Management system, management device, management method, and program

Abstract

A management system of a manufacturing apparatus having a manufacturing device including one or more device components for manufacturing a product, and an inspection device that inspects the product, the management system including a display unit, a device component information acquisition unit, a product component information acquisition unit, a manufacturing-time abnormality information acquisition unit that acquires manufacturing-time abnormality information related to an abnormality at the time of manufacturing of the product, an inspection information acquisition unit that acquires inspection information including information of an abnormality at the time of inspection of the product, an improvement candidate information acquisition unit that acquires improvement candidate information that is a candidate for improvement in the manufacturing apparatus, and a management work assistance unit that generates and displays, on the display unit, for each of the device components and / or each of the product components that are candidates for the improvement, list information including classified statistical values of the abnormality at the time of manufacturing of the product and the abnormality at the time of inspection of the product for a prescribed statistical period.

Description

Technical Field

[0001] This invention relates to technologies for quality management and process improvement in production lines. Background Technology

[0002] In production lines for products that are becoming increasingly automated and labor-saving, inspection devices are installed at intermediate and final stages to automate defect detection and classification. Furthermore, experiments have been conducted to estimate the causes of defects based on the inspection results, effectively utilizing this technology for quality management and manufacturing equipment maintenance.

[0003] As an example, if we cite existing examples related to surface mount production lines for printed circuit boards, Patent Document 1 discloses the following idea: by separately calculating the defect rate of the final inspection after reflow soldering according to the nozzles of the chip mounter (hereinafter also referred to as the mounter), information on the nozzles that cause a decrease in quality level is indicated. Furthermore, Patent Document 2 proposes the following method: calculating the defect rate of components during the post-reflow soldering inspection according to the nozzles / feeders of the mounter, and detecting abnormalities in the nozzles and feeders based on whether the defect rate exceeds the normal rate.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2005-156156

[0007] Patent Document 2: Japanese Patent Application Publication No. 2006-332461

[0008] Patent Document 3: Japanese Patent No. 5767754

[0009] Patent Document 4: Japanese Patent Application Publication No. 2017-194921 Summary of the Invention

[0010] The problem that the invention aims to solve

[0011] As in the aforementioned example, if information such as the defect rate is displayed based on the components (referred to as "equipment components") of the manufacturing apparatus, it may provide clues for estimating the location of defects. However, this information only reveals the fact that defects are more frequent in products processed by that particular equipment component; it does not provide confirmation that the direct cause of the defect actually exists within that equipment component. This is because, in the case of a pick-and-place machine, the possibility that the cause lies in equipment components other than nozzles and feeders can be considered, as well as the possibility that the cause lies in other processes such as solder printing or reflow soldering. Furthermore, it is also possible that the cause lies not in the manufacturing apparatus or equipment components, but in a specific component or combination of equipment components.

[0012] Furthermore, even if the cause of a defect can be identified in a particular component, conventional methods cannot pinpoint the specific nature of the malfunction. Therefore, even when the location of the defect is known, expert knowledge and experience are indispensable for identifying the actual anomaly and implementing appropriate corrective measures, or trial-and-error adjustments may be necessary. Taking a pick-and-place machine as an example, even knowing that defects are frequent in a particular nozzle, it's impossible to determine whether nozzle replacement, cleaning, or installation adjustments are sufficient, or whether the solution lies in modifying the pick-and-place machine's installation procedure or addressing components and parts other than the nozzle. In particular, when multiple errors occur in the defective area, the analysis of the root cause and the determination of countermeasures become even more challenging.

[0013] The present invention was made in view of the above-mentioned actual situation, and its purpose is to provide a technology for making equipment maintenance and quality management more efficient in product manufacturing equipment.

[0014] Methods for solving problems

[0015] To achieve the above objectives, the present invention employs the following structure. Specifically, a management system for a manufacturing equipment includes: a manufacturing apparatus comprising one or more apparatus components for manufacturing a product; and an inspection apparatus for inspecting the product. The management system for the manufacturing equipment includes: a display unit; an apparatus component information acquisition unit that acquires apparatus component information, including information on manufacturing anomalies of the product, for each apparatus component in the manufacturing apparatus; a product component information acquisition unit that acquires product component information, including information on manufacturing anomalies of the product, for each product component constituting the product; a manufacturing anomaly information acquisition unit that acquires manufacturing anomaly information related to manufacturing anomalies of the product in the manufacturing apparatus; and an inspection information acquisition unit that acquires... The system includes: inspection information containing information about anomalies during product inspection by the inspection device; an improvement candidate information acquisition unit that acquires improvement candidate information, which is information about the device components and / or product components in the manufacturing equipment that are candidates for improvement; and a management operation assistance unit that, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information, generates overview information for each device component and / or each product component that is a candidate for improvement and displays it on the display unit, wherein the overview information includes statistical values ​​of manufacturing anomalies and inspection anomalies of the product categorized by type within a specified statistical period.

[0016] Here, "manufacturing equipment" refers to all equipment used to manufacture products, such as manufacturing plants, production lines, and manufacturing apparatuses. "Manufacturing apparatus" refers to various apparatuses used to manufacture products, such as the various apparatuses in a printed circuit board (PCB) production line including solder printers, pick-and-place machines, and reflow ovens; manufacturing apparatuses for various product components that constitute the PCB; and solder manufacturing apparatuses. "Apparatus components" refers to various components and mechanisms that constitute the manufacturing apparatus, such as nozzles, heads, feeders, cameras, pumps, and worktables in a pick-and-place machine. "Product components" are the various elements that constitute a product, such as electronic product components like IC chips, printed wiring boards (the so-called raw substrate), and solder in a PCB. "Inspection apparatus" can be, for example, apparatus that performs inspections such as automated optical inspection (AOI) and automated X-ray inspection (AXI), or it can be an inspection apparatus that reflects information from visual inspection. Furthermore, inspection apparatuses may be built into the manufacturing apparatus.

[0017] Additionally, "device component information" may include, for example, the type of device component, the model of the device component, the device component ID, the operating time of the device component, the number of times the device component has been operated, and installation parameters. Here, the installation parameters, for example in a pick-and-place machine, may include the position of the feeder, the suction height of the nozzle, and the head movement speed.

[0018] In addition, "product component information" includes, for example, part number, reel ID, product component manufacturing batch, product component type, product component shape, and product component position on the substrate.

[0019] In addition, "abnormalities during product manufacturing" refers to errors detected during product manufacturing in the manufacturing equipment. For example, in the case of a pick-and-place machine, this includes parts not being picked up by the nozzle, abnormalities in the position / angle of the parts being picked up, and defects in the parts supplied by the feeder.

[0020] Furthermore, "abnormalities during product inspection" not only include "actual defects" that are judged as defective by the inspection equipment and also as defective by visual inspection, but also include so-called "over-inspection" (over-testing) that are judged as defective by the inspection equipment but as good by visual inspection. In addition, it can also include abnormalities that should be understood as a sign of defect, such as a decrease in quality indicators calculated based on the measured values ​​during inspection, for example, a decrease in the process capability index.

[0021] Furthermore, the “each product component constituting the product” mentioned herein does not refer to each component used in a product itself, but rather to each product component that can be determined, for example, by means of the same type of product component that is configured in a specified part of a specified product.

[0022] Furthermore, "the device component and / or product component that become a candidate for improvement" refers to a device component or product component that is estimated to be the cause of an anomaly when an anomaly occurs during the manufacturing or inspection of the product. In addition, "obtaining" improvement candidate information also includes calculating it through computation. For example, extracting improvement candidates based on a comparison of the number of anomalies occurring for each component with normal values, or a comparison of the number of anomalies occurring among different components of the same type, is equivalent to "obtaining" as described herein.

[0023] Based on this structure, manufacturing equipment managers can comprehensively identify the statistical values ​​of manufacturing and inspection anomalies categorized by type for each device component and product component that is a candidate for improvement. Therefore, even when multiple anomalies occur, the causes of the anomalies can be efficiently screened and improvement measures taken. Specifically, considering the combination of anomaly types makes it easy to screen causes and their countermeasures. In addition, based on the situation of anomalies occurring simultaneously, it is easy to determine the priority of which component to prioritize when taking countermeasures.

[0024] Alternatively, the overview information may also include information indicating the location of the anomaly. This "information indicating the location of the anomaly" could be the name of the production line, device, inspection machine, or their corresponding ID. Such a structure allows for a more accurate and easier determination of the cause of the anomaly.

[0025] Alternatively, the overview information may also include information related to the replacement of the device components and information related to the maintenance of the device components. Furthermore, the "information related to the replacement of device components" may include the final replacement date and time of the corresponding device component, the elapsed time since the final replacement, and a history of replacement frequency. Similarly, the "information related to the maintenance of device components" may include the final maintenance date and time of the corresponding device component and the cumulative number of maintenance procedures performed. Such a structure allows for more efficient screening of the causes of anomalies.

[0026] Alternatively, the management operation assistance unit may display the device components and / or product components that are candidates for improvement in order of the number of anomalies during the manufacturing of the product and / or the number of anomalies during the inspection of the product, or in order of the probability of being the cause of the anomalies during the manufacturing of the product and / or the anomalies during the inspection of the product, from high to low.

[0027] Here, the order of anomalies from most to least can be the order of the individual statistical values ​​of each anomaly, or the order of the statistical values ​​calculated by multiplying them by a coefficient predetermined according to the type of anomaly. Alternatively, the "order of probability of anomalies as causes from highest to lowest" can be set as the order of the scores of the anomalies that occurred, predetermined according to the type of anomaly, from highest to lowest. With such a configuration, the priority becomes clear, enabling more efficient improvement work on manufacturing equipment.

[0028] Alternatively, the management operation assistance unit can display different colors for each type of anomaly during product manufacturing and inspection, and adjust the color intensity based on the number of statistical values ​​for each anomaly. This structure improves the visibility of the displayed content, thus enabling more efficient screening of the causes of anomalies.

[0029] Alternatively, the improvement candidates in the improvement candidate information may be limited to the device components and / or product components for which the cause of the abnormality during the manufacturing of the product and / or the abnormality during the inspection of the product has been determined.

[0030] For example, if the cause of an anomaly can be determined according to predetermined rules based on the combination of the type and location of the anomaly, then only the device or product component that caused the anomaly will be shown to be efficient. Therefore, equipment managers only need to implement (instruct) corrective measures targeting the cause, thus significantly reducing the time from the occurrence of the anomaly to its correction.

[0031] Alternatively, the product may be a component mounting substrate, the manufacturing apparatus may be a chip placement machine, the product component may be the component, and the abnormality during the manufacturing of the product may include at least one of component failure during component mounting or a defect in image judgment processing during component mounting. The abnormality during the inspection of the product may include at least one of actual defects of the component mounting substrate, over-detection, or abnormal measurement values.

[0032] Furthermore, "defects in image judgment processing during component mounting" here refers to situations where the state of the component being adsorbed by the nozzle (the adsorption position / angle of the component) deviates from the specified allowable range, or defects in the component itself provided by the feeder (component discrepancies, missing terminals, etc.). In chip mounters on component mounting substrate production lines, there are many device components that could potentially cause malfunctions; therefore, this structure is preferred.

[0033] Furthermore, the present invention provides a management device for a manufacturing equipment, the manufacturing equipment comprising: a manufacturing apparatus including one or more apparatus components for manufacturing a product; and an inspection device for inspecting the product. The management device for the manufacturing equipment includes: an apparatus component information acquisition unit for acquiring apparatus component information for each apparatus component in the manufacturing apparatus; a product component information acquisition unit for acquiring product component information for each product component constituting the product; a manufacturing error information acquisition unit for acquiring manufacturing error information related to errors in the manufacturing apparatus during the manufacturing of the product; and an inspection information acquisition unit for acquiring inspection information including the inspection information of the inspection device. The system includes: inspection information on anomalies during product inspection; an improvement candidate information acquisition unit, which acquires improvement candidate information, which is information on the device components and / or product components in the manufacturing equipment that are candidates for improvement; and a management operation assistance unit, which, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information, generates overview information for each device component and / or each product component that is a candidate for improvement, the overview information including statistical values ​​of manufacturing anomalies and inspection anomalies of the product categorized by type within a specified statistical period.

[0034] Furthermore, to achieve the above objectives, the present invention provides a method for managing manufacturing equipment, the manufacturing equipment comprising: a manufacturing apparatus including one or more apparatus components for manufacturing a product; and an inspection device for inspecting the product. The method for managing the manufacturing equipment includes: an apparatus component information acquisition step, acquiring apparatus component information for each apparatus component in the manufacturing apparatus; a product component information acquisition step, acquiring product component information for each product component constituting the product; a manufacturing error information acquisition step, acquiring manufacturing error information related to errors in the manufacturing apparatus during the manufacturing of the product; and an inspection information acquisition step, acquiring inspection information including information on errors during the inspection of the product by the inspection device. The process includes: an improvement candidate information acquisition step, in which improvement candidate information is information about the device components and / or product components in the manufacturing equipment that are candidates for improvement; a management operation auxiliary information generation step, in which, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information, a summary information is generated for each device component and / or each product component that is a candidate for improvement, the summary information including statistical values ​​of manufacturing anomalies and inspection anomalies of the product categorized by type within a specified statistical period; and a management operation auxiliary information output step, in which the summary information generated in the management operation auxiliary information generation step is output.

[0035] Furthermore, the present invention can also be understood as a program for causing a computer to perform the above-described methods, and a computer-readable recording medium that non-temporarily records such a program. Additionally, the above-described structures and processes can be combined with each other to constitute the present invention, provided that no technical contradiction arises.

[0036] Invention Effects

[0037] According to the present invention, a technology can be provided to improve the efficiency of equipment maintenance and quality management in product manufacturing equipment. Attached Figure Description

[0038] [ Figure 1 ] Figure 1 This is a schematic diagram of the manufacturing equipment management system used in this application example.

[0039] [ Figure 2 ] Figure 2 This is a flowchart illustrating the processing flow of a manufacturing equipment management system in an application example.

[0040] [ Figure 3 ] Figure 3 This is an example of a management operation auxiliary screen displayed in a manufacturing equipment management system.

[0041] [ Figure 4 ] Figure 4 This is a diagram showing the schematic structure of the manufacturing equipment for the implementation method.

[0042] [ Figure 5 ] Figure 5 This is a functional block diagram of the management device in the implementation method.

[0043] [ Figure 6 ] Figure 6 This is a schematic diagram illustrating the structure of a pick-and-place machine according to an embodiment.

[0044] [ Figure 7 ] Figure 7 This is a diagram representing an example of manufacturing log data.

[0045] [ Figure 8 ] Figure 8 This is an example of a management operation assistance screen displayed by a display device in an embodiment.

[0046] [ Figure 9 ] Figure 9 Figure 1 shows a method for screening and improving the causes of abnormalities in target devices using a management device implemented through an embodiment. Figure 9 Figure 2 shows a method for screening and improving the causes of abnormalities in target devices through a management device implemented in the manner of the implementation. Detailed Implementation

[0047] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings. However, unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of the constituent elements described in the following examples are not intended to limit the scope of the present invention to them.

[0048] <Application Examples>

[0049] This invention can, for example, be used as Figure 1 The manufacturing equipment management system 9 shown is used in this application. The manufacturing equipment management system 9 is a system that manages chip mounters on a surface mount production line for printed circuit boards, and has a mounter 91 and an inspection device 92 as its constituent elements.

[0050] The pick-and-place machine 91 is a device for picking up electronic components to be mounted on a substrate and placing the components on solder paste at the corresponding locations.

[0051] Inspection device 92 is a device used to inspect the configuration of electronic components on a substrate removed from pick-and-place machine 91. In inspection device 92, the configuration of components (which may be the main body of the component, electrodes, or other components) placed on solder paste is measured in two or three dimensions, and various inspection items are judged to be within normal values ​​(allowable ranges) based on the measurement results.

[0052] like Figure 1 As shown, the manufacturing equipment management system 9 has a component information acquisition unit 921, a device component information acquisition unit 922, a manufacturing abnormality information acquisition unit 923, an inspection information acquisition unit 924, an improvement candidate information acquisition unit 925, a management operation assistance unit 926, and a display unit 927. These functions are installed on the inspection device 92.

[0053] The component information acquisition unit 921 acquires information related to various electronic components, substrates, solders, and other components used in the pick-and-place machine 91. The device component information acquisition unit 922 acquires information about various components and mechanisms that constitute the pick-and-place machine.

[0054] The manufacturing error information acquisition unit 923 acquires information about errors detected when components are mounted onto a substrate in the pick-and-place machine 91. Specifically, it acquires an image of the component being picked up by the nozzle using a camera (not shown) equipped on the pick-and-place machine 91, processes the image, and determines whether an error has occurred. Furthermore, this error information is associated with the device component or part that experienced the error.

[0055] The inspection information acquisition unit 924 acquires information about the inspection results from the inspection device 92, particularly information about any abnormalities. Here, abnormalities include not only "actual defects" that are determined to be defective by the inspection device 92 and also visually defective, but also so-called "passed inspections" that are determined to be defective by the inspection device 92 but visually acceptable. Furthermore, this abnormality information is associated with the device component or part where the abnormality occurred.

[0056] In the event of an anomaly occurring during manufacturing or inspection, the improvement candidate information acquisition unit 925 acquires information about the component or part number of the pick-and-place machine 91 that is estimated to be the cause of the anomaly (i.e., that some improvements are deemed necessary).

[0057] The management operation assistance unit 926, based on the information obtained by the component information acquisition unit 921, the device component information acquisition unit 922, the manufacturing abnormality information acquisition unit 923, the inspection information acquisition unit 924, and the improvement candidate information acquisition unit 925, generates a list of statistical values ​​categorized by type for each device component or part that is a candidate for improvement, and outputs it to the display unit 927.

[0058] Next, based on Figure 2 This section describes the processing flow of the management operation assistance screen in the manufacturing equipment management system 9. First, the component information acquisition unit 921 acquires component information (S101), and the device component information acquisition unit 922 acquires device component information (S102). Next, the manufacturing anomaly information acquisition unit 923 acquires manufacturing anomaly information (S103), and the inspection information acquisition unit 924 acquires inspection information (S104). Then, the improvement candidate information acquisition unit 925 acquires information on the device structure and components estimated to be the cause of the anomaly (S105). Next, the management operation assistance unit 926, based on the information acquired in steps S101 to S105, generates a summary of statistical values ​​categorized by type for each device component or component that becomes a candidate for improvement (S106). Finally, the management operation assistance unit 926 causes the display unit 927 to display the information generated in step S106 (step S107), ending the series of processes.

[0059] Figure 3 This represents an example of a management operation assistance screen displayed on display unit 927. For example... Figure 3As shown, in the overview information generated by the management operation assistance unit 926, for the components (5 feeders) and parts (5 numbers) of the pick-and-place machine extracted as improvement candidates, the statistical values ​​are displayed in a horizontal column according to each type of abnormality during inspection and each type of abnormality during part manufacturing. Specifically, the statistical values ​​for "over-inspection" and "actual defect" are displayed as types of abnormalities during inspection, and the statistical values ​​for "image processing error" and "part not adsorbed error" are displayed as types of abnormalities during manufacturing.

[0060] In addition to displaying the statistical values ​​for each type of anomaly in the overview information, it also displays information indicating the location of the anomaly (production line name, pick-and-place machine name, inspection machine name) and the ID of the device component. Furthermore, the column for the statistical values ​​of each anomaly is displayed in a color corresponding to the type of anomaly; if there are many statistical values, the color is displayed more intensely (no color is displayed when the statistical value is 0).

[0061] By reviewing the above-mentioned screens (hereinafter also referred to as management operation aid screens), managers of manufacturing equipment can efficiently screen for the causes of abnormalities.

[0062] <Implementation Method>

[0063] The following provides a more detailed description of an example of a method for implementing the present invention.

[0064] (System Architecture)

[0065] Figure 4 This diagram schematically illustrates an example of the configuration of manufacturing equipment in a surface mount production line for printed circuit boards according to this embodiment. Surface mount technology (SMT) refers to the technique of soldering electronic components onto the surface of a printed circuit board. A surface mount production line mainly consists of three processes: solder printing, component mounting, and reflow soldering (solder deposition).

[0066] like Figure 4 As shown, in a surface mount production line, as manufacturing equipment, a solder printing unit X1, a pick-and-place machine X2, and a reflow oven X3 are sequentially arranged from the upstream side. The solder printing unit X1 is a device that prints solder paste onto the electrode portions (called pads) of a printed circuit board using a screen printer. The pick-and-place machine X2 is a device used to pick up electronic components to be mounted on the substrate and place the components onto the corresponding solder paste; it is also called a chip mounter. The reflow oven X3 is a heating device used to heat and melt the solder paste, then cool it to solder the electronic components onto the substrate. When the number and types of electronic components mounted on the substrate are large, multiple pick-and-place machines X2 are sometimes installed in the surface mount production line.

[0067] In addition, the surface mount production line is equipped with a system that automatically detects defects or the possibility of defects by inspecting the status of the substrates at the exit of each process, from solder printing to component mounting to reflow soldering. Besides automatically classifying good and defective products, this system also has the function of providing feedback to the operation of each manufacturing unit based on the inspection results and their analysis (e.g., changes to the installation procedure).

[0068] Solder printing inspection apparatus Y1 is used to inspect the solder paste printing status on a substrate removed from solder printing apparatus X1. In solder printing inspection apparatus Y1, the solder paste printed on the substrate is measured in two or three dimensions, and various inspection items are determined based on the measurement results to determine whether they are within the normal range (tolerable range). Inspection items include, for example, the volume, area, height, positional offset, and shape of the solder. In two-dimensional measurement of the solder paste, image sensors (cameras) can be used, while in three-dimensional measurement, laser displacement meters, phase-shifting methods, spatial coding methods, and optical cut-off methods can be used.

[0069] The component inspection device Y2 is used to inspect the configuration of electronic components on a substrate removed from the pick-and-place machine X2. In the component inspection device Y2, components (which may be the main body of a component, electrodes, or other parts of a component) placed on solder paste are measured in two or three dimensions. Based on the measurement results, various inspection items are determined to be within acceptable limits. Inspection items include, for example, component positional offset, angular (rotational) offset, missing components, different components, different polarities (electrodes on the component side and the substrate side have different polarities), reversed orientation (components are positioned facing the back), and component height. Similar to solder printing inspection, image sensors (cameras) can be used for two-dimensional measurement of electronic components, while laser displacement meters, phase-shifting methods, spatial coding methods, and optical cut-off methods can be used for three-dimensional measurement.

[0070] The visual inspection device Y3 is used to inspect the soldering quality of substrates removed from the reflow oven X3. In the visual inspection device Y3, the solder portion after reflow soldering is measured in two or three dimensions, and various inspection items are judged to be within acceptable ranges based on the measurement results. Inspection items include those similar to those for component inspection, as well as the quality of solder joint shape. In solder shape measurement, in addition to the aforementioned laser displacement meter, phase shift method, spatial coding method, and optical cut-off method, a so-called color highlighting method can also be used (irradiating the solder surface with R, G, and B illumination at different incident angles, capturing the reflected light of each color using a top camera, thereby detecting the three-dimensional shape of the solder as two-dimensional color information).

[0071] X-ray inspection apparatus Y4 is a device used to inspect the soldering condition of a substrate using X-ray images. For example, in the case of packaged components such as BGA (Ball Grid Array) and CSP (Chip Size Package), and multilayer substrates, the solder joints are hidden beneath the components and substrate, making it impossible to inspect the solder condition in visual inspection apparatus Y3 (i.e., in visual images). X-ray inspection apparatus Y4 compensates for this weakness in visual inspection. Inspection items performed by X-ray inspection apparatus Y4 include, for example, component positional deviation, solder height, solder volume, solder ball diameter, length of back solder pads, and the quality of solder joints. Furthermore, X-ray transmission images or CT (Computed Tomography) images can be used as the X-ray images.

[0072] (Management device)

[0073] The manufacturing devices X1 to X3 and the inspection devices Y1 to Y4 described above are connected to the management device 1 via a network (LAN). The management device 1 is a system responsible for managing and controlling the manufacturing devices X1 to X3 and the inspection devices Y1 to Y4. Although not shown in the diagram, it is composed of a general-purpose computer system equipped with a CPU (processor), main storage device (memory), auxiliary storage device (hard disk, etc.), input devices (keyboard, mouse, controller, touch panel, etc.), and a display device 10. The functions of the management device 1, described later, are implemented by the CPU reading and executing programs stored in the auxiliary storage device.

[0074] Furthermore, the management device 1 can consist of one computer or multiple computers. Alternatively, all or part of the functions of the management device 1 can be installed in the computer built into any of the manufacturing devices X1 to X3 or the inspection devices Y1 to Y4. Alternatively, part of the functions of the management device 1 can be implemented through a server on a network (such as a cloud server).

[0075] The management device 1 of this embodiment has a functional unit for enabling managers of manufacturing equipment to efficiently maintain and manage the quality of the equipment. Figure 5 A block diagram showing the functional parts of the management device 1.

[0076] like Figure 5 As shown, the management device 1 has various functional units including a component information acquisition unit 11, a component information DB (database) 111, a device component information acquisition unit 12, a device component information DB 121, a manufacturing abnormality information acquisition unit 13, a manufacturing abnormality information DB 131, an inspection information acquisition unit 14, an inspection information DB 141, an improvement candidate information acquisition unit 15, and a management operation assistance unit 16.

[0077] The following example, using a pick-and-place machine X2, will be used to explain in detail the operation of each functional unit of the management device 1.

[0078] (Pick and place machine)

[0079] Figure 6 This diagram schematically illustrates the structure of the pick-and-place machine X2. The pick-and-place machine X2 includes a worktable 20 for placing a substrate B, multiple feeders 21 for providing electronic components P, a movable head 22 for picking up electronic components P, multiple nozzles 23 mounted on the head 22, and a vacuum pump 24 for controlling the air pressure of each nozzle. Electronic components P with different numbers are provided on each column of feeders 21. Furthermore, the pick-and-place machine X2 includes an upper camera 25, a lower camera 26, a contact sensor 27 for measuring the contact pressure on the nozzle end face, and a pressure sensor 28 for measuring the air pressure of the nozzle, serving as an observation system for detecting abnormalities in the machine's operation. The control unit 29 is a module responsible for controlling, calculating, and processing information for each part of the pick-and-place machine X2, and includes a CPU (processor) and memory. It may also include an output device for outputting information. Regarding the coordinate system, the X and Y axes are parallel to the substrate surface, and the Z axis is perpendicular to the substrate surface.

[0080] If substrate B is placed onto workbench 20, control unit 29 controls each nozzle 23 according to the installation procedure, and the required electronic components P are picked up / transported from feeder 21 and sequentially placed on substrate B. Once all electronic components P have been placed (installed), substrate B is moved to the downstream process (inspection device Y2). Additionally, as manufacturing information for substrate B, manufacturing log information is recorded in the memory of pick-and-place machine X2. This manufacturing log information includes manufacturing error information associated with substrate ID, component number of each component, circuit number, and information indicating the device components (nozzle ID, feeder ID) that have been processed for each component.

[0081] Figure 7 This is an example of the manufacturing log information in the X2 pick-and-place machine. Each line is a manufacturing record for a single component, including substrate ID, component number, circuit number, nozzle ID, feeder ID, and manufacturing error information (number of image processing errors, number of component not picked up). By referring to the manufacturing log information, one can determine which device or component manufactured each component on the substrate.

[0082] (Data collection from management devices)

[0083] The component information acquisition unit 11 acquires information related to various electronic components, substrates, solders, and other components used in the production line and stores it in the component information DB 111. The timing of information acquisition is arbitrary. For example, information can be acquired when a new component is introduced into the production line, or when a component with an existing component number but a different manufacturing batch is introduced into the production line. The method of information acquisition can be, for example, automatic acquisition from the component manufacturer's server via a network, or acquisition through user input.

[0084] The device component information acquisition unit 12 acquires information related to various components and mechanisms constituting the manufacturing apparatus, such as the pick-and-place machine X2, and stores it in the device component information DB 121. The timing of information acquisition is arbitrary. For example, information can be acquired when replacing or maintaining device components, or when introducing new device components into the production line. The method of information acquisition can be, for example, automatic acquisition from the manufacturing apparatus manufacturer's server via a network, or acquisition through user input.

[0085] The manufacturing error information acquisition unit 13 acquires the aforementioned manufacturing log information (including manufacturing error information) from the pick-and-place machine X2 and stores it in the manufacturing error information DB 131. The timing of acquiring the manufacturing log information is arbitrary. For example, the control unit 29 of the pick-and-place machine X2 may send the manufacturing log information to the management device 1 whenever the substrate is mounted in the pick-and-place machine X2. Alternatively, the manufacturing error information acquisition unit 13 may acquire the information at a predetermined time or frequency, or it may acquire the information based on an acquisition request from the user.

[0086] The inspection information acquisition unit 14 acquires information on the inspection results of the mounted substrate (especially information on actual defects and over-inspections) from the component inspection device Y2 and stores it in the inspection information DB 141. The timing of acquiring the inspection information is arbitrary. For example, the inspection information can be acquired whenever the substrate inspection in the component inspection device Y2 is completed. Alternatively, the information can be acquired at a predetermined time or frequency, or it can be acquired based on an acquisition request from the user.

[0087] The improvement candidate information acquisition unit 15 extracts device component or part numbers that are estimated to be the cause of errors during component manufacturing or defects during inspection (i.e., candidates for improvement) based on the information obtained by the manufacturing anomaly information acquisition unit 13 and the inspection information acquisition unit 14. The timing and method of acquiring the improvement candidate information are not particularly limited; for example, improvement candidates can be extracted for each specified statistical period based on a comparison of the number of anomalies occurring for each device component or part number with the normal value, or a comparison of the number of anomalies occurring between different components / numbers of the same type.

[0088] The management operation assistance unit 16, based on the information obtained by the component information acquisition unit 11, the device component information acquisition unit 12, the manufacturing anomaly information acquisition unit 13, the inspection information acquisition unit 14, and the improvement candidate information acquisition unit 15, generates a summary of statistical values ​​categorized by type for each device component and component number that becomes an improvement candidate, including manufacturing anomalies and inspection anomalies within a specified statistical period, and outputs this information to the display device 10. Alternatively, the display device 10, from which the summary information is output, can also be configured separately from the main body of the management device 1. That is, the summary information can also be output via a communication unit (not shown).

[0089] The screen displayed on display device 10 can be the same as the screen output from manufacturing equipment management system 9 in the above application example (see reference). Figure 3 (Similar to, but not limited to) Figure 8 This refers to examples of other screens displayed on a display device.

[0090] like Figure 8 As shown in other screen display examples, device components and parts are displayed collectively as improvement candidates (hereinafter, device components and parts will also be collectively referred to as devices). Furthermore, for each device among the improvement candidates, statistical values ​​are displayed numerically for each type of anomaly, and also as horizontal bar charts. Devices are displayed in descending order of actual defects, from most to least. Therefore, equipment management personnel can more easily and intuitively grasp the status of anomalies.

[0091] Furthermore, the management can use methods such as the following to screen phenomena that could be the cause of an anomaly based on the displayed overview information.

[0092] (Example of an abnormal cause 1)

[0093] For example, if the category of the device extracted as an improvement target is "nozzle", and an actual defect is included in the anomaly, the cause of the actual defect is considered to be any one of the following three: "The up and down movement of the nozzle is sluggish, resulting in inconsistent part adsorption / installation height, thus causing adsorption errors and part misalignment during installation", "The nozzle is not suitable for the part shape, thus it cannot stably adsorb the part, and the part shifts during head movement after adsorption", or "The nozzle is blocked, resulting in insufficient vacuum pressure and inability to stably adsorb the part, and the part shifts during head movement after adsorption".

[0094] Figure 9 Table (A) shows the relationship between the causes of actual defects in the suction nozzle and the presence or absence of manufacturing anomalies related to the nozzle, namely image processing errors and component non-adsorption errors. Here, regarding the suction nozzles identified as targets for improvement, the number of units with component non-adsorption errors, in addition to actual defects, is taken into account, as follows... Figure 9As shown in (A), the actual cause of this defect can be filtered to #1, "Sluggish up-and-down movement of the nozzle, inconsistent component adsorption / installation height, thus causing adsorption errors and component misalignment during installation." In this case, the supervisor can instruct the work supervisor to confirm whether the nozzle movement is smooth, etc.

[0095] On the other hand, if there is no actual defect, image processing error, or part not being adsorbed, the actual defect could be caused by either #2 "The nozzle is not suitable for the part shape, therefore it cannot stably adsorb the part, and the part shifts during head movement after adsorption" or #3 "The nozzle is clogged, the vacuum pressure is insufficient to stably adsorb the part, and the part shifts during head movement after adsorption." Therefore, the improvement actions taken by the management would include instructing the operations manager to check for nozzle clogging and to confirm the part installation procedure (parameters), etc.

[0096] (Example of anomaly)

[0097] Next, in the case where the device category of the object to be improved is "part number", there is no actual defect, and there is an image judgment processing error, the following four phenomena are considered as the cause of the image judgment processing error. That is, any one of the following: "the actual size of the part has changed in batches", "the part position cannot be accurately detected", "the tolerance for the part size is too strict", or "the part adsorption position has shifted significantly".

[0098] Figure 9 Table (B) represents the relationship between the cause of an image determination processing error in a part number and the actual defects and non-adhesion errors of that part number. Here, regarding part numbers extracted as targets for improvement, without considering anomalies other than image determination processing errors, such as... Figure 9 As shown in (B), the cause is either #1 "The actual size of the component has changed in batches" or #3 "The tolerance for the component size is too strict".

[0099] (Advantages of this implementation method)

[0100] Based on the structure of this embodiment described above, a list of statistical values ​​categorized by type is displayed for each device to be improved, including abnormalities during substrate manufacturing and abnormalities during inspection. Therefore, the person in charge of the equipment can easily screen for the causes of such abnormalities and can efficiently maintain and manage the manufacturing equipment.

[0101] <Other>

[0102] The above description of the embodiments is merely illustrative of the present invention, and the present invention is not limited to the specific embodiments described above. Various modifications can be made within the scope of the present invention's technical concept. For example, in the above embodiments, the overview information generated by the management operation assistance unit 16 may also include the final replacement date and time of the target device, the elapsed time since the final replacement, and the history of replacement counts. Additionally, it may also include information such as the final maintenance date and time of the device components of the target device, and the cumulative number of maintenance operations performed.

[0103] Furthermore, in the above implementation, the devices to be improved are sorted based on the actual number of defective items. However, it is not necessary to display them in such an order. They can also be displayed in order of increasing or decreasing likelihood of being the cause of the defect, based on other abnormal information.

[0104] Furthermore, in the above embodiment, the management operation assistance unit is configured to cause the display device to output a screen containing overview information, but it is not limited to this structure. The management operation assistance unit may also simply generate data for displaying the screen containing overview information. The generated data can be sent to other machines via the communication unit or stored in the storage unit. That is, the present invention can also be applied to information processing devices that do not have a display unit.

[0105] In addition, the management device 1 in the above embodiment may also include a unit that, when detecting an anomaly in the production line and extracting the improvement target device that is the cause of the anomaly, reports this to the management person in charge.

[0106] Furthermore, in the above embodiments, a chip mounting machine in a component mounting substrate production line was used as an example for explanation, but the present invention can also be applied to manufacturing equipment for other products.

[0107] <Postscript>

[0108] One embodiment of the present invention is a management system (1) for a manufacturing equipment, the manufacturing equipment comprising: a manufacturing apparatus including one or more apparatus components for manufacturing products; and an inspection apparatus for inspecting the products, the management system (1) for the manufacturing equipment comprising:

[0109] Display unit (10);

[0110] The device component information acquisition unit (12) acquires device component information for each of the device components in the manufacturing apparatus;

[0111] The product component information acquisition unit (11) acquires product component information for each product component constituting the product;

[0112] Manufacturing anomaly information acquisition unit (13) acquires manufacturing anomaly information related to anomalies of the manufacturing device during the manufacturing of the product;

[0113] The inspection information acquisition unit (14) acquires inspection information containing information about abnormalities when the inspection device inspects the product;

[0114] Improvement candidate information acquisition unit (15) acquires improvement candidate information, which is information on the device component and / or the product component that are candidates for improvement in the manufacturing equipment; and

[0115] The management operation assistance unit (16) generates, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information, a list of statistical values ​​categorized by type for each device component and / or each product component that becomes a candidate for improvement, including manufacturing anomalies and inspection anomalies of the product within a specified statistical period, and displays it on the display unit.

[0116] Another embodiment of the present invention is a management device (1) for a manufacturing equipment, the manufacturing equipment comprising: a manufacturing apparatus including one or more apparatus components for manufacturing products; and an inspection device for inspecting the products, the management device (1) for the manufacturing equipment comprising:

[0117] The device component information acquisition unit (12) acquires device component information for each of the device components in the manufacturing apparatus;

[0118] The product component information acquisition unit (11) acquires product component information for each product component constituting the product;

[0119] Manufacturing anomaly information acquisition unit (13) acquires manufacturing anomaly information related to anomalies of the manufacturing device during the manufacturing of the product;

[0120] The inspection information acquisition unit (14) acquires inspection information containing information about abnormalities when the inspection device inspects the product;

[0121] Improvement candidate information acquisition unit (15) acquires improvement candidate information, which is information on the device component and / or the product component that are candidates for improvement in the manufacturing equipment; and

[0122] The management operation support unit (16) generates, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information, a list of statistical values ​​categorized by type for each device component and / or each product component that becomes a candidate for improvement. This list includes manufacturing anomalies and inspection anomalies of the product within a specified statistical period.

[0123] Another embodiment of the present invention is a management method for a manufacturing equipment, the manufacturing equipment comprising: a manufacturing apparatus including one or more apparatus components for manufacturing products; and an inspection apparatus for inspecting the products, the management method for the manufacturing equipment comprising:

[0124] The device component information acquisition step (S102) acquires device component information for each device component in the manufacturing apparatus;

[0125] Product component information acquisition step (S101): For each product component constituting the product, product component information is acquired;

[0126] Manufacturing anomaly information acquisition step (S103): Acquire manufacturing anomaly information related to anomalies of the manufacturing apparatus during the manufacturing of the product;

[0127] The inspection information acquisition step (S104) acquires inspection information containing information about abnormalities that occur when the inspection device inspects the product.

[0128] Improvement candidate information acquisition step (S105): Obtain improvement candidate information, which is information on the device component and / or the product component that are candidates for improvement in the manufacturing equipment;

[0129] The management operation auxiliary information generation step (S106) generates, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information, a summary of statistical values ​​categorized by type for each device component and / or each product component that becomes a candidate for improvement; and

[0130] The task assistance information output step (S107) outputs a summary of information generated in the task assistance information generation step.

[0131] Label Explanation

[0132] 1: Management device; 10: Display device; 11: Component information acquisition unit; 111: Component information database; 12: Device component information acquisition unit; 121: Device component information database; 13: Manufacturing abnormality information acquisition unit; 131: Manufacturing abnormality information database; 14: Inspection information acquisition unit; 141: Inspection information database; 15: Improvement candidate information acquisition unit; 16: Management operation assistance unit; 20: Workbench; 21: Feeder; 22: Head; 23: Nozzle; 24: Vacuum pump; 25: Upper camera; 26: Lower camera; 27: Contact sensor; 28: Pressure sensor; 29: Control unit; X1: Solder printing device; X2: Pick and place machine; X3: Reflow oven; Y1: Solder printing inspection device; Y2: Component inspection device; Y3: Appearance inspection device; Y4: X-ray inspection device; B: Substrate; P: Electronic component.

Claims

1. A management system for a manufacturing equipment, the manufacturing equipment comprising: a manufacturing apparatus including one or more apparatus components for manufacturing products; and an inspection apparatus for inspecting the products, the management system for the manufacturing equipment comprising: Display unit; The device component information acquisition unit acquires device component information for each of the device components in the manufacturing apparatus; The product component information acquisition unit acquires product component information for each product component that constitutes the product. A manufacturing anomaly information acquisition unit acquires manufacturing anomaly information related to anomalies in the manufacturing apparatus during the manufacturing of the product. The inspection information acquisition unit acquires inspection information that includes information about any abnormalities that occur when the inspection device inspects the product. An improvement candidate information acquisition unit acquires improvement candidate information, which is information about the device components and / or product components in the manufacturing equipment that are candidates for improvement; and The management operation support unit generates overview information and displays it on the display unit for each of the device components and / or each of the product components that becomes a candidate for improvement, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information. The overview information includes statistical values ​​of manufacturing anomalies and inspection anomalies of the product categorized by type within a specified statistical period.

2. The management system according to claim 1, characterized in that, The overview information also includes information indicating the location where the anomaly occurred.

3. The management system according to claim 1 or 2, characterized in that, The overview information also includes information related to the replacement of the device components and information related to the maintenance of the device components.

4. The management system according to claim 1 or 2, characterized in that, The management operation support unit displays the device components and / or product components that are candidates for improvement, either in descending order of the number of anomalies during the manufacturing process and / or the number of anomalies during the inspection of the product, or in descending order of the probability that they are the cause of the anomalies during the manufacturing process and / or the number of anomalies during the inspection of the product.

5. The management system according to claim 1 or 2, characterized in that, The management operation assistance unit distinguishes and displays each type of anomaly during the manufacturing process and the inspection process of the product using different colors, and changes the color intensity according to the number of statistical values ​​of the anomalies.

6. The management system according to claim 1 or 2, characterized in that, The improvement candidates in the improvement candidate information are only those device components and / or product components for which the cause of the abnormality during the manufacturing of the product and / or the abnormality during the inspection of the product has been determined.

7. The management system according to claim 1 or 2, characterized in that, The product is a component mounting substrate, the manufacturing apparatus is a chip mounter, and the product component is a component. The manufacturing defects of the product include at least one of the following: poor component adhesion during component assembly or defects in image processing during component assembly. Abnormalities during product inspection include at least one of the following: actual defects in the component mounting substrate, over-detection, or abnormalities in the measured values ​​detected during inspection by the inspection device. Over-detection refers to a situation where a product is determined to be defective by the inspection device but is judged to be good by visual inspection.

8. A management device for a manufacturing equipment, the manufacturing equipment comprising: a manufacturing apparatus including one or more apparatus components for manufacturing products; and an inspection device for inspecting the products, the management device for the manufacturing equipment comprising: The device component information acquisition unit acquires device component information for each of the device components in the manufacturing apparatus; The product component information acquisition unit acquires product component information for each product component that constitutes the product. A manufacturing anomaly information acquisition unit acquires manufacturing anomaly information related to anomalies in the manufacturing apparatus during the manufacturing of the product. The inspection information acquisition unit acquires inspection information that includes information about any abnormalities that occur when the inspection device inspects the product. An improvement candidate information acquisition unit acquires improvement candidate information, which is information about the device components and / or product components in the manufacturing equipment that are candidates for improvement; and The management operation support unit generates overview information for each of the device components and / or each of the product components that becomes a candidate for improvement, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information. The overview information includes statistical values ​​of manufacturing anomalies and inspection anomalies of the product categorized by type within a specified statistical period.

9. A method for managing manufacturing equipment, the manufacturing equipment comprising: a manufacturing apparatus including one or more apparatus components for manufacturing products; and an inspection apparatus for inspecting the products, the method for managing the manufacturing equipment comprising: The step of obtaining device component information involves obtaining device component information for each device component in the manufacturing apparatus. The product component information acquisition step involves acquiring product component information for each product component that constitutes the product. The manufacturing anomaly information acquisition step acquires manufacturing anomaly information related to anomalies in the manufacturing apparatus during the manufacturing of the product. The inspection information acquisition step involves acquiring inspection information that includes information about any abnormalities that occur when the inspection device inspects the product. The improvement candidate information acquisition step involves acquiring improvement candidate information, which is information about the device components and / or product components in the manufacturing equipment that have become candidates for improvement. The management operation auxiliary information generation step, based on the device component information, the product component information, the manufacturing anomaly information, the inspection information, and the improvement candidate information, generates overview information for each device component and / or each product component that becomes a candidate for improvement. The overview information includes statistical values ​​of manufacturing anomalies and inspection anomalies of the product, categorized by type, within a specified statistical period. as well as The management operation auxiliary information output step outputs a summary of information generated in the management operation auxiliary information generation step.

10. A storage medium for non-transitory storage of a program that causes an information processing device to perform the steps of the management method of claim 9.

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