An electronic product gluing device

Abstract

The present application relates to the field of electronic product processing, and in particular to an electronic product gluing device, the technical scheme of which is to include a machine platform, a positioning assembly arranged on the top surface of the machine platform and used to load a circuit board, a glue dispenser arranged on the machine platform and located above the positioning assembly, a material discharge assembly arranged on the machine platform and used to place a protective cover on the circuit board, and an ultraviolet lamp arranged on the machine platform and used to irradiate the glue dispensing position of the circuit board, wherein a moving assembly for controlling the movement of the ultraviolet lamp is provided on the machine platform. The present application has the effect of improving the gluing efficiency of the protective cover and accelerating the solidification speed of the gluing position of the protective cover.

Description

Technical Field

[0001] The present application relates to the field of electronic product processing, and in particular to an electronic product gluing device. Background Art

[0002] With the development of science and technology, people have higher and higher requirements for network transmission rates, and the speed of network signals is also getting higher and higher, so optical modules are produced. Optical modules are mainly electronic products that convert electricity to light and light to electricity. Optical modules can convert electrical signals into optical signals and transmit them to longer distances. During the production and assembly process of existing electronic products with optical modules, workers need to install a protective cover on the circuit board to protect the chip to prevent the chip from being scratched during the installation process, which affects the use of the chip. The staff installs the protective cover on the circuit board with glue. Since the glue takes time to solidify, the staff needs to put the bonded circuit board aside for static. However, when moving the circuit board or when the circuit board is static, the staff may accidentally touch the protective cover, causing the protective cover to be skewed or offset, affecting the adhesive effect of the protective cover. Summary of the invention

[0003] In order to improve the gluing efficiency and gluing effect of the protective cover, the present application provides an electronic product gluing device.

[0004] The present application provides an electronic product gluing device, which adopts the following technical solution:

[0005] An electronic product gluing device comprises a machine platform, a positioning assembly arranged on the top surface of the machine platform and used for loading a circuit board, a glue dispenser arranged on the machine platform and located above the positioning assembly, a material discharge assembly arranged on the machine platform and used for placing a protective cover on the circuit board, and an ultraviolet lamp arranged on the machine platform and used for irradiating a glue dispensing position of the circuit board, wherein a moving assembly for controlling the movement of the ultraviolet lamp is provided on the machine platform.

[0006] By adopting the above technical scheme, the machine is used to install the positioning component, the glue dispensing machine, the feeding component and the ultraviolet lamp. The positioning component determines the position of the circuit board, the glue dispensing machine applies glue on the circuit board, the feeding component places the protective cover at the glue applying position of the glue dispensing machine, the ultraviolet lamp is used to irradiate the glue applying position, accelerate the solidification speed of the colloid, and improve the gluing efficiency of the protective cover. The moving component is used to control the movement of the ultraviolet lamp and adjust the irradiation angle of the ultraviolet lamp to facilitate the ultraviolet lamp to fully irradiate the gluing position of the protective cover.

[0007] Preferably, the positioning assembly includes a positioning seat arranged on the machine platform, a positioning plate arranged on the positioning seat and used to position the circuit board, and a positioning cylinder arranged on the positioning seat, wherein the piston end of the positioning cylinder is arranged toward the dispensing machine and connected to the positioning plate.

[0008] By adopting the above technical solution, the positioning seat is installed on the machine platform to improve the stability of the positioning plate and the positioning cylinder. The positioning plate is used to place the circuit board, and the positioning cylinder is used to drive the positioning plate to move toward the discharge end of the dispensing machine, so as to facilitate the dispensing machine to apply glue on the circuit board.

[0009] Preferably, the positioning plate is provided with positioning blocks 1 for positioning the circuit board on both sides along the length direction, the positioning plate is provided with positioning block 2 at one end close to the dispensing machine, the positioning plate is provided with an installation groove along the width direction, a bidirectional screw is provided in the installation groove, a rotating motor for driving the bidirectional screw to rotate is provided on the positioning plate, and the positioning block 1 is threadedly connected to the bidirectional screw.

[0010] By adopting the above technical solution, positioning block 1 and positioning block 2 are used to position the side of the circuit board, which is convenient for the staff to place the circuit board and determine the placement position of the circuit board. The rotating motor drives the bidirectional screw to rotate, and the rotation of the bidirectional screw drives the positioning block 1 to move, so that the positioning blocks 1 on both sides are close to or away from each other, thereby improving the stability of the circuit board during gluing.

[0011] Preferably, the cross-section of the positioning block 1 is trapezoidal and the slope is arranged toward the circuit board.

[0012] By adopting the above technical solution, the cross-section of the positioning block one is trapezoidal, and the trapezoid is a right-angled trapezoid. The vertical horizontal surface connected to the slope of the positioning block one is positioned on the side of the circuit board. The sloped surface facilitates the removal of the circuit board and reduces the interference of the positioning block one with the circuit board.

[0013] Preferably, the discharge assembly includes a support platform arranged on the machine platform, a cross guide rail arranged on the support platform and a downward pressure cylinder arranged on the cross guide rail, and a suction nozzle is provided at the piston end of the downward pressure cylinder, and the suction nozzle is used to adsorb the protective cover.

[0014] By adopting the above technical solution, the support table is used to install a cross guide rail, and the cross guide rail transmits the downward pressure cylinder to the top of the gluing position of the circuit board according to the size of the circuit board. After the suction nozzle absorbs the protective cover, the protective cover is placed in the gluing position through the downward pressure cylinder.

[0015] Preferably, the moving assembly includes a moving seat arranged on the machine platform, a positioning member arranged on the moving seat and used to position the ultraviolet lamp, and a moving cylinder arranged on the machine platform and used to push the moving seat to move toward the circuit board. The machine platform is provided with a slide groove along the moving path of the circuit board, and the bottom surface of the moving seat is provided with a slider located in the slide groove, and the piston end of the moving cylinder is connected to the slider.

[0016] By adopting the above technical solution, the movable seat is used to install the positioning piece, the positioning piece is used to position the ultraviolet lamp, and the movable cylinder pushes the movable seat toward the position of the circuit board, which is convenient for the ultraviolet lamp to irradiate the gluing position of the protective cover and speed up the gluing rate of the protective cover. The slide groove and the slider improve the stability of the movable seat on the machine platform, making it convenient for the movable cylinder to push the movable seat.

[0017] Preferably, the positioning member includes a bending plate arranged on the movable seat and located above the positioning assembly, a plurality of universal ball heads arranged on the bending plate and a connecting rod arranged on the universal ball heads, one end of the connecting rod is connected to the universal ball head, and the other end of the connecting rod is provided with a positioning ring for positioning the ultraviolet lamp.

[0018] By adopting the above technical solution, the bending plate is used to install the universal ball head, the connecting rod is used to install the ultraviolet lamp, the universal ball head is convenient for adjusting the angle of the connecting rod, and then adjusting the irradiation angle of the ultraviolet lamp, and the positioning ring improves the stability of the ultraviolet lamp on the connecting rod.

[0019] Preferably, the bending plate includes a plurality of bending blocks and a rotating shaft for connecting two adjacent bending blocks, a groove is provided at one end of the bending block, a protrusion is provided at the other end of the bending block, the rotating shaft is located in the groove, a rotating groove for installing the rotating shaft is provided on the protrusion, and the rotating shaft is located in the rotating groove.

[0020] By adopting the above technical solution, several bending blocks can be bent at angles according to the shape of the circuit board, so that the ultraviolet lamp can better irradiate the bonding position. The protrusion is located in the groove to facilitate the connection between two adjacent bending blocks. The rotating shaft facilitates the angle adjustment of the bending block. The rotating groove is used to install the rotating shaft, thereby improving the connection stability and rotation stability of the two adjacent bending blocks.

[0021] Preferably, a mounting ear is provided on one side of the positioning ring close to the connecting rod, and a rotating shaft located on the mounting ear is provided on the connecting rod.

[0022] By adopting the above technical solution, the mounting ears and the rotating shaft are used to adjust the position of the positioning ring, which is convenient for locally adjusting the rotation angle of the ultraviolet lamp and facilitating the ultraviolet lamp to irradiate the gluing position of the protective cover.

[0023] Preferably, a threaded hole is formed on the side wall of the positioning ring, a positioning screw is provided on the positioning ring and is located in the threaded hole, and a protective pad is provided at one end of the positioning screw located in the positioning ring.

[0024] By adopting the above technical solution, the threaded hole and the positioning screw are used to fix the ultraviolet lamp on the positioning ring to improve the stability of the ultraviolet lamp, and the protective pad is used to protect the ultraviolet lamp to reduce the possibility of the positioning screw scratching the ultraviolet lamp.

[0025] In summary, the ultraviolet lamp directly irradiates the gluing position of the protective cover to accelerate the solidification efficiency of the gluing position of the protective cover. The movable component can adjust the irradiation angle of the ultraviolet lamp, which is convenient for adjusting the irradiation angle of the ultraviolet lamp according to the gluing position of the circuit board to accelerate the gluing efficiency of the protective cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the structure of an electronic product gluing device of the present application;

[0027] Figure 2 It is a structural schematic diagram of a positioning component in an electronic product gluing device of the present application;

[0028] Figure 3 It is a structural schematic diagram of a movable component in an electronic product gluing device of the present application.

[0029] : 1. machine; 2. positioning assembly; 21. positioning seat; 22. positioning plate; 23. positioning cylinder; 3. dispensing machine; 4. discharge assembly; 41. support table; 42. cross guide; 43. downward pressure cylinder; 5. ultraviolet lamp; 6. moving assembly; 61. moving seat; 62. positioning piece; 621. bending plate; 6211. bending block; 6212. rotating shaft; 622. universal ball head; 623. connecting rod; 63. moving cylinder; 7. positioning block one; 8. positioning block two; 9. mounting groove; 10. bidirectional screw; 11. rotating motor; 12. suction nozzle; 13. slide groove; 14. slider; 15. positioning ring; 16. groove; 17. bump; 18. rotating groove; 19. mounting ear; 20. rotating shaft; 24. threaded hole; 25. positioning screw; 26. protective pad. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-3 This application is described in further detail.

[0031] The present application embodiment discloses an electronic product gluing device. Figure 1, including a machine 1, a positioning component 2 installed on the top surface of the machine 1, a glue dispenser 3 installed on the top surface of the machine 1, a material discharge component 4 and an ultraviolet lamp 5 installed on the top surface of the machine 1, the positioning component 2 is used to position the circuit board, the processing end of the glue dispenser 3 is located above the positioning component 2, the material discharge component 4 is used to place the protective cover on the circuit board, the ultraviolet lamp 5 is installed on the machine 1 and the ultraviolet lamp 5 is used to irradiate the gluing position of the circuit board, and a moving component 6 for driving the ultraviolet lamp 5 to move toward the circuit board is also installed on the top surface of the machine 1. The staff places the circuit board on the positioning component 2, and the positioning component 2 transfers the circuit board to the processing end of the glue dispenser 3. After the glue dispenser 3 applies glue on the circuit board, the material discharge component 4 places the protective cover at the gluing position, and then the moving component 6 moves the ultraviolet lamp 5 to the top of the circuit board, and the ultraviolet lamp 5 is used to accelerate the solidification efficiency of the gluing position of the protective cover.

[0032] Reference Figure 1 and Figure 2 The positioning assembly 2 includes a positioning seat 21 fixedly mounted on the machine 1, a positioning plate 22 mounted on the positioning seat 21, and a positioning cylinder 23 fixedly mounted on the positioning seat 21 and used to drive the positioning plate 22 to move toward the dispensing machine 3. The piston end of the positioning cylinder 23 is fixedly connected to the positioning plate 22, so that the positioning cylinder 23 can push the positioning plate 22 to the bottom of the processing end of the dispensing machine 3. In order to improve the stability of the circuit board on the positioning plate 22, positioning blocks 7 are installed on both sides of the length direction of the positioning plate 22 along the length direction, and the positioning blocks 7 are used to position both sides of the length of the circuit board. A positioning block 28 is fixed at one end of the positioning plate 22 close to the dispensing machine 3, and the positioning block 28 is used to position one side of the width direction of the circuit board. The cross section of the positioning block 7 is trapezoidal, and the trapezoid is a right-angled trapezoid. The slope of the positioning block 7 is set toward the circuit board. The vertical plane of the positioning block 7 is used to position the circuit board. When the staff needs to take out the circuit board, the slope can effectively reduce the interference of the positioning block 7 on the removal of the circuit board.

[0033] Reference Figure 1 and Figure 2 In order to improve the positioning effect of the positioning block 7 on the circuit board and facilitate the staff to place the circuit board, a mounting groove 9 is opened on the top surface of the positioning plate 22 along the width direction, and a bidirectional screw 10 is installed in the mounting groove 9. A rotating motor 11 for driving the bidirectional screw 10 to rotate is fixedly installed on the positioning plate 22, and the output end of the rotating motor 11 is fixed to one end of the bidirectional screw 10. A protrusion extends from the bottom surface of the positioning block 7 toward the mounting groove 9, and the protrusion is threadedly connected with the bidirectional screw 10. When the bidirectional screw 10 rotates, the positioning block 7 is driven to move along the width direction of the positioning plate 22, so that the positioning blocks 7 on both sides can clamp the two sides of the circuit board, thereby improving the stability of the circuit board when moving.

[0034] Reference Figure 1After the circuit board reaches the bottom of the processing end of the glue dispenser 3, the glue dispenser 3 applies glue on the circuit board, and then the discharge assembly 4 places the protective cover on the circuit board. The discharge assembly 4 includes a support table 41 fixedly mounted on the top surface of the machine table 1, a cross guide 42 fixedly mounted on the support table 41, and a downward pressure cylinder 43 mounted on the cross guide 42. The cross guide 42 drives the downward pressure cylinder 43 to move. The piston end of the downward pressure cylinder 43 is fixedly mounted with a suction nozzle 12. After the suction nozzle 12 absorbs the protective cover, the cross guide 42 moves, driving the downward pressure cylinder 43 to move to the top of the gluing position of the circuit board. The downward pressure cylinder 43 drives the suction nozzle 12 to press down, pressing the protective cover to the gluing position.

[0035] Reference Figure 1 and Figure 3 After the protective cover is bonded to the circuit board, the moving assembly 6 drives the ultraviolet lamp 5 to move above the protective cover, and the ultraviolet lamp 5 irradiates the adhesive position of the protective cover to accelerate the solidification speed of the colloid. The moving assembly 6 includes a moving seat 61 installed on the top surface of the machine 1, a positioning member 62 installed on the moving seat 61, and a moving cylinder 63 installed on the top surface of the machine 1 and used to push the moving seat 61 toward the circuit board. The positioning member 62 is used to position the ultraviolet lamp 5. A slide groove 13 is opened on the top surface of the machine 1 along the moving direction of the circuit board. A slider 14 located in the slide groove 13 is fixedly installed on the bottom surface of the moving seat 61. The piston end of the moving cylinder 63 is fixed to the slider 14. The moving cylinder 63 pushes the slider 14 to move in the slide groove 13, which facilitates the moving seat 61 to move toward the circuit board.

[0036] Reference Figure 1 and Figure 3 The positioning member 62 includes a bending plate 621 mounted on the moving seat 61, a plurality of universal ball heads 622 mounted on the bending plate 621, and a connecting rod 623 fixedly mounted on the universal ball head 622. The bending plate 621 includes a plurality of bending blocks 6211 connected end to end in sequence and a rotating shaft 6212 mounted on the bending block 6211. A groove 16 is provided at one end of the bending block 6211, a protrusion 17 is fixed at the other end of the bending block 6211, and adjacent protrusions 17 are inserted into the groove 16. A rotating groove 18 connected to the groove 16 is provided on the bending block 6211. The rotating shaft 6212 is fixedly mounted on the bending block 6211 and is located in the groove 16. When the protrusion 17 is inserted into the groove 16, the bending block 6211 is located in the rotating groove 18, which is used to connect two adjacent bending blocks 6211. The bending shape of the bending plate 621 can be adjusted according to the irradiation requirements of the ultraviolet lamp 5. In the present application, three sets of universal ball heads 622, connecting rods 623 and ultraviolet lamps 5 are arranged to perform surrounding irradiation on the gluing position of the circuit board to accelerate the solidification speed of the gluing position of the circuit board.

[0037] Reference Figure 1 and Figure 3One end of the connecting rod 623 is fixed to the universal ball head 622, and the other end of the connecting rod 623 is fixed with a positioning ring 15. A mounting ear 19 is fixed to the side of the positioning ring 15 close to the connecting rod 623. A rotating shaft 20 located on the mounting ear 19 is fixed to the connecting rod 623. The positioning ring 15 is rotatably connected to the connecting rod 623 through the mounting ear 19 and the rotating shaft 20. The ultraviolet lamp 5 is inserted into the positioning ring 15. In order to improve the stability of the ultraviolet lamp 5 in the positioning ring 15, a threaded hole 24 is opened on the side wall of the positioning ring 15. The positioning ring 15 is provided with a positioning screw 25 located in the threaded hole 24. The positioning screw 25 is threadedly connected to the positioning ring 15. When the ultraviolet lamp 5 is inserted into the positioning ring 15, the positioning screw 25 is screwed into the positioning ring 15 to tighten the ultraviolet lamp 5. A protective pad 26 is fixed to the end of the positioning screw 25 that contacts the ultraviolet lamp 5 . The protective pad 26 can effectively protect the ultraviolet lamp 5 and prevent the positioning screw 25 from scratching the ultraviolet lamp 5 when it is pressed against the ultraviolet lamp 5 .

[0038] The implementation principle of an electronic product gluing device in an embodiment of the present application is as follows: the staff places the circuit board on the positioning plate 22, places one end of the circuit board close to the positioning block 28, and then starts the rotating motor 11 to drive the bidirectional screw 10 to rotate, and the positioning blocks 17 on both sides clamp and position the two sides of the circuit board to improve the stability of the circuit board on the positioning plate 22. After the circuit board is placed, start the positioning cylinder 23 to push the circuit board to the bottom of the processing end of the glue dispenser 3, the glue dispenser 3 applies glue on the circuit board, and then start the positioning cylinder 23 to recycle the circuit board. Then start the cross guide 42 to move the downward pressure cylinder 43 to the top of the circuit board gluing position, and then the downward pressure cylinder 43 presses down the suction nozzle 12 that has adsorbed the protective cover, and presses the protective cover to the circuit board gluing position. Then start the moving component 6 to move the ultraviolet lamp 5, first adjust the bending angle of the bending block 6211, and then adjust the irradiation angle of the ultraviolet lamp 5 to ensure that the ultraviolet lamp 5 is aimed at the gluing position of the circuit board, and then start the moving cylinder 63 to move the moving seat 61 toward the circuit board. The ultraviolet lamp 5 moves to the top of the circuit board with the moving seat 61. At this time, adjust the irradiation angle of the ultraviolet lamp 5 to ensure the accuracy of the ultraviolet lamp 5 irradiating the gluing position of the circuit board and speed up the solidification speed of the glue application position of the protective cover.

[0039] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electronic product gluing device, characterized in that: The invention comprises a machine platform (1), a positioning component (2) arranged on the top surface of the machine platform (1) and used for loading a circuit board, a glue dispenser (3) arranged on the machine platform (1) and located above the positioning component (2), a material discharge component (4) arranged on the machine platform (1) and used for placing a protective cover on the circuit board, and an ultraviolet lamp (5) arranged on the machine platform (1) and used for irradiating a glue dispensing position of the circuit board, wherein the machine platform (1) is provided with a moving component (6) for controlling the movement of the ultraviolet lamp (5), and the positioning component (2) comprises a positioning seat (21) arranged on the machine platform (1), a positioning plate (22) arranged on the positioning seat (21) and used for positioning the circuit board, and a positioning cylinder (23) arranged on the positioning seat (21), wherein a piston end of the positioning cylinder (23) is provided. The positioning plate (22) is arranged toward the dispensing machine (3) and connected to the positioning plate (22). The positioning plate (22) is provided with positioning blocks (7) for positioning the circuit board on both sides along the length direction. The positioning plate (22) is provided with a positioning block (8) at one end close to the dispensing machine (3). The positioning plate (22) is provided with a mounting groove (9) along the width direction. A bidirectional screw (10) is provided in the mounting groove (9). A rotating motor (11) for driving the bidirectional screw (10) to rotate is provided on the positioning plate (22). The positioning block (7) is threadedly connected to the bidirectional screw (10). The moving assembly (6) includes a moving seat (61) arranged on the machine platform (1), a positioning member (62) arranged on the moving seat (61) and used to position the ultraviolet lamp (5), and a device A movable cylinder (63) is arranged on a machine platform (1) and is used to push a movable seat (61) to move toward a circuit board. The machine platform (1) is provided with a slide groove (13) along the moving path of the circuit board. The bottom surface of the movable seat (61) is provided with a slider (14) located in the slide groove (13). The piston end of the movable cylinder (63) is connected to the slider (14). The positioning member (62) comprises a bending plate (621) arranged on the movable seat (61) and located above the positioning assembly (2), a plurality of universal ball heads (622) arranged on the bending plate (621), and a connecting rod (623) arranged on the universal ball head (622). One end of the connecting rod (623) is connected to the universal ball head (622), and the other end of the connecting rod (623) is provided with a A positioning ring (15) is provided for positioning the ultraviolet lamp (5); the discharge assembly (4) comprises a support platform (41) arranged on the machine platform (1), a cross guide rail (42) arranged on the support platform (41), and a downward pressure cylinder (43) arranged on the cross guide rail (42); a suction nozzle (12) is provided at the piston end of the downward pressure cylinder (43); the suction nozzle (12) is used to absorb the protective cover; the bending plate (621) comprises a plurality of bending blocks (6211) and a rotating shaft (6212) for connecting two adjacent bending blocks (6211); a groove (16) is provided at one end of the bending block (6211); a convex block (17) is provided at the other end of the bending block (6211); the rotating shaft (6212) is located in the groove (16);The protrusion (17) is provided with a rotation groove (18) for installing the rotation shaft (6212), the rotation shaft (6212) is located in the rotation groove (18), the positioning ring (15) is provided with a mounting ear (19) on one side close to the connecting rod (623), and the connecting rod (623) is provided with a rotation shaft (20) located on the mounting ear (19).

2. The electronic product gluing device according to claim 1, characterized in that: The cross section of the positioning block 1 (7) is trapezoidal and the slope is arranged toward the circuit board.

3. The electronic product gluing device according to claim 1, characterized in that: A threaded hole (24) is formed on the side wall of the positioning ring (15), a positioning screw (25) located in the threaded hole (24) is provided on the positioning ring (15), and a protective pad (26) is provided at one end of the positioning screw (25) located in the positioning ring (15).

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