Solar energy cleaning-free high-temperature cloth preparation pasting and cutting device

Abstract

The application discloses a solar energy cleaning-free high-temperature cloth preparation sticking and cutting device, which comprises a conveying roller for conveying the high-temperature cloth, a rubber belt discharging roller for conveying the rubber belt and a cutting assembly for sticking the rubber belt and the high-temperature cloth. The application relates to the technical field of high-temperature cloth preparation. The solar energy cleaning-free high-temperature cloth preparation sticking and cutting device continuously removes glue on both sides of the rubber belt, prevents glue on both sides of the rubber belt from overflowing to cover both sides of the high-temperature cloth in the subsequent processing or conveying process, causes glue overflow to reduce the quality of the finished product, causes the cloth surface assembly position to be stuck to the layer super-high adhesive belt, each layer is subjected to a hot processing technology in the sticking process to be more firmly adhered to the high-temperature cloth, if dirt appears at the sticking position during use, the stuck rubber belt can be torn off a layer, a large amount of manpower does not need to be spent for cleaning during use, and the service life of the high-temperature cloth can be prolonged.

Description

Technical Field

[0001] This invention relates to the field of high-temperature fabric preparation technology, specifically to a device for preparing, bonding, and cutting solar-powered, wash-free high-temperature fabric. Background Technology

[0002] Solar cells are devices that convert solar radiation into electricity. They represent a high-tech advancement in solar energy development and are a new type of specialized power source. The principle of solar power generation utilizes the quantum effect of semiconductors such as silicon to directly convert visible sunlight into electrical energy. However, silicon's photoelectric conversion efficiency decreases when directly exposed to the atmosphere, so the cells must be encapsulated. A composite solar cell encapsulation film using white EVA and glass fiber cloth encapsulates the white EVA layer and glass fiber cloth.

[0003] During the production of solar modules, a large amount of EVA glue will flow out around the perimeter. EVA glue is very sticky and easily sticks to the cloth. If it is not cleaned in time, it will cause dirt to appear on the module and affect the quality of the module. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a solar-powered, wash-free, high-temperature fabric preparation, bonding, and cutting device, which solves the aforementioned problems.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solution: a solar-powered, washable, high-temperature cloth preparation, bonding, and cutting device, comprising a conveying roller for conveying the high-temperature cloth, a tape discharge roller for conveying the tape, and a cutting assembly for bonding the tape and the high-temperature cloth. The cutting assembly includes a de-adhesive mechanism for removing adhesive from the tape, a cutting mechanism for cutting the tape, a guiding mechanism for guiding the tape, and a forming mechanism for hot-pressing the tape and the high-temperature cloth.

[0006] The tape adheres to the surface of the high-temperature cloth. The adhesive removal mechanism is used to scrape off 2-3cm of EVA adhesive on both sides of the tape. The cutting mechanism is used to cut the tape and cut easy-tear sections on the tape.

[0007] The adhesive removal mechanism includes a fixed plate and a rotating roller disposed on one side of the adhesive tape. Adhesive sections are fixedly connected to both ends of the rotating roller. A guide frame is fixedly connected to the bottom of the fixed plate, and a scraper is slidably connected to one side of the guide frame. One side of the scraper abuts against the surface of the adhesive section. A return spring is fixedly connected to the bottom of the fixed plate, and one end of the return spring is fixedly connected to the top of the scraper. The adhesive tape is conveyed through the adhesive sections at both ends of the rotating roller, adhering the adhesive on both sides. Then, as the adhesive sections rotate, the tape moves to the rear, where the scraper scrapes off the adhesive above the adhesive section for cleaning. Due to the return spring, when the scraper wears down, the return spring pushes the scraper downwards on one side of the guide frame, causing the scraper to... Maintaining constant contact with the adhesive section allows for continuous removal of adhesive from both sides of the tape, preventing glue overflow during subsequent processing or transportation. This prevents the high-temperature cloth from being covered in glue, which would reduce the quality of the finished product. High-strength fiberglass cloth is produced with expanded microspheres added during manufacturing. After production, 4 to 5 layers of ultra-high adhesion tape are applied to the fabric components. Each layer undergoes a heat treatment process during application to ensure a strong bond. If dirt appears at the application point, simply peel off a layer of tape to clean the fabric. This reduces the need for extensive cleaning and extends the lifespan of the high-temperature cloth.

[0008] As a further aspect of the present invention: the tape has multiple layers, and the tear-resistant sections are staggered; multiple cutting components are provided for layering and pasting the multi-layer tape.

[0009] As a further aspect of the present invention: one side of the scraper is provided with an inclined surface that gradually slopes from the middle to both sides. When in use, the glue on the adhesive section is scraped off by the scraper and then guided to both sides by the inclined surface for discharge.

[0010] As a further aspect of the present invention: the cutting mechanism includes a receiving plate and a track frame respectively disposed on both sides of the tape. The track frame is connected to a laser cutting head for cutting the tape. The laser cutting head moves up, down, left, and right on the track frame to cut the tearable section into shape. The laser is received by the receiving plate to prevent damage to other components. The cutting is convenient and the shape can be quickly adjusted.

[0011] As a further aspect of the present invention: the guiding mechanism includes a guide roller, the inner cavity of which is provided with a vacuum groove communicating with an external vacuum pump, and the surface of which is provided with a vacuum hole communicating with the inner cavity of the vacuum groove. In use, the vacuum pump evacuates the vacuum groove, and the smooth surface of the tape is adsorbed through the vacuum hole to guide the tape. The tape is then adjusted to an angle and guided above the high-temperature cloth so that it overlaps with the high-temperature cloth for heat pressing. The tape, after being cut by the cutting mechanism, hangs vertically downward and is adsorbed by the vacuum hole.

[0012] As a further embodiment of the present invention: the forming mechanism includes a temperature regulating roller and a temperature regulating box disposed above the high-temperature cloth, and a receiving roller disposed below the high-temperature cloth. The inner cavity of the temperature regulating box is divided into temperature regulating chambers by a partition plate. The inner cavity of the partition plate is fixedly connected to a semiconductor cooler that extends to the two temperature regulating chambers respectively. The inner cavity of the temperature regulating chamber is filled with a heat-conducting liquid. The inner cavity of the temperature regulating chamber is connected to the temperature regulating roller through a heat-conducting pipe. The semiconductor cooler operates to heat and cool in the two temperature regulating chambers respectively. Then, the heat-conducting liquid is transported to the receiving roller respectively through the heat-conducting pipe for temperature regulation.

[0013] As a further aspect of the present invention: the cooling end of the semiconductor cooler is located in the temperature regulating cavity on the left, and the heating end of the semiconductor cooler is located in the temperature regulating cavity on the right. The left and right arrangement first heats and pressurizes the tape and high-temperature cloth, and then cools and shapes them quickly through refrigeration.

[0014] As a further embodiment of the present invention: the cutting mechanism is located below the adhesive removal mechanism, the guiding mechanism is located below the cutting mechanism, and the forming mechanism is located diagonally behind the guiding mechanism.

[0015] The tape output roller outputs the tape, which is conveyed through adhesive sections at both ends of the rotating roller. The adhesive sections adhere the adhesive from both sides, and the tape moves to the rear as the adhesive sections rotate. A scraper scrapes off the adhesive from the top of the adhesive sections for cleaning. A return spring is in place; when the scraper wears down, it pushes the scraper downwards on one side of the guide frame, keeping it in contact with the adhesive sections for continuous adhesive removal. A laser cutting head moves up, down, left, and right on the track frame to cut the tearable section into shape. A receiving plate catches the laser, preventing damage to other components. Cutting is convenient, and the shape can be quickly adjusted. A vacuum pump evacuates air from the vacuum chamber, and the smooth surface of the tape is attracted through the vacuum holes. The tape is guided and its angle adjusted to overlap the high-temperature cloth for heat pressing. The tape, cut by the cutting mechanism, hangs vertically downwards and is held in place by the vacuum holes. A semiconductor cooler then... The process involves heating and cooling in two separate temperature-controlled chambers. The heat transfer fluid is then transported to the receiving rollers via heat pipes for temperature regulation. The cooling end of the semiconductor cooler is located in the left-hand temperature-controlled chamber, and the heating end is located in the right-hand chamber. This left-right arrangement heats and pressurizes the tape and high-temperature cloth before rapidly cooling and solidifying them. This prevents glue overflow from the tape during subsequent processing or transport, which could cover the sides of the high-temperature cloth and reduce the quality of the finished product. High-strength fiberglass cloth is used, and expanded microspheres are added during production to create the high-temperature cloth. After production, 4 to 5 layers of ultra-high-tack tape are adhered to the cloth surface. Each layer undergoes a heat treatment process during adhesion to ensure a strong bond. If dirt appears at the adhesive surface, a layer of tape can be peeled off, leaving the cloth clean. This reduces the need for extensive cleaning and extends the lifespan of the high-temperature cloth.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] 1. This invention continuously removes adhesive from both sides of the tape to prevent glue overflow during subsequent processing or transportation, which would cover the sides of the high-temperature cloth with glue, resulting in reduced product quality. Furthermore, it uses high-strength fiberglass cloth with expanded microspheres added during production to manufacture the high-temperature cloth. A layer of ultra-high tack tape is adhered to the cloth surface assembly. Each layer undergoes a heat treatment process during adhesion to ensure a more secure bond. If dirt appears at the adhesive surface, a layer of tape can be peeled off, leaving the cloth clean. This eliminates the need for extensive manual cleaning and extends the lifespan of the high-temperature cloth.

[0018] 2. This invention uses a laser cutting head that moves up, down, left, and right on a track frame to cut the easy-tear section into shape. A receiving plate catches the laser, preventing damage to other parts. Cutting is convenient, and the shape can be quickly adjusted. The easy-tear section allows for quick removal of the tape, making operation convenient and simple.

[0019] 3. In use, the vacuum pump evacuates the vacuum tank, and the smooth surface of the tape is adsorbed through the vacuum hole to guide the tape. The tape is then adjusted to an angle and guided above the high-temperature cloth so that it overlaps with the high-temperature cloth for heat pressing. The tape, after being cut by the cutting mechanism, hangs vertically downward and is adsorbed by the vacuum hole, which can quickly guide the tape.

[0020] 4. In this invention, a semiconductor cooler operates to heat and cool the material in two temperature-controlled chambers. Then, a heat-conducting liquid is delivered to the receiving rollers through heat-conducting pipes for temperature regulation. The left and right arrangement first heats and pressurizes the tape and high-temperature cloth, and then cools and shapes them quickly through refrigeration, making full use of energy. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the structure of the high-temperature cloth and tape of the present invention;

[0023] Figure 3 This is a schematic diagram of the adhesive removal mechanism of the present invention;

[0024] Figure 4 This is a side view of the adhesive removal mechanism of the present invention;

[0025] Figure 5 For the present invention Figure 1 A magnified view of a section at point A in the middle;

[0026] Figure 6 This is a schematic diagram of the molding component of the present invention.

[0027] In the diagram: 1. Tape discharge roller; 2. Conveying roller; 3. Rotating roller; 4. Adhesive section; 5. Fixing plate; 6. Return spring; 7. Scraper; 8. Inclined surface; 9. Guide frame; 10. Guide roller; 11. Vacuum tank; 12. Vacuum hole; 13. Laser cutting head; 14. Receiving plate; 15. Temperature regulating roller; 16. Receiving roller; 17. Temperature regulating box; 18. Heat conduction pipe; 19. Partition plate; 20. Temperature regulating chamber; 21. Semiconductor cooler; 22. High temperature cloth; 23. Tape; 24. Easy-tear section. Detailed Implementation

[0028] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0029] Please see Figure 1-6 The present invention provides a technical solution: a solar-powered, wash-free, high-temperature cloth preparation, bonding, and cutting device, comprising a conveying roller 2 for conveying the high-temperature cloth 22, a tape discharge roller 1 for conveying the tape 23, and a cutting assembly for bonding the tape 23 and the high-temperature cloth 22. The cutting assembly includes a de-adhesive mechanism for removing adhesive from the tape 23, a cutting mechanism for cutting the tape 23, a guiding mechanism for guiding the tape 23, and a forming mechanism for hot-pressing the tape 23 and the high-temperature cloth 22.

[0030] The tape 23 is adhered to the surface of the high-temperature cloth 22. The adhesive removal mechanism is used to scrape off the EVA adhesive 2-3cm on both sides of the tape 23. The cutting mechanism is used to cut the tape 23 and cut out easy-tear sections 24 on the tape 23.

[0031] The adhesive removal mechanism includes a fixed plate 5 and a rotating roller 3 mounted on one side of the tape 23. Adhesive sections 4 are fixedly connected to both ends of the rotating roller 3. A guide frame 9 is fixedly connected to the bottom of the fixed plate 5, and a scraper 7 is slidably connected to one side of the guide frame 9. One side of the scraper 7 abuts against the surface of the adhesive section 4. A return spring 6 is fixedly connected to the bottom of the fixed plate 5, and one end of the return spring 6 is fixedly connected to the top of the scraper 7. The tape 23 is conveyed through the adhesive sections 4 at both ends of the rotating roller 3, where the adhesive sections 4 adhere the adhesive on both sides. As the adhesive sections 4 rotate, the tape moves to the rear, where the scraper 7 scrapes off the adhesive above the adhesive sections 4 for cleaning. Due to the reset spring 6, when the scraper 7 wears down, the reset spring 6 pushes the scraper 7 downwards on one side of the guide frame 9, allowing the scraper 7 to continuously move downwards. Maintaining contact with the adhesive section 4 allows for continuous removal of adhesive from both sides of the tape 23, preventing glue overflow during subsequent processing or transportation. This prevents the high-temperature cloth 22 from being covered with glue, thus reducing the quality of the finished product. Furthermore, the high-temperature cloth 22 is produced using high-strength fiberglass cloth with expanded microspheres added during production. After production, 4 to 5 layers of ultra-high tack tape 23 are adhered to the fabric component. Each layer undergoes a heat treatment process during adhesion to ensure a stronger bond to the high-temperature cloth 22. If dirt appears at the adhesion point, simply peel off one layer of tape 23 to clean the fabric. This eliminates the need for extensive manual cleaning and extends the lifespan of the high-temperature cloth 22.

[0032] The tape 23 has multiple layers, and the tear-off segments 24 are staggered. Multiple cutting components are provided for applying the multi-layer tape 23 in layers.

[0033] The scraper 7 has a slope 8 that gradually slopes from the middle to both sides on one side. When in use, the glue on the adhesive section 4 is scraped off by the scraper 7 and then guided to both sides by the slope 8 for discharge.

[0034] The cutting mechanism includes a receiving plate 14 and a track frame respectively disposed on both sides of the tape 23. The track frame is connected to a laser cutting head 13 for cutting the tape 23. The laser cutting head 13 moves up, down and left and right on the track frame to cut the easy-tear section 24 into shape. The laser is received by the receiving plate 14 to prevent damage to other parts. The cutting is convenient and the shape can be quickly adjusted.

[0035] The guiding mechanism includes a guide roller 10. The inner cavity of the guide roller 10 is provided with a vacuum groove 11 that communicates with an external vacuum pump. The surface of the guide roller 10 is provided with a vacuum hole 12 that communicates with the inner cavity of the vacuum groove 11. During use, the vacuum pump evacuates the vacuum groove 11 and the smooth surface of the tape 23 is adsorbed through the vacuum hole 12 to guide the tape 23. The tape 23 is then guided at an angle to be positioned above the high-temperature cloth 22 so that it overlaps with the high-temperature cloth 22 for heat pressing. The tape 23, after being cut by the cutting mechanism, hangs vertically downward and is adsorbed by the vacuum hole 12.

[0036] The forming mechanism includes a temperature regulating roller 15 and a temperature regulating box 17 disposed above the high-temperature cloth 22, and a receiving roller 16 disposed below the high-temperature cloth 22. The inner cavity of the temperature regulating box 17 is divided into temperature regulating chambers 20 by a partition plate 19. The inner cavity of the partition plate 19 is fixedly connected to a semiconductor cooler 21 that extends to the two temperature regulating chambers 20 respectively. The inner cavity of the temperature regulating chamber 20 is filled with heat-conducting liquid. The inner cavity of the temperature regulating chamber 20 is connected to the temperature regulating roller 15 through a heat-conducting pipe 18. The semiconductor cooler 21 operates to heat and cool in the two temperature regulating chambers 20 respectively. Then, the heat-conducting liquid is transported to the receiving roller 16 for temperature regulation through the heat-conducting pipe 18.

[0037] The cooling end of the semiconductor cooler 21 is located in the temperature regulating cavity 20 on the left, and the heating end of the semiconductor cooler 21 is located in the temperature regulating cavity 20 on the right. The left and right arrangement first heats and pressurizes the tape 23 and the high-temperature cloth 22, and then cools and shapes them quickly through cooling.

[0038] The cutting mechanism is located below the adhesive removal mechanism, the guiding mechanism is located below the cutting mechanism, and the forming mechanism is located diagonally behind the guiding mechanism.

[0039] The tape output roller 1 outputs the tape 23, which is conveyed through the adhesive sections 4 at both ends of the rotating roller 3. The adhesive sections 4 adhere the adhesive from both sides, and the tape moves to the rear as the adhesive sections 4 rotate. A scraper 7 then scrapes off the adhesive from the top of the adhesive sections 4 for cleaning. A return spring 6, when worn, pushes the scraper 7 downwards on one side of the guide frame 9, ensuring the scraper 7 remains in contact with the adhesive sections 4, continuously removing adhesive from both sides of the tape 23. The laser cutting head 13 moves up, down, left, and right on the track frame. The right-hand movement cuts the easy-tear section 24 into shape, and the laser is supported by the receiving plate 14 to prevent damage to other parts. Cutting is convenient, and the shape can be quickly adjusted. A vacuum pump evacuates air from the vacuum tank 11, and the smooth surface of the tape 23 is adsorbed through the vacuum hole 12. The tape 23 is guided, and its angle is adjusted to guide it above the high-temperature cloth 22 so that it overlaps with the high-temperature cloth 22 for heat pressing. The tape 23, after being cut by the cutting mechanism, hangs vertically downwards and is adsorbed by the vacuum hole 12. The tape 23 is then passed through a semi-... The semiconductor cooler 21 operates, heating and cooling in two temperature-regulating chambers 20 respectively. Then, the heat-conducting liquid is transported to the receiving roller 16 via the heat-conducting pipe 18 for temperature regulation. The cooling end of the semiconductor cooler 21 is located in the left temperature-regulating chamber 20, and the heating end is located in the right temperature-regulating chamber 20. This left-right arrangement first heats and pressurizes the tape 23 and the high-temperature cloth 22, then rapidly cools and shapes them, preventing glue overflow from both sides of the tape 23 during subsequent processing or conveying, which could cause the high-temperature cloth 22 to be covered with glue on both sides, resulting in... Excess adhesive reduces the quality of the finished product. High-temperature cloth 22 is produced by adding expanded microspheres to high-strength fiberglass cloth during the production process. After production, 4 to 5 layers of ultra-high adhesion tape 23 are pasted on the cloth surface components. During the pasting process, each layer undergoes a heat treatment process to make it more firmly bonded to the high-temperature cloth 22. If dirt appears at the pasted area during use, one layer of tape 23 can be peeled off, and the cloth surface will be clean again. During use, a lot of manpower is not needed for cleaning, which can also extend the service life of the high-temperature cloth 22.

[0040] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A solar-powered, washable, high-temperature fabric preparation, bonding, and cutting device, comprising a conveying roller (2) for conveying the high-temperature fabric (22), a tape discharge roller (1) for conveying the tape (23), and a cutting assembly for bonding the tape (23) and the high-temperature fabric (22), characterized in that: The cutting assembly comprises a glue removing mechanism for removing glue from the adhesive tape (23), a cutting mechanism for cutting the adhesive tape (23), a guiding mechanism for guiding the adhesive tape (23), and a forming mechanism for hot-pressing the adhesive tape (23) and the high-temperature cloth (22); The adhesive tape (23) is adhered to the surface of the high-temperature cloth (22), the glue removing mechanism is used for scraping off the EVA glue on both sides of the adhesive tape (23) by 2-3 cm, and the cutting mechanism is used for cutting off the adhesive tape (23) and cutting out the easy-to-tear sections (24) on the adhesive tape (23). The glue removing mechanism comprises a fixed plate (5) arranged on one side of the adhesive tape (23) and a rotating roller (3), both ends of the rotating roller (3) are fixedly connected with glue sticking sections (4), the bottom of the fixed plate (5) is fixedly connected with a guide frame (9), one side of the guide frame (9) is slidably connected with a scraper (7), one side of the scraper (7) abuts against the surface of the glue sticking section (4), the bottom of the fixed plate (5) is fixedly connected with a return spring (6), one end of the return spring (6) is fixedly connected with the top of the scraper (7).

2. The solar power self-cleaning high temperature fabric preparation pasting cutting device according to claim 1, characterized in that: The adhesive tape (23) is provided with multiple layers, and the easy-to-tear sections (24) are staggered between the layers, and the cutting assembly is provided with multiple cutting mechanisms for layer-by-layer pasting of the multiple layers of adhesive tape (23).

3. The solar power self-cleaning high temperature fabric preparation pasting cutting device according to claim 1, characterized in that: One side of the scraper (7) is provided with an inclined surface (8) gradually inclined from the middle to both sides.

4. The solar power self-cleaning high temperature fabric preparation pasting cutting device according to claim 1, characterized in that: The cutting mechanism comprises a receiving plate (14) and a track frame arranged on both sides of the adhesive tape (23), respectively, and the surface of the track frame is drivingly connected with a laser cutting head (13) for cutting the adhesive tape (23).

5. The solar power self-cleaning high temperature fabric preparation pasting cutting device according to claim 1, characterized in that: The guiding mechanism comprises a guide roller (10), the inner cavity of the guide roller (10) is provided with a vacuum groove (11) in communication with an external vacuum pump, and the surface of the guide roller (10) is provided with a vacuum hole (12) in communication with the inner cavity of the vacuum groove (11).

6. The solar power self-cleaning high temperature fabric preparation pasting cutting device according to claim 1, characterized in that: The forming mechanism comprises a temperature adjusting roller (15) and a temperature adjusting box (17) arranged above the high-temperature cloth (22), and further comprises a receiving roller (16) arranged below the high-temperature cloth (22), the inner cavity of the temperature adjusting box (17) is partitioned into temperature adjusting cavities (20) by a partition plate (19), the inner cavity of the partition plate (19) is fixedly connected with semiconductor refrigerators (21) extending into the two temperature adjusting cavities (20), respectively, the inner cavities of the temperature adjusting cavities (20) are filled with heat-conducting liquid, and the inner cavities of the temperature adjusting cavities (20) are in communication with the temperature adjusting roller (15) through heat-conducting pipelines (18).

7. The solar power self-cleaning high temperature fabric preparation pasting cutting device according to claim 6, characterized in that: The refrigeration end of the semiconductor refrigerator (21) is located in the left temperature adjusting cavity (20), and the heating end of the semiconductor refrigerator (21) is located in the right temperature adjusting cavity (20).

8. The solar power self-cleaning high temperature fabric preparation pasting cutting device according to claim 1, characterized in that: The cutting mechanism is arranged below the glue removing mechanism, the guiding mechanism is arranged below the cutting mechanism, and the forming mechanism is arranged obliquely behind the guiding mechanism.

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