Photoelectric card manufacturing method and photoelectric card

Abstract

The present invention discloses a method for manufacturing photoelectric playing cards and photoelectric playing cards, relating to the technical field of entertainment products. The photoelectric playing card manufacturing method adopts a multi-layer composite structure. The middle layer structure of the photoelectric playing card is formed by arranging the light-emitting circuit of the playing card on a dielectric layer material and compounding a cushioning layer material on the dielectric layer material. The paper battery, light-emitting element, and conductive circuit on the light-emitting circuit are all designed to be flexible, making the bending performance of the photoelectric playing card closer to that of traditional paper printed materials. Pressing the upper printed layer sheet causes the conductive switch to contact the conductive circuit, thereby conducting the circuit between the paper battery and the light-emitting element. The paper battery provides a DC voltage to drive the light-emitting element, which illuminates the pattern on the upper printed layer. No external power source is required as a driving source, resulting in better consistency and integration of the playing card. The photoelectric playing card of the present invention has a built-in light-emitting circuit. Once the light-emitting circuit is turned on, the playing card can be illuminated, making the playing card more competitive and attractive in the market.

Description

Technical Field

[0001] The present invention relates to the technical field of entertainment products, and in particular to a method for manufacturing photoelectric cards and the photoelectric cards. Background Art

[0002] Photoelectric packaging is a type of smart packaging and an important development direction in the field of packaging materials. Compared with traditional packaging, photoelectric packaging is obviously more eye-catching. Existing photoelectric packaging usually uses LEDs and EL cold light sheets as the light source. These components have complex structures and large volumes. On the one hand, they are difficult to assemble, and on the other hand, they are not suitable for mass production.

[0003] LEDs, as light emitters, are point-emitting materials. To achieve effective displays, patterns or text must be directly displayed using an LED array. However, this display method requires a large power source, which significantly increases size and cost. EL cold light sheets are surface-emitting materials, but their characteristics dictate that they require high-voltage AC power as a driving source. Common battery power sources are mostly low-voltage DC, and the converters that convert low-voltage DC to high-voltage AC are bulky and produce annoying noise. Traditional eye-catching features like laser hot stamping are becoming increasingly worn out, and the appeal and competitiveness of playing cards in the market continues to decline. Existing technologies lack the technology and manufacturing processes to apply optoelectronic packaging to thin and lightweight playing cards. Summary of the Invention

[0004] In order to solve the above problems, the technical solution provided by the present invention is:

[0005] A method for manufacturing a photoelectric card, comprising:

[0006] Printing a pattern on the upper printing layer material; partially screen printing a conductive switch on the back of the upper printing layer material; performing positioning punching on the upper printing layer material; and punching the upper printing layer material into an upper printing layer sheet;

[0007] Printing patterns on the lower printing layer material; performing positioning punching on the lower printing layer material; punching the lower printing layer material into a lower printing layer sheet;

[0008] Performing positioning punching on the cushioning layer material; performing die cutting at specific positions of the cushioning layer material;

[0009] Pre-baking the dielectric layer material; printing conductive circuits on the pre-baked dielectric layer material using conductive silver paste; printing a UV layer on the silver paste area using a register overprinting process; printing glue on the non-conductive area using a register overprinting process, and covering the non-conductive area with a release film after the glue is cured; and performing positioning punching on the dielectric layer material;

[0010] The release film on the dielectric layer material is peeled off, and the dielectric layer material and the cushioning layer material are compounded into a middle layer through the punching; the middle layer is cut into middle layer sheets; the middle layer sheets are subjected to water return and pressure maintenance in sequence; an ACF film is attached to the die-cut portion of the middle layer sheet; a paper battery and a light-emitting component are attached to the ACF film; and the ACF film area of ​​the middle layer sheet is subjected to heat pressing to electrically connect the paper battery and the light-emitting component to the conductive circuit respectively.

[0011] According to the punching holes on the upper printing layer sheet, the middle layer sheet and the lower printing layer sheet, the upper printing layer sheet, the middle layer sheet and the lower printing layer sheet are compounded and punched into photoelectric cards by using a glue mounting process.

[0012] The present invention is further configured to, after hot pressing the ACF film area of ​​the middle layer sheet, provide a conductive part to the switch of the conductive circuit to turn on the conductive circuit, and collect the brightness of the light-emitting part through a photosensitive device to determine whether the conductive circuit is qualified; if the brightness of the light-emitting part exceeds a preset threshold, the conductive circuit is judged to be qualified, and the middle layer sheet enters the next composite punching step; if the brightness of the light-emitting part does not exceed the preset threshold, the conductive circuit is judged to be unqualified, and the middle layer sheet is marked as a defective product and discarded.

[0013] The present invention is further configured such that the conductive silver paste is printed on the dielectric layer material using a roll-to-roll screen printing process, and the conductive silver paste is subjected to a surface drying treatment after printing.

[0014] The present invention further sets the hot pressing process parameters of the ACF film area of ​​the middle layer sheet as follows: hot pressing temperature is 155°C to 165°C, hot pressing weight is 6 to 8kg, hot pressing time is 20 to 24s, and blowing cooling time is 6 to 10s.

[0015] The present invention is further configured to print patterns on the upper printing layer material, including the following steps: performing corona treatment on the upper printing layer material; performing black primer printing on the back of the upper printing layer material; applying UV glue on the back of the upper printing layer material; transferring cold-stamped electroplated aluminum with a designed pattern to the back of the upper printing layer material; performing primer coating on the front of the upper printing layer material; performing four-color CMYK printing on the front of the upper printing layer material; applying UV glue on the front of the upper printing layer material; performing local cold stamping on a part of the front of the upper printing layer material; performing full-page varnish coating on the front of the upper printing layer material; and performing local varnish coating on the front of the upper printing layer material.

[0016] The present invention is further configured to locally screen-print a conductive switch on the back of the upper printed layer material, comprising the following steps: using conductive carbon paste and printing on the back of the upper printed layer material through a roll-to-roll screen printing process; and drying the upper printed layer material after printing.

[0017] The present invention is further configured to print patterns on the lower printing layer material, including: performing corona treatment on the lower printing layer material; printing a white primer on the front of the lower printing layer material; performing four-color CMYK printing on the front of the lower printing layer material; printing an anti-counterfeiting code on the front of the lower printing layer material; applying full-page varnish on the front of the lower printing layer material; and applying partial varnish on the front of the lower printing layer material.

[0018] The present invention is further configured such that the flexible light emitting device adopts an LED light emitting module or an OLED light emitting body, and the paper battery adopts a flexible zinc-manganese paper battery or a lithium-manganese paper battery.

[0019] The present invention is further configured such that the upper printing layer material and the lower printing layer material are made of PET or white cardboard, and the cushioning layer material and the medium layer material are made of white cardboard.

[0020] A photoelectric card is prepared according to the above-mentioned photoelectric card manufacturing method, and the overall thickness of the photoelectric card is 1.0-1.5 mm.

[0021] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0022] The photoelectric card of this technical solution adopts a multi-layer composite structure. The middle layer structure of the photoelectric card is formed by arranging the light-emitting circuit of the card on the dielectric layer material, and compounding the padding layer material on the dielectric layer material. The paper battery, light-emitting component and conductive circuit on the light-emitting circuit are all flexible, making the bending performance of the photoelectric card closer to that of traditional paper printed products. In addition, the power supply of the light-emitting circuit is completed by the low-voltage DC power supply paper battery, and no external power supply is required as a driving source, which improves the consistency and integration of the card.

[0023] The photoelectric cards in this technical solution illuminate by pressing the upper printed layer, causing the conductive switch to contact the conductive circuit, thereby completing the circuit between the paper battery and the light-emitting element. The paper battery then provides a DC voltage to the light-emitting element, which then illuminates the pattern on the upper printed layer. The photoelectric cards of this invention not only have the bendability of traditional paper printed materials, but also have a built-in light-emitting circuit that illuminates the card when triggered, making the cards more competitive and attractive in the market. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1This is a flow chart of a method for manufacturing photoelectric cards according to an embodiment of the present invention.

[0025] Figure 2 Schematic cross-section of a photoelectric card according to an embodiment of the present invention.

[0026] Figure 3 This is a flow chart of pattern printing of the upper printing layer material according to an embodiment of the present invention.

[0027] Figure 4 This is a flow chart of pattern printing of the printing layer material according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0029] Example 1

[0030] Combined with attachment Figure 1 The technical solution of the present invention is a method for manufacturing photoelectric cards, comprising:

[0031] Printing a pattern on the upper printing layer material; partially screen printing a conductive switch on the back of the upper printing layer material; performing positioning punching on the upper printing layer material; and punching the upper printing layer material into an upper printing layer sheet;

[0032] Printing patterns on the lower printing layer material; performing positioning punching on the lower printing layer material; punching the lower printing layer material into a lower printing layer sheet;

[0033] Performing positioning punching on the cushioning layer material; performing die cutting at specific positions of the cushioning layer material;

[0034] Pre-baking the dielectric layer material; printing conductive circuits on the pre-baked dielectric layer material using conductive silver paste; printing a UV layer on the silver paste area using a register overprinting process; printing glue on the non-conductive area using a register overprinting process, and covering the non-conductive area with a release film after the glue is cured; and performing positioning punching on the dielectric layer material;

[0035] The release film on the dielectric layer material is peeled off, and the dielectric layer material and the cushioning layer material are compounded into a middle layer through the punching; the middle layer is cut into middle layer sheets; the middle layer sheets are subjected to water return and pressure maintenance in sequence; an ACF film is attached to the die-cut portion of the middle layer sheet; a paper battery and a light-emitting component are attached to the ACF film; and the ACF film area of ​​the middle layer sheet is subjected to heat pressing to electrically connect the paper battery and the light-emitting component to the conductive circuit respectively.

[0036] According to the punching holes on the upper printing layer sheet, the middle layer sheet and the lower printing layer sheet, the upper printing layer sheet, the middle layer sheet and the lower printing layer sheet are compounded and punched into photoelectric cards by using a glue mounting process.

[0037] In the above embodiment, the photoelectric card adopts a multi-layer composite structure. The middle layer structure of the photoelectric card is formed by arranging the card's light-emitting circuit on a dielectric layer material, and compounding a cushioning layer material on the dielectric layer material. The paper battery, light-emitting element and conductive circuit on the light-emitting circuit are all flexible, making the bending performance of the photoelectric card closer to that of traditional paper printed materials. In addition, the light-emitting circuit is powered by a low-voltage DC power supply paper battery, and no external power source is required as a driving source, which improves the consistency and integration of the card.

[0038] Combined with attachment Figure 2 The photoelectric card after molding includes four layers, including an upper printing layer 10, a cushioning layer 20, a dielectric layer 30 and a lower printing layer 40, wherein the upper printing layer sheet is the upper printing layer 10, the middle layer sheet is a composite of the cushioning layer 20 and the dielectric layer 30, and the lower printing layer sheet is the lower printing layer 40.

[0039] In each step of the above embodiment, the positioning punching of each layer of material, the die-cutting of the cushioning layer, the printing of the conductive circuit of the dielectric layer, the printing of the UV layer of the dielectric layer, the printing of glue in the non-silver paste area of ​​the dielectric layer, the flat lamination of the dielectric layer and the cushioning layer, the attachment of the ACF film at the die-cut of the middle layer sheet, the attachment of paper batteries and light-emitting components on the ACF film, and the final mounting and lamination of the sheets are all performed using CCD machine vision positioning. The CCD machine vision system is a product used for industrial detection and identification.

[0040] In the above embodiment, considering the water absorption of the dielectric layer material and the precision requirements of the subsequent process alignment, the material is first pre-baked, and the baking conditions are: 100-140°C, 15-20 minutes; a UV layer is printed to protect the silver paste to prevent oxidation failure (this printing process step requires leaving a conductive connection area to facilitate subsequent ACF film bonding).

[0041] In the above embodiment, the ACF film is an anisotropic conductive film in the form of a roll tape, which is composed of two layers of release paper sandwiching the anisotropic conductive material. Therefore, during the ACF film attachment process, a suction nozzle is first used to pick it up, the release paper on one side is peeled off and attached to the designated position, and then the release paper on the other side is blown away by a blowing device, and then the paper battery and the light-emitting body are attached.

[0042] In the above embodiment, the ACF film is not conductive after bonding and needs to be activated by heating and pressurizing, a process that is completely unavailable in existing card products. The photoelectric card uses the proven ACF hot pressing process, which can ensure the bond strength between the light-emitting element, paper battery and conductive circuit. Even if the card is bent at a certain angle, poor contact will not occur.

[0043] In the above embodiment, the specific positions of the cushioning layer material specifically correspond to the positions of the paper battery, the light-emitting component and the conductive switch, and the size of the die-cut opening is adapted to the size of the corresponding device.

[0044] In the above embodiment, the middle layer sheet is returned to water on a constant temperature and humidity production line.

[0045] In the above embodiment, the upper printing layer sheet, the middle layer sheet and the lower printing layer sheet are all intermediately punched or cut to size, and finally a punching step is required to obtain the final photoelectric card.

[0046] In the above embodiment, the punched holes on the upper printing layer sheet, the middle layer sheet and the lower printing layer sheet serve as positioning holes to achieve positioning and mounting. The back of the upper printing layer sheet (except for the conductive switch position) and the back of the lower printing layer sheet are coated with white mounting glue, which are respectively compounded on the upper and lower sides of the middle layer sheet, and the sheets are pressure-held after compounding. The main function is to ensure that the glue is completely cured and the bonding strength between the layers is the best. The pressure-holding process parameters are: the pressure-holding weight is 5-7kg, and the pressure-holding time is 20-28h. The advantages of using white mounting glue are as follows: 1. The process operation is simple, no heat drying is required, and the material no longer deforms; the stability of the card size is guaranteed. 2. White glue is suitable for gluing between paper and paper, and paper and PET. The material matching is flexible and the structure is symmetrical.

[0047] In this embodiment, after the ACF film area of ​​the middle layer sheet is hot-pressed, a conductive part is provided to the switch of the conductive circuit to turn on the conductive circuit, and the brightness of the light-emitting part is collected by a photosensitive device to determine whether the conductive circuit is qualified; if the brightness of the light-emitting part exceeds a preset threshold, the conductive circuit is judged to be qualified, and the middle layer sheet enters the next composite punching step; if the brightness of the light-emitting part does not exceed the preset threshold, the conductive circuit is judged to be unqualified, and the middle layer sheet is marked as a defective product and discarded.

[0048] In the above embodiment, after the paper battery and the light-emitting component are attached to the middle sheet, it is unable to independently emit light due to the lack of a conductive switch on the upper printed layer to trigger the switch point of the conductive circuit. However, in order to test whether the light-emitting circuit on the middle sheet is normal, a detection mechanism needs to be set up to detect the quality of the middle sheet.

[0049] In the above embodiment, the brightness of the light-emitting element may be determined by a detection circuit with a photoresistor, and whether the light-emitting element is normally lit is determined based on voltage information across the photoresistor.

[0050] In this embodiment, the conductive silver paste is printed on the dielectric layer material by using a roll-to-roll screen printing process, and the conductive silver paste is subjected to a surface drying treatment after printing.

[0051] In the above embodiment, in order to improve production efficiency, the conductive silver paste is subjected to a surface drying treatment, and the surface drying process includes a temperature of 75° C. to 85° C. and a time of 8 to 12 minutes.

[0052] In this embodiment, the hot pressing process parameters of the ACF film area of ​​the middle layer sheet are: hot pressing temperature of 155° C. to 165° C., hot pressing weight of 6 to 8 kg, hot pressing time of 20 to 24 seconds, and air blowing cooling time of 6 to 10 seconds.

[0053] In this embodiment, as shown in the attached Figure 3 As shown, pattern printing on the upper printing layer material includes the following steps:

[0054] The upper printing layer material is subjected to corona treatment; a black primer is printed on the back of the upper printing layer material; UV glue is applied to the back of the upper printing layer material; cold-stamped electroplated aluminum with a designed pattern is transferred to the back of the upper printing layer material; a primer is applied to the front of the upper printing layer material; four-color CMYK printing is performed on the front of the upper printing layer material; UV glue is applied to the front of the upper printing layer material; local cold stamping is performed on a part of the front of the upper printing layer material; full-screen varnish is applied on the front of the upper printing layer material; and local varnish is applied on the front of the upper printing layer material.

[0055] In the above embodiment, corona treatment of the upper printing layer material can improve the surface energy of the material and enhance the adsorption of the material to ink, varnish, etc., and the process parameters are: voltage 10000~20000V, power 2~70KW; the main functions of printing black primer on the back of the upper printing layer material are: 1. covering the hot stamping lines on the back, 2. covering the excess luminous area of ​​the luminous body (forming patterning), and the process parameters are: anilox roller 1000 lines; BCM (ink carrying capacity) 1.94; the cold-stamped electroplated aluminum is silver, the purpose of which is to cover the excess luminous area of ​​the luminous body (forming patterning), and the process parameters are: anilox roller parameter 300 lines; the primer material on the front of the upper printing layer material is acrylic material, the purpose of which is to further enhance the bonding strength between the ink and the material, and the process parameters are: anilox roller parameter 300 lines ; The front side is printed in four colors, in the order of light color first and dark color later, printing yellow, magenta, cyan and black in sequence, wherein the process parameters are: yellow - anilox roller 900 lines, BCM (ink carrying capacity) 2.58, magenta - anilox roller 900 lines, BCM2.26, cyan - anilox roller 1000 lines, BCM2.26, black - anilox roller 1100 lines, BCM2.0; the purpose of local cold stamping on the front side of the upper printing layer material is to create a metallic texture effect on the printed surface; the purpose of full-plate varnish coating on the front side of the upper printing layer material is to brighten the surface of the material and form a high-gloss effect, and the process parameters are: anilox roller parameter 200 lines; the purpose of local varnish coating on the front side of the upper printing layer material is to form a reverse texture effect, or a matte contrast, or a frosted touch and other high-end effects with varnish 1, and the process parameters are: anilox roller parameter 200 lines.

[0056] In this embodiment, as shown in the attached Figure 4 As shown, the local silk-screening of the conductive switch on the back side of the upper printed layer material includes the following steps:

[0057] Conductive carbon paste is used to print on the back of the upper printing layer material through a roll-to-roll screen printing process; and after printing, the upper printing layer material is dried under the following conditions: temperature 110-130° C., 12-18 minutes.

[0058] In this embodiment, printing a pattern on the lower printing layer material includes:

[0059] The lower printing layer material is subjected to corona treatment; a white primer is printed on the front surface of the lower printing layer material; four-color CMYK printing is performed on the front surface of the lower printing layer material; an anti-counterfeiting code is printed on the front surface of the lower printing layer material; a full-page varnish coating is performed on the front surface of the lower printing layer material; and a partial varnish coating is performed on the front surface of the lower printing layer material.

[0060] In the above embodiment, the printing process of the lower printing layer material may refer to the process parameters of the upper printing layer material.

[0061] In this embodiment, the flexible light emitting device adopts an LED light emitting module or an OLED light emitting body, and the paper battery adopts a flexible zinc-manganese paper battery or a lithium-manganese paper battery.

[0062] In this embodiment, the upper printing layer material and the lower printing layer material are PET material or white cardboard, and the cushioning layer material and the dielectric layer material are white cardboard.

[0063] The photoelectric cards of this invention illuminate by pressing the upper printed layer to bring the conductive switch into contact with the conductive circuit, thereby completing the circuit between the paper battery and the light-emitting element. The paper battery then provides a DC voltage to the light-emitting element, which then illuminates the pattern on the upper printed layer. The photoelectric cards of this invention not only have the bendability of traditional paper printed materials but also have a built-in light-emitting circuit that illuminates the card upon triggering, making them more competitive and attractive in the market.

[0064] The present photoelectric card manufacturing method integrates a flexible light source and power supply into the card system, resulting in improved bendability and a luminous effect while maintaining a relatively small thickness. Testing has shown that cards with varying process parameters, materials, and battery types can achieve a lifespan of 15,000 to 25,000 presses.

[0065] Example 2

[0066] Combined with attachment Figure 2 The technical solution of the present invention is a photoelectric card, which is prepared according to the above-mentioned photoelectric card manufacturing method, and the overall thickness of the photoelectric card is 1.0mm~1.5mm.

[0067] In the above embodiment, the thickness of the upper printing layer may be 0.20 mm to 0.4 mm; the thickness of the cushioning layer may be 0.4 mm; the thickness of the dielectric layer may be 0.20 mm to 0.36 mm; and the thickness of the lower printing layer may be 0.20 mm to 0.4 mm.

[0068] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to in detail.

[0069] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0070] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for manufacturing photoelectric cards, characterized in that: include: Performing pattern printing on the upper printing layer material; Partially screen-printing a conductive switch on the back side of the upper printed layer material; Performing positioning punching on the upper printing layer material; Punching the upper printing layer material into an upper printing layer sheet; Printing a pattern on the lower printing layer material; performing positioning punching on the lower printing layer material; Punching the lower printing layer material into a lower printing layer sheet; Performing positioning punching on the cushioning layer material; performing die cutting at specific positions of the cushioning layer material; Pre-baking the dielectric layer material; printing conductive circuits on the pre-baked dielectric layer material using conductive silver paste; Use the overprinting process to print the UV layer on the silver paste area; use the overprinting process to print the glue on the non-conductive area, and cover it with a release film after the glue is cured; Performing positioning punching on the dielectric layer material; The release film on the dielectric layer material is peeled off, and the dielectric layer material and the cushioning layer material are compounded into a middle layer through the punching; the middle layer is cut into middle layer sheets; the middle layer sheets are subjected to water return and pressure maintenance in sequence; an ACF film is attached to the die-cut portion of the middle layer sheet; a paper battery and a light-emitting component are attached to the ACF film; and the ACF film area of ​​the middle layer sheet is subjected to heat pressing to electrically connect the paper battery and the light-emitting component to the conductive circuit respectively. According to the punching holes on the upper printing layer sheet, the middle layer sheet and the lower printing layer sheet, the upper printing layer sheet, the middle layer sheet and the lower printing layer sheet are compounded and punched into photoelectric cards by using a glue mounting process.

2. The method for manufacturing photoelectric cards according to claim 1, characterized in that: After hot pressing the ACF film area of ​​the middle layer sheet, a conductive member is provided to the switch of the conductive circuit to conduct the conductive circuit, and the brightness of the light-emitting member is collected by a photosensitive device to determine whether the conductive circuit is qualified; If the brightness of the light-emitting element exceeds a preset threshold, the conductive circuit is judged to be qualified, and the middle layer sheet enters the next composite punching step; If the brightness of the light-emitting element does not exceed a preset threshold, the conductive circuit is judged to be unqualified, and the middle layer sheet is marked as defective and rejected.

3. The method for manufacturing photoelectric cards according to claim 1, wherein: The conductive silver paste is printed on the dielectric layer material by using a roll-to-roll screen printing process, and the conductive silver paste is subjected to a surface drying treatment after printing.

4. The method for manufacturing photoelectric cards according to claim 1, wherein: The hot pressing process parameters of the ACF film area of ​​the middle layer sheet are as follows: hot pressing temperature is 155° C. to 165° C., hot pressing weight is 6 to 8 kg, hot pressing time is 20 to 24 seconds, and blowing cooling time is 6 to 10 seconds.

5. The method for manufacturing photoelectric cards according to claim 1, wherein: Printing the upper printing layer material with patterns comprises the following steps: The upper printing layer material is subjected to corona treatment; a black primer is printed on the back of the upper printing layer material; UV glue is applied to the back of the upper printing layer material; cold-stamped electroplated aluminum with a designed pattern is transferred to the back of the upper printing layer material; a primer is applied to the front of the upper printing layer material; four-color CMYK printing is performed on the front of the upper printing layer material; UV glue is applied to the front of the upper printing layer material; local cold stamping is performed on a part of the front of the upper printing layer material; full-screen varnish is applied on the front of the upper printing layer material; and local varnish is applied on the front of the upper printing layer material.

6. The method for manufacturing photoelectric cards according to claim 1, characterized in that: The local silk-screen conductive switch on the back side of the upper printed layer material comprises the following steps: Conductive carbon paste is used to print on the back of the upper printing layer material through a roll-to-roll screen printing process; and the upper printing layer material is dried after printing.

7. The method for manufacturing photoelectric cards according to claim 1, wherein: Printing the pattern on the lower printing layer material includes: The lower printing layer material is subjected to corona treatment; a white primer is printed on the front surface of the lower printing layer material; four-color CMYK printing is performed on the front surface of the lower printing layer material; an anti-counterfeiting code is printed on the front surface of the lower printing layer material; a full-page varnish coating is performed on the front surface of the lower printing layer material; and a partial varnish coating is performed on the front surface of the lower printing layer material.

8. The method for manufacturing photoelectric cards according to claim 1, characterized in that: The light-emitting component adopts an LED light-emitting module or an OLED light-emitting body, and the paper battery adopts a flexible zinc-manganese paper battery or a lithium-manganese paper battery.

9. The method for manufacturing photoelectric cards according to claim 1, characterized in that: The upper printing layer material and the lower printing layer material are PET material or white cardboard, and the cushioning layer material and the medium layer material are white cardboard.

10. A photoelectric card, characterized in that: The photoelectric card is prepared according to the photoelectric card manufacturing method according to any one of claims 1 to 9, and the overall thickness of the photoelectric card is 1.0 to 1.5 mm.

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