High temperature gas cooled reactor primary circuit gas test temperature boost and control method and system

Abstract

The present disclosure provides a high-temperature gas-cooled reactor primary loop gas pressure test temperature rising and control method and device, the method comprising: heating the primary loop in the primary loop low-pressure stage; in the primary loop exhaust pressure reduction stage, the temperature of the primary loop is slowed down by controlling the primary loop exhaust pressure reduction rate. In the high-temperature gas-cooled reactor primary loop gas pressure test temperature rising and control method and system of the present disclosure, the technical characteristics of the high-temperature reactor are combined, the existing conditions of the high-temperature gas-cooled reactor are fully utilized, and the comprehensive temperature rising and control strategy such as low-pressure preheating and control of temperature drop in the pressure reduction stage is adopted to overcome the temperature rising and guaranteeing problems of the primary loop, effectively raise the temperature of the primary loop to above the non-ductility transition temperature, and maintain the temperature stable according to the test needs, which has the advantages of high reliability, simple operation, controllable cost and the like.

Description

Technical Field

[0001] This disclosure belongs to the field of high-temperature gas-cooled reactor technology, specifically relating to a method and system for raising and controlling the temperature of the primary loop gas pressure test of a high-temperature gas-cooled reactor. Background Technology

[0002] The primary loop of the high-temperature gas-cooled reactor mainly consists of a reactor pressure vessel, a steam generator, and hot gas ducts, with a volume of 520 m³. 3 The primary circuit is housed within a concrete structure. After installation, a pressure test is required to verify the strength and sealing of the primary circuit system equipment, as well as the deformation and displacement of the primary circuit pressure vessel under pressure, and to check the effectiveness of the support system. High-temperature gas-cooled reactors (HTGRs) use helium as the primary coolant, and the reactor pressure vessel contains numerous carbon reactor internals, graphite reactor internals, and ceramic materials such as graphite spheres. These materials readily absorb moisture and are difficult to remove; therefore, the HTGR primary circuit pressure test must be conducted by introducing dry compressed air to increase the primary circuit pressure. According to ASME specifications, the target pressure for the primary circuit pressure test is 8.9 MPa.g, achieved through a diaphragm compressor in the helium supply and storage system (flow rate approximately 200 m³ / g).

[0003] 3 The / h) circuit is a single-loop boost, and the boost process alone takes nearly 10 days.

[0004] Based on the requirement of the non-ductile transition temperature of the metallic material in the primary loop pressure vessel of a high-temperature gas-cooled reactor, the primary loop temperature must not be lower than 18°C ​​throughout the entire primary loop pressure test, and a necessary safety margin should be maintained. Meanwhile, during the primary loop sealing verification process, it is necessary to read nearly a hundred temperature measurement points in the primary loop system to calculate the changes in primary loop gas mass. However, the gas medium is extremely sensitive to temperature changes, and temperature fluctuations can significantly affect the accuracy of leakage rate calculations.

[0005] Furthermore, unlike pressurized water reactor power plants, the main helium blower of high-temperature gas-cooled reactors cannot operate continuously throughout the entire primary circuit pressure test. During the primary circuit depressurization process, the gas does work on the outside, which leads to a drop in the primary circuit temperature. In addition, the reactor pressure vessel and steam generator are not insulated.

[0006] Based on the technical characteristics and requirements of the primary loop pressure test of the high-temperature gas-cooled reactor, it is necessary to adopt a reliable method to raise the primary loop temperature to above the non-ductile temperature and maintain the temperature stability according to the test requirements. There are no relevant technical solutions in the existing technology for raising, controlling and maintaining the stability of the temperature during the primary loop pressure test of the high-temperature gas-cooled reactor. Summary of the Invention

[0007] This disclosure aims to at least solve one of the technical problems existing in the prior art, and to provide a method and system for raising and controlling the temperature of the primary loop pressure test of a high-temperature gas-cooled reactor.

[0008] This disclosure provides a method for raising and controlling the temperature during a primary loop pressure test of a high-temperature gas-cooled reactor. The method includes:

[0009] During the low-voltage phase of the primary circuit, the primary circuit is heated;

[0010] During the primary circuit exhaust pressure reduction stage, the temperature drop of the primary circuit is slowed down by controlling the primary circuit exhaust pressure reduction rate.

[0011] Optionally, heating the primary circuit includes:

[0012] The primary circuit is heated to approximately 50°C by the main helium blower.

[0013] Optionally, the method of mitigating the primary circuit temperature drop by controlling the primary circuit exhaust pressure reduction rate includes:

[0014] The temperature drop rate of the ceramic stack is controlled by controlling the primary circuit exhaust pressure reduction rate to not exceed 0.3 MPa / h, so as to slow down the temperature drop of the primary circuit by releasing heat through the ceramic stack.

[0015] Optionally, before heating the primary circuit during the low-voltage phase of the primary circuit, the method further includes:

[0016] The primary loop compartment is sealed off, the cooling system is shut down, and heat dissipation is reduced.

[0017] Optionally, the cooling system includes at least one of a waste heat removal system, a support cooling system, and a shielded cooling water system.

[0018] Optionally, the method further includes:

[0019] Hot air is continuously supplied to the primary loop compartment through a pre-set heating fan that is in fluid communication with the primary loop compartment in order to maintain the ambient temperature of the primary loop compartment.

[0020] Optionally, the continuous supply of hot air into the primary loop compartment via a pre-set heating fan in fluid communication with the primary loop compartment includes:

[0021] The power and air volume required by the heating fan are obtained based on the target value of the primary circuit temperature control and the ambient temperature. The inlet air temperature and inlet air flow of the heating fan are then adjusted according to the power and air volume.

[0022] Optionally, the method further includes:

[0023] During the primary air intake stage, the primary air intake temperature is increased by a pre-installed heat preservation and heating device on the intake pipe.

[0024] Optionally, the heat preservation and heating device includes at least one of a heat tracing cable, a laid insulation material, and an electric heater.

[0025] Another aspect of this disclosure provides a temperature rise and control system for the primary loop pressure test of a high-temperature gas-cooled reactor, comprising:

[0026] A primary circuit heating device is used to heat the primary circuit during the low-pressure phase of the primary circuit;

[0027] An exhaust pressure reduction control device is used to slow down the temperature drop in the primary circuit by controlling the exhaust pressure reduction rate in the primary circuit during the primary circuit exhaust pressure reduction phase.

[0028] The method and system for raising and controlling the primary loop pressure test temperature of the high-temperature gas-cooled reactor disclosed in this embodiment combine the technical characteristics of the high-temperature reactor and the configuration of the system equipment, make full use of the existing conditions of the high-temperature gas-cooled reactor, and overcome the difficulties in raising and ensuring the primary loop temperature by adopting comprehensive temperature raising and control strategies such as low-pressure preheating and controlling the temperature drop during the depressurization stage. It effectively raises the primary loop temperature to above the non-ductile transition temperature and can maintain temperature stability according to test needs. It has the advantages of high reliability, simplicity and ease of implementation, and controllable cost. Attached Figure Description

[0029] Figure 1 This is a schematic flowchart illustrating a method for increasing and controlling the temperature of a primary loop pressure test of a high-temperature gas-cooled reactor according to an embodiment of this disclosure.

[0030] Figure 2 This is a flowchart illustrating a method for increasing and controlling the temperature of a primary loop pressure test of a high-temperature gas-cooled reactor according to another embodiment of this disclosure.

[0031] Figure 3 This is a flowchart illustrating a method for increasing and controlling the temperature of a primary loop pressure test of a high-temperature gas-cooled reactor according to another embodiment of this disclosure.

[0032] Figure 4 This is a flowchart illustrating a method for increasing and controlling the temperature of a primary loop pressure test of a high-temperature gas-cooled reactor according to another embodiment of this disclosure.

[0033] Figure 5 This is a schematic diagram of the structure of the temperature rise and control system for the primary loop pressure test of a high-temperature gas-cooled reactor according to another embodiment of the present disclosure. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solutions of this disclosure, the disclosure will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0035] Unless otherwise specifically stated, the technical or scientific terms used in this disclosure should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms "comprising" or "including," as used in this disclosure, do not limit the shapes, numbers, steps, actions, operations, components, elements, and / or groups thereof mentioned, nor do they exclude the appearance or inclusion of one or more other different shapes, numbers, steps, actions, operations, components, elements, and / or groups thereof, or the inclusion of these. In the description of this disclosure, "a plurality of" means two or more, unless otherwise expressly specified.

[0036] In some descriptions of the invention, unless otherwise expressly specified and limited, terms such as “installation,” “connection,” “linking,” or “fixing” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect through an intermediate medium, which can be the internal connection of two elements or the interaction between two elements.

[0037] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this disclosure. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale, and techniques, methods, and devices known to those skilled in the art may not be discussed in detail; however, where appropriate, the illustrated techniques, methods, and devices should be considered part of the specification. In all the examples shown and discussed herein, any other specific example may have different values. It should be noted that similar symbols and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0038] Before discussing in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the operations (steps) as sequential processes, many of these operations can be performed in parallel, concurrently, or simultaneously. Furthermore, the order of the operations can be rearranged. The process can be terminated when an operation is completed, but it may also have additional steps not included in the figures. The process may correspond to a method, function, procedure, subroutine, subroutine, etc.

[0039] Below, we will refer to Figure 1 This disclosure describes a method for increasing and controlling the temperature of the primary loop gas pressure test of a high-temperature gas-cooled reactor according to an embodiment of the present disclosure.

[0040] For example, such as Figure 1 As shown, the methods for increasing and controlling the temperature during the primary loop pressure test of the high-temperature gas-cooled reactor include:

[0041] S100: During the low-voltage phase of the primary circuit, the primary circuit is heated.

[0042] For example, at the start of the primary loop pressure test of the high-temperature gas-cooled reactor, gas is introduced into the primary loop to increase the primary loop pressure. After the primary loop is introduced into the primary loop, when the primary loop is in the low-pressure stage, the primary loop is preheated at low pressure.

[0043] For example, the primary loop is heated to approximately 50°C by a main helium blower. For example, after the primary loop intake gas is pressurized, the main helium blower is activated to stir and heat the primary loop, thereby raising its temperature to approximately 50°C. It should be noted that stirring and heating refers to the process of converting the mechanical energy of the main helium blower into the thermal energy of the medium by driving the primary loop medium with the main helium blower, thus achieving heating.

[0044] It should be noted that because the reactor contains a large number of ceramic reactor internals and graphite spheres, moisture absorbed by these materials will begin to leach out at temperatures exceeding 60°C. To prevent moisture condensation at the cryogenic components of the primary loop system, which could lead to corrosion of mechanical parts or damage to electrical components, the main helium blower heats the primary loop to approximately 50°C before shutting down. Additionally, the main helium blower is designed for a rated operating condition with a density of 6.33 kg / m³. 3 In the helium atmosphere, the primary loop pressure test uses room temperature dry compressed air as the gas source. When the inlet air temperature is 20℃, the density will exceed the rated operating condition of the main helium blower when the primary loop pressure exceeds 0.53MPa, posing a risk of damage to the main helium blower. Therefore, to avoid the risk of damage, for example, the main helium blower should be started for heating when the primary loop pressure does not exceed 0.53MPa, and the power, current and other operating conditions of the main helium blower should be closely monitored.

[0045] S200: During the primary circuit exhaust pressure reduction stage, the temperature drop of the primary circuit is slowed down by controlling the primary circuit exhaust pressure reduction rate.

[0046] For example, during the primary circuit exhaust depressurization stage, the temperature drop rate of the ceramic stack is controlled by controlling the primary circuit exhaust depressurization rate to not exceed 0.3 MPa / h. The temperature drop in the primary circuit is compensated by releasing the heat stored within the ceramic stack, thereby slowing down the temperature drop by releasing heat from the ceramic stack. For example, the heat released by the ceramic stack is the heat released by the internal components of the ceramic stack.

[0047] Specifically, during the primary loop depressurization phase, the primary loop temperature continuously decreases due to the work done by the primary loop gas. The primary loop of a high-temperature gas-cooled reactor contains numerous carbon-based internal components, graphite-based internal components, and ceramic materials such as graphite spheres. These materials store a significant amount of heat during the pressurization phase. Because the thermal conductivity of these ceramic materials is lower than that of gases and metals, their temperature decreases more slowly and is higher than that of gases and metals during the depressurization process. Therefore, the primary loop depressurization rate should be controlled to not exceed 0.3 MPa / h, and the depressurization rate should be adjusted promptly based on the temperature drop in the primary loop. This release of the stored heat from the ceramic materials compensates for the temperature decrease caused by the primary loop's external work and heat dissipation.

[0048] The method for raising and controlling the temperature of the primary loop pressure test in the high-temperature gas-cooled reactor disclosed in this embodiment combines the technical characteristics of the high-temperature reactor and the configuration of the system equipment. It makes full use of the existing conditions of the high-temperature gas-cooled reactor and adopts a comprehensive temperature raising and control strategy, such as low-pressure preheating and controlling the temperature drop during the depressurization stage, to raise and control the temperature of the primary loop to meet the temperature requirements during the primary loop pressure test. This overcomes the difficulties in raising and ensuring the temperature of the primary loop, effectively raises the temperature of the primary loop to above the non-ductile transition temperature, and can maintain temperature stability according to test needs. It has the advantages of high reliability, simplicity, and controllable cost.

[0049] The following will combine Figure 2 The specific steps of the method for increasing and controlling the temperature of the primary loop pressure test of the high-temperature gas-cooled reactor in the embodiment are further described.

[0050] For example, such as Figure 2 As shown, before heating the primary circuit in step S100 (low-voltage stage), the process further includes:

[0051] S000: Close the primary loop compartment, shut down the cooling system, and reduce heat dissipation.

[0052] For example, upon commencement of the primary loop pressure test of a high-temperature gas-cooled reactor, the primary loop system compartment is sealed off, and the cooling systems within the primary loop compartment that affect primary loop heat dissipation are shut down to reduce system heat dissipation during the primary loop pressure test. For example, the cooling system includes one or more of a residual heat removal system, a support cooling system, and a shielded cooling water system.

[0053] Specifically, in this step, the primary loop system compartment is sealed off, the manhole door of the compartment is closed, and the top of the compartment is sealed off with an insulated tarpaulin or other insulation material instead of the concrete cover plate of the formal compartment; the cooling system in the primary loop compartment is shut down, mainly including the waste heat exhaust system, the support cooling system, and the shielded cooling water system, in order to reduce the external heat dissipation of the primary loop system.

[0054] In the method for raising and controlling the temperature of the primary loop pressure test of the high-temperature gas-cooled reactor in this embodiment, the primary loop temperature is controlled by reducing heat dissipation, which effectively avoids heat dissipation in the initial stage of the test, thereby raising and controlling the temperature of the primary loop to meet the temperature requirements during the primary loop pressure test.

[0055] The following will combine Figure 3 The specific steps of the method for increasing and controlling the temperature of the primary loop pressure test of the high-temperature gas-cooled reactor in the embodiment are further described.

[0056] For example, such as Figure 3 As shown, the method for increasing and controlling the temperature of the primary loop pressure test of a high-temperature gas-cooled reactor also includes:

[0057] S300: Hot air is continuously supplied to the primary loop compartment through a pre-set heating fan that is in fluid communication with the primary loop compartment in order to maintain the ambient temperature of the primary loop compartment.

[0058] For example, before the test begins, a large heating fan is installed outside the primary loop compartment. The outlet of the heating fan is equipped with a duct. The duct passes through a manhole to supply hot air to the compartment, thereby achieving fluid communication between the primary loop compartment and the heating fan. After the duct is installed, the gap between the duct and the manhole is sealed. After the test begins, for example, hot air is continuously supplied to the primary loop compartment through the manhole, and the inlet air temperature and flow rate are adjusted according to the test conditions to maintain the ambient temperature of the primary loop compartment.

[0059] For example, the power and air volume required by the heating fan are obtained based on the primary loop temperature control target value and the ambient temperature, and the inlet air temperature and inlet air flow of the heating fan are adjusted according to the power and air volume. Those skilled in the art can set the primary loop temperature control target value according to actual usage conditions, and can select a suitable device to obtain the ambient temperature according to actual usage conditions; no specific limitations are imposed in this embodiment.

[0060] Specifically, based on the target value of the primary loop temperature control and the ambient temperature, the power and air volume required by the heating fan are calculated. Before the test begins, the heating fan and heat-resistant air duct are arranged outside the primary loop chamber. After the test begins, hot air is introduced into the primary loop system chamber through the heat-resistant air duct. The primary loop is uniformly heated by increasing the temperature of the primary loop chamber. For example, during the test, the primary loop temperature can be continuously monitored, and the outlet temperature and flow rate of the heating fan can be adjusted according to the changes in the primary loop temperature.

[0061] For example, according to the ASME Concrete Containment Code, the concrete temperature of the chamber should not exceed 70°C. Therefore, the outlet temperature of the heating fan and the chamber temperature should be controlled to not exceed 65°C. When personnel need to enter the chamber for non-destructive testing or other operations during the test, the outlet temperature of the heating fan should be lowered to approximately 30°C, and the insulation tarpaulin on the top of the chamber should be opened to reduce the ambient temperature to a level permissible for personnel entry. The above is merely an illustrative example illustrating that the outlet temperature of the heating fan can be adjusted according to different usage conditions. Those skilled in the art can adjust it according to actual usage conditions; this embodiment is not specifically limited.

[0062] It should be noted that step S300 is executed after the experiment begins. For example, step S300 may be executed after step S000; for example, step S300 may be executed simultaneously with steps S100 and S200; for example, step S300 may be executed before step S100; for example, step S300 may be executed simultaneously with step S100 and stop when step S200 is executed. Figure 3 The process sequence in this example is merely illustrative. Those skilled in the art can select the execution order of step S300 in the experiment according to the actual use case. There are no specific restrictions in this embodiment.

[0063] In the method for raising and controlling the temperature of the primary loop pressure test of the high-temperature gas-cooled reactor in this embodiment, hot air is continuously supplied to the primary loop chamber by a heating fan to raise and control the ambient temperature of the primary loop chamber. In addition, the power and air volume required by the heating fan can be obtained according to the primary loop temperature control target value and the ambient temperature, so as to effectively control the primary loop temperature and meet the temperature requirements during the primary loop pressure test.

[0064] The following will combine Figure 4 The specific steps of the method for increasing and controlling the temperature of the primary loop pressure test of the high-temperature gas-cooled reactor in the embodiment are further described.

[0065] For example, such as Figure 4 As shown, the method for increasing and controlling the temperature of the primary loop pressure test of a high-temperature gas-cooled reactor also includes:

[0066] S400: During the primary air intake stage, the primary air intake temperature is increased by a pre-installed heat preservation and heating device on the intake pipe.

[0067] For example, the heat preservation and heating device includes one or more of a heat tracing cable, a laid insulation material, and an electric heater. Those skilled in the art can set other heat preservation and heating devices according to actual usage needs, and no specific limitations are imposed in this embodiment.

[0068] For example, the primary circuit intake air temperature can be increased to above 20°C by installing a heat-insulating heating device on the primary circuit intake pipe. For example, when the primary circuit pressure test is conducted in a season with low ambient temperature, the primary circuit compressor and part of the primary circuit intake pipe are located outdoors, resulting in a low primary circuit intake air temperature. During the primary circuit pressure test, a large amount of low-temperature compressed air is continuously injected, affecting the temperature rise of the primary circuit. Therefore, the primary circuit intake air temperature can be increased to above 20°C by installing a heating tape and insulation material or installing an electric heater on the primary circuit. It should be noted that the heat-insulating heating device pre-installed on the intake pipe is not only applicable to test conditions with low ambient temperature but also to other ambient temperatures. When applied to other ambient temperatures, those skilled in the art can set the temperature value to be increased by installing the heat-insulating heating device on the primary circuit intake pipe according to actual usage requirements; this embodiment does not impose specific limitations.

[0069] It should be noted that step S400 is executed after the experiment begins. For example, step S400 may be executed after step S000; for example, step S400 may be executed after step S100 and before step S200; for example, step S400 may be executed simultaneously with steps S100 and S200; for example, step S400 may be executed before step S100; for example, step S400 may be executed simultaneously with step S100 and stop when step S200 is executed. Figure 4 The process sequence in this example is merely illustrative. Those skilled in the art can select the execution order of step S400 in the experiment according to the actual usage. There are no specific restrictions in this embodiment.

[0070] In the method for raising and controlling the temperature of the primary loop gas pressure test of the high-temperature gas-cooled reactor in this embodiment, the primary loop inlet temperature is raised by a heat preservation and heating device pre-installed on the inlet pipe, thereby raising and controlling the temperature of the primary loop to meet the temperature requirements during the primary loop gas pressure test.

[0071] The following will combine Figure 5 This disclosure describes a temperature rise and control system for a primary loop pressure test of a high-temperature gas-cooled reactor, according to another embodiment of the present disclosure.

[0072] For example, such as Figure 5 As shown, the temperature rise and control system for the primary loop pressure test of the high-temperature gas-cooled reactor includes:

[0073] A primary circuit heating device 100 is used to heat the primary circuit during the low-pressure stage of the primary circuit;

[0074] The exhaust pressure reduction control device 200 is used to slow down the temperature drop in the primary circuit by controlling the exhaust pressure reduction rate in the primary circuit during the primary circuit exhaust pressure reduction phase.

[0075] In the temperature rise and control system for the primary loop pressure test of the high-temperature gas-cooled reactor in this embodiment, the technical characteristics of the high-temperature reactor and the configuration of the system equipment are combined, and the existing conditions of the high-temperature gas-cooled reactor are fully utilized. By adopting a comprehensive temperature rise and control strategy, such as low-pressure preheating and controlling the temperature drop during the depressurization stage, the temperature of the primary loop is raised and controlled to meet the temperature requirements during the primary loop pressure test. This overcomes the difficulties in raising and ensuring the primary loop temperature, effectively raises the primary loop temperature to above the non-ductile transition temperature, and can maintain temperature stability according to test needs. It has the advantages of high reliability, simplicity and ease of implementation, and controllable cost.

[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0077] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A method for increasing and controlling the temperature during primary loop pressure testing of a high-temperature gas-cooled reactor, characterized in that, The method includes: During the low-voltage phase of the primary circuit, the primary circuit is heated; During the primary circuit exhaust pressure reduction stage, the temperature drop of the primary circuit is slowed down by controlling the primary circuit exhaust pressure reduction rate. The method of mitigating the temperature drop of the primary circuit by controlling the primary circuit exhaust pressure reduction rate includes: controlling the temperature drop rate of the ceramic stack by controlling the primary circuit exhaust pressure reduction rate to not exceed 0.3 MPa / h, so as to mitigate the temperature drop of the primary circuit by releasing heat through the ceramic stack.

2. The method for increasing and controlling the primary loop pressure test temperature of a high-temperature gas-cooled reactor according to claim 1, characterized in that, The heating of the primary circuit includes: The primary circuit is heated to approximately 50°C by the main helium blower.

3. The method for increasing and controlling the primary loop pressure test temperature of a high-temperature gas-cooled reactor according to claim 1, characterized in that, Before heating the primary circuit during the low-voltage phase of the primary circuit, the method further includes: The primary loop compartment is sealed off, the cooling system is shut down, and heat dissipation is reduced.

4. The method for increasing and controlling the primary loop pressure test temperature of a high-temperature gas-cooled reactor according to claim 3, characterized in that, The cooling system includes at least one of a waste heat removal system, a support cooling system, and a shielded cooling water system.

5. The method for raising and controlling the primary loop pressure test temperature of a high-temperature gas-cooled reactor according to any one of claims 1 to 3, characterized in that, The method further includes: Hot air is continuously supplied to the primary loop compartment through a pre-set heating fan that is in fluid communication with the primary loop compartment in order to maintain the ambient temperature of the primary loop compartment.

6. The method for increasing and controlling the primary loop pressure test temperature of a high-temperature gas-cooled reactor according to claim 5, characterized in that, The continuous supply of hot air into the primary loop compartment via a pre-installed heating fan that is in fluid communication with the primary loop compartment includes: The power and air volume required by the heating fan are obtained based on the target value of the primary circuit temperature control and the ambient temperature. The inlet air temperature and inlet air flow of the heating fan are then adjusted according to the power and air volume.

7. The method for raising and controlling the primary loop pressure test temperature of a high-temperature gas-cooled reactor according to any one of claims 1 to 3, characterized in that, The method further includes: During the primary air intake stage, the primary air intake temperature is increased by a pre-installed heat preservation and heating device on the intake pipe.

8. The method for increasing and controlling the primary loop pressure test temperature of a high-temperature gas-cooled reactor according to claim 7, characterized in that, The heat preservation and heating device includes at least one of a heat tracing cable, a laid insulation material, and an electric heater.

9. A temperature rise and control system for the primary loop pressure test of a high-temperature gas-cooled reactor, characterized in that, include: A primary circuit heating device is used to heat the primary circuit during the low-pressure phase of the primary circuit; An exhaust pressure reduction control device is used to slow down the temperature drop of the primary circuit by controlling the exhaust pressure reduction rate of the primary circuit during the exhaust pressure reduction stage. Specifically, the device controls the temperature drop rate of the ceramic stack by controlling the exhaust pressure reduction rate of the primary circuit to not exceed 0.3 MPa / h, so as to slow down the temperature drop of the primary circuit by releasing heat through the ceramic stack.

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