge is prone to form a curled edge after being in contact with the aluminum part of the roller. If the size of the baffle is too large, uneven heating is prone to form a drum edge. In the embodiment, the film substrate is first pasted and evaporated, and then the film substrate is plated by the suspension plating method. Even if the suspension plating is prone to splash metal, the metal liquid is not easy to break the film surface, thereby reducing the hole probability. At the same time, the suspension plating method can also compensate for the problem of thin aluminum layer on the edge of the pasting roller. Of course, although the above characteristics exist, the film speed and wire feeding speed in the second film plating device still need to be set. At this time, the film substrate speed can still be set to 100 m / min-400 m / min, and the wire feeding speed can be set to 300 m / min-500 mm / min. At this time, the hole probability of the produced film product can still be reduced, and the elongation of the film product can be improved.

[0055] In addition, when the film product is produced by using the film plating method provided in the embodiment, trial production is generally first performed. The slight curled edge can be corrected by the suspension plating method, and the product can be slightly trimmed. If it cannot be corrected, the machine needs to be stopped in time. For example, if a drum edge or a curled edge appears after the pasting roller plating, the embodiment can be flattened in the subsequent suspension plating process. After the film surface is flattened, the production can be continued. In addition, after the first evaporation, the square resistance of the film can be measured by using a square resistance meter. After the measurement, the wire feeding amount can be adjusted according to the resistance change. For example, if a slight drum edge and a curled edge appear in the pasting roller plating process, the film can be transferred to the suspension plating device for correction. If it is serious, the film can only be trimmed. In addition, since the suspension plating method does not need a baffle, the edge position of the film is plated with an aluminum layer during the evaporation process. Under the action of tension, the edge position can be flattened during the plating process.

[0056] In the embodiment, two samples are also tested. The test is performed on the combination of the pasting roller type and the suspension type mentioned in the application. The film speed of the pasting roller type is 70 m / min, the film speed of the suspension type is 100 m / min, and the wire feeding speed is 300 mm / min. The test results are shown in Table 2. The product film produced by the above process satisfies the following conditions at the same time: the 100 um pinhole frequency (ea / m2) is less than or equal to 0.1, the 500 um pinhole frequency (ea / m2) is less than or equal to 0.2, the elongation satisfies MD≥55% and TD≥36%, MD is the longitudinal elongation, and TD is the transverse elongation. It can be seen that the film product produced by the method of first evaporating by the pasting roller plating method and then evaporating by the suspension plating method has fewer holes and greatly increased elongation.

[0057] Table 2:

[0058] Test sample 100um pinhole frequency 500um pinhole frequency Product elongation Coated roll sample 1 0.6 0.8 MD=30%, TD=25% Coated roll + suspension sample 1 0.1 0.1 MD=55%, TD=36% Coated roll sample 2 0.5 0.9 MD=33%, TD=24% Coated roll + suspension sample 2 0.1 0.2 MD=59%, TD=38%

[0059] Through the experiment, it is known that the film product produced by the method provided in the embodiment of the application has a lower hole probability and greatly improved film extensibility, so as to improve the production quality of the film.

[0060] In the embodiment, before the first evaporation of the film substrate by the suspension type film coating device in the first film coating device, the film substrate is pretreated to set a bonding layer on the film substrate. Since the high molecular material and the metal are connected by molecular bonds, the combination of the two molecular bonds is poor, and the problem of poor bonding force between the high molecular material and the metal is solved by the metal oxide primer. Therefore, in the embodiment, a bonding force improving layer is set on the film, and the bonding force improving layer can be a metal oxide layer or an alloy layer or other metal capable of improving the bonding force between the metal and the film substrate in the evaporation process.

[0061] As an example, Figure 2 is a structural schematic diagram of a suspension type film coating device in the embodiment of the application, as Figure 2 shown, the suspension type film coating device is arranged in a vacuum chamber and includes a first unwinding device 21, a first winding device 22, an evaporation boat 23, a plurality of guide rollers 24 for guiding the film in the evaporation process, a first tension roller 25 for controlling the film tension, a first cooling roller 26, and a main roller 27, etc. The film coating device can coat one side of the film, and the film can be coated twice to coat both sides of the film. Of course, the suspension type film coating device is not limited to the structure shown in the accompanying drawings of the embodiment, but can be other structures for suspension evaporation. Any structure that can be used for suspension type film coating can be used. In the evaporation process, the film substrate is unwound by the first unwinding device 21, passes through the plurality of guide rollers 24, the first tension roller 25, the first cooling roller 26, and the main roller 27 on the film path, and is wound by the winding device 22. Figure 2

[0062] Figure 3 is a structural schematic diagram of a paste roller type film coating device in the embodiment of the application, as Figure 3 ​As shown, the second unwinding device 31 and the second winding device 32 are included, and on the unwinding and winding path, there are multiple evaporation zones, the second cooling roller 33, the flattening roller 34 and the second tension roller 35, in the device, the evaporation zone generally uses the crucible 36 as the evaporation source, when evaporating and coating, the thin film substrate is coated on the second cooling roller 33, in the embodiment, six evaporation zones are used to coat the two surfaces of the thin film substrate, which greatly improves the evaporation efficiency of the thin film. Of course, other roller coating devices in the prior art can also be used for coating, and the embodiment is not limited in particular.

[0063] In addition, the embodiment of the present application also provides a conductive film prepared according to the above method. The holes on the conductive film prepared by the above method satisfy the conditions that the frequency of 100um pinholes is less than or equal to 0.2 and the frequency of 500um pinholes is less than or equal to 0.2, and the elongation rate satisfies the conditions that the longitudinal elongation rate is greater than or equal to 50% and the transverse elongation rate is greater than or equal to 40%, or the holes on the conductive film satisfy the conditions that the frequency of 100um pinholes (ea / m2) is less than or equal to 0.1 and the frequency of 500um pinholes (ea / m2) is less than or equal to 0.2, and the elongation rate satisfies the conditions that the longitudinal elongation rate is greater than or equal to 55% and the transverse elongation rate is greater than or equal to 36%.

[0064] It can be seen that the conductive film prepared by the above preparation method has a low hole frequency and good elongation performance.

[0065] In the description of the embodiments of the present application, it should be noted that the terms "upper, lower, inner and outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first, second or third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0066] Unless otherwise specified and limited, the terms "mounting, connecting, connecting" in the embodiments of the present application should be understood broadly, for example: it can be fixedly connected, detachably connected or integrally connected; it can also be mechanically connected, electrically connected or directly connected, it can also be indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0067] While the present application has been described with reference to the preferred embodiments, it is to be understood that various modifications can change the scope of the present application to which they are not intended to deviate. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided that there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method of producing an electrically conductive film, characterized by, The preparation method comprises: taking a film substrate; winding the film substrate in a first coating device to perform first evaporation, and evaporating a first metal layer on the surface of the film substrate; roughening the surface of the film substrate with the first metal layer; winding the roughened film substrate in a second coating device to perform second evaporation, and evaporating a second metal layer on the first metal layer; performing first evaporation on the film substrate in the first coating device by using a suspension coating method; performing second evaporation on the film substrate in the second coating device by using a roller coating method, or performing first evaporation on the film substrate in the first coating device by using a roller coating method; performing second evaporation on the film substrate in the second coating device by using a suspension coating method.

2. The production method according to claim 1, characterized by, Before the winding of the film substrate in the first coating device to perform first evaporation, the method further comprises: roughening the surface of the film substrate or setting a bonding layer on the film substrate.

3. The preparation method according to claim 1, characterized in that, The roller system in the first coating device and the second coating device is sponge roller, rubber roller or adsorption roller.

4. The production method according to claim 3, characterized by, In the suspension coating method, an evaporation boat is used as an evaporation source, the film substrate has a film running speed of 100 m / min to 400 m / min, and the evaporation boat has a wire feeding speed of 300 mm / min to 500 mm / min.

5. The preparation method according to claim 4, wherein in the roller coating method, a crucible is used as an evaporation source, and the film substrate has a film running speed of 70 m / min to 100 m / min.

6. The conductive film prepared according to the production method of any one of claims 1 to 5, characterized by The holes on the conductive film satisfy 100um pinhole frequency ea / m 2 Less than or equal to 0.2 and 500um pinhole frequency ea / m 2 Less than or equal to 0.2, the elongation rate satisfies longitudinal tensile rate greater than or equal to 50% and transverse tensile rate greater than or equal to 40%, or the holes on the conductive film satisfy 100um pinhole frequency ea / m 2 Less than or equal to 0.1 and 500um pinhole frequency ea / m 2 Less than or equal to 0.2, the elongation rate satisfies longitudinal tensile rate greater than or equal to 55% and transverse tensile rate greater than or equal to 36%.

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