Backlight panel and display module

Abstract

The present application discloses a backlight panel and a display module. The backlight panel includes a back panel and a light-emitting chip, and the backlight panel also includes: a quantum dot diffusion plate and a reflective layer, the quantum dot diffusion plate is arranged on one side of the back panel, the light-emitting chip is arranged between the quantum dot diffusion plate and the back panel, and the light-emitting surface of the light-emitting chip is arranged toward the back panel; the reflective layer is arranged on the side of the back panel facing the light-emitting chip, the light-emitting chip and the reflective layer are arranged at intervals, and the light of the light-emitting chip is directed toward the reflective layer, so that the light is reflected to the quantum dot diffusion plate through the reflective layer. The technical solution of the present application can reduce the design and use of the light guide plate and reduce the overall thickness.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a backlight panel and a display module. Background Art

[0002] The current backlight module is usually provided with a light guide plate to guide the light from the light guide plate to the diffusion film, so that the light is emitted through the diffusion film to complete the display of the display device. Due to the provision of the light guide plate, the overall thickness of the display device is relatively thick, which is not conducive to a lightweight design. Summary of the invention

[0003] The purpose of the present application is to provide a backlight panel and a display module, which can effectively reduce the design of the light guide plate and reduce the overall thickness.

[0004] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0005] According to one aspect of the embodiments of the present application, the present application provides a backlight panel, the backlight panel comprising a backlight panel and a light-emitting chip, the backlight panel further comprising:

[0006] A quantum dot diffusion plate, wherein the quantum dot diffusion plate is disposed on one side of the back plate, the light-emitting chip is disposed between the quantum dot diffusion plate and the back plate, and the light-emitting surface of the light-emitting chip is disposed toward the back plate; and

[0007] A reflective layer is provided on a side of the back plate facing the light emitting chip, the light emitting chip and the reflective layer are arranged at intervals, and the light of the light emitting chip is directed toward the reflective layer so that the light is reflected by the reflective layer toward the quantum dot diffusion plate.

[0008] In one aspect, the quantum dot diffuser plate has a light incident surface facing the reflective layer, the light incident surface of the quantum dot diffuser plate is provided with a circuit layer, the light emitting chip is provided on the light incident surface, and the electrode of the light emitting chip is connected to the circuit layer.

[0009] In one aspect, the light incident surface of the quantum dot diffusion plate is provided with a plurality of protrusions, the protrusions abut against the reflective layer, grooves are formed between adjacent protrusions, the circuit layer is at least partially arranged along the grooves, and the light-emitting chip is arranged in the grooves.

[0010] In one aspect, the quantum dot diffusion plate is provided with a scattering hole, the scattering hole is located on a side of the light-emitting chip facing away from the reflective layer, and light is scattered through the scattering hole.

[0011] In one aspect, the center of the light emitting chip is located on the axis of the scattering hole, and the diameter of the scattering hole gradually increases in a direction away from the light emitting chip.

[0012] In one aspect, a transparent medium is disposed in the scattering hole, and a refractive index of the transparent medium is different from a refractive index of the quantum dot diffusion plate.

[0013] In one aspect, the scattering hole is provided on the light incident surface of the quantum dot diffusion plate, and the opening of the scattering hole on the light incident surface is located between the anode and the cathode of the light emitting chip;

[0014] or

[0015] The scattering hole is embedded in the quantum dot diffusion plate, and a partial structure of the quantum dot diffusion plate is arranged between the scattering hole and the light-emitting chip.

[0016] In one aspect, the back plate is surrounded to form a mounting groove, the quantum dot diffusion plate is arranged in the mounting groove, the reflective layer is arranged at the bottom of the mounting groove, and the backlight plate further comprises a rubber frame, the rubber frame is arranged on a side of the quantum dot diffusion plate away from the back plate, and covers the gap between the quantum dot diffusion plate and the side wall of the mounting groove;

[0017] The backlight plate further comprises a blocking portion, which is protruding from the groove side wall of the mounting groove, and the quantum dot diffusion plate is clamped on the blocking portion to form a reflective space between the light emitting chip and the reflective layer.

[0018] In one aspect, the blocking portion is disposed around a groove side wall of the installation groove, and the blocking portion is disposed close to the reflective layer.

[0019] In addition, in order to solve the above problems, the present application also provides a display module, which includes a color resistance layer and a backlight plate as described above, and the color resistance layer is arranged on a side of the quantum dot diffusion plate away from the reflective layer.

[0020] In the present application, the light-emitting chip is arranged between the back plate and the quantum dot diffusion plate, and the light of the light-emitting chip is directed to the reflective layer, and the reflective layer then directs the light to the quantum dot diffusion plate. Through the spacing between the light-emitting chip and the reflective layer, the light of the light-emitting chip is reflected, and the emission angle diverges, and further diffuses after entering the quantum dot diffusion plate, so that the light emission is more uniform. Among them, the light-emitting surface of the light-emitting chip is arranged toward the reflective layer, and directly enters the quantum dot diffusion plate after reflection, and does not need to be set up with a light guide plate, thereby reducing the overall thickness.

[0021] Moreover, through the setting of the quantum dot diffuser, not only can the light be diffused well, making the brightness of the light the same at all positions, but it can also stimulate the formation of new light, and the white color passing through the quantum dot diffuser is purer.

[0022] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 The schematic diagram of the structure of the backlight panel provided with the blocking portion in the first embodiment of the present application is shown schematically.

[0025] Figure 2 The schematic diagram of the structure of the backlight panel provided with the protrusion in the first embodiment of the present application is shown schematically.

[0026] Figure 3 The schematic diagram of the structure of the backlight panel provided with scattering holes in the first embodiment of the present application is shown schematically.

[0027] Figure 4 Another structural diagram of the scattering hole in the first embodiment of the present application is schematically shown.

[0028] Figure 5 The application is schematically shown Figure 4 Schematic diagram of the structure of the setting position of the light-emitting chip.

[0029] Figure 6 The schematic diagram shows the structure of the scattering holes embedded in the quantum dot diffusion plate in the first embodiment of the present application.

[0030] The following are the descriptions of the reference numerals:

[0031] 10. quantum dot diffusion plate; 20. reflective layer; 30. back plate; 40. light emitting chip; 50. plastic frame; 60. blocking part; 70. color blocking layer;

[0032] 110, quantum dot; 120, light incident surface; 130, raised portion; 140, groove; 150, scattering hole; 151, opening; 160, transparent medium; 310, mounting groove; 311, reflecting space; 410, anode; 420, cathode; 810, anode layer; 820, cathode layer. DETAILED DESCRIPTION

[0033] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0034] Embodiment 1

[0035] See also Figure 1 As shown, the present application provides a backlight panel, which includes a backplate 30 and a light-emitting chip 40. The backplate 30 is mainly used to support and protect the light-emitting chip 40 to prevent the light-emitting chip 40 from being damaged. The backplate 30 can be metal or non-metal. The light emitted by the light-emitting chip 40 can be used as a backlight source to make the color resistance layer 70 present light of different colors. The light-emitting chip 40 is mainly Micro LED (Micro Light Emitting Diode Display). Micro LED occupies a small space and is arranged more densely, which increases the light density. Light-emitting diodes can efficiently convert electrical energy into light energy for lighting. Light-emitting diodes also have the advantages of fast response speed, energy saving and environmental protection, and long service life.

[0036] The backlight plate also includes: a quantum dot diffusion plate 10 and a reflective layer 20. The quantum dot diffusion plate 10 is doped with quantum dots 110, wherein the quantum dot 110 (Quantum Dot, referred to as QD) can also be called nanocrystal, which is a nanoparticle composed of II-VI or III-V elements. The particle size of the quantum dot 110 is generally between 1-100nm, which is smaller than or close to the exciton Bohr radius of the corresponding bulk material, resulting in a quantum confinement effect. Since electrons and holes are quantum confined, the continuous energy band structure becomes a discrete energy level structure with molecular characteristics. Under the excitation of an external light source, a certain light pressure is applied to the quantum dots 110, and they will emit light of a specific frequency. The frequency of the emitted light will change with the change of the size of the quantum dot 110, so the color of the light emitted by the quantum dot 110 can be controlled by adjusting the size of the quantum dot 110. Moreover, the special discrete energy level structure of the quantum dot 110 makes its half-wave width narrower, and it can emit light of higher purity, thereby obtaining high-quality pure monochromatic light.

[0037] In the present application, red and green light quantum dots 110 are arranged in the quantum dot diffusion plate 10, and the light-emitting chip 40 is a blue light chip. The blue light chip is used to excite the red and green light quantum dots 110 to emit red and green light and form red, green and blue primary colors with part of the unabsorbed blue light. The three primary colors are mixed to form white light.

[0038] The quantum dot diffusion plate 10 is disposed on one side of the back plate 30, and the light emitting chip 40 is disposed between the quantum dot diffusion plate 10 and the back plate 30, and the light emitting surface of the light emitting chip 40 is disposed toward the back plate 30; the light emitting surface of the light emitting chip 40 is not disposed toward the quantum dot diffusion plate 10, but is disposed away from the quantum dot diffusion plate 10. The light emitting chip 40 can be disposed on the quantum dot diffusion plate 10, or at any position between the quantum dot diffusion plate 10 and the back plate 30.

[0039] The quantum dot diffusion plate 10 can be a glass diffusion plate, and the light-emitting chip 40 can be understood as being inverted on the lower side of the glass diffusion plate. The glass diffusion plate can be understood as quantum dots doped in a glass substrate. By using a glass substrate, the thickness of the entire device can also be reduced. The glass substrate has a high thermal conductivity and a high thermal conductivity. It can better maintain the stability of the panel in high-density welding products and can meet more complex wiring requirements.

[0040] The reflective layer 20 is arranged on the side of the back plate 30 facing the light emitting chip 40, and the light emitting chip 40 and the reflective layer 20 are arranged at intervals. The intervals between the light emitting chip 40 and the reflective layer 20 can ensure that the two are at a certain distance. Avoid the light emitting chip 40 from directly touching the reflective layer 20 to prevent the light emitting chip 40 from being damaged. At the same time, the light emitting chip 40 and the reflective layer 20 are at a certain interval distance. The light of the light emitting chip 40 is emitted toward the reflective layer 20, so that the light is reflected to the quantum point diffusion plate 10 through the reflective layer 20. Therefore, by the intervals between the light emitting chip 40 and the reflective layer 20, the light can also have a sufficient propagation distance. The longer the distance the light propagates, the more divergent the angle. After being reflected by the reflective layer 20, the light can form a sufficiently large divergent angle, which is conducive to the divergence of the light, making it more uniform and improving the degree of light diffusion.

[0041] The reflective layer 20 can reflect light, and the reflective layer 20 can be reflective ink. The reflective ink is made of ultra-fine glass powder, and contains tens of thousands of light-reflecting microspheres. By using the principle of lens refraction and concave spherical reflection, the ink generates light with a high reflectivity when irradiated, such as white reflective ink.

[0042] In addition, the reflective layer 20 may also be a reflective sheet having a mirror reflective surface, and the mirror reflective surface is arranged toward the light emitting chip 40. The mirror reflective surface of the reflective sheet can well reflect light and improve reflection efficiency.

[0043] In this embodiment, the light emitting chip 40 is arranged between the back plate 30 and the quantum dot diffusion plate 10, and the light of the light emitting chip 40 is emitted to the reflective layer 20, and the reflective layer 20 then emits the light to the quantum dot diffusion plate 10. Through the interval between the light emitting chip 40 and the reflective layer 20, the light of the light emitting chip 40 is reflected, and the emission angle diverges, and further diffuses after entering the quantum dot diffusion plate 10, so that the light emission is more uniform. Among them, the light emitting surface of the light emitting chip 40 is arranged toward the reflective layer 20, and directly enters the quantum dot diffusion plate 10 after reflection, and does not need to be set up with a light guide plate, thereby reducing the overall thickness of the display module.

[0044] In addition, in this embodiment, through the setting of the quantum dot diffusion plate 10, not only can the light be diffused well, so that the brightness intensity formed by the light is the same at each position, but also under the excitation of the blue light-emitting chip, red light and green light can be emitted through the quantum dot diffusion plate 10. The white light formed by the mixture of red light, green light and blue light has a higher color gamut, making the displayed picture bright.

[0045] In order to ensure that the light-emitting chip 40 can effectively emit light, the quantum dot diffusion plate 10 has a light incident surface 120 facing the reflective layer 20. The light incident surface 120 of the quantum dot diffusion plate 10 is provided with a circuit layer. The light-emitting chip 40 is arranged on the light incident surface 120, and the electrode of the light-emitting chip 40 is connected to the circuit layer. The circuit layer is used to transmit electrical signals to the light-emitting chip 40 to light up the light-emitting chip 40. The circuit layer can be a metal layer, such as gold, silver, copper, etc. It can also be a semiconductor layer, such as ITO (Indium Tin Oxide). For example, a layer of transparent conductive film material is coated on the light incident surface of the quantum dot diffusion plate 10, and the required connecting wires between the pins of the light-emitting chip are etched out by laser etching to form a circuit layer. Then the light-emitting chip 40 is connected to the etched circuit layer through the ITO conductive electrode or conductive ink.

[0046] The light emitting chip 40 is provided with an anode 410 and a cathode 420, and the circuit layer includes an anode layer 810 and a cathode layer 820. The anode layer 810 and the cathode layer 820 can be provided in the same layer, and the anode layer 810 and the cathode layer 820 provide different electrical signals respectively. The anode 410 of the light emitting chip 40 is connected to the anode layer 810, and the cathode 420 of the light emitting chip 40 is connected to the cathode layer 820, and different high and low potentials are formed on the anode 410 and the cathode 420 of the light emitting chip 40, so that the light emitting chip 40 emits light.

[0047] The light emitting surface of the light emitting chip 40 faces the reflective layer 20, and the light passing through the reflective layer 20 easily generates a lamp shadow in the direction of the light emitting chip 40 facing away from the reflective layer 20. It can also be understood that the lamp shadow is mainly caused by the light failing to fully illuminate the back of the light emitting chip 40. Due to the existence of the lamp shadow, the light emitted from the quantum dot diffuser 10 may be uneven, resulting in uneven brightness and affecting the display effect of the display module.

[0048] For this purpose, see Figure 2 As shown, the light incident surface 120 of the quantum dot diffuser 10 is provided with a plurality of protrusions 130 , the protrusions 130 abut against the reflective layer 20 , grooves 140 are formed between adjacent protrusions 130 , the circuit layer is at least partially arranged along the grooves 140 , and the light emitting chip 40 is arranged in the grooves 140 .

[0049] The protrusion 130 is in contact with the reflective layer 20, and the light passing through the reflective layer 20 can directly pass through the protrusion 130 and enter the quantum dot diffuser 10 as quickly as possible. The light begins to diffuse and scatter when entering the protrusion 130. Therefore, when the light diffused by the protrusion 130 is scattered to the position of the groove 140, the angle of light scattering and deflection is large enough, and the light can be deflected to the side away from the light emitting surface of the light emitting chip 40, that is, to the back of the light emitting chip 40, so that the amount of light in this area is sufficient, the lamp shadow phenomenon is alleviated, and even the formation of lamp shadow can be eliminated.

[0050] See also Figure 3 As shown, in order to further reduce the lamp shadow phenomenon, the quantum dot diffuser 10 is provided with a scattering hole 150, which is located on the side of the light-emitting chip 40 facing away from the reflective layer 20, and the light is scattered through the scattering hole 150. The light incident from the light incident surface 120 of the quantum dot diffuser 10 will be directed toward the scattering hole 150 when it diffuses and propagates. The scattering hole 150 can scatter the light, and when the light passes through the scattering hole 150, the forward direction of the light is deflected again, thereby completing the scattering. The light is scattered on the back side of the light-emitting chip 40, which can fully illuminate the back side of the light-emitting chip 40 and dissipate the lamp shadow.

[0051] Furthermore, in order to better eliminate the influence of the light shadow, the center of the light emitting chip 40 is located on the axis of the scattering hole 150, and the diameter of the scattering hole 150 gradually increases in the direction away from the light emitting chip 40. The scattering hole 150 is a bilaterally symmetrical hole, and the axis of the scattering hole 150 is also the center line. The center of the light emitting chip 40 is directly opposite to the center of the scattering hole 150, so that the effect of eliminating the light shadow on the left and right sides of the light emitting chip 40 can be the same.

[0052] The shadow area of ​​the light emitting chip 40 may gradually expand in the quantum dot diffusion plate 10. Therefore, the diameter of the scattering hole 150 is set to gradually increase, thereby eliminating the influence of the larger scattering of the shadow and covering the possible shadow.

[0053] In order to further ensure the effect of eliminating lamp shadows, the maximum diameter of the scattering hole 150 can be made larger than the horizontal size of the light-emitting chip 40. In this way, the scattering hole 150 can cover the light-emitting chip 40 and completely cover the position where lamp shadows may be generated, thereby eliminating the lamp shadows.

[0054] In order to improve the scattering effect of the scattering hole 150, a transparent medium 160 is arranged in the scattering hole 150, and the refractive index of the transparent medium 160 is different from the refractive index of the quantum dot diffusion plate 10. When light propagates between two different media, the light will be refracted. The transparent medium 160 can be air or a material such as silica. When the light propagates in the quantum dot diffusion plate 10, it has a plurality of different scattering angles. Therefore, when the light is directed toward the scattering hole 150, the light with different scattering angles further deflects the advancing direction, increasing the disorder of the light at the position of the light-emitting chip 40, and these scattered light rays are fully scattered on the back side of the light-emitting chip 40, compensating for the lamp shadow produced by the light-emitting chip 40.

[0055] It should be noted that the area occupied by the light emitting chip 40 is very small, and the size of the opening 151 of the scattering hole 150 can usually be larger than the distance between the anode and the cathode of the light emitting chip 40. The size of the light emitting chip 40 is very small, and the opening 151 of the scattering hole 150 is also very small. The circuit layer is laid at the opening 151 of the scattering hole 150, which can basically meet the fixing requirements of the light emitting chip 40.

[0056] However, in order to make the position of the light-emitting chip 40 on the quantum dot diffusion plate 10 more secure, the present application provides two ways of arranging the scattering holes 150 .

[0057] See also Figure 4 and Figure 5As shown, the first setting mode is that the scattering hole 150 is arranged on the light incident surface 120 of the quantum dot diffusion plate 10, and the opening 151 of the scattering hole 150 on the light incident surface 120 is located between the anode and the cathode of the light emitting chip 40; the opening 151 of the scattering hole 150 is arranged on the light incident surface 120 of the quantum dot diffusion plate 10. If the position of the opening 151 of the scattering hole 150 is too large, the anode and cathode of the light emitting chip 40 are fixed on the circuit layer, and the circuit layer directly faces the opening 151 of the scattering hole 150, and there is a situation where the circuit layer is suspended above. As a result, the fixing of the circuit layer is unstable, and the light emitting chip 40 may not be firmly fixed. For this reason, it can be known from the first setting mode that the size of the opening 151 of the scattering hole 150 is reduced so that the opening 151 is located between the anode 410 and the cathode 420 of the light emitting chip 40. In this way, at least part of the structure of the quantum dot diffusion plate 10 is set up at the positions of the anode and cathode, ensuring that the circuit layers at the positions of the cathode and anode can be attached to the quantum dot diffusion plate 10, and will not affect the fixation of the anode and cathode of the light-emitting chip 40, thereby making the fixation of the light-emitting chip 40 more secure.

[0058] See also Figure 6 As shown, the second setting mode is that the scattering hole 150 is embedded in the quantum dot diffusion plate 10, and a part of the structure of the quantum dot diffusion plate 10 is arranged between the scattering hole 150 and the light-emitting chip 40. The scattering hole 150 is arranged inside the quantum dot diffusion plate 10, and the scattering hole 150 does not contact the external environment, and the scattering hole 150 is closed. The circuit layer can contact the quantum dot diffusion plate 10 on the entire surface, and the circuit layer can be stably attached to the quantum dot diffusion plate 10, so that the light-emitting chip 40 is fixed more securely.

[0059] The above two configurations can both enable the light emitting chip 40 to be stably fixed on the quantum dot diffusion plate 10 , while enabling the scattering holes 150 to play a role in eliminating lamp shadows.

[0060] In one aspect, the back plate 30 is surrounded to form a mounting groove 310. For example, the back plate 30 includes a bottom plate and a side plate, the side plate is surrounded by the bottom plate, and the mounting groove 310 is formed between the side plate and the bottom plate. The inner surface of the bottom plate is the bottom of the groove, and the inner surface of the side plate is the side wall of the groove. The quantum dot diffusion plate 10 is arranged in the mounting groove 310, and the reflective layer 20 is arranged at the bottom of the mounting groove 310. The backlight plate also includes a rubber frame 50, which is arranged on the side of the quantum dot diffusion plate 10 away from the back plate 30 and covers the gap between the quantum dot diffusion plate 10 and the side wall of the mounting groove 310; through the sealing effect of the rubber frame 50, the quantum dot diffusion plate 10 and the back plate 30 are sealed together to prevent external moisture or dust from entering the gap between the quantum dot diffusion plate 10 and the back plate 30.

[0061] See again Figure 1As shown, the backlight plate also includes a blocking portion 60, which is convexly arranged on the groove side wall of the mounting groove 310, and the quantum dot diffusion plate 10 is clamped on the blocking portion 60, so that a reflective space 311 is formed between the light-emitting chip 40 and the reflective layer 20. By setting the blocking portion 60, it is ensured that the light-emitting chip 40 and the reflective layer 20 are arranged at intervals. The blocking portion 60 can be pre-arranged on the groove side wall, the blocking portion 60 can be integrally formed with the back plate 30, or the blocking portion 60 can be arranged on the groove side wall after the back plate 30 is processed to complete the structure of the mounting groove 310. When installing the quantum dot diffusion plate 10, the quantum dot diffusion plate 10 is directly placed in the mounting groove 310, and the quantum dot diffusion plate 10 falls and is clamped on the upper surface of the blocking portion 60.

[0062] It should be noted that in order to prevent the blocking portion 60 from blocking the light emitting surface of the light emitting chip 40, the protruding length of the blocking portion 60 is relatively short, and the protruding length of the blocking portion 60 is greater than the gap between the quantum dot diffusion plate 10 and the side wall of the groove, and the blocking portion 60 can overlap the edge of the quantum dot diffusion plate 10 and maintain a certain spacing distance from the light emitting chip 40 at the upper edge position of the quantum dot diffusion plate 10.

[0063] In one aspect, the blocking portion 60 is disposed in an annular shape on the side wall of the mounting groove 310, and the blocking portion 60 is disposed close to the reflective layer 20. The blocking portion 60 is an annular structure, and the quantum dot diffusion plate 10 is stuck on the blocking portion 60 of the annular structure to prevent the quantum dot diffusion plate 10 from falling. The annular structure is designed according to the structure of the mounting groove 310. If the mounting groove 310 is a circular groove, the annular structure is a circular ring. If the mounting groove 310 is a square groove, the annular structure is a square ring.

[0064] In addition, a plurality of blocking parts 60 may be provided, and the plurality of blocking parts 60 are arranged at intervals and evenly distributed on the side walls of the groove, so that the quantum dot diffusion plate 10 can be subjected to uniform force at the position where it contacts the blocking part 60 in the installation groove 310, thereby making the position of the quantum dot diffusion plate 10 more secure.

[0065] Embodiment 2

[0066] The present application further provides a display module, which includes a color resist layer 70 and the backlight plate as described above, wherein the color resist layer 70 is disposed on a side of the quantum dot diffusion plate 10 away from the reflective layer 20 .

[0067] The display module also includes a thin film transistor (Thin Film Transistor, TFT for short) and a liquid crystal layer (Liquid Crystal Layer). The liquid crystal layer is arranged between the color resistance layer 70 and the thin film transistor. When the display module is working, a driving voltage is applied to the thin film transistor to control the rotation of the liquid crystal molecules in the liquid crystal layer to project the light, thereby generating a picture. Since the liquid crystal panel itself does not emit light, it is necessary to use the light source provided by the backlight plate to display the image normally. The backlight plate of the present application is a direct-type backlight plate, which forms a surface light source and provides it to the liquid crystal layer after the light from the light-emitting chip 40 passes through the quantum dot diffusion plate 10. In the present application, the display module also includes a polarizer, which is usually arranged between the color resistance layer 70 and the quantum dot diffusion plate 10, and the polarizer is used to ensure that the emitted light is linearly polarized light.

[0068] The implementation methods and beneficial effects of the display module refer to the above-mentioned backlight panel solution, which will not be described in detail here.

[0069] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application.

[0070] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A backlight panel, comprising a backlight panel and a light-emitting chip, characterized in that: The backlight panel also includes: A quantum dot diffusion plate, wherein the quantum dot diffusion plate is disposed on one side of the back plate, the light-emitting chip is disposed between the quantum dot diffusion plate and the back plate, the light-emitting surface of the light-emitting chip is disposed toward the back plate, and the quantum dot diffusion plate is provided with scattering holes; and A reflective layer, wherein the reflective layer is disposed on a side of the back plate facing the light-emitting chip, the light-emitting chip and the reflective layer are spaced apart, the scattering hole is located on a side of the light-emitting chip facing away from the reflective layer, and the light of the light-emitting chip is directed toward the reflective layer, so that the light is reflected by the reflective layer toward the quantum dot diffuser plate and scattered by the scattering hole; Wherein, the scattering hole is arranged on the light incident surface of the quantum dot diffusion plate, and the opening of the scattering hole on the light incident surface is located between the anode and the cathode of the light emitting chip; or The scattering hole is embedded in the quantum dot diffusion plate, and a partial structure of the quantum dot diffusion plate is arranged between the scattering hole and the light-emitting chip.

2. The backlight panel according to claim 1, characterized in that: The quantum dot diffusion plate has a light incident surface facing the reflective layer. The light incident surface of the quantum dot diffusion plate is provided with a circuit layer. The light emitting chip is arranged on the light incident surface, and the electrode of the light emitting chip is connected to the circuit layer.

3. The backlight panel according to claim 2, characterized in that: The light incident surface of the quantum dot diffusion plate is provided with a plurality of protrusions, the protrusions abut against the reflective layer, grooves are formed between adjacent protrusions, the circuit layer is at least partially arranged along the grooves, and the light emitting chip is arranged in the grooves.

4. The backlight panel according to claim 1, characterized in that: The center of the light emitting chip is located on the axis of the scattering hole, and the diameter of the scattering hole gradually increases in a direction away from the light emitting chip.

5. The backlight panel according to claim 1, characterized in that: A transparent medium is arranged in the scattering hole, and the refractive index of the transparent medium is different from the refractive index of the quantum dot diffusion plate.

6. The backlight panel according to claim 2, characterized in that: The back plate is surrounded to form a mounting groove, the quantum dot diffusion plate is arranged in the mounting groove, the reflective layer is arranged at the bottom of the mounting groove, and the backlight plate further comprises a rubber frame, the rubber frame is arranged at a side of the quantum dot diffusion plate away from the back plate, and covers the gap between the quantum dot diffusion plate and the groove side wall of the mounting groove; The backlight plate further comprises a blocking portion, which is protruding from the groove side wall of the mounting groove, and the quantum dot diffusion plate is clamped on the blocking portion to form a reflective space between the light emitting chip and the reflective layer.

7. The backlight panel according to claim 6, characterized in that: The blocking portion is arranged around the groove side wall of the installation groove, and the blocking portion is arranged close to the reflection layer.

8. A display module, characterized in that: The display module comprises a color resist layer and a backlight plate according to any one of claims 1 to 7, wherein the color resist layer is arranged on a side of the quantum dot diffusion plate away from the reflective layer.

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