A fully automatic feeding and loading equipment for semiconductor packaging process

Abstract

This application relates to a fully automated feeding and loading device for semiconductor packaging processes, belonging to the technical field of semiconductor packaging. It includes a mounting base; two limiting plates, both perpendicularly connected to the mounting base and coplanar; an adjusting plate located between the two limiting plates, coplanar with the limiting plates, perpendicular to the mounting base, and sliding through the mounting base along its length; an adjusting cylinder connected to the adjusting plate and the mounting base, used to drive the adjusting plate to slide along its length; a clamping rod perpendicularly connected to the limiting plate and the adjusting plate on the same side; the clamping rod is used to clamp the wafer; a carrier box, with the adjusting cylinder located inside the carrier box, and the mounting base connected to the carrier box; and a feeding assembly connected to the carrier box, used to adjust the position of the carrier box in three-dimensional space. This application is convenient for use under various working conditions.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor packaging, and in particular to a fully automated feeding and loading device for semiconductor packaging processes. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. The packaging process includes: wafer preparation, where the wafer is diced into small wafers; the diced wafers are then glued onto islands on a corresponding substrate; ultra-fine metal wires or conductive resin are used to connect the wafer's bonding pads to the corresponding pins on the substrate, forming the required circuitry; the individual wafers are then encapsulated and protected with a plastic casing; after encapsulation, a series of operations are performed, and finally, the finished product is tested. Fully automated feeding and loading equipment is used to transport materials during the semiconductor packaging process.

[0003] During wafer preparation, the wafer needs to be developed to remove the exposed photoresist, followed by cleaning and softening, and then plasma etching. Fully automated feeding and loading equipment is required for both the cleaning and handling of the wafers and the plasma etching process.

[0004] Existing fully automated feeding and loading equipment mostly uses wafer lifting or vacuum adsorption methods to pick up and place wafers.

[0005] Regarding the aforementioned technologies, when transferring wafers by lifting, only the wafer can be transported, but it cannot be flipped. When transferring wafers by adsorption, the wafer can be flipped, but after the wafer has been washed, it is not convenient to transfer the wafer by vacuum adsorption, which has the drawback of being inconvenient for use in various working conditions. Summary of the Invention

[0006] To address the shortcomings of being inconvenient for use under various operating conditions, this application provides a fully automated feeding and loading device for semiconductor packaging processes.

[0007] This application provides a fully automated feeding and loading device for semiconductor packaging processes, employing the following technical solution: a mounting base; two limiting plates, both perpendicularly connected to the mounting base and coplanar; an adjusting plate located between the two limiting plates, coplanar with the limiting plates, perpendicular to the mounting base, and sliding through the mounting base along its length; an adjusting cylinder connected to the adjusting plate and the mounting base, used to drive the adjusting plate to slide along its length; a clamping rod perpendicularly connected to the limiting plates and the adjusting plate on the same side; the clamping rod is used to clamp the wafer; a carrier box, with the adjusting cylinder located inside the carrier box, and the mounting base connected to the carrier box; and a feeding assembly connected to the carrier box, used to adjust the position of the carrier box in three-dimensional space.

[0008] By adopting the above technical solution, when clamping the wafer, the limiting plate and the adjusting plate are parallel to the wafer, and the adjusting clamping rod is located on the side closer to the wafer. At this time, the feeding assembly is activated, and the feeding assembly drives the adjusting plate to move closer to the wafer. When the wafer is located between multiple clamping rods, the adjusting cylinder drives the adjusting plate to move closer to the limiting plate, thereby achieving the clamping rods clamping the wafer. Thus, even after the wafer is reversed or washed with water, the wafer can still be transferred stably, achieving the effect of being easy to use under various working conditions.

[0009] Preferably, the mounting base is a cylindrical structure, and the limiting plate is connected to one end face of the mounting base; the mounting base is rotatably connected to the carrier box, and the rotation axis of the mounting base is the center line of the length of the limiting plate; the carrier box is provided with a rotating assembly for driving the mounting base to rotate; the rotating assembly includes: a rotating motor, fixedly connected to the inner wall of the carrier box; a driving gear, coaxially fixedly connected to the output shaft of the rotating motor; and a driven gear, coaxially sleeved on the circumferential outer wall of the mounting base and meshing with the driving gear.

[0010] By adopting the above technical solution, when transferring the wafer after clamping it, if the wafer needs to be reversed, it is only necessary to start the rotating motor. The output shaft of the rotating motor drives the driving gear to rotate, and then the driven gear rotates. Since the center line of the length direction of the adjustment plate is the rotation axis of the driven gear, it is convenient to clamp the wafer under various working conditions and also convenient to adjust the wafer, thus achieving the effect of convenient use and convenient feeding.

[0011] Preferably, the outer circumferential wall of the clamping rod is provided with a receiving groove.

[0012] By adopting the above technical solution, the setting of the receiving groove facilitates the clamping rod to clamp the wafer, thereby improving the stability of the clamping rod when clamping the wafer.

[0013] Preferably, the end of the clamping rod near the limiting plate and the adjusting plate is coaxially connected to a connecting shaft, which passes through the limiting plate or the adjusting plate and is threadedly connected to it.

[0014] By adopting the above technical solution, the connection shaft makes it easy for workers to separate the clamping plate from the adjusting plate or the limiting plate, thereby facilitating the replacement of clamping rods of different sizes or materials, and achieving the effect of making it convenient for workers to use.

[0015] Preferably, the end of the limiting plate opposite to the clamping rod passes through the mounting base and is slidably connected to the mounting base; a fixing plate is vertically fixedly connected to the side wall of the mounting base opposite to the clamping rod; the fixing plate is parallel to the limiting plate; a rack is fixedly connected to the limiting plate along its length; an adjusting component is connected to the fixing plate; the adjusting component includes: an adjusting cylinder, an adjusting gear, a locking plate, and a locking shaft; the adjusting cylinder is rotatably connected to the fixing plate, and the axis of rotation is the axis along the length of the adjusting cylinder; the adjusting gear is sleeved on the circumferential outer wall of the adjusting cylinder and meshes with the rack; the locking shaft is inserted into the adjusting cylinder and threadedly connected to the adjusting cylinder, and the locking shaft is threadedly connected to the fixing plate; the locking plate is vertically fixedly connected to the circumferential outer wall of the locking shaft and abuts against the upper end face of the adjusting cylinder.

[0016] By adopting the above technical solution, when clamping wafers of different sizes, the adjusting plate can adjust the relative position between the adjusting plate and the limiting plate under the action of the adjusting cylinder to clamp the wafer; when clamping wafers of different sizes, the relative position between the limiting plate and the adjusting plate is adjusted under the action of the adjusting component, thereby achieving the clamping of the wafer with minimal work done by the adjusting cylinder; thus achieving the effect of improving work efficiency.

[0017] Preferably, the feeding assembly includes: a base, vertically arranged, which is a cylindrical structure with a closed bottom; a lifting column, which is a cylindrical structure, inserted into the base and sliding along its length and rotating along its center line as the axis of rotation; a connecting plate, vertically fixedly connected to the top of the lifting column; and a reversing plate, located above the connecting plate and parallel to it; one end of the reversing plate is connected to the end of the connecting plate away from the lifting column, and the reversing plate is rotatably connected to the connecting plate, with the axis of rotation of the reversing plate parallel to the axis of rotation of the lifting column.

[0018] By adopting the above technical solution, when using the feeding assembly for feeding, the lifting column can adjust the height of the clamping rod, thereby adjusting the height of the material; the bearing box, connecting plate and reversing plate can adjust the orientation of the material, and the connecting plate and reversing plate themselves have a certain length, thereby realizing the transportation of the material; thus realizing automatic feeding of the material.

[0019] Preferably, extension plates are fixedly connected to both sides of the adjustment plate away from the mounting base; the clamping rod is connected to the extension plates.

[0020] By adopting the above technical solution, the extension board improves the stability of the clamping rod when clamping the wafer.

[0021] Preferably, the end of the limiting plate near the expansion plate has a clearance groove.

[0022] By adopting the above technical solution, the setting of the relief slot facilitates the insertion of the expansion board into the relief slot, thereby the clamping of the wafer is not limited by the expansion board, and smaller wafers can be clamped.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. When clamping a wafer, the limiting plate and adjusting plate are parallel to the wafer, and the adjusting clamping rod is located on the side closer to the wafer. At this time, the feeding assembly is activated, which drives the adjusting plate to move closer to the wafer. When the wafer is located between multiple clamping rods, the adjusting cylinder drives the adjusting plate to move closer to the limiting plate, thereby achieving the clamping rods clamping the wafer. Thus, even after the wafer is reversed or washed, the wafer can still be stably transferred, achieving the effect of easy use under various working conditions.

[0025] 2. When clamping wafers of different sizes, the adjusting plate, under the action of the adjusting cylinder, can adjust the relative position between the adjusting plate and the limiting plate to clamp the wafer; when clamping wafers of different sizes, the adjusting component adjusts the relative position between the limiting plate and the adjusting plate, thereby achieving wafer clamping with minimal work done by the adjusting cylinder; thus improving work efficiency.

[0026] 3. After clamping the wafer, when transferring the wafer, if the wafer needs to be reversed, simply start the rotating motor. The output shaft of the rotating motor drives the drive gear to rotate, which in turn drives the driven gear. Since the center line of the length direction of the adjustment plate is the rotation axis of the driven gear, it is convenient to clamp the wafer under various working conditions and also convenient to adjust the wafer, achieving the effect of convenient use and convenient feeding. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of this application;

[0028] Figure 2 This is a schematic diagram showing some parts of the regulating cylinder;

[0029] Figure 3 This is a schematic diagram showing some of the clamped parts.

[0030] In the diagram, 1. Mounting base; 11. Fixing plate; 12. Adjusting component; 121. Adjusting cylinder; 122. Adjusting gear; 123. Locking plate; 124. Locking shaft; 2. Limiting plate; 21. Rack; 22. Clearance groove; 3. Adjusting plate; 31. Extension plate; 4. Adjusting cylinder; 5. Clamping rod; 51. Receiving groove; 52. Connecting shaft; 6. Carrier box; 7. Feeding assembly; 71. Base; 72. Lifting column; 73. Connecting plate; 74. Reversing plate; 8. Rotating assembly; 81. Rotating motor; 82. Driving gear; 83. Driven gear. Detailed Implementation

[0031] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0032] This application discloses a fully automated feeding and loading device for semiconductor packaging processes.

[0033] refer to Figure 1 and Figure 2 The fully automated feeding and loading equipment for semiconductor packaging processes includes a mounting base 1, a limiting plate 2, an adjusting plate 3, an adjusting cylinder 4, a clamping rod 5, a carrier box 6, and a feeding assembly 7. The mounting base 1, limiting plate 2, adjusting plate 3, adjusting cylinder 4, clamping rod 5, and carrier box 6 work together to load materials, and the feeding assembly 7 is used to convey materials. In this embodiment, the material is a wafer. Specifically, the mounting base 1 has a cylindrical structure; two limiting plates 2 are provided, and the two limiting plates 2 are coplanar; both limiting plates 2 are perpendicularly connected to the mounting base 1, and the length direction of the limiting plates 2 is the same as the length direction of the mounting base 1.

[0034] refer to Figure 1 and Figure 2 An adjusting plate 3 is located between two limiting plates 2, and the adjusting plate 3 and the limiting plates 2 are coplanar. The adjusting plate 3 is perpendicular to the mounting base 1, and the adjusting plate 3 passes through the mounting base 1 and slides along the length direction of the adjusting plate 3. An extension plate 31 is fixedly connected to the two side walls of the adjusting plate 3 away from the mounting base 1. A clearance groove 22 is opened at the end of the limiting plate 2 near the extension plate 31, and the clearance groove 22 is used to place the extension plate 31. An adjusting cylinder 4 connects the adjusting plate 3 and the mounting base 1 and is used to drive the adjusting plate 3 to slide along its length direction. A clamping rod 5 is vertically connected to the same side of the limiting plate 2 and the adjusting plate 3, and the clamping rod 5 is used to clamp the wafer; that is, the clamping rod 5 is connected to the extension plate 31, and at the same time, the clamping rod 5 is connected to the limiting plate 2.

[0035] refer to Figure 2 and Figure 3The clamping rod 5 has a receiving groove 51 on its outer circumference; a connecting shaft 52 is coaxially connected to one end of the clamping rod 5 near the limiting plate 2 and the adjusting plate 3, and the connecting shaft 52 passes through the limiting plate 2 or the adjusting plate 3 and is threadedly connected to it; in this embodiment, the connecting shaft 52 can also pass through the expansion plate 31 and be threadedly connected to the expansion plate 31; the adjusting cylinder 4 is located inside the bearing box 6, and the mounting base 1 is connected to the bearing box 6.

[0036] refer to Figure 1 and Figure 2 The feeding assembly 7 is connected to the carrier box 6 and is used to adjust the position of the carrier box 6 in three-dimensional space. The feeding assembly 7 includes a base 71, a lifting column 72, a connecting plate 73, and a reversing plate 74. The base 71 is vertically arranged and is a cylindrical structure with a closed bottom. The lifting column 72 is cylindrical and is inserted into the base 71, sliding along the length of the lifting column 72. The lifting column 72 rotates around its own length centerline. The connecting plate 73 is vertically fixed to the lifting column 74. The top of the lifting column 72; the reversing plate 74 is located above the connecting plate 73, and the reversing plate 74 is parallel to the connecting plate 73. One end of the reversing plate 74 is connected to the end of the connecting plate 73 away from the lifting column 72, and the reversing plate 74 is rotatably connected to the connecting plate 73; the rotation axis of the reversing plate 74 is parallel to the rotation axis of the lifting column 72; the bearing box 6 is connected to the end of the reversing plate 74 that is not connected to the connecting plate 73, and the bearing box 6 is rotatably connected to the reversing plate 74; the rotation axis of the bearing box 6 is parallel to the rotation axis of the reversing plate 74.

[0037] In use, the adjusting limit plate 2 and adjusting plate 3 are parallel to the wafer, and the clamping rod 5 is located on the side of the adjusting plate 3 closest to the wafer. At this time, the lifting column 72 drives the clamping rod 5 to move downward. When the wafer is directly opposite the receiving slot 51, the adjusting cylinder 4 is activated. The adjusting cylinder 4 drives the adjusting plate 3 to move closer to the limit plate 2, thereby clamping the wafer and completing the material loading. At this time, the lifting column 72 moves up and down along the length of the lifting column 72 in the base 71 to adjust the height of the material. The lifting column 72 rotates in the base 71, or the reversing plate 74 and the connecting plate 73 rotate relative to each other, or the carrier box 6 and the reversing plate 74 rotate relative to each other to adjust the material conveying angle. At the same time, if the reversing plate 74 and the lifting column 72 rotate simultaneously, the wafer can be conveyed. Thus, the material is transported according to different working conditions. At the same time, the setting of the connecting shaft 52 makes it easy for the operator to disassemble the clamping rod 5 and replace it with a clamping rod 5 of different size or material.

[0038] refer to Figure 1 and Figure 2The mounting base 1 is rotatably connected to the carrier box 6. The rotation axis of the mounting base 1 is the center line of the length direction of the limiting plate 2. The carrier box 6 is provided with a rotating assembly 8 for driving the mounting base 1 to rotate. The rotating assembly 8 includes a rotating motor 81, a driving gear 82, and a driven gear 83. The rotating motor 81 is fixedly connected to the inner wall of the carrier box 6. The driving gear 82 is coaxially fixedly connected to the output shaft of the rotating motor 81. The driven gear 83 is coaxially sleeved on the outer circumferential wall of the mounting base 1 and meshes with the driving gear 82. When the wafer is clamped and transferred, if the wafer needs to be reversed, it is only necessary to start the rotating motor 81. The output shaft of the rotating motor 81 drives the driving gear 82 to rotate, and then the driven gear 83 rotates. Since the center line of the length direction of the adjusting plate 3 is the rotation axis of the driven gear 83, it is convenient to clamp the wafer under various working conditions and also convenient to adjust the wafer, achieving the effect of convenient use and convenient feeding.

[0039] refer to Figure 1 and Figure 2 The end of the limiting plate 2 facing away from the clamping rod 5 passes through the mounting base 1 and is slidably connected to the mounting base 1. A fixing plate 11 is vertically fixed to the side wall of the mounting base 1 facing away from the clamping rod 5. The fixing plate 11 is parallel to the limiting plate 2. Specifically, the fixing plate 11 and the clamping rod 5 are located on the same side of the limiting plate 2. A rack 21 is fixedly connected to the limiting plate 2 along its length. Specifically, the rack 21 is located on the side wall of the two limiting plates 2 that are close to each other. An adjusting member 12 is connected to the fixing plate 11 to adjust the relative position between the limiting plate 2 and the mounting base 1.

[0040] refer to Figure 1 and Figure 2 The adjusting component 12 includes an adjusting cylinder 121, an adjusting gear 122, a locking plate 123, and a locking shaft 124. The adjusting cylinder 121 is rotatably connected to the fixing plate 11, with the axis of rotation being the axis of length of the adjusting cylinder 121, and the adjusting cylinder 121 is perpendicular to the mounting base 1. The adjusting gear 122 is sleeved on the outer circumferential wall of the adjusting cylinder 121 and meshes with the rack 21. The locking shaft 124 is inserted into the adjusting cylinder 121 and threadedly connected to the adjusting cylinder 121, and the locking shaft 124 is threadedly connected to the fixing plate 11. The locking plate 123 is vertically fixedly connected to the outer circumferential wall of the locking shaft 124 and abuts against the upper end face of the adjusting cylinder 121, and is used to control whether the adjusting cylinder 121 rotates.

[0041] When clamping wafers of different sizes, the adjusting plate 3, under the action of the adjusting cylinder 4, can adjust the relative position between the adjusting plate 3 and the limiting plate 2 to clamp the wafer; when clamping wafers of different sizes, the adjusting component 12 adjusts the relative position between the limiting plate 2 and the adjusting plate 3, thereby achieving the clamping of the wafer with minimal work done by the adjusting cylinder 4; thus achieving the effect of improving work efficiency.

[0042] The implementation principle of a fully automatic feeding and loading device for semiconductor packaging process according to an embodiment of this application is as follows: When clamping a wafer, the rotating motor 81 is controlled to make the limiting plate 2 and the adjusting plate 3 parallel to the wafer, and the adjusting clamping rod 5 is located on the side closer to the wafer; at this time, the feeding assembly 7 is started, and the lifting column 72 drives the adjusting plate 3 to move towards the side closer to the wafer; when the wafer is located between multiple clamping rods 5, the adjusting cylinder 4 drives the adjusting plate 3 to move towards the side closer to the limiting plate 2, thereby realizing that the clamping rods 5 clamp the wafer; thus, even after the wafer is reversed or washed with water, the wafer can still be stably transferred, achieving the effect of being easy to use under various working conditions.

[0043] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A fully automated feeding and loading device for semiconductor packaging processes, characterized in that: include: Mounting base (1); The limiting plate (2) is provided in two pieces. Both limiting plates (2) are perpendicularly connected to the mounting base (1), and the two limiting plates (2) are coplanar. The adjusting plate (3) is located between the two limiting plates (2), and the adjusting plate (3) is coplanar with the limiting plate (2). The adjusting plate (3) is perpendicular to the mounting base (1), and the adjusting plate (3) passes through the mounting base (1) and slides along the length direction of the adjusting plate (3). Adjusting cylinder (4) connects adjusting plate (3) and mounting base (1) and is used to drive adjusting plate (3) to slide along its length; The clamping rod (5) is vertically connected to the same side of the limiting plate (2) and the adjusting plate (3); the clamping rod (5) is used to clamp the wafer; The carrier box (6) and the adjusting cylinder (4) are located inside the carrier box (6), and the mounting base (1) is connected to the carrier box (6); The feeding assembly (7) is connected to the carrier box (6) and is used to adjust the position of the carrier box (6) in three-dimensional space; The mounting base (1) is a cylindrical structure, and the limiting plate (2) is connected to one end face of the mounting base (1); the mounting base (1) is rotatably connected to the bearing box (6), and the rotation axis of the mounting base (1) is the center line of the length of the limiting plate (2); the bearing box (6) is provided with a rotating assembly (8) for driving the mounting base (1) to rotate; the rotating assembly (8) includes: Rotary motor (81) is fixedly connected to the inner wall of the bearing box (6); The drive gear (82) is coaxially and fixedly connected to the output shaft of the rotary motor (81); The driven gear (83) is coaxially sleeved on the outer circumferential wall of the mounting base (1) and meshes with the driving gear (82); The end of the limiting plate (2) facing away from the clamping rod (5) passes through the mounting base (1) and is slidably connected to the mounting base (1); a fixing plate (11) is vertically fixedly connected to the side wall of the mounting base (1) facing away from the clamping rod (5); the fixing plate (11) is parallel to the limiting plate (2); a rack (21) is fixedly connected to the limiting plate (2) along its length; an adjusting component (12) is connected to the fixing plate (11); the adjusting component (12) includes: an adjusting cylinder (121), an adjusting gear (122), a locking plate (123), and a locking shaft (124); The adjusting cylinder (121) is rotatably connected to the fixed plate (11), and the axis of rotation is the axis of the length of the adjusting cylinder (121); the adjusting gear (122) is sleeved on the outer circumferential wall of the adjusting cylinder (121) and meshes with the rack (21); the locking shaft (124) is inserted into the adjusting cylinder (121) and threadedly connected to the adjusting cylinder (121), and the locking shaft (124) is threadedly connected to the fixed plate (11); the locking plate (123) is vertically fixedly connected to the outer circumferential wall of the locking shaft (124) and abuts against the upper end face of the adjusting cylinder (121).

2. The fully automated feeding and loading equipment for semiconductor packaging process according to claim 1, characterized in that: The clamping rod (5) has a receiving groove (51) on its circumferential outer wall.

3. The fully automated feeding and loading equipment for semiconductor packaging process according to claim 1, characterized in that: The clamping rod (5) is coaxially connected to a connecting shaft (52) at one end near the limiting plate (2) and the adjusting plate (3). The connecting shaft (52) passes through the limiting plate (2) or the adjusting plate (3) and is threadedly connected to them.

4. The fully automated feeding and loading equipment for semiconductor packaging process according to claim 1, characterized in that: The feeding assembly (7) includes: The base (71) is vertically set and is a cylindrical structure with a closed bottom. The lifting column (72) is a cylindrical structure. The lifting column (72) is inserted into the base (71) and slides along its length and rotates along its center line as the axis of rotation. The connecting plate (73) is vertically fixed to the top of the lifting column (72); The reversing plate (74) is located above the connecting plate (73) and is parallel to the connecting plate (73); one end of the reversing plate (74) is connected to the end of the connecting plate (73) away from the lifting column (72), and the reversing plate (74) is rotatably connected to the connecting plate (73), and the rotation axis of the reversing plate (74) is parallel to the rotation axis of the lifting column (72).

5. The fully automated feeding and loading equipment for semiconductor packaging process according to claim 1, characterized in that: The adjustment plate (3) is fixedly connected to the two sides of the end opposite to the mounting base (1) with an extension plate (31); the clamping rod (5) is connected to the extension plate (31).

6. The fully automated feeding and loading equipment for semiconductor packaging process according to claim 5, characterized in that: The limiting plate (2) has a clearance groove (22) at one end near the expansion plate (31).

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