Chip temperature control device and control method thereof, and medical detection equipment

By using a liquid cooling tank and a spray system in the PCR temperature control equipment, rapid heating and cooling are achieved, solving the problem of slow heating and cooling rates in existing PCR temperature control equipment, improving detection efficiency and reducing energy consumption.

CN116700383BActive Publication Date: 2026-04-21BEIJING BOE TECH DEV CO LTD +1
View PDF 3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING BOE TECH DEV CO LTD
Filing Date
2022-02-25
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

Existing PCR temperature control equipment has a slow heating and cooling rate, which affects detection efficiency.

Method used

It employs a liquid cooling tank and a spray system, which sprays coolant onto the heating plate through nozzles to cool it down, and allows the coolant to separate naturally during heating. Combined with a control system, it precisely controls temperature changes.

Benefits of technology

It improves the heating and cooling efficiency of PCR detection, reduces detection time, and lowers energy consumption.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116700383B_ABST
    Figure CN116700383B_ABST
Patent Text Reader

Abstract

This application provides a chip temperature control device and its control method, as well as a medical testing device. The chip temperature control device includes a heating plate, a liquid cooling tank, a spraying system, and a control system. The heating plate is supported at the end of the side wall of the liquid cooling tank away from the bottom wall. The spraying system includes nozzles disposed within the liquid cooling tank. The control system is configured to control the heating plate to heat when the temperature of the microfluidic chip needs to be increased, and to control the nozzles to spray coolant onto the heating plate when the temperature of the microfluidic chip needs to be decreased. By setting up the liquid cooling tank, nozzles, and control system, the nozzles spray coolant onto the heating plate when the temperature of the microfluidic chip needs to be decreased, improving the cooling efficiency compared to air cooling. When the temperature of the microfluidic chip needs to be increased, the nozzles stop spraying coolant, and the previously sprayed coolant naturally separates from the heating plate under the action of gravity, improving the heating efficiency.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of biochemical detection equipment technology, and more specifically, to a chip temperature control device and its control method, and medical detection equipment. Background Technology

[0002] The in vitro diagnostics industry is mainly divided into biochemical diagnostics, immunodiagnostics, and molecular diagnostics based on their principles. In recent years, molecular diagnostics has become the fastest-growing sector. Among them, polymerase chain reaction (PCR) detection technology is currently the most widely used molecular diagnostic technology in clinical practice, and it has broad application prospects in gene expression, mutation detection, and cancer companion diagnostics.

[0003] PCR is a molecular biology technique used to amplify specific DNA fragments. Its main process involves denaturing DNA into single strands at 95°C, annealing it at 60°C, binding primers to the single strands according to base complementarity, and then extending the DNA at 72°C to complete replication. This process requires a temperature control device that can cyclically control the denaturation, annealing, and extension temperatures. However, existing PCR temperature control devices suffer from slow heating and cooling rates, leading to prolonged PCR detection time and affecting detection efficiency. Summary of the Invention

[0004] This application addresses the shortcomings of existing methods by proposing a chip temperature control device and its control method, as well as a medical testing device, aiming to solve the problem of slow heating and cooling rates in existing PCR temperature control equipment.

[0005] In a first aspect, embodiments of this application provide a chip temperature control device, comprising:

[0006] A heating plate is used to support the microfluidic chip and to heat the microfluidic chip.

[0007] A liquid cooling tank includes a bottom wall and a side wall protruding from the side edge of the bottom wall, wherein the end of the side wall away from the bottom wall supports the heating plate;

[0008] A liquid spraying system, including nozzles disposed within the liquid cooling tank;

[0009] The control system, electrically connected to the heating plate and the spraying system respectively, is configured to control the nozzle to spray coolant onto the heating plate when it is necessary to lower the temperature of the microfluidic chip, and is configured to control the heating plate to heat and control the nozzle to stop spraying coolant when it is necessary to raise the temperature of the microfluidic chip.

[0010] Optionally, the nozzle is disposed on the bottom wall of the liquid cooling tank.

[0011] Optionally, the bottom wall of the liquid cooling tank has a protrusion on the side near the heating plate, the nozzle passes through the protrusion, and two adjacent protrusions form a channel.

[0012] Optionally, in the direction from the bottom wall of the liquid cooling tank to the heating plate, the distance between the nozzle and the heating plate is less than or equal to 20 cm.

[0013] Optionally, the orthographic projection of the nozzle on the bottom wall of the liquid cooling tank overlaps with the orthographic projection of the microfluidic chip on the bottom wall of the cooling tank.

[0014] Optionally, the orthographic projection area of ​​the nozzle on the heating plate is greater than or equal to 2.25 square centimeters.

[0015] Optionally, the nozzle opening shape is circular, and the nozzle opening diameter is less than or equal to 2 mm.

[0016] Optionally, the number of nozzles is multiple, and the multiple nozzles are arranged in an array.

[0017] Optionally, the spraying system further includes a water pump, an inlet pipe, and a return pipe. The inlet pipe is connected to both the water pump and the nozzle, and the return pipe is connected to both the water pump and the liquid cooling tank. The number of inlet pipes is multiple.

[0018] The water pump is used to drive the coolant from the inlet pipe to the nozzle, so that the coolant is sprayed out from the nozzle; the water pump is also used to draw coolant from the liquid cooling tank through the return pipe.

[0019] Optionally, in the direction from the bottom wall of the liquid cooling tank to the heating plate, the distance between the water inlet pipe and the heating plate is less than or equal to the distance between the water return pipe and the heating plate.

[0020] Optionally, the control system includes a temperature sensor disposed on the heating plate, the temperature sensor being configured to monitor the temperature of the microfluidic chip placed on the heating plate in real time;

[0021] The control system is configured to control the heating plate to be powered on and heated according to preset parameters based on the detected temperature of the microfluidic chip, and to control the nozzle to spray coolant onto the heating plate.

[0022] Secondly, embodiments of this application provide a medical testing device, including the chip temperature control device described in embodiments of this application.

[0023] Thirdly, embodiments of this application provide a control method for a chip temperature control device, comprising:

[0024] In a test cycle, the heating plate is powered on to reach a first preset temperature and maintain it for a first preset time.

[0025] The heating plate is powered off, and the nozzle is controlled to spray coolant onto the heating plate so that the heating plate reaches the second preset temperature.

[0026] The nozzle is controlled to continuously spray coolant onto the heating plate for a second preset time.

[0027] Control the nozzle to stop spraying coolant onto the heating plate, control the heating plate to be powered on, so that the heating plate reaches a third preset temperature and remains at a third preset temperature for a third preset time.

[0028] The beneficial technical effects of the technical solutions provided in this application include:

[0029] The chip temperature control device in this embodiment includes a heating plate, a liquid cooling tank, a spraying system, and a control system. The heating plate supports and heats the microfluidic chip. The liquid cooling tank includes a bottom wall and a side wall protruding from the side edge of the bottom wall. The end of the side wall away from the bottom wall supports the heating plate. The spraying system includes nozzles disposed within the liquid cooling tank. The control system is configured to control the heating plate to heat when the temperature of the microfluidic chip needs to be increased, and to control the nozzles to spray coolant onto the heating plate when the temperature of the microfluidic chip needs to be decreased. By configuring the liquid cooling tank, nozzles, and control system, the nozzles spray coolant onto the heating plate when the temperature of the microfluidic chip needs to be decreased, improving cooling efficiency compared to air cooling. When the temperature of the microfluidic chip needs to be increased, the nozzles stop spraying coolant, and the previously sprayed coolant naturally separates from the heating plate under gravity. Therefore, the heating plate does not heat the coolant during heating, improving heating efficiency.

[0030] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0031] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0032] Figure 1 A schematic diagram of the chip temperature control device provided in this application;

[0033] Figure 2 A top view of the liquid cooling tank and spray system in the chip temperature control device provided in this application;

[0034] Figure 3This is a schematic diagram of the nozzle arrangement and water spraying in the first embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the nozzle arrangement in the second embodiment of this application;

[0036] Figure 5 This is a schematic diagram of the nozzle arrangement in the third embodiment of this application;

[0037] Figure 6 This is a schematic diagram of the control method of the chip temperature control device provided in the embodiments of this application.

[0038] In the picture:

[0039] 10-Chip temperature control device; 11-Heating plate; 12-Liquid cooling tank; 121-Bottom wall; 1210-Protrusion; 1211-Channel; 122-Side wall; 1220-Groove;

[0040] 20-Spraying system; 21-Nozzle; 22-Inlet pipe; 23-Outlet pipe; 24-Return pipe; 25-Water pump; 30-Control system; 40-Microfluidic chip. Detailed Implementation

[0041] This application is described in detail below. Examples of embodiments of this application are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Furthermore, detailed descriptions of known technologies that are unnecessary for the features of this application are omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0042] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in this application means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when we say an element is “connected” or “coupled” to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein can include wireless connections or wireless coupling. The term “and / or” as used herein includes all or any units and all combinations of one or more associated listed items.

[0043] The inventors of this application considered that during PCR detection, the PCR temperature control device needs to heat the microfluidic chip 40 placed within it and control the microfluidic chip 40 to maintain different temperatures for corresponding durations. To improve the efficiency of PCR detection and reduce detection time, the PCR control device needs to be able to heat up and cool down rapidly and efficiently. Some PCR temperature control devices in related technologies use air cooling, but air cooling has low cooling efficiency. If water cooling is used, since the coolant is always in contact with the heating element in the PCR temperature control device, the heating element will also heat the coolant during the heating process, resulting in a slower heating rate and increased energy consumption.

[0044] The chip temperature control device and its control method, as well as the medical testing equipment provided in this application, aim to solve the above-mentioned technical problems in the prior art.

[0045] The following describes in detail, with reference to the accompanying drawings, the chip temperature control device and its control method, and the medical testing equipment provided in the embodiments of this application.

[0046] Combination Figure 1 and Figure 2 As shown, the chip temperature control device 10 in this embodiment includes:

[0047] The heating plate 11 is used to support the microfluidic chip 40 and to heat the microfluidic chip 40.

[0048] The liquid cooling tank 12 includes a bottom wall 121 and a side wall 122 protruding from the side edge of the bottom wall 121. The end of the side wall 122 away from the bottom wall 121 supports the heating plate 11.

[0049] The liquid spraying system 20 includes nozzles 21 disposed in the liquid cooling tank 12;

[0050] The control system 30 is electrically connected to the heating plate 11 and the spray system 20, respectively. It is configured to control the nozzle 21 to spray coolant onto the heating plate 11 when it is necessary to lower the temperature of the microfluidic chip 40, and to control the heating plate 11 to heat up and control the nozzle 21 to stop spraying coolant when it is necessary to raise the temperature of the microfluidic chip 40.

[0051] Specifically, the heating plate 11 is used to place the microfluidic chip 40. The heating plate 11 can be made of a material with good thermal conductivity, such as metal. After being powered on, the heating plate 11 heats up, raising the temperature of the microfluidic chip 40 placed on it. The liquid cooling tank 12 includes a bottom wall 121 and a side wall 122 disposed on the bottom wall 121. The side wall 122 is located at the side edge of the bottom wall 121, forming an open space. A groove 1220 is provided at the end of the side wall 122 away from the bottom wall 121 to support the heating plate 11. A nozzle 21 is disposed in the liquid cooling tank 12, and the control system 30 is electrically connected to the heating plate 11 and the nozzle 21 respectively.

[0052] In a PCR test cycle, the temperature of the microfluidic chip 40 placed on the heating plate 11 needs to be raised to a specified temperature, then the temperature of the microfluidic chip 40 needs to be lowered to a specified temperature, and then the temperature of the microfluidic chip 40 needs to be raised to a specified temperature again. When it is necessary to raise the temperature of the microfluidic chip 40 placed on the heating plate 11, the control system 30 controls the heating plate 11 to be powered on and heated, and controls the nozzle 21 to stop spraying coolant; when it is necessary to lower the temperature of the microfluidic chip 40 placed on the heating plate 11, the control system 30 controls the heating plate 11 to be powered off and stopped heating, and controls the nozzle 21 to spray coolant onto the heating plate 11; when it is necessary to raise the temperature of the microfluidic chip 40 placed on the heating plate 11 again, the control system 30 controls the heating plate 11 to be powered on and heated, and controls the nozzle 21 to stop spraying coolant. At this time, the coolant naturally separates from the heating plate 11 under the action of gravity and falls back into the liquid cooling tank 12. The coolant does not directly contact the heating plate 11 (the air medium in the liquid cooling tank 12 separates the coolant and the heating plate 11). Therefore, the heating plate 11 does not need to heat the coolant when heating. Compared with the water cooling method of related technologies where the coolant is always in contact with the heating plate 11, the heating plate 11 heats up faster and has higher heating efficiency.

[0053] The chip temperature control device 10 provided in this application embodiment, by setting up a liquid cooling tank 12, a nozzle 21 and a control system 30, sprays coolant onto the heating plate 11 through the nozzle 21 when the temperature of the microfluidic chip 40 needs to be lowered, which improves the cooling efficiency compared with air cooling; when the temperature of the microfluidic chip 40 needs to be raised, the nozzle 21 is controlled to stop spraying coolant, and the previously sprayed coolant naturally separates from the heating plate 11 under the action of gravity. Therefore, the heating plate 11 will not heat the coolant when it is heated, which improves the heating efficiency.

[0054] It should be noted that the shape and size of the liquid cooling tank 12 can be adjusted according to the actual situation. The coolant can be water, or it can be a liquid with better thermal conductivity (lower boiling point and easier volatility) formed by adding additives to water. The specific choice can be determined according to the actual situation.

[0055] The specific position of the nozzle 21 can be adjusted according to actual conditions. For example, it can be set on the side wall 122 or bottom wall 121 of the liquid cooling tank 12. Optionally, in the embodiments of this application, such as Figure 1 As shown, the nozzle 21 is located on the bottom wall 121 of the liquid cooling tank 12, that is, the nozzle 21 is located at the bottom of the liquid cooling tank 12. Therefore, it avoids the need to adjust the angle when the nozzle 21 is set on the side wall 122 of the liquid cooling tank 12, and makes it easier to set the nozzle 21.

[0056] When the nozzle 21 is positioned at the bottom of the liquid cooling tank 12, in the direction from the bottom wall 121 of the liquid cooling tank 12 to the heating plate 11 ( Figure 1 In the first direction (as described in the first part of the text), the distance between the nozzle 21 and the heating plate 11 needs to be maintained within a reasonable range. If the distance between the nozzle 21 and the heating plate 11 is too small, after the coolant falls back into the liquid cooling tank, if the coolant is not drained in time, the liquid level of the coolant will rise and easily come into contact with the heating plate 11, thus affecting the heating rate of the heating plate 11. If the distance between the nozzle 21 and the heating plate 11 is too large, the nozzle 21 needs to have a large spray pressure when spraying the coolant. If the spray pressure is insufficient, the coolant may not be able to contact the heating plate 11 after being sprayed, affecting the cooling performance. Optionally, in the embodiments of this application, in the direction from the bottom wall 121 of the liquid cooling tank 12 to the heating plate 11, the distance between the nozzle 21 and the heating plate 11 is less than or equal to 20 cm. This ensures that the coolant can contact the heating plate 11 after being sprayed, ensuring the cooling effect of the heating plate 11, while reducing the risk of the coolant accumulating in the liquid cooling tank and coming into contact with the heating plate 11, thus avoiding affecting the heating rate of the heating plate 11.

[0057] The specific position of the nozzle 21 can be adjusted according to the actual situation. Optionally, in the embodiments of this application, the orthographic projection of the nozzle 21 on the bottom wall 121 of the liquid cooling tank 12 overlaps with the orthographic projection of the microfluidic chip 40 on the bottom wall 121 of the liquid cooling tank 12. Therefore, the coolant sprayed by the nozzle 21 can fully cover the area where the microfluidic chip 40 is located, which is beneficial to the faster cooling of the microfluidic chip 40 on the heating plate 11.

[0058] The area dimensions of the heating plate 11 and the liquid cooling tank 12 can be determined based on the area dimensions of the microfluidic chip 40. For example, some existing microfluidic chips 40 have dimensions of 4cm x 5cm (the chip is a rectangle with a length of 5cm and a width of 4cm), so the area of ​​the heating plate 11 and the water tank needs to be greater than or equal to 20 square centimeters to better support and carry the microfluidic chip 40. For a microfluidic chip 40 with dimensions of 4cm x 5cm, the effective area size of the chip (the area located at the center of the microfluidic chip 40) is 1.5cm x 1.5cm (a square with a side length of 1.5cm), and the effective area is 2.25 square centimeters. Optionally, in the embodiments of this application, the orthographic projection area of ​​the nozzle 21 on the heating plate 11 is greater than or equal to 2.25 square centimeters. Therefore, after placing the microfluidic chip 40 on the heating plate 11, the orthographic projection of the effective area of ​​the microfluidic chip 40 on the heating plate 11 can fall into the orthographic projection of the nozzle 21 on the heating plate 11. After the nozzle 21 sprays coolant, the coolant can fully cover the area on the heating plate 11 corresponding to the effective area of ​​the microfluidic chip 40, thereby improving the cooling efficiency of the microfluidic chip 40.

[0059] The opening shape of nozzle 21 can be square, circular, elliptical, etc., and the specific shape can be determined according to the actual situation. Optional, such as Figure 2 As shown in the embodiments of this application, the nozzle 21 has a circular opening shape, which makes the manufacturing of the nozzle 21 easier and reduces the flow resistance of the coolant at the nozzle 21, thereby increasing the injection speed and injection pressure of the coolant. The number of nozzles 21 can be single or multiple, such as... Figure 3 As shown, when nozzle 21 is a single nozzle, the opening diameter of nozzle 21 is greater than or equal to 2cm.

[0060] It should be noted that during the cooling process of the heating plate 11, the density of the nozzles 21 and the size of the nozzles 21 affect the cooling rate of the heating plate 11. The cooling rate is fastest when only one nozzle 21 is provided and covers the area where the microfluidic chip 40 is located. When the heating of the heating plate 11 is uneven (the middle area heats up faster and has a higher temperature), the temperature of different areas on the heating plate 11 is different. In order to make the cooling of the heating plate more uniform, optionally, in the embodiments of this application, combined with Figure 2 , Figure 4 and Figure 5 As shown, there are multiple nozzles 21 arranged in an array. When spraying coolant, the nozzles 21 near the center area (…) Figure 5The time for the nozzles in the middle region S1 to spray coolant is extended, and the time for the nozzles to spray coolant is gradually reduced from the middle region to the edge region. Therefore, the nozzles 21 can be controlled in zones to achieve the purpose of uniformly cooling the heating plate 11.

[0061] When there are multiple nozzles 21, the size of the nozzles 21 and the spacing between them can be adjusted according to the actual situation. Given a fixed area where the nozzles 21 cover, the smaller the opening size of the nozzles 21, the smaller the spacing between the nozzles 21, and the greater the number of nozzles 21. (See also...) Figure 4 Optionally, in embodiments of this application, the opening diameter of the nozzle 21 is less than or equal to 2 mm, and the distance d between two adjacent nozzles 21 is less than or equal to 2 mm. This increases the number of nozzles 21, which is beneficial for ensuring sufficient contact between the heating plate 11 and the coolant, thereby improving cooling efficiency.

[0062] The inventors of this application have performed simulations of two specific embodiments. In one specific embodiment, such as... Figure 3 As shown, a single circular nozzle 21 with a diameter of 2 cm is used. When the inlet velocity is 0.1 m / s, the ejected liquid... Figure 1 When the height in the first direction reaches 20cm, it still possesses velocity, with a velocity magnitude of 0.007m / s. In another specific embodiment, such as... Figure 4 As shown, multiple circular nozzles 21 are used, arranged in a 4x4 array (total of 16 nozzles, 4 horizontally and 4 vertically). The diameter of each nozzle 21 is 2 mm. When the inlet velocity is 1.7 m / s, the ejected liquid... Figure 1 When the height in the first direction reaches 20cm, it still has speed, with a speed of 0.045m / s.

[0063] Optional, such as Figure 1 and Figure 2 As shown in the embodiments of this application, the spray system 20 further includes a water pump 25, an inlet pipe 22, and a return pipe 24. The inlet pipe 22 is connected to the water pump 25 and the nozzle 21, respectively, and the return pipe 24 is connected to the water pump 25 and the liquid cooling tank 12, respectively. The water pump 25 is used to drive the coolant to flow from the inlet pipe 22 to the nozzle 21, so that the coolant is sprayed out from the nozzle 21. The water pump 25 is also used to draw coolant from the liquid cooling tank 12 through the return pipe 24.

[0064] Combination Figure 1 and Figure 2As shown, the inlet pipe 22 is embedded in the bottom wall 121 of the liquid cooling tank 12, and the nozzle 21 is located on the side of the bottom wall 121 near the heating plate 11. The inlet pipe 22 is connected to the nozzle 21 and the water pump 25. The spraying system 20 also includes an outlet pipe 23, which is embedded in the bottom wall 121 of the liquid cooling tank 12. The outlet pipe 23 is connected to the water pump 25 and the nozzle 21. The inlet pipe 22, the outlet pipe 23, and the water pump 25 form a loop. When it is necessary for the nozzle 21 to spray coolant, the control system 30 controls the water pump 25 to start. The water pump 25 drives the coolant to flow from the inlet pipe 22 to the nozzle 21 and sprays the coolant out of the nozzle 21. The coolant that is not sprayed out of the nozzle 21 flows back to the water pump 25 through the outlet pipe 23. The opening size of the nozzle 21 and the power of the water pump 25 affect the speed at which the coolant is sprayed. It can be understood that when the number of nozzles 21 is fixed, the smaller the opening size of the nozzle 21 and the greater the power of the water pump 25, the faster the coolant is sprayed. The opening size of the nozzle 21 and the power of the water pump 25 can be determined according to the actual situation.

[0065] Combination Figure 1 and Figure 2 As shown, the return water pipe 24 is connected to both the liquid cooling tank 12 and the outlet water pipe 23. The coolant sprayed from the nozzle 21 separates from the heating plate 11 under gravity and falls back into the liquid cooling tank, then flows back to the water pump 25 via the return water pipe 24 and the outlet water pipe 23, thus achieving coolant circulation. By setting up the return water pipe 24, coolant accumulation in the liquid cooling tank 12 is prevented from contacting the heating plate 11, thus avoiding affecting the heating rate of the heating plate 11. Furthermore, the coolant can circulate within the chip temperature control device 10, avoiding frequent addition of coolant and facilitating its use.

[0066] Optional, combined Figure 1 and Figure 2 As shown, the bottom wall 121 of the liquid cooling tank 12 has a protrusion 1210 on the side near the heating plate 11, and the nozzle 21 passes through the protrusion 1210. Specifically, a channel 1220 can be formed between two adjacent protrusions 1210. After the cooling liquid falls back into the liquid cooling tank 12, the channel 1220 can play a guiding role, so that the cooling liquid can gather more quickly and flow to the return water pipe 24, thus accelerating the circulation of the cooling liquid.

[0067] It should be noted that the number of inlet pipe 22, outlet pipe 23 and return pipe 24 can be adjusted according to the actual situation. Optionally, there can be multiple inlet pipes 22, which can improve the circulation efficiency of the coolant and help to improve the cooling speed of the heating plate 11.

[0068] Optionally, in the embodiments of this application, in the direction from the bottom wall 121 of the liquid cooling tank 12 to the heating plate 11 ( Figure 1 In the first direction (of the water supply), the distance between the inlet pipe 22 and the heating plate 11 is less than or equal to the distance between the return pipe 24 and the heating plate 11. Specifically, in conjunction with... Figure 1 and Figure 2 As shown, the return water pipe 24 and the outlet water pipe 23 are below the inlet water pipe 22, that is, the height of the return water pipe 24 and the outlet water pipe 23 is lower than the height of the inlet water pipe 22. Therefore, it is convenient for the coolant to collect in the liquid cooling tank 12 and then flow to the water pump 25 through the return water pipe 24 and the outlet water pipe 23, which helps to speed up the circulation of the coolant.

[0069] In an embodiment of this application, optionally, the control system 30 includes a temperature sensor disposed on the heating plate 11. Figure 1 (Not shown in the image), a temperature detector is configured to monitor the temperature of the microfluidic chip 40 placed on the heating plate 11 in real time. The control system 30 is configured to control the heating plate 11 to be energized and heated according to preset parameters based on the detected temperature of the microfluidic chip 40, and to control the nozzle 21 to spray coolant onto the heating plate 11. The temperature detector is electrically connected to the control system 30, transmitting the measured temperature to the control system 30. By setting a temperature detector, the heating and cooling of the heating plate 11 can be more precisely controlled based on the temperature measured by the detector (the timing and duration of energizing and spraying coolant are more precise), which is beneficial to improving the heating and cooling efficiency of the chip temperature control device 10. The specific location of the temperature detector can be adjusted according to actual conditions and is not limited here.

[0070] Based on the same inventive concept, this application also provides a medical testing device, which includes the chip temperature control device 10 provided in this application embodiment. Since the medical testing device includes the chip temperature control device 10 provided in this application embodiment, the medical testing device has the same beneficial effects as the chip temperature control device 10, which will not be described again here.

[0071] Based on the same inventive concept, this application also provides a control method for the chip temperature control device 10, such as... Figure 6 As shown, it includes:

[0072] S101. In a test cycle, control the heating plate to be powered on, so that the heating plate reaches the first preset temperature and continues for the first preset time;

[0073] S102. Control the heating plate to turn off the power and control the nozzle to spray coolant onto the heating plate so that the heating plate reaches the second preset temperature;

[0074] S103. Control the nozzle to continuously spray coolant onto the heating plate for the second preset time;

[0075] S104. Control the nozzle to stop spraying coolant onto the heating plate, control the heating plate to be powered on, so that the heating plate reaches the third preset temperature and continues for the third preset time.

[0076] Please see Figure 1 , Figure 2 and Figure 4 Specifically, the microfluidic chip 40 is first placed on the heating plate 11. In one PCR test cycle, the control system 30 controls the heating plate 11 to be powered on and heated until it reaches a first preset temperature. Then, the control system 30 controls the heating plate 11 to be powered on intermittently to maintain the first preset temperature for a first preset time. Next, the control system 30 controls the heating plate 11 to be powered off and controls the nozzle 21 to spray coolant onto the heating plate 11. When the temperature of the heating plate 11 drops to a second preset temperature, the control system 30 controls the nozzle 21 to continue spraying coolant onto the heating plate 11 for a second preset time and then stops spraying coolant. The coolant falls back into the liquid cooling tank under the action of gravity. Then, the control system 30 controls the nozzle 21 to stop spraying coolant and simultaneously controls the heating plate 11 to be powered on until it reaches a third preset temperature. Then, the control system 30 controls the heating plate 11 to be powered on intermittently to maintain the third preset temperature for a third preset time.

[0077] In the embodiments of this application, by setting up a liquid cooling tank 12, a nozzle 21 and a control system 30, when it is necessary to lower the temperature of the microfluidic chip 40, the nozzle 21 sprays coolant onto the heating plate 11, which improves the cooling efficiency compared with air cooling. When it is necessary to raise the temperature of the microfluidic chip 40, the nozzle 21 is controlled to stop spraying coolant, and the previously sprayed coolant naturally separates from the heating plate 11 under the action of gravity. Therefore, the heating plate 11 will not heat the coolant when it is heated, which improves the heating efficiency.

[0078] It should be noted that the first preset temperature, second preset temperature, third preset temperature, first preset time, second preset time, and third preset time can be adjusted according to actual conditions. Please refer to [link / reference needed]. Figure 1 , Figure 2 and Figure 4In one specific embodiment, in a PCR test cycle, the heating plate 11 is first heated to 95 degrees Celsius (first preset temperature) and maintained for 30 seconds (first preset time) to pre-denature the DNA. Then, the heating plate 11 is de-energized to stop heating, and the water pump 25 is turned on, causing the nozzle 21 to spray cooling liquid onto the heating plate 11, lowering its temperature to 56 degrees Celsius (second preset temperature), and the spraying of cooling liquid continues for 30 seconds (second preset time) to anneal the DNA. Next, the water pump 25 is turned off to stop spraying cooling liquid, and the heating plate 11 is energized to raise its temperature to 72 degrees Celsius (third preset temperature) and maintained for 60 seconds (third preset time) to extend the DNA, thus completing one PCR cycle. A complete PCR test requires 35 to 45 PCR cycles.

[0079] By applying the embodiments of this application, at least the following beneficial effects can be achieved:

[0080] 1. The chip temperature control device 10 in this embodiment includes a heating plate 11, a liquid cooling tank 12, a spraying system 20, and a control system 30. The heating plate 11 is supported at the end of the side wall 122 of the liquid cooling tank 12 away from the bottom wall 121. The spraying system 20 includes nozzles 21 disposed in the liquid cooling tank 12. The control system 30 is configured to control the heating plate 11 to heat when the temperature of the microfluidic chip 40 needs to be increased, and is configured to control the nozzles 21 to spray coolant onto the heating plate 11 when the temperature of the microfluidic chip 40 needs to be decreased. By setting up the liquid cooling tank 12, the nozzles 21, and the control system 30, the nozzles 21 spray coolant onto the heating plate 11 when the temperature of the microfluidic chip 40 needs to be decreased, which improves the cooling efficiency compared to air cooling. When the temperature of the microfluidic chip 40 needs to be increased, the nozzles 21 stop spraying coolant, and the previously sprayed coolant naturally separates from the heating plate 11 under the action of gravity. Therefore, the heating plate 11 does not heat the coolant when heating, which improves the heating efficiency.

[0081] 2. In the embodiments of this application, the nozzle 21 is disposed at the bottom wall 121 of the liquid cooling tank 12, that is, the nozzle 21 is located at the bottom of the liquid cooling tank 12. Therefore, the angle adjustment is avoided when the nozzle 21 is disposed on the side wall 122 of the liquid cooling tank 12, and the placement of the nozzle 21 is easier.

[0082] 3. In the embodiments of this application, by making the distance between the nozzle 21 and the heating plate 11 in the direction from the bottom wall 121 of the liquid cooling tank 12 to the heating plate 11 less than or equal to 20 cm, it can be ensured that the coolant can contact the heating plate 11 after being sprayed out, thus ensuring the cooling effect of the heating plate 11. At the same time, it can reduce the risk of the coolant falling back into the liquid cooling tank and accumulating, and then contacting the heating plate 11, thus avoiding affecting the heating of the heating plate 11.

[0083] 4. By making the orthographic projection area of ​​the nozzle 21 on the heating plate 11 greater than or equal to 2.25 square centimeters, the orthographic projection of the effective area of ​​the microfluidic chip 40 on the heating plate 11 can fall within the orthographic projection of the nozzle 21 on the heating plate 11. After the nozzle 21 sprays coolant, the coolant can fully cover the area on the heating plate 11 corresponding to the effective area of ​​the microfluidic chip 40, thereby improving the cooling efficiency of the microfluidic chip 40.

[0084] 5. In the embodiments of this application, by setting multiple nozzles 21 and arranging them in an array, multiple water jets can be sprayed when spraying coolant, making the contact between the heating plate 11 and the coolant more sufficient and uniform, which is beneficial to improving the cooling efficiency.

[0085] 6. By making the opening diameter of the nozzle 21 less than or equal to 2 mm, and the spacing between two adjacent nozzles 21 in the plurality of nozzles 21 less than or equal to 2 mm, the number of nozzles 21 can be increased, which is beneficial to ensure sufficient contact between the heating plate 11 and the coolant and improve the cooling efficiency.

[0086] 7. By setting up the return water pipe 24, the coolant can be prevented from accumulating in the liquid cooling tank 12 and coming into contact with the heating plate 11, thus avoiding affecting the heating rate of the heating plate 11. It can also enable the coolant to circulate in the chip temperature control device 10, avoiding the need for frequent additional addition of coolant and facilitating the use of the chip temperature control device 10.

[0087] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0088] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0089] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0090] The above description is only a partial embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A chip temperature control device, characterized in that, include: A heating plate is used to support the microfluidic chip and to heat the microfluidic chip. A liquid cooling tank includes a bottom wall and a side wall protruding from the side edge of the bottom wall, wherein the end of the side wall away from the bottom wall supports the heating plate; A liquid spraying system, including nozzles disposed within the liquid cooling tank; The control system, electrically connected to the heating plate and the spraying system respectively, is configured to control the nozzle to spray coolant onto the heating plate when it is necessary to lower the temperature of the microfluidic chip, and is configured to control the heating plate to heat up and control the nozzle to stop spraying coolant when it is necessary to raise the temperature of the microfluidic chip. The area dimensions of the heating plate and the liquid cooling tank are determined based on the area dimensions of the microfluidic chip. The nozzle is located on the bottom wall of the liquid cooling tank; The bottom wall of the liquid cooling tank has a protrusion on the side near the heating plate, the nozzle passes through the protrusion, and two adjacent protrusions form a channel; In the direction from the bottom wall of the liquid cooling tank to the heating plate, the distance between the nozzle and the heating plate is less than or equal to 20 centimeters.

2. The chip temperature control device according to claim 1, characterized in that, The orthographic projection of the nozzle on the bottom wall of the liquid cooling tank overlaps with the orthographic projection of the microfluidic chip on the bottom wall of the cooling tank.

3. The chip temperature control device according to claim 2, characterized in that, The projected area of ​​the nozzle on the heating plate is greater than or equal to 2.25 square centimeters.

4. The chip temperature control device according to claim 3, characterized in that, The nozzle has a circular opening shape, and the opening diameter is less than or equal to 2 millimeters.

5. The chip temperature control device according to claim 4, characterized in that, The number of nozzles is multiple, and the multiple nozzles are arranged in an array.

6. The chip temperature control device according to any one of claims 1 to 5, characterized in that, The spray system further includes a water pump, an inlet pipe, and a return pipe. The inlet pipe is connected to the water pump and the nozzle, and the return pipe is connected to the water pump and the liquid cooling tank. There are multiple inlet pipes. The water pump is used to drive the coolant from the inlet pipe to the nozzle, so that the coolant is sprayed out from the nozzle. The water pump is also used to draw coolant from the liquid cooling tank through the return pipe.

7. The chip temperature control device according to claim 6, characterized in that, In the direction from the bottom wall of the liquid cooling tank to the heating plate, the distance between the inlet pipe and the heating plate is less than or equal to the distance between the return pipe and the heating plate.

8. The chip temperature control device according to any one of claims 1 to 5, characterized in that, The control system includes a temperature detector disposed on the heating plate, the temperature detector being configured to monitor the temperature of the microfluidic chip placed on the heating plate in real time; The control system is configured to control the heating plate to be powered on and heated according to preset parameters based on the detected temperature of the microfluidic chip, and to control the nozzle to spray coolant onto the heating plate.

9. A medical testing device, characterized in that, Includes the chip temperature control device according to any one of claims 1 to 8.

10. A control method for the chip temperature control device according to any one of claims 1 to 8, characterized in that, include: In a test cycle, the heating plate is powered on to reach a first preset temperature and maintain it for a first preset time. The heating plate is powered off, and the nozzle is controlled to spray coolant onto the heating plate so that the heating plate reaches the second preset temperature. The nozzle is controlled to continuously spray coolant onto the heating plate for a second preset time. Control the nozzle to stop spraying coolant onto the heating plate, control the heating plate to be powered on, so that the heating plate reaches a third preset temperature and remains at a third preset temperature for a third preset time.

Citation Information

Patent Citations

  • Power module life test cooling device

    CN109755193A

  • Temperature control system, detection system and temperature control method of micro-fluidic chip

    CN111266139A

  • Chip mounting method

    CN111696871A