Vehicle-mounted communication chip test system

Abstract

This invention provides a vehicle-mounted communication chip testing system, comprising a first host computer, a second host computer, a first microcontroller, a second microcontroller, a first power module, a second power module, a first communication chip, a second communication chip, a first non-wake-up-free chip group to be tested, and a second non-wake-up-free chip group to be tested. The first non-wake-up-free chip group to be tested is connected to the first host computer, the first microcontroller, the first power module, and the second non-wake-up-free chip group to be tested. The second non-wake-up-free chip group to be tested is connected to the second host computer, the second microcontroller, and the second power module. The first microcontroller is connected to the first power module, and the second microcontroller is connected to the second power module. The first communication chip is configured in the first non-wake-up-free chip group to be tested, and the second communication chip is configured in the second non-wake-up-free chip group to be tested. This system can quickly and effectively perform batch testing of vehicle-mounted communication chips, shorten the testing cycle, reduce the testing workload, and lower the testing cost.

Description

Technical Field

[0001] This application relates to the field of vehicle electronics technology, specifically to a vehicle-mounted communication chip testing system. Background Technology

[0002] Vehicle communication chips refer to transceiver chips for vehicle communication networks, also known as interface chips, such as CAN (Controller Area Network) chips, LIN (Local Interconnect Network) chips, Ethernet chips, etc. The communication between various vehicle components and ECU (Electronic Control Unit, also known as controller) is inseparable from transceiver chips. Vehicle communication chips are key components for the underlying communication between vehicles and industries.

[0003] Before configuring a vehicle, testing is required. Due to the large number of automotive communication chips, the testing cycle is long, the workload is heavy, and the cost is too high. How to quickly and effectively conduct mass testing of domestically produced chips has become a problem currently facing automobile companies. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, this application provides an in-vehicle communication chip testing system to solve the aforementioned technical problem of how to quickly and effectively conduct batch testing of domestically produced chips.

[0005] This application provides a vehicle-mounted communication chip testing system, comprising: a first host computer, a second host computer, a first microcontroller, a second microcontroller, a first power module, a second power module, a first communication chip, a second communication chip, a first non-wake-up chip group to be tested, and a second non-wake-up chip group to be tested; the first non-wake-up chip group to be tested is connected to the first host computer, the first microcontroller, the first power module, and the second non-wake-up chip group to be tested; the second non-wake-up chip group to be tested is connected to the second host computer, the second microcontroller, and the second power module; the first microcontroller is connected to the first power module; the second microcontroller is connected to the second power module; the first communication chip is configured in the first non-wake-up chip group to be tested, and the second communication chip is configured in the second non-wake-up chip group to be tested.

[0006] In one embodiment of this application, if a communication function test is performed on the first non-wake-up chipset under test and the second non-wake-up chipset under test, the first host computer sends a first power-on control command to the first microcontroller through the first communication chip. The first microcontroller enables the first power module through the first power-on control command, so that the first power module supplies power to the first non-wake-up chipset under test. The second host computer sends a second power-on control command to the second microcontroller through the second communication chip. The second microcontroller enables the second power module through the second power-on control command, so that the second power module supplies power to the second non-wake-up chipset under test. The first host computer transmits a first test message to the first non-wake-up chipset under test and controls the first non-wake-up chipset under test to send the first test message. The second host computer controls the second non-wake-up chipset under test to receive the message and obtain a first message reception result. The second host computer determines the communication function test result based on the first message reception result.

[0007] In one embodiment of this application, the vehicle communication chip testing system further includes a first wake-up chip group to be tested and a second wake-up chip group to be tested; the first wake-up chip group to be tested is connected to the first microcontroller, the first power module, and the second wake-up chip group to be tested, respectively; the second wake-up chip group to be tested is connected to the second microcontroller and the second power module, respectively; if a local wake-up function test is performed on the first wake-up chip group to be tested, the first host computer controls the first microcontroller through the first communication chip, so that the first microcontroller sends a local wake-up signal to the first wake-up chip group to be tested to locally wake up the first wake-up chip group to be tested; the first host computer transmits a second test message to the first microcontroller through the first communication chip, the first microcontroller transmits the second test message to the first wake-up chip group to be tested, and controls the first wake-up chip group to be tested to send the second test message; the second wake-up chip group to be tested receives the message, obtains the second message reception result, and transmits it to the second microcontroller, the second microcontroller transmits the second message reception result to the second host computer through the second communication chip; the second host computer determines the local wake-up function test result based on the second message reception result.

[0008] In one embodiment of this application, the vehicle communication chip testing system further includes a connector; the first wake-up chip group to be tested is connected to the second wake-up chip group to be tested through the connector; the first non-wake-up chip group to be tested is connected to the second non-wake-up chip group to be tested through the connector; the connector includes a first connector and a second connector, and the first connector and the second connector are connected by a wire harness, the parameters of the wire harness meeting preset conditions; if a remote wake-up function test is performed on the first wake-up chip group to be tested, the second host computer controls the second microcontroller through the second communication chip, so that the second microcontroller sends a remote wake-up signal to the first wake-up chip group to be tested through the second wake-up chip group to be tested, remotely waking up the first wake-up chip group to be tested, the first power module, and the first microcontroller; the first microcontroller receives messages through the first wake-up chip group to be tested, obtains a third message reception result, and transmits it to the first host computer; the first host computer determines the remote wake-up function test result based on the third message reception result.

[0009] In one embodiment of this application, the second host computer determines the communication function test result based on the first message reception result, including: if the first message reception result is empty, the communication function test result is abnormal; if the first message reception result is not empty, the communication function test result is normal; or, if the first message reception result is different from a preset message, the communication function test result is abnormal; if the first message reception result is the same as the preset message, the communication function test result is normal, and the first test message is a preset message.

[0010] In one embodiment of this application, if the communication function test result, the local wake-up function test result, and the remote wake-up function test result are all normal, the communication rate is adjusted to perform a first communication quality test on the first non-wake-up chipset under test, the second non-wake-up chipset under test, the first wake-up chipset under test, and the second wake-up chipset under test, and the first communication quality test result is determined based on the message reception result after adjusting the communication rate.

[0011] In one embodiment of this application, if the first communication quality test result is good, a second communication quality test is performed on the first non-wake-up chipset under test, the second non-wake-up chipset under test, the first wake-up chipset under test, and the second wake-up chipset under test based on different temperatures, and the second communication quality test result is determined based on the message reception results at different temperatures.

[0012] In one embodiment of this application, if the second communication quality test result is good, the communication anti-interference capability test is performed on the first non-wake-up chip group to be tested, the second non-wake-up chip group to be tested, the first wake-up chip group to be tested, and the second wake-up chip group to be tested based on different electromagnetic intensities, and the communication anti-interference capability test result is determined based on the message reception results under different electromagnetic intensities.

[0013] In one embodiment of this application, the first power module includes a first power supply, a first PMOS transistor, a first inductor, and a first system base chip; the first power supply is connected to the first PMOS transistor, the first PMOS transistor is connected to the first inductor, the first inductor is connected to the first system base chip, and the first system base chip is connected to the first microcontroller, the first non-wake-up chipset under test, and the first wake-up chipset under test, respectively; the second power module includes a second power supply, a second PMOS transistor, a second inductor, and a second system base chip; the second power supply is connected to the second PMOS transistor, the second PMOS transistor is connected to the second inductor, the second inductor is connected to the second system base chip, and the second system base chip is connected to the second microcontroller, the second non-wake-up chipset under test, and the second wake-up chipset under test, respectively; the first system base chip includes a first power converter, and the second system base chip includes a second power converter.

[0014] In one embodiment of this application, the chips in the chipset to be tested include at least one of a CAN chip and a LIN chip, and the chipset to be tested includes a first non-wake-up chipset to be tested, a second non-wake-up chipset to be tested, a first wake-up chipset to be tested, and a second wake-up chipset to be tested.

[0015] In one embodiment of this application, the vehicle communication chip testing system further includes a first circuit board and a second circuit board; the first system base chip, the first microcontroller, the first non-wake-up chip group to be tested, and the first wake-up chip group to be tested are configured in the first circuit board; the second system base chip, the second microcontroller, the second non-wake-up chip group to be tested, and the second wake-up chip group to be tested are configured in the second circuit board.

[0016] The beneficial effects of this invention: This invention provides a vehicle-mounted communication chip testing system, which includes a first host computer, a second host computer, a first microcontroller, a second microcontroller, a first power module, a second power module, a first communication chip, a second communication chip, a first non-wake-up chip group to be tested, and a second non-wake-up chip group to be tested; by connecting the first non-wake-up chip group to be tested to the first host computer, the first microcontroller, the first power module, and the second non-wake-up chip group to be tested respectively, the first power module can supply power to the first non-wake-up chip group to be tested, and the first host computer can supply power to the first non-wake-up chip group to be tested. The system enables message sending and receiving control of the non-wake-up chipset under test, as well as communication between the first and second non-wake-up chipsets under test. The second non-wake-up chipset under test is connected to a second host computer, a second microcontroller, and a second power module, respectively. This allows the second power module to supply power to the second non-wake-up chipset under test, and the second host computer to control message sending and receiving. This vehicle communication chip testing system can quickly and effectively perform batch testing of vehicle communication chips, shortening the testing cycle, reducing the testing workload, and lowering testing costs.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0019] Figure 1 This is a system architecture diagram of an in-vehicle communication chip testing system, as illustrated in an exemplary embodiment of this application.

[0020] Figure 2 This is a schematic diagram illustrating data interaction during communication function testing of an in-vehicle communication chip, as shown in an exemplary embodiment of this application.

[0021] Figure 3 This is a system architecture diagram of an in-vehicle communication chip testing system, illustrated in another exemplary embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the structure of a vehicle communication chip testing system according to a specific embodiment of this application;

[0023] Figure 5 yes Figure 4The illustrated embodiment shows a test flowchart of the vehicle communication chip test system. Detailed Implementation

[0024] The embodiments of this application will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be understood that the preferred embodiments are only for illustrating this application and are not intended to limit the scope of protection of this application.

[0025] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0026] It should be noted that in this application, terms such as "first" and "second" are merely for distinguishing similar objects, and do not limit the order or sequence of similar objects. The variations of "including" and "having" indicate that the scope covered by the subject of the word is not exclusive, except for the examples shown by the word.

[0027] It is understood that the various numerical designations, step numbers, and other identifiers recorded in this application are for descriptive convenience and are not intended to limit the scope of this application. The size of the identifiers in this application does not imply the order of execution; the execution order of each process should be determined by its function and internal logic.

[0028] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present application. However, it will be apparent to those skilled in the art that embodiments of the present application may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present application.

[0029] It should be noted that, because current vehicle ECUs are based on the traditional EE (Electrical / Electronic) distributed architecture, vehicle controllers are scattered. These controllers communicate with each other via communication chips and wiring harnesses to control the vehicle's powertrain, chassis, body, etc. Depending on the vehicle's price range, there may be dozens or even hundreds of controllers. Therefore, a vehicle may have dozens or even hundreds of communication chips. According to traditional vehicle component verification methods, component verification and vehicle-wide verification are performed. Each controller undergoes a long verification cycle, incurring high time and manpower costs. Furthermore, the entire verification process can only verify a few communication chips (one or two). Communication quality is closely related to the wiring harness; the wiring harness used in component testing may be inconsistent with the vehicle's communication wiring harness, leading to inconsistent experimental results.

[0030] To address these issues, embodiments of this application propose an in-vehicle communication chip testing system, which will be described in detail below.

[0031] Please see Figure 1 , Figure 1 This is a system architecture diagram of an in-vehicle communication chip testing system, as illustrated in an exemplary embodiment of this application.

[0032] like Figure 1 As shown, the system architecture of the vehicle-mounted communication chip testing system may include a first host computer 1, a second host computer 2, a first microcontroller 3, a second microcontroller 4, a first power module 5, a second power module 6, a first communication chip 7, a second communication chip 8, a first non-wake-up chip group under test 9, and a second non-wake-up chip group under test 10. The first non-wake-up chip group 9 is connected to the first host computer 1, the first microcontroller 3, the first power module 5, and the second non-wake-up chip group 10, respectively. The second non-wake-up chip group 10 is connected to the second host computer 2, the second microcontroller 4, and the second power module 6, respectively. The first microcontroller 3 is connected to the first power module 5; the second microcontroller 4 is connected to the second power module 6; the first communication chip 7 is configured in the first non-wake-up chip group 9, and the second communication chip 8 is configured in the second non-wake-up chip group 10.

[0033] In one embodiment of this application, the chips to be tested are classified according to their characteristics to obtain non-wake-up chips to be tested and wake-up chips to be tested. Non-wake-up chips to be tested refer to vehicle communication chips without wake-up functionality, while wake-up chips to be tested refer to vehicle communication chips with wake-up functionality. Multiple non-wake-up chips to be tested are divided into two groups: a first non-wake-up chip group 9 and a second non-wake-up chip group 10. A reserved CAN bus is led out from the first non-wake-up chip group 9 as the first communication chip 7, and a reserved CAN bus is led out from the second non-wake-up chip group 10 as the second communication chip 8. The host computer controls the microcontroller to send and receive messages, observes whether there are error frames in the sent and received messages, and adjusts the message sending and receiving rate through the reserved CAN bus.

[0034] In this embodiment, the chip under test includes at least one of a CAN chip and a LIN chip. A microcontroller with rich CAN and / or LIN communication interfaces is selected as the first microcontroller 3 and the second microcontroller 4, respectively. Both the first microcontroller 3 and the second microcontroller 4 have reserved JTAG (Joint Test Action Group) debugging interfaces. Each host computer (first host computer 1 or second host computer 2) can easily configure the corresponding microcontroller (first microcontroller 3 or second microcontroller 4) interface through the reserved JTAG debugging interface. Power modules (first power module 5 and second power module 6) provide point power to the entire system architecture.

[0035] The vehicle communication chip testing system of this application embodiment supplies power to the non-wake-up chip groups under test (first non-wake-up chip group 9 and second non-wake-up chip group 10) through a power module, and controls the sending and receiving of messages to the non-wake-up chip groups under test through a host computer. It can realize the communication function between the first non-wake-up chip group and the second non-wake-up chip group under test, and quickly and effectively perform batch testing of vehicle communication chips, which shortens the testing cycle, reduces the testing workload, and lowers the testing cost.

[0036] In one embodiment of this application, if a communication function test is performed on a first non-wake-up chipset 9 and a second non-wake-up chipset 10 to be tested, a first host computer 1 sends a first power-on control command to a first microcontroller 3 through a first communication chip 7. The first microcontroller 3 enables a first power module 5 through the first power-on control command, so that the first power module 5 supplies power to the first non-wake-up chipset 9. A second host computer 2 sends a second power-on control command to a second microcontroller 4 through a second communication chip 8. The second microcontroller 4 enables a second power module 6 through the second power-on control command, so that the second power module 6 supplies power to the second non-wake-up chipset 10. The first host computer 1 transmits a first test message to the first non-wake-up chipset 9 and controls the first non-wake-up chipset 9 to send the first test message. The second host computer 2 controls the second non-wake-up chipset 10 to receive the message and obtain the first message reception result. The second host computer 2 determines the communication function test result based on the first message reception result.

[0037] Please see Figure 2 , Figure 2 This is a schematic diagram illustrating data interaction during communication function testing of an in-vehicle communication chip, as shown in an exemplary embodiment of this application. Figure 2 As shown, the tester operates the first host computer 1, which transmits the first test message to the first non-wake-up chipset 9 under test and controls the message transmission of the first non-wake-up chipset 9 to send the first test message. The tester then operates the second host computer 2, which controls the message reception of the second non-wake-up chipset 10 under test to receive the message, obtain the first message reception result, and return it to the second host computer 2. When the second non-wake-up chipset 10 receives a message, it takes the received message as the first message reception result; when the second non-wake-up chipset 10 does not receive a message, it takes an empty value as the first message reception result.

[0038] Before the aforementioned tests, the power modules (first power module 5 and second power module 6) need to be constantly powered on the vehicle communication chip test system. The first host computer 1 sends a first power-on control command, and the first communication chip 7 transmits the first power-on control command to the first microcontroller 3. In response to the first power-on control command, the first microcontroller 3 enables the first power module 5, waking it up so that the first power module 5 can provide normal power to the first non-wake-up chipset 9 under test. Correspondingly, the second host computer 2 sends a second power-on control command, and the second communication chip 8 transmits the first power-on control command to the second microcontroller 4. In response to the second power-on control command, the second microcontroller 4 enables the second power module 6, waking it up so that the second power module 6 can provide normal power to the second non-wake-up chipset 10 under test.

[0039] In this embodiment, the first microcontroller 3 and the first power module 5 are connected by hardwire, and the second microcontroller 4 and the second power module 6 are connected by hardwire.

[0040] The technical solution of this embodiment controls the non-wake-up chipset under test (including the first non-wake-up chipset under test 9 and the second non-wake-up chipset under test 10) to send and receive messages, so as to perform communication function testing on the vehicle communication chip in the non-wake-up chipset under test. This can realize rapid and effective batch testing of vehicle communication chips, which shortens the testing cycle, reduces the testing workload, and lowers the testing cost.

[0041] In one embodiment of this application, the second host computer 2 determines the communication function test result based on the first message reception result, including: if the first message reception result is empty, the communication function test result is abnormal; if the first message reception result is not empty, the communication function test result is normal.

[0042] In this embodiment, the second non-wake-up chipset 10 under test can only receive messages if all the chips in the non-wake-up chipset under test are functioning normally. Therefore, after receiving the first message reception result returned by the second non-wake-up chipset 10 under test, the second host computer 2 judges the first message reception result. If the first message reception result is not empty, the communication function test result can be determined to be normal; if the first message reception result is empty, the communication function test result can be determined to be abnormal.

[0043] In another embodiment of this application, the second host computer 2 determines the communication function test result based on the first message reception result, and further includes: if the first message reception result is different from the preset message, the communication function test result is abnormal; if the first message reception result is the same as the preset message, the communication function test result is normal, and the first test message is the preset message.

[0044] In this embodiment, since the chip under test may have normal transmission and reception functions but send and receive abnormal messages, relying solely on whether the first message reception result is empty as the basis for determining whether the communication function test result is normal may not be accurate. Therefore, a preset message is used as the first test message. The communication function test result is normal only if the second non-wake-up chip group 10 under test receives the correct message, i.e., the first message reception result is the same as the preset message. If the second non-wake-up chip group 10 under test receives an incorrect message or does not receive a message, i.e., the first message reception result is different from the preset message, the communication function test result is abnormal.

[0045] In another embodiment of this application, the communication function test result can also be determined based on whether the first host computer 1 receives an error frame. If the first host computer 1 receives an error frame, the communication function test result is determined to be abnormal. If the first host computer 1 does not receive an error frame, the communication function test result is determined to be normal.

[0046] The above embodiments tested the sending function of the first non-wake-up chipset 9 and the receiving function of the second non-wake-up chipset 10. Correspondingly, the receiving function of the first non-wake-up chipset 9 and the sending function of the second non-wake-up chipset 10 can also be tested. The testing principle is the same as that of the above embodiments, and will not be repeated here.

[0047] In one embodiment of this application, the vehicle communication chip testing system further includes a first wake-up chip group 11 to be tested and a second wake-up chip group 12 to be tested; the first wake-up chip group 11 to be tested is connected to a first microcontroller 3, a first power module 5, and the second wake-up chip group 12 to be tested, respectively; the second wake-up chip group 12 to be tested is connected to a second microcontroller 4 and a second power module 6, respectively; if a local wake-up function test is performed on the first wake-up chip group 11 to be tested, the first host computer 1 controls the first microcontroller 3 through the first communication chip 7, so that the first microcontroller 3 sends a local wake-up signal to the first wake-up chip group 11 to be tested. The first host computer 1 transmits a second test message to the first microcontroller 3 via the first communication chip 7. The first microcontroller 3 then transmits the second test message to the first wake-up chip group 11 and controls the first wake-up chip group 11 to send the second test message. The second wake-up chip group 12 receives the message, obtains the second message reception result, and transmits it to the second microcontroller 4. The second microcontroller 4 transmits the second message reception result to the second host computer 2 via the second communication chip 8. The second host computer 2 determines the local wake-up function test result based on the second message reception result.

[0048] Please see Figure 3 , Figure 3This is a system architecture diagram of an in-vehicle communication chip testing system, illustrated in another exemplary embodiment of this application. Figure 3 As shown, the system architecture may include a first host computer 1, a second host computer 2, a first microcontroller 3, a second microcontroller 4, a first power module 5, a second power module 6, a first communication chip 7, a second communication chip 8, a first non-wake-up chipset under test 9, a second non-wake-up chipset under test 10, a first wake-up chipset under test 11, and a second wake-up chipset under test 12. Specifically, the first non-wake-up chip group 9 to be tested is connected to the first host computer 1, the first microcontroller 3, the first power module 5, and the second non-wake-up chip group 10 to be tested; the second non-wake-up chip group 10 to be tested is connected to the second host computer 2, the second microcontroller 4, and the second power module 6; the first communication chip 7 is configured in the first non-wake-up chip group 9 to be tested, and the second communication chip 8 is configured in the second non-wake-up chip group 10 to be tested; the first wake-up chip group 11 to be tested is connected to the first microcontroller 3, the first power module 5, and the second wake-up chip group 12 to be tested; the second wake-up chip group 12 to be tested is connected to the second microcontroller 4 and the second power module 6; the first microcontroller 3 is connected to the first power module 5; and the second microcontroller 4 is connected to the second power module 6.

[0049] This system architecture can test not only the communication function of the chip under test, but also its local wake-up function. The testing procedure for the communication function is described in the preceding embodiments and will not be repeated here. After confirming that the communication function test results of the first wake-up chip group 11 and the second wake-up chip group 12 are normal, if a local wake-up function test is performed on the first wake-up chip group 11, after the vehicle communication chip test system is powered on, the tester does not perform any operation on the first host computer 1, so that the first wake-up chip group 11 and the first power module 5 enter a sleep state. After the first wake-up chip group 11 enters a sleep state, the tester operates the first host computer 1. The first host computer 1 sends a local wake-up control command to the first microcontroller 3 through the first communication chip 7. The first microcontroller 3 responds to the local wake-up control command and sends a local wake-up signal to the first wake-up chip group 11 to locally wake up the first wake-up chip group 11. After the first test wake-up chipset 11 is woken up, it enables the first power module 5 and wakes up the first power module 5 so that the first power module 5 can supply power to the first test wake-up chipset 11 normally.

[0050] In addition, the second host computer 2 sends a second power-on control command, and the second communication chip 8 transmits the first power-on control command to the second microcontroller 4. In response to the second power-on control command, the second microcontroller 4 enables the second power module 6 and wakes it up so that the second power module 6 can provide normal power to the second non-wake-up chipset 10 and the second wake-up chipset 12 under test.

[0051] The first host computer 1 uses a preset message as the first test message, generates a message sending control command including a second test message, and sends it to the first communication chip 7, so that the first communication chip 7 transmits the message sending control command to the first microcontroller 3; the first microcontroller 3 responds to the message sending control command, transmits the second test message to the first wake-up chip group under test 11, and controls the first wake-up chip group under test 11 to send the second test message; the second wake-up chip group under test 12 receives the message, generates the second message receiving result, and transmits it to the second microcontroller 4, and the second microcontroller 4 transmits the second message receiving result to the second host computer 2 through the second communication chip 8; after receiving the second message receiving result, the second host computer 2 compares the second message receiving result with the preset message to determine the local wake-up function test result. If the second message receiving result is the same as the preset message, the local wake-up function test result is normal; otherwise, the local wake-up function test result is abnormal.

[0052] Similarly, the local wake-up function of the second wake-up chipset 12 can also be tested.

[0053] The technical solution of this embodiment enables batch testing of the local wake-up function of the chip under test, further shortening the testing cycle and reducing testing costs.

[0054] In one embodiment of this application, the vehicle communication chip testing system further includes a connector 13; a first wake-up chip group 11 to be tested is connected to a second wake-up chip group 12 to be tested via connector 13; a first non-wake-up chip group 9 to be tested is connected to a second non-wake-up chip group 10 to be tested via connector 13; connector 13 includes a first connector 131 and a second connector 132, which are connected by a wire harness, and the parameters of the wire harness meet preset conditions. If a remote wake-up function test is performed on the first wake-up chip group 11 to be tested, the second host computer 2 controls the second microcontroller 4 through the second communication chip 8, so that the second microcontroller 4 sends a remote wake-up signal to the first wake-up chip group 11 to be tested via the second wake-up chip group 12 to remotely wake up the first wake-up chip group 11, the first power module 5, and the first microcontroller 3; the first microcontroller 3 receives messages through the first wake-up chip group 11 to obtain a third message reception result and transmits it to the first host computer 1; the first host computer 1 determines the remote wake-up function test result based on the third message reception result.

[0055] In this embodiment, to simulate vehicle communication, two connectors, namely the first connector 131 and the second connector 132, are configured in the vehicle communication chip testing system. The first connector 131 and the second connector 132 are connected by a wiring harness, and the parameters of the wiring harness meet preset conditions. Meeting these preset conditions means that the length, impedance, and material of the wiring harness must be the same as or similar to the network wiring harness used in the vehicle communication system. Furthermore, point-to-point connections and one-to-many connections should be specifically distinguished, and the wiring harness network between the first connector 131 and the second connector 132 should be arranged according to the communication network of the actual vehicle. The first non-wake-up chip group 9 and the first wake-up chip group 11 under test are respectively connected to the first connector 131 to achieve external communication. The second non-wake-up chip group 10 and the second wake-up chip group 12 under test are respectively connected to the second connector 132 to achieve external communication.

[0056] Because this vehicle communication chip testing system is similar to the vehicle communication system, it offers higher accuracy in testing the communication function and local wake-up function of the chip under test. Furthermore, this system can also perform remote wake-up function testing on the chip under test. After confirming that the communication function test results of the first wake-up chip group 11 and the second wake-up chip group 12 are normal, if a remote wake-up function test is performed on the first wake-up chip group 11, after the vehicle communication chip testing system is powered on, the tester does not perform any operation on the first host computer 1, allowing the first wake-up chip group 11, the first power module 5, and the first microcontroller 3 to enter a sleep state. Once all three are in sleep mode, the tester operates the second host computer 2. The second host computer 2 sends a remote wake-up control command to the second microcontroller 4 through the second communication chip 8. The second microcontroller 4 responds to the remote wake-up control command, generates a remote wake-up signal, and transmits it to the second wake-up chip group 12, causing the second wake-up chip group 12 to send a remote wake-up signal to the first wake-up chip group 11, remotely waking it up. In illustrative terms, the remote wake-up frame can be any frame or a fixed frame. After the first wake-up chip group 11 under test is woken up, it enables the first power module 5, waking it up so that it can supply power to the first wake-up chip group 11 and the first microcontroller 3, thus waking up the first microcontroller 3. After being woken up, the first microcontroller 3 acquires the remote wake-up message received by the first wake-up chip group 11 under test, uses it as the third message reception result, and sends it to the first host computer 1. The first host computer 1 judges the third message reception result. If the third message reception result has no error frames, the remote wake-up function test result is normal; otherwise, the remote wake-up function test result is abnormal.

[0057] Similarly, the remote wake-up function of the second wake-up chipset 12 can also be tested.

[0058] The technical solution of this embodiment enables batch testing of the remote wake-up function of the chip under test, further shortening the testing cycle and reducing the testing cost. At the same time, since the communication method of this system is more similar to that of the whole vehicle communication, the accuracy of testing the local wake-up function and communication function of the chip under test is also higher.

[0059] In one embodiment of this application, the first power module 5 includes a first power supply 51, a first PMOS transistor 52, a first inductor 53, and a first system base chip 54; the first power supply 51 is connected to the first PMOS transistor 52, the first PMOS transistor 52 is connected to the first inductor 53, the first inductor 53 is connected to the first system base chip 54, and the first system base chip 54 is connected to the first microcontroller 3, the first non-wake-up chip group under test 9, and the first wake-up chip group under test 11, respectively; the second power module 6 includes a second power supply 61, a second PMOS transistor 62, a second inductor 63, and a second system base chip 64; the second power supply 61 is connected to the second PMOS transistor 62, the second PMOS transistor 62 is connected to the second inductor 63, the second inductor 63 is connected to the second system base chip 64, and the second system base chip 64 is connected to the second microcontroller 4, the second non-wake-up chip group under test 10, and the second wake-up chip group under test 12, respectively; the first system base chip 54 includes a first power converter, and the second system base chip 64 includes a second power converter.

[0060] In this embodiment, the power supply (first power supply 51 or second power supply 61) provides a constant 12V power, simulating the power supply of the vehicle's small battery. The constant 12V power passes through the reverse protection design of the PMOS transistor (first PMOS transistor 52 or second PMOS transistor 62), and then through the inductor (first inductor 53 or second inductor 63) to smooth out the power surge, finally reaching the SBC (System Basis Chip) system chip (first system basis chip 54 or second system basis chip 64) smoothly. The SBC system chip includes a switching power supply DC-DC (DC to DC power converter) and a linear regulator LDO (Low Dropout Regulator), and also has CAN, LIN, and reset functions. The SBC system chip provides different and stable voltages to the microcontroller and the chipset under test through the switching power supply DC-DC and the linear regulator LDO, mainly serving as the point power supply for the entire system. In addition, the SBC system chip is also used to wake up the microcontroller.

[0061] In one embodiment of this application, the chips in the chipset to be tested include at least one of a CAN chip and a LIN chip, and the chipset to be tested includes a first non-wake-up chipset to be tested 9, a second non-wake-up chipset to be tested 10, a first wake-up chipset to be tested 11, and a second wake-up chipset to be tested 12.

[0062] In one embodiment of this application, the vehicle communication chip testing system further includes a first circuit board and a second circuit board; a first system base chip 54, a first microcontroller 3, a first non-wake-up chip group 9 to be tested and a first wake-up chip group 11 to be tested are configured in the first circuit board; a second system base chip 64, a second microcontroller 4, a second non-wake-up chip group 10 to be tested and a second wake-up chip group 12 to be tested are configured in the second circuit board.

[0063] In this embodiment, the overall architecture of the vehicle communication chip testing system mainly consists of two boards. The SBC chip (SBC system chip), microcontroller and the chip group to be tested are mounted on the circuit board, which facilitates connection and testing, and allows for quick, convenient and flexible replacement of the chip group to be tested.

[0064] In one embodiment of this application, if the communication function test result, the local wake-up function test result, and the remote wake-up function test result are all normal, the communication rate is adjusted to perform a first communication quality test on the first non-wake-up chipset 9, the second non-wake-up chipset 10, the first wake-up chipset 11, and the second wake-up chipset 12 to be tested, and the first communication quality test result is determined based on the message reception result after adjusting the communication rate.

[0065] In this embodiment, if the communication function test results, local wake-up function test results, and remote wake-up function test results of the chipset under test are all normal, the communication rate can be adjusted to test the first communication quality of the chipset under test. For example, the communication rate between the first non-wake-up chipset 9 and the second non-wake-up chipset 10 under test can be changed by the host computer to the highest rate, and then the host computer can be observed to see if there are any error frames. If there are no error frames, the first communication quality test result is good.

[0066] In one embodiment of this application, if the first communication quality test result is good, a second communication quality test is performed on the first non-wake-up chip group 9 to be tested, the second non-wake-up chip group 10 to be tested, the first wake-up chip group 11 to be tested, and the second wake-up chip group 12 to be tested based on different temperatures, and the second communication quality test result is determined according to the message reception results at different temperatures.

[0067] In this embodiment, if the first communication quality test result is good, the ambient temperature can be changed to test the second communication quality of the chipset under test. For example, the communication rate of each communication chip in the chipset under test can be adjusted to its maximum allowable limit via a host computer. The system can then be placed in a temperature chamber to conduct environmental experiments under extreme conditions such as high temperature, low temperature, and temperature cycling. If communication messages are sent and received normally, the second communication quality test result is good.

[0068] In one embodiment of this application, if the second communication quality test result is good, the communication anti-interference capability test is performed on the first non-wake-up chip group 9, the second non-wake-up chip group 10, the first wake-up chip group 11, and the second wake-up chip group 12 under different electromagnetic intensities, and the communication anti-interference capability test result is determined according to the message reception result under different electromagnetic intensities.

[0069] In this embodiment, if the second communication quality test result is good, the communication anti-interference capability test can also be performed on the communication chip under test in the chipset under test. For example, the communication rate of each communication chip under test in the chipset under test can be adjusted to its maximum allowable limit by the host computer, and EMC (Electro Magnetic Compatibility) test can be performed on the system to test the anti-interference capability of the entire system communication network.

[0070] Please see Figure 4 , Figure 4 This is a schematic diagram illustrating the structure of a vehicle-mounted communication chip testing system according to a specific embodiment of this application. Figure 4As shown in the specific embodiment, the vehicle communication chip testing system includes: computer 1 (first host computer 1), computer 2 (second host computer 2), microcontroller 3 (first microcontroller 3), microcontroller 4 (second microcontroller 4), power supply 51 (first power supply 51), PMOS transistor 52 (first PMOS transistor 52), inductor 53 (first inductor 53), SBC54 (first system base chip 54), power supply 61 (second power supply 61), PMOS transistor 62 (second PMOS transistor 62), inductor 63 (second inductor 63), SBC64 (second system base chip 64), reserved CAN 7 (first communication chip 7), reserved CAN 8 (second communication chip 8), CAN LIN chipset 9 without wake-up (first non-wake-up chipset 9 under test), CAN LIN chipset 10 without wake-up (second non-wake-up chipset 10 under test), and CAN with wake-up. LIN chipset 11 (first wake-up chipset 11 under test), CANLIN chipset 12 with wake-up function (second wake-up chipset 12 under test), J1 connector 131 (first connector 131), J2 connector 132 (second connector 132). Among them, the CAN LIN chipset 9 without wake-up is connected to computer 1, microcontroller 3, SBC54 and J1 connector 131 respectively; the CAN LIN chipset 10 without wake-up is connected to computer 2, microcontroller 4, SBC64 and J2 connector 132 respectively; the CAN LIN chipset 11 with wake-up is connected to microcontroller 3, SBC54 and J1 connector 131 respectively; the CAN LIN chipset 12 with wake-up is connected to microcontroller 4, SBC64 and J2 connector 132 respectively; J1 connector 131 and J2 connector 132 are connected; SBC54 is connected to microcontroller 3; SBC64 is connected to microcontroller 4; a reserved CAN7 is led out from the CAN LIN chipset 9 without wake-up, and a reserved CAN8 is led out from the CAN LIN chipset 10 without wake-up.

[0071] The vehicle communication chip testing system shown in this specific embodiment can quickly and effectively perform batch testing of communication functions, local wake-up functions, and remote wake-up functions on the chips under test, shortening the testing cycle and reducing testing costs.

[0072] Please see Figure 5 , Figure 5 yes Figure 4 The illustrated embodiment shows a test flowchart of the vehicle communication chip test system; as shown Figure 5 As shown, the testing procedure for vehicle communication chips by the vehicle communication chip testing system is as follows:

[0073] 1) Provide the actual wiring harness length for communication between connector J1 131 and connector J2 132 based on the vehicle's CAN and LIN communication.

[0074] Between connector J1 131 and connector J2 132, a wire harness of similar length, impedance, and material is selected based on the length of the network wire harness for CAN and LIN communication of the whole vehicle.

[0075] 2) Arrange the J1 connector 131 and the J2 connector 132 to be directly connected or cross-connected.

[0076] Point-to-point connections and one-to-many connections should be specifically distinguished according to the actual vehicle's communication network, with the wiring harness network between connectors J1 131 and J2 132 arranged accordingly. A reserved CAN bus is also provided in both the non-wake-up CAN LIN chipset 9 and the non-wake-up CAN LIN chipset 10, designated as reserved CAN7 and reserved CAN8 respectively. The purpose of the reserved CAN buses is to control the microcontroller's message transmission and reception, monitor for erroneous frames in the transmitted and received messages, and adjust the message transmission and reception rate.

[0077] 3) Power on the circuit board and the communication chip will send and receive messages normally.

[0078] After completing the wiring harness arrangement between connectors J1 (131) and J2 (132), connect both circuit boards to constant power. CAN buses are pre-connected to the computer. Through the JTAG interface, enable the microcontroller to power the SBC, which in turn powers the CAN and LIN chipsets.

[0079] 4) Change the working mode of the communication chip, such as verification wake-up and low power mode.

[0080] The communication chip performs normal message transmission and reception. It connects to the computer via a reserved CAN communication channel of the microcontroller. The host computer software on the left configures the CAN and LIN communication channels (without wake-up) to send messages. The host computer on the right receives messages from the CAN and LIN communication channels (without wake-up) and observes the transmitted and received messages for error frames. The absence of error frames indicates normal communication functionality of the CAN and LIN chipsets. Then, the host computer adjusts the communication rate to the maximum and observes again for error frames. The absence of error frames indicates good chip communication quality.

[0081] The host computer on the left operates the microcontroller via reserved CAN communication, sending local wake-up signals to the CAN and LIN chipsets with wake-up capabilities. It observes whether the host computer receives error frames and whether the right computer receives messages. If there are no error frames and the message reception is normal, the local wake-up function of the CAN and LIN chipsets with wake-up capabilities is normal. The host computer on the right operates the microcontroller via reserved CAN communication, sending arbitrary and fixed frames to the left-side CAN and LIN chipsets with wake-up capabilities to wake them up. It observes whether the host computer receives error frames and whether the message reception is normal. If normal, the remote wake-up communication function of the chipsets is normal.

[0082] 5) Conduct DV (Design Validation) environmental experiments and EMC experiments.

[0083] After simulating normal vehicle communication conditions, the communication rate of each communication chip was adjusted to its maximum allowable limit. Environmental tests were then conducted in a corresponding temperature chamber, subjecting the chip to a series of extreme conditions, including high temperature, low temperature, and temperature cycling. These tests simulated whether vehicle communication functioned normally under extreme weather conditions. If communication messages were sent and received normally, the chip's communication quality was considered good.

[0084] Adjust the chip's communication rate to its maximum and perform EMC testing on the entire analog communication device to test the anti-interference capability of the entire communication network.

[0085] The technical solutions of this application can not only perform batch testing of the communication function, local wake-up function and remote wake-up function of the communication chip under test, but also test the communication quality of the communication chip under test by adjusting the communication rate, temperature and electromagnetic intensity.

[0086] It should be noted that, in practical applications, the vehicle communication chip testing system provided in the above embodiments can be assigned to different functional modules as needed, that is, the internal structure of the system can be divided into different functional modules to complete all or part of the functions described above, and this is not a limitation.

[0087] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of a system according to various embodiments of this application. Each block in a flowchart or block diagram may represent a module, segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0088] The units described in the embodiments of this application can be implemented in software or hardware, and the described units can also be located in a processor. The names of these units do not necessarily limit the specific unit itself.

[0089] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A vehicle-mounted communication chip testing system, characterized in that, The vehicle-mounted communication chip testing system includes a first host computer, a second host computer, a first microcontroller, a second microcontroller, a first power module, a second power module, a first communication chip, a second communication chip, a first non-wake-up chipset to be tested, and a second non-wake-up chipset to be tested. The first non-wake-up chipset under test is connected to the first host computer, the first microcontroller, the first power module, and the second non-wake-up chipset under test, respectively; the second non-wake-up chipset under test is connected to the second host computer, the second microcontroller, and the second power module, respectively; the first microcontroller is connected to the first power module; the second microcontroller is connected to the second power module; the first communication chip is configured in the first non-wake-up chipset under test, and the second communication chip is configured in the second non-wake-up chipset under test. In this process, the first host computer transmits the first test message to the first non-wake-up chipset under test and controls the first non-wake-up chipset under test to send the first test message; the second host computer controls the second non-wake-up chipset under test to receive the message and obtain the first message reception result; the second host computer determines the communication function test result based on the first message reception result.

2. The vehicle-mounted communication chip testing system according to claim 1, characterized in that, If a communication function test is performed on the first non-wake-up chipset under test and the second non-wake-up chipset under test, the first host computer sends a first power-on control command to the first microcontroller through the first communication chip. The first microcontroller enables the first power module through the first power-on control command, so that the first power module supplies power to the first non-wake-up chipset under test. The second host computer sends a second power-on control command to the second microcontroller through the second communication chip. The second microcontroller enables the second power module through the second power-on control command, so that the second power module supplies power to the second non-wake-up chipset under test.

3. The vehicle-mounted communication chip testing system according to claim 2, characterized in that, The vehicle communication chip testing system also includes a first wake-up chip group to be tested and a second wake-up chip group to be tested. The first wake-up chip group under test is connected to the first microcontroller, the first power module, and the second wake-up chip group under test respectively; the second wake-up chip group under test is connected to the second microcontroller and the second power module respectively. If a local wake-up function test is performed on the first wake-up chipset under test, the first host computer controls the first microcontroller through the first communication chip, so that the first microcontroller sends a local wake-up signal to the first wake-up chipset under test to locally wake up the first wake-up chipset under test; the first host computer transmits a second test message to the first microcontroller through the first communication chip, the first microcontroller transmits the second test message to the first wake-up chipset under test, and controls the first wake-up chipset under test to send the second test message; the second wake-up chipset under test receives the message, obtains the second message reception result, and transmits it to the second microcontroller, the second microcontroller transmits the second message reception result to the second host computer through the second communication chip; the second host computer determines the local wake-up function test result based on the second message reception result.

4. The vehicle-mounted communication chip testing system according to claim 3, characterized in that, The vehicle-mounted communication chip testing system also includes a connector; The first wake-up chip group to be tested is connected to the second wake-up chip group to be tested via the connector; the first non-wake-up chip group to be tested is connected to the second non-wake-up chip group to be tested via the connector; the connector includes a first connector and a second connector, and the first connector and the second connector are connected by a wire harness, the parameters of the wire harness meeting preset conditions; If a remote wake-up function test is performed on the first wake-up chipset under test, the second host computer controls the second microcontroller through the second communication chip, so that the second microcontroller sends a remote wake-up signal to the first wake-up chipset under test through the second wake-up chipset under test, thereby remotely waking up the first wake-up chipset under test, the first power module, and the first microcontroller; the first microcontroller receives messages through the first wake-up chipset under test, obtains a third message reception result, and transmits it to the first host computer; the first host computer determines the remote wake-up function test result based on the third message reception result.

5. The vehicle-mounted communication chip testing system according to claim 3, characterized in that, The second host computer determines the communication function test result based on the first message reception result, including: If the first message reception result is empty, the communication function test result is abnormal; if the first message reception result is not empty, the communication function test result is normal. or, If the first message reception result is different from the preset message, the communication function test result is abnormal; if the first message reception result is the same as the preset message, the communication function test result is normal, and the first test message is the preset message.

6. The vehicle-mounted communication chip testing system according to claim 4, characterized in that, If the communication function test results, the local wake-up function test results, and the remote wake-up function test results are all normal, the communication rate is adjusted to perform a first communication quality test on the first non-wake-up chipset under test, the second non-wake-up chipset under test, the first wake-up chipset under test, and the second wake-up chipset under test. The first communication quality test result is determined based on the message reception result after adjusting the communication rate.

7. The vehicle-mounted communication chip testing system according to claim 6, characterized in that, If the first communication quality test result is good, a second communication quality test is performed on the first non-wake-up chipset under test, the second non-wake-up chipset under test, the first wake-up chipset under test, and the second wake-up chipset under test based on different temperatures, and the second communication quality test result is determined according to the message reception results at different temperatures.

8. The vehicle-mounted communication chip testing system according to claim 7, characterized in that, If the second communication quality test result is good, the communication anti-interference capability test is performed on the first non-wake-up chip group to be tested, the second non-wake-up chip group to be tested, the first wake-up chip group to be tested, and the second wake-up chip group to be tested based on different electromagnetic intensities, and the communication anti-interference capability test result is determined according to the message reception results under different electromagnetic intensities.

9. The vehicle-mounted communication chip testing system according to any one of claims 3-8, characterized in that, The first power module includes a first power supply, a first PMOS transistor, a first inductor, and a first system base chip; the first power supply is connected to the first PMOS transistor, the first PMOS transistor is connected to the first inductor, the first inductor is connected to the first system base chip, and the first system base chip is connected to the first microcontroller, the first non-wake-up chipset under test, and the first wake-up chipset under test, respectively. The second power module includes a second power supply, a second PMOS transistor, a second inductor, and a second system base chip; the second power supply is connected to the second PMOS transistor, the second PMOS transistor is connected to the second inductor, the second inductor is connected to the second system base chip, and the second system base chip is connected to the second microcontroller, the second non-wake-up chipset under test, and the second wake-up chipset under test, respectively. The first system base chip includes a first power converter, and the second system base chip includes a second power converter.

10. The vehicle-mounted communication chip testing system according to any one of claims 3-8, characterized in that, The chips in the chipset under test include at least one of a CAN chip and a LIN chip, and the chipset under test includes a first non-wake-up chipset under test, a second non-wake-up chipset under test, a first wake-up chipset under test, and a second wake-up chipset under test.

11. The vehicle-mounted communication chip testing system according to claim 9, characterized in that, The vehicle-mounted communication chip testing system also includes a first circuit board and a second circuit board. The first system base chip, the first microcontroller, the first non-wake-up chipset under test, and the first wake-up chipset under test are configured in the first circuit board; The second system base chip, the second microcontroller, the second non-wake-up chipset under test, and the second wake-up chipset under test are configured in the second circuit board.

Images