Heat transfer device based on electric field regulation, heat transfer method and electronic device

Abstract

The application provides a heat transfer device based on electric field regulation, a heat transfer method and an electronic device, and relates to the technical field of heat exchange equipment. The heat transfer device based on electric field regulation comprises a lower pole plate, an upper pole plate, a temperature supply module and a high-voltage electric control module. The upper surface of the lower pole plate is provided with liquid heat-conducting glue. The upper pole plate is parallel to the lower pole plate. The temperature supply module is connected to the upper pole plate or the lower pole plate. The high-voltage electric control module is electrically connected to the upper pole plate and the lower pole plate respectively. The high-voltage electric control module is used for applying a controllable high-voltage electric field between the upper pole plate and the lower pole plate, so as to make the liquid heat-conducting glue form a heat-conducting liquid column connecting the upper pole plate and the lower pole plate under the driving of electrostatic force. The liquid heat-conducting glue transfers heat. The heat transfer coefficient is high, the heat transfer efficiency is guaranteed, the energy consumption is reduced, and the overall structure of the heat transfer device based on electric field regulation is simple. The controllable high-voltage electric field can realize accurate regulation of the heat transfer speed and efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat exchange equipment, in particular to a heat transfer device based on electric field regulation, a heat transfer method and electronic equipment. BACKGROUND

[0002] At present, there are many kinds of heat transfer technologies, which can be generally divided into 1, heat pipe technology heat transfer; 2, multiphase flow heat transfer; 3, multi-medium heat transfer; 4, heat convection technology heat transfer, etc.

[0003] At present, most heat conduction technologies use traditional metal heat transfer methods, but the heat transfer metal has large thermal resistance and low total heat transfer coefficient, resulting in low heat transfer efficiency. Moreover, most heat transfer regulation is mechanical processing type regulation, which not only has poor temperature control function and poor regulation precision, but also has complex equipment and large power consumption. SUMMARY

[0004] The purpose of the present application is to provide a heat transfer device based on electric field regulation, a heat transfer method and electronic equipment to solve the problems existing in the prior art.

[0005] To achieve the above purpose, in a first aspect, the present application provides a heat transfer device based on electric field regulation, comprising:

[0006] a lower pole plate, the upper surface of the lower pole plate being provided with liquid heat-conducting glue;

[0007] an upper pole plate arranged above the lower pole plate and parallel to the lower pole plate;

[0008] a temperature supply module for generating a heat source or a cold source, the temperature supply module being connected to the upper pole plate for heat exchange with the upper pole plate, or the temperature supply module being connected to the lower pole plate for heat exchange with the lower pole plate; and

[0009] a high-voltage control module electrically connected to the upper pole plate and the lower pole plate respectively, the high-voltage control module being used to apply a controllable high-voltage electric field between the upper pole plate and the lower pole plate, so as to make the liquid heat-conducting glue form a heat-conducting liquid column connecting the upper pole plate and the lower pole plate under the driving of electrostatic force.

[0010] As a further improvement of the above technical solution:

[0011] In combination with the first aspect, in a possible implementation, the upper pole plate comprises a substrate and an ITO conductive layer, the ITO conductive layer being arranged on the lower surface of the substrate facing the lower pole plate, and the ITO conductive layer being electrically connected to the anode of the high-voltage control module.

[0012] In combination with the first aspect, in a possible implementation, the lower electrode plate comprises a substrate and an ITO conductive layer, the ITO conductive layer is arranged on the upper surface of the substrate facing the upper electrode plate, the ITO conductive layer is electrically connected with the positive electrode of the high-voltage electric control module, and the liquid heat-conductive adhesive is arranged on the upper surface of the ITO conductive layer.

[0013] In combination with the first aspect, in a possible implementation, the ITO conductive layer forms a plurality of ITO conductive regions on the substrate, and the high-voltage electric control module can control the power-on or power-off of each ITO conductive region respectively.

[0014] In combination with the first aspect, in a possible implementation, the substrate is a glass product, a ceramic product or a heat-conductive metal product.

[0015] In combination with the first aspect, in a possible implementation, the spacing width between the upper electrode plate and the lower electrode plate is 5 mm to 15 mm.

[0016] In combination with the first aspect, in a possible implementation, the liquid heat-conductive adhesive forms a heat-conductive adhesive layer on the upper surface of the lower electrode plate or forms heat-conductive adhesive drops on the upper surface of the lower electrode plate.

[0017] To achieve the above object, the second aspect of the present application further provides a heat transfer method, which applies the heat transfer device based on electric field regulation provided in the first aspect, and the heat transfer method comprises the following steps:

[0018] starting the temperature supply module to work;

[0019] applying an adjustable high-voltage electric field to the upper electrode plate and the lower electrode plate by the high-voltage electric control module, so that the liquid heat-conductive adhesive forms a heat-conductive liquid column connecting the upper electrode plate and the lower electrode plate under the driving of electrostatic force;

[0020] stopping the high-voltage electric control module from applying a high-voltage electric field to the upper electrode plate and the lower electrode plate when the temperature of the upper electrode plate or the lower electrode plate reaches a preset range value.

[0021] To achieve the above object, the third aspect of the present application further provides an electronic device, which comprises a PCB circuit board and the heat transfer device based on electric field regulation provided in the first aspect.

[0022] The temperature supply module is connected with the upper electrode plate, the PCB circuit board is arranged on the lower electrode plate, and the PCB circuit board can exchange heat with the lower electrode plate; or

[0023] The temperature supply module is connected to the lower plate, the PCB circuit board is arranged on the upper plate, and the PCB circuit board can exchange heat with the upper plate.

[0024] To achieve the above purpose, in a fourth aspect, the application further provides an electronic device comprising a heat dissipation device and the heat transfer device based on electric field regulation provided in the first aspect.

[0025] The temperature supply module is connected to the upper plate, the temperature supply module is a PCB circuit board, and the temperature supply module is used to generate a heat source.

[0026] The temperature supply module is connected to the lower plate, the temperature supply module is a PCB circuit board, and the temperature supply module is used to generate a heat source.

[0027] Compared with the prior art, the application has the following beneficial effects:

[0028] The application provides a heat transfer device based on electric field regulation, a heat transfer method and an electronic device. The heat transfer device based on electric field regulation is arranged in parallel with the upper plate and the lower plate, a controllable high-voltage electric field is applied between the upper plate and the lower plate by a high-voltage electric control module, liquid heat-conducting glue arranged on the surface of the lower plate forms a heat-conducting liquid column connecting the upper plate and the lower plate under the driving of electrostatic force, so that heat is transferred between the upper plate and the lower plate through the heat-conducting liquid column, and the size of the high-voltage electric field applied between the upper plate and the lower plate can be regulated by the high-voltage electric control module according to actual needs, so as to change the cross-sectional width of the formed heat-conducting liquid column, so that the heat transfer area between the upper plate and the lower plate is changed, so as to realize accurate regulation of the speed and efficiency of heat transfer between the upper plate and the lower plate. When heat transfer between the upper plate and the lower plate is not needed, the high-voltage electric field applied between the upper plate and the lower plate is stopped by the high-voltage electric control module. Therefore, the heat transfer device based on electric field regulation provided in the application transfers heat through liquid heat-conducting glue, has a high heat transfer coefficient, has guaranteed heat transfer efficiency, and reduces energy consumption. Moreover, the heat transfer device based on electric field regulation has a simple overall structure, and the speed and efficiency of heat transfer can be accurately regulated through a controllable high-voltage electric field. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings are included to provide a further understanding of the present application, and are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and serve to explain the principles of the present application. It should be understood that these drawings are only illustrative of certain embodiments of the present application and therefore should not be used to limit the scope of the present application. Other embodiments of the present application will be readily apparent to those of ordinary skill in the art from this disclosure, namely, the specification and drawings. In the drawings:

[0030] Figure 1 Fig. 1 shows a perspective view of a first heat transfer device based on electric field regulation provided by an embodiment of the present application;

[0031] Figure 2 Fig. 2 shows a simplified structural schematic diagram of the heat transfer device based on electric field regulation shown in Fig. 1; Figure 1

[0032] Figure 3 Fig. 3 shows a structural schematic diagram of a second heat transfer device based on electric field regulation provided by an embodiment of the present application;

[0033] Figure 4 Fig. 4 shows a structural schematic diagram of a third heat transfer device based on electric field regulation provided by an embodiment of the present application;

[0034] Figure 5 Fig. 5 shows a structural schematic diagram of a fourth heat transfer device based on electric field regulation provided by an embodiment of the present application;

[0035] Figure 6 Fig. 6 shows a perspective view of a first heat transfer device based on electric field regulation provided by an embodiment of the present application;

[0036] Figure 7 Fig. 7 shows a simplified structural schematic diagram of the heat transfer device based on electric field regulation shown in Fig. 6; Figure 6

[0037] Fig. 8 shows a change diagram of the heat transfer liquid column in the heat transfer device based on electric field regulation shown in Fig. 6 during the transition from state (a) to state (d) when the adjacent two first ITO conductive areas are switched between power-on and power-off; Figure 8 Figure 6 Fig. 9 shows the state change images of the heat transfer liquid column during the transition when the adjacent two first ITO conductive areas are switched between power-on and power-off, which are captured by a high-speed camera, wherein OFF indicates that the area is in a power-off state, and ON indicates that the area is in a power-on state;

[0038] Figure 9 Figure 6 Fig. 10 shows the state change images of the heat transfer liquid column during the transition when the adjacent two first ITO conductive areas are switched between power-on and power-off, which are captured by a high-speed camera, wherein OFF indicates that the area is in a power-off state, and ON indicates that the area is in a power-on state;

[0039] Figure 10 Fig. 11 shows a change diagram of the heat transfer liquid column in the heat transfer device based on electric field regulation shown in Fig. 6 during the transition from state (a) to state (d) when the adjacent two first ITO conductive areas are switched between power-on and power-off; Figure 6 ​​​The formation process images of the heat-conducting liquid column are shown in the high-speed camera when one of the first ITO conductive regions in the electric field-based heat transfer device is powered alone (a) (b), two first ITO conductive regions are powered simultaneously (c), and three first ITO conductive regions are powered simultaneously (d), wherein OFF indicates that the region is in a power-off state, and ON indicates that the region is in a power-on state;

[0040] Figure 11 The structural schematic diagram of the second electric field-based heat transfer device provided in Embodiment Two of the present application is shown;

[0041] Figure 12 The structural schematic diagram of the third electric field-based heat transfer device provided in Embodiment Two of the present application is shown;

[0042] Figure 13 The three-dimensional structural schematic diagram of the first electric field-based heat transfer device provided in Embodiment Three of the present application is shown;

[0043] Figure 14 The structural schematic diagram of the second electric field-based heat transfer device provided in Embodiment Three of the present application is shown; Figure 13 The simplified structural schematic diagram of the electric field-based heat transfer device is shown;

[0044] Figure 15 The structural schematic diagram of the second electric field-based heat transfer device provided in Embodiment Three of the present application is shown;

[0045] Figure 16 The structural schematic diagram of the third electric field-based heat transfer device provided in Embodiment Three of the present application is shown;

[0046] Figure 17 The structural schematic diagram of the first electric field-based heat transfer device provided in Embodiment Four of the present application is shown;

[0047] Figure 18 The structural schematic diagram of the second electric field-based heat transfer device provided in Embodiment Four of the present application is shown;

[0048] Figure 19 The structural schematic diagram of the third electric field-based heat transfer device provided in Embodiment Four of the present application is shown;

[0049] Figure 20 The structural schematic diagram of the first electronic device provided in Embodiment Five of the present application is shown;

[0050] Figure 21 The structural schematic diagram of the second electronic device provided in Embodiment Five of the present application is shown;

[0051] Figure 22 The structural schematic diagram of the third electronic device provided in Embodiment Five of the present application is shown;

[0052] Figure 23 Fig. 1 shows a structural schematic diagram of a first electronic device provided by the embodiment six of the present application;

[0053] Figure 24 Fig. 2 shows a structural schematic diagram of a second electronic device provided by the embodiment six of the present application;

[0054] Figure 25 Fig. 3 shows a structural schematic diagram of a third electronic device provided by the embodiment six of the present application;

[0055] Figure 26 Fig. 4 shows a structural schematic diagram of a first electronic device provided by the embodiment seven of the present application;

[0056] Figure 27 Fig. 5 shows a structural schematic diagram of a second electronic device provided by the embodiment seven of the present application;

[0057] Figure 28 Fig. 6 shows a structural schematic diagram of a third electronic device provided by the embodiment seven of the present application;

[0058] Figure 29 Fig. 7 shows a state diagram of the temperature rising from 62.1℃ to 100.7℃ in 100 seconds of the heat transfer in (a) to (f) when the temperature supply module supplies the temperature of 135℃;

[0059] Figure 30 Fig. 8 shows a state diagram of the temperature rising from 44℃ to 89℃ in 100 seconds of the heat transfer in the left heat-conducting liquid column and rising from 44.2℃ to 98.5℃ in 100 seconds of the heat transfer in the right heat-conducting liquid column in (a) to (f) when the temperature supply module supplies the temperature of 135℃.

[0060] Explanation of reference signs:

[0061] 100, upper pole plate; 110, first substrate; 120, first ITO conductive layer; 121, first ITO conductive area; 200, lower pole plate; 210, second substrate; 220, second ITO conductive layer; 221, second ITO conductive area; 300, temperature supply module; 310, heater; 320, refrigerator; 400, high-voltage electric control module; 500, liquid heat-conducting adhesive; 600, support; 700, PCB circuit board; 800, heat dissipation device; 900, heat-conducting insulating plate. DETAILED DESCRIPTION

[0062] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present application, and are not intended to limit the present application.

[0063] In the embodiments of the present application, it is to be understood that the terms "upper", "lower", "horizontal", etc. indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0064] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0065] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0066] The present application will be described in detail below with reference to the accompanying drawings and in conjunction with exemplary embodiments.

[0067] Embodiment one

[0068] Please refer to Figure 1 , Figure 2 , Figure 3 , the drawings and Figure 5 , the present embodiment provides a heat transfer device based on electric field regulation, which realizes accurate regulation of heat transfer through controllable high-voltage electric field.

[0069] In the present embodiment, the heat transfer device based on electric field regulation comprises a lower plate 200, an upper plate 100, a temperature supply module 300 and a high-voltage control module 400.

[0070] Among them, the upper plate 100 and the lower plate 200 are arranged along the vertical direction, the lower plate 200 is located below the upper plate 100, the upper plate 100 and the lower plate 200 are arranged in parallel with each other, and the upper surface of the lower plate 200 is provided with liquid heat-conducting adhesive 500.

[0071] Furthermore, in this embodiment, the lower electrode plate 200 is arranged horizontally to prevent the liquid thermally conductive adhesive 500 from flowing on the upper surface of the lower electrode plate 200. The upper electrode plate 100 can be supported by the bracket 600 to keep the upper electrode plate 100 above the lower electrode plate 200.

[0072] In some embodiments, in order to prevent the liquid thermally conductive adhesive 500 from rolling off the periphery of the lower electrode plate 200, an insulating baffle can be provided on the outer periphery of the lower electrode plate 200 in practical use.

[0073] Please refer to the figure. Figure 1 , Figure 2 and Figure 4 A temperature supply module 300 is used to generate a heat source or a cold source. In some embodiments, the temperature supply module 300 is connected to a lower electrode plate 200 for heat exchange. That is, the heat source or cold source generated by the temperature supply module 300 can be directly transferred to the upper electrode plate 100. Furthermore, the lower electrode plate 200 is disposed on the temperature supply module 300.

[0074] Optionally, a thermally conductive insulating plate 900 is provided between the temperature supply module 300 and the lower electrode plate 200. Specifically, the thermally conductive insulating plate 900 is a thermally conductive silicone plate, but other thermally conductive insulating materials can also be selected.

[0075] Please see Figure 1 , Figure 3 and Figure 5 In other embodiments, the temperature supply module 300 is connected to the upper electrode plate 100 for heat exchange. That is, the heat or cold source generated by the temperature supply module 300 can be directly transferred to the upper electrode plate 100. Furthermore, the temperature supply module 300 is disposed on the upper surface of the upper electrode plate 100 facing away from the lower electrode plate 200.

[0076] Optionally, a thermally conductive insulating plate 900 is provided between the temperature supply module 300 and the upper electrode plate 100. Specifically, the thermally conductive insulating plate 900 is a thermally conductive silicone plate, but other thermally conductive insulating materials can also be selected.

[0077] The high-voltage control module 400 is electrically connected to the upper electrode plate 100 and the lower electrode plate 200 respectively. The high-voltage control module 400 is used to apply a controllable high-voltage electric field between the upper electrode plate 100 and the lower electrode plate 200, so that the liquid thermally conductive adhesive 500 forms a thermally conductive liquid column connecting the upper electrode plate 100 and the lower electrode plate 200 under the drive of electrostatic force.

[0078] The high-voltage electrical control module 400 includes a controller and a high-voltage power supply. The controller is configured to control the on / off state of the high-voltage power supply. The high-voltage power supply is electrically connected to the upper electrode plate 100 and the lower electrode plate 200, respectively.

[0079] Optionally, the distance between the upper electrode plate 100 and the lower electrode plate 200 is 5mm-15mm. It should be noted that the distance between the upper electrode plate 100 and the lower electrode plate 200 can be adjusted according to actual conditions, for example, the distance between the upper electrode plate 100 and the lower electrode plate 200 can be selected as 5.2mm, 5.8mm, 6mm, 5.2mm, 6.5mm, 7.1mm, 8mm, 8.6mm, 9mm, 9.4mm, 10mm, 10.2mm, 10.5mm, 11.1mm, 11.6mm, 12mm, 12.5mm, 13mm, 13.2mm, 13.5mm, 14mm, 14.5mm or 14.8mm. It should be understood that the above is only an example and is not a limitation of the scope of protection of the present application.

[0080] Optionally, the voltage provided by the high-voltage power supply is in the range of 3KV-15KV. In actual use, the size of the voltage provided by the high-voltage power supply is determined according to the distance between the upper electrode plate 100 and the lower electrode plate 200 to ensure that the heat-conducting liquid column can be better formed between the upper electrode plate 100 and the lower electrode plate 200.

[0081] Please refer to Figure 1 and Figure 2 Specifically, in the present embodiment, the upper electrode plate 100 includes a substrate and an ITO conductive layer. In order to distinguish the description, the substrate of the upper electrode plate 100 is defined as the first substrate 110 and the ITO conductive layer is defined as the first ITO conductive layer 120 in the present embodiment. The first ITO conductive layer 120 is arranged on the lower surface of the first substrate 110 facing the lower electrode plate 200. The first ITO conductive layer 120 is electrically connected to the positive electrode of the high-voltage power supply in the high-voltage electric control module 400, and the lower electrode plate 200 is electrically connected to the negative electrode of the high-voltage power supply.

[0082] Therefore, when a high-voltage electric field is applied between the upper electrode plate 100 and the lower electrode plate 200 by the high-voltage power supply, the surface of the liquid heat-conducting adhesive 500 on the lower electrode plate 200 will be attached with negative charges. Under the driving of electrostatic force, the negative charges will move upward to the upper electrode, thereby driving the liquid heat-conducting adhesive 500 to rise and connect with the upper electrode and keep stable, so as to form a heat-conducting liquid column between the upper electrode and the lower electrode. The upper electrode plate 100 and the lower electrode plate 200 are connected by the heat-conducting liquid column, thereby realizing heat exchange between the upper electrode plate 100 and the lower electrode plate 200.

[0083] Optionally, the first substrate 110 is a glass product, a ceramic product or a heat-conducting metal product, wherein the heat-conducting metal product includes a copper product, an aluminum product or an iron product. In the present embodiment, the lower electrode plate 200 is a copper product.

[0084] Please refer to Figure 1 , Figure 2 and Figure 3In some embodiments, the liquid heat-conductive glue 500 forms a heat-conductive glue drop on the upper surface of the lower electrode plate 200.

[0085] Referring to Figure 4 and Figure 5 In other embodiments, the liquid heat-conductive glue 500 forms a heat-conductive glue layer on the upper surface of the lower electrode plate 200, that is, the upper surface of the lower electrode plate 200 is covered with a heat-conductive glue layer.

[0086] Referring to Figures 1 to 5 The embodiment also provides a heat transfer method, which applies the heat transfer device based on electric field regulation provided above. The heat transfer method comprises the following steps:

[0087] S10: Start the temperature supply module 300.

[0088] S20: Apply a regulatable high-voltage electric field to the upper electrode plate 100 and the lower electrode plate 200 by the high-voltage electric control module 400, so that the liquid heat-conductive glue 500 forms a heat-conductive liquid column connecting the upper electrode plate 100 and the lower electrode plate 200 under the driving of the electrostatic force.

[0089] S30: When the temperature of the upper electrode plate 100 or the lower electrode plate 200 reaches a preset range value, stop applying the high-voltage electric field to the upper electrode plate 100 and the lower electrode plate 200 by the high-voltage electric control module 400.

[0090] Compared with the prior art, the heat transfer device based on electric field regulation provided by the embodiment arranges the upper electrode plate 100 and the lower electrode plate 200 in parallel, applies a controllable high-voltage electric field between the upper electrode plate 100 and the lower electrode plate 200 by the high-voltage electric control module 400, and the liquid heat-conductive glue 500 arranged on the surface of the lower electrode plate 200 forms a heat-conductive liquid column connecting the upper electrode plate 100 and the lower electrode plate 200 under the driving of the electrostatic force, so that the heat between the lower electrode plate 200 and the upper electrode plate 100 is transferred through the heat-conductive liquid column, and the size of the high-voltage electric field applied between the upper electrode plate 100 and the lower electrode plate 200 by the high-voltage electric control module 400 can be regulated according to actual needs (specifically by regulating the voltage value provided by the high-voltage power supply), so as to change the cross-sectional width of the formed heat-conductive liquid column, so that the heat transfer area between the upper electrode plate 100 and the lower electrode plate 200 is changed, so as to realize the precise regulation of the speed and efficiency of the heat transfer between the upper electrode plate 100 and the lower electrode plate 200; when the heat transfer between the upper electrode plate 100 and the lower electrode plate 200 is not needed, the high-voltage electric field applied between the upper electrode plate 100 and the lower electrode plate 200 by the high-voltage electric control module 400 is stopped. Therefore, the heat transfer device based on electric field regulation provided by the embodiment transfers heat through the liquid heat-conductive glue 500, has a high heat transfer coefficient, and has a guaranteed heat transfer efficiency, thereby reducing energy consumption. Moreover, the heat transfer device based on electric field regulation has a simple overall structure, and the controllable high-voltage electric field can realize the precise regulation of the speed and efficiency of the heat transfer.

[0091] Embodiment Two

[0092] Please refer to Figures 6 to 12 , the embodiment provides a heat transfer device based on electric field regulation. The embodiment is improved on the basis of the above-mentioned embodiment one, and compared with the above-mentioned embodiment one, the difference lies in that:

[0093] Please refer to Figure 6 , Figure 7 , Figure 11 and Figure 12 , the first ITO conductive layer 120 forms a plurality of first ITO conductive regions 121 on the first substrate 110, and each ITO conductive region is connected with the positive electrode of the high-voltage power supply. The controller in the high-voltage control module 400 can control the power-on or power-off of each ITO conductive region respectively. Alternatively, the plurality of first ITO conductive regions 121 are formed by a plurality of ITO conductive films arranged on the lower surface of the first substrate 110.

[0094] Please refer to Figure 9 and Figure 10 , in the case that the upper surface of the lower plate 200 is covered with a layer of heat-conducting adhesive layer, when one first ITO conductive region 121 is controlled to be powered on, a high-voltage electric field is formed between the first ITO conductive region 121 and the lower plate 200, so that the liquid heat-conducting adhesive 500 forms a heat-conducting liquid column connecting the lower plate 200 and the first ITO conductive region 121, thereby realizing the heat transfer between the first ITO conductive region 121 and the lower plate 200. Similarly, if two or three first ITO conductive regions 121 are controlled to be powered on at the same time, a corresponding number of heat-conducting liquid columns are formed between the upper plate 100 and the lower plate 200 at the same time, respectively realizing the heat transfer between the corresponding first ITO conductive regions 121 and the lower plate 200.

[0095] Please refer to Figure 8 and Figure 9 , in the case that the upper surface of the lower plate 200 is provided with a heat-conducting adhesive drop, when the corresponding first ITO conductive region 121 above the heat-conducting adhesive drop is controlled to be powered on, a high-voltage electric field is formed between the first ITO conductive region 121 and the lower plate 200, so that a heat-conducting liquid column is formed to connect the lower plate 200 and the first ITO conductive region 121, for realizing the heat transfer between the first ITO conductive region 121 and the lower plate 200. Further, by switching to the power-on of the first ITO conductive region 121 of the adjacent region, the heat-conducting adhesive drop moves to the first ITO conductive region 121 of the adjacent region directly below along the upper surface of the lower plate 200, and a new heat-conducting liquid column is reformed in the first ITO conductive region 121, for realizing the heat transfer between the powered first ITO conductive region 121 and the lower plate 200.

[0096] Optionally, the shape of the first ITO conductive region 121 can be circular, polygonal or other regular shape. The cross-sectional shape of the corresponding formed heat-conducting liquid column is consistent with the shape of the first ITO conductive region 121.

[0097] Compared with the prior art, the heat transfer device based on electric field regulation provided by the embodiment can accurately realize heat transfer of the specified region by controlling the power supply of different first ITO conductive regions 121, so as to realize reasonable energy distribution, more accurate temperature control and more flexible and environmentally friendly heat transfer control.

[0098] Embodiment Three

[0099] Please refer to Figure 13 , Figure 14 , Figure 15 and Figure 16 , the embodiment provides a heat transfer device based on electric field regulation. The embodiment is improved on the basis of the above-mentioned embodiment one, and compared with the above-mentioned embodiment one, the difference lies in that:

[0100] In the embodiment, the lower electrode plate 200 includes a substrate and an ITO conductive layer. In order to distinguish the description, the substrate of the lower electrode plate 200 is defined as the second substrate 210 and the ITO conductive layer is defined as the second ITO conductive layer 220 in the embodiment. The second ITO conductive layer 220 is arranged on the upper surface of the second substrate 210 facing the upper electrode plate 100, and the second ITO conductive layer 220 is electrically connected with the positive electrode of the high-voltage power supply in the high-voltage electric control module 400, and the upper electrode plate 100 is electrically connected with the negative electrode of the high-voltage power supply.

[0101] Therefore, when the high-voltage electric field between the upper electrode plate 100 and the lower electrode plate 200 is applied by the high-voltage power supply, the surface of the liquid heat-conducting adhesive 500 on the lower electrode plate 200 will be attached with positive charges. Under the driving of electrostatic force, the positive charges will move upward to the upper electrode and drive the liquid heat-conducting adhesive 500 to rise and connect with the upper electrode and keep stable, so as to form a heat-conducting liquid column between the upper electrode and the lower electrode. The upper electrode plate 100 and the lower electrode plate 200 are connected by the heat-conducting liquid column, so as to realize heat exchange between the upper electrode plate 100 and the lower electrode plate 200.

[0102] Optionally, the second substrate 210 is a glass piece, a ceramic piece or a heat-conducting metal piece, wherein the heat-conducting metal piece includes a copper piece, an aluminum piece or an iron piece. In the embodiment, the upper electrode plate 100 is a copper piece.

[0103] In some embodiments, the liquid heat-conducting adhesive 500 forms a heat-conducting adhesive layer on the upper surface of the lower electrode plate 200, that is, the upper surface of the lower electrode plate 200 is covered with a heat-conducting adhesive layer.

[0104] In some embodiments, the liquid heat conductive glue 500 forms a heat conductive glue drop on the upper surface of the lower electrode plate 200.

[0105] Embodiment Four

[0106] Please refer to Figure 17 , Figure 18 and Figure 19 , the present embodiment provides a heat transfer device based on electric field regulation. The present embodiment is an improvement on the basis of the above-mentioned embodiment three. Compared with the above-mentioned embodiment three, the difference lies in that:

[0107] The second ITO conductive layer 220 forms a plurality of second ITO conductive areas 221 on the second substrate 210, and each ITO conductive area is connected with the positive electrode of the high-voltage power supply. The controller in the high-voltage control module 400 can control the power-on or power-off of each ITO conductive area respectively. Alternatively, the plurality of second ITO conductive areas 221 are formed by a plurality of ITO conductive films arranged on the upper surface of the second substrate 210.

[0108] Please refer to Figure 9 and Figure 10 , in the case of covering the upper surface of the lower electrode plate 200 with a layer of heat conductive glue, when one second ITO conductive area 221 is powered on, a high-voltage electric field is formed between the second ITO conductive area 221 and the upper electrode plate 100, so that the liquid heat conductive glue 500 forms a heat conductive liquid column connecting the lower electrode plate 200 and the second ITO conductive area 221, thereby realizing the heat transfer between the second ITO conductive area 221 and the upper electrode plate 100. Similarly, if two or three second ITO conductive areas 221 are powered on at the same time, a corresponding number of heat conductive liquid columns can be formed between the upper electrode plate 100 and the lower electrode plate 200 at the same time, thereby realizing the heat transfer between the corresponding second ITO conductive areas 221 and the upper electrode plate 100 respectively.

[0109] Please refer to Figure 8 and Figure 9 , in the case of setting a heat conductive glue drop on the upper surface of the lower electrode plate 200, when the corresponding second ITO conductive area 221 above the heat conductive glue drop is powered on, a high-voltage electric field is formed between the second ITO conductive area 221 and the upper electrode plate 100, so that a heat conductive liquid column is formed to connect the second ITO conductive area 221 and the upper electrode plate 100, in order to realize the heat transfer between the second ITO conductive area 221 and the upper electrode plate 100. Further, by switching to the power-on of the second ITO conductive area 221 of the adjacent area, the heat conductive glue drop moves to the second ITO conductive area 221 of the adjacent area along the upper surface of the lower electrode plate 200, and a new heat conductive liquid column is reformed on the second ITO conductive area 221, in order to realize the heat transfer between the powered second ITO conductive area 221 and the upper electrode plate 100.

[0110] Optionally, the shape of the second ITO conductive area 221 can be circular, polygonal or other regular shape. The cross-sectional shape of the corresponding formed heat-conducting liquid column is consistent with the shape of the second ITO conductive area 221.

[0111] Compared with the prior art, the heat transfer device based on electric field regulation provided in the embodiment can accurately realize heat transfer of the specified area by controlling the power supply of different second ITO conductive areas 221, so as to realize reasonable distribution of energy, more accurate temperature control, and more flexible and environmentally friendly heat transfer control.

[0112] Please refer to Figure 29 and Figure 30 , wherein, Figure 29 Figures (a) to (f) in the drawings show the change process of the temperature of the single heat-conducting liquid column 100 from 62.1℃ to 100.7℃ within 100 seconds of heat transfer based on the temperature supply module 300 supplying a temperature of 135℃. Figure 30 Figures (a) to (f) in the drawings show the change process of the temperature of the two heat-conducting liquid columns from 44℃ to 89℃ for the left heat-conducting liquid column and from 44.2℃ to 98.5℃ for the right heat-conducting liquid column within 100 seconds of heat transfer based on the temperature supply module 300 supplying a temperature of 135℃.

[0113] Embodiment Five

[0114] Please refer to Figure 1 , Figure 20 , Figure 21 and Figure 22 , the embodiment provides an electronic device. The electronic device comprises a PCB circuit board 700 and a heat transfer device based on electric field regulation provided by any one of the above embodiments.

[0115] The heat transfer device based on electric field regulation in the electronic device provided in the embodiment can be used for heating the PCB circuit board 700, so as to ensure that the PCB circuit board 700 can operate under normal temperature conditions in a low-temperature environment, thereby ensuring the normal operation of the electronic device. The specific scheme is as follows:

[0116] Please refer to Figure 20 In some embodiments, the temperature supply module 300 is a heater 310 for providing a heat source. The temperature supply module 300 is connected to the upper electrode plate 100 through the heat-conducting insulating plate 900, and the PCB circuit board 700 is arranged on the lower electrode plate 200, specifically on the lower surface of the lower electrode plate 200, and the PCB circuit board 700 can exchange heat with the lower electrode plate 200. Optionally, the heat-conducting insulating plate 900 can also be arranged between the PCB circuit board 700 and the lower electrode plate 200.

[0117] Thus, the high-voltage electrically controlled module 400 applies an adjustable high-voltage electric field to the upper plate 100 and the lower plate 200, so that the liquid heat-conducting glue 500 forms a heat-conducting liquid column connecting the upper plate 100 and the lower plate 200 under the driving of the electrostatic force, and the heat source provided by the temperature supply module 300 is sequentially transmitted to the PCB circuit board 700 through the upper plate 100, the heat-conducting liquid column and the lower plate 200, thereby achieving the heating of the PCB circuit board 700.

[0118] Referring to Figure 21 In other embodiments, the temperature supply module 300 is a heater 310 for providing a heat source. The temperature supply module 300 is connected to the lower plate 200 through the heat-conducting insulating plate 900, and the PCB circuit board 700 is arranged on the upper plate 100 through the heat-conducting insulating plate 900, specifically on the upper surface of the upper plate 100, and the PCB circuit board 700 can exchange heat with the upper plate 100. Thus, the high-voltage electrically controlled module 400 applies an adjustable high-voltage electric field to the upper plate 100 and the lower plate 200, so that the liquid heat-conducting glue 500 forms a heat-conducting liquid column connecting the upper plate 100 and the lower plate 200 under the driving of the electrostatic force, and the heat source provided by the temperature supply module 300 is sequentially transmitted to the PCB circuit board 700 through the lower plate 200, the heat-conducting liquid column and the upper plate 100, thereby achieving the heating of the PCB circuit board 700.

[0119] Further, a temperature sensor can be arranged on the PCB circuit board 700 to monitor the temperature of the PCB circuit board 700 in real time. When the temperature of the PCB circuit board 700 exceeds a set value, the temperature sensor feeds back a signal to the high-voltage electrically controlled module 400, and the high-voltage electrically controlled module 400 adjusts the applied high-voltage electric field according to the signal fed back by the temperature sensor to change the area of the cross section of the heat-conducting liquid column and accurately control the heat transfer (the applied high-voltage electric field can be stopped when necessary), thereby ensuring that the temperature of the PCB circuit board 700 is stable during operation.

[0120] Embodiment six

[0121] Referring to Figure 1 , Figure 23 , Figure 24 and Figure 25 The embodiment provides an electronic device. The electronic device includes a PCB circuit board 700 and a heat transfer device based on electric field adjustment provided by any one of the above embodiments.

[0122] The heat transfer device based on electric field adjustment in the electronic device provided by the embodiment can be used for heat dissipation of the PCB circuit board 700, thereby cooling and dissipating heat in time when the temperature of the PCB circuit board 700 is too high, and ensuring the normal operation of the electronic device. The specific scheme is as follows:

[0123] Please see Figure 23 In some embodiments, the temperature supply module 300 is a cooler 320 used to provide a cold source. The temperature supply module 300 is connected to the upper electrode plate 100 via a thermally conductive insulating plate 900. A PCB circuit board 700 is disposed on the lower electrode plate 200, specifically on the lower surface of the lower electrode plate 200. The PCB circuit board 700 can exchange heat with the lower electrode plate 200. A thermally conductive insulating plate 900 is also disposed between the PCB circuit board 700 and the lower electrode plate 200. Thus, the high-voltage electric control module 400 applies an adjustable high-voltage electric field to the upper electrode plate 100 and the lower electrode plate 200, causing the liquid thermal conductive adhesive 500 to form a thermally conductive liquid column connecting the upper electrode plate 100 and the lower electrode plate 200 under the drive of electrostatic force. This allows the cold source provided by the temperature supply module 300 to be transferred to the PCB circuit board 700 in sequence through the upper electrode plate 100, the thermally conductive liquid column, and the lower electrode plate 200. The cold source exchanges heat with the heat source generated by the PCB circuit board 700, thereby achieving heat dissipation of the PCB circuit board 700.

[0124] Please see Figure 24 In some embodiments, the temperature supply module 300 is a cooler 320 used to provide a cold source. The temperature supply module 300 is connected to the lower electrode plate 200 via a thermally conductive insulating plate 900. The PCB circuit board 700 is disposed on the upper electrode plate 100 via the thermally conductive insulating plate 900, specifically on the upper surface of the upper electrode plate 100. The PCB circuit board 700 can exchange heat with the upper electrode plate 100. A controllable high-voltage electric field is applied to the upper electrode plate 100 and the lower electrode plate 200 by a high-voltage electronic control module 400, causing the liquid thermally conductive adhesive 500 to form a thermally conductive liquid column connecting the upper electrode plate 100 and the lower electrode plate 200 under the drive of electrostatic force. This allows the cold source provided by the temperature supply module 300 to be transferred sequentially through the lower electrode plate 200, the thermally conductive liquid column, and the upper electrode plate 100 to the PCB circuit board 700. The cold source exchanges heat with the heat source generated by the PCB circuit board 700, achieving heat dissipation for the PCB circuit board 700.

[0125] Furthermore, a temperature sensor (not shown) can be installed on the PCB circuit board 700 to monitor the temperature of the PCB circuit board 700 in real time. When the temperature of the PCB circuit board 700 exceeds the set value, the temperature sensor sends a signal back to the high-voltage electronic control module 400. The high-voltage electronic control module 400 receives the signal from the temperature sensor and applies an adjustable high-voltage electric field to the upper electrode plate 100 and the lower electrode plate 200 to form a heat-conducting liquid column connecting the upper electrode plate 100 and the lower electrode plate 200 for heat conduction, thereby ensuring that the operating temperature of the PCB circuit board 700 is stable.

[0126] Please see Figure 25In some embodiments, a temperature sensor is arranged corresponding to each heat-generating electronic component of the PCB circuit board 700. When the temperature detected by one or more temperature sensors exceeds the corresponding set value, the high-voltage control module 400 obtains the signal fed back by the temperature sensor to apply an adjustable high-voltage electric field to the specified area of the upper plate 100 and the lower plate 200 to form a heat-conducting liquid column connecting the upper plate 100 and the lower plate 200 for precise heat conduction, so as to ensure that the temperature of the PCB circuit board 700 during operation is in a stable state.

[0127] Embodiment Seven

[0128] Please refer to Figure 1 , Figure 26 , Figure 27 and Figure 28 , the embodiment provides an electronic device. The electronic device comprises a heat dissipation device 800 and a heat transfer device based on electric field regulation provided by any one of the above embodiments.

[0129] Please refer to Figure 26 , wherein the temperature supply module 300 is connected to the upper plate 100 through the heat-conducting insulating plate 900, the temperature supply module 300 is the PCB circuit board 700, and the PCB circuit board 700 generates heat source when working. The heat dissipation device 800 is arranged on the lower plate 200 through the heat-conducting insulating plate 900, and the heat dissipation device 800 is used for heat exchange with the lower plate 200. Therefore, when the heat source generated by the PCB circuit board 700 when working exceeds the preset value (which can be fed back by the temperature sensor), an adjustable high-voltage electric field is applied to the upper plate 100 and the lower plate 200 by the high-voltage control module 400 to form a heat-conducting liquid column connecting the upper plate 100 and the lower plate 200 for heat conduction. At this time, the heat source generated by the PCB circuit board 700 is transmitted to the heat dissipation device 800 through the upper plate 100, the heat-conducting liquid column and the lower plate 200, and then the heat dissipation device 800 carries away the heat, so as to ensure that the temperature of the PCB circuit board 700 during operation is in a stable state.

[0130] Please refer to Figure 27In some embodiments, the temperature supply module 300 is connected to the lower electrode plate 200 through the heat-conducting insulation plate 900, and the temperature supply module 300 is a PCB circuit board 700 that generates heat when working. The heat dissipation device 800 is arranged on the upper electrode plate 100 through the heat-conducting insulation plate 900, and the heat dissipation device 800 is used for heat exchange with the upper electrode plate 100. Thus, when the heat generated by the PCB circuit board 700 when working exceeds a preset value (which can be fed back by a temperature sensor), the high-voltage electric control module 400 applies an adjustable high-voltage electric field to the upper electrode plate 100 and the lower electrode plate 200 to form a heat-conducting liquid column connecting the upper electrode plate 100 and the lower electrode plate 200 for heat conduction. At this time, the heat generated by the PCB circuit board 700 is transmitted to the heat dissipation device 800 through the lower electrode plate 200, the heat-conducting liquid column, and the upper electrode plate 100, and then the heat dissipation device 800 carries away the heat, so that the temperature for ensuring the operation of the PCB circuit board 700 is in a stable state. Optionally, the heat dissipation device 800 can adopt air cooling or liquid cooling.

[0131] Please refer to Figure 28 In other embodiments, a temperature sensor can be arranged corresponding to each heat-generating electronic element of the PCB circuit board 700. When the temperature detected by one or more temperature sensors exceeds the corresponding set value, the high-voltage electric control module 400 obtains the signal fed back by the temperature sensor to apply an adjustable high-voltage electric field to the specified area of the upper electrode plate 100 and the lower electrode plate 200 to form a heat-conducting liquid column connecting the upper electrode plate 100 and the lower electrode plate 200 for precise heat conduction in the specified area, so as to ensure that the temperature for the operation of the PCB circuit board 700 is in a stable state.

[0132] The above describes optional embodiments of the application in detail with reference to the drawings, but the application is not limited to the specific details in the above embodiments. Within the technical concept of the application, the technical solution of the application can be variously modified, and these simple modifications all belong to the protection scope of the application.

Claims

1. A heat transfer device based on electric field control, characterized in that, include: The lower electrode plate (200) has liquid thermally conductive adhesive (500) on its upper surface. The upper electrode plate (100) is arranged above the lower electrode plate (200) and parallel to the lower electrode plate (200); A temperature supply module (300) is used to generate a heat source or a cold source. The temperature supply module (300) is connected to the upper electrode plate (100) for heat exchange with the upper electrode plate (100), or the temperature supply module (300) is connected to the lower electrode plate (200) for heat exchange with the lower electrode plate (200). and A high-voltage electric control module (400) is electrically connected to the upper electrode plate (100) and the lower electrode plate (200) respectively. The high-voltage electric control module (400) is used to apply a controllable high-voltage electric field between the upper electrode plate (100) and the lower electrode plate (200) so that the liquid thermal conductive adhesive (500) forms a thermally conductive liquid column connecting the upper electrode plate (100) and the lower electrode plate (200) under the drive of electrostatic force. When heat transfer between the upper electrode plate (100) and the lower electrode plate (200) is not required, the high-voltage electric field applied between the upper electrode plate (100) and the lower electrode plate (200) is stopped by the high-voltage electric control module (400).

2. The heat transfer device based on electric field control according to claim 1, characterized in that, The upper electrode plate (100) includes a substrate and an ITO conductive layer. The ITO conductive layer is disposed on the lower surface of the substrate facing the lower electrode plate (200). The ITO conductive layer is electrically connected to the positive electrode of the high-voltage electronic control module (400).

3. The heat transfer device based on electric field control according to claim 1, characterized in that, The lower electrode plate (200) includes a substrate and an ITO conductive layer. The ITO conductive layer is disposed on the upper surface of the substrate facing the upper electrode plate (100). The ITO conductive layer is electrically connected to the positive electrode of the high voltage control module (400). The liquid thermally conductive adhesive (500) is disposed on the upper surface of the ITO conductive layer.

4. The heat transfer device based on electric field control according to claim 2 or 3, characterized in that, The ITO conductive layer forms multiple ITO conductive regions on the substrate, and the high-voltage control module (400) can control the power supply or power cut-off of each of the ITO conductive regions respectively.

5. The heat transfer device based on electric field control according to claim 2 or 3, characterized in that, The substrate is made of glass, ceramic or thermally conductive metal.

6. The heat transfer device based on electric field control according to any one of claims 1-3, characterized in that, The distance between the upper electrode plate (100) and the lower electrode plate (200) is 5mm to 15mm.

7. The heat transfer device based on electric field control according to any one of claims 1-3, characterized in that, The liquid thermally conductive adhesive (500) forms a thermally conductive adhesive layer on the upper surface of the lower electrode plate (200), or the liquid thermally conductive adhesive (500) forms thermally conductive adhesive droplets on the upper surface of the lower electrode plate (200).

8. A heat transfer method, characterized in that, The heat transfer method employs a heat transfer device based on electric field control according to any one of claims 1-7, wherein the heat transfer method comprises: Start the temperature supply module (300) to work; The high-voltage electric control module (400) applies an adjustable high-voltage electric field to the upper electrode plate (100) and the lower electrode plate (200) so that the liquid thermally conductive adhesive (500) forms a thermally conductive liquid column connecting the upper electrode plate (100) and the lower electrode plate (200) under the drive of electrostatic force. When the temperature of the upper electrode plate (100) or the lower electrode plate (200) reaches a preset range value, the high voltage electric field applied to the upper electrode plate (100) and the lower electrode plate (200) is stopped by the high voltage electric control module (400).

9. An electronic device, characterized in that, Includes a PCB circuit board (700) and a heat transfer device based on electric field control according to any one of claims 1-7; The temperature supply module (300) is connected to the upper electrode plate (100), and the PCB circuit board (700) is disposed on the lower electrode plate (200). The PCB circuit board (700) can exchange heat with the lower electrode plate (200); or The temperature supply module (300) is connected to the lower electrode plate (200), and the PCB circuit board (700) is disposed on the upper electrode plate (100). The PCB circuit board (700) can exchange heat with the upper electrode plate (100).

10. An electronic device, characterized in that, It includes a heat dissipation device (800) and a heat transfer device based on electric field control according to any one of claims 1-7; The temperature supply module (300) is connected to the upper electrode plate (100), and the temperature supply module (300) is a PCB circuit board (700) used to generate a heat source. The heat dissipation device (800) is disposed on the lower electrode plate (200) and is used to exchange heat with the lower electrode plate (200); or The temperature supply module (300) is connected to the lower electrode plate (200). The temperature supply module (300) is a PCB circuit board (700) used to generate a heat source. The heat dissipation device (800) is disposed on the upper electrode plate (100) and is used to exchange heat with the upper electrode plate (100).

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