Chip unsealing device and chip unsealing method

Abstract

The application belongs to the technical field of semiconductor equipment, and discloses a chip unsealing device and a chip unsealing method. The chip unsealing device comprises a chip clamping assembly, a plasma device, an ultrasonic cleaning pool and a driving assembly. The chip clamping assembly is used for clamping a chip to be unsealed, and the chip clamping assembly can drive the chip to move to below the plasma device, and the plasma device is used for performing ablation work on the chip. The ultrasonic cleaning pool is provided with a cleaning liquid, the chip clamping assembly can drive the chip to be immersed in the cleaning liquid in the ultrasonic cleaning pool, the ultrasonic cleaning pool is used for cleaning the surface of the chip, and the driving assembly is used for driving the chip clamping assembly to move. The chip is ablated and unsealed by using the plasma device, the unsealing effect is good, the chip body is not easy to be damaged, the surface of the chip is cleaned and washed by using the ultrasonic cleaning pool, residual plastic sealing material fillers can be dissolved and removed, the unsealing effect is good, the safety degree is higher compared with chemical wet etching, and the cleaning is pollution-free.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a chip desealing device and a chip desealing method. Background Technology

[0002] In the existing technology, in order to improve the quality and reliability of semiconductor chips, it is often necessary to depackage the chips to expose the wafer and bonding wires for observation and analysis. Most existing technologies use laser methods, chemical wet etching, or a combination of dry and wet etching methods to depackage the chips.

[0003] Laser desealing primarily utilizes the heat generated by a laser to vaporize the material. However, due to the fragility of semiconductor wafers, the laser cannot directly reach the sample surface, thus failing to completely remove the surface material. The remaining material requires other methods for removal. Chemical wet etching, on the other hand, uses concentrated sulfuric acid and fuming nitric acid to immerse the sample surface for desealing. These chemicals are highly corrosive and pose a significant risk; excessive immersion can damage semiconductor bonding wires, affecting the desealing effect.

[0004] Therefore, there is an urgent need for a chip depackaging device and a chip depackaging method to solve the above problems. Summary of the Invention

[0005] One objective of this invention is to provide a chip desealing device that, during the chip desealing process, is less likely to damage the chip itself, has a good desealing effect, high safety, and good cleanliness.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Chip desealing device, including:

[0008] A chip clamping assembly for clamping a chip;

[0009] A plasma device, wherein the chip clamping assembly is capable of moving the chip to a position below the plasma device, and the plasma device is used to perform an ablation operation on the chip;

[0010] An ultrasonic cleaning tank is provided with a cleaning solution. The chip clamping assembly can immerse the chip in the cleaning solution. The ultrasonic cleaning tank is used to clean the surface of the chip.

[0011] A driving component, the driving component being used to drive the chip clamping component to move.

[0012] As an optional technical solution for chip unpacking device, the driving component includes a motion platform and a rotation mechanism. The motion platform is used to drive the chip clamping component to move horizontally, and the rotation mechanism is used to drive the chip clamping component to rotate. The rotation axis of the chip clamping component is set horizontally.

[0013] As an optional technical solution for chip unpacking device, the rotating mechanism includes a rotating motor and a rotating shaft. The rotating shaft is fixedly connected to the lower part of the chip clamping assembly, and the rotating motor is used to drive the rotating shaft to rotate.

[0014] As an optional technical solution for chip unpacking device, the motion platform includes a first horizontal guide rail, a second horizontal guide rail, and a connecting frame. The first horizontal guide rail and the second horizontal guide rail are perpendicular. The rotating shaft is arranged along the extension direction of the second horizontal guide rail. The second horizontal guide rail is slidably disposed on the first horizontal guide rail. The connecting frame is slidably disposed on the second horizontal guide rail. The rotating mechanism is mounted on the connecting frame.

[0015] As an optional technical solution for the chip unpacking device, the chip unpacking device further includes an imaging device and a controller. The imaging device is used to detect the position of the chip, and the imaging device is electrically connected to the controller. The controller is used to control the driving component, the plasma device, and the ultrasonic cleaning tank.

[0016] As an optional technical solution for chip unpacking device, the chip unpacking device also includes a laser device. The chip clamping component can move the chip to the underside of the laser device, and the laser device is used to perform preliminary ablation on the chip.

[0017] As an optional technical solution for chip desealing device, the chip desealing device further includes an air blowing device for drying the chip.

[0018] As an optional technical solution for chip desealing devices, the air blowing device is connected to the air outlet of the plasma device, and the air outlet is used to supply air to the air blowing device.

[0019] As an optional technical solution for chip unpacking devices, the clamping size of the chip clamping assembly is adjustable.

[0020] As an optional technical solution for chip desealing devices, the plasma device includes a plasma torch, which is used to generate a plasma flame and is capable of moving in a vertical direction.

[0021] Another objective of this invention is to improve a chip desealing method that can safely and efficiently deseale chips without damaging the chip itself.

[0022] To achieve this objective, the present invention adopts the following technical solution:

[0023] A chip desealment method, applied to the aforementioned chip desealment device, wherein the chip desealment method includes:

[0024] Place the chip within the chip clamping assembly;

[0025] Move the chip below the plasma device and control the plasma device to perform an ablation operation on the chip;

[0026] The chip is moved and immersed in the cleaning solution of an ultrasonic cleaning tank, where it is cleaned.

[0027] As an optional technical solution for chip depackaging, the chip depackaging device also includes a laser device;

[0028] The chip desealing method further includes, before moving the chip below the plasma device and controlling the plasma device to perform an ablation operation on the chip:

[0029] Move the chip below the laser device and control the laser device to perform initial unsealing of the chip.

[0030] As an optional technical solution for chip depackaging, the chip depackaging device also includes an imaging device and a controller;

[0031] The chip unpacking method further includes, after placing the chip within the chip clamping assembly:

[0032] The chip is imaged using the imaging device, and the area to be unsealed or delayered is set using the controller.

[0033] As an optional technical solution for chip desealing, the chip desealing device also includes an air blowing device;

[0034] The chip unpacking method, after moving the chip to immerse it in the cleaning solution of the ultrasonic cleaning tank and cleaning the chip through the ultrasonic cleaning tank, further includes:

[0035] Move the chip below the air blowing device and control the air blowing device to dry the chip.

[0036] The beneficial effects of this invention are:

[0037] This invention provides a chip unpacking device, including a chip clamping assembly, a plasma device, an ultrasonic cleaning tank, and a driving assembly. The chip clamping assembly holds the chip to be unpacked and moves it under the plasma device, which performs an ablation operation on the chip. The ultrasonic cleaning tank contains a cleaning solution, and the chip clamping assembly immerses the chip in this solution. The ultrasonic cleaning tank cleans the chip surface. The driving assembly moves the chip clamping assembly. Using the plasma device for ablation unpacking results in good unpacking performance and minimizes damage to the chip itself. The ultrasonic cleaning tank effectively dissolves and removes residual molding compound from the chip surface, resulting in good unpacking performance. Compared to chemical wet etching, this method is safer and cleaner without causing pollution.

[0038] This invention also provides a chip unpacking method, which involves placing the chip within a chip clamping assembly; moving the chip under a plasma device and controlling the plasma device to perform an ablation operation on the chip; and moving the chip to immerse it in a cleaning solution in an ultrasonic cleaning tank for cleaning. By using a plasma device to ablate the chip and an ultrasonic device to clean it, the chip can be safely and efficiently unpacked without damaging the chip itself. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the chip unpacking device provided by the present invention;

[0040] Figure 2 This is a top view of the driving component provided by the present invention;

[0041] Figure 3 This is a flowchart of the chip unpacking method provided by the present invention.

[0042] In the picture:

[0043] 1. Chip clamping assembly; 2. Plasma equipment; 21. Plasma torch; 3. Ultrasonic cleaning tank; 4. Drive assembly; 41. Motion platform; 411. First horizontal guide rail; 412. Second horizontal guide rail; 413. Connecting frame; 42. Rotating mechanism; 421. Rotating motor; 422. Rotating shaft; 5. Imaging equipment; 6. Laser equipment; 7. Air blowing equipment. Detailed Implementation

[0044] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0045] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0048] like Figure 1As shown, this embodiment provides a chip unpacking device, including a chip clamping assembly 1, a plasma device 2, an ultrasonic cleaning tank 3, and a driving assembly 4. The chip clamping assembly 1 clamps the chip to be unpacked and can move the chip under the plasma device 2, which performs an ablation operation on the chip. The ultrasonic cleaning tank 3 contains a cleaning solution, and the chip clamping assembly 1 can immerse the chip in the cleaning solution. The ultrasonic cleaning tank 3 cleans the chip surface. The driving assembly 4 drives the chip clamping assembly 1 to move. Using the plasma device 2 for ablation unpacking results in good unpacking performance and minimizes damage to the chip itself. Using the ultrasonic cleaning tank 3 to clean the chip surface dissolves and removes residual molding compound, resulting in good unpacking performance. Compared to chemical wet etching, this method is safer and cleaner without causing pollution. In this embodiment, the cleaning solution is deionized water or acetone. Using deionized water or acetone as the cleaning solution allows for the dissolution of residual molding compound on the chip surface without corroding the chip, resulting in good cleaning performance. The plasma device 2 includes a plasma torch 21, which is used to generate a plasma flame. The plasma torch 21 can move vertically to adjust the distance between the plasma flame and the chip, adapting to chips of different thicknesses.

[0049] Among them, such as Figure 2As shown, the drive assembly 4 includes a motion platform 41 and a rotation mechanism 42. The motion platform 41 is used to drive the chip clamping assembly 1 to move horizontally, facilitating the chip unsealing process by moving the chip clamping assembly 1 below the plasma device 2 for ablation, and then moving it above the ultrasonic cleaning tank 3 for the next cleaning operation. The rotation mechanism 42 is used to drive the chip clamping assembly 1 to rotate. The rotation axis of the chip clamping assembly 1 is horizontally set. The rotating chip clamping assembly 1 can adjust the ablation angle of the chip by the plasma device 2, and after the ablation operation, it can also flip the chip downwards and immerse it in the cleaning solution of the ultrasonic cleaning tank 3 for the next cleaning operation. It has high work efficiency and simple structure. Specifically, the rotation mechanism 42 includes a rotation motor 421 and a rotating shaft 422. The rotating shaft 422 is fixedly connected to the bottom of the chip clamping assembly 1, and the rotation motor 421 is used to drive the rotating shaft 422 to rotate. The user can control the rotation motor 421 to adjust the angle of the chip clamping assembly 1, thereby adjusting the chip's posture, which is convenient for ablation unsealing of the chip or immersion in the cleaning solution for cleaning. Furthermore, the motion platform 41 includes a first horizontal guide rail 411, a second horizontal guide rail 412, and a connecting frame 413. The first horizontal guide rail 411 and the second horizontal guide rail 412 are perpendicular to each other. The rotating shaft 422 is arranged along the extension direction of the second horizontal guide rail 412. The first horizontal guide rail 411 is slidably disposed on the second horizontal guide rail 412, and the connecting frame 413 is slidably disposed on the first horizontal guide rail 411. The rotating mechanism 42 is installed on the connecting frame 413, thereby allowing the position of the chip clamping component 1 to be adjusted on the horizontal plane. In this embodiment, two second horizontal guide rails 412 are spaced apart, the connecting frame 413 is mounted on the two second horizontal guide rails 412, and the rotating mechanism 42 is installed between the two second horizontal guide rails 412. This arrangement can ensure the structural strength of the motion platform 41 and also avoid interference between the chip clamping component 1 and the motion platform 41 during rotation, ensuring the normal operation of the chip unsealing device.

[0050] Preferably, the chip desealing device further includes an imaging device 5 and a controller. The imaging device 5 is used to detect the position of the chip and is electrically connected to the controller, transmitting the detected chip information to the controller. The controller controls the operation of the drive assembly 4, the plasma device 2, and the ultrasonic cleaning tank 3. Through the cooperation of the imaging device 5 and the controller, the area to be desealed or delaminated is set, and the drive assembly 4 is manipulated to move the chip clamping assembly 1 to below the plasma device 2. The plasma device 2 is activated and ablates the chip surface according to the set method to perform the desealing operation. Then, the drive assembly 4 is controlled to move the chip clamping assembly 1 to above the ultrasonic cleaning tank 3. The drive assembly 4 drives the chip clamping assembly 1 to flip over, immersing the desealed chip in the cleaning solution. Ultrasonic vibration is used to clean the chip, dissolving and removing residual molding compound.

[0051] Furthermore, the chip unpacking device in this embodiment also includes a laser device 6. The chip clamping assembly 1 can move the chip to a position below the laser device 6, which is used to perform preliminary ablation on the chip. Preliminary ablation of the chip using a laser involves first removing the upper layer with a high-energy laser beam. Once the chip approaches the surface or the bonding lines are exposed, the operation stops, and a plasma device 2 is used for precise ablation. Using the laser device 6 for preliminary ablation improves the efficiency of the unpacking process. Since the subsequent unpacking process using the plasma device 2 requires lower precision from the laser operation, this avoids damage to the chip by the laser device 6.

[0052] The chip clamping component 1 in this embodiment has an adjustable clamping size, which can clamp chips of different sizes, increasing the application range of the chip unpacking device. Specifically, the chip clamping component 1 includes a clamp and a locking member. The clamp is used to clamp the chip, and the locking member can lock the chip in the clamp to prevent the chip from falling off during the unpacking process.

[0053] The chip unsealing device in this embodiment also includes an air blowing device 7, which is used to dry the chip. After the unsealed chip is cleaned by the ultrasonic cleaning tank 3, some cleaning liquid remains on the chip surface. To avoid affecting the subsequent chip collection, air is blown onto the cleaned chip by the air blowing device 7 to dry it. Preferably, the air blowing device 7 is connected to the air outlet of the plasma device 2, and the air outlet is used to supply air to the air blowing device 7, simplifying the device structure. In other embodiments, dry nitrogen gas can also be used externally to supply air to the air blowing device 7.

[0054] like Figure 3 As shown, this embodiment also provides a chip desealing method, which is applied to the above-mentioned chip desealing device. The chip desealing method includes:

[0055] S1. Place the chip into the chip clamping assembly 1;

[0056] S2. Imaging the chip using imaging device 5, and setting the area to be unsealed or delayered using the controller;

[0057] Imaging the chip with the imaging device 5 and setting the unsealing or delamination area with the controller can improve the efficiency of the unsealing operation and reduce the possibility of operational errors. The imaging device 5 transmits the chip's positioning information to the plasma device 2. The positioning information includes the center coordinates of the chip's delamination area, as well as the length and width of the chip, which makes it easier for the user to further set the unsealing or delamination area with the controller.

[0058] S3. Move the chip below the laser device 6 and control the laser device 6 to perform initial unsealing of the chip;

[0059] The chip is initially unsealed using laser equipment 6. Since subsequent steps include plasma ablation, this step has lower precision requirements, which improves chip unsealing efficiency and avoids damage to the chip.

[0060] S4. Move the chip below the plasma device 2 and control the plasma device 2 to perform ablation on the chip;

[0061] This embodiment uses a room-temperature, room-pressure plasma device 2. Argon gas is used to excite and form plasma, and oxygen is added to increase its activity. Through the physical bombardment of argon ions and the oxidation of oxygen atoms, the organic components of the molding compound typically decompose, forming water vapor and carbon dioxide. This process is safe and environmentally friendly, causing no pollution. Users can set the flow rate and ratio of argon and oxygen according to the type of unsealing operation.

[0062] S5. Move the chip and immerse it in the cleaning solution of the ultrasonic cleaning tank 3, and clean the chip through the ultrasonic cleaning tank 3.

[0063] S6. Move the chip below the air blowing device 7 and control the air blowing device 7 to dry the chip.

[0064] After step S6 is completed, the chip unsealing device can be controlled to repeat step S4, performing multiple unsealing operations on the chip to ensure the unsealing effect. By using plasma equipment 2 to ablate the chip and ultrasonic equipment to clean it, the chip can be safely and efficiently unsealed without damaging the chip itself.

[0065] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A chip debonding apparatus characterized by comprising: The chip unsealing device comprises a chip clamping assembly (1) for clamping a chip, a plasma device (2) capable of moving the chip clamping assembly (1) to below the plasma device (2) for ablation of the chip, an ultrasonic cleaning tank (3) provided with a cleaning liquid, the chip clamping assembly (1) being capable of immersing the chip into the cleaning liquid for cleaning the surface of the chip, a driving assembly (4) for driving the movement of the chip clamping assembly (1), the driving assembly (4) comprising a moving platform (41) for horizontally moving the chip clamping assembly (1) and a rotating mechanism (42) for rotating the chip clamping assembly (1), the rotating axis of the chip clamping assembly (1) being horizontally arranged, and the clamping size of the chip clamping assembly (1) being adjustable. The rotating mechanism (42) comprises a rotating motor (421) and a rotating shaft (422), the rotating shaft (422) being fixedly connected below the chip clamping assembly (1), and the rotating motor (421) being used for driving the rotation of the rotating shaft (422). The moving platform (41) comprises a first horizontal guide rail (411), a second horizontal guide rail (412) and a connecting frame (413), the first horizontal guide rail (411) and the second horizontal guide rail (412) being perpendicular, the rotating shaft (422) being arranged along the extension direction of the second horizontal guide rail (412), the second horizontal guide rail (412) being slidingly arranged on the first horizontal guide rail (411), and the connecting frame (413) being slidingly arranged on the second horizontal guide rail (412), the rotating mechanism (42) being mounted on the connecting frame (413). The chip unsealing device further comprises an image device (5) for detecting the position of the chip and a controller electrically connected with the image device (5), the controller being used for controlling the driving assembly (4), the plasma device (2) and the ultrasonic cleaning tank (3). The chip unsealing device further comprises a blowing device (7) for air-drying the chip. The blowing device (7) is connected to the air outlet of the plasma device (2), the air outlet being used for supplying air to the blowing device (7). The plasma device (2) comprises a plasma torch (21) for generating a plasma flame, the plasma torch (21) being capable of moving in the vertical direction.

2. The chip de-bonding apparatus of claim 1, wherein, The chip unsealing method is applied to the chip unsealing device according to any one of the preceding claims 1-7, the chip unsealing method comprising:

3. The chip de-bonding apparatus of claim 2, wherein, ​ 4. The chip de-bonding apparatus of any one of claims 1-3, wherein, ​ 5. The chip de-bonding apparatus of any one of claims 1-3, wherein, ​ 6. The chip de-bonding apparatus of claim 5, wherein, ​ 7. The chip de-bonding apparatus of any one of claims 1-3, wherein, ​ 8. A method of debonding a chip, characterized by, ​ placing a chip in a chip holding assembly (1); moving the chip under a plasma device (2) and controlling the plasma device (2) to perform ablation on the chip; moving the chip to immerse it in a cleaning liquid in an ultrasonic cleaning tank (3) and cleaning the chip by the ultrasonic cleaning tank (3).

9. The method of claim 8, wherein the chip is a microchip. The chip unsealing device further comprises a laser device (6); The chip unsealing method further comprises, before moving the chip under the plasma device (2) and controlling the plasma device (2) to perform ablation on the chip: moving the chip under the laser device (6) and controlling the laser device (6) to perform preliminary unsealing on the chip.

10. The method of claim 9, wherein the chip is a microchip. The chip unsealing device further comprises an imaging device (5) and a controller; The chip unsealing method further comprises, after placing a chip in a chip holding assembly (1): imaging the chip by the imaging device (5) and setting the area that needs to be unsealed or delaminated by the controller.

11. The method of claim 10, wherein the chip is a microchip. The chip unsealing device further comprises a blowing device (7); The chip unsealing method further comprises, after moving the chip to immerse it in a cleaning liquid in an ultrasonic cleaning tank (3) and cleaning the chip by the ultrasonic cleaning tank (3): moving the chip under the blowing device (7) and controlling the blowing device (7) to dry the chip.

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