Bonding apparatus

Abstract

The application discloses a kind of bonding equipment, the bonding equipment is used to the first object and second object are bonded, at least one of the two surfaces of the first object and the second object is provided with bonding layer.Therein, the bonding equipment includes first carrier, second carrier and first driving member;The first carrier is used to place the first object;The second carrier is used to place the second object;The first driving member can drive the first carrier and / or the second carrier moves, to make the first carrier and the second carrier close and make the first object and the second object bond.The technical scheme of the present application can improve bonding efficiency and bonding accuracy.

Description

Technical Field

[0001] This invention relates to the field of adhesive technology, and in particular to an adhesive device. Background Technology

[0002] Bonding, the process of attaching one object to another, is common in product manufacturing. For example, in the assembly of consumer electronics, most products involve bonding silicone pads. However, currently, the industry standard for bonding is manual, where silicone pads or other objects are manually attached to the electronic or other products. This manual process is slow, affecting bonding efficiency. Furthermore, manual bonding is prone to misalignment and inconsistent bonding pressure, impacting bonding accuracy. Summary of the Invention

[0003] The main objective of this invention is to provide an adhesive bonding device that aims to improve bonding efficiency and bonding accuracy.

[0004] To achieve the above objectives, the present invention provides an adhesive bonding device for bonding a first object and a second object, wherein at least one of the two opposing surfaces of the first object and the second object is provided with an adhesive layer, and the adhesive bonding device comprises:

[0005] A first carrier, the first carrier being used to hold the first object;

[0006] A second carrier, the second carrier being used to hold the second object; and

[0007] A first driving member is capable of driving the first carrier and / or the second carrier to move, so that the first carrier and the second carrier are brought close together and the first object and the second object are adhered together.

[0008] Optionally, the first carrier has a first mounting surface for mounting the first object, and the first carrier is provided with a mounting hole, the mounting hole having a first opening, the first opening being located on the first mounting surface;

[0009] The second carrier is disposed in the mounting hole, the second carrier has a second mounting surface, the second mounting surface and the hole wall at one end of the mounting hole near the first hole opening form a positioning groove, the positioning groove is used to accommodate the second object;

[0010] The direction parallel to the second mounting surface to the first opening is defined as the first direction, and the first driving member can drive the first carrier and / or the second carrier to slide along the first direction.

[0011] Optionally, the second carrier is provided with an adsorption hole, one end of which has a second opening, the second opening being located on the second mounting surface, and the end of the adsorption hole away from the second opening being used to connect to an air extraction device;

[0012] And / or, the first mounting surface is provided with a positioning sensor, the positioning sensor being electrically connected to the first driving member, the positioning sensor being used to detect whether the first object is mounted on the first mounting surface.

[0013] Optionally, the mounting hole has a third opening at the end away from the first opening, the third opening is located on the surface of the first carrier away from the first mounting surface, and the end of the second carrier away from the second mounting surface protrudes through the third opening;

[0014] The first driving member is disposed on the side of the first carrier away from the first mounting surface and is connected to the end of the second carrier away from the second mounting surface, so as to drive the second carrier to slide along the first direction to approach and move away from the first mounting surface.

[0015] Optionally, the number of the mounting holes and the number of the second carriers are both at least two, and each of the second carriers is slidably disposed in one of the mounting holes along the first direction; the bonding device further includes a connector, which connects the ends of at least two carriers away from the second mounting surface and the first driving member;

[0016] And / or, the first driving component is a telescopic cylinder.

[0017] Optionally, the bonding device further includes a clamping mechanism for cooperating with the first carrier to clamp the first object placed on the first carrier.

[0018] Optionally, the clamping mechanism includes:

[0019] Second drive unit; and

[0020] A clamping member is connected to the second driving member and can be driven by the second driving member to approach and move away from the first carrier. The clamping member is used to abut against the first object placed on the first carrier.

[0021] Optionally, the second driving member can drive the clamping member to slide and rotate, and the sliding direction of the clamping member and the rotation axis of the clamping member are arranged parallel to each other.

[0022] Optionally, the bonding device further includes a positioning structure for positioning the first object placed on the first carrier.

[0023] Optionally, the first carrier has a first mounting surface for mounting the first object, and the positioning structure includes:

[0024] A first positioning element is disposed on the first mounting surface and is capable of being adapted and inserted into the first object mounted on the first mounting surface; and

[0025] The second positioning member, the first carrier has a side wall surface connected to the first placement surface, the second positioning member and the side wall surface are arranged opposite to each other, and the side of the second positioning member near the side wall surface is provided with a guide surface to guide the first positioning member and the first object to be inserted and engaged.

[0026] In use, the bonding device of the present invention allows a first object to be placed on a first carrier of the bonding device, and a second object to be placed on a second object of the bonding device. Then, a first driving member provides power to drive the first carrier and / or the second carrier to move, bringing them closer together. At this time, the first object placed on the first carrier and the second object placed on the second carrier can come into contact. Furthermore, since at least one of the two facing surfaces of the first and second objects is provided with an adhesive layer, the first and second objects can be bonded and fixed through this adhesive layer, thus completing the process of bringing the first and second objects closer together for bonding.

[0027] Furthermore, since the bonding equipment in this solution places the first object and the second object on a first carrier and a second carrier respectively, and drives the first object and / or the second object to complete the proximity bonding process through a first driving component, it replaces the traditional method of manually bringing the first and second objects close together to complete the proximity bonding, thus achieving automated operation of the proximity bonding of the first and second objects. At this time, the automatic proximity bonding operation by the bonding equipment has a faster working cycle and can operate for a longer period of time, thereby improving bonding efficiency. Moreover, the automatic proximity bonding operation by the bonding equipment also allows the first and second objects to accurately approach each other along a preset moving direction, reducing the possibility of misalignment during bonding; at the same time, it can also apply a preset bonding pressure evenly to the first and second objects, reducing the possibility of inconsistent bonding pressure leading to inconsistent bonding between products, thereby improving bonding accuracy. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of an embodiment of the bonding device of the present invention;

[0030] Figure 2 for Figure 1 A structural schematic diagram of the bonding equipment from another perspective;

[0031] Figure 3 for Figure 1 An exploded structural diagram of a bonding device;

[0032] Figure 4 for Figure 3 Another structural schematic diagram of the exploded structure of the bonding equipment;

[0033] Figure 5 for Figure 1 A partial structural diagram of the bonding equipment;

[0034] Figure 6 for Figure 1 A schematic diagram of the structure of the first carrier in the bonding equipment.

[0035] Explanation of icon numbers:

[0036] label name label name 100 bonding equipment 50 bearing plate 10 First carrier 51 Avoidance 11 First resettlement area 53 Mounting plate 13 Mounting holes 60 clamping mechanism 15 sidewall 61 Second drive unit 20 Second carrier 63 Clamping parts 21 Second resettlement area 70 Positioning structure 23 positioning groove 71 First positioning component 25 Adsorption pores 73 Second positioning component 30 First driving component 731 Guide surface 40 connector 733 elongated hole

[0037] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0039] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0040] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0042] In simple terms, bonding is the process of attaching one object to another, making them a unified whole. Bonding is a common and essential part of product manufacturing. For example, in the assembly of consumer electronics, the bonding of silicone pads is involved in the vast majority of electronic products.

[0043] However, the current industry standard for bonding processes is manual bonding, where silicone pads or other objects with adhesive layers are manually attached to electronic or other products. While this manual bonding method can achieve the bonding of two objects, it has certain drawbacks. Specifically, the first drawback is that operators cannot work efficiently for extended periods, making it difficult to maintain a consistent bonding rhythm and thus affecting bonding efficiency. The second drawback is that when operators bring two objects close together for bonding, hand tremors are inevitable, leading to misalignment during bonding. Furthermore, it is difficult for operators to maintain consistent bonding pressure on both objects each time, affecting bonding accuracy. In other words, current industry bonding processes, because they rely on manual bonding of two objects, struggle to achieve good results in both bonding efficiency and bonding accuracy.

[0044] Based on the above considerations, in order to solve the problems of low bonding efficiency and unsatisfactory bonding accuracy in the current bonding processes in the industry, this application proposes a bonding device. By setting a first driving component to drive the movement of a first carrier for placing a first object and / or a second carrier for placing a second object, the first carrier and the second carrier are brought closer together to complete the bonding between the first object and the second object. This achieves automatic close-to-close bonding of the two objects, replacing the traditional manual close-to-close bonding, thereby improving bonding efficiency and bonding accuracy.

[0045] It should be noted that the bonding equipment proposed in this application is not limited to bonding silicone pads to electronic products as mentioned above. It can also be used to bond waterproof membranes or light-blocking films to electronic products or other similar products, or to bond and fix two plastic sheets, or even two metal sheets, etc. In other words, the first object can be an electronic product or other product, and the second object can be a silicone pad, waterproof membrane, or light-blocking film, etc. Alternatively, the first and second objects can be the same, both being plastic sheets or metal sheets, etc. The bonding equipment proposed in this application does not specifically limit the objects to be bonded; the first and second objects can be any objects. As long as it is necessary to bond the first and second objects, the bonding equipment proposed in this application can be used.

[0046] The specific structure of the bonding device proposed in this application will be explained and described in the following specific embodiments. In one embodiment of this application, please refer to the reference. Figures 1 to 3 The bonding device 100 proposed in this application includes a first carrier 10, a second carrier 20, and a first driving member 30. The first carrier 10 is used to place a first object; the second carrier 20 is used to place a second object; the first driving member 30 is capable of driving the first carrier 10 and / or the second carrier 20 to move, so that the first carrier 10 and the second carrier 20 are brought closer together to bond the first object and the second object.

[0047] The first carrier 10 can be used to provide a placement position for placing the first object. The first carrier 10 can be a plate structure, a solid structure, or a frame structure formed by assemblies of columns, etc. This application does not specifically limit the structural form and shape of the first carrier 10, as long as it can be used to place the first object. If an adhesive layer is provided on the first object for subsequent bonding and fixing to a second object, the adhesive layer on the first object can be located on the side opposite to the first carrier 10.

[0048] The second carrier 20 can be used to provide a placement position for placing a second object. The second carrier 20 can be a plate structure, a solid structure, or a frame structure formed by assemblies of columns, etc. This application does not specifically limit the structural form and shape of the second carrier 20, as long as it can be used to place the second object. If an adhesive layer is provided on the second object for subsequent bonding and fixing to the first object, the adhesive layer on the second object can be located on the side opposite to the second carrier 20. Furthermore, the positional relationship between the second carrier 20 and the first carrier 10 can be as described below: the second carrier 20 is located in the mounting hole 13 of the first carrier 10; of course, the second carrier 20 can also be arranged relatively spaced from the first carrier 10 in the vertical or horizontal direction. This application does not specifically limit the relative position between the second carrier 20 and the first carrier 10.

[0049] The first driving member 30 can provide power to drive the first carrier 10 and / or the second carrier 20 to move. That is, the first driving member 30 can be used to drive only the first carrier 10, only the second carrier 20, or both the first carrier 10 and the second carrier 20 to move. It ensures that under the drive of the first driving member 30, the first carrier 10 and the second carrier 20 can approach each other, allowing the first object placed on the first carrier 10 and the second object placed on the second carrier 20 to come into contact, and are thus bonded and fixed by an adhesive layer on at least one of the two facing surfaces of the first and second objects. When the first driving member 30 is used to drive only one of the first carrier 10 and the second carrier 20, the first driving member 30 can be a cylinder, a motor, or a combination of a motor and a one-way lead screw, etc. That is, the first driving member 30 can drive either the first carrier 10 or the second carrier 20 to slide or rotate. When the first driving member 30 is used to drive the first carrier 10 and the second carrier 20 to move, the first driving member 30 can be two cylinders or two motors, etc., to drive the first carrier 10 and the second carrier 20 to slide or rotate respectively. Of course, the first driving member 30 can also be a combination of a motor and a bidirectional lead screw, so that the first carrier 10 and the second carrier 20 can be driven to slide respectively through two helical segments with different directions of rotation on the bidirectional lead screw. Therefore, this application does not limit the structure of the first driving member 30, as long as it can be used to drive the first carrier 10 and / or the second carrier 20 to slide or rotate so that the first carrier 10 and the second carrier 20 are brought closer together.

[0050] In use, the bonding device 100 of this application allows a first object to be placed on a first carrier 10 of the bonding device 100, and a second object to be placed on a second carrier 20 of the bonding device 100. Then, a first driving member 30 provides power to drive the first carrier 10 and / or the second carrier 20 to move, bringing the first carrier 10 and the second carrier 20 closer together. At this time, the first object placed on the first carrier 10 and the second object placed on the second carrier 20 can come into contact. Furthermore, since at least one of the two facing surfaces of the first and second objects is provided with an adhesive layer, the first and second objects can be bonded and fixed through this adhesive layer, thus completing the process of bringing the first and second objects closer together for bonding.

[0051] Furthermore, since the bonding device 100 in this solution places the first object and the second object respectively by setting the first carrier 10 and the second carrier 20, and drives the first object and / or the second object to complete the proximity bonding process by setting the first driving member 30, it replaces the traditional method of manually bringing the first object and the second object closer together to complete the proximity bonding, realizing the automated operation of proximity bonding of the first object and the second object. At this time, the automatic proximity bonding operation by the bonding device 100 has a faster working cycle and can operate for a long time, thereby improving bonding efficiency. Moreover, the automatic proximity bonding operation by the bonding device 100 also allows the first object and the second object to accurately approach each other along the preset moving direction, reducing the possibility of misalignment of the first object and the second object; at the same time, it can also apply the preset bonding pressure evenly to the first object and the second object, reducing the possibility of inconsistent bonding pressure leading to inconsistent bonding of different products, thereby improving bonding accuracy.

[0052] Please refer to the reference. Figure 1 , Figure 3 , Figure 5 as well as Figure 6 In one embodiment of this application, the first carrier 10 has a first mounting surface 11 for mounting a first object. The first carrier 10 is provided with a mounting hole 13, which has a first opening located on the first mounting surface 11. The second carrier 20 is located on the mounting hole 13 and has a second mounting surface 21. The second mounting surface 21 and the wall of the mounting hole 13 near the first opening form a positioning groove 23, which is used to accommodate the second object. The direction parallel to the second mounting surface 21 to the first opening is defined as the first direction. The first driving member 30 can drive the first carrier 10 and / or the second carrier 20 to slide along the first direction.

[0053] The first mounting surface 11 can be a planar structure or an arc-shaped structure. The first mounting surface 11 can be located above the first carrier 10, or it can be located to the side of the first carrier 10. The mounting hole 13 can be used to mount the second carrier 20. The mounting hole 13 can have only a first opening on the first mounting surface 11, making it a blind hole structure. Alternatively, the mounting hole 13 can be a through hole structure, in which case it can further have a third opening on the surface of the first carrier 10 facing away from the first mounting surface 11, or the third opening can be located on the surface of the first carrier 10 connected to the first mounting surface 11. The shape of the mounting hole 13 can be adapted to the shape of the second carrier 20. For example, when the second carrier 20 is an annular structure, the mounting hole 13 can also be correspondingly annular; when the second carrier 20 is circular or square, the mounting hole 13 can also be correspondingly square or circular. The second mounting surface 21 on the second carrier 20 can be a planar structure or an arc-shaped structure. The end of the second carrier 20 with the second mounting surface 21 does not protrude from the first opening of the mounting hole 13. That is, the end of the second carrier 20 with the second mounting surface 21 is located inside the mounting hole 13, so that the second mounting surface 21 and the hole wall of the mounting hole 13 near the first opening form a positioning groove 23. For example, when the first mounting surface 11 is facing upward, the second mounting surface 21 is also facing upward and is lower than the first mounting surface 11, and thus the positioning groove 23 is formed by the second mounting surface 21 and the hole wall at the upper end of the mounting hole 13. The positioning groove 23 can accommodate the second object, while the first object is placed on the first mounting surface 11. Then, driven by the first driving member 30, the first carrier 10 and / or the second carrier 20 can slide along a first direction, or more specifically, along a vertical direction. This allows the first carrier 10 to slide along the direction from the first mounting surface 11 towards the second mounting surface 21, and / or the second carrier 20 to slide along the direction from the second mounting surface 21 towards the first mounting surface 11. At this point, the first mounting surface 11 and the second mounting surface 21 can approach each other, thereby causing the second object and the first object to adhere together.

[0054] In this embodiment, a mounting hole 13 is provided on the first carrier 10, which provides space for the second carrier 20. This allows the second carrier 20 and the first carrier 10 to be distributed very compactly, reducing the overall volume of the bonding device 100 and improving the convenience of subsequent handling and use. More importantly, when bonding a second object on the second mounting surface 21 to a groove on the first mounting surface 11, both the second mounting surface 21 and the second object need to be fitted into the groove on the first object to complete the bonding. In this case, the second mounting surface 21 and the second object have the same shape, making it impossible to provide a structure to limit the object's position on the periphery of the second object on the second mounting surface 21. Similarly, when bonding a thinner second object to the first object, such as bonding a silicone pad coated with an adhesive layer to a product, the thinness of the silicone pad also makes it impossible to provide a structure to limit the silicone pad on the second mounting surface 21 of the second carrier 20. Specifically, since the silicone pad on the second mounting surface 21 needs to be bonded to the product on the first mounting surface 11, the height of the positioning structure 70 for positioning the silicone pad on the second mounting surface 21 needs to be lower than the height of the silicone pad. This ensures that the positioning structure 70 will not obstruct the bonding between the silicone pad and the product when the silicone pad is bonded to the product. However, the silicone pad itself is very thin, making it difficult to process the positioning structure 70 for positioning the silicone pad on the second mounting surface 21. Therefore, in many bonding scenarios, it is difficult to set a positioning structure 70 for positioning the second object on the second mounting surface 21. If the second object is not properly positioned on the second mounting surface 21, it will affect the subsequent bonding accuracy. Therefore, in this embodiment, the second carrier 20 is cleverly placed inside the mounting hole 13, so that the second mounting surface 21 and the hole wall of the mounting hole 13 near the first mounting surface 11 form a positioning groove 23. This positioning groove 23 effectively solves the problem of positioning the second object on the second mounting surface 21. Simultaneously, the wall of the mounting hole 13 also guides the relative sliding of the first carrier 10 and the second carrier 20, enabling the first carrier 10 and the second carrier 20 to accurately approach and align. Therefore, in addition to positioning the second object during placement, the mounting hole 13 also guides the approach of the first carrier 10 and the second carrier 20, thereby enabling more accurate adhesion of the second object on the second mounting surface 21 to the first object on the first mounting surface 11, thus improving adhesion accuracy.

[0055] Please refer to Figure 3In one embodiment of this application, the second carrier 20 is provided with an adsorption hole 25, one end of the adsorption hole 25 has a second orifice, the second orifice is located on the second mounting surface 21, and the end of the adsorption hole 25 away from the second orifice is used to connect to an air extraction device.

[0056] The suction device can remove gas, as it is connected to the adsorption hole 25. Therefore, when the suction device performs suction, the gas at the adsorption hole 25 can be removed, creating a vacuum between the second mounting surface 21 and the second object, enabling vacuum adsorption of the second object. The suction device can be a vacuum pump. The number of adsorption holes 25 can be one, two, or more, to improve the stability of the second object's positioning.

[0057] In this embodiment, by setting the adsorption holes 25 to adsorb the second object, the second object can be stably positioned on the second placement surface 21 without moving. Simultaneously, the second object is less prone to deformation after being adsorbed and positioned, ensuring a relatively flat, preset bonding posture. This allows the second object to be accurately positioned and bonded to the first object in a flat, preset bonding posture, thereby improving bonding accuracy.

[0058] In one embodiment of this application, the first mounting surface 11 is provided with a positioning sensor, which is electrically connected to the first driving member 30. The positioning sensor is used to detect whether the first mounting surface 11 is occupied by a first object.

[0059] The positioning sensor can transmit a product positioning signal to the first driving member 30 when it detects that a first object is placed on the first mounting surface 11, after which the first driving member 30 can start working. The positioning sensor can be directly mounted on the first mounting surface 11, or a space can be provided on the first mounting surface 11 for mounting the positioning sensor. This application does not specifically limit the placement location of the positioning sensor. Specifically, the positioning sensor can be a photosensitive element; that is, when no first object is placed on the first mounting surface 11, the photosensitive element can detect light; when the first object is placed on the first mounting surface 11, the photosensitive element cannot detect light, thereby triggering the first object positioning signal. Alternatively, the positioning sensor can also be a touch switch; when the first object is placed on the first mounting surface 11, the first object can touch the switch, thereby triggering the first object positioning signal. Or, the positioning sensor can also be a proximity sensor; when the first object is placed on the first mounting surface 11, it can be sensed by the proximity sensor to trigger the first object positioning signal. Therefore, this application does not limit the specific type of the position sensor, as long as it can be used to detect the signal of the first object being placed in position.

[0060] In this embodiment, by setting a positioning sensor, the automation level of the bonding equipment 100 is improved, so that the first driving component 30 does not need to be manually started, thereby further improving the bonding efficiency.

[0061] Please refer to the reference. Figures 1 to 6 In one embodiment of this application, the mounting hole 13 has a third opening at the end away from the first opening. The third opening is located on the surface of the first carrier 10 away from the first mounting surface 11. The end of the second carrier 20 away from the second mounting surface 21 protrudes through the third opening. The first driving member 30 is located on the side of the first carrier 10 away from the first mounting surface 11 and is connected to the end of the second carrier 20 away from the second mounting surface 21, so as to drive the second carrier 20 to slide along the first direction to approach and move away from the first mounting surface 11.

[0062] In addition to the first opening described above, one end of the mounting hole 13 further has a third opening located on the surface of the first carrier 10 facing away from the first mounting surface 11. In other words, the mounting hole 13 is a through-hole structure. For example, when the first mounting surface 11 faces upwards, the first and third openings of the mounting hole 13 are respectively located on the upper and lower surfaces of the first carrier 10, facing away from each other in the vertical direction. Thus, the end of the second carrier 20 away from the second mounting surface 21 can pass through the third opening of the mounting hole 13 to connect with the first driving member 30 located outside the first carrier 10. The sliding direction of the second carrier 20, when the first mounting surface 11 faces upwards, can be vertical, so that the second carrier 20 moves closer to the first mounting surface 11 when moving upwards and moves away from the first mounting surface 11 when moving downwards. Of course, this application is not limited to this; when the first mounting surface 11 faces laterally, the first direction can be horizontal.

[0063] In this embodiment, the mounting hole 13 is designed as a through hole, which simplifies its structure and facilitates its fabrication. Furthermore, this design allows the first driving member 30 to be positioned on the outer side of the first carrier 10 away from the first mounting surface 11, simplifying its installation. Moreover, the first driving member 30 only needs to be connected to the second carrier 20, while the first carrier 10 remains fixed. This simplifies both the fabrication of the mounting hole 13 and the installation of the first driving member 30, thereby improving the ease of manufacturing the bonding device 100. Additionally, positioning the first driving member 30 on the outer side of the first carrier 10 reduces the required size of the first carrier 10, thus reducing the overall size of the bonding device 100.

[0064] Please refer to the reference. Figures 1 to 4In one embodiment of this application, the number of mounting holes 13 and the number of second carriers 20 are both at least two, and each second carrier 20 is slidably disposed in a mounting hole 13 along a first direction; the bonding device 100 also includes a connector 40, which connects the end of at least two carriers away from the second mounting surface 21 and the first driving member 30.

[0065] The number of mounting holes 13 and the number of second carriers 20 can both be two, or three or more. In this case, the second object can be simultaneously bonded to multiple locations of the first object placed on the first mounting surface 11. The connector 40 can serve as a transitional connection, that is, it can connect at least two second carriers 20 and also connect to the first driving member 30. Thus, when the driving connector 40 of the first driving member 30 slides along the first direction, it can drive the second carriers 20 closer to and further away from the first mounting surface 11. The connector 40 can be a plate structure, making its structure relatively simple and facilitating the placement of at least two second carriers 20 and the first driving member 30 on opposite surfaces of the connector 40, while also improving the ease of installation. Of course, this application is not limited to this; in other embodiments, the connector 40 can also be a column or other structure. The at least two second carriers 20 can be detachably connected to the connector 40 (e.g., using screws or snap-fit ​​connections) to improve the convenience of subsequent replacement. Similarly, the connector 40 and the first drive member 30 can also be detachably connected (e.g., using screw connection or snap-fit ​​connection).

[0066] In this embodiment, by setting the number of mounting holes 13 and second carriers 20 to at least two, the second object can be bonded to at least two locations on the first object at a time, thereby improving bonding efficiency. The inclusion of connector 40 allows for the use of only one first driving member 30, improving the ease of manufacturing the bonding device 100 and reducing manufacturing costs. Furthermore, driving at least two second carriers 20 with the same first driving member 30 enables synchronous movement and the application of the same bonding pressure, ensuring consistent bonding of the at least two second carriers 20 to the first carrier 10 and improving bonding accuracy.

[0067] In one embodiment of this application, the first driving member 30 is a telescopic cylinder.

[0068] In this embodiment, the first driving component 30 is configured as a telescopic cylinder, such that the connecting component 40 is disposed at one end of the first driving component 30. This ensures that other parts of the first driving component 30 do not affect the connecting component 40 and one end of the second carrier 20, thereby further improving the convenience of configuring the first driving component 30. Of course, in other embodiments, the first driving component 30 may also be an electric push rod or a combination of a motor and a lead screw. This application does not limit the specific structure of the first driving component 30.

[0069] In one embodiment of this application, to improve the convenience of placing the first carrier 10 and the first driving member 30, please refer to the following reference. Figures 1 to 4 The bonding device 100 may further include a support plate 50, on which the first carrier 10 can be mounted. Furthermore, to improve the convenience of subsequent maintenance and replacement, the first carrier 10 can be detachably connected (e.g., using screws or clips) to the support plate 50. Simultaneously, the support plate 50 may be provided with a clearance opening 51, through which the connector 40 and / or the first carrier 10 can pass. The first driving member 30 is located on the side of the support plate 50 opposite to the first carrier 10. Thus, the support plate 50 can jointly support and mount the first carrier 10 and the first driving member 30. Further, since the first driving member 30 is positioned corresponding to the connector 40, it facilitates the connection between the first driving member 30 and the support plate 50. The surface of the support plate 50 opposite to the first carrier 10 may be provided with a mounting plate 53, a portion of which extends into the area corresponding to the clearance opening 51, allowing the first driving member 30 corresponding to the clearance opening 51 to be mounted onto the mounting plate 53. In addition, the connection between the mounting plate 53, the carrier plate 50, and the first driving component 30 can all be detachable (e.g., using screw connections or snap-fit ​​connections) to improve the convenience of subsequent maintenance and replacement.

[0070] Please refer to Figure 1 In one embodiment of this application, the bonding device 100 further includes a clamping mechanism 60, which is used to cooperate with the first carrier 10 to clamp the first object placed on the first placement surface 11.

[0071] In this embodiment, the clamping mechanism 60 can clamp and limit the first object placed on the first carrier 10, so that when the first carrier 10 is driven by the first driving member 30 to approach the first placement surface 11 and adhere to the first object, the first object will not move and can be stably and effectively adhered. Moreover, by clamping and fixing the first object with the clamping mechanism 60 and the first carrier 10, it is not necessary to set a limiting structure on the first object, which helps to protect the structure of the first object itself. It should be noted that the clamping mechanism 60 can be a structure including the second driving member 61 and the clamping member 63 as described below. Of course, it can also be a structure of an elastic arm, that is, when the elastic arm is opened, the first object can be placed, and after the force on the elastic arm is released, the elastic arm can return to its original shape under the action of elastic force and abut against the first object. Alternatively, the clamping mechanism 60 includes a rotatable clamping block and an elastic member connected to the clamping block, so that the second carrier 20 can be placed when the clamping block is rotated open. After the force applied to the clamping block is released, the clamping block can be reset under the action of the elastic element and pressed against the first object on the first carrier 10. Therefore, this application does not limit the specific structure of the clamping mechanism 60. In addition, it should be noted that in other embodiments, when the first object itself has a large weight, its own gravity can overcome the force exerted by the second object on the first object during adhesion. Alternatively, when a hole is provided in the first object, the first object can be limited and fixed by threading a screw to the first carrier 10.

[0072] Please refer to Figure 1 In one embodiment of this application, the clamping mechanism 60 includes a second driving member 61 and a clamping member 63. The clamping member 63 is connected to the second driving member 61 and can be driven by the second driving member 61 to approach and move away from the first mounting surface 11. The clamping member 63 is used to abut against a first object mounted on the first mounting surface 11 of the first carrier 10.

[0073] The second driving member 61 can provide power to drive the clamping member 63 to move. The clamping member 63 can abut against the first object placed on the first carrier 10, thereby clamping and limiting the first object. The second driving member 61 can be a cylinder, a motor, or a combination of a motor and a lead screw, etc., and the clamping member 63 can be a plate structure or a column structure, etc. This application does not limit the type of the second driving member 61 or the structure of the clamping member 63. The second driving member 61 can drive the clamping member 63 to slide, drive the clamping member 63 to rotate, or, as described below, drive the clamping member 63 to both slide and rotate.

[0074] In this embodiment, by using a second driving member 61 to drive the clamping member 63 to move closer to and away from the first carrier 10, the limiting of the first object can be automated, thereby further improving the automation level of the bonding equipment 100 and thus improving the bonding efficiency. The second driving member 61 can be electrically connected to the positioning sensor described above for detecting the placement of the first object, so that the second driving member 61 can promptly limit the first object after it is placed on the first carrier 10, thereby increasing the work cycle and improving the bonding efficiency. Alternatively, the second driving member 61 can also be installed on the surface of the support plate 50 facing the first carrier 10, so that the various parts of the bonding equipment 100 can be assembled into a whole, facilitating subsequent handling and management.

[0075] In one embodiment of this application, the second driving member 61 can drive the pressing member 63 to slide and rotate. The sliding direction of the pressing member 63 and the rotation axis of the pressing member 63 are parallel to each other, that is, both are parallel to the first direction.

[0076] In this embodiment, the second driving member 61 can drive the clamping member 63 to slide and rotate. Thus, when the first object needs to be placed on the first carrier 10, the second driving member 61 can drive the clamping member 63 to rotate until it is misaligned with the first carrier 10. At this time, the clamping member 63 will not affect the placement process of the first object, thus facilitating the placement of the first object by the operator. After the first object is placed, the second driving member 61 can drive the clamping member 63 to rotate again to face the first carrier 10, and then drive the clamping member 63 to slide close to the first carrier 10, thereby clamping and limiting the first object placed on the first carrier 10. After bonding, when it is necessary to remove the first object, the second driving member 61 can drive the clamping member 63 to slide away from the first carrier 10, causing the clamping member 63 to detach from the first object. Then, the second driving member 61 can drive the clamping member 63 to rotate again until it is misaligned with the first carrier 10, making it convenient for the operator to remove the first object. To simplify the structure of the second driving member 61, it can be a swing cylinder, enabling a single object to simultaneously perform telescopic and sliding functions. However, this application is not limited to this. In other embodiments, the second driving member 61 may also include two telescopic cylinders. One telescopic cylinder drives the clamping member 63 to slide perpendicular to the first direction, achieving misalignment and alignment with the first carrier 10. The other telescopic cylinder drives the first cylinder and the clamping member 63 to slide along the first direction, moving closer to and away from the first carrier 10. Alternatively, the second driving member 61 may also consist of a motor and a telescopic cylinder. The motor drives the first clamping member 63 to rotate, achieving misalignment and alignment with the first carrier 10. The telescopic cylinder drives the motor and the clamping member 63 to slide along the first direction, moving closer to and away from the first carrier 10.

[0077] In one embodiment of this application, the bonding device 100 further includes a positioning structure 70, which is used to position a first object placed on a first mounting surface 11 of a first carrier 10.

[0078] In this embodiment, the positioning structure 70 helps to improve the accuracy of the first object being placed on the first carrier 10, that is, to accurately place the first object at the preset position on the first carrier 10, thereby facilitating the accurate bonding of the second object to the first object.

[0079] Please refer to the reference. Figure 1 , Figure 5 as well as Figure 6In one embodiment of this application, the positioning structure 70 includes a first positioning member 71 and a second positioning member 73. The first positioning member 71 is disposed on the first mounting surface 11 and can be adapted to be inserted into the first object placed on the first mounting surface 11. The first carrier 10 has a side wall surface 15 connected to the first mounting surface 11. The second positioning member 73 and the side wall surface 15 are disposed opposite to each other. The side of the second positioning member 73 near the side wall surface 15 is provided with a guide surface 731 to guide the first positioning member 71 and the first object to be inserted and engaged.

[0080] In this embodiment, the positioning structure 70 is configured to include a first positioning member 71 disposed on the first mounting surface 11 and a second positioning member 73 disposed on one side of the first carrier 10. This allows the first object to be initially guided and positioned via the guide surface 731 on the second positioning member 73, followed by precise positioning via the first positioning member 71. This improves the accuracy of the first object's placement on the first carrier 10 and reduces the initial alignment accuracy requirements between the first object and the first carrier 10. Accurate positioning is achieved through gradual guidance, thus improving the ease of placing the first object and consequently enhancing the usability of the bonding device 100 and accelerating the work cycle, thereby further improving bonding efficiency. Specifically, when the surface of the first object facing the first mounting surface 11 has a protrusion (e.g., a protrusion block, protruding pillar, or protruding rib structure), the first positioning member 71 can be a corresponding groove structure. When the surface of the first object facing the first mounting surface 11 has a groove structure, the first positioning member 71 can be a corresponding protrusion structure, ensuring that the first object and the first positioning member 71 can be inserted and fitted together to achieve positioning. Furthermore, the first positioning member 71 also allows for a gap between the first object and the first mounting surface 11, ensuring that the first object does not immediately come into direct contact with the adhesive layer on the second object when it is placed on the first carrier 10. This facilitates correction of the first object's placement even if it is not properly positioned, without affecting subsequent bonding work. Alternatively, if the positioning groove 23 has sufficient depth, the first object can also rest against the first mounting surface 11 when placed on the first carrier 10. In this case, the depth of the positioning groove 23 prevents the adhesive layer on the first object and the second object located within the positioning groove 23 from contacting each other immediately upon placement on the first carrier 10. The second positioning member 73 can be a plate, block, or column structure, and the guide surface 731 on the second positioning member 73 can be an inclined or curved surface, ensuring that the first object can be guided to interlock with the first positioning member 71 when in contact with it. To improve the guiding effect, second positioning elements 73 can be provided at least on opposite sides of the first carrier 10, or second positioning elements 73 can be provided around the first carrier 10, so as to guide the placement of the first object on each side. Furthermore, on the projection plane perpendicular to the first direction, the projection of the first object can be located inside the second positioning elements 73 surrounding the first carrier 10. Of course, when the first object is relatively large, it can also have a contact surface adapted to the guide surface 731 on the second positioning element 73, and after being placed on the first carrier 10, a portion of the first object will be located outside the second positioning elements 73 surrounding the first carrier 10.At this time, the second positioning member 73 not only guides the placement of the first object, but also supports the first object, thereby improving the stability of the first object placed on the first carrier 10 in cooperation with the clamping mechanism 60.

[0081] Furthermore, to improve the ease of installation of the second positioning component 73, please refer to the following: Figure 1 and Figure 5 The second positioning member 73 can also be mounted on the surface of the support plate 50 facing the first carrier 10, and can be located between the side wall 15 of the first carrier 10 and the second driving member 61 in the clamping mechanism 60. Furthermore, to adapt to different sizes of first objects and improve the versatility of the bonding device 100, the second positioning member 73 can also be slidably disposed on the support plate 50 along a second direction perpendicular to the first direction. Specifically, an elongated hole 733 can be provided on the second positioning member 73, extending along the second direction, and a screw can be inserted into the support plate 50 through the elongated hole 733. When the second positioning member 73 needs adjustment, the screw can be loosened so that it no longer tightens the second positioning member 73. At this time, the second positioning member 73 can be driven to slide along the elongated hole 733 for adjustment, and after adjustment, the screw can be tightened again. Furthermore, it should be noted that this application is not limited to this; in other embodiments, the positioning structure 70 may only include the first positioning member 71.

[0082] In one embodiment of this application, the bonding device 100 proposed in this application can be used as follows: a second object coated with an adhesive layer is placed within the positioning groove 23 formed by the second mounting surface 21 and the hole wall of the mounting hole 13, with the adhesive layer of the second object facing upwards towards the opening of the positioning groove 23. Then, a first object can be placed on the first mounting surface 11 of the first carrier 10, and the first object is positioned by a positioning mechanism to ensure accurate placement on the first carrier 10. Subsequently, a positioning sensor provided on the first mounting surface 11 can detect the first object's placement signal and transmit it to the first driving member 30 and the second driving member 61. This allows the first driving member 30 to drive the first carrier 10 upwards, while the second driving member 61 drives the clamping member 63 to rotate above the first carrier 10 and further drives the clamping member 63 downwards to clamp and limit the first object on the first carrier 10. After the first driving member 30 drives the first carrier 10 to a preset position, the first object on the first carrier 10 can be bonded to the second object on the second carrier 20. The first driving member 30 and the second driving member 61 can also ensure that the first object and the second object are bonded and held under pressure for a preset time. After the pressure holding period ends, the first driving member 30 can drive the second carrier 20 to descend and reset, while the second driving member 61 can also drive the clamping member 63 to rise and rotate and reset. At this time, the first object and the second object bonded together can be removed from the first carrier 10.

[0083] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. An adhesive bonding device, characterized in that, The bonding device is used to bond a first object and a second object, wherein at least one of the two opposing surfaces of the first object and the second object is provided with an adhesive layer, and the bonding device includes: A first carrier, the first carrier being used to hold the first object; A second carrier, the second carrier being used to hold the second object; and A first driving member, the first driving member being capable of driving the first carrier and / or the second carrier to move, so as to bring the first carrier and the second carrier closer together and thus make the first object and the second object stick together; The first carrier has a first mounting surface for mounting the first object. The first carrier has a mounting hole with a first opening located on the first mounting surface. The second carrier is disposed in the mounting hole, the second carrier has a second mounting surface, the second mounting surface and the hole wall at one end of the mounting hole near the first hole opening form a positioning groove, the positioning groove is used to accommodate the second object; The direction parallel to the second mounting surface to the first opening is defined as the first direction. The first driving member can drive the first carrier and / or the second carrier to slide along the first direction. The mounting hole is used to install the second carrier, and the hole wall of the mounting hole has a guiding effect on the relative sliding of the first carrier and the second carrier.

2. The bonding equipment as described in claim 1, characterized in that, The second carrier is provided with an adsorption hole, one end of which has a second opening. The second opening is located on the second mounting surface, and the end of the adsorption hole away from the second opening is used to connect to an air extraction device. And / or, the first mounting surface is provided with a positioning sensor, the positioning sensor being electrically connected to the first driving member, the positioning sensor being used to detect whether the first object is mounted on the first mounting surface.

3. The bonding equipment as described in claim 1, characterized in that, The mounting hole has a third opening at the end away from the first opening. The third opening is located on the surface of the first carrier away from the first mounting surface. The end of the second carrier away from the second mounting surface protrudes through the third opening. The first driving member is disposed on the side of the first carrier away from the first mounting surface and is connected to the end of the second carrier away from the second mounting surface, so as to drive the second carrier to slide along the first direction to approach and move away from the first mounting surface.

4. The bonding equipment as described in claim 3, characterized in that, The number of the mounting holes and the number of the second carriers are both at least two, and each of the second carriers is slidably disposed in one of the mounting holes along the first direction; the bonding device further includes a connector, which connects the ends of at least two of the carriers away from the second mounting surface and the first driving member; And / or, the first driving component is a telescopic cylinder.

5. The bonding apparatus according to any one of claims 1 to 4, characterized in that, The bonding device further includes a clamping mechanism, which is used to cooperate with the first carrier to clamp the first object placed on the first carrier.

6. The bonding equipment as described in claim 5, characterized in that, The clamping mechanism includes: Second drive unit; and A clamping member is connected to the second driving member and can be driven by the second driving member to approach and move away from the first carrier. The clamping member is used to abut against the first object placed on the first carrier.

7. The bonding device as described in claim 6, characterized in that, The second driving member can drive the clamping member to slide and rotate, and the sliding direction of the clamping member and the rotation axis of the clamping member are arranged parallel to each other.

8. The bonding apparatus according to any one of claims 1 to 4, characterized in that, The bonding device further includes a positioning structure for positioning the first object placed on the first carrier.

9. The bonding device as described in claim 8, characterized in that, The first carrier has a first mounting surface for mounting the first object, and the positioning structure includes: A first positioning element is disposed on the first mounting surface and is capable of being adapted and inserted into the first object mounted on the first mounting surface; and The second positioning member, the first carrier has a side wall surface connected to the first placement surface, the second positioning member and the side wall surface are arranged opposite to each other, and the side of the second positioning member near the side wall surface is provided with a guide surface to guide the first positioning member and the first object to be inserted and engaged.

Images