Diamond wire saw joint repairing device for wafer cutting

Abstract

The application aims to provide a diamond wire saw joint repairing device for wafer cutting, which can realize efficient and stable joint at the breaking position, and make the joint repaired diamond wire have good internal structure performance, and improve the durability and safety in use. The device comprises a device base table serving as a support, and a pair of clamping positioning devices mounted on the device base table and used for clamping and fixing two cutting wires separated from each other, at least one of the clamping positioning devices is movably connected with the device base table around a vertical central axis, and drives the end of one cutting wire to move close to the end of the other cutting wire; the two clamping positioning devices are respectively connected with the positive and negative poles of an external power source, so that the external power source, the clamping positioning devices and the cutting wires abutting against each other can form a current conduction loop.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of metal workpiece joint repair equipment, in particular to a kind of wafer cutting diamond wire saw joint repair equipment. BACKGROUND

[0002] Diamond wire cutting production wafer refers to the diamond wire made of diamond or cubic boron etc. Ultra-hard material, under the condition of high-speed rotation, cutting wafer. Diamond wire diameter is very small, usually in 50-300 microns, but high hardness, can easily cut silicon wafer material. Diamond wire cutting system needs high automation and precision control, including diamond wire tension control system, wire feeding and winding system, cutting fluid supply system etc. Can realize efficient and precise cutting process. After diamond wire cutting, wafer surface roughness is very low, and the cutting quality is very high, which is very suitable for subsequent slicing and packaging process, which is also the reason why diamond wire cutting is popular. But in the actual application of diamond wire to cut the crystal bar raw material, due to uneven stress and wear, it is easy to cause the diamond wire to break locally. When cutting the crystal bar, the surface machining precision of the obtained wafer blank will not be very high, so in order to reduce the loss and save the cost, the diamond wire used for cutting will be welded and repaired to continue to be used.

[0003] Some devices for connecting workpieces by welding on the market can also be applied to the collection repair of diamond wire for wafer cutting. For example, the Chinese patent application file with the application number CN200580034985.9 discloses a device for implementing jointing, separating or surface treatment processes, in particular welding processes, which is provided with a work head acting on the workpiece to be processed, in particular with a work head for releasing welding energy to the workpiece to be welded, and the device is provided with a sensor device for detecting the position and / or position change of the work head and / or a reference point in space relative to a reference position of the work head and / or relative to the workpiece to be processed, in particular to be welded, so that at least one characteristic parameter of the jointing, separating or surface treatment process, in particular the welding process, can be influenced according to the detected position and / or position change.

[0004] For example, a system and method for using a protruding edge weld for minimizing edge distortion and reducing the electrode size, flange size, welding force and current load required to produce a given weld, the method comprising the steps of forming at least one expanded protrusion along a first workpiece edge, securing the protrusion against a second workpiece and applying a force and a current load to the protrusion to melt a portion of the protrusion; and a system for performing the method, comprising a dedicated protrusion forming fixture, a resistance welding device preferably having a dedicated electrode and a controller communicatively connected to the fixture and the device, and also capable of repairing a joint of a broken diamond wire.

[0005] However, the applicant found that even if the two segments of the cutting wire are repaired by using the common resistance welding form, the different joint proximity methods of the cutting wire end will have a great influence on the strength, hardness and other performances of the obtained cutting wire joint position, and will have different effects on the continuous service life of the cutting wire and the safety during the work process. In addition, due to the small diameter of the diamond wire, although it has great hardness, it is easy to be damaged by slight extrusion deformation during clamping. At this time, the diamond wire may have a fracture damage position point at other positions when it causes the cutting wafer and bears a great external force, which brings other risks to the cutting process. Therefore, how to optimize the repair process of the diamond wire by using the device to obtain better repair effect is a problem that a technical person pays great attention to.

[0006] In view of the above problems, the present application provides a wafer cutting diamond wire saw joint repair device capable of realizing efficient and stable joint at the fracture position, so that the repaired diamond wire has good internal structural performance, improves the durability and safety during use. SUMMARY

[0007] The present application provides a wafer cutting diamond wire saw joint repair device capable of realizing efficient and stable joint at the fracture position, so that the repaired diamond wire has good internal structural performance, improves the durability and safety during use.

[0008] The above technical purposes of the present application are realized by the following technical solutions:

[0009] The utility model provides a kind of diamond wire saw joint repair equipment for wafer cutting, including the device base that plays the supporting effect, and a pair of clamping positioning device is installed on the device base, respectively for the clamping fixation of two sections of cutting line mutually broken and separated, at least one clamping positioning device is rotatably movable around vertical central axis with the device base between connection, and the end of one side cutting line is driven to move close to the end of other side cutting line;Two clamping positioning devices are also connected with the positive and negative poles of external power supply respectively, so that external power supply and the clamping positioning device and the cutting line mutually abutting can form current conduction loop.

[0010] As the preferred of the utility model, two clamping positioning devices can rotate around fixed central axis respectively, drive the end of two side cutting line to mutually close.

[0011] As the preferred of the utility model, wire terminal is fixedly connected with the terminal post outwardly protruding outside clamping positioning device by connecting wire of external power supply.

[0012] As the preferred of the utility model, the clamping positioning device includes main module and clamping module that can be moved up and down along the main module, clamping area is formed between the main module and the clamping module, drive mechanism for driving the clamping module to move up and down relative to the main module and pressure limiting mechanism for limiting the force applied to clamping cutting line are also formed between the main module and the clamping module.

[0013] As the preferred of the utility model, the clamping module includes clamping guide column passing through the main module in vertical direction and clamping part fixed to the upper end of the clamping guide column, and the clamping part can clamp cutting line or not following the lifting movement of the clamping guide column.

[0014] As the preferred of the utility model, elastic reset element is also provided between the main module and the clamping module to play the supporting role between the two components to ensure that cutting line passes through the clamping area smoothly.

[0015] As the preferred of the utility model, the drive mechanism includes eccentric drive wheel and drive rod fixedly connected to the eccentric drive wheel, the eccentric drive wheel is movably installed at the lower part of the main module and can rotate around fixed central axis, while driving the clamping module to perform pressing action.

[0016] As a preferred of the present application, the pressure limiting mechanism comprises a connecting block fixedly arranged at the bottom of the clamping guide column, a lifting slider sleeved and mounted on the clamping guide column and capable of lifting vertically, and an elastic pre-tensioning piece arranged between the connecting block and the lifting slider, the lower part of the main body module is provided with a hollow mounting cavity, the eccentric driving wheel is arranged in the mounting cavity and the two sides thereof are movably connected with the inner side of the mounting cavity, and an avoiding cavity for the lower part of the clamping guide column to pass through is formed in the eccentric driving wheel.

[0017] As a preferred of the present application, an insulating protective sleeve is arranged at the end of the driving rod.

[0018] As a preferred of the present application, an observation module for observing the joining process of the cutting wire is further comprised.

[0019] In summary, the present application can realize the following beneficial effects:

[0020] 1. The wafer cutting diamond wire saw joint repair equipment given in the technical scheme of the present application adopts a mode that the two broken cutting wires are fixed on the two clamping positioning devices on the two sides respectively, and then the two cutting wires are relatively rotated to make the end faces of the two cutting wires approach and join on one side first, and then the other side is gradually approached and joined until the end faces of the two cutting wires are completely joined, so that higher joint quality can be obtained. Compared with the direct abutment and power joint after abutment, or the transmission joint mode that the end portions of the two cutting wires are translated and abutted on each other at an instant to realize high-temperature melting joint, the optimization effects that can be obtained mainly include the following points:

[0021] a. Temperature is easier to control. Starting from local joint, the initial temperature rising rate can be controlled first, and then the temperature of the whole end face is controlled through the rotation speed, so that the optimal welding temperature can be reached without overheating.

[0022] b. Temperature distribution is more uniform. By rotating, different parts are sequentially joined, so that the uniform distribution of temperature in each region can be better realized, and a relatively consistent temperature field of the whole end face is obtained.

[0023] c. Joint effect is better. The more accurate temperature control and uniform distribution are beneficial to the material to reach the optimal melting state, so that higher melting depth ratio and stronger joint strength can be realized.

[0024] d. Residual stress is smaller. Since the temperature field is more uniform, the melting and re-solidification of each part are more coordinated, so that the residual stress generated is smaller, which makes the toughness of the welding point higher.

[0025] e. The welding point appearance is better. The temperature is uniform and the control precision is high, which can reduce overheating and other problems, and the welding point surface quality is higher and the appearance is better.

[0026] 2. The cutting wire saw joint repair equipment for wafer cutting provided in the technical scheme of the present application, the clamping and positioning device for fixing the cutting wire comprises a pressure limiting mechanism, which limits the clamping and pressing force within a certain range during the clamping and fixing of the cutting wire by the user driving device, avoids the deformation of the undamaged part of the cutting wire due to the local large pressure, and ensures that the cutting wire does not break during the cutting of the wafer by the repaired cutting wire.

[0027] 3. The cutting wire saw joint repair equipment for wafer cutting provided in the technical scheme of the present application, the clamping and positioning device for fixing the cutting wire adopts a driving mode of driving the eccentric driving wheel through a driving rod, which is very labor-saving and convenient, and an insulating protective sleeve is further sleeved and installed on the driving rod, so that the device can be directly connected in the resistance welding equipment for welding and connecting the two parts of the cutting wire, and the repair work of the cutting wire by the equipment is more efficient and convenient. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the cutting wire saw joint repair equipment for wafer cutting;

[0029] Figure 2 It is a schematic diagram of the working principle of the equipment of the cutting wire joint type realized by rotating the clamping and positioning device on one side only;

[0030] Figure 3 It is a schematic diagram of the working principle of the equipment of the cutting wire joint type realized by rotating the clamping and positioning devices on both sides independently;

[0031] Figure 4 It is a schematic diagram of the state of the two sections of the cutting wire when they are connected to each other by the repair equipment;

[0032] Figure 5 It is an enlarged schematic diagram of the cutting wire end surface joint process when the two sections of the cutting wire are close to each other by rotating;

[0033] Figure 6 It is a schematic diagram of the state of the cutting wire when it is initially placed in the clamping and positioning device;

[0034] Figure 7 It is a schematic diagram of the state of the cutting wire when it is clamped and fixed by the clamping and positioning device;

[0035] Figure 8The principle diagram of clamping and positioning device clamping and fixing cutting line in side direction view angle;

[0036] Figure 9 The principle diagram of eccentric driving wheel driving lifting slider to move up and down.

[0037] In the figure:

[0038] A - cutting line;

[0039] B - equipment base;

[0040] C - clamping and positioning device, C1 - terminal post, C2 - connecting wire;

[0041] D - observation module;

[0042] 1 - main body module, 101 - installation cavity;

[0043] 2 - clamping module, 201 - clamping guide post, 202 - clamping part;

[0044] 3 - driving mechanism, 301 - eccentric driving wheel, 3011 - avoiding cavity, 302 - driving rod, 303 - insulation protection sleeve;

[0045] 4 - pressure limiting mechanism, 401 - connecting block, 402 - lifting slider, 403 - elastic pre-tensioning element;

[0046] 5 - elastic reset element;

[0047] 6 - notched positioning clamping mechanism, 601 - supporting block, 602 - pressing block. DETAILED DESCRIPTION

[0048] The following specific embodiments are only an explanation of the present application, and are not a limitation of the present application, and the person skilled in the art can make a modification of the present embodiment without creative contribution according to the need after reading the present specification, but as long as in the scope of the claims of the present application, it is protected by the patent law.

[0049] The present scheme is realized through the following technical means:

[0050] Embodiment: In this embodiment, first need to explain the processing repair joint processing of diamond cutting line, diamond cutting line is the most commonly used wafer cutting wire, it is made of diamond and nickel and other materials, has very high hardness and high temperature resistance, can cut silicon wafer and other hard and brittle materials at high speed. Diamond cutting line cutting efficiency, cutting quality is good, is the mainstream choice in the industry. And an important feature of diamond cutting line is that it belongs to tungsten carbide based alloy, has certain electric conductivity, high melting point, usually in 2600-2900℃, need higher welding temperature. Resistance welding can produce high enough temperature, but need to choose the right current and welding time control in the melting point temperature of diamond cutting line. When the diamond cutting line is used as a cutting line saw in the equipment, a diamond cutting line saw is formed. Since only the use of diamond cutting line to play the cutting role in the use scenario is discussed in this embodiment, it is referred to as cutting line A in the following.

[0051] In this embodiment, a wafer cutting diamond cutting line saw joint repair device is given, mainly including a device base B serving as a support, and a pair of clamping positioning devices C respectively used for clamping and fixing two sections of cutting line A separated from each other, at least one of the clamping positioning devices C is movably connected with the device base B around a vertical central axis, and drives the end of one side cutting line A to move close to the end of the other side cutting line A; the two clamping positioning devices C are respectively connected with the positive and negative poles of an external power supply, so that the external power supply and the clamping positioning devices C and the cutting lines A abutting each other can form a current conduction loop.

[0052] The clamping positioning device C can be divided into a main body module 1 and a clamping module 2, and the clamping module 2 can move up and down relative to the main body module 1 along the vertical direction.

[0053] Specifically, referring to the drawings Figure 6The implementation structure of the clamping positioning device C is given, wherein the main body module 1 is in the form of a cuboid block, a hollow concave mounting cavity 101 is formed in the lower part of the main body module 1, an eccentric driving wheel 301 capable of rotating around a horizontal fixed center axis is movably installed in the mounting cavity 101, a through hole 3011 is formed in the center of the eccentric driving wheel 301, and a driving rod 302 is formed on the eccentric driving wheel 301 and extends radially outward from the center. For example, a horizontal cylindrical center shaft can pass through the main body module 1 on the outside and the eccentric driving wheel 301 on the inside. At this time, the height of the bottom of the circular arc-shaped outer contour in the vertical direction changes during the rotation of the eccentric driving wheel 301 around the center axis.

[0054] A clamping module 2 is installed above the main body module 1, and the clamping module 2 mainly includes a clamping guide column 201 extending in the vertical direction and a clamping part 202 in the form of a block extending horizontally in the horizontal direction. The clamping part 202 can be connected and fixed by being sleeved on the clamping guide column 201 at the top and then being welded together, and a channel is formed in the main body module 1. The lower part of the clamping guide column 201 in the clamping module 2 passes through the channel in the main body module 1 from top to bottom and enters the mounting cavity 101, and then continues to pass through the through hole 3011 in the eccentric driving wheel 301 and extends downward. It should be noted that the clamping guide column does not interfere with the rotation of the eccentric driving wheel during the lifting movement.

[0055] A pressure limiting mechanism 4 is arranged at the lower part of the clamping positioning device C. Specifically, the mechanism includes a lifting slider 402 sleeved and installed at the lower part of the clamping guide column 201, the lifting slider 402 can move up and down along the clamping guide column 201 in the vertical direction; a connecting block 401 with a radial size larger than the clamping guide column 201 is fixedly installed on the clamping guide column 201 by screwing or clamping; a compressible metal spring is installed between the lifting slider 402 and the connecting block 401 as an elastic pre-tensioning piece 403, and the upper and lower ends of the metal spring are in abutment with the upper surface of the connecting block 401 and the lower surface of the lifting slider 402, respectively.

[0056] Meanwhile, the upper clamping module 2 is extended to one side, and the upper part of the main module 1 is also extended to one side, and a notch positioning clamping mechanism 6 for clamping and fixing the end of the cutting line A is formed between the two parts. Figure 8 As shown in the enlarged structural schematic view, a V-shaped notch structure is formed on the supporting block 601, and when the cutting line A with a cylindrical cross section enters the notch, it can be firmly positioned under the pressing action of the lower pressing block 602.

[0057] During operation, the broken end of the cutting line A is first introduced into the clamping area between the main module 1 and the clamping module 2. At this time, the user presses the driving rod 302 to drive the eccentric driving wheel 301 to rotate and push the lifting slide 402 downward. At this time, the lifting slide 402 moves downward and pushes the metal spring and the clamping module 2 to move downward together until the clamping module 2 contacts the cutting line A at the same time as the main module 1, completing the clamping and positioning. In a common clamping mechanism, because the radial size of the cutting line A is very small, it is difficult for the operator to accurately determine when to stop pressing to avoid loosening or damaging the cutting line A. However, in this embodiment, due to the presence of the special pressure limiting mechanism 4, even if the user continues to press the driving rod 302 beyond the ideal clamping limit, the force between the connecting block 401 and the lifting slide 402 has exceeded the expected limit range, so the metal spring will immediately deform elastically.

[0058] In terms of effect, even after the clamping and fixing of the cutting line A is completed, if the operator presses the driving lifting slide 402 to move a large amount, the amount of movement will not be completely transmitted to the cutting line A, but will be absorbed by the deformation and contraction of the metal spring, thereby reducing the extrusion force and impact on the cutting line A as the workpiece to be processed, and achieving effective protection effect.

[0059] It is noted that, in order to realize the connection by resistance welding, the side of the main module 1 is formed with an outwardly protruding terminal post C1, and a connecting wire C2 for realizing the conduction with an external power source is installed. The main module 1 as a whole or at least a part thereof is made of a metal material such as copper or aluminum alloy, and the supporting block 601 is also made of the same material. In this structure, when the two mutually separated cutting wires A are fixed on the clamping positioning device C and are close to each other until contact, the current can flow from one side of the cutting wire A segment to the other side of the cutting wire A segment through the contact surface, and at the same time, a very high heat is generated on the contact surface, which drives the two parts of the cutting wire A to melt on the contact surface and be connected to each other, realizing the repair connection of the cutting wire A as a whole.

[0060] Specifically, referring to the drawings Figure 2 The structure of the single-sided rotation is given, or the structure of the two-sided simultaneous rotation is given Figure 3 The structure of the two-sided simultaneous rotation is given, and both of the two ways can realize the rotation of at least one side of the clamping positioning device C and the cutting wire A fixed thereon towards the cutting wire A on the other side of the clamping positioning device C.

[0061] In the actual process of connecting and repairing the cutting wire A, first, the two mutually separated cutting wires A are fixed by using the clamping positioning devices C on both sides, and then the control switch of the external power source is turned on. At this time, one side of the cutting wire A is connected in communication with the positive electrode of the external power source, and the other side of the cutting wire A is connected in communication with the negative electrode of the external power source. Referring to the drawings Figure 5 The enlarged view of the end surface of the two cutting wires A that are close to each other in a rotating manner is given. When the central angle of the rotation of one side of the cutting wire A relative to the center of rotation is γ, the distance between the inner side edge of the part of the cutting wire A and the inner side edge of the other part of the cutting wire A is a, and the distance between the outer side edge of the part of the cutting wire A and the outer side edge of the other part of the cutting wire A is b. Obviously, the length of a is smaller than the length of b. As the two parts of the cutting wire A continue to approach each other, the inner side edges will inevitably contact each other first and melt and connect under the action of the conducted current, and the melting and connecting of the outer side edges will be delayed, thereby becoming a process of gradually extending from one side to the other side until the end portions of the two parts of the cutting wire A are completely connected together.

[0062] For the gradual contact melting connection mode of the cutting line A, compared with the common direct translation butt joint connection mode, the initial temperature rise rate can be controlled first from the local joint, and then the temperature of the whole end face is controlled through the rotation speed, so that the optimal welding temperature can be achieved without overheating. Since the different parts are sequentially connected by rotation, the temperature can be more evenly distributed in each area, and a more consistent temperature field is obtained on the whole end face. In addition, in this connection mode, the temperature control is more accurate and uniform, which is beneficial to the material to achieve the best melting state, so that higher melting depth ratio and stronger joint strength can be achieved. Further, since the temperature field is more uniform, the melting and re-solidification of each part are more coordinated, so the residual stress is smaller, which makes the toughness of the welding point higher. At the same time, under the condition of uniform temperature and high control accuracy, overheating and other problems can be reduced, so that the surface quality of the two parts is higher, the appearance is better, and the difficulty of subsequent surface processing is also reduced accordingly.

[0063] In addition, for safety reasons, an insulating protective sleeve 303 made of plastic or rubber material can also be preferably sleeved and installed on the outer end of the driving rod 302. At this time, the driving rod 302 can not only drive the eccentric driving wheel 301 to rotate to realize the fixation of the cutting line A, but also can independently drive the clamping positioning device C on one side and the cutting line A fixed thereon to rotate together under the action of the horizontal force applied by the operator, and approach and joint with the cutting line A on the clamping positioning device C on the other side.

[0064] In order to realize more efficient operation in the process of repeatedly clamping different cutting lines A, a rubber elastic reset element 5 can also be installed between the main module 1 and the clamping module 2, so that the clamping module 2 is lifted upward before clamping the cutting line A, which facilitates the introduction of the new cutting line A end into the clamping area after completing a joint repair process.

[0065] In order to more accurately observe and detect whether the two parts of the cutting line A end face are opposite to each other during the joint process, the device given in this embodiment also includes an observation module D. Specifically, the observation module D includes image sensors or lenses installed above the two cutting lines A, and the image signals obtained by the image sensors or lenses are transmitted to the external display screen, so that the joint process can be observed in real time, thereby improving the joint repair effect and obtaining better quality of the cutting line A.

[0066] The above merely illustrates the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements shall be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A diamond wire saw joint repair device for wafer dicing, characterized in that: The device includes a support base (B) and a pair of clamping and positioning devices (C) mounted on the base (B), which are used to clamp and fix two broken and separated cutting lines (A). At least one clamping and positioning device (C) is movably connected to the base (B) in a rotatable manner about a vertical central axis, and drives the end of one cutting line (A) to move closer to the end of the other cutting line (A). The two clamping and positioning devices (C) are also connected to the positive and negative terminals of an external power source, respectively, so that a current conduction loop can be formed between the external power source, the clamping and positioning devices (C), and the cutting lines (A) that abut against each other.

2. The wafer dicing diamond wire saw joint repair equipment according to claim 1, characterized in that: The two clamping and positioning devices (C) can rotate about a fixed central axis, driving the ends of the cutting lines (A) on both sides to come closer together and engage.

3. The wafer dicing diamond wire saw joint repair equipment according to claim 2, characterized in that: An outwardly protruding terminal (C1) is provided on the outside of the clamping and positioning device (C), and an external power supply is used to fix the electrode terminals to the terminal (C1) through a connecting wire (C2).

4. The wafer dicing diamond wire saw joint repair equipment according to any one of claims 1-3, characterized in that: The clamping and positioning device (C) includes a main body module (1) and a clamping module (2) capable of moving up and down along the main body module (1). A clamping area is formed between the clamping module (2) and the main body module (1). A drive mechanism (3) for driving the clamping module (2) to move up and down relative to the main body module (1) and a pressure limiting mechanism (4) for limiting the force applied to the clamping cutting line (A) are also formed between the main body module (1) and the clamping module (2).

5. The wafer dicing diamond wire saw joint repair equipment according to claim 4, characterized in that: The clamping module (2) includes a clamping guide post (201) that passes through the main module (1) in a vertical direction and a clamping part (202) fixed to the upper end of the clamping guide post (201). The clamping part (202) can follow the lifting and lowering movement of the clamping guide post (201) to realize whether or not to clamp the cutting line (A).

6. The wafer dicing diamond wire saw joint repair equipment according to claim 5, characterized in that: An elastic reset element (5) is also provided between the main body module (1) and the clamping module (2) to provide support between the two components so as to ensure that the cutting line (A) passes smoothly through the clamping area.

7. The wafer dicing diamond wire saw joint repair equipment according to claim 6, characterized in that: The drive mechanism (3) includes an eccentric drive wheel (301) and a drive rod (302) fixedly connected to the eccentric drive wheel (301). The eccentric drive wheel (301) is movably installed on the lower part of the main body module (1) and can rotate around a fixed central axis, while driving the clamping module (2) to perform a pressing action.

8. The diamond wire saw joint repair equipment for wafer dicing according to claim 7, characterized in that: The pressure limiting mechanism (4) includes a connecting block (401) fixedly disposed at the bottom of the clamping guide post (201), a lifting slider (402) sleeved on the clamping guide post (201) and capable of moving up and down in the vertical direction, and an elastic pre-support top member (403) disposed between the connecting block (401) and the lifting slider (402). The lower part of the main module (1) is provided with a hollow mounting cavity (101). The eccentric drive wheel (301) is disposed in the mounting cavity (101) and its two sides are respectively movably connected to the inner side of the mounting cavity (101). The eccentric drive wheel (301) is provided with a clearance cavity (3011) that runs vertically through the lower part of the clamping guide post (201) for passage.

9. The diamond wire saw joint repair equipment for wafer dicing according to claim 8, characterized in that: An insulating protective sleeve (303) is installed at the end of the drive rod (302).

10. The wafer dicing diamond wire saw joint repair equipment according to claim 1, characterized in that: It also includes an observation module (D) for observing and monitoring the joining process of the cutting line (A).

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