An ultraviolet irradiation surface modification apparatus

Abstract

The application discloses an ultraviolet irradiation surface modification device, which comprises a box body, a plurality of placing cavities are formed in the box body, a sample table and an irradiation lamp array are arranged in each placing cavity, the sample table is used for carrying a substrate to be irradiated, the irradiation lamp array emits ultraviolet light towards the sample table, and the placing cavities are additionally provided with an atmosphere adjusting device and a heat exchanger, the atmosphere adjusting device is used for controlling the concentration of an atmosphere such as ozone or oxygen in the placing cavities, and the heat exchanger is used for adjusting the temperature in the placing cavities, so that the irradiation environment atmosphere in the placing cavities can be adjusted according to the substrate to be irradiated. The application can be applied to substrates to be irradiated with different irradiation range requirements, and the irradiation environment atmosphere in the placing cavities is effectively controlled through the atmosphere adjusting device and the heat exchanger, so that a stable environment is provided for ultraviolet surface activation or stabilization treatment of the substrate to be irradiated, and the stability and uniformity of the surface activation or stabilization treatment of the substrate to be irradiated are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of surface modification technology, and more particularly to an ultraviolet irradiation surface modification device. Background Technology

[0002] Surface modification can impart new properties to the surface of materials or products while maintaining their original properties, such as hydrophilicity, biocompatibility, antistatic properties, and dyeability. There are many methods for surface modification, which can be broadly categorized as: surface chemical reaction methods, surface grafting methods, and surface composite methods. During surface modification, it is often necessary to activate the material surface to generate active groups that react with the subsequent modification system, forming chemical bonds and increasing adhesion. Simultaneously, the surface modification process often requires subsequent oxidation treatments to form a more stable surface. Ultraviolet irradiation can generate active groups such as OH groups on the surface of polymers and other materials, and can also excite ozone generation in the air atmosphere, achieving surface oxidative stabilization in conjunction with ultraviolet light; this method is commonly used in surface modification processes.

[0003] Aerospace materials used in harsh service environments often require surface modification to better adapt to the long-term service requirements of the space environment. For example, solar panel substrates are key components of flexible solar cell wings in low-Earth orbit (LEO) spacecraft, with extensive use of polyimide insulating films and carbon fiber / resin composites on their surfaces. Due to the presence of highly reactive atomic oxygen in the LEO spacecraft operating environment, surface materials such as polyimide exposed to the space environment undergo severe oxidation and corrosion, directly leading to component failure. Activated silanization surface modification mainly includes surface activation, surface silanization, and surface stabilization processes, which can significantly improve the atomic oxygen resistance of the substrate, meeting the development needs of LEO spacecraft. Among these, surface activation and surface stabilization are crucial steps in atomic oxygen resistance surface modification technology. The stability and reliability of the UV irradiation intensity on the substrate surface are extremely important, requiring real-time monitoring of the UV lamp's operating status to prevent quality accidents. Furthermore, it places high demands on the uniformity of the equipment's mechanical manufacturing. In addition, in practical applications, the substrates requiring surface modification vary in shape, and current equipment cannot meet the needs of surface activation or stabilization treatment for substrates of different sizes and shapes, resulting in uneven UV irradiation. Summary of the Invention

[0004] To address the aforementioned technical problems, the present invention aims to provide an ultraviolet irradiation surface modification device, which solves the problems in the prior art.

[0005] To achieve the above objectives, the present invention provides an ultraviolet irradiation surface modification apparatus, comprising:

[0006] The box has several placement cavities inside, each containing a sample stage and an irradiation lamp array. The sample stage is used to support the substrate to be irradiated, and the irradiation lamp array emits ultraviolet light towards the sample stage, corresponding to different irradiation ranges of the substrate to be irradiated.

[0007] The placement chamber is also equipped with an atmosphere conditioning device and a heat exchanger. The atmosphere conditioning device can be used to control the concentration of ozone or oxygen in the placement chamber, and the heat exchanger is used to adjust the temperature in the placement chamber so that the irradiation environment atmosphere in the placement chamber can be adjusted according to the substrate to be irradiated.

[0008] By setting up irradiation lamp arrays in several placement chambers, the device can be adapted to irradiated substrates with different irradiation range requirements, effectively optimizing the applicability of the device. At the same time, the irradiation environment atmosphere in the placement chambers is effectively controlled by the atmosphere conditioning device and heat exchanger, thereby providing a stable environment for the ultraviolet surface activation or stabilization treatment of the substrates to be irradiated. This effectively improves the stability and uniformity of the surface activation or stabilization treatment of the substrates to be irradiated, so as to meet the ever-evolving needs of material surface modification.

[0009] In some embodiments, the ultraviolet irradiation surface modification device provided by the present invention further includes several reflective structures, each disposed in a corresponding placement cavity, for reflecting a portion of the ultraviolet light emitted by the irradiation lamp array to the sample stage.

[0010] The reflective structure not only reduces the interference of ultraviolet light in non-irradiated areas on the irradiated substrate, but also enables more precise control of the oxidation modification process. In addition, it effectively improves the utilization rate of ultraviolet light, thereby reducing the cost of use.

[0011] In some embodiments, there are three placement cavities, namely a first placement cavity, a second placement cavity, and a third placement cavity. The irradiation lamp array in the first placement cavity is a top irradiation lamp array, the irradiation lamp array in the second placement cavity is a double-sided irradiation lamp array, and the irradiation lamp array in the third placement cavity is a 360° irradiation lamp array.

[0012] The three different irradiation lamp arrays enable the device to be used on substrates with different irradiation range requirements, effectively optimizing the applicability of the device and enabling simultaneous ultraviolet irradiation treatment of three different substrates to meet the irradiation range requirements, thus effectively improving the working efficiency of the device.

[0013] In some embodiments, the top irradiation lamp array includes a plurality of first ultraviolet lamps, which are arranged in parallel at the top of the first placement cavity;

[0014] The sample stage in the first placement cavity is a first sample stage, which is located directly below the first ultraviolet lamp, so that the first ultraviolet lamp can irradiate and cover the side of the substrate to be irradiated that is close to the first ultraviolet lamp.

[0015] The reflective structure in the first placement cavity is a planar reflector, which is disposed on the side of the first ultraviolet lamp away from the first sample stage.

[0016] The top irradiation lamp array is designed to meet the irradiation range requirements of the substrate to be irradiated, while the planar reflector effectively increases the ultraviolet irradiation intensity and ultraviolet light utilization of the first ultraviolet lamp, effectively saving costs.

[0017] In some embodiments, a first lifting assembly is further provided inside the first placement cavity. The first lifting assembly is fixedly disposed on the side wall of the first placement cavity in a direction parallel to the side wall of the first placement cavity. The first sample stage is movably mounted on the first lifting assembly, so that the distance between the first sample stage and the first ultraviolet lamp tube can be adjusted.

[0018] By adjusting the distance between the first sample stage and the first ultraviolet lamp, the intensity of ultraviolet light irradiating the substrate by the first ultraviolet lamp can be effectively adjusted, thereby adjusting the surface modification, activation or stabilization process of the substrate under ultraviolet irradiation.

[0019] In some embodiments, the sample stage in the second placement cavity is a second sample stage, which is disposed at the bottom of the second placement cavity;

[0020] The dual-sided irradiation lamp array includes two sets of ultraviolet lamp tubes, which are symmetrically arranged on both sides of the second sample stage. Each ultraviolet lamp tube set includes several parallel and spaced second ultraviolet lamp tubes, so that the second ultraviolet lamp tubes can irradiate and cover the two sides of the substrate to be irradiated corresponding to the second ultraviolet lamp tubes.

[0021] The two sets of ultraviolet lamps are designed to ensure that the irradiation range is symmetrical on both sides of the substrate to be irradiated.

[0022] In some embodiments, the reflective structure in the second placement cavity is a wavy reflector, which is disposed on the side of the second ultraviolet lamp away from the second sample stage. The wavy reflector includes a plurality of orderly arranged protrusions, and the second ultraviolet lamp is disposed between each pair of protrusions.

[0023] By placing the second ultraviolet lamp between two adjacent protrusions, the ultraviolet light reflection intensity of the wavy reflector is effectively increased, making the light reflection more concentrated, further improving the utilization rate of ultraviolet light, and also effectively improving the uniformity of ultraviolet irradiation.

[0024] In some embodiments, two second horizontal tracks are provided on both sides of the second sample stage, and the two sets of ultraviolet lamp tubes are respectively movably arranged on the two second horizontal tracks, so that the ultraviolet lamp tubes can slide on the second horizontal tracks, thereby adjusting the distance between the second sample stage and the second ultraviolet lamp tubes.

[0025] The setting of the second horizontal track enables the adjustment of the ultraviolet light intensity irradiated by the second ultraviolet lamp on the substrate to be irradiated by adjusting the distance between the second sample stage and the second ultraviolet lamp, thereby adjusting the surface modification, activation or stabilization treatment process of the substrate under ultraviolet irradiation.

[0026] In some embodiments, an ultraviolet lamp compensation device is provided on the second sample stage. The ultraviolet lamp compensation device is used to compensate for the ultraviolet radiation emitted by the ultraviolet lamp compensation device, and the ultraviolet lamp compensation device emits ultraviolet light toward the substrate to be irradiated.

[0027] In some embodiments, the sample stage in the third placement cavity is a third sample stage, which is located at the bottom of the third placement cavity. The 360° irradiation lamp array includes three sets of third ultraviolet lamps and three sets of third horizontal tracks. The third ultraviolet lamps are movably mounted on their respective third horizontal tracks. All three sets of third horizontal tracks surround the center of the third sample stage and face the center of the third sample stage, so that the distance between the third ultraviolet lamps and the center of the third sample stage is adjustable, and the third ultraviolet lamps can irradiate and cover all surfaces of the substrate to be irradiated.

[0028] The 360° irradiation lamp array meets the requirement of a 360° irradiation range for the substrate to be irradiated. In addition, the setting of the third horizontal track allows for adjustment of the distance between the substrate to be irradiated and the second ultraviolet lamp, thereby adjusting the intensity of ultraviolet light irradiated by the third ultraviolet lamp on the substrate, and thus adjusting the surface modification, activation or stabilization treatment process of the substrate under ultraviolet irradiation.

[0029] In some embodiments, the reflective structure in the third placement cavity is a folded reflector, which is disposed between two adjacent third horizontal tracks;

[0030] The folded reflector includes two reflective plates connected but not parallel, with the side of the larger included angle between the two reflective plates closer to the third sample stage.

[0031] The arrangement of the two reflectors ensures that areas on the substrate that are far from the third ultraviolet lamp receive sufficient intensity of ultraviolet irradiation, and also effectively improves the uneven irradiation of ultraviolet light in the third placement cavity.

[0032] In some embodiments, the placement cavity further includes an in-situ reaction chamber, the top of which is provided with a plurality of fourth ultraviolet lamps, a reaction box is provided directly below the ultraviolet lamp array, a fourth sample stage is provided inside the reaction box, a quartz glass window is provided on the side of the reaction box near the fourth ultraviolet lamps, and a heating plate is provided on the side of the reaction box away from the fourth ultraviolet lamps. The in-situ reaction chamber is connected to the atmosphere conditioning device.

[0033] The in-situ reaction chamber design enables the substrate to undergo silanization surface modification immediately after ultraviolet irradiation, or silanization surface modification simultaneously with ultraviolet irradiation. This allows for the control of the surface activation process of the substrate by adjusting different ultraviolet irradiation intensities and different silanization solution temperatures.

[0034] In some embodiments, the in-situ reaction chamber further includes several height-lifting tracks, which are disposed on the side wall of the in-situ reaction chamber. The reaction box is slidably connected to the height-lifting tracks, so that the reaction box can slide along the height-lifting tracks to adjust the distance between the reaction box and the fourth ultraviolet lamp.

[0035] By adjusting the distance between the fourth sample stage and the fourth ultraviolet lamp via a height-adjusting track, the intensity of ultraviolet irradiation can be effectively adjusted, thereby controlling the surface activation process of the substrate to be irradiated.

[0036] The ultraviolet irradiation surface modification device provided by this invention can bring at least one of the following benefits.

[0037] Beneficial effects:

[0038] 1. The ultraviolet irradiation surface modification device of the present invention, by setting irradiation lamp arrays in several placement chambers respectively, enables the device to be adapted to substrates requiring different irradiation ranges, effectively optimizing the applicability of the device. At the same time, the irradiation environment atmosphere in the placement chamber is effectively controlled by the atmosphere conditioning device and the heat exchanger, thereby providing a stable environment for the ultraviolet surface activation or stabilization treatment of the substrate to be irradiated, and thus effectively improving the stability and uniformity of the surface activation or stabilization treatment of the substrate to be irradiated, so as to meet the ever-evolving needs of material surface modification.

[0039] 2. In this invention, by setting an adjustable reflective structure in the placement cavity, the ultraviolet light will be reflected towards the sample stage after being irradiated by the reflective structure. This not only reduces the interference of ultraviolet light in the non-irradiated area on the substrate to be irradiated, but also enables more precise control of the oxidation modification process. In addition, it effectively improves the utilization rate of ultraviolet light, thereby reducing the cost of use. Attached Figure Description

[0040] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of the present invention.

[0041] Figure 1 This is a front view schematic diagram of the ultraviolet irradiation surface modification device according to an embodiment of the present invention;

[0042] Figure 2 This is a schematic diagram of the elevation structure of the ultraviolet irradiation surface modification device according to an embodiment of the present invention;

[0043] Figure 3 This is a top view schematic diagram of the ultraviolet irradiation surface modification device according to an embodiment of the present invention;

[0044] Figure 4 This is a schematic diagram of the elevation structure of the 360° irradiation lamp array of the ultraviolet irradiation surface modification device according to an embodiment of the present invention.

[0045] Explanation of icon numbers:

[0046] First placement chamber 10, top irradiation lamp array 11, first sample stage 12, first lifting assembly 13, second placement chamber 20, double-sided irradiation lamp array 21, second ultraviolet lamp tube 211, wave-shaped reflector 212, lamp box 213, second sample stage 22, clamping component 221, ultraviolet lamp compensation device 222, third placement chamber 30, 360° irradiation lamp array 31, third ultraviolet lamp tube 311, third horizontal track 312, folded reflector 32, third sample outlet 33, third sample stage 34, in-situ reaction chamber 40, fourth ultraviolet lamp tube 41, reaction box 42, quartz glass window 421, height lifting track 43, atmosphere conditioning device 50, heat exchanger 60. Detailed Implementation

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0048] To keep the drawings concise, each figure only schematically shows the parts relevant to the invention, and these do not represent the actual structure of the product. Furthermore, to facilitate understanding, in some figures, only one of components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0049] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0050] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0051] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0052] In one embodiment, refer to the appendix to the specification. Figures 1 to 3 As shown, the ultraviolet irradiation surface modification device provided by the present invention includes a housing with several placement cavities inside. Each placement cavity is equipped with a sample stage and an irradiation lamp array. The sample stage is used to support the substrate to be irradiated. The irradiation lamp array emits ultraviolet light towards the sample stage and corresponds to different irradiation ranges of the substrate to be irradiated. In addition, an atmosphere conditioning device 50 and a heat exchanger 60 are also provided in the placement cavity. The atmosphere conditioning device 50 is used to control the ozone concentration in the placement cavity, and the heat exchanger 60 is used to adjust the temperature in the placement cavity, so that the irradiation environment atmosphere in the placement cavity can be adjusted according to the substrate to be irradiated.

[0053] It should be noted that several placement chambers are arranged in sequence, and the irradiation range of the radiation lamp array in different placement chambers is different to accommodate substrates with different radiation requirements. The sub-control devices of the atmosphere conditioning device 50 are independently connected to each placement chamber to independently control the ozone concentration in each placement chamber. The heat exchanger 60 can be a copper fin heat exchanger or an aluminum fin heat exchanger, which is installed on the side wall inside the placement chamber to effectively prevent the radiation lamp array from generating a large amount of heat during long-term operation, thereby preventing the accumulation of heat in the placement chamber and the continuous rise in temperature.

[0054] In addition, the irradiation lamp array can be composed of multiple ultraviolet lamps, variable frequency electronic rectifiers, and mounting brackets. Preferably, the ultraviolet lamps can be low-pressure quartz mercury lamps or low-pressure metal halide lamps. The specific shape of the ultraviolet lamps can be any of the following: straight, U-shaped, or M-shaped. The specific lamp shape can be selected according to the irradiation space and irradiation area. There is a corresponding relationship between the number of variable frequency electronic rectifiers and the number of ultraviolet lamps. Generally, in order to maintain current stability, one variable frequency electronic rectifier is selected to connect one group of ultraviolet lamps.

[0055] In one embodiment, the ultraviolet irradiation surface modification device provided by the present invention further includes several reflective structures, which are respectively disposed in the corresponding placement cavities and are used to reflect part of the ultraviolet light emitted by the irradiation lamp array to the sample stage.

[0056] The reflective structure is used to increase the intensity of ultraviolet light irradiation and adjust the uniformity of ultraviolet light intensity, while reducing the interference of non-irradiated areas on the substrate to be irradiated. The reflective structure can be anodized high-gloss mirror reflective aluminum plate or diffuse reflective aluminum plate. The specific shape of the reflective structure can be any of the following: planar, trapezoidal, or semi-circular arc. The specific shape depends on the characteristics and requirements of the substrate to be irradiated.

[0057] In one embodiment, based on the previous embodiment, refer to the appendix to the specification. Figure 1 and Figure 2 As shown, there are three placement cavities: a first placement cavity 10, a second placement cavity 20, and a third placement cavity 30. The irradiation lamp array in the first placement cavity 10 is a top irradiation lamp array 11, the irradiation lamp array in the second placement cavity 20 is a double-sided irradiation lamp array 21, and the irradiation lamp array in the third placement cavity 30 is a 360° irradiation lamp array 31. The top irradiation lamp array 11 is suitable for substrates with a radiation response range on one side, the double-sided irradiation lamp array 21 is suitable for substrates with a radiation response range on both opposite sides, and the 360° irradiation lamp array 31 is suitable for substrates with a radiation response range that surrounds the entire body.

[0058] In one embodiment, refer to the appendix to the specification. Figure 1 and Figure 2 As shown, the top irradiation lamp array 11 includes a plurality of first ultraviolet lamps, which are arranged in parallel at the top of the first placement cavity 10. The sample stage in the first placement cavity 10 is a first sample stage 12, which is located directly below the first ultraviolet lamps, so that the first ultraviolet lamps can irradiate and cover the side of the substrate to be irradiated that is close to the first ultraviolet lamps. The reflective structure in the first placement cavity 10 is a planar reflector, which is located on the side of the first ultraviolet lamps away from the first sample stage 12.

[0059] Specifically, the effective length of the first ultraviolet lamp can meet the horizontal dimensions of the irradiation area. The first ultraviolet lamp is parallel to the placement plane of the first sample stage 12. The first ultraviolet lamps can also be stacked to effectively avoid uneven ultraviolet irradiation of the substrate due to uneven light intensity at both ends of the first ultraviolet lamp. In addition, the first sample stage 12 can be made of nickel-iron alloy, and a strong magnet for fixing the sample can be provided on the first sample stage 12.

[0060] It should be noted that the top irradiation lamp array 11 may also include a top box, which is fixedly installed on the top of the first placement cavity 10. The first ultraviolet lamp tube is fixed to the side of the top box near the first sample stage 12 by a fixing bracket. The planar reflector is installed on the side of the first ultraviolet lamp tube away from the first sample stage 12. In addition, several blowing devices may be installed inside the top box, and several ventilation holes may be opened on the side wall of the top box to effectively dissipate heat and cool down the first ultraviolet lamp tube during operation.

[0061] In one embodiment, refer to the appendix to the specification. Figure 2 As shown, a first lifting assembly 13 is also provided in the first placement cavity. The first lifting assembly 13 is fixedly disposed on the side wall of the first placement cavity 10 in a direction parallel to the side wall of the first placement cavity 10. The first sample stage 12 is movably mounted on the first lifting assembly 13, so that the distance between the first sample stage 12 and the first ultraviolet lamp tube can be adjusted.

[0062] Specifically, there may be four first lifting components 13, which are respectively set at the four sides of the first placement cavity 10. The first lifting component 13 may be a locking strip with a number of locking teeth. The locking strip is set vertically on the side wall of the first placement cavity 10 with the locking teeth corresponding to the angle of the locking teeth to the first sample stage 12. By placing the first sample stage 12 at different heights of locking teeth, the distance between the first sample stage 12 and the first ultraviolet lamp is adjusted, thereby adjusting the ultraviolet irradiation intensity of the first ultraviolet lamp on the substrate.

[0063] In one embodiment, refer to the appendix to the specification. Figure 3 As shown, the sample stage in the second placement cavity 20 is the second sample stage 22, which is located at the bottom of the second placement cavity 20. The double-sided irradiation lamp array 21 includes two sets of ultraviolet lamp tubes, which are symmetrically arranged on both sides of the second sample stage 22. Each ultraviolet lamp tube set includes several parallel and spaced second ultraviolet lamp tubes 211, so that the second ultraviolet lamp tubes 211 can irradiate and cover the two sides of the substrate to be irradiated corresponding to the second ultraviolet lamp tubes 211.

[0064] Specifically, the second sample stage 22 can be composed of a base and a clamping member 221. The clamping member 221 is disposed at both ends of the base. At the same time, the substrate to be irradiated is held vertically on the base under the clamping action of the clamping member 221. The ultraviolet lamp tube groups on both sides are arranged parallel to the substrate to be irradiated, so that the two sides of the substrate to be irradiated can be effectively irradiated. The second placement cavity 20 is provided with a sample placement port for placing the sample, so that the substrate to be irradiated can be lowered from above and inserted into the clamping member 221.

[0065] In one embodiment, based on the above embodiments, refer to the appendix to the specification. Figure 2 and Figure 3 As shown, the reflective structure in the second placement cavity 20 is a wave-shaped reflector 212. The wave-shaped reflector 212 is located on the side of the second ultraviolet lamp tube 211 away from the second sample stage 22. The wave-shaped reflector 212 includes several orderly arranged protrusions, and the second ultraviolet lamp tube 211 is disposed between each two protrusions.

[0066] Specifically, the design of the wave-shaped reflector 212 allows the ultraviolet light from the second ultraviolet lamp tube 211 to be utilized more effectively. The protrusion can be any of the following shapes: conical, pyramidal, frustum, pointed, or rounded. The specific shape of the protrusion depends on the actual needs. In addition, the surface of the protrusion on the wave-shaped reflector is a smooth mirror.

[0067] It should be noted that the UV lamp assembly may include two sets of lamp boxes 213. The second UV lamp 211 may be a straight UV lamp. The second UV lamp 211 is located on the side of the lamp box 213 near the second sample stage 22. The wavy reflector 212 is located on the side of the lamp box 213 corresponding to the second UV lamp 211 away from the second sample stage 22. In addition, a blower may also be provided inside the lamp box 213 to effectively cool the second UV lamp 211.

[0068] In one embodiment, based on the above embodiments, refer to the appendix to the specification. Figure 1 and Figure 3 As shown, two second horizontal tracks are provided on both sides of the second sample stage 22, and two sets of ultraviolet lamp tubes are respectively movably arranged on the two second horizontal tracks, so that the ultraviolet lamp tubes can slide on the second horizontal tracks, thereby adjusting the distance between the second sample stage 22 and the second ultraviolet lamp tube 211.

[0069] Specifically, the bottom of the UV lamp assembly is provided with guide wheels corresponding to the second horizontal track, so that the UV lamp assembly can slide along the second horizontal track toward or away from the second sample stage 22, thereby adjusting the distance between the second sample stage 22 and the second UV lamp 211 to adjust the UV light intensity irradiated on the substrate by the second UV lamp 211.

[0070] In one embodiment, refer to the appendix to the specification. Figure 1 and Figure 3 As shown, an ultraviolet lamp compensation device 222 is provided on the second sample stage 22. The ultraviolet lamp compensation device 222 is used to compensate for the ultraviolet light irradiation of the ultraviolet lamp compensation device 222. The ultraviolet lamp compensation device 222 emits ultraviolet light toward the substrate to be irradiated.

[0071] Specifically, the ultraviolet lamp compensation device 222 can consist of a transparent glass and several ultraviolet lamps. The ultraviolet lamps emit ultraviolet light toward the substrate to be irradiated in order to compensate for the area on the substrate to be irradiated that cannot be uniformly and effectively covered by the second ultraviolet lamp tubes 211 near the bottom and on both sides.

[0072] In one embodiment, refer to the appendix to the specification. Figure 3 and Figure 4 As shown, the sample stage in the third placement cavity 30 is the third sample stage 34. The substrate to be irradiated is placed at the center of the third sample stage 34. The third sample stage 34 is located at the bottom of the third placement cavity 30. The 360° irradiation lamp array 31 includes three sets of third ultraviolet lamps 311 and three sets of third horizontal tracks 312. The third ultraviolet lamps 311 are movably mounted on the corresponding third horizontal tracks 312. The three sets of third horizontal tracks 312 surround the center of the third sample stage 34 and face the center of the third sample stage 34, so that the distance between the third ultraviolet lamps 311 and the center of the third sample stage 34 can be adjusted, and the third ultraviolet lamps 311 can irradiate and cover all surfaces of the substrate to be irradiated.

[0073] Specifically, when the distance between the two third horizontal tracks 312 is equal, that is, when the included angle between the two third horizontal tracks 312 is 120°, the coverage effect of the third ultraviolet lamp tube 311 on the substrate to be irradiated is optimal. It should be noted that the sample placement port of the third placement cavity 30 is the third sample placement port 33, which is located at the top of the third placement cavity 30 and is positioned directly above the third sample stage 34. In addition, the sample placement port can be provided with a top cover, and a hook structure for hanging is provided on the side of the top cover near the third placement cavity 30 to adjust the height position of the substrate to be irradiated.

[0074] In one embodiment, refer to the appendix to the specification. Figure 3 and Figure 4 As shown, based on the above embodiment, the reflective structure in the third placement cavity 30 is a folded reflector 32. The folded reflector 32 is disposed between two adjacent third horizontal tracks 312. The folded reflector 32 includes two reflective plates. The two reflective plates are connected and not parallel. The side with the larger included angle of the two reflective plates is close to the third sample stage 34.

[0075] Specifically, the folded reflector 32 is arranged parallel to the third ultraviolet lamp 311, and the fold line at the connection of the two reflectors is also parallel to the third ultraviolet lamp 311. The reflective structure can also be an arc-shaped reflector, with the center of the arc-shaped reflector facing away from the third sample stage 34.

[0076] In one embodiment, refer to the appendix to the specification. Figure 1 and Figure 2 As shown, based on the above embodiment, the placement cavity also includes an in-situ reaction chamber 40. A plurality of fourth ultraviolet lamps 41 are arranged on the top of the in-situ reaction chamber 40. A reaction box 42 is arranged directly below the ultraviolet lamp array. A fourth sample stage is arranged inside the reaction box 42. A quartz glass window 421 is arranged on the side of the reaction box 42 near the fourth ultraviolet lamps 41. A heating plate is arranged on the side of the reaction box 42 away from the fourth ultraviolet lamps 41. The in-situ reaction chamber 40 is connected to the atmosphere conditioning device 50.

[0077] Specifically, in-situ reaction refers to detecting the performance changes of the same sample at a fixed location during different irradiation-silanization-irradiation processes. The in-situ reaction chamber 40 is used for immediate silanization surface modification of the substrate after UV irradiation, or for simultaneous UV irradiation. The reaction box 42 is used to hold the silane reagent, allowing for the control of the surface activation process of the substrate by adjusting different UV irradiation intensities and silanization solution temperatures. The top of the reaction box 42 is semi-sealed with quartz glass, which can be freely placed. UV light passes through the highly transparent quartz glass and irradiates the surface of the substrate on the fourth sample stage. The heating plate, which can be a cast aluminum heating plate, is located on the bottom outside of the reaction box 42 to heat the silane reagent inside, thereby accelerating the silanization surface modification reaction of the substrate.

[0078] It should be noted that the in-situ reaction chamber 40 and the reaction box 42 are equipped with silane reagent inlet and outlet. Silane reagent is added to the reaction box 42 through the silane reagent inlet. The ozone concentration inside the reaction box 42 is adjusted by connecting it to the ozone regulating device 50, thereby realizing the silanization surface modification reaction of the substrate to be irradiated under different ozone environments.

[0079] In one embodiment, refer to the appendix to the specification. Figure 2 As shown, based on the above embodiment, the in-situ reaction chamber 40 also includes several height lifting tracks 43. The height lifting tracks 43 are disposed on the side wall of the in-situ reaction chamber 40. The reaction box 42 is slidably connected to the height lifting tracks 43, so that the reaction box 42 can slide along the height lifting tracks 43 to adjust the distance between the reaction box 42 and the fourth ultraviolet lamp 41.

[0080] Specifically, the in-situ reaction box 42 is movably fixed on the height lifting track 43. The distance between the fourth sample stage and the fourth ultraviolet lamp 41 is adjusted by the height lifting track 43 to effectively adjust the intensity of ultraviolet irradiation, thereby controlling the surface activation process of the substrate to be irradiated.

[0081] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A device for surface modification by ultraviolet irradiation, characterized in that, include: The box has several independent placement cavities inside. Each placement cavity is equipped with a sample stage and an irradiation lamp array. The sample stage is used to hold the substrate to be irradiated. The irradiation lamp array emits ultraviolet light towards the sample stage and corresponds to different irradiation ranges of the substrate to be irradiated. The number of placement cavities is three, namely the first placement cavity, the second placement cavity and the third placement cavity. The irradiation lamp array in the first placement cavity is a top irradiation lamp array, the irradiation lamp array in the second placement cavity is a double-sided irradiation lamp array, and the irradiation lamp array in the third placement cavity is a 360° irradiation lamp array. The placement chamber is also equipped with an atmosphere conditioning device and a heat exchanger. Each placement chamber is independently connected to the atmosphere conditioning device to independently control the ozone concentration in the corresponding placement chamber. The heat exchanger is located on the side wall of each placement chamber to counteract the heat generated by the irradiation lamp array and maintain the temperature stability in the corresponding placement chamber, so that the irradiation environment atmosphere in the placement chamber can be independently adjusted according to the substrate to be irradiated. It also includes several reflective structures, each disposed in the corresponding placement cavity, for reflecting a portion of the ultraviolet light emitted by the irradiation lamp array to the sample stage.

2. The ultraviolet irradiation surface modification apparatus according to claim 1, characterized in that, The top irradiation lamp array includes a plurality of first ultraviolet lamps, which are arranged in parallel at the top of the first placement cavity; The sample stage in the first placement cavity is a first sample stage, which is located directly below the first ultraviolet lamp, so that the first ultraviolet lamp can irradiate and cover the side of the substrate to be irradiated that is close to the first ultraviolet lamp. The reflective structure in the first placement cavity is a planar reflector, which is disposed on the side of the first ultraviolet lamp away from the first sample stage.

3. The ultraviolet irradiation surface modification device according to claim 2, characterized in that, The first placement cavity is also provided with a first lifting assembly. The first lifting assembly is fixedly disposed on the side wall of the first placement cavity in a direction parallel to the side wall of the first placement cavity. The first sample stage is movably mounted on the first lifting assembly, so that the distance between the first sample stage and the first ultraviolet lamp tube can be adjusted.

4. The ultraviolet irradiation surface modification apparatus according to any one of claims 1-3, characterized in that, The sample stage in the second placement cavity is a second sample stage, which is disposed at the bottom of the second placement cavity; The dual-sided irradiation lamp array includes two sets of ultraviolet lamp tubes, which are symmetrically arranged on both sides of the second sample stage. Each ultraviolet lamp tube set includes several parallel and spaced second ultraviolet lamp tubes, so that the second ultraviolet lamp tubes can irradiate and cover the two sides of the substrate to be irradiated corresponding to the second ultraviolet lamp tubes.

5. The ultraviolet irradiation surface modification apparatus according to claim 4, characterized in that, The reflective structure in the second placement cavity is a wave-shaped reflector. The wave-shaped reflector is located on the side of the second ultraviolet lamp away from the second sample stage. The wave-shaped reflector includes several orderly arranged protrusions, and the second ultraviolet lamp is disposed between each of the two protrusions.

6. The ultraviolet irradiation surface modification apparatus according to claim 5, characterized in that, Two second horizontal tracks are provided on both sides of the second sample stage. The two sets of ultraviolet lamp tubes are respectively movably arranged on the two second horizontal tracks, so that the ultraviolet lamp tubes can slide on the second horizontal tracks, thereby adjusting the distance between the second sample stage and the second ultraviolet lamp tubes.

7. The ultraviolet irradiation surface modification apparatus according to claim 6, characterized in that, The second sample stage is equipped with an ultraviolet lamp compensation device, which is used to compensate for the ultraviolet light irradiation of the ultraviolet lamp and emits ultraviolet light toward the substrate to be irradiated.

8. The ultraviolet irradiation surface modification apparatus according to any one of claims 1-3 and 5-7, characterized in that, The sample stage in the third placement cavity is a third sample stage, which is located at the bottom of the third placement cavity. The 360° irradiation lamp array includes three sets of third ultraviolet lamps and three sets of third horizontal tracks. The third ultraviolet lamps are respectively movably arranged on the corresponding third horizontal tracks. The three sets of third horizontal tracks surround the center of the third sample stage and face the center of the third sample stage, so that the distance between the third ultraviolet lamp and the center of the third sample stage is adjustable, and the third ultraviolet lamp can irradiate and cover all surfaces of the substrate to be irradiated.

9. The ultraviolet irradiation surface modification apparatus according to claim 8, characterized in that, The reflective structure in the third placement cavity is a folded reflector, which is disposed between two adjacent third horizontal tracks; The folded reflector includes two reflective plates connected but not parallel, with the side of the larger included angle between the two reflective plates closer to the third sample stage.

10. The ultraviolet irradiation surface modification apparatus according to any one of claims 1-3, 5-7, and 9, characterized in that, The placement chamber also includes an in-situ reaction chamber. Several fourth ultraviolet lamps are arranged on the top of the in-situ reaction chamber. A reaction box is arranged directly below the ultraviolet lamp array. A fourth sample stage is arranged inside the reaction box. A quartz glass window is arranged on the side of the reaction box near the fourth ultraviolet lamps. A heating plate is arranged on the side of the reaction box away from the fourth ultraviolet lamps. The in-situ reaction chamber is connected to the atmosphere conditioning device.

11. The ultraviolet irradiation surface modification apparatus according to claim 10, characterized in that, The in-situ reaction chamber also includes several height-lifting tracks, which are disposed on the side wall of the in-situ reaction chamber. The reaction box is slidably connected to the height-lifting tracks, so that the reaction box can slide along the height-lifting tracks to adjust the distance between the reaction box and the fourth ultraviolet lamp.

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