Housing for electronic device, electronic device and foldable electronic device

Abstract

The present application provides a housing for an electronic device, an electronic device, and a foldable electronic device, wherein the housing includes a frame and a middle plate, wherein the frame surrounds and connects to the outer peripheral side of the middle plate; the frame is made of an amorphous alloy material, and the middle plate is made of an alloy material. Such a design can make the frame have a higher structural strength, and even if the size of the frame in the thickness direction is smaller, the structural strength requirements of the housing can be met. Moreover, the smaller size of the frame in the thickness direction can also reduce the weight of the housing, and can achieve lightness and thinness while ensuring the structural strength of the electronic device.

Description

Technical Field

[0001] The present application relates to the field of electronic devices, and in particular to a housing for an electronic device, an electronic device, and a foldable electronic device. Background Art

[0002] The housing of electronic devices is an important component for protecting electronic devices. Common electronic devices include mobile phones, tablet computers, wearable devices, vehicle-mounted devices, augmented reality (AR) / virtual reality (VR) devices, laptops, ultra-mobile personal computers (UMPC), netbooks, personal digital assistants (PDA), etc. Taking mobile phones as an example, the housing of mobile phones is usually made of PC material (Polycarbonate), ABS material (Acrylonitrile Butadiene Styrene) or a combination of PC material and ABS material.

[0003] With the continuous advancement of science and technology, the thinning and lightening of electronic devices has become a focus of people's attention. In the prior art, in order to solve this problem, the whole housing of the electronic device (including the middle plate and the frame connected to the outer edge of the middle plate) is set to be a housing made of alloy material (for example, aluminum alloy material) to meet the demand for thinning and lightening of electronic devices. However, the structural strength of the alloy material is limited. If the housing of the electronic device is made thinner, it cannot meet the structural strength requirements of the housing of the electronic device.

[0004] Therefore, the electronic device housing in the prior art often cannot meet the requirements of both lightness and thinness and structural strength at the same time. Summary of the invention

[0005] The embodiments of the present application provide a housing for an electronic device, an electronic device, and a foldable electronic device, which solve the technical problem in the prior art that the housing of the electronic device cannot be both lightweight and have sufficient structural strength.

[0006] In a first aspect, an embodiment of the present application provides a shell for an electronic device, the shell comprising a frame and a middle plate; wherein the frame surrounds and is connected to the outer peripheral side of the middle plate, and the frame is made of an amorphous alloy material, and the middle plate is made of an alloy material.

[0007] By adopting the above technical scheme, the frame is made of amorphous alloy material. Compared with the existing structure in which the entire shell is set to an alloy material, when the frame size of the shell (for example, the size of the frame in the thickness direction and the height direction of the shell) is the same, the structural strength of the frame in the present application is higher, so that the structural strength of the shell with the frame is higher. From another perspective, when the structural strength of the frame is the same, the frame size in the present application (for example, the size of the frame in the thickness direction and the height direction of the shell) is smaller. And the smaller size of the frame in the thickness direction and the height direction can also reduce the weight of the shell. Therefore, the shell of the electronic device provided by the present application can be made thinner and lighter on the basis of ensuring structural strength, that is, it can take into account both thinner and lighter requirements and meet structural strength requirements.

[0008] In addition, by making the middle plate from an alloy material, the alloy material has a relatively low cost and can ensure sufficient strength.

[0009] Therefore, the shell provided in the present application can not only be made thinner and lighter while ensuring its structural strength, but is also beneficial for controlling the production cost of the shell.

[0010] In some embodiments, there is a gap between the outer peripheral side of the middle plate and the inner peripheral side of the frame, and the outer peripheral side of the middle plate is formed with multiple connecting parts at intervals along the circumference of the middle plate, and the end of each of the multiple connecting parts is connected to the corresponding inner wall of the frame.

[0011] By adopting the above technical solution, a gap is formed between the outer peripheral side wall of the middle plate and the corresponding inner peripheral side wall of the frame. The gap can be used as a deformation space for the middle plate and the frame under high temperature or some environments that affect their deformation. This can avoid the phenomenon that the middle plate and the frame are squeezed against each other due to different shrinkage ratios, causing the middle plate to convex or concave.

[0012] In some embodiments, the gap is filled with a plastic piece, and the plastic piece is respectively attached to the inner peripheral side wall surface of the frame and the outer peripheral side wall surface of the middle plate.

[0013] By adopting the above technical solution, by filling the gap with plastic parts, the plastic parts can fill the gap between the middle plate and the frame on the one hand, and on the other hand, the plastic parts have good elasticity. When the middle plate and the frame are deformed, the plastic parts will not produce a large extrusion force on the two. On the contrary, the plastic parts can absorb the extrusion force caused by the deformation of the middle plate and the frame, effectively avoiding the deformation of the two due to mutual extrusion.

[0014] In some embodiments, a plurality of holes arranged at intervals are formed at the outer peripheral edge of the middle plate at positions corresponding to the gaps, and the plastic part in the gaps further extends into each of the plurality of holes.

[0015] By adopting the above technical solution, by setting holes on the outer peripheral side edges of the middle plate, when the middle plate and the frame are subjected to the injection molding process, the plastic parts at high temperature will be in a fluid state and flow into each of the multiple holes, so that the connection area between the plastic parts and the middle plate is larger, thereby improving the bonding between the plastic parts and the middle plate.

[0016] In some embodiments, each hole portion passes through the middle plate in the thickness direction of the middle plate, and a guide groove is formed on the middle plate between the hole portion and the outer edge of the middle plate, and the guide groove connects the gap and the hole portion.

[0017] By adopting the above technical solution, a guide groove is formed between the hole portion and the outer edge of the middle plate. The guide groove can guide the plastic part in a fluid state in the gap to each hole portion in the multiple hole portions, thereby preventing the plastic from overflowing and contaminating other positions of the middle plate.

[0018] In some embodiments, the connecting portion includes an extension portion extending outward from the outer edge of the middle plate and a joint structure located at the end of the extension portion. The extension portion and the joint structure are formed as one piece, and the joint structure forms a joint surface that is compatible with the inner wall surface of the frame. The joint structure is fitted with the inner peripheral side wall surface of the frame through the joint surface.

[0019] By adopting the above technical solution, a joint surface that fits with the inner circumferential side wall of the frame is formed on the joint structure, and the joint surface is used to fit and connect with the inner circumferential side wall of the frame. This can make the connection area between the connecting part and the inner wall of the frame larger, which is beneficial to improving the connection strength between the middle plate and the frame.

[0020] In some embodiments, the compressive strength of the frame made of amorphous alloy material is 1200MPa to 2200MPa, and the Young's modulus is 80Gpa to 100GPa; the compressive strength of the middle plate made of alloy material is 500MPa to 1200MPa, and the Young's modulus is 40GPa to 80GPa.

[0021] In some embodiments, the frame made of amorphous alloy material has a hardness of 450 HV to 650 HV, and the middle plate made of alloy material has a hardness of 90 HV to 400 HV.

[0022] In some embodiments, the alloy material has a density of 1.5 g / cm3 to 2.5 g / cm3.

[0023] By adopting the above technical solution, the density of the alloy material is required to be 1.5g / cm3 to 2.5g / cm3, so that the mass of the middle plate is smaller, and the shell can be made lighter.

[0024] In some embodiments, the frame is configured such that, in a cross section of the frame, an outer wall surface of the frame is in an arc-shaped structure protruding toward the outside of the frame.

[0025] By adopting the above technical solution, by setting the outer wall surface of the frame to be an arc-shaped structure protruding toward the outside of the frame, the frame can present more side wall area based on a smaller thickness, thereby making the connection area between the side wall of the frame and the middle plate larger, which is beneficial to improving the connection strength between the frame and the middle plate when the frame is connected to the middle plate.

[0026] In some embodiments, the frame is an arc-shaped structure with uniform thickness.

[0027] The adoption of the above technical solution can effectively enhance the user's experience of use and avoid the user's discomfort caused by the bosses or edges on the outer wall of the frame.

[0028] In some embodiments, the overall length of the frame is set to 50 mm to 200 mm; and,

[0029] In the cross section of the frame, the wall thickness of the frame is set to 0.25 mm to 3 mm, and the height of the frame is set to 2 mm to 10 mm.

[0030] In some embodiments, a snap-fit ​​structure matched with the connecting portion is formed on the inner side wall of the frame, and an end of the connecting portion is snap-fitted with the snap-fit ​​structure.

[0031] In some embodiments, the snap-fit ​​structure is configured as an inverted structure, and the end of the connecting portion is configured as a U-shaped snap-fit ​​structure adapted to the inverted structure, and the U-shaped snap-fit ​​structure is held in the inverted structure.

[0032] By adopting the above technical solution, the frame and the middle plate are connected through the inverted buckle structure and the U-shaped buckle structure, which not only has a simple structure but also facilitates the connection between the frame and the middle plate.

[0033] In some embodiments, the middle plate is a plate or a die-casting with uniform thickness, and the thickness is set to be 0.3 mm to 2 mm.

[0034] In some embodiments, a battery enclosure is further disposed on one surface of the middle plate, and the battery enclosure surrounds a battery installation area.

[0035] In some embodiments, the battery enclosure is fixed to the mid-plate by protruding through injection molding of injection molding material.

[0036] In some embodiments, the height of the battery enclosure is set to 0.8 mm to 4.2 mm, the thickness at the connection between the battery enclosure and the middle plate is set to 0.6 mm to 1.2 mm, and the thickness of the top of the battery enclosure is set to 0.4 mm to 1.2 mm.

[0037] By adopting the above technical solution, by setting the thickness of the connection between the battery enclosure and the middle plate to 0.6mm to 1.2mm, and the thickness of the top of the battery enclosure to 0.4mm to 1.2mm, the battery enclosure can be set to gradually become thinner from the connection between the battery enclosure and the middle plate to the top. This can save consumables of the battery enclosure without affecting the connection strength between the battery enclosure and the middle plate, and further reduce the weight of the shell.

[0038] In some embodiments, the amorphous alloy material is a Zr-based amorphous alloy material.

[0039] In some embodiments, the Zr-based amorphous alloy material includes Zr element and Cu element.

[0040] In some embodiments, the middle plate is made of aluminum alloy material or magnesium alloy material.

[0041] In some embodiments, the frame is integrally formed on the outer peripheral side of the middle plate.

[0042] In a second aspect, the present application provides an electronic device, and the electronic device includes a housing of the above structure.

[0043] By adopting the above technical solution, the housing of the above structure can not only be made thinner and lighter while ensuring its structural strength, but also help to control the production cost of the housing. Therefore, the housing of the electronic device with such structure is conducive to making the electronic device thinner and lighter.

[0044] In a third aspect, the present application provides a foldable electronic device, comprising a hinge mechanism, a first shell and a second shell arranged on both sides of the hinge mechanism, the first shell and the second shell being rotatably connected via the hinge mechanism; the first shell and the second shell both adopt the shell of the above-mentioned structure.

[0045] By adopting the above technical solution, the housing with the above structure can not only be made thinner and lighter while ensuring its structural strength, but also help control the production cost of the housing. Therefore, both the first housing and the second housing adopt the housing with the above structure, which is conducive to making the foldable electronic device thinner and lighter.

[0046] In some embodiments, the sides of the middle plate of the first shell and the middle plate of the second shell that are close to each other are both formed with a shaft accommodating area, and the shaft mechanism is disposed in the shaft accommodating area;

[0047] The pivot mechanism includes a base, a first rotating arm and a second rotating arm arranged on both sides of the base, one end of the first rotating arm is rotatably connected to one side of the base, and the other end is connected to the middle plate of the first shell, and one end of the second rotating arm is rotatably connected to the other side of the base, and the other end is connected to the middle plate of the second shell.

[0048] The middle plate of the first shell and the middle plate of the second shell both have step structures at their ends close to the rotating shaft mechanism, and the step structures form a rotating shaft accommodating area.

[0049] By adopting the above technical solution, since the sides of the first middle plate and the second middle plate close to each other are both formed with a shaft accommodating area, the shaft mechanism connecting the two shells can be accommodated in the shaft accommodating area, which can reduce the space of the shaft mechanism in the thickness direction of the foldable electronic device.

[0050] In some embodiments, the step structure is formed by bending the middle plate, and the bending angle radius of the step structure relative to the body of the middle plate is set to 0.3 mm to 0.6 mm.

[0051] In some embodiments, the thickness of the foldable electronic device in the unfolded state is 4.2 mm to 4.3 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1a A schematic diagram of a three-dimensional structure of a housing of an electronic device from a front perspective in some solutions;

[0053] Figure 1b A schematic diagram of a production process flow of a housing of an electronic device in some solutions;

[0054] Figure 2a A schematic diagram of the three-dimensional structure of the housing of the electronic device provided in an embodiment of the present application from a front perspective;

[0055] Figure 2a-1 A schematic diagram of a three-dimensional structure of a housing of an electronic device provided in an embodiment of the present application from a front perspective with plastic parts removed;

[0056] Figure 2a-2 A schematic diagram of a partial cross-section of an electronic device provided in an embodiment of the present application;

[0057] Figure 2b A schematic diagram of the three-dimensional structure of a housing of an electronic device provided in an embodiment of the present application from a rear perspective;

[0058] Figure 2c A schematic diagram of the three-dimensional structure of a frame in a housing of an electronic device provided in an embodiment of the present application;

[0059] Figure 2d A schematic diagram of a top view of a frame in a housing of an electronic device provided in an embodiment of the present application;

[0060] Figure 2e for Figure 2d Schematic diagram of BB cross-section structure;

[0061] Figure 3a A schematic diagram of the three-dimensional structure of a middle plate of a housing of an electronic device provided in an embodiment of the present application;

[0062] Figure 3b A schematic diagram of the cross-sectional structure of a housing of an electronic device provided in an embodiment of the present application;

[0063] Figure 3c A schematic diagram of the structure of a middle plate and a battery enclosure of a housing of an electronic device provided in an embodiment of the present application;

[0064] Figure 3d A schematic diagram of the partial structure of the middle plate and the battery enclosure of the shell of the electronic device provided in an embodiment of the present application.

[0065] Figure 4a A schematic diagram of the three-dimensional structure of a housing of an electronic device provided in an embodiment of the present application from a first viewing angle;

[0066] Figure 4a-1 for Figure 4a AA cross-section diagram of ;

[0067] Figure 4a-2 for Figure 4a BB-view cross-sectional diagram;

[0068] Figure 4a-3 for Figure 4a A schematic cross-sectional view of BB from another perspective;

[0069] Figure 4a-4 for Figure 4a Schematic diagram of CC cross section;

[0070] Figure 4b A schematic diagram of the three-dimensional structure of a housing of an electronic device provided in an embodiment of the present application from a second viewing angle;

[0071] Figure 4c A schematic diagram of a top view of a housing of an electronic device provided in an embodiment of the present application;

[0072] Figure 4d A bottom view structural diagram of a housing of an electronic device provided in an embodiment of the present application;

[0073] Figure 5a A production process flow chart of a housing of an electronic device provided in an embodiment of the present application;

[0074] Figure 5a-1 This is a flowchart of the production process of the housing in the embodiment of the present application;

[0075] Figure 5b A schematic diagram of the injection molding principle of the housing of an electronic device provided in an embodiment of the present application;

[0076] Figure 5c A schematic diagram of the forming principle of a slider of a housing of an electronic device provided in an embodiment of the present application;

[0077] Figure 6a A schematic diagram of the front structure of an electronic device housing provided in an embodiment of the present application;

[0078] Figure 6b A schematic diagram of the back structure of an electronic device housing provided in an embodiment of the present application;

[0079] Figure 7a A schematic structural diagram of a foldable electronic device housing from a first viewing angle provided in an embodiment of the present application;

[0080] Figure 7b A schematic diagram of the structure of a foldable electronic device housing from a second viewing angle provided in an embodiment of the present application;

[0081] Figure 7c A schematic diagram of a partial structure of a foldable electronic device provided in an embodiment of the present application when the back side is unfolded;

[0082] Figure 7d A schematic diagram of a partial structure of a foldable electronic device in a front-unfolded state provided by an embodiment of the present application;

[0083] Figure 7e A schematic diagram of the structure of a foldable electronic device in a folded state provided in an embodiment of the present application.

[0084] Description of reference numerals:

[0085] Explanation of prior art marking:

[0086] 100', shell; 110', frame; 120', middle plate.

[0087] Description of the accompanying drawings in the present application:

[0088] 100. Shell;

[0089] 110. Border;

[0090] 110A, outer wall surface; 111, accommodation area; 112, gap; 110A', frame prefabricated part;

[0091] 120, middle plate; 120A, first surface; 120B, second surface; 120A', middle plate preform;

[0092] 121, connecting portion; 1211, extending portion; 1212, joining structure; 1212A, joining surface; 122, hole portion; 123, guide groove;

[0093] 130. Plastic parts; 131. Buffer chamber;

[0094] 140. Battery enclosure;

[0095] 141. Battery installation area;

[0096] 10A, first shell; 101A, frame of the first shell; 102A, middle plate of the first shell; 10B, second shell;

[0097] 101B, frame of the second shell; 102B, middle plate of the second shell; 10C, shaft accommodating area; 10D, step structure;

[0098] 10. Electronic equipment;

[0099] 20. Foldable electronic device; 200. Hinge mechanism; 300. Display screen; 400. Back cover.

[0100] A1, first slider; A2, second slider; A3, third slider. DETAILED DESCRIPTION

[0101] The embodiment of the present application provides a housing of an electronic device, which can be applied to the electronic device and can be used as the shell of the electronic device to protect and support the electronic device as a whole. The electronic device can be a tablet electronic device, such as a tablet mobile phone, a tablet computer, a wearable device, a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), and other electronic devices.

[0102] The shell in the embodiment of the present application can also be applied to foldable electronic devices, such as foldable mobile phones, foldable computers, various foldable wearable devices, vehicle-mounted devices, augmented reality (AR) / virtual reality (VR) devices.

[0103] See also Figure 1a-1b , Figure 1a A schematic diagram of a three-dimensional structure of a housing of an electronic device from a front perspective in some solutions; Figure 1b Schematic diagram of the production process flow of the housing of electronic equipment in some schemes.

[0104] like Figure 1aAs shown, the electronic device includes a housing 100' and a display screen (not shown in the figure), and the housing 100' is configured as an integrated structure made of the same alloy material (for example, aluminum alloy). The housing 100' includes a middle plate 120' and a frame 110' surrounding the outer peripheral side of the middle plate 120', and the frame 110' surrounds the peripheral side of the display screen to support and protect the peripheral side of the display screen.

[0105] It should be further understood that the display screen and the middle plate 120 ′ are stacked in the thickness direction of the electronic device, and the display screen is located on a side of the electronic device closer to the front.

[0106] The entire housing 100' of this electronic device (including the middle plate 120' and the frame 110' connected to the outer edge of the middle plate 120') is set to be a housing made of an alloy material (for example, an aluminum alloy material), but the structural strength of the alloy material is limited. If the electronic device housing is made thinner, it cannot meet the structural strength requirements of the electronic device housing.

[0107] like Figure 1b As shown, the preparation process of the housing of this electronic device is as follows.

[0108] The first step (aluminum plate incoming): prepare aluminum alloy plates.

[0109] Step 2 (DDG): Grind and cut the aluminum alloy sheet through the DDG process to obtain the positioning reference of the product.

[0110] The third step (CNC1): using CNC technology to roughen the front side of the aluminum alloy plate / gluing the inner cavity. In this step, a receiving space is formed on the front side of the aluminum alloy plate, and the receiving space is used to receive the display screen.

[0111] Step 4 (CNC2): Use CNC technology to process the aluminum alloy sheet after the front roughing / inner cavity glue drawing to form antenna seams, glue drawing holes and related back features. In this step, a storage space for accommodating electronic devices such as motherboards and batteries is formed on the back of the aluminum alloy sheet. After this step is completed, a shell preform is formed, which includes a middle plate preform and a frame preform surrounding the outer periphery of the middle plate preform.

[0112] Step 5 (T treatment): Use chemical reaction to form tiny holes on the surface of the middle plate prefabricated part to enhance the bonding strength.

[0113] Step 6 (NMT): Nano injection molding, using mold molding to form relevant internal structures and antenna seams inside the shell preform.

[0114] Step 7 (CNC3): Use CNC technology to fine-process the front and side wall structures of the shell preform.

[0115] Step 8 (CNC4): Use CNC technology to process SPK holes / USB holes and other peripheral side holes in the frame preform of the shell preform.

[0116] Step 9 (fine polishing): Polish the exterior surface of the frame prefabricated component to improve the appearance texture after anodizing.

[0117] Step 10 (Sandblasting): Use 180# sandblasting to make the frame prefabricated parts look more delicate.

[0118] Step 11 (Anode): Anode appearance treatment of the frame prefabricated parts.

[0119] Step 12 (CNC5): Use CNC to cut off the process connection materials of the middle plate prefabricated parts and the frame prefabricated parts, tap the threads, and cut off the electrical connection PAD.

[0120] In the above process:

[0121] DDG refers to a fully CNC high-efficiency double side surface precision grinder (CNC double side surface grinder), which uses double side surface high-speed grinding to accurately grind aluminum plates into regular three-dimensional volumes to facilitate subsequent CNC finishing.

[0122] CNC indexing machine processing.

[0123] T treatment refers to heat treatment, heat treatment (using T (E) treatment solution to treat the substrate, etching smaller honeycomb nanopores, and finally forming a nano-scale coral reef structure on the surface of the substrate).

[0124] NMT refers to nano-molding, where metal and plastic are combined through nanotechnology.

[0125] Sand blasting refers to the use of compressed air as a power to form a high-speed jet beam, which sprays abrasive at high speed onto the surface of the workpiece to be processed, causing physical changes to the surface of the workpiece to meet quality requirements.

[0126] Anodic machining refers to the process of placing the workpiece at the anode of the electrolytic cell to machine the oxide layer.

[0127] The shell of this electronic device has a relatively complicated manufacturing process (for example, it takes two machining processes, CNC1 and CNC2, to complete the shell preform including the middle plate preform and the frame preform surrounding the outer periphery of the middle plate preform), and the machining time is long, which leads to high production costs.

[0128] To solve the above problems, the shell provided in the embodiment of the present application includes a frame and a middle plate, the interior of the frame is formed with a accommodating area, the frame surrounds and connects to the outer peripheral side of the middle plate, the frame is a frame made of amorphous alloy material, and the middle plate is a middle plate made of alloy material. Compared with the structure of the existing shell as a whole set to alloy material, when the frame size of the shell (for example, the size of the frame in the thickness direction and height direction of the shell) is the same, the structural strength of the frame in the present application is higher, so that the structural strength of the shell with the frame is higher. From another perspective, when the structural strength of the frame is the same, the frame size (for example, the size of the frame in the thickness direction and height direction of the shell) in the present application is smaller. And the smaller size of the frame in the thickness direction and height direction can also reduce the weight of the shell. Therefore, the shell of the electronic device provided in the present application can be thinned on the basis of ensuring structural strength, that is, it can take into account both thinning and meeting the requirements of structural strength.

[0129] Furthermore, the embodiment of the present application also provides a processing technology for a shell, specifically, amorphous alloy material is vacuum die-casted and the frame is integrally formed on the peripheral side of the middle plate preform in the mold, so that a shell preform including the middle plate preform and the frame preform surrounding the outer periphery of the middle plate preform can be obtained. Compared with the prior art solution of "the shell preform including the middle plate preform and the frame preform surrounding the outer periphery of the middle plate preform can be completed by two machining operations of CNC1 and CNC2", the process is simpler and has lower cost.

[0130] In order to make the purpose, technical solutions and advantages of the present application clearer, the structure and production process of the housing of the electronic device provided in the embodiment of the present application are described in detail below with reference to the accompanying drawings.

[0131] See also Figure 2a , Figure 2a-1 , Figure 2a-2 , Figure 2b , Figure 2a A schematic diagram of the three-dimensional structure of the housing of an electronic device provided in an embodiment of the present application from a front perspective. Figure 2a-1 A schematic diagram of the three-dimensional structure of the housing of the electronic device provided in an embodiment of the present application from a front perspective with the plastic parts removed. Figure 2a-2 A schematic diagram of a partial enlarged cross-section of a housing of an electronic device provided in an embodiment of the present application. Figure 2b A schematic diagram of the three-dimensional structure of the housing of an electronic device provided in an embodiment of the present application from a back perspective.

[0132] like Figure 2a , Figure 2a-1 , Figure 2a-2 , Figure 2bAs shown, the housing 100 of the electronic device provided in the embodiment of the present application is formed with a receiving space (not shown in the figure) for receiving components of the electronic device. The housing 100 can also protect the electronic device and support the entire device.

[0133] Specifically, the housing 100 may include a frame 110 and a middle plate 120. The frame 110 surrounds and is connected to the outer peripheral side of the middle plate 120. Or it can be understood that the frame 110 surrounds a receiving area 111, and the middle plate 120 is arranged in the receiving area 111. It should be noted that the frame 110 may be arranged around the entire outer peripheral side of the middle plate 120, or may be arranged in a partial area of ​​the outer peripheral side of the middle plate 120, the frame 110 may be connected to a partial area of ​​the outer peripheral side of the middle plate 120, or may be connected to the entire area of ​​the outer peripheral side of the middle plate 120, and the present application does not impose any restrictions on this.

[0134] In one embodiment, the frame 110 is configured as a frame made of an amorphous alloy material, and the middle plate 120 is configured as a middle plate made of an alloy material.

[0135] Those skilled in the art will appreciate that the middle plate 120 is a support frame located inside the electronic device, and is mainly used to support the entire device. Figure 2a-2 ) and rear cover (see Figure 2a-2 ) are arranged on both sides of the middle plate 120 of the housing 100. Figure 2a-2 As shown, the middle plate 120 includes a first surface 120A and a second surface 120B that are arranged opposite to each other, the first surface 120A is close to the back cover, and the second surface 120B is close to the back of the display screen 300. A first cavity W1 can be formed between the back cover and the middle plate 120, and a second cavity W2 can be formed between the display screen and the middle plate. The first cavity W1 and the second cavity W2 form the above-mentioned accommodation space. The first cavity W1 can be used to install internal components such as batteries, printed circuit boards, cameras, antennas, etc., and the second cavity W2 can be arranged with a vibration element for screen sound or other elements that need to be arranged between the middle plate 120 and the display screen.

[0136] The back cover is a structure on the electronic device that is arranged opposite to the display screen 300 and is connected to the frame 110. It is used to seal the components of the electronic device inside the electronic device and can also prevent dust, collision, and hardware scratches. The back cover can be a back cover made of metal material (i.e., a metal back cover) or a back cover made of non-conductive material (i.e., a non-metal back cover), such as a glass back cover, a plastic back cover, etc.

[0137] The display screen 300 of the electronic device is used to display images. The display screen 300 can be a liquid crystal display (LCD) screen, an organic light emitting diode (OLED) display screen, etc., wherein the OLED display screen can be a flexible display screen or a rigid display screen. The display screen can be an ordinary regular screen, or it can be a special-shaped screen, a folding screen, etc. For example, the display screen can be relatively freely rotated or folded to form an arc, a multi-prism, etc. The display screen can be set on the front and / or back of the electronic device. The front of the electronic device can be understood as the side facing the user when the user uses the electronic device, and the back of the electronic device can be understood as the side facing away from the user when the user uses the electronic device. In the case where the display screen is provided on both the front and back of the electronic device, the side where the main display screen is located is considered to be the front of the electronic device, and the side where the secondary display screen is located is considered to be the back of the electronic device. The surface connecting the front and back of the electronic device can be called the side of the electronic device.

[0138] It should be noted that the display screen 300 has a light-emitting surface that can display images. The back side of the display screen involved in the embodiment of the present application refers to a side surface of the display screen 300 that is arranged opposite to the above-mentioned light-emitting surface, that is, a side surface of the display screen close to the middle plate 120, that is, a surface of the display screen opposite to the second surface 120B of the middle plate 120.

[0139] In the embodiment of the present application, the side where the display screen of the electronic device is located is defined as the front side of the electronic device, the side where the back cover of the electronic device is located is defined as the back side of the electronic device, and the surface connecting the front side and the back side of the electronic device is defined as the side of the electronic device. The side of the electronic device shown in the figure is the side where the frame is located.

[0140] The following combination Figure 2c to Figure 2e The specific structure and material of the frame 110 are described in detail.

[0141] See also Figure 2c to Figure 2e , Figure 2c A schematic diagram of the three-dimensional structure of a frame in a shell of an electronic device provided in an embodiment of the present application. Figure 2d A schematic diagram of the top structure of a frame in a shell of an electronic device provided in an embodiment of the present application. Figure 2e for Figure 2d Schematic diagram of the BB cross-section structure.

[0142] It should be noted that the specific structure of the frame 110 in the present application is not limited. In one embodiment, Figure 2c and Figure 2d As shown, the frame 110 as a whole is an arc-shaped structure with uniform thickness, and the outer wall surface 110A of the frame 110 is an arc-shaped structure protruding toward the outside of the frame.

[0143] This can not only effectively improve the user's experience of use, but also avoid the discomfort of the user caused by the bosses or edges on the outer wall of the frame. It can also make the frame present more side wall area on the basis of a smaller thickness, so that the connection area between the side wall of the frame and the middle plate can be larger, which is conducive to improving the connection strength between the frame and the middle plate when the frame is connected to the middle plate. It can be understood by those skilled in the art that in other alternative embodiments, the thickness of the frame 110 can also be uneven, and the frame 110 can also adopt a non-arc structure.

[0144] like Figure 2c and Figure 2d As shown, the overall length L of the frame 110 made of amorphous alloy material is set to 50 mm to 200 mm.

[0145] It should be understood that the overall length L of the frame 110 made of amorphous alloy material can be set to any value between 50mm and 200mm, for example, it can be 50mm, 75mm, 100.5mm, 200m, etc., which should be determined according to the size requirements of the electronic equipment used, and this application does not make a sole requirement.

[0146] like Figure 2e As shown, the wall thickness M of the frame 110 made of amorphous alloy material is set to 0.25 mm to 3 mm.

[0147] It should be understood that the wall thickness M of the frame 110 can be set to any value between 0.25 mm and 3 mm, for example, 0.25 mm, 1.275 mm, 1.8 mm, 3 mm, etc. Similarly, the specific size of the wall thickness M of the frame 110 can also be determined according to actual design and use requirements, and this application does not make the only requirement.

[0148] like Figure 2e As shown, the height H of the frame 110 made of amorphous alloy material is set to 2 mm to 10 mm.

[0149] It should be understood that the height H of the frame 110 made of amorphous alloy material can be set to any value between 2 mm and 10 mm, for example, 2 mm, 5.6 mm, 7.4 mm, 10 mm, etc. Similarly, the specific size of the height H of the frame 110 can also be determined according to actual design and use requirements, and this application does not make the only requirement.

[0150] It should be understood that in order to make the housing 100 of the electronic device thinner and lighter, the embodiment of the present application tends to design the wall thickness M of the frame 110 and the height H of the frame 110 to be smaller. For example, the wall thickness M of the frame 110 can be designed to be 0.25 mm, and the wall thickness H of the frame 110 can be designed to be 2 mm.

[0151] In some embodiments, the frame 110 made of amorphous alloy material in the present application has a compressive strength of 1200 MPa to 2200 MPa, a Young's modulus of 80 Gpa to 100 GPa, and a hardness of 450 HV to 650 HV.

[0152] Amorphous alloys are solidified by ultra-rapid cooling. When the alloy solidifies, the atoms do not have time to arrange themselves in order and crystallize. The resulting solid alloy has a long-range disordered structure. The molecules (or atoms, ions) that make up the material do not have regular spatial periodicity, and there are no grains or grain boundaries like in crystalline alloys.

[0153] It should be understood that the compressive strength of the frame 110 made of amorphous alloy material can be set to any value in the range of 1200MPa to 2200MPa, for example, 1200MPa, 1563.5MPa, 2200MPa, etc. The hardness of the frame 110 made of amorphous alloy material can be set to any value in the range of 450HV to 650HV, for example, 450HV, 500.5HV, 650HV, etc. The Young's modulus of the frame 110 made of amorphous alloy material can be set to any value in the range of 80Gpa to 100GPa, for example, 80Gpa, 90.5Gpa, 100Gpa, etc. The above parameters should be set according to the actual design and use requirements, and this application does not make the only requirement for this.

[0154] It is further understood that in order to improve the structural strength of the frame 110, the embodiment of the present application tends to design the compressive strength parameter and hardness parameter of the amorphous alloy material to be larger. For example, the compressive strength of the amorphous alloy material can be designed to be 2200 MPa, and the hardness of the amorphous alloy material can be designed to be 650 HV.

[0155] The amorphous alloy material used in the frame 110 of the present application is explained in detail below.

[0156] The amorphous alloy material used for the frame 110 in the present application may be a Zr (zirconium)-based amorphous alloy material, and the Zr (zirconium)-based amorphous alloy material includes Zr (zirconium) elements and Cu (copper) elements.

[0157] It should be understood that the Zr (zirconium)-based amorphous alloy material includes but is not limited to Zr (zirconium) elements and Cu (copper) elements, and may also include other elements, such as Al elements.

[0158] Please refer to Table 1, which is a comparison table of experimental parameters of Zr (zirconium) based amorphous alloy materials and titanium, aluminum, and stainless steel, wherein the performance comparison is based on the same size frame using different materials.

[0159] Table 1:

[0160]

[0161]

[0162] In the above table:

[0163] Hardness refers to the ability of a material to locally resist a hard object pressing into its surface.

[0164] Compressive strength refers to the strength limit when external force is applied.

[0165] Compressive yield strength is an important parameter of material strength and a test indicator for judging the mechanical properties of materials. It refers to the strength limit and deformation limit of materials under compression. It can reflect the compressive strength of materials and is an important indicator for determining the performance grade of materials.

[0166] The compression modulus refers to the ratio of the vertical compressive stress to the total vertical strain when an object cannot be deformed.

[0167] Young's modulus is a physical quantity that describes the ability of solid materials to resist deformation. When a metal wire with a length of L and a cross-sectional area of ​​S is stretched by ΔL under the action of force F, F / S is called stress, and its physical meaning is the force exerted on the metal wire per unit cross-sectional area; ΔL / L is called strain, and its physical meaning is the elongation corresponding to the unit length of the metal wire. The ratio of stress to strain is called elastic modulus. ΔL is a small change. Young's modulus, also known as tensile modulus, is a type of elastic modulus. Young's modulus measures the stiffness of an isotropic elastic body and is defined as the ratio between uniaxial stress and uniaxial deformation within the range of application of Hooke's law. It is inclusive of the elastic modulus. In addition to Young's modulus, the elastic modulus also includes bulk modulus and shear modulus.

[0168] The elastic limit refers to the ability of a metal material to resist external force to a certain limit. If the tensile force continues to increase, the object will undergo plastic deformation until it breaks (for example, a round bar tensile specimen will undergo elastic deformation as the tensile force increases; when the tensile force exceeds the elastic limit, the round bar begins to yield; when the tensile force continues to increase until it reaches the tensile limit, the round bar breaks).

[0169] The elongation / compression ratio refers to the percentage of the total deformation ΔL of the gauge section after the specimen is tensile fractured to the original gauge length L.

[0170] The damping ratio is the ratio of the damping coefficient to the critical damping coefficient, which refers to the various frictions and other obstacles that cause the free vibration to decay. The larger the damping ratio, the stronger the damping force in the vibration system, the faster the amplitude decreases, and the faster the vibration system returns to equilibrium.

[0171] Poisson's ratio refers to the ratio of the transverse normal strain to the axial normal strain when the material is subjected to unidirectional tension or compression. It is also called the transverse deformation coefficient. It is an elastic constant that reflects the transverse deformation of the material.

[0172] Corrosion resistance is the ability of metal materials to resist the corrosive damage of the surrounding medium. It is determined by the composition, chemical properties, and organizational morphology of the material.

[0173] As shown in Table 1 above, three Zr (zirconium) based amorphous alloy materials are provided as examples, wherein the first Zr (zirconium) based amorphous alloy material and the second Zr (zirconium) based amorphous alloy material both include Zr (zirconium) elements and Cu (copper) elements. The third Zr (zirconium) based amorphous alloy material includes Zr (zirconium) elements, Al (aluminum) elements, and Cu (copper) elements.

[0174] As shown in Table 1, after testing, in the comparison of various parameters:

[0175] The hardness parameter range of the first Zr (zirconium) based amorphous alloy material in multiple tests is 492HV-553HV, the hardness parameter range of the second Zr (zirconium) based amorphous alloy material in multiple tests is 568HV to 619HV, and the hardness parameter range of the third Zr (zirconium) based amorphous alloy material in multiple tests is 498HV to 545HV. The hardness parameters of the three Zr (zirconium) based amorphous alloy materials are significantly better than 360HV to 380HV of titanium (label: Ti-6Al-4V), 90HV to 107HV of aluminum (label: 6061-T6), and 160HV-200HV of stainless steel (label: SUS304).

[0176] The compressive strength parameter range of the first Zr (zirconium) based amorphous alloy material in multiple tests is 1815MPa-2052MPa, the compressive strength parameter range of the second Zr (zirconium) based amorphous alloy material in multiple tests is 1896MPa-2044MPa, and the hardness parameter range of the third Zr (zirconium) based amorphous alloy material in multiple tests is 498HV to 545HV. The compressive strength parameters of the three Zr (zirconium) based amorphous alloy materials are also significantly better than 1200MPa-1280MPa of titanium (label: Ti-6Al-4V), 520MPa-720MPa of aluminum (label: 6061-T6), and 500MPa-600MPa of stainless steel (label: SUS304).

[0177] The Young's modulus parameter range of the first Zr (zirconium) based amorphous alloy material in multiple tests is 92.9 GPa. The Young's modulus parameter range of the second Zr (zirconium) based amorphous alloy material in multiple tests is 94.9 GPa. The Young's modulus parameter range of the third Zr (zirconium) based amorphous alloy material in multiple tests is 81 GPa. It can be seen that the three Zr (zirconium) based amorphous alloy materials also have good deformation resistance.

[0178] In addition, the damping ratio of the first Zr (zirconium) based amorphous alloy material is 0.00030-0.00035, the damping ratio of the second Zr (zirconium) based amorphous alloy material is 0.00059-0.00069, and the damping ratio of the third Zr (zirconium) based amorphous alloy material is 0.00059-0.00069. When the frame 110 adopts any one of the three Zr (zirconium) based amorphous alloy materials, it can quickly return to a balanced state when subjected to external force vibration, and the three Zr (zirconium) based amorphous alloy materials also have good corrosion resistance.

[0179] In addition, the Poisson's ratio of the three Zr (zirconium) based amorphous alloy materials is equivalent to that of titanium (label: Ti-6Al-4V), aluminum (label: 6061-T6) and stainless steel (label: SUS304). When the frame 110 adopts one of the above three Zr (zirconium) based amorphous alloy materials, the lateral positive strain generated by the force is equivalent to the axial positive strain of titanium (label: Ti-6Al-4V), aluminum (label: 6061-T6) and stainless steel (label: SUS304).

[0180] Therefore, the frame 110 of the shell 100 is made of any one of the above three Zr (zirconium) based amorphous alloy materials, so that the shell 100 is made thinner and lighter while ensuring its own structural strength, and other performances of the frame 110 are less affected by other factors.

[0181] It should be understood that the embodiments of the present application mainly test the parameters that have a greater impact on the structural strength of the frame 110, and selectively test the elastic limit, elongation, compression rate, and compressive yield strength.

[0182] In the comparison of the above parameters, the hardness and compressive strength of the parameters that affect the structural strength of the frame 110 are better than those of titanium (label: Ti-6Al-4V), aluminum (label: 6061-T6) and stainless steel (label: SUS304). The frame 110 of the housing 100 is made of the above three Zr (zirconium) based amorphous alloy materials, so that the frame 110 of the housing 100 can be made thinner while ensuring its own structural strength.

[0183] Please refer to Table 2, which is a comparison table of experimental process capability parameters of Zr (zirconium) based amorphous alloy materials and titanium, aluminum, and stainless steel.

[0184] Table 2:

[0185]

[0186] As shown in Table 2 above, three examples of Zr (zirconium) based amorphous alloy materials are also provided. The first Zr (zirconium) based amorphous alloy material, the second Zr (zirconium) based amorphous alloy material, and the third Zr (zirconium) based amorphous alloy material all adopt vacuum die-casting in the main forming process, and their process costs are significantly better than titanium (label: Ti-6Al-4V), aluminum (label: 6061-T6), and stainless steel (label: SUS304).

[0187] In addition, the thickness of the first Zr (zirconium) based amorphous alloy material can be designed to be 0.3 mm to 2.0 mm, the minimum thickness can be designed to be 0.25 mm, the minimum fillet can be designed to be 0.1 mm, and the dimensional accuracy can be designed to be ±0.02 mm.

[0188] The thickness of the second Zr (zirconium) based amorphous alloy material can be designed to be 0.3 mm to 5 mm, the minimum thickness can be designed to be 0.25 mm, the minimum fillet can be designed to be 0.1 mm, and the dimensional accuracy can be designed to be ±0.02 mm.

[0189] The thickness of the third Zr (zirconium) based amorphous alloy material can be designed to be 0.3 mm to 2.0 mm, the minimum thickness can be designed to be 0.25 mm, the minimum fillet can be designed to be 0.1 mm, and the dimensional accuracy can be designed to be ±0.02 mm.

[0190] The thickness of titanium (label: Ti-6Al-4V) is designed to be greater than 0.3 mm, the thickness of aluminum (label: 6061-T6) is designed to be greater than 0.4 mm, and the thickness of stainless steel (label: SUS304) is designed to be greater than 0.5 mm.

[0191] The minimum thickness of titanium (label: Ti-6Al-4V) is designed to be 0.3 mm, the minimum thickness of aluminum (label: 6061-T6) is designed to be 0.4 mm, and the minimum thickness of stainless steel (label: SUS304) is designed to be 0.4 mm.

[0192] The minimum fillet design of titanium (label: Ti-6Al-4V) is 0.2mm, the minimum fillet design of aluminum (label: 6061-T6) is 0.4mm, and the minimum fillet design of stainless steel (label: SUS304) is 0.2mm.

[0193] The dimensional accuracy of titanium (label: Ti-6Al-4V) is designed to be ±0.03mm, the dimensional accuracy of aluminum (label: 6061-T6) is designed to be ±0.03mm, and the dimensional accuracy of stainless steel (label: SUS304) is designed to be ±0.03mm.

[0194] It can be seen that the thickness of the three Zr (zirconium) based amorphous alloy materials can be made significantly thinner than titanium (label: Ti-6Al-4V), aluminum (label: 6061-T6), and stainless steel (label: SUS304).

[0195] Compared with titanium (label: Ti-6Al-4V), aluminum (label: 6061-T6), and stainless steel (label: SUS304), the three Zr (zirconium) based amorphous alloy materials have comparable coloring process, minimum draft angle, and minimum aperture.

[0196] Therefore, the frame 110 of the housing 100 is made of Zr (zirconium)-based amorphous alloy material, which can reduce costs and achieve lighter and thinner design.

[0197] For the above three Zr (zirconium) based amorphous alloy materials, the frame 110 of the housing 100 can be made of one of the Zr (zirconium) based amorphous alloy materials.

[0198] It should be understood that in the above three Zr (zirconium) based amorphous alloy materials, the composition ratio between the Zr (zirconium) element, the Cu (copper) element or the Al (aluminum) element should be set according to actual needs, and the embodiment of the present application does not make the only requirement.

[0199] The Zr (zirconium)-based amorphous alloy material of the present application is not limited to including Zr (zirconium) elements and Cu (copper) elements, but may also include other elements, such as one or more of Al (aluminum), Ni (nickel), Fe (iron), Mg (magnesium), and Nb (niobium) elements.

[0200] Exemplarily, in some examples, the composition of the Zr (zirconium)-based amorphous alloy material may contain 30 to 65 weight % Zr, 25 to 45 weight % Cu, 5 to 18 weight % Al, 2 to 13 weight % Ni, 0 to 4 weight % Fe, 0 to 4 weight % Mg and 0 to 4 weight % Nb, and the chemical formula may be Zr48Cu33Al10Ni9, Zr50Cu23Al10Ni7, Zr37Cu35Al13Ni15, etc.

[0201] In some embodiments, the amorphous alloy material may also be Ti (titanium) based Ti-based, Cu (copper) based Cu-based, Fe (iron) based Fe-based, or La (lanthanum) based La-based.

[0202] The specific structure and materials of the middle plate 120 are described in detail below with reference to the accompanying drawings.

[0203] See also Figure 3a to Figure 3d , Figure 3a It is a schematic diagram of the three-dimensional structure of the middle plate 120 of the housing 100 of the electronic device provided in an embodiment of the present application. Figure 3bIt is a schematic diagram of the cross-sectional structure of a housing 100 of an electronic device provided in an embodiment of the present application. Figure 3c A schematic structural diagram of a middle plate 120 and a battery enclosure 140 of a housing 100 of an electronic device provided in an embodiment of the present application. Figure 3d A schematic diagram of the partial structure of the middle plate 120 and the battery enclosure 140 of the housing 100 of the electronic device provided in an embodiment of the present application.

[0204] like Figure 3a-Figure 3b As shown, a plurality of connection parts 121 are formed on the outer peripheral edge of the middle plate 120 and at intervals along the circumference of the middle plate 120 , and an end of each connection part 121 of the plurality of connection parts is used to connect with the corresponding inner side wall of the frame 110 .

[0205] The connecting portion 121 includes an extension portion 1211 extending outward from the outer edge of the middle plate 120 and a joint structure 1212 located at the end of the extension portion 1211. The extension portion 1211 and the joint structure 1212 are formed as a whole, and the joint structure 1212 is formed with a joint surface 1212A that is adapted to the inner wall surface of the frame 110. The joint structure 1212 is bonded to the inner peripheral side wall surface of the frame 110 through the joint surface 1212A.

[0206] Alternatively, each connection portion 121 may be configured as a U-shaped buckle structure with a flange at the end, and the connection portion 121 may be fixed by being buckled with the buckle structure of the frame 110 by utilizing the U-shaped buckle structure.

[0207] By connecting the frame 110 and the middle plate 120 through the inverted buckle structure and the U-shaped buckle structure, not only the structure is simple, but also the connection between the frame 110 and the middle plate 120 is convenient.

[0208] It should be understood that the connection parts 121 can be set to any number such as 4, 6, 8, etc., and the specific setting should be based on actual design and usage requirements. The embodiments of the present application do not make the only requirement for this.

[0209] In one example, if Figure 3a As shown, the number of the connecting parts 121 can be 4. Two are evenly arranged on the long side of the middle plate 120, and one is arranged on the short side. The connecting part 121 on the short side is more preferably located at the end of the short side.

[0210] The peripheral edge of the middle plate 120 is formed with a plurality of hole portions 122 arranged at intervals along the circumference of the middle plate 120, each hole portion 122 penetrates the middle plate 120 in the thickness direction of the middle plate, and a guide groove 123 is formed on the middle plate 120 between the hole portion 122 and the outer edge of the middle plate 120, and the guide groove 123 connects the gap 112 and the hole portion 122.

[0211] When the middle plate 120 is connected to the frame, since the plastic part 130 is in a fluid state at high temperature, the plastic part 130 located in the gap 112 will flow into each hole portion 122 of the multiple hole portions through the guide groove 123, which is beneficial to improve the bonding between the plastic part 130 and the middle plate 120, thereby improving the connection strength between the middle plate 120 and the frame 110.

[0212] In addition, forming a plurality of holes 122 evenly spaced and arranged along the circumference of the middle plate 120 at the peripheral edge of the middle plate 120 is also beneficial to reducing the weight of the middle plate 120 and is more conducive to making the shell 100 lighter and thinner.

[0213] It should be understood that the hole portion 122 can be set to any number such as 5, 8, 10, etc. The specific number should be set according to actual design and usage requirements, and the embodiment of the present application does not make a sole requirement for this.

[0214] like Figure 3b As shown, the middle plate 120 is a plate or a die-casting with uniform thickness, and the thickness H1 of the middle plate 120 is set to 0.3 mm to 2 mm.

[0215] It should be understood that the thickness H1 of the middle plate 120 can be any value between 0.3 mm and 2 mm, for example, 0.3 mm, 0.75 mm, 1.8 mm, etc. The specific setting should be based on actual design and use requirements, and this embodiment does not make any requirements for this.

[0216] It should be noted that, in order to make the housing 100 of the electronic device thinner and lighter, the embodiment of the present application tends to design the thickness H1 of the middle plate 120 to be smaller, for example, to be 0.3 mm.

[0217] like Figure 3c As shown, a battery enclosure 140 is also provided on the middle plate 120, and the battery enclosure 140 surrounds and forms a battery installation area 141. The battery enclosure 140 is fixed to the middle plate 120 by injection molding of an injection molding material. In one embodiment, the battery enclosure 140 is provided as a ring structure.

[0218] like Figure 3d As shown, the height H2 of the battery enclosure 140 is set to 0.8 mm to 4.2 mm, the thickness M1 at the connection between the battery enclosure 140 and the middle plate 120 is set to 0.6 mm to 1.2 mm, and the thickness M2 at the top of the battery enclosure is set to 0.4 mm to 1.2 mm.

[0219] It should be understood that the height H1 of the battery enclosure 140 can be set to any value in the range of 0.8mm to 4.2mm, for example, 0.8mm, 1.75mm, 4.2mm, etc. The thickness M1 at the connection between the battery enclosure 140 and the middle plate 120 can be set to any value in the range of 0.6mm to 1.2mm, for example, 0.6mm, 1.05mm, 1.2mm, etc. The thickness M2 at the top of the battery enclosure 140 can be set to any value in the range of 0.4mm to 1.2mm, for example, 0.4mm, 0.95mm, 1.2mm, etc. In order to make the housing 100 of the electronic device thinner and lighter, the present application tends to design the thickness M1 at the connection between the battery enclosure 140 and the middle plate 120 and the thickness M2 at the top of the battery enclosure 140 to be smaller. For example, the thickness M1 at the connection between the battery enclosure 140 and the middle plate 120 can be designed to be 0.6mm, and the thickness M2 at the top of the battery enclosure 140 can be designed to be 0.4mm.

[0220] It is further necessary to understand that Figure 3d As shown, the thickness of the battery enclosure 140 gradually and evenly decreases from the connection between the battery enclosure 140 and the middle plate 120 to the top of the battery enclosure 140 .

[0221] The battery enclosure 140 is fixed on the middle plate 120 by injection molding of injection molding material. By setting the injection molding material, the injection molding material has good elasticity. When the battery arranged in the battery installation area 141 is subjected to force vibration, the injection molding material can buffer and protect the battery, and can also provide insulation protection for the battery.

[0222] In addition, by setting the outer wall surface of the frame 110 to be an arc-shaped structure protruding toward the outside of the frame, the frame 110 can present a larger side wall area based on a smaller thickness, so that the connection area between the side wall of the frame 110 and the middle plate 120 can be larger, which is beneficial to improving the connection strength between the frame 110 and the middle plate 120 when the frame 110 and the middle plate 120 are connected.

[0223] In some embodiments, the middle plate 120 in the present application is made of an alloy material, the compressive strength of the alloy material is 500MPa to 1200MPa, the Young's modulus is 40GPa to 80GPa, the hardness of the alloy material is 90HV to 400HV, and the density of the alloy material is 1.5g / cm3 to 2.5g / cm3.

[0224] Alloy material refers to a solid product with metallic properties obtained by mixing and melting one metal with another or several metals or non-metals and then cooling and solidifying.

[0225] It should be understood that the compressive strength of the alloy material can be set to any value within the range of 500MPa to 1200MPa, for example, 500MPa, 955.5MPa, 1200MPa, etc. The hardness of the alloy material can be set to any value within the range of 90HV to 400HV, for example, 90HV, 200.5HV, 400HV, etc. The Young's modulus of the alloy material can be set to any value within the range of 40Gpa to 80GPa, for example, 40Gpa, 60.5Gpa, 80Gpa, etc. The density of the alloy material can be set to any parameter between 1.5g / cm3 and 2.5g / cm3, for example, 1.5g / cm3, 2.05g / cm3, 2.5g / cm3, etc. The above parameters should be set according to the actual design and use requirements, and this application does not make the only requirement for this.

[0226] It is further understood that, in order to improve the structural strength of the middle plate 120, the embodiment of the present application tends to design the compressive strength parameter and hardness parameter of the alloy material to be larger and the density to be smaller. For example, the compressive strength of the alloy material can be designed to be 1200MPa, the hardness of the alloy material can be designed to be 400HV, and the density can be set to 1.5g / cm3.

[0227] It should be further understood that the alloy material can be made of aluminum alloy material or magnesium alloy material.

[0228] Aluminum alloy material is an alloy with aluminum as the base and a certain amount of other alloying elements added. The other alloying elements can be manganese and magnesium. Adding manganese can improve its corrosion resistance, and adding magnesium can strengthen it and reduce its specific gravity. It is characterized by corrosion resistance, good polishing properties, and can maintain a bright surface for a long time. Its strength is higher than pure aluminum.

[0229] Magnesium alloy material is an alloy composed of magnesium and other elements. It has the advantages of low density, high strength, large elastic modulus, good heat dissipation, good shock absorption, and strong ability to withstand impact loads. Other elements can be aluminum, zinc, manganese, cerium, thorium, etc.

[0230] The connection method between the frame 110 and the middle plate 120 is described in detail below with reference to the accompanying drawings.

[0231] See also Figure 4a-4d , Figure 4a A schematic diagram of the three-dimensional structure from a first perspective of a shell of an electronic device provided in an embodiment of the present application. Figure 4a-1 for Figure 4a AA local cross-section diagram. Figure 4a-2 for Figure 4a BB-view cross-sectional diagram. Figure 4a-3 for Figure 4a Schematic diagram of the cross section of BB from another perspective. Figure 4a-4for Figure 4a Schematic diagram of CC cross section. Figure 4b A schematic diagram of the stereoscopic structure from a second perspective of the housing of an electronic device provided in an embodiment of the present application. Figure 4c A schematic diagram of the top structure of a housing of an electronic device provided in an embodiment of the present application. Figure 4d A schematic diagram of the bottom structure of the housing of an electronic device provided in an embodiment of the present application.

[0232] like Figure 4a-4d As shown, three sides of the frame 110 surround the outer periphery of the middle plate 120 , and the plastic part 130 is filled between the peripheral edge of the middle plate 120 and the corresponding inner wall surface of the frame 110 .

[0233] It should be understood that in the embodiment of the present application, the plastic part 130 is filled between the peripheral edge of the middle plate 120 and the corresponding inner wall surface of the frame 110, and the plastic part 130 can buffer the deformation of the middle plate 120 and the frame 110 under high temperature or some environments that affect their deformation. Even if the frame 110 and the middle plate 120 are made of different materials and have different shrinkage ratios, it can prevent the middle plate 120 and the frame 110 from squeezing each other due to different shrinkage ratios, causing the middle plate to convex or concave.

[0234] It should be further understood that the width of the plastic part 130 can be set to any value such as 5 mm, 10 mm, 13.5 mm, etc., and the specific setting should be based on actual design and usage requirements. The embodiment of the present application does not make the only requirement for this.

[0235] like Figure 4a As shown, the connection parts 121 arranged at intervals on the periphery of the middle plate 120 are fixedly connected to the corresponding inner side walls of the frame 110. The connection parts 121 may be set to 4. Among them, 2 are evenly arranged on the long side of the middle plate 120, and 1 is arranged on the short side. The connection parts 121 on the short side are more located at the end of the short side.

[0236] like Figure 4a-1 and Figure 4a-4 As shown, the connection portion 121 includes an extension portion 1211 extending from the outer edge of the middle plate 120, and a joint structure 1212 is formed at the end of the extension portion 1211. The joint structure 1212 has a joint surface 1212A in an arc shape. The joint surface 1212A of the connection portion 121 fits with the inner wall surface of the frame 110.

[0237] When the frame 110 is molded on the outer peripheral side of the middle plate 120 , the joint surface 1212A serves as a molding surface of the frame 110 , and is used to mold the frame 110 and the middle plate 120 into an integral structure.

[0238] Alternatively, the frame 110 is connected to the outer peripheral side of the middle plate 120 by a fixed connection process such as welding, and the joint surface 1212A serves as a connection surface of the frame 110. For example, when the two are fixed by a welding process, the joint surface 1212A can serve as a welding surface to relatively fix the frame 110 and the middle plate 120.

[0239] Alternatively, the connection portion 121 may be configured as a U-shaped snap-fit ​​structure, a snap-fit ​​structure may be formed on the inner wall of the frame 110, the snap-fit ​​structure may be configured as an inverted structure, and the U-shaped snap-fit ​​structure may be snap-fitted into the inverted structure to fix the frame 110 and the middle plate 120.

[0240] like Figure 4a-2 , Figure 4a-3 , Figure 4c , Figure 4d As shown, one end of the plastic part 130 is also in contact with the inner wall of the frame 110, and the other end is in contact with the end surface of the middle plate 120. The battery enclosure 140 can be a convex plate-shaped structure that is integrally injection molded with the plastic part 130. There is a gap between the battery enclosure 140 and the main body of the plastic part 130. A buffer chamber 131 is also formed inside the plastic part 130. The buffer chamber 131 extends along the extension direction of the frame 100. The buffer chamber 131 can be used to achieve:

[0241] When the frame 110 and the middle plate 120 have different deformation degrees, not only can the deformation of the plastic part 130 itself be used to buffer the deformation difference between the frame 110 and the middle plate 120, but the buffer chamber 131 can also further absorb and buffer the deformation difference, thereby further preventing the middle plate 120 from convexing or concave when the frame 110 and the middle plate 120 have different deformation degrees.

[0242] The production process of the housing 100 of the electronic device is described in detail below with reference to the accompanying drawings.

[0243] See also Figure 5a-Figure 5b , Figure 5a 1 is a flow chart of the production process of the housing 100 in the embodiment of the present application. Figure 5a-1 1 is a flowchart of the production process of the housing 100 in the embodiment of the present application. Figure 5b A schematic diagram of the injection molding principle of a housing 100 of an electronic device provided in an embodiment of the present application. Figure 5c A schematic diagram of the forming principle of a slider of a housing 100 of an electronic device provided in an embodiment of the present application.

[0244] In some embodiments, Figure 5a-Figure 5a-1 As shown, the housing 100 of the electronic device provided in the embodiment of the present application is produced by the following steps:

[0245] Step 1: Prepare the middle plate prefabricated part 120A' (see Figure 5cThe structure shown can eventually be formed into Figure 3a The middle plate preform 120A' may be a plate or die-casting of an alloy material, for example, a plate or die-casting of a magnesium alloy material, or a plate or die-casting of an aluminum alloy material.

[0246] Step 2: integrally forming a frame preform 110A' on the outer peripheral side of the middle plate preform 120A' (see Figure 5c The structure shown in the figure can eventually be formed as Figure 2a-1 Specifically, for example, the middle plate preform 120A' is placed in a die-casting mold, and an amorphous alloy material is poured into the die-casting module. After solidification, a frame preform 110A' is integrally formed on the outer peripheral side of the middle plate preform 120A'. The frame preform 110A' can be made of an amorphous alloy material, such as a Zr (zirconium)-based amorphous alloy material. The Zr (zirconium)-based amorphous alloy material is injection-molded on the outer peripheral side of the middle plate preform 120A', thereby obtaining a combination of the middle plate preform 120A and the frame preform 110A'.

[0247] It should be understood that when the frame preform 110A' is integrally formed on the outer periphery of the middle plate preform 120A, it can be integrally formed in a high temperature mold. The specific temperature can be any temperature in the range of 950°C to 1000°C, for example, 950°C, 970.5°C, 1000°C, etc.

[0248] like Figure 5c As shown, the outer arc surface of the frame preform 110A' is formed by a slider. The first slider A1, the second slider A2 and the third slider A3 are independent of each other. The first slider A1 is used to form the long side of the frame preform 110A', and the second slider A2 and the third slider A3 are used to form the short side of the frame preform 110A'. The seams between the first slider A1, the second slider A2 and the third slider A3 correspond to the antenna seams.

[0249] Step 3 (CNC1): The front and back surfaces of the combined part of the frame preform 110A' and the middle plate preform 120A' are processed by CNC (CNC double side surface grinder) machine tool, and the antenna seam breakpoint on the frame preform 110A' is cut open.

[0250] It should be understood that processing the front and back surfaces of the combination of the frame preform 110A' and the middle plate preform 120A' by CNC machine tools is beneficial to improving the aesthetics.

[0251] Step 4 (T treatment): forming holes in the middle plate preform 120A' through chemical reaction.

[0252] For example, the holes are formed by heat treatment, and the heat treatment uses T(E) treatment solution to treat the middle plate preform 120A'. Small honeycomb nanopores are etched, and a nano-scale coral reef structure is formed on the surface of the middle plate preform 120A', thereby improving the bonding between the middle plate preform 120A' and the injection molding material (such as plastic).

[0253] Step 5 (NMT): Fill the gap between the inner wall surface of the frame preform 110A' and the outer wall surface of the middle plate preform 120A', and form a battery enclosure preform on one side wall of the middle plate preform 120A'.

[0254] Exemplarily, the gap (which may be the gap 112) between the inner wall surface of the frame preform 110A and the outer wall surface of the middle plate preform 120A' is filled with an injection molding material through a nano injection molding process, and a battery enclosure preform is formed on the back of the middle plate preform 120A' with the injection molding material through a nano injection molding process. Plastic can be selected as the injection molding material, and the plastic is filled into the gap between the inner wall surface of the frame preform 110A' and the outer wall surface of the middle plate preform 120A' through a nano injection molding process, and the plastic fills the gap between the inner wall surface of the frame preform 110A' and the outer wall surface of the middle plate preform 120A, and finally forms a plastic part.

[0255] It should be understood that the middle plate preform 120A' and the frame preform 110A' are combined by plastic nano injection molding technology. On the one hand, the plastic can fill the gap between the middle plate preform 120A' and the frame preform 110A', and on the other hand, the plastic has good elasticity. When the middle plate preform 120A' and the frame preform 110A' are deformed, the plastic will not produce a large extrusion force on the two. On the contrary, the plastic can absorb the extrusion force caused by the deformation of the middle plate preform 120A' and the frame preform 110A', effectively avoiding the deformation of the two due to mutual extrusion.

[0256] It is important to understand that Figure 5b As shown, when plastic is injected between the middle plate preform 120A' and the frame preform 110A', a slanted top mold is set inside the frame preform 110A, the top of the mold is the inlet, and the lower end is provided with an exhaust port, and exhaust is achieved by a special vacuum machine.

[0257] Furthermore, after the middle plate preform 120A' and the frame preform 110A' are integrally molded, the antenna slot is processed by CNC machinery to have a length of 0.8mm to 1mm. The middle plate preform 120A and the frame preform 110A' are combined with plastic by nanotechnology.

[0258] The length of the antenna slot can be set to any parameter within the range of 0.8 mm to 1 mm. For example, it can be 0.8 mm, 0.91 mm, 1 mm, etc. It can be set according to actual design and usage requirements, and this application does not make the only requirement.

[0259] Step 6 (CNC2): Process the antenna seam and the exterior surface of the frame preform 110A' by CNC machine tools.

[0260] Step 7 (CNC2): Polishing the exterior surface of the frame preform 110A'.

[0261] In the seventh step, polishing is helpful to improve the texture of the appearance of the frame preform 110A'.

[0262] Step 8 (PVD): The exterior surface of the frame preform 110A' is processed using the Physical Vapour Deposition (PVD) technology.

[0263] Physical vapor deposition technology: refers to the technology of vaporizing the material source - solid or liquid surface into gaseous atoms, molecules or partially ionized into ions under vacuum conditions by physical methods, and depositing a thin film with some special functions on the substrate surface through a low-pressure gas (or plasma) process. Surface treatment. Advantages: metallic color, wear and corrosion resistance, fine surface, and oxidation resistance.

[0264] Step 9 (CNC3): Use CNC machine tools to process SPK holes / USB holes and related openings on the sides of the middle plate preform 120A' and the frame preform 110A (such as Figure 4b shown).

[0265] Step 10: Complete the production of the housing 100 (eg Figure 4a-4d status shown).

[0266] In this process, the slider molding burrs are distributed at the antenna seam and are removed when processing the antenna seam. The burrs in the mold opening direction go on the arc surface and can be removed when processing the gate.

[0267] See also Figure 6a-6b , Figure 6a A schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application. Figure 6b A schematic diagram of the back structure of an electronic device housing provided in an embodiment of the present application.

[0268] like Figure 6a-6bAs shown, the electronic device in the embodiment of the present application can be a flat-type electronic device, and the electronic device includes a housing 100. The housing 100 includes a frame 110 and a middle plate 120; the frame 110 surrounds the middle plate 120 and is in an annular structure, the frame 110 is made of an amorphous alloy material, and the middle plate is made of an alloy material. The compressive strength of the amorphous alloy material is 1200MPa to 2200MPa, and the Young's modulus is 80Gpa to 100GPa; the compressive strength of the alloy material is 500MPa to 1200MPa, and the Young's modulus is 40GPa to 80GPa. The housing 100 can have a higher structural strength, and even if the size of the frame in the thickness direction is smaller, the structural strength requirements of the housing can be met. And the smaller size of the frame in the thickness direction can also reduce the weight of the housing 10, and the electronic device 10 can be made thinner on the basis of ensuring the structural strength.

[0269] The embodiment of the present application also provides a foldable electronic device, see Figures 7a to 7e , Figure 7a A schematic diagram of the three-dimensional structure of a foldable electronic device housing from a first viewing angle provided in an embodiment of the present application. Figure 7b A schematic diagram of the three-dimensional structure of a foldable electronic device housing from a second viewing angle provided in an embodiment of the present application. Figure 7c A schematic diagram of the partial structure of a foldable electronic device in an unfolded state on the back provided in an embodiment of the present application. Figure 7d A schematic diagram of the three-dimensional structure of a foldable electronic device in an open state provided in an embodiment of the present application. Figure 7e A schematic diagram of the three-dimensional structure of a foldable electronic device in a folded state provided in an embodiment of the present application.

[0270] like Figure 7a As shown, the foldable electronic device includes a first shell 10A and a second shell 10B, the first shell 10A includes a frame 101A and a middle plate 102A, and the second shell 10B includes a frame 101B and a middle plate 102B.

[0271] like Figure 7b As shown, the sides of the middle plate 102A of the first shell and the middle plate 102B of the second shell that are close to each other are both formed with a shaft accommodating area 10C.

[0272] Specifically, the middle plate 102A of the first shell and the second middle plate 102B have step structures 10D at their ends close to the shaft mechanism 200 , and the step structures 10D form a shaft accommodating area 10C.

[0273] like Figure 7cAs shown, the hinge mechanism 200 is arranged in the hinge accommodating area 10C, and the hinge mechanism 200 includes a base 220, a first rotating arm 211 and a second rotating arm 212 arranged on both sides of the base 220, one end of the first rotating arm 211 is rotatably connected to one side of the base 220, and the other end is connected to the middle plate 102 of the first shell, one end of the second rotating arm 212 is rotatably connected to the other side of the base 220, and the other end is connected to the middle plate 102B of the second shell.

[0274] like Figure 7d and Figure 7e As shown, the foldable electronic device also includes a display screen 300 and a back cover (not shown in the figure). When the foldable electronic device is in a folded state, the back cover is used to protect the entire foldable electronic device. Figure 7a-7c It can be seen that the display screen 300 is set on the front side of the middle plate 101A of the first shell and the front side of the middle plate 102B of the second shell, and the back side of the middle plate 101A of the first shell and the back side of the middle plate 102B of the second shell are both provided with a back cover.

[0275] Specifically, the hinge mechanism 200 connecting the two shells can be accommodated in the hinge accommodation area 10C, which can reduce the space occupied by the hinge mechanism 200 in the thickness direction of the foldable electronic device.

[0276] Since the first shell 10A and the second shell 102B both adopt the same structure as the shells in any of the above-mentioned embodiments, such a structure is conducive to achieving a lightweight and thin foldable electronic device.

[0277] like Figure 7a-7c As shown, in some embodiments, combined Figure 3b As shown, in some embodiments, the step structure 10D is formed by bending the middle plate 120, and the bending angle radius R of the step structure 10D relative to the body of the middle plate 120 is set to 0.3 mm to 0.6 mm.

[0278] It should be understood that the bending angle radius R of the step structure 10D relative to the body of the middle plate 120 can be set to any parameter within the range of 0.3 mm to 0.6 mm, for example, 0.3 mm, 0.55 mm, 0.6 mm, etc.

[0279] The above two electronic devices (i.e., tablet electronic devices or foldable electronic devices) have a frame 110 of the housing 100 made of an amorphous alloy material. Compared with the existing structure in which the housing is entirely set to an alloy material (e.g., an aluminum alloy), when the housing frame size (e.g., the size of the frame in the thickness direction and the height direction of the housing) is the same, the structural strength of the frame in the embodiment of the present application is higher, thereby making the structural strength of the housing with the frame higher. From another perspective, when the structural strength of the frame is the same, the frame size (e.g., the size of the frame in the thickness direction and the height direction of the housing) in the present application is smaller. And the smaller size of the frame in the thickness direction and the height direction can also reduce the weight of the housing. Therefore, the housing of the electronic device provided in the present application can be made thinner and lighter on the basis of ensuring structural strength, that is, it can take into account both thinner and lighter requirements and meet structural strength requirements.

[0280] For example, Figure 7d-7e As shown, the thickness h of the foldable electronic device 20 in the unfolded state is 4.2 mm to 4.3 mm, while the thickness of the foldable electronic device in the prior art in the unfolded state is at least 4.8 mm.

[0281] It should be understood that the overall thickness h of the foldable electronic device 20 in the unfolded state can be set to any parameter within the range of 4.2 mm to 4.3 mm, such as 4.2 mm, 4.25 mm, 4.3 mm, etc.

[0282] It is further to be understood that, in order to make the foldable electronic device 20 thinner, the present application prefers to set the overall thickness h of the foldable electronic device 20 in the unfolded state to 4.2 mm.

[0283] In the embodiments of the present application, those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the embodiments. On the contrary, the purpose of introducing the application in conjunction with the embodiments is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0284] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0285] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0286] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0287] In the description of this application, it should be understood that in this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals. "Communication connection" can refer to electrical signal transmission, including wireless communication connection and wired communication connection. Wireless communication connection does not require a physical medium and does not belong to a connection relationship that limits the product structure.

[0288] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A housing for an electronic device, characterized in that: The shell includes a frame and a middle plate; wherein, The frame surrounds and is connected to the outer peripheral side of the middle plate, and the frame is made of an amorphous alloy material, and the middle plate is made of an alloy material; There is a gap between the outer peripheral side of the middle plate and the inner peripheral side of the frame, and the outer peripheral side of the middle plate is formed with a plurality of connecting parts at intervals along the circumference of the middle plate, and the end of each connecting part of the plurality of connecting parts is connected to the corresponding inner side wall of the frame, and each connecting part is a U-shaped buckle structure with a flange at the end, which is fixedly engaged with the snap-fit ​​structure of the frame, and at least two of the plurality of connecting parts are evenly arranged on the long side of the middle plate, and one of the plurality of connecting parts is arranged on the short side of the middle plate near the end; The gap is filled with a plastic part, and the plastic part is respectively attached to the inner peripheral side wall surface of the frame and the outer peripheral side wall surface of the middle plate; A plurality of holes arranged at intervals are formed at the outer peripheral edge of the middle plate and at positions corresponding to the gaps, and the plastic part in the gaps also extends into each of the plurality of holes; A buffer chamber is formed inside the plastic part, and the buffer chamber extends along the extension direction of the frame.

2. The housing for electronic equipment according to claim 1, characterized in that: Each of the holes passes through the middle plate in the thickness direction of the middle plate, and a guide groove is formed on the middle plate between the hole and the outer edge of the middle plate, the guide groove connecting the gap and the hole.

3. The housing for an electronic device according to claim 1, characterized in that: The connecting portion includes an extension portion extending outward from the outer edge of the middle plate and a joining structure located at the end of the extension portion. The extension portion and the joining structure are formed as one piece, and the joining structure is formed with a joining surface that is adapted to the inner wall surface of the frame. The joining structure is fitted with the inner peripheral side wall surface of the frame through the joining surface.

4. The housing for electronic equipment according to claim 1, characterized in that: The compressive strength of the frame made of the amorphous alloy material is 1200MPa to 2200MPa, and the Young's modulus is 80Gpa to 100GPa; the compressive strength of the middle plate made of the alloy material is 500MPa to 1200MPa, and the Young's modulus is 40GPa to 80GPa.

5. The housing for electronic equipment according to claim 1, characterized in that: The hardness of the frame made of the amorphous alloy material is 450HV to 650HV, and the hardness of the middle plate made of the alloy material is 90HV to 400HV.

6. The housing for electronic equipment according to claim 1, characterized in that: The density of the middle plate made of the alloy material is 1.5 g / cm 3 Up to 2.5g / cm 3 .

7. The housing for an electronic device according to claim 1, characterized in that: In the cross section of the frame, the wall thickness of the frame is set to 0.25 mm to 3 mm, and the height of the frame is set to 2 mm to 10 mm.

8. The housing for electronic equipment according to claim 1, characterized in that: A battery enclosure is also provided on one surface of the middle plate, and the battery enclosure surrounds and forms a battery installation area; The battery enclosure is formed on the one surface of the middle plate by an injection molding process.

9. The housing for electronic equipment according to claim 8, characterized in that: The height of the battery enclosure is set to 0.8mm to 4.2mm, the thickness of the connection between the battery enclosure and the middle plate is set to 0.6mm to 1.2mm, and the thickness of the top of the battery enclosure is set to 0.4mm to 1.2mm.

10. The housing for an electronic device according to any one of claims 1 to 9, characterized in that: The amorphous alloy material is a Zr-based amorphous alloy material.

11. The housing for electronic equipment according to claim 10, characterized in that: The Zr-based amorphous alloy material includes Zr element and Cu element.

12. The housing for an electronic device according to any one of claims 1 to 9, characterized in that: The middle plate is made of aluminum alloy material or magnesium alloy material.

13. The housing for an electronic device according to any one of claims 1 to 9, characterized in that: The frame is integrally formed on the outer peripheral side of the middle plate.

14. An electronic device, characterized in that: The electronic device comprises the housing according to any one of claims 1 to 13.

15. A foldable electronic device, comprising a hinge mechanism, a first shell and a second shell arranged on both sides of the hinge mechanism, wherein the first shell and the second shell are rotatably connected through the hinge mechanism; characterized in that: The first shell and the second shell both adopt the shell as described in any one of claims 1 to 13.

16. The foldable electronic device according to claim 15, characterized in that: The sides of the middle plate of the first shell and the middle plate of the second shell that are close to each other are both formed with a shaft accommodating area, and the shaft mechanism is arranged in the shaft accommodating area; The pivot mechanism includes a base, a first rotating arm and a second rotating arm arranged on both sides of the base, one end of the first rotating arm is rotatably connected to one side of the base, and the other end is connected to the middle plate of the first shell, and one end of the second rotating arm is rotatably connected to the other side of the base, and the other end is connected to the middle plate of the second shell.

17. The foldable electronic device according to claim 16, wherein: The middle plate of the first shell and the middle plate of the second shell both have step structures at their ends close to the rotating shaft mechanism, and the step structures form the rotating shaft accommodating area.

18. The foldable electronic device according to claim 17, characterized in that: The step structure is formed by bending the middle plate, and a bending angle radius of the step structure relative to the body of the middle plate is set to 0.3 mm to 0.6 mm.

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