Roller for a carrier transport assembly, substrate processing system, method for maintaining a substrate processing system, and method for manufacturing an apparatus

Abstract

Describes a roller for a carrier transport assembly. The roller includes a roller body that is rotatable and has a substrate support surface; a roller shell that surrounds a portion of the roller; and a capture surface of the roller shell that has at least a first surface portion facing the roller.

Description

Technical Field

[0001] Embodiments relate to methods for reducing contamination in a substrate processing system and / or a substrate processing apparatus. Embodiments further relate to trapping contaminants and / or cleaning carriers at or within a vacuum processing system. Embodiments particularly relate to a particle trapping device, a particle removal device, a transport system, a load lock chamber, and a vacuum processing chamber. Background Art

[0002] Substrates are typically coated in a vacuum coating plant under high vacuum conditions at a pressure in the range of 5×10 -4 hPa to 0.5 hPa. To increase plant productivity and to avoid having to evacuate the entire apparatus (particularly the high vacuum part) for each substrate, load locks and unload locks are used for the substrates.

[0003] For example, in flat panel display production, particles from both mechanical elements of the processing system and the processing itself are a major factor in yield loss. Therefore, in recent years, there has been an increased desire to reduce contamination during vacuum processing. Particle contamination can occur, for example, if a transport system or element in the processing system generates particles during processing, if the substrate to be processed introduces particles into the evacuated processing system, and so on. For example, mechanical friction (e.g., during the transport of a substrate carrier or a substrate, respectively) can lead to particle generation. During operation, there are multiple possible sources of contaminating particles in a deposition system, which can affect product quality.

[0004] Cleaning and replacing elements and continuously evacuating the processing system is one way to reduce the risk of product contamination. As described above, the processing is advantageously performed in the fastest and most efficient manner possible. Cleaning and replacement procedures take time for maintenance, which reduces production time.

[0005] For example, in a physical vapor deposition (PVD) system, substrates can be transported with a moving substrate carrier. The substrate carrier can be in rolling contact with a plurality of support rollers. Tribological wear in the contact zones leads to particle release and particle generation. When particles land on the substrate (e.g., as defects in a film), it can result in a loss of device yield. Reducing particles that can have a negative impact on substrate processing results in increased yield, and thus a commercial benefit.

[0006] A reduction in the number of particles affecting substrate processing can be provided by a) reducing particle generation and b) trapping or collecting the generated particles such that the particles do not affect substrate processing. Trapping particles (such as transporting particles) can reduce the addition of pre - deposition and post - deposition particles to the substrate, as well as reduce successive particle - induced defect formation and yield loss. Improvements to critical defects (especially metal conductive particle defects) exhibit a large leverage, since a 1% increase in the yield of a production system can easily provide significant revenue opportunities.

[0007] In view of the above, it is beneficial to provide a particle reduction device, an improved load - lock chamber, an improved vacuum processing system, and an improved method of transporting and / or cleaning a carrier in a vacuum processing system. Summary of the Invention

[0008] According to the present invention, there is provided a roller for a carrier transport assembly as claimed in claims 1 to 8, a substrate processing system as claimed in claims 9 to 11, a method of maintaining a substrate processing system as claimed in claims 12 to 13, and a method of manufacturing a device as claimed in claim 14.

[0009] According to one embodiment, there is provided a roller for a carrier transport assembly. The roller includes a roller body that is rotatable and has a substrate support surface; a roller sleeve around a portion of the roller; and a trapping surface of the roller sleeve, the trapping surface having at least a first surface portion facing the roller.

[0010] According to one embodiment, there is provided a substrate processing system. The substrate processing system includes a carrier transport assembly having a plurality of rollers arranged along a transport direction of the carrier transport assembly, each of the plurality of rollers being a roller according to an embodiment of the present disclosure.

[0011] According to one embodiment, there is provided a method of maintaining a substrate processing system. The method includes removing a plurality of roller sleeves from a plurality of rollers of a carrier transport assembly; cleaning or removing the trapping surface of each of the plurality of roller sleeves; and assembling the plurality of rollers by providing roller sleeves for each roller.

[0012] According to one embodiment, there is provided a method of manufacturing a device. The method includes transporting a carrier supporting a substrate using a carrier transport assembly having a plurality of rollers, the transporting including rotating the roller body of each roller; trapping particles generated at the rollers in a roller sleeve having a trapping surface; and processing or depositing one or more thin film layers of the device.

[0013] According to one embodiment, a carrier cleaning head for cleaning a carrier moving along a transport direction is provided. The carrier cleaning head includes a cleaning head body having a first conduit and a second conduit; two or more pairs of brushes, each pair of brushes having a first brush extending in a first direction and a second brush extending in a second direction opposite to the first direction, the pairs of brushes being arranged along the transport direction; a first opening assembly in fluid communication with the first conduit and configured to provide a purification gas; and a second opening assembly in fluid communication with the second conduit and configured for particle removal.

[0014] According to one embodiment, a substrate processing system is provided. The substrate processing system includes a first vacuum chamber having a first wall; and a carrier cleaning head according to an embodiment of the present disclosure, the carrier cleaning head being disposed adjacent to the first wall, particularly outside the first vacuum chamber.

[0015] According to one embodiment, a method of maintaining a substrate processing system is provided. The method includes removing a plurality of brushes from two or more pairs of brushes of a cleaning head body of a carrier cleaning head; cleaning the plurality of brushes; and assembling the carrier cleaning head by providing cleaning brushes.

[0016] According to one embodiment, a method of manufacturing a device is provided. The method includes transporting a carrier supporting a substrate into a substrate processing system having a load lock chamber; trapping particles adhered to the carrier using a carrier cleaning head according to an embodiment of the present disclosure; and processing or depositing one or more thin film layers of the device. Description of the Drawings

[0017] For a more particular description of the features of the present invention as briefly summarized above, embodiments may be referred to, and the accompanying drawings are related to embodiments of the present invention and are described below:

[0018] Figure 1 A view showing a transport system for transporting a carrier according to an embodiment described herein;

[0019] Figure 2 A schematic cross-sectional view showing a carrier transport system that can be used in the embodiments described herein; and

[0020] Figure 3 A perspective view showing a roller assembly of a transport system according to an embodiment of the present disclosure, the transport system being, for example, Figure 1 or Figure 2 the transport system shown in and including a particle reduction device;

[0021] Figure 4A A perspective view of a roller assembly of a transport system according to an embodiment of the present disclosure, the transport system being, for example, Figure 1 or Figure 2 the transport system shown in

[0022] Figure 4B A perspective view of a roller assembly of a transport system according to an embodiment of the present disclosure, the transport system being, for example, Figure 1 or Figure 2 the transport system shown in

[0023] Figure 5 A schematic view of a particle reduction device according to an embodiment described herein, the device being particularly a particle removal device and having a brush for cleaning a carrier, a gas nozzle, and a suction inlet;

[0024] Figure 6 A schematic view of a particle reduction device according to an embodiment described herein, the device being particularly a particle removal device and having a brush for cleaning a carrier, a gas nozzle, and a suction inlet;

[0025] Figure 7A and Figure 7B A magnified view of a particle reduction device according to an embodiment described herein and being, for example, as shown in Figure 5 and / or Figure 6 ;

[0026] Figure 8 A part of a vacuum processing system including a particle trap according to an embodiment described herein, the particle trap including a roller having a trapping surface at a roller housing sleeve and a carrier cleaning head;

[0027] Figure 9 A flowchart illustrating a method of maintaining a substrate processing system according to an embodiment of the present disclosure, the method including replacing a brush of a carrier cleaning head and replacing a carrier housing sleeve having a trapping surface; and

[0028] Figure 10 A flowchart illustrating a method of manufacturing a device including a particle trap according to an embodiment of the present disclosure;

[0029] For the sake of facilitating understanding, wherever possible, the same reference numerals have been used to denote the same elements common to the various figures. It is contemplated that the elements disclosed in one embodiment may be beneficially used in other embodiments without specific recitation. Detailed Description

[0030] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the accompanying drawings. Generally, only differences regarding the respective embodiments are described. In addition, features that are described or illustrated as part of one embodiment can be used in other embodiments or in combination with other embodiments to yield still further embodiments. This specification is intended to embrace such modifications and variations.

[0031] According to embodiments of the present disclosure, apparatuses and methods are provided that can reduce the number of particles that can affect substrate processing. According to some embodiments, after particles are generated, the particles are trapped. According to further additional or alternative embodiments, after particles are generated, the particles are removed from a carrier and trapped. Compared with other concepts that aim to reduce particle generation, embodiments of the present disclosure relate to trapping particles after particle generation.

[0032] According to some embodiments, a method and apparatus for particle trapping during substrate transport in a PVD system are provided. Particles generated in a substrate transport system (e.g., rollers for supporting a carrier) are attracted to a predetermined location. Thus, particles can be prevented from falling on a substrate, such as a glass substrate. A mechanical trapping mechanism can be provided at the rolling contact area.

[0033] According to some embodiments, a method and apparatus for in-situ cleaning and removing particles from a carrier in a PVD system are provided. Particles adhered to, for example, a carrier can be removed from the carrier and attracted to a predetermined location. Thus, particles can be prevented from falling on a substrate, such as a glass substrate. For example, a cleaning device can be provided for removing particles from each moving carrier.

[0034] Thus, particle trapping can result in a reduction in the number of particles that can negatively affect substrate processing. Further, additionally or alternatively, maintenance can be simplified, and thus product maintenance time can be reduced. Since the particles are trapped at a predetermined location, the cleaning procedure during product maintenance can be simplified.

[0035] Figure 1 A carrier 10 supported by rollers 100 of a carrier transport assembly is shown. The carrier 10 can include a frame 12. For example, the frame 12 can include one or more frame bars. In addition, the carrier 10 can include a plurality of clamps 11. The clamps 11 support a substrate 13 at the carrier 10. According to some embodiments that can be combined with other embodiments described herein, the carrier 10 can include a rod 14. The rod 14 can have a cylindrical cross-section. According to some embodiments that can be combined with other embodiments described herein, the carrier can further include a rod or track, for example, a flat track. The rod, track, or rod is provided at one or more of the frame bars and is configured to contact one or more rollers 100 of the carrier transport assembly. In Figure 1In the example shown in , the bars, rails or rods are attached to the frame, for example by one or more connecting elements, such as connecting bridges.

[0036] The carrier transport assembly may include a plurality of rollers 100 . Figure 1 The roller 100 may support the weight of the carrier 10 or at least a portion of the weight of the carrier 10 (see also FIG. Figure 2 ). In addition, the roller 100 can be configured to transport the carrier along a transport direction. For example, the roller can be driven to rotate and / or move the carrier along the transport direction. The roller 100 includes a roller body 102. The roller body 102 is rotatable around an axis. In addition, the roller includes a substrate supporting surface 104. According to some embodiments, the substrate supporting surface 104 can be a cylindrical surface. According to further embodiments that can be combined with other embodiments described herein, the substrate supporting surface can be shaped as a concave surface. The concave substrate supporting surface 104 can correspond to the cylindrical shape of the rod 14, such as Figure 1 1. The substrate support surface shaped to include grooves (eg, grooves along the periphery of the roller body 102) can at least partially accommodate the rod or bar. Thus, the carrier 10 can be guided along the transport direction by the contact surface.

[0037] The roller 100 comprises a roller cover 110. The roller cover 110 surrounds at least a portion of the roller and in particular surrounds the substrate supporting surface 104 of the roller 100. The roller cover comprises a capture surface 112. Figure 1 Two capture surfaces 112 are shown. At least one capture surface of the roller cover 110 faces the roller and in particular the substrate support surface of the roller. The capture surface 112 can capture particles released from the roller. For example, the particles can be captured by magnetic forces, adhesives, mechanical labyrinths and / or electrostatic forces.

[0038] Figure 2 is a schematic cross-sectional view of a carrier transport system 200 including a track assembly 210 according to embodiments described herein. Figure 2 Schematic front view of a carrier transport assembly and a carrier according to embodiments described herein is shown. The carrier transport system 200 is configured to transport a carrier 10. The carrier may carry a substrate or a mask in a transport direction in a vacuum chamber. The transport direction (T) is perpendicular to Figure 1 The carrier 10 has a substantially vertical orientation V during transport (eg vertical orientation + / - 10°).

[0039] Some embodiments described herein relate to the concept of transporting a carrier in a "vertical or near - vertical orientation" or a substantially vertical orientation. In the context of the present disclosure, the vertical orientation of the carrier 10 means that the carrier 10 is aligned to extend in a direction generally parallel to the direction in which gravity is oriented, i.e., generally parallel to the vertical direction Y. A near - vertical orientation can be defined as an orientation that deviates from exact verticality (the latter being defined by gravity) by up to 15 degrees. In a vertical or near - vertical orientation, the carrier can support a substrate in a vertically erected or near - vertically erected orientation. Similarly, a substantially horizontal orientation can deviate from the horizontal direction by up to 15 degrees.

[0040] According to an embodiment described herein, the track assembly 210 includes a first passive magnetic unit 220 that extends in the transport direction T. As Figure 2 shown, the first passive magnetic unit is configured to be located on top of the carrier. The first passive magnetic unit 220 has a first magnetic pole and a second magnetic pole. According to an embodiment described herein, an apparatus for vacuum processing a substrate may include a carrier 10 configured to support a substrate or a mask. The carrier 10 may include a first passive magnetic unit 20 on top of the carrier as Figure 2 shown. The first passive magnetic unit 20 may have a first magnetic pole and a second magnetic pole. The magnetic poles of both the carrier and the track assembly may be vertically arranged or both may be horizontally arranged. Thus, lateral stability can be provided to the body. The first passive magnetic unit 20 of the carrier is configured to be magnetically coupled with the first passive magnetic unit 220 of the track assembly. For example, the north pole of the first passive magnetic unit of the track assembly may face the south pole of the first passive magnetic unit of the carrier and vice versa.

[0041] According to an embodiment described herein, the track assembly 210 includes a second passive magnetic unit 222 that extends in the transport direction T. The second passive magnetic unit 222 has a third magnetic pole and a fourth magnetic pole. The carrier 10 further includes a second passive magnetic unit 22 having a third magnetic pole and a fourth magnetic pole. The second passive magnetic unit 22 of the carrier is configured to be magnetically coupled with the second passive magnetic unit 222 of the track assembly. The third and fourth magnetic poles of the carrier are opposite poles to the third and fourth magnetic poles of the track assembly. Thus, the magnetic force between the second passive magnetic unit of the carrier and the second passive magnetic unit of the track assembly is an attractive force in a direction opposite to gravity.

[0042] As Figure 2 shown, the second passive magnetic unit 222 of the track assembly may be configured to be located on one side of the carrier 10 and coupled to one side of the second passive magnetic unit 22 of the carrier 10. The second passive magnetic unit 222 of the track assembly is configured to counteract at least 60% of the weight of the carrier and partially levitate the substrate carrier.

[0043] According to an embodiment described herein, the first passive magnetic unit of the track assembly and the second passive magnetic unit of the track assembly are configured to counteract at least the weight of the carrier or more weight. The magnetic levitation provided by coupling the first passive magnetic unit of the track assembly with the first passive magnetic unit of the carrier, together with the magnetic levitation provided by coupling the second passive magnetic unit of the track assembly with the second passive magnetic unit of the carrier, counteracts at least 70%, particularly at least 90%, more particularly 100% or more of the weight of the carrier.

[0044] According to an embodiment of the present disclosure, the weight of the carrier (particularly a carrier that is substantially vertically oriented) is supported by a first passive magnetic unit located at the top of the carrier, a second magnetic unit oriented towards the bottom of the carrier (i.e., vertically below the first passive magnetic unit), and rollers. The downward pulling force of the drive assembly is further counteracted by the first passive magnetic unit located at the top of the carrier, the second magnetic unit oriented towards the bottom of the carrier (i.e., vertically below the first passive magnetic unit), and the rollers.

[0045] During the processing of the substrate, the carrier can be heated. Thus, there is thermal expansion. Particularly for a vertically oriented or substantially vertically oriented substrate, where the substrate can have a vertical height of 1 meter or more or even up to several meters (i.e., a large-area substrate), the thermal expansion can be significant. Therefore, it is beneficial if the second passive magnetic unit (i.e., the passive magnetic unit located below the first passive magnetic unit at the top of the carrier) counteracts most of the weight of the carrier. The amount of thermal expansion at the location of the second passive magnetic unit is less than the amount of thermal expansion adjacent to the first passive magnetic unit. Therefore, the supporting force of the passive magnetic unit is less affected by the thermal expansion at the location of the second passive magnetic unit.

[0046] Figure 2 The second passive magnetic unit is shown at a vertical position between the roller and the first passive magnetic unit. According to some embodiments that can be combined with other embodiments described herein, the second passive magnetic unit can also be vertically disposed below the roller. The second passive magnetic unit and the roller can be vertically close to each other to reduce the influence of thermal expansion. For example, the second passive magnetic unit and the roller can have a vertical distance that is 20% or less of the vertical dimension of the carrier, particularly 10% or less of the vertical dimension of the carrier, more particularly 5% or less of the vertical dimension of the carrier.

[0047] According to an embodiment described herein, the carrier 10 has a first track, such as a top track 204, which is configured to contact an upwardly oriented portion of the substrate support surface of at least one of the plurality of rollers 100. The carrier 10 further includes a second track, such as a bottom track 206. The second track may be configured to contact a downwardly oriented portion of the substrate support surface of at least one of the plurality of rollers 100. According to some embodiments that may be combined with other embodiments described herein, a gap may be provided between the second track and the bottom of the roller. For example, the gap may be 1 mm or less, such as 0.5 mm or less or even less than 0.3 mm. The distance between the first track and the second track is slightly larger than the diameter of the roller, such as 1 mm or less larger, such as 0.5 mm or less, or even less than 0.3 mm.

[0048] According to an embodiment described herein, the resultant downward pulling force generated by weight, magnetic levitation force, the drive assembly 230, and the third passive magnetic unit may be 30% or less of the weight of the carrier, such as 20% or less, such as 10% or less. The resultant force is supported by at least one of the plurality of rollers 100. The top of at least one of the plurality of rollers is configured to contact the first track to be able to compensate for the resultant force. At least one of the plurality of rollers 100 bears the resultant force and overcomes the instability of the magnet in the vertical direction. The minimized contact surface between the carrier and the track assembly and the minimized weight on the rollers significantly reduce the particles generated due to transportation. In the case where an upward resultant force is generated during, for example, certain operating conditions, the carrier may contact the second track, such as the bottom track 206. The roller jacket 110 is shown by a dashed line in Figure 2 which. The roller jacket may be disposed before and / or in front of the roller body 102 in the transportation direction and is thus shown by a dashed line.

[0049] Embodiments of the present disclosure having a roller jacket with a trapping surface provide a particle trapping function that allows particles to be trapped in situ at a predetermined position, i.e., the trapping surface. The trapping surface is provided at the roller jacket or the roller housing. Thus, when replacing the roller jacket or the roller housing during product maintenance, the particles can be removed from the substrate processing system. Experiments may show that 80% or more of the particles generated on the roller can be trapped at the roller jacket. In addition, particle trapping at the roller can be provided under atmospheric conditions and vacuum conditions. According to some embodiments that may be combined with other embodiments described herein, the trapping concept may include magnetic trapping, adhesion trapping, such as by an adhesive, and mechanical labyrinth trapping, where the mechanical labyrinth prevents the particles from escaping. Thus, the particles that may affect substrate processing can be reduced. In addition, the particles being trapped at a predetermined position at the roller jacket results in less workload during product maintenance.

[0050] Figure 3The roller 100 is shown. The roller 100 has a roller body 102, and the roller body 102 has a substrate support surface 104. A roller housing 110 surrounds at least a portion of the roller and provides a trap for particles. For example, particles can be generated during contact of the track of the carrier with the substrate support surface 104 of the roller body 102. As Figure 3 exemplarily shown in, some embodiments of the present disclosure provide a magnetic trap for ferromagnetic particles. The roller sleeve 100 includes one or more trapping surfaces 112. At least a first surface portion faces the roller body 102. The roller sleeve can include, for example, a magnet housing having a plurality of openings 312 and 314. A magnet 320 is provided in the magnet housing. For example, the magnet 320 can be a permanent magnet having a magnet surface.

[0051] According to some embodiments that can be combined with other embodiments described herein, the magnet housing can be made of a magnetic material, particularly a ferromagnetic material. Thus, the magnet 320 is fixed relative to the magnet housing 315. Therefore, vibrations during the operation of the carrier transport assembly do not cause movement of the magnet 320 within the magnet housing 315. Particles are not released from the particle trap due to unwanted movement.

[0052] Particles released during contact between the substrate support surface 104 and the track or bar of the carrier are trapped by the magnet and the magnet housing. In particular, ferromagnetic particles can be attracted by the attraction of the permanent magnet. According to some embodiments that can be combined with other embodiments described herein, the roller sleeve can include a first magnet housing and a first magnet on a first side of the roller along the transport direction T, and a second magnet housing and a second magnet on a second side of the roller along the transport direction T. The upper and lower sides of the roller are not surrounded by the roller sleeve to allow the substrate support surface for the top and bottom tracks of the carrier.

[0053] Figure 3 The magnet housing 315 shown in includes a first side and a second side facing the transport direction T. The openings 312 can be provided at the first side and the second side. In particular, the openings 312 are provided on the side of the respective magnet housing facing the roller body 102. The first side and the second side can be the vertical sides of the magnet sleeve. According to some embodiments that can be combined with other embodiments described herein, additional openings 314 can be provided in the magnet housing at a third side and a fourth side of the magnet housing. The third side can be provided between the first side and the second side. The fourth side can be provided between the first side and the second side. The third side and the fourth side of the respective magnet housing can be the horizontal sides.

[0054] According to some embodiments, which can be combined with other embodiments described herein, the capture surface can include the magnet surface of the magnet 320 and can include the surface of the magnet housing. Particularly for a ferromagnetic magnet housing, the magnetic attraction force generated by the magnet 320 is also provided by the surface of the magnet housing. The openings 312 and the additional openings 314 allow the capture of particles that are released from the roller during roller rotation due to the centripetal force of the particles present at the roller during roller rotation. The test duration of the roller sleeve having the capture surface is equivalent to 1 1 / 2 years of operation of the carrier transport assembly has demonstrated effective particle capture, particularly for the capture of ferromagnetic particles having a magnetic attraction force. For example, according to an embodiment of the present disclosure, during the test of the roller sleeve, approximately 80% of the particle amount can be captured.

[0055] According to one embodiment, a roller for a carrier transport assembly is provided. The roller includes a roller body and a roller sleeve, the roller body is rotatable and has a substrate support surface, and the roller sleeve surrounds at least a portion of the roller. The roller further includes a capture surface of the roller sleeve, the capture surface having at least a first surface portion facing the roller. For example, the capture surface includes a magnet housing. The magnet housing can be configured to accommodate a magnet, particularly a permanent magnet. According to some embodiments, which can be combined with other embodiments described herein, the magnet housing can include a plurality of openings and / or the magnet housing can be made of a magnetic material, particularly a ferromagnetic material.

[0056] Furthermore, additionally or alternatively, the capture surface can include the magnet surface of a permanent magnet. According to some embodiments, which can be combined with other embodiments described herein, the roller sleeve can include a first magnetic trap at a first radial orientation of the roller and a second magnetic trap at a second radial orientation of the roller, wherein the second radial orientation is different from the first radial orientation. The roller sleeve surrounds at least a portion of the roller, for example, by having two or more magnetic traps on different sides of the roller and / or by having a capture surface that partially surrounds the substrate support surface of the roller body.

[0057] According to some embodiments, which can be combined with other embodiments described herein, additionally or alternatively, the capture surface can include an adhesive, and an electrostatic surface, and / or a mechanical maze for capturing particles at the roller sleeve. FIG. 4 shows a roller 100 having a roller sleeve 110. The roller body has a substrate support surface 104. A portion of the roller sleeve is provided with a capture surface including an adhesive. According to some embodiments, which can be combined with other embodiments described herein, the adhesive can be an adhesive pad (i.e., a sticky pad), a tape, or another adhesive. According to an embodiment of the present disclosure, for one roller of the carrier transport assembly, the capture surface can have 50 cm 2or more area. For example, by bringing 5 to 15 rollers into contact with a carrier configured to support a substrate, a capture surface of 250 cm 2 to 750 cm 2 can be provided.

[0058] According to some embodiments that can be combined with other embodiments described herein, a vacuum-compatible grease can be provided as the capture surface of the roller casing. Utilizing a vacuum-compatible grease allows for good desorption characteristics for substrate processing under vacuum conditions.

[0059] Figure 4A A roller having a roller casing is shown, which can be beneficially used in a carrier transport assembly as shown in Figure 1 . For a carrier transport assembly as shown in Figure 2 , a roller 100 as shown in Figure 4B can be used. The roller casing includes a first portion on a first side of the roller body 102 and a second portion on an opposite side of the roller body 102. Substrate support surfaces 104 are provided on the upper and lower portions of the roller body 102 to contact the upper and lower tracks of the carrier. A capture surface 112, for example having an adhesive (such as a vacuum-compatible grease), can be provided at a portion of the capture surface facing the roller body 102.

[0060] Embodiments of the present disclosure relate to capturing particles at a predetermined position in a substrate processing system. The capture of particles reduces the number of particles affecting substrate processing. Additionally or alternatively, capturing particles at a predetermined position reduces the maintenance workload because the particles can be removed by cleaning the capture position. Some embodiments of the present disclosure relate to a roller having a roller casing with a capture surface. In particular, particles generated at the contact surface between the roller and the carrier can be captured by the roller casing. According to additional or alternative embodiments, particles adhered to the carrier can be captured. For example, the particles can be captured before the carrier enters a vacuum processing system, i.e., when the carrier is transported into the load lock chamber of the substrate processing system.

[0061] According to one embodiment, a carrier cleaning head for cleaning a carrier moving along a transport direction is provided. The carrier cleaning head includes a cleaning head body having a first conduit and a second conduit and two or more pairs of brushes, each pair of brushes having a first brush extending in a first direction and a second brush extending in a second direction opposite to the first direction, and the pairs of brushes are arranged along the transport direction. The carrier cleaning head includes a first opening assembly that is in fluid communication with the first conduit and is configured to provide a purifying gas; and a second opening assembly that is in fluid communication with the second conduit and is configured for particle removal.

[0062] Figure 5 shows a carrier cleaning head 500, particularly a carrier cleaning head for a carrier as exemplarily shown in Figure 2 The carrier 10 includes a top track 204 and a bottom track 206. A part 504 of the carrier body is disposed between the top track 204 and the bottom track 206, specifically located between the tracks in the vertical direction. Particles that may adhere to the carrier, particularly particles adhering to the carrier tracks, can be removed from the carrier by the carrier cleaning head 500. Carrier cleaning is provided when the carrier is transported past the carrier cleaning head.

[0063] According to an embodiment of the carrier cleaning head, a combination of brushing, purging, and suction for particle removal is incorporated. For example, purging can be provided as purging with clean dry air (CDA), i.e., provided as CDA purging. According to some embodiments that can be combined with other embodiments described herein, a cascaded cleaning concept with multiple brushes (particularly multiple pairs of brushes) can be provided. A pair of brushes can include a first brush or first brush pad for the top track 204 and a second brush or second brush pad for the bottom track 206. The cascaded arrangement of the carrier cleaning head provides two or more brushes or pairs of brushes along the transport direction of the carrier. According to some embodiments that can be combined with other embodiments described herein, four, six, or eight flat brushes can be provided in two rows (e.g., an upper row and a lower row). One or more openings for particle removal allow the capture of particles, for example, through suction ports. The number of particles affecting substrate processing can be reduced, and the workload of product maintenance can be reduced.

[0064] Figure 5 shows a carrier cleaning head 500, the carrier cleaning head including a cleaning head body 510. The cleaning head body 510 supports a first brush 522 and a second brush 524. The first brush and the second brush form a pair of brushes 520. The first brush is guided to clean the top track 204. The second brush is guided to clean the bottom track 206. The cleaning head body 510 includes a first conduit 512. The first conduit 512 is connected to a gas line 518 for providing a purging gas. The purging gas can be, for example, CDA purging gas. The cleaning head body further includes a second conduit 514. The second conduit 514 is configured for removing particles and is connected to a suction port 519. For example, the suction port 519 can be connected to a pump.

[0065] The carrier cleaning head provides an in - situ method for cleaning a carrier, particularly for removing particles adhering to the carrier. In - situ cleaning is provided for a moving carrier. Particles are captured. The cleaning head body 510 can be disposed in a system and can be provided for an existing system without affecting production processing.

[0066] According to some embodiments, which can be combined with other embodiments described herein, the carrier cleaning head provides multiple pairs of brushes. For example, two pairs, three pairs, four pairs, or five pairs of brushes can be provided along the transport direction of the carrier. The pairs of brushes are provided in a cascaded arrangement.

[0067] Figure 6 A detailed view of a portion of the carrier cleaning head is shown. The cleaning head body 510 is spaced apart from the top rail 204 of the carrier by a gap Gl. Similarly ( Figure 6 not shown in the figure), the cleaning head body 510 is spaced apart from the bottom rail 206 by a gap. According to some embodiments, which can be combined with other embodiments described herein, the cleaning head body is further spaced apart from a portion 504 of the carrier disposed between the top rail and the bottom rail of the carrier. Figure 6 A gap G2 is shown, which depicts the space between the cleaning head body 510 and the portion 504 of the carrier. According to some embodiments, one or more further openings 622 can be provided in the cleaning head body. The one or more further openings 622 face the portion 504 of the carrier and are in fluid communication with a second conduit for particle removal.

[0068] The spokes 620 or bristles of the brush are inclined with respect to the vertical orientation and the horizontal orientation. The inclination is shown by Figure 6 the angle α in the figure. For example, the angle α can be between 30° and 75°. The length of the spoke 620 is longer than the gap Gl, particularly longer than the gap Gl along the spoke direction. Thus, the spoke provides pressure to the carrier rail. According to some embodiments, which can be combined with other embodiments described herein, the spokes and / or the brush of the brush are compressed. The length of the spoke that can provide an overlap depth without compromising the spoke can result in an overlap depth of 2 mm or more. The inclination of the spoke further provides cleaning of the carrier rail in the region of the gap G2 between the cleaning head body 510 and the portion 504 of the carrier. For example, the portion 504 of the carrier can extend vertically and / or parallel to the substrate support surface of the carrier. Due to the inclination of the spokes of the brush, the brush can reach the corner between the carrier rail and the body of the carrier (e.g., at the portion 504 of the carrier) for particle removal. According to some embodiments, which can be combined with the embodiments of the present disclosure, the gap Gl and the gap G2 can be between 3 mm and 6 mm.

[0069] According to some embodiments, the spokes of the pair of brushes or the bristles of the pair of brushes may be inclined relative to the transport direction and relative to the direction perpendicular to the transport direction. Additionally or alternatively, the first brush of a pair of brushes is arranged on a first side of the cleaning head body, for example, arranged on the top side and facing the top guide rail of the carrier. The second brush of a pair of brushes is arranged on a second side of the cleaning head body, for example, arranged on the bottom side, that is, the second side opposite to the first side and facing the bottom guide rail of the carrier. The cleaning head body may further include a third opening assembly having one or more third openings (i.e., one or more further openings 622) arranged on a third side of the carrier head body, and the third side is arranged between the first side and the second side.

[0070] According to another embodiment that can be combined with other embodiments described herein, the brush may be made of a conductive material or coated with a conductive material. The brush may include a brush pad and spokes attached to the brush pad. By having a conductive material or a conductive coating, electrostatic discharge (ESD) during brushing can be reduced or avoided. The spokes, i.e., the bristles of the brush, have antistatic properties. According to some embodiments, the brush pad may include a conductive material, such as aluminum, etc.

[0071] Figure 7A and Figure 7B Shows a part of the cleaning head body 510. A plurality of brushes 522 are arranged along the transport direction T. Thus, when the carrier moves along the carrier cleaning head, a part of the track, rod or bar of the carrier is subsequently cleaned by the brushes. The brush includes a brush pad 722 and spokes 724. For example, two rows of spokes may be attached to one brush pad. The spokes of adjacent rows of spokes may be offset relative to each other. The entire surface of the track can be cleaned.

[0072] The carrier cleaning head includes a first opening assembly having an opening 710. The opening 710 is in fluid communication with a first conduit and provides a purifying gas in the direction of the brushing area. The first opening assembly may be disposed between the first brush 522 and the second brush 524, particularly along the transport direction. Figure 7A Shows a top view of the carrier cleaning head. The corresponding brushes and the corresponding openings 710 are provided on the bottom side of the cleaning head body 510. According to an embodiment of the present disclosure, the top-side brush and the corresponding bottom-side brush form a pair of brushes.

[0073] The carrier cleaning head includes a second opening assembly having an opening 712. The opening 712 is in fluid communication with a second conduit. The second conduit may be connected to a suction port for removing particles during the cleaning of the carrier. The opening 712 of the second opening assembly may be arranged between the brushes along the transport direction. Additionally or alternatively, the opening 712 may be arranged between multiple rows of spokes at one brush 522. AsFigure 6 As exemplarily shown, one or more third openings 622 may be provided, such as as vertical slits, to remove particles adhering to the vertical plane of the carrier (i.e., the portion of the carrier between the top track and the bottom track).

[0074] As Figure 7B As shown, the brush 522 can be removed from the cleaning head body 510. The brush pad 722 of the brush 522 can be connected to the cleaning head body 510 through a clamping mechanism, which can be based on screws, for example. During maintenance, the carrier cleaning head with three pairs of brushes can be maintained by removing six brushes and replacing them with cleaned or new brushes.

[0075] As described above, the carrier cleaning head includes a first opening assembly that is in fluid communication with a first conduit and is configured to provide a purifying gas; and a second opening assembly that is in fluid communication with a second conduit and is configured for particle removal. According to some embodiments, the first opening assembly and the second opening assembly can be arranged between two brushes along the transport direction. The first opening assembly can be oriented to direct the purifying gas to at least one of two or more pairs of brushes. A pair of brushes can include two brush pads removably coupled to the cleaning head body. Additionally or alternatively, each brush in a pair of brushes includes multiple rows of spokes, and the multiple rows of spokes are offset from each other in a direction perpendicular to the transport direction.

[0076] The carrier cleaning head according to an embodiment of the present disclosure provides a small distance of the opening of the first opening assembly relative to the workpiece to be cleaned. Thus, even for a relatively low flow rate, the ratio of the flow rate of the purifying gas at the nozzle or opening to the distance can be relatively high. For example, the distance from the opening of the first opening assembly to the workpiece can be 15 mm or less. Thus, at a relatively low flow rate, the ratio of the flow rate to the distance can be 330 [1 / s] or greater. The consumption of the purifying gas (e.g., CDA) can be reduced. In addition, the ratio between the purifying gas flow rate and the suction capacity can be increased. Having a higher suction capacity compared to the purifying air flow increases the cleaning effect. For example, the suction capacity can be between 200 m 3 / h and 300 m 3 / h. According to some embodiments that can be combined with the embodiments described herein, the suction capacity can be at least twice, particularly at least three times, the purifying gas flow rate.

[0077] The carrier cleaning head according to an embodiment of the present disclosure combines brushing, purifying, and suction to remove particles from the track surface of the carrier track. For example, using CDA and suction for purification, particles can be continuously removed, and brush cooling can be further achieved.

[0078] Figure 8Illustrates a substrate processing system 800. The substrate processing system 800 includes a front-end module 802. The front-end module provides a carrier and a substrate to one or more vacuum chambers of the substrate processing system, respectively. Figure 8 Illustrates a first vacuum chamber 804 as a load lock chamber. In addition, a second vacuum chamber 806 is provided as a production chamber or a processing chamber. One or more carriers are removed from the front-end module 802 into the load lock chamber. In Figure 8 an example, a carrier 10 is shown. In addition, in Figure 8 an example, a substrate processing station 850 or a substrate processing tool is shown. For example, the processing module may be a deposition source, such as a PVD source, such as a rotatable sputtering cathode. According to other embodiments, the substrate processing station 850 may include a chemical vapor deposition (CVD) source, a heater, an etching tool, or other processing tools.

[0079] The carrier track has an area exposed in the horizontal direction and shows a risk of collecting loose particles. A carrier cleaning head 500 is shown at the exit of the front-end module 802. The carrier cleaning head 500 may be adjacent to the entrance to the load lock chamber (i.e., the first vacuum chamber 804). The carrier cleaning head may be provided under atmospheric conditions, i.e., outside the first vacuum chamber 804. Before the carrier enters the vacuum chamber of the substrate processing system 800, the carrier (and in particular one or more carrier tracks, rods, or bars) is cleaned by the carrier cleaning head 500. The carrier may be cleaned in-situ, i.e., while inside the substrate processing system. According to some embodiments, the position of the carrier cleaning head may be adjusted relative to the transport assembly of the vacuum processing system. For example, the position may be adjusted vertically and horizontally perpendicular to the transport direction T.

[0080] According to one embodiment, a substrate processing system is provided. The substrate processing system includes a first vacuum chamber having a first wall. A carrier cleaning head according to an embodiment of the present disclosure is arranged adjacent to the first wall of the first vacuum chamber and in particular outside the vacuum chamber. For example, a carrier transport assembly may be provided, wherein the carrier transport assembly is configured to transport a carrier having a top track and a bottom track along a transport direction. The cleaning head body is vertically away from the top track and vertically away from the bottom track, and wherein the cleaning head body is horizontally away from the carrier in a horizontal direction different from the transport direction.

[0081] The substrate processing system may further include a pump 820 in fluid communication with a second conduit of the carrier cleaning head. In addition, a gas source 822, such as for CDA, may be provided in fluid communication with a first conduit of the carrier cleaning head. The gas source may be a gas tank or a gas line of a factory for substrate processing.

[0082] Figure 8 A carrier transport assembly is shown that includes a plurality of rollers 100 located in a first vacuum chamber 804 and a second vacuum chamber 806. Exemplarily, the rollers 100 in the first vacuum chamber include a roller sleeve having a trapping surface. The carrier transport assembly may include rollers according to embodiments of the present disclosure. Figure 8 Exemplarily shown is the roller sleeve 110 in the first vacuum chamber 804. Rollers according to embodiments of the present disclosure may be disposed in each vacuum chamber of the substrate processing system.

[0083] Figure 8 A substrate processing system 800 is shown that includes a carrier cleaning head according to embodiments of the present disclosure and a carrier transport assembly having rollers according to the present disclosure. According to some embodiments that may be combined with other embodiments described herein, particle trapping using the carrier cleaning head and particle trapping using the trapping surface of the roller sleeve may be provided separately from each other or in combination with each other.

[0084] According to one embodiment, a substrate processing system including a carrier transport assembly is provided. The carrier transport assembly includes a plurality of rollers arranged along a transport direction. Each of the plurality of rollers may be a roller according to embodiments of the present disclosure. The substrate processing system may include a vacuum chamber in which the plurality of rollers are disposed. Additionally, the substrate processing system may include one or more substrate processing stations 850.

[0085] According to some embodiments, in physical vapor deposition (PVD) tools (such as AKT Pivot and NewAristo from Applied Materials Inc.), a substrate carrier moves on a carrier transport assembly, where the rods or tracks of the carrier move on a roller arrangement. During system operation, particles may be generated due to friction between the roller arrangement and the carrier. The particles may accumulate on the rods of the substrate carrier or may cause deterioration of substrate processing in the vacuum chamber. The particles accumulated on the carrier are transported through the system and may circulate in the system. Eventually, due to air flow patterns, such as during exhaust and pumping of a vacuum chamber such as a load lock chamber, or due to electrostatic and / or dynamic effects, the particles may reach the flat substrate.

[0086] Figure 9A method of maintaining a substrate processing system is shown. At operation 902, maintenance begins. At operation 912, a plurality of brushes or brush pads of two or more pairs of brushes are removed from a cleaning head body of a carrier cleaning head, respectively. The plurality of brushes may be cleaned, or the brushes may be replaced with new (e.g., cleaned brushes). At operation 914, the carrier cleaning head is assembled by providing cleaned brushes to the carrier cleaning head. In an additional or alternative maintenance process, as shown at operation 922, a plurality of roller sleeves may be removed from a plurality of rollers of a carrier transport assembly. For each of the plurality of roller sleeves, a trapping surface of the roller sleeve may be cleaned or removed. At operation 924, the plurality of rollers are assembled by providing a roller sleeve for each roller. For example, a cleaned roller sleeve may be provided, either a new roller sleeve or a previously cleaned roller sleeve.

[0087] Figure 9 Brush replacement and roller sleeve replacement are shown as separate maintenance processes. The two maintenance processes may be provided separately from each other, or both maintenance processes may be provided.

[0088] Figure 10 A method of fabricating a device in a substrate processing system is shown. For example, the device may be a display. The display may be fabricated on a large area substrate of GEN 4.5 generation or higher generations, particularly in a PVD substrate processing system. At operation 950, a carrier supporting a substrate is transported into a substrate processing system having a load lock chamber. According to an embodiment of the present disclosure, particles adhering to the carrier may be trapped by a carrier cleaning head. This is illustrated by operation 952. The substrate processing system includes a carrier transport assembly having a plurality of rollers. The transport includes rotation of a roller body of each roller. At operation 954, particles generated at the rollers are trapped in a roller sleeve having a trapping surface. At operation 956, one or more thin film layers of the device may be processed or deposited in the substrate processing system. Figure 10 Trapping of particles adhering to the carrier and trapping of particles generated during carrier transport are shown. According to an embodiment of the present disclosure, the two trapping mechanisms may be provided separately from each other or in combination.

[0089] According to an embodiment, in-situ removal of particles can reduce particles that may adhere to a production sheet or substrate before and after deposition, as well as continuous particle-induced defect formation and yield loss.

[0090] Embodiments of the present disclosure further provide one or more of the following advantages. Particles generated in or potentially transferred to a substrate processing system are trapped. Accordingly, the number of particles that may negatively impact substrate processing is reduced. Additionally, particle trapping is provided at a predetermined location such that product maintenance can be simplified because the particles can be removed from the predetermined location during product maintenance. Cleaning efficiency is improved by providing an improved ratio of purge gas flow rate to the nozzle distance of the purge gas opening to the cleaning location. The purge gas flow rate can be reduced, which further affects the ratio between the amount of purge gas and the suction amount to improve cleaning efficiency. A trapping surface provided at the roller sleeve (i.e., a trapping surface adjacent to particle generation) can reduce the distribution of particles in the substrate processing system.

[0091] While the foregoing relates to embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope of the invention is determined by the appended claims.

Claims

1. A roller for a carrier transport assembly, comprising: A roller body, the roller body being rotatable and having a substrate support surface, wherein the substrate support surface contacts the track of the carrier during transportation of the carrier using the roller; A roller housing, the roller housing surrounding at least a portion of the roller; And A capture surface of the roller housing, the capture surface having at least a first surface portion facing the substrate support surface to capture particles released from the roller.

2. The roller according to claim 1, further comprising: A magnet housing, the magnet housing including the capture surface.

3. The roller according to claim 2, wherein the magnet housing includes a plurality of openings.

4. The roller according to claim 2, wherein the magnet housing is made of a magnetic material.

5. The roller according to claim 3, wherein the magnet housing is made of a magnetic material.

6. The roller according to claim 1, wherein the capture surface includes a magnet surface of a permanent magnet.

7. The roller according to any one of claims 2 to 6, wherein the roller housing includes: A first magnetic trap at a first radial orientation of the roller; and A second magnetic trap at a second radial orientation of the roller, the second radial orientation being different from the first radial orientation, wherein the magnet housing is included in the first magnetic trap or the second magnetic trap.

8. The roller according to claim 1, wherein the capture surface includes: An adhesive, a mechanical maze, and / or an electrostatic surface.

9. The roller according to claim 8, wherein the adhesive is an adhesive pad disposed on the surface of the roller housing.

10. A substrate processing system, comprising: A carrier transport assembly, comprising: A plurality of rollers, the plurality of rollers being arranged along the transport direction of the carrier transport assembly, each roller of the plurality of rollers being the roller according to any one of claims 1 to 9.

11. The substrate processing system according to claim 10, further comprising: A vacuum chamber, wherein the plurality of rollers are disposed within the vacuum chamber; and A substrate processing station for processing substrates.

12. The substrate processing system according to any one of claims 10 to 11, further comprising: A load lock chamber, and A carrier track cleaner adjacent to the load lock chamber.

13. A method of maintaining a substrate processing system, comprising: Removing a plurality of roller housings from a plurality of rollers of a carrier transport assembly, wherein each of the plurality of rollers has a substrate support surface that contacts the track of the carrier during transportation of the carrier using the plurality of rollers; Cleaning or removing a capture surface of each of the plurality of roller housings, wherein the capture surface has at least a first surface portion facing the substrate support surface to capture particles released from the plurality of rollers; And Assembling the plurality of rollers by providing a roller housing for each of the rollers.

14. The method according to claim 13, further comprising: Removing a plurality of brush pads from a carrier cleaning head.

15. A method of manufacturing a device, comprising: Transporting a carrier supporting a substrate using a carrier transport assembly having a plurality of rollers, the transport including rotating a roller body of each of the rollers, wherein the roller body has a substrate support surface that contacts a track of the carrier during transport of the carrier using the roller; Trapping particles generated at the roller in a roller casing having a trapping surface, wherein the trapping surface has at least a first surface portion facing the substrate support surface to trap particles released from the roller; and Processing or depositing one or more thin film layers of the device.

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