A multi-locus temperature monitoring system and method

Abstract

The application provides a multi-bin temperature monitoring system and method in the technical field of chemical component storage, which comprises a communication acquisition board and a plurality of temperature acquisition boards; the communication acquisition board comprises a first MCU, an Ethernet interface, a PHY chip, a memory, a plurality of fire-fighting IO ports and a plurality of first communication interfaces; the temperature acquisition board comprises a second MCU, a second communication interface, a plurality of ADC chips and a plurality of temperature sensors; the first MCU is connected with the PHY chip, the memory, the fire-fighting IO ports and the first communication interfaces respectively; the Ethernet interface is connected with the PHY chip; each first communication interface is connected with a plurality of second communication interfaces respectively; one end of each ADC chip is connected with the second MCU, and the other end is connected with a plurality of temperature sensors. The application has the advantages of greatly reducing the temperature monitoring cost and greatly improving the production line expandability.

Description

Technical Field

[0001] This invention relates to the field of chemical composition and capacity technology, and in particular to a multi-storage temperature monitoring system and method. Background Technology

[0002] After production, battery cells need to undergo formation and capacity testing. Formation involves the initial charge and discharge of the cells, while capacity testing involves sorting the cells by capacity. Due to hardware and press limitations, the formation and capacity testing line is divided into multiple storage locations, each corresponding to multiple battery cells. Each cell requires individual temperature monitoring during the formation and capacity testing process to prevent overheating or underheating, which could lead to explosions or render the cells unusable.

[0003] Traditionally, each storage location is equipped with an independent temperature acquisition system, which transmits monitoring data to the central control system for monitoring. This has the following problems: 1. Installing an independent temperature acquisition system for each storage location is costly; 2. Each temperature acquisition system requires separate maintenance, which is a large workload and increases labor costs; 3. When it is necessary to increase the number of storage locations or battery cells, the temperature acquisition system needs to be reinstalled and configured, which is not conducive to production line expansion and upgrades.

[0004] Therefore, how to provide a multi-location temperature monitoring system and method to reduce temperature monitoring costs and improve production line scalability has become an urgent technical problem to be solved. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a multi-location temperature monitoring system and method to reduce temperature monitoring costs and improve production line scalability.

[0006] In a first aspect, the present invention provides a multi-storage temperature monitoring system, including a communication acquisition board and several temperature acquisition boards;

[0007] The communication acquisition board includes a first MCU, an Ethernet interface, a PHY chip, a memory, several fire I / O ports, and several first communication interfaces.

[0008] The temperature acquisition board includes a second MCU, a second communication interface, several ADC chips, and several temperature sensors.

[0009] The first MCU is connected to the PHY chip, memory, fire IO port and first communication interface respectively; the Ethernet interface is connected to the PHY chip; each of the first communication interfaces is connected to a number of second communication interfaces respectively; one end of each of the ADC chips is connected to the second MCU and the other end is connected to a number of temperature sensors.

[0010] Furthermore, the memory is FLASH.

[0011] Furthermore, both the first and second communication interfaces are 485, CAN, CANFD, or SPI interfaces.

[0012] Furthermore, the temperature sensor is a platinum resistance thermometer.

[0013] Furthermore, it also includes a host computer connected to the Ethernet interface.

[0014] Furthermore, the ADC chip is connected to the second MCU via an SPI interface.

[0015] Secondly, the present invention provides a multi-storage location temperature monitoring method, comprising the following steps:

[0016] Step S10: The first MCU creates several virtual storage locations, configures the temperature acquisition board occupied by each virtual storage location, and allocates a storage address in the memory for each temperature acquisition board.

[0017] Step S20: The first MCU stores the temperature data collected by each temperature acquisition board to the storage address;

[0018] Step S30: The first MCU sets temperature monitoring parameters for each of the virtual storage locations, monitors the stored temperature data based on the monitoring parameters, and generates a monitoring report.

[0019] Step S40: The first MCU transmits a fire alarm through the fire IO port based on the monitoring report.

[0020] Furthermore, it also includes:

[0021] Step S50: The communication acquisition board receives the upgrade message sent by the host computer, parses the upgrade message to obtain the temperature acquisition board number to be upgraded; based on the temperature acquisition board number, it matches the corresponding temperature acquisition board from the virtual storage location, and determines whether the matched temperature acquisition board is currently occupied. If so, it waits for the temperature acquisition board to be idle before performing the upgrade operation; otherwise, it immediately performs the upgrade operation.

[0022] Further, step S20 specifically includes:

[0023] The ADC converts the temperature data collected by the temperature sensor from an analog signal to a digital signal and transmits it to the second MCU. The second MCU then transmits the received temperature data to the first MCU through the second communication interface and the first communication interface in sequence. The first MCU stores the temperature data collected by each temperature acquisition board to the corresponding storage address.

[0024] Furthermore, in step S30, the temperature monitoring parameters include an upper limit for temperature protection, a lower limit for temperature protection, and a trigger duration.

[0025] The advantages of this invention are:

[0026] 1. By setting up a communication acquisition board and several temperature acquisition boards, each of the first communication interfaces of the communication acquisition board is connected to several temperature acquisition boards, and each ADC chip of the temperature acquisition board is connected to several temperature sensors. That is, the temperature data collected by several temperature sensors can be summarized and monitored through one communication acquisition board. Unlike the traditional method of installing a complete temperature acquisition system for each storage location, this reduces the purchase cost of equipment, the workload of maintenance, and the manpower cost of operation and maintenance. When it is necessary to increase the number of storage locations or cells, only the corresponding temperature sensors need to be added and connected to the ADC chip. Ultimately, this greatly reduces the cost of temperature monitoring and greatly improves the scalability of the production line.

[0027] 2. By creating several virtual storage locations through the first MCU, configuring the temperature acquisition board occupied by each virtual storage location, and setting temperature monitoring parameters for each virtual storage location, the number of virtual storage locations and the temperature acquisition board occupied by each virtual storage location can be freely configured according to actual production needs. Temperature monitoring parameters can be flexibly set for differentiated monitoring, which greatly improves the flexibility and applicability of the monitoring system. Furthermore, the temperature acquisition board can be expanded and upgraded without stopping the system, greatly improving the scalability and maintainability of the monitoring system. Attached Figure Description

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] Figure 1 This is a circuit block diagram of a multi-storage temperature monitoring system according to the present invention.

[0030] Figure 2 This is a flowchart of a multi-storage temperature monitoring method according to the present invention.

[0031] Marker explanation:

[0032] 100 - A multi-storage temperature monitoring system, 1 - Communication acquisition board, 2 - Temperature acquisition board, 3 - Host computer, 11 - First MCU, 12 - Ethernet interface, 13 - PHY chip, 14 - Memory, 15 - Fire protection I / O port, 16 - First communication interface, 21 - Second MCU, 22 - Second communication interface, 23 - ADC chip, 24 - Temperature sensor. Detailed Implementation

[0033] The technical solution in this application embodiment has the following general idea: the temperature data collected by several temperature sensors 24 is collected and monitored by a communication acquisition board 1, which eliminates the need to install a complete temperature acquisition system for each storage location as is the case in the past, thereby reducing the cost of temperature monitoring; when it is necessary to increase the number of storage locations or battery cells, only the corresponding temperature sensor 24 needs to be added and connected to the ADC chip 23, thereby improving the scalability of the production line.

[0034] Please refer to Figures 1 to 2 As shown, a preferred embodiment of the multi-storage temperature monitoring system 100 of the present invention includes a communication acquisition board 1 and a plurality of temperature acquisition boards 2.

[0035] The communication acquisition board 1 includes a first MCU 11, an Ethernet interface 12, a PHY chip 13, a memory 14, several fire I / O ports 15, and several first communication interfaces 16. The first MCU 11 is used to control the operation of the communication acquisition board 1. In specific implementation, any MCU that can perform this function can be selected from the existing technology, and it is not limited to any particular model. For example, the STM32F103 series MCU from STMicroelectronics is used. The control program is well known to those skilled in the art, and can be obtained by those skilled in the art without creative effort. The Ethernet interface 12 is used to connect to the host computer 3. The memory 14 is used to store the temperature data acquired by the temperature acquisition board 2. The fire I / O ports 15 are used to connect to fire-fighting equipment (not shown). The first communication interfaces 16 are used to communicate with the temperature acquisition board 2.

[0036] The temperature acquisition board 2 includes a second MCU 21, a second communication interface 22, several ADC chips 23, and several temperature sensors 24. The second MCU 21 is used to control the operation of the temperature acquisition board 2. In specific implementation, any MCU that can perform this function can be selected from the existing technology, and it is not limited to any particular model. For example, the STM32F103 series MCU from STMicroelectronics is used. Moreover, the control program is well known to those skilled in the art, and it can be obtained by those skilled in the art without any creative effort. The second communication interface 22 is used to communicate with the communication acquisition board 1. The ADC chips 23 are used to perform analog-to-digital conversion on the temperature data collected by the temperature sensors 24 to facilitate subsequent calculation, analysis, and monitoring.

[0037] The first MCU11 is connected to the PHY chip 13, the memory 14, the fire IO port 15 and the first communication interface 16 respectively; the Ethernet interface 12 is connected to the PHY chip 13; each of the first communication interfaces 16 is connected to a plurality of second communication interfaces 22 respectively; one end of each of the ADC chips 23 is connected to the second MCU 21, and the other end is connected to a plurality of temperature sensors 24.

[0038] The memory 14 is a FLASH.

[0039] Both the first communication interface 16 and the second communication interface 22 are 485 interfaces, CAN interfaces, CANFD interfaces or SPI interfaces.

[0040] The temperature sensor 24 is a platinum resistance thermometer.

[0041] It also includes a host computer 3, which is connected to the Ethernet interface 12.

[0042] The ADC chip 23 is connected to the second MCU 21 via the SPI interface.

[0043] A preferred embodiment of the multi-storage temperature monitoring method of the present invention includes the following steps:

[0044] Step S10: The first MCU creates several virtual storage locations, configures the temperature acquisition board occupied by each virtual storage location, and allocates a storage address for each temperature acquisition board in the memory; by creating the virtual storage locations, the temperature acquisition boards can be managed differently.

[0045] Step S20: The first MCU stores the temperature data collected by each temperature acquisition board to the storage address;

[0046] Step S30: The first MCU sets temperature monitoring parameters for each of the virtual storage locations, monitors the stored temperature data based on the monitoring parameters, and generates a monitoring report.

[0047] Step S40: The first MCU transmits a fire alarm through the fire IO port based on the monitoring report.

[0048] Also includes:

[0049] Step S50: The communication acquisition board receives the upgrade message sent by the host computer, parses the upgrade message to obtain the temperature acquisition board number to be upgraded; based on the temperature acquisition board number, it matches the corresponding temperature acquisition board from the virtual storage location, and determines whether the matched temperature acquisition board is currently occupied. If so, it waits for the temperature acquisition board to be idle before performing the upgrade operation; otherwise, it immediately performs the upgrade operation.

[0050] Step S20 specifically involves:

[0051] The ADC converts the temperature data collected by the temperature sensor from an analog signal to a digital signal and transmits it to the second MCU. The second MCU then transmits the received temperature data to the first MCU through the second communication interface and the first communication interface in sequence. The first MCU stores the temperature data collected by each temperature acquisition board to the corresponding storage address.

[0052] In step S30, the temperature monitoring parameters include the upper limit of temperature protection, the lower limit of temperature protection, and the trigger duration.

[0053] During specific monitoring, when the temperature value carried by the temperature data triggers for a duration exceeding the upper limit of the temperature protection, a high-level signal is sent to the relay of the fire protection equipment through the fire IO port to trigger the fire protection equipment to perform the corresponding action; when the temperature value carried by the temperature data triggers for a duration lower than the lower limit of the temperature protection, a high-level signal is also sent to the relay of the fire protection equipment through the fire IO port to trigger the fire protection equipment to perform the corresponding action.

[0054] In summary, the advantages of this invention are as follows:

[0055] 1. By setting up a communication acquisition board and several temperature acquisition boards, each of the first communication interfaces of the communication acquisition board is connected to several temperature acquisition boards, and each ADC chip of the temperature acquisition board is connected to several temperature sensors. That is, the temperature data collected by several temperature sensors can be summarized and monitored through one communication acquisition board. Unlike the traditional method of installing a complete temperature acquisition system for each storage location, this reduces the purchase cost of equipment, the workload of maintenance, and the manpower cost of operation and maintenance. When it is necessary to increase the number of storage locations or cells, only the corresponding temperature sensors need to be added and connected to the ADC chip. Ultimately, this greatly reduces the cost of temperature monitoring and greatly improves the scalability of the production line.

[0056] 2. By creating several virtual storage locations through the first MCU, configuring the temperature acquisition board occupied by each virtual storage location, and setting temperature monitoring parameters for each virtual storage location, the number of virtual storage locations and the temperature acquisition board occupied by each virtual storage location can be freely configured according to actual production needs. Temperature monitoring parameters can be flexibly set for differentiated monitoring, which greatly improves the flexibility and applicability of the monitoring system. Furthermore, the temperature acquisition board can be expanded and upgraded without stopping the system, greatly improving the scalability and maintainability of the monitoring system.

[0057] While specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments described are merely illustrative and not intended to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A method for monitoring temperature at multiple storage locations, characterized in that: The method requires the use of a multi-storage temperature monitoring system, including a communication acquisition board, several temperature acquisition boards, and a host computer. The communication acquisition board includes a first MCU, an Ethernet interface, a PHY chip, a memory, several fire I / O ports, and several first communication interfaces. The temperature acquisition board includes a second MCU, a second communication interface, several ADC chips, and several temperature sensors. The first MCU is connected to the PHY chip, the memory, the fire IO port and the first communication interface respectively; The Ethernet interface is connected to the PHY chip and the host computer; each of the first communication interfaces is connected to a plurality of second communication interfaces; one end of each of the ADC chips is connected to the second MCU, and the other end is connected to a plurality of temperature sensors; The memory is FLASH; Both the first and second communication interfaces are 485, CAN, CANFD, or SPI interfaces. The temperature sensor is a platinum resistance thermometer. The ADC chip is connected to the second MCU via an SPI interface; The method includes the following steps: Step S10: The first MCU creates several virtual storage locations, configures the temperature acquisition board occupied by each virtual storage location, and allocates a storage address in the memory for each temperature acquisition board. Step S20: The ADC converts the temperature data collected by the temperature sensor from analog signal to digital signal and transmits it to the second MCU. The second MCU transmits the received temperature data to the first MCU in sequence through the second communication interface and the first communication interface. The first MCU stores the temperature data collected by each temperature acquisition board to the corresponding storage address. Step S30: The first MCU sets temperature monitoring parameters for each of the virtual storage locations, monitors the stored temperature data based on the monitoring parameters, and generates a monitoring report; the temperature monitoring parameters include an upper temperature protection limit, a lower temperature protection limit, and a trigger duration. Step S40: The first MCU transmits a fire alarm through the fire I / O port based on the monitoring report; Step S50: The communication acquisition board receives the upgrade message sent by the host computer, parses the upgrade message to obtain the temperature acquisition board number to be upgraded; based on the temperature acquisition board number, it matches the corresponding temperature acquisition board from the virtual storage location, and determines whether the matched temperature acquisition board is currently occupied. If so, it waits for the temperature acquisition board to be idle before performing the upgrade operation; otherwise, it immediately performs the upgrade operation.

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