A display device and its manufacturing method

Abstract

This invention discloses a display device and its manufacturing method. The display device includes a display panel and a backlight module located on the light-incident side of the display panel. The backlight module includes a lamp board. The first conductive portion of the first circuit layer of the lamp board is formed by filling a pre-soldering solution into the imprinted recess after stamping and then curing. The light source and the first conductive portion are electrically connected through curing. Compared with the soldering method using reflow soldering and other processes in related technologies, this method omits the solder paste printing process, thereby avoiding the problem of low light source transfer yield caused by misaligned or skewed solder paste application.

Description

[0001] This application claims priority to Chinese Patent Application No. 202210168788.1, filed on February 23, 2022, entitled "A Display Device and a Method of Manufacturing", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of display technology, and more particularly to a display device and its manufacturing method. Background Technology

[0003] Mini LED (Mini Light Emitting Diode) has become a hot topic as a backlight in liquid crystal displays (LCDs). It can significantly improve the existing display effect, not only enabling the backlight to be thinner, but also achieving more refined dynamic control and improving the dynamic contrast of the LCD.

[0004] Current Mini LED circuit boards mostly employ etching processes, where copper is coated onto the substrate surface, followed by exposure, development, and etching to complete the circuit layer fabrication. When fabricating the LED board using this process, solder paste needs to be applied, the Mini LED transferred, and finally, reflow soldering is used to complete the electrical connection between the Mini LED and the circuit layer on the circuit board. As Mini LED sizes decrease or the size of the circuit boards increases, the precision requirements for solder paste application become increasingly stringent, making it prone to misalignment and uneven application, leading to low Mini LED transfer yield. Summary of the Invention

[0005] In a first aspect of the present invention, a display device is provided, the display device comprising:

[0006] Display panel, used for image display;

[0007] A backlight module is located on the light-incident side of the display panel; the backlight module includes a lamp panel that serves as a light source.

[0008] The light panel includes:

[0009] substrate;

[0010] The first circuit layer is located on the side of the substrate facing the display panel; the first circuit layer includes:

[0011] The first imprint layer includes a first recessed portion recessed toward one side of the substrate, and the first recessed portion forms a circuit pattern of the first circuit layer.

[0012] The first conductive part is located in the first recessed part and serves as the line of the first circuit layer.

[0013] The first conductive part is formed by curing a pre-solution; the pre-solution includes a polymer, a crosslinking agent, a conductive material, and an initiator.

[0014] During the fabrication of the light board, the light source is transferred to pads formed by a pre-soldering solution. After curing, the pre-soldering solution forms the first conductive part, completing the electrical connection with the light source. Simultaneously, because the pre-soldering solution contains polymers, the polar groups in the polymers have a certain adhesiveness to the light source, which also helps improve the transfer yield. Compared to related technologies that use reflow soldering and other processes for welding, this method omits the solder paste printing process, thus avoiding the problem of low light source transfer yield caused by misaligned or uneven solder paste application. Furthermore, the fabrication of the first circuit layer involves imprinting a first recessed area on the first imprint layer to form a circuit pattern, and then filling the first recessed area with the pre-soldering solution to cure and form the first conductive part. Compared to related technologies, this method eliminates the need for complex processes such as exposure, development, and etching, greatly simplifying the process steps and avoiding environmental problems caused by etching waste liquid.

[0015] In some embodiments of the present invention, the polymer may be selected from at least one of hyperbranched polyurethane acrylate and polymethyl methacrylate.

[0016] In some embodiments of the present invention, the crosslinking agent may be at least one of trimethylolpropane triacrylate and polyethylene glycol diacrylate.

[0017] In some embodiments of the present invention, the conductive material may be selected from silver nanoparticles.

[0018] In some embodiments of the present invention, the initiator may be a thermal initiator or a photoinitiator;

[0019] Azo initiators can be selected as thermal initiators;

[0020] The photoinitiator can be 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone.

[0021] In some embodiments of the present invention, the lamp board further includes: a plurality of light sources and a protective layer. The plurality of light sources are located on the side of the first circuit layer away from the substrate; the light sources are electrically connected to a first conductive portion of the first circuit layer; the protective layer, located on the side of the first circuit layer away from the substrate, includes a plurality of openings for exposing the light sources; wherein, the light sources may be Mini LEDs; the material of the protective layer may be white oil.

[0022] In a second aspect of the invention, another display device is provided, the display device comprising:

[0023] Display panel, used for image display;

[0024] A backlight module is located on the light-incident side of the display panel; the backlight module includes: a lamp panel, which serves as the light source for the backlight module;

[0025] The light panel includes:

[0026] substrate;

[0027] The first circuit layer is located on the side of the substrate facing the display panel;

[0028] The second circuit layer is located on the side of the substrate away from the display panel;

[0029] The area of ​​the circuit in the first circuit layer projected onto the substrate is larger than the area of ​​the circuit in the second circuit layer projected onto the substrate, and the projection of the circuit in the first circuit layer onto the substrate completely covers the projection of the circuit in the second circuit layer onto the substrate; the circuits in the first circuit layer and the circuits in the second circuit layer are electrically connected through vias in the substrate.

[0030] The circuitry in the second layer is concentrated in a smaller area, which reduces the amount of conductive material used and saves costs.

[0031] In some embodiments of the present invention, the first line layer includes:

[0032] The first imprint layer is located on the side of the substrate facing the display panel; the first imprint layer includes a first recessed portion recessed towards one side of the substrate, and the first recessed portion forms the circuit pattern of the first circuit layer.

[0033] The first conductive portion is located within the first recessed portion and serves as the wiring of the first circuit layer.

[0034] The second line layer includes:

[0035] The second imprint layer is located on the side of the substrate away from the display panel; the second imprint layer includes a second recessed portion recessed towards one side of the substrate, and the second recessed portion forms the circuit pattern of the second circuit layer.

[0036] The second conductive portion, located within the second recess, serves as the wiring of the second circuit layer. The circuit patterns of the first and second circuit layers are formed through an imprinting process, and the wiring of the first and second circuit layers is formed by filling with conductive material. This process is simple and avoids material waste and environmental pollution caused by etching and other processes.

[0037] In some embodiments of the present invention, a pre-solution can be used to fill a first recess to form a first conductive portion, and a pre-solution can be used to fill a second recess to form a second conductive portion. The materials used to prepare the pre-solution include: a polymer, a crosslinking agent, a conductive material, and an initiator.

[0038] In some embodiments of the present invention, the substrate is made of a flexible insulating material, which can be combined with the Roll to Roll process to manufacture the lamp board, resulting in high manufacturing efficiency and enabling the fabrication of large-size circuits.

[0039] In some embodiments of the present invention, the lamp board further includes: multiple light sources and multiple driver chips. The multiple driver chips are electrically connected to the light sources through the lines of the first circuit layer. At least two driver chips are cascaded through the lines of the second circuit layer. The cascaded chips can be connected to the control board through a connecting line.

[0040] In some embodiments of the present invention, the lamp board is connected to the control board by binding a flexible circuit board; wherein one end of the flexible circuit board is bound to the first circuit layer or the second circuit layer.

[0041] In some embodiments of the present invention, the lamp board is connected to the adapter board via a flexible circuit board, and the adapter board is connected to the control board via a connecting cable; one end of the flexible circuit board is bonded to the first circuit layer or the second circuit layer, and the other end of the flexible circuit board is connected to the connection terminal on the adapter board. This reduces connection difficulty and cost.

[0042] In some embodiments of the present invention, the lines of the second circuit layer are distributed in multiple mutually separated regions; the display device includes multiple flexible circuit boards; the multiple flexible circuit boards are arranged in a one-to-one correspondence with the multiple mutually separated regions; the display device includes an adapter board, the adapter board includes multiple connection terminals, and one connection terminal is connected to one flexible circuit board; or, the display device includes multiple adapter boards, and one flexible circuit board is connected to a connection terminal on one adapter board.

[0043] In some embodiments of the present invention, the backlight module further includes: auxiliary components; the auxiliary components are located on the side of the first circuit layer facing the display panel and are electrically connected to the first circuit layer; or, at least some of the auxiliary components are disposed on an adapter board. Disposing some of the auxiliary components on the adapter board can reduce the complexity of the circuit design for the first circuit layer.

[0044] In some embodiments of the present invention, the light source is a Mini LED. Compared with ordinary LEDs, Mini LEDs have a smaller size, which means that more light sources can be set on the same area of ​​the light panel, providing higher backlight brightness and more delicate zone control effect.

[0045] In a third aspect of the present invention, a method for manufacturing a display device is provided, comprising:

[0046] Prepare the pretreatment solution;

[0047] An imprinting adhesive is applied to one side surface of the substrate to form a first imprinting layer;

[0048] The first imprinted layer is imprinted to form the first recessed portion;

[0049] The first recess is filled with the pre-prepared solution;

[0050] The light source is moved to the side of the pretreatment solution away from the substrate, so that the light source comes into contact with the pretreatment solution;

[0051] The pre-solution is solidified to form a first conductive part, and the light source is electrically connected to the first conductive part to form a lamp board.

[0052] The manufacturing process of the light board eliminates the need for solder paste printing, thus avoiding the problem of low light source transfer yield caused by misaligned or uneven solder paste application. Furthermore, the process eliminates the need for complex steps such as exposure, development, and etching, greatly simplifying the manufacturing process and avoiding environmental issues caused by etching waste liquid.

[0053] In some embodiments of the present invention, before transferring the light source to the side of the pre-solution away from the substrate, the method further includes:

[0054] A protective layer is formed on the side of the pretreatment solution facing away from the substrate; the protective layer includes multiple openings for exposing the light source. The protective layer protects the circuitry of the first circuit layer.

[0055] In some embodiments of the present invention, transferring the light source to the side of the pretreatment solution away from the substrate includes: transferring the light source to the side of the pretreatment solution away from the substrate and performing a hot-pressing treatment on the light source. The hot-pressing treatment presses the light source into a certain depth within the pretreatment solution, ensuring full contact between the electrodes of the light source and the conductive material, and making the lamp board structure more stable.

[0056] In a fourth aspect of the invention, another method for manufacturing a display device is provided, comprising:

[0057] Imprinting adhesive is applied to both sides of the substrate to form a first imprinting layer and a second imprinting layer.

[0058] The first embossing layer is embossed to form the first recessed portion, and the second embossing layer is embossed to form the second recessed portion;

[0059] A first circuit layer is formed by filling a first recess with conductive material, and a second circuit layer is formed by filling a second recess with conductive material.

[0060] The light source is soldered onto the first circuit layer to form a lamp board.

[0061] In embodiments of the present invention, a first circuit layer can be formed by filling a first recess with a pre-solution, and a second circuit layer can be formed by filling a second recess with a pre-solution. The materials used to prepare the pre-solution include: polymers, crosslinking agents, conductive materials, and initiators. Attached Figure Description

[0062] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0063] Figure 1 This is one of the cross-sectional structural schematic diagrams of the display device provided in the embodiments of the present invention;

[0064] Figure 2 This is one of the schematic diagrams of the lamp panel structure provided in the embodiment of the present invention;

[0065] Figure 3 This is a second schematic diagram of the lamp panel structure provided in an embodiment of the present invention;

[0066] Figure 4 One of the perspective schematic diagrams of a display device provided in an embodiment of the present invention;

[0067] Figure 5a This is a schematic diagram of the lamp board structure of a PCB circuit board using a single layer of circuitry in related technologies;

[0068] Figure 5b This is a schematic diagram of the lamp board structure of a PCB circuit board using double-layer circuitry in related technologies;

[0069] Figure 6 This is a perspective view of a display device in related technologies;

[0070] Figure 7 This is the third schematic diagram of the lamp board structure provided in the embodiment of the present invention;

[0071] Figure 8a This is the fourth schematic diagram of the lamp board structure provided in the embodiment of the present invention;

[0072] Figure 8b This is the fifth schematic diagram of the lamp board structure provided in the embodiment of the present invention;

[0073] Figure 9 This is the sixth schematic diagram of the lamp panel structure provided in the embodiment of the present invention;

[0074] Figure 10 A second perspective view of the display device provided in an embodiment of the present invention;

[0075] Figure 11 This is the seventh schematic diagram of the lamp board structure provided in the embodiment of the present invention;

[0076] Figure 12 This is one of the top views of the lamp panel structure provided in an embodiment of the present invention;

[0077] Figure 13a This is a second top view of the lamp panel structure provided in an embodiment of the present invention;

[0078] Figure 13b This is the third top view of the lamp panel structure provided in the embodiment of the present invention;

[0079] Figure 14 This is one of the flowcharts for a method of manufacturing a display device provided in an embodiment of the present invention;

[0080] Figures 15a-15e A schematic diagram of the structure corresponding to each step in the manufacturing process of the display device provided in the embodiment of the present invention;

[0081] Figure 16 This is the second flowchart of a display device manufacturing method provided in an embodiment of the present invention;

[0082] Figure 17 A schematic diagram of the structure corresponding to the steps of fabricating a protective layer for the display device provided in the embodiments of the present invention;

[0083] Figure 18 This is a schematic diagram of the hot pressing process provided in an embodiment of the present invention;

[0084] Figure 19 This is the third flowchart of the display device manufacturing method provided in the embodiments of the present invention;

[0085] Figure 20 This is a schematic diagram of the manufacturing process of the display device provided in an embodiment of the present invention.

[0086] Among them, 100-backlight module, 200-display panel, 1-lamp board, 11-light source, 12-connection terminal, 13-substrate, 14-PCB circuit board, 141-circuit layer, 15-first circuit layer, 151-first imprint layer, 152-first conductive part, 153-first recessed part, 17-protective layer, 2-back plate, 3-diffuser plate, 4-optical film, 16-second circuit layer, 161-second imprint layer, 162-second conductive part, 163-second recessed part, 21-opening, IC-driver chip, f-flexible circuit board, T-adapter board, A-auxiliary component, H-through hole, L-prepared solution, HT-hot pressing tool, BFL-buffer layer. Detailed Implementation

[0087] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. Terms describing position and direction in the present invention are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of the present invention. The accompanying drawings of the present invention are for illustrative purposes only and do not represent actual proportions.

[0088] In a first aspect of the present invention, a display device is provided.

[0089] Figure 1 This is one of the cross-sectional structural schematic diagrams of the display device provided in the embodiments of the present invention.

[0090] like Figure 1 As shown, the display device includes a backlight module 100 and a display panel 200.

[0091] The display panel 200 is located on the light-emitting side of the backlight module 100 and is used for image display. The shape and size of the display panel 200 are adapted to the shape and size of the display device. When applied to televisions or mobile terminals, the display panel 200 can be rectangular, including a top side, a ground side, a left side, and a right side, wherein the top side and the ground side are opposite each other, the left side and the right side are opposite each other, the top side is connected to one end of the left side and one side of the right side, and the ground side is connected to the other end of the left side and the other end of the right side. When applied to irregularly shaped display devices, the display panel 200 can also take the shape of a circle or other shapes, without limitation.

[0092] The display panel 200 is a transmissive display panel, capable of modulating the transmittance of light, but it does not emit light itself. The display panel 200 has multiple pixel units arranged in an array. Each pixel unit can independently control the transmittance and color of light incident from the backlight module 100 onto that pixel unit, so that the light transmitted through all pixel units constitutes the displayed image. In a specific implementation, the display panel 200 can be a liquid crystal display panel. A liquid crystal display panel places liquid crystal between two conductive glass plates. Driven by the electric field between two electrodes, the liquid crystal molecules are induced to twist, thereby controlling the transmission or blocking function of the backlight, thus displaying the image. If a color filter is added, a color image can be displayed.

[0093] The backlight module 100 is located on the light-incident side of the display panel 200, and its shape and size are adapted to the shape and size of the display panel 200. In this embodiment of the invention, the backlight module is a direct-lit backlight module, which is used to emit light uniformly throughout the entire light-emitting surface, providing the display panel 200 with sufficient brightness and uniform light distribution so that the display panel 200 can display images normally.

[0094] The backlight module 100 includes a light board that serves as the light source. In related technologies, the light board typically uses Mini LEDs (Mini Light Emitting Diodes) as the light source. Existing Mini LED circuit boards mostly employ an etching process, coating copper onto the substrate surface, followed by exposure, development, and etching processes to complete the circuit layer fabrication. When fabricating the light board using this process, solder paste needs to be applied to transfer the Mini LEDs, and finally, reflow soldering is used to complete the electrical connection between the Mini LEDs and the circuit layers in the circuit board. As the size of Mini LEDs decreases or the size of the circuit boards increases, the precision requirements for solder paste application become increasingly stringent, easily leading to misaligned or skewed solder paste application, resulting in low Mini LED transfer yield.

[0095] In view of this, in this embodiment of the invention, a lamp board made of a novel material and structure is used, which can solve the problem of low Mini LED transfer yield during the manufacturing process of display devices.

[0096] Figure 2 This is one of the schematic diagrams of the lamp panel structure provided in the embodiment of the present invention.

[0097] like Figure 2 As shown, in this embodiment of the invention, the lamp board 1 includes: a substrate 13, a first circuit layer 15, and a plurality of light sources 11.

[0098] The substrate 13, typically located at the bottom of the lamp panel 1, serves to support components such as the first circuit layer 15 and the light source 11. The shape and size of the substrate 13 are adapted to the shape and size of the backlight module 100. In some embodiments, the substrate 13 is made of BT (Bismaleimide Triazine) resin, FR4 grade heat-resistant resin, glass, or other materials with good heat resistance and a low coefficient of thermal expansion. In other embodiments, the substrate 13 may also be made of metal materials, such as aluminum and its alloys. Metal materials have good thermal conductivity, which can accelerate the heat dissipation of the lamp panel and reduce the temperature of the display device during operation. When applied to flexible display devices, the substrate 13 may also be made of flexible materials, which is not limited here.

[0099] The first circuit layer 15 is located on one side of the substrate 13. In this embodiment of the invention, the first circuit layer 15 is located on the side of the substrate 13 facing the display panel and is used to provide driving signals to the light source 11. The first circuit layer 15 includes a first imprint layer 151 and a first conductive portion 152.

[0100] The first imprinted layer 151 includes a first recessed portion 153 recessed towards one side of the substrate 13, and the first recessed portion 153 forms the circuit pattern of the first circuit layer 15. In a specific implementation, an imprinting adhesive can be uniformly coated on the surface of one side of the substrate, and then the first recessed portion can be imprinted on the imprinting adhesive through an imprinting process to form the preset circuit pattern of the first circuit layer. The imprinting adhesive can be a light-curing adhesive or a thermosetting adhesive. After imprinting, the imprinting adhesive is cured by ultraviolet light irradiation or heating to form the first imprinted layer, which is not limited here.

[0101] The first conductive portion 152 is located within the first recessed portion 153 and serves as a circuit of the first circuit layer 15. The light source 11 is located on the side of the first circuit layer 15 facing away from the substrate 13 and is electrically connected to the first conductive portion 152 of the first circuit layer 15. In specific implementations, the light source 11 can be a Mini LED, which is not limited here.

[0102] The first conductive part 152 is formed by curing a pre-solution. The materials used in the pre-solution include a polymer, a crosslinking agent, a conductive material, and an initiator. Specifically, the initiator can be a photoinitiator or a thermal initiator. Correspondingly, the pre-solution undergoes a crosslinking polymerization reaction under irradiation with light of a specific wavelength or under heating at a certain temperature, thereby curing and forming the first conductive part. The conductive material is uniformly distributed in the pre-solution, giving the first conductive part excellent conductivity. When the light source is transferred to the pre-solution, the conductive material therein initially makes an electrical connection with the light source. After curing, the connection between the light source and the conductive material is fixed, achieving the final electrical connection. Furthermore, the polymer has many polar groups, providing some adhesion to the light source, which is beneficial for improving the transfer yield of the light source. Specifically, based on the required bonding strength after curing and the conductivity requirements of the first conductive part, the materials of each component of the pre-solution and the proportions between the components are rationally selected to ensure that the first conductive part has good bonding properties and excellent conductivity.

[0103] In this embodiment of the invention, the first conductive part and the light source are electrically connected by curing. Compared with the soldering method using reflow soldering and other processes in related technologies, the process of printing solder paste is omitted, thereby avoiding the problem of low light source transfer yield caused by misaligned or skewed solder paste application. At the same time, the fabrication of the first circuit layer adopts the method of imprinting a first recessed part on the first imprint layer to form a circuit pattern, and filling the first recessed part with a pre-soldering solution to form the first conductive part. Compared with related technologies, this method does not require complex processes such as exposure, development, and etching, greatly simplifying the process steps and avoiding environmental problems caused by etching waste liquid.

[0104] In this embodiment of the invention, the polymer has numerous polar groups, exhibiting a certain degree of adhesion to the light source. During the contact process between the light source and the pre-solution, the conductive material and the light source initially form an electrical connection. After curing, the connection between the light source and the conductive material is fixed, achieving a final electrical connection and improving the transfer yield of the light source. Depending on the strength requirements, suitable polymer monomers, oligomers, etc., can be selected from the polymer. Specifically, the polymer can be one or a mixture of more than one of hyperbranched polyurethane acrylate and polymethyl methacrylate, etc., without limitation.

[0105] In this invention, the crosslinking agent contains multiple functional groups that can react with the polymer. These groups, under the action of an initiator, induce a crosslinking polymerization reaction in the polymer, resulting in curing. The oligomer molecules crosslink under the action of the crosslinking agent to form three-dimensional polymer molecules, further improving the bonding performance and the strength of the first conductive part. The crosslinking agent is selected based on the properties of the polymer. In specific implementations, the crosslinking agent can be one or a mixture of multiple types of trimethylolpropane triacrylate and polyethylene glycol diacrylate; no limitation is made here.

[0106] In this embodiment of the invention, an initiator is used to initiate a crosslinking polymerization reaction between the polymer and the crosslinking agent. The initiator is selected based on the properties of the polymer and the crosslinking agent, as well as the method of initiating the crosslinking polymerization reaction. Specifically, when using photoinitiation, a photoinitiator, such as 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone, can be selected; when using thermal initiation, a thermal initiator, such as an azo initiator, can be selected, and no limitation is made here.

[0107] In this embodiment of the invention, a conductive material is used to achieve the conductive function of the first conductive part. When preparing the pretreatment solution, the conductive material is uniformly dispersed in the pretreatment solution, so that the solidified first conductive part has excellent conductivity. The conductive material can be selected from metal microparticles with excellent conductivity, so that the conductive material can be uniformly dispersed in the pretreatment solution during preparation. In specific implementations, nano-silver particles can be selected as the conductive material, and this is not limited thereto.

[0108] Figure 3 This is the second schematic diagram of the lamp board structure provided in an embodiment of the present invention.

[0109] In embodiments of the present invention, such as Figure 3 As shown, the light panel also includes a protective layer 17.

[0110] The protective layer 17 is located on the side of the first circuit layer 15 facing away from the substrate 13, covering the surface of the first circuit layer 15 and protecting it. The protective layer 17 includes multiple openings for exposing the light source 11. In practice, the protective layer 17 can be printed onto the surface of the first circuit layer 15 using screen printing. The material of the protective layer can be an insulating material that is immiscible with or has very low solubility in the preceding solution; specifically, white oil can be used, but this is not limited to any particular material.

[0111] Figure 4 This is one of the perspective schematic diagrams of a display device provided in an embodiment of the present invention.

[0112] In embodiments of the present invention, such as Figure 4 As shown, the backlight module 100 also includes: a back plate 2, a diffuser plate 3, and an optical film 4.

[0113] The backplate 2 is located on the side of the lamp panel 1 opposite to the display panel 200, and serves a supporting and load-bearing function. The shape of the backplate 2 is adapted to the shape of the backlight module 100. The backplate 2 includes a top side, a ground side, a left side, and a right side. The top side and the ground side are opposite to each other, and the left side and the right side are opposite to each other. The top side is connected to one end of the left side and one side of the right side, respectively, and the ground side is connected to the other end of the left side and the other end of the right side, respectively.

[0114] The back plate 2 is made of aluminum, iron, aluminum alloy, or iron alloy. The back plate 2 is used to support the lamp panel 1, as well as to support and fix the edges of components such as the diffuser plate 3 and the optical film 4. The back plate 2 also serves to dissipate heat from the lamp panel 1.

[0115] The diffuser plate 3 is located on the light-emitting side of the lamp plate 1 and is at a certain distance from the lamp plate 1. This distance is set to allow sufficient light mixing between the light sources on the lamp plate. The function of the diffuser plate 3 is to scatter the incident light, making the light passing through the diffuser plate 3 more uniform.

[0116] The diffuser plate 3 contains scattering particle material. When light is incident on the scattering particle material, it undergoes continuous refraction and reflection, thereby scattering the light and achieving a uniform light distribution. The thickness of the diffuser plate is typically set between 1.5mm and 3mm. The thicker the diffuser plate, the greater the haze and the better the uniformity.

[0117] The diffuser plate 3 can usually be processed by extrusion. The material used for the diffuser plate 3 is generally selected from at least one of polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene-based materials (PS), and polypropylene (PP).

[0118] In this embodiment of the invention, the lamp panel 1 can be used to emit blue light. In this case, the diffuser plate 3 can be a quantum dot diffuser plate, used to realize color conversion and diffusion functions.

[0119] The optical film 4 is located on the side of the diffuser plate 3 facing away from the lamp plate 1. The size of the optical film 4 is adapted to the display device, slightly smaller than the display device, and is usually set as rectangular or square.

[0120] In specific implementation, the optical film 4 includes one or more combinations of fluorescent film, quantum film, prism sheet and brightness enhancement film, which are set according to specific needs and are not limited here.

[0121] As the number of zones on an LED light board increases, the number of driver chips also increases, making the wiring on the light board very complex. Currently, the substrate for LED light boards mainly uses PCBs. When applied to multi-zone LED light boards, there are two solutions in related technologies: using single-layer PCB circuit boards and using double-layer PCB circuit boards.

[0122] The lamp board 1 typically needs to be connected to the control board of the display device, which controls the lamp board 1. The lamp board 1 and the control board are connected using a flexible flat cable (FFC). Currently, PCB-based lamp boards require connection terminals 12 to connect to the FFC.

[0123] Figure 5a This is a schematic diagram of the lamp board structure of a PCB circuit board using a single layer of circuitry in related technologies; Figure 5b This is a schematic diagram of the lamp board structure of a PCB circuit board using double-layer circuitry in related technologies.

[0124] like Figure 5a and Figure 5b As shown, in the related technology, the lamp board includes: a light source 11, a driver chip IC, a PCB circuit board 14, and a connection terminal 12.

[0125] When using a single-layer PCB circuit board, such as Figure 5a As shown, the lamp board has a circuit layer 141 on only one side. In this scheme, electrical components such as the driver chip IC, the light source 11, capacitors and resistors (not shown in the figure) all need to be placed on the side of the lamp board with the circuit layer 141.

[0126] Figure 6 This is a perspective view of a display device in the related art.

[0127] For lamp boards using single-layer PCB circuitry, holes need to be drilled in the board to accommodate connection terminals 12. In this case, recessed terminals can be used. Accordingly, such as... Figure 2 As shown, an opening 21 needs to be provided on the backplate 2 at the position corresponding to the recessed terminal for wire output. For LED light boards with many partitions, since the single-layer circuit board cannot realize complex circuit design, it is not possible to cascade multiple driver chips. It is necessary to set a corresponding connection terminal 12 for each driver chip to connect to the control board, which results in a large number of openings required for the light board 1 and the backplate 2. At the same time, a large number of FFC wires are required, which increases the difficulty of design and manufacturing, and is not conducive to the thinning of the backlight module.

[0128] When using a double-layer PCB circuit board, such as Figure 5b As shown, circuit layers 141 are provided on both opposite sides of the lamp board. In this design, the light source 11 is placed on one side of the PCB circuit board 14, and components such as the driver chip IC, capacitors, and resistors (not shown in the figure) are placed on the opposite side. The two circuit layers are connected through through holes on the PCB circuit board 14. In this design, the PCB circuit board 14 has double-layer traces, which makes it easy to cascade driver chip ICs and eliminates the need for recessed connection terminals, allowing the use of surface-mount terminals. This reduces the number of holes required in the lamp board. However, the double-layer PCB circuit board is expensive, resulting in higher costs, which has become a bottleneck restricting the further development and application of LED lamp boards.

[0129] In view of this, in a second aspect of the present invention, another display device is provided, which employs a novel LED light panel that can significantly reduce the difficulty of designing and manufacturing the LED light panel and reduce manufacturing costs.

[0130] like Figure 1 As shown, the display device includes a backlight module 100 and a display panel 200. The backlight module 100 includes a lamp panel that serves as a light source.

[0131] Figure 7 This is the third schematic diagram of the lamp board structure provided in the embodiment of the present invention.

[0132] like Figure 7 As shown, the lamp board 1 includes: multiple light sources 11, a substrate 13, a first circuit layer 15, a second circuit layer 16, and a driver chip IC.

[0133] The substrate 13, located between the first circuit layer 15 and the second circuit layer 16, serves to support and carry the first circuit layer 15 and the second circuit layer 16. The shape and size of the substrate 13 are adapted to the shape and size of the backlight module.

[0134] In some embodiments, the substrate 13 is made of BT (Bismaleimide Triazine) resin, FR4 grade heat-resistant resin, glass, or other materials that have good heat resistance and a low coefficient of thermal expansion. In other embodiments, the substrate 13 may also be made of metal materials, such as aluminum and its alloys. Metal materials have good thermal conductivity, which can accelerate the heat dissipation of the lamp panel and reduce the temperature of the display device during operation. When applied to flexible display devices, the substrate 13 may also be made of flexible materials, and this is not limited thereto.

[0135] The first circuit layer 15 is located on the side of the substrate 13 facing the display panel and is mainly used to connect the light source 11, the driver chip IC and auxiliary components.

[0136] The light source 11 is located on the side of the first circuit layer 15 facing the display panel and is electrically connected to the first circuit layer 15. The light source 11 can use LEDs; specifically, it can use white LEDs, blue LEDs, or ultraviolet LEDs. When using blue LEDs or ultraviolet LEDs, a quantum dot film needs to be used. The quantum dot film emits red and green light when excited by blue LEDs, or it emits red, green, and blue light when excited by ultraviolet LEDs, thus achieving a wider color gamut. The light source 11 can also use tri-color LEDs (red, green, and blue). These three colors of LEDs are arranged in an array on the light panel as needed, and white light is obtained by mixing the three colors of light; this is not limited here.

[0137] In some embodiments, the light source 11 may use a Mini LED (Mini-Light Emitting Diode). Compared with ordinary LEDs, Mini LEDs have a smaller size, which means that more light sources can be set on the same area of ​​the light panel, providing higher backlight brightness and more delicate zone control effect.

[0138] The driver chip IC is located on the side of the first circuit layer 15 facing the display panel, and is electrically connected to the light source 11 through the lines of the first circuit layer 15. In this embodiment of the invention, multiple driver chip ICs are provided on the lamp board to achieve zoned control of the light source 11.

[0139] The second circuit layer 16 is located on the side of the substrate 13 opposite to the display panel. The first circuit layer 15 and the second circuit layer 16 are electrically connected through through-holes on the substrate 13.

[0140] In this embodiment of the invention, the lamp board is equipped with multiple driver ICs. In related technologies, a single-layer PCB circuit board is used, which makes it difficult to cascade multiple driver ICs. Therefore, large-scale openings are required on the PCB circuit board and backplane for each driver IC to set connection terminals for connection with the control board. The design and manufacturing of the lamp board is quite difficult. However, in the embodiment of the invention, multiple driver ICs can be set on one side of the first circuit layer 15. The first circuit layer 15 is connected to the second circuit layer 16 through through holes on the substrate 13. The cascading of multiple driver ICs is achieved through the wiring of the second circuit layer 16. Multiple cascaded driver ICs can be connected to the control board with only one connection terminal, reducing the number of connection terminals, reducing the openings on the lamp board and backplane, reducing the design and manufacturing difficulty of the lamp board, and reducing costs.

[0141] In this embodiment of the invention, the substrate 13 can be made of a flexible insulating material, specifically a polymer material such as polyimide or polyester film, or a flexible glass material. Using a roll-to-roll process, circuit patterns of the first circuit layer 15 and the second circuit layer 16 are imprinted on both sides of the substrate 13. Because the first circuit layer 15 and the second circuit layer 16 are fabricated using an imprinting process, targeted circuit design is possible. Specifically, for the first circuit layer 15 and the second circuit layer 16, only conductive material needs to be filled into the grooves of the imprinted circuit patterns to complete the circuit layer fabrication. The entire process involves no etching. In contrast, traditional PCB circuit boards require etching the circuit patterns onto the copper-clad layer of the substrate, resulting in significant waste and high costs. Furthermore, the industrial waste liquids such as developing solutions and etching solutions generated during PCB manufacturing are difficult to treat, posing significant environmental problems. This problem is particularly pronounced for double-layer PCB circuit boards.

[0142] Furthermore, the Roll to Roll process simplifies the fabrication of flexible substrates, enabling processing speeds exceeding 5 m / min and significantly improving manufacturing efficiency. Simultaneously, the Roll to Roll process allows for the fabrication of large-size circuitry, eliminating the need for splicing in small backlight modules (e.g., 32-inch). The substrate 13 can also be made of rigid materials or other suitable materials for use as a substrate; no restrictions are placed here.

[0143] Accordingly, in embodiments of the present invention, such as Figure 7 As shown, the first circuit layer 15 includes: a first imprinted layer 151 and a first conductive portion 152.

[0144] The first imprint layer 151 is located on the side of the substrate 13 facing the display panel; the first imprint layer 151 includes a first recessed portion 153 recessed towards the side of the substrate 13, and the first recessed portion 153 forms the circuit pattern of the first circuit layer 15.

[0145] The material of the first imprint layer 151 can be a photocurable resin. After imprinting, the first imprint layer 151 is cured under ultraviolet light to form the pattern of the first circuit layer 15. The material of the first imprint layer 151 can also be a thermocurable material or other curable material, which is not limited here.

[0146] The first conductive portion 152 is located within the first recessed portion 153 and serves as the wiring of the first wiring layer 15. The material of the first conductive portion 152 can be a material with excellent conductivity, such as metallic copper, and is not limited herein.

[0147] Similarly, the second circuit layer 16 includes: a first imprinted layer 161 and a first conductive portion 162.

[0148] The second imprint layer 161 is located on the side of the substrate 13 facing the display panel; the second imprint layer 161 includes a second recessed portion 163 recessed towards the side of the substrate 13, and the second recessed portion 163 forms the circuit pattern of the second circuit layer 16.

[0149] The material of the second imprint layer 161 can be a light-curable resin. After imprinting, the second imprint layer 161 is cured under ultraviolet light to form the pattern of the second circuit layer 16. The material of the second imprint layer 161 can also be a thermosetting material or other curable material, which is not limited here.

[0150] The second conductive portion 162 is located within the second recessed portion 163 and serves as a circuit in the first circuit layer 16. The material of the second conductive portion 162 can be a material with excellent conductivity, such as metallic copper, and is not limited thereto.

[0151] In this embodiment of the invention, the first circuit layer 15 is mainly used to connect the light source 11, the driver chip IC, and auxiliary components, while the second circuit layer 16 is mainly used for cascading multiple driver chip ICs. Therefore, the area where the circuits of the first circuit layer 15 are located basically includes the entire surface of the substrate 13 facing the display panel; while the circuits of the second circuit layer 16 only need to be set in the areas corresponding to the multiple cascaded driver chip ICs.

[0152] In practice, it is only necessary to fill the circuit pattern formed by the first recess 153 and the second recess 163 with conductive material to form the circuit of the first circuit layer 15 and the second circuit layer 16, without having to etch the entire metal surface. This can effectively reduce the amount of conductive material used and greatly reduce the manufacturing cost.

[0153] Since the lines of the second line layer 16 are only used for cascading driver chips, the orthographic projection range of the area where the lines of the first line layer 15 are located on the substrate 13 is larger than the orthographic projection range of the area where the lines of the second line layer 16 are located on the substrate 13, and the orthographic projection of the area where the lines of the first line layer 15 are located on the substrate 13 completely covers the orthographic projection of the area where the lines of the second line layer 16 are located on the substrate 13.

[0154] At locations where a connection is required between the first circuit layer 15 and the second circuit layer 16, multiple holes can be designed in advance in the area where holes are required during circuit design. The first circuit layer 15 and the second circuit layer 16 can be connected through the through holes in this area, which can reduce the requirements for the imprinting accuracy of the first circuit layer 15 and the second circuit layer 16 during the imprinting process.

[0155] After the first conductive part 152 of the first circuit layer 15 and the second conductive part 162 of the second circuit layer 16 are directly formed by filling conductive material, during the transfer of the light source 11, it is also necessary to fix the light source and the lamp board through processes such as reflow soldering. If the solder paste is brushed off-center or crooked, it will result in a low yield of light source transfer.

[0156] In view of this, in some embodiments, the first and second conductive parts can also be formed by curing a pretreatment solution. The materials used to prepare the pretreatment solution include a polymer, a crosslinking agent, a conductive material, and an initiator. Specifically, the initiator can be a photoinitiator or a thermal initiator. Correspondingly, the pretreatment solution undergoes a crosslinking polymerization reaction under irradiation with light of a specific wavelength or under heating at a certain temperature, thereby curing and forming the first and second conductive parts. The conductive material is uniformly distributed in the pretreatment solution, giving the first and second conductive parts excellent conductivity. When the light source or driving chip is transferred to the pretreatment solution, the conductive material therein initially makes an electrical connection with the light source. After curing, the connection between the light source or driving chip and the conductive material is fixed, achieving the final electrical connection. Furthermore, the polymer has many polar groups, providing some adhesion to the light source and driving chip, which is beneficial for improving the transfer yield. Specifically, based on the strength after curing and the conductivity requirements of the first and second conductive parts, the materials of each component of the pretreatment solution and the proportions between the components are rationally selected to ensure that the first and second conductive parts have good adhesion and excellent conductivity.

[0157] The first and second conductive parts of the lamp board are electrically connected to the light source or driver chip through curing. Compared with the soldering process, the process of printing solder paste is omitted, thus avoiding the problem of low light source transfer yield caused by misaligned or crooked solder paste application.

[0158] In some embodiments, the polymer has numerous polar groups, exhibiting a certain degree of adhesion to both the light source and the driver chip. During the contact between the light source, driver chip, and other components and the pre-solution, the conductive material initially forms an electrical connection with the light source and driver chip. After curing, the connection between the light source and the conductive material is fixed, achieving the final electrical connection and improving the transfer yield. Depending on the required adhesion strength, the polymer can be selected from suitable polymer monomers, oligomers, etc. In specific implementations, the polymer can be one or a mixture of more than one of hyperbranched polyurethane acrylate and polymethyl methacrylate, etc., without limitation.

[0159] In some embodiments, the crosslinking agent contains multiple functional groups that can react with the polymer, and is used to induce crosslinking polymerization of the polymer under the action of an initiator to produce curing. The oligomer molecules crosslink under the action of the adhesive to form three-dimensional polymer molecules, further improving the bonding performance and the strength of the conductive part. The crosslinking agent is selected according to the properties of the polymer. In specific embodiments, the crosslinking agent can be one or a mixture of more than one of trimethylolpropane triacrylate and polyethylene glycol diacrylate, and is not limited thereto.

[0160] In some embodiments, an initiator is used to initiate a crosslinking polymerization reaction between the polymer and the crosslinking agent. The initiator is selected based on the properties of the polymer and the crosslinking agent, as well as the method of initiating the crosslinking polymerization reaction. Specifically, when photoinitiation is used, a photoinitiator, such as 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone, can be selected; when thermal initiation is used, a thermal initiator, such as an azo initiator, can be selected, and no limitation is made here.

[0161] In some embodiments, the conductive material is used to realize the conductive function of the first conductive part and the second conductive part. When preparing the pretreatment solution, the conductive material is uniformly dispersed in the pretreatment solution, so that the first and second conductive parts formed after curing have excellent conductivity. The conductive material can be selected from metal microparticles with excellent conductivity, so that the conductive material can be uniformly dispersed in the pretreatment solution when it is prepared. In specific implementations, nano-silver particles can be selected as the conductive material, and this is not limited thereto.

[0162] In some embodiments, the lamp board further includes a first protective layer located on the side of the first circuit layer facing away from the substrate, and a second protective layer located on the side of the second circuit layer facing away from the substrate. The first and second protective layers include multiple openings for exposing components such as light sources or driver chips. Specifically, the first protective layer can be screen-printed on the surface of the first circuit layer, and the second protective layer can be screen-printed on the surface of the second circuit layer. The materials of the first and second protective layers can be insulating materials that are immiscible or have very low solubility with the preceding solution; specifically, white oil can be used, but this is not limited to these materials.

[0163] In this embodiment of the invention, the display device further includes a control board. In related technologies, the lamp board needs to be provided with connection terminals, and a flexible flat cable (FFC) is connected to the connection terminals, and then the control board is connected through the FFC to realize the connection between the lamp board and the control board.

[0164] In this embodiment of the invention, a flexible printed circuit (FPC) is bonded to the lamp board, and the FPC is connected to the control board.

[0165] Figure 8a This is the fourth schematic diagram of the lamp board structure provided in the embodiment of the present invention; Figure 8b The fifth schematic diagram of the lamp board structure provided in the embodiment of the present invention.

[0166] like Figure 8a As shown, in some embodiments of the present invention, one end of the flexible circuit board f is bound to the first circuit layer 15. The flexible circuit board f is bound to the first circuit layer 15, and the second circuit layer 16 is used for routing the connection lines between multiple driver chip ICs. Ensuring the flatness of the surface of the second circuit layer 16 facing away from the substrate 13 allows for a tighter fit between the lamp board and the backplate during installation.

[0167] like Figure 8b As shown, in some embodiments of the present invention, one end of the flexible circuit board f is bonded to the second wiring layer 16. Bonding the flexible circuit board f to the second wiring layer 16 can save more routing space for the first wiring layer 15 and reduce the difficulty of bonding.

[0168] Figure 9 This is the sixth schematic diagram of the lamp panel structure provided in the embodiment of the present invention.

[0169] like Figure 9 As shown, the display device also includes an adapter board. The lamp board 1 is connected to the adapter board T via a flexible circuit board f, and further connected to the control board via the adapter board T. In a specific implementation, the adapter board T and the control board can be connected via a flexible flat cable. The flexible circuit board f is relatively expensive. When the line between the lamp board and the control board is short, it can be directly connected via the flexible circuit board f; when the line between the lamp board and the control board is long, an adapter board can be used, and an FFC connection can be used to connect the adapter board T and the control board, thereby reducing costs.

[0170] like Figure 9As shown, a connection terminal 12 is provided on the adapter plate T. One end of the flexible circuit board f is bound to the lamp board 1, and the other end is connected to the connection terminal 12 on the adapter plate T, thereby reducing the difficulty of connection and disassembly. A surface-mount terminal can be provided on the adapter plate T for connecting the flexible circuit board f.

[0171] Figure 10 This is a second perspective view of the display device provided in an embodiment of the present invention.

[0172] like Figure 10 As shown, in this embodiment of the invention, the back plate 2 is used to support the edges of components such as the lamp board 1 and the diffuser plate 3. In specific implementation, the connecting wires of the lamp board 1 need to pass through the back plate and connect to the control board outside the backlight module. The flexible circuit board f is usually bound to the edge of the lamp board 1. Therefore, it is only necessary to drill holes 21 at the corresponding positions on the edge of the back plate 2 to form openings for the flexible circuit board f as the wire outlets. The middle area of ​​the lamp board 1 does not need to have terminals or be bound to the flexible circuit board f. Therefore, it is not necessary to drill holes in the middle area of ​​the back plate 2, which can be used for the design of a small back cover of the whole machine, optimizing the overall appearance.

[0173] Figure 11 This is the seventh schematic diagram of the lamp board structure provided in the embodiment of the present invention.

[0174] like Figure 11 As shown, in this embodiment of the invention, the backlight module further includes: auxiliary element A.

[0175] Auxiliary component A may include electrical components such as resistors and capacitors, which are designed to meet specific functions. In specific implementation, auxiliary component A may be directly set on the side of the first line layer facing the display panel and connected to the lines of the first line layer.

[0176] Or, such as Figure 11 As shown, at least some of the auxiliary components A can also be placed on the adapter board T and connected to the lamp board 1 through the wiring of the adapter board T and the flexible circuit board f, so as to reduce the number of electrical components on the first circuit layer 15 and reduce the design difficulty.

[0177] Figure 12 This is one of the top views of the lamp panel structure provided in an embodiment of the present invention.

[0178] In the implementation of this invention, such as Figure 12 As shown, the lamp board 1 has a routing area for a second circuit layer 16. In this case, only a flexible circuit board f and an adapter board T are needed for connection with the lamp board 1. This approach is suitable for situations where the backlight module has fewer sections and the circuitry is relatively simple.

[0179] Figure 13a This is a second top view of the lamp panel structure provided in an embodiment of the present invention; Figure 13b The third top view of the lamp panel structure provided in the embodiment of the present invention.

[0180] like Figure 13a and Figure 13b As shown, the lamp board 1 has multiple separate second circuit layer 16 routing areas. At this time, multiple flexible circuit boards f can be set to correspond one-to-one with the multiple separate areas.

[0181] like Figure 13a As shown, in some embodiments of the present invention, the display device includes an adapter plate T, which includes a plurality of connection terminals 12. The number of connection terminals 12 is adapted to the number of flexible circuit boards f, and one connection terminal 12 is connected to one flexible circuit board f.

[0182] like Figure 13b As shown, in some embodiments of the present invention, the display device includes a plurality of adapter plates T, the number of adapter plates T being the same as the number of flexible circuit boards f, and one flexible circuit board f being connected to a connection terminal on one adapter plate T.

[0183] In practice, the number and arrangement of the adapter boards T can be adapted to the partitioning requirements of the backlight module and are not limited to the connection methods mentioned above.

[0184] In embodiments of the present invention, such as Figure 10 As shown, the backlight module 100 also includes a back plate 2, a diffuser plate 3, and an optical film 4. Their structure and related functions can be found in the above embodiments, and will not be repeated here.

[0185] In a third aspect of the present invention, a method for manufacturing a display device is provided.

[0186] Figure 14 This is one of the flowcharts for a method of manufacturing a display device provided in an embodiment of the present invention.

[0187] like Figure 14 As shown, the manufacturing method of the display device provided in this embodiment of the invention includes the following steps in its specific manufacturing process:

[0188] S21: Prepare the pretreatment solution;

[0189] S22: Apply imprinting adhesive to one side surface of the substrate to form a first imprinting layer;

[0190] S23: Imprint the first imprint layer to form the first recess;

[0191] S24: Fill the first recess with the pre-solution;

[0192] S25: Move the light source to the side of the pretreatment solution away from the substrate, so that the light source comes into contact with the pretreatment solution;

[0193] S26: The pre-solution is solidified to form a first conductive part, and the light source is electrically connected to the first conductive part to form a lamp board.

[0194] Figures 15a-15e The diagram shows the structural schematics corresponding to each step in the manufacturing process of the display device provided in the embodiments of the present invention.

[0195] In practice, a pretreatment solution is first prepared for use. The pretreatment solution includes a polymer, a crosslinking agent, a conductive material, and an initiator. The materials of each component of the pretreatment solution and the proportions between the components are selected reasonably according to the required bonding strength after curing and the conductivity requirements of the first conductive part, so that the pretreatment solution has good bonding performance and excellent conductivity.

[0196] like Figure 15a As shown, an imprinting adhesive is coated on one side surface of the substrate 13 to form a first imprinting layer 151; as Figure 15b As shown, a first recess 153 is then imprinted on the first imprint layer 151 using an imprinting process, forming a preset circuit pattern of the first circuit layer 15. The imprinting adhesive can be a light-curing adhesive or a thermosetting adhesive. Correspondingly, after imprinting, the imprinting adhesive is cured by irradiation with light of a specific wavelength or by heating; for example... Figure 15c As shown, the pretreatment solution L is then filled into the first recess 153, and allowed to stand for a set time to allow the pretreatment solution L to level out in the first recess 153. The length of the set time can be determined experimentally and is not limited here. Figure 15d As shown, the light source 11 is moved to the side of the pretreatment solution L away from the substrate 13, so that the light source 11 comes into contact with the pretreatment solution L, and a preliminary electrical connection is made between the light source and the conductive material in the pretreatment solution; as Figure 15e As shown, finally, depending on the type of initiator, the pre-solution is irradiated with light of a specific wavelength or heated to induce a cross-linking polymerization reaction and produce solidification, forming the first conductive part 152, thereby fixing the electrical connection between the light source 11 and the first conductive part 152, and forming a lamp plate.

[0197] After the light panel is manufactured, it is applied to the backlight module of the display device to complete the manufacturing of the display device.

[0198] Figure 16 This is the second flowchart of a method for manufacturing a display device according to an embodiment of the present invention.

[0199] In embodiments of the present invention, such as Figure 16 As shown, before S25: transferring the light source to the side of the pre-solution away from the substrate, the process further includes:

[0200] S27: A protective layer is formed on the side of the pre-solution away from the substrate.

[0201] In addition, S25: transferring the light source to the side of the pre-solution away from the substrate includes:

[0202] The light source is transferred to the side of the pre-solution away from the substrate, and the light source is subjected to hot pressing treatment.

[0203] Figure 17 A schematic diagram of the structure corresponding to the steps of fabricating a protective layer for the display device provided in the embodiments of the present invention.

[0204] Figure 17 As shown, before transferring the light source to the side of the pre-solution L away from the substrate 13, a protective layer 17 is first formed on the side of the pre-solution L away from the substrate 13. The protective layer 17 can be printed on the side of the pre-solution L away from the substrate 13 by screen printing. During manufacturing, multiple openings need to be reserved on the protective layer 17 to expose components such as the light source. The material of the protective layer can be an insulating material that is immiscible with or has extremely low solubility in the pre-solution, such as white oil, etc., which is not limited here.

[0205] When transferring the light source to the side of the pretreatment solution away from the substrate, a hot-pressing process is also included. The purpose of hot pressing is to press the light source into a set depth within the pretreatment solution, so that after the pretreatment solution solidifies, the connection between the light source and the first circuit layer is more stable. The pressing depth can be set according to actual needs and is not limited here.

[0206] Figure 18 This is a schematic diagram of the hot pressing process provided in an embodiment of the present invention.

[0207] like Figure 18 As shown, during the hot pressing process, a buffer layer BFL is placed between the hot pressing tool HT and the light source 11. The buffer layer BFL softens and becomes elastic under the heating of the hot pressing tool HT, preventing the light source 11 from directly contacting the rigid hot pressing tool HT and causing damage to the light source 11 during the hot pressing process. After hot pressing, the light source 11 is pressed into a certain depth into the pre-solution L, ensuring full contact between the electrodes of the light source 11 and the conductive material in the pre-solution L. The hot pressing tool and buffer layer are then removed, and the pre-solution L is cured to complete the lamp board fabrication. Compared to a lamp board formed without hot pressing, the lamp board formed by hot pressing the light source has a more stable structure, and the contact between the electrodes of the light source and the conductive material is more complete, which can improve the transfer yield of the light source.

[0208] A fourth aspect of the present invention provides another method for manufacturing a display device.

[0209] Figure 19 This is the third flowchart of the display device manufacturing method provided in the embodiments of the present invention; Figure 20This is a schematic diagram of the manufacturing process of the display device provided in an embodiment of the present invention.

[0210] like Figure 19 As shown, the manufacturing method of the display device provided in this embodiment of the invention includes the following steps in its specific manufacturing process:

[0211] S11: Apply imprinting adhesive to both sides of the substrate to form a first imprinting layer and a second imprinting layer.

[0212] S12: Imprint the first imprint layer to form a first recessed portion, and imprint the second imprint layer to form a second recessed portion;

[0213] S13: A first circuit layer is formed by filling the first recess with conductive material, and a second circuit layer is formed by filling the second recess with conductive material.

[0214] S14: Weld the light source onto the first circuit layer to form a lamp board.

[0215] like Figure 19 and Figure 20 As shown, in a specific implementation, imprinting adhesive can be applied to both sides of the substrate 13 to form a first imprint layer 151 and a second imprint layer 161, respectively. Then, through an imprinting process, a first recess 153 is imprinted on the first imprint layer 151 to form the circuit pattern of the first circuit layer, and a second recess 163 is imprinted on the second imprint layer 161 to form the circuit pattern of the second circuit layer. Multiple through holes H for connecting the first circuit layer and the second circuit layer are opened at corresponding positions of the first imprint layer 151 and the second imprint layer 161 by means of laser drilling or mechanical drilling. Next, conductive material is filled into the first recess 153, the second recess 163 and the through holes to form the first circuit layer 15 and the second circuit layer 16. The conductive material can be a material with excellent conductivity, such as copper. Finally, the light source 11 is installed at the corresponding position on the first circuit layer 15 through processes such as welding to form a lamp board.

[0216] The vias between the first and second circuit layers can be drilled and filled with conductive material after the first and second circuit layers are formed; alternatively, corresponding holes can be opened at corresponding positions on the substrate first, and through holes of the imprinted layer can be directly imprinted at corresponding positions of the imprinted layer during the imprinting process to avoid drilling again. This is not limited here.

[0217] After the light board is fabricated, driver chips, capacitors, resistors, and other components can be soldered onto it. Specifically, substrate 13 can be made of flexible insulating materials, such as polymers like polyimide or polyester film, or flexible glass. The imprinting adhesive can be a photocurable material. Combined with a roll-to-roll process, the processing speed can exceed 5m / min, greatly simplifying the process, improving production efficiency, and reducing costs. It also allows for the fabrication of large-size circuits, eliminating the need for splicing in small backlight modules (e.g., 32-inch). The imprinting process eliminates developing and etching steps, generating no waste liquids such as developing or etching solutions. The process is simple and environmentally friendly, offering significant advantages over traditional PCB manufacturing processes.

[0218] In some embodiments, when performing S13: filling the first recess with conductive material to form a first circuit layer, and filling the second recess with conductive material to form a second circuit layer, the conductive material can be replaced with a pretreatment solution. The material used to prepare the pretreatment solution can be referred to the above embodiments and will not be repeated here. Correspondingly, after filling the pretreatment solution, the light source can be transferred to the side of the pretreatment solution in the first recess away from the substrate, so that the light source comes into contact with the pretreatment solution; then, the pretreatment solution is cured to form a first conductive part, and the light source is electrically connected and fixed to the first conductive part to form a lamp board. Fixing the first conductive part and the light source by curing the pretreatment solution eliminates the need for solder paste printing, thus avoiding the problem of low light source transfer yield caused by misaligned or skewed solder paste application.

[0219] According to the first inventive concept, the present invention provides a display device comprising a display panel and a backlight module. The backlight module includes a lamp board. A first conductive portion of the first circuit layer of the lamp board is formed by filling a pre-solution in a first recessed portion after imprinting a first imprinted layer, followed by curing. The pre-solution includes a polymer, a crosslinking agent, a conductive material, and an initiator. During contact between the light source and the pre-solution, the conductive material initially electrically connects to the light source. After curing, the connection between the light source and the conductive material is fixed, achieving final electrical connection. Simultaneously, the polar groups in the polymer provide some adhesion to the light source, further improving the light source transfer yield. Compared to related technologies that use reflow soldering processes, this invention omits the solder paste printing process, thus avoiding the problem of low light source transfer yield caused by misaligned or uneven solder paste application. Meanwhile, the fabrication of the first circuit layer involves imprinting a first recess on the first imprint layer to form a circuit pattern, and then filling the first recess with a pre-solution and solidifying it to form the first conductive part. Compared with related technologies, this method does not require complex processes such as exposure, development, and etching, which greatly simplifies the process steps and avoids environmental problems caused by etching waste liquid.

[0220] According to the second inventive concept, depending on the required bonding strength after curing, the polymer can be selected from one or a mixture of multiple types of hyperbranched polyurethane acrylate and polymethyl methacrylate.

[0221] According to the third inventive concept, depending on the properties of the polymer, the crosslinking agent can be selected from one or a mixture of more than one of trimethylolpropane triacrylate and polyethylene glycol diacrylate.

[0222] According to the fourth inventive concept, the initiator can be selected by photoinitiation, or when photoinitiation is used, a photoinitiator such as 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone can be selected; when thermal initiation is used, a thermal initiator such as an azo initiator can be selected.

[0223] According to the fifth inventive concept, the conductive material can be selected from metal particles with excellent conductivity, so that the conductive material can be uniformly dispersed in the pre-solution when it is prepared.

[0224] According to the sixth inventive concept, the lamp panel further includes: multiple light sources and a protective layer. The multiple light sources are located on the side of the first circuit layer facing away from the substrate; the protective layer is located on the side of the first circuit layer facing away from the substrate. The protective layer is used to protect the first circuit layer.

[0225] According to the seventh inventive concept, the present invention provides another display device, which includes multiple driver chips. The lamp board of the display device is manufactured using an imprinting process. During the manufacturing process, the routing area of ​​the circuit layer can be specifically designed. The second circuit layer is only used for the routing of circuits cascading between multiple chips. Therefore, the range of the circuits in the second circuit layer can be greatly reduced, making the orthographic projection area of ​​the circuit area of ​​the first circuit layer on the substrate larger than the orthographic projection area of ​​the circuit area of ​​the second circuit layer on the substrate. Moreover, the orthographic projection area of ​​the circuit area of ​​the first circuit layer on the substrate completely covers the orthographic projection area of ​​the circuit area of ​​the second circuit layer on the substrate. This enables the cascading of multiple driver chips and multi-zone control of the lamp board, while reducing the use of conductive materials and lowering costs.

[0226] According to the eighth inventive concept, the circuit patterns of the first circuit layer and the second circuit layer are formed by imprinting, and the circuits of the first circuit layer and the second circuit layer are formed by filling conductive materials. The process is simple and avoids material waste and environmental pollution caused by etching and other processes.

[0227] According to the ninth inventive concept, a circuit can be formed by filling a first recess with a pre-solution to form a first conductive portion, thus forming a first circuit layer; and a circuit can be formed by filling a second recess with a pre-solution to form a second conductive portion, thus forming a second circuit layer. The materials used to prepare the pre-solution include: a polymer, a crosslinking agent, a conductive material, and an initiator.

[0228] According to the tenth invention concept, the substrate material is a flexible insulating material, which can be combined with the Roll to Roll process to manufacture the lamp board, resulting in high manufacturing efficiency and enabling the production of large-size circuits.

[0229] According to the eleventh inventive concept, the lamp board also includes: multiple light sources and multiple driver chips. The multiple driver chips are electrically connected to the light sources through the lines of the first circuit layer. At least two driver chips are cascaded through the lines of the second circuit layer. The cascaded chips can be connected to the control board through a connecting line.

[0230] According to the twelfth inventive concept, the lamp board is connected to the control board by binding a flexible circuit board; wherein, one end of the flexible circuit board is bound to the first circuit layer or the second circuit layer.

[0231] According to the thirteenth invention concept, the lamp board is connected to the adapter board by binding a flexible circuit board, and the adapter board is connected to the control board by a connecting cable; one end of the flexible circuit board is bound to the first circuit layer or the second circuit layer, and the other end of the flexible circuit board is connected to the connection terminal on the adapter board. This can reduce the connection difficulty and reduce costs.

[0232] According to the fourteenth inventive concept, the lines of the second circuit layer are distributed in multiple mutually separated areas; the display device includes multiple flexible circuit boards; the multiple flexible circuit boards are arranged in a one-to-one correspondence with the multiple mutually separated areas; the display device includes an adapter board, the adapter board includes multiple connection terminals, and one connection terminal is connected to one flexible circuit board; or, the display device includes multiple adapter boards, and one flexible circuit board is connected to a connection terminal on one adapter board.

[0233] According to the fifteenth inventive concept, the backlight module further includes: auxiliary components; the auxiliary components are located on the side of the first circuit layer facing the display panel and are electrically connected to the first circuit layer; or, at least some of the auxiliary components are disposed on an adapter board. Disposing some of the auxiliary components on the adapter board can reduce the complexity of the circuit design for the first circuit layer.

[0234] According to the sixteenth inventive concept, the light source is a Mini LED. Compared with ordinary LEDs, Mini LEDs have a smaller size, which means that more light sources can be set on the same area of ​​the light panel, providing higher backlight brightness and more delicate zone control effects.

[0235] According to the seventeenth inventive concept, the present invention provides a method for manufacturing a display device, comprising: preparing a pre-treatment solution; coating an imprinting adhesive on one side surface of a substrate to form a first imprint layer; imprinting the first imprint layer to form a first recess; filling the first recess with the pre-treatment solution; transferring a light source to the side of the pre-treatment solution away from the substrate, so that the light source is in contact with the pre-treatment solution; curing the pre-treatment solution to form a first conductive part, and electrically connecting the light source with the first conductive part to form a lamp board. In the lamp board manufacturing process, solder paste printing is not required, thus avoiding the problem of low light source transfer yield caused by misaligned or skewed solder paste application. Simultaneously, the manufacturing process eliminates the need for complex processes such as exposure, development, and etching, greatly simplifying the process steps and avoiding environmental problems caused by etching waste liquid.

[0236] According to the eighteenth inventive concept, before transferring the light source to the side of the pretreatment solution away from the substrate, a protective layer is formed on the side of the pretreatment solution away from the substrate. The protective layer is used to protect the first circuit layer.

[0237] According to the nineteenth inventive concept, when the light source is transferred to the side of the pre-solution away from the substrate, the light source is subjected to hot pressing treatment so that the connection between the light source and the first circuit layer is more stable after the pre-solution is solidified.

[0238] According to the twentieth inventive concept, another method for manufacturing a display device is provided, comprising: coating an imprinting adhesive on both sides of a substrate to form a first imprinting layer and a second imprinting layer; imprinting the first imprinting layer to form a first recess, and imprinting the second imprinting layer to form a second recess; filling the first recess with a conductive material to form a first circuit layer, and filling the second recess with a conductive material to form a second circuit layer; and soldering a light source onto the first circuit layer to form a lamp board.

[0239] According to the twenty-first inventive concept, a first circuit layer can be formed by filling a first recess with a pre-solution, and a second circuit layer can be formed by filling a second recess with a pre-solution. The materials used to prepare the pre-solution include: a polymer, a crosslinking agent, a conductive material, and an initiator.

[0240] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0241] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A display device, characterized in that, include: Display panel, used for image display; The backlight module is located on the light-incident side of the display panel; The backlight module includes a lamp panel that serves as a light source; The light panel includes: substrate; A first circuit layer is located on the side of the substrate facing the display panel; the first circuit layer includes: The first imprint layer includes a first recessed portion recessed toward one side of the substrate, and the first recessed portion forms the circuit pattern of the first circuit layer. A first conductive portion is located within the first recessed portion and serves as a circuit in the first circuit layer; the first conductive portion is formed by curing a pretreatment solution; the pretreatment solution includes: a polymer, a crosslinking agent, a conductive material, and an initiator; Multiple light sources are located on the side of the first circuit layer away from the substrate; the light sources are electrically connected to the first conductive part of the first circuit layer; the light sources are subjected to hot pressing treatment to press them into the pre-solution to a set depth; after the pre-solution is cured, the light sources are connected to the first circuit layer.

2. The display device as claimed in claim 1, characterized in that, The polymer is at least one of hyperbranched polyurethane acrylate and polymethyl methacrylate.

3. The display device as claimed in claim 1, characterized in that, The crosslinking agent is at least one of trimethylolpropane triacrylate and polyethylene glycol diacrylate.

4. The display device as claimed in claim 1, characterized in that, The conductive material is silver nanoparticles.

5. The display device as claimed in claim 1, characterized in that, The initiator is a thermal initiator or a photoinitiator; The thermal initiator is an azo initiator; The photoinitiator is 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]-1-propanone.

6. The display device as claimed in claim 1, characterized in that, The light panel also includes: A protective layer is located on the side of the first circuit layer opposite to the substrate; the protective layer includes a plurality of openings for exposing the light source; The light source is a Mini LED; The protective layer is made of white oil.

7. A display device, characterized in that, include: Display panel, used for image display; The backlight module is located on the light-incident side of the display panel; The backlight module includes: a light panel, which serves as the light source for the backlight module; The light panel includes: substrate; The first circuit layer is located on the side of the substrate facing the display panel; The second circuit layer is located on the side of the substrate opposite to the display panel; Multiple light sources are located on the side of the first circuit layer away from the substrate; Wherein, the area where the lines of the first line layer are located in the substrate is larger than the area where the lines of the second line layer are located in the substrate, and the area where the lines of the first line layer are located in the substrate completely covers the area where the lines of the second line layer are located in the substrate; the lines of the first line layer and the lines of the second line layer are electrically connected through the through-holes of the substrate. The first circuit layer includes: a first imprint layer and a first conductive portion; the light source is electrically connected to the first conductive portion of the first circuit layer; the first imprint layer is located on the side of the substrate facing the display panel; the first imprint layer includes a first recessed portion recessed towards the substrate, the first recessed portion forming a circuit pattern of the first circuit layer; the first conductive portion is located within the first recessed portion, serving as a circuit of the first circuit layer; the first conductive portion is formed by curing a pretreatment solution; the pretreatment solution includes: a polymer, a crosslinking agent, a conductive material, and an initiator; the light source is subjected to hot pressing treatment to press the light source into a set depth of the pretreatment solution, and after the pretreatment solution is cured, the light source is connected to the first circuit layer.

8. The display device as claimed in claim 7, characterized in that, The second line layer includes: The second imprint layer is located on the side of the substrate opposite to the display panel; the second imprint layer includes a second recessed portion recessed towards one side of the substrate, and the second recessed portion forms the circuit pattern of the second circuit layer; The second conductive portion is located within the second recessed portion and serves as the wiring of the second circuit layer.

9. A method for manufacturing a display device as described in any one of claims 1 to 6, characterized in that, include: Prepare the pretreatment solution; The pretreatment solution includes: a polymer, a crosslinking agent, a conductive material, and an initiator; An imprinting adhesive is applied to one side surface of the substrate to form a first imprinting layer; The first imprinted layer is imprinted to form the first recessed portion; The pre-prepared solution is filled into the first recess; The light source is transferred to the side of the pretreatment solution away from the substrate, and the light source is subjected to hot pressing treatment to bring the light source into contact with the pretreatment solution, and the light source is pressed into the pretreatment solution to a set depth; The pre-solution is solidified to form a first conductive part, and the light source is electrically connected to the first conductive part to form a lamp panel.

10. The method for manufacturing a display device as described in claim 9, characterized in that, Before transferring the light source to the side of the pretreatment solution away from the substrate, the method further includes: A protective layer is formed on the side of the pretreatment solution facing away from the substrate; the protective layer includes a plurality of openings for exposing the light source.

11. A method for manufacturing a display device as described in claim 7 or 8, characterized in that, include: Imprinting adhesive is applied to both sides of the substrate to form a first imprinting layer and a second imprinting layer. The first embossed layer is embossed to form a first recessed portion, and the second embossed layer is embossed to form a second recessed portion; A first circuit layer is formed by filling the first recess with a pre-solution, and a second circuit layer is formed by filling the second recess with a pre-solution. The light source is transferred to the side of the pre-solution in the first recess that is away from the substrate, so that the light source comes into contact with the pre-solution in the first recess. The pre-solution in the first recess is then cured to form a first conductive part, and the light source is electrically connected to the first conductive part to form a lamp board.

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