Physical vapor deposition coating apparatus and coating method

Abstract

The application discloses a physical vapor deposition coating equipment and a coating method. The coating equipment comprises a bearing platform for bearing a to-be-coated element, and a first orthographic projection of the to-be-coated element on the bearing platform is located in the bearing platform; a protective cover is located on a side of the bearing platform bearing the to-be-coated element, and a second orthographic projection of the protective cover on the bearing platform covers the bearing platform exposed from the first orthographic projection; wherein the bearing platform and the protective cover have conductive performance, the protective cover is insulated from the bearing platform during coating of the to-be-coated element; and a first grounding circuit is used for electrically connecting the protective cover after the to-be-coated element is removed from the bearing platform after coating. In the above manner, the application can reduce the probability of discharge lines.

Description

Technical Field

[0001] This application belongs to the field of physical vapor deposition coating technology, specifically relating to a physical vapor deposition coating equipment and coating method. Background Technology

[0002] When manufacturing Micro-LED screens using large-size glass substrates, physical vapor deposition (PVD) equipment is typically used to prepare the conductive metal film. When the glass substrate passes through a PVD station for coating, for example, when the coating metal is Mo, Al, Ag, or Cu, discharge patterns are easily generated at the edges of the glass substrate, thus affecting the screen's appearance. Summary of the Invention

[0003] This application provides a physical vapor deposition coating apparatus and coating method that can reduce the probability of discharge streaks appearing.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a physical vapor deposition (PVD) coating apparatus, comprising: a support platform for supporting an element to be coated, wherein a first orthographic projection of the element to be coated on the support platform is located within the support platform; a protective cover located on the side of the support platform supporting the element to be coated, wherein a second orthographic projection of the protective cover on the support platform covers the support platform exposed from the first orthographic projection; wherein the support platform and the protective cover are conductive, and the protective cover is insulated from the support platform during the coating process of the element to be coated; and a first grounding circuit for electrically connecting to the protective cover after the coating of the element to be coated is completed and it is removed from the support platform.

[0005] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a physical vapor deposition coating method, the coating method comprising: placing the element to be coated on a support platform and insulating a protective cover from the support platform; wherein the protective cover and the element to be coated are disposed on the same side of the support platform, the support platform and the protective cover are conductive, a first orthographic projection of the element to be coated on the support platform is located within the support platform, and a second orthographic projection of the protective cover on the support platform covers the support platform exposed from the first orthographic projection; coating the element to be coated; and in response to the completion of coating of the element to be coated, after moving the element to be coated away from the support platform, electrically connecting a first grounding circuit to the protective cover.

[0006] Unlike existing technologies, the beneficial effects of this application are as follows: The physical vapor deposition (PVD) coating equipment provided in this application has a conductive platform and protective cover. During the coating process on the element to be coated, the protective cover is insulated from the platform, and there is no contact between them. Electrons accumulated on the surface of the element and the protective cover during the coating process have no current release path, thus reducing the probability of discharge patterns forming on the surface of the element and lowering the probability of abnormal appearance. After the coating process is completed and the element is removed from the platform, the protective cover is electrically connected to the first grounding circuit to release electrons from its surface. At this point, there is no contact between the protective cover and the element, and the discharge current on the protective cover surface does not flow through the element, further reducing the probability of discharge patterns forming on the surface of the element after coating and lowering the probability of abnormal appearance. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0008] Figure 1 This is a schematic diagram of one embodiment of an existing physical vapor deposition coating equipment;

[0009] Figure 2 This is a schematic diagram of the structure of one embodiment of the surface of the element to be coated;

[0010] Figure 3 This is a schematic diagram of the structure of one embodiment of the physical vapor deposition coating equipment of this application;

[0011] Figure 4 A schematic diagram of the structure of an embodiment of the first surface of the component to be coated and the insulating part;

[0012] Figure 5 for Figure 3 A schematic diagram of one embodiment after the coating of the element to be coated is completed;

[0013] Figure 6a for Figure 3 A top view schematic diagram of another embodiment of the insulating component and protective cover;

[0014] Figure 6b for Figure 6a A cross-sectional view of one embodiment along the BB section line;

[0015] Figure 7 This is a schematic diagram of another embodiment of the physical vapor deposition coating equipment of this application;

[0016] Figure 8 for Figure 7 A schematic diagram of one embodiment after the coating of the element to be coated is completed;

[0017] Figure 9 This is a schematic flowchart of one embodiment of the physical vapor deposition coating method of this application. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] The principle of physical vapor deposition (PVD) coating technology is to use low-voltage, high-current arc discharge technology under vacuum conditions to evaporate the target material and ionize both the evaporated material and the gas. The electric field then accelerates the evaporation, causing the evaporated material to deposit onto the surface of the component to be coated. For example... Figure 1 As shown, Figure 1 This is a schematic diagram of an embodiment of a conventional physical vapor deposition (PVD) coating apparatus. In the horizontal PVD coating apparatus, the target material 10 is electrically connected to the cathode (i.e., negative potential) of the DC power supply, and the support platform 12 and the protective cover 14 are electrically connected to the ground wire (i.e., 0V potential). During the coating process, Ar+ ions are accelerated under an electric field and directed towards the target material 10, sputtering the target material and depositing it onto the surface of the element to be coated 16 (e.g., a glass substrate) and the surface of the protective cover 14 to form a film layer. At the same time, electrons in the plasma, through continuous collisions, eventually escape the magnetic field binding near the target material 10, becoming low-energy electrons, and fly towards the grounded protective cover 14 and the surface of the element to be coated 16. After a period of use, the upper surface of the protective cover 14 at a certain location will be covered with a certain amount of target material. When target material also accumulates in the gap between the protective cover 14 and the element to be coated 16, the low-energy electrons accumulated in the film layer on the surface of the element to be coated 16 will be guided to the ground through the target material, the protective cover 14, and the support platform 12 at the gap, thereby forming a discharge current on the surface of the film layer of the element to be coated 16, which will cause current thermal burns to the film layer, forming discharge patterns 18, as detailed below. Figure 2 As shown, Figure 2 This is a schematic diagram of one embodiment of the surface of the element to be coated.

[0020] To resolve the above issues, please refer to Figure 3 , Figure 3This is a schematic diagram of one embodiment of the physical vapor deposition coating equipment of this application. The coating equipment includes a support platform 20, a protective cover 22, and a first grounding circuit 24.

[0021] Specifically, the support platform 20 is used to support the element 26 to be coated, and the first orthographic projection of the element 26 on the support platform 20 is located within the support platform 20. Optionally, the element 26 to be coated can be a glass substrate, and its first orthographic projection can be circular; in this case, the surface of the support platform 20 in contact with the element 26 to be coated can also be circular. Furthermore, during the coating process, the temperature of the element 26 to be coated needs to be maintained within a certain range, such as 180℃-230℃. Therefore, the support platform 20 can be made of a material with good thermal conductivity, such as a metal, and the element 26 to be coated is heated by heating the support platform 20. And to ensure operational safety, the support platform 20 is generally grounded.

[0022] The protective cover 22 is located on the side of the support platform 20 that supports the element 26 to be coated. The second orthographic projection of the protective cover 22 on the support platform 20 covers the support platform 20 exposed in the first orthographic projection. This design reduces the probability of the target material being sputtered onto the surface of the support platform 20 during the coating process. Generally, the target material 28 of the physical vapor deposition (PVD) equipment is located on the side of the element 26 to be coated away from the support platform 20. The target material 28 is made of metal, meaning the film layer to be formed on the surface of the element 26 is a metal film layer. Therefore, the protective cover 22 is generally made of metal (e.g., alloy). This design allows for better adhesion between the metal film layer deposited on the surface of the protective cover 22 and the protective cover 22, reducing the probability of the metal film layer delaminating from the surface of the protective cover 22, thereby reducing the probability of introducing particles during the coating process and improving the coating effect.

[0023] As described above, both the carrier platform 20 and the protective cover 22 are generally made of metal, meaning they are conductive. During the coating process of the element 26 to be coated, the protective cover 22 is insulated from the carrier platform 20, and there is no contact between them. During the coating process, the electrons accumulated in the film layer deposited on the surface of the element 26 and the protective cover 22 have no current release path, reducing the probability of discharge patterns forming on the surface of the element 26 during coating, thus reducing the probability of its abnormal appearance. After the coating of the element 26 is completed and removed from the carrier platform 20, the protective cover 22 is electrically connected to the first grounding circuit 24 to release electrons from its surface. At this time, there is no contact between the protective cover 22 and the element 26, and the discharge current of the protective cover 22 does not flow through the element 26, further reducing the probability of discharge patterns forming on the surface of the element 26 after coating, thus reducing the probability of its abnormal appearance.

[0024] Please continue reading. Figure 3 The support platform 20 includes a base layer 200 and a protrusion 202 extending from one side surface of the base layer 200. The side of the protrusion 202 facing away from the base layer 200 is used to support the element 26 to be coated, and an annular recess 204 is formed between the side of the protrusion 202 and the base layer 200. It should be noted that in this application, the description of the annular shape is not limited to a circular ring, but can be any other closed shape with a hollow area. For example, the orthographic projection of the annular recess 204 on the base layer 200 can be a circular ring, a rectangular ring, etc.

[0025] Furthermore, the coating equipment may also include an insulating component 21 located within the annular recess 204 and fixedly connected to the support platform 20. Optionally, the insulating component 21 may be made of Teflon or similar material and may be fixedly connected to the base layer 200 or protrusion 202 of the support platform 20 by means of screws or the like. The third orthographic projection of the insulating component 21 on the support platform 20 is located within the area formed by the first and second orthographic projections. This design allows the surface of the insulating component 21 facing away from the base layer 200 to be covered by the element 26 to be coated, or by the element 26 to be coated and the protective cover 22, during the coating process, thereby reducing the probability of film deposition on the surface of the insulating component 21 and consequently reducing the probability of particles introduced due to film shedding during the coating process. The protective cover 22 contacts the insulating component 21 in the first direction X perpendicular to the base layer 200 to the protrusion 202. When the protective cover 22 can move up and down, the introduction of the insulating element 21 can guide the movement of the protective cover 22; when the position of the protective cover 22 is fixed, the introduction of the insulating element 21 can support and bear the load for the protective cover 22.

[0026] Optionally, the insulating element 21 is annular, and the protective cover 22 is annular; in the first direction X, the insulating element 21 is sleeved around at least a portion of the protrusion 202 and contacts the protrusion 202; the protective cover 22 is sleeved around at least a portion of the insulating element 21 and contacts the insulating element 21. This design is relatively simple in structure and easy to assemble.

[0027] Alternatively, such as Figure 3As shown, the surfaces of the insulating member 21 and the protrusion 202 facing away from the base layer 200 are flush. The surfaces of the insulating member 21 and the protrusion 202 facing away from the base layer 200 together support the element 26 to be coated. Preferably, the insulating member 21 includes a first surface 210 for contacting the element 26 to be coated, and the outer edge of the element 26 to be coated can be flush with the outer edge of the first surface 210 of the insulating member 21. Alternatively, the outer edge of the element 26 to be coated can extend beyond the outer edge of the first surface 210 of the insulating member 21, i.e., the first surface 210 of the insulating member 21 is recessed relative to the element 26 to be coated. This design allows for the absence of film deposition on the first surface 210 of the insulating member 21 during the coating process, thereby reducing the probability of particle generation during coating.

[0028] Better, such as Figure 4 As shown, Figure 4 This is a schematic diagram of one embodiment of the first surface of the element to be coated and the insulating component. The outer edge of the element 26 to be coated generally has a notch 260, through which the surface to be coated on the element 26 can be defined. In this case, the orthographic projection of the notch 260 onto the first surface 210 is located outside the first surface 210; for example, the first surface 210 is circular, and the notch 260 includes a apex closest to the center of the element 26 to be coated, through which the outer edge of the first surface 210 can pass.

[0029] Another option, such as Figure 3 As shown, during the coating process of the component 26 to be coated, the surfaces of the protective cover 22 facing away from the substrate 200, the insulating component 21 facing away from the substrate 200, and the protrusion 202 facing away from the substrate 200 are flush. On the one hand, this design ensures that the protective cover 22 will not touch the side of the component 26 to be coated, thereby reducing the probability of the component 26 being damaged. On the other hand, this design can minimize the probability of film deposition on the side of the insulating component 21.

[0030] In one embodiment, please refer to [the relevant documentation / reference]. Figure 3 and Figure 5 , Figure 5 for Figure 3A schematic diagram of one embodiment after the coating of the element to be coated is completed. The third orthographic projection of the insulating member 21 on the support platform 20 covers the annular recess 204, and the third orthographic projection does not overlap with the second orthographic projection of the protective cover 22 on the support platform 20. The first grounding circuit 24 is electrically connected to the support platform 20. The insulating member 21 is sleeved around all the protrusions 202, and the protective cover 22 is sleeved around part of the insulating member 21. Optionally, the first grounding circuit 24 includes a first grounding wire (not shown), one end of which is electrically connected to the support platform 20, and the other end of which is grounded. In this case, the coating equipment may also include a first lifting assembly 23, which is fixedly connected to the protective cover 22 and is used to drive the protective cover 22 closer to or further away from the support platform 20. Figure 3 As shown, during the coating process of the element 26 to be coated, the first lifting assembly 23 drives the protective cover 22 away from the support platform 20. At this time, there is no contact between the protective cover 22 and the support platform 20, and the electrons accumulated in the film layer deposited on the surface of the element 26 to be coated and the surface of the protective cover 22 during the coating process have no current release path. Figure 5 As shown, after the coating of the element 26 to be coated is completed and it is removed from the support platform 20, the first lifting assembly 23 drives the protective cover 22 to approach and contact the support platform 20. The protective cover 22 is electrically connected to the first grounding circuit 24 through the support platform 20. The above-described structure is relatively simple and the equipment is easy to assemble.

[0031] Optionally, the first lifting assembly 23 includes a plurality of first insulating support rods 230, which pass through the support platform 20 and are fixedly connected to the protective cover 22. In this case, the support platform 20 has a first through hole corresponding to the position of the first insulating support rod 230, and the first insulating support rod 230 passes through the first through hole at the corresponding position. This design can reduce the size of the coating equipment. Furthermore, the plurality of first insulating support rods 230 can be arranged at equal intervals along the outer periphery of the protrusion 202, so that the protective cover 22 will not tilt as it moves closer to or away from the support platform 20.

[0032] Alternatively, such as Figure 6a As shown, Figure 6a for Figure 3 A top view schematic diagram of another embodiment of the insulating component and protective cover. Figure 6b for Figure 6aA cross-sectional view along line BB of one embodiment. An insulating member 21 has a track groove 212 on the side facing the protective cover 22, and the protective cover 22 has a protrusion 220 on the side facing the insulating member 21, with the protrusion 220 located within the track groove 212. The track groove 212 allows the insulating member 21 to better perform its guiding function. When multiple track grooves 212 are provided on the side of the insulating member 21 facing the protective cover 22, the multiple track grooves 212 can be arranged parallel to each other. Furthermore, to prevent the protective cover 22 from detaching from the insulating member 21 as it moves away from the support platform 20, such as... Figure 6b As shown, the track groove 212 is not through the first surface 210 of the insulating member 21, and at this time the bottom surface of the track groove 212 near the first surface 210 forms a limiting surface.

[0033] In addition, please refer to again Figure 3 or Figure 5 The coating equipment provided in this application may also include a second lifting assembly 27, which includes a plurality of second insulating support rods 270, each of which passes through the carrier platform 20; when the coating process is completed, the second insulating support rods 270 can drive the element 26 to be coated away from the carrier platform 20 so as to remove it from the carrier platform 20.

[0034] Of course, in other embodiments, in the coating equipment provided in this application, the insulating member 21 may also be sleeved around the periphery of a portion of the protrusion 202, and the protective cover 22 may be sleeved around the periphery of all the insulating members 21. In this case, in the first direction X, the insulating member 21 and the protective cover 22 are fixedly connected, and the first lifting assembly 23 may be fixedly connected to the insulating member 21 or the protective cover 22 to drive the insulating member 21 and the protective cover 22 to move closer to or further away from the support platform 20.

[0035] In the above embodiment, the probability of discharge ripples is reduced by changing the position of the protective cover 22. In other embodiments, the position of the protective cover 22 may remain the same during and after the coating process; in this case, please refer to [reference needed]. Figure 7 , Figure 7 This is a schematic diagram of another embodiment of the physical vapor deposition coating apparatus of this application. The third orthographic projection of the insulating member 21 on the support platform 20 covers at least a portion of the annular recess 204, and a receiving groove 214 penetrating a portion of the side of the insulating member 21 is provided on the edge opposite to the base layer 200. The protective cover 22 is fixedly disposed within the receiving groove 214 and covers the surface of the receiving groove 214 opposite to the support platform 20. Optionally, the third orthographic projection covers all annular recesses 204. Alternatively, the receiving groove 214 is annular.

[0036] Furthermore, the coating equipment also includes a controller 25 connected to the first grounding circuit 24, used to control the first grounding circuit 24 to be electrically connected to the protective cover 22 after the coating of the element 26 to be coated is completed, and used to control the first grounding circuit 24 to be disconnected from the protective cover 22 during the coating process of the element 26 to be coated. The above design is relatively simple and easy to implement. Optionally, the first grounding circuit 24 includes a first grounding line 240 and a switch 242 located on the first grounding line 240; wherein, one end of the first grounding line 240 is electrically connected to the protective cover 22, and the other end of the first grounding line 240 is grounded; the controller 25 is coupled to the switch 242 and used to control the switch 242 to be turned on or off, so that the protective cover 22 can be grounded or not grounded.

[0037] Please continue reading. Figure 7 and Figure 8 , Figure 8 for Figure 7 A schematic diagram of one embodiment after the coating of the element to be coated is completed. The coating equipment provided in this application also includes a second lifting assembly 27, used to drive the element 26 to be coated 26 closer to or further away from the support platform 20, and coupled to the controller 25; wherein, coupling means that the two can transmit signals. Figure 7 As shown, in response to the second lifting assembly 27 driving the element 26 to be coated to approach and contact the support platform 20, the controller 25 controls the first grounding circuit 24 to disconnect from the protective cover 22; specifically, the switch 242 in the first grounding circuit 24 can be controlled to disconnect. Figure 8 As shown, in response to the second lifting assembly 27 driving the element to be coated 26 away from the support platform 20 to the first position, the controller 25 controls the first grounding circuit 24 to be electrically connected to the protective cover 22; specifically, the switch 242 in the first grounding circuit 24 can be controlled to be turned on.

[0038] Optionally, the second lifting assembly 27 includes a plurality of second insulating support rods 270, which pass through the bearing platform 20. For example, the bearing platform 20 is provided with a plurality of second through holes (not shown), and one second insulating support rod 270 passes through one second through hole. The structural design of this second lifting assembly 27 is relatively simple.

[0039] In addition, such as Figure 7 As shown, since the carrier platform 20 is conductive, the coating equipment provided in this application may further include a second grounding circuit 29, which is electrically connected to the carrier platform 20, for grounding the carrier platform 20 during the coating process to improve operational safety. Optionally, the second grounding circuit 29 includes a second grounding line 290, one end of which is electrically connected to the carrier platform 20, and the other end of which is grounded.

[0040] In addition, the coating equipment provided in this application may also include other structures; for example, it may also include a coating chamber (not shown) and an ion wind purging mechanism (not shown); in this case, the support platform 20 and the protective cover 22 in any of the above embodiments are located inside the coating chamber. The ion wind purging mechanism is used to neutralize the surface of the element 26 to be coated after the coating is completed and it is removed from the coating chamber, so as to eliminate the influence of electrons accumulated on the surface of the film layer on the element 26 to be coated.

[0041] Please see Figure 9 , Figure 9 This is a schematic flowchart of one embodiment of the physical vapor deposition coating method of this application. The coating method utilizes the coating equipment in any of the above embodiments, and specifically includes:

[0042] S101: Position the element 26 to be coated on the carrier platform 20, and insulate the protective cover 22 from the carrier platform 20; wherein the protective cover 22 and the element 26 to be coated are disposed on the same side of the carrier platform 20, the carrier platform 20 and the protective cover 22 are conductive, the first orthographic projection of the element 26 to be coated on the carrier platform 20 is located inside the carrier platform 20, and the second orthographic projection of the protective cover 22 on the carrier platform 20 covers the carrier platform 20 exposed from the first orthographic projection.

[0043] Specifically, please refer to Figure 3 or Figure 7 When corresponding Figure 3 In the structure described above, the support platform 20 is electrically connected to the first grounding circuit 24, and the coating equipment includes a first lifting assembly 23, which is fixedly connected to the protective cover 22. The step S101 above, which insulates the protective cover 22 from the support platform 20, includes: the first lifting assembly 23 driving the protective cover 22 away from the support platform 20. Preferably, the surface of the protective cover 22 near the element to be coated 26 is flush with the surface of the element to be coated 26 near the support platform 20. When corresponding... Figure 7 When the structure is in the above step S101, the step of insulating the protective cover 22 from the support platform 20 includes: fixing the protective cover 22 in the receiving groove 214 of the insulating component 21; and at this time, the controller 25 controls the switch 242 to be turned off.

[0044] S102: Coating is performed on the element 26 to be coated.

[0045] S103: In response to the completion of coating of the element 26 to be coated, after moving the element 26 to be coated away from the support platform 20, the first grounding circuit 24 is electrically connected to the protective cover 22.

[0046] Specifically, please refer to Figure 5 or Figure 8 When corresponding Figure 3In the structure described above, the supporting platform 20 is electrically connected to the first grounding circuit 24, and the coating equipment includes a first lifting assembly 23, which is fixedly connected to the protective cover 22. The step S103 above, which electrically connects the first grounding circuit 24 to the protective cover 22, includes: the first lifting assembly 23 driving the protective cover 22 closer to and in contact with the supporting platform 20. When the corresponding... Figure 8 When the structure is in place, controller 25 controls switch 242 to turn on.

[0047] In addition, before removing the element 26 to be coated, the surface of the element 26 to be coated needs to be electrically neutralized to eliminate the influence of electrons accumulated on the surface of the film layer on the element 26 to be coated.

[0048] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A physical vapor deposition coating apparatus, characterized in that, include: A support platform is used to support the component to be coated, and the first orthographic projection of the component to be coated on the support platform is located within the support platform; A protective cover is located on the side of the support platform that supports the element to be coated. The second orthographic projection of the protective cover on the support platform covers the support platform exposed from the first orthographic projection. The support platform and the protective cover are conductive. During the coating process of the element to be coated, the protective cover is insulated from the support platform. A first grounding circuit is used to be electrically connected to the protective cover after the coating of the element to be coated is completed and it is removed from the carrier platform; wherein, the first grounding circuit is electrically connected to the carrier platform; A first lifting assembly is fixedly connected to the protective cover and is used to drive the protective cover closer to or further away from the support platform. During the coating process of the element to be coated, the first lifting assembly drives the protective cover away from the support platform. After the coating of the element to be coated is completed and it is removed from the support platform, the first lifting assembly drives the protective cover closer to and in contact with the support platform. The protective cover is electrically connected to the first grounding circuit through the support platform.

2. The coating equipment according to claim 1, characterized in that, The support platform includes a base layer and a protrusion extending from one side surface of the base layer. The side of the protrusion facing away from the base layer is used to support the element to be coated, and an annular recess is formed between the side of the protrusion and the base layer. The coating equipment also includes: An insulating element is located within the annular recess and is fixedly connected to the support platform; the third orthographic projection of the insulating element on the support platform is located within the area formed by the first orthographic projection and the second orthographic projection; the protective cover contacts the insulating element in a first direction perpendicular to the base layer to the protrusion.

3. The coating equipment according to claim 2, characterized in that, The insulating element is annular, and the protective cover is annular; in the first direction, the insulating element is sleeved around at least a portion of the protrusion and contacts the protrusion; the protective cover is sleeved around at least a portion of the insulating element and contacts the insulating element.

4. The coating equipment according to claim 2, characterized in that, The insulating component and the protrusion are flush with the surface of the side facing away from the base layer. The side of the insulating component facing away from the base layer and the side of the protrusion facing away from the base layer are used to jointly support the element to be coated.

5. The coating equipment according to claim 4, characterized in that, During the coating process of the element to be coated, the protective cover is flush with the side facing away from the base layer, the insulating part is flush with the side facing away from the base layer, and the protrusion is flush with the side facing away from the base layer.

6. The coating equipment according to claim 2 or 3, characterized in that, The third orthographic projection covers the annular recess, and the third orthographic projection does not overlap with the first orthographic projection. The first lifting assembly includes a plurality of first insulating support rods, which pass through the bearing platform and are fixedly connected to the protective cover.

7. The coating equipment according to claim 6, characterized in that, The insulating component has a track groove on the side facing the protective cover, and the protective cover has a protrusion on the side facing the insulating component, with the protrusion located within the track groove.

8. The coating equipment according to claim 2 or 3, characterized in that, The third orthographic projection covers at least part of the annular recess, and the insulating member has a receiving groove on the edge opposite to the base layer, and the protective cover is fixedly installed in the receiving groove; The coating equipment further includes a controller connected to the first grounding circuit, used to control the first grounding circuit to be electrically connected to the protective cover after the coating of the element to be coated is completed, and used to control the first grounding circuit to be disconnected from the protective cover during the coating process of the element to be coated.

9. The coating equipment according to claim 8, characterized in that, The coating equipment also includes a second grounding circuit, which is electrically connected to the support platform.

10. The coating equipment according to claim 8, characterized in that, Also includes: The second lifting assembly is used to drive the element to be coated to approach or move away from the support platform and is coupled to the controller; in response to the second lifting assembly driving the element to be coated away from the support platform to a first position, the controller controls the first grounding circuit to be electrically connected to the protective cover. In response to the second lifting assembly driving the element to be coated to approach and contact the carrier platform, the controller controls the first grounding circuit to disconnect from the protective cover.

11. The coating equipment according to claim 10, characterized in that, The second lifting assembly includes a plurality of second insulating support rods, which pass through the bearing platform.

12. The coating equipment according to claim 1, characterized in that, Also includes: The coating chamber, the support platform and the protective cover are located inside the coating chamber; An ion wind purging mechanism is used to neutralize the surface of the element to be coated after the coating process is completed and the element is removed from the coating chamber.

13. A physical vapor deposition coating method, characterized in that, The coating method includes: The element to be coated is placed on a support platform, and the protective cover is insulated from the support platform; wherein the protective cover and the element to be coated are disposed on the same side of the support platform, the support platform and the protective cover are conductive, the first orthographic projection of the element to be coated on the support platform is located within the support platform, and the second orthographic projection of the protective cover on the support platform covers the support platform exposed from the first orthographic projection; The element to be coated is coated; In response to the completion of coating of the element to be coated, after the element to be coated is moved away from the support platform, the first grounding circuit is electrically connected to the protective cover; The support platform is electrically connected to the first grounding circuit, and the coating equipment includes a first lifting component, which is fixedly connected to the protective cover. The step of insulating the protective cover from the support platform includes: the first lifting component driving the protective cover away from the support platform; The step of electrically connecting the first grounding circuit to the protective cover includes: the first lifting assembly driving the protective cover closer to the support platform and into contact with the support platform.

14. The method according to claim 13, characterized in that, The surface of the protective cover near the element to be coated is flush with the surface of the element to be coated near the support platform.

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