Analog front-end architecture for capacitive pressure sensors

Abstract

The invention relates to an analog front-end architecture (100) for a capacitive pressure sensor (109), having a low-noise amplifier unit (101) for amplifying a sensor signal of the capacitive pressure sensor (109) in a low-noise manner, wherein the low-noise amplifier unit (101) comprises a first integrator unit (103) and a second integrator unit (105), wherein the first integrator unit (103) is connected to input terminals (INP, INN) of the low-noise amplifier unit (101) and is configured as a rectangular wave train integrator and is set up for amplifying the sensor signal of the capacitive pressure sensor (109) according to a rectangular wave train integration technique, and wherein the second integrator unit (105) is connected to output terminals (OUT1, OUT2) of the low-noise amplifier unit (101) and is set up for integrating an amplified voltage signal of the first integrator unit (103).

Description

Technical Field

[0001] This invention relates to an analog front-end architecture for a capacitive pressure sensor. Background Technology

[0002] Pressure sensors are widely used in automotive and consumer applications. Historically, pressure sensors based on piezoresistive materials were used. More recently, capacitive pressure sensors based on microelectromechanical systems (MEMS) have become increasingly popular. Their widespread use in smartphones, smartwatches, wearables, and the Internet of Things (IoT) leverages their key advantages: optimized noise and current consumption, and improved total cost of ownership (TCO). MEMS sensors are used in conjunction with electronic interface circuitry that enables accurate measurement of the pressure. To attach analog sensor systems to digital systems, an analog front-end architecture (AFE) is typically used, which amplifies the sensor signal and converts the analog sensor signal into a digital signal. In most AFE architectures used for MEMS sensors, the first amplifier is the most critical module in terms of noise and power. Traditional solutions use linear amplifiers configured as charge-to-voltage converters with capacitive feedback. This simple architecture suffers from output noise aliasing due to the high bandwidth of the charge-to-voltage converter, which is necessary for small residual errors in the transient response. Summary of the Invention

[0003] Therefore, the objective of this invention is to provide an improved analog front-end architecture for capacitive pressure sensors.

[0004] This task is solved by the method and system according to the independent claims. The advantageous configuration is the subject of the dependent claims.

[0005] According to one aspect of the present invention, an analog front-end architecture for a capacitive pressure sensor is provided, the analog front-end architecture having a low-noise amplifier unit for amplifying the sensor signal of the capacitive pressure sensor in a low-noise manner, wherein the low-noise amplifier unit includes a first integrator unit and a second integrator unit, wherein the first integrator unit is connected to the input terminal of the low-noise amplifier unit, configured as a rectangular wave train integrator and configured to amplify the input signal of the low-noise amplifier unit according to the rectangular wave train integration technique, and wherein the second integrator unit is connected to the output terminal of the low-noise amplifier unit and configured to integrate the amplified voltage signal of the first integrator unit.

[0006] This provides the following technical advantages: an improved analog front-end architecture for capacitive pressure sensors can be provided. The sensor signal of the capacitive pressure sensor can be amplified with low noise using a low-noise amplifier unit. The combination of a first integrator unit and a second integrator unit, configured as a rectangular waveguide integrator, achieves improved noise and power performance. Furthermore, by using rectangular waveguide integration technology in a closed-loop architecture, high stability, repeatability, and accuracy of the sensor signal amplification can be achieved, where the voltage signal of the pressure sensor is accurately reproduced through signal amplification. The use of rectangular waveguide integration technology also reduces the need for integrator-transconductor amplifier configurations. The aliasing of the first amplifier and the improvement of the noise power ratio of the first integrator-transconductor amplifier.

[0007] According to one embodiment, the low-noise amplifier unit is configured as a negative closed-loop architecture and includes a feedback unit configured to refeed a charge proportional to the amplified voltage signal from the output of the second integrator unit back into the input terminals of the low-noise amplifier unit.

[0008] This allows for the following technical advantages: if the negative loop is precisely designed, the voltage variation at the input terminals of the low-noise amplifier unit can be reduced by using an amplified voltage signal at the input terminals, based on the balance between the charge fed in by the connected capacitive pressure sensor and the charge feedback from the LNA. This reduces or eliminates the nonlinear amplifier characteristics of the low-noise amplifier unit caused by a step rise in the voltage signal applied to the input terminals. Consequently, improved amplifier characteristics can be achieved.

[0009] According to one embodiment, the feedback unit includes at least one feedback switching element, wherein the effects of high-frequency sampling of the analog-to-digital converter connected to the output of the low-noise amplifier unit can be suppressed by the feedback switching element.

[0010] This allows for the following technical advantages: the negative impact of high-frequency sampling of the analog-to-digital converter connected to the analog front-end architecture in the low-noise amplifier unit can be reduced through the feedback unit. This, in turn, improves amplifier characteristics.

[0011] According to one embodiment, the feedback unit includes at least one feedback capacitor element, wherein the feedback capacitor element enables the amplified voltage signal fed back from the second integrator unit to the low-noise amplifier unit to be matched with the charge signal of the capacitive pressure sensor connected to the input terminal of the low-noise amplifier unit.

[0012] This achieves the following technical advantages: The voltage signal fed into the input terminal of the low-noise amplifier unit by the feedback capacitor element can be matched to the voltage signal of the capacitive pressure sensor. Through multiple integration cycles of the low-noise amplifier unit, the LNA negative loop matches the charge fed into the input terminal through the feedback unit to the value of the charge fed into the capacitive pressure sensor. This reduces the voltage difference between the voltage signal of the capacitive pressure sensor and the voltage acting on the input terminal of the low-noise amplifier unit to zero, thereby achieving the direct linearity of the low-noise amplifier unit, which in turn optimizes the amplifier characteristics.

[0013] According to one embodiment, the first integrator unit includes a transconductor, wherein the integrator unit includes an operational transconductor amplifier.

[0014] Therefore, the following technical advantages can be achieved: reliable, accurate and low-noise amplifier characteristics can be realized through the transconductance of the first integrator unit and the operational transconductance amplifier of the second integrator unit.

[0015] According to one embodiment, the first integrator unit includes a transconductor, a demodulator unit having a plurality of demodulator switching elements, and at least one integrator capacitor element, wherein the first integrator unit is connected to a subsequent integrator unit via a shared integrator capacitor element.

[0016] This allows for the following technical advantages: improvements to the first integrator unit and the connected second integrator unit, as well as low-noise amplifier characteristics. Rectangular wave train integration technology can be implemented at arbitrary integration steps using the demodulator unit and multiple demodulator switching elements.

[0017] According to one embodiment, the analog front-end architecture also includes a multiplexer unit connected to a low-noise amplifier unit, wherein the sensor signal of the temperature sensor can be fed into the analog front-end architecture through the multiplexer unit.

[0018] Therefore, the following technical advantages can be achieved: the analog front-end architecture can amplify and process not only the sensor signal of the capacitive pressure sensor but also the sensor signal of the additional temperature sensor. Thus, the analog front-end architecture can simultaneously process signals from different sensors, thereby improving the measurement characteristics of the capacitive pressure sensor. By considering the sensor signal from the temperature sensor, the pressure sensor value of the capacitive pressure sensor can be compensated. This improves the applicability of the analog front-end architecture of this invention.

[0019] According to one embodiment, the analog front-end architecture also includes a dual sampling unit with multiple sampler switching elements, wherein the polarity between the output terminals of the capacitive pressure and temperature sensors and the input terminals of the low-noise amplifier unit is interchangeable.

[0020] This allows for the following technical advantages: any residual offset from the analog front-end architecture can be removed through the associated double-sampling technique. This improves the measurement accuracy of pressure and temperature sensors.

[0021] According to one implementation, the analog front-end architecture can operate continuously or with a configurable power duty cycle.

[0022] This allows for the following technical advantages: it improves the applicability of analog front-end architectures by enabling them to operate continuously or with individually configured power duty cycles.

[0023] According to one implementation, the analog front-end architecture is compatible with capacitive MEMS pressure sensors, particularly with capacitive MEMS pressure sensors having a capacitive Wheatstone full bridge or a capacitive Wheatstone half bridge, or having a single active capacitor with or without a reference capacitor.

[0024] This allows for the following technical advantages: providing a simulated front-end architecture with the widest possible applicability. Attached Figure Description

[0025] Embodiments of the present invention are illustrated in the following figures. In the schematic diagrams:

[0026] Figure 1 A schematic diagram of an analog front-end architecture according to one implementation is shown;

[0027] Figure 2 It shows according to Figure 1 The time curve of the takt scheme for the analog front-end architecture in the implementation method;

[0028] Figure 3 Another schematic diagram of an analog front-end architecture according to another embodiment is shown;

[0029] Figure 4 Another schematic diagram of an analog front-end architecture according to another embodiment is shown; and

[0030] Figure 5 A schematic diagram illustrating the time progression of measurement characteristics of a sensor system with an analog front-end architecture according to one embodiment is shown. Detailed Implementation

[0031] Figure 1A schematic diagram of an analog front-end architecture 100 according to one embodiment is shown.

[0032] In the illustrated embodiment, the analog front-end architecture 100 includes a low-noise amplifier unit 101. The low-noise amplifier unit 101 includes a first integrator unit 103 configured as a rectangular wave train integrator and includes a second integrator unit 105. The analog front-end architecture 100 is also configured as a closed-loop architecture and includes a feedback unit 107.

[0033] In the illustrated embodiment, the first integrator unit 103 includes a transconductor Gm, a demodulator unit 104, and two integrator capacitor elements CG and CS. The second integrator unit 105 includes an operational transconductor amplifier OTA, which is configured as an alternating capacitor integrator.

[0034] In the illustrated embodiment, the analog front-end architecture 100 is connected to a capacitive pressure sensor 109, which is attached to the analog front-end architecture 100 via first input terminals and second input terminals INP and INN. The capacitive pressure sensor 109 is operated by a driver 111. The capacitive pressure sensor 109 is configured as a capacitive Wheatstone bridge and includes two sensor capacitor elements CACT and two reference capacitor elements CREF.

[0035] In the analog front-end architecture 100, the LNA low-noise amplifier unit 101 is also connected to the analog-to-digital converter (ADC) via a first output terminal and second output terminals OUT1 and OUT2. The ADC includes two converter switching elements ADC1.

[0036] The transconductor Gm is connected to the first input terminal INP via the first wire L1 and to the second input terminal INN via the second wire L2. The demodulator unit 104 is connected to both the transconductor Gm of the first integrator unit 103 and the integrator capacitor elements CG and CS via the first wire L1 and the second wire L2. The operational transconductor amplifier OTA is connected to the first output terminal OUT1 via the first wire L1 and to the second output terminal OUT2 of the LNA low-noise amplifier unit 101 of the analog front-end architecture 100 via the second wire L2.

[0037] The demodulator unit 104 includes two first demodulator switching elements GM1, which are respectively arranged in the first conductor L1 and the second conductor L2. Furthermore, the demodulator unit 104 includes two second demodulator switching elements GM2, which are respectively arranged in the third conductor L3 and the fourth conductor L4. The third conductor L3 and the fourth conductor L4 represent a cross connection between the first conductor L1 and the second conductor L2.

[0038] The second integrator unit 105 further includes two first integrator capacitor elements CS and two second integrator capacitor elements CINT, which are arranged in pairs in the first conductor L1 and the second conductor L2, respectively. The operational transconductance amplifier OTA is connected to the first conductor L1 and the second conductor L2 via a seventh conductor L7 and an eighth conductor L8, respectively. The seventh conductor L7 has two connection points with the first conductor L1, and the eighth conductor L8 has two connection points with the second conductor L2. The second integrator capacitor elements CINT are arranged between the two connection points of the seventh conductor L7 and the first conductor L1, or between the two connection points of the eighth conductor L8 and the second conductor L2.

[0039] The first integrator unit 103 and the second integrator unit 105 are respectively connected via an integrator capacitor element CG. The integrator capacitor element CG is arranged in the thirteenth conductor L13, which is the connection between the first conductor L1 and the second conductor L2.

[0040] The first integrator switching element INT1 is also connected to the first wire L1 and the common-mode voltage VCM via the fifth wire L5. The fourteenth wire L14 establishes the connection between the second integrator switching element INT2, the first wire L1, and the common-mode voltage VCM.

[0041] Another first integrator switching element INT1 is connected to the second wire L2 and the common-mode voltage VCM via the sixth wire L6.

[0042] The fifteenth conductor L15 establishes a connection between another second integrator switching element INT2, the second conductor L2, and the common-mode voltage VCM. A first integrator capacitor element CS is positioned in the first conductor L1 between the connection points of the first conductor L1 and the fifth conductor L5 and the fourteenth conductor L14. Another first integrator capacitor element CS is positioned in the second conductor L2 between the connection points of the second conductor L2 and the sixth conductor L6 and the fifteenth conductor L15.

[0043] Feedback unit 107 includes a tenth wire L10 and a twelfth wire L12. The tenth wire connects the second output terminal OUT2 to the first input terminal INP, and the twelfth wire connects the first output terminal OUT1 to the second input terminal INN. Feedback unit 107 also includes a ninth wire L9 and an eleventh wire L11. The ninth wire connects the first output terminal OUT1 to the tenth wire L10, and the eleventh wire connects the second output terminal OUT2 to the twelfth wire L12. In the tenth wire L10, feedback unit 107 also includes a second feedback switch element FB2, a fourth feedback switch element FB4, and a feedback capacitor element CFB. Similarly, in the twelfth wire L12, feedback unit 107 also includes a second feedback switch element FB2, a fourth feedback switch element FB4, and a feedback capacitor element CFB. The fourth feedback switch element FB4 is arranged between the feedback capacitor element CFB and the input terminals INP and INN, respectively. In the ninth wire L9 and the eleventh wire L11, a first feedback switch element FB1 is also provided, respectively. In addition, the feedback unit 107 also has a sixteenth wire L16 and a seventeenth wire L17, wherein the sixteenth wire L16 is the connection between the tenth wire L10 and another common-mode voltage VCM and has a third feedback switching element FB3, and wherein the seventeenth wire L17 is the connection between the twelfth wire L12 and another common-mode voltage VCM and has a third feedback switching element FB3.

[0044] After multiple switching cycles of the first integrator unit 103 and the second integrator unit 105, the charge fed into the input terminals of the front-end architecture 100 via the feedback unit 107 perfectly compensates for the signal charge acting on the first and second input terminals INN and INP by the capacitive pressure sensor 109. The negative impact of high-frequency sampling performed by the analog-to-digital converter (ADC) during the feedback period of the feedback unit 107 can also be suppressed by the fourth feedback switch element FB4. Through the first to third feedback switch elements FB1, FB2, and FB3, the feedback through the feedback unit 107—that is, the feedback voltage fed into the input terminals of the analog front-end architecture 100—can be matched to the rectangular wave train integration cycle.

[0045] In particular, the first integrator capacitor element CS and the feedback capacitor element CFB can be configured as adjustable capacitors, thereby allowing tuning of the individual switching elements and capacitor elements, and optimized amplification can be achieved through the low-noise amplifier unit 101.

[0046] Based on the voltage signals acting on the first and second input terminals INP and INN, the transconductor Gm generates a corresponding current value. These current values ​​are integrated over the integration time TG, and the integrator capacitor element CG is charged accordingly. After the integration time TG ends, the charge on the integrator capacitor element CG is discharged into the operational transconductor amplifier OTA. This allows for the integration of the voltage signal from the pressure or temperature sensor. The integration time TG can be arbitrarily configured using the corresponding switching characteristics of the first and second demodulator switching elements GM1 and GM2. The switching characteristics of the first and second integrator switching elements INT1 and INT2, or the first to fourth feedback switching elements FB1, FB2, FB3, and FB4, can be matched to the switching characteristics of the first and second demodulator switching elements GM1 and GM2. Furthermore, the first integrator capacitor element CS or the feedback capacitor element CFB can be matched to optimize the switching or integration characteristics of the low-noise amplifier unit 101.

[0047] Figure 2 It shows Figure 1 The timing diagram of the clock scheme for the implementation of the analog front-end architecture 100.

[0048] Figure 2The switching characteristics of driver 111, first demodulator switching elements and second demodulator switching elements GM1, GM2, first integrator switching elements and second integrator switching elements INT1, INT2, first feedback switching elements to fourth feedback switching elements FB1, FB2, FB3, FB4, and converter switching element ADC1 are illustrated. Through the corresponding interconnections of the first and second demodulator switching elements GM1, GM2 and the first and second integrator switching elements INT1, INT2, the charge fed into the first and second input terminals INP, INN of the capacitive pressure sensor 109 can be integrated using the first integrator unit 103 via rectangular wave train integration. Through the corresponding interconnections of the first feedback switching elements to the third feedback switching elements FB1, FB2, FB3, the corresponding feedback of feedback unit 107 can be modulated to amplify according to the rectangular wave train integration technique, in which the changed signal is fed back to the input terminals of analog front-end architecture 100 proportionally to the output charge signal of second integrator unit 105. By using the fourth feedback switch element FB4, any negative impact of high-frequency sampling of the analog-to-digital converter (ADC) achieved through the corresponding interconnection of the converter switching element ADC1 can be reduced or suppressed by adapting the switching pattern of the fourth feedback switch element FB4 to the switching pattern of the converter switching element ADC1 for high-frequency sampling of the ADC. During the sampling of the first and second output terminals OUT1 and OUT2 of the low-noise amplifier unit 101 by the converter switching element ADC1, and while the feedback unit 107 is connected to the first input terminal INP and the second output terminal OUT2 via CFB OUT1, the fourth feedback switch element FB4 must be turned on for a very short time.

[0049] The switching characteristics of the switching elements shown herein are merely exemplary and do not describe any actual switching characteristics of the analog front-end architecture 100 of the present invention.

[0050] Figure 3 Another schematic diagram of an analog front-end architecture 100 according to another embodiment is shown.

[0051] Figure 3 It shows Figure 1 A simplified diagram illustrating an implementation of the analog front-end architecture 100. Figure 1 Details of the analog front-end architecture 100 shown are not included. Figure 3 As shown, the components of the analog front-end architecture 100 are in Figure 3 This is limited to the low-noise amplifier unit 101. The low-noise amplifier unit 101 is in... Figure 3 The implementation methods may include in Figure 1 All the components shown.

[0052] In the illustrated embodiment, the analog front-end architecture 100, particularly the low-noise amplifier unit 101, is similar to... Figure 1 The ground is connected to the capacitive pressure sensor 109 and the analog-to-digital converter (ADC). The capacitive pressure sensor 109 is in turn connected to the driver 111 and is configured as a capacitive Wheatstone bridge with two sensor capacitor elements CACT and two reference capacitor elements CREF.

[0053] and Figure 1 Unlike other implementations, the analog front-end architecture 100 in the illustrated embodiment also includes a multiplexer unit 115. Furthermore, the analog front-end architecture 100 is connected to a temperature sensor 113. In the illustrated embodiment, the sensor signals from the capacitive pressure sensor 109 and the temperature sensor 113 are input to the multiplexer unit 115. Using the multiplexer unit 115, both the sensor signals from the capacitive pressure sensor 109 and the temperature sensor 113 can be amplified and processed accordingly by the analog front-end architecture 100 according to a timing scheme. The sensor signals from the capacitive pressure sensor 109 and the temperature sensor 113 are introduced into the analog front-end architecture 100 as corresponding charge signals, wherein the charge signal of the capacitive pressure sensor 109 is proportional to the measured pressure, and the charge signal of the temperature sensor 113 is proportional to the measured temperature.

[0054] Figure 4 Another schematic diagram of an analog front-end architecture 100 according to another embodiment is shown.

[0055] Figure 4 based on Figure 3 The implementation methods described herein include all the features described therein. Figure 4In the analog front-end architecture 100, a dual sampling unit 117 is also included. The dual sampling unit 117 is connected to the low-noise amplifier unit 101 and the multiplexer unit 115 via a first conductor L1 and a second conductor L2. The dual sampling unit 117 includes four sampler switching elements CH1, one of which is arranged in the first conductor L1 and one in the second conductor L2. Another sampler switching element CH1 is arranged in the eighteenth conductor L18, and a fourth sampler switching element CH1 is arranged in the nineteenth conductor L19. The eighteenth and nineteenth conductors L18 and L19 are respectively cross-connections between the first and second conductors L1 and L2. Dual sampling of the sensor signal from the capacitive pressure sensor 109 and the sensor signal from the temperature sensor 113 can be performed using the dual sampling unit 117. In the case of dual sampling, the polarity of the corresponding sensor signal is swapped within two consecutive sampling cycles. Thus, any remaining offset between the capacitive pressure sensor 109 or the temperature sensor 113 and the analog front-end architecture 100 can be corrected using the associated dual sampling technique.

[0056] Figure 5 A schematic diagram of the time progression of the measurement characteristics of a sensor system having an analog front-end architecture 100 according to one embodiment is shown.

[0057] exist Figure 5 The middle shows Figure 4 The time progression of the measurement characteristics of the analog front-end architecture 100, which includes the sensor signal from the capacitive pressure sensor 109 and the sensor signal from the temperature sensor 113, is measured using a dual-sampling method. Figure 5 In the embodiments described, both the capacitive pressure sensor 109 and the temperature sensor 113 can operate in a tick-based operating mode by alternately interconnecting the sensors between a standby mode SB and an operating mode ON. Figure 5The diagram illustrates the time progression of the measurement characteristics of the two sensors during the measurement phase of the sensor operation in ON mode. According to the illustrated embodiment, the measurement phase begins with an activation phase WU, in which the pressure and temperature sensors or analog front-end architecture 100 are activated to perform measurements. In the illustrated embodiment, temperature measurement TM is performed first, followed by pressure measurement PM. After pressure measurement PM is completed, the pressure or temperature sensor switches back to standby mode SB. In the illustrated embodiment, temperature measurement TM includes a first temperature measurement T1 and a second temperature measurement T2. Pressure measurement PM includes a first pressure measurement P1 and a second pressure measurement P2. The first and second temperature measurements T1 and T2, and the first and second pressure measurements P1 and P2, are recorded here with different polarities using a dual-sampling technique, such that the voltage signal of the first temperature measurement T1 is polarized in opposite directions to the voltage signal of the second temperature measurement T2, and the voltage signal of the first pressure measurement P1 is polarized in opposite directions to the voltage signal of the second pressure measurement P2. By comparing the voltage signals of the first temperature measurement and the second temperature measurement T1, T2, or by comparing the voltage signals of the first pressure measurement and the second pressure measurement P1, P2, offset correction can be performed on the temperature sensor 113 or the corresponding pressure sensor 109. The temperature or pressure measurements can be performed in such a way that the two measurements do not interfere with each other.

Claims

1. An analog front-end architecture (100) for a capacitive pressure sensor (109) having a low-noise amplifier unit (101) for amplifying the sensor signal of the capacitive pressure sensor (109) in a low-noise manner, wherein, The low-noise amplifier unit (101) includes a first integrator unit (103) and a second integrator unit (105), wherein the first integrator unit (103) is connected to the input terminals (INP, INN) of the low-noise amplifier unit (101) and is configured as a rectangular wave train integrator and configured to amplify the sensor signal of the capacitive pressure sensor (109) according to the rectangular wave train integration technique, and wherein the second integrator unit (105) is connected to the output terminals (OUT1, OUT2) of the low-noise amplifier unit (101) and configured to integrate the amplified voltage signal of the first integrator unit (103), wherein the low-noise amplifier unit (101) is configured as a closed-loop architecture and includes a feedback unit (107) configured to refeed a charge proportional to the amplified voltage signal from the second integrator unit (105) back into the input terminals (INP, INN) of the low-noise amplifier unit (101).

2. The analog front-end architecture (100) according to claim 1, wherein, The feedback unit (107) includes at least one feedback switching element (FB1, FB2, FB3, FB4), wherein the feedback switching element (FB1, FB2, FB3, FB4) can suppress the influence of high-frequency sampling of the analog-to-digital converter (ADC) connected to the output of the low-noise amplifier unit (101).

3. The analog front-end architecture (100) according to claim 1 or 2, wherein, The feedback unit (107) includes at least one feedback capacitor element (CFB), wherein the voltage signal of the second integrator unit (105) is matched with the voltage signal of the capacitive pressure sensor (109) through the feedback capacitor element (CFB), and the voltage signal of the second integrator unit (105) is returned to the low noise amplifier unit (101) for amplification, and the capacitive pressure sensor (109) is connected to the input terminals (INP, INN) of the low noise amplifier unit (101).

4. The analog front-end architecture (100) according to claim 1 or 2, wherein, The first integrator unit (103) includes a transconductor (Gm), and the second integrator unit (105) includes an operational transconductor amplifier (OTA).

5. The analog front-end architecture (100) according to any one of the preceding claims, wherein, The first integrator unit (103) includes a demodulator unit (104) having a plurality of demodulator switching elements (GM1, GM2) and includes at least one integrator capacitor element (CG), wherein the first integrator unit (103) is connected to the second integrator unit (105) through the integrator capacitor element (CG).

6. The analog front-end architecture (100) according to any one of the preceding claims further includes a multiplexer unit (115) connected to the low-noise amplifier unit (101), wherein, The multiplexer unit (115) can feed the sensor signal of the temperature sensor (113) into the analog front-end architecture (100).

7. The analog front-end architecture according to any one of the preceding claims further includes a dual sampling unit (117) having a plurality of sampler switching elements (CH1), wherein, Through the dual sampling unit (117), the polarity between the output terminal (SO) of the capacitive pressure sensor (109) and the input terminals (INP, INN) of the low-noise amplifier unit (101) can be interchanged.

8. The analog front-end architecture (100) according to any one of the preceding claims, wherein, The analog front-end architecture (100) can operate continuously or with a configurable power duty cycle.

9. The analog front-end architecture (100) according to any one of the preceding claims, wherein, The analog front-end architecture (100) is compatible with capacitive MEMS pressure sensors.

10. The analog front-end architecture (100) according to claim 9, wherein, The capacitive MEMS pressure sensor is constructed as a capacitive Wheatstone full bridge, a capacitive Wheatstone half bridge, or a capacitive MEMS pressure sensor with or without a single active capacitor and a reference capacitor.

Images