Wafer processing apparatus

Abstract

The present application provides a wafer processing device, which includes a conversion mechanism, a processing tank, a clamp and a processing box. The conversion mechanism includes a translation track and a turnover table arranged on the translation track, and the turnover table has a turnover shaft. The processing tank is pivotally arranged on the turnover table by the turnover shaft, and the processing tank has an opening. The clamp is movably arranged in the processing tank and can move out of the opening. One side of the processing box has a side opening corresponding to one end of the translation track, and a nozzle assembly is arranged in the processing box and faces the side opening. The turnover table can turn the clamp to face the side opening, and the turnover table can move along the translation track to the processing box to move the clamp out of the opening into the processing box to a position corresponding to the nozzle assembly. Therefore, the wafer processing device of the present application can be suitable for horizontal and vertical wafer processing.

Description

Technical Field

[0001] This invention relates to wafer surface processing, and more particularly to a wafer processing apparatus capable of being used for both vertical and horizontal wafer processing. Background Technology

[0002] Existing wafer fabrication processes involve multiple steps such as immersion in chemical solutions, spraying with chemical solutions, rinsing, and drying. Generally, each step is performed using specific equipment, and wafers need to be transferred between stations by robotic arms. As a result, equipment costs are high, transfer times are long, and relocation is required when changing stations, leading to poor throughput in existing wafer fabrication lines.

[0003] In view of this, the inventor has devoted himself to researching and applying theoretical principles to address the aforementioned problems in the prior art, which is the target of the inventor's improvement. Summary of the Invention

[0004] The present invention provides a wafer fabrication apparatus that can be used for both vertical and horizontal wafer fabrication processes.

[0005] This invention provides a wafer fabrication apparatus comprising a conversion mechanism, a process slot, a fixture, and a process box. The conversion mechanism includes a translation track and a flipping table disposed on the translation track, the flipping table having a flipping shaft. The process slot is pivotally mounted on the flipping table via the flipping shaft and has an opening. The fixture is movably disposed within the process slot and can move to protrude from the opening. One side of the process box has a side opening corresponding to one end of the translation track. A nozzle assembly is disposed within the process box and faces the side opening. The flipping table can flip the fixture so that it faces the side opening, and the flipping table can move along the translation track towards the process box, moving the fixture with the protruding opening through the side opening into the process box to the position corresponding to the nozzle assembly.

[0006] The wafer fabrication apparatus of the present invention has a nozzle assembly connected to a lifting assembly, which can drive the nozzle assembly to move up and down within the process chamber.

[0007] The wafer fabrication apparatus of the present invention has an air jet nozzle on the top of the process chamber.

[0008] The wafer fabrication apparatus of the present invention further includes a negative pressure chamber, which is connected to both the process tank and the process chamber. The wafer fabrication apparatus of the present invention also includes a sleeve assembly, which includes a plurality of tube segments movably connected in series. One end of the sleeve assembly is connected to the process tank, and the other end of the sleeve assembly is connected to the negative pressure chamber. An exhaust port is provided at the top of the process chamber, and the exhaust port is connected to the negative pressure chamber.

[0009] The wafer fabrication apparatus of the present invention has a drainage trough at the bottom of its process box.

[0010] The wafer fabrication apparatus of the present invention includes a flip actuator disposed between a flip table and a process slot. The flip actuator may include a telescopic rod connected between the flip table and the process slot. The flip actuator may also include a flip motor that drives the flip shaft. The flip motor and the flip shaft are connected and interlocked by a transmission gear set.

[0011] In the wafer fabrication apparatus of the present invention, when the fixture is located inside the process chamber, the opening of the process slot aligns with the side opening of the process chamber. A sealing ring is provided at the side opening of the process chamber, and the process slot presses against the sealing ring to seal the opening with the side opening.

[0012] The wafer fabrication apparatus of the present invention has at least one of the process slot and the fixture connected to a translation actuator, which can drive the process slot and the fixture to move relative to each other so that the fixture moves in and out of the process slot.

[0013] The wafer fabrication apparatus of the present invention has a process slot for horizontal wafer fabrication and a process box for vertical wafer fabrication. Furthermore, a transfer mechanism allows for the transfer of fixtures between the process slot and the process box. Therefore, horizontal and vertical processes can be performed on the same wafer on the same apparatus without the need to transfer the wafer between multiple fixtures. Thus, the wafer fabrication apparatus of the present invention eliminates the wafer positioning step and accelerates production capacity.

[0014] To provide a better understanding of the above and other aspects of the present invention, specific embodiments are described below in conjunction with the accompanying drawings, but these are not intended to limit the scope of the invention. Attached Figure Description

[0015] Figure 1 and Figure 2 This is a three-dimensional schematic diagram of a wafer fabrication apparatus according to the first embodiment of the present invention.

[0016] Figure 3 This is a partial cross-sectional view of the wafer fabrication apparatus according to the first embodiment of the present invention.

[0017] Figures 4 to 7 This is a schematic diagram of various usage states for switching between flat wafer processing and vertical wafer processing according to the first embodiment of the present invention.

[0018] Figure 8 and Figure 9 This is a schematic diagram of the various usage states of the wafer fabrication apparatus of the first embodiment of the present invention for vertical wafer fabrication.

[0019] Figure 10 This is a schematic diagram of the wafer fabrication apparatus of the first embodiment of the present invention in use for a flat wafer fabrication process.

[0020] Figure 11This is a schematic diagram of the wafer fabrication apparatus of the second embodiment of the present invention in use for a flat wafer fabrication process.

[0021] In the attached figures, the following labels are used:

[0022] 10: Wafer

[0023] 100: Conversion Mechanism

[0024] 110: Translation Track

[0025] 120: Turning Table

[0026] 121: Reversing axis

[0027] 130: Translation actuator

[0028] 140: Flip actuator

[0029] 141: Telescopic pole

[0030] 142: Reversing Motor

[0031] 143: Transmission gear set

[0032] 200: Processing tank

[0033] 201: Opening

[0034] 210: Bushing assembly

[0035] 211a, 211b, 211c, 211d: Pipe sections

[0036] 220: Negative pressure chamber

[0037] 300: Fixture

[0038] 310: Rotating component

[0039] 311: Rotary Motor

[0040] 312: Belt

[0041] 400: Process Box

[0042] 401:Side port

[0043] 402: Exhaust port

[0044] 410: Drainage channel

[0045] 420: Sealing ring

[0046] 430: Jet nozzle

[0047] 440: Airtight Lock

[0048] 500: Nozzle Assembly

[0049] 510: Lifting Component Detailed Implementation

[0050] See Figures 1 to 2 The first embodiment of the present invention provides a wafer fabrication apparatus suitable for horizontal and vertical processes of a single wafer 10. In this embodiment, the wafer fabrication apparatus of the present invention includes a conversion mechanism 100, a process slot 200, a fixture 300, and a process box 400.

[0051] The conversion mechanism 100 includes a translation track 110 and a tilting table 120. The tilting table 120 is disposed on the translation track 110 and can translate along the translation track 110. The tilting table 120 has a tilting shaft 121, which is horizontally arranged and can be used for pitch tilting. The tilting table 120 is provided with a tilting actuator 140. In this embodiment, the tilting actuator 140 may include a telescopic rod 141, one end of which is connected to the tilting table 120. Specifically, the telescopic rod 141 may be in the form of an electric cylinder, a pneumatic cylinder, or a screw and nut assembly, etc., and the present invention is not limited thereto.

[0052] The process tank 200 is pivotally mounted on the tilting table 120 via a tilting shaft 121, allowing it to tilt and rotate. The process tank 200 has an opening 201. When the opening 201 of the process tank 200 is facing upwards, it can be used for flat wafer 10 processes such as soaking, rinsing, and spin drying. The other end of the aforementioned tilting actuator 140 is connected to the process tank 200, and the connection point between the tilting actuator 140 and the process tank 200 is offset to one side of the tilting shaft 121. Therefore, when the tilting actuator 140 is actuated, it can generate a torque relative to the tilting shaft 121 to tilt the process tank 200.

[0053] A clamp 300 is used to hold the wafer 10. The clamp 300 is movably disposed within the process slot 200 and can enter and exit the process slot 200 through the opening 201. The aforementioned process slot 200 is provided with a translation actuator 130, which can drive the process slot 200 and the clamp 300 to move relative to each other, thereby causing the clamp 300 to enter and exit the process slot 200. The translation actuator 130 may be in the form of an electric cylinder, but the present invention is not limited thereto. In this embodiment, the translation actuator 130 is preferably connected to the flip shaft 121, and the process slot 200 is pivotally mounted on the flip table 120 via the translation actuator 130. The translation actuator 130 can move the outer wall of the process slot 200 to move it relative to the clamp 300, thereby causing the clamp 300 to enter and exit the process slot 200.

[0054] The process chamber 400 can be used for spraying processes on vertically positioned wafers 10. One side of the process chamber 400 has a side opening 401, which is configured corresponding to one end of a translational track 110. A nozzle assembly 500 is disposed inside the process chamber 400, and the nozzle assembly 500 is positioned facing the side opening. The nozzle assembly 500 can be connected to a lifting assembly 510, which drives the nozzle assembly 500 to move up and down within the process chamber 400. In this embodiment, the lifting assembly 510 can be an electric cylinder, a vertical screw and nut assembly, or a vertical rack and pinion assembly; the invention is not limited to these. A jet nozzle 430 can be provided at the top of the process chamber 400, an exhaust port 402 is provided at the top of the process chamber 400, and a drainage trough 410 is provided at the bottom of the process chamber 400.

[0055] See Figure 1 and Figure 2 The longitudinal direction of the tilting axis 121 of the tilting table 120 is perpendicular to the longitudinal direction of the translation track 110, therefore the tilting table 120 can... Figures 4 to 6 The flipping fixture 300 shown is oriented towards the side opening, and the flipping table 120 can be turned as follows: Figures 6 to 8 The device further moves along the translation track 110 towards the process box 400. At this time, the fixture 300 protrudes from the opening 201, allowing it to move into the process box 400 through the side opening to the position corresponding to the nozzle assembly 500. See also... Figure 9 The nozzle assembly 500 moves up and down within the process chamber 400, spraying process solutions or cleaning solutions onto the surface of the wafer 10. When the fixture 300 is located within the process chamber 400, the opening 201 of the process slot 200 aligns with the side opening of the process chamber 400, and the periphery of the side opening can be... Figure 3 The diagram shows a sealing ring 420. The edge of the opening 201 of the process tank 200 presses against the sealing ring 420 to seal the opening 201 with the side opening. A jet nozzle 430 may be provided on the top of the process tank 400 to spray downwards, causing the process liquid or cleaning liquid to flow downwards to the drain tank 410. At the same time, it can provide positive pressure to drive the process waste gas to the exhaust port 402, thereby achieving the effect of gas-liquid separation and recovery.

[0056] See Figure 1 and Figure 2 The wafer fabrication apparatus of the present invention may further include a negative pressure chamber 220, which is connected to the process tank 200 and the process chamber 400 respectively, and is preferably connected to the exhaust port 402 via a pipeline (not shown). The negative pressure chamber 220 is connected to a negative pressure source (not shown) to drive the process tank 200 or the process chamber 400 to discharge process waste gas.

[0057] See Figure 1 and Figure 2In this embodiment, the process tank 200 is connected to the negative pressure chamber 220 via a sleeve assembly 210. The sleeve assembly 210 includes a plurality of tube segments 211a, 211b, 211c, and 211d, which are movably sleeved and connected to each other. One end of the sleeve assembly 210 is connected to the process tank 200, and the other end of the sleeve assembly 210 is connected to the negative pressure chamber 220. See also Figures 4 to 7 The movable pipe sections 211a, 211b, 211c, and 211d can extend and retract to accommodate the displacement of the process groove 200. See also... Figures 4 to 6 These pipe sections 211a, 211b, 211c, and 211d may include straight pipe sections 211a and 211d as well as curved pipe sections 211b and 211c. The curved pipe sections 211b and 211c have both ends perpendicular to each other, and one end is coaxially configured with the flip shaft 121, thus allowing them to rotate to cooperate with the flipping action of the process groove 200 relative to the flip shaft 121. See also... Figures 6 to 7 At least a portion of the pipe segments 211a, 211b, 211c, and 211d are arranged parallel to the translation track 110. In this embodiment, at least a portion of one pipe segment 211c is arranged parallel to the translation track 110 and this portion can be translated longitudinally to enter the negative pressure chamber 220. When the clamp 300 moves into the process box 400, this pipe segment 211c can enter the negative pressure chamber 220 and abut against the inner wall of the negative pressure chamber 220 to block the communication between the process groove 200 and the negative pressure chamber 220, thereby enabling the negative pressure to be switched to the process box 400.

[0058] See Figure 10 When performing the flat wafer 10 process, the opening 201 of the process tank 200 faces upward, the fixture 300 moves into the process tank 200, and the sleeve assembly 210 exits the negative pressure chamber 220, connecting the negative pressure chamber 220 to the process tank 200. Furthermore, the wafer fabrication apparatus of the present invention also includes an airtight gate 440, which closes the side opening 401 of the process chamber 400 to prevent air from flowing into the negative pressure chamber 220 and causing the pressure inside the negative pressure chamber 220 to rise, thereby allowing the negative pressure energy to be switched to the process tank 200. The fixture 300 is equipped with a rotating component 310. When performing the flat wafer 10 process, the fixture 300 can rotate the wafer 10 by rotating the rotating component 310. The rotating component 310 is located on the flip shaft 121 of the flip table 120 and includes a rotary motor 311 that drives the fixture 300. The fixture 300 and the rotary motor 311 can be connected and driven by a belt 312 or a gearbox.

[0059] See Figure 11A second embodiment of the present invention provides a wafer fabrication apparatus, comprising a conversion mechanism 100, a process slot 200, a fixture 300, and a process box 400. The wafer fabrication apparatus provided in this embodiment has a generally similar structure to the first embodiment, and the similarities between this embodiment and the first embodiment will not be repeated. The difference between this embodiment and the first embodiment is that the flip actuator 140 may include a flip motor 142, and the flip motor 142 is connected to the flip shaft 121 to flip the process slot 200. In this embodiment, the flip motor 142 and the flip shaft 121 are axially parallel and side-by-side, and the flip motor 142 and the flip shaft 121 are connected and mutually activated by a transmission gear set 143.

[0060] The wafer fabrication apparatus of the present invention includes a process tank 200 for immersion, rinsing, and rotary drying of horizontally positioned wafers 10, and a process box 400 for spraying of vertically positioned wafers 10. Furthermore, a transfer mechanism 100 allows the jig 300 to be transferred between the process tank 200 and the process box 400. Therefore, horizontal and vertical processes can be performed on the same wafer 10 on the same apparatus without the need to transfer the wafer 10 between multiple jigs 300. Thus, the wafer fabrication apparatus of the present invention eliminates the wafer 10 positioning step, thereby accelerating production capacity.

[0061] In summary, although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the invention. Those skilled in the art to which this invention pertains can make various corresponding changes and modifications based on the present invention without departing from its spirit and essence; however, all such corresponding changes and modifications should fall within the protection scope of the appended claims.

Claims

1. A wafer fabrication apparatus, characterized in that, Include: A conversion mechanism includes a translation track and a tilting table disposed on the translation track, the tilting table having a tilting shaft; A process slot is pivotally mounted on the flipping table via the flipping shaft, and the process slot has an opening; A clamp, movably disposed within the process slot and movable protruding from the opening; and A process box has a side opening on one side and the side opening is configured to face one end of the translation track. A nozzle assembly is provided inside the process box and the nozzle assembly is configured to face the side opening. The flipping table can flip the clamp so that the clamp faces the side opening, and the flipping table can move along the translation track to the process box and move the clamp protruding from the opening into the process box through the side opening to the position corresponding to the nozzle assembly.

2. The wafer fabrication apparatus as described in claim 1, characterized in that, The nozzle assembly is connected to a lifting assembly, which can drive the nozzle assembly to move up and down within the process chamber.

3. The wafer fabrication apparatus as described in claim 1, characterized in that, The top of the process box is equipped with a jet nozzle.

4. The wafer fabrication apparatus as described in claim 1, characterized in that, It also includes a negative pressure chamber, which is connected to the process tank and the process box respectively.

5. The wafer fabrication apparatus as described in claim 4, characterized in that, It also includes a sleeve assembly comprising a plurality of tube segments that are movably sleeved together, one end of the sleeve assembly being connected to the process tank and the other end of the sleeve assembly being connected to the negative pressure chamber.

6. The wafer fabrication apparatus as described in claim 4, characterized in that, The top of the process chamber is provided with an exhaust port, which is connected to the negative pressure chamber.

7. The wafer fabrication apparatus as described in claim 1, characterized in that, The bottom of the process box is equipped with a drainage trough.

8. The wafer fabrication apparatus as described in claim 1, characterized in that, A flipping actuator is provided between the flipping table and the process tank.

9. The wafer fabrication apparatus as described in claim 8, characterized in that, The flip actuator includes a telescopic rod connecting the flip table and the process slot.

10. The wafer fabrication apparatus as claimed in claim 8, characterized in that, The flip actuator includes a flip motor that drives the flip shaft.

11. The wafer fabrication apparatus as claimed in claim 10, characterized in that, The flipping motor and the flipping shaft are connected and linked by a transmission gear set.

12. The wafer fabrication apparatus as claimed in claim 1, characterized in that, When the fixture is located inside the process box, the opening of the process slot aligns with the side opening of the process box.

13. The wafer fabrication apparatus as claimed in claim 12, characterized in that, The process chamber has a sealing ring on its side opening, and the process groove presses against the sealing ring to seal the opening with the side opening.

14. The wafer fabrication apparatus as claimed in claim 1, characterized in that, At least one of the process slot and the fixture is connected to a translation actuator, which can drive the process slot and the fixture to move relative to each other, so that the fixture moves in and out of the process slot.

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