Driving pump, liquid cooling module, electronic device and vibrator manufacturing method

Abstract

Drive pump, liquid cooling module, electronic equipment and vibrator preparation method relate to medium drive micro device technical field, and drive pump includes casing and vibrator; The casing has first channel and second channel, and the casing is equipped with pump cavity, and the first channel, the pump cavity and the second channel are communicated in proper order to form flow channel; The vibrator includes electrode layer, piezoelectric layer, electrode connecting layer and support layer which are connected in layers; The piezoelectric layer, electrode connecting layer and support layer form co-sintered body, the electrode layer is attached on the side of piezoelectric layer away from support layer, and the electrode connecting layer is located between piezoelectric layer and support layer; The vibrator is located in the casing and constitutes part of the side wall of the pump cavity, for driving medium to flow in the flow channel. The co-sintered body formed by sintering the piezoelectric layer and the support layer can effectively improve the yield and reliability of the finished drive pump, increase the amplitude and conversion efficiency of the vibrator, and the connection between the piezoelectric layer and the support layer is more firm, so that the performance and reliability of the drive pump are improved.

Description

Technical Field

[0001] This application relates to the field of media-driven micro-device technology, and in particular to a method for manufacturing a drive pump, liquid cooling module, electronic device, and oscillator. Background Technology

[0002] With the development of microelectronic components, the size of electronic products is gradually decreasing. In order to meet the high performance requirements and increasing heat flux density of mobile terminal products and other electronic devices, micro-pump liquid cooling technology is constantly developing and has become one of the development trends of heat dissipation technology for microelectronic devices.

[0003] Mobile terminal products such as smartphones, watches, PCs, and wearable devices have stringent design requirements regarding thickness, size, and weight, as well as high reliability during movement. Micropumps, as the power core of liquid cooling systems, represent a bottleneck in achieving the performance, thickness, and reliability of mobile terminal products, and are a key technology for electronic applications.

[0004] Piezoelectric ceramics exhibit the inverse piezoelectric effect, enabling the conversion between electrical and mechanical energy. They can drive the flow of refrigerant and are characterized by thinness, small size, simple structure, high pressure, low flow rate, no electromagnetic interference, and low operating noise. They can achieve precise fluid transport and control, and can be used as the driving oscillator of micropumps. They are suitable for high flow resistance and low flow rate heat dissipation systems such as ultra-thin liquid cooling films in mobile phones and watches.

[0005] Because piezoelectric ceramics operate at high frequencies and undergo reciprocating bending during operation, prolonged use can lead to fatigue damage. Therefore, it is necessary to press metal sheets or other support mechanisms onto the piezoelectric ceramic sheets to provide support and protection. Currently, the piezoelectric ceramics and metal sheets are usually bonded together with adhesive. However, the long-term temperature and weather resistance of the adhesive layer is limited. It is prone to failure when the temperature exceeds 85 ℃ or falls below -40 ℃, resulting in a decrease in adhesive strength and even detachment under long-term vibration of the piezoelectric ceramic. Furthermore, the adhesive layer softens and expands at high and low temperatures, undergoing creep and a decrease in Young's modulus, which greatly reduces the amplitude of the oscillator and the efficiency of electrical and mechanical energy conversion. Moreover, with the miniaturization of devices (<2mm), the adhesive bonding process window is small, affecting the yield and reliability of drive pump products. Summary of the Invention

[0006] This application provides a method for manufacturing a drive pump, a liquid cooling module, electronic equipment, and an oscillator. By directly sintering the piezoelectric layer and the support layer into an integral structure, the use of adhesive layers to connect the piezoelectric layer and the support layer can be avoided. The connection between the piezoelectric layer and the support layer is more secure, and the piezoelectric layer and the support layer will not fall off even during long-term operation, thereby improving the performance and reliability of the drive pump.

[0007] In a first aspect, this application provides a drive pump, including a housing and a vibrator;

[0008] The housing has a first channel and a second channel, and the housing is provided with a pump chamber. The first channel, the pump chamber and the second channel are connected in sequence to form a flow channel.

[0009] The oscillator includes a stacked electrode layer, a piezoelectric layer, an electrode connection layer, and a support layer;

[0010] The piezoelectric layer, the electrode connection layer, and the support layer constitute a co-sintered body. The electrode layer is attached to the side of the piezoelectric layer facing away from the support layer, and the electrode connection layer is located between the piezoelectric layer and the support layer.

[0011] The oscillator is located inside the housing and forms part of the sidewall of the pump cavity, used to drive the medium to flow in the flow channel.

[0012] The piezoelectric layer, electrode connection layer, and support layer are sintered together to form a co-sintered body, avoiding the use of an adhesive layer to connect the piezoelectric layer and support layer. This results in a more robust connection between the piezoelectric layer and support layer, preventing detachment even during long-term operation at temperatures exceeding 85 ℃ or below -40 ℃, thus improving the performance and reliability of the drive pump. The co-sintered structure also avoids issues such as softening and expansion, shape creep, and decreased Young's modulus of the adhesive layer at high and low temperatures, increasing the amplitude and conversion efficiency of the oscillator. Furthermore, the presence of an adhesive layer as a flexible connection mechanism reduces the energy conversion efficiency of the piezoelectric oscillator during vibration; the direct rigid connection between the piezoelectric layer and support layer improves the energy conversion efficiency. When the drive pump is used in miniaturized devices (device size <2 mm), this application utilizes the co-sintered structure formed by sintering the piezoelectric layer and support layer, effectively improving the yield and reliability of the finished drive pump during manufacturing.

[0013] In one possible implementation, the difference in the coefficients of thermal expansion between the piezoelectric layer and the support layer is less than or equal to 20 × 10⁻⁶. -6 / K. It can prevent severe warping deformation of the oscillator during the high-temperature sintering process, prevent large internal stress between the piezoelectric layer and the support layer of the oscillator, and improve the piezoelectric performance of the piezoelectric layer.

[0014] In one possible implementation, the electrode connection layer contains particles, the hardness of which is greater than the hardness of any one of the piezoelectric layer, the electrode connection layer, and the support layer. This improves the structural strength of the oscillator while also enhancing the connection strength between the piezoelectric layer, the electrode connection layer, and the support layer within the oscillator.

[0015] In one possible implementation, the hardness of the particles is greater than or equal to 120 hv.

[0016] In one possible implementation, the particles are made of at least one material selected from silicon carbide, tungsten, diamond, and corundum.

[0017] In one possible implementation, the particle size D90 is less than or equal to 10 micrometers.

[0018] In one possible implementation, the coefficients of thermal expansion of the piezoelectric layer and the support layer are in the range of 4 × 10⁻⁶. -6 Up to 8×10 -6 Within the range of / K.

[0019] In one possible implementation, the piezoelectric layer has multiple layers, which are stacked together. Adjacent piezoelectric layers are connected through the electrode connection layer, which can improve the vibration intensity of the oscillator and enhance the driving ability of the pump to drive the flowing medium.

[0020] In one possible implementation, the drive pump further includes at least two valves located in the first channel and the second channel, respectively, to achieve flow control in the first channel and the second channel.

[0021] In one possible implementation, the oscillator is in the shape of a square sheet, the length of the piezoelectric layer is in the range of 4 mm to 35 mm, the thickness of the piezoelectric layer is in the range of 0.04 mm to 2 mm, the length of the support layer is in the range of 5 mm to 35 mm, and the thickness of the support layer is in the range of 0.04 mm to 3 mm.

[0022] In one possible implementation, the oscillator is disc-shaped, the diameter of the support layer is in the range of 4 mm to 35 mm, the thickness of the support layer is in the range of 0.04 mm to 3 mm, the diameter of the piezoelectric layer is in the range of 4 mm to 35 mm, and the thickness of the piezoelectric layer is in the range of 0.04 mm to 2 mm.

[0023] In one possible implementation, the support layer can be made of ceramic and / or glass materials, ensuring good structural strength while having a thermal expansion coefficient close to that of the piezoelectric layer.

[0024] Secondly, this application provides a liquid-cooled module, including the drive pump described in any of the above claims, and further including a liquid-cooled module. The liquid-cooled module includes a liquid-cooled outlet and a liquid-cooled inlet. The liquid-cooled outlet is used to communicate with a first channel of the drive pump, and the liquid-cooled inlet is used to communicate with a second channel of the drive pump. A portion of the liquid-cooled module surrounding the liquid-cooled outlet and a portion of the housing surrounding the first channel form an integrated sealed structure. A portion of the liquid-cooled module surrounding the liquid-cooled inlet and a portion of the housing surrounding the second channel also form an integrated sealed structure.

[0025] The pump, as the power source of the liquid cooling module, provides the power for the flow and circulation of the cooling medium within the liquid cooling components, achieving active liquid cooling and thus a sustained heat dissipation effect. Compared to passive liquid cooling, active liquid cooling can adjust the pump speed as needed to achieve optimal heat dissipation, while passive liquid cooling can only passively follow the temperature changes of the components. Therefore, active liquid cooling offers better adjustability. It should be noted that the liquid cooling outlet is connected to the first channel, but this does not mean that the liquid cooling outlet and the pump inlet are always connected; it only indicates that under certain conditions, the cooling medium can flow from the liquid cooling outlet into the first channel. The relationship between the liquid cooling inlet and the second channel is similar.

[0026] Among them, piezoelectric components utilize the inverse piezoelectric effect of piezoelectric materials. Piezoelectric materials are crystalline materials that exhibit a voltage between their two ends when subjected to pressure. The inverse piezoelectric effect refers to the mechanical deformation or stress that occurs in a certain direction when an electric field is applied to the piezoelectric component; when the applied electric field is removed, these deformations or stresses also disappear. Using piezoelectric components in pumps offers advantages such as small size, high energy density, and no electromagnetic interference, enabling precise delivery and control of the cooling medium. In one embodiment, the piezoelectric component includes piezoelectric ceramics, a metal substrate, and a plastic separator (to prevent the liquid working medium from corroding the metal substrate).

[0027] In this embodiment, the liquid-cooled module around the liquid-cooled outlet and the pump base around the first channel form an integrated sealed structure, as do the liquid-cooled module around the liquid-cooled inlet and the pump base around the second channel. The integrated sealed structure means that there is no continuous interface between the two components due to mutual fusion and penetration. The periphery of the liquid-cooled outlet refers to the adjacent area surrounding the liquid-cooled outlet. If screws are used to fix the liquid-cooled module and the pump base, the boundary between them is continuous because they are separate components. Compared to screw fixing, the integrated sealed structure in this application is generally impossible to separate unless damaged by external force, whereas with screw connection, the pump base and liquid-cooled module can be separated simply by removing the screws.

[0028] The screw-based fixing method suffers from limitations in quality control due to factors such as assembly precision and material resilience. This can lead to cooling medium leakage during actual use, affecting heat dissipation efficiency and potentially damaging internal components. Furthermore, a base is typically required within the pump, with screws passing through the base and liquid-cooled module for fixation. In contrast, the integrated sealing structure of this application fuses a portion of the liquid-cooled module around the liquid outlet with a portion of the pump base around the first channel, resulting in a tighter connection and improved sealing between the pump base and the liquid-cooled module. This eliminates the need for an additional base, simplifying the liquid-cooled module structure, reducing costs and manufacturing complexity, and enabling an ultra-thin design. Furthermore, the liquid cooling module provided in this application can be applied to electronic devices. When electronic devices are subjected to external forces (such as falling to the ground and colliding with the ground), the screw fixing method may cause the connection between the pump base and the liquid cooling module to loosen, or the O-ring to shift and the local seal to be not tight. However, the integrated sealing structure makes it difficult for the pump base and the liquid cooling module to undergo relative displacement, which helps to improve the stability of the overall structure of the liquid cooling module and improve the service life of electronic devices.

[0029] In this application, by setting up a liquid cooling module: First, a pump is used to provide power for the flow and circulation of the cooling medium, thereby achieving active heat dissipation in the liquid cooling module. Compared with passive liquid cooling, this can more effectively reduce the temperature of the device and improve heat dissipation efficiency.

[0030] Secondly, the area around the liquid cooling outlet in the liquid cooling module and the area around the first channel in the pump body are integrated sealing structures, and the area around the liquid cooling inlet in the liquid cooling module and the area around the second channel in the pump body are integrated sealing structures. Compared with screw fixing, the integrated sealing structure has a better sealing effect, which can prevent the cooling medium from leaking, thereby avoiding the reduction of the heat dissipation efficiency of the cooling medium and protecting the device from damage.

[0031] In some possible implementations, the liquid cooling module includes a first flexible membrane, the liquid cooling outlet and the liquid cooling inlet are disposed on the first flexible membrane, the drive pump includes a pump bottom wall, and the pump bottom wall and a portion of the first flexible membrane surrounding the liquid cooling outlet and the liquid cooling inlet form an integrated sealing structure.

[0032] In this embodiment, the fixed connection between the liquid-cooled module and the pump is actually a fixed connection between the first flexible membrane and the pump bottom wall. The portions of the first flexible membrane located around the liquid-cooled outlet and the liquid-cooled inlet are integrally sealed with the pump bottom wall. Since the first flexible membrane and the pump bottom wall are made of the same or similar materials, the difficulty of hot-pressing is relatively small, which is conducive to forming an integral sealing structure.

[0033] In this embodiment, the interface between the first flexible membrane and the pump bottom wall is discontinuous. In one embodiment, at least a portion of the first flexible membrane and the pump bottom wall are continuously fused together to form an integrated sealing structure. In another embodiment, the portion of the first flexible membrane other than the liquid-cooled outlet and inlet is an integrated sealing structure with the pump bottom wall, and there is no interface between them. This sealing interface is preferred, as it has stronger flexibility, sealing performance, and impact resistance. However, it is difficult to perfectly manufacture and achieve in engineering, and more often it is a partially continuous fused interface, with micro-air gaps or discontinuous non-welded areas between the interfaces.

[0034] In one possible implementation, the liquid cooling module further includes a second flexible membrane and a first rigid substrate located between the first flexible membrane and the second flexible membrane. The first flexible membrane, the second flexible membrane, and the first rigid substrate together form a liquid cooling channel of the liquid cooling module, and the two ends of the first rigid substrate are integrally sealed with the first flexible membrane and the second flexible membrane, respectively.

[0035] In this embodiment, the interface materials of the sealing weld between the first rigid substrate and the first and second flexible membranes are the same or similar. Welding methods without solder paste or other third materials, such as thermocompression bonding, hot melt welding, ultrasonic welding, and ultra-frequency welding, can improve the sealing performance and reliability between the first rigid substrate and the first and second flexible membranes. If leakage occurs in the seal between the first rigid substrate and the first and second flexible membranes, it will lead to a rapid decline in system performance and rapid failure.

[0036] In this embodiment, the first and second flexible membranes are flexible and have good bending performance, making them suitable for situations where the liquid-cooled module needs to be bent. A first rigid substrate is disposed between the first and second flexible membranes, with both ends of the first rigid substrate supporting the first and second flexible membranes, which helps to improve the overall strength of the liquid-cooled module in the thickness direction. The cooling medium flows in the inner cavity formed by the first flexible membrane, the second flexible membrane, and the first rigid substrate. In this design, both ends of the first rigid substrate are integrated with the first and second flexible membranes as a sealing structure, which can improve the sealing performance of the inner cavity and prevent the cooling medium from leaking into the inner cavity.

[0037] In this embodiment, the two ends of the first rigid substrate have discontinuous interfaces with the first and second flexible membranes, respectively. In one embodiment, the two ends of the first rigid substrate and at least a portion of the first and second flexible membranes are continuously fused together to form an integrated sealing structure. In another embodiment, the two ends of the first rigid substrate are completely and continuously fused with the first and second flexible membranes to form an integrated sealing structure, with no interface between the two ends of the first rigid substrate and the first flexible membrane, and no interface between the two ends of the first rigid substrate and the second flexible membrane, which is beneficial for further improving the sealing effect.

[0038] In one possible implementation, the liquid-cooled module further includes a second rigid substrate, which divides the liquid-cooling channel of the liquid-cooled module into an inlet channel and an outlet channel. The liquid-cooled outlet is connected to the inlet channel, and the liquid-cooled inlet is connected to the outlet channel. The two ends of the second rigid substrate are integrally sealed with the first flexible membrane and the second flexible membrane, respectively.

[0039] In this embodiment, the two ends of the second rigid substrate are integrated with the first and second flexible membranes using an integrated sealing structure, thereby improving sealing performance and reliability. If leakage occurs in the separation and sealing between the second rigid substrate and the first and second flexible membranes, it will lead to a significant decrease in the performance of the liquid cooling system and its gradual failure.

[0040] In this embodiment, the second rigid substrate divides the flow channels within the cavity into an inlet channel and an outlet channel. Both the inlet and outlet channels are formed by the second rigid substrate, the first rigid substrate, the first flexible membrane, and the second flexible membrane. The inlet channel is in communication with the liquid cooling inlet, and the outlet channel is in communication with the liquid cooling outlet. The separation of the inlet and outlet channels by the second rigid substrate helps to prevent the cooling medium from mixing in the inlet and outlet channels, thus avoiding a reduction in cooling efficiency. Both ends of the second rigid substrate are integrally thermo-sealed with the first and second flexible membranes, which helps to improve the isolation effect between the inlet and outlet channels and further enhances the structural strength of the liquid cooling module.

[0041] Understandably, the inlet and outlet channels are not completely isolated parts. The second rigid matrix only separates the inlet and outlet channels adjacent to the pump. In order to allow the cooling medium to circulate in the liquid-cooled module, the inlet and outlet channels are connected in the area away from the pump.

[0042] In this embodiment, the two ends of the second rigid substrate have discontinuous interfaces with the first and second flexible membranes, respectively. In one embodiment, the two ends of the second rigid substrate are continuously fused with at least a portion of the first and second flexible membranes to form an integrated sealing structure. In another embodiment, the two ends of the second rigid substrate are completely and continuously fused with the first and second flexible membranes to form an integrated sealing structure, with no interface between the two ends of the second rigid substrate and the first flexible membrane, which is beneficial for further improving the sealing effect.

[0043] In one possible implementation, the liquid-cooled module further includes a third rigid substrate, which is distributed within the liquid inlet channel and the liquid outlet channel, and the two ends of the third rigid substrate are integrally sealed with the first flexible membrane and the second flexible membrane, respectively.

[0044] In this embodiment, multiple third rigid substrates divide the inlet channel into multiple interconnected inlet sub-channels and the outlet channel into multiple interconnected outlet sub-channels. The third rigid substrates function as flow guides in both the inlet and outlet channels, reducing flow resistance and preventing eddy current losses, thus enhancing the heat transfer effect of the cooling medium. The third rigid substrates can be strip-shaped or cylindrical. A strip-shaped third rigid substrate facilitates the flow of the cooling medium, while a cylindrical third rigid substrate enhances the mixing of the cooling medium.

[0045] Thirdly, this application provides an electronic device including a drive pump as described in any of the preceding claims, or a liquid cooling module as described in any of the preceding claims, wherein the drive pump and / or liquid cooling module is located within the electronic device or within an accessory of the electronic device.

[0046] Fourthly, this application provides a method for preparing an oscillator for use in any of the above-described drive pumps, comprising the following steps:

[0047] Prepare a piezoelectric sheet and a support sheet, wherein the piezoelectric sheet is made of a piezoelectric material and the support sheet is made of a non-metallic material;

[0048] An electrode paste is prepared between the piezoelectric sheet and the support sheet;

[0049] A certain pressure is applied to clamp the piezoelectric sheet and the support sheet, and the electrode paste between the piezoelectric sheet and the support sheet is squeezed;

[0050] The electrode paste is dried at the first temperature;

[0051] After the pressure is removed, the piezoelectric sheet, the electrode paste, and the support sheet are sintered at a second temperature for a certain period of time to form an integral co-sintered body.

[0052] An electrode layer is formed on the surface of the piezoelectric sheet opposite to the support sheet, and polarized to form an oscillator.

[0053] In one possible implementation, the difference in the coefficients of thermal expansion between the piezoelectric element and the support sheet is less than or equal to 20 × 10⁻⁶. -6 / K.

[0054] In one possible implementation, the coefficients of thermal expansion of the piezoelectric layer, the electrode connection layer, and the support layer are within 4 × 10⁻⁶. -6 Up to 8×10-6 Within the range of / K.

[0055] In one possible implementation, the electrode slurry contains particles made of at least one material selected from silicon carbide, tungsten, diamond, and corundum, the particles having a diameter of less than 10 micrometers, and the mass ratio of the particles in the electrode slurry being in the range of 1% to 3%.

[0056] In one possible implementation, the clamping pressure in the step of applying a certain pressure to clamp the piezoelectric sheet and the support sheet is in the range of 0.1 MPa to 0.3 MPa.

[0057] In one possible implementation, in the step of drying the electrode slurry at a first temperature, the first temperature is in the range of 80°C to 200°C.

[0058] In one possible implementation, during the step of sintering at a second temperature for a certain period of time, the second temperature is in the range of 550°C to 850°C.

[0059] In one possible implementation, the electrode paste comprises silver paste.

[0060] In one possible implementation, the silver content in the silver paste is in the range of 55wt% to 65wt%.

[0061] In one possible implementation, the preparation of the electrode paste between the piezoelectric sheet and the support sheet includes: preparing the electrode paste on the support sheet by screen printing or spraying according to a design pattern, and attaching the side of the support sheet having the electrode paste to the piezoelectric sheet.

[0062] In one possible implementation, the polarization voltage during the polarization step is in the range of 200VDC to 300VDC. Attached Figure Description

[0063] Figure 1 This is an external schematic diagram of the drive pump provided in the embodiments of this application from one perspective;

[0064] Figure 2 This application provides Figure 1 AA cross-section diagram in the middle;

[0065] Figure 3 This is an external schematic diagram of the drive pump provided in an embodiment of this application from another perspective;

[0066] Figure 4 This is a magnified schematic diagram of the electrode layer, piezoelectric layer, electrode connection layer and support layer provided in the embodiments of this application under an electron microscope;

[0067] Figure 5 The embodiments provided in this application Figure 4 Elemental analysis curves along the white cross-section in the middle;

[0068] Figure 6 This is a schematic diagram of the particles disposed in the electrode connection layer provided in the embodiments of this application;

[0069] Figure 7 This is a schematic diagram of an oscillator structure composed of multiple piezoelectric layers provided in the embodiments of this application;

[0070] Figure 8 This is a schematic diagram of the structure of the disc-shaped oscillator provided in the embodiments of this application;

[0071] Figure 9 This is a schematic diagram of the structure of the square-shaped oscillator provided in the embodiments of this application;

[0072] Figure 10 This is a flowchart of an oscillator fabrication method provided in an embodiment of this application;

[0073] Figure 11 This is a schematic diagram of the structure of a liquid cooling module provided in an embodiment of this application;

[0074] Figure 12 This is a schematic diagram of another liquid cooling module provided in the embodiments of this application;

[0075] Figure 13 This is a cross-sectional view of the liquid cooling module provided in the embodiments of this application;

[0076] Figure 14 This is a cross-sectional view of the liquid cooling module provided in the embodiments of this application;

[0077] Figure 15 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0078] The embodiments of this application are described below with reference to the accompanying drawings.

[0079] For ease of understanding, the English abbreviations and related technical terms used in the embodiments of this application will be explained and described below.

[0080] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0081] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0082] It should be understood that the term "and / or" used in this document is merely a description of the same field in the related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0083] It should be understood that the terms "first," "second," etc., used in this application are for distinguishing purposes only and should not be construed as indicating or implying relative importance or order.

[0084] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0085] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can be fixed connections, detachable connections, mating connections or integral connections; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0086] This application provides a drive pump that utilizes the inverse piezoelectric effect of piezoelectric materials, such as the inverse piezoelectric effect of piezoelectric ceramics. By applying a certain voltage to both sides of the piezoelectric ceramic, the piezoelectric ceramic undergoes deformation and vibration under electrical excitation, thereby realizing the mutual conversion of electrical energy and mechanical energy, forming a miniature high- and low-frequency (10-30KHz) adjustable drive pump.

[0087] Piezoelectric ceramics exhibit the piezoelectric effect; when an external force is applied, a concentrated charge is generated on the ceramic surface. When an electrical driving signal is provided to a piezoelectric ceramic, it undergoes electrostriction, resulting in a certain deformation. Piezoelectric ceramics are widely used in surface acoustic wave devices, acoustic wave sensors, resonators, electronic ignition, fluid pumps, motors, and micro-displacement actuators.

[0088] See Figures 1 to 3 As shown, Figure 1 An external schematic diagram of a drive pump is shown from one perspective. Figure 2 It shows Figure 1 AA cross-section diagram in the figure, Figure 3 An external schematic diagram of the drive pump is shown from another perspective. In this embodiment, Figure 1 The illustrated drive pump is in the shape of a disc, but it can also be in other shapes.

[0089] The drive pump 100 includes a housing 110 and a vibrator 120, with the vibrator 120 housed within the housing 110. The housing 110 can be formed into a single unit from multiple layers of materials or structural components through processes such as pressure melting, high-temperature sintering, low-temperature bonding, or low-temperature diffusion welding, thus eliminating the conventional method of using organic adhesives to bond multiple layers of materials or structural components. The housing 110 provides mounting support and protection for the vibrator 120 and the valve 130. Furthermore, the housing 110 has an internal cavity channel that forms the flow channel of the drive pump 100, allowing the medium driven by the pump to circulate within this channel. A portion of the housing 110 forms the sidewall of the flow channel.

[0090] The oscillator 120 includes an electrode layer 124, a piezoelectric layer 121, an electrode connection layer 122, and a support layer 123 stacked sequentially. The different layers within the oscillator 120 have different thicknesses. In some cases, the thicknesses of the piezoelectric layer 121 and the electrode connection layer 122 can be in the nanometer or micrometer range, while the thicknesses of the electrode layer 124 and the support layer 123 can be in the micrometer or millimeter range. The thicknesses of the electrode layer 124, the support layer 123, and the piezoelectric layer 121 can be several times or tens of times the thickness of the electrode connection layer 122.

[0091] In one embodiment, the piezoelectric layer 121 can be made of a material exhibiting the inverse piezoelectric effect. The inverse piezoelectric effect refers to the phenomenon where, when an electric field is applied in the polarization direction of a dielectric, the dielectric undergoes mechanical deformation or stress in a certain direction, and this deformation or stress disappears when the applied electric field is removed. Materials exhibiting the piezoelectric effect include crystals such as quartz and sodium potassium tartrate, as well as polymers. Ceramic materials such as barium titanate, lead titanate, lithium niobate, barium niobate, lithium titanate, and lead zirconate titanate are all materials exhibiting the piezoelectric effect. Piezoelectric polymers can be polyvinylidene fluoride (PVDF).

[0092] In one embodiment, the material used to fabricate the piezoelectric layer 121 includes, but is not limited to, piezoelectric ceramics, and the piezoelectric ceramics constituting the piezoelectric layer 121 can be in sheet form. The piezoelectric ceramics have the inverse piezoelectric effect and can vibrate and deform under the action of an electric field.

[0093] In one embodiment, the support layer 123 serves as the substrate of the oscillator 120, and its shape is the same as or similar to that of the piezoelectric layer 121. The support layer 123 can be made of a material with good structural strength and vibration performance. The support layer 123 and the piezoelectric layer 121 are stacked together, which can increase the structural strength of the piezoelectric layer 121 and ensure that the piezoelectric layer 121 can vibrate stably. Under the working condition of the drive pump 100 operating for a long time and the piezoelectric layer 121 vibrating at high frequency for a long time, the support layer 123 can reduce the structural fatigue of the piezoelectric layer 121 and enhance the service life of the drive pump 100.

[0094] In this embodiment, the piezoelectric layer 121, the electrode connection layer 122, and the support layer 123 are co-sintered bodies. The co-sintered body described in this application refers to a co-sintered body in which atoms or ions migrate and penetrate the contact surface of two components through heating, the contact surface of the two components partially fuses, and after fusion, the pressure and / or temperature is reduced, and the contact surface of the two components is connected into a whole, so that the two components are sintered into a whole.

[0095] Macroscopically, the two components of a co-sintered body are connected as a single unit; when the two components are of similar color, the interface between them is not obvious. (See also...) Figure 4 As shown, Figure 4 This is a magnified schematic diagram of electrode layer 124, piezoelectric layer 121, electrode connection layer 122, and support layer 123 under an electron microscope. Microscopically, electrode layer 124 can be a metal layer sprayed on one side of piezoelectric layer 121 along the Z direction. There is a clear interface between electrode layer 124 and piezoelectric layer 121. Piezoelectric layer 121, electrode connection layer 122, and support layer 123 are made of different materials. After high-temperature sintering, the connection surfaces between the layers partially fuse. The resulting co-sintered body slice has a clear interface due to the different materials. This interface is not obvious under direct macroscopic vision.

[0096] See Figure 5 As shown, Figure 5 for Figure 4 In the image, the elemental analysis curves along the white (Z-direction) cross-section allow for elemental analysis of different structural layers in the longitudinal (Z-direction) region of oscillator 120 using inductively coupled plasma mass spectrometry (ICP-MS), revealing the content of major elements within each layer. (See also...) Figure 5 As shown, Figure 5 The X-axis shown is Figure 4The depth along the Z-axis is represented by the Z-axis, and the elemental composition at different depths is represented by the Y-axis. Around 700 to 800 micrometers, iron is abundant, and this corresponds to the support layer 123 made of metallic materials. Around 800 to 900 micrometers, platinum and lead are abundant, and this corresponds to the piezoelectric layer formed by piezoelectric ceramics. Areas with abundant carbon correspond to layers other than electrode layer 124, piezoelectric layer 121, electrode connection layer 122, and support layer 123. At approximately 100 and 500 micrometers, areas with lower elemental content are interstitial layers filled with air. Figure 5 It can be seen that there are no corresponding elements of the adhesive layer between the support layer 123 and the piezoelectric layer 121. The support layer 123 and the piezoelectric layer 121 are sintered together and a connection interface is formed at about 800 micrometers.

[0097] In one embodiment, the piezoelectric layer 121, the electrode connection layer 122, and the support layer 123 are sintered together to form a co-sintered body, which avoids the use of adhesive layers to connect the piezoelectric layer 121 and the support layer 123. The connection between the piezoelectric layer 121 and the support layer 123 is more robust. Even in environments where the operating temperature exceeds 85 ℃ or is below -40 ℃, the piezoelectric layer 121 and the support layer 123 will not detach during long-term operation, thus improving the performance and reliability of the drive pump 100.

[0098] The piezoelectric layer 121, electrode connection layer 122, and support layer 123 are sintered together to form a co-sintered body. This avoids problems such as softening and expansion of the adhesive layer, shape creep, and decrease in Young's modulus at high and low temperatures, thereby increasing the amplitude and conversion efficiency of the oscillator. Furthermore, the presence of the adhesive layer as a flexible connection mechanism can reduce the energy conversion efficiency of the piezoelectric oscillator during vibration. The direct rigid connection between the piezoelectric layer 121 and the support layer 123 can improve the energy conversion efficiency of the piezoelectric oscillator.

[0099] When the drive pump 100 is used in miniaturized devices (device size <2mm), if the piezoelectric layer 121 and the support layer 123 are bonded with an adhesive layer, the process window for adhesive bonding is small, which affects the yield and reliability of the drive pump 100 product. This application forms a co-sintered body by sintering the piezoelectric layer 121 and the support layer 123, which can effectively improve the yield and reliability of the finished drive pump 100 during preparation.

[0100] In one embodiment, the electrode connection layer 122 is an intermediate layer that is conductive and can connect the piezoelectric layer 121 and the support layer 123. The piezoelectric layer 121 has the inverse piezoelectric effect, and an electrode layer is respectively disposed on both sides of the piezoelectric layer 121. The electrode layers on both sides of the piezoelectric layer 121 provide electrical signals to the piezoelectric layer 121, and the piezoelectric layer 121 vibrates under the drive of the electrical signals.

[0101] The piezoelectric layer 121, the electrode connection layer 122, and the support layer 123 constitute a co-sintered body. The electrode connection layer 122 connects the piezoelectric layer 121 and the support layer 123, and also forms an electrode of the piezoelectric layer 121. The electrode layer 124 is attached to the side of the piezoelectric layer 121 facing away from the support layer 123 to form another electrode of the piezoelectric layer 121.

[0102] In one embodiment, the electrode connection layer 122 can be formed by preparing an electrode paste. A layer of electrode paste is sprayed onto one side of the piezoelectric layer 121 and / or the support layer 123. The electrode paste may contain conductive materials such as silver. The piezoelectric layer 121 and the support layer 123 are then fastened together, with the electrode paste layer sandwiched between the piezoelectric layer 121 and the support layer 123. Through heating and calcination, the electrode paste fuses with the piezoelectric layer 121 and the support layer 123 at the interface to form a co-sintered body of the piezoelectric layer 121, the electrode connection layer 122, and the support layer 123.

[0103] In one embodiment, see Figure 2 As shown, a pump chamber 113 is provided inside the housing 110. The pump chamber 113 is a cavity formed by the partial structure of the housing 110, and the side wall of the pump chamber 113 is the surface of the partial structure of the housing 110.

[0104] The oscillator 120 is located inside the housing 110, and the oscillator 120 is located on one side of the pump chamber 113 to form part of the sidewall of the pump chamber 113; see reference. Figure 2 As shown, the oscillator 120 is located on one side of the pump chamber 113 in the Z direction, forming the side wall of the pump chamber 113 along the Z direction.

[0105] The housing 110 has a first channel 111 and a second channel 112. The first channel 111 and the second channel 112 can be through holes provided on the housing 110, or channels provided on the housing 110 with a certain flow length. The first channel 111, the pump chamber 113 and the second channel 112 are connected in sequence to form a flow channel. When the vibrator 120 vibrates, it can drive the medium to flow in the flow channel. For example, under the drive of the vibrator 120, the medium can enter the pump chamber 113 from the first channel 111, pass through the pump chamber 113 and flow out from the second channel 112 to drive the pump, thus realizing the flow of the medium.

[0106] In one embodiment, the drive pump includes at least two valves 130, which are located in a first channel 111 and a second channel 112, respectively. Both the first channel 111 and the second channel 112 are equipped with valves 130. The valve 130 in the first channel 111 can be an inlet valve, and the valve 130 in the second channel 112 can be an outlet valve.

[0107] The inlet valve can connect the first channel 111 to the pump chamber 113; when the inlet valve is open, the first channel 111 is connected to the pump chamber 113; when the inlet valve is closed, the first channel 111 is isolated from the pump chamber 113.

[0108] The outlet valve can connect the second channel 112 to the pump chamber 113; when the outlet valve is open, the second channel 112 is connected to the pump chamber 113; when the outlet valve is closed, the second channel 112 is isolated from the pump chamber 113.

[0109] The medium can first enter the pump chamber 113 through the inlet valve in the first channel 111, and then be discharged from the outlet valve in the second channel 112, so as to realize the flow of the medium in the flow channel.

[0110] In one possible implementation, the difference in the coefficients of thermal expansion between the piezoelectric layer 121 and the support layer 123 can be less than or equal to 20 × 10⁻⁶. -6 / K. Here, the thermal expansion coefficient refers to the change in length of an object caused by a unit temperature change under isobaric conditions (where p is constant). This length change can occur in one or more directions.

[0111] During operation, the piezoelectric oscillator 120 will generate millions or even billions of repeated vibrations. If the various components of the oscillator 120, such as the piezoelectric layer 121 and the support layer 123, have different and significantly different coefficients of thermal expansion, and if there are different phenomena such as repeated thermal stress, adhesive creep, and expansion of microbubbles in the adhesive under low pressure, microcracks may appear in the various components of the oscillator 120. Furthermore, moisture can be absorbed within the microcracks. Water expands, contracts, vaporizes, and condenses under the influence of temperature, accelerating and enlarging the crack development, disrupting the inherent resonant frequency of the piezoelectric oscillator, and causing a gradual decline in performance.

[0112] In this embodiment, the piezoelectric layer 121 and the support layer 123 have the same or similar coefficients of thermal expansion. Specifically, the difference in their coefficients of thermal expansion can be less than or equal to 20 × 10⁻⁶. -6 / K. After the piezoelectric layer 121 and the support layer 123 are sintered into an integral structure, it can prevent the oscillator 120 from undergoing severe warping deformation during the high-temperature sintering process, prevent large internal stress between the piezoelectric layer 121 and the support layer 123 of the oscillator 120, and improve the piezoelectric performance of the piezoelectric layer 121.

[0113] In one embodiment, the piezoelectric layer 121 may be made of piezoelectric ceramic material, and the material of the support layer 123 may be an inorganic non-metallic material with a thermal expansion coefficient similar to that of the piezoelectric ceramic, such as ceramic and glass.

[0114] In one embodiment, the difference in the coefficients of thermal expansion between the materials used to fabricate the electrode connection layer 122 and the piezoelectric layer 121 can be less than or equal to 20 × 10⁻⁶. -6 / K, and / or, the difference in the coefficients of thermal expansion of the materials used to fabricate the electrode connection layer 122 and the support layer 123 can be less than or equal to 20 × 10⁻⁶. -6 / K.

[0115] In one possible implementation, the coefficients of thermal expansion of both the piezoelectric layer 121 and the support layer 123 are 4 × 10⁻⁶. -6 Up to 8×10 -6 Within the range of / K. The piezoelectric layer 121 can be made of materials with piezoelectric properties, such as piezoelectric ceramics, whose coefficient of thermal expansion is within 4×10⁻⁶. -6 Up to 8×10 -6 Within the range of / K; the support layer 123 can be made with a thermal expansion coefficient of 4×10. -6 Up to 8×10 -6 Made of materials such as ceramics or glass within the range of / K.

[0116] In one embodiment, the electrode connection layer 122 may contain silver, with an overall coefficient of thermal expansion of 4 × 10⁻⁶. -6 Up to 8×10 -6 Within the range of / K.

[0117] In one possible implementation, see [reference] Figure 6 As shown, Figure 6 A schematic diagram of particles disposed in the electrode connection layer is shown. The electrode connection layer 122 contains particles 125, wherein the hardness of the particles 125 is greater than the hardness of any one of the piezoelectric layer 121, the electrode connection layer 122, and the support layer 123. The hardness of the particles 125 may be greater than the hardness of the piezoelectric layer 121; and / or, the hardness of the particles 125 may be greater than the hardness of the electrode connection layer 122; and / or, the hardness of the particles 125 may be greater than the hardness of the support layer 123.

[0118] See Figure 6 The enlarged schematic diagram shows that the interface between the piezoelectric layer 121 and the electrode connection layer 122 is not smooth, and the interface between the support layer 123 and the electrode connection layer 122 is also not smooth, but has certain pits (it should be noted that...). Figure 6 The pit shown is arc-shaped, but it can also be other shapes (the shape of the pit is not limited). Some particles 125 penetrate into the pit, increasing the connection strength between the piezoelectric layer 121, the electrode connection layer 122 and the support layer 123.

[0119] In one embodiment, the hardness of particle 125 is greater than that of piezoelectric layer 121, electrode connection layer 122 and support layer 123. The hardness of particle 125 can be greater than or equal to 120hv, where hv is the unit of Vickers hardness. Vickers hardness refers to the Vickers hardness value of a diamond pyramid indenter with a 136-degree angle between its opposite faces, which is pressed into the surface of the test sample under a specified load F, held for a certain time and then the load is removed. The diagonal length d of the indentation is measured, the surface area of ​​the indentation is calculated, and finally the average pressure on the surface area of ​​the indentation is calculated.

[0120] This application incorporates hard particles 125 within the electrode connection layer 122. During the fabrication of the oscillator 120, particles of a certain hardness (which can be in powder form) can be doped into the electrode connection layer 122. In one embodiment, the particles can be ceramic powder or metal powder. The hard powder is rigid and, after the electrode connection layer 122 is fabricated, is pressed and embedded into the surface of the support layer 123 and / or the piezoelectric layer 121, which is made of a ceramic material. Together with the piezoelectric layer 121 and the support layer 123, they form a riveted structure when heated to a glassy state. This improves the structural strength of the oscillator 120 and enhances the connection strength between the piezoelectric layer 121, the electrode connection layer 122, and the support layer 123 within the oscillator 120.

[0121] In one embodiment, the particles 125 may be made of at least one material such as silicon carbide, tungsten, diamond, and corundum. In an oscillator 120, the material used to make the particles 125 may be a single material, such as silicon carbide alone, or it may be a mixture of particles made of multiple materials, such as a mixture of silicon carbide particles, tungsten particles, and corundum particles.

[0122] In one embodiment, the particle size D90 of particle 125 is less than or equal to 10 micrometers. A single integral electrode connection layer 122 contains multiple particles 125, and the particle sizes of these multiple particles 125 may be unequal. It should be noted that D90 refers to the particle size corresponding to 90% of the total particle size distribution of all particles 125 in an integral electrode connection layer 122; physically, it means that particles with a diameter smaller than (or greater than) D90 account for 90% of the total particles.

[0123] In one possible implementation, the piezoelectric layer 121 may have multiple layers, which are stacked together, and adjacent piezoelectric layers 121 are connected by an electrode connection layer 122. See also... Figure 7 As shown, Figure 7A schematic diagram of an oscillator structure composed of multiple piezoelectric layers is shown. This embodiment uses a three-layer piezoelectric layer 121 as an example. In the multilayer piezoelectric layer 121, an electrode layer 124 is attached to the outer piezoelectric layer 121a on the side facing away from the support layer 123, along with an electrode layer 124. The electrode layer 124 and the electrode connection layer 122a constitute the electrodes on both sides of the piezoelectric layer 121a. The electrode connection layer 122a and the electrode connection layer 122b constitute the electrodes on both sides of the piezoelectric layer 121b. The electrode connection layer 122b and the electrode connection layer 122c constitute the electrodes on both sides of the piezoelectric layer 121c.

[0124] Under the excitation of the electrodes on both sides of each electrode connection layer 122, the multilayer piezoelectric layer 121 vibrates in the same direction and at the same frequency, which can improve the vibration intensity of the oscillator and improve the driving ability of the pump to drive the circulating medium.

[0125] In one possible implementation, see [reference] Figure 1 and Figure 8 As shown, Figure 8 It shows and Figure 1 Similarly, the schematic diagram shows the disc-shaped oscillator structure in the disc-shaped drive pump. The drive pump as a whole can be cylindrical (or plate-shaped, with a diameter greater than its height), and the shape of the oscillator 120 can match the shape of the drive pump. The oscillator 120 can be disc-shaped. In this shape, the diameter of the support layer 123 is in the range of 4 mm to 35 mm, and the thickness of the support layer 123 is in the range of 0.04 mm to 3 mm, where the thickness refers to the height in the Z direction; the diameter of the piezoelectric layer 121 is in the range of 4 mm to 35 mm, and the thickness of the piezoelectric layer 121 is in the range of 0.04 mm to 2 mm, where the thickness refers to the height in the Z direction.

[0126] In one possible implementation, see [reference] Figure 9 As shown, Figure 9 A schematic diagram of a square-shaped oscillator is shown. The overall driving pump can be in the shape of a square column (also called a square plate, with equal or similar length and width, and a height less than its length and width). The shape of the oscillator 120 can match the shape of the driving pump, and the oscillator 120 is square-shaped. In this shape, the length and width of the piezoelectric layer 121 are both in the range of 4 mm to 35 mm, and the thickness of the piezoelectric layer 121 is in the range of 0.04 mm to 2 mm, where the thickness refers to the height in the Z direction; the length and width of the support layer 123 are in the range of 5 mm to 35 mm, and the thickness of the support layer 123 is in the range of 0.04 mm to 3 mm.

[0127] This application also provides a method for preparing an oscillator, used to prepare an oscillator for driving a pump in any of the above embodiments, see reference. Figure 10 As shown, it includes the following steps:

[0128] Step S100: Prepare the piezoelectric sheet and the support sheet;

[0129] The piezoelectric element is made of piezoelectric material, which can be piezoelectric ceramic. The support plate is made of ceramic (ceramic with non-piezoelectric properties) or glass. The piezoelectric element and the support plate can have the same shape, either circular or square. The support plate can be larger than the piezoelectric element.

[0130] Step S200: Prepare an electrode paste layer on the piezoelectric sheet and / or support sheet;

[0131] An electrode paste layer can be prepared on the piezoelectric sheet and / or support sheet by screen printing or spraying. The electrode paste can be silver paste.

[0132] In step S300, a certain pressure is applied to clamp the piezoelectric sheet and the support sheet, and the electrode paste between the piezoelectric sheet and the support sheet is squeezed.

[0133] This embodiment takes the formation of an electrode paste layer on a piezoelectric sheet as an example. The side of the piezoelectric sheet with the electrode paste layer is laminated with a support sheet. A clamping force is applied to both sides of the laminated piezoelectric sheet and support sheet. The direction of the clamping force can be perpendicular to the piezoelectric sheet and support sheet (the piezoelectric sheet and support sheet can be parallel or nearly parallel), and the clamping pressure can be in the range of 0.1 MPa to 0.3 MPa. Through clamping, the electrode paste can be tightly bonded to both the piezoelectric sheet and the support sheet.

[0134] Step S400: Dry the electrode slurry at a first temperature;

[0135] While the piezoelectric sheet and the support sheet are held in a clamped state, the material is heated to a first temperature and maintained for a certain period of time until the electrode paste layer between the piezoelectric sheet and the support sheet is dried.

[0136] The first temperature can be in the range of 80℃ to 200℃.

[0137] In step S500, the pressure is released, and the material is sintered at a second temperature for a certain time to form an integral co-sintered body consisting of the piezoelectric sheet, electrode paste, and support sheet.

[0138] The second temperature can be in the range of 550℃ to 850℃, during which the piezoelectric sheet, electrode paste layer and support sheet are sintered and fused at the connection interface to form an integrated co-sintered body.

[0139] In step S600, an electrode layer is formed on the surface of the piezoelectric sheet facing away from the support sheet, and the sheet is polarized to form an oscillator. In one embodiment, the polarization voltage can be in the range of 200VDC to 300VDC.

[0140] After the piezoelectric sheet, electrode paste layer and support sheet are sintered to form a co-sintered body, the temperature is lowered to room temperature, and an electrode layer is formed on the surface of the piezoelectric sheet away from the support sheet. The electrode layer is polarized to form an oscillator with a sequentially stacked structure of support layer-electrode connection layer-piezoelectric layer-electrode layer.

[0141] In one possible implementation, the electrode paste contains particles 125, which may be made of at least one material such as silicon carbide, tungsten, diamond, and corundum, to form an electrode bonding layer 122 containing hard particles 125. In an oscillator 120, the material used to make the particles 125 may be a single material, such as silicon carbide alone, or it may be a mixture of particles made of multiple materials, such as a mixture of silicon carbide particles, tungsten particles, and corundum particles.

[0142] The hardness of particle 125 is greater than that of any one of the piezoelectric layer 121, electrode connection layer 122, and support layer 123. The hardness of particle 125 may be greater than that of piezoelectric layer 121; and / or, the hardness of particle 125 may be greater than that of electrode connection layer 122; and / or, the hardness of particle 125 may be greater than that of support layer 123.

[0143] In one embodiment, the hardness of particle 125 is greater than that of piezoelectric layer 121, electrode connection layer 122 and support layer 123. The hardness of particle 125 can be greater than or equal to 120hv, where hv is the unit of Vickers hardness. Vickers hardness refers to the Vickers hardness value of a diamond pyramid indenter with a 136-degree angle between its opposite faces, which is pressed into the surface of the test sample under a specified load F, held for a certain time and then the load is removed. The diagonal length d of the indentation is measured, the surface area of ​​the indentation is calculated, and finally the average pressure on the surface area of ​​the indentation is calculated.

[0144] In one embodiment, when the particles 125 are formed from multiple materials, the particles 125 made from different materials have different hardnesses. In this embodiment, the hardness of the particles 125 is the average of the hardnesses of the different materials. For example, the particles 125 are composed of silicon carbide and corundum, and the hardness of the particles 125 is the average of the hardness of silicon carbide and the hardness of corundum.

[0145] This application incorporates hard particles 125 within the electrode connection layer 122. During the fabrication of the oscillator 120, particles of a certain hardness (which can be in powder form) can be doped into the electrode connection layer 122. In one embodiment, the particles can be ceramic powder or metal powder. The hard powder is rigid and, after the electrode connection layer 122 is fabricated, is pressed and embedded into the surface of the support layer 123 and / or the piezoelectric layer 121, which is made of a ceramic material. Together with the piezoelectric layer 121 and the support layer 123, they form a riveted structure when heated to a glassy state. This improves the structural strength of the oscillator 120 and enhances the connection strength between the piezoelectric layer 121, the electrode connection layer 122, and the support layer 123 within the oscillator 120.

[0146] In one embodiment, the silver content in the silver paste can be in the range of 55wt% to 65wt%.

[0147] In one possible implementation, the difference in the coefficients of thermal expansion between the piezoelectric element and the support sheet is less than or equal to 20 × 10⁻⁶. -6 / K, so that the oscillator 120 will not undergo severe warping deformation during the high-temperature sintering process, and prevent large internal stress between the piezoelectric layer 121 and the support layer 123 of the oscillator 120, thereby improving the piezoelectric performance of the piezoelectric layer 121.

[0148] In one embodiment, the thermal expansion coefficient of the materials used for the piezoelectric sheet and the support sheet can be 4 × 10⁻⁶. -6 Up to 8×10 -6 In the range of / K. For example, piezoelectric elements can be made of piezoelectric ceramics, whose coefficient of thermal expansion is in the range of 4 × 10⁻⁶. -6 Up to 8×10 -6 Within the range of / K, the support sheet can be made of materials with a thermal expansion coefficient of 4×10 -6 Up to 8×10 -6 Made of ceramic or glass within the range of / K.

[0149] This application also provides a liquid cooling module, see reference. Figure 11 As shown, Figure 11 A schematic diagram of a liquid cooling module is shown, including the drive pump described in any of the above embodiments, and also including a liquid cooling module 200. The liquid cooling module 200 includes a pipe 240, and a liquid cooling channel 241 is provided in the pipe 240. The liquid cooling channel 241 has a liquid cooling inlet 212 and a liquid cooling outlet 211. The liquid cooling outlet 211 can be connected to the first channel 111, and the liquid cooling inlet 212 can be connected to the second channel 112.

[0150] Pipe 240 can be made of a metal material with good thermal conductivity, such as copper or aluminum.

[0151] The liquid-cooled module 200 can be mounted on the heat-generating device of the electronic device and is attached to or close to the heat-generating device. A shielding device, graphite sheet, graphene film, or thermal interface material can be provided between the heat-generating device and the liquid-cooled module. The drive pump 100 drives the refrigerant to flow in the pipe 240 of the liquid-cooled module 200. The refrigerant circulates in the pump chamber 113 of the drive pump 100 and the liquid-cooled channel 241 of the liquid-cooled module 200 to reduce the temperature of the heat-generating device.

[0152] It should be noted that the plane containing the liquid cooling channel 241 of the liquid cooling module 200 can be perpendicular to the plane containing the entire drive pump 100, for example... Figure 11 In the process, the pump chamber 113 of the drive pump 100 can be considered to extend along the XY plane (Y direction not shown), and the liquid cooling channel 241 can be considered to extend along the XZ plane.

[0153] In one embodiment, the liquid cooling channel 241 of the liquid cooling module 200 can also extend along the XY plane so that both the liquid cooling channel 241 and the drive pump 100 can be attached to the plane to be cooled.

[0154] In one possible implementation, see [reference] Figure 12 As shown, the liquid-cooled module 200 includes a liquid-cooled outlet 211 and a liquid-cooled inlet 212. The liquid-cooled outlet 211 is used to communicate with the first channel 111 of the drive pump 100, and the liquid-cooled inlet 212 is used to communicate with the second channel 112 of the drive pump 100. A portion of the liquid-cooled module 200 surrounding the liquid-cooled outlet 211 and a portion of the housing 110 surrounding the first channel 111 form an integrated sealed structure. Similarly, a portion of the liquid-cooled module 200 surrounding the liquid-cooled inlet 212 and a portion of the housing 110 surrounding the second channel 112 form an integrated sealed structure. In engineering applications, adhesive can be applied to the pump and liquid-cooled module to enhance structural positioning and strength, but this does not seal the welded surfaces.

[0155] The drive pump 100, serving as the power source for the liquid cooling module, provides the power for the flow and circulation of the cooling medium in the liquid cooling module 200, achieving active liquid cooling and thus providing sustained heat dissipation. Compared to passive liquid cooling, active liquid cooling can adjust the speed of the drive pump 100 as needed to achieve optimal heat dissipation, while passive liquid cooling can only passively follow changes in device temperature. Therefore, active liquid cooling offers better adjustability. It should be noted that the liquid cooling outlet 211 is connected to the first channel 111 (pump inlet), but this does not mean that the liquid cooling outlet 211 and the first channel 111 (pump inlet) are always connected. It only indicates that under certain conditions, the cooling medium can flow from the liquid cooling outlet 211 into the first channel 111 (pump inlet). The relationship between the liquid cooling inlet 212 and the second channel 112 (pump outlet) is similar.

[0156] In this embodiment, the portion of the liquid-cooled module 200 surrounding the liquid-cooled outlet 211 and the portion of the housing 110 surrounding the first channel 111 (pump inlet) form an integrated sealed structure. Similarly, the portion of the liquid-cooled module 200 surrounding the liquid-cooled inlet 212 and the portion of the housing 110 surrounding the second channel 112 (pump outlet) form an integrated sealed structure. Here, "forming an integrated sealed structure" means that there is no continuous interface between the two due to mutual fusion and penetration. The periphery of the liquid-cooled outlet 211 refers to the adjacent area surrounding the liquid-cooled outlet 211. If screws are used to fix the liquid-cooled module 200 and the housing 110, since the liquid-cooled module 200 and the housing 110 are separate devices in this case, the boundary between them is continuous. Compared to screw fixing, the integrated sealed structure in this embodiment cannot be separated unless damaged by external force, while with screw connection, the housing 110 can be separated from the liquid-cooled module 200 simply by removing the screws.

[0157] The screw-connection method, due to limitations in assembly precision and material resilience, makes quality control difficult. This can lead to cooling medium leakage during actual use, affecting heat dissipation efficiency and damaging internal components. Furthermore, a base is typically required in the drive pump 100, with screws passing through the base and liquid-cooled module 200 for fixation. In contrast, the integrated sealing structure in this embodiment fuses a portion of the liquid-cooled module 200 around the liquid outlet 211 with a portion of the housing 110 around the first channel 111 (pump inlet), resulting in a tighter connection and improved sealing between the housing 110 and the liquid-cooled module 200. This eliminates the need for an additional base, simplifying the liquid-cooled module structure, reducing costs and manufacturing complexity, and enabling an ultra-thin design. Furthermore, the liquid cooling module provided in this application embodiment can be applied to electronic devices. When the electronic device is subjected to external force (such as falling to the ground and colliding with the ground), the screw fixing method may cause the connection between the housing 110 and the liquid cooling module 200 to become loose, or the O-ring to shift and the local seal to be not tight. The integrated sealing structure makes it less likely for the housing 110 and the liquid cooling module 200 to undergo relative displacement, thereby improving the stability of the overall structure of the liquid cooling module and increasing the service life of the electronic device.

[0158] In this application, the liquid cooling module is configured such that: First, the vibrator 120 in the drive pump 100 does not contain a connecting adhesive layer, thus enhancing the working strength and service life of the vibrator 120. This places higher demands on the service life of the liquid cooling module. Furthermore, the area around the liquid cooling outlet 211 in the liquid cooling module 200 and the area around the first channel 111 (pump inlet) in the housing 110 form an integrated sealing structure. Similarly, the area around the liquid cooling inlet 212 in the liquid cooling module 200 and the area around the second channel 112 (pump outlet) in the housing 110 also form an integrated sealing structure. Compared to screw fixing, this integrated sealing structure provides better sealing, preventing cooling medium leakage under high-intensity and long-term operating conditions, thereby avoiding reduced cooling medium heat dissipation efficiency and protecting the device from damage.

[0159] Secondly, by using the drive pump 100 to provide power for the flow and circulation of the cooling medium, active heat dissipation is achieved in the liquid cooling module. Compared with passive liquid cooling, this can more effectively reduce the temperature of the device and improve heat dissipation efficiency.

[0160] In one embodiment, the centers of the liquid cooling outlet 211 and the first channel 111 (pump inlet) are aligned along the thickness Z direction of the liquid cooling module, and the projections of the areas enclosed by the peripheral walls of the liquid cooling outlet 211 and the first channel 111 (pump inlet) overlap along the thickness Z direction. This design helps to reduce the flow resistance of the cooling medium when passing through the liquid cooling outlet 211 and the first channel 111 (pump inlet), thereby improving cooling efficiency.

[0161] In one embodiment, the centers of the liquid cooling inlet 212 and the second channel 112 (pump outlet) are aligned along the thickness Z direction of the liquid cooling module, and the projections of the areas enclosed by the peripheral walls of the liquid cooling inlet 212 and the second channel 112 (pump outlet) overlap along the thickness Z direction. This design helps to reduce the flow resistance of the cooling medium when passing through the liquid cooling inlet 212 and the second channel 112 (pump outlet), thereby improving cooling efficiency.

[0162] Please continue reading. Figure 12 In one embodiment, the liquid cooling module 200 includes a first flexible membrane 210, a liquid cooling outlet 211 and a liquid cooling inlet 212 disposed on the first flexible membrane 210, and the pump bottom wall 114 and a portion of the first flexible membrane 210 surrounding the liquid cooling outlet 211 and the liquid cooling inlet 212 are an integrated sealing structure.

[0163] In this embodiment, the fixed connection between the liquid-cooled module 200 and the drive pump 100 is actually the fixed connection between the first flexible membrane 210 and the pump bottom wall 114. The portions of the first flexible membrane 210 located around the liquid-cooled outlet 211 and the liquid-cooled inlet 212 are integrally sealed with the pump bottom wall 114. Since the first flexible membrane 210 and the pump bottom wall 114 are made of the same or similar materials, the difficulty of hot pressing is relatively small, which is conducive to forming an integral sealing structure.

[0164] In this embodiment, the first flexible membrane 210 and the pump bottom wall 114 form a discontinuous interface. (See also...) Figure 13 , Figure 13 This is a cross-sectional view of the liquid cooling module provided in an embodiment of this application. In one embodiment, at least a portion of the first flexible membrane 210 and the pump bottom wall 114 are continuously fused together to form an integrated sealing structure. Please refer to... Figure 14 , Figure 14 This is a cross-sectional view of a liquid cooling module provided in another embodiment of this application. In another embodiment, the portion of the first flexible membrane 210, excluding the liquid cooling outlet 211 and the liquid cooling inlet (not shown in the figure), is an integrated sealing structure with the pump bottom wall 114, with no interface between them. This sealing interface is preferred, as it has stronger flexibility, sealing performance, and impact resistance. However, it is difficult to perfectly manufacture and achieve in engineering, and is more often a partially continuous fused interface with micro-air gaps or discontinuous non-welded areas between the interfaces.

[0165] In some embodiments, to improve the connection stability between the drive pump 100 and the liquid cooling module 200, adhesive bonding can be used at the connection point between the drive pump 100 and the liquid cooling module 200 to enhance sealing performance and reliability.

[0166] Please continue reading. Figure 12 In one embodiment, the liquid-cooled module 200 further includes a second flexible membrane 220 and a first rigid substrate 230 located between the first flexible membrane 210 and the second flexible membrane 220. The first flexible membrane 210, the second flexible membrane 220, and the first rigid substrate 230 enclose a liquid-cooling channel 241 of the liquid-cooled module 200. The two ends of the first rigid substrate 230 are integrally sealed with the first flexible membrane 210 and the second flexible membrane 220, respectively. In one embodiment, if leakage occurs in the seal between the first rigid substrate 230 and the first flexible membrane 210 and the second flexible membrane 220, it will lead to a rapid decline in system performance and rapid failure. The two interface materials of the sealing weld between the first rigid substrate 230 and the first flexible membrane 210 and the second flexible membrane 220 are the same or similar. Using welding methods without solder paste or other third materials, such as thermocompression bonding, hot melt welding, ultrasonic welding, and ultra-frequency welding, can improve the sealing performance and reliability between the first rigid substrate 230 and the first flexible membrane 210 and the second flexible membrane 220.

[0167] In this embodiment, the first flexible membrane 210 and the second flexible membrane 220 are flexible and have good bending performance, making them suitable for situations where the liquid-cooled module 200 needs to be bent. A first rigid substrate 230 is disposed between the first flexible membrane 210 and the second flexible membrane 220. The two ends of the first rigid substrate 230 are used to support the first flexible membrane 210 and the second flexible membrane 220, which helps to improve the overall strength of the liquid-cooled module 200 in the thickness Z direction. The cooling medium flows in the liquid-cooling channel 241 formed by the first flexible membrane 210, the second flexible membrane 220, and the first rigid substrate 230. In this design, the two ends of the first rigid substrate 230 are respectively integrated with the first flexible membrane 210 and the second flexible membrane 220 as an integrated sealing structure, which can improve the sealing performance of the liquid-cooling channel 241 and prevent the cooling medium from leaking in the liquid-cooling channel 241.

[0168] In this embodiment, the two ends of the first rigid substrate 230 have discontinuous interfaces with the first flexible membrane 210 and the second flexible membrane 220, respectively. In one embodiment, the two ends of the first rigid substrate 230 and at least a portion of the first flexible membrane 210 and the second flexible membrane 220 are continuously fused together to form an integrated sealing structure. In another embodiment, the two ends of the first rigid substrate 230 are completely and continuously fused with the first flexible membrane 210 and the second flexible membrane 220 to form an integrated sealing structure, with no interface between the two ends of the first rigid substrate 230 and the first flexible membrane 210, and no interface between the two ends of the first rigid substrate 230 and the second flexible membrane 220.

[0169] Please continue reading. Figure 12 In one embodiment, the liquid-cooled module 200 further includes a second rigid substrate 250. The second rigid substrate 250 divides the liquid-cooling channel 241 of the liquid-cooled module 200 into an inlet channel 242 and an outlet channel 243. The liquid-cooled outlet 211 is connected to the inlet channel 242, and the liquid-cooled inlet 212 is connected to the outlet channel 243. The two ends of the second rigid substrate 250 are integrated with the first flexible membrane 210 and the second flexible membrane 220, respectively, forming an integrated sealing structure. If leakage occurs in the division and sealing between the second rigid substrate 250 and the first flexible membrane 210 and the second flexible membrane 220, it will lead to a significant decrease in the performance of the liquid-cooling system and its gradual failure. In this embodiment, the two ends of the second rigid substrate 250 are integrated with the first flexible membrane 210 and the second flexible membrane 220, respectively, to improve sealing performance and reliability.

[0170] In this embodiment, the second rigid substrate 250 is used to divide the flow channel of the liquid cooling channel 241 into an inlet flow channel 242 and an outlet flow channel 243. Both the inlet flow channel 242 and the outlet flow channel 243 are formed by the second rigid substrate 250, the first rigid substrate 230, the first flexible membrane 210, and the second flexible membrane 220. The inlet flow channel 242 is in communication with the liquid cooling outlet 211, and the outlet flow channel 243 is in communication with the liquid cooling inlet 212. The separation of the inlet flow channel 242 and the outlet flow channel 243 by the second rigid substrate 250 helps to prevent the cooling medium in the inlet flow channel 242 and the outlet flow channel 243 from mixing, thereby reducing the cooling efficiency. Both ends of the second rigid substrate 250 are integrally heat-sealed with the first flexible membrane 210 and the second flexible membrane 220, which helps to improve the isolation effect between the liquid inlet channel 242 and the liquid outlet channel 243, and can further improve the structural strength of the liquid cooling module 200.

[0171] Understandably, the inlet channel 242 and the outlet channel 243 are not completely isolated parts. The second rigid base 250 merely separates the inlet channel 242 and the outlet channel 243 adjacent to the drive pump 100. However, in order to allow the cooling medium to circulate within the liquid-cooled module 200, the inlet channel 242 and the outlet channel 243 are connected in a region away from the drive pump 100. For example, in Figure 15 In the liquid cooling module shown, the inlet channel 242 and the outlet channel 243 are connected in a relatively narrow end region.

[0172] In this embodiment, the two ends of the second rigid substrate 250 have discontinuous interfaces with the first flexible membrane 210 and the second flexible membrane 220, respectively. In one embodiment, the two ends of the second rigid substrate 250 are continuously fused with at least a portion of the first flexible membrane 210 and the second flexible membrane 220 to form an integrated sealing structure. In another embodiment, the two ends of the second rigid substrate 250 are completely continuously fused with the first flexible membrane 210 and the second flexible membrane 220 to form an integrated sealing structure, with no interface between the two ends of the second rigid substrate 250 and the first flexible membrane 210, and no interface between the two ends of the second rigid substrate 250 and the second flexible membrane 220.

[0173] Please continue reading. Figure 12 In one embodiment, the liquid cooling module 200 further includes a third rigid substrate 260, which is distributed within the liquid inlet channel 242 and the liquid outlet channel 243. The two ends of the third rigid substrate 260 are integrally sealed with the first flexible membrane 210 and the second flexible membrane 220, respectively. If leakage occurs in the separation and sealing between the third rigid substrate 260 and the first flexible membrane 210 and the second flexible membrane 220, it will cause a slight decrease in the performance of the liquid cooling system, but will not cause the entire liquid cooling system to fail.

[0174] In this embodiment, multiple third rigid substrates 260 divide the inlet channel 242 into multiple interconnected inlet sub-channels and the outlet channel 243 into multiple interconnected outlet sub-channels. The third rigid substrates 260 serve as guides in both the inlet and outlet channels 242 and 243, reducing flow resistance and avoiding eddy current losses, thus enhancing the heat transfer effect of the cooling medium. The third rigid substrates 260 can be strip-shaped or cylindrical. A strip-shaped third rigid substrate 260 facilitates the flow of the cooling medium, while a cylindrical third rigid substrate 260 enhances the mixing of the cooling medium.

[0175] Please continue reading. Figure 15 In one embodiment, since the third rigid substrate 260 serves both as a guide and a mixer, the third rigid substrate 260 can be placed in the region where the width of the liquid inlet channel 242 or the liquid outlet channel 243 changes abruptly, in the region where the flow direction of the cooling medium changes abruptly, and in the region adjacent to the liquid cooling inlet.

[0176] In this embodiment, the two ends of the third rigid substrate 260 have discontinuous interfaces with the first flexible membrane 210 and the second flexible membrane 220, respectively. In one embodiment, the two ends of the third rigid substrate 260 and at least a portion of the first flexible membrane 210 and the second flexible membrane 220 are continuously fused together to form an integrated sealing structure. In another embodiment, the two ends of the third rigid substrate 260 are completely and continuously fused with the first flexible membrane 210 and the second flexible membrane 220 to form an integrated sealing structure, with no interface between the two ends of the third rigid substrate 260 and the first flexible membrane 210, and no interface between the two ends of the second rigid substrate 250 and the second flexible membrane 220.

[0177] This application also provides a specific embodiment of an electronic device, including the drive pump 100 described in any of the above embodiments, and / or including the liquid cooling module described in any of the above embodiments, wherein the liquid cooling module is located within the electronic device 300 or within an accessory of the electronic device 300.

[0178] Please see Figure 15 As shown, Figure 15 This is a schematic diagram of the structure of the electronic device 300 provided in this application. In one embodiment, the electronic device 300 includes a housing 310 and electronic functional components 320 and a liquid cooling module located within the housing 310. The liquid cooling module is located inside the housing 310, between the heat-generating device and the housing or screen.

[0179] In this embodiment, for example, the electronic device 300 can be an electronic product such as a mobile phone, tablet computer, laptop computer, and wearable device. The electronic functional components 320 in the electronic device 300 include, but are not limited to, a processor, internal memory, charging management module, power management module, battery, antenna, communication module, camera, audio module, speaker, receiver, microphone, sensor module, motor, and indicators. The electronic device 300 may have more or fewer electronic functional components 320 than described above. Various electronic functional components 320 can be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits. The electronic functional components 320 release heat when in operation. When the internal temperature of the electronic device 300 is too high, it will affect the working efficiency of the electronic functional components 320 and the lifespan of the electronic device 300. Therefore, a liquid cooling module is needed to control the temperature rise of the electronic functional components 320.

[0180] In one embodiment, the liquid cooling module is located between the housing 310 and the electronic functional components 320.

[0181] exist Figure 15 In the illustrated embodiment, the electronic device 300 is a foldable device, having both a flattened state and a folded state. The electronic device 300 includes a first non-foldable portion 330, a foldable portion 340, and a second non-foldable portion 350. The second non-foldable portion 350 can be folded towards the first non-foldable portion 330 via the foldable portion 340. The liquid-cooled module can be sequentially divided along the length Y direction into a first liquid-cooled film stationary area 280, a liquid-cooled film bending area 270, and a second liquid-cooled film stationary area 290. When the electronic device 300 is in the folded state, the liquid-cooled module 200 folds through the liquid-cooled film bending area 270, causing the liquid-cooled film bending area 270 to bend, while the first liquid-cooled film stationary area 280 and the second liquid-cooled film stationary area 290 do not deform. If the folding machine has three or more N folding screens, there can be at most three or N liquid-cooled modules and 2 or N-1 bending areas; and at least 2 liquid-cooled films and 1 bending area, where N is an integer greater than 2. For straight-board designs, there can be no bends, and one or more liquid cooling films can be used. Depending on the performance requirements of the liquid cooling system, one or more liquid pumps can be installed, which can be connected in parallel, series, or mixed connections, and can be placed adjacently or non-adjacently, such as near the motherboards of different screens. Pumps may experience pressure fluctuations, 2-50µm micro-vibrations, and some noise during operation. Flexible liquid cooling modules help absorb pressure fluctuations, volume changes, and reduce the impact of vibration and noise.

[0182] The first rigid substrate 230 is arranged in a closed configuration around the edges of the first liquid cooling film stationary region 280, the liquid cooling film bending region 270, and the second liquid cooling film stationary region 290. The drive pump 100 is located in the second liquid cooling film stationary region 290 and is positioned close to the first rigid substrate 230 along the width X direction. The drive pump 100 has third rigid substrates 260 on both sides along the length Y direction, wherein the third rigid substrates 260 on both sides of the drive pump 100 along the length Y direction are respectively columnar and strip-shaped. In this embodiment, the drive pump 100 and the adjacent first flexible film 210, second flexible film 220, and other structural components within the electronic device 300 are typically spaced apart or supplemented with damping material, wherein the damping material can be bonded to the first flexible film 210, second flexible film 220, or structural components. For example, the structural components can be at least one of a display screen, a housing 310, a battery, and a camera.

[0183] A second rigid base 250 is provided on the side of the drive pump 100 away from the first rigid base 230 along the width X direction. The second rigid base 250 divides the liquid cooling film stationary region 290, the liquid cooling film bending region 270, and the liquid cooling channel 241 of part of the first liquid cooling film stationary region 280 into an inlet channel 242 and an outlet channel 243. Specifically, in the second liquid cooling film stationary region 290, part of the second rigid base 250 extends along the width X direction, and part of the second rigid base 250 extends along the length Y direction. The second rigid base 250 extending along the length Y direction divides the liquid cooling channel 241 located on both sides along the width X direction into an inlet channel 242 and an outlet channel 243. The second rigid base 250 extending along the width X direction is used together with the third rigid base 260 to guide the flow of the cooling medium flowing out of the drive pump 100. In the liquid inlet channel 242 of the second liquid-cooled film static region 290, the third rigid substrate 260 can be strip-shaped or columnar. The strip-shaped third rigid substrate 260 extends along the width X direction, and columnar third rigid substrates 260 are provided on both sides of the strip-shaped third rigid substrate 260 along the width X direction. In the liquid outlet channel 243 of the second liquid-cooled film static region 290, the third rigid substrate 260 is strip-shaped and extends along the length Y direction. The area enclosed by the first rigid substrate 230 of the second liquid-cooled film static region 290 is substantially rectangular or square.

[0184] In the liquid-cooled film bending region 270, the second rigid substrate 250 extends along the length Y direction, dividing the liquid-cooled channels 241 located on both sides of the second rigid substrate 250 along the width X direction into an inlet channel 242 and an outlet channel 243. The third rigid substrates 260 in both the inlet channel 242 and the outlet channel 243 are strip-shaped and extend along the length Y direction. The area enclosed by the first rigid substrate 230 in the liquid-cooled film bending region 270 is substantially strip-shaped. In this embodiment, the liquid-cooled module within the liquid-cooled film bending region 270 is arranged across the axis, meaning the liquid-cooled module spans the main axis of the liquid-cooled film bending region 270.

[0185] In the first liquid-cooled film static region 280, a portion of the second rigid substrate 250 is in an inverted C-shape, and another portion is strip-shaped and extends along the width X direction. The inverted C-shaped second rigid substrate 250 divides the liquid-cooled channel 241 into an inlet channel 242 and an outlet channel 243. The third rigid substrates 260 on both sides of the inverted C-shaped second rigid substrate 250 are also inverted C-shaped. A columnar third rigid substrate 260 is provided on one side of the end of the strip-shaped second rigid substrate 250 along the width X direction, and the inlet channel 242 and the outlet channel 243 are connected in the third rigid substrate 260 to form a cooling cycle.

[0186] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A liquid cooling module, characterized in that, The system includes a drive pump (100) and a liquid cooling module (200). The drive pump (100) includes a housing (110) and an oscillator (120). The housing (110) has a first channel (111) and a second channel (112). A pump chamber (113) is provided inside the housing (110). The first channel (111), the pump chamber (113), and the second channel (112) are sequentially connected to form a flow channel. The oscillator (120) includes a stacked electrode layer (124), a piezoelectric layer (121), and an electrode connection layer (120). 22) and support layer (123); the piezoelectric layer (121), the electrode connection layer (122) and the support layer (123) constitute a co-sintered body, the electrode layer (124) is attached to the side of the piezoelectric layer (121) away from the support layer (123), and the electrode connection layer (122) is located between the piezoelectric layer (121) and the support layer (123); the oscillator (120) is located in the housing (110) and constitutes part of the sidewall of the pump chamber (113) for driving the medium to flow in the flow channel; The liquid-cooled module (200) includes a liquid-cooled outlet (211) and a liquid-cooled inlet (212). The liquid-cooled outlet (211) is connected to the first channel (111) of the drive pump (100), and the liquid-cooled inlet (212) is connected to the second channel (112) of the drive pump (100). The portion of the liquid-cooled module (200) surrounding the liquid-cooled outlet (211) and the portion of the housing (110) surrounding the first channel (111) are integrally sealed. The portion of the liquid-cooled module (200) surrounding the liquid-cooled inlet (212) is also connected to the second channel (112) of the drive pump (100). The cold module (200) and the portion of the housing (110) around the second channel (112) are an integrated sealed structure. The liquid-cooled module (200) includes a first flexible membrane (210). The liquid-cooled outlet (211) and the liquid-cooled inlet (212) are disposed on the first flexible membrane (210). The drive pump (100) includes a pump bottom wall (114). The pump bottom wall (114) and the portion of the first flexible membrane (210) around the liquid-cooled outlet (211) and the liquid-cooled inlet (212) are an integrated sealed structure.

2. The liquid cooling module according to claim 1, characterized in that, The drive pump (100) includes a housing (110) and a vibrator (120). The housing (110) has a first channel (111) and a second channel (112), and a pump chamber (113) is provided inside the housing (110). The first channel (111), the pump chamber (113) and the second channel (112) are connected in sequence to form a flow channel. The oscillator (120) includes a stacked electrode layer (124), a piezoelectric layer (121), an electrode connection layer (122), and a support layer (123). The piezoelectric layer (121), the electrode connection layer (122), and the support layer (123) constitute a co-sintered body. The electrode layer (124) is attached to the side of the piezoelectric layer (121) away from the support layer (123). The electrode connection layer (122) is located between the piezoelectric layer (121) and the support layer (123). The oscillator (120) is located inside the housing (110) and forms part of the sidewall of the pump chamber (113), for driving the medium to flow in the flow channel.

3. The liquid cooling module according to claim 2, characterized in that, The difference in the coefficients of thermal expansion between the piezoelectric layer (121) and the support layer (123) is less than or equal to 20 × 10⁻⁶. -6 / K.

4. The liquid cooling module according to claim 2 or 3, characterized in that, The electrode connection layer (122) contains particles (125), and the hardness of the particles (125) is greater than the hardness of any one of the piezoelectric layer (121), the electrode connection layer (122) and the support layer (123).

5. The liquid cooling module according to claim 4, characterized in that, The hardness of the particle (125) is greater than or equal to 120hv.

6. The liquid cooling module according to claim 4, characterized in that, The particles (125) are made of at least one of silicon carbide, tungsten, diamond and corundum.

7. The liquid cooling module according to any one of claims 4, characterized in that, The particle size D90 of the particles (125) is less than or equal to 10 micrometers.

8. The liquid cooling module according to claim 2 or 3, characterized in that, The coefficients of thermal expansion of the piezoelectric layer (121) and the support layer (123) are 4 × 10⁻⁶. -6 Up to 8×10 -6 Within the range of / K.

9. The liquid cooling module according to claim 2 or 3, characterized in that, The piezoelectric layer (121) has multiple layers, and the multiple piezoelectric layers (121) are stacked. Adjacent piezoelectric layers (121) are connected through the electrode connection layer (122).

10. The liquid cooling module according to claim 2 or 3, characterized in that, The drive pump also includes at least two valves (130), which are located in the first channel (111) and the second channel (112), respectively.

11. The liquid cooling module according to claim 2 or 3, characterized in that, The oscillator (120) is in the shape of a disc, the diameter of the support layer (123) is in the range of 4 mm to 35 mm, the thickness of the support layer (123) is in the range of 0.04 mm to 3 mm, the diameter of the piezoelectric layer (121) is in the range of 4 mm to 35 mm, and the thickness of the piezoelectric layer (121) is in the range of 0.04 mm to 2 mm.

12. The liquid cooling module according to claim 2 or 3, characterized in that, The oscillator (120) is square-shaped, the length of the piezoelectric layer (121) is in the range of 4 mm to 35 mm, the thickness of the piezoelectric layer (121) is in the range of 0.04 mm to 2 mm, the length of the support layer (123) is in the range of 5 mm to 35 mm, and the thickness of the support layer (123) is in the range of 0.04 mm to 3 mm.

13. The liquid cooling module according to claim 2 or 3, characterized in that, The support layer (123) is made of ceramic and / or glass materials.

14. The liquid-cooled module according to any one of claims 1-3, characterized in that, The liquid-cooled module (200) further includes a second flexible membrane (220) and a first rigid substrate (230) located between the first flexible membrane (210) and the second flexible membrane (220). The first flexible membrane (210), the second flexible membrane (220) and the first rigid substrate (230) together form a liquid-cooled channel (241) of the liquid-cooled module (200). The two ends of the first rigid substrate (230) are integrated with the first flexible membrane (210) and the second flexible membrane (220) respectively.

15. The liquid cooling module according to claim 14, characterized in that, The liquid-cooled module (200) further includes a second rigid substrate (250), which divides the liquid-cooled channel (241) of the liquid-cooled module (200) into an inlet channel (242) and an outlet channel (243). The liquid-cooled outlet (211) is connected to the inlet channel (242), and the liquid-cooled inlet (212) is connected to the outlet channel (243). The two ends of the second rigid substrate (250) are integrated with the first flexible membrane (210) and the second flexible membrane (220) respectively.

16. The liquid cooling module according to claim 15, characterized in that, The liquid-cooled module (200) also includes a third rigid substrate (260), which is distributed in the liquid inlet channel (242) and the liquid outlet channel (243). The two ends of the third rigid substrate (260) are integrated with the first flexible membrane (210) and the second flexible membrane (220) respectively to form a sealed structure.

17. An electronic device, characterized in that, Includes the liquid cooling module according to any one of claims 1-16, wherein the drive pump and / or liquid cooling module is located within the electronic device (300) or within an accessory of the electronic device (300).

18. A method for preparing an oscillator, used to prepare an oscillator (120) in the drive pump (100) of the liquid-cooled module according to any one of claims 1-16, characterized in that, Includes the following steps: Prepare a piezoelectric sheet and a support sheet, wherein the piezoelectric sheet is made of a piezoelectric material and the support sheet is made of a non-metallic material; An electrode paste is prepared between the piezoelectric sheet and the support sheet; A certain pressure is applied to clamp the piezoelectric sheet and the support sheet, and the electrode paste between the piezoelectric sheet and the support sheet is squeezed; The electrode paste is dried at the first temperature; After the pressure is removed, the piezoelectric sheet, the electrode paste, and the support sheet are sintered at a second temperature for a certain period of time to form an integral co-sintered body. An electrode layer is formed on the surface of the piezoelectric sheet opposite to the support sheet, and polarized to form an oscillator (120).

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