Active phased array antenna temperature control device and satellite

Abstract

The present invention provides an active phased array antenna temperature control device and satellite. Based on the active phased array antenna, the ground electrical board utilizes a paper honeycomb sandwich structure. A polyimide-coated germanium film is affixed to the heat dissipation surface to ensure a high absorption-to-emission ratio, ensuring effective heat dissipation when high-power equipment is heated. Due to the extremely low thermal conductivity of the paper honeycomb, it also provides insulation after the equipment is shut down, significantly reducing the need for thermal control compensation heaters. This structure effectively addresses antenna temperature control issues by dissipating heat at high temperatures and retaining heat at low temperatures. This invention addresses both heat dissipation and insulation issues for active phased array antennas, while simultaneously adapting to temperature requirements under varying external heat flux conditions. It exhibits high adaptability, reliability, and design flexibility.

Description

Technical Field

[0001] The present invention relates to the technical field of spacecraft thermal control, and in particular to an active phased array antenna temperature control device and a satellite. Background Art

[0002] Active phased array antennas are a predominant form of spaceborne radar. Characterized by a cluster of devices evenly distributed across the antenna, they generate significant heat during operation, making thermal management a key issue in spacecraft thermal management design. In traditional satellites, because the cluster of devices is concentrated in a relatively small area, without effective thermal control measures, the rapid temperature rise of the devices during operation can lead to immediate failure.

[0003] To ensure heat dissipation, active phased array antennas are often positioned facing the ground as a heat dissipation surface, while compensating heaters are deployed to maintain the device temperature. Due to the large heat dissipation surface, compensating power is high when the device is powered off or not operating, placing a greater demand on satellite energy.

[0004] As spaceborne active phased array antenna technology advances, their size continues to increase, but the power density of these devices remains constant. This also necessitates the entire ground surface be used as a heat dissipation surface. Furthermore, while maintaining device temperature, the required compensation power increases exponentially with the increase in antenna aperture. Given limited resources, appropriate methods must be employed to maintain temperature.

[0005] After searching the prior art:

[0006] Patent document CN114865267A discloses a phased array antenna TR assembly and an active phased array antenna, involving the field of active phased array thermal control technology to improve the heat dissipation efficiency of the TR module. The heat dissipation measures provided in this patent document operate in an atmospheric environment and are not suitable for spaceborne applications.

[0007] Patent document CN112433552B discloses a temperature control device for an active phased array relay antenna. This device addresses the in-orbit temperature control issue for active phased array relay antennas by spraying white paint on the front of the antenna waveguide, adding a heat sink to the sun-facing side, and placing heat pipes within the cavity. However, the technology provided in this patent document is primarily applicable to smaller-diameter active phased array antennas and does not address methods for maintaining temperature when the device is not operating.

[0008] Patent document CN111918526A discloses a heat transfer device suitable for space-based equipment clusters. By combining a phase-change heat pipe with a phase-change energy storage box, this device effectively suppresses the temperature rise of short-term, high-power equipment clusters, addressing their temperature control issues. The core technology provided by this patent document lies in the use of phase-change heat pipes combined with a phase-change energy storage box, leveraging the properties of phase-change materials to achieve temperature control. This differs fundamentally from the present invention in its principles and methods, and places higher demands on the phase-change materials and devices, consuming additional weight resources.

[0009] Patent document CN107167774A discloses a thermal control system for a dual-side-view, high-power, high-heat-flux planar phased array antenna. The system includes a transmitter-receiver chip assembly and a pre-embedded area for phase-change heat pipes mounted on a structural honeycomb panel. The phase-change heat pipes utilize aluminum-ammonia phase-change heat pipes, which equalize the temperature of the transmitter-receiver chip assembly and suppress temperature rise. A thermally conductive filler is placed between the transmitter-receiver chip assembly and the pre-embedded heat pipe area on the honeycomb panel to increase contact heat conduction between the transmitter-receiver chip assembly and the phase-change heat pipes. The technology provided in this patent document relies on pre-embedded phase-change heat pipes in an aluminum honeycomb sandwich structure. Temperature rise suppression and insulation rely on the latent heat of the energy storage material in the phase-change heat pipes, which is fundamentally different from the present invention in terms of principle and method. Compared to this patent document, the present invention does not require the additional weight of phase-change energy storage materials and can reduce power consumption compared to conventional methods at lower temperatures (the overall temperature change is below the phase transition point of the phase-change energy storage material). The present invention fully utilizes the low thermal conductivity of the paper honeycomb structure, significantly reducing the use of thermal control compensation heaters regardless of the temperature conditions of the antenna. Summary of the Invention

[0010] In view of the defects in the prior art, the object of the present invention is to provide an active phased array antenna temperature control device and a satellite.

[0011] According to the present invention, an active phased array antenna temperature control device includes: an active mounting plate 4, a frame 5, an electrical board 1, a heat pipe 10, and a polyimide germanium-plated film 2;

[0012] The active mounting board 4, the frame 5, the electrical board 1, and the polyimide germanium-plated film 2 are connected in sequence;

[0013] The heat pipe 10 passes through the upper and lower surfaces of the active mounting plate 4;

[0014] The upper surface of the active mounting plate 4 serves as a mounting surface for the device group 3 , and the lower surface of the active mounting plate 4 is connected to the frame 5 .

[0015] Preferably, indium foil is placed between the device cluster 3 and the active mounting board 4 .

[0016] Preferably, the active mounting plate 4 is an aluminum honeycomb structure, the heat pipe 10 is pre-buried in the aluminum honeycomb structure, and the indium foil contacts the portion of the heat pipe 10 exposed from the upper surface of the active mounting plate 4 .

[0017] Preferably, it also includes a multi-layer thermal insulation component 6;

[0018] The multi-layer thermal insulation assembly 6 covers the back of the active mounting plate 4 and the back of the device group 3;

[0019] The multi-layer thermal insulation assembly 6 also covers the sides of the active mounting board 4 , the sides of the frame 5 , and the sides of the electrical board 1 .

[0020] Preferably, the side of the electrical board 1 with the polyimide germanium-plated film 2 is used as the ground surface of the antenna, and the solar absorption rate of the polyimide germanium-plated film 2 is α s =0.45±0.04, infrared emissivity ε h =0.79±0.04.

[0021] Preferably, the electrical board 1 adopts a paper honeycomb sandwich structure, wherein the paper honeycomb sandwich structure comprises: a carbon fiber skin 8, a paper honeycomb 7, and a printed circuit board 9 arranged in sequence;

[0022] The carbon fiber skin 8, paper honeycomb 7, and printed circuit board 9 are previously connected using structural adhesive;

[0023] The thermal conductivity of the paper honeycomb 7 is 0.05±0.01 W / m·K.

[0024] Preferably, the heat transfer path is: the device group 3 , the upper surface of the active mounting board 4 , the heat pipe 10 , the lower surface of the active mounting board 4 , the electrical board 1 , and the polyimide germanium-plated film 2 .

[0025] Preferably, the heat transfer path is: the device group 3, the upper surface of the active mounting board 4, the heat pipe 10, the lower surface of the active mounting board 4, the electrical board 1, and the polyimide germanium-plated film 2;

[0026] The heat transfer path of the electrical board 1 is: carbon fiber skin 8, paper honeycomb 7, and printed circuit board 9; the surface of the carbon fiber skin 8 receives heat radiation from the lower surface of the active mounting board 4; the printed circuit board 9 radiates heat to the cold space through the polyimide germanium-plated film 2.

[0027] Preferably, the plurality of devices in the device group 3 conduct heat to the same heat pipe 10 .

[0028] A satellite provided according to the present invention includes the active phased array antenna temperature control device.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. The present invention is adapted to the requirements of active phased array antennas for simultaneously taking into account both heat dissipation and thermal insulation. It is particularly suitable for temperature control of active phased array antennas with large apertures, high short-term power, high heat dissipation requirements, and tight power resources. It meets the heat dissipation and thermal insulation requirements of active phased array antennas in different spatial environments and internal power consumption conditions, has moderate temperature, and has high adaptability.

[0031] 2. The reliability of the entire device structure of the present invention is high, and the entire device product adopts passive thermal control measures, and there are no problems with system startup, termination and failure.

[0032] 3. The present invention solves the heat dissipation and heat preservation problems of active phased array antennas, and adapts to the temperature requirements under different external heat flow conditions. It has the characteristics of high adaptability, good reliability, flexible design, and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0034] Figure 1 This is a schematic structural comparison diagram of a top view and a side view of a heat dissipation and thermal insulation device for an active phased array antenna according to an embodiment of the present invention, wherein the multi-layer thermal insulation component is not shown in the top view.

[0035] Figure 2 This is a temperature curve of an actual test of a high-power device according to an embodiment of the present invention.

[0036] Figure 3 This is an actual on-orbit temperature curve of a high-power device according to an embodiment of the present invention.

[0037] The figure shows:

[0038] DETAILED DESCRIPTION

[0039] The present invention will be described in detail below with reference to specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those skilled in the art, several changes and improvements can be made without departing from the scope of the present invention. These all fall within the scope of protection of the present invention.

[0040] The active phased array antenna provided by the present invention adopts a paper honeycomb sandwich structure for the ground electrical board, and adheres a polyimide germanium-plated film on the heat dissipation surface to ensure the absorption-emission ratio, thereby ensuring a heat dissipation effect after a high-power device group generates heat. At the same time, considering that the paper honeycomb has an extremely low thermal conductivity, it also has a heat preservation function after the device is shut down, which greatly reduces the use of thermal control compensation heaters. Therefore, through this structure, heat can be dissipated at high temperatures and heat can be preserved at low temperatures, effectively solving the antenna temperature control problem and adapting to the temperature requirements under different external heat flow conditions. It has the characteristics of high adaptability, good reliability and flexible design.

[0041] like Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of a heat dissipation and insulation device for an active phased array antenna according to one embodiment of the present invention. The diagram shows an electrical board 1, a polyimide-coated germanium film 2, a device cluster 3, an active mounting plate 4, a frame 5, a multi-layer thermal insulation assembly 6, a paper honeycomb 7, a carbon fiber skin 8, a printed circuit board 9, and a heat pipe 10.

[0042] The active phased array antenna includes: an active mounting plate 4, a frame 5 and an electrical plate 1. The active mounting plate 4 and the electrical plate 1 are respectively mounted on the upper and lower surfaces of the frame 5. The high-power device group 3 is mounted on the active mounting plate 4. Since the equipment generates a large amount of heat consumption in a short period of time, in order to remove the heat as quickly as possible, high-purity indium foil is padded between the high-power device group 3 and the active mounting plate 4. Heat pipes 10 are pre-embedded in the aluminum honeycomb of the active mounting plate 4. This fully utilizes the thermal capacity of the active mounting plate 4 and the heat pipes 10 to suppress the temperature rise of the high-power device group 3 during operation.

[0043] The electrical board 1 is the ground of the antenna, and the polyimide germanium-plated film 2 is pasted for heat dissipation. The solar absorption rate of the polyimide germanium-plated film 2 is α s =0.45±0.04, infrared emissivity ε h =0.79±0.04. The active phased array antenna's ground-facing electrical board 1 utilizes a paper honeycomb sandwich structure, with a polyimide-coated germanium film 2 applied to the heat dissipation surface to ensure a high absorption-to-emission ratio, effectively dissipating heat from the high-power device cluster 3. Due to the extremely low thermal conductivity of the paper honeycomb, it also provides insulation after the device is shut down, significantly reducing the need for thermal compensation heaters. The paper honeycomb sandwich structure primarily consists of a carbon fiber skin 8, a paper honeycomb 7, and a printed circuit board 9, connected with structural adhesive. This ensures antenna electrical performance while reducing heat transfer between the carbon fiber skin 8 and the printed circuit board 9. The paper honeycomb 7 has a thermal conductivity of 0.05±0.01 W / m·K, providing sufficient heat dissipation to ensure the high-power device cluster 3 returns to its initial temperature before the next startup. It also insulates the antenna after the high-power device cluster 3 is shut down, significantly reducing the need for thermal compensation heaters.

[0044] The backs of the active mounting board 4 and high-power device cluster 3, as well as the sides of the active mounting board 4, frame 5, and electrical board 1, are all covered with multi-layer thermal insulation 6 to prevent drastic changes in external heat flux from affecting the antenna temperature. The sides of the active mounting board 4, frame 5, and electrical board 1 are flush. The frame 5, in its thickness, provides a physical space for air to radiate heat from the active mounting board 4 to the electrical board 1.

[0045] The heat transfer path of the active phased array antenna is from the high-power device group 3 to the upper surface of the active mounting board 4, the heat pipe 10, and then to the lower surface of the active mounting board 4. Then, it is radiated to the surface of the carbon fiber skin 8 of the electrical board 1, and then longitudinally conducted to the printed circuit board 9 through the paper honeycomb 7. Finally, the heat is radiated to the cold space through the polyimide germanium-plated film 2 attached thereto.

[0046] In the description of this application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0047] The present invention utilizes the aforementioned structure to dissipate heat at high temperatures and retain heat at low temperatures, effectively addressing the thermal management challenges of active phased array antennas. It also adapts to temperature requirements under varying external heat flux conditions, offering stable temperature control, minimal energy requirements, high adaptability, excellent reliability, and flexible design.

[0048] The present invention will be described in more detail below.

[0049] Based on the above temperature control method, the temperature of a satellite's active phased array antenna high-power equipment group was tested and verified on-orbit. The test simulated the heat flow outside the orbit through heaters and absorbing heat sinks, and the active phased array relay antenna operated according to the actual working mode.

[0050] Figure 2 The temperature curve for the high-power device is shown above. The test results show that the temperature of the high-power device cluster remained between 1.4°C and 15.5°C when the active phased array antenna was powered on. High-purity indium foil was placed between the high-power device cluster and the active mounting plate, and heat pipes were embedded in the aluminum honeycomb of the active mounting plate, fully utilizing the thermal capacity of the active mounting plate and heat pipes. The temperature rise of the high-power device cluster during operation was only 14.1°C. Due to the heat transfer properties of the paper honeycomb, the high-power device cluster slowly cooled to 1.4°C after the device was powered off, eliminating the need for a compensating heater. This structure dissipates heat at high temperatures and maintains heat at low temperatures, effectively solving the antenna temperature control problem.

[0051] The on-orbit temperature is maintained at 0.2~14.7℃, which is consistent with the test results, providing good protection for antenna operation.

[0052] Furthermore, the large-aperture active phased array antenna consists of multiple Figure 1 The sub-array composition shown in the figure can ensure that all antenna array devices are within the appropriate temperature range through the same method.

[0053] The above embodiments demonstrate that the heat dissipation and heat preservation device for an active phased array antenna of the present invention has the characteristics of stable temperature control, low energy demand, high adaptability, good reliability, and flexible design.

[0054] The above describes specific embodiments of the present invention. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art may make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. The embodiments of this application and the features in the embodiments may be combined with each other in any manner unless there is a conflict.

Claims

1. An active phased array antenna temperature control device, characterized in that: include: Active mounting plate (4), frame (5), electrical plate (1), heat pipe (10), polyimide germanium-plated film (2); The active mounting plate (4), the frame (5), the electrical plate (1), and the polyimide germanium-plated film (2) are connected in sequence; The heat pipe (10) penetrates the upper and lower surfaces of the active mounting plate (4); The upper surface of the active mounting plate (4) serves as the mounting surface of the device group (3), and the lower surface of the active mounting plate (4) is connected to the frame (5); The electrical board (1) adopts a paper honeycomb sandwich structure, wherein the paper honeycomb sandwich structure comprises: a carbon fiber skin (8), a paper honeycomb (7), and a printed board (9) arranged in sequence; The carbon fiber skin (8), the paper honeycomb (7) and the printed circuit board (9) are connected by structural adhesive; The thermal conductivity of the paper honeycomb (7) is 0.05±0.01 W / m·K.

2. The active phased array antenna temperature control device according to claim 1, characterized in that: Indium foil is placed between the device group (3) and the active mounting board (4).

3. The active phased array antenna temperature control device according to claim 2, characterized in that: The active mounting plate (4) is an aluminum honeycomb structure, the heat pipe (10) is pre-buried in the aluminum honeycomb structure, and the indium foil contacts the portion of the heat pipe (10) exposed on the upper surface of the active mounting plate (4).

4. The active phased array antenna temperature control device according to claim 1, characterized in that: Also included is a multi-layer thermal insulation assembly (6); The multi-layer heat insulation assembly (6) covers the back side of the active mounting plate (4) and the back side of the device group (3); The multi-layer heat insulation assembly (6) also covers the side surfaces of the active mounting plate (4), the side surfaces of the frame (5), and the side surfaces of the electrical panel (1).

5. The active phased array antenna temperature control device according to claim 1, characterized in that: The side of the electrical board (1) with the polyimide germanium-plated film (2) is used as the ground surface of the antenna. The solar absorption rate of the polyimide germanium-plated film (2) is α s =0.45±0.04, infrared emissivity ε h =0.79±0.

04.

6. The active phased array antenna temperature control device according to claim 1, characterized in that: The heat transfer path comprises: a device group (3), an upper surface of an active mounting plate (4), a heat pipe (10), a lower surface of the active mounting plate (4), an electrical board (1), and a polyimide germanium-plated film (2).

7. The active phased array antenna temperature control device according to claim 1, characterized in that: The heat transfer path is: a device group (3), an upper surface of an active mounting plate (4), a heat pipe (10), a lower surface of the active mounting plate (4), an electrical board (1), and a polyimide germanium-plated film (2); The electrical board (1) has a heat transfer path comprising: a carbon fiber skin (8), a paper honeycomb (7), and a printed circuit board (9); wherein the surface of the carbon fiber skin (8) receives heat radiation from the lower surface of the active mounting board (4); and the printed circuit board (9) radiates heat to a cold space through a polyimide germanium-plated film (2).

8. The active phased array antenna temperature control device according to claim 7, characterized in that: A plurality of devices in the device group (3) conduct heat to the same heat pipe (10).

9. A satellite, characterized in that: The active phased array antenna temperature control device comprises any one of claims 1 to 8.

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