Electronic device

Abstract

An application of the present disclosure is an electronic device. One of objects of one embodiment of the present application is to provide an electronic device which is convenient to use when worn on the body. One embodiment of the present application is an arm-mounted electronic device including a display panel, a power storage device, a circuit, and a sealing body. The display panel displays using power supplied from the power storage device. The circuit includes an antenna to charge the power storage device wirelessly. The sealing body includes the display panel, the power storage device, and the circuit in the inside thereof. The sealing body has a portion through which visible light is transmitted. The sealing body can be mounted on an arm or connected to a structure which can be mounted on an arm.

Description

Technical Field

[0001] One aspect of the present invention relates to an electronic device. More particularly, one aspect of the present invention relates to a wearable electronic device, such as an arm-worn electronic device.

[0002] Note that one aspect of the present invention is not limited to the technical fields described above. Examples of technical fields encompassing one aspect of the present invention include semiconductor devices, display devices, light-emitting devices, energy storage devices, memory devices, electronic devices, lighting devices, input devices (e.g., touch sensors), input / output devices (e.g., touch panels), their driving methods, or their manufacturing methods.

[0003] In this invention, electronic devices refer to all devices that operate by being supplied with electricity, including electro-optical devices such as power sources (e.g., energy storage devices) and information terminal devices.

[0004] In this specification, the term "energy storage device" refers to all components and devices that have the function of storing energy, such as lithium-ion secondary batteries (also known as rechargeable batteries), lithium-ion capacitors, and double-layer capacitors. Background Technology

[0005] In recent years, wearable display devices and electronic devices have been proposed, referred to as wearable displays or wearable devices. For example, head-mounted displays worn on the head and smartwatches worn on the arm have been developed.

[0006] Patent document 1 proposes a ring-shaped display device that can be worn on the body.

[0007] Because wearable devices are worn on the body, in order to achieve high portability and a comfortable wearing experience, the overall device, including the display panel, driving circuit and power supply, needs to be lightweight.

[0008] In many cases, energy storage devices are installed in wearable devices. For example, the development of lithium-ion rechargeable batteries is booming because they can achieve high capacitance and miniaturization.

[0009] Furthermore, light-emitting elements utilizing electroluminescence (EL) (also referred to as "EL elements") have the characteristics of being easy to achieve in terms of thinness, lightweight and flexibility; being able to respond to input signals at high speed; and being able to be driven by a low-voltage DC power supply, etc., making them one of the display elements suitable for wearable displays.

[0010] [Patent Document 1] U.S. Patent Application Publication No. 2015 / 0077438

[0011] Wearable devices required to be used during water sports (including marine sports) such as swimming and scuba diving, or while bathing.

[0012] Furthermore, because wearable devices are used in a wide variety of environments, a broad operating temperature range is required for the display panel and power storage device. For example, electronic devices may not function properly in places exposed to direct sunlight, such as on a car dashboard or in front of a window, inside a car parked under the blazing sun, in high-temperature environments such as deserts, or in low-temperature environments such as cold regions with glaciers. Summary of the Invention

[0013] One objective of this invention is to provide an electronic device that can be used underwater. Another objective of this invention is to provide a highly waterproof electronic device. Another objective of this invention is to provide a wearable electronic device. Another objective of this invention is to provide an all-weather electronic device. Another objective of this invention is to provide a highly convenient electronic device. Another objective of this invention is to provide a highly reliable electronic device. Another objective of this invention is to provide an electronic device with high visibility regardless of ambient light.

[0014] Furthermore, one objective of this invention is to provide an electronic device capable of operating over a wide temperature range. Another objective of this invention is to provide a small, lightweight, or flexible electronic device. Another objective of this invention is to provide a highly secure electronic device. Another objective of this invention is to provide an electronic device with low power consumption. Another objective of this invention is to provide an electronic device that can be used for an extended period once fully charged. Finally, one objective of this invention is to provide a novel electronic device.

[0015] Note that the description of the above objectives does not preclude the existence of other objectives. Furthermore, one aspect of the present invention does not require achieving all of the above objectives. Additionally, objectives other than those described above can be extracted from the description in the application documents.

[0016] One aspect of the present invention is an electronic device comprising a display panel, a power storage device, circuitry, and a sealed enclosure. The display panel includes a light-emitting element. The light-emitting element is functional in emitting light using power supplied from the power storage device. The circuitry includes an antenna. The circuitry is functional in wirelessly charging the power storage device. The sealed enclosure internally includes the display panel, the power storage device, and the circuitry. At least a portion of the sealed enclosure is functional in allowing light emitted by the light-emitting element to pass through. The sealed enclosure can be worn on the arm.

[0017] The aforementioned electronic device can also be stacked sequentially from one side of the arm, consisting of a power storage device, an antenna, and a display panel, when the user wears the sealed body on their arm.

[0018] Another aspect of the present invention is an electronic device comprising a display panel, a power storage device, a circuit, a sealing body, and a structure. The display panel includes a light-emitting element. The light-emitting element has the function of emitting light using power supplied from the power storage device. The circuit includes an antenna. The circuit has the function of wirelessly charging the power storage device. The sealing body is connected to the structure. The sealing body includes the display panel, the power storage device, and the circuit within itself. At least a portion of the sealing body has the function of allowing light emitted by the light-emitting element to pass through. The structure can be worn on the arm.

[0019] The aforementioned electronic devices can also be stacked sequentially from one side of the arm, consisting of a power storage device, an antenna, and a display panel, when the user wears the structure on their arm.

[0020] Another aspect of the present invention is an electronic device comprising a display panel, a power storage device, a circuit, and a sealing body. The display panel has the function of displaying using power supplied from the power storage device. The circuit includes an antenna. The circuit has the function of wirelessly charging the power storage device. The sealing body includes the display panel, the power storage device, and the circuit within it. At least a portion of the sealing body has the function of allowing visible light to pass through. The display panel includes a first display element and a second display element. The first display element includes a reflective layer that has the function of reflecting light. The first display element has the function of controlling the transmission of light. The reflective layer has an opening. The second display element has a portion overlapping the opening. The second display element has the function of emitting light into the opening. The area of ​​the opening is preferably 5% or more and 20% or less of the area of ​​the reflective layer.

[0021] In the aforementioned electronic device, the display panel preferably further includes signal lines, pixel circuitry, a first conductive layer, a second conductive layer, and an insulating layer. The second display element is electrically connected to the pixel circuitry. The first display element is electrically connected to the first conductive layer. The first conductive layer has a portion that overlaps the second conductive layer through an insulating layer. The first conductive layer and the second conductive layer are electrically connected. The second conductive layer is electrically connected to the pixel circuitry. The pixel circuitry is electrically connected to the signal lines.

[0022] Another aspect of the present invention is an electronic device comprising a display panel, a power storage device, a circuit, and a sealing body. The display panel has the function of displaying using power supplied from the power storage device. The circuit includes an antenna. The circuit has the function of wirelessly charging the power storage device. The sealing body includes the display panel, the power storage device, and the circuit within it. At least a portion of the sealing body has the function of allowing visible light to pass through. The display panel includes a liquid crystal element and a light-emitting element. The liquid crystal element includes a liquid crystal layer, a first conductive layer, and a second conductive layer. The first conductive layer has the function of reflecting light. The first conductive layer has an opening. The light-emitting element includes a layer containing a light-emitting material, a third conductive layer, and a fourth conductive layer. The light-emitting element has a portion overlapping the opening. The light-emitting element has the function of emitting light into the opening. The area of ​​the opening is preferably 5% or more and 20% or less of the area of ​​the first conductive layer.

[0023] In the aforementioned electronic device, the display panel preferably further includes signal lines, pixel circuits, a fifth conductive layer, a sixth conductive layer, and an insulating layer. The light-emitting element is electrically connected to the pixel circuit. The liquid crystal element is electrically connected to the fifth conductive layer. The fifth conductive layer has a portion that overlaps the sixth conductive layer through an insulating layer. The fifth conductive layer and the sixth conductive layer are electrically connected. The sixth conductive layer is electrically connected to the pixel circuit. The pixel circuit is electrically connected to the signal lines.

[0024] In the electronic devices described above, the sealing body is preferably wearable on the arm. In another embodiment of the present invention, the electronic device may also have the energy storage device, antenna, and display panel stacked sequentially from one side of the arm when the user wears the sealing body on their arm.

[0025] Furthermore, in the electronic devices described above, a structural body is preferably included. The sealing body is connected to the structural body. The structural body can be worn on the arm. In one embodiment of the present invention, the electronic device can also have the power storage device, antenna, and display panel sequentially stacked from one side of the arm when the user wears the structural body on their arm.

[0026] Additionally, the aforementioned structures may include one or more of the following: a voice input unit, a touch sensor, an illuminance sensor, and a component for wearing on the arm. The voice input unit or touch sensor can be disposed inside or outside the sealed body. The voice input unit, touch sensor, and illuminance sensor are preferably disposed inside the sealed body. The voice input unit, touch sensor, and illuminance sensor may also be connected to a display panel, a power storage device, or a circuit, respectively. Furthermore, the display panel may also include a touch sensor. The component for wearing on the arm is connected to the sealed body or structure.

[0027] Furthermore, in the above structures, the display panel may also have a curved surface with a radius of curvature of 1 mm or more and 150 mm or less. Additionally, in the above structures, the display panel may also have a curved surface with a radius of curvature greater than 150 mm. For example, the display panel may also have a curved surface with a radius of curvature greater than 150 mm and less than 1 m, or a curved surface with a radius of curvature of 1 m or more and 10 m or less. The curved surface of the display panel may also be a concave surface, a convex surface, or both a concave and a convex surface. Furthermore, in the above structures, the display panel may also include a flexible portion.

[0028] Furthermore, in each of the above structures, the energy storage device may also have a curved surface with a radius of curvature of 10 mm or more and 150 mm or less. Additionally, in each of the above structures, the energy storage device may also include a flexible portion.

[0029] Furthermore, in each of the above structures, the interior of the sealing body is preferably under a reduced pressure atmosphere. Additionally, in each of the above structures, the interior of the sealing body preferably contains a buoyancy material.

[0030] According to one aspect of the present invention, an electronic device capable of use in water can be provided. Additionally, according to one aspect of the present invention, an electronic device with high waterproof performance can be provided. Furthermore, according to one aspect of the present invention, an electronic device that can be worn on the body can be provided. Furthermore, according to one aspect of the present invention, an all-weather electronic device can be provided. Furthermore, according to one aspect of the present invention, an electronic device with high convenience can be provided. Furthermore, according to one aspect of the present invention, an electronic device with high reliability can be provided. Furthermore, according to one aspect of the present invention, an electronic device with high visibility regardless of ambient light can be provided.

[0031] Furthermore, according to one aspect of the present invention, an electronic device with a wide operating temperature range can be provided. Additionally, according to one aspect of the present invention, a small, lightweight, or flexible electronic device can be provided. Furthermore, according to one aspect of the present invention, a highly secure electronic device can be provided. Furthermore, according to one aspect of the present invention, an electronic device with low power consumption can be provided. Furthermore, according to one aspect of the present invention, an electronic device that can be used for an extended period once fully charged can be provided. Furthermore, according to one aspect of the present invention, a novel electronic device can be provided.

[0032] Note that the description of these effects does not preclude the existence of other effects. Furthermore, an embodiment of the present invention does not necessarily need to possess all of the aforementioned effects. Additionally, effects other than those described above can be extracted from the description in the application documents. Attached Figure Description

[0033] Figures 1A to 1GThis is a diagram illustrating an example of an electronic device;

[0034] Figures 2A to 2C This is a diagram illustrating an example of an electronic device;

[0035] Figures 3A to 3F This is a diagram illustrating an example of an electronic device;

[0036] Figure 4A and Figure 4B This is a diagram illustrating an example of an electronic device;

[0037] Figures 5A to 5D This is a diagram illustrating an example of an electronic device;

[0038] Figures 6A to 6D This is a diagram illustrating an example of the components of an electronic device;

[0039] Figure 7A and Figure 7B This is a diagram illustrating an example of the components of an electronic device;

[0040] Figures 8A to 8C This is a diagram illustrating an example of the components of an electronic device;

[0041] Figures 9A to 9D This is a diagram illustrating an example of an electronic device;

[0042] Figures 10A to 10D This is a diagram illustrating an example of an electronic device;

[0043] Figures 11A to 11C This is a diagram illustrating an example of wearable electronic devices;

[0044] Figures 12A to 12C This is a diagram showing an example of an energy storage device and an example of an electrode;

[0045] Figure 13A and Figure 13B This is a diagram showing an example of an energy storage device;

[0046] Figure 14A and Figure 14B This is a diagram showing an example of an energy storage device;

[0047] Figure 15 This is a diagram showing an example of an energy storage device;

[0048] Figure 16A and Figure 16B This is a diagram showing an example of an energy storage device;

[0049] Figure 17A and Figure 17B This is a diagram showing an example of an energy storage device;

[0050] Figure 18 This is a diagram showing an example of an energy storage device;

[0051] Figures 19A to 19D This is a diagram illustrating an example of a method for manufacturing an energy storage device;

[0052] Figure 20A , Figure 20B , Figure 20C1 and Figure 20C2 This is a diagram showing an example of an energy storage device;

[0053] Figure 21 This is a diagram showing an example of an energy storage device;

[0054] Figures 22A to 22D This is a diagram illustrating an example of a method for manufacturing an energy storage device;

[0055] Figure 23 This is a diagram showing an example of an energy storage device;

[0056] Figure 24A and Figure 24B This is a diagram showing an example of a light-emitting device;

[0057] Figure 25A and Figure 25B This is a diagram showing an example of a light-emitting device;

[0058] Figures 26A to 26D This is a diagram showing an example of a light-emitting device;

[0059] Figure 27A and Figure 27B This is a diagram showing an example of a light-emitting device;

[0060] Figures 28A to 28C This is a diagram illustrating an example of an input / output device;

[0061] Figure 29A and Figure 29B This is a diagram illustrating an example of an input / output device;

[0062] Figure 30A and Figure 30B This is a diagram illustrating an example of an input / output device;

[0063] Figures 31A to 31C This is a diagram illustrating an example of an input / output device;

[0064] Figure 32A and Figure 32B This is a diagram illustrating an example of the components of an electronic device;

[0065] Figure 33A and Figure 33BThis is a diagram illustrating an example of the components of an electronic device;

[0066] Figures 34A to 34C This is a diagram showing an example of a transistor;

[0067] Figures 35A to 35G This is a diagram illustrating an example of an electronic device;

[0068] Figure 36A and Figure 36B This is a diagram illustrating an example of an electronic device;

[0069] Figures 37A to 37F This is a diagram illustrating an example of an electronic device;

[0070] Figures 38A to 38C This is a diagram illustrating an example of an electronic device;

[0071] Figures 39A to 39D This is a diagram illustrating an example of an electronic device;

[0072] Figures 40A to 40D This is a diagram illustrating an example of the components of an electronic device;

[0073] Figure 41 This is a diagram illustrating an example of a pixel circuit in a display device;

[0074] Figure 42A , Figure 42B1 and Figure 42B2 This is a diagram showing an example of a display device;

[0075] Figure 43A , Figure 43B1 and Figure 43B2 This is a diagram showing an example of a display device;

[0076] Figures 44A to 44D This is a diagram showing an example of a display device;

[0077] Figure 45 This is a diagram illustrating an example of the components of an electronic device. Detailed Implementation

[0078] The embodiments will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to the following description, and those skilled in the art will readily understand that its methods and details can be varied in many ways without departing from the spirit and scope of the invention. Therefore, the present invention should not be construed as being limited to the contents described in the embodiments shown below.

[0079] Note that in the structure of the invention described below, the same reference numerals are used in different figures to indicate the same parts or parts having the same function, and repeated descriptions are omitted. Furthermore, when indicating parts having the same function, the same shading lines are sometimes used without additional reference numerals.

[0080] Furthermore, for ease of understanding, the positions, sizes, and extents of the components shown in the accompanying drawings may not represent their actual positions, sizes, and extents. Therefore, the disclosed invention is not necessarily limited to the positions, sizes, and extents disclosed in the accompanying drawings.

[0081] Furthermore, depending on the situation or state, the "film" and "layer" can be interchanged. For example, a "conductive layer" can be changed into a "conductive film." In addition, an "insulating film" can be changed into an "insulating layer."

[0082] Implementation Method 1

[0083] In this embodiment, refer to Figures 1A to 11C An electronic device according to one aspect of the present invention.

[0084] Although this embodiment primarily uses arm-worn electronic devices and watch-type electronic devices as examples, there are no particular limitations on the method of using the electronic device according to one aspect of the present invention. For example, the electronic device can be used either without being worn on the body or worn on a part other than the arm (waist, leg, etc.).

[0085] One aspect of the present invention is an electronic device comprising a display panel, a power storage device, circuitry, and a sealed body. The display panel includes a light-emitting element. The light-emitting element is functional in emitting light using power supplied from the power storage device. The circuitry includes an antenna and is functional in wirelessly charging the power storage device. The sealed body internally includes the display panel, the power storage device, and the circuitry. At least a portion of the sealed body is functional in allowing light emitted by the light-emitting element to pass through. The electronic device of one aspect of the present invention can be worn on the arm, or a structure connected to the sealed body can be worn on the arm.

[0086] By using a sealing element, the display panel, energy storage device, and circuitry, which are the sealed components, can be protected, thereby enabling highly durable electronic devices. Furthermore, by using a highly waterproof sealing element, highly waterproof electronic devices that can be used underwater can be achieved.

[0087] Note that in this specification and the like, the constituent elements of an electronic device according to one aspect of the present invention that are located in a sealing body and sealed by the sealing body are collectively referred to as the sealed body.

[0088] In the manufacture of an electronic device according to one aspect of the present invention, the display panel and the energy storage device can be sealed by covering them with a sealing body. This allows for the easy manufacture of highly reliable electronic devices. Furthermore, by making the sealing body into a shape that is easy to wear, such as a strap, the sealing body itself can be worn on the body and used as a wearable device.

[0089] One aspect of the present invention provides an electronic device that can charge a storage device via contactless power transmission. Therefore, the storage device does not need to be removed from the sealed enclosure during charging. Consequently, the sealed enclosure can completely cover the entire sealed body, further improving the waterproofness of the electronic device.

[0090] In another embodiment of the invention, one or more of the constituent elements of the sealed body may also be flexible. For example, the display panel or the energy storage device may also be flexible, and both the display panel and the energy storage device may be flexible.

[0091] Because the sealing body is flexible, it can protect the display panel and the energy storage device without reducing their flexibility, even when at least one of them is flexible. Thus, by using one aspect of the present invention, a flexible electronic device with high reliability and safety can be achieved. When the electronic device is flexible, it provides advantages such as easy installation and removal, and a comfortable wearing experience for the user, making it preferable.

[0092] In the electronic device of this embodiment, the entire sealed body is covered by a flexible sealing body. By covering the sealed body with a flexible sealing body, an electronic device that is not easily damaged even when repeatedly bent and stretched can be realized.

[0093] Furthermore, by using a heat-resistant sealing material, the display panel can be driven even at high temperatures. Additionally, the electronic device can be reversibly bent even at high temperatures. In this case, it is even more preferable to use heat-resistant light-emitting elements and energy storage devices.

[0094] Next, the electronic device of this embodiment will be described in detail.

[0095] Figure 1A A perspective view of the electronic device 100 is shown. Furthermore, Figure 1B A top view of electronic device 100 is shown. Figure 1C Show along Figure 1B Cross-sectional view between the dotted line A and B in the diagram. Figure 1F Show along Figure 1B Cross-sectional view between the dotted and dashed lines CD.

[0096] The electronic device 100 includes a display panel 10, a power storage device 20, a circuit 30, and a sealing body 40. Figure 1AIn the above, the portion of the display panel 10 that the user can see is referred to as the display unit 15 of the electronic device 100.

[0097] <Display Unit 15>

[0098] The electronic device 100 includes a display unit 15. Figure 1A In this embodiment, the display section 15 has a curved surface. An example is shown where the display panel 10 includes a light-emitting element. Furthermore, in... Figure 1C In the diagram, arrows indicate the direction of light emission when the light-emitting element is removed.

[0099] The display section 15 can also be flexible. That is, the curvature of the display section 15 can be changed by deforming it. Figure 1A The state change is shown. Additionally, the display unit 15 can also be accessed from, for example... Figure 1A The deformation of the curved surface shown is as follows: Figure 1B The flat state shown. Note that it is not necessary to deform the flexible display part 15 into a flat state.

[0100] Furthermore, the display section 15 may also be non-flexible. The non-flexible display section 15 may be either flat or curved.

[0101] When the flexibility of the display panel is lower than that of the sealing body, the radius of curvature of the display portion 15 hardly changes when the electronic device of one aspect of the present invention is worn on the arm, etc. Therefore, the end of the electronic device preferably has flexibility.

[0102] <Sealed Body 40>

[0103] Electronic device 100 includes a sealing body 40. In Figure 1A In the middle, the sealing body 40 has a curved surface.

[0104] The sealing body 40 has a strap-like portion that can be worn on the arm. The strap-like portion can be used as a strap for the electronic device 100.

[0105] The sealing body 40 is flexible. That is, the curvature of the sealing body 40 can be adjusted by deformation. Figure 1A The state change is shown. The curvature of the seal 40 can be changed to be greater than... Figure 1A The curvature of the state shown is less than Figure 1A The curvature of the state shown can be either greater than or less than 1. Figure 1A The curvature of the state shown. Additionally, the seal 40 can also be obtained from, as... Figure 1A The deformation of the curved surface shown is as follows: Figure 1B The flat state shown. Note that it is not necessary to deform the flexible seal 40 into a flat state.

[0106] The sealing body 40 preferably comprises a thin film. The thin film has one or more properties selected from surface protection properties, shape retention properties, optical properties, and gas barrier properties. The thin film includes one or both inorganic and organic films. The sealing body 40 may have a single-layer structure or a multilayer structure.

[0107] The sealed body 40 includes, within it, a display panel 10, a power storage device 20, and a circuit 30, which are sealed components. The sealed components are sealed by the sealed body 40 and isolated from the external atmosphere of the electronic device 100.

[0108] For example, the sealed body can also be sealed by laminating one or a pair of films (bag processing, etc.) between folded films or between a pair of films.

[0109] Alternatively, the object to be sealed can be sealed by bonding one or a pair of films. Various curing adhesives can be used, including UV-curing adhesives such as UV-curing resins, reactive curing adhesives, thermosetting adhesives, and anaerobic adhesives. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenolic resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, and EVA (ethylene vinyl acetate) resins. Materials with low moisture permeability, such as epoxy resins, are particularly preferred. Two-component mixed resins can also be used.

[0110] Furthermore, when unevenness or irregularity occurs on the surface of the electronic device 100 along the shape of the object to be sealed, it can sometimes lead to a decrease in the visibility of the display. Therefore, it is preferable to place the object to be sealed in a shell such as a plastic shell and seal the shell with the sealing body 40, thereby making the surface of the electronic device 100 flat.

[0111] By using a thin film on the seal 40, the flexibility of the seal 40 can be improved.

[0112] There are no particular restrictions on the material of the sealing body 40, as long as it can withstand the temperature of the operating environment. The sealing body 40 can be formed from various materials such as glass, organic resin, rubber, plastic, and metal.

[0113] For example, as the sealing body 40, materials with flexibility and visible light transmittance can be used, such as polyester resins like polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide-imide resin, polyvinyl chloride resin, or aromatic polyamide resin, etc.

[0114] The sealing body 40 preferably has high water resistance. Specifically, it is preferable to use a highly water-resistant material in the sealing body 40 or to perform a water-resistant treatment on the surface of the sealing body 40. This prevents external moisture from entering the display panel 10 and the like from the electronic device 100, thereby improving the reliability of the electronic device 100. Furthermore, by improving the water resistance of the sealing body 40, the electronic device 100 can be used underwater.

[0115] The sealing body 40 allows visible light to pass through at least the display unit 15. The user can see the display on the display panel 10 through the sealing body 40. Furthermore, the power storage device 20 and the circuit 30 can also be seen.

[0116] In one embodiment of the invention, the portion of the sealing body 40 other than the display portion 15 may also be designed to block visible light. For example, a structure may be used to block visible light from the portion other than the display portion 15, so that the user cannot see at least one of the power storage device 20 and the circuit 30.

[0117] The electronic device 100 includes a display panel 10, a power storage device 20, and a circuit 30 stacked on top of each other. There are no particular restrictions on their stacking order as long as the user can see the display on the display panel 10. Furthermore, they do not necessarily need to be stacked; two or more of the display panel 10, power storage device 20, and circuit 30 can be arranged on the same plane.

[0118] For example, such as Figure 1F As shown, the electronic device 100 may also include a circuit 30 on the power storage device 20, and a display panel 10 on the circuit 30. When the sealing body 40 is worn on the arm, by adopting a structure in which the power storage device 20, the circuit 30, and the display panel 10 are stacked sequentially from one side of the arm, the user can see the display on the display panel 10. Alternatively, a structure in which the circuit 30, the power storage device 20, and the display panel 10 are stacked sequentially from one side of the arm may also be adopted.

[0119] The space sealed by the sealing body 40 is preferably in a reduced pressure atmosphere or an inert atmosphere. By using this atmosphere, the reliability of the display panel 10 and the like can be improved compared to the case where the space is in an atmospheric atmosphere.

[0120] Figure 1D and Figure 1E Is with Figure 1C Different along Figure 1B The cross-sectional view between the dotted line AB in the diagram. Additionally, Figure 1G Is with Figure 1F Different along Figure 1B Cross-sectional view between the dotted and dashed lines CD.

[0121] Although Figure 1C and Figure 1FThe diagram shows an example where the sealing body 40 covers the side of the sealed body on the front (display surface) side of the electronic device 100, and the back of the electronic device 100 is flat, but it is not limited to this. Figure 1D and Figure 1G As shown, the sealing body 40 on the front (display surface) side and the sealing body 40 on the back side of the electronic device 100 can cover the sides of the sealed body, and both the front and back sides of the electronic device 100 have portions that protrude from other parts (such as strips). Additionally, as... Figure 1E As shown, the sealing body 40 on one side of the back of the electronic device 100 can also cover the side of the sealed body, and the front (display surface) of the electronic device 100 can also be flat. Additionally, as... Figure 1C As shown, the portion of the electronic device 100 including the display unit 15 may protrude beyond other portions (such as the belt). Furthermore, as... Figure 1E As shown, the rear side of the electronic device 100 may also have a part that protrudes from other parts (such as the belt).

[0122] Figures 2A to 5D An electronic device different from electronic device 100 is shown.

[0123] Figure 2A A perspective view of electronic device 100a is shown. Additionally, Figure 3A A top view of electronic device 100a is shown. Figure 3B Show along Figure 3A The cross-sectional view between the dotted and dashed lines EF in the diagram. Figure 3F The cross-sectional view between the dotted and dashed lines GH is shown.

[0124] The electronic device 100a includes a display unit 15. Furthermore, the electronic device 100a includes a sealed body 40. Inside the sealed body 40, the electronic device 100a includes a display panel 10, a power storage device 20, and a circuit 30.

[0125] In electronic device 100a, display panel 10 overlaps with energy storage device 20, circuit 30 overlaps with energy storage device 20, and display panel 10 does not overlap with circuit 30. Thus, the sealed body can also be located in the portion of the sealed body 40 that serves as a strap. For example, when using a flexible energy storage device 20, the energy storage device 20 can be arranged in a wide area inside the sealed body 40, thereby enabling an electronic device that can be used for a long time once fully charged.

[0126] The interior of the sealed body 40 may also contain a buoyancy material. For example, a solid buoyancy material or a gas-sealed buoyancy material can be used as the buoyancy material. The buoyancy material may also contain polymer materials (resins, etc.) or gases (carbon dioxide, etc.). Foaming resins that foam polyethylene, polypropylene, or styrene may also be used as the buoyancy material.

[0127] By using buoyancy materials, an electronic device of one aspect of the present invention can easily float in water, thereby making it easy to find if the electronic device is lost in water.

[0128] Alternatively, a rubber-elastic component may be included inside the sealing body 40. In a rubber-elastic component, internal stress generated during deformation is easily dispersed. Therefore, when an electronic device according to one aspect of the present invention is bent, the stress locally applied to the bent portion is mitigated, thereby preventing damage to the electronic device. Additionally, this component can also be used as a buffer to disperse physical pressure or impact from the outside.

[0129] Note that rubber elasticity refers to the ability of rubber to absorb and store energy when subjected to external force, returning to its original state. Components with rubber elasticity can undergo reversible deformation.

[0130] Figures 3C to 3E Is with Figure 3B Different along Figure 3A The cross-sectional view between the dotted and dashed lines EF in the diagram.

[0131] For example, preferred in Figure 3B , Figure 3C , Figure 3D and Figure 3F The space 42 shown includes buoyancy material or a component with rubber elasticity.

[0132] like Figure 3B As shown, the display panel 10 can also contact the energy storage device 20, and the circuit 30 can also contact the energy storage device 20. Additionally, as... Figure 3C As shown, the display panel 10 may not be in contact with the energy storage device 20. Similarly, the circuit 30 may not be in contact with the energy storage device 20. Furthermore, the display panel 10, the energy storage device 20, and the circuit 30 may also be in contact with the sealing body 40. Figure 3B and Figure 3C An example is shown where the energy storage device 20 is in contact with the sealing body 40. Figure 3C An example is shown where the display panel 10 is in contact with the sealing body 40. Furthermore, as... Figure 3D As shown, the sealing body 40 may not be in contact with the sealed body. In addition, if two or more of the display panel 10, the energy storage device 20, the circuit 30 and the sealing body 40 have parts that are in contact with each other, they can be fixed by adhesives or the like, or they can be in contact in a way that allows them to move relative to each other.

[0133] In addition, such as Figure 3EAs shown, the interior of the sealed body 40 can also be in a sufficiently depressurized atmosphere. This prevents the display panel 10, the energy storage device 20, and the circuitry 30 from deteriorating due to impurities. Furthermore, it enables the electronic device to be thinner and lighter.

[0134] Although Figure 3B and Figure 3F The diagram shows an example where the sealing body 40 covers the side of the sealed body on the front (display surface) side of the electronic device 100a, and the back of the electronic device 100a is flat, but it is not limited to this. Figure 3D As shown, the sealing body 40 on the front (display surface) side and the sealing body 40 on the back side of the electronic device 100a can cover the side of the sealed body, and both the front and back sides of the electronic device 100a have portions that protrude from other parts (such as the strip).

[0135] The number of display panel 10, energy storage device 20, and circuit 30 included in one embodiment of the electronic device of the present invention is not limited to one, and the number of each can be two or more. In addition, the number of display units 15 included in one embodiment of the electronic device of the present invention is not limited to one, and can be two or more.

[0136] Figure 2B A perspective view of an electronic device 100b including three display units (display unit 15a, display unit 15b and display unit 15c) is shown.

[0137] The three display units of the electronic device 100b can be composed of a single display panel 10 including the three display units, or they can be composed of three display panels 10, each including one display unit.

[0138] When an electronic device includes multiple display units, the diversity of displays can be increased. Multiple display units can also be used as independent display units to display different images. Furthermore, the same image can be displayed on all display units. Additionally, a single image can be displayed on two or more display units.

[0139] Preferably, in one embodiment of the present invention, a sensor is provided to detect the user's line of sight, the electronic device's vertical orientation, rotation angle, or direction. For example, a gyroscope sensor or an image sensor can be used. Therefore, the display can be placed in an orientation easily visible to the user, or on a display section easily visible to the user. Furthermore, by keeping the display section less visible to the user in a switched-off state, power consumption can be reduced. In addition, the user can operate the electronic device to select the display section or the content displayed on the display section.

[0140] Figure 2CThe electronic device 100c shown includes a display unit 15 that is larger than that of the electronic device 100a.

[0141] By using the aforementioned sensors or user-operated electronic devices, even when using electronic devices with large displays, only the parts that are easily visible to the user can be displayed, while other parts are turned off, thereby reducing power consumption.

[0142] One embodiment of the present invention provides an electronic device that can have either a structure for wearing a sealed body on the arm or a structure for wearing a body connected to the sealed body on the arm. Examples of such a body include straps (cords, wires, mesh straps, belts, etc.) or springs. Wearing methods include placing the electronic device directly on the skin, wearing the electronic device on the arm through clothing, sewing the electronic device to the clothing by stitching it onto the portion of the clothing overlapping the arm, and attaching the electronic device to the clothing by using Velcro (a registered trademark in Japan) or similar fasteners on the portion of the clothing overlapping the arm.

[0143] The sealing body can also have a structure that combines a thin film with a strip spring made of a convex material (such as stainless steel). Alternatively, a strip spring using a convex component (such as stainless steel) can also be used as the structural body. Therefore, electronic devices can be attached and detached instantly. In this case, the electronic device can be securely fixed to the skin or to the arm through clothing. Because a strip spring is used, there is no need to adjust the length of the strap, thus enabling the electronic device to be worn regardless of the arm's size.

[0144] Figure 4A A perspective view of the electronic device 100d is shown. Furthermore, Figure 5A A top view of electronic device 100d is shown. Figure 5B Show along Figure 5A The cross-sectional view between the dotted and dashed lines J and K. Furthermore, in Figure 5B In the image, arrows indicate the direction of light emission from the light-emitting elements included in the display panel 10.

[0145] The electronic device 100d includes a sealed body 40 and a strap 155. The sealed body 40 contains a display panel 10, circuitry 30, and a power storage device 20, etc. The sealed body 40 is connected to the strap 155.

[0146] The sealing body 40 and the strap 155 are preferably detachably connected. For example, multiple straps with different designs that can be connected to the sealing body 40 can be prepared, and the strap connected to the sealing body 40 can be selected according to the clothing, location, time, situation, etc., which can increase the opportunity to use electronic devices. In addition, old straps 155 can be replaced with new straps. Furthermore, multiple sealing bodies 40 with different shapes or performance can be prepared, and the sealing body 40 connected to the strap can be selected according to the situation.

[0147] In addition, such as Figure 4B As shown in the electronic device 100e, the strap 155 may also have a recess in which a sealing body 40 is disposed. When the sealing body 40 protrudes beyond the strap 155, there is a concern that the display unit 15 may be damaged or the electronic device may be destroyed due to friction or collision with other objects during use. Therefore, it is preferable to connect the strap 155 and the sealing body 40 in such a way that their surfaces form approximately the same plane. Alternatively, the recess of the strap 155 may be deeper than the thickness of the sealing body 40.

[0148] Although Figure 4A and Figure 5A An example is shown where the width of the sealing body 40 is equal to the width of the strip 155, but one aspect of the invention is not limited to this. Figure 5C As shown, the width of the sealing body 40 can also be smaller than the width of the strip 155. Furthermore, as... Figure 5D As shown, the width of the sealing body 40 can also be greater than the width of the strip 155.

[0149] Next, an example of the constituent elements of an electronic device according to one aspect of the present invention will be shown.

[0150] Figure 6A The constituent elements 150 shown include a display panel 10, a power storage device 20, a circuit 30, and a sealing body 40. The sealing body 40 contains the display panel 10, the power storage device 20, and the circuit 30. Hereinafter, the display panel 10, the power storage device 20, and the circuit 30 will sometimes be collectively referred to as the sealed body.

[0151] For example, constituent element 150, such as Figure 4A The constituent elements 150a and Figure 4B As shown in component 150b, it can be used by connecting the sealing body 40 and the strap 155. Additionally, as... Figures 3A to 3E As shown, the sealing body 40 can also be worn on the arm by forming the sealing body 40 into a strip.

[0152] exist Figure 6B In the example, a block diagram is used to illustrate the connection relationship of the sealed body.

[0153] The display panel 10 includes a light-emitting element 11. The light-emitting element 11 may also have the function of emitting light using power supplied from the energy storage device 20.

[0154] In addition, the display panel 10 may also have the function of emitting light using power supplied from components other than the power storage device 20.

[0155] The energy storage device 20 has a portion that overlaps with the display panel 10.

[0156] In addition, the energy storage device 20 may also have the function of supplying power to components other than the display panel 10.

[0157] The energy storage device 20 includes a positive electrode, a negative electrode, an insulator, an electrolyte, and an outer packaging.

[0158] Circuit 30 includes antenna 31. Antenna 31 has a portion that overlaps with display panel 10. Circuit 30 can charge energy storage device 20 wirelessly (also known as contactlessly).

[0159] Because the display panel 10 and the circuit 30 overlap, or the display panel 10 and the energy storage device 20 overlap, the constituent element 150 can be miniaturized. In particular, it is preferable to provide the three overlapping portions of the display panel 10, the energy storage device 20, and the circuit 30. The miniaturization of the constituent element 150 is especially effective when a strip is provided in addition to the sealing body 40. Note that in cases where miniaturization of the constituent element 150 is not required, such as when the sealing body 40 is used as a strip for an electronic device, the overlapping portions of the display panel 10 and the circuit 30, or the overlapping portions of the display panel 10 and the energy storage device 20, may not be present.

[0160] The energy storage device 20 preferably has a portion that overlaps with the circuit 30. For example, at least a portion of the antenna 31 may also overlap with the energy storage device 20. By arranging the antenna 31 between the display panel 10 and the energy storage device 20, overlapping the display panel 10, the energy storage device 20, and the circuit 30 makes it difficult for the user of the electronic device to see the antenna 31, thereby maintaining the appearance of the electronic device, which is therefore preferred. When the display panel 10 is arranged between an external antenna and the antenna 31, radio wave transmission and reception can also be performed. That is, radio waves transmitted by the external antenna pass through the display panel 10, and the antenna 31 receives the radio waves.

[0161] Given the environment in which the electronic device will be used, light-emitting elements that can emit light in that environment and energy storage devices that can supply power to the display panel in that environment are used.

[0162] An electronic device according to one aspect of the present invention is preferably usable in both low-temperature and high-temperature environments. Furthermore, an electronic device according to one aspect of the present invention is preferably usable over a wide temperature range (e.g., above 0°C and below 100°C, preferably above -25°C and below 150°C, more preferably above -50°C and below 200°C). An electronic device according to one aspect of the present invention can be used both indoors and outdoors.

[0163] The light-emitting element included in one aspect of the electronic device of the present invention is preferably capable of emitting light in environments of 0°C and 100°C. Furthermore, the energy storage device included in one aspect of the electronic device of the present invention is preferably capable of supplying power to the display panel in environments of 0°C and 100°C.

[0164] Electronic devices may also include switches. Figure 6C , Figure 6D The display panel 10, the energy storage device 20, the circuit 30, the circuit 50, and the switch 51 are shown as sealed components.

[0165] For example, such as Figure 6C As shown, when switch 51 is in the closed state, circuit 30 can wirelessly charge the energy storage device 20.

[0166] For example, such as Figure 6D As shown, when switch 51 is in the ON state, the energy storage device 20 can supply power to the display panel 10.

[0167] The constituent elements of an electronic device according to one aspect of the present invention will be described in detail below.

[0168] <Display Panel 10>

[0169] The display panel 10 includes a light-emitting element 11. As a structural example of the display panel 10, the light-emitting device is described in detail in Embodiment 3, and the input / output device is described in detail in Embodiment 4. Note that the display elements included in the display panel 10 are not limited to light-emitting elements. Additionally, the display panel may also include detection elements such as touch sensors.

[0170] The display panel 10 can be an active matrix with active elements (non-linear elements) in the pixels or a passive matrix without active elements in the pixels.

[0171] The display panel 10 can also be flexible. For example, the flexibility of the display panel 10 can be improved by using a thin film for at least one of the support substrate and the sealing substrate of the light-emitting element 11.

[0172] For example, it is preferable to use a display that can withstand 100,000 bends in a bending test with a radius of curvature of 5 mm. It is preferable to use the electronic device while bending the display panel in a range of 1 mm or more and 150 mm or less, more preferably in a range of 5 mm or more and 150 mm or less.

[0173] As the light-emitting element 11, it is preferable to use an element that can emit light in both low-temperature and high-temperature environments. Examples of low-temperature environments include those above -100°C and below 0°C, preferably those above -100°C and below -25°C, and more preferably those above -100°C and below -50°C. Examples of high-temperature environments include those above 100°C and below 300°C, preferably those above 150°C and below 300°C, and more preferably those above 200°C and below 300°C. Note that, in addition to low-temperature and high-temperature environments, the light-emitting element 11 can also emit light in environments above 0°C and below 100°C. For example, the light-emitting element 11 can emit light at room temperature (above 20°C and below 30°C).

[0174] As the light-emitting element 11, a self-emissive element can be used, and within this scope, elements whose brightness is controlled by current or voltage can be included. For example, light-emitting diodes (LEDs), organic EL elements, and inorganic EL elements can be used. The light-emitting element 11 is not limited to light-emitting elements, and other display elements can also be used.

[0175] The higher the heat resistance of the light-emitting element 11, the better. For example, when an organic EL element is used as the light-emitting element 11, the glass transition temperature of each organic compound contained in the organic EL element is preferably 100°C or higher and 300°C or lower, more preferably 150°C or higher and 300°C or lower.

[0176] In one embodiment of the invention, when the antenna 31 receives power from an external antenna through the display panel 10, the thinner the pair of electrodes included in the light-emitting element 11, the better. For example, the total thickness of the pair of electrodes is 1 μm or less, preferably 500 nm or less, more preferably 350 nm or less, and even more preferably 250 nm or less.

[0177] <Electronic Storage Device 20>

[0178] As the energy storage device 20, it is preferable to use an energy storage device that can supply power to the display panel 10 in both low-temperature and high-temperature environments. Examples of low-temperature environments include those above -100°C and below 0°C, preferably those above -100°C and below -25°C, and more preferably those above -100°C and below -50°C. Examples of high-temperature environments include those above 100°C and below 300°C, preferably those above 150°C and below 300°C, and more preferably those above 200°C and below 300°C. Note that, in addition to low-temperature and high-temperature environments, the energy storage device 20 can also be used in environments above 0°C and below 100°C. For example, the energy storage device 20 can be used at room temperature (above 20°C and below 30°C).

[0179] Examples of energy storage devices 20 include, for example, lithium-ion secondary batteries such as lithium polymer batteries (lithium-ion polymer batteries) that utilize gel electrolytes, nickel-metal hydride batteries, nickel-cadmium batteries, organic free radical batteries, lead-acid batteries, air secondary batteries, nickel-zinc batteries, silver-zinc batteries, etc.

[0180] Using lithium-ion rechargeable batteries, which can achieve high energy density, makes it possible to achieve lightweight and miniaturized electronic devices, making them a preferred choice.

[0181] For example, a secondary battery comprising a non-aqueous electrolyte can be used. This non-aqueous electrolyte contains an ionic liquid (a salt that melts at room temperature) and an alkali metal salt. Because the ionic liquid is flame-retardant and non-volatile, a secondary battery with high heat resistance can be achieved. For example, the ionic liquid preferably contains imidazolium cations and anions. The alkali metal salt is preferably a lithium salt.

[0182] Secondary batteries using gel electrolytes or all-solid secondary batteries using solid electrolytes are preferred due to their high heat resistance and safety.

[0183] As an energy storage device 20, various shapes of secondary batteries can be used, such as coin-shaped (single-layer flat type), cylindrical type, thin type, square type, and sealed type. In addition, a structure with multiple positive electrodes, multiple negative electrodes and multiple separators stacked or a structure with positive electrodes, negative electrodes and separators wound (wound type) can also be adopted.

[0184] Furthermore, the electronic device of one aspect of the present invention may also serve as an energy storage device 20, including a lithium-ion capacitor, a double-layer capacitor, etc.

[0185] The energy storage device 20 can also be flexible. For example, the flexibility of the energy storage device 20 can be improved by using a film as an outer packaging. The area surrounded by the outer packaging includes at least the positive electrode, the negative electrode, and the electrolyte (or liquid electrolyte solution).

[0186] In electronic devices, a structure of overlapping light-emitting element 11 and energy storage device 20 can also be adopted. The larger the overlapping area of ​​the light-emitting element 11 and energy storage device 20, the wider the range over which the heat generated by the light-emitting element 11 can be used to heat the energy storage device 20. Even if an energy storage device is used, which is more difficult to operate in low-temperature environments compared to high-temperature environments, the reliability of the electronic device can be improved.

[0187] A structural example of the energy storage device 20 will be described in detail in Embodiment 2.

[0188] <Circuit 30>

[0189] Circuit 30 includes antenna 31. Furthermore, circuit 30 may also include controller 32.

[0190] Antenna 31 can receive power from an external antenna (e.g., antenna 68 of a charger). Antenna 31 can also receive power from an external antenna via the display panel 10. Alternatively, antenna 31 can also receive power from an external antenna via the power storage device 20.

[0191] The controller 32 has the function of converting the power received using the antenna 31 into power supplied to the energy storage device 20 and outputting it to the energy storage device 20. For example, the controller 32 may also function as an AC-DC converter. In this case, the power received using the antenna 31 is converted into DC power and output to the energy storage device 20.

[0192] In the electronic device of this embodiment, charging is performed using a structure in which the antenna 68 (primary coil) of the charger and the antenna 31 (secondary coil) of the electronic device are magnetically coupled. Power is transferred to the secondary coil side non-contactly by means of electromagnetic induction, which generates a voltage in the secondary coil using an alternating magnetic field generated in the primary coil. Note that the method of receiving power is not limited to electromagnetic induction.

[0193] The antenna included in the electronic device is not limited to charging the contactless power storage device 20. For example, an antenna and memory can be installed in the electronic device to transmit and receive electronic data. Images or information can also be displayed on the display panel 10 based on the received data. Antennas with GPS (Global Positioning System) functionality can also be installed to obtain location information or GPS time.

[0194] For safety reasons, it is preferable that the input / output terminals for charging or discharging the energy storage device are not exposed on the surface of the electronic device. When the input / output terminals are exposed, there is a concern that water, such as rain, may cause short circuits or that contact with the body may result in electric shock. By using the antenna 31, the energy storage device can be charged non-contactly, thus achieving a structure that prevents the input / output terminals from being exposed on the surface of the electronic device.

[0195] <Circuit 50>

[0196] Circuit 50 has the function of converting the power supplied from the energy storage device 20 into power that makes the light-emitting element 11 emit light. For example, circuit 50 may have the function of converting the output voltage of the energy storage device 20 into (boosting or bucking) the voltage required for the light-emitting element 11 to emit light.

[0197] Circuit 50 may also have the function of generating signals to drive display panel 10 and outputting them to display panel 10. Circuit 50 may also include signal line driving circuit or scan line driving circuit. Display panel 10 may also include signal line driving circuit or scan line driving circuit.

[0198] <Switch 51>

[0199] Switch 51 is electrically connected to circuit 50. Switch 51 is electrically connected to energy storage device 20. Switch 51 is electrically connected to circuit 30.

[0200] There are no particular restrictions on the type of switch 51; for example, an electrical switch or a mechanical switch can be used. Specifically, examples include transistors, diodes, magnetic switches, and switches with mechanical contacts.

[0201] Figure 7A and Figure 7B A specific example of a sealed object is shown. Figure 7A Showing the front (display side) of the sealed object. Figure 7B The back of the sealed body is shown.

[0202] Figure 7A and Figure 7B An example is shown where a laminated secondary battery is used as an energy storage device 20. For example... Figure 7B As shown, the central part of the energy storage device 20 is a section with multiple electrodes stacked on top of each other, and its thickness is greater than that of the ends.

[0203] Electrode 21a is electrically connected to one of the positive and negative terminals of the energy storage device 20. Electrode 21b is electrically connected to the other of the positive and negative terminals of the energy storage device 20.

[0204] Electrodes 21a and 21b are bent while sandwiching circuit board 55, and electrically connected to terminals 33a and 33b on circuit board 55, respectively.

[0205] The circuit board 55 is provided with the structure Figure 6C The circuits 30, 50, etc., shown are illustrated as electronic components 35. The circuit board 55 is provided with electronic components such as capacitors, resistors, or switches. For example, a printed circuit board can be used as the circuit board 55.

[0206] A switch 51 is provided on the circuit board 55. Figure 7A , Figure 7B An example of using a magnetic switch as switch 51 is shown. The switch can be switched on / off by attaching or removing the magnet.

[0207] Antenna 31 is electrically connected to terminal 34 on circuit board 55. A portion of antenna 31 is located between energy storage device 20 and display panel 10. That is, in the electronic device, antenna 31 has a portion that overlaps with display panel 10. Antenna 31 has a portion that overlaps with energy storage device 20.

[0208] Antenna 31 can receive power from an external antenna through display panel 10.

[0209] Terminal 12a of the display panel 10 is electrically connected to terminal 52a on the circuit board 55 via wiring 53a. Terminal 12b of the display panel 10 is electrically connected to terminal 52b on the circuit board 55 via wiring 53b.

[0210] In one embodiment of the electronic device of the present invention, both the energy storage device and the antenna have portions that overlap with the display panel. Furthermore, the energy storage device and the circuitry partially overlap each other. For example... Figure 7A , Figure 7B As shown, for example, a portion of the antenna 31 may also be located between the display panel 10 and the power storage device 20.

[0211] As described above, miniaturization of the sealed body can be achieved when at least two of the constituent elements of an electronic device, such as a power storage device, a display panel, a circuit board, and an antenna, overlap. Therefore, this is preferred.

[0212] For example, the energy storage device 20 preferably has a portion that overlaps with at least one of the display panel 10, the circuit board 55, and the antenna 31. Figure 7A and Figure 7B As shown, the energy storage device 20 is particularly preferably equipped with a portion that overlaps with each of the display panel 10, the circuit board 55 and the antenna 31.

[0213] The environment in which the electronic device of one aspect of the present invention can be used is not limited to atmospheric atmosphere. For example, the electronic device of one aspect of the present invention can be used in water at temperatures above 0°C and below 100°C. Because the light-emitting element and the energy storage device can be used over a wide temperature range and are sealed by a sealing body, the electronic device of one aspect of the present invention can ensure high reliability even when used in water.

[0214] In addition, such as Figure 8A and Figure 8B As shown, an electronic device according to one aspect of the present invention may also have multiple regions sealed by a sealing body 40. For example... Figure 8A and Figure 8B As shown, the sealed body can also be arranged separately in multiple spaces, and the sealing region 41 can overlap with wiring 45 and other components that connect the separately arranged elements. This region can be described as a flexible region 70. Figure 8B As shown, the electronic device can be bent in the flexible region 70. Figure 8B In this method, by bending the flexible area 70 and the portion of the sealing body 40 that overlaps with the energy storage device 20, even if the display panel 10 is not flexible, the electronic device can be bent and wrapped around an arm or similar object. Furthermore, even if the display panel 10 is flexible, it can be bent to deform the electronic device.

[0215] exist Figure 8A The upper space includes a display panel 10, and the lower space includes a power storage device 20 and a circuit 30. The display panel 10 is electrically connected to the power storage device 20 and the circuit 30 via wiring 45.

[0216] Additionally, electronic devices can also have double-layered sealed areas. For example... Figure 8C As shown, a sealing area 41b can also be provided around the sealing area 41a to provide a double seal for the display panel 10, etc. By providing a double or more layers of sealing, the reliability of electronic devices can be improved.

[0217] like Figure 8C As shown, the ends of the display panel 10, the energy storage device 20, and the circuit 30 are preferably chamfered. This can suppress the corner seals of the display panel 10, the energy storage device 20, and the circuit 30, and even if a thin film or the like is used as a sealing material, the decrease in the reliability of the electronic device can be suppressed.

[0218] Furthermore, an electronic device according to one aspect of the present invention preferably includes a photoelectric conversion element and uses the photoelectric conversion element to charge an energy storage device. For example, it is preferable to charge the energy storage device by solar power generation. Additionally, an electronic device according to one aspect of the present invention may also have the function of generating and charging electricity using the movements of a user's arm.

[0219] An electronic device according to one aspect of the present invention preferably includes one or more sensors. As sensors, for example, sensors capable of measuring factors such as: force, displacement, position, velocity, acceleration, angular velocity, number of rotations, distance, light (visible light, infrared light, ultraviolet light, etc.), liquid, magnetism, temperature, chemical substances, sound, time, hardness, electric field, current, voltage, electrical power, radiation, flow rate, humidity, slope, vibration, or odor can be used.

[0220] An electronic device according to one aspect of the present invention preferably includes sensors for measuring the user’s biological information such as heart rate, respiratory rate, pulse rate, body temperature or blood pressure.

[0221] One embodiment of the present invention provides an electronic device that preferably has the functions of detecting and transmitting biological and location information. For example, the electronic device can detect changes in a user's health status and transmit the biological and location information to other electronic devices. Therefore, the user can be quickly rescued when they are unwell or encounter an accident.

[0222] For example, optical sensors can be used to measure heart rate based on the contraction of capillaries in the arm or other parts of the body.

[0223] In addition, sensors that determine whether electronic devices are worn on a user's arm based on the skin's conductivity can be used to automatically turn the electronic devices on and off.

[0224] For example, these sensors are preferably installed on the side of the electronic device that comes into contact with the user's skin.

[0225] Furthermore, the electronic device of one aspect of the present invention can also be an electronic device capable of measuring data of the usage environment. For example, it may also include an ultraviolet sensor or an illuminance sensor. By knowing the amount of ultraviolet radiation, it is useful for the user's sun protection. In addition, the brightness of the display can be automatically adjusted according to the illuminance of the usage environment. For example, these sensors are preferably mounted on the display side of the electronic device.

[0226] Furthermore, the electronic device of one aspect of the present invention can also be an electronic device capable of receiving GPS signals.

[0227] One aspect of the electronic device of the present invention includes a driving circuit for wirelessly driving a display panel, a circuit for charging a power storage device, and a protection circuit for preventing overcharging of the power storage device. Furthermore, it may also include circuitry for controlling or driving other functional elements, specifically integrated circuits (CPU, etc.).

[0228] Furthermore, an electronic device according to one aspect of the present invention may also include various functional elements or components such as imaging elements, power generation elements, speakers, and microphones.

[0229] An electronic device according to one aspect of the present invention may also include a touch panel.

[0230] In one embodiment of the present invention, a structure in which an electrostatic capacitive touch sensor or a pressure-sensitive touch sensor is superimposed on the display panel, or a structure in which the display panel itself has the function of a touch sensor (also known as an In-Cell type touch panel), may be used. As an In-Cell type touch panel, an electrostatic capacitive or optical touch sensor may be used.

[0231] When engaging in water sports such as swimming or scuba diving, or while bathing, touch operations can sometimes be difficult to perform or detect. Therefore, in one aspect of the electronic device of the present invention, an audio input unit is preferably included as the input unit. For example, the electronic device preferably includes a microphone, particularly a bone conduction microphone. Because bone conduction microphones offer superior noise immunity, they can detect sound with high sensitivity even in noisy or background noise environments. Furthermore, bone conduction microphones are suitable for use underwater. Moreover, since the microphone's position is not limited to near the mouth, the electronic device offers a high degree of freedom in its wearing position, allowing for seamless application to arm-worn electronic devices. Additionally, the electronic device can also include a bone conduction speaker as an output unit. Furthermore, the electronic device can also include other microphones or speakers that can be used underwater.

[0232] Furthermore, by applying one aspect of the present invention, a waterproof wearable device for everyday use can be realized. For example, an electronic device according to one aspect of the present invention has a waterproof rating of 2 bar or more, preferably 5 bar or more, more preferably 10 bar or more, and even more preferably 20 bar or more.

[0233] Furthermore, a wearable device for diving can be realized by applying one aspect of the present invention. For example, in scuba diving, if the electronic device according to one aspect of the present invention has a water resistance of 100m, preferably 200m, it can be used when diving in shallow water. Moreover, if the electronic device according to one aspect of the present invention has a water resistance of 300m, preferably 1000m, it can be used not only in shallow water but also in deep water. Because the electronic device according to one aspect of the present invention includes a display panel using a light-emitting element, it has the characteristic of high visibility at night or underwater.

[0234] Furthermore, an electronic device according to one aspect of the present invention preferably includes a rotating frame (bezel) for measuring diving time or decompression time, especially an anti-rotation frame.

[0235] Furthermore, the electronic device of one embodiment of the present invention may also have the function of measuring, recording, and displaying air temperature, water temperature, water depth, or dive logs, or the function of a timer. Additionally, it may have the function of transmitting location information specified by GPS signals to other electronic devices. This can improve the safety of marine sports or work at sea.

[0236] Furthermore, when an electronic device of one aspect of the present invention is resistant to salt water, it is suitable for use in situations involving marine activities or work at sea, and is therefore preferred.

[0237] Figures 9A to 9D as well as Figures 10A to 10D A specific example of an arm-worn electronic device according to one aspect of the present invention is shown.

[0238] Figures 9A to 9D as well as Figures 10A to 10D Each of the electronic devices shown includes one or more display units 15 and one or more sealing bodies 40.

[0239] Figure 9A and Figure 9B as well as Figures 10A to 10C Examples include electronic devices that can have the seal 40 directly wrapped around an arm or similar object.

[0240] The sealing body 40 is flexible and can be bent to fit the shape of the wearable electronic device. Furthermore, the display unit 15 can also be flexible.

[0241] Clip 91 is connected to sealing body 40.

[0242] The sealing body 40 has multiple openings 93. To prevent the sealing body 40 from being damaged starting from the end of the opening 93 or for impurities to enter the interior of the sealing body 40 from the end of the opening 93, a sealing portion 95 is preferably included at the end of the opening 93. The sealing portion 95 can reinforce the vicinity of the end of the opening 93 of the sealing body 40. There are no limitations on the material of the sealing portion 95; for example, metal, alloy, organic resin, etc. can be used.

[0243] Figure 9A and Figure 10A This example shows a display section 15 that is square. Figure 9B , Figure 10B and Figure 10CAn example of a circular display section 15 is shown. There are no particular limitations on the shape of the display section 15. For example, various shapes such as polygons, ovals, semicircles, stars, and hearts can also be used, in addition to squares.

[0244] Although Figure 9A and Figure 9B The image shows an electronic device including a display unit located roughly in the center of the device, but there are no particular restrictions on the position or number of display units. For example... Figure 10A As shown, the electronic device may also include three display units. Furthermore, as... Figure 10B and Figure 10C As shown, the electronic device may also include a display unit at a position offset from the center of the electronic device. Furthermore, when the electronic device includes multiple display units, the shapes of the multiple display units may be identical or different from each other.

[0245] also, Figure 9C , Figure 9D and Figure 10D Examples include electronic devices that can wrap a structure connected to the sealing body 40 around an arm or similar object.

[0246] For example, such as Figure 9C and Figure 10D As shown, the electronic device may also include a locking strap 97 as a structure. Additionally, as... Figure 9D As shown, the electronic device may also include a strip-shaped strip 155 as a structure.

[0247] Figure 9C and Figure 9D An example is shown that includes a sealing body 40 and a display unit 15. Figure 10D An example is shown that includes two sealing bodies 40 and two display sections 15.

[0248] As a structural component, one or more of the following can be used: metal, resin, and natural materials. Metals include stainless steel, aluminum, and titanium alloys. Resins include acrylic resin and polyimide resin. Natural materials include processed wood, stone, bone, leather, paper, and cloth.

[0249] Figures 11A to 11C An example of a wearable electronic device according to one aspect of the present invention is shown. Figure 11A This is an example of wearing an electronic device of one aspect of the present invention on the wrist. Figure 11B This is an example of wearing an electronic device of one aspect of the present invention on clothing, in other words, an example of a sleeve-type electronic device. Figure 11C This is an example of wearing an electronic device of one aspect of the present invention on the upper arm.

[0250] Furthermore, the electronic device of one aspect of the present invention is not limited to an electronic device worn on a part of the body; it can also be worn on robots (factory robots, humanoid robots, etc.), columnar objects (building pillars, utility poles, signposts), or tools, etc.

[0251] One embodiment of the present invention provides an electronic device with communication capabilities and may have a structure capable of sending and receiving emails on a standalone basis. For example, the electronic device is preferably capable of executing various applications such as mobile phone, email, article reading and writing, music playback, network communication, and computer games.

[0252] Furthermore, by wirelessly connecting the electronic device of one aspect of the present invention to a smartphone or other mobile phone or portable information terminal, it is also possible to send and receive emails. For example, by using the electronic device of one aspect of the present invention with a smartphone, the display unit of the electronic device of one aspect of the present invention can also be used as a secondary display.

[0253] Thus, in one aspect of the present invention, by sealing the display panel, circuitry, and power storage device with a highly waterproof sealant, a wearable device usable during water sports or bathing can be realized. Furthermore, in another aspect of the present invention, by using a highly heat-resistant sealant, display panel, and power storage device, a wearable device with a wide operating temperature range can be realized.

[0254] This implementation method can be appropriately combined with other implementation methods.

[0255] Implementation Method 2

[0256] In this embodiment, refer to Figures 12A to 23 This describes a power storage device for an electronic device that can be used in one aspect of the present invention. Note that the power storage device of one aspect of the present invention is not limited to the structure illustrated in this embodiment, and can be applied in various shapes and configurations.

[0257] In this embodiment, a lithium-ion secondary battery is used as an example for explanation; however, the invention is not limited to this. This invention can be applied to batteries, primary batteries, secondary batteries, lithium-air batteries, lead-acid batteries, lithium-ion polymer secondary batteries, nickel-metal hydride batteries, nickel-cadmium batteries, nickel-iron batteries, nickel-zinc batteries, silver-zinc oxide batteries, solid-state batteries, air batteries, zinc-air batteries, capacitors, lithium-ion capacitors, double-layer capacitors, and supercapacitors.

[0258] In one aspect of the present invention, the power supply method for the energy storage device can be a method of supplying power to an object (hereinafter referred to as a receiving device) without contacting a power supply source (hereinafter also referred to as a power supply device) (also referred to as contactless power supply, wireless power supply, etc.). Examples of contactless power supply methods include magnetic resonance, electromagnetic induction, and electrostatic induction.

[0259] <Structure Example 1>

[0260] Figure 12A Battery cell 500 is shown. Although in Figure 12A The present invention illustrates a thin secondary battery as an example of battery cell 500, but is not limited to this. For example, secondary batteries using a wound body, cylindrical secondary batteries, or coin-shaped secondary batteries can also be used in electronic devices according to one aspect of the present invention.

[0261] like Figure 12A As shown, the battery cell 500 includes a positive electrode 503, a negative electrode 506, a separator 507, and an outer casing 509. The battery cell 500 may also include a positive electrode wire 510 and a negative electrode wire 511.

[0262] Figure 13A and Figure 13B Show along Figure 12A An example of a cross-sectional view of the portion shown by the dashed lines A1-A2 in the diagram. Figure 13A and Figure 13B The cross-sectional structure of a battery cell 500 manufactured using a pair of positive electrodes 503 and negative electrodes 506 is shown.

[0263] like Figure 13A and Figure 13B As shown, the battery cell 500 includes a positive electrode 503, a negative electrode 506, a separator 507, an electrolyte 508, and an outer casing 509. The separator 507 is sandwiched between the positive electrode 503 and the negative electrode 506. The area surrounded by the outer casing 509 is filled with the electrolyte 508.

[0264] The positive electrode 503 includes a positive electrode active material layer 502 and a positive electrode current collector 501. The negative electrode 506 includes a negative electrode active material layer 505 and a negative electrode current collector 504. The active material layer can be formed on one or both surfaces of the current collector. The separator 507 is located between the positive electrode current collector 501 and the negative electrode current collector 504.

[0265] A battery cell includes one or more positive electrodes and one or more negative electrodes. For example, a battery cell may have a stacked structure that includes multiple positive electrodes and multiple negative electrodes.

[0266] Figure 14A Show along Figure 12AOther examples of cross-sectional views of the portions shown by the dashed lines A1-A2 in the diagram. Additionally, Figure 14B Show along Figure 12A The cross-sectional view of the portion shown by the dashed lines B1-B2 in the figure.

[0267] Figure 14A and Figure 14B The cross-sectional structure of a battery cell 500 manufactured using multiple sets of positive electrodes 503 and negative electrodes 506 is shown. There is no particular limitation on the number of electrode layers included in the battery cell 500. A larger number of electrode layers allows for the realization of an energy storage device with greater capacity. Conversely, a smaller number of electrode layers allows for the realization of a thinner and more flexible energy storage device.

[0268] Figure 14A and Figure 14B Examples shown include: two positive electrodes 503 having a positive active material layer 502 on one surface of the positive current collector 501; two positive electrodes 503 having a positive active material layer 502 on both surfaces of the positive current collector 501; and three negative electrodes 506 having a negative active material layer 505 on both surfaces of the negative current collector 504. That is, the battery cell 500 includes six positive active material layers 502 and six negative active material layers 505. Note that... Figure 14A and Figure 14B An example of the insulator 507 being bag-shaped is shown, but it is not limited to this; the insulator 507 can be rectangular or corrugated.

[0269] under, Figure 12B The diagram shows the appearance of the positive electrode 503. The positive electrode 503 includes a positive electrode current collector 501 and a positive electrode active material layer 502.

[0270] in addition, Figure 12C The diagram shows the appearance of the negative electrode 506. The negative electrode 506 includes a negative electrode current collector 504 and a negative electrode active material layer 505.

[0271] Here, the positive electrode 503 and the negative electrode 506 preferably include tab regions for electrically connecting the stacked plurality of positive electrodes to each other and the plurality of negative electrodes to each other. In addition, the tab regions are preferably connected to electrode wires.

[0272] like Figure 12B As shown, the positive electrode 503 preferably has a tab region 281. A portion of the tab region 281 is preferably soldered to the positive electrode wire 510. The tab region 281 preferably has an area exposing the positive current collector 501. By soldering the positive electrode wire 510 to the area exposing the positive current collector 501, the contact resistance can be further reduced. Figure 12BThe example shown is an example in which the positive current collector 501 is exposed in the entire region of the tab region 281, but the tab region 281 may also have a positive active material layer 502 in a portion thereof.

[0273] like Figure 12C As shown, the negative electrode 506 preferably has a tab region 282. A portion of the tab region 282 is preferably soldered to the negative electrode wire 511. The tab region 282 preferably has an area exposing the negative electrode current collector 504. By soldering the negative electrode wire 511 to the area exposing the negative electrode current collector 504, the contact resistance can be further reduced. Figure 12C The example shown is that the negative electrode current collector 504 is exposed throughout the entire region of the tab region 282, but the tab region 282 may also have a negative electrode active material layer 505 in a portion thereof.

[0274] Note that, although Figure 12A An example is shown where the end of the positive electrode 503 is roughly aligned with the end of the negative electrode 506, but the positive electrode 503 may also have a portion located outside the end of the negative electrode 506.

[0275] In battery cell 500, the area of ​​the region of negative electrode 506 that does not overlap with positive electrode 503 should be as small as possible.

[0276] Figure 13A An example is shown where the end of the negative electrode 506 is located inside the positive electrode 503. By adopting this structure, the negative electrode 506 can be made to overlap entirely with the positive electrode 503, or the area of ​​the region of the negative electrode 506 that does not overlap with the positive electrode 503 can be reduced.

[0277] Furthermore, in the battery cell 500, the areas of the positive electrode 503 and the negative electrode 506 are preferably approximately the same. For example, the areas of the positive electrode 503 and the negative electrode 506, which are separated by an insulator 507, are preferably approximately the same. For example, the areas of the positive electrode active material layer 502 and the negative electrode active material layer 505, which are separated by an insulator 507, are preferably approximately the same.

[0278] For example, such as Figure 14A and Figure 14B As shown, the area of ​​the surface of the positive electrode 503 on the side of the separator 507 is preferably approximately the same as the area of ​​the surface of the negative electrode 506 on the side of the separator 507. By making the area of ​​the surface of the positive electrode 503 on the side of the negative electrode 506 approximately the same as the area of ​​the surface of the negative electrode 506 on the side of the positive electrode 503, the area of ​​the negative electrode 506 that does not overlap with the positive electrode 503 can be reduced (or, ideally, this area can be eliminated), and the irreversible capacity of the battery cell 500 can be reduced, so this is preferred. Alternatively, as Figure 14A and Figure 14BAs shown, the area of ​​the surface of the positive electrode active material layer 502 on the side of the insulator 507 is preferably approximately the same as the area of ​​the surface of the negative electrode active material layer 505 on the side of the insulator 507.

[0279] In addition, such as Figure 14A and Figure 14B As shown, the ends of the positive electrode 503 and the negative electrode 506 are preferably substantially aligned. Furthermore, the ends of the positive electrode active material layer 502 and the negative electrode active material layer 505 are preferably substantially aligned.

[0280] also, Figure 13B An example is shown where the end of the positive electrode 503 is located inside the negative electrode 506. By employing this structure, the positive electrode 503 can completely overlap with the negative electrode 506, or the area of ​​the positive electrode 503 that does not overlap with the negative electrode 506 can be reduced. If the end of the negative electrode 506 is located inside the end of the positive electrode 503, current may sometimes concentrate at the end of the negative electrode 506. For example, if the current concentrates on a portion of the negative electrode 506, lithium may sometimes deposit on the negative electrode 506. By reducing the area of ​​the positive electrode 503 that does not overlap with the negative electrode 506, current concentration on a portion of the negative electrode 506 can be suppressed. Therefore, lithium deposition on the negative electrode 506 can be suppressed, which is preferable.

[0281] like Figure 12A As shown, the positive lead 510 is preferably electrically connected to the positive terminal 503. Similarly, the negative lead 511 is preferably electrically connected to the negative terminal 506. The positive lead 510 and the negative lead 511 are exposed to the outside of the outer casing 509 and serve as terminals for electrical contact with the outside.

[0282] The positive current collector 501 and the negative current collector 504 can also serve as terminals for external electrical connection. In this case, the positive current collector 501 and the negative current collector 504 can be configured with a portion of them exposed to the outside of the outer packaging 509 without the use of electrode wires.

[0283] exist Figure 12A In this configuration, the positive electrode wire 510 and the negative electrode wire 511 are arranged on the same side of the battery cell 500, but if... Figure 15 As shown, the positive electrode wire 510 and the negative electrode wire 511 can also be arranged on different sides of the battery cell 500. Thus, in the battery cell of one embodiment of the present invention, the electrode wires can be freely arranged, resulting in a high degree of design freedom. Therefore, the design freedom of products using energy storage devices can be increased. Furthermore, the productivity of products using energy storage devices can be improved.

[0284] The following is a detailed description of the components of a battery cell.

[0285] "Collection of Currents"

[0286] There are no particular restrictions on the materials used as current collectors, as long as they do not cause significant chemical changes and exhibit high conductivity in the energy storage device. Materials used as positive and negative current collectors include, for example, stainless steel, gold, platinum, zinc, iron, nickel, copper, aluminum, titanium, tantalum, manganese, alloys of these metals, or sintered carbon. Additionally, copper or stainless steel coated with carbon, nickel, or titanium can also be used. Furthermore, aluminum alloys with added elements to improve heat resistance, such as silicon, titanium, neodymium, scandium, and molybdenum, can also be used. Additionally, metal elements that react with silicon to form silicides can be used to form current collectors. Examples of metal elements that react with silicon to form silicides include zirconium, titanium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, cobalt, and nickel.

[0287] Irreversible reactions with the electrolyte sometimes occur on the surface of the positive or negative current collector. Therefore, it is preferable that the reactivity of the positive and negative current collectors with the electrolyte be low. For example, by using stainless steel or the like for the positive or negative current collector, the reactivity with the electrolyte can sometimes be further reduced, which is therefore preferred.

[0288] Furthermore, both the positive and negative current collectors can be suitably shaped in various ways, including foil, plate (sheet), mesh, cylindrical, coil, perforated metal mesh, drawn metal mesh, porous, and nonwoven fabric. Additionally, to improve adhesion to the active material layer, both the positive and negative current collectors may have minute irregularities on their surfaces. Moreover, the positive and negative current collectors preferably have a thickness of 5 μm or more and 30 μm or less.

[0289] Alternatively, a primer layer can be formed on a portion of the surface of the current collector. Here, the primer layer refers to a film used to reduce the contact resistance between the current collector and the active material layer, or to improve the tightness between the current collector and the active material layer. Furthermore, the primer layer does not necessarily have to be formed on the entire surface of the current collector; it can also be island-shaped (partially formed). Additionally, the primer layer can also serve as the active material and have capacity. For example, carbon materials can be used as the primer layer. Examples of carbon materials include carbon black such as acetylene black, carbon nanotubes, and graphite. Furthermore, metal layers, layers containing carbon and polymers, and layers containing metals and polymers can also be used as the primer layer.

[0290] "Active Substance Layer"

[0291] The active material layer contains active material. Active material refers only to substances related to the insertion and extraction of ions used as charge carriers; in this specification, the layer containing active material is referred to as the active material layer. In addition to active material, the active material layer may also contain conductive additives and binders.

[0292] The positive electrode active material layer contains one or more positive electrode active materials. The negative electrode active material layer contains one or more negative electrode active materials.

[0293] The positive and negative electrode active materials play a central role in the battery reaction of the energy storage device, releasing and absorbing charge carrier ions. To extend the lifespan of the energy storage device, the active materials are preferably materials with small capacity for irreversible reactions involved in the battery reaction and high charge-discharge efficiency.

[0294] As a positive electrode active material, materials in which charge carrier ions such as lithium ions can be inserted and extracted can be used. Examples of positive electrode active materials include materials with olivine-type crystal structure, layered rock salt-type crystal structure, spinel-type crystal structure, and NASICON-type crystal structure.

[0295] For example, compounds such as LiFeO2, LiCoO2, LiNiO2, LiMn2O4, V2O5, Cr2O5, and MnO2 can be used as positive electrode active materials.

[0296] Materials with an olivine-type crystalline structure include lithium-containing complex phosphates (general formula LiMPO4 (M is one or more of Fe(II), Mn(II), Co(II), and Ni(II))). Typical examples of the general formula LiMPO4 include LiFePO4, LiNiPO4, LiCoPO4, LiMnPO4, and LiFe... a Ni b PO4, LiFe a Co b PO4, LiFe a Mn b PO4, LiNi a Co b PO4, LiNi a Mn b PO4 (a+b is less than 1, 0 < a < 1, 0 < b < 1), LiFe c Ni d Co e PO4, LiFe c Ni d Mn e PO4, LiNi c Co d Mn e PO4 (c+d+e is less than 1, 0<c<1, 0<d<1, 0<e<1), LiFe f Ni g Co h Mn iCompounds such as PO4 (f+g+h+i is less than 1, 0<f<1, 0<g<1, 0<h<1, 0<i<1).

[0297] For example, lithium iron phosphate (LiFePO4) uniformly meets the requirements for positive electrode active materials, such as safety, stability, high capacity density, high potential, and the presence of lithium ions that can be extracted during initial oxidation (charging), so it is preferred.

[0298] By using LiFePO4 as the positive electrode active material, a highly safe energy storage device can be achieved that remains stable even under external loads such as overcharging. Therefore, this type of energy storage device is particularly suitable for portable devices or wearable devices worn on the body.

[0299] Materials with a layered rock salt-type crystalline structure include, for example: lithium cobalt oxide (LiCoO2); LiNiO2; LiMnO2; Li2MnO3; LiNi 0.8 Co 0.2 O2 and other NiCo compounds (general formula LiNi) x Co 1-x O2 (0 < x < 1)); LiNi 0.5 Mn 0.5 O2 and other NiMn-type compounds (general formula LiNi) x Mn 1-x O2 (0 < x < 1)); and LiNi 1 / 3 Mn 1 / 3 Co 1 / 3 O2 and other NiMnCo compounds (also known as NMC, with the general formula LiNi) x Mn y Co 1-x-y O2 (x > 0, y > 0, x + y < 1)). Additionally, Li (Ni) can also be cited. 0.8 Co 0.15 Al 0.05 O2, Li2MnO3-LiMO2 (M is Co, Ni, Mn, etc.)

[0300] In particular, LiCoO2 has advantages such as large capacity, atmospheric stability compared to LiNiO2, and thermal stability compared to LiNiO2, so it is the preferred choice.

[0301] Examples of materials with a spinel-type crystalline structure include LiMn2O4 and Li 1+x Mn 2-x O4 (0 < x < 2), LiMn 2-x Al x O4 (0 < x < 2), LiMn 1.5 Ni 0.5O4, etc.

[0302] When a small amount of lithium nickelate (LiNiO2 or LiNi) is mixed into materials containing manganese such as LiMn2O4 with a spinel-type crystal structure... 1-x M x When O2 (0 < x < 1) (M = Co, Al, etc.) is used, it has the advantages of inhibiting the dissolution of manganese or the decomposition of electrolyte, so it is preferred.

[0303] Alternatively, as a positive electrode active material, Li can be used. (2-j) Lithium-containing composite silicates such as MSiO4 (where M is one or more of Fe(II), Mn(II), Co(II), and Ni(II), 0≤j≤2). As a general formula Li (2-j) A typical example of MSiO4 is Li. (2-j) FeSiO4, Li (2-j) NiSiO4, Li (2-j) CoSiO4, Li (2-j) MnSiO4, Li (2-j) Fe k Ni l SiO4, Li (2-j) Fe k Co l SiO4, Li (2-j) Fe k Mn l SiO4, Li (2-j) Ni k Co l SiO4, Li (2-j) Ni k Mn l SiO4 (k+l is less than 1, 0 < k < 1, 0 < l < 1), Li (2-j) Fe m Ni n Co q SiO4, Li (2-j) Fe m Ni n Mn q SiO4, Li (2-j) Ni m Co n Mn q SiO4 (m+n+q is less than 1, 0<m<1, 0<n<1, 0<q<1), Li (2-j) Fe r Ni s Co t Mn uCompounds such as SiO4 (where r+s+t+u is less than 1, 0<r<1, 0<s<1, 0<t<1, 0<u<1).

[0304] In addition, as a positive electrode active material, it can be used with the general formula A x NASICON-type compounds are represented by M2(XO4)3 (A = Li, Na, Mg, M = Fe, Mn, Ti, V, Nb, Al, X = S, P, Mo, W, As, Si). Examples of NASICON-type compounds include Fe2(MnO4)3, Fe2(SO4)3, and Li3Fe2(PO4)3.

[0305] In addition, as positive electrode active materials, the following can be used: compounds represented by the general formulas Li2MPO4F, Li2MP2O7, and Li5MO4 (M = Fe, Mn); perovskite fluorides such as FeF3; metal chalcogenides (sulfides, selenides, tellurides) such as TiS2 and MoS2; materials with an anti-spinel crystal structure such as LiMVO4 (M = Mn, Co, Ni); and vanadium oxides (V2O5, V6O5, etc.). 13 Materials such as LiV3O8, manganese oxides, and organic sulfur compounds.

[0306] As the positive electrode active material, a material composed of multiple of the above-described materials can also be used. For example, a solid solution composed of multiple of the above-described materials can be used as the positive electrode active material. For example, LiCo can be used. 1 / 3 Mn 1 / 3 Ni 1 / 3 Solid solutions of O2 and Li2MnO3 are used as positive electrode active materials.

[0307] In addition, when the charge carrier ion is an alkali metal ion or an alkaline earth metal ion other than lithium ions, as a positive electrode active material, compounds in which lithium is replaced by charge carriers of alkali metals (e.g., sodium, potassium, etc.) or alkaline earth metals (e.g., calcium, strontium, barium, beryllium, magnesium, etc.) can also be used to replace lithium as charge carriers in the above-mentioned lithium compounds, lithium-containing complex phosphates and lithium-containing complex silicates.

[0308] The average particle size of the primary particles of the positive electrode active material is preferably 5 nm or more and 100 μm or less.

[0309] For example, when olivine-structured lithium-containing composite phosphates are used as the positive electrode active material, the lithium diffusion path is one-dimensional, resulting in a slow lithium diffusion rate. Therefore, when using olivine-structured lithium-containing composite phosphates, to improve the charge / discharge rate, it is preferable to set the average particle size of the positive electrode active material to, for example, 5 nm or more and 1 μm or less. Alternatively, it is preferable to set the specific surface area of ​​the positive electrode active material to 10 m² / s. 2 / g or more and 50m2 / g or less.

[0310] For example, compared with active materials with layered rock salt-type crystal structures, active materials with olivine structures undergo very little structural change during charging and discharging, and their crystal structure is stable. Therefore, they are stable in operation even when overcharging. Thus, when using positive electrode active materials with olivine structures, highly safe energy storage devices can be achieved.

[0311] As a negative electrode active material, carbon-based materials, alloy materials, etc. can be used.

[0312] As carbon-based materials, there are graphite, graphitizing carbon (soft carbon), non-graphitizing carbon (hard carbon), carbon nanotubes, graphene, carbon black, etc. As for graphite, there are mesophase carbon microspheres (MCMB), coke-based artificial graphite, pitch-based artificial graphite, and spheroidized natural graphite, among other artificial graphite. Furthermore, graphite can be shaped into flakes or spheres.

[0313] As graphite, when lithium ions are intercalated within it (during the formation of lithium-graphite intercalation compounds), it exhibits a low potential (above 0.1 V and below 0.3 V vs. Li / Li) similar to that of lithium metal. + Therefore, lithium-ion secondary batteries can exhibit high operating voltages. Furthermore, graphite has the following advantages: higher capacity per unit volume; less volume expansion; lower cost; and higher safety compared to lithium metal, making it a preferred choice.

[0314] When the charge carrier ion is lithium ion, alloy materials can be used, for example, materials containing at least one of Mg, Ca, Ga, Si, Al, Ge, Sn, Pb, As, Sb, Bi, Ag, Au, Zn, Cd, Hg, and In. These elements have a higher capacity than carbon, especially silicon, which has a theoretical capacity of 4200 mAh / g, thereby increasing the capacity of the energy storage device. Examples of alloy materials (compound-based materials) using these elements include Mg₂Si, Mg₂Ge, Mg₂Sn, SnS₂, V₂Sn₃, FeSn₂, CoSn₂, Ni₃Sn₂, Cu₆Sn₅, Ag₃Sn, Ag₃Sb, Ni₂MnSb, CeSb₃, LaSn₃, La₃Co₂Sn₇, CoSb₃, InSb, and SbSn.

[0315] In addition, oxides such as SiO, SnO, SnO2, titanium dioxide (TiO2), and lithium titanium oxide (Li4Ti5O) can be used as negative electrode active materials. 12 ), lithium-graphite intercalation compounds (Li x C6), niobium pentoxide (Nb2O5), tungsten oxide (WO2), molybdenum oxide (MoO2), etc. Here, SiO is a compound containing silicon and oxygen, and when the atomic ratio of silicon to oxygen is silicon:oxygen = α:β, α preferably has an approximate value of β. Here, "having an approximate value" means, for example, that the absolute value of the difference between α and β is preferably 20% or less of the value of β, more preferably 10% or less.

[0316] Furthermore, Li3N-type structures containing lithium and transition metal nitrides can be used as negative electrode active materials. 3-x M x N (M is Co, Ni, or Cu). For example, Li 2.6 Co 0.4 N3 exhibits large charge / discharge capacities (900 mAh / g, 1890 mAh / cm³). 3 Therefore, it is the preferred option.

[0317] When lithium and transition metal nitrides are used as negative electrode active materials, lithium ions are contained in the negative electrode active material. Therefore, they can be combined with materials such as V₂O₅ and Cr₃O₈, which do not contain lithium ions, as positive electrode active materials. Note that when lithium-ion-containing materials are used as positive electrode active materials, lithium and transition metal nitrides can also be used as negative electrode active materials by pre-deintercalating and deintercalating the lithium ions contained in the positive electrode active material.

[0318] Furthermore, materials that induce the conversion reaction can also be used as negative electrode active materials. For example, transition metal oxides that do not alloy with lithium, such as cobalt oxide (CoO), nickel oxide (NiO), and iron oxide (FeO), can be used as negative electrode active materials. Other examples of materials that induce the conversion reaction include oxides such as Fe2O3, CuO, Cu2O, RuO2, and Cr2O3, and CoS. 0.89 Sulfides such as NiS and CuS, nitrides such as Zn3N2, Cu3N, and Ge3N4, phosphides such as NiP2, FeP2, and CoP3, and fluorides such as FeF3 and BiF3.

[0319] The average particle size of the primary particles of the negative electrode active material is preferably 5 nm or more and 100 μm or less.

[0320] The positive electrode active material layer and the negative electrode active material layer may also contain conductive additives.

[0321] As a conductive additive, materials such as carbon, metals, or conductive ceramics can be used. Furthermore, fibrous materials can also be used as conductive additives. The content of the conductive additive relative to the total weight of the active material layer is preferably 1 wt% or more and 10 wt% or less, more preferably 1 wt% or more and 5 wt% or less.

[0322] Conductive additives can form a conductive network within the electrode. These additives also maintain conductive pathways between the active materials of the negative electrode. By adding conductive additives to the active materials, a layer of active materials with high conductivity can be achieved.

[0323] As conductive additives, examples include natural graphite, artificial graphite such as mesophase carbon microspheres, and carbon fibers. For carbon fibers, examples include mesophase pitch-based carbon fibers and isotropic pitch-based carbon fibers. Carbon nanofibers or carbon nanotubes can also be used. For example, carbon nanotubes can be manufactured through vapor phase growth. As conductive additives, examples include carbon materials such as carbon black (acetylene black (AB), etc.), graphite (lead black) particles, graphene, or fullerenes. For example, metal powders or fibers of copper, nickel, aluminum, silver, gold, etc., or conductive ceramic materials can also be used.

[0324] Thin-sheet graphene possesses excellent electrical properties, such as high conductivity, as well as good physical properties, such as flexibility and mechanical strength. Therefore, using graphene as a conductive additive can increase the electrical conductivity between active materials or between active materials and current collectors.

[0325] Note that in this specification, graphene includes monolayer graphene or multilayer graphene with two or more layers but less than 100 layers. Monolayer graphene refers to a thin sheet of carbon molecules having a single atomic layer of π bonds. Additionally, graphene oxide refers to a compound formed by oxidizing the aforementioned graphene.

[0326] Graphene enables surface contact with low contact resistance, and even when thin, it has very high conductivity. Furthermore, even in small quantities, it can efficiently form conductive pathways within the active material layer.

[0327] When using active materials with small average particle sizes, such as those with an average particle size of less than 1 μm, the specific surface area of ​​the active material is large, thus requiring more conductive pathways connecting the active materials to each other. In this case, it is particularly preferable to use graphene, which has very high conductivity and can efficiently form conductive pathways even in small quantities.

[0328] Both the positive electrode active material layer and the negative electrode active material layer may contain binders.

[0329] In this specification, the binder has at least one of the functions of bonding or adhering active materials to each other and bonding or adhering the active material layer to the current collector. Furthermore, the state of the binder sometimes changes during the manufacture of the electrode or battery. For example, the binder may sometimes be in at least one of the states of liquid, solid, and gel. Additionally, during the manufacture of the electrode or battery, the binder may sometimes change from a monomer to a polymer.

[0330] As a binder, water-soluble polymers can be used, for example. Polysaccharides can also be used as water-soluble polymers. Among polysaccharides, cellulose derivatives such as carboxymethyl cellulose (CMC), methyl cellulose, ethyl cellulose, hydroxypropyl cellulose, diacetyl cellulose, and regenerated cellulose, or starch, can be used.

[0331] In addition, styrene-butadiene rubber (SBR), styrene-isoprene-styrene rubber, acrylonitrile-butadiene rubber, butadiene rubber, fluororubber, and ethylene-propylene-diene copolymer can be used as binders. These rubber materials can be combined with the aforementioned water-soluble polymers. Because these rubber materials possess rubber elasticity and are easily stretchable, highly reliable electrodes capable of withstanding stress caused by the expansion and contraction of the active material during charging and discharging, or electrode bending, can be obtained. On the other hand, these rubber materials sometimes have hydrophobic groups and are not easily soluble in water. In this case, because the particles are dispersed in the aqueous solution in an undissolved state, it is sometimes difficult to increase the viscosity of the composition containing the solvent used to form the active material layer (also known as the electrode binder composition) to a suitable viscosity for coating. At this point, by using a water-soluble polymer with high viscosity-adjusting properties, such as polysaccharides, the viscosity of the solution can be appropriately increased, and the water-soluble polymer can be uniformly dispersed with the rubber material. This results in a highly uniform electrode (e.g., an electrode with high uniformity in electrode thickness or electrode resistance).

[0332] As an adhesive, materials such as PVdF, polystyrene, polymethyl methacrylate, polymethyl methacrylate (PMMA), sodium polyacrylate, polyvinyl alcohol (PVA), polyethylene oxide (PEO), polypropylene oxide, polyimide, polyvinyl chloride, polytetrafluoroethylene, polyethylene, polypropylene, isobutylene, polyethylene terephthalate (PET), nylon, polyacrylonitrile (PAN), polyvinyl chloride, ethylene propylene diene monomer (EPDM), polyvinyl acetate, and nitrocellulose can be used.

[0333] As an adhesive, two or more of these materials can also be used in combination.

[0334] The binder content in the total weight of the active material layer is preferably 1 wt% or more and 10 wt% or less, more preferably 2 wt% or more and 8 wt% or less, and even more preferably 3 wt% or more and 5 wt% or less.

[0335] Electrolyte

[0336] As the solvent for electrolyte 508, aprotic organic solvents are preferred. For example, one or more of the following can be used in any combination and ratio: ethylene carbonate (EC), propylene carbonate (PC), butenyl carbonate, vinyl chloride carbonate, vinylene carbonate (VC), γ-butyrolactone, γ-valerolactone, dimethyl carbonate (DMC), diethyl carbonate (DEC), methyl methyl carbonate (EMC), methyl formate, methyl acetate, methyl butyrate, 1,3-dioxane, 1,4-dioxane, dimethoxyethane (DME), dimethyl sulfoxide, diethyl ether, methyl diglyme, acetonitrile, benzonitrile, tetrahydrofuran, sulfolane, sulfonyl lactone, etc.

[0337] By using one or more flame-retardant and non-volatile ionic liquids (room temperature molten salts) as the solvent for the electrolyte, the battery can be prevented from cracking or catching fire even if the internal temperature rises due to internal short circuits or overcharging. Ionic liquids include cations and anions; in one embodiment of the present invention, the ionic liquid includes organic cations and anions. Examples of organic cations used in the electrolyte include aliphatic onium cations such as quaternary ammonium cations, tertiary sulfonium cations, and quaternary phosphonium cations; and aromatic cations such as imidazolium cations and pyridinium cations. Examples of anions used in the electrolyte include monovalent amide anions, monovalent methylide anions, fluorosulfonic acid anions, perfluoroalkyl sulfonic acid anions, tetrafluoroborate anions, perfluoroalkyl borate anions, hexafluorophosphate anions, and perfluoroalkyl phosphate anions.

[0338] Furthermore, as electrolytes dissolved in the aforementioned solvents, when lithium ions are used as charge carriers, LiPF6, LiClO4, LiAsF6, LiBF4, LiAlCl4, LiSCN, LiBr, LiI, Li2SO4, and Li2B can be used in any combination and ratio, for example. 10 Cl 10 Li2B 12 Cl 12One or more of the following lithium salts: LiCF3SO3, LiC4F9SO3, LiC(CF3SO2)3, LiC(C2F5SO2)3, LiN(FSO2)2, LiN(CF3SO2)2, LiN(C4F9SO2)(CF3SO2), and LiN(C2F5SO2)2.

[0339] As the electrolyte for an energy storage device, it is preferable to use a high-purity electrolyte with low content of particulate dust or elements other than the constituent elements of the electrolyte (hereinafter simply referred to as "impurities"). Specifically, the weight ratio of impurities to the electrolyte is 1% or less, preferably 0.1% or less, and more preferably 0.01% or less.

[0340] Additives such as vinylene carbonate (VC), propane sulphol (PS), tert-butylbenzene (TBB), fluoroethylene carbonate (FEC), and LiBOB can also be added to the electrolyte. The concentration of the additives can be set to be above 0.1 wt% and below 5 wt% of the total solvent.

[0341] Alternatively, polymer gel electrolytes, which are formed by the expansion of a polymer by an electrolyte, can also be used.

[0342] As polymers, examples include polymers with a polyoxyethylene structure such as polyethylene oxide (PEO), PVdF, polyacrylonitrile, and copolymers containing them. For example, PVdF-HFP, a copolymer of PVdF and hexafluoropropylene (HFP), can be used. The polymer can also have a porous shape.

[0343] Alternatively, polymerization initiators and crosslinking agents can be added to the electrolyte to induce gelation. For example, polymerization functional groups can be introduced into the cations or anions constituting the ionic liquid, and polymerization initiators can be used to polymerize them, thereby polymerizing the ionic liquid itself. Furthermore, crosslinking agents can be used to gel the polymerized ionic liquid.

[0344] Electrolytes can also be used in combination with solid electrolytes containing inorganic materials such as sulfides or oxides, or solid electrolytes containing polymeric materials such as PEO (polyethylene oxide). For example, a solid electrolyte can also be formed on the surface of the active material layer. When using solid electrolytes and electrolytes in combination, sometimes a separator or spacer is not required.

[0345] Furthermore, when a gelled polymer material is used as the solvent for the electrolyte, safety, such as leakage resistance, is improved. It also enables the energy storage device to be thinner and lighter. For example, polyethylene oxide polymers, polyacrylonitrile polymers, polyvinylidene fluoride polymers, polyacrylate polymers, and polymethacrylate polymers can be used. Additionally, polymers that can gel the electrolyte at room temperature (e.g., 25°C) are preferred. Silicone sealants can also be used. Note that in this specification, for example, polyvinylidene fluoride polymers (PVdF) refer to polymers containing polyvinylidene fluoride, and include poly(vinylidene fluoride-hexafluoropropylene) copolymers, etc.

[0346] Furthermore, qualitative analysis of these polymers can be performed using techniques such as FT-IR (Fourier Transform Infrared Spectroscopy). For example, polyvinylidene fluoride polymers exhibit absorption peaks originating from CF bonds in the FT-IR spectra. Additionally, polyacrylonitrile polymers exhibit absorption peaks originating from C≡N bonds in the FT-IR spectra.

[0347] The Isolation Body

[0348] As the separator 507, paper, nonwoven fabric, glass fiber, ceramic, or synthetic fibers such as nylon (polyamide), vinylon (polyvinyl alcohol fiber), polyester, acrylic, polyolefin, polyurethane, etc. can be used. The separator 507 can also have a single-layer structure or a multilayer structure.

[0349] More specifically, the material used as the separator 507 may be, for example, one or more selected from fluorinated polymers, polyethers such as polyethylene oxide and polypropylene oxide, polyolefins such as polyethylene and polypropylene, polyacrylonitrile, polyvinylidene chloride, polymethyl methacrylate, polymethyl acrylate, polyvinyl alcohol, polymethacrylonitrile, polyvinyl acetate, polyvinylpyrrolidone, polyethyleneimine, polybutadiene, polystyrene, polyisoprene, polyurethane polymers, polyphenylene sulfide and derivatives thereof; cellulose; paper; nonwoven fabric; and glass fiber.

[0350] Outer Packaging

[0351] In the outer packaging 509, the surface in contact with the electrolyte 508, i.e., the inner surface, preferably does not react significantly with the electrolyte 508. When moisture enters the battery cell 500 from the outside, the components of the electrolyte 508 will react with the water. Therefore, the outer packaging 509 preferably has low moisture permeability.

[0352] As the outer packaging 509, for example, a three-layer film structure can be used: a highly flexible metal film such as aluminum, stainless steel, copper, or nickel is placed on a film made of polyethylene, polypropylene, polycarbonate, ionomer, or polyamide, and an insulating synthetic resin film such as polyamide resin or polyester resin is placed on the outer surface of this metal film as the outer packaging. By adopting the above three-layer structure, the permeation of electrolyte or gas can be blocked, while ensuring insulation and electrolyte resistance. A sealed structure can be formed by folding the outer packaging inward and overlapping it, or by overlapping two outer packagings with their insides facing each other and heating them, melting the inner material and welding the two outer packagings together.

[0353] The battery cell 500 can be flexible by using a flexible outer casing 509. When the battery cell is flexible, it can be mounted on at least a portion of a flexible energy storage device or electronic device, and the battery cell 500 can be bent in conjunction with the deformation of the energy storage device or electronic device.

[0354] <Structure Example 2>

[0355] Figure 16A A perspective view of the secondary battery 200 is shown. Figure 16B A top view of the secondary battery 200 is shown.

[0356] Figure 17A Show along Figure 16B The cross-sectional view of the portion indicated by the dashed lines C1-C2 in the figure. Figure 17B Show along Figure 16B The cross-sectional view of the portion indicated by the dashed lines C3-C4 in the diagram. Note that, for clarity, Figure 17A and Figure 17B The abstract shows the constituent elements of a portion.

[0357] The secondary battery 200 includes a positive electrode 211, a negative electrode 215, and a separator 203. The secondary battery 200 also includes a positive electrode wire 221, a negative electrode wire 225, and an outer packaging 207.

[0358] Both the positive electrode 211 and the negative electrode 215 include a current collector and an active material layer. The positive electrode 211 and the negative electrode 215 are arranged such that the active material layers face each other with the separator 203 in between.

[0359] In the electrodes (positive electrode 211 and negative electrode 215) included in the secondary battery 200, it is preferable that the electrode located on the outer diameter side of the bend is longer in the bending direction than the electrode located on the inner diameter side. By adopting this structure, when the secondary battery 200 is bent at a certain curvature, the ends of the positive electrode 211 and the negative electrode 215 can be aligned. That is, the entire region of the positive electrode active material layer of the positive electrode 211 can be arranged opposite to the negative electrode active material layer of the negative electrode 215. Therefore, the positive electrode active material of the positive electrode 211 can contribute to the battery reaction without waste. This increases the capacity per unit volume of the secondary battery 200. This structure is particularly effective when the curvature of the secondary battery 200 is fixed.

[0360] The positive lead 221 is electrically connected to multiple positive terminals 211. The negative lead 225 is electrically connected to multiple negative terminals 215. Both the positive lead 221 and the negative lead 225 include a sealing layer 220.

[0361] The outer packaging 207 covers multiple positive electrodes 211, multiple negative electrodes 215, and multiple separators 203. The secondary battery 200 contains electrolyte (not shown) in the area covered by the outer packaging 207. The secondary battery 200 is sealed by adhesiveting the three sides of the outer packaging 207.

[0362] exist Figure 17A and Figure 17B The illustration shows an example using multiple rectangular insulators 203, with each insulator 203 sandwiched between a pair of positive electrodes 211 and negative electrodes 215; however, the invention is not limited to this. An insulator can also be positioned between the positive and negative electrodes by bending (also referred to as corrugated) or winding a sheet-like insulator.

[0363] For example, Figures 19A to 19D The manufacturing method of the secondary battery 200 is shown. Figure 18 The following is shown when using the above manufacturing method: Figure 16B The cross-sectional view of the portion indicated by the dotted lines C1-C2 in the figure.

[0364] First, a negative electrode 215 is set on the isolation body 203. Figure 19A At this time, the negative electrode 215 is arranged such that the negative electrode active material layer included in the negative electrode 215 overlaps with the separator 203.

[0365] Next, the insulator 203 is folded and overlapped onto the negative electrode 215. Then, the positive electrode 211 is overlapped onto the insulator 203. Figure 19BAt this time, the positive electrode 211 is arranged such that the positive electrode active material layer included in the positive electrode 211 overlaps with the separator 203 and the negative electrode active material layer. In addition, when an electrode with an active material layer formed on one surface of the current collector is used, the positive electrode 211 and the negative electrode 215 are arranged so that the positive electrode active material layer of the positive electrode 211 and the negative electrode active material layer of the negative electrode 215 are opposite to each other with the separator 203 in between.

[0366] When a heat-welding material such as polypropylene is used for the separator 203, electrode misalignment during manufacturing can be suppressed by heat-welding the overlapping areas of the separators 203 and then overlapping another electrode onto the separator 203. Specifically, it is preferable to use areas of the separators 203 that do not overlap with the negative electrode 215 or the positive electrode 211, and which overlap with each other, for example, with... Figure 19B The area shown in region 203a is thermally welded.

[0367] By repeating the above steps, such as Figure 19C As shown, the positive electrode 211 and the negative electrode 215 can be stacked with the separator 203 sandwiched between them.

[0368] Note that multiple negative electrodes 215 and multiple positive electrodes 211 can also be alternately sandwiched in the space between the pre-folded and repeatedly folded isolation body 203.

[0369] Next, as Figure 19C As shown, the isolator 203 covers multiple positive electrodes 211 and multiple negative electrodes 215.

[0370] Furthermore, such as Figure 19D As shown, by overlapping the regions of the isolation bodies 203, for example Figure 19D The area 203b shown is thermally welded, and multiple positive electrodes 211 and multiple negative electrodes 215 are covered and bundled together by the insulator 203.

[0371] Alternatively, multiple positive electrodes 211, multiple negative electrodes 215, and the isolator 203 can be bundled together using binding materials.

[0372] Because the positive electrode 211 and the negative electrode 215 are overlapped through the above steps, an insulator 203 includes a region sandwiched between the positive electrode 211 and the negative electrode 215, and a region configured to cover the plurality of positive electrodes 211 and the plurality of negative electrodes 215.

[0373] In other words, Figure 18 and Figure 19D The secondary battery 200 shown includes an insulator 203, a portion of which is folded. Multiple positive electrodes 211 and multiple negative electrodes 215 are sandwiched within the folded area of ​​the insulator 203.

[0374] <Structure Example 3>

[0375] Figure 20A A perspective view of the secondary battery 250 is shown. Figure 20B A top view of the secondary battery 250 is shown. Additionally, Figure 20C1 A cross-sectional view of the first electrode assembly 230 is shown. Figure 20C2 A cross-sectional view of the second electrode assembly 231 is shown.

[0376] The secondary battery 250 includes a first electrode assembly 230, a second electrode assembly 231, and a separator 203. The secondary battery 250 also includes a positive electrode wire 221, a negative electrode wire 225, and an outer packaging 207.

[0377] like Figure 20C1 As shown, in the first electrode assembly 230, a positive electrode 211a, an insulator 203, a negative electrode 215a, an insulator 203, and a positive electrode 211a are stacked sequentially. Both the positive electrode 211a and the negative electrode 215a include active material layers on the two surfaces of the current collector.

[0378] like Figure 20C2 As shown, in the second electrode assembly 231, a negative electrode 215a, an insulator 203, a positive electrode 211a, an insulator 203, and a negative electrode 215a are stacked sequentially. Both the positive electrode 211a and the negative electrode 215a include active material layers on the two surfaces of the current collector.

[0379] In other words, in the first electrode assembly 230 and the second electrode assembly 231, the positive electrode and the negative electrode are arranged opposite each other with an active material layer separated by an insulator 203.

[0380] The positive lead 221 is electrically connected to multiple positive terminals 211. The negative lead 225 is electrically connected to multiple negative terminals 215. Both the positive lead 221 and the negative lead 225 include a sealing layer 220.

[0381] Figure 21 Show along Figure 20B An example of a cross-sectional view of the portion indicated by the dashed lines C3-C4. Note that, for clarity, Figure 21 The abstract shows the constituent elements of a portion.

[0382] like Figure 21 As shown, the secondary battery 250 has a structure in which a plurality of first electrode assemblies 230 and a plurality of second electrode assemblies 231 are covered by a wound separator 203.

[0383] The outer packaging 207 covers multiple first electrode assemblies 230, multiple second electrode assemblies 231, and a separator 203. The secondary battery 200 contains electrolyte (not shown) in the area covered by the outer packaging 207. The secondary battery 200 is sealed by adhesiveting the three sides of the outer packaging 207.

[0384] For example, Figures 22A to 22D The manufacturing method of the secondary battery 250 is shown.

[0385] First, a first electrode assembly 230 is disposed on the isolator 203. Figure 22A ).

[0386] Next, the isolator 203 is folded and overlapped onto the first electrode assembly 230. Then, two second electrode assemblies 231 are overlapped onto the first electrode assembly 230 with respect to the isolator 203. Figure 22B ).

[0387] Next, the isolator 203 is wound around the two second electrode assemblies 231. Then, the two first electrode assemblies 230 are overlapped on top of the two second electrode assemblies 231, with the isolator 203 in between. Figure 22C ).

[0388] Next, the isolator 203 is wound around the two first electrode assemblies 230. Figure 22D ).

[0389] Because multiple first electrode assemblies 230 and multiple second electrode assemblies 231 are overlapped through the above process, these electrode assemblies are disposed between the spacers 203 that are wound into a spiral shape.

[0390] In addition, preferably, the outer side of the outermost electrode does not include an active material layer.

[0391] In addition, although Figure 20C1 and Figure 20C2 The diagram shows an electrode assembly comprising three electrodes and two separators; however, one embodiment of the invention is not limited to this and may include four or more electrodes and three or more separators. Increasing the number of electrodes further increases the capacity of the secondary battery 250. Alternatively, it may include two electrodes and one separator. When the number of electrodes is smaller, a secondary battery with higher resistance to bending can be manufactured. Furthermore, although in Figure 21The diagram shows a secondary battery 250 comprising three first electrode assemblies 230 and two second electrode assemblies 231. However, the invention is not limited to this and may include more electrode assemblies. Increasing the number of electrode assemblies can further increase the capacity of the secondary battery 250. Furthermore, the secondary battery 250 may also include fewer electrode assemblies. A smaller number of electrode assemblies can also result in a secondary battery with higher resistance to bending.

[0392] in addition, Figure 23 Show along Figure 20B Other examples of cross-sectional views of the portions indicated by the dashed lines C3-C4 in the diagram. For example... Figure 23 As shown, the insulator 203 can also be disposed between the first electrode assembly 230 and the second electrode assembly 231 by folding the insulator 203 into a corrugated tube shape.

[0393] This implementation method can be appropriately combined with other implementation methods.

[0394] Implementation Method 3

[0395] In this embodiment, a light-emitting device for an electronic device that can be used in one aspect of the present invention will be described with reference to the accompanying drawings. Although this embodiment primarily illustrates a light-emitting device using organic EL elements, one aspect of the present invention is not limited thereto.

[0396] <Structure Example 1>

[0397] Figure 24A A plan view of the light-emitting device is shown. Figure 24B Show along Figure 24A An example of a cross-sectional view between the dashed lines D1-D2 in the diagram. The light-emitting device shown in Structural Example 1 is a top-emitting type light-emitting device using a color filter method. In this embodiment, the light-emitting device can, for example, use sub-pixels of three colors—R (red), G (green), and B (blue)—to represent a color structure; use sub-pixels of four colors—R, G, B, and W (white)—to represent a color structure; or use sub-pixels of four colors—R, G, B, and Y (yellow)—to represent a color structure, etc. There are no particular restrictions on the color elements, and colors other than RGBWY can also be used, such as cyan or magenta.

[0398] Figure 24A The light-emitting device shown includes a light-emitting part 804, a driving circuit part 806, and an FPC 808.

[0399] Figure 24BThe illustrated light-emitting device includes: a flexible substrate 701, an adhesive layer 703, an insulating layer 705, multiple transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, multiple light-emitting elements, an insulating layer 821, an adhesive layer 822, a coloring layer 845, a light-shielding layer 847, an insulating layer 715, an adhesive layer 713, and a flexible substrate 711. The adhesive layer 822, insulating layer 715, adhesive layer 713, and flexible substrate 711 allow visible light to pass through. The light-emitting elements and transistors included in the light-emitting portion 804 and the driving circuit portion 806 are sealed by the flexible substrate 701, flexible substrate 711, and adhesive layer 822.

[0400] In the light-emitting section 804, a transistor 820 and a light-emitting element 830 are disposed on a flexible substrate 701, separated by an adhesive layer 703 and an insulating layer 705. The light-emitting element 830 includes a lower electrode 831 on the insulating layer 817, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source or drain electrode of the transistor 820. The end of the lower electrode 831 is covered by the insulating layer 821. The lower electrode 831 preferably reflects visible light. The upper electrode 835 allows visible light to pass through.

[0401] Furthermore, the light-emitting portion 804 includes a coloring layer 845 overlapping with the light-emitting element 830 and a light-shielding layer 847 overlapping with the insulating layer 821. An adhesive layer 822 is filled between the light-emitting element 830 and the coloring layer 845.

[0402] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor constituting the transistor. Furthermore, to reduce surface unevenness caused by the transistor, the insulating layer 817 is preferably selected as an insulating layer with planarization function. When an organic material is used as the insulating layer 817, there is a concern that impurities such as moisture may penetrate the transistor or light-emitting element 830 from the outside of the light-emitting device through the insulating layer 817 exposed at the end of the light-emitting device. The penetration of impurities can degrade the transistor or light-emitting element 830, thereby leading to the deterioration of the light-emitting device. Therefore, as... Figure 24B As shown, by providing an opening in the insulating layer 817 to reach the inorganic film (here, the insulating layer 815), the light-emitting device is preferably designed to prevent impurities such as moisture from easily reaching the transistor or light-emitting element 830 even if they intrude from the outside of the light-emitting device. Alternatively, the insulating layer 817 may be formed not at the end of the light-emitting device.

[0403] In the drive circuit section 806, a plurality of transistors are disposed on the flexible substrate 701 with an adhesive layer 703 and an insulating layer 705 in between. Figure 24B One of the multiple transistors included in the drive circuit section 806 is shown.

[0404] An adhesive layer 703 is used to bond the insulating layer 705 to the flexible substrate 701. Additionally, an adhesive layer 713 is used to bond the insulating layer 715 to the flexible substrate 711. By using a highly moisture-resistant film as at least one of the insulating layers 705 and 715, impurities such as water can be prevented from entering the light-emitting element 830 or the transistor 820, thus improving the reliability of the light-emitting device, and is therefore preferred.

[0405] The conductive layer 857 is electrically connected to an external input terminal that transmits signals or potentials from the outside to the drive circuit section 806. Here, an example is shown where an FPC 808 is provided as an external input terminal. To prevent an increase in the number of processes, the conductive layer 857 is preferably manufactured using the same material and the same processes as the electrodes or wiring used in the light-emitting section or drive circuit section. Here, an example is shown where the conductive layer 857 is manufactured using the same material and the same processes as the electrodes constituting the transistor 820.

[0406] exist Figure 24B In the illustrated light-emitting device, FPC808 is located on a flexible substrate 711. Connector 825 is connected to conductive layer 857 through openings in the flexible substrate 711, adhesive layer 713, insulating layer 715, adhesive layer 822, insulating layer 817, and insulating layer 815. Connector 825 is also connected to FPC808. FPC808 and conductive layer 857 are electrically connected via connector 825. When conductive layer 857 overlaps with flexible substrate 711, by creating an opening in the flexible substrate 711 (or using a substrate with an opening), conductive layer 857, connector 825, and FPC808 can be electrically connected.

[0407] Show Figure 24A and Figure 24B The example shown is a variation of the light-emitting device. Figure 25A A plan view of the light-emitting device is shown. Figure 25B Show Figure 25A An example of a cross-sectional view between the dotted lines D3 and D4 in the diagram. Figure 26A Show along Figure 25A An example of a cross-sectional view between the dotted lines D5 and D6 in the diagram.

[0408] Figure 25A and Figure 25B The illustrated light-emitting device is an example where the flexible substrate 701 and flexible substrate 711 have different dimensions. The FPC 808 is located on the insulating layer 715 and does not overlap the flexible substrate 711. The connector 825 is connected to the conductive layer 857 through openings provided in the insulating layer 715, the adhesive layer 822, the insulating layer 817, and the insulating layer 815. Because openings are not required in the flexible substrate 711, there are no restrictions on the material of the flexible substrate 711.

[0409] Furthermore, the insulating layer formed using an organic resin with low gas barrier or moisture resistance is preferably not exposed at the end of the light-emitting device. This structure prevents impurities from entering from the sides of the light-emitting device. For example, as... Figure 25B and Figure 26A As shown, the insulating layer 817 may not be provided at the end of the light-emitting device.

[0410] in addition, Figure 26B A modified example of the light-emitting part 804 is shown.

[0411] Figure 26B The light-emitting device shown includes insulating layers 817a and 817b, and a conductive layer 856 is included on insulating layer 817a. The source electrode or drain electrode of transistor 820 is electrically connected to the lower electrode of light-emitting element 830 through conductive layer 856.

[0412] Figure 26B The light-emitting device shown includes spacers 823 on the insulating layer 821. By providing spacers 823, the spacing between the flexible substrate 701 and the flexible substrate 711 can be adjusted.

[0413] Figure 26B The light-emitting device shown includes a protective layer 849 covering a coloring layer 845 and a light-shielding layer 847. An adhesive layer 822 is filled between the light-emitting element 830 and the protective layer 849.

[0414] also, Figure 26C A modified example of the light-emitting element 830 is shown.

[0415] In addition, such as Figure 26C As shown, the light-emitting element 830 may also include an optical adjustment layer 832 between the lower electrode 831 and the EL layer 833. A light-transmitting conductive material is preferably used as the optical adjustment layer 832. Due to the combination of the color filter (coloring layer) and the microcavity structure (optical adjustment layer), light with high color purity can be extracted from the light-emitting device of one embodiment of the present invention. The thickness of the optical adjustment layer varies according to the emitted color of each sub-pixel.

[0416] <Structure Example 2>

[0417] Figure 26D The light-emitting device shown includes a flexible substrate 701, an adhesive layer 703, an insulating layer 705, a conductive layer 814, a conductive layer 857a, a conductive layer 857b, a light-emitting element 830, an insulating layer 821, an adhesive layer 713, and a flexible substrate 711.

[0418] The conductive layers 857a and 857b are external connection electrodes of the light-emitting device and can be electrically connected to FPC, etc.

[0419] The light-emitting element 830 includes a lower electrode 831, an EL layer 833, and a upper electrode 835. The end of the lower electrode 831 is covered by an insulating layer 821. The light-emitting element 830 can adopt a bottom-emitting structure, a top-emitting structure, or a dual-emitting structure. The electrode, substrate, insulating layer, etc. on the light-extracting side allow visible light to pass through. The conductive layer 814 is electrically connected to the lower electrode 831.

[0420] The light extraction structure in the substrate on the light extraction side can include a hemispherical lens, a microlens array, a thin film with an uneven structure, or a light-diffusing thin film. For example, a substrate with a light extraction structure can be formed by bonding the lens or thin film to a resin substrate using an adhesive having the same refractive index as the substrate, the lens, or the thin film.

[0421] Although the conductive layer 814 is not necessarily required, it is preferred to be provided because it can suppress the voltage drop caused by the resistance of the lower electrode 831. Alternatively, for the same purpose, a conductive layer electrically connected to the upper electrode 835 may be provided on the insulating layer 821, the EL layer 833, or the upper electrode 835.

[0422] The conductive layer 814 can be formed in a single layer or in a stack using materials selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, and aluminum, or alloys with these materials as the main components. The thickness of the conductive layer 814 can be set to, for example, 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0.5 μm or less.

[0423] <Structure Example 3>

[0424] Figure 25A A plan view of the light-emitting device is shown. Figure 27A Show along Figure 25A An example of a cross-sectional view between the dashed lines D3 and D4. The light-emitting device shown in structural example 3 is a bottom-emitting type light-emitting device using a color filter method.

[0425] Figure 27A The light-emitting device shown includes: a flexible substrate 701, an adhesive layer 703, an insulating layer 705, multiple transistors, a conductive layer 857, an insulating layer 815, a coloring layer 845, insulating layers 817a and 817b, a conductive layer 856, multiple light-emitting elements, an insulating layer 821, an adhesive layer 713, and a flexible substrate 711. The flexible substrate 701, adhesive layer 703, insulating layer 705, insulating layer 815, insulating layer 817a, and insulating layer 817b allow visible light to pass through.

[0426] In the light-emitting section 804, transistors 820 and 824, and a light-emitting element 830 are disposed on a flexible substrate 701, separated by an adhesive layer 703 and an insulating layer 705. The light-emitting element 830 includes a lower electrode 831 on the insulating layer 817b, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source or drain electrode of the transistor 820. The end of the lower electrode 831 is covered by the insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 allows visible light to pass through. There are no particular limitations on the position of the coloring layer 845 overlapping the light-emitting element 830; for example, it can be disposed between insulating layers 817a and 817b, or between insulating layers 815 and 817a.

[0427] In the drive circuit section 806, a plurality of transistors are disposed on the flexible substrate 701 with an adhesive layer 703 and an insulating layer 705 in between. Figure 27A Two of the multiple transistors included in the drive circuit section 806 are shown.

[0428] An adhesive layer 703 is used to bond the insulating layer 705 to the flexible substrate 701. By using a highly moisture-resistant film as the insulating layer 705, impurities such as water can be prevented from entering the light-emitting element 830, transistor 820, or transistor 824, thus improving the reliability of the light-emitting device, which is therefore preferred.

[0429] The conductive layer 857 is electrically connected to an external input terminal that transmits signals or potentials from the outside to the drive circuit section 806. Here, an example is shown where an FPC 808 is provided as an external input terminal. Here, an example is shown where the conductive layer 857 is manufactured using the same material and the same process as the conductive layer 856.

[0430] <Structure Example 4>

[0431] Figure 25A A plan view of the light-emitting device is shown. Figure 27B Show along Figure 25A An example of a cross-sectional view between the dashed lines D3 and D4. The light-emitting device shown in structural example 4 is a top-emitting type light-emitting device that uses a separate coloring method.

[0432] Figure 27B The light-emitting device shown includes: a flexible substrate 701, an adhesive layer 703, an insulating layer 705, multiple transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, multiple light-emitting elements, an insulating layer 821, a spacer 823, an adhesive layer 713, and a flexible substrate 711. The adhesive layer 713 and the flexible substrate 711 allow visible light to pass through.

[0433] exist Figure 27BIn the illustrated light-emitting device, the connector 825 is located on the insulating layer 815. The connector 825 is connected to the conductive layer 857 through an opening provided in the insulating layer 815. Additionally, the connector 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected via the connector 825.

[0434] <An example of materials>

[0435] Next, we will describe the materials that can be used in the light-emitting device. Note that sometimes the components already described earlier in this specification are omitted.

[0436] Materials such as glass, quartz, organic resin, metal, alloy, and semiconductor can be used as substrates. The substrate on the side from which the light-emitting element is extracted uses a material that allows the light to pass through.

[0437] In particular, a flexible substrate is preferred. For example, an organic resin or a glass, metal, or alloy with a thickness that allows for flexibility can be used. For example, the thickness of the flexible substrate is preferably 1 μm or more and 200 μm or less, more preferably 1 μm or more and 100 μm or less, further preferably 10 μm or more and 50 μm or less, and even more preferably 10 μm or more and 25 μm or less.

[0438] Since organic resin has a lower specific gravity than glass, using organic resin as a flexible substrate makes the light-emitting device lighter than using glass as a flexible substrate, which is therefore preferred.

[0439] The substrate is preferably made of a highly resilient material. This allows for the creation of a light-emitting device that is highly impact-resistant and less prone to damage. For example, by using an organic resin substrate, a thin metal substrate, or an alloy substrate, a lightweight and less easily damaged light-emitting device can be achieved compared to using a glass substrate.

[0440] Metallic and alloy materials are preferred because they have high thermal conductivity and can easily conduct heat to the entire substrate, thus suppressing local temperature rise in the light-emitting device. The thickness of the substrate made of metallic or alloy materials is preferably 10 μm or more and 200 μm or less, more preferably 20 μm or more and 50 μm or less.

[0441] There are no particular restrictions on the materials used to form the metal or alloy substrate; for example, alloys of metals such as aluminum, copper, nickel, aluminum alloys, or stainless steel are preferred. Silicon is an example of a material that can form a semiconductor substrate.

[0442] Furthermore, when a material with high thermal emissivity is used as the substrate, the surface temperature rise of the light-emitting device can be suppressed, thereby preventing damage to the light-emitting device or a decrease in reliability. For example, the substrate can also be a stacked structure of a metal substrate and a layer with high thermal emissivity (e.g., a metal oxide or ceramic material can be used).

[0443] Materials that are flexible and transparent include, for example, polyester resins such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin (nylon, aromatic polyamide, etc.), polycyclic olefin resin, polystyrene resin, polyamide-imide resin, polyvinyl chloride resin, and polytetrafluoroethylene (PTFE) resin. Materials with a low coefficient of linear expansion are particularly preferred, such as polyamide-imide resin, polyimide resin, polyamide resin, and PET. Additionally, substrates in which resin is impregnated into the fiber body (also called prepregs) or substrates in which inorganic fillers are mixed into organic resins can also be used to reduce the coefficient of linear expansion.

[0444] The flexible substrate can be a stacked structure, wherein layers using the aforementioned materials are stacked with a hard coating (e.g., a silicon nitride layer, etc.) that protects the surface of the device from damage or other damage, or layers of materials that can disperse pressure (e.g., an aramid resin layer, etc.).

[0445] Flexible substrates can also be stacked layers. In particular, by employing a structure with glass layers, the barrier properties against water or oxygen can be improved, thus providing a highly reliable light-emitting device.

[0446] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are stacked from the side closest to the light-emitting element can be used. The thickness of this glass layer is set to 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. This thickness of glass layer achieves both high water or oxygen barrier properties and flexibility. Furthermore, the thickness of the organic resin layer is set to 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By incorporating this organic resin layer, mechanical strength can be improved by suppressing breakage or cracks in the glass layer. By applying this composite material of glass and organic resin to the substrate, a highly reliable flexible light-emitting device can be realized.

[0447] As an adhesive layer, various curing adhesives can be used, such as UV-curing resins, reactive curing adhesives, thermosetting adhesives, and anaerobic adhesives. Alternatively, adhesive sheets can also be used.

[0448] Additionally, a desiccant can be included in the adhesive layer. For example, a substance that adsorbs moisture through chemical adsorption, such as an oxide of an alkaline earth metal (calcium oxide or barium oxide, etc.), can be used. Alternatively, a substance that adsorbs moisture through physical adsorption, such as zeolite or silica gel, can be used. When a desiccant is included in the resin, it can prevent impurities such as moisture from penetrating the functional elements, thereby improving the reliability of the light-emitting device, and is therefore preferred.

[0449] Furthermore, by including fillers or light-scattering components with high refractive indices in the adhesive layer, the light extraction efficiency of the light-emitting element can be improved. For example, titanium oxide, barium oxide, zeolite, zirconium, etc., can be used.

[0450] The insulating layers 705 and 715 are preferably made of insulating films with high moisture resistance. Alternatively, the insulating layers 705 and 715 preferably have the function of preventing impurities from diffusing into the light-emitting element.

[0451] Examples of insulating films with high moisture resistance include silicon nitride films, silicon oxynitride films, and aluminum nitride films, which contain both nitrogen and silicon. Additionally, silicon oxide films, silicon oxynitride films, and aluminum oxide films can also be used.

[0452] For example, the water vapor transmission rate of a moisture-resistant insulating film is set to 1×10⁻⁶. -5 [g / (m 2 ·day)] or less, preferably 1×10 -6 [g / (m 2 ·day)] or less, preferably 1×10 -7 [g / (m 2 ·day)] or less, is further preferably 1×10 -8 [g / (m 2 ·day)] below.

[0453] In the light-emitting device, at least one of the insulating layers 705 and 715 needs to allow light emission from the light-emitting element to pass through. Preferably, the average transmittance of light with wavelengths of 400 nm or higher and 800 nm or lower is higher in the insulating layer on the side of the insulating layer 705 or 715 that allows light emission from the light-emitting element to pass through than in the other insulating layer.

[0454] There are no particular restrictions on the structure of the transistors in the light-emitting device. For example, interleaved or deinterleaved transistors can be used. Furthermore, top-gate or bottom-gate transistor structures can also be used. There are no particular restrictions on the semiconductor materials used for the transistors; examples include silicon, germanium, and organic semiconductors. Alternatively, oxide semiconductors containing at least one of indium, gallium, and zinc, such as In-Ga-Zn metal oxides, can also be used.

[0455] There are no particular restrictions on the crystallinity of the semiconductor material used in transistors; amorphous semiconductors or crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a portion of crystalline regions) can be used. When using crystalline semiconductors, the degradation of transistor characteristics can be suppressed, so they are preferred.

[0456] In one aspect of the invention, CAAC-OS (CAxis-aligned crystalline oxide semiconductor) is preferably used as the semiconductor material for the transistor. Unlike amorphous semiconductors, CAAC-OS has a low defect energy level density, thus improving the reliability of the transistor. Furthermore, because CAAC-OS has unobservable grain boundaries, stable and uniform films can be formed over large areas, and it is less prone to cracking in the CAAC-OS film due to stress generated when bending flexible light-emitting devices.

[0457] CAAC-OS is a crystalline oxide semiconductor with its c-axis oriented approximately perpendicular to the film surface. It has also been confirmed that oxide semiconductors, in addition to single-crystal structures, possess various crystalline structures, such as nano-crystal (nc) structures, which are aggregates of nanocrystals at the nanoscale. The crystallinity of CAAC-OS is lower than that of the single-crystal structure but higher than that of the nc structure.

[0458] To achieve transistor characteristic stabilization, a base film is preferably provided. As the base film, a single layer or stack of inorganic insulating films such as silicon oxide, silicon nitride, silicon oxynitride, and silicon oxynitride can be used. The base film can be formed by sputtering, CVD (Chemical Vapor Deposition) methods (plasma CVD, thermal CVD, MOCVD (Metal Organic Chemical Vapor Deposition), etc.), ALD (Atomic Layer Deposition), coating, printing, etc. Note that a base film may be omitted if not needed. In the above structural examples, the insulating layer 705 can also serve as the base film of the transistor.

[0459] As a light-emitting element, a self-emissive element can be used, and within this category, elements whose brightness is controlled by current or voltage can be used. For example, light-emitting diodes (LEDs), organic EL elements, and inorganic EL elements can be used.

[0460] The light-emitting element can employ a top-emitting structure, a bottom-emitting structure, or a double-sided emitting structure. A conductive film that allows visible light to pass through is used as the electrode on the light-extracting side. Conversely, a conductive film that reflects visible light is preferably used as the electrode on the non-light-extracting side.

[0461] As a conductive film that allows visible light to pass through, indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide (ZnO), and zinc oxide with gallium addition can be used, for example. Alternatively, it can be formed by making metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (e.g., titanium nitride) thin enough to be transparent. Furthermore, a laminate of the above materials can be used as the conductive film. For example, when using a laminate of silver and magnesium alloys with ITO, conductivity can be improved, so it is preferred. Graphene can also be used.

[0462] As a conductive film that reflects visible light, materials such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or alloys containing these materials, can be used. Additionally, lanthanum, neodymium, or germanium can be added to the aforementioned materials or alloys. Furthermore, the conductive film reflecting visible light can be formed using alloys containing aluminum, such as aluminum-titanium alloys, aluminum-nickel alloys, aluminum-neodymium alloys, aluminum, nickel, and lanthanum alloys (Al-Ni-La), silver-copper alloys, silver, palladium, and copper alloys (Ag-Pd-Cu, also referred to as APC), or silver-magnesium alloys. Alloys containing silver and copper have high heat resistance and are therefore preferred. Furthermore, by laminating a metal film or metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and the metal oxide film include titanium and titanium oxide. Alternatively, a conductive film that allows visible light to pass through can be laminated with a film made of a metallic material. For example, a laminated film of silver and ITO, or a laminated film of silver and magnesium alloy and ITO can be used.

[0463] Each electrode can be formed using vapor deposition or sputtering. Alternatively, it can be formed using inkjet printing, screen printing, or plating.

[0464] When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835, holes are injected into the EL layer 833 from the anode side, while electrons are injected into the EL layer 833 from the cathode side. The injected electrons and holes recombine in the EL layer 833, thereby causing the light-emitting material contained in the EL layer 833 to emit light.

[0465] The EL layer 833 includes at least a light-emitting layer. In addition to the light-emitting layer, the EL layer 833 may also include a layer containing a material with high hole injection capacity, a material with high hole transport capacity, a hole blocking material, a material with high electron transport capacity, a material with high electron injection capacity, or a bipolar material (a material with both high electron transport capacity and high hole transport capacity).

[0466] The EL layer 833 can be composed of low-molecular-weight compounds, high-molecular-weight compounds, or inorganic compounds. The layers constituting the EL layer 833 can be formed by methods such as vapor deposition (including vacuum vapor deposition), transfer printing, printing, inkjet printing, and coating.

[0467] The light-emitting element 830 may also contain two or more light-emitting materials. This allows for the creation of a light-emitting element that emits white light, for example. White light emission can be achieved by selecting light-emitting materials in a manner that makes the emission of each of the two or more light-emitting materials complementary colors. For example, light-emitting materials that emit light in the form of R (red), G (green), B (blue), Y (yellow), or O (orange) can be used, or light-emitting materials that emit light containing spectral components of two or more of R, G, and B. For example, light-emitting materials that emit blue light and light-emitting materials that emit yellow light can be used. In this case, the emission spectrum of the light-emitting material emitting yellow light preferably includes spectral components of green and red. Furthermore, the emission spectrum of the light-emitting element 830 preferably has two or more peaks in the wavelength range of the visible region (e.g., 350 nm or more and 750 nm or less, or 400 nm or more and 800 nm or less).

[0468] The EL layer 833 can also have multiple light-emitting layers. In the EL layer 833, multiple light-emitting layers can be stacked in contact with each other, or multiple light-emitting layers can be stacked with a separation layer in between. For example, a separation layer can also be provided between the fluorescent light-emitting layer and the phosphorescent light-emitting layer.

[0469] A separation layer is provided to prevent, for example, energy transfer (especially triplet energy transfer) from the excited state of the phosphorescent material generated in the phosphorescent layer to the fluorescent material in the fluorescent layer due to the Dexter mechanism. The separation layer may have a thickness of a few nm. Specifically, it is 0.1 nm or more and 20 nm or less, or 1 nm or more and 10 nm or less, or 1 nm or more and 5 nm or less. The separation layer comprises a single material (preferably a bipolar material) or multiple materials (preferably hole transport materials and electron transport materials).

[0470] The separation layer can also be formed using the material contained in the light-emitting layer that contacts the separation layer. This facilitates the fabrication of the light-emitting element and reduces the driving voltage. For example, when the phosphorescent light-emitting layer is composed of a host material, an auxiliary material, and a phosphorescent material (guest material), the separation layer can also be formed using the host material and the auxiliary material. In other words, the separation layer has regions that do not contain phosphorescent material, while the phosphorescent light-emitting layer has regions that do contain phosphorescent material. Therefore, the separation layer and the phosphorescent light-emitting layer can be deposited separately by selecting whether or not phosphorescent material is present. By employing this structure, the separation layer and the phosphorescent light-emitting layer can be formed in the same chamber. This reduces manufacturing costs.

[0471] The light-emitting element 830 can be a single unit including one EL layer, or it can be a series element including multiple EL layers stacked with charges between them.

[0472] The light-emitting element is preferably disposed between a pair of highly moisture-resistant insulating films. This prevents impurities such as moisture from penetrating the light-emitting element, thereby suppressing a decrease in the reliability of the light-emitting device. Specifically, as described above, when highly moisture-resistant insulating films are used as insulating layers 705 and 715, the light-emitting element is located between a pair of highly moisture-resistant insulating films, thereby suppressing a decrease in the reliability of the light-emitting device.

[0473] As insulating layer 815, inorganic insulating films such as silicon oxide film, silicon oxynitride film, and aluminum oxide film can be used, for example. As insulating layers 817, 817a, and 817b, organic materials such as polyimide, acrylic resin, polyamide, polyimide amide, and benzocyclobutene resin can be used, for example. Low-dielectric-constant materials (low-k materials) can also be used. Furthermore, multiple insulating films can be stacked to form each insulating layer.

[0474] The insulating layer 821 is formed using organic or inorganic insulating materials. For example, polyimide resin, polyamide resin, acrylic resin, silicone resin, epoxy resin, or phenolic resin can be used as the resin. In particular, it is preferable to use a photosensitive resin material to form an opening on the lower electrode 831, and the sidewalls of the opening are formed as curved inclined surfaces.

[0475] There are no particular restrictions on the method for forming the insulating layer 821. For example, photolithography, sputtering, vapor deposition, droplet jetting (inkjet printing, etc.), and printing (screen printing, offset printing, etc.) can be used.

[0476] The spacer 823 can be formed using inorganic insulating materials, organic insulating materials, or metallic materials. For example, various materials suitable for the aforementioned insulating layer can be used as inorganic or organic insulating materials. Furthermore, titanium, aluminum, etc., can be used as metallic materials. By electrically connecting the spacer 823 containing the conductive material to the upper electrode 835, the potential drop caused by the resistance of the upper electrode 835 can be suppressed. Additionally, the spacer 823 can be in the shape of a positive cone or an inverse cone.

[0477] As a conductive layer for a light-emitting device, used as an electrode or wiring in a transistor, or as an auxiliary electrode in a light-emitting element, a single layer or stack of metallic materials such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, scandium, or alloys containing the aforementioned elements can be used. Alternatively, the conductive layer can be formed using conductive metal oxides. As conductive metal oxides, indium oxide (In₂O₃, etc.), tin oxide (SnO₂, etc.), ZnO, ITO, indium zinc oxide (In₂O₃-ZnO, etc.), or materials containing silicon oxide in these metal oxide materials can be used.

[0478] A coloring layer is a colored layer that allows light of a specific wavelength range to pass through. For example, color filters that allow light of the red, green, blue, and yellow wavelength ranges to pass through can be used. Each coloring layer is formed at the desired location using various materials and employing methods such as printing, inkjet printing, or etching using photolithography. Furthermore, a transparent or white resin can be disposed overlapping the light-emitting element in the white sub-pixel.

[0479] A light-shielding layer is disposed between adjacent coloring layers. The light-shielding layer blocks light emitted from adjacent light-emitting elements, thereby suppressing color mixing between adjacent light-emitting elements. Here, by distributing the coloring layer with its ends overlapping the light-shielding layer, light leakage can be suppressed. The light-shielding layer can be made of a material that blocks light emitted from the light-emitting elements; for example, a black matrix can be formed using a resin material containing metallic materials, pigments, or dyes. Furthermore, by distributing the light-shielding layer in an area outside the light-emitting parts, such as the drive circuit section, unintentional light leakage caused by waveguide light, etc., can be suppressed, which is therefore preferable.

[0480] In addition, a protective layer can be provided that covers the coloring layer and the light-shielding layer. By providing a protective layer, impurities contained in the coloring layer can be prevented from diffusing into the light-emitting element. The protective layer is made of a material that transmits light emitted from the light-emitting element. For example, inorganic insulating films such as silicon nitride films and silicon oxide films, or organic insulating films such as acrylic resin films and polyimide films can be used. A laminated structure of organic and inorganic insulating films can also be used.

[0481] Furthermore, when the adhesive layer material is applied to the coloring layer and the light-shielding layer, the material used as the protective layer is preferably a material with high wettability to the adhesive layer material. For example, as the protective layer, an oxide conductive film such as an ITO film or a metal film such as an Ag film with a thickness sufficient to be transparent is preferably used.

[0482] By using a material with high wettability to the adhesive layer material as the protective layer, the adhesive layer material can be applied evenly. This prevents air bubbles from being introduced when bonding a pair of substrates, thus preventing display defects.

[0483] As a connector, various anisotropic conductive films (ACF) or anisotropic conductive pastes (ACP) can be used.

[0484] As described above, light-emitting devices, display devices, input / output devices, etc., can be applied to one aspect of the present invention. For example, display elements include EL elements (including organic and inorganic EL elements, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.), liquid crystal elements, electrophoretic elements, and display elements using MEMS (microelectromechanical systems).

[0485] Furthermore, the light-emitting device according to one aspect of the present invention can be used as both a display device and a lighting device. For example, it can also be used as a light source such as a backlight or a front light source, that is, as a lighting device for a display device.

[0486] This implementation method can be appropriately combined with other implementation methods.

[0487] Implementation Method 4

[0488] In this embodiment, an input / output device for an electronic device that can be used in one aspect of the present invention is described with reference to the accompanying drawings. Regarding the components of the input / output device that are the same as those of the light-emitting device described in Embodiment 3, please refer to the above description. Furthermore, although a touch panel using a light-emitting element is illustrated in this embodiment, the invention is not limited thereto.

[0489] <Structure Example 1>

[0490] Figure 28A This is a top view of the input / output device. Figure 28B It is along Figure 28A The cross-sectional view of the dashed-dot line AB and the dashed-dot line CD. Figure 28C It is along Figure 28A The cross-sectional view of the dashed line EF in the figure.

[0491] Figure 28A The touch panel 390 shown includes a display unit 301 (which also serves as an input unit), a scan line driving circuit 303g (1), an imaging pixel driving circuit 303g (2), an image signal line driving circuit 303s (1), and an imaging signal line driving circuit 303s (2).

[0492] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308.

[0493] Pixel 302 comprises multiple sub-pixels. Each sub-pixel includes a light-emitting element and pixel circuitry.

[0494] The pixel circuit supplies power to drive the light-emitting element. The pixel circuit is electrically connected to wiring that supplies selection signals. Furthermore, the pixel circuit is electrically connected to wiring that supplies image signals.

[0495] The scan line drive circuit 303g(1) can supply a selection signal to the pixel 302.

[0496] The image signal line driving circuit 303s(1) can supply image signals to the pixel 302.

[0497] The imaging pixel 308 can be used to construct a touch sensor. Specifically, the imaging pixel 308 can detect fingers or the like touching the display unit 301.

[0498] Imaging pixel 308 includes photoelectric conversion elements and imaging pixel circuitry.

[0499] The imaging pixel circuit drives the photoelectric conversion element. The imaging pixel circuit is electrically connected to wiring that supplies control signals. Furthermore, the imaging pixel circuit is electrically connected to wiring that supplies power potential.

[0500] Examples of control signals include signals that select the imaging pixel circuit for reading the recorded imaging signal, signals that initialize the imaging pixel circuit, and signals that determine the time for the imaging pixel circuit to detect light.

[0501] The imaging pixel driving circuit 303g(2) can supply control signals to the imaging pixel 308.

[0502] The imaging signal line driving circuit 303s(2) can read out the imaging signal.

[0503] like Figure 28B and Figure 28CAs shown, the touch panel 390 includes a flexible substrate 701, an adhesive layer 703, an insulating layer 705, a flexible substrate 711, an adhesive layer 713, and an insulating layer 715. Furthermore, the flexible substrate 701 and the flexible substrate 711 are bonded together by the adhesive layer 360.

[0504] The flexible substrate 701 and the insulating layer 705 are bonded together by an adhesive layer 703. Furthermore, the flexible substrate 711 and the insulating layer 715 are bonded together by an adhesive layer 713. For the materials that can be used for the substrate, adhesive layer, and insulating layer, please refer to Embodiment 3.

[0505] Pixel 302 includes sub-pixels 302R, 302G, and 302B. Figure 28C Additionally, sub-pixel 302R includes a light-emitting module 380R, sub-pixel 302G includes a light-emitting module 380G, and sub-pixel 302B includes a light-emitting module 380B.

[0506] For example, subpixel 302R includes a light-emitting element 350R and pixel circuitry. The pixel circuitry includes a transistor 302t capable of supplying power to the light-emitting element 350R. Furthermore, the light-emitting module 380R includes the light-emitting element 350R and optical elements (e.g., a coloring layer 367R that allows red light to pass through).

[0507] The light-emitting element 350R includes a lower electrode 351R, an EL layer 353, and an upper electrode 352 stacked sequentially. Figure 28C ).

[0508] The EL layer 353 includes a first EL layer 353a, an intermediate layer 354 and a second EL layer 353b stacked in sequence.

[0509] In addition, a microcavity structure can be set in the light-emitting module 380R to efficiently extract light of a specific wavelength. Specifically, an EL layer can also be set between a film that reflects visible light and a semi-reflective and semi-transparent film, which are set for efficient extraction of specific light.

[0510] For example, the light-emitting module 380R includes an adhesive layer 360 that contacts the light-emitting element 350R and the coloring layer 367R. The coloring layer 367R is located at a position overlapping with the light-emitting element 350R. Thus, a portion of the light emitted by the light-emitting element 350R passes through the adhesive layer 360 and the coloring layer 367R, and... Figure 28B or Figure 28C The arrow in the image is emitted to the outside of the light-emitting module 380R.

[0511] The touch panel 390 includes a light-shielding layer 367BM. The light-shielding layer 367BM is provided in such a way that it surrounds a colored layer (e.g., colored layer 367R).

[0512] The touch panel 390 includes an anti-reflective layer 367p that overlaps with the display unit 301. For example, a circular polarizer can be used as the anti-reflective layer 367p.

[0513] The touch panel 390 includes an insulating layer 321. The insulating layer 321 covers transistors 302t and the like. Alternatively, the insulating layer 321 can be used as a layer to planarize the surface of pixel circuits or imaging pixel circuits. Furthermore, it is preferable that the transistors 302t and the like are covered by an insulating layer capable of suppressing the diffusion of impurities into them.

[0514] The touch panel 390 includes a partition wall 328 that overlaps with the end of the lower electrode 351R. An isolator 329 is provided on the partition wall 328 for controlling the spacing between the flexible substrate 701 and the flexible substrate 711.

[0515] The image signal line driving circuit 303s(1) includes a transistor 303t and a capacitor 303c. Furthermore, the driving circuit can be formed on the same substrate as the pixel circuit using the same manufacturing process. Figure 28B As shown, transistor 303t may have a second gate 304 disposed on insulating layer 321. This allows the second gate 304 to be electrically connected to the gate of transistor 303t, and also allows different potentials to be applied to the second gate 304 and the gate of transistor 303t. Alternatively, if needed, the second gate 304 can be disposed in transistor 308t or transistor 302t, etc.

[0516] Imaging pixel 308 includes a photoelectric conversion element 308p and imaging pixel circuitry. The imaging pixel circuitry can detect the light incident on the photoelectric conversion element 308p. The imaging pixel circuitry includes a transistor 308t. For example, a pin-type photodiode can be used for the photoelectric conversion element 308p.

[0517] The touch panel 390 includes wiring 311 capable of supplying signals, and terminals 319 are provided on the wiring 311. An FPC 309 capable of supplying signals such as image signals and synchronization signals is electrically connected to the terminals 319. The FPC 309 may also be mounted with a printed circuit board (PWB).

[0518] Alternatively, transistors 302t, 303t, and 308t can be manufactured using the same manufacturing process. Alternatively, these transistors can be manufactured using different processes.

[0519] <Structure Example 2>

[0520] Figure 29A and Figure 29B This is a perspective view of the touch panel 525. Note that typical components are shown for ease of understanding. Figure 30A and Figure 30B It is along Figure 29A The cross-sectional view of the dashed line X1-X2 in the figure.

[0521] like Figure 29A and Figure 29B As shown, the touch panel 525 includes a display unit 521, a scan line driving circuit 303g (1), and a touch sensor 595, etc. In addition, the touch panel 525 includes a flexible substrate 701, a flexible substrate 711, and a flexible substrate 590.

[0522] The touch panel 525 includes a plurality of pixels and a plurality of wirings 311. The plurality of wirings 311 are capable of supplying signals to the pixels. The plurality of wirings 311 are guided on the outer periphery of the flexible substrate 701, a portion of which forms a terminal 319. The terminal 319 is electrically connected to the FPC 529(1).

[0523] The touch panel 525 includes a touch sensor 595 and a plurality of wirings 598. The plurality of wirings 598 are electrically connected to the touch sensor 595. The plurality of wirings 598 are guided on the outer periphery of a flexible substrate 590, a portion of which forms a terminal. This terminal is electrically connected to the FPC 529(2). Note that, for ease of understanding, in Figure 29B The electrodes and wiring of the touch sensor 595, which are disposed on the back side of the flexible substrate 590 (the side opposite to the flexible substrate 701), are shown by solid lines in the middle.

[0524] As a touch sensor 595, a capacitive touch sensor can be used, for example. Types of capacitive touch sensors include surface-type capacitive touch sensors and projection-type capacitive touch sensors. Here, the application of a projection-type capacitive touch sensor is shown.

[0525] As projection-type capacitive touch sensors, there are self-capacitance touch sensors and mutual-capacitance touch sensors. Mutual-capacitance touch sensors are preferred because they can perform multi-point detection simultaneously.

[0526] In addition, various sensors that can detect the proximity or contact of objects such as fingers can be used for the touch sensor 595.

[0527] The projection-type capacitive touch sensor 595 includes electrodes 591 and 592. Electrode 591 is electrically connected to any one of a plurality of wirings 598, and electrode 592 is electrically connected to the other one of the plurality of wirings 598.

[0528] like Figure 29A and Figure 29B As shown, electrode 592 has a shape in which multiple quadrilaterals are repeatedly arranged in one direction and connected to each other at the corners.

[0529] Electrode 591 is quadrilateral and is repeatedly arranged in directions intersecting the extension direction of electrode 592. Multiple electrodes 591 are not necessarily arranged orthogonally to a single electrode 592, but can also be arranged with an angle of less than 90° between them.

[0530] Wiring 594 is arranged to intersect with electrode 592. Wiring 594 electrically connects two electrodes 591 sandwiching one of electrodes 592. It is preferable to minimize the area of ​​the intersection between electrode 592 and wiring 594. This reduces the area of ​​the region where electrodes are not located, thus reducing the non-uniformity of light transmittance. Consequently, it reduces the brightness non-uniformity of light transmitted through touch sensor 595.

[0531] The shapes of electrodes 591 and 592 are not limited to these, and can have various shapes.

[0532] like Figure 30A As shown, the touch panel 525 includes a flexible substrate 701, an adhesive layer 703, an insulating layer 705, a flexible substrate 711, an adhesive layer 713, and an insulating layer 715. The flexible substrates 701 and 711 are bonded together by the adhesive layer 360.

[0533] The adhesive layer 597 bonds the flexible substrate 590 and the flexible substrate 711 together in such a way that the touch sensor 595 overlaps with the display unit 521. The adhesive layer 597 is transparent.

[0534] Electrodes 591 and 592 are formed using a light-transmitting conductive material. As a light-transmitting conductive material, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and gallium-added zinc oxide can be used. Alternatively, a graphene-containing film can be used. The graphene-containing film can be formed, for example, by reducing graphene oxide, which is formed in a film-like state. As a reduction method, heating or similar methods can be employed.

[0535] Note that materials used for conductive films such as electrodes 591, 592, and wiring 594—that is, materials constituting the wiring or electrodes of the touch panel—can include, for example, transparent conductive films containing indium oxide, tin oxide, zinc oxide, etc. (e.g., ITO). Furthermore, materials used for the wiring or electrodes constituting the touch panel preferably have low resistance values. For example, silver, copper, aluminum, carbon nanotubes, graphene, metal halides (silver halides, etc.) can be used. Additionally, metal nanowires composed of multiple conductors that are extremely fine (e.g., a few nanometers in diameter) can also be used. Alternatively, metal meshes that form a mesh of conductors can be used. For example, Ag nanowires, Cu nanowires, Al nanowires, Ag meshes, Cu meshes, and Al meshes can be used. For example, when Ag nanowires are used as wiring or electrodes constituting the touch panel, visible light transmittance of 89% or more and a sheet resistance of 40 Ω / square or more and 100 Ω / square or less can be achieved. Furthermore, since materials such as metal nanowires, metal meshes, carbon nanotubes, and graphene, which are examples of materials that can be used to form the wiring or electrodes of the aforementioned touch panel, have high transmittance to visible light, they can also be used as electrodes for display elements (e.g., pixel electrodes or common electrodes).

[0536] After the transparent conductive material is formed on the flexible substrate 590 by sputtering, the unwanted parts can be removed by various patterning techniques such as photolithography to form electrodes 591 and 592.

[0537] Electrodes 591 and 592 are covered by an insulating layer 593. Openings leading to electrodes 591 are provided in the insulating layer 593, and wiring 594 electrically connects adjacent electrodes 591. Because the aperture ratio of the touch panel can be increased, a light-transmitting conductive material is preferably used for wiring 594. Furthermore, materials with higher conductivity than electrodes 591 and 592 can reduce resistance, making wiring 594 suitable for this purpose.

[0538] The touch sensor 595 can be protected by providing an insulating layer that covers the insulating layer 593 and the wiring 594.

[0539] Connection layer 599 electrically connects wiring 598 to FPC529(2).

[0540] The display unit 521 includes a plurality of pixels arranged in a matrix. Since the structure of the pixels is the same as in structural example 1, a description is omitted.

[0541] In addition, such as Figure 30BAs shown, a touch panel can also be constructed using two substrates, flexible substrate 701 and flexible substrate 711, without using flexible substrate 590. Flexible substrate 711 is bonded to insulating layer 715 by adhesive layer 713, and touch sensor 595 is disposed in contact with insulating layer 715. A coloring layer 367R and a light-shielding layer 367BM are disposed in contact with insulating layer 589 covering touch sensor 595. Alternatively, the coloring layer 367R or the light-shielding layer 367BM can be disposed in contact with wiring 594 without insulating layer 589.

[0542] <Structure Example 3>

[0543] Figures 31A to 31C This is a cross-sectional view of the touch panel 525B. The touch panel 525B described in this embodiment differs from the touch panel 525 of structural example 2 in that the supplied image information is displayed on the side where the transistor is located; and the touch sensor is located on the side of the flexible substrate 701 of the display section. Here, only the different structures will be described in detail; for parts where the same structure can be used, the above description will be used.

[0544] The color layer 367R is located at the position overlapping with the light-emitting element 350R. Additionally, Figure 31A The light-emitting element 350R shown emits light toward the side where the transistor 302t is located. As a result, a portion of the light emitted by the light-emitting element 350R passes through the coloring layer 367R and is emitted to the outside of the light-emitting module 380R in the direction of the arrow in the figure.

[0545] The touch panel 525B includes a light-shielding layer 367BM in the direction of emitted light. The light-shielding layer 367BM is provided in such a way that it surrounds a colored layer (e.g., colored layer 367R).

[0546] Touch sensor 595 is disposed on the side of flexible substrate 701, and not on the side of flexible substrate 711. Figure 31A ).

[0547] The adhesive layer 597 is used to bond the flexible substrate 590 to the flexible substrate 701 in such a way that the touch sensor 595 overlaps with the display. The adhesive layer 597 is transparent.

[0548] exist Figure 31A and Figure 31B The diagram shows the structure when a bottom-gate transistor is applied to the display unit 521.

[0549] For example, semiconductor layers containing oxide semiconductors, amorphous silicon, etc., can be applied to Figure 31A Transistor 302t and transistor 303t are shown.

[0550] For example, semiconductor layers containing polysilicon, etc., can be applied to Figure 31B Transistor 302t and transistor 303t are shown.

[0551] exist Figure 31C The diagram shows the structure when a top-gate transistor is used.

[0552] For example, a semiconductor layer containing polycrystalline silicon or a monocrystalline silicon film transferred from a monocrystalline silicon substrate can be applied to... Figure 31C Transistor 302t and transistor 303t are shown.

[0553] As described in Embodiment 1, an electronic device of one aspect of the present invention overlaps a display panel and a power storage device. Figure 32A and Figure 32B An example of a cross-sectional view is shown in the case of an overlapping touch panel and a thin secondary battery. Figure 32A The touch panel shown has the same Figure 30A The touch panel 525 shown has the same structure. Figure 32A The thin secondary battery shown has the same characteristics as... Figure 14A The battery cell 500 shown has the same structure. Figure 32B The touch panel shown has the same Figure 30B The touch panel 525 shown has the same structure. Figure 32B The thin secondary battery shown has the same characteristics as... Figure 14B The battery cell 500 shown has the same structure.

[0554] Although Figure 32A and Figure 32B The illustration shows an example where the flexible substrate 701 of the touch panel contacts the outer casing 509 of the battery cell; however, the invention is not limited to this. Adhesives or the like can also be used to fix the touch panel and the battery cell together. Furthermore, a circuit board or similar component can be included between the touch panel and the battery cell.

[0555] Figure 33A and Figure 33B Show Figure 32A The example shows a modified structure of a touch panel with a thin secondary battery, including sub-pixel 302R and scan line driving circuit 303g (1).

[0556] Figure 33A An example is shown where the insulating layer 705 and the outer packaging 509 are bonded together by the adhesive layer 703. Thus, in one aspect of the invention, transistors and light-emitting elements manufactured on a substrate can also be transferred onto a secondary battery.

[0557] In addition, Figure 33BThe example shown is an example in which a flexible substrate 701 and an insulating layer 705 are bonded together by an adhesive layer 703a and a flexible substrate 701 and an outer packaging body 509 are bonded together by an adhesive layer 703b.

[0558] Figures 34A to 34C The transistor 848 shown is one of the top-gate transistors that includes a back gate electrode. Figure 34A This is a top view of the transistor 848. Figure 34B It is along Figure 34A The cross-sectional view between the dotted and dashed lines X1 and X2 in the diagram. Figure 34C It is along Figure 34A A cross-sectional view of the area between the dotted and dashed lines Y1 and Y2.

[0559] In transistor 848, a semiconductor layer 742 is disposed on the protrusion of insulating layer 772. By disposing of semiconductor layer 742 on the protrusion of insulating layer 772, the sidewalls of semiconductor layer 742 can also be covered by electrode 743. That is, transistor 848 has a structure in which the semiconductor layer 742 can be surrounded by the electric field of electrode 743. Thus, the transistor structure in which the channeled semiconductor layer is surrounded by the electric field of conductive film is called a surrounded channel (S-channel) structure. In addition, transistors with S-channel structure are also called "S-channel type transistors" or "S-channel transistors".

[0560] In the s-channel structure, the channel can also be formed entirely (bulk) within the semiconductor layer 742. The s-channel structure increases the transistor's leakage current, thereby resulting in a higher on-state current. Furthermore, the electric field of the electrode 743 can deplete the entire channel formation region within the semiconductor layer 742. Therefore, the s-channel structure can further reduce the transistor's off-state current.

[0561] Electrode 723 is disposed on substrate 771 having an insulating surface. Electrode 723 can be used as a back gate electrode.

[0562] An electrode 744a disposed on insulating layer 729 is electrically connected to semiconductor layer 742 through an opening 747c disposed on insulating layers 726, 728, and 729. Additionally, an electrode 744b disposed on insulating layer 729 is electrically connected to semiconductor layer 742 through an opening 747d disposed on insulating layers 726, 728, and 729.

[0563] Electrode 743, disposed on insulating layer 726, is electrically connected to electrode 726 through openings 747a and 747b disposed in insulating layers 726 and 772. Thus, electrode 746 and electrode 723 are supplied with the same potential. Alternatively, one or both openings 747a and 747b may be omitted. Without openings 747a and 747b, different potentials can be supplied to electrode 723 and electrode 746.

[0564] In addition, as semiconductors used for transistors with s-channel structures, examples include oxide semiconductors, or silicon such as polycrystalline silicon or monocrystalline silicon transposed from a monocrystalline silicon substrate.

[0565] This implementation method can be appropriately combined with other implementation methods.

[0566] Implementation Method 5

[0567] In this embodiment, refer to Figures 35A to 40D An electronic device according to one aspect of the present invention.

[0568] One aspect of the present invention is an electronic device comprising a display panel, a power storage device, circuitry, and a sealed body. The display panel has the function of displaying information using power supplied from the power storage device. The circuitry includes an antenna. The circuitry has the function of wirelessly charging the power storage device. The sealed body internally includes the display panel, the power storage device, and the circuitry. At least a portion of the sealed body has the function of allowing visible light to pass through. The electronic device of one aspect of the present invention can be worn on the arm, or a structure connected to the sealed body can be worn on the arm.

[0569] By using a sealing element, the display panel, energy storage device, and circuitry, which are the sealed components, can be protected, thereby enabling highly durable electronic devices. Furthermore, by using a highly waterproof sealing element, highly waterproof electronic devices that can be used underwater can be achieved.

[0570] In the manufacture of an electronic device according to one aspect of the present invention, the display panel and the energy storage device can be sealed by covering them with a sealing body. This allows for the easy manufacture of highly reliable electronic devices. Furthermore, by making the sealing body into a shape that is easy to wear, such as a strap, the sealing body itself can be worn on the body and used as a wearable device.

[0571] One aspect of the present invention provides an electronic device that can charge a storage device via contactless power transmission. Therefore, the storage device does not need to be removed from the sealed enclosure during charging. Consequently, the sealed enclosure can completely cover the entire sealed body, further improving the waterproofness of the electronic device.

[0572] In another embodiment of the invention, one or more of the constituent elements of the sealed body may also be flexible. For example, the display panel or the energy storage device may also be flexible, and both the display panel and the energy storage device may be flexible.

[0573] Because the sealing body is flexible, it can protect the display panel and the energy storage device without reducing their flexibility, even when at least one of them is flexible. Thus, by using one aspect of the present invention, a flexible electronic device with high reliability and safety can be achieved. When the electronic device is flexible, it provides advantages such as easy installation and removal, and a comfortable wearing experience for the user, making it preferable.

[0574] In the electronic device of this embodiment, the entire sealed body is covered by a flexible sealing body. By covering the sealed body with a flexible sealing body, an electronic device that is not easily damaged even when repeatedly bent and stretched can be realized.

[0575] Furthermore, by using a heat-resistant sealing material, the display panel can be driven even at high temperatures. Additionally, the electronic device can be reversibly bent even at high temperatures. In this case, a heat-resistant display panel and a power storage device are even more preferable.

[0576] In this embodiment, the case of using the display device described in detail in Embodiment 6 as a display panel will be described as an example. Note that the structure described in Embodiment 1 can be applied to the electronic device of this embodiment.

[0577] In one aspect of the display device of the present invention, by switching the display element (selecting the display element) according to the ambient brightness or the amount of external light incident on the display device, the user can fully see the display of the device regardless of the ambient brightness. For example, in a bright environment, it is preferable to use an external light-emitting and reflective liquid crystal element for display. For example, in a dim environment, it is preferable to use a light-emitting element such as an organic EL element for display. The display device may also use multiple display elements simultaneously.

[0578] An electronic device according to one aspect of the present invention preferably includes a sensor for detecting the brightness of the ambient light in which the electronic device is used. For example, a photodiode or image sensor is preferred. The electronic device preferably automatically switches the display element based on the brightness detected by the sensor. The convenience of the electronic device is improved when the display state of the display device can be automatically changed according to the brightness of the ambient light.

[0579] In one aspect of the electronic device of the present invention, the user of the electronic device is preferably able to manually switch the elements used for display.

[0580] Next, the electronic device of this embodiment will be described in detail.

[0581] Figure 35A A perspective view of electronic device 101 is shown. Furthermore, Figure 35B A top view of electronic device 101 is shown. Figure 35C Show along Figure 35B Cross-sectional view between the dotted line A and B in the diagram. Figure 35F Show along Figure 35B Cross-sectional view between the dotted and dashed lines CD.

[0582] Electronic device 101 includes a display panel 10, a power storage device 20, a circuit 30, and a sealing body 40. Figure 35A In the above, the portion of the display panel 10 that the user can see is referred to as the display unit 15 of the electronic device 101.

[0583] <Display Unit 15>

[0584] Electronic device 101 includes a display unit 15. Figure 35A , Figure 35C and Figure 35F In the above, the display unit 15 is planar. Figure 35C In the diagram, the side indicated by the arrow is the display side of the electronic device 101.

[0585] The display section 15 can also be flexible. That is, the curvature of the display section 15 can be changed by deforming it. Figure 35A The state shown changes. Alternatively, the display section 15 can be fixed in a planar state or in a curved state.

[0586] When the flexibility of the display panel is lower than that of the sealing body, the radius of curvature of the display portion 15 hardly changes when the electronic device of one aspect of the present invention is worn on the arm, etc. Therefore, the end of the electronic device preferably has flexibility.

[0587] ,Seal body 40>

[0588] Electronic device 101 includes a sealing body 40. Figure 35A In this context, the sealing body 40 has a curved surface. Additionally, the sealing body 40 can also be derived from, for example... Figure 35A The deformation of the curved surface shown is as follows: Figure 35B The flat state is shown. Since the details of the sealing body 40 that can be used in electronic device 101 are the same as in Embodiment 1, the description is omitted.

[0589] The electronic device 101 contains a display panel 10, a power storage device 20, and a circuit 30 stacked on top of each other. As long as the user can see the display on the display panel 10, there are no particular restrictions on their stacking order. In addition, they do not necessarily need to be stacked, and two or more of the display panel 10, power storage device 20, and circuit 30 can be arranged on the same plane.

[0590] For example, such as Figure 35F As shown, the electronic device 101 may also include a circuit 30 on the power storage device 20, and a display panel 10 on the circuit 30. When the sealing body 40 is worn on the arm, by adopting a structure in which the power storage device 20, the circuit 30, and the display panel 10 are stacked sequentially from one side of the arm, the user can see the display on the display panel 10. Alternatively, a structure in which the circuit 30, the power storage device 20, and the display panel 10 are stacked sequentially from one side of the arm may also be adopted.

[0591] The space sealed by the sealing body 40 is preferably in a reduced pressure atmosphere or an inert atmosphere. By using this atmosphere, the reliability of the display panel 10 and the like can be improved compared to the case where the space is in an atmospheric atmosphere.

[0592] Figure 35D and Figure 35E Is with Figure 35C Different along Figure 35B The cross-sectional view between the dotted line AB in the diagram. Additionally, Figure 35G Is with Figure 35F Different along Figure 35B Cross-sectional view between the dotted and dashed lines CD.

[0593] Although Figure 35C and Figure 35F The diagram shows an example where the sealing body 40 covers the side of the sealed body on the front (display surface) side of the electronic device 101, and the back of the electronic device 101 is flat, but it is not limited to this. Figure 35D and Figure 35G As shown, the sealing body 40 on the front (display surface) side and the sealing body 40 on the back side of the electronic device 101 can cover the side of the sealed body, and both the front and back sides of the electronic device 101 have portions that protrude from other parts (such as strips). Additionally, as... Figure 35E As shown, the sealing body 40 on one side of the back of the electronic device 101 can also cover the side of the sealed body, and the front (display surface) of the electronic device 101 can also be flat. Additionally, as... Figure 35C As shown, the portion of the electronic device 101 including the display unit 15 may protrude beyond other portions (such as the belt). Furthermore, as... Figure 35E As shown, the rear side of the electronic device 101 may also have a part that protrudes from other parts (such as the belt).

[0594] Figures 36A to 39D An electronic device different from electronic device 101 is shown.

[0595] Figure 36A A perspective view of electronic device 101a is shown. Additionally, Figure 37A A top view of electronic device 101a is shown. Figure 37B Show along Figure 37A The cross-sectional view between the dotted and dashed lines EF in the diagram. Figure 37F A cross-sectional view between the dashed-dot line GH is shown. Furthermore, Figure 36B A perspective view of electronic device 101b is shown.

[0596] Figure 36A and Figure 36B An example is shown where the display section 15 is a plane. Figure 36A Examples of energy storage device 20 and circuit 30 having flexibility and curved surfaces. Figure 36B This is an example of an energy storage device 20 having flexibility and a curved surface. Figure 36A and Figure 36B There are no restrictions on the flexibility of the display panel 10. Figure 36B In this context, there are no restrictions on the flexibility of circuit 30.

[0597] The electronic device 101a includes a display unit 15. Furthermore, the electronic device 101a includes a sealed body 40. Inside the sealed body 40, the electronic device 101a includes a display panel 10, a power storage device 20, and a circuit 30.

[0598] In electronic device 101a, display panel 10 overlaps with energy storage device 20, circuit 30 overlaps with energy storage device 20, and display panel 10 does not overlap with circuit 30. Thus, the sealed body can also be located in the portion of the sealed body 40 that serves as a strap. For example, when using a flexible energy storage device 20, the energy storage device 20 can be arranged in a wide area inside the sealed body 40, thereby enabling an electronic device that can be used for a long time once fully charged.

[0599] As detailed in Embodiment 1, at least one of a buoyancy material and a rubber-elastic component may also be included inside the sealing body 40.

[0600] Figures 37C to 37E Is with Figure 37B Different along Figure 37A The cross-sectional view between the dotted and dashed lines EF in the diagram.

[0601] For example, preferred in Figure 37B , Figure 37C , Figure 37D and Figure 37F The space 42 shown includes buoyancy material or a component with rubber elasticity.

[0602] like Figure 37B As shown, the display panel 10 can also contact the energy storage device 20, and the circuit 30 can also contact the energy storage device 20. Additionally, as... Figure 37C As shown, the display panel 10 may not be in contact with the energy storage device 20. Similarly, the circuit 30 may not be in contact with the energy storage device 20. Furthermore, the display panel 10, the energy storage device 20, and the circuit 30 may also be in contact with the sealing body 40. Figure 37B and Figure 37C An example is shown where the energy storage device 20 is in contact with the sealing body 40. Figure 37C An example is shown where the display panel 10 is in contact with the sealing body 40. Furthermore, as... Figure 37D As shown, the sealing body 40 may not be in contact with the sealed body. In addition, if two or more of the display panel 10, the energy storage device 20, the circuit 30 and the sealing body 40 have parts that are in contact with each other, they can be fixed by adhesives or the like, or they can be in contact in a way that allows them to move relative to each other.

[0603] In addition, such as Figure 37E As shown, the interior of the sealed body 40 can also be in a sufficiently depressurized atmosphere. This prevents the display panel 10, the energy storage device 20, and the circuitry 30 from deteriorating due to impurities. Furthermore, it enables the electronic device to be thinner and lighter.

[0604] Although Figure 37B and Figure 37F The diagram shows an example where the sealing body 40 covers the side of the sealed body on the front (display surface) side of the electronic device 101a, and the back of the electronic device 101a is flat, but it is not limited to this. Figure 37D As shown, the sealing body 40 on the front (display surface) side and the sealing body 40 on the back side of the electronic device 101a can cover the side of the sealed body, and both the front and back sides of the electronic device 101a have portions that protrude from other parts (such as the strip).

[0605] Figure 38A A perspective view of electronic device 101c is shown. Furthermore, Figure 39A A top view of electronic device 101c is shown. Figure 39B Show along Figure 39A The cross-sectional view between the dotted and dashed lines J and K in the diagram.

[0606] Electronic device 101c includes a sealed body 40 and a strap 155. The sealed body 40 contains a display panel 10, circuitry 30, and a power storage device 20, etc. The sealed body 40 is connected to the strap 155. Preferably, the sealed body 40 and the strap 155 are detachably connected.

[0607] In addition, such as Figure 38B Electronic devices 101d and Figure 38C As shown in the electronic device 101e, the strap 155 may also have a recess in which a sealing body 40 is disposed. When the sealing body 40 protrudes beyond the strap 155, there is a concern that the display unit 15 may be damaged or the electronic device may be destroyed due to friction or collision with other objects during use. Therefore, it is preferable to connect the strap 155 and the sealing body 40 in such a way that their surfaces form approximately the same plane. Alternatively, the recess in the strap 155 may be deeper than the thickness of the sealing body 40.

[0608] Electronic device 101d is an example where the display unit 15 is flat. Electronic device 101e is an example where the display unit 15 has a curved surface.

[0609] Although Figure 38A and Figure 39A An example is shown where the width of the sealing body 40 is equal to the width of the strip 155, but one aspect of the invention is not limited to this. Figure 39C As shown, the width of the sealing body 40 can also be smaller than the width of the strip 155. Additionally, as... Figure 39D As shown, the width of the sealing body 40 can also be greater than the width of the strip 155.

[0610] Next, an example of the constituent elements of an electronic device according to one aspect of the present invention will be shown.

[0611] Figure 40A The constituent elements 151 shown include a display panel 10, a power storage device 20, a circuit 30, and a sealing body 40. The sealing body 40 contains the display panel 10, the power storage device 20, and the circuit 30. Hereinafter, the display panel 10, the power storage device 20, and the circuit 30 will sometimes be collectively referred to as the sealed body.

[0612] For example, constituent element 151, such as Figure 38A Constituent elements 151a, Figure 38B The constituent elements 151b and Figure 38C As shown in component 151c, it can be used by connecting the sealing body 40 and the strap 155. Furthermore, as... Figures 37A to 37E As shown, the sealing body 40 can also be worn on the arm by forming the sealing body 40 into a strip.

[0613] exist Figure 40B In the example, a block diagram is used to illustrate the connection relationship of the sealed body.

[0614] The display panel 10 includes a display element 13. The display panel 10 has the function of displaying using power supplied from the energy storage device 20.

[0615] In addition, the display panel 10 may also have the function of displaying using power supplied from components other than the power storage device 20.

[0616] The energy storage device 20 has a portion that overlaps with the display panel 10.

[0617] In addition, the energy storage device 20 may also have the function of supplying power to components other than the display panel 10.

[0618] Circuit 30 includes antenna 31. Antenna 31 has a portion that overlaps with display panel 10. Circuit 30 can charge energy storage device 20 wirelessly (also known as contactlessly).

[0619] Because the display panel 10 and the circuit 30 overlap, or the display panel 10 and the energy storage device 20 overlap, the constituent element 151 can be miniaturized. In particular, it is preferable to provide the three overlapping portions of the display panel 10, the energy storage device 20, and the circuit 30. The miniaturization of the constituent element 151 is especially effective when a strip is provided in addition to the sealing body 40. Note that in cases where miniaturization of the constituent element 151 is not required, such as when the sealing body 40 is used as a strip for an electronic device, the overlapping portions of the display panel 10 and the circuit 30, or the overlapping portions of the display panel 10 and the energy storage device 20, may not be present.

[0620] The energy storage device 20 preferably has a portion that overlaps with the circuit 30. For example, at least a portion of the antenna 31 may also overlap with the energy storage device 20. By arranging the antenna 31 between the display panel 10 and the energy storage device 20, overlapping the display panel 10, the energy storage device 20, and the circuit 30 makes it difficult for the user of the electronic device to see the antenna 31, thereby maintaining the appearance of the electronic device, which is therefore preferred. When the display panel 10 is arranged between an external antenna and the antenna 31, radio wave transmission and reception can also be performed. That is, radio waves transmitted by the external antenna pass through the display panel 10, and the antenna 31 receives the radio waves.

[0621] Given the environment in which the electronic device will be used, a display panel that can emit light in that environment and an energy storage device that can supply power to the display panel in that environment are used.

[0622] An electronic device according to one aspect of the present invention is preferably usable in both low-temperature and high-temperature environments. Furthermore, an electronic device according to one aspect of the present invention is preferably usable in a wide temperature range (e.g., above 0°C and below 100°C, preferably above -25°C and below 150°C, more preferably above -50°C and below 200°C). An electronic device according to one aspect of the present invention can also be used indoors and outdoors.

[0623] The display panel included in one aspect of the electronic device of the present invention is preferably capable of displaying in environments of 0°C and 100°C. Furthermore, the energy storage device included in one aspect of the electronic device of the present invention is preferably capable of supplying power to the display panel in environments of 0°C and 100°C.

[0624] Electronic devices may also include switches. Figure 40C , Figure 40D The display panel 10, the energy storage device 20, the circuit 30, the circuit 50, and the switch 51 are shown as sealed components.

[0625] For example, such as Figure 40C As shown, when switch 51 is in the closed state, circuit 30 can wirelessly charge the energy storage device 20.

[0626] For example, such as Figure 40D As shown, when switch 51 is in the ON state, the energy storage device 20 can supply power to the display panel 10.

[0627] The constituent elements of an electronic device according to one aspect of the present invention will be described in detail below.

[0628] <Display Panel 10>

[0629] The display panel 10 includes a display element 13. As a structural example of the display panel 10, the display device will be described in detail in Embodiment 6. The display panel may also include detection elements such as a touch sensor.

[0630] The display panel 10 can be configured using either an active matrix or a passive matrix.

[0631] The display panel 10 can also be flexible. For example, the flexibility of the display panel 10 can be improved by using a thin film for at least one of the support substrate and the sealing substrate of the display element 13.

[0632] For example, it is preferable to use the electronic device while bending the display panel in a range of 1m or more and 10m or less, more preferably in a range of 1m or more and 5m or less. Furthermore, if the display panel has higher flexibility, the electronic device can also be used while bending the display panel in a range of 1mm or more and less than 1m.

[0633] The display panel 10 is preferably capable of displaying in both low-temperature and high-temperature environments. Examples of low-temperature environments include those above -100°C and below 0°C, preferably those above -100°C and below -25°C, and more preferably those above -100°C and below -50°C. Examples of high-temperature environments include those above 100°C and below 300°C, preferably those above 150°C and below 300°C, and more preferably those above 200°C and below 300°C. Note that, in addition to low-temperature and high-temperature environments, the display panel 10 can also be displayed in environments above 0°C and below 100°C. For example, the display panel 10 can be displayed at room temperature (above 20°C and below 30°C).

[0634] Display element 13 can be a light-emitting element, a liquid crystal element, an electrophoretic element, or a display element using MEMS (microelectromechanical systems). As a light-emitting element, it can be a self-emissive element, including elements whose brightness is controlled by current or voltage. For example, light-emitting diodes (LEDs), organic EL elements, and inorganic EL elements can be used.

[0635] The higher the heat resistance of the display element 13, the better. For example, when an organic EL element is used as the display element 13, the glass transition temperature of each organic compound contained in the organic EL element is preferably 100°C or higher and 300°C or lower, more preferably 150°C or higher and 300°C or lower.

[0636] <Electronic Storage Device 20>

[0637] For detailed information and structural examples of the energy storage device 20, please refer to Embodiments 1 and 2, so the description is omitted here.

[0638] In electronic devices, a structure can also be adopted that overlaps the display element 13 and the energy storage device 20. The larger the overlapping area of ​​the display element 13 and the energy storage device 20, the wider the range over which the heat generated by the display element 13 can be used to heat the energy storage device 20. Even if an energy storage device is used, which is more difficult to operate in low-temperature environments compared to high-temperature environments, the reliability of the electronic device can be improved.

[0639] <Circuit 30>

[0640] For details regarding circuit 30, please refer to Implementation Method 1, so the description is omitted here.

[0641] <Circuit 50>

[0642] Circuit 50 has the function of converting the power supplied from the energy storage device 20 into power to drive the display element 13. For example, circuit 50 may have the function of converting the output voltage of the energy storage device 20 into (boosting or bucking) the voltage required to drive the display element 13.

[0643] <Switch 51>

[0644] For details regarding switch 51, please refer to Implementation Method 1, so the description is omitted here.

[0645] The environment in which the electronic device of one aspect of the present invention can be used is not limited to atmospheric atmosphere. For example, the electronic device of one aspect of the present invention can be used in water at temperatures above 0°C and below 100°C. Because the display panel and the energy storage device can be used over a wide temperature range and are sealed by a sealing body, the electronic device of one aspect of the present invention can ensure high reliability even when used in water.

[0646] Reference Figures 8A to 8C The description can also be applied to the constituent elements of the electronic device described in this embodiment.

[0647] The electronic device and its constituent elements described in this embodiment can also be applied to... Figures 9A to 10D The arm-worn electronic device shown.

[0648] This implementation method can be appropriately combined with other implementation methods.

[0649] Implementation Method 6

[0650] In this embodiment, a display device for an electronic device that can be used in one aspect of the present invention is described with reference to the accompanying drawings. Although this embodiment mainly illustrates a display device using liquid crystal elements and organic EL elements, one aspect of the present invention is not limited thereto. Furthermore, regarding the same components as in Embodiment 3, the same components included in the display device can also be referred to the description above.

[0651] One aspect of the display device of the present invention includes a first display element and a second display element. The first display element includes a reflective layer that functions to reflect light. The first display element has the function of controlling the transmission of light. The reflective layer has an opening. The second display element has a portion that overlaps with the opening. The second display element has the function of emitting light into the opening. The area of ​​the opening is preferably 5% or more and 20% or less of the area of ​​the reflective layer.

[0652] For example, when sufficient external light is incident on the display device (in a bright environment, etc.), the display can be performed using both the external light and the first display element. This reduces the power consumption of the display device. Furthermore, even in dimly lit environments where there is little external light incident on the display device, the second display element can be used for display. Moreover, in dim environments, both the first and second display elements can be driven for display. Furthermore, in dim environments, only the second display element can be used for display. Thus, according to one aspect of the present invention, a display device with high visibility and convenience regardless of ambient brightness, or an all-weather display device, can be realized.

[0653] One aspect of the display device of the present invention can have one second display element for a first display element, or it can have two or more second display elements for a first display element. For example, it is preferred when the number of pixels composed of the first display element is equal to the number of pixels composed of the second display elements, the resolution of the display using the first display element is equal to the resolution of the display using the second display elements.

[0654] The display device having the above structure preferably further includes signal lines, pixel circuitry, a first conductive layer, a second conductive layer, and an insulating layer. The second display element is electrically connected to the pixel circuitry. The first display element is electrically connected to the first conductive layer. The first conductive layer has a portion that overlaps the second conductive layer through an insulating layer. The first conductive layer and the second conductive layer are electrically connected. The second conductive layer is electrically connected to the pixel circuitry. The pixel circuitry is electrically connected to the signal lines. The pixel circuitry is capable of driving both the first and second display elements, which are arranged with the insulating layer sandwiched between them.

[0655] In another embodiment of the present invention, a display device includes a liquid crystal element and a light-emitting element. The liquid crystal element includes a liquid crystal layer, a first conductive layer, and a second conductive layer. The first conductive layer has the function of reflecting light. The first conductive layer has an opening. The light-emitting element includes a layer containing a light-emitting material, a third conductive layer, and a fourth conductive layer. The light-emitting element has a portion overlapping the opening. The light-emitting element has the function of emitting light into the opening. The area of ​​the opening is preferably 5% or more and 20% or less of the area of ​​the first conductive layer.

[0656] One aspect of the present invention provides a display device that includes a reflective liquid crystal element as a first display element and an organic EL element as a second display element.

[0657] Therefore, when sufficient external light is incident on the display device, an external light and reflective liquid crystal element can be used for display. Even in dimly lit environments where there is little external light incident on the display device, an organic EL element can be used for display. Thus, according to one aspect of the present invention, a display device with high visibility and convenience regardless of ambient brightness, or an all-weather display device, can be realized.

[0658] The display device having the above structure preferably further includes signal lines, pixel circuitry, a fifth conductive layer, a sixth conductive layer, and an insulating layer. The light-emitting element is electrically connected to the pixel circuitry. The liquid crystal element is electrically connected to the fifth conductive layer. The fifth conductive layer has a portion that overlaps the sixth conductive layer with an insulating layer between them. The fifth conductive layer and the sixth conductive layer are electrically connected. The sixth conductive layer is electrically connected to the pixel circuitry. The pixel circuitry is electrically connected to the signal lines. The pixel circuitry is capable of driving both the light-emitting element and the liquid crystal element, which are arranged with an insulating layer sandwiched between them.

[0659] Figure 41 A circuit diagram showing the pixel circuitry included in the display device of this embodiment is shown. Figure 41 This is the circuit diagram of pixel circuit 630(i,j) and pixel circuit 630(i,j+1).

[0660] Figure 41 The pixel circuits 630(i,j) and 630(i,j+1) shown include switches SW1 and SW2, capacitor C1, capacitor C2, and transistor M. Note that although in Figure 41 The dashed lines in the diagram show the pixel circuit, which include the first display element 650 and the second display element 640. However, the following description addresses the case where the pixel circuit does not include the first display element 650 and the second display element 640.

[0661] Figure 41 Examples of switches SW1 and SW2 including transistors are shown. Switches SW1 and SW2 preferably include transistors using oxide semiconductors.

[0662] illustrate Figure 41 The connection relationship of pixel circuit 630(i,j) and pixel circuit 630(i,j+1) is shown.

[0663] Pixel circuit 630(i,j) is electrically connected to signal line S1(j), signal line S2(j), scan line G1(i), scan line G2(i), wiring CSCOM and wiring ANO.

[0664] Pixel circuit 630(i, j+1) is electrically connected to signal line S1(j+1), signal line S2(j+1), scan line G1(i), scan line G2(i), wiring CSCOM and wiring ANO.

[0665] When the voltage of the signal supplied to signal line S2(j) is different from the voltage of the signal supplied to signal line S1(j+1), signal line S1(j+1) is arranged separately from signal line S2(j). Figure 41 An example is shown where signal line S2(j+1) is configured adjacent to signal line S2(j).

[0666] The gate of switch SW1 is electrically connected to scan line G1(i). One of the source and drain of switch SW1 is electrically connected to signal line S1(j), and the other of the source and drain of switch SW1 is electrically connected to one electrode of capacitor element C1 and one electrode of first display element 650.

[0667] The other electrode of capacitor element C1 is electrically connected to wiring CSCOM.

[0668] Another electrode of the first display element 650 is electrically connected to wiring VCOM1.

[0669] The gate of switch SW2 is electrically connected to scan line G2(i). One of the source and drain of switch SW2 is electrically connected to signal line S2(j), and the other of the source and drain of switch SW2 is electrically connected to the gate and back gate of transistor M and one electrode of capacitor element C2.

[0670] One of the source and drain of transistor M is electrically connected to the wiring ANO and the other electrode of capacitor element C2, and the other of the source and drain of transistor M is electrically connected to one electrode of second display element 640.

[0671] Another electrode of the second display element 640 is electrically connected to wiring VCOM2.

[0672] Pixel circuit 630(i,j) is electrically connected to the first display element 650(i,j). Pixel circuit 630(i,j) is electrically connected to the second display element 640(i,j).

[0673] Figure 42A A block diagram illustrating the configuration of pixels and wiring included in the display device 600 is shown. Figure 42B1 and Figure 42B2 This is a schematic diagram illustrating the opening 651H of the display device 600.

[0674] like Figure 42AAs shown, the display device 600 includes i scan lines G1, i scan lines G2, j signal lines S1, j signal lines S2, j wiring CSCOM, j wiring ANO, m×n pixels 602, driving circuit GD, and driving circuit SD. Note that i is an integer greater than or equal to 1 and less than or equal to m, j is an integer greater than or equal to 1 and less than or equal to n, and m and n are integers greater than or equal to 1.

[0675] Figure 42A , Figure 42B1 and Figure 42B2 The display device 600 shown includes pixels 602 (i, j).

[0676] Scan line G1(i), scan line G2(i), wiring CSCOM and wiring ANO are electrically connected to a group of pixels 602(i,1) to 602(i,n) arranged in the row direction (indicated by arrow R in the figure).

[0677] Signal lines S1(j) and S2(j) are electrically connected to another group of pixels 602(1,j) to 602(m,j) arranged in the column direction (indicated by arrow C in the figure).

[0678] For example, a pixel 602(i,j+1) adjacent to pixel 602(i,j) in the row direction preferably has an opening in a manner different from the configuration of the opening 651H of pixel 602(i,j). Figure 42B1 ).

[0679] For example, a pixel 602(i+1,j) adjacent to pixel 602(i,j) in the column direction preferably has an opening in a manner different from the configuration of the opening 651H of pixel 602(i,j). Figure 42B2 ).

[0680] Alternatively, the opening 651H can also be positioned in the same location across all pixels.

[0681] The drive circuit GD is electrically connected to the scan line G1(i). Various sequential circuits, such as shift registers, can be used as the drive circuit GD. Transistors and capacitors can be used as the drive circuit GD. The transistors included in the drive circuit GD can be formed using the same process as the transistors included in the pixel circuit 630(i,j).

[0682] The driver circuit SD is electrically connected to the signal line S1(j). For example, an integrated circuit can be used as the driver circuit SD. Specifically, an integrated circuit formed on a silicon substrate can be used as the driver circuit SD.

[0683] For example, by using the COG (Chip on Glass) method, the driving circuit SD can be mounted on a pad electrically connected to the pixel circuit 630(i,j). Specifically, an integrated circuit can be mounted on the pad using an anisotropic conductive film.

[0684] Figure 43A This is a bottom view of the display device 600 (a view of the side opposite to the display surface). Figure 43B1 and Figure 43B2 This is a bottom view illustrating part of the structure of the display device 600. Figure 43B2 It was omitted. Figure 43B1 A bottom view of a portion of the structure shown. Figure 43A An example is shown where a cell consists of three pixels 602(i,j).

[0685] Figure 44A It is along Figure 43A , Figure 43B1 and Figure 43B2 The cross-sectional view of the dashed lines X1-X2, X3-X4, X5-X6, X7-X8, X9-X10, X11-X12 shown. Figures 44B to 44D This is a structural example of a transistor that can be used in a display device 600.

[0686] exist Figure 44A In the diagram, dashed arrows indicate the direction in which the first display element 650 (i, j) displays information by controlling the intensity of reflected external light. Additionally, in... Figure 44A In the diagram, solid lines indicate the display direction of the second display element 640(i,j). Thus, the second display element 640(i,j) displays in the same direction as the first display element 650(i,j).

[0687] like Figure 44A As shown, the driving circuit GD includes transistor MD.

[0688] like Figure 44A As shown, pixel 602(i,j) includes a first display element 650(i,j), a second display element 640(i,j), a first conductive layer 681, a second conductive layer 682, an insulating layer 621, and a pixel circuit 630(i,j). Figure 44A The image shows transistor M and switch SW1 in pixel circuit 630(i,j).

[0689] The first display element 650(i,j) includes a first electrode 651(i,j), a second electrode 652, and a layer 653 comprising liquid crystal material. The second electrode 652 is configured to form an electric field between itself and the first electrode 651(i,j) to control the orientation of the liquid crystal material.

[0690] The display device 600 preferably includes alignment film AF1 and alignment film AF2. A layer 653 containing liquid crystal material is located between alignment film AF2 and alignment film AF1.

[0691] The first display element 650(i, j) includes a reflective layer that functions to reflect incident light. Additionally, the first display element 650(i, j) has the function of controlling the intensity of the reflected light. The reflective layer has an opening 651H. Figure 44A The diagram shows an example where the first electrode 651(i,j) comprises a stack of a conductive layer that allows light to pass through and a conductive layer that reflects light. Furthermore, a reflective layer may also be provided in addition to the first electrode 651(i,j).

[0692] like Figure 44A As shown, the side ends of the first electrode 651(i,j) are embedded in the insulating layer 621.

[0693] As the second display element 640(i,j), a light-emitting element can be used. The second display element 640(i,j) includes a third electrode 641(i,j), a fourth electrode 642, and a layer 643(j) containing a light-emitting material. An insulating layer 668 covers the end of the third electrode 641(i,j). The insulating layer 668 formed along the edge of the third electrode 641(i,j) can prevent short circuits between the third electrode 641(i,j) and the fourth electrode 642.

[0694] The second display element 640(i,j) has the function of emitting light into the opening 651H.

[0695] The second display element 640(i,j) is capable of displaying on the area surrounded by the area displayed by the first display element 650(i,j). Figure 43B1 and Figure 43B2 The first display element 650(i,j) displays in the area overlapping with the first electrode 651(i,j), and the second display element 640(i,j) displays in the area overlapping with the opening 651H.

[0696] The first conductive layer 681 is electrically connected to the first display element 650(i,j). Figure 44A An example is shown where the first conductive layer 681 is electrically connected to the first electrode 651(i,j). The first conductive layer 681 may have a single-layer structure or a stacked structure. The first conductive layer 681 may also be used as the first electrode 651(i,j).

[0697] The second conductive layer 682 has a region that overlaps with the first conductive layer 681. The second conductive layer 682 can be a single-layer structure or a stacked structure.

[0698] The insulating layer 621 has a region sandwiched between the second conductive layer 682 and the first conductive layer 681.

[0699] In region 691c, the second conductive layer 682 is electrically connected to the first conductive layer 681.

[0700] The second conductive layer 682 is electrically connected to the pixel circuit 630(i, j). Figure 44A In the middle, the second conductive layer 682 is electrically connected to the conductive layer 612b.

[0701] One of conductive layers 612a and 612b is used as the source of the transistor that serves as switch SW1, and the other of conductive layers 612a and 612b is used as the drain. Conductive layer 612a is electrically connected to signal line S1(j). Conductive layer 612a can also be considered as part of signal line S1(j). Figure 41 and Figure 44A ).

[0702] The first electrode 651(i,j) of the first display element 650(i,j) is electrically connected to the conductive layer 612b of the switch SW1 via the first conductive layer 681 and the second conductive layer 682. That is, the first display element 650(i,j) is electrically connected to the pixel circuit 630(i,j). Note that the method of electrically connecting the first display element 650(i,j) and the pixel circuit 630(i,j) is not limited to this. For example, the first electrode 651(i,j) and the conductive layer 612b can also be electrically connected via one of the first conductive layer 681 and the second conductive layer 682. Alternatively, the first electrode 651(i,j) and the conductive layer 612b can be directly connected.

[0703] One of the source and drain electrodes of transistor M is electrically connected to wiring ANO. The third electrode 641(i,j) of the second display element 640(i,j) is electrically connected to the other of the source and drain electrodes of transistor M in the connection portion 662. Therefore, the second display element 640(i,j) is electrically connected to the pixel circuit 630(i,j). Transistor M is superimposed on the third electrode 641(i,j) through an insulating layer 661.

[0704] Additionally, the display device 600 includes a conductive layer 619b and a conductive layer 611b. Figure 44A ).

[0705] The insulating layer 621 has a region sandwiched between the conductive layer 619b and the conductive layer 611b.

[0706] Conductive layer 619b is electrically connected to conductive layer 611b in region 691b. Furthermore, conductive layer 611b is electrically connected to pixel circuitry 630(i, j).

[0707] The conductive layer 619b is electrically connected to the flexible printed circuit board (FPC) via the connector ACF. Thus, power or signals can be supplied to the pixel circuitry through the conductive layer 619b. Although in Figure 44A The diagram shows an example where the connection between the conductive layer 619b and the FPC is located on one side of the display surface of the display device 600, but it can also be located on the side opposite to the display surface.

[0708] Pixel 602(i,j) also includes a color layer CF, a light-shielding layer BM, an insulating layer 671, and a functional film 670.

[0709] The coloring layer CF has an area that overlaps with the first display element 650(i,j). The light-shielding layer BM has an opening in the area that overlaps with the first display element 650(i,j).

[0710] The coloring layer CF has an area that overlaps with the second display element 640(i,j). The light-shielding layer BM has an opening in the area that overlaps with the second display element 640(i,j).

[0711] An insulating layer 671 is disposed between the coloring layer CF and the layer 653 containing liquid crystal material, or between the light-shielding layer BM and the layer 653 containing liquid crystal material. This allows the unevenness caused by the thickness of the coloring layer CF to be flattened. Furthermore, it suppresses the diffusion of impurities from the light-shielding layer BM or the coloring layer CF into the layer 653 containing liquid crystal material.

[0712] The functional film 670 has a region overlapping with the first display element 650 (i, j). The functional film 670 has a region overlapping with the second display element 640 (i, j). The functional film 670 is configured such that the substrate 690 is sandwiched between the functional film 670 and the first display element 650 (i, j).

[0713] The second display element 640(i,j) is sealed by the adhesive layer 605 and the substrate 610. The sealing method for the second display element 640(i,j) is not limited to this. For example, an insulating film with high gas barrier properties can be used to cover the second display element 640(i,j). In this case, the adhesive layer 605 and the substrate 610 may not be provided.

[0714] Substrate 690 has a region overlapping with substrate 610. Functional layer 660 is disposed between substrate 610 and substrate 690. Functional layer 660 includes pixel circuits 630(i, j), second display elements 640(i, j), insulating layers 616, 618, 621, 661, and 668. Adhesive layer 695 functions to bond functional layer 660 and substrate 690. Structure KB functions to provide a predetermined gap between functional layer 660 and substrate 690.

[0715] The substrate 690 is preferably thin. For example, alkali-free glass polished to a thickness of 0.2 mm or 0.1 mm is preferably used as the substrate 690.

[0716] The display device 600 includes a conductive layer 619a, a conductive layer 611a, and a conductor CP.

[0717] The insulating layer 621 has a region sandwiched between the conductive layer 619a and the conductive layer 611a.

[0718] Conductive layer 619a is electrically connected to conductive layer 611a in region 691a. Furthermore, conductive layer 611a is electrically connected to pixel circuitry 630(i, j).

[0719] The conductor CP is sandwiched between the conductive layer 619a and the second electrode 652 and electrically connects the conductive layer 619a and the second electrode 652. For example, conductive particles can be used for the conductor CP.

[0720] Below is an example of a material that can be used in a display device. Note that since the materials that can be used in the substrate, adhesive layer, transistor, light-emitting element, conductive layer, insulating layer, coloring layer, and light-shielding layer included in the display device can be referred to the description in Embodiment 3, detailed descriptions are omitted.

[0721] As the first display element 650(i, j), a display element with the function of controlling the reflection or transmission of light can be used. For example, a structure combining a liquid crystal element and a polarizer or a MEMS display element with a shutter mechanism can be used. By using a reflective display element, the power consumption of the display panel can be suppressed. Specifically, a reflective liquid crystal display element can be used in the first display element 650(i, j).

[0722] As driving methods for liquid crystal elements, the following can be used: IPS (In-Plane-Switching) mode, TN (Twisted Nematic) mode, FFS (Fringe Field Switching) mode, ASM (Axially Symmetric aligned Micro-cell) mode, OCB (Optically Compensated Birefringence) mode, FLC (Ferroelectric Liquid Crystal) mode, and AFLC (Anti-Ferroelectric Liquid Crystal) mode, etc.

[0723] In addition, as a driving method for liquid crystal elements, vertical alignment (VA) modes can be used, specifically MVA (Multi-Domain Vertical Alignment) mode, PVA (Patterned Vertical Alignment) mode, ECB (Electrically Controlled Birefringence) mode, CPA (Continuous Pinwheel Alignment) mode, ASV (Advanced SuperView) mode, etc.

[0724] For example, thermotropic liquid crystals, low-molecular-weight liquid crystals, high-molecular-weight liquid crystals, high-molecular-weight dispersed liquid crystals, ferroelectric liquid crystals, and antiferroelectric liquid crystals can be used. Furthermore, liquid crystal materials exhibiting cholesteric, smectic, cubic, chiral nematic, or isotropic phases can be used. Additionally, liquid crystal materials exhibiting a blue phase can be used.

[0725] Materials that reflect visible light are used as reflective layers. For example, materials containing silver, materials containing both silver and palladium, or materials containing both silver and copper can be used as reflective layers.

[0726] The reflective layer can reflect light that passes through layer 653, which contains liquid crystal material.

[0727] The reflective layer can also have an uneven surface. Therefore, incident light can be reflected in various directions to produce a white display.

[0728] The first electrode 651(i, j) can also be used as a reflective layer. Alternatively, a reflective layer can be disposed between the liquid crystal material-containing layer 653 and the first electrode 651(i, j). Furthermore, a light-transmitting first electrode 651(i, j) can be disposed between the reflective layer and the liquid crystal material-containing layer 653.

[0729] The total area of ​​the opening 651H can be appropriately set. When the ratio of the total area of ​​the opening 651H to the total area of ​​the non-opening portion is small, a bright display can be achieved using the first display element 650(i,j). Conversely, when the ratio of the total area of ​​the opening 651H to the total area of ​​the non-opening portion is large, a bright display can be achieved using the second display element 640(i,j). Preferably, the area of ​​the opening 651H is set in a manner that ensures sufficient brightness when displaying with any display element.

[0730] Furthermore, when the area of ​​the opening 651H is small, the electric field applied to the layer 653 containing the liquid crystal material can be made uniform, thereby suppressing the degradation of the display quality of the first display element 650(i,j). When the area of ​​the opening 651H is large, the efficiency of extracting the light emitted by the second display element 640(i,j) to the outside of the display device can be improved.

[0731] There are no particular limitations on the shape of the opening 651H; for example, it can be a polygon such as a quadrilateral, an ellipse, a circle, a cross, a stripe, a slit, or a checkered pattern. The opening 651H can also be positioned near adjacent pixels. Preferably, the opening 651H is positioned near sub-pixels of the same color. This suppresses the phenomenon (also known as crosstalk) where light emitted from the second display element 640(i, j) interferes with the color layer positioned in adjacent sub-pixels of other colors.

[0732] The second electrode 652 can be a conductive material that allows visible light to pass through. For example, a conductive oxide, such as a conductive oxide containing indium, can be used as the second electrode 652. Alternatively, a thin metal film that allows light to pass through (e.g., with a thickness of 1 nm or more and 10 nm or less) can be used as the second electrode 652. Furthermore, metal nanowires, such as silver nanowires, can be used as the second electrode 652.

[0733] Specifically, as the second electrode 652, indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide with gallium added, zinc oxide with aluminum added, etc. can be used.

[0734] Organic materials, inorganic materials, or composite materials of organic and inorganic materials can be used as structural elements KB. Structural elements KB are used as spacers. Furthermore, granular spacers can also be used as structural elements KB. As granular spacers, silica, or elastic materials such as resin or rubber are preferred. Sometimes, the granular spacers are flattened in the vertical direction.

[0735] For example, polyimide or the like can be used as alignment films AF1 and AF2. Alignment films AF1 and AF2 are preferably formed in a predetermined direction by a rubbing process or photo-alignment technique. For example, a film containing soluble polyimide can be used for alignment film AF1 or alignment film AF2.

[0736] As the functional film 670, polarizers, phase retardation plates, diffusion films, antireflective films, or condensing films can be used. Furthermore, polarizers containing dichroic dyes can be used in the functional film 670. Additionally, antistatic films that inhibit dust adhesion, water-repellent films that are not easily soiled, and hard coatings that prevent damage during use can be used in the functional film 670.

[0737] Display devices include transistors of one or more structures. For example, a display device can... Figures 44B to 44D At least one of the transistors in the structure shown is used in a display device.

[0738] Figure 44B The switch SW1 shown includes a conductive layer 604, an insulating layer 606, a semiconductor layer 608, a conductive layer 612a, and a conductive layer 612b. Conductive layer 604 serves as the gate. One of conductive layers 612a and 612b serves as the source, and the other of conductive layers 612a and 612b serves as the drain. Insulating layer 606 serves as the gate insulating layer. The switch SW1 is not limited to... Figure 44B The structure shown can also have Figure 44C and Figure 44D The structure shown.

[0739] Figure 44C The transistors M and MD shown include a conductive layer 604, an insulating layer 606, a semiconductor layer 608, conductive layers 612a, 612b, and a conductive layer 624. Conductive layer 604 serves as the gate. One of conductive layers 612a and 612b serves as the source, and the other serves as the drain. Insulating layer 606 serves as the gate insulating layer. Conductive layer 624 serves as the back gate. Insulating layer 616 is located between conductive layer 624 and semiconductor layer 608. Conductive layers 624 and 604 have overlapping portions separated by semiconductor layer 608. Conductive layer 624 is located between insulating layers 616 and 618. Transistor M and transistor MD can have the same structure or different structures. For example, transistor M and transistor MD can have... Figures 44B to 44D Any structure shown in the diagram. Although in Figure 44A The width of conductive layer 604 in the transistor M shown is smaller than the width of conductive layer 624, but it is not limited to this. Although in Figure 44A The width of conductive layer 604 in the transistor MD shown is greater than the width of conductive layer 624, but it is not limited to this.

[0740] Figure 44DThe transistor shown includes a conductive layer 604, an insulating layer 606, a semiconductor layer 608, a conductive layer 612a, and a conductive layer 612b. The conductive layer 604 is used as the gate. The insulating layer 606 is used as the gate insulating layer.

[0741] The semiconductor layer 608 has a first region 608a and a second region 608b that do not overlap with the conductive layer 604. The semiconductor layer 608 also has a third region 608c between the first region 608a and the second region 608b. The third region 608c overlaps with the conductive layer 604.

[0742] The resistivity of the first region 608a and the second region 608b is lower than that of the third region 608c. One of the first region 608a and the second region 608b is used as a source region, and the other of the first region 608a and the second region 608b is used as a drain region. The first region 608a is electrically connected to the conductive layer 612a. The second region 608b is electrically connected to the conductive layer 612b.

[0743] As described in Embodiment 1, an electronic device of one aspect of the present invention overlaps a display panel and a power storage device. Figure 45 An example of a cross-sectional view showing an overlay display panel with a thin secondary battery. Figure 45 The display panel shown has the same Figure 44A The display device 600 shown has the same structure. Figure 45 The thin secondary battery shown has the same characteristics as... Figure 14A The battery cell 500 shown has the same structure.

[0744] Although Figure 45 The illustration shows an example where the substrate 610 of the display panel is in contact with the outer casing 509 of the battery cell, but the invention is not limited to this. The display panel and the battery cell may also be fixed together by adhesives or the like. Additionally, a circuit board or similar component may be included between the display panel and the battery cell.

[0745] This implementation method can be appropriately combined with other implementation methods.

[0746] Symbol Explanation

[0747] AF1 orientation film

[0748] AF2 orientation film

[0749] C1 Capacitor Component

[0750] C2 Capacitor Component

[0751] G1 scan line

[0752] G2 scan line

[0753] S1 signal line

[0754] S2 signal line

[0755] SW1 switch

[0756] SW2 switch

[0757] VCOM1 cabling

[0758] VCOM2 cabling

[0759] 10 Display Panel

[0760] 11 Light-emitting elements

[0761] 12a terminal

[0762] 12b terminal

[0763] 13 Display Components

[0764] 15 Display Section

[0765] 15a Display Section

[0766] 15b Display Section

[0767] 15c Display Unit

[0768] 20. Energy storage devices

[0769] 21a electrode

[0770] 21b electrode

[0771] 30 Circuits

[0772] 31 antennas

[0773] 32 controllers

[0774] 33a terminal

[0775] 33b terminal

[0776] 34 terminals

[0777] 35 Electronic components

[0778] 40 Sealing body

[0779] 41 Sealed area

[0780] 41a Sealed area

[0781] 41b Sealed area

[0782] 42 Space

[0783] 45. Wiring

[0784] 50 circuits

[0785] 51 Switch

[0786] 52a terminal

[0787] 52b terminal

[0788] 53a wiring

[0789] 53b wiring

[0790] 55 circuit board

[0791] 68 antennas

[0792] 70 areas

[0793] 91 Clips

[0794] 93 Opening

[0795] 95 Sealing section

[0796] 97 ribbons

[0797] 100 Electronic devices

[0798] 100a Electronic Equipment

[0799] 100b Electronic Devices

[0800] 100c electronic devices

[0801] 100d electronic devices

[0802] 100e electronic devices

[0803] 101 Electronic Devices

[0804] 101a Electronic Equipment

[0805] 101b Electronic Devices

[0806] 101c electronic devices

[0807] 101d electronic devices

[0808] 101e electronic devices

[0809] 150 constituent elements

[0810] 150a Components

[0811] 150b Components

[0812] 151 Constituent Elements

[0813] 151a Constituent Elements

[0814] 151b Constituent Elements

[0815] 151c Constituent Elements

[0816] 155 straps

[0817] 200 rechargeable batteries

[0818] 203 Isolation Body

[0819] Area 203a

[0820] Area 203b

[0821] 207 Outer Packaging

[0822] 211 Positive electrode

[0823] 211a Positive Electrode

[0824] 215 Negative electrode

[0825] 215a negative electrode

[0826] 220 sealing layer

[0827] 221 Positive lead wire

[0828] 225 negative wire

[0829] 230 Electrode Assembly

[0830] 231 Electrode Assembly

[0831] 250 rechargeable battery

[0832] 281 protrusion region

[0833] 282 protrusion area

[0834] 301 Display Department

[0835] 302 pixels

[0836] 302B subpixel

[0837] 302G subpixels

[0838] 302R subpixel

[0839] 302t transistor

[0840] 303C capacitor

[0841] 303g(1) Scan line drive circuit

[0842] 303g(2) Imaging Pixel Driving Circuit

[0843] 303s(1) Image signal line driving circuit

[0844] 303s(2) Imaging signal line driving circuit

[0845] 303t transistor

[0846] 304 gate

[0847] 308 imaging pixels

[0848] 308p photoelectric conversion element

[0849] 308t transistor

[0850] 309 FPC

[0851] 311 Wiring

[0852] 319 terminal

[0853] 321 Insulation Layer

[0854] 328 partition wall

[0855] 329 Spacers

[0856] 350R light-emitting element

[0857] 351R lower electrode

[0858] 352 Upper Electrode

[0859] 353 EL layer

[0860] 353a EL layer

[0861] 353b EL layer

[0862] 354 Intermediate Layer

[0863] 360° adhesive layer

[0864] 367BM light-shielding layer

[0865] 367p anti-reflective layer

[0866] 367R shader layer

[0867] 380B LED module

[0868] 380G Light-Emitting Module

[0869] 380R LED module

[0870] 390 Touch Panel

[0871] 500 battery cells

[0872] 501 Positive Current Collector

[0873] 502 Positive Electrode Active Material Layer

[0874] 503 Positive Electrode

[0875] 504 negative current collector

[0876] 505 Negative Electrode Active Material Layer

[0877] 506 Negative Electrode

[0878] 507 Isolation

[0879] 508 Electrolyte

[0880] 509 Outer Packaging

[0881] 510 Positive lead wire

[0882] 511 Negative conductor

[0883] 521 Display Department

[0884] 525 Touch Panel

[0885] 525B Touch Panel

[0886] 529 FPC

[0887] 589 Insulation Layer

[0888] 590 Flexible substrate

[0889] 591 electrode

[0890] 592 electrode

[0891] 593 Insulation layer

[0892] 594 Wiring

[0893] 595 Touch Sensor

[0894] 597 Adhesive layer

[0895] 598 Wiring

[0896] 599 Connection Layer

[0897] 600 display devices

[0898] 602 pixels

[0899] 604 conductive layer

[0900] 605 Adhesive Layer

[0901] 606 insulation layer

[0902] 608 semiconductor layer

[0903] Area 608a

[0904] Area 608b

[0905] 608c area

[0906] 610 substrate

[0907] 611a conductive layer

[0908] 611b conductive layer

[0909] 612a conductive layer

[0910] 612b conductive layer

[0911] 616 Insulation Layer

[0912] 618 Insulation Layer

[0913] 619a conductive layer

[0914] 619b conductive layer

[0915] 621 Insulation Layer

[0916] 624 conductive layer

[0917] 630 pixel circuit

[0918] 640 Second display element

[0919] 641 Third Electrode

[0920] 642 Fourth Electrode

[0921] 643 Layer containing luminescent material

[0922] 650 First Display Element

[0923] 651 First Electrode

[0924] 651H Opening

[0925] 652 Second Electrode

[0926] 653 Layer containing liquid crystal material

[0927] 660 Functional Layer

[0928] 661 Insulation Layer

[0929] 662 Connecting part

[0930] 668 Insulation Layer

[0931] 670 Functional Membrane

[0932] 671 Insulation layer

[0933] 681 First conductive layer

[0934] 682 Second conductive layer

[0935] 690 substrate

[0936] Area 691a

[0937] Area 691b

[0938] Area 691c

[0939] 695 Adhesive Layer

[0940] 701 Flexible Substrate

[0941] 703 Adhesive Layer

[0942] 703a adhesive layer

[0943] 703b adhesive layer

[0944] 705 insulation layer

[0945] 711 Flexible Substrate

[0946] 713 Adhesive Layer

[0947] 715 Insulation Layer

[0948] 723 electrode

[0949] 726 Insulation Layer

[0950] 728 Insulation Layer

[0951] 729 Insulation Layer

[0952] 742 Semiconductor Layer

[0953] 743 electrode

[0954] 744a electrode

[0955] 744b electrode

[0956] 746 electrode

[0957] 747a Opening

[0958] 747b Opening

[0959] 747c Opening

[0960] 747d opening

[0961] 771 substrate

[0962] 772 Insulation Layer

[0963] 804 Light-emitting part

[0964] 806 Drive Circuit Section

[0965] 808 FPC

[0966] 814 conductive layer

[0967] 815 Insulation Layer

[0968] 817 Insulation Layer

[0969] 817a Insulation Layer

[0970] 817b Insulation Layer

[0971] 820 transistors

[0972] 821 Insulation Layer

[0973] 822 Adhesive Layer

[0974] 823 Spacer

[0975] 824 transistors

[0976] 825 Connector

[0977] 830 Light-emitting element

[0978] 831 Lower Electrode

[0979] 832 Optical Adjustment Layer

[0980] 833 EL layer

[0981] 835 Upper Electrode

[0982] 845 Coloring Layer

[0983] 847 Light-shielding layer

[0984] 848 transistors

[0985] 849 Protective Layer

[0986] 856 conductive layer

[0987] 857 conductive layer

[0988] 857a conductive layer

[0989] 857b conductive layer

Claims

1. An electronic device, comprising: Display panel, energy storage device, circuit, seals, and tape. The display panel has a first display section and a second display section. The sealing body has a first film and a second film. The display panel, the energy storage device, and the circuit are sealed by the first thin film and the second thin film. The display panel has light-emitting elements. The light-emitting element has the function of emitting light using the power supplied from the energy storage device. The circuit has an antenna and is capable of wirelessly charging the energy storage device. At least a portion of the sealed body has the function of transmitting light emitted by the light-emitting element. The first display portion overlaps with the first part of the sealing body. The second display unit overlaps with the second part of the sealing body. The first portion and the second portion of the sealing body have regions arranged facing each other. The band has a recess. The sealing body is disposed in the recess, and the surface of the sealing body and the surface of the strip form the same plane. The strap, which is detachably connected to the sealing body, can be mounted on the arm.

2. The electronic device as claimed in claim 1, wherein, When the sealing body is installed on the arm, the energy storage device, the antenna, and the display panel are stacked sequentially from the side of the arm.

3. The electronic device as claimed in claim 1, wherein, The interior of the sealed body is under reduced pressure atmosphere.

4. The electronic device as claimed in claim 1, wherein, The interior of the sealed body contains a buoyancy material.

Images