Air conditioning system for data center machine room and data center machine room management method

Abstract

The application discloses an air conditioning system for a data center room and a data center room management method, and relates to the refrigeration field.The air conditioning system comprises n air conditioning units, a heat pump host and a heat preservation water storage tank;the refrigeration systems of the n air conditioning units are connected in parallel;the n air conditioning units are used for collecting heat emitted by electronic equipment in the data center room and providing cold energy to the data center;the heat recovery refrigeration pipeline outlet of the n air conditioning units is communicated with the refrigeration side inlet of the heat pump host through an input pipeline;the refrigeration side outlet of the heat pump host is communicated with the refrigeration pipeline inlet of the n air conditioning units through an output pipeline;the cooling water side outlet of the heat pump host is communicated with the heat preservation water storage tank;the heat pump host is used for providing refrigeration liquid to the n air conditioning units and delivering high-temperature cooling water obtained through heat pump heat circulation to the heat preservation water storage tank through the cooling water side outlet; and the refrigeration liquid is used for absorbing heat emitted by the electronic equipment in the data center room.

Description

Technical Field

[0001] This application relates to the field of refrigeration, and in particular to an air conditioning system for data center computer rooms and a data center computer room management method. Background Technology

[0002] With the exponential growth in the amount of data that needs to be processed, data center facilities are developing rapidly.

[0003] Typically, a large number of electronic devices are concentrated in a data center, causing excessive and concentrated heat dissipation, making heat dissipation difficult. Related technologies usually involve installing indirect evaporative cooling units outside the data center. The cooling system within these units provides cooling to the data center, thus lowering its temperature.

[0004] However, this results in a significant amount of heat being wasted. Summary of the Invention

[0005] This application provides an air conditioning system and a data center management method for a data center computer room. The technical solution includes at least the following:

[0006] According to one aspect of this application, an air conditioning system for a data center computer room is provided, the air conditioning system comprising: n air conditioning units, a heat pump host and an insulated water storage tank;

[0007] The refrigeration systems of n air conditioning units are connected in parallel. The n air conditioning units are used to collect the heat emitted by electronic equipment in the data center and to provide cooling to the data center.

[0008] The heat recovery refrigeration pipeline outlets of n air conditioning units are connected to the refrigeration side inlet of the heat pump host via input pipelines. The refrigeration side outlet of the heat pump host is connected to the refrigeration pipeline inlet of n air conditioning units via output pipelines. The cooling water side outlet of the heat pump host is connected to the insulated water storage tank.

[0009] The heat pump unit is used to provide refrigerant to n air conditioning units. The refrigerant is used to absorb the heat emitted by electronic equipment in the data center and to transport the high-temperature cooling water obtained by the heat pump unit through the cooling water side inlet to the insulated water storage tank.

[0010] According to one aspect of this application, a data center management method is provided, the data center management method being applied to the air conditioning system described above, the method comprising:

[0011] The air conditioning unit is controlled to provide cooling to the data center computer room and to collect the heat emitted by the electronic equipment in the data center computer room through the refrigerant liquid. The refrigerant liquid enters the cooling side inlet of the heat pump host through the heat recovery refrigerant pipeline outlet and input pipeline of the i-th air conditioning unit.

[0012] The heat pump unit supplies refrigerant to the air conditioning unit. The refrigerant passes through the heat pump unit's refrigerant side outlet and output pipe in sequence and enters the air conditioning unit's refrigerant pipe inlet.

[0013] The heat pump unit controls the high-temperature cooling water obtained from the heating cycle to be transported to the insulated water storage tank through the cooling water side inlet.

[0014] According to one aspect of this application, a computer device is provided, the computer device comprising: a processor and a memory;

[0015] The memory stores at least one computer program, which is loaded and executed by the processor to implement the data center management method described above.

[0016] According to one aspect of this application, a computer-readable storage medium is provided, in which a computer program is stored, the computer program being executed by a processor to implement the data center management method described above.

[0017] According to one aspect of this application, a chip is provided, the chip including programmable logic circuitry and / or program instructions, which, when the chip is running, are used to implement the data center management method described above.

[0018] According to one aspect of this application, a computer program product is provided, comprising computer instructions stored in a computer-readable storage medium, wherein a processor reads from the computer-readable storage medium and executes the computer instructions to implement the data center management method described above.

[0019] The beneficial effects of the technical solutions provided in this application include at least the following:

[0020] The heat emitted by electronic equipment in the data center is recovered by using n parallel air conditioning units. The heat pump host provides refrigerant to the n air conditioning units so that the air conditioning units can provide cooling for the data center. At the same time, the high-temperature cooling water obtained by the heat pump host heat circulation is transported to the insulated water storage tank to realize the recovery and utilization of the heat emitted by electronic equipment in the data center. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of an air conditioning system provided in an exemplary embodiment of this application;

[0023] Figure 2 This is a partial schematic diagram of an air conditioning system provided in an exemplary embodiment of this application;

[0024] Figure 3 This is a partial schematic diagram of an air conditioning system provided in an exemplary embodiment of this application;

[0025] Figure 4 This is a schematic diagram of an air conditioning unit provided in an exemplary embodiment of this application;

[0026] Figure 5 This is a schematic diagram of another structure of an air conditioning unit provided in an exemplary embodiment of this application;

[0027] Figure 6 This is a schematic diagram of the structure of an air conditioning system provided in an exemplary embodiment of this application;

[0028] Figure 7 This is a schematic diagram of the structure of an air conditioning system provided in an exemplary embodiment of this application;

[0029] Figure 8 This is a schematic diagram of the structure of an air conditioning system provided in an exemplary embodiment of this application;

[0030] Figure 9 This is a schematic diagram of the structure of an air conditioning system provided in an exemplary embodiment of this application;

[0031] Figure 10 This is a schematic diagram of the structure of an air conditioning system provided in an exemplary embodiment of this application;

[0032] Figure 11 This is a flowchart of a data center management method provided in an exemplary embodiment of this application;

[0033] Figure 12 This is a schematic diagram of the structure of a data center management device provided in an exemplary embodiment of this application;

[0034] Figure 13 This is a schematic diagram of the structure of a computer device provided in an exemplary embodiment of this application.

[0035] The following explains the various labels in the attached diagram:

[0036] 100 - Air conditioning system;

[0037] 10-Air conditioning unit;

[0038] 111 - First evaporator; 112 - Second evaporator;

[0039] 121 - First air supply outlet; 122 - First return air outlet;

[0040] 131 - First group of fans; 132 - Second group of fans;

[0041] 141 - Two-way valve; 142 - Three-way valve;

[0042] 151 - Second return air outlet; 152 - Second air outlet; 153 - Air-to-air heat exchanger;

[0043] 16-Ball valve;

[0044] 17-Spray pipe;

[0045] 20-Heat pump unit;

[0046] 21-Compressor;

[0047] 22-Condenser;

[0048] 23 - Throttling valve;

[0049] 24 - Evaporator;

[0050] 30 - Insulated water storage tank;

[0051] 41-Cold aisle of data center computer room; 42-Hot return air aisle of data center computer room;

[0052] 50 - Terminal equipment;

[0053] 51-Water supply pipeline;

[0054] 52 - Heating pipeline;

[0055] 60 - Water pump;

[0056] 01-Input pipeline; 02-Output pipeline; 03-Heat recovery pipeline; 04-Internal circulation pipeline; 05-External circulation pipeline. Detailed Implementation

[0057] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by those skilled in the art.

[0058] In the embodiments of this application, the terms "front" and "rear" are based on the front and rear shown in the accompanying drawings. "First end" and "second end" refer to two opposite ends.

[0059] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0060] In recent years, to improve air quality, various regions have actively promoted the "coal-to-electricity" conversion program, mainly by using air source heat pumps to replace coal-fired heating in order to reduce air pollution. However, when the ambient temperature is below a certain level, air source heat pumps may become unusable or operate at low efficiency, thus hindering the progress of the "coal-to-electricity" program.

[0061] Data center server rooms typically house a large number of electronic devices, which can cause excessive and concentrated heat generation from these devices, affecting their operation.

[0062] Against this backdrop, the air conditioning system 100 provided in this application embodiment can meet the coal-to-electricity conversion work by recovering the heat emitted by electronic equipment in the data center computer room, while also improving the cooling efficiency of the air conditioning unit 10 and providing sufficient cooling capacity for the data center computer room.

[0063] Indicative Figure 1 The diagram shows a schematic of an air conditioning system 100 provided in an exemplary embodiment of this application, which can simultaneously recover the heat emitted by electronic devices in the data center and provide cooling to the data center to lower its temperature.

[0064] Indicatively, the air conditioning system 100 includes: n air conditioning units 10, a heat pump main unit 20, and an insulated water storage tank 30.

[0065] The cooling systems in the n air conditioning units 10 are connected in parallel. The n air conditioning units 10 are used to collect the heat emitted by the electronic equipment in the data center (hereinafter referred to as heat emission) and provide cooling to the data center, thereby reducing the indoor temperature of the data center and recovering the heat emitted by the indoor electronic equipment.

[0066] To recover dissipated heat, the outlets of the heat recovery refrigeration pipes of the n air conditioning units 10 are connected to the refrigeration-side inlet of the heat pump host 20 via input pipe 01, allowing the dissipated heat to be transported to the heat pump host 20 through input pipe 01. The refrigeration-side outlet of the heat pump host 20 is connected to the refrigeration pipe inlets of the n air conditioning units 10 via output pipe 02, allowing the refrigerant or cooling fluid (hereinafter referred to as refrigerant) obtained after processing by the heat pump host 20 to be transported to the n air conditioning units 10 through output pipe 02. The refrigerant or cooling fluid, after being processed in the air conditioning units 10, can be converted into cooling capacity to provide cooling for the data center server room. Optionally, the refrigerant is a refrigerant, and the cooling fluid is chilled water.

[0067] Schematic illustration: The heat pump unit 20 is used to supply refrigerant to n air conditioning units 10, and to deliver the high-temperature cooling water obtained by the heating cycle of the heat pump unit 20 to the insulated water storage tank 30 through the cooling water side outlet. The refrigerant is used to absorb the heat emitted by electronic equipment in the data center server room, while the hot indoor air in the data center server room exchanges heat with the refrigerant in the air conditioning units 10 to provide cooling to the data center server room.

[0068] The refrigerant flowing in the refrigeration side of the heat pump unit 20 can be either water or refrigerant; the liquid flowing in the cooling water side is cooling water.

[0069] The following example uses the case where the refrigerant flowing in the cooling side of the heat pump unit 20 is refrigerant and the cooling water flowing in the cooling water side is cooling water.

[0070] The flow path of refrigerant in air conditioning system 100 can be described schematically as follows:

[0071] Low-temperature liquid refrigerant is output from the cooling side outlet of the heat pump host 20 and enters the cooling pipe inlet of the air conditioning unit 10 through the output pipe 02. Inside the air conditioning unit 10, the refrigerant exchanges heat with the hot return air in the data center computer room, which has a higher temperature, so that the hot return air is cooled into cold air, and the cold air is sent into the room of the data center computer room by the air conditioning unit 10. At the same time, the hot return air in the data center computer room is absorbed by the refrigerant flowing in the air conditioning unit 10. The air conditioning unit 10 sends the refrigerant that has absorbed heat into the delivery pipe 01 and returns to the heat pump host 20 through the cooling side inlet so that the heat pump host 20 can process the refrigerant.

[0072] For example, the low-temperature liquid refrigerant exchanges heat with the hot air at a higher return air temperature in the data center computer room inside the air conditioning unit 10. During this process, the low-temperature liquid refrigerant absorbs heat and rises in temperature, and then vaporizes into a gaseous refrigerant at room temperature. In addition, the heat absorption of the refrigerant during this process lowers the temperature of the hot return air, thereby enabling the air conditioning unit 10 to provide cooling capacity to the data center computer room.

[0073] Subsequently, the room-temperature gaseous refrigerant enters the heat pump unit 20, where it is compressed into a high-temperature gaseous refrigerant. This high-temperature gaseous refrigerant is then cooled by low-temperature cooling water, achieving heat exchange. During this heat exchange process, the low-temperature cooling water absorbs heat from the refrigerant, becoming high-temperature cooling water, while the high-temperature gaseous refrigerant is cooled... Encountering cold The refrigerant, which has become a room temperature liquid, is throttled and depressurized by the throttling valve 23, and then becomes a low temperature liquid refrigerant, which is then sent to the refrigeration pipe inlet of the air conditioning unit 10 for recycling.

[0074] Indicatively, the cooling water outlet of the heat pump unit 20 is connected to the insulated water storage tank 30 to store the high-temperature cooling water obtained by the heating cycle of the heat pump unit 20.

[0075] refer to Figure 1 In the air conditioning system 100 provided in this embodiment, refrigerant flows from n air conditioning units 10 to the heat pump host 20 in the input pipe 01. The n input ends of the input pipe 01 are respectively connected to the heat recovery refrigerant pipe outlets of the n air conditioning units 10, so that the refrigerant collected by the n air conditioning units 10 can be centrally transported to the input pipe 01; the output end of the input pipe 01 is connected to the refrigerant side inlet of the heat pump host 20, so that the collected refrigerant that has absorbed heat can be transported to the heat pump host 20 for processing.

[0076] To facilitate the supply of refrigerant from the heat pump unit 20 to the n air conditioning units 10, the refrigerant flows from the heat pump unit 20 to the n air conditioning units 10 in the output pipe 02. The input end of the output pipe 02 is connected to the refrigerant-side outlet of the heat pump unit 20 to allow the refrigerant to flow out; the n output ends of the output pipe 02 are respectively connected to the refrigerant pipe inlets of the n air conditioning units 10, so that each of the n air conditioning units 10 can receive the refrigerant.

[0077] Schematic example, using a refrigerant liquid, the heat pump unit 20 also includes a cooling water side outlet. After the refrigerant is compressed and condensed within the heat pump unit 20, achieving heat exchange with the low-temperature cooling water, the heat pump unit 20 outputs high-temperature cooling water from the cooling water side outlet. This high-temperature cooling water is generated through the heating cycle of the heat pump unit 20 and does not require further heating treatment. Subsequently, the output high-temperature cooling water is stored in an insulated water tank 30.

[0078] The installation of the water inlet of the insulated water storage tank 30 can be configured according to the needs of the water user, and this application does not impose any restrictions. For example, if the water user is an office building or residential area surrounding a data center computer room, the water inlet of the insulated water storage tank 30 can be connected to the water supply or heating pipeline of the office building or residential area to meet the hot water or heating needs of the office building or residential area, thereby avoiding the use of coal-fired power and achieving the goal of green environmental protection.

[0079] In summary, the air conditioning system 100 provided in this application embodiment recovers the heat emitted by electronic equipment in the data center computer room through n parallel air conditioning units 10, and provides refrigerant liquid to the n air conditioning units 10 through the heat pump host 20 so that the air conditioning units 10 provide cooling capacity to the data center computer room; at the same time, the high-temperature cooling water obtained by the heating cycle of the heat pump host 20 is transported to the insulated water storage tank 30 to realize the recovery and utilization of the heat emitted by electronic equipment in the data center computer room.

[0080] The air conditioning system 100 provided in this application embodiment can minimize the system energy consumption of the data center computer room, so that the air conditioning unit 10 can indirectly achieve zero power consumption and zero carbon emissions, thereby reducing the power usage effectiveness (PUE) of the data center computer room and achieving a green data center computer room. For example, the air conditioning system 100 provided in this application embodiment can make the annual average PUE value of the data center computer room less than 1.1.

[0081] To enable the heat pump unit 20 to process the refrigerant, the heat pump unit 20 provided in this embodiment of the application includes a compressor 21, a condenser 22, and a throttling valve 23 connected in series. Figure 2 and Figure 3 Partial schematic diagrams of an air conditioning system 100 provided in an exemplary embodiment of this application are shown.

[0082] Indicatively, the cooling side outlet of the heat pump host 20 is connected to the cooling pipe inlet of each air conditioning unit 10 through the output pipe 02; the compressor 21 is installed on the input pipe 01, and the refrigerant that has absorbed the heat emitted by the electronic equipment in the data center is compressed by the compressor 21 to become a high-temperature, high-pressure gaseous refrigerant; the condenser 22 is installed on the outlet pipe of the compressor 21, and the throttle valve 23 is installed on the outlet pipe of the condenser 22.

[0083] The condenser 22 is used to cool the compressed high-temperature, high-pressure refrigerant to achieve heat exchange; the throttling valve 23 is used to throttle and reduce the pressure of the cooled room-temperature, liquid refrigerant to obtain a low-temperature refrigerant liquid.

[0084] Taking the refrigerant as an example, the low-temperature liquid refrigerant exchanges heat with the hot air with a higher return air temperature in the data center computer room in the air conditioning unit 10. The refrigerant absorbs heat and vaporizes into a low-temperature gaseous refrigerant, so that the heat emitted by the electronic equipment in the data center computer room is transferred to the refrigerant and enters the compressor 21 through the input pipe 01.

[0085] Subsequently, compressor 21 compresses the low-temperature gaseous refrigerant to transform it into a high-temperature, high-pressure gaseous refrigerant; the compressed refrigerant then enters condenser 22 through a series pipeline, where condenser 22 cools the high-temperature gaseous refrigerant.

[0086] In this process, the refrigerant exchanges heat with the low-temperature cooling water in the condenser 22, and this heat exchange process is the cooling treatment performed on the refrigerant by the condenser 22. Subsequently, the cooled refrigerant is throttled and depressurized through the throttling valve 23, so that the cooled refrigerant becomes a low-temperature, liquid refrigerant, which is then sent into n air conditioning units 10.

[0087] Optionally, condenser 22 is a shell-and-tube condenser.

[0088] refer to Figure 2 and Figure 3 Taking the heat pump unit 20 as an example, where the liquid flowing on the refrigeration side is refrigerant and the liquid flowing on the cooling water side is cooling water, and the condenser 22 is a shell-and-tube condenser, the high-temperature gaseous refrigerant after compression enters the refrigeration pipeline of the shell-and-tube condenser from the refrigeration side inlet, and the low-temperature cooling water enters the water pipeline of the shell-and-tube condenser from the cooling water side inlet. The refrigeration pipeline and the water pipeline are in contact but not connected.

[0089] Subsequently, the high-temperature gaseous refrigerant cools down and dissipates heat when it encounters cold, becoming a room-temperature liquid refrigerant; correspondingly, the low-temperature cooling water heats up and absorbs heat when it encounters heat, becoming high-temperature cooling water, thereby realizing heat exchange, so that the dissipated heat is carried in the high-temperature cooling water, realizing the recovery of heat dissipated by electronic equipment in the data center computer room.

[0090] In summary, the air conditioning system 100 provided in this application embodiment can process the refrigerant by connecting the compressor 21, condenser 22 and throttle valve 23 in series in the heat pump host 20, thereby recovering and utilizing the heat emitted by electronic equipment in the data center computer room, and providing refrigerant to the air conditioning unit 10.

[0091] Since n air conditioning units 10 are connected in parallel and connected to the heat pump host 20 through the input pipe 01, the air conditioning system 100 only needs to provide one compressor 21 and one condenser 22 to handle the heat emitted by electronic equipment in the data center computer room, thereby simplifying the structure of the air conditioning unit 10 and improving the cooling efficiency of the air conditioning unit 10.

[0092] As described above, the refrigerant in the air conditioning unit 10 exchanges heat with the indoor hot air in the data center computer room to recover the dissipated heat and provide cooling to the data center computer room.

[0093] refer to Figure 3 In the air conditioning system 100 provided in this application embodiment, each of the n air conditioning units 10 includes: a first evaporator 111, a first air supply outlet 121 and a first return air outlet 122. The first evaporator 111 is used to receive refrigerant liquid and to exchange heat between the refrigerant liquid and the indoor hot air in the data center computer room.

[0094] Indicatively, the first air outlet 121 is connected to the cold aisle 41 of the data center server room;

[0095] The first return air vent 122 of the air conditioning unit 10 is connected to the hot return air duct 42 of the data center computer room, and the first evaporator 111 is located on the periphery of the first return air vent 122.

[0096] An air circulation loop is formed between the first air supply outlet 121, the cold aisle 41, the hot return air aisle 42, and the first return air outlet 122;

[0097] The input end of the first evaporator 111 is connected to the cooling side outlet of the heat pump host 20 through the output pipe 02, and the output pipe of the first evaporator 111 is connected to the cooling side inlet of the heat pump host 20 through the input pipe 01.

[0098] The first air outlet 121 is used to deliver cold air to the cold aisle 41. Based on the air circulation loop of the cold aisle 41 and the hot return air aisle 42, the hot air converges at the outlet of the hot return air aisle 42 and is discharged from the first return air outlet 122, contacting the first evaporator 111 disposed around the first return air outlet 122. Optionally, the first air outlet 121 is connected to the cold aisle 41 via an air supply duct; the first return air outlet 122 is connected to the hot return air aisle 42 via a return air duct.

[0099] refer to Figure 3 Optionally, each air conditioning unit 10 further includes: a first set of fans 131; the first set of fans 131 is disposed around the first air outlet 121 to facilitate air convection between the cold aisle 41 and the hot return air aisle 42 in each data center server room. The location of the first set of fans 131 around the first air outlet 121 can be set according to actual needs. Optionally, refer to... Figure 3 The arrow in the image points from the front to the back at the first air outlet 121, and the first set of fans 131 is located in front of the first air outlet 121.

[0100] As described above, the refrigerant enters the first evaporator 111 through the output pipe 02. Subsequently, the air conditioning unit 10 can be controlled to turn on the first set of fans 131, sending the cold air into the cold aisle 41. Through air convection, the hot air (i.e., the heat emitted by the indoor electronic equipment in the data center server room) circulates to the first return air vent 122.

[0101] Taking refrigerant as an example, the refrigerant in a room temperature liquid state enters the first evaporator 111 and comes into contact with the hot air flow. The refrigerant absorbs the heat from the hot air flow to recover the dissipated heat; while absorbing the heat from the hot air flow, the refrigerant cools the hot air flow into cold air, which is then sent to the first air outlet 121 so that it can be circulated and sent into the cold aisle 41.

[0102] In this cycle, through the internal air circulation of the air conditioning unit 10 and the data center computer room, the mechanical cooling of the data center computer room can be supplemented by the heat exchange between the hot airflow and the refrigerant, thereby achieving zero power consumption and zero carbon emissions in the data center computer room. On the one hand, it improves the cooling efficiency of the air conditioning unit 10, and on the other hand, it minimizes the PUE of the data center computer room, thus achieving the goal of a green data center computer room.

[0103] Optionally, to collect dissipated heat, one or more evaporators may be installed in the air conditioning unit 10. Figure 4 and Figure 5 The following are schematic diagrams illustrating two optional structures of the air conditioning unit 10 provided in an exemplary embodiment of this application.

[0104] 1. The air conditioning unit 10 includes an evaporator.

[0105] refer to Figure 4 The air conditioning unit 10 includes a first evaporator 111, a first air supply outlet 121, and a first return air outlet 122. The first evaporator 111 is inclinedly disposed in the air conditioning unit 10, and the first air supply outlet 121 and the first return air outlet 122 are respectively disposed on both sides of the first evaporator 111.

[0106] The first evaporator 111, the first air supply outlet 121, and the first return air outlet 122 constitute the internal circulation of the air conditioning unit 10. It mainly achieves heat recovery and supplementary mechanical refrigeration through the heat exchange between the indoor hot air and the refrigerant in the data center computer room. The relevant description can be found in the foregoing content and will not be repeated here.

[0107] Optionally, in order to control the flow of refrigerant, each air conditioning unit 10 in the air conditioning system 100 provided in this application embodiment further includes a two-way valve 141; the two-way valve 141 is disposed on the input pipeline 01 and is located between the compressor 21 and the first evaporator 111.

[0108] The two-way valve 141 is used to control the flow rate of refrigerant supplied to the first evaporator 111. The opening degree of the two-way valve 141 can be determined according to the cooling demand (call for cooling, CFC) of the data center computer room.

[0109] Optionally, if the air conditioning unit 10 includes an evaporator, n air conditioning units 10 are installed indoors in the data center computer rooms; or, the air conditioning system 100 serves m data center computer rooms, and the i-th air conditioning unit 10 of the n air conditioning units 10 is installed indoors in the j-th data center computer room of the m data center computer rooms, where n is not greater than m.

[0110] At this time, the air conditioning unit 10 can provide “free” mechanical cooling capacity for the data center computer room, without the need to use other cooling sources.

[0111] II. The air conditioning unit 10 includes two evaporators.

[0112] refer to Figure 5 In the case where the air conditioning unit 10 includes a first evaporator 111, in the air conditioning system 100 provided in the embodiments of this application, each air conditioning unit 10 also includes a second evaporator 112, a second return air vent 151, a second air outlet 152, and an air-to-air heat exchanger 153.

[0113] Schematic diagram: the first evaporator 111 and the second evaporator 112 are connected in parallel;

[0114] The second return air outlet 151 is located at the outdoor side channel inlet of the air-to-air heat exchanger 153, and the second air outlet 152 is located at the outdoor side channel outlet of the air-to-air heat exchanger 153.

[0115] The second evaporator 112 is disposed on the periphery of the second air outlet 152;

[0116] The input end of the second evaporator 112 is connected to the refrigeration side outlet of the heat pump host 20 through the output pipe 02;

[0117] The output terminals of the first evaporator 111 and the second evaporator 112 are connected in parallel and then connected to the input pipeline 01 through the heat recovery pipeline.

[0118] The second return air vent 151 is used to transfer outdoor cold air from outside the air conditioning unit 10 to the air-to-air heat exchanger 153. After receiving the outdoor cold air, the air-to-air heat exchanger 153 exchanges heat with the indoor hot air in the data center server room to achieve heat recovery. The second evaporator 112 is used to collect the hot air discharged by the air-to-air heat exchanger 153 during heat exchange. This hot air absorbs the heat emitted by the electronic equipment in the data center server room. The hot air discharged by the air-to-air heat exchanger 153 exchanges heat again with the refrigerant in the second evaporator 112 so that the refrigerant in the second evaporator 112 absorbs heat and rises in temperature.

[0119] refer to Figure 5 In the case where the air conditioning unit 10 includes two evaporators, the first evaporator 111 and the second evaporator 112 are connected in parallel and are respectively arranged on different sides of the air conditioning unit 10.

[0120] The first evaporator 111, the first air supply outlet 121 and the first return air outlet 122 constitute the internal circulation of the air conditioning unit 10. It mainly achieves heat recovery and supplementary mechanical refrigeration through the heat exchange between the indoor hot air and the refrigerant in the data center computer room. This part can be referred to the above content and will not be repeated here.

[0121] In addition, the second evaporator 112, the second return air vent 151, the second air outlet 152, and the air-to-air heat exchanger 153 constitute the external circulation of the air conditioning unit 10. The main heat exchange is achieved through the first heat exchange between the outdoor cold air in the data center computer room and the heat emitted by the electronic equipment in the data center computer room in the air-to-air heat exchanger 153; and then through the second heat exchange between the second evaporator 112 and the heat discharged from the air-to-air heat exchanger 153, so as to realize the heat recovery of the emitted heat.

[0122] Still taking the example of refrigerant as the refrigerating liquid, refer to... Figure 5 The flow path of the refrigerant in the air conditioning unit 10 can be described as follows:

[0123] Low-temperature liquid refrigerant enters the air conditioning unit 10 through the output pipe 02; then, the refrigerant is divided into two flow routes: the process of the refrigerant flowing through the first evaporator 111 can be referred to the above content and will not be repeated here; at the same time, the refrigerant is also sent into the second evaporator 112 to realize the recovery of dissipated heat.

[0124] When the refrigerant is introduced into the second evaporator 112, the air conditioning unit 10 controls the air-to-air heat exchanger 153 to open. This absorbs cold outdoor air from the data center server room through the first air outlet 121 and hot indoor air from the data center server room through the first return air outlet 122, allowing for the first heat exchange between the cold outdoor air and the hot indoor air in the air-to-air heat exchanger 153. Subsequently, the exchanged cold air is sent into the data center server room through the first air outlet 121, while the exchanged hot air (i.e., the hot air stream that has absorbed heat from the electronic equipment in the data center server room) is discharged to the periphery of the second evaporator 112. Since the second evaporator 112 stores room-temperature liquid refrigerant, upon contact with the hot air stream discharged from the air-to-air heat exchanger 153, the refrigerant heats up and then vaporizes into a low-temperature gaseous refrigerant.

[0125] Subsequently, two streams of low-temperature gaseous refrigerant are discharged from the output ends of the first evaporator 111 and the second evaporator 112 respectively. The streams from the output ends of the first evaporator 111 and the second evaporator 112 are connected in series to the heat recovery pipeline 03, so that the two streams of low-temperature gaseous refrigerant flow into the input pipeline 01 and finally enter the heat pump host 20 for further processing.

[0126] Optionally, each air conditioning unit 10 also includes a second set of fans 132; the second set of fans 132 is disposed around the second air outlet 152. The location of the second set of fans 132 around the second air outlet 152 can be set according to actual needs. Optionally, refer to... Figure 5 The arrow in the image points from the front to the back at the second air outlet 152, and the second set of fans 132 is located in front of the second air outlet 152.

[0127] Optionally, each air conditioning unit 10 also includes a ball valve 16; the ball valve 16 is disposed between the heat recovery line 03 and the input line 01.

[0128] Optionally, each air conditioning unit 10 also includes a spray pipe 17; the spray pipe 17 is disposed between the second evaporator 112 and the second air outlet 152.

[0129] refer to Figure 5In the case where the air conditioning unit 10 includes a first evaporator 111 and a second evaporator 112, in order to achieve the diversion control of the flow of refrigerant liquid, each air conditioning unit 10 in the air conditioning system 100 provided in this application embodiment further includes a three-way valve 142.

[0130] Among them, the three-way valve 142 is installed on the output pipeline 02, and the three-way valve 142 is used to regulate the liquid flow rate entering the first evaporator 111 and the second evaporator 112;

[0131] The first end of the three-way valve 142 is connected to the cooling side outlet of the heat pump host 20, the second end of the three-way valve 142 is connected to the first evaporator 111 through the internal circulation pipe 04, and the third end of the three-way valve is connected to the second evaporator 112 through the external circulation pipe 05.

[0132] Optionally, the opening degree of the three-way valve 142 can be determined according to the percentage of CFC in the air conditioning unit 10.

[0133] The CFC percentage can be set according to actual needs. For example, when CFC is less than 30%, the three-way valve 142 controls the internal circulation pipe 04 leading to the first evaporator 111 to close, making its opening degree 0, while the external circulation pipe 05 leading to the second evaporator 112 is fully opened, making its opening degree 100%. Alternatively, when CFC is greater than 30%, the three-way valve 142 directly proportionally adjusts the opening degree of the internal circulation pipe 04 and inversely proportionally adjusts the opening degree of the external circulation pipe 05. Furthermore, when CFC is greater than or equal to 100%, the opening degree of the internal circulation pipe 04 reaches its maximum (e.g., 100%), while the opening degree of the external circulation pipe 05 is 0. Finally, when CFC is less than -50%, the opening degree of the internal circulation pipe 04 is 0, while the opening degree of the external circulation pipe 05 is 100%.

[0134] Optionally, at least one of the n air conditioning units 10 is an indirect evaporative cooling air conditioning unit, which is located outside the data center computer room.

[0135] Indirect evaporative cooling air conditioning units refer to air conditioning units that use indirect evaporative cooling technology to achieve mechanical refrigeration.

[0136] For example, n air conditioning units 10 are all indirect evaporative cooling air conditioning units. The n indirect evaporative cooling air conditioning units are installed outdoors in the data center computer room. The internal circulation of the indirect evaporative cooling air conditioning units can be realized through the first evaporator 111, using the heat generated indoors in the data center computer room for heat exchange to achieve heat recovery and supplement mechanical cooling. The external circulation of the indirect evaporative cooling air conditioning units can be realized through the second evaporator 112, using the heat exchange of the outdoor cold air in the data center computer room in the air-to-air heat exchanger 153 to provide supplementary mechanical cooling to the data center computer room. The heat recovery is achieved by the heat exchange of the hot air discharged from the second evaporator 112 and the air-to-air heat exchanger 153.

[0137] In summary, the air conditioning system 100 provided in this application embodiment presents two optional structures for the air conditioning unit 10. In the first case, the air conditioning unit 10 includes a first evaporator 111 to form the internal circulation of the air conditioning unit 10, fully utilizing the heat emitted by electronic equipment in the data center server room to achieve heat recovery and indoor cooling. In the second case, the air conditioning unit 10 includes a first evaporator 111 and a second evaporator 112, respectively forming the internal and external circulation of the air conditioning unit 10, which can simultaneously utilize the heat emitted by electronic equipment in the data center server room and outdoor cold air to achieve heat recovery and indoor cooling.

[0138] It should be understood that the air conditioning unit 10 may also be equipped with three or more evaporators to improve the cooling efficiency and heat recovery efficiency of the air conditioning unit 10. Similarly, improving the mass efficiency and heat recovery efficiency of the air conditioning unit 10 by increasing the number of evaporators or changing the arrangement of the evaporators is within the scope of protection of this application.

[0139] The preceding content used refrigerant as the refrigerating liquid as an example. The following example uses chilled water as the refrigerating liquid:

[0140] Figure 6 The diagram shows a structural diagram of an air conditioning system 100 provided in an exemplary embodiment of this application. In the case where a compressor 21, a condenser 22 and a throttle valve 23 are connected in series in the heat pump host 20, the heat pump host 20 also includes an evaporator 24.

[0141] To illustrate, the evaporator 24, compressor 21, condenser 22 and expansion valve 23 are connected in series.

[0142] Schematic illustration: Both condenser 22 and evaporator 24 include two interconnected but non-connected pipes. The inlet and outlet of the first pipe of condenser 22 are the cooling water outlet and cooling water inlet of the heat pump unit 20, respectively, and the outlet of the first pipe of condenser 22 is connected to the insulated water storage tank 30. The second pipe of condenser 22 is connected to the first pipe of evaporator 24, that is, the inlet of the second pipe of condenser 22 is connected to the outlet of the first pipe of evaporator 24, and the outlet of the second pipe of condenser 22 is connected to the inlet of the first pipe of evaporator 24. The inlet and outlet of the second pipe of evaporator 24 are the cooling-side outlet and inlet of the heat pump unit 20, respectively, and the inlet of the second pipe of evaporator 24 is connected to the cooling pipe inlets of n air conditioning units 10 via input pipe 02.

[0143] Optionally, the liquid flowing in the first pipe of the condenser 22 is cooling water, the liquid flowing between the second pipe of the condenser 22 and the first pipe of the evaporator 24 is refrigerant, and the liquid flowing in the second pipe of the evaporator 24 is chilled water.

[0144] The flow paths of cooling water, refrigerant, and chilled water in the heat pump unit 20 can be described as follows:

[0145] The low-temperature cooling water exchanges heat with the refrigerant in the second pipe of the condenser 22, causing the low-temperature cooling water to absorb heat and rise in temperature to become high-temperature cooling water, which is then sent from the cooling water side outlet of the heat pump unit 20 into the insulated water storage tank 30. At the same time, during this heat exchange, the refrigerant dissipates heat and cools down to become a room-temperature liquid refrigerant.

[0146] Subsequently, the refrigerant flows from the second pipe of the condenser 22 into the expansion valve 23 for throttling and pressure reduction, becoming a low-temperature liquid refrigerant. This low-temperature liquid refrigerant then flows into the first pipe of the evaporator 24. The chilled water entering the second pipe of the evaporator 24 is high-temperature chilled water. This high-temperature chilled water absorbs the heat emitted by the electronic equipment in the data center server room. This process is similar to the aforementioned process and will not be repeated here.

[0147] In evaporator 24, the refrigerant in the first pipe exchanges heat with the chilled water in the second pipe, causing the high-temperature chilled water in the second pipe to cool down and become low-temperature chilled water. This low-temperature chilled water is then sent through the outlet and inlet pipes 02 of the second pipe to the inlets of the cooling pipes of n air conditioning units 10, enabling the n air conditioning units 10 to provide cooling to the data center server room. Simultaneously, during this heat exchange, the refrigerant in the first pipe absorbs heat and rises in temperature. After absorbing heat dissipated by the electronic equipment in the data center server room, the refrigerant vaporizes into a gaseous refrigerant. Subsequently, the gaseous refrigerant flows out from the outlet of the first pipe of evaporator 24 and enters compressor 21 for compression, becoming a high-temperature, high-pressure gaseous refrigerant. This gaseous refrigerant then enters the inlet of the second pipe of condenser 22 to exchange heat again with the cooling water in the second pipe of condenser 22.

[0148] In summary, in the air conditioning system 100 provided in this application embodiment, by combining the use of condenser 22 and evaporator 24, the amount of refrigerant used is reduced while ensuring the cooling effect of air conditioning unit 10, thus saving resources and improving the efficiency of compressor 21.

[0149] It should be understood that the liquid flowing in the different pipes of condenser 22 and evaporator 24 can be adjusted according to actual needs, and the above is only an example.

[0150] Figure 7-10 Schematic diagrams of the structure of the air conditioning system 100 provided in different exemplary embodiments of this application are shown respectively.

[0151] In illustrative terms, to meet the heating needs of the terminal device 50, in the air conditioning system 100 provided in this application embodiment, the terminal device 50 is connected to the cooling water inlet of the heat pump host 20 through the water supply pipe 51.

[0152] The insulated water storage tank 30 is connected to the terminal equipment 50 through the heating pipeline 52;

[0153] The heat pump unit 20 is also used to receive low-temperature cooling water provided by the terminal device 50, and to provide high-temperature cooling water obtained after heat exchange to the terminal device 50. The low-temperature cooling water is used to exchange heat with the compressed refrigerant.

[0154] Among them, terminal equipment 50 refers to the heating equipment of the water user. For example, terminal equipment 50 is the hot water supply equipment or heating equipment installed in office buildings or residential areas around the data center computer room, and the low-temperature cooling water can be heating circulation low-temperature cooling water or municipal tap water.

[0155] Optionally, the air conditioning system 100 also includes a water pump 60; the water pump 60 is installed on the water supply line 51.

[0156] refer to Figure 5 and Figure 6 Taking an air conditioning unit 10 that includes a first evaporator 111 and a second evaporator 112, and the refrigerant as an example, the liquid flow of the refrigerant in the first evaporator 111 and the second evaporator 112 is distributed through a three-way valve 142.

[0157] The refrigerant allocated to the first evaporator 111 absorbs the heat emitted by the electronic equipment in the corresponding data center computer room through the internal circulation of the air conditioning unit 10, thereby lowering the indoor temperature of the data center computer room and supplementing the mechanical cooling. The refrigerant allocated to the second evaporator 112 absorbs the heat discharged by the air-to-air heat exchanger 153 to achieve heat recovery of the data center computer room.

[0158] For example, still taking the case where the liquid flowing in the cooling side of the heat pump unit 20 is refrigerant and the liquid flowing in the cooling water side is cooling water, the refrigerant in a normal temperature liquid state can be a refrigerant at 30-40℃, and the heat recovery process is as follows:

[0159] After the refrigerant is depressurized by the expansion valve 23, it becomes a low-temperature (e.g., 0-10℃) and low-pressure liquid refrigerant, and then enters each air conditioning unit 10 through the input pipeline 01.

[0160] After being distributed by the three-way valve 142, the low-temperature, low-pressure liquid refrigerant enters the first evaporator 111 and the second evaporator 112, respectively. After absorbing heat in the two evaporators, the liquid refrigerant vaporizes. The refrigerant, having absorbed the heat emitted by the electronic equipment in the data center, flows sequentially through the heat recovery pipeline 03 and the output pipeline 02 back to the heat pump host 20.

[0161] Subsequently, the compressor 21 in the heat pump unit 20 compresses the refrigerant, transforming it into a high-temperature (e.g., 70-90℃), high-pressure gaseous refrigerant. Based on the series connection of the compressor 21, condenser 22, and expansion valve 23, the compressed gaseous refrigerant sequentially enters the condenser 22 and expansion valve 23, where it is cooled and transformed into a room-temperature (e.g., 30-40℃), high-pressure liquid refrigerant. This cooling process is a heat exchange process, during which the refrigerant absorbs heat from the data center server room and circulates it through the heat pump unit 20, thus achieving heat recovery.

[0162] Subsequently, the room temperature, high pressure liquid refrigerant is depressurized again by the throttling valve 23 and becomes a low temperature, low pressure liquid refrigerant, which enters each air conditioning unit 10 through the input pipeline 01, realizing the recycling of refrigerant.

[0163] In illustrative terms, while achieving heat recovery, the air conditioning system 100 can also meet the heating needs of the terminal equipment 50. The heat recovery process is as follows:

[0164] Terminal device 50 delivers low-temperature cooling water (e.g., 5-20℃) to water pump 60 via water supply pipeline 51. Water pump 60 delivers the low-temperature cooling water to the cooling water inlet of heat pump host 20. Subsequently, the low-temperature cooling water cools the high-temperature, high-pressure gaseous refrigerant in condenser 22, raising the water temperature to 50-60℃. The water is then sent to insulated water storage tank 30 for storage.

[0165] The stored high-temperature cooling water can be sent to the terminal equipment through the heating pipeline 52 to supply hot water or heating to the office buildings or residential areas around the data center computer room.

[0166] Based on actual needs, the air conditioning system 100 provided in this application embodiment has the following three operating modes under different outdoor ambient temperatures:

[0167] 1. Fully mechanical refrigeration and heat recovery operation mode.

[0168] This operating mode is illustrative and can be used during the summer.

[0169] In summer, outdoor temperatures are much higher than indoor temperatures, which means that air conditioning unit 10 cannot use natural cooling. The cooling of the data center server room must rely entirely on air conditioning unit 10. At this time, while performing heat recovery, heat pump host 20 needs to provide sufficient refrigerant to air conditioning unit 10 to ensure that air conditioning unit 10 can provide enough cooling capacity to the data center server room.

[0170] In this operating mode, refer to Figure 7 All the refrigerant enters the first evaporator 111 and does not enter the second evaporator 112. Through the internal circulation of the air conditioning unit 10, it makes full use of the heat emitted by the electronic equipment in the data center computer room for heat exchange, so as to provide sufficient cooling capacity for the air conditioning unit 10.

[0171] 2. Partial mechanical refrigeration and heat recovery operation mode.

[0172] This operating mode is illustrative and can be used in spring, autumn, or transitional seasons.

[0173] Outdoor temperatures are higher in spring and autumn or during transitional seasons, but may be lower than the return air temperature in the hot aisle 42 at the top of the data center, so the air conditioning unit 10 can use some natural cooling.

[0174] In this operating mode, refer to Figure 8 After being regulated by the three-way valve 142, the refrigerant enters the first evaporator 111 and the second evaporator 112 respectively, so as to simultaneously carry out the internal and external circulation of the air conditioning unit 10.

[0175] The internal circulation using the first evaporator 111 is the same as the first operating mode; the external circulation using the second evaporator 112 mainly utilizes the heat exchange between the outdoor cold air in the data center computer room and the air-to-air heat exchanger 153 to provide cooling air to the data center computer room, that is, the air conditioning unit 10 utilizes part of the natural cooling to cool the data center computer room.

[0176] 3. Fully natural cooling and heat recovery operation mode.

[0177] This operating mode is illustrative and can be used in winter.

[0178] In contrast to summer, the outdoor temperature in winter is much lower than the indoor temperature, so the air conditioning unit 10 can rely entirely on natural cooling, meaning that the cooling of the data center can depend entirely on natural cooling.

[0179] In this operating mode, refer to Figure 9 All the refrigerant enters the second evaporator 112 and does not enter the first evaporator 111. Through the external circulation of the air conditioning unit 10, the outdoor cold air of the data center computer room is fully utilized to exchange heat with the indoor hot air in the data center computer room in the air-to-air heat exchanger 153, so as to provide sufficient cooling capacity for the air conditioning unit 10. In other words, the air conditioning unit 10 makes full use of natural cooling to cool the data center computer room.

[0180] Based on the foregoing, the three operating modes provided in this application embodiment are distinguished by season. It should be understood that the operating modes are switched according to changes in indoor and outdoor ambient temperatures, and are not entirely dependent on the season. Therefore, they should not limit the air conditioning system 100 provided in this application embodiment.

[0181] Figure 11 A flowchart of a data center management method provided in an exemplary embodiment of this application is shown. This method is applied to the air conditioning system 100 provided in the above embodiment. For a detailed description of the air conditioning system 100, please refer to the foregoing content. The data center management method includes the following steps:

[0182] Step 102: Control n air conditioning units 10 to provide cooling to the data center server room, and collect the heat emitted by electronic equipment in the data center server room through refrigerant liquid.

[0183] The refrigerant flows sequentially through the heat recovery refrigeration pipe outlets and input pipes 01 of n air conditioning units 10 into the refrigeration side inlet of the heat pump host 20. The refrigerant is used to absorb the heat emitted by electronic equipment in the data center computer room.

[0184] Based on the foregoing, one or more evaporators can be installed in each air conditioning unit. Depending on the number of evaporators, step 102 can be implemented in several ways:

[0185] 1. When each air conditioning unit 10 includes a first evaporator 111, step 102 can be implemented as follows:

[0186] Control n air conditioning units 10 to receive refrigerant liquid obtained after processing by heat pump host 20;

[0187] The first evaporator 111 is controlled to use refrigerant to cool the hot indoor air in the data center computer room.

[0188] In this process, the refrigerant exchanges heat with the indoor hot air in the first evaporator 111, turning the indoor hot air into cold air. The cold air then enters the cold aisle 41 of the data center computer room through the first air outlet 121. After passing through the air circulation loop between the data center computer room and the air conditioning unit 10, the indoor hot air flows to the hot return air aisle 42 of the data center computer room, so as to exchange heat with the refrigerant flowing in the first evaporator 111 again.

[0189] 2. When each air conditioning unit 10 includes a second evaporator 112 and an air-to-air heat exchanger 153, step 102 can be implemented as follows:

[0190] The air-to-air heat exchanger 153 receives outdoor cold air from outside the n air conditioning units 10 and exchanges heat between the outdoor cold air and the indoor hot air of the n air conditioning units 10.

[0191] The second evaporator 112 is controlled to absorb the heat generated during heat exchange in the air-to-air heat exchanger 153.

[0192] 3. When each air conditioning unit 10 includes a first evaporator 111, a second evaporator 112, and an air-to-air heat exchanger 153, step 102 can be implemented as follows:

[0193] Control n air conditioning units 10 to receive refrigerant liquid obtained after processing by heat pump host 20;

[0194] The first evaporator 111 is controlled to cool the hot indoor air of the data center computer room using refrigerant liquid;

[0195] The air-to-air heat exchanger 153 receives outdoor cold air from outside the n air conditioning units 10 and exchanges heat between the outdoor cold air and the indoor hot air of the n air conditioning units 10.

[0196] The second evaporator 112 is controlled to absorb the heat generated during heat exchange in the air-to-air heat exchanger 153.

[0197] The flow path of the refrigerant in the air conditioning system 100 can be referred to the above content and will not be repeated here.

[0198] Step 104: Control the heat pump main unit 20 to supply refrigerant to n air conditioning units.

[0199] The refrigerant flows sequentially through the refrigeration side outlet of the heat pump main unit 20 and the output pipe 02 into the refrigeration pipe inlet of n air conditioning units.

[0200] Optionally, if each air conditioning unit 10 includes a first evaporator 111, a second evaporator 112, and a three-way valve 142, step 106 can be implemented as follows:

[0201] Adjust the opening degree of the three-way valve 142 according to the cooling demand of n air conditioning units 10;

[0202] The three-way valve 142 is controlled to supply a first ratio of refrigerant to the first evaporator 111 and a second ratio of refrigerant to the second evaporator 112.

[0203] The flow regulation of the first evaporator 111 and the second evaporator 112 by the three-way valve 142 can be referred to the above content and will not be repeated here.

[0204] Step 106: Control the heat pump host 20 to deliver the high-temperature cooling water obtained from the heating cycle to the insulated water storage tank 30 through the cooling water side outlet.

[0205] Optionally, step 106 can be implemented as follows:

[0206] The heat pump main unit 20 receives low-temperature cooling water supplied by the terminal device 50;

[0207] The heat pump host 20 supplies high-temperature cooling water from the insulated water tank 30 to the terminal device 50. The high-temperature cooling water is obtained through the heating cycle of the heat pump host 20.

[0208] Optionally, if a condenser 22 is provided in the heat pump unit 20, controlling the heat pump unit 20 to receive low-temperature cooling water provided by the terminal device 50 can be achieved as follows:

[0209] The condenser 22 receives low-temperature cooling water supplied from the cooling water side inlet by the terminal device 50.

[0210] The process of the heat pump host 20 providing high-temperature liquid to the terminal device 50 can be referred to the above content and will not be repeated here.

[0211] Optionally, if a compressor 21, a condenser 22, and a throttling valve 23 are connected in series in the heat pump host 20, the data center management method provided in this application embodiment further includes the following step between step 102 and step 104:

[0212] The compressor 21 is controlled to compress the refrigerant;

[0213] The condenser 22 is controlled to use cooling water to cool the compressed refrigerant in order to achieve heat exchange;

[0214] The throttling valve 23 controls the flow and pressure reduction of the cooled refrigerant to obtain a low-temperature refrigerant.

[0215] Before the compressor 21 compresses the refrigerant, the heat pump main unit can be controlled to receive the vaporized refrigerant.

[0216] Based on the foregoing, the vaporized refrigerant can be obtained in the following two ways: When the liquid flowing in the input pipe 01 and output pipe 02 is refrigerant, the heat pump host 20 is controlled to receive the vaporized refrigerant generated after absorbing heat emitted by electronic equipment in the data center server room from the n air conditioning units 10; when the liquid flowing in the input pipe 01 and output pipe 02 is chilled water, the heat pump host 20 is also equipped with an evaporator 24, and the heat pump host 20 is controlled to receive the vaporized refrigerant through the evaporator 24. The vaporized refrigerant is obtained by the refrigerant in the evaporator 24 absorbing heat from the high-temperature chilled water in the n air conditioning units 10.

[0217] In summary, the embodiments of this application provide a data center management method that, by controlling n air conditioning units 10 and heat pump hosts 20, can achieve heat recovery of heat emitted by electronic equipment in the data center and indoor cooling of the data center.

[0218] The following are device embodiments of this application. For details not described in detail in the device embodiments, please refer to the corresponding descriptions in the above method embodiments. They will not be repeated here.

[0219] Figure 12 This application shows a schematic diagram of a data center management apparatus provided in an exemplary embodiment, the apparatus comprising:

[0220] The first control module 1220 is used to control n air conditioning units 10 to provide cooling to the data center computer room, and to collect the heat emitted by electronic equipment in the data center computer room through the refrigerant liquid. The refrigerant liquid enters the cooling side inlet of the heat pump host 20 through the heat recovery refrigeration pipeline outlet and the input pipeline 01 of the n air conditioning units 10.

[0221] The second control module 1240 is used to control the heat pump host 20 to provide refrigerant to n air conditioning units 10. The refrigerant passes through the refrigerant side outlet and output pipe 02 of the heat pump host 20 and enters the refrigerant pipe inlet of the n air conditioning units 10 in sequence.

[0222] The second control module 1240 is also used to control the heat pump host 20 to transport the high-temperature cooling water obtained from the heating cycle to the insulated water storage tank 30 through the cooling water side outlet.

[0223] Optionally, the heat pump host 20 is equipped with a compressor 21, a condenser 22 and a throttling valve 23 connected in series. The second control module 1240 is also used to control the compressor 21 to compress the refrigerant; control the condenser 22 to cool the compressed refrigerant to achieve heat exchange; and control the throttling valve 23 to throttle and reduce the pressure of the cooled refrigerant to obtain a low-temperature refrigerant.

[0224] Optionally, each air conditioning unit 10 includes: a first evaporator 111 and a first control module 1220, which can receive refrigerant liquid processed by the heat pump host 20 in n air conditioning units 10; and control the first evaporator 111 to use the refrigerant liquid to cool the indoor hot air of the data center server room.

[0225] Optionally, each air conditioning unit 10 further includes: a second evaporator 112 and an air-to-air heat exchanger 153, and a first control module 1220, used to control the air-to-air heat exchanger 153 to receive outdoor cold air from outside the n air conditioning units 10 and to exchange heat between the outdoor cold air and the indoor hot air of the n air conditioning units 10; and to control the second evaporator 112 to absorb the heat generated when the air-to-air heat exchanger 153 exchanges heat.

[0226] Optionally, each air conditioning unit 10 further includes: a first evaporator 111, a second evaporator 112, and a three-way valve 142; and a first control module 1220, used to adjust the opening of the three-way valve 142 according to the cooling demand of the n air conditioning units 10; and to control the three-way valve 142 to provide a first ratio of refrigerant to the first evaporator 111 and a second ratio of refrigerant to the second evaporator 112.

[0227] Optionally, the second control module 1240 is used to control the heat pump host 20 to receive low-temperature cooling water provided by the terminal device 50; and to control the heat pump host 20 to provide high-temperature cooling water from the insulated water storage tank 30 to the terminal device 50.

[0228] Optionally, the heat pump host 20 is provided with a condenser 22; the second control module 1240 is used to control the heat pump host 20 to receive low-temperature cooling water provided by the terminal device 50, including: controlling the condenser 22 to receive low-temperature cooling water provided by the terminal device 50 from the cooling water side inlet.

[0229] Figure 13The diagram illustrates the structure of a computer device provided in an exemplary embodiment of this application. The computer device includes a processor 1320 and a memory 1340. The memory 1340 stores at least one computer program, which is loaded and executed by the processor 1320 to implement the data center management method described above.

[0230] The processor 1320 can be implemented in at least one of the following hardware forms: DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array).

[0231] Schematic, processor 1320 is used to control n air conditioning units (10) to provide cooling to the data center computer room, and to collect the heat emitted by electronic equipment in the data center computer room through refrigerant liquid. The refrigerant liquid enters the refrigerant side inlet of the heat pump host (20) through the heat recovery refrigerant pipe outlet and input pipe (01) of the n air conditioning units (10) in sequence. It controls the heat pump host (20) to provide refrigerant liquid to the n air conditioning units (10). The refrigerant liquid enters the refrigerant pipe inlet of the n air conditioning units (10) through the refrigerant side outlet and output pipe (02) of the heat pump host (20) in sequence. It controls the heat pump host (20) to transport the high-temperature cooling water obtained from the heating cycle to the insulated water storage tank (30) through the cooling water side outlet.

[0232] The memory 1340 may include one or more computer-readable storage media, which may be non-transitory. The memory 1340 may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices or flash memory devices. In some embodiments, the non-transitory computer-readable storage media in the memory 1340 are used to store at least one instruction, which is executed by the processor 1320 to implement the data center management method provided in the method embodiments of this application.

[0233] Those skilled in the art will understand that Figure 13 The structure shown does not constitute a limitation on the computer device and may include more or fewer components than shown, or combine certain components, or use different component arrangements.

[0234] This application also provides a computer-readable storage medium storing a computer program for execution by a processor to implement the data center management method described above.

[0235] This application also provides a chip, which includes programmable logic circuits and / or program instructions, for implementing the data center management method described above when the chip is running.

[0236] This application also provides a computer program product, which includes computer instructions stored in a computer-readable storage medium. The processor reads and executes the computer instructions from the computer-readable storage medium to implement the data center management method described above.

[0237] In this application, it should be understood that the terms “first”, “second”, etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0238] All of the above-mentioned optional technical solutions can be combined in any way to form the optional embodiments of this application, and will not be described in detail here.

[0239] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An air conditioning system (100) for a data center computer room, characterized in that, The air conditioning system (100) includes: n air conditioning units (10), a heat pump host (20) and an insulated water storage tank (30). Each of the n air conditioning units (10) includes a first evaporator (111), a second evaporator (112), a first air supply outlet (121), a first return air outlet (122), a second return air outlet (151), a second air outlet (152) and an air-to-air heat exchanger (153). The refrigeration systems in the n air conditioning units (10) are connected in parallel. The n air conditioning units (10) are used to collect the heat emitted by the electronic equipment in the data center and to provide cooling to the data center. The heat recovery refrigeration pipeline outlets of the n air conditioning units (10) are connected to the refrigeration side inlet of the heat pump host (20) via the input pipeline (01), the refrigeration side outlet of the heat pump host (20) is connected to the refrigeration pipeline inlet of the n air conditioning units (10) via the output pipeline (02), and the cooling water side outlet of the heat pump host (20) is connected to the insulated water storage tank (30). The heat pump host (20) is used to provide refrigerant to the n air conditioning units (10) and to transport the high-temperature cooling water obtained by the heat pump host (20) heating cycle to the insulated water storage tank (30) through the cooling water side outlet. The refrigerant is used to absorb the heat emitted by the electronic equipment in the data center computer room. The first evaporator (111) and the second evaporator (112) are connected in parallel and are respectively arranged on different sides of each air conditioning unit (10); wherein, the first evaporator (111), the first air outlet (121), and the first return air outlet (122) are used to form the internal circulation of each air conditioning unit (10), and the internal circulation realizes heat recovery and supplements mechanical refrigeration through the heat exchange between the indoor hot air in the data center and the refrigerant liquid; the second evaporator (112), the second return air outlet (151), the second air outlet (152), and the air-to-air heat exchanger (153) are used to form the external circulation of each air conditioning unit (10), and the external circulation realizes heat recovery by first exchanging the heat emitted by the outdoor cold air in the data center and the heat emitted by the electronic equipment in the data center in the air-to-air heat exchanger (153), and then exchanging the heat emitted by the second evaporator (112) and the heat emitted by the air-to-air heat exchanger (153) in the air-to-air heat exchanger (153).

2. The air conditioning system (100) according to claim 1, characterized in that, The heat pump host (20) is equipped with a compressor (21), a condenser (22) and a throttle valve (23) connected in series. The compressor (21) is mounted on the input pipeline (01); The condenser (22) is located on the outlet pipe of the compressor (21), and the throttle valve (23) is located on the outlet pipe of the condenser (22).

3. The air conditioning system (100) according to claim 2, characterized in that, The first air outlet (121) is connected to the cold aisle (41) of the data center computer room; The first return air vent (122) is connected to the hot return air duct (42) of the data center computer room, and the first evaporator (111) is located on the periphery of the first return air vent (122); An air circulation loop is formed between the first air supply outlet (121), the cold aisle (41), the hot return air aisle (42), and the first return air outlet (122); The input end of the first evaporator (111) is connected to the refrigeration side outlet of the heat pump host (20) through the output pipe (02), and the output end of the first evaporator (111) is connected to the refrigeration side inlet of the heat pump host (20) through the input pipe (01).

4. The air conditioning system (100) according to claim 3, characterized in that, Each air conditioning unit (10) further includes: a first set of fans (131); The first set of fans (131) is located around the first air outlet (121).

5. The air conditioning system (100) according to claim 3, characterized in that, Each air conditioning unit (10) further includes: a two-way valve (141); The two-way valve (141) is installed on the output pipeline (02) and is located between the compressor (21) and the first evaporator (111).

6. The air conditioning system (100) according to claim 3, characterized in that, The n air conditioning units (10) are installed indoors in the data center computer room; Alternatively, the air conditioning system (100) serves m data center computer rooms, and the i-th air conditioning unit (10) of the n air conditioning units (10) is located in the room of the j-th data center computer room among the m data center computer rooms, where n is not greater than m.

7. The air conditioning system (100) according to claim 3, characterized in that, The first evaporator (111) and the second evaporator (112) are connected in parallel; The second return air inlet (151) is located at the inlet of the outdoor channel of the air-to-air heat exchanger (153), and the second air outlet (152) is located at the outlet of the outdoor channel of the air-to-air heat exchanger (153). The second evaporator (112) is disposed on the periphery of the second air outlet (152); The input end of the second evaporator (112) is connected to the refrigeration side outlet of the heat pump host (20) through the output pipe (02); The output end of the first evaporator (111) is connected in parallel with the output end of the second evaporator (112) and then connected to the input pipeline (01) through the heat recovery pipeline (03).

8. The air conditioning system (100) according to claim 7, characterized in that, Each air conditioning unit (10) further includes: a second set of fans (132); The second set of fans (132) is located around the second air outlet (152).

9. The air conditioning system (100) according to claim 7, characterized in that, Each air conditioning unit (10) also includes: a three-way valve (142); The three-way valve (142) is installed on the output pipeline (02); The first end of the three-way valve (142) is connected to the refrigeration side outlet of the heat pump host (20), the second end of the three-way valve (142) is connected to the first evaporator (111) through the internal circulation pipe (04), and the third end of the three-way valve (142) is connected to the second evaporator (112) through the external circulation pipe (05).

10. The air conditioning system (100) according to claim 7, characterized in that, Each air conditioning unit (10) also includes: a ball valve (16); The ball valve (16) is located between the heat recovery pipeline (03) and the input pipeline (01).

11. The air conditioning system (100) according to claim 7, characterized in that, Each air conditioning unit (10) further includes: a spray pipe (17); The spray pipe (17) is disposed between the second evaporator (112) and the second air outlet (152).

12. The air conditioning system (100) according to claim 7, characterized in that, At least one of the n air conditioning units (10) is an indirect evaporative cooling air conditioning unit, which is located outside the data center computer room.

13. The air conditioning system (100) according to claim 2, characterized in that, The heat pump unit (20) also includes an evaporator (24); The evaporator (24), the compressor (21), the condenser (22), and the throttle valve are connected in series.

14. The air conditioning system (100) according to any one of claims 1 to 13, characterized in that, The terminal device (50) is connected to the cooling water inlet of the heat pump host (20) via a water supply pipeline (51); The insulated water storage tank (30) is connected to the terminal equipment (50) through the heating pipeline (52); The heat pump host (20) is also used to receive low-temperature cooling water provided by the terminal device (50) and to provide the high-temperature cooling water to the terminal device (50).

15. The air conditioning system (100) according to claim 14, characterized in that, The air conditioning system (100) also includes: a water pump (60). The water pump (60) is installed on the water supply pipeline (51).

16. A data center computer room management method, characterized in that, The method is applied to an air conditioning system (100) as described in any one of claims 1 to 15, the method comprising: The n air conditioning units (10) are controlled to provide cooling to the data center computer room, and the heat emitted by the electronic equipment in the data center computer room is collected by the cooling liquid. The cooling liquid passes through the heat recovery cooling pipe outlet of the n air conditioning units (10) and the input pipe (01) to enter the cooling side inlet of the heat pump host (20). The heat pump host (20) is controlled to supply the refrigerant to the n air conditioning units (10). The refrigerant passes through the refrigerant side outlet of the heat pump host (20) and the output pipe (02) in sequence and enters the refrigerant pipe inlet of the n air conditioning units (10). The heat pump host (20) is controlled to deliver the high-temperature cooling water obtained from the heating cycle to the insulated water storage tank (30) through the cooling water side outlet; Each of the n air conditioning units (10) includes a first evaporator (111), a second evaporator (112), a first air supply outlet (121), a first return air outlet (122), a second return air outlet (151), a second air outlet (152), and an air-to-air heat exchanger (153); the first evaporator (111) and the second evaporator (112) are connected in parallel and respectively disposed on different sides of each air conditioning unit (10); wherein, the first evaporator (111), the first air supply outlet (121), and the first return air outlet (122) are used to form the internal circulation of each air conditioning unit (10), and the internal circulation is circulated through the data. The heat exchange between the indoor hot air in the computer room and the refrigerant liquid achieves heat recovery and supplements mechanical refrigeration; the second evaporator (112), the second return air vent (151), the second air outlet (152) and the air-to-air heat exchanger (153) are used to form the external circulation of each air conditioning unit (10). The external circulation achieves heat recovery by first exchanging the heat emitted by the outdoor cold air in the data center computer room with the heat emitted by the electronic equipment in the data center computer room in the air-to-air heat exchanger (153), and then exchanging the heat emitted by the second evaporator (112) with the heat emitted by the air-to-air heat exchanger (153).

17. The method according to claim 16, characterized in that, The heat pump unit (20) is equipped with a compressor (21), a condenser (22), and a throttle valve (23) connected in series. The method further includes: The compressor (21) is controlled to compress the refrigerant; The condenser (22) is controlled to use cooling water to cool the compressed refrigerant in order to achieve heat exchange; The throttling valve (23) is controlled to throttle and reduce the pressure of the cooled refrigerant in order to obtain a low-temperature refrigerant.

18. The method according to claim 16, characterized in that, The air conditioning unit (10) includes: a first evaporator (111), and the control of the n air conditioning units (10) to collect the heat emitted by the electronic equipment in the data center computer room through the refrigerant includes: Control the n air conditioning units (10) to receive the refrigerant liquid obtained after being processed by the heat pump host (20); The first evaporator (111) is controlled to cool the indoor hot air of the data center computer room using the refrigerant liquid.

19. The method according to claim 16 or 17, characterized in that, Each air conditioning unit (10) includes: a second evaporator (112) and an air-to-air heat exchanger (153), wherein controlling the n air conditioning units (10) to collect heat dissipated by electronic equipment in the data center computer room through a refrigerant liquid includes: The air-to-air heat exchanger (153) is controlled to receive outdoor cold air from outside the n air conditioning units (10) and to exchange heat between the outdoor cold air and the indoor hot air of the n air conditioning units (10). The second evaporator (112) is controlled to absorb the heat generated during heat exchange by the air-to-air heat exchanger (153).

20. The method according to claim 16 or 17, characterized in that, Each air conditioning unit (10) further includes: a first evaporator (111), a second evaporator (112), and a three-way valve (142), wherein controlling the heat pump main unit (20) to supply the refrigerant to the n air conditioning units (10) includes: The opening degree of the three-way valve (142) is adjusted according to the cooling demand of the n air conditioning units (10); The three-way valve (142) is controlled to supply a first ratio of refrigerant to the first evaporator (111) and a second ratio of refrigerant to the second evaporator (112).

21. A data center management device, characterized in that, The device includes: The first control module is used to control n air conditioning units (10) to provide cooling to the data center computer room, and to collect the heat emitted by the electronic equipment in the data center computer room through the refrigerant liquid. The refrigerant liquid enters the cooling side inlet of the heat pump host (20) through the heat recovery refrigeration pipeline outlet and input pipeline (01) of the n air conditioning units (10). The second control module is used to control the heat pump host (20) to provide the refrigerant to the n air conditioning units (10). The refrigerant passes through the refrigerant side outlet and output pipe (02) of the heat pump host (20) and enters the refrigerant pipe inlet of the n air conditioning units (10). The second control module is also used to control the heat pump host (20) to deliver the high-temperature cooling water obtained from the heating cycle to the heat-insulated water storage tank (30) through the cooling water side outlet; Each of the n air conditioning units (10) includes a first evaporator (111), a second evaporator (112), a first air supply outlet (121), a first return air outlet (122), a second return air outlet (151), a second air outlet (152), and an air-to-air heat exchanger (153); the first evaporator (111) and the second evaporator (112) are connected in parallel and respectively disposed on different sides of each air conditioning unit (10); wherein, the first evaporator (111), the first air supply outlet (121), and the first return air outlet (122) are used to form the internal circulation of each air conditioning unit (10), and the internal circulation is circulated through the data. The heat exchange between the indoor hot air in the computer room and the refrigerant liquid achieves heat recovery and supplements mechanical refrigeration; the second evaporator (112), the second return air vent (151), the second air outlet (152) and the air-to-air heat exchanger (153) are used to form the external circulation of each air conditioning unit (10). The external circulation achieves heat recovery by first exchanging the heat emitted by the outdoor cold air in the data center computer room with the heat emitted by the electronic equipment in the data center computer room in the air-to-air heat exchanger (153), and then exchanging the heat emitted by the second evaporator (112) with the heat emitted by the air-to-air heat exchanger (153).

22. A computer device, characterized in that, The computer device includes: a processor and a memory; The memory stores at least one computer program, which is loaded and executed by the processor to implement the data center management method as described in any one of claims 16 to 20.

23. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, which is executed by a processor to implement the data center management method as described in any one of claims 16 to 20.

24. A chip, characterized in that, The chip includes programmable logic circuits and program instructions, and when the chip is running, it is used to implement the data center management method as described in any one of claims 16 to 20.

25. A computer program product, characterized in that, The computer program product includes computer instructions stored in a computer-readable storage medium, and a processor reads and executes the computer instructions from the computer-readable storage medium to implement the data center management method as described in any one of claims 16 to 20.

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