Display module and display device

Abstract

Embodiments of the present application provide a display module and a display device. The display module comprises a display panel, a driving circuit board and a shielding layer. The driving circuit board is bonded on the display panel. In the thickness direction of the display module, the shielding layer is located on the side of the driving circuit board away from the display panel, and the shielding layer covers the driving circuit board and at least part of the display panel. The side of the shielding layer facing the display panel is provided with a glue layer and a first graphene layer. The first graphene layer is arranged in the same layer as the glue layer. In the thickness direction of the display module, the first graphene layer at least partially overlaps the driving circuit board. In the embodiments of the present application, the heat generated by the driving circuit board can be quickly dissipated outward through the first graphene layer and the shielding layer, improving the heat dissipation effect of the driving circuit board in the direction away from the display panel, which is conducive to reducing the heat accumulation at the position of the driving circuit board, thereby avoiding the display abnormality problem caused by the high temperature of the display module.

Description

[Technical Field]

[0001] This application relates to the field of display technology, and in particular to a display module and display device. [Background Technology]

[0002] In display devices, the driver circuit board generates a lot of heat when it is working, and this heat needs to be dissipated in a timely manner to avoid affecting the normal operation of the display device.

[0003] However, in existing display devices, the heat generated at the driver circuit board is poorly dissipated, easily accumulating and being conducted to the display panel, leading to overheating and display malfunctions. Therefore, a solution is urgently needed.

[0004] [Application Content]

[0005] In view of this, embodiments of this application provide a display module and a display device to solve the above problems.

[0006] In a first aspect, embodiments of this application provide a display module, including a display panel, a driving circuit board, and a shielding layer. The driving circuit board is bonded to the display panel. Along the thickness direction of the display module, the shielding layer is located on the side of the driving circuit board away from the display panel, and the shielding layer covers the driving circuit board and at least a portion of the display panel. The shielding layer has an adhesive layer and a first graphene layer disposed on the side facing the display panel. The first graphene layer and the adhesive layer are disposed in the same layer. Along the thickness direction of the display module, the first graphene layer and the driving circuit board at least partially overlap.

[0007] In one implementation of the first aspect, a first graphene layer covers the surface of the driving circuit board away from the display panel, and the first graphene layer covers at least one side of the driving circuit board.

[0008] In one implementation of the first aspect, the display module includes a second graphene layer located on the side of the shielding layer away from the display panel.

[0009] In one implementation of the first aspect, the display module includes a cover plate, and the display panel includes a first part and a second part connected together, with the first part and the second part overlapping along the thickness direction of the display module; wherein the first part is attached to the cover plate, and the second part is bonded to a driving circuit board, with the driving circuit board located on the side of the second part away from the first part.

[0010] In one implementation of the first aspect, the shielding layer is a conductive cloth.

[0011] In one implementation of the first aspect, the shielding layer is a metal layer.

[0012] In one implementation of the first aspect, the shielding layer comprises copper.

[0013] In one implementation of the first aspect, a metal support layer is provided between the first part and the second part, and the projected area of ​​the shielding layer on the plane where the display module is located is greater than the projected area of ​​the metal support layer on the plane where the display module is located.

[0014] In one implementation of the first aspect, the shielding layer is set across the entire surface of the display module.

[0015] In one implementation of the first aspect, the display module further includes a buffer layer located between the metal support layer and the first portion of the display panel; a shielding layer extends and is attached to the buffer layer.

[0016] In one implementation of the first aspect, thermally conductive adhesive is provided on the side of the drive circuit board, and the thermal conductivity of the thermally conductive adhesive is greater than that of the adhesive layer.

[0017] Secondly, embodiments of this application provide a display device, including the display module as provided in the first aspect.

[0018] In this embodiment, a first graphene layer with a high thermal conductivity is at least partially overlapped with the driving circuit board to replace at least part of the adhesive layer at the corresponding location on the driving circuit board. This reduces the amount of material with low thermal conductivity at the driving circuit board location and increases the amount of material with high thermal conductivity at the driving circuit board location. As a result, the heat generated by the driving circuit board can be quickly dissipated outwards through the first graphene layer and the shielding layer, improving the heat dissipation effect of the driving circuit board away from the display panel. This helps reduce heat accumulation at the location of the driving circuit board, thereby reducing the heat conducted from the driving circuit board location to the display area of ​​the display panel, and ultimately helping to avoid display abnormalities caused by overheating of the display module. [Attached Image Description]

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of a display module in the prior art;

[0021] Figure 2 This is a schematic diagram of a display module provided in an embodiment of this application;

[0022] Figure 3 A schematic diagram of yet another display module provided in an embodiment of this application;

[0023] Figure 4 A schematic diagram of yet another display module provided in an embodiment of this application;

[0024] Figure 5 A schematic diagram of yet another display module provided in an embodiment of this application;

[0025] Figure 6 A bottom view of a display module provided in an embodiment of this application;

[0026] Figure 7 A schematic diagram of yet another display module provided in an embodiment of this application;

[0027] Figure 8 A schematic diagram of yet another display module provided in an embodiment of this application;

[0028] Figure 9 This is a schematic diagram of a display device provided in an embodiment of this application.

Detailed Implementation Methods

[0029] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0030] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0031] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0032] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0033] In the description of this specification, it should be understood that the terms "substantially", "approximately", "about", "about", "generally", "largely" used in the claims and embodiments of this application refer to values ​​that can be generally agreed upon within a reasonable range of process operations or tolerances, rather than a precise value.

[0034] It should be understood that although the terms "first," "second," etc., may be used to describe graphene layers, protective films, etc., in the embodiments of this application, these graphene layers, protective films, etc., should not be limited to these terms. These terms are only used to distinguish graphene layers, protective films, etc., from one another. For example, without departing from the scope of the embodiments of this application, the first graphene layer may also be referred to as the second graphene layer, and similarly, the second graphene layer may also be referred to as the first graphene layer.

[0035] Figure 1 This is a schematic diagram of a display module in the prior art.

[0036] In the existing display module 01', such as Figure 1 As shown, the display module 01' includes a display panel 10', a driving circuit board 20', and a conductive cloth 30'. The display panel 10' includes a first part 11', a bent part 12', and a second part 13' connected in sequence. The first part 11' may include the main display area of ​​the display panel 10', and the second part 13' is located on one side of the backlight surface of the first part 11'.

[0037] In other words, the second part 13' of the display panel 10 can be bent to the backlight side of the first part 11', thereby reducing the bezel width of the display panel 10', increasing the screen ratio of the main display area, and thus facilitating the narrow bezel display of the display panel 10'.

[0038] The driver circuit board 20' is bonded to the second portion 13' of the display panel 10' and is used to provide display signals to the display panel 10'. Specifically, the driver circuit board 20' is located on the side of the second portion 13' away from the first portion 11'.

[0039] The conductive cloth 30' is located on the side of the driving circuit board 20' away from the display panel 10', and in the thickness direction Z' of the display module 01', the conductive cloth 30' covers at least a portion of the driving circuit board 20' and the second part 13' of the display panel 10'.

[0040] The conductive cloth 30' has an adhesive layer 40' on its surface facing the driving circuit board 20', and the conductive cloth 30' can be adhered to the driving circuit board 20' and a portion of the second part 13' of the display panel 10' through the adhesive layer 40'.

[0041] The inventors of this application discovered through research that in existing display modules 01', the heat generated by the driving circuit board 20' is mainly dissipated through the conductive cloth 30'. However, since there is an adhesive layer 40' between the conductive cloth 30' and the driving circuit board 20', and the adhesive layer 40' typically has a low thermal conductivity and poor heat dissipation, the heat generated by the driving circuit board 20' easily accumulates and is conducted to the display area of ​​the display panel 10', causing the display panel 10' to experience display abnormalities due to excessively high temperatures.

[0042] Through meticulous and in-depth research, the applicant in this case has provided a solution to the problems existing in the prior art.

[0043] Figure 2 This is a schematic diagram of a display module provided in an embodiment of this application.

[0044] This application provides a display module 01, such as... Figure 2 As shown, the display module 01 includes a display panel 10, a driving circuit board 20, and a shielding layer 30. The driving circuit board 20 is bonded to the display panel 10 and can be used to provide display signals to the display panel 10.

[0045] Along the thickness direction Z of the display module 01, the shielding layer 30 is located on the side of the driving circuit board 20 away from the display panel 10, and the shielding layer 30 covers the driving circuit board 20 and at least part of the display panel 10. The shielding layer 30 can be used to shield the driving circuit board 20 from the influence of external electromagnetic signals on its normal operation.

[0046] Optionally, the shielding layer 30 is a conductive cloth.

[0047] Optionally, the shielding layer 30 is a metal layer.

[0048] Furthermore, the shielding layer 30 includes copper, meaning that the shielding layer 30 can be prepared using copper, an easily processed metal.

[0049] The shielding layer 30 has an adhesive layer 40 and a first graphene layer 50 disposed on the side facing the display panel 10, with the first graphene layer 50 and the adhesive layer 40 disposed in the same layer. Specifically, the adhesive layer 40 and the first graphene layer 50 can be attached to the surface of the shielding layer 30 facing the display panel 10, and the shielding layer 30 can be bonded and fixed to other film layers in the display module 01 by the adhesive layer 40.

[0050] Along the thickness direction Z of the display module 01, the first graphene layer 50 overlaps at least partially with the driving circuit board 20.

[0051] In other words, at least a portion of the first graphene layer 50 is located between the shielding layer 30 and the driving circuit board 20, and the first graphene layer 50 can replace at least a portion of the adhesive layer 40 on the side of the driving circuit board 20 away from the display panel 10.

[0052] Understandably, graphene typically has a high thermal conductivity, even better than that of metals, which can provide excellent heat dissipation. In other words, compared to the adhesive layer 40, graphene can accelerate heat conduction.

[0053] In this embodiment, the first graphene layer 50 with a high thermal conductivity overlaps at least partially with the driving circuit board 20, replacing at least a portion of the adhesive layer 40 at the corresponding position of the driving circuit board 20. This reduces the amount of material with low thermal conductivity at the position of the driving circuit board 20 and increases the amount of material with high thermal conductivity at the position of the driving circuit board 20. Thus, the heat generated by the driving circuit board 20 can be quickly dissipated outward through the first graphene layer 50 and the shielding layer 30 with high thermal conductivity, improving the heat dissipation effect of the driving circuit board 20 away from the display panel 10. This helps reduce heat accumulation at the position of the driving circuit board 20, thereby reducing the heat conducted from the position of the driving circuit board 20 to the display area of ​​the display panel 10, and further helping to avoid display abnormalities caused by overheating of the display module 01.

[0054] Alternatively, please continue to refer to Figure 2 Along the thickness direction Z of the display module 01, the projection of the first graphene layer 50 onto the plane of the driving circuit board 20 completely covers the driving circuit board 20. Thus, the entire surface of the driving circuit board 20 away from the display panel 10 can directly contact the first graphene layer 50, thereby increasing the area of ​​the driving circuit board 20 that can directly dissipate heat through the first graphene layer 50 and the shielding layer 30, further improving the heat dissipation effect of the driving circuit board 20.

[0055] Please continue to refer to this. Figure 2 In one embodiment of this application, the display module 01 includes a cover lens, and the display panel 10 includes a first part 11, a second part 12 connected together and a bent part 13 located between the first part 11 and the second part 12. Along the thickness direction Z of the display module 01, the second part 12 overlaps with the first part 11, and the second part 12 may be located on one side of the backlight surface of the first part 11.

[0056] The first part 11 is bonded to the cover lens and may include the main display area of ​​the display panel 10. Of course, a polarizer (POL) and optical adhesive (OCA) may also be disposed between the first part 11 and the cover lens. The second part 12 is bonded to the driving circuit board 20, which is located on the side of the second part 12 away from the first part 11.

[0057] In other words, the second part 12 of the display panel 10 can be bent to the backlight side of the first part 11, and the drive circuit board 20 is bonded to the side of the second part 12 away from the first part 11.

[0058] In this embodiment of the application, while improving the heat dissipation effect of the driving circuit board 20, the second part 12 of the display panel 10 can be bent to the backlight side of the first part 11, which is conducive to reducing the bezel width of the display panel 10, increasing the screen ratio of the main display area, and thus facilitating the realization of narrow bezel display of the display panel 10.

[0059] Figure 3 This is a schematic diagram of another display module provided in an embodiment of this application.

[0060] In one embodiment of this application, such as Figure 3 As shown, the first graphene layer 50 covers the surface 20A of the driving circuit board 20 away from the display panel 10, and the first graphene layer 50 covers at least one side 20B of the driving circuit board 20.

[0061] Optionally, the first graphene layer 50 is attached to the surface 20A of the driving circuit board 20 away from the display panel 10, and to at least one side 20B of the driving circuit board 20.

[0062] In this embodiment, the first graphene layer 50 can cover multiple surfaces of the driving circuit board 20, which helps to further increase the area of ​​the driving circuit board 20 that can dissipate heat directly through the first graphene layer 50. This allows the heat at the location of the driving circuit board 20 to be conducted away more quickly, thereby helping to further avoid the display module 01 from displaying abnormalities due to high temperature.

[0063] Figure 4 This is a schematic diagram of yet another display module provided in an embodiment of this application. Figure 5 This is a schematic diagram of yet another display module provided in an embodiment of this application. Figure 6 This is a bottom view of a display module provided in an embodiment of this application.

[0064] like Figure 4 and Figure 5 As shown, in one embodiment of this application, the display module 01 includes a second graphene layer 60, which is located on the side of the shielding layer 30 away from the display panel 10.

[0065] Optionally, the second graphene layer 60 is attached to the surface of the shielding layer 30 away from the display panel 10.

[0066] As the above analysis shows, graphene has an excellent thermal conductivity, which can increase the heat conduction effect compared to adhesive materials. Moreover, the thermal conductivity of graphene is even better than that of metals, and its thermal conductivity is far greater than that of air, which has a lower thermal conductivity.

[0067] In this embodiment, a second graphene layer 60 with a higher thermal conductivity is added to the side of the shielding layer 30 away from the display panel 10. This is equivalent to further increasing the thermal conductivity of the material at the corresponding position of the driving circuit board 20, which is beneficial to further increase the thermal conduction efficiency at the position of the driving circuit board 20. The heat at the position of the driving circuit board 20 can be conducted away more quickly through the first graphene layer 50, the shielding layer 30 and the second graphene layer 60 with higher thermal conductivity. Of course, the heat transferred outward from the position of the driving circuit board 20 through the adhesive layer 40 and the shielding layer 30 can also be further accelerated outward through the second graphene layer 60, which is beneficial to further increase the heat dissipation effect of the driving circuit board 20 in the direction away from the display panel 10, thereby further reducing the heat accumulation at the position of the driving circuit board 20, and further helping to avoid display abnormalities caused by overheating of the display module 01.

[0068] Optionally, such as Figure 5 As shown, the shielding layer 30 is disposed across the entire surface of the display module 01, and the second graphene layer 60 has the same area as the shielding layer 30. Exemplarily, combined with... Figure 5 and Figure 6 As shown, in the thickness direction Z of the display module 01, the shielding layer 30 can at least cover the main display area AA of the display panel 10. Similarly, the second graphene layer 60 can also at least cover the main display area AA of the display panel 10.

[0069] In this way, the area of ​​heat dissipation of the driving circuit board 20 through the shielding layer 30 and the second graphene layer 60 can be increased, which is conducive to further improving the heat dissipation effect of the driving circuit board 20, reducing the heat accumulation at the location of the driving circuit board 20, and further reducing the heat transferred from the driving circuit board 20 to the display panel 10.

[0070] Figure 7 This is a schematic diagram of another display module provided in an embodiment of this application.

[0071] In one embodiment of this application, such as Figure 7As shown, a metal support layer 70 is provided between the first part 11 and the second part 12 of the display panel 10. After the second part 12 of the display panel 10 is bent, it can be bonded and fixed to the metal support layer 70 to prevent the bent part 13 of the display panel 10 from springing back. Of course, a first protective film BP1 can be provided on the side of the second part 12 facing the metal support layer 70. The first protective film BP1 is attached to the surface of the second part 12 facing the first part 11 (the back side of the second part 12) to protect the back side of the second part 12 from scratches.

[0072] Among them, the projected area of ​​the shielding layer 30 on the plane where the display module 01 is located is greater than the projected area of ​​the metal support layer 70 on the plane where the display module 01 is located.

[0073] Furthermore, along the thickness direction Z of the display module 01, the projection of the second graphene layer 60 located on the side of the shielding layer 30 away from the display panel 10 onto the plane of the metal support layer 70 can also be greater than that of the metal support layer 70.

[0074] Optionally, the shielding layer 30 is provided across the entire surface of the display module 01. Of course, the second graphene layer 60 located on the side of the shielding layer 30 away from the display panel 10 can also be provided across the entire surface of the display module 01.

[0075] In this embodiment, the shielding layer 30 can be a metal layer. By setting a larger area for the shielding layer 30, the heat dissipation area can be increased, improving the heat dissipation effect at the location of the driving circuit board 20 and the display panel 10, thereby improving the display effect of the display module 01. Furthermore, the shielding layer 30 can also serve as a support in the display module 01, replacing part of the metal support layer 70 located on the back of the first portion 11 of the display panel 10. This eliminates the need to cover the entire surface of the metal support layer 70, thus saving on the manufacturing cost of the display module 01.

[0076] For example, such as Figure 1 As shown, in the existing display module 01', a metal support layer 70' and a buffer layer 80' are disposed between the first part 11' and the second part 13' of the display panel 10'. The buffer layer 80' can be foam. The metal support layer 70' is located on the side of the buffer layer 80' closest to the drive circuit board 20', and the metal support layer 70' and the buffer layer 80' have the same area. And as... Figure 7 In the display module 01 provided in this application, the area of ​​the metal support layer 70 is relative to... Figure 1 The area of ​​the metal support layer 70' is significantly reduced, which helps to reduce the manufacturing cost of the display module 01.

[0077] In addition, the inventors of this application have conducted experimental verification on the heat dissipation effect of the display module 01 provided in the embodiments of this application. The just noticeable difference (JND) threshold of the display module 01' in the prior art is 2.2, while the JND threshold of the display module 01 provided in the embodiments of this application can reach 2.1. Based on this, it can be inferred that the technical solution can improve the heat dissipation effect and improve the display effect of the display module 01.

[0078] Please continue to refer to this. Figure 7 In one embodiment of this application, the display module 01 further includes a buffer layer 80, which may be a foam layer, and is located between the metal support layer 70 and the first portion 11 of the display panel 10. Furthermore, a second protective film BP2 may be provided on the side of the buffer layer 80 facing the first portion 11 of the display panel 10. The second protective film BP2 is attached to the surface of the first portion 11 facing the buffer layer 80 (the back side of the first portion 11) to protect the back side of the first portion 11 from scratches.

[0079] The shielding layer 30 extends and is attached to the buffer layer 80.

[0080] Optionally, an adhesive layer 40 is provided on the side of the shielding layer 30 facing the buffer layer 80, and the shielding layer 30 is bonded to the surface of the buffer layer 80 away from the first part 11 of the display panel 10 by the adhesive layer 40.

[0081] Understandably, in existing display modules, the areas of the metal support layer and the buffer layer are usually equal, and the metal support layer and the buffer layer can be supplied as a single unit during the manufacturing process of the display module.

[0082] In this embodiment, the shielding layer 30 is extended and attached to the buffer layer 80. This eliminates the need for the metal support layer 70 to have the same area as the buffer layer 80. This helps ensure that the shielding layer 30 can replace part of the metal support layer 70 on the side of the first part 11 of the display panel 10. While increasing the area of ​​the shielding layer 30, the area of ​​the metal support layer 70 in the display module 01 is reduced. This helps to improve the heat dissipation effect of the driving circuit board 20 while saving the manufacturing cost of the display module 01.

[0083] Figure 8 This is a schematic diagram of another display module provided in an embodiment of this application.

[0084] In one embodiment of this application, such as Figure 8 As shown, thermally conductive adhesive 90 is provided on the side of the drive circuit board 20, and the thermal conductivity coefficient of the thermally conductive adhesive 90 is greater than that of the adhesive layer 40.

[0085] The thermally conductive adhesive 90 may include at least one of silicone, acrylic adhesive, polystyrene adhesive, and polyester adhesive.

[0086] It should be noted that, Figure 8 This is only used to illustrate that the thermally conductive adhesive 90 is disposed on the side of the drive circuit board 20, and is not used to indicate which side of the drive circuit board 20 the thermally conductive adhesive 90 is specifically located on.

[0087] In this embodiment, thermally conductive adhesive 90 is provided on the side of the driving circuit board 20, which is equivalent to further increasing the material with high thermal conductivity at the location of the driving circuit board 20. The heat generated by the driving circuit board 20 can also be dissipated through the thermally conductive adhesive 90 with high thermal conductivity, further increasing the area of ​​the driving circuit board 20 for heat dissipation through the material with high thermal conductivity. This is beneficial to further improve the heat dissipation effect of the driving circuit board 20, thereby further reducing the heat accumulation at the location of the driving circuit board 20 and avoiding display abnormalities caused by excessive temperature in the display module 01.

[0088] Figure 9 This is a schematic diagram of a display device provided in an embodiment of this application.

[0089] This application provides a display device 02, such as... Figure 9 As shown, the display device 02 includes the display module 01 provided in the above embodiments. Exemplarily, the display device 02 provided in the embodiments of this application can be an electronic device such as a mobile phone, computer, television, or vehicle display, and this application does not make any specific limitations.

[0090] In the display device 02, a first graphene layer 50 with a high thermal conductivity is provided to at least partially overlap with the driving circuit board 20, replacing at least a portion of the adhesive layer 40 at the corresponding position of the driving circuit board 20. This reduces the amount of material with low thermal conductivity at the position of the driving circuit board 20 and increases the amount of material with high thermal conductivity at the position of the driving circuit board 20. Thus, the heat generated by the driving circuit board 20 can be quickly dissipated outward through the first graphene layer 50 with high thermal conductivity and the shielding layer 30, improving the heat dissipation effect of the driving circuit board 20 in the direction away from the display panel 10. This helps reduce heat accumulation at the position of the driving circuit board 20, thereby reducing the heat conducted from the position of the driving circuit board 20 to the display area of ​​the display panel 10, and ultimately helping to avoid display abnormalities caused by overheating of the display device 02.

[0091] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A display module, characterized in that, include: Display panel; A driver circuit board, the driver circuit board being bonded to the display panel; A shielding layer, along the thickness direction of the display module, is located on the side of the driving circuit board away from the display panel, and the shielding layer covers the driving circuit board and at least a portion of the display panel; The shielding layer has an adhesive layer and a first graphene layer on the side facing the display panel, and the first graphene layer and the adhesive layer are disposed in the same layer. Along the thickness direction of the display module, the first graphene layer at least partially overlaps with the driving circuit board, the surface of the first graphene layer facing the shielding layer is bonded to the shielding layer, and the surface of the first graphene layer facing the driving circuit board is bonded to the driving circuit board.

2. The display module according to claim 1, characterized in that, The first graphene layer covers the surface of the driving circuit board away from the display panel, and the first graphene layer covers at least one side of the driving circuit board.

3. The display module according to claim 1, characterized in that, The display module includes a second graphene layer, which is located on the side of the shielding layer away from the display panel.

4. The display module according to claim 1, characterized in that, The display module includes a cover plate, and the display panel includes a first part and a second part connected together, with the first part and the second part overlapping along the thickness direction of the display module; The first part is attached to the cover plate, and the second part is bonded to the drive circuit board, with the drive circuit board located on the side of the second part away from the first part.

5. The display module according to claim 4, characterized in that, The shielding layer is a conductive cloth.

6. The display module according to claim 4, characterized in that, The shielding layer is a metal layer.

7. The display module according to claim 6, characterized in that, The shielding layer comprises copper.

8. The display module according to claim 6, characterized in that, A metal support layer is provided between the first part and the second part, and the projection area of ​​the shielding layer on the plane where the display module is located is greater than the projection area of ​​the metal support layer on the plane where the display module is located.

9. The display module according to claim 8, characterized in that, The shielding layer is provided across the entire surface of the display module.

10. The display module according to claim 8, characterized in that, The display module further includes a buffer layer, which is located between the metal support layer and the first part of the display panel; The shielding layer extends and adheres to the buffer layer.

11. The display module according to claim 1, characterized in that, The side of the drive circuit board is provided with thermally conductive adhesive, and the thermal conductivity coefficient of the thermally conductive adhesive is greater than that of the adhesive layer.

12. A display device, characterized in that, The display device includes the display module as described in any one of claims 1-11.

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