Electronic device with curved dielectric resonator antenna

Abstract

The present disclosure relates to electronic devices with curved dielectric resonator antennas. An electronic device is provided that can be provided with a phased antenna array having a curved dielectric resonant element. The curved dielectric resonant element can have a first section, a second section that is not parallel to the first section, and an angled surface that couples the first section to the second section. One or more feed probes can be coupled to the first section to excite the dielectric resonant element. A reflector can be provided on the angled surface to direct electromagnetic energy from the first section to the second section, and vice versa. The curved dielectric resonant element can exhibit a smaller overall height than a dielectric resonator having a straight column of dielectric material, thereby allowing a reduction in the thickness of the electronic device. Despite the reduction in overall height, the angled surface and the reflector can optimize the radio frequency performance of the antenna.

Description

[0001] This application claims priority to U.S. Patent Application No. 17 / 670,020, filed February 11, 2022, the entire contents of which are incorporated herein by reference. Background Technology

[0002] This disclosure relates in general to electronic devices, and more specifically to electronic devices having wireless communication circuitry.

[0003] This electronic device typically includes wireless communication circuitry. For example, cellular phones, computers, and other devices usually contain antennas and wireless transceivers to support wireless communication.

[0004] Support for wireless communication in millimeter-wave and centimeter-wave frequency bands may be required. Millimeter-wave communication (sometimes referred to as extremely high frequency (EHF) communication) and centimeter-wave communication involve frequencies ranging from approximately 10 GHz to 300 GHz. Operation at these frequencies can support high throughput, but can present significant challenges. For example, radio frequency signals at millimeter-wave and centimeter-wave frequencies can be characterized by substantial attenuation and / or distortion during signal propagation through various media. Additionally, antennas may exhibit insufficient bandwidth if not carefully managed, and the presence of conductive electronic components can make it difficult to incorporate components for handling millimeter-wave and centimeter-wave communication into electronic devices. Summary of the Invention

[0005] The electronic device may include wireless circuitry and a housing. The housing may have an outer conductive housing structure and a rear wall. A display may be mounted opposite the rear wall to the outer conductive housing structure. A phased antenna array is capable of radiating at frequencies greater than 10 GHz through the display overlay, antenna windows in the housing, a sapphire overlay for a camera window in the device, a dielectric overlay for the rear housing wall of the device, or other dielectric overlays.

[0006] A phased antenna array may include a dielectric resonator antenna with a curved dielectric resonator element. The curved dielectric resonator element may have a first segment extending along a first longitudinal axis, a second segment extending from the first segment along a second longitudinal axis, and an angular surface coupling the first segment to the second segment. The angular surface may not extend parallel to the first and second longitudinal axes. One or more feed probes may be coupled to the first segment to excite the dielectric resonator element. A reflector may be disposed on the angular surface to guide electromagnetic energy from the first segment to the second segment and vice versa. The curved dielectric resonator element can exhibit a smaller overall height than a dielectric resonator with a straight dielectric material pillar, thereby allowing for a reduction in the thickness of the electronic device. Despite this reduction in overall height, the angular surface and the reflector can optimize the antenna's radio frequency performance. Attached Figure Description

[0007] Figure 1 It is a perspective view of an exemplary electronic device based on some implementation schemes.

[0008] Figure 2 It is a schematic diagram of an exemplary circuit in an electronic device according to some implementation schemes.

[0009] Figure 3 It is a schematic diagram of an exemplary wireless circuit based on some implementation schemes.

[0010] Figure 4 This is a diagram illustrating an exemplary phased antenna array based on some implementation schemes.

[0011] Figure 5 It is a cross-sectional side view of an exemplary electronic device having a phased antenna array for radiating through different sides of the electronic device according to some embodiments.

[0012] Figure 6 This is a cross-sectional side view of an exemplary dielectric resonator antenna that can be installed in an electronic device according to some implementation schemes.

[0013] Figure 7 This is a perspective view of an exemplary dielectric resonator antenna based on some implementation schemes.

[0014] Figure 8 This is a cross-sectional side view of an exemplary bent dielectric resonator antenna that can be installed in an electronic device according to some implementation schemes.

[0015] Figure 9 This is a cross-sectional view of an exemplary curved dielectric resonator antenna for covering multiple polarizations, according to some implementation schemes. Detailed Implementation

[0016] Electronic devices such as Figure 1 The electronic device 10 may be equipped with wireless circuitry including an antenna. This antenna can be used to transmit and / or receive radio frequency signals. The antenna may include a phased antenna array for performing wireless communication and / or spatial ranging operations using millimeter-wave and centimeter-wave signals. Millimeter-wave signals, sometimes referred to as extremely high frequency (EHF) signals, propagate at frequencies above about 30 GHz (e.g., 60 GHz or other frequencies between about 30 GHz and 300 GHz). Centimeter-wave signals propagate at frequencies between about 10 GHz and 30 GHz. If desired, the device 10 may also include an antenna for processing satellite navigation system signals, cellular telephone signals, wireless local area network signals, near-field communication, light-based wireless communication, or other wireless communication.

[0017] Device 10 may be a portable electronic device or other suitable electronic device. For example, device 10 may be a laptop computer, tablet computer, smaller devices (such as wristwatches, wall-mounted devices, headphones, handsets, or other wearable or micro-devices), handheld devices (such as cellular phones), media players, or other small portable devices. Device 10 may also be a set-top box, desktop computer, display with integrated computer or other processing circuitry, display without integrated computer, wireless access point, wireless base station, electronic equipment integrated into a newsstand, building, or vehicle, or other suitable electronic equipment.

[0018] Device 10 may include a housing such as housing 12. Housing 12 (sometimes referred to as a shell) may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or combinations thereof. In some cases, components of housing 12 may be formed of dielectric or other low-conductivity materials (e.g., glass, ceramic, plastic, sapphire, etc.). In other cases, housing 12 or at least some of the structures constituting housing 12 may be formed of metallic elements.

[0019] If desired, device 10 may have a display such as display 14. Display 14 may be mounted on the front of device 10. Display 14 may be a capacitive touch electrode or a touchscreen that is not sensitive to touch. The back of housing 12 (i.e., the side of device 10 opposite to the front of device 10) may have a substantially flat housing wall, such as a rear housing wall 12R (e.g., a planar housing wall). The rear housing wall 12R may have a gap that extends completely through the rear housing wall, thus separating portions of housing 12 from each other. The rear housing wall 12R may include conductive portions and / or dielectric portions. If desired, the rear housing wall 12R may include a planar metal layer covered by a thin layer or dielectric coating such as glass, plastic, sapphire, or ceramic (e.g., a dielectric overlay). Housing 12 may also have shallow grooves that do not extend completely through housing 12. The gaps or grooves may be filled with plastic or other dielectric materials. If necessary, the separated portions of the housing 12 (e.g., through the through slot) can be joined together by an internal conductive structure (e.g., a metal sheet or other metal component bridging the slot).

[0020] The housing 12 may include peripheral housing structures such as peripheral structure 12W. The conductive portions of peripheral structure 12W and the conductive portions of the rear housing wall 12R are sometimes collectively referred to herein as the conductive structure of housing 12. Peripheral structure 12W may extend around the periphery of device 10 and display 14. In a configuration where device 10 and display 14 have a rectangular shape with four edges, peripheral structure 12W may be implemented using a peripheral housing structure having a rectangular ring shape with four corresponding edges and extending from the rear housing wall 12R to the front of device 10 (by way of example). In other words, device 10 may have a length (e.g., measured parallel to the Y-axis), a width less than the length (e.g., measured parallel to the X-axis), and a height less than the width (e.g., measured parallel to the Z-axis). If desired, peripheral structure 12W or a portion thereof may serve as the frame of display 14 (e.g., surrounding all four sides of display 14 and / or decorative embellishments that help hold display 14 to device 10). If necessary, the peripheral structure 12W can form the sidewall structure of the device 10 (e.g., by forming a metal strip with vertical sidewalls, curved sidewalls, etc.).

[0021] The peripheral structure 12W may be formed of a conductive material (such as a metal) and is therefore sometimes referred to as a peripheral conductive shell structure, conductive shell structure, peripheral metal structure, peripheral conductive sidewall, peripheral conductive sidewall structure, conductive shell sidewall, peripheral conductive shell sidewall, sidewall, sidewall structure, or peripheral conductive shell member (by way of example). The peripheral structure 12W may be formed of a metal such as stainless steel, aluminum, alloy, or other suitable material. One, two, or more than two separate structures may be used to form the peripheral structure 12W.

[0022] The peripheral structure 12W does not necessarily have a uniform cross-section. For example, if desired, the top of the peripheral structure 12W may have an inwardly projecting flange that helps hold the display 14 in place. The bottom of the peripheral structure 12W may also have an enlarged lip (e.g., in the plane of the back of the device 10). The peripheral structure 12W may have substantially straight vertical sidewalls, may have curved sidewalls, or may have other suitable shapes. In some configurations (e.g., when the peripheral structure 12W serves as the outer frame of the display 14), the peripheral structure 12W may extend around the lip of the housing 12 (i.e., the peripheral structure 12W may only cover the edge of the housing 12 surrounding the display 14 and not the remaining sidewalls of the housing 12).

[0023] The rear housing wall 12R may be located in a plane parallel to the display 14. In the configuration of device 10, where some or all of the rear housing wall 12R is formed of metal, it may be necessary to form a portion of the peripheral structure 12W as an integrated part of the housing structure forming the rear housing wall 12R. For example, the rear housing wall 12R of device 10 may include a planar metal structure, and a portion of the peripheral structure 12W on the side of housing 12 may be formed as a flat or curved vertically extending integrated metal portion of the planar metal structure (e.g., the rear housing wall 12R and the peripheral structure 12W may be formed from a continuous sheet of metal in a monolithic configuration). If desired, housing structures such as these housing structures may be machined from metal blocks and / or may include multiple metal pieces assembled together to form housing 12. The rear housing wall 12R may have one or more, two or more, or three or more parts. The conductive portions of the peripheral structure 12W and / or the rear housing wall 12R may form one or more outer surfaces of the device 10 (e.g., user-visible surfaces of the device 10), and / or may be implemented using internal structures that do not form outer surfaces of the device 10 (e.g., user-invisible conductive housing structures of the device 10, such as conductive structures covered with layers (e.g., thin decorative layers, protective coatings, and / or other coatings that may include dielectric materials such as glass, ceramics, and plastics) or other structures that form outer surfaces of the device 10 and / or serve to conceal the conductive portions of the peripheral structure 12W and / or the rear housing wall 12R from being seen by the user).

[0024] Display 14 may have a pixel array forming an effective area AA, which displays an image of the user of device 10. For example, the effective area AA may include a display pixel array. The pixel array may be formed from liquid crystal display (LCD) components, electrophoretic pixel arrays, plasma display pixel arrays, organic light-emitting diode display pixels or other light-emitting diode pixel arrays, electrowetting display pixel arrays, or display pixels based on other display technologies. If desired, the effective area AA may include a touch sensor, such as a touch sensor capacitive electrode, a force sensor, or other sensors for collecting user input.

[0025] Display 14 may have invalid boundary regions extending along one or more edges of the active region AA. The invalid region AA of display 14 may lack pixels for displaying images and may overlap with circuitry and other internal device structures within housing 12. To prevent these structures from being viewed by the user of device 10, an opaque masking layer may be applied to the underside of the display overlay or to other layers in display 14 that overlap with the invalid region AA. The opaque masking layer may have any suitable color. The invalid region AA may include a recessed area or notch extending into the active region AA (e.g., at speaker port 16). The active region AA may be defined, for example, by a lateral region of the display module of display 14 (e.g., a display module including pixel circuitry, touch sensor circuitry, etc.).

[0026] A display cover can be used to protect the display 14. The display cover may be made of a layer of transparent glass, transparent plastic, transparent ceramic, sapphire, or other transparent crystalline material, or one or more other transparent layers. The display cover may have a planar shape, a convex curved profile, a shape with planar and curved portions, a layout including a planar main area surrounding one or more edges (parts of one or more edges bending outwards from the plane of the planar main area), or other suitable shapes. The display cover may cover the entire front of the device 10. In another suitable arrangement, the display cover may substantially cover all of the front of the device 10 or only a portion of the front of the device 10. Openings may be formed in the display cover. For example, openings may be formed in the display cover to accommodate buttons. Openings may also be formed in the display cover to accommodate ports such as speaker port 16 or microphone port. If desired, openings may be formed in the housing 12 to form communication ports (e.g., audio jack ports, digital data ports, etc.) and / or audio ports for audio components, such as speakers and / or microphones.

[0027] Display 14 may include conductive structures such as capacitive electrode arrays for touch sensors, conductive lines for addressing pixels, driver circuitry, etc. Housing 12 may include internal conductive structures such as metal frame members and planar conductive housing members (sometimes referred to as conductive support plates or back plates) spanning the walls of housing 12 (e.g., a substantially rectangular sheet formed by welding or otherwise connecting one or more metal portions between opposing sides of the peripheral structure 12W). The conductive support plate may form the outer rear surface of device 10, or may be covered by a dielectric overlay (such as a thin decorative layer, protective coating, and / or other coatings that may include dielectric materials such as glass, ceramic, or plastic) or other structures that form the outer surface of device 10 and / or serve to conceal the conductive support plate from being seen by the user (e.g., the conductive support plate may form part of the rear housing wall 12R). Device 10 may also include conductive structures such as printed circuit boards, components mounted on the printed circuit boards, and other internal conductive structures. For example, these conductive structures, which may be used to form a ground plane in device 10, may extend under the effective area AA of display 14.

[0028] In regions 22 and 20, openings may be formed within the conductive structures of device 10 (e.g., between the peripheral structure 12W and the opposing conductive grounding structure (such as conductive portions of the rear housing wall 12R, conductive traces on a printed circuit board, conductive electronic components in display 14, etc.)). If desired, these openings, sometimes referred to as gaps, may be filled with air, plastic, and / or other dielectrics and may be used to form slot antenna resonant elements for one or more antennas in device 10.

[0029] The conductive housing structure and other conductive structures in device 10 can be used as a ground plane for the antenna in device 10. The openings in regions 22 and 20 can be used as slots in open or closed slot antennas, as a central dielectric region surrounded by conductive paths of material in a loop antenna, as spaces separating antenna resonant elements (such as strip antenna resonant elements or inverted F-shaped antenna resonant elements) from the ground plane, contributing to the performance of parasitic antenna resonant elements, or otherwise serving as part of the antenna structures formed in regions 22 and 20. If desired, the ground plane under the effective area AA of the display 14 and / or other metallic structures in device 10 may have a portion extending into a portion of the end of device 10 (e.g., the ground portion may extend toward the dielectric-filled openings in regions 22 and 20), thereby narrowing the slots in regions 22 and 20. Region 22 may sometimes be referred to herein as the lower region or lower end of device 10. Region 20 may sometimes be referred herein as the upper region or upper end of device 10.

[0030] Generally, device 10 may include any suitable number of antennas (e.g., one or more, two or more, three or more, four or more, etc.). The antennas in device 10 may be located along one or more edges of the device housing at opposite first and second ends of the elongated device housing (e.g., at...). Figure 1 The device 10 may be located in area 22 and / or area 20, at the center of the device housing, in other suitable locations, or in one or more of these locations. Figure 1 The arrangement is only illustrative.

[0031] The outer structure 12W may include an outer gap structure. For example, the outer structure 12W may include one or more dielectric-filled gaps, such as... Figure 1 The gap 18 is shown. Gaps in the peripheral structure 12W can be filled using dielectrics such as polymers, ceramics, glass, air, other dielectric materials, or combinations thereof. Gaps 18 divide the peripheral structure 12W into one or more peripheral conductive segments. Conductive segments formed in this way can form part of an antenna in the device 10 if desired. Other dielectric openings can be formed in the peripheral structure 12W (e.g., dielectric openings other than gap 18) and can serve as dielectric antenna windows for antennas mounted inside the device 10. Antennas within the device 10 can be aligned with dielectric antenna windows for transmitting radio frequency signals through the peripheral structure 12W. Antennas within the device 10 can also be aligned with inactive areas IA of the display 14 for transmitting radio frequency signals through the display 14.

[0032] To provide the end user of device 10 with the largest possible display (e.g., to maximize the area of ​​the device used for displaying media, running applications, etc.), it is desirable to increase the amount of area covered by the effective area AA of display 14 on the front of device 10. Increasing the size of the effective area AA can reduce the size of the ineffective area IA within device 10. This reduces the area behind display 14 available for antennas within device 10. For example, the effective area AA of display 14 may include conductive structures to prevent radio frequency signals processed by an antenna mounted behind the effective area AA from radiating through the front of device 10. Therefore, it is desirable to provide an antenna that occupies a small amount of space within device 10 (e.g., allowing the largest possible effective display area AA) while still allowing the antenna to communicate with wireless equipment outside device 10 with satisfactory efficiency bandwidth.

[0033] In a typical scenario, device 10 may have one or more upper antennas and one or more lower antennas. For example, an upper antenna may be formed in region 20 of device 10. For example, a lower antenna may be formed in region 22 of device 10. If desired, additional antennas may be formed along the edge of the housing 12 extending between region 22 and region 20. Examples of device 10 including three or four upper antennas and five lower antennas are described herein as examples. Antennas may be used individually to cover the same communication frequency band, overlapping communication frequency bands, or separate communication frequency bands. The antenna may be used to implement an antenna diversity scheme or a multiple-input multiple-output (MIMO) antenna scheme. Additional antennas for covering any other desired frequencies may also be installed at any desired location within the interior of device 10. Figure 1 The examples shown are merely illustrative. If desired, the housing 12 may have other shapes (e.g., square, cylindrical, spherical, combinations of these shapes, and / or different shapes, etc.).

[0034] Figure 2 A schematic diagram of an exemplary component that can be used in device 10 is shown. Figure 2 As shown, device 10 may include control circuitry 28. Control circuitry 28 may include storage circuitry 30, such as a storage repository. Storage circuitry 30 may include hard disk drive storage devices, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory configured to form a solid-state drive), volatile memory (e.g., static or dynamic random access memory), etc.

[0035] Control circuitry 28 may include processing circuitry such as processing circuitry 32. Processing circuitry 32 can be used to control the operation of device 10. Processing circuitry 32 may include one or more microprocessors, microcontrollers, digital signal processors, host processors, baseband processor integrated circuits, application-specific integrated circuits, central processing units (CPUs), graphics processing units (GPUs), etc. Control circuitry 28 may be configured to perform operations in device 10 using hardware (e.g., dedicated hardware or circuitry), firmware, and / or software. Software code used to perform operations in device 10 may be stored on storage circuitry 30 (e.g., storage circuitry 30 may include a non-transitory (tangible) computer-readable storage medium storing the software code). This software code may sometimes be referred to as program instructions, software, data, commands, or code. The software code stored on storage circuitry 30 may be executed by processing circuitry 32.

[0036] Control circuitry 28 can be used to run software on device 10, such as internet browsing applications, Voice over Internet Protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. To support interaction with external equipment, control circuitry 28 can be used to implement communication protocols. Communication protocols that can be implemented using control circuitry 28 include Internet Protocol, wireless LAN protocols (e.g., IEEE 802.11 protocol—sometimes referred to as WiFi). ® Protocols used for other short-range wireless communication links, such as Bluetooth. ® This includes protocols such as WPAN protocols, IEEE 802.11ad protocols, cellular phone protocols, MIMO protocols, antenna diversity protocols, satellite navigation system protocols, and antenna-based spatial ranging protocols (e.g., Radio Detection and Ranging (RADAR) protocols or other required distance detection protocols for signals transmitted at millimeter-wave and centimeter-wave frequencies). Each communication protocol may be associated with a corresponding Radio Access Technology (RAT) that specifies the physical connection method used to implement the protocol.

[0037] Device 10 may include input-output circuitry 24. Input-output circuitry 24 may include input-output devices 26. Input-output devices 26 may be used to allow data to be supplied to device 10 and to allow data to be supplied from device 10 to external devices. Input-output devices 26 may include user interface devices, data port devices, sensors, and other input-output components. For example, input-output devices may include touchscreens, displays without touch sensor capabilities, buttons, joysticks, scroll wheels, touchpads, keypads, keyboards, microphones, cameras, speakers, status indicators, light sources, audio jacks, and other audio port components, digital data port devices, light sensors, gyroscopes, accelerometers, or other components capable of detecting motion and device orientation relative to the earth, capacitive sensors, proximity sensors (e.g., capacitive proximity sensors and / or infrared proximity sensors), magnetic sensors, and other sensors and input-output components.

[0038] Input-output circuitry 24 may include wireless circuitry, such as wireless circuitry 34 for wireless transmission of radio frequency signals. Although for clarity... Figure 2 In the example, control circuitry 28 is shown separately from wireless circuitry 34, but wireless circuitry 34 may include processing circuitry forming part of processing circuitry 32 and / or storage circuitry forming part of storage circuitry 30 forming part of control circuitry 28 (e.g., a portion of control circuitry 28 that may be implemented on wireless circuitry 34). For example, control circuitry 28 may include baseband processor circuitry or other control components forming part of wireless circuitry 34.

[0039] Wireless circuit 34 may include millimeter-wave and centimeter-wave transceiver circuitry such as millimeter-wave / centimeter-wave transceiver circuitry 38. Millimeter-wave / centimeter-wave transceiver circuitry 38 may support communication at frequencies between approximately 10 GHz and 300 GHz. For example, millimeter-wave / centimeter-wave transceiver circuitry 38 may support communication in extremely high frequency (EHF) or millimeter-wave communication bands between approximately 30 GHz and 300 GHz and / or in centimeter-wave communication bands (sometimes referred to as ultra-high frequency (SHF) bands) between approximately 10 GHz and 30 GHz. For example, millimeter-wave / centimeter-wave transceiver circuitry 38 may support communication in the following communication bands: the IEEE K communication band between approximately 18 GHz and 27 GHz, the K-band between approximately 26.5 GHz and 40 GHz... a Communication frequency band, between approximately 12 GHz and 18 GHz K u The communication band may include the V communication band between approximately 40 GHz and 75 GHz, the W communication band between approximately 75 GHz and 110 GHz, or any other desired band between approximately 10 GHz and 300 GHz. If desired, the millimeter-wave / centimeter-wave transceiver circuitry 38 may support IEEE 802.11ad communication at 60 GHz (e.g., the WiGig or 60 GHz Wi-Fi band between approximately 57 GHz and 61 GHz) and / or the 5G mobile network or 5G wireless system (5G) New Radio (NR) frequency range 2 (FR2) communication band between approximately 24 GHz and 90 GHz. The millimeter-wave / centimeter-wave transceiver circuitry 38 may be formed from one or more integrated circuits (e.g., multiple integrated circuits mounted on a general-purpose printed circuit board in a system package device, one or more integrated circuits mounted on different substrates, etc.).

[0040] Millimeter-wave / centimeter-wave transceiver circuit 38 (sometimes simply referred to herein as transceiver circuit or millimeter-wave / centimeter-wave circuit) can perform spatial ranging operations using radio frequency signals transmitted and received by the millimeter-wave / centimeter-wave transceiver circuit 38 at millimeter-wave and / or centimeter-wave frequencies. The received signal may be a version of the transmitted signal that has been reflected from an external object and returned to device 10. Control circuit 28 can process the transmitted and received signals to detect or estimate the distance between device 10 and one or more external objects around device 10 (e.g., objects outside device 10, such as the body of a user or other person, other equipment, animals, furniture, walls, or other objects or obstacles near device 10). If desired, control circuit 28 can also process the transmitted and received signals to identify the two-dimensional or three-dimensional spatial position of the external object relative to device 10.

[0041] The spatial ranging operation performed by the millimeter-wave / centimeter-wave transceiver circuit 38 is unidirectional. If needed, the millimeter-wave / centimeter-wave transceiver circuit 38 can also communicate bidirectionally with external wireless equipment, such as external wireless equipment 10 (e.g., via a bidirectional millimeter-wave / centimeter-wave wireless communication link). External wireless equipment may include other electronic devices such as electronic device 10, wireless base stations, wireless access points, wireless accessories, or any other desired equipment for transmitting and receiving millimeter-wave / centimeter-wave signals. Bidirectional communication involves the transmission of wireless data by the millimeter-wave / centimeter-wave transceiver circuit 38 and the reception of the transmitted wireless data by the external wireless equipment. Wireless data may include, for example, data encoded into corresponding data packets, such as wireless data associated with telephone calls, streaming media content, internet browsing, wireless data associated with software applications running on device 10, email messages, etc.

[0042] If needed, wireless circuitry 34 may include transceiver circuitry for handling communications at frequencies below 10 GHz, such as non-millimeter-wave / centimeter-wave transceiver circuitry 36. For example, non-millimeter-wave / centimeter-wave transceiver circuitry 36 may handle wireless local area network (WLAN) communication bands, such as 2.4 GHz and 5 GHz Wi-Fi. ® (IEEE 802.11) band; Wireless Personal Area Network (WPAN) communication bands, such as 2.4GHz Bluetooth. ®Communication frequency bands; cellular telephone communication frequency bands, such as the low frequency band (LB) (e.g., 600MHz to 960MHz), the low-mid frequency band (LMB) (e.g., 1400MHz to 1550MHz), the mid frequency band (MB) (e.g., 1700MHz to 2200MHz), the high frequency band (HB) (e.g., 2300MHz to 2700MHz), the ultra-high frequency band (UHB) (e.g., 3300MHz to 5000MHz), or other cellular communication frequency bands between approximately 600MHz and approximately 5000MHz (e.g., 3G bands, 4G LTE bands, 5G New Radio frequency range 1 (FR1) band below 10GHz, etc.); near field communication (NFC) bands (e.g., 13.56MHz); satellite navigation bands (e.g., the L1 Global Positioning System (GPS) band at 1575MHz, the L5 at 1176MHz). GPS bands, GLONASS bands, BeiDou Navigation Satellite System (BDS) bands, etc.; ultra-wideband (UWB) communication bands supported by the IEEE 802.15.4 protocol and / or other UWB communication protocols (e.g., a first UWB communication band of 6.5 GHz and / or a second UWB communication band of 8.0 GHz); and / or any other desired communication bands. The communication bands processed by the RF transceiver circuitry may sometimes be referred to herein as frequency bands or simply “bands” and may span the corresponding frequency range. The non-millimeter-wave / centimeter-wave transceiver circuitry 36 and the millimeter-wave / centimeter-wave transceiver circuitry 38 may each include one or more integrated circuits, power amplifier circuitry, low-noise input amplifiers, passive RF components, switching circuitry, transmission line structures, and other circuitry for processing RF signals.

[0043] Generally speaking, the transceiver circuitry in wireless circuit 34 can cover (process) any desired frequency band. For example... Figure 2 As shown, wireless circuitry 34 may include antenna 40. Transceiver circuitry may use one or more antennas 40 to transmit radio frequency (RF) signals (e.g., antenna 40 may transmit RF signals for transceiver circuitry). As used herein, the term "transmit RF signals" means the transmission and / or reception of RF signals (e.g., for performing one-way and / or two-way wireless communication with external wireless communication equipment). Antenna 40 may transmit RF signals by radiating them (or through an intermediary device structure such as a dielectric overlay) into free space. Alternatively or additionally, antenna 40 may receive RF signals from free space (e.g., through an intermediary device structure such as a dielectric overlay). The transmission and reception of RF signals by antenna 40 each involve the excitation or resonance of antenna currents on antenna resonant elements in the antenna by RF signals within the antenna's operating frequency band.

[0044] In satellite navigation system links, cellular phone links, and other long-distance links, radio frequency signals are typically used to transmit data over thousands of feet or miles. Wi-Fi at 2.4 GHz and 5 GHz... ® Links and Bluetooth ® In short-range wireless links, radio frequency (RF) signals are typically used to transmit data over distances of tens or hundreds of feet. Millimeter-wave / centimeter-wave transceiver circuitry 38 can transmit RF signals over short distances traveling along a line-of-sight path. To enhance signal reception in millimeter-wave and centimeter-wave communications, phased antenna arrays and beamforming (straightening) techniques can be used (e.g., schemes in which the antenna signal phase and / or amplitude of each antenna in the array is adjusted to perform beam steering). Antenna diversity schemes can also be used to ensure that antennas have begun to be blocked or otherwise degraded, as the operating environment of device 10 can be switched to a state where no antennas are used and higher-performance antennas are employed in their locations.

[0045] The antenna 40 in the wireless circuit 34 can be formed using any suitable antenna type. For example, the antenna 40 may include an antenna with a resonant element, formed from a stacked patch antenna structure, a loop antenna structure, a patch antenna structure, an inverted F-shaped antenna structure, a slot antenna structure, a planar inverted F-shaped antenna structure, a monopole antenna structure, a dipole antenna structure, a helical antenna structure, a Yagi-Uda antenna structure, a mixture of these designs, etc. In another suitable arrangement, the antenna 40 may include an antenna with a dielectric resonant element, such as a dielectric resonator antenna. If desired, one or more antennas 40 may be cavity-backed antennas. Different types of antennas may be used for different frequency bands and combinations of frequency bands. For example, one type of antenna may be used to form a non-millimeter-wave / centimeter-wave wireless link for a non-millimeter-wave / centimeter-wave transceiver circuit 36, while another type of antenna may be used to transmit radio frequency signals at millimeter-wave and / or centimeter-wave frequencies for a millimeter-wave / centimeter-wave transceiver circuit 38. The antenna 40 for transmitting radio frequency signals at millimeter-wave and / or centimeter-wave frequencies may be arranged in one or more phased antenna arrays.

[0046] Figure 3 The diagram shows an antenna 40 that can be formed in a phased antenna array for transmitting radio frequency signals at millimeter-wave and / or centimeter-wave frequencies. Figure 3As shown, antenna 40 can be coupled to millimeter-wave / centimeter-wave transceiver circuit 38. Millimeter-wave / centimeter-wave transceiver circuit 38 can be coupled to antenna feed section 44 of antenna 40 using a transmission line path including radio frequency transmission line 42. Radio frequency transmission line 42 may include a positive signal conductor such as signal conductor 46, and may include a ground conductor such as ground conductor 48. Ground conductor 48 can be coupled to antenna ground of antenna 40 (e.g., at the ground antenna feed terminal of antenna feed section 44 located at antenna ground). Signal conductor 46 can be coupled to antenna resonant element of antenna 40. For example, signal conductor 46 can be coupled to the positive antenna feed terminal of antenna feed section 44 located at antenna resonant element.

[0047] In another suitable arrangement, antenna 40 can be an antenna fed by a feed probe. In this arrangement, antenna feed section 44 can be implemented as a feed probe. Signal conductor 46 can be coupled to the feed probe. RF transmission line 42 can transmit RF signals to and from the feed probe. When RF signals are being transmitted on the feed probe and antenna, the feed probe can excite the resonant element of the antenna (e.g., excite the electromagnetic resonant mode of the dielectric antenna resonant element of antenna 40). The resonant element can radiate RF signals in response to being excited by the feed probe. Similarly, when the antenna receives RF signals (e.g., from free space), the RF signals can excite the resonant element of the antenna (e.g., excite the electromagnetic resonant mode of the dielectric antenna resonant element of antenna 40). This can generate an antenna current on the feed probe, and the corresponding RF signal can be transmitted to the transceiver circuitry via the RF transmission line.

[0048] The RF transmission line 42 may include a stripline transmission line (sometimes simply referred to as a stripline herein), a coaxial cable, a coaxial probe implemented with a metallized via, a microstrip transmission line, an edge-coupled microstrip transmission line, an edge-coupled stripline transmission line, a waveguide structure, or a combination thereof. Various types of transmission lines can be used to form the transmission line path that couples the millimeter-wave / centimeter-wave transceiver circuitry 38 to the antenna feed section 44. If desired, filter circuits, switching circuits, impedance matching circuits, phase shifter circuits, amplifier circuits, and / or other circuits may be inserted onto the RF transmission line 42.

[0049] The radio frequency (RF) transmission lines in device 10 can be integrated into a ceramic substrate, a rigid printed circuit board, and / or a flexible printed circuit. In a suitable arrangement, the RF transmission lines in device 10 can be integrated within a multilayer laminate structure (e.g., layers of conductive material (such as copper) and dielectric material (such as resin) laminated together without the intervention of an adhesive), which can be folded or bent in multiple dimensions (e.g., two-dimensional or three-dimensional) and retain its bent or folded shape after bending (e.g., the multilayer laminate structure can be folded into a specific three-dimensional shape to wire around other device components and can be sufficiently rigid to retain its shape after folding without being held in place by reinforcements or other structures). All the multiple layers of the laminate structure can be laminated together in batches without adhesive (e.g., in a single pressing process) (e.g., in contrast to performing multiple pressing processes to laminate multiple layers together with adhesive).

[0050] Figure 4 This illustrates how an antenna 40 for processing radio frequency signals at millimeter-wave and centimeter-wave frequencies can be formed in a phased antenna array. For example... Figure 4 As shown, the phased antenna array 54 (sometimes referred to herein as an array, antenna array, or array of antennas 40) can be coupled to radio frequency transmission line 42. For example, the first antenna 40-1 in the phased antenna array 54 can be coupled to the first radio frequency transmission line 42-1, the second antenna 40-2 in the phased antenna array 54 can be coupled to the second radio frequency transmission line 42-2, the Nth antenna 40-N in the phased antenna array 54 can be coupled to the Nth radio frequency transmission line 42-N, and so on. Although antennas 40 are described herein as forming a phased antenna array, antennas 40 in the phased antenna array 54 can sometimes be referred to as collectively forming a single phased array antenna.

[0051] The antennas 40 in the phased antenna array 54 can be arranged in any desired number of rows and columns or in any other desired pattern (e.g., the antennas do not need to be arranged in a grid pattern with rows and columns). During signal transmission operation, the radio frequency transmission line 42 can be used to transmit signals (e.g., radio frequency signals, such as millimeter wave and / or centimeter wave signals) from the millimeter wave / centimeter wave transceiver circuit 38 ( Figure 3 The signal is supplied to the phased antenna array 54 for wireless transmission. During signal reception operation, the radio frequency transmission line 42 can be used to supply the signal received at the phased antenna array 54 (e.g., received from external wireless equipment, or transmitted signal reflected by an external object) to the millimeter-wave / centimeter-wave transceiver circuitry 38. Figure 3 ).

[0052] Using multiple antennas 40 in a phased antenna array 54 allows for beam steering arrangements by controlling the relative phase and amplitude (vibration) of the radio frequency signals transmitted by the antennas. Figure 4 In the example, each of the antennas 40 has a corresponding radio frequency phase and amplitude controller 50 (e.g., a first phase and amplitude controller 50-1 inserted on radio frequency transmission line 42-1 can control the phase and amplitude of the radio frequency signal processed by antenna 40-1, a second phase and amplitude controller 50-2 inserted on radio frequency transmission line 42-2 can control the phase and amplitude of the radio frequency signal processed by antenna 40-2, and an Nth phase and amplitude controller 50-N inserted on radio frequency transmission line 42-N can control the phase and amplitude of the radio frequency signal processed by antenna 40-N, etc.).

[0053] The phase and amplitude controllers 50 may each include circuitry for adjusting the phase of the radio frequency signal on the radio frequency transmission line 42 (e.g., a phase shifter circuit) and / or circuitry for adjusting the amplitude of the radio frequency signal on the radio frequency transmission line 42 (e.g., a power amplifier and / or low-noise amplifier circuitry). The phase and amplitude controllers 50 may be collectively referred to herein as beam steering circuitry (e.g., beam steering circuitry for steering the beam of the radio frequency signal transmitted and / or received by the phased antenna array 54).

[0054] Phase and amplitude controller 50 can adjust the relative phase and / or amplitude of the transmitted signals supplied to each antenna in phased antenna array 54, and can adjust the relative phase and / or amplitude of the received signals received by phased antenna array 54. If desired, phase and amplitude controller 50 may include phase detection circuitry for detecting the phase of the received signals received by phased antenna array 54. The terms “beam” or “signal beam” may be used herein to uniformly refer to wireless signals transmitted and received by phased antenna array 54 in a particular direction. A signal beam may exhibit a peak gain oriented in a particular pointing direction with a corresponding pointing angle (e.g., based on constructive and destructive interference of the signal combination from each antenna in the phased antenna array). The term “transmit beam” may sometimes be used herein to refer to radio frequency signals transmitted in a particular direction, while the term “receive beam” may sometimes be used herein to refer to radio frequency signals received from a particular direction.

[0055] For example, if the phase and amplitude controller 50 is adjusted to generate a first set of phases and / or amplitudes of the transmitted radio frequency signal, the transmitted signal will form as follows: Figure 4Beam B1 is a transmit beam oriented in the direction of point A. However, if the phase and amplitude controller 50 is adjusted to generate a second set of phases and / or amplitudes for the transmitted signal, the transmitted signal will form a transmit beam oriented in the direction of point B, as shown in beam B2. Similarly, if the phase and amplitude controller 50 is adjusted to generate a first set of phases and / or amplitudes, an RF signal can be received from the direction of point A (e.g., an RF signal in the beam), as shown in beam B1. If the phase and amplitude controller 50 is adjusted to generate a second set of phases and / or amplitudes, an RF signal can be received from the direction of point B, as shown in beam B2.

[0056] Based on Figure 2 The control circuit 28 receives corresponding control signals 52 to control each phase and amplitude controller 50 to generate the desired phase and / or amplitude (e.g., control signal 52-1 can be used to control the phase and / or amplitude provided by phase and amplitude controller 50-1, control signal 52-2 can be used to control the phase and / or amplitude provided by phase and amplitude controller 50-2, etc.). If needed, the control circuit can actively adjust the control signals 52 in real time to steer the transmit or receive beam in different desired directions over time. If needed, the phase and amplitude controller 50 can provide the control circuit 28 with information identifying the phase of the received signal.

[0057] When performing wireless communication using radio frequency signals at millimeter-wave and centimeter-wave frequencies, the radio frequency signals are transmitted along the line-of-sight path between the phased antenna array 54 and the external communication equipment. If an external object is located... Figure 4 At point A, the phase and amplitude controller 50 can be adjusted to steer the signal beam toward point A (e.g., to steer the direction of the steerable signal beam toward point A). The phased antenna array 54 can transmit and receive radio frequency signals in the direction of point A. Similarly, if external communication equipment is located at point B, the phase and amplitude controller 50 can be adjusted to steer the signal beam toward point B (e.g., to steer the direction of the steerable signal beam toward point B). The phased antenna array 54 can transmit and receive radio frequency signals in the direction of point B. Figure 4 In the example, for simplicity, beam steering is shown as occurring in a single degree of freedom (e.g., in...). Figure 4 This can be performed on the page facing left and right. However, in practice, it can be performed in two or more degrees of freedom (e.g., entering and leaving the page in three dimensions and in...). Figure 4 The phased antenna array 54 may have a corresponding field of view on which beam steering can be performed (e.g., in a hemispherical or hemispherical segment of the phased antenna array). If desired, the device 10 may include a plurality of phased antenna arrays, each facing a different direction to provide coverage from multiple sides of the device.

[0058] Figure 5 This is a cross-sectional side view of device 10 in an example where device 10 has multiple phased antenna arrays. (See example...) Figure 5 As shown, the peripheral structure 12W may extend around the (lateral) periphery of the device 10 and may extend from the rear housing wall 12R to the display 14. The display 14 may have a display module such as a display module 68 (sometimes referred to as a display panel). The display module 68 may include pixel circuitry, touch sensor circuitry, force sensor circuitry, and / or any other desired circuitry for forming the effective area AA of the display 14. The display 14 may include a dielectric overlay, such as a display overlay 56 overlapping the display module 68. The display module 68 may emit image light and may receive sensor input through the display overlay 56. The display overlay 56 and the display 14 may be mounted to the peripheral structure 12W. The lateral regions of the display 14 that do not overlap with the display module 68 may form the ineffective area IA of the display 14.

[0059] Device 10 may include multiple phased antenna arrays 54, such as a rear-facing phased antenna array 54-1. Figure 5 As shown, the phased antenna array 54-1 can transmit and receive radio frequency signals 60 at millimeter-wave and centimeter-wave frequencies through the rear housing wall 12R. In cases where the rear housing wall 12R includes a metal portion, the radio frequency signal 60 can be transmitted through holes or openings in the metal portion of the rear housing wall 12R, or through other dielectric portions of the rear housing wall 12R. The holes may overlap with a dielectric overlay or dielectric coating extending across a lateral region of the rear housing wall 12R (e.g., between peripheral structures 12W). The phased antenna array 54-1 can perform beam steering for the radio frequency signal 60 across the hemisphere under device 10, as indicated by arrow 62.

[0060] The phased antenna array 54-1 can be mounted to a substrate such as substrate 64. Substrate 64 can be an integrated circuit chip, flexible printed circuit, rigid printed circuit board, or other substrate. In this document, substrate 64 may sometimes be referred to as an antenna module. If desired, transceiver circuitry (e.g., Figure 2 The millimeter-wave / centimeter-wave transceiver circuit 38) can be mounted to the antenna module. The phased antenna array 54-1 can be adhered to the rear housing wall 12R using adhesive, can be pressed against (e.g., contact) the rear housing wall 12R, or can be spaced apart from the rear housing wall 12R.

[0061] The field of view of the phased antenna array 54-1 is limited to the hemisphere below the rear of device 10. The display module 68 and other components 58 in device 10 (e.g., Figure 2The input-output circuitry 24 or control circuitry 28, the battery for device 10, etc., include conductive structures. These conductive structures can, if not carefully managed, prevent the transmission of radio frequency signals by the phased antenna array within device 10 across the hemisphere on the front of device 10. While an additional phased antenna array to cover the hemisphere on the front of device 10 could be mounted against the display overlay 56 within the ineffective area IA, there may not be sufficient space between the lateral periphery of display module 68 and the peripheral structure 12W to form all the circuitry and radio frequency transmission lines necessary to fully support the phased antenna array.

[0062] To mitigate these issues and provide coverage across the front of device 10, a front-facing phased antenna array can be mounted within the peripheral region 66 of device 10. The antennas in the front-facing phased antenna array may include dielectric resonator antennas. The dielectric resonator antennas may be... Figure 5 It occupies less area in the XY plane than other types of antennas such as patch antennas and slot antennas. Implementing the antenna as a dielectric resonator antenna allows the radiating elements of the front-facing phased antenna array to be fitted within the unused area IA between the display module 68 and the peripheral structure 12W. Meanwhile, the RF transmission lines and other components of the phased antenna array can be located behind (below) the display module 68. While this document describes an example of a front-facing phased antenna array radiating through the display 14, in another suitable arrangement, the phased antenna array could be a side-facing phased antenna array radiating through one or more apertures in the peripheral structure 12W.

[0063] Figure 6 This is a cross-sectional side view of an exemplary dielectric resonator antenna in the front-facing phased antenna array of device 10. Figure 6 As shown, device 10 may include a given antenna 40 (e.g., mounted on...). Figure 5 A front-facing phased antenna array (within the outer region 66). Figure 6 Antenna 40 may be a dielectric resonator antenna. In this example, antenna 40 includes a dielectric resonator element 92 mounted to an underlying substrate (such as circuit board 72). For example, circuit board 72 may be a flexible printed circuit board or a rigid printed circuit board.

[0064] Circuit board 72 has a lateral region extending along the rear housing wall 12R (e.g., in Figure 6 In the XY plane). The circuit board 72 can be adhered to the rear housing wall 12R using adhesive, can be pressed against (e.g., placed in contact) the rear housing wall 12R, or can be separated from the rear housing wall 12R. The circuit board 72 may have a first end at the antenna 40 and be coupled to millimeter-wave / centimeter-wave transceiver circuitry in the device 10 (e.g., in the XY plane). Figure 2The millimeter-wave / centimeter-wave transceiver circuit 38) has a corresponding second end. In a suitable arrangement, the second end of the circuit board 72 can be coupled to... Figure 5 Antenna module.

[0065] like Figure 6 As shown, circuit board 72 may include a stacked dielectric layer 70. The dielectric layer 70 may include polyimide, ceramic, liquid crystal polymer, plastic, and / or any other desired dielectric material. Conductive traces (such as signal trace 82) may be patterned on the top surface 76 of circuit board 72. Conductive traces (such as ground trace 80) may be patterned on the opposite bottom surface 78 of circuit board 72 or elsewhere within circuit board 72. Ground trace 80 may be maintained at a ground potential and is therefore sometimes referred to herein as ground trace 80. Ground trace 80 may utilize conductive vias extending through circuit board 72 (for clarity, in...). Figure 6 (Not shown) An additional ground trace 80 is shorted to the inside of circuit board 72 and / or on the top surface 76 of circuit board 72. Ground trace 80 may form part of the antenna ground portion of antenna 40. Ground trace 80 may be coupled to the system ground portion in device 10 (e.g., using solder, weld, conductive adhesive, conductive tape, conductive bracket, conductive pin, conductive screw, conductive clip, or a combination thereof). For example, ground trace 80 may be coupled to a conductive portion of peripheral structure 12W, rear housing wall 12R, or other grounding structure in device 10. Figure 6 The example is merely illustrative, wherein signal trace 82 is formed on top surface 76, while ground trace 80 is formed on bottom surface 78 of circuit board 72. If desired, one or more dielectric layers 70 may be layered on signal trace 82, and / or one or more dielectric layers 70 may be layered under ground trace 80.

[0066] The antenna 40 can be fed using radio frequency transmission lines (such as radio frequency transmission line 74) formed on and / or embedded in the circuit board 72. Radio frequency transmission line 74 (e.g., Figure 3 A given radio frequency transmission line 74 (42) may include a ground trace 80 and a signal trace 82. The portion of the ground trace 80 that overlaps with the signal trace 82 may form the ground conductor of the radio frequency transmission line 74 (e.g., Figure 3 The grounding conductor 48). The signal trace 82 may form the signal conductor of the radio frequency transmission line 74 (e.g., Figure 3 The signal conductor 46, and therefore sometimes referred to herein as signal trace 82. The radio frequency transmission line 74 transmits radio frequency signals between the antenna 40 and the millimeter-wave / centimeter-wave transceiver circuitry. Figure 6The example is merely illustrative, in which antenna 40 is fed using signal trace 82 and ground trace 80. Generally, antenna 40 can be fed using any desired transmission line structure in and / or on circuit board 72.

[0067] The dielectric resonant element 92 of the antenna 40 may be formed from a cylindrical (pillar) of dielectric material mounted to the top surface 76 of the circuit board 72. If desired, the dielectric resonant element 92 may be embedded (e.g., laterally surrounding) within a dielectric substrate (such as dielectric substrate 90) mounted to the top surface 76 of the circuit board 72. The dielectric resonant element 92 may have a bottom surface 100 at the circuit board 72 and an opposing top surface 98 at the display 14. The bottom surface 100 may sometimes be referred to as the bottom end, bottom surface, proximal end, or proximal side surface of the dielectric resonant element 92. Similarly, the top surface 98 may sometimes be referred to herein as the top end, top surface, distal end, or distal side surface of the dielectric resonant element 92. The dielectric resonant element 92 may have a vertically extending sidewall 102 extending from the top surface 98 to the bottom surface 100. The dielectric resonant element 92 may extend along a central axis / longitudinal axis (e.g., parallel to the Z-axis) passing through the center of both the top surface 98 and the bottom surface 100. The length of the dielectric resonant element 92 (e.g., as parallel to) Figure 6 The longitudinal axis and Z-axis measurements) can be greater than the width / thickness of the dielectric resonator element 92 (e.g., as parallel to...). Figure 6 X-axis and Y-axis measurements).

[0068] The dimensions of the dielectric resonant element 92 can be adjusted (e.g., in...). Figure 6 The operating (resonant) frequency of antenna 40 is selected in the X, Y, and / or Z axes, which adjusts the resonance and boundary conditions of one or more electromagnetic modes of electromagnetic energy within the dielectric resonant element. The dielectric resonant element 92 can be composed of elements with a dielectric constant of ε. r3 The dielectric material pillars are formed. The dielectric constant ε r3 The values ​​can be relatively high (e.g., greater than 10.0, greater than 12.0, greater than 15.0, greater than 20.0, between 15.0 and 40.0, between 10.0 and 50.0, between 18.0 and 30.0, between 12.0 and 45.0, etc.). In a suitable arrangement, the dielectric resonant element 92 can be formed of zirconium oxide or ceramic material. If desired, other dielectric materials can be used to form the dielectric resonant element 92.

[0069] The dielectric substrate 90 can be made of a dielectric constant ε r4 The material is formed from this. Dielectric constant ε r4 The dielectric constant ε of the dielectric resonator element 92 can be less than that of the dielectric resonator element. r3(For example, less than 18.0, less than 15.0, less than 10.0, between 3.0 and 4.0, less than 5.0, between 2.0 and 5.0, etc.). Dielectric constant ε r4 It can be compared to the dielectric constant ε r3 Smallest values ​​are at least 10.0, 5.0, 15.0, 12.0, 6.0, etc. In a suitable arrangement, the dielectric substrate 90 can be formed of molded plastic (e.g., injection-molded plastic). For example, after the dielectric resonant element 92 has been mounted or secured to the circuit board 72, the molded plastic in the dielectric substrate 90 can be molded onto the dielectric resonant element 92. Therefore, the dielectric substrate 90 may sometimes be referred to herein as plastic overmolding. Other dielectric materials can be used to form the dielectric substrate 90, or the dielectric substrate 90 may be omitted if desired. The difference in dielectric constant between the dielectric resonant element 92 and the dielectric substrate 90 can establish radio frequency boundary conditions between the dielectric resonant element 92 and the dielectric substrate 90 from the bottom surface 100 to the top surface 98. This allows the dielectric resonant element 92 to be configured as a waveguide for propagating radio frequency signals at millimeter-wave and centimeter-wave frequencies.

[0070] The dielectric substrate 90 may have a width (thickness) 106 on each side of the dielectric resonant element 92. The width 106 can be selected to isolate the dielectric resonant element 92 from the surrounding structure 12W and to minimize signal reflections in the dielectric substrate 90. The width 106 may be, for example, of a dielectric constant ε. r4 The effective wavelength of the radio frequency signal in the dielectric material is at least one-tenth of that in the dielectric material. For example, the width 106 can be 0.4-0.5 mm, 0.3-0.5 mm, 0.2-0.6 mm, greater than 0.1 mm, greater than 0.3 mm, 0.2-2.0 mm, 0.3-1.0 mm, or greater than 0.4 mm to 0.5 mm. Figure 6 The example in which the width 106 is constant over the entire height of the dielectric resonant element 92 is merely illustrative.

[0071] When excited by the signal conductor of the RF transmission line 74, the dielectric resonant element 92 can radiate the RF signal 104. In some scenarios, the slot is formed in a ground trace on the top surface 76 of the flexible printed circuit board, the slot is indirectly fed by the signal conductor embedded in the circuit board 72, and the slot excites the dielectric resonant element 92 to radiate the RF signal 104. However, in these scenarios, the radiation characteristics of the antenna may be affected by how the dielectric resonant element is mounted to the circuit board 72. For example, air gaps or adhesive layers used to mount the dielectric resonant element to the flexible printed circuit board may be difficult to control and may unintentionally affect the radiation characteristics of the antenna. To mitigate the problems associated with using a bottom slot to excite the dielectric resonant element 92, the antenna 40 can be fed using an RF feed probe such as a feed probe 85. The feed probe 85 can form the antenna feed portion of the antenna 40 (e.g., Figure 3 It is part of the antenna feed section 44.

[0072] like Figure 6 As shown, the feed probe 85 may include a feed conductor 84. The feed conductor 84 may include a first portion on a given sidewall 102 of the dielectric resonant element 92. The feed conductor 84 may be formed from a stamped sheet metal patch pressed against the sidewall 102 (e.g., via a bias structure and / or a dielectric substrate 90). In another suitable arrangement, the feed conductor 84 may be formed from a conductive trace directly patterned to the sidewall 102 (e.g., using a sputtering process, a laser direct structuring process, or other conductive deposition techniques). The feed conductor 84 may include a second portion coupled to the signal trace 82 using a conductive interconnect structure 86. The conductive interconnect structure 86 may include solder, weld, conductive adhesive, conductive tape, conductive foam, conductive spring, conductive support, and / or any other desired conductive interconnect structure. As an example, the feed probe 85 can be pressed against or mounted to the dielectric resonator 92, which can then be molded within the dielectric substrate 90 (e.g., the dielectric substrate 90 can be molded on the feed probe 85 and the dielectric resonator 92), and the feed probe 85 can be soldered to the conductive interconnect structure 86 to surface mount the antenna 40 (e.g., the dielectric resonator 92 and the dielectric substrate 90) to the circuit board 72.

[0073] Signal trace 82 can transmit radio frequency (RF) signals to and from feed probe 85. Feed probe 85 can electromagnetically couple the RF signals on signal trace 82 into dielectric resonant element 92. This can be used to excite one or more electromagnetic modes (e.g., RF cavity mode or waveguide mode) of dielectric resonant element 92. When excited by feed probe 85, the electromagnetic mode of dielectric resonant element 92 can configure the dielectric resonant element as a waveguide along the length of dielectric resonant element 92 (e.g., at...). Figure 6The wavefront of the radio frequency signal 104 propagates along the Z-axis direction through the top surface 98 and through the display 14.

[0074] For example, during signal transmission, RF transmission line 74 can supply RF signals from millimeter-wave / centimeter-wave transceiver circuitry to antenna 40. Feed probe 85 can couple the RF signals on signal trace 82 to dielectric resonator 92. This can be used to excite one or more electromagnetic modes of dielectric resonator 92, causing RF signal 104 to propagate upwards along the length of dielectric resonator 92 and through display overlay 56 to the outside of device 10. Similarly, during signal reception, RF signal 104 can be received through display overlay 56. The received RF signal can excite electromagnetic modes of dielectric resonator 92, causing RF signal to propagate downwards along the length of dielectric resonator 92. Feed probe 85 can couple the received RF signal to RF transmission line 74, which transmits the RF signal to millimeter-wave / centimeter-wave transceiver circuitry. The relatively large difference in dielectric constant between the dielectric resonator 92 and the dielectric substrate 90 allows the dielectric resonator 92 to transmit the radio frequency signal 104 with relatively high antenna efficiency (e.g., by establishing a strong boundary for the radio frequency signal between the dielectric resonator 92 and the dielectric substrate 90). The relatively high dielectric constant of the dielectric resonator 92 also allows it to occupy a relatively small volume compared to the case where a material with a lower dielectric constant is used.

[0075] The size of the feed probe 85 can be selected (e.g., in...). Figure 6 The impedance of the RF transmission line 74 is matched with that of the dielectric resonant element 92 in the X and Z directions to help match the impedance of the RF transmission line 74 with that of the dielectric resonant element 92. Feed probes 85 may be located on specific sidewalls 102 of the dielectric resonant element 92 to provide the desired linear polarization (e.g., vertical or horizontal polarization) to the antenna 40. If desired, multiple feed probes 85 may be formed on multiple sidewalls 102 of the dielectric resonant element 92 to configure the antenna 40 to simultaneously cover multiple orthogonal linear polarizations. If desired, the phase of each feed probe can be adjusted independently over time to provide additional polarization to the antenna, such as elliptical or circular polarization. Feed probes 85 may sometimes be referred to herein as feed conductors, feed patches, or probe feeds. The dielectric resonant element 92 may sometimes be referred to herein as a dielectric radiating element, dielectric radiator, dielectric resonator, dielectric antenna resonant element, dielectric column, dielectric pillar, radiating element, or resonant element. When fed by one or more feed probes, such as feed probe 85, the dielectric resonator antenna, such as Figure 6 The antenna 40 may sometimes be referred to in this paper as a probe-fed dielectric resonator antenna.

[0076] The display overlay 56 can be made of dielectric constant ε r1 Less than the dielectric constant ε r3 Dielectric materials are formed. For example, the dielectric constant ε r1 The dielectric constant can be between approximately 3.0 and 10.0 (e.g., between 4.0 and 9.0, between 5.0 and 8.0, between 5.5 and 7.0, between 5.0 and 7.0, etc.). In a suitable arrangement, the display cover layer 56 can be formed of glass, plastic, or sapphire. If not careful, a relatively large difference in dielectric constant between the display cover layer 56 and the dielectric resonant element 92 can cause undesirable signal reflections at the boundary between the display cover layer and the dielectric resonant element. These reflections can lead to destructive interference between the transmitted and reflected signals, as well as stray signal loss that unintentionally limits the antenna efficiency of the antenna 40.

[0077] To mitigate the impact, antenna 40 may be provided with an impedance matching layer such as a dielectric matching layer 94. The dielectric matching layer 94 may be mounted between the dielectric resonant element 92 and the display cover layer 56 on the top surface 98 of the dielectric resonant element 92. If desired, the dielectric matching layer 94 may be adhered to the dielectric resonant element 92 using an adhesive layer 96. If desired, adhesive may also be used, or alternatively, to adhere the dielectric matching layer 94 to the display cover layer 56. The adhesive 96 may be relatively thin so as not to significantly affect the propagation of the radio frequency signal 104.

[0078] The dielectric matching layer 94 can be made of dielectric constant ε r2 The dielectric material is formed. The dielectric constant ε r2 It can be greater than the dielectric constant ε r1 And less than the dielectric constant ε r3 For example, the dielectric constant ε r2 It can be equal to SQRT(ε) r1 *ε r3 ), where SQRT() is the square root operator and "*" is the multiplication operator. The existence of a dielectric matching layer 94 allows radio frequency signals to propagate without being directed towards a dielectric constant of ε. r1 The material and the dielectric constant are ε r3 The sharp boundaries between the materials help reduce signal reflection.

[0079] The dielectric matching layer 94 may be provided with a thickness 88. The thickness 88 may be selected to be approximately equal to one-quarter (e.g., within 15%) of the effective wavelength of the radio frequency signal 104 in the dielectric matching layer 94. This is achieved by dividing the free-space wavelength of the radio frequency signal 104 (e.g., a centimeter or millimeter wavelength corresponding to a frequency between 10 GHz and 300 GHz) by a constant factor (e.g., ε). r2The effective wavelength is given by the square root of the wavelength. When a thickness of 88 is provided, the dielectric matching layer 94 can form a quarter-wavelength impedance transducer that mitigates any destructive interference associated with the reflected radio frequency signal 104 at the boundary between the display cover layer 56, the dielectric matching layer 94, and the dielectric resonant element 92. This is merely illustrative, and the dielectric matching layer 94 can be omitted if desired.

[0080] When configured in this manner, antenna 40 can radiate radio frequency signal 104 through the front of device 10, although it is coupled to millimeter-wave / centimeter-wave transceiver circuitry on a circuit board located at the rear of device 10. The relatively narrow width of dielectric resonant element 92 allows antenna 40 to fit within the volume between display module 68, other components 58, and peripheral structure 12W. Figure 6 The antenna 40 may be formed in a front-facing phased antenna array that transmits radio frequency signals across at least a portion of the hemisphere on the front of the device 10.

[0081] Figure 7 for Figure 6 A perspective view of a probe-fed dielectric resonator antenna in which multiple feed probes are used to cover multiple polarizations in the dielectric resonator element. For clarity, from Figure 7 Omitted Figure 6 The peripheral structure 12W, dielectric substrate 90, dielectric matching layer 94, adhesive 96, rear housing wall 12R, display 14 and other components 58.

[0082] like Figure 7 As shown, the dielectric resonant element 92 of the antenna 40 (e.g., Figure 6 The bottom surface 100 of the antenna 40 can be mounted onto the top surface 76 of the circuit board 72. Multiple feed probes 85 (such as a first feed probe 85V and a second feed probe 85H mounted to the dielectric resonator 92 and the circuit board 72) can be used to feed the antenna 40. The first feed probe 85V includes a feed conductor 84V on the first sidewall 102 of the dielectric resonator 92. The second feed probe 85H includes a feed conductor 84H on the second (orthogonal) sidewall 102 of the dielectric resonator 92.

[0083] Antenna 40 can be fed using multiple radio frequency transmission lines 74 (such as a first radio frequency transmission line 74V and a second radio frequency transmission line 74H). The first radio frequency transmission line 74V may include conductive traces 122V and 120V on the top surface 76 of the circuit board 72. Conductive traces 122V and 120V may form the signal conductor of the first radio frequency transmission line 74V (e.g., Figure 6The signal trace 82 is a portion of the circuit board 72. Similarly, the second radio frequency transmission line 74H may include conductive traces 122H and 120H on the top surface 76 of the circuit board 72. Conductive traces 122H and 120H may form the signal conductor of the second radio frequency transmission line 74H (e.g., Figure 6 Part of the signal trace 82.

[0084] Conductive trace 122V may be narrower than conductive trace 120V. Conductive trace 122H may be narrower than conductive trace 120H. Conductive trace 120V and conductive trace 120H may be, for example, conductive contact pads on the top surface 76 of circuit board 72. The feed conductor 84V of the first feed probe 85V may be mounted and coupled to conductive trace 120V (e.g., using...). Figure 6 (Conductive interconnect structure 86). Similarly, the feed conductor 84H of the second feed probe 85H can be mounted and coupled to the conductive trace 120H.

[0085] A first radio frequency (RF) transmission line 74V and a first feed probe 85V can transmit a first RF signal having a first linear polarization (e.g., vertical polarization). When driven using the first RF signal, the first feed probe 85V can excite one or more electromagnetic modes of the dielectric resonant element 92 associated with the first polarization. When excited in this way, the wavefront associated with the first RF signal can propagate along the length of the dielectric resonant element 92 (e.g., along the central axis / longitudinal axis 109) and can be radiated through a display (e.g., via...). Figure 6 The display cover 56). The sidewall 102 may extend in the direction of the central axis / longitudinal axis 109 (e.g., in the +Z direction). The central axis / longitudinal axis 109 may pass through the center of both the top surface and the bottom surface of the dielectric resonant element 92 (e.g., Figure 6 Top surface 98 and bottom surface 100).

[0086] Similarly, the second RF transmission line 74H and the second feed probe 85H can transmit an RF signal with a second linear polarization orthogonal to the first polarization (e.g., horizontal polarization). When driven using the second RF signal, the second feed probe 85H can excite one or more electromagnetic modes of the dielectric resonator 92 associated with the second polarization. When excited in this way, the wavefront associated with the second RF signal can propagate along the length of the dielectric resonator 92 and can be radiated through the display (e.g., via...). Figure 6(Display overlay 56). Both the second feed probe 85H and the first feed probe 85V can be active simultaneously, so that the antenna 40 transmits both the first and second radio frequency signals at any given time. In another suitable arrangement, one of the second feed probe 85H and the first feed probe 85V can be active simultaneously, so that the antenna 40 transmits a radio frequency signal with only a single polarization at any given time.

[0087] The dielectric resonant element 92 may have a first width 110, a second width (thickness) 112, and a height 114. The first width 110, second width 112, and height 114 can be selected to provide a corresponding mixture of electromagnetic cavity mode / waveguide mode to the dielectric resonant element 92, which, when excited by the second feed probe 85H and / or the first feed probe 85V, configures the antenna 40 to radiate at a desired frequency. For example, the height 114 may be 2mm-10mm, 4mm-6mm, 3mm-7mm, 4.5mm-5.5mm, 3mm-4mm, 3.5mm, or greater than 2mm. The second width 112 and the first width 110 may each be 0.5mm-1.0mm, 0.4mm-1.2mm, 0.7mm-0.9mm, 0.5mm-2.0mm, 1.5mm-2.5mm, 1.7mm-1.9mm, 1.0mm-3.0mm, etc. The second width 112 may be equal to the first width 110 or may differ from the first width 110 in other arrangements. The sidewall 102 of the dielectric resonant element 92 may contact the surrounding dielectric substrate (e.g., Figure 6 The dielectric substrate 90. The dielectric substrate may be molded on the second feed probe 85H and the first feed probe 85V, or may include openings, notches, or other structures that accommodate the presence of the second feed probe 85H and the first feed probe 85V. Figure 7 The examples are merely illustrative, and the dielectric resonant element 92 may have other shapes if desired (e.g., shapes with any desired number of straight sidewalls and / or curved sidewalls 102).

[0088] Feed conductors 84V and 84H can each have a width of 118 and a height of 116. The width 118 and height 116 can be selected to match the impedance of the first RF transmission line 74V and the second RF transmission line 74H with the impedance of the dielectric resonant element 92. For example, the width 118 can be between 0.3 mm and 0.7 mm, between 0.2 mm and 0.8 mm, between 0.4 mm and 0.6 mm, or other values. The height 116 can be between 0.3 mm and 0.7 mm, between 0.2 mm and 0.8 mm, between 0.4 mm and 0.6 mm, or other values. The height 116 can be equal to or different from the width 118.

[0089] If desired, the first RF transmission line 74V and the second RF transmission line 74H may include one or more transmission line matching shorts, such as matching shorts 124 coupled to traces 122V and 122H. Matching shorts 124 can help ensure that the impedance of the second RF transmission line 74H and the first RF transmission line 74V is matched with the impedance of the dielectric resonant element 92. Matching shorts 124 may have any desired shape or may be omitted. Feed conductors 84V and 84H may have other shapes (e.g., shapes with any desired number of straight edges and / or curved edges).

[0090] Generally speaking, it is expected that device 10 will exhibit the thinnest possible thickness (e.g., in...). Figure 6 (in the Z-axis direction). However, mounting the dielectric resonator 92 within the peripheral region 66 inadvertently limits the reduction in the thickness of the device 10. For example, the thickness of the device 10 may be limited by the height of the dielectric resonator 92 required to configure the antenna 40 to transmit radio frequency signals at the desired frequency and desired antenna efficiency (e.g., Figure 7 The height 114) is constrained. In order to allow for a further reduction in the thickness of the device 10, the dielectric resonant element 92 in the peripheral region 66 of the device 10 may be a curved dielectric resonant element (e.g., the antenna 40 may be a curved dielectric resonator antenna).

[0091] Figure 8 This is a cross-sectional side view of device 10, illustrating an example of a curved dielectric resonant element that can be disposed in device 10 (e.g., for radiation through a dielectric overlay (such as display overlay 56)). Figure 8 As shown, antenna 40 can be mounted to circuit board 72 and aligned with the opening between display module 68 and peripheral structure 12W. Dielectric resonant element 92 can be a curved dielectric resonant element, rather than formed by a single linear pillar of dielectric material (e.g., as shown in the diagram). Figure 6 and Figure 7 (As shown in the example).

[0092] When configured as a curved dielectric resonator, the dielectric resonator 92 may have at least two segments extending along different longitudinal axes (e.g., longitudinal axes that are not parallel to each other). For example, as Figure 8As shown, the dielectric resonant element 92 may include a first segment (part) 128 extending from the bottom surface 100 of the dielectric resonant element and along a corresponding longitudinal axis 132. The dielectric resonant element 92 may also have a second segment (part) 130 extending from the end of the first segment 128 opposite to the bottom surface 100 and along the longitudinal axis 134 to the top surface 98 of the dielectric resonant element 92. The longitudinal axis 134 may be oriented at a non-parallel angle relative to the longitudinal axis 132. For example, the longitudinal axis 134 may be oriented perpendicular to the longitudinal axis 132 (e.g., the longitudinal axis 132 may be parallel to...). Figure 8 The Y-axis extends, while the longitudinal axis 134 is parallel to... Figure 8 (Z-axis extension). This allows the dielectric resonant element 92 to be configured with a vertical bend between the bottom surface 100 and the top surface 98. As an example, it can be manufactured using current sintering and wire sawing. Figure 8 The curved dielectric resonant element. The first segment 128 and the second segment 130 can be embedded (molded) within the dielectric substrate 90 and mounted to the circuit board 72.

[0093] The first segment 128 of the dielectric resonant element 92 may have at least a first sidewall 140 and a second sidewall 146 opposite to the first sidewall 140 (e.g., on opposite sides of the longitudinal axis 132). A feed probe 85 may be coupled to the first sidewall 140 and may be molded within the dielectric substrate 90 if desired. The feed probe 85 may be soldered to signal traces on the circuit board 72 (e.g., using surface mount technology (SMT) when mounting the antenna 40 to the circuit board 72). The antenna 40 may also have a conductive structure 131 disposed on the second sidewall 146 opposite to the feed probe 85. The conductive structure 131 may include feed probes for the antenna 40 (e.g., for covering such...). Figure 7 The additional polarized feed probe 85 shown may include a parasitic element (e.g., a parasitic patch) pressed against the dielectric resonant element 92 and coupled to ground, or may be omitted. When the conductive structure 131 is a feed probe, the conductive structure 131 may be coupled to a signal trace on the circuit board 72 (e.g., Figure 6 The signal trace 82). When the conductive structure 131 is a parasitic element, the conductive structure 131 can be soldered to the ground trace on the circuit board 72. The conductive structure 131 does not need to be provided on the sidewall opposite to the feed probe 85, and if necessary, it can be provided on one or more sidewalls extending between the second sidewall 146 and the first sidewall 140 (in Figure 8 (Not shown in the cross-sectional side view).

[0094] The first segment 128 may have a length parallel to the longitudinal axis 132 extending from the bottom surface 100 to the second segment 130. The first segment 128 may also have a width measured from the second sidewall 146 to the first sidewall 140, which is less than the length of the first segment 128. In the case where the dielectric resonant element is a straight, unbent column (e.g., Figure 7 The length of the first segment 128 (length 114) can be less than the length of the dielectric resonant element. For example, the width of the first segment 128 can be less than the length of the first segment 128.

[0095] The second segment 130 of the dielectric resonant element 92 may have at least a first sidewall 142 and a second sidewall 144 opposite to the first sidewall 142 (e.g., on the opposite side of the longitudinal axis 134). The second segment 130 may have a length parallel to the longitudinal axis 134 extending from the first segment 128 to the top surface 98. The second segment 130 may also have a width measured from the first sidewall 142 to the second sidewall 144. For example, the width of the second segment 130 may be less than the length of the second segment 130. In an arrangement where the dielectric resonant element is a straight, unbent column (e.g., Figure 7 The length of the first segment 128 is 114), and the length of the second segment 130 can be less than the length of the dielectric resonant element. A structure having a first segment 128 and a second segment 130... Figure 8 The dielectric resonator 92 may sometimes be referred to in this paper as a bent dielectric resonator or an angled dielectric resonator.

[0096] The lengths of the first segment 128 and the second segment 130 can be selected to configure the dielectric resonant element 92 to exhibit a total length approximately equal to the length of the dielectric resonant element (e.g., given by the sum of the first and second lengths) when the dielectric resonant element is a straight, unbent pillar. For example, the length of the first segment plus the length of the second segment can be approximately equal to... Figure 7 The length is 114. This allows the dielectric resonant element 92 to be configured to exhibit the characteristics of a straight, unbent pillar (e.g., as shown in the image). Figure 6 and Figure 7 The arrangement shown in the figure is a mixture of similar electromagnetic resonance modes, which configures the dielectric resonator 92 to transmit radio frequency signals at desired frequencies greater than 10 GHz with satisfactory antenna efficiency when excited by the feed probe 85.

[0097] Simultaneously, bending the dielectric resonator 92 in this manner allows the antenna 40 to be configured to exhibit an overall height 126, as defined by the sum of the width of the first segment 128, the length of the second segment 130, and the portion of the dielectric substrate 90 between the first segment 128 and the bottom end 148 of the dielectric substrate 90. In an arrangement where the dielectric resonator is a straight, unbent pillar, the overall height 126 can be less than the length of the dielectric resonator (e.g., the overall height 126 can be less than...). Figure 6 (Height 114). This allows the antenna 40 to be fitted within the device 10 while minimizing the overall thickness of the device 10.

[0098] While bending (slanting) the dielectric resonator 92 in this manner can allow for a reduction in the thickness of the device 10, if not carefully managed, the bent dielectric resonator can exhibit degraded radio frequency (RF) performance compared to an arrangement where the dielectric resonator is a straight, unbent column. For example, if the first sidewalls 140 and 142 intersect at a right angle, this right angle can cause unpredictable reflections of the RF signal excited in the first segment 128, thereby preventing a significant amount of electromagnetic energy radiation from passing through the top surface 98 of the dielectric resonator 92 and limiting the overall performance of the antenna.

[0099] To optimize the radio frequency performance of antenna 40, dielectric resonant element 92 may be provided with an angular surface 136 that couples the first sidewall 140 of the first segment 128 to the first sidewall 142 of the second segment 130. Angular surface 136 may be referred to herein as angular surface 136 because it extends from the first sidewall 140 to the first sidewall 142 at an angle that is not parallel to the lateral planes of both the first sidewall 140 and the first sidewall 142 (e.g., an angle that is not parallel to both longitudinal axes 132 and 134 and is therefore not zero). Angular surface 136 may sometimes be referred to herein as the angular surface, angular sidewall, or angular wall of dielectric resonant element 92. The angle of angular surface 136 may be selected if desired (e.g., relative to...). Figure 8 The Y-axis measurement is used to reflect electromagnetic energy propagating along the dielectric resonant element 92 within the total internal reflection (TIR) ​​range of the first segment 128 and the second segment 130. As an example, the angled surface 136 may be oriented relative to the Y-axis at angles of 45 degrees, 30 degrees, 60 degrees, between 30 and 60 degrees, between 10 and 70 degrees, or other angles. The angled surface 136 may be planar or non-planar (e.g., curved).

[0100] For example, during signal transmission, the feed probe 85 can excite the first segment 128 of the dielectric resonant element 92 to generate an electromagnetic wave propagating in direction 150. This electromagnetic wave can be reflected off the angled surface 136 and into the second segment 130, which propagates the electromagnetic wave upwards (as shown in direction 152) and through the top surface 98. This process can be reversed during signal reception. The angled surface 136 helps ensure that the maximum amount of electromagnetic energy (RF signal) propagating through the first segment 128 is transferred to the second segment 130, and vice versa.

[0101] To further optimize the RF signal reflection performed by the angled surface 136 and thus optimize the RF performance of the antenna 40, a reflective structure such as a reflector 138 may be provided at or on the angled surface 136. The reflector 138 is made of a material different from that of the dielectric substrate 90 and the dielectric resonant element 92. The reflector 138 may increase or enhance the impedance discontinuity between the dielectric resonant element 92 and the dielectric substrate 90 to maximize the reflection characteristics of the angled surface 136 at RF. As an example, the reflector 138 may include an air gap between the dielectric substrate 90 and the angled surface 136. As another example, the reflector 138 may include a dielectric material (e.g., a dielectric coating) disposed on the angled surface 136 and embedded within the dielectric substrate 90. The dielectric material may have a dielectric constant that deviates more from the dielectric constant of the dielectric resonant element 92 than that of the dielectric substrate 90. As yet another example, the reflector 138 may include a conductive material disposed on the angled surface 136 and embedded within the dielectric substrate 90. The conductive material may include conductive patches, stamped metal sheets, metal plates, or metal foils that are fixed, pressed, adhered, or otherwise coupled to the corner surface 136 (e.g., via the dielectric substrate 90), or may include conductive (e.g., metallic) films, conductive traces, or conductive (e.g., metallic) coatings deposited (e.g., electroplated) onto the corner surface 136 (e.g., using LDS processes, sputtering processes, physical vapor deposition processes, etc.) before the dielectric substrate 90 is molded onto the dielectric resonant element. The reflector 138 may sometimes be referred to herein as a reflector structure or a reflective structure. Metallic materials may be particularly suitable for the reflector 138 because metals exhibit high reflectivity at frequencies greater than 10 GHz. Such a reflector may be set using additional masking, electroplating, and / or coating operations during the fabrication process of the antenna 40 (e.g., after machining the dielectric resonant element 92 using sintering and wire sawing).

[0102] In this way, antenna 40 can be configured to exhibit similar RF performance (e.g., antenna efficiency) when transmitting RF signals through display overlay 56 as in an arrangement of straight, unbent pillars of dielectric resonant elements, while decoupling the thickness of device 10 from the length of dielectric resonant element 92 required to cover the desired frequencies of interest. In other words, providing curved dielectric resonant elements for antenna 40 in this way, compared to an arrangement of straight, unbent pillars of dielectric resonant elements, can reduce the overall thickness of device 10 without degrading the RF performance of antenna 40 (e.g., at frequencies greater than 10 GHz).

[0103] Figure 8 The examples provided are merely illustrative. If desired, the dielectric resonant element 92 may include more than two segments that follow other longitudinal axes and are coupled together using angled surfaces (such as angled surface 136) and reflectors (such as reflector 138). This allows the dielectric resonant element to follow a tortuous path from the bottom surface 100 to the top surface 98 to fit into other device shape factors. Reflector 138 may overlap or cover all or only a portion of angled surface 136. The bottom end 148 of the dielectric substrate 90 may be mounted to the circuit board 72, or, if desired, the circuit board 72 may be mounted (e.g., soldered) to the bottom surface 100 of the dielectric resonant element 92 (e.g., some or all of the circuit board 72 may be vertically oriented such that some or all of the side surfaces of the circuit board are perpendicular to the bottom surface 100). Figure 8 (Extended within the XZ plane).

[0104] The dielectric resonant element 92 can have any desired cross-sectional shape (e.g., as viewed in directions 150, 152, or in a plane parallel to the angled surface 136). As an example, the dielectric resonant element 92 can have a rectangular (e.g., square) cross-section. For example, a rectangular cross-section can maximize ceramic utilization. As another example, the dielectric resonant element 92 can have a hexagonal cross-sectional shape (profile).

[0105] Figure 9 This is a cross-sectional view showing how the dielectric resonant element 92 can have a hexagonal cross-section or profile (e.g., viewed in directions 150, 152, or in a plane parallel to the angled surface 136). Figure 9 As shown, the dielectric resonant element 92 may have a hexagonal cross-section with six sidewalls 154 (e.g., sidewalls of equal length). The longitudinal axis of the dielectric resonant element 92 may extend through the center of the dielectric resonant element into and out of the page plane.

[0106] In the first section 128 ( Figure 8Within the dielectric resonant element 92, one or more feed probes 85 may be disposed on one or more sidewalls 154 (e.g., adjacent sidewalls 154). If necessary, parasitic elements (e.g., Figure 8 The conductive structure 131 can be disposed on the sidewall 154 opposite to the sidewall 154 where the feed probe is disposed. The first section 128 intersects with the second section 130 ( Figure 8 In the case of ), the sidewall 154 can be formed into a corner surface, such as Figure 8 Angular surfaces 136 (e.g., six angular surfaces extending parallel to each other and) Figure 8 (Angled surface 136). One or more sidewalls 154 (e.g., a pair of adjacent sidewalls 154, a pair of opposing sidewalls 154, all six sidewalls 154, etc.) may be provided with corresponding reflectors 138 for reflecting radio frequency signals between the first and second segments of the dielectric resonant element. For example, this can allow the reflectors to completely reflect and couple radio frequency signals of different polarizations between the first and second segments. Figure 9 The hexagonal profile is particularly suitable for reflecting horizontally and vertically polarized radio frequency signals excited on the first segment by a pair of feed probes 85 (for example, because a dielectric resonator with a rectangular cross-section may produce an undesirable mixture between orthogonal polarizations when reflecting radio frequency signals between the first and second segments, while the reflection away along the angular surface following the hexagonal cross-section profile minimizes this mixture). Figure 9 The examples are merely illustrative, and in general, the dielectric resonant element 92 can have any desired cross-sectional shape or profile (e.g., any desired number of straight and / or curved edges of any desired length).

[0107] Device 10 may collect and / or use personally identifiable information. It is well known that the use of personally identifiable information should comply with privacy policies and practices generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to the user.

[0108] According to one embodiment, an electronic device is provided, the electronic device including a housing, a dielectric overlay on the housing, a circuit board, a dielectric substrate on the circuit board, and a bent dielectric resonant element embedded in the dielectric substrate and configured to transmit radio frequency signals through the dielectric overlay.

[0109] According to another embodiment, the curved dielectric resonant element has a first segment extending along a first longitudinal axis and a second segment extending from the first segment along a second longitudinal axis that is not parallel to the first longitudinal axis.

[0110] According to another embodiment, the second longitudinal axis is perpendicular to the first longitudinal axis.

[0111] According to another embodiment, the curved dielectric resonant element has a surface that extends not parallel to the first longitudinal axis and the second longitudinal axis and couples the first segment to the second segment.

[0112] According to another embodiment, the electronic device includes a reflector on the surface.

[0113] According to another embodiment, the reflector includes an air gap.

[0114] According to another embodiment, the reflector comprises metal.

[0115] According to another embodiment, the electronic device includes a feed probe coupled to the first segment, soldered to the circuit board, and embedded in the dielectric substrate.

[0116] According to another embodiment, the electronic device includes an additional feed probe coupled to the first segment, the feed probe being configured to transmit a first polarized radio frequency signal, and the additional feed probe being configured to transmit a second polarized radio frequency signal.

[0117] According to another embodiment, the curved dielectric resonant element has a hexagonal cross-sectional profile.

[0118] According to another embodiment, the housing includes a peripheral conductive housing structure, the electronic device includes a display with a display module, the dielectric overlay covers the display module, and the curved dielectric resonant element is configured to transmit radio frequency signals through the gap between the display module and the peripheral conductive housing structure.

[0119] According to one embodiment, an electronic device is provided, comprising: a dielectric layer, a dielectric resonant element having a first segment, a second segment, and a surface, and a feed probe, the first segment having a first sidewall extending along a first longitudinal axis, the second segment having a second sidewall extending along a second longitudinal axis not oriented parallel to the first longitudinal axis, the surface coupling the first sidewall to the second sidewall, the surface being not parallel to the first longitudinal axis and not parallel to the second longitudinal axis, and the feed probe being coupled to the first segment and configured to excite the dielectric resonant element to radiate through the dielectric layer.

[0120] According to another embodiment, the electronic device includes a dielectric substrate molded on the first segment and the second segment.

[0121] According to another embodiment, the power probe is coupled to the first sidewall, and the electronic device includes a printed circuit to which the power probe is soldered.

[0122] According to another embodiment, the electronic device includes a reflector on the surface.

[0123] According to another embodiment, the reflector comprises metal.

[0124] According to another embodiment, the electronic device includes a dielectric substrate molded on the first segment, the second segment, and the reflector.

[0125] According to another embodiment, the dielectric layer includes a display cover layer, the first longitudinal axis extending parallel to the side surface of the display cover layer, and the second longitudinal axis extending perpendicular to the first longitudinal axis.

[0126] According to one embodiment, an antenna is provided, comprising: a dielectric resonant element having: a first segment extending along a first longitudinal axis, a second segment extending along a second longitudinal axis, a first angular surface coupled to the first segment and extending not parallel to the first and second longitudinal axes, a second angular surface coupled to the first segment and extending parallel to the first angular surface, a first reflector on the first angular surface, a second reflector on the second angular surface, and a first feed probe and a second feed probe coupled to the first segment and configured to excite the dielectric resonant element to transmit first and second polarized radio frequency signals at frequencies greater than 10 GHz.

[0127] According to another implementation, the first segment and the second segment have hexagonal cross-sectional profiles.

[0128] The foregoing description is merely illustrative, and various modifications can be made by those skilled in the art without departing from the scope and substance of the described embodiments. The aforementioned embodiments can be implemented independently or in any combination.

Claims

1. An electronic device, comprising: shell; Dielectric coating layer on the outer casing; Circuit board; Dielectric substrate on the circuit board; A curved dielectric resonant element embedded within the dielectric substrate and configured to transmit radio frequency signals through the dielectric overlay, wherein the curved dielectric resonant element has a first segment extending along a first longitudinal axis and a second segment extending from the first segment along a second longitudinal axis not parallel to the first longitudinal axis. and The reflector between the first segment and the second segment.

2. The electronic device according to claim 1, wherein the second longitudinal axis is perpendicular to the first longitudinal axis.

3. The electronic device of claim 2, wherein the curved dielectric resonant element has a surface that extends not parallel to the first longitudinal axis and the second longitudinal axis and couples the first segment to the second segment.

4. The electronic device of claim 3, wherein the reflector is on the surface.

5. The electronic device of claim 4, wherein the reflector includes an air gap.

6. The electronic device of claim 4, wherein the reflector comprises metal.

7. The electronic device according to claim 2, further comprising: Feed probes coupled to the first segment, soldered to the circuit board, and embedded in the dielectric substrate.

8. The electronic device according to claim 7, further comprising: An additional feed probe coupled to the first segment, wherein the feed probe is configured to transmit a first polarized radio frequency signal, and the additional feed probe is configured to transmit a second polarized radio frequency signal.

9. The electronic device of claim 8, wherein the curved dielectric resonant element has a hexagonal cross-sectional profile.

10. The electronic device of claim 1, wherein the housing includes a peripheral conductive housing structure, and the electronic device further includes: A display having a display module, wherein a dielectric overlay covers the display module, and wherein the curved dielectric resonant element is configured to transmit radio frequency signals through a gap between the display module and the peripheral conductive housing structure.

11. An electronic device, comprising: Dielectric layer; Dielectric resonant element, the dielectric resonant element having The first segment has a first sidewall extending along a first longitudinal axis. The second segment has a second sidewall extending along a second longitudinal axis, the second longitudinal axis being oriented not parallel to the first longitudinal axis. A surface that couples the first sidewall to the second sidewall, the surface being oriented to be neither parallel to the first longitudinal axis nor parallel to the second longitudinal axis; as well as A feed probe, coupled to the first segment and configured to excite the dielectric resonant element to radiate through the dielectric layer.

12. The electronic device according to claim 11, further comprising: A dielectric substrate molded on the first segment and the second segment.

13. The electronic device of claim 11, wherein the feed probe is coupled to the first sidewall, and the electronic device further comprises: A printed circuit, wherein the power supply probe is soldered to the printed circuit.

14. The electronic device of claim 11, further comprising: A reflector on the surface.

15. The electronic device of claim 14, wherein the reflector comprises metal.

16. The electronic device of claim 15, further comprising: A dielectric substrate molded on the first section, the second section, and the reflector.

17. The electronic device of claim 11, wherein the dielectric layer comprises a display cover layer, the first longitudinal axis extending parallel to a side surface of the display cover layer, and the second longitudinal axis extending perpendicular to the first longitudinal axis.

18. An antenna, comprising: Dielectric resonant element, the dielectric resonant element having The first segment extending along the first longitudinal axis, The second segment extending along the second longitudinal axis, A first angular surface, which couples the first segment to the second segment and extends not parallel to the first longitudinal axis and the second longitudinal axis, and A second angular surface, which couples the first segment to the second segment and extends parallel to the first angular surface; First reflector on the first angled surface; The second reflector on the second angled surface; as well as A first feed probe and a second feed probe are coupled to the first segment and configured to excite the dielectric resonant element to transmit first polarized and second polarized radio frequency signals at frequencies greater than 10 GHz.

19. The antenna of claim 18, wherein the first segment and the second segment have a hexagonal cross-sectional profile.

Images