Semiconductor device and electronic apparatus

Abstract

This invention provides a semiconductor device that eliminates the need for complex processing to restrict adhesive extrusion and can be mounted in a housing in a manner that prevents liquid from seeping into the housing. The semiconductor device (10) of this invention includes: a detection element (40) mounted on a substrate (20) and having a detection portion (40D) for detecting pressure; a resin encapsulation body (50) disposed on the substrate (20); and a cylindrical member (60) supported on the resin encapsulation body (50). The resin encapsulation body (50) includes: a base (51) disposed on the substrate (50), in which the detection element (40) is embedded; and a protrusion (52) having an exposure hole (53) exposing the detection portion (40D) and protruding from the base (51) into the cylindrical member (60). The cylindrical member (60) includes: a cylindrical body portion (61); and a lower flange portion (63) supported on the base (51). The lower flange (63) is located on the inner side of the outer edge (51C) of the base (51) when viewed from above. The outer surface (52A) of the protrusion (52) is bonded to the inner circumferential surface (61B) of the cylindrical member (60).

Description

Technical Field

[0001] The present invention relates to a semiconductor device for measuring pressure and an electronic device having the semiconductor device. Background Technology

[0002] Patent Document 1 discloses a pressure sensor for measuring pressure. The pressure sensor is mounted on the housing of a pressure measuring device or the like. The pressure sensor includes a substrate and a cylindrical cap adhered to a frame portion provided on the substrate. An annular O-ring is fitted around the cap. When the pressure sensor is mounted on the housing, the gap between the housing and the pressure sensor is sealed by the O-ring. This prevents liquid from seeping into the interior of the housing from the outside through the gap.

[0003] However, in the pressure sensor disclosed in Patent Document 1, the bonding surface between the cover and the frame is small. With such a small bonding surface, adhesive may be squeezed out of the cover when it is bonded to the frame. Therefore, in order to prevent adhesive squeezing, a complex process is implemented in the pressure sensor to provide recesses on the bonding surface for inducing adhesive.

[0004] In response to this, in the semiconductor device for measuring pressure disclosed in Patent Document 2, the cylindrical member corresponding to the aforementioned cover has an outwardly extending flange portion, which is bonded to the resin encapsulation body. Because the flange portion extends outward, the bonding surface between the flange portion and the resin encapsulation body is larger than the bonding surface of the cover of the pressure sensor disclosed in Patent Document 1. Therefore, in this semiconductor device, adhesive extrusion can be reduced without the complex processing required for the cover of the pressure sensor disclosed in Patent Document 1.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: International Publication No. 2019 / 181410

[0008] Patent Document 2: International Publication No. 2019 / 208127 Summary of the Invention

[0009] The problem the invention aims to solve

[0010] However, in the semiconductor device disclosed in Patent Document 2, the following problems arise because the cylindrical member has a flange. The semiconductor device is mounted to the housing by inserting it into a mounting hole provided in the housing with an O-ring fitted into the cylindrical member. At this time, it is possible that the O-ring will get caught on the bent edge of the opening of the mounting hole, making it difficult to install the semiconductor device and the O-ring into the housing.

[0011] To address this issue, a chamfering of the edge of the mounting hole opening is considered. However, with the chamfered edge, a gap may form between the O-ring and the chamfered portion of the housing when the semiconductor device with the O-ring is mounted in the housing. In this case, it may not be possible to adequately prevent liquid from seeping into the housing.

[0012] To solve this problem, the outer diameter of the mounting hole is increased so that, in addition to the O-ring, the flange located closer to the front of the O-ring can also be inserted into the mounting hole. This allows the O-ring to be inserted further inward than the chamfered portion of the housing, corresponding to the amount by which the flange closer to the front is also inserted into the mounting hole. Therefore, the problem of an increased gap between the O-ring and the chamfered portion of the housing is avoided.

[0013] However, in the semiconductor device disclosed in Patent Document 2, when viewed from above, the flange is rectangular, while the mounting hole is circular because the O-ring is circular. This means the diameter of the mounting hole needs to be increased to allow the flange to be inserted. In this case, the gap between the inner surface of the housing constituting the mounting hole and the flange increases at the center of each side of the rectangular flange. Consequently, the O-ring is not adequately supported at this center, and it may sag. In this situation, it may not be able to adequately prevent liquid from seeping into the housing.

[0014] The pressure sensor disclosed in Patent Document 1 does not have a flange, so it does not have the above-mentioned problems, but as mentioned above, it requires complex processing to limit the extrusion of the adhesive.

[0015] Therefore, the object of the present invention is to solve the aforementioned problems and provide a semiconductor device that does not require complex processing for restricting the extrusion of adhesives and can be mounted on a housing in a manner that prevents liquid from seeping into the housing.

[0016] Solution for solving the problem

[0017] To achieve the stated objective, the present invention is configured as follows.

[0018] One semiconductor device according to a technical solution of the present invention includes:

[0019] Substrate;

[0020] A detection element is mounted on the upper surface of the substrate and has a detection section for detecting pressure.

[0021] A resin encapsulation body is disposed on the upper surface of the substrate, the detection element is embedded in the resin encapsulation body, and the resin encapsulation body has an exposure hole that exposes the detection portion of the detection element upwards; and

[0022] A cylindrical component supported by the resin encapsulation body.

[0023] The resin encapsulation body includes:

[0024] A base, disposed on the upper surface of the substrate, wherein the detection element is embedded in the base; and

[0025] The protrusion, having the exposure hole, protrudes upward from the base and enters the cylindrical member.

[0026] The cylindrical component includes:

[0027] The cylindrical main body; and

[0028] A flange portion, which extends from the outer side of the main body portion over its entire circumference, is supported by the base portion.

[0029] At least a portion of the flange portion is located, when viewed from above, inside the outer edge of the base portion of the resin encapsulation.

[0030] The outer surface of the protrusion is bonded to the inner circumferential surface of the cylindrical member.

[0031] The effects of the invention

[0032] According to the present invention, there is no need for complex processing to restrict the extrusion of the adhesive, and it can be installed in the housing in a manner that prevents liquid from seeping into the housing. Attached Figure Description

[0033] Figure 1 This is a perspective view of a semiconductor device according to the first embodiment of the present invention.

[0034] Figure 2 It is along Figure 1 A cross-sectional view along line AA.

[0035] Figure 3 yes Figure 1 The semiconductor device is installed in the electronic device in a state that is along with Figure 1 The diagram corresponding to the cross section of line AA.

[0036] Figure 4 yes Figure 1 The semiconductor device is installed in the electronic device in a state that is along with Figure 1 The diagram corresponding to the cross section of the BB line.

[0037] Figure 5 This is a perspective view of a semiconductor device according to the second embodiment of the present invention.

[0038] Figure 6 yes Figure 5 The semiconductor device is installed in the electronic device in a state that is along with Figure 5 The diagram corresponding to the cross section of the CC line.

[0039] Figure 7 This is a perspective view of a semiconductor device according to the third embodiment of the present invention.

[0040] Figure 8 yes Figure 7 The semiconductor device is installed in the electronic device in a state that is along with Figure 7 The diagram corresponding to the cross-section of the DD line. Detailed Implementation

[0041] One semiconductor device according to a technical solution of the present invention includes:

[0042] Substrate;

[0043] A detection element is mounted on the upper surface of the substrate and has a detection section for detecting pressure.

[0044] A resin encapsulation body is disposed on the upper surface of the substrate, the detection element is embedded in the resin encapsulation body, and the resin encapsulation body has an exposure hole that exposes the detection portion of the detection element upwards; and

[0045] A cylindrical component supported by the resin encapsulation body.

[0046] The resin encapsulation body includes:

[0047] A base, disposed on the upper surface of the substrate, wherein the detection element is embedded in the base; and

[0048] The protrusion, having the exposure hole, protrudes upward from the base and enters the cylindrical member.

[0049] The cylindrical component includes:

[0050] The cylindrical main body; and

[0051] A flange portion extends from the outer side of the main body portion and is supported by the base portion.

[0052] At least a portion of the flange portion is located, when viewed from above, inside the outer edge of the base portion of the resin encapsulation.

[0053] The outer surface of the protrusion is bonded to the inner circumferential surface of the cylindrical member.

[0054] According to this structure, at least a portion of the flange is located inside the outer edge of the base when viewed from above. Therefore, when a semiconductor device with an O-ring embedded in the main body of the cylindrical member is disposed in a recess of the electronic device housing, and the flange is also disposed in the recess, the diameter of the recess can be reduced by an amount corresponding to the position of at least a portion of the flange being inside the outer edge of the base. This reduces the gap between the flange and the inner surface of the housing constituting the recess.

[0055] According to this structure, the outer surface of the protrusion is bonded to the inner circumferential surface of the cylindrical member. Even assuming that the adhesive is extruded between the outer surface of the protrusion and the inner circumferential surface of the cylindrical member, the extruded adhesive will be located inside the cylindrical member. Therefore, the extruded adhesive will not hinder the mounting of the semiconductor device to the housing.

[0056] Furthermore, since the flange portion of the cylindrical component and the base portion of the resin encapsulation do not necessarily need to be bonded, there is no need to increase the contact area between the flange portion and the base portion. Additionally, there is no need to perform complex processing such as providing recesses in the flange portion to induce adhesive bonding.

[0057] Alternatively, the base of the resin encapsulation may be polygonal when viewed from above, and the flange of the cylindrical member may be circular when viewed from above. According to this structure, when viewed from above, the flange, like the O-ring embedded in the main body of the cylindrical member, is circular. Therefore, the gap between the flange and the inner surface of the recessed portion of the housing can be reduced, and any deviation in this gap can be eliminated.

[0058] Alternatively, the base of the resin encapsulation may include: a first base disposed on the upper surface of the substrate; and a second base protruding upward from the first base and located inside the outer edge of the first base when viewed from above, supporting the flange of the cylindrical member.

[0059] According to this structure, the second base is located further inward than the outer edge of the first base when viewed from above. Therefore, when a semiconductor device with an O-ring embedded in the main body of the cylindrical member is disposed in a recess of the housing of an electronic device, and both the cylindrical member and the second base are disposed in the recess, the diameter of the recess can be reduced by an amount corresponding to the position of the second base being further inward than the outer edge of the first base. This reduces the gap between the flange and the inner surface of the recess forming the housing. Furthermore, by inserting the second base into the recess, the O-ring embedded in the main body of the cylindrical member can be inserted further into the recess.

[0060] Alternatively, the first base of the resin encapsulation may be polygonal when viewed from above, and the second base of the resin encapsulation may be circular when viewed from above. According to this structure, when viewed from above, the second base is also circular, similar to the O-ring embedded in the main body of the cylindrical member. Therefore, the gap between the second base and the inner surface of the recessed portion of the housing can be reduced, and any deviation in this gap can be eliminated.

[0061] Alternatively, the resin encapsulation may be positioned inside the outer edge of the substrate when viewed from above. According to this structure, the resin encapsulation is positioned inside the outer edge of the substrate when viewed from above. Therefore, when a semiconductor device with an O-ring embedded in the main body of the cylindrical member is disposed in a recess of the electronic device housing, with the resin encapsulation entirely disposed in the recess, the diameter of the recess can be reduced by an amount corresponding to the position of the resin encapsulation inside the outer edge of the substrate. This reduces the gap between the flange and the inner surface of the recess forming the housing. Furthermore, by inserting the resin encapsulation entirely into the recess, the O-ring embedded in the main body of the cylindrical member can be inserted further into the recess.

[0062] Alternatively, the substrate may be polygonal when viewed from above, and the resin encapsulation may be circular when viewed from above. According to this structure, when viewed from above, the resin encapsulation and the O-ring embedded in the cylindrical member are both circular. Therefore, the gap between the resin encapsulation and the inner surface of the recess forming the housing can be reduced, and any deviation in this gap can be eliminated.

[0063] Alternatively, the main body of the cylindrical member can be cylindrical or elliptical. According to this structure, with the O-ring fitted into the main body, gaps are less likely to form between the O-ring and the main body. As a result, the possibility of liquid flowing between the O-ring and the main body can be reduced.

[0064] Alternatively, the flange of the cylindrical member may extend from the outer side of the main body over its entire circumference. According to this structure, the O-ring can be stably supported by the flange when it is fitted into the main body.

[0065] Alternatively, the protrusion of the resin encapsulation may protrude to a position above the flange of the cylindrical member. According to this structure, the semiconductor device can be configured such that, with the O-ring embedded in the main body of the cylindrical member, the protrusion faces the O-ring across the main body of the cylindrical member. Therefore, the protrusion can withstand the deformation of the main body of the cylindrical member caused by the force acting on the main body of the cylindrical member from the O-ring, thus suppressing such deformation.

[0066] Alternatively, the cylindrical member can be made of metal. According to this structure, since the cylindrical member is made of metal, the dimensional accuracy of the cylindrical member can be improved.

[0067] Alternatively, the cylindrical member can be made of resin. According to this structure, since the cylindrical member is made of resin, the adhesive strength can be enhanced when the cylindrical member is bonded to a resin encapsulation body that is also made of resin.

[0068] The semiconductor device of one embodiment of the present invention may also include a circuit element mounted on the upper surface of the substrate and electrically connected to the detection element.

[0069] An electronic device according to one embodiment of the present invention includes: the aforementioned semiconductor device; an O-ring arranged to surround the cylindrical member when viewed from above, the inner periphery of the O-ring contacting the outer surface of the main body portion of the cylindrical member; and a housing for mounting the semiconductor device.

[0070] Alternatively, the housing may include: a recess recessed from the inner surface of the housing toward the outer surface of the housing for at least a cylindrical member and the O-ring in the semiconductor device; and an opening that allows the recess to open to the outside of the housing, exposing the detection portion of the detection element to the outside of the housing by means of the cylindrical member disposed in the recess, wherein the inner surface of the housing constituting the recess has a tapered surface at its end on the inner surface side of the housing, the tapered surface being inclined such that the inner diameter of the recess decreases as it moves from the inner surface of the housing toward the outer surface of the housing.

[0071] According to this structure, when a semiconductor device with an O-ring embedded in the main body of the cylindrical member is inserted into the recess of the housing of an electronic device, the O-ring is smoothly guided into the recess by contacting the tapered surface with the O-ring.

[0072] <First Embodiment>

[0073] Figure 1 This is a perspective view of a semiconductor device according to the first embodiment of the present invention. Figure 2 It is along Figure 1 The figures are cross-sectional views along line AA. The height direction 101, circumferential direction 102, and radial direction 103 shown in these figures and those described later are for illustrative purposes and are not intended to limit the invention. In the height direction 101, the side of the base plate 20 is defined as lower, and the side of the cylindrical member 60 is defined as upper. The circumferential direction 102 is the direction along the circumference of the cylindrical member 60. The radial direction 103 is from the axis C of the cylindrical member 60 (refer to...). Figure 2 It extends in a radial pattern.

[0074] Semiconductor device 10 is a pressure sensor that detects pressure. For example... Figure 1 and Figure 2 As shown, the semiconductor device 10 includes a substrate 20, a circuit element 30 mounted on the substrate 20, a detection element 40 mounted on the substrate 20, a resin encapsulation body 50, and a cylindrical member 60.

[0075] In the first embodiment, the substrate 20 is a rigid substrate such as a glass epoxy board or a ceramic substrate, but is not limited to this. For example, the substrate 20 may also be a lead frame.

[0076] In the first embodiment, the substrate 20 is a cuboid shape that is relatively thin in the height direction 101. That is, in the first embodiment, the substrate 20 is a quadrilateral when viewed from above. However, the shape of the substrate 20 is not limited to a cuboid shape (a quadrilateral shape when viewed from above). For example, the substrate 20 may also be a polygon other than a quadrilateral when viewed from above.

[0077] like Figure 2 As shown, circuit elements 30 are mounted on the upper surface 20A of the substrate 20. The substrate 20 has pads 20B on its upper surface 20A. Although in Figure 2 A pad 20B is marked, but there is not a single pad 20B. The pad 20B is electrically connected to the circuit element 30 via a bonding wire 82. The substrate 20 has external connection terminals (not shown) on its lower surface 20C, which serves as the back side of the upper surface 20A. The semiconductor device 10 is electrically connected to other external devices via the external connection terminals, such as the electronic device 1 described later (see reference). Figure 3 ) printed circuit boards.

[0078] The circuit element 30 includes an upper surface 30A and a lower surface 30B, which serves as the back surface of the upper surface 30A. In the first embodiment, the circuit element 30 is an element equipped with an application-specific integrated circuit (ASIC). In the case of the first embodiment, the lower surface 30B of the circuit element 30 is bonded to the upper surface 20A of the substrate 20 using a chip mounting film, chip mounting material, or the like.

[0079] Circuit element 30 has a first pad 30C on its upper surface 30A. Although in Figure 2 Only one first pad 30C is marked, but the first pad 30C is not limited to one. The first pad 30C is electrically connected to the pad 20B of the substrate 20 via bonding wire 82.

[0080] Circuit element 30 has a second pad 30D on its upper surface 30A, independent of the first pad 30C. Although in Figure 2 A second pad 30D is marked, but there is not a single second pad 30D. The second pad 30D is electrically connected to the detection element 40 via a bonding wire 81.

[0081] Circuit element 30 includes a signal processing circuit that processes the signal output from detection element 40 and outputs the processed signal to substrate 20. For example, in the first embodiment, circuit element 30 includes a converter, a filter, a temperature sensor, a processor, and a memory. The converter converts the voltage signal output from detection element 40 into a digital signal. The filter filters the digital signal from the converter. The temperature sensor detects the temperature. The processor corrects the filtered digital signal based on the detected temperature. The memory stores correction coefficients, etc., used when correcting the digital signal using the detected temperature.

[0082] In the first embodiment, the detection element 40 is a pressure sensor element for measuring pressure. The detection element 40 includes an upper surface 40A and a lower surface 40B, which is the back surface of the upper surface 40A. The detection element 40 is, for example, a piezoelectric pressure sensor element or a capacitive pressure sensor element, and is a MEMS (Micro Electro Mechanical Systems) element. In the first embodiment, the lower surface 40B of the detection element 40 is bonded to the upper surface 30A of the circuit element 30 using a chip mounting film, chip mounting material, or the like. Thus, the detection element 40 is mounted on the upper surface 30A of the circuit element 30.

[0083] The sensing element 40 has pads 40C on its upper surface 40A. Although in Figure 2 A pad 40C is marked, but the pad 40C is not limited to one. The pad 40C is electrically connected to the second pad 30D of the circuit element 30 via a bonding wire 81. That is, the detection element 40 is electrically connected to the substrate 20 via the circuit element 30.

[0084] The detection element 40 has a detection section 40D on its upper surface 40A that is subjected to pressure. That is, the detection section 40D detects pressure. In the first embodiment, the detection section 40D of the detection element 40, which is a pressure sensor element, is a pressure-bearing diaphragm or spacer. Furthermore, the detection section 40D, for example, has a passivation film, achieving waterproofing.

[0085] The resin encapsulation 50 is manufactured by molding a rigid resin, such as a thermosetting resin, or an epoxy molding resin, onto the upper surface 20A of the substrate 20. That is, as... Figure 2As shown, a resin encapsulation 50 is disposed on the upper surface 20A of the substrate 20. A portion of the upper surface 20A of the substrate 20 (particularly the pads 20B) is protected and waterproofed by being covered by the resin encapsulation 50.

[0086] like Figure 2 As shown, circuit element 30, detection element 40, and bonding wires 81 and 82 are embedded in resin encapsulation 50. Circuit element 30 (particularly first pad 30C and second pad 30D), detection element 40 (particularly pad 40C), and bonding wires 81 and 82 are protected and waterproofed by being embedded in resin encapsulation 50.

[0087] Based on the above, the resin encapsulation body 50 is used to waterproof the electrical connection between the substrate 20 and the circuit element 30, as well as the electrical connection between the circuit element 30 and the detection element 40.

[0088] like Figure 1 and Figure 2 As shown, the resin encapsulation 50 includes a base 51 and a protrusion 52.

[0089] The base 51 constitutes the portion of the resin encapsulation 50 on the side adjacent to the substrate 20. That is, the base 51 constitutes the lower portion of the resin encapsulation 50. Figure 2 As shown, the lower surface 51A of the base 51 is in contact with the upper surface 20A of the substrate 20. That is, the base 51 is disposed on the upper surface 20A of the substrate 20.

[0090] In the first embodiment, the base 51 is a cuboid shape that is relatively thin in the height direction 101. That is, in the first embodiment, the base 51 is quadrilateral when viewed from above. When viewed from above, the base 51 and the base substrate 20 have the same shape and the same size. Thus, the outer surface 51Ca of the base 51 and the outer surface 20Da of the base substrate 20 are coplanar.

[0091] Furthermore, the shape of the base 51 is not limited to a cuboid shape (which is a quadrilateral shape when viewed from above). For example, the base 51 can also be a polygon other than a quadrilateral when viewed from above. In addition, the base 51 can also be a shape other than a polygon when viewed from above, such as a circle. Furthermore, the base 51 and the base plate 20 can also be different shapes and different sizes when viewed from above.

[0092] The protrusion 52 constitutes a portion of the resin encapsulation 50 on the side opposite to the base substrate 20 relative to the base 51. In other words, the protrusion 52 constitutes the upper portion of the resin encapsulation 50. The protrusion 52 protrudes from the base 51 away from the base substrate 20. In other words, the protrusion 52 protrudes upward from the base 51.

[0093] The protrusion 52 enters the cylindrical member 60, which will be described later.

[0094] In the first embodiment, the protrusion 52 is provided at the center of the base 51 when viewed from above. In other words, when viewed from above, the base 51 extends to a position further outward than the outer surface 52A of the protrusion 52.

[0095] In the first embodiment, the lower portions of the circuit element 30, the detection element 40, the lower portion of the bonding wire 81, and the bonding wire 82 are embedded in the base 51. In the first embodiment, the upper portion of the detection element 40 and the upper portion of the bonding wire 81 are embedded in the protrusion 52.

[0096] Alternatively, the lower part of the circuit element 30 may be embedded in the base 51, and the upper part of the circuit element 30 may be embedded in the protrusion 52. Alternatively, the lower part of the bonding wire 82 may be embedded in the base 51, and the upper part of the bonding wire 82 may be embedded in the protrusion 52. Alternatively, the entire detection element 40 may be embedded in the base 51. Alternatively, the entire bonding wire 81 may be embedded in the base 51.

[0097] The protrusion 52 has an exposure hole 53. The exposure hole 53 extends through the protrusion 52 in the vertical direction. That is, the protrusion 52 is cylindrical.

[0098] The shape of the protrusion 52 matches the shape of the inner peripheral surface 61B of the main body 61 of the cylindrical member 60, which will be described later. As explained later, in the first embodiment, the inner peripheral surface 61B of the main body 61 of the cylindrical member 60 is circular when viewed from above. Therefore, the shape of the protrusion 52 is also circular when viewed from above. That is, in the first embodiment, the protrusion 52 is cylindrical. In addition, if the inner peripheral surface 61B of the cylindrical member 60 is not circular but has other shapes when viewed from above, the shape of the protrusion 52 is also other shapes. For example, if the inner peripheral surface 61B of the cylindrical member 60 is quadrilateral when viewed from above, the shape of the protrusion 52 is quadrilateral cylindrical.

[0099] A portion of the upper surface 40A and the detection portion 40D of the detection element 40 face the lower end of the exposure hole 53. That is, a portion of the upper surface 40A and the detection portion 40D of the detection element 40 are exposed to the outside of the resin encapsulation 50 via the exposure hole 53. In other words, the exposure hole 53 exposes the detection portion 40D of the detection element 40 to the outside of the resin encapsulation 50.

[0100] The opening of the exposure hole 53 is located on the upper surface 52B of the protrusion 52. That is, the resin encapsulation body 50 exposes the detection portion 40D of the detection element 40 upward. With the aid of the cylindrical member 60 and the exposure hole 53 (described later), pressure is applied to the detection portion 40D of the detection element 40 from outside the semiconductor device 10, and the detection element 40 is able to measure this pressure.

[0101] When viewed from above, the protrusion 52 is located around the detection portion 40D of the detection element 40. That is, when viewed from above, the protrusion 52 is located outside the detection portion 40D.

[0102] Furthermore, a passivation film is used to waterproof the detection section 40D of the detection element 40, which is exposed to the outside via the exposure hole 53. Although the exposure hole 53 in the first embodiment is quadrilateral in plan view, it can also be other shapes (e.g., circular in plan view). The exposure hole 53 only needs to function as a pressure inlet hole to introduce pressure into the detection section 40D.

[0103] In the first embodiment, the cylindrical member 60 is made of a metal such as stainless steel. Alternatively, the cylindrical member may be made of a material other than metal. For example, the cylindrical member may also be made of resin. Examples of resins include, for instance, the rigid resin constituting the resin encapsulation 50.

[0104] like Figure 1 and Figure 2 As shown, the cylindrical member 60 includes a main body 61, an upper flange 62, and a lower flange 63. The lower flange 63 is an example of a flange. In addition, the main body 61, the upper flange 62, and the lower flange 63 can be integrally formed, or they can be composed of independent components and assembled together by fitting or other means.

[0105] In the first embodiment, the main body 61 is cylindrical. The protrusion 52 of the resin encapsulant 50 enters the internal space 64 of the main body 61 from below. As previously described, the shape of the protrusion 52 matches the shape of the inner circumferential surface 61B of the main body 61 of the cylindrical member 60. Therefore, the outer surface 52A of the protrusion 52 faces the inner circumferential surface 61B of the main body 61. In the first embodiment, a small gap is formed between the outer surface 52A of the protrusion 52 and the inner circumferential surface 61B of the main body 61. Adhesive 70 is present in this gap. That is, the outer surface 52A of the protrusion 52 is bonded to the inner circumferential surface 61B of the main body 61. Alternatively, the outer surface 52A of the protrusion 52 may also contact the inner circumferential surface 61B of the main body 61.

[0106] The upper flange 62 extends radially 103 from the outer surface 61A of the main body 61. The upper flange 62 is located at the upper end of the main body 61. The upper flange 62 extends over the entire circumference of the outer surface 61A in the circumferential direction 102. The upper flange 62 is circular when viewed from above.

[0107] Alternatively, the upper flange portion 62 may be located at a position other than the upper end of the main body portion 61. Furthermore, the upper flange portion 62 may partially extend from the outer surface 61A in the circumferential direction 102. For example, the cylindrical member 60 may also have a plurality of upper flange portions 62 arranged at intervals in the circumferential direction 102. Furthermore, the upper flange portion 62 may have a shape other than a circle when viewed from above, for example, a quadrilateral shape when viewed from above.

[0108] The lower flange 63 extends radially 103 from the outer surface 61A of the main body 61. The lower flange 63 is located below the upper flange 62, and is spaced apart from the upper flange 62 in the height direction 101. The lower flange 63 is located at the lower end of the main body 61. The lower flange 63 extends over its entire circumference in the circumferential direction 102 of the outer surface 61A. The lower flange 63 is circular when viewed from above.

[0109] like Figure 2 As shown, the lower surface 60A of the lower flange 63 contacts the upper surface 51B of the base 51 of the resin encapsulation 50 from above. That is, the lower flange 63 is supported by the base 51 of the resin encapsulation 50.

[0110] When viewed from above, the lower flange 63 is located inside the outer edge 51C of the base 51 of the resin encapsulation body 50. The outer edge 51C of the base 51 is the portion formed by the outer surface 51Ca of the base 51 and the area near the outer surface 51Ca of the base 51.

[0111] Alternatively, the lower flange 63 may be located at a position other than the lower end of the main body 61. In this case, for example, the lower end of the main body 61 may be located below the lower flange 63, and the lower end of the main body 61 may be supported by the base 51 of the resin encapsulation body 50. Furthermore, the lower flange 63 may also partially extend from the outer surface 61A in the circumferential direction 102. For example, the cylindrical member 60 may also have a plurality of lower flanges 63 arranged at intervals in the circumferential direction 102. Furthermore, the lower flange 63 may also be a shape other than circular when viewed from above, for example, a quadrilateral when viewed from above.

[0112] With the protrusion 52 of the resin encapsulation 50 entering the main body 61 from below, the upper surface 52B of the protrusion 52 is positioned above the lower flange 63. In other words, the protrusion 52 protrudes to a position above the lower flange 63. Furthermore, the position of the upper surface 52B of the protrusion 52 is not limited to... Figure 2 The position shown. For example, the upper surface 52B of the protrusion 52 may also be located below the upper end of the lower flange 63. In addition, for example, the upper surface 52B of the protrusion 52 may also be at the same height as the upper end of the cylindrical member 60.

[0113] Figure 3 yes Figure 1 The semiconductor device is installed in the electronic device in a state that is along with Figure 1 The diagram corresponding to the cross section of line AA. Figure 4 yes Figure 1 The semiconductor device is installed in the electronic device in a state that is along with Figure 1 The diagram corresponding to the cross section of the BB line.

[0114] like Figure 3 and Figure 4 As shown, the semiconductor device 10 is mounted on the housing 2 of the electronic device 1 for use. The electronic device 1 is, for example, a pressure measuring device, and includes the semiconductor device 10, an O-ring OR, and the housing 2.

[0115] An O-ring OR is fitted into the cylindrical member 60 of the semiconductor device 10. The O-ring OR is annular. The inner diameter of the O-ring OR is configured to be the same as or approximately the same as the outer diameter of the main body 61 of the cylindrical member 60. The O-ring OR is made of a component that is easily compressed and deformed, such as nitrile rubber.

[0116] like Figure 2 As shown by the dashed line, the O-ring OR is arranged to surround the main body 61 of the cylindrical member 60 when viewed from above. In the first embodiment, the inner diameter of the O-ring OR is configured to be larger than the outer diameter of the main body 61.

[0117] like Figure 2 As shown, the upper flange 62 of the cylindrical member 60 is used to prevent the O-ring OR, which is mounted on the main body 61 of the cylindrical member 60, from detaching from the upper end of the main body 61. The lower flange 63 of the cylindrical member 60 is used to prevent the O-ring OR, which is mounted on the main body 61, from detaching from the lower end of the main body 61. Alternatively, the upper flange 62 of the cylindrical member 60 may be omitted. In this case, the inner diameter of the O-ring OR is configured to be smaller than the outer diameter of the main body 61, so that the O-ring OR will not move.

[0118] like Figure 3 and Figure 4 As shown, the housing 2 has a recess 2A and an opening 2B.

[0119] The recess 2A is recessed from the inner surface 2C of the housing 2 toward the outer surface 2D of the housing 2. The inner surface 2C of the housing 2 faces the internal space of the housing 2. The outer surface 2D of the housing 2 is the back surface of the inner surface 2C and faces the outside of the housing 2. A semiconductor device 10 with an O-ring OR is disposed in the recess 2A. In the first embodiment, the O-ring OR, the cylindrical member 60, the protrusion 52 of the resin encapsulation body 50, and the upper part of the detection element 40 are disposed in the recess 2A.

[0120] Furthermore, the semiconductor device 10 disposed in the recess 2A is mounted to the housing 2 by a known means (not shown) such as fitting. Moreover, the portion of the semiconductor device 10 disposed in the recess 2A is not limited to the portion described above. It is sufficient as long as at least the O-ring OR and the cylindrical member 60 of the semiconductor device 10 are disposed in the recess 2A.

[0121] The opening 2B penetrates the housing 2. The opening 2B connects the exterior of the housing 2 and the recess 2A. In other words, the opening 2B makes the recess 2A open to the exterior of the housing 2. The detection section 40D of the detection element 40 of the semiconductor device 10 communicates with the exterior of the electronic device 1 via the exposure hole 53 of the resin encapsulation 50, the internal space 64 of the main body 61 of the cylindrical member 60, the recess 2A of the housing 2, and the opening 2B of the housing 2. That is, the opening 2B exposes the detection section 40D to the exterior of the housing 2 via the cylindrical member 60. This allows the semiconductor device 10 to measure the external pressure of the electronic device 1.

[0122] An O-ring OR is disposed in the gap between the semiconductor device 10 configured as described above and the inner side surface 2Aa of the recess 2A of the housing 2.

[0123] With the semiconductor device 10 disposed in the recess 2A of the housing 2, the length in the radial direction 103 between the outer surface 61A of the main body 61 of the cylindrical member 60 and the inner surface 2Aa constituting the recess 2A is greater than the diameter R of the O-ring OR (refer to...). Figure 2 Short. Therefore, when the semiconductor device 10 is disposed in the recess 2A, the O-ring OR is compressed and deformed (refer to...). Figure 3 and Figure 4 Thus, the inner periphery ORa of the O-ring OR contacts the outer surface 61A of the main body 61 of the cylindrical member 60, and the outer periphery ORb of the O-ring OR contacts the inner surface 2Aa that constitutes the recess 2A. As a result, the gap between the semiconductor device 10 and the housing 2 is sealed, and the O-ring OR prevents liquid from seeping into the interior of the electronic device 1 from the outside through this gap.

[0124] The inner surface 2Aa of the recess 2A of the housing 2 has a tapered surface 2F at its end 2E on the inner surface 2C side of the housing 2. The end 2E on the inner surface 2C side of the housing 2 is formed by the inner surface 2C of the housing 2 and the area near the inner surface 2C of the housing 2. The tapered surface 2F is inclined relative to the height direction 101. The tapered surface 2F tends towards the axis C of the cylindrical member 60 as it moves from the inner surface 2C toward the outer surface 2D. In other words, the tapered surface 2F is inclined relative to the height direction 101 in such a way that the inner diameter of the recess 2A decreases as it moves from the inner surface 2C toward the outer surface 2D. Furthermore, the presence or absence of the tapered surface 2F is arbitrary.

[0125] The semiconductor device 10 is inserted into the recess 2A from the internal space side of the housing 2, with the upper flange 62 side of the cylindrical member 60 as the front side. During the insertion of the semiconductor device 10 into the recess 2A, the O-ring OR contacts the conical surface 2F from the internal space side of the housing 2.

[0126] As the semiconductor device 10 is further inserted into the recess 2A, the O-ring OR is guided along the tapered surface 2F. At this time, a reaction force acts on the O-ring OR from the tapered surface 2F. This reaction force includes a component force in the direction of the axis C. Under the action of this component force, the O-ring OR is compressed. The compressed O-ring OR passes through the tapered surface 2F. Thus, as described above, the inner periphery ORa of the O-ring OR contacts the outer surface 61A of the main body 61 of the cylindrical member 60, and the outer periphery ORb of the O-ring OR contacts the inner surface 2Aa constituting the recess 2A. As a result, the gap between the semiconductor device 10 and the housing 2 is sealed.

[0127] As the semiconductor device 10 is further inserted into the recess 2A, such as Figure 4 As shown, the upper surface 51B of the base 51 of the resin encapsulation 50 contacts the inner surface 2C of the housing 2. Specifically, the periphery of the vertices of the quadrilateral on the upper surface 51B of the base 51 contacts the inner surface 2C of the housing 2. This positions the semiconductor device 10 relative to the housing 2. In other words, it prevents the semiconductor device 10 from being excessively inserted into the recess 2A.

[0128] Furthermore, when the aforementioned peripheral portion is in contact with the inner surface 2C of the housing 2, such as Figure 3 As shown, the central part of the side of the quadrilateral on the upper surface 51B of the base 51 (in other words, the middle part between two adjacent vertices) does not contact the inner surface 2C of the shell 2.

[0129] According to the first embodiment, the lower flange portion 63 is located inside the outer edge portion 51C of the base portion 51 when viewed from above. Therefore, when a semiconductor device 10 with an O-ring seal OR embedded in the main body portion 61 of the cylindrical member 60 is disposed in the recess 2A of the housing 2 of the electronic device 1, and the lower flange portion 63 is also disposed in the recess 2A, the diameter of the recess 2A can be reduced by an amount corresponding to the position of the lower flange portion 63 being inside the outer edge portion 51C of the base portion 51. This reduces the gap between the lower flange portion 63 and the inner surface 2Aa of the housing 2 constituting the recess 2A. Furthermore, although in the first embodiment the lower flange portion 63 is located inside the outer edge portion 51C of the base portion 51 when viewed from above, a portion of the lower flange portion 63 may also be located outside the outer edge portion 51C of the base portion 51. For example, a portion of the lower flange portion 63 may be located outside the center of the four sides of the upper surface 51B of the base portion 51. That is, as long as the periphery of the vertex in the upper surface 51B of the base 51 is located outside the lower flange 63, the semiconductor device 10 can be positioned relative to the housing 2 by contacting the periphery with the inner surface 2C of the housing 2.

[0130] According to the first embodiment, the outer surface 52A of the protrusion 52 is bonded to the inner peripheral surface 61B of the cylindrical member 60. Even assuming that the adhesive 70 is extruded between the outer surface 52A of the protrusion 52 and the inner peripheral surface 61B of the cylindrical member 60, the extruded adhesive 70 will be located in the internal space 64 of the cylindrical member 60 or below the lower flange 63 of the cylindrical member 60. Therefore, the extruded adhesive 70 will not hinder the mounting of the semiconductor device 10 to the housing 2.

[0131] Furthermore, since the lower flange portion 63 of the cylindrical member 60 and the base portion 51 of the resin encapsulation body 50 do not necessarily need to be bonded, there is no need to increase the contact area between the lower flange portion 63 and the base portion 51. Additionally, there is no need to perform complex processing such as providing recesses in the lower flange portion 63 to induce adhesive.

[0132] According to the first embodiment, when viewed from above, the lower flange portion 63 is circular, just like the O-ring OR fitted into the main body portion 61 of the cylindrical member 60. Therefore, the gap between the lower flange portion 63 and the inner surface 2Aa of the recess 2A of the housing 2 can be reduced, and deviation of this gap can be eliminated.

[0133] According to the first embodiment, the main body 61 is cylindrical. Therefore, with the O-ring OR fitted into the main body 61, gaps are less likely to form between the O-ring OR and the main body 61. As a result, the possibility of liquid flowing between the O-ring OR and the main body 61 can be reduced.

[0134] According to the first embodiment, the lower flange portion 63 extends from the outer side 61A of the main body portion 61 over its entire circumference. Therefore, when the O-ring OR is fitted into the main body portion 61, the lower flange portion 63 can stably support the O-ring OR.

[0135] According to the first embodiment, the protrusion 52 protrudes to a position above the lower flange 63 of the cylindrical member 60. Therefore, the semiconductor device 10 can be configured such that, with the O-ring OR fitted into the main body 61 of the cylindrical member 60, the protrusion 52 faces the O-ring OR in the radial direction 103, across the main body 61 of the cylindrical member 60. Thus, the protrusion 52 can withstand deformation of the main body 61 of the cylindrical member 60 caused by the force acting on the main body 61 from the O-ring OR, thereby suppressing such deformation.

[0136] According to the first embodiment, since the cylindrical member 60 is made of metal, the dimensional accuracy of the cylindrical member 60 can be improved.

[0137] When the cylindrical member 60 is made of resin, the bonding strength can be enhanced when the cylindrical member 60 is bonded to the resin encapsulation 50, which is also made of resin.

[0138] According to the first embodiment, when a semiconductor device 10 with an O-ring OR embedded in the main body 61 of the cylindrical member 60 is inserted into the recess 2A of the housing 2 of the electronic device 1, the O-ring OR is contacted by the tapered surface 2F, thereby smoothly guiding the O-ring OR into the recess 2A.

[0139] In the first embodiment, the main body 61 of the cylindrical member 60 can be cylindrical, and is not limited to a cylindrical shape. For example, the main body 61 can be either an elliptical cylinder or a polygonal cylinder. In addition, when the main body 61 is a polygonal cylinder, the more sides there are, the less likely it is to form a gap with the O-ring seal OR, which is therefore preferred.

[0140] Although the detection element 40 is mounted on the upper surface 30A of the circuit element 30 in the first embodiment, the detection element 40 may also be mounted on the upper surface 20A of the substrate 20 by bonding or the like.

[0141] In the first embodiment, the circuit element 30 is electrically connected to the substrate 20 via a bonding wire 82, and the detection element 40 is electrically connected to the circuit element 30 via a bonding wire 81. However, the connection method of the substrate 20, the circuit element 30, and the detection element 40 is not limited to this. For example, the detection element 40 may also be connected to the substrate 20 via a bonding wire, just like the circuit element 30. In this case, the detection element 40 is electrically connected to the circuit element 30 via the substrate 20.

[0142] In the first embodiment, the substrate 20, circuit element 30, and detection element 40 are electrically connected by bonding wires 81 and 82, respectively. However, the substrate 20, circuit element 30, and detection element 40 may also be electrically connected by means other than bonding wires 81 and 82. For example, the circuit element 30 may be mounted on the substrate 20 using a flip chip. In this case, the circuit element 30 and the substrate 20 are electrically connected by solder.

[0143] <Second Implementation>

[0144] Figure 5 This is a perspective view of a semiconductor device according to the second embodiment of the present invention. Figure 6 yes Figure 5 The semiconductor device is installed in the electronic device in a state that is along with Figure 5 The diagram shows the cross-section corresponding to the CC line. The difference between the semiconductor device 10A of the second embodiment and the semiconductor device 10 of the first embodiment is that the base 51 of the resin package 50 includes a first base 511 and a second base 512.

[0145] like Figure 5 and Figure 6 As shown, the base 51 of the resin encapsulation 50 includes a first base 511 and a second base 512.

[0146] The first base portion 511 constitutes the portion of the base portion 51 on the side of the substrate 20. That is, the first base portion 511 constitutes the lower portion of the base portion 51. The lower surface 511A of the first base portion 511 is in contact with the upper surface 20A of the substrate 20. That is, the first base portion 511 is provided on the upper surface 20A of the substrate 20.

[0147] In the second embodiment, the first base portion 511 is a relatively thin cuboid shape in the height direction 101. That is, in the second embodiment, the first base portion 511 is quadrilateral when viewed from above. When viewed from above, the first base portion 511 and the base substrate 20 have the same shape and the same size. Therefore, the outer surface 511Ca of the first base portion 511 and the outer surface 20Da of the base substrate 20 are coplanar.

[0148] Furthermore, the shape of the first base portion 511 is not limited to a cuboid shape (which is a quadrilateral shape when viewed from above). For example, the first base portion 511 may also be a polygon other than a quadrilateral when viewed from above. Alternatively, the first base portion 511 may be a shape other than a polygon when viewed from above, such as a circle. In addition, the first base portion 511 and the base plate 20 may also have different shapes and different sizes when viewed from above.

[0149] The second base portion 512 constitutes the portion of the base 51 that is opposite to the substrate 20 relative to the first base portion 511. That is, the second base portion 512 constitutes the upper portion of the base 51. The second base portion 512 protrudes from the first base portion 511 away from the substrate 20. In other words, the second base portion 512 protrudes upward from the first base portion 511.

[0150] In the second embodiment, the second base 512 is cylindrical. That is, the second base 512 is circular when viewed from above. Alternatively, the second base 512 can also be a shape other than cylindrical, such as a quadrangular prism. In this case, the second base 512 is quadrilateral when viewed from above.

[0151] like Figure 6 As shown, the upper surface 512A of the second base 512 contacts the lower surface 60A of the lower flange portion 63 of the cylindrical member 60 from below. That is, the second base 512 supports the lower flange portion 63 of the cylindrical member 60.

[0152] like Figure 5 and Figure 6 As shown, the second base 512 is located inside the outer edge 511C of the first base 511 when viewed from above. The outer edge 511C of the first base 511 is the portion formed by the outer surface 511Ca of the first base 511 and the area near the outer surface 511Ca of the first base 511.

[0153] The protrusion 52 protrudes upward from the second base 512.

[0154] like Figure 6 As shown, the semiconductor device 10A of the second embodiment is inserted into the recess 2A of the housing 2 in the same manner as the semiconductor device 10 of the first embodiment. The electronic device 1A includes the semiconductor device 10A, an O-ring OR mounted on the semiconductor device 10A, and the housing 2.

[0155] With the semiconductor device 10A inserted into the recess 2A of the housing 2, the upper surface 511B of the first base 511 contacts the inner surface 2C of the housing 2. Specifically, the periphery of the vertices of the quadrilateral on the upper surface 511B of the first base 511 contacts the inner surface 2C of the housing 2. This positions the semiconductor device 10A relative to the housing 2.

[0156] Furthermore, similar to the first embodiment, when the peripheral portion is in contact with the inner surface 2C of the housing 2, the central portion of the side of the quadrilateral on the upper surface 511B of the first base 511 (in other words, the middle portion between two adjacent vertices) does not contact the inner surface 2C of the housing 2.

[0157] In the second embodiment, the O-ring OR, the cylindrical member 60, the protrusion 52 and the second base 512 of the resin encapsulation body 50, the upper part of the detection element 40, and the upper part of the circuit element 30 are disposed in the recess 2A.

[0158] According to the second embodiment, the second base 512 is located inside the outer edge 511C of the first base 511 when viewed from above. Therefore, when a semiconductor device 10A with an O-ring OR fitted into the main body 61 of the cylindrical member 60 is disposed in the recess 2A of the housing 2 of the electronic device 1A, and both the cylindrical member 60 and the second base 512 are disposed in the recess 2A, the diameter of the recess 2A can be reduced by an amount corresponding to the position of the second base 512 being inside the outer edge 511C of the first base 511. This reduces the gap between the lower flange 63 and the inner surface 2Aa of the housing 2 constituting the recess 2A. Furthermore, by inserting the second base 512 into the recess 2A, the O-ring OR fitted into the main body 61 of the cylindrical member 60 can be inserted further inside the recess 2A.

[0159] According to the second embodiment, when viewed from above, the second base 512 is circular, just like the O-ring OR fitted into the main body 61 of the cylindrical member 60. Therefore, the gap between the second base 512 and the inner surface 2Aa of the recess 2A of the housing 2 can be reduced, and deviation of this gap can be eliminated.

[0160] <Third Implementation>

[0161] Figure 7 This is a perspective view of a semiconductor device according to the third embodiment of the present invention. Figure 8 yes Figure 7 The semiconductor device is installed in the electronic device in a state that is along with Figure 7 The diagram shows the cross-section of the DD line. The difference between the semiconductor device 10B of the third embodiment and the semiconductor device 10 of the first embodiment is that the resin package 50A is located inside the outer edge of the substrate 20 when viewed from above.

[0162] like Figure 7 and Figure 8 As shown, the semiconductor device 10B includes a resin package 50A.

[0163] The resin encapsulation body 50A includes a base 54 with a structure different from that of the base 51 in the first embodiment and a protrusion 52 with the same structure as that in the first embodiment, which protrudes upward from the base 54.

[0164] When viewed from above, the base 54 is located at the outer edge 20D of the substrate 20 (see reference). Figure 8The outer edge 20D of the substrate 20 is located on the inner side. The outer edge 20D of the substrate 20 is formed by the outer surface 20Da of the substrate 20 and the area near the outer surface 20Da of the substrate 20. At this point, the base 51, which is the same size as the substrate 20 when viewed from above (see reference...). Figure 1 ) and base 54 are different structures.

[0165] In other words, when viewed from above, the outer edge 54C of the base 54 is located inside the outer edge 20D of the substrate 20. The outer edge 54C of the base 54 is the portion formed by the outer surface 54Ca of the base 54 and the area near the outer surface 54Ca of the base 54.

[0166] Furthermore, when viewed from above, the protrusion 52 is located inside the outer edge 54C of the base 54.

[0167] Based on the above, the resin encapsulation body 50A, including the base 54 and the protrusion 52, is located inside the outer edge 20D of the substrate 20 when viewed from above.

[0168] In the third embodiment, the base 54 is cylindrical. That is, the base 54 is circular when viewed from above. In other words, the resin encapsulation 50A containing the base 54 is circular when viewed from above. Alternatively, the base 54 can also be a shape other than cylindrical. For example, the base 54 can also be a quadrangular prism. In this case, the resin encapsulation 50A containing the base 54 is quadrilateral when viewed from above.

[0169] In the third embodiment, the substrate 20, like in the first embodiment, is a cuboid shape that is relatively thin in the height direction 101. That is, the substrate 20 is quadrilateral when viewed from above. However, the shape of the substrate 20 is not limited to a cuboid shape (a quadrilateral shape when viewed from above). For example, the substrate 20 may also be a polygon other than a quadrilateral when viewed from above.

[0170] like Figure 8 As shown, the upper surface 54B of the base 54 contacts the lower surface 60A of the lower flange portion 63 of the cylindrical member 60 from below. That is, the base 54 supports the lower flange portion 63 of the cylindrical member 60.

[0171] The semiconductor device 10B of the third embodiment is inserted into the recess 2A of the housing 2 in the same manner as the semiconductor device 10 of the first embodiment. The electronic device 1B includes the semiconductor device 10B, an O-ring OR mounted on the semiconductor device 10B, and the housing 2.

[0172] With the semiconductor device 10B inserted into the recess 2A of the housing 2, the upper surface 20A of the substrate 20 contacts the inner surface 2C of the housing 2. Specifically, the periphery of the vertices of the quadrilateral on the upper surface 20A of the substrate 20 contacts the inner surface 2C of the housing 2. This positions the semiconductor device 10B relative to the housing 2.

[0173] Furthermore, similar to the first embodiment, when the peripheral portion is in contact with the inner surface 2C of the housing 2, the central portion of the side of the quadrilateral on the upper surface 20A of the base substrate 20 (in other words, the middle portion between two adjacent vertices) does not contact the inner surface 2C of the housing 2.

[0174] In the third embodiment, all parts of the semiconductor device 10B except the substrate 20 are disposed in the recess 2A.

[0175] According to the third embodiment, the resin encapsulant 50A is located inside the outer edge 20D of the substrate 20 when viewed from above. Therefore, when a semiconductor device 10B with an O-ring OR embedded in the main body 61 of the cylindrical member 60 is disposed in the recess 2A of the housing 2 of the electronic device 1B, the diameter of the recess 2A can be reduced by an amount corresponding to the position of the resin encapsulant 50A inside the outer edge 20D of the substrate 20, provided that the resin encapsulant 50A is entirely disposed in the recess 2A. This reduces the gap between the lower flange 63 and the inner surface 2Aa of the housing 2 constituting the recess 2A. Furthermore, by inserting the resin encapsulant 50A entirely into the recess 2A, the O-ring OR embedded in the main body 61 of the cylindrical member 60 can be inserted further inside the recess 2A.

[0176] According to the third embodiment, when viewed from above, the resin encapsulation body 50A and the O-ring OR embedded in the cylindrical member 60 are both circular. Therefore, the gap between the resin encapsulation body 50A and the inner surface 2Aa of the recess 2A of the housing 2 can be reduced, and deviation of this gap can be eliminated.

[0177] Furthermore, by appropriately combining any of the various embodiments described above, their respective effects can be achieved.

[0178] The invention has been fully described with reference to the accompanying drawings and in connection with preferred embodiments, but various modifications and variations will be apparent to those skilled in the art. It should be understood that such modifications and variations are included therein as long as they do not depart from the scope of the invention as defined by the claims.

[0179] Explanation of reference numerals in the attached figures

[0180] 1. Electronic device; 2. Housing; 2A. Recess; 2Aa. Inner surface; 2B. Opening; 2C. Inner surface; 2D. Outer surface; 2E. End; 2F. Tapered surface; 10. Semiconductor device; 20. Substrate; 20A. Upper surface; 20D. Outer edge; 40. Detection element; 40D. Detection part; 50. Resin encapsulation; 51. Base; 511. First base; 511C. Outer edge; 512. Second base; 51C. Outer edge; 52. Protrusion; 52A. Outer surface; 53. Exposure hole; 60. Cylindrical member; 61. Main body; 61A. Outer surface; 61B. Inner peripheral surface; 63. Lower flange (flange); OR. O-ring; ORa. Inner peripheral part.

Claims

1. A semiconductor device, wherein, The semiconductor device includes: Substrate; A detection element is mounted on the upper surface of the substrate and has a detection section for detecting pressure. A resin encapsulation body is disposed on the upper surface of the substrate, the detection element is embedded in the resin encapsulation body, and the resin encapsulation body has an exposure hole that exposes the detection portion of the detection element upwards; and A cylindrical component supported by the resin encapsulation body. The resin encapsulation body includes: A base, disposed on the upper surface of the substrate, wherein the detection element is embedded in the base; and The protrusion, having the exposure hole, protrudes upward from the base and enters the cylindrical member. The cylindrical component includes: The cylindrical main body; and A flange portion extends from the outer side of the main body portion and is supported by the base portion. At least a portion of the flange portion is located, when viewed from above, inside the outer edge of the base portion of the resin encapsulation. The outer surface of the protrusion is bonded to the inner circumferential surface of the cylindrical member.

2. The semiconductor device according to claim 1, wherein, The base of the resin encapsulation is polygonal when viewed from above. The flange portion of the cylindrical member is circular when viewed from above.

3. The semiconductor device according to claim 2, wherein, The base of the resin encapsulation includes: A first base portion is disposed on the upper surface of the substrate; and The second base, which protrudes upward from the first base and is located inside the outer edge of the first base when viewed from above, supports the flange of the cylindrical member.

4. The semiconductor device according to claim 3, wherein, The first base of the resin encapsulation is polygonal when viewed from above. The second base of the resin encapsulation is circular when viewed from above.

5. The semiconductor device according to claim 1, wherein, The resin encapsulation is located inside the outer edge of the substrate when viewed from above.

6. The semiconductor device according to claim 5, wherein, The substrate is polygonal when viewed from above. The resin encapsulation is circular when viewed from above.

7. The semiconductor device according to any one of claims 1 to 6, wherein, The main body of the cylindrical component is cylindrical or elliptical.

8. The semiconductor device according to any one of claims 1 to 6, wherein, The flange portion of the cylindrical member extends from the outer side of the main body portion over its entire circumference.

9. The semiconductor device according to any one of claims 1 to 6, wherein, The protrusion of the resin encapsulation extends above the flange of the cylindrical member.

10. The semiconductor device according to any one of claims 1 to 6, wherein, The cylindrical component is made of metal.

11. The semiconductor device according to any one of claims 1 to 6, wherein, The cylindrical component is made of resin.

12. The semiconductor device according to any one of claims 1 to 6, wherein, The semiconductor device includes a circuit element mounted on the upper surface of the substrate and electrically connected to the detection element.

13. An electronic device, wherein, The electronic device includes: The semiconductor device according to any one of claims 1 to 12; An O-ring, configured to surround the cylindrical member when viewed from above, has its inner circumference in contact with the outer surface of the main body of the cylindrical member; and A housing for mounting the semiconductor device.

14. The electronic device according to claim 13, wherein, The housing includes: A recess, recessed from the inner surface of the housing toward the outer surface of the housing, for accommodating at least a cylindrical member and the O-ring in the semiconductor device; and An opening that allows the recess to open to the outside of the housing, and the cylindrical member disposed in the recess exposes the detection portion of the detection element to the outside of the housing. The inner surface of the recess forming the housing has a tapered surface at the end of the housing on the inner surface side, the tapered surface being inclined in such a way that the inner diameter of the recess decreases as it moves from the inner surface of the housing toward the outer surface of the housing.

Images