Miniature FFC embedded intelligent module

Abstract

The utility model provides a kind of micro FFC embedded intelligent module, the interface of FFC connector is fixedly installed with U-shaped hollow groove block, the upper surface of U-shaped recess in U-shaped hollow groove block middle part is transversely provided with thin film thermocouple array, the inside of U-shaped hollow groove block is provided with including ADC converter, MCU single-chip microcomputer and capacitor, the top of the left and right ends of U-shaped hollow groove block is respectively provided with green pilot lamp and red pilot lamp and with MCU single-chip microcomputer communication connection, thin film thermocouple array, ADC converter and MCU single-chip microcomputer are sequentially connected, thin film thermocouple array, ADC converter and MCU single-chip microcomputer, green pilot lamp and red pilot lamp are electrically connected with capacitor. Through the technical scheme of the utility model, thin film thermocouple array and ADC converter realize ±0.1 ℃ temperature resolution, can observe FFC flat cable overheating condition in real time, significantly reduce the risk of connector failure caused by abnormal temperature rise of micro device due to FFC flat cable, give consideration to miniaturization, high precision and long-term stability.

Description

Technical Field

[0001] This utility model relates to the field of microelectronic device connection technology, and more specifically, to a micro FFC embedded smart module. Background Technology

[0002] FFC (Flexible Flat Cable) is an ultra-thin flat conductor made of flexible insulating substrates such as polyimide. It is formed into a parallel conductor array through a precision etching process, featuring thinness (0.1-0.3mm), high flexibility, and suitability for high-density wiring. It is widely used in the internal signal transmission of electronic devices such as smartphones and laptops. FFC connectors are miniaturized connectors specifically designed for FFC, employing ZIF (Zero Insertion Force) or non-ZIF structures. They achieve a reliable connection between the cable conductor and the PCB board through precision spring contacts. Features include low height (typically <2mm), a self-locking mechanism to prevent detachment, and optimized impedance matching, meeting the stringent requirements of modern electronic devices for compact space, high-frequency signals, and repeated insertion and removal.

[0003] According to industry statistics, 27% of micro device failures are caused by overheating of the FFC cable, leading to abnormal temperature rise in the connector. However, abnormal temperature rise of the FFC cable inside the micro device cannot be monitored in real time. Therefore, it is necessary to implement temperature detection at the connection point to prevent failures of micro devices caused by overheating of the FFC cable. Summary of the Invention

[0004] To overcome the shortcomings of existing technologies, this utility model provides a miniature FFC embedded intelligent module.

[0005] This utility model is achieved through the following technical solution: a miniature FFC embedded intelligent module, including an FFC connector, a U-shaped hollow slot block is fixedly installed at the interface of the FFC connector, a thin film thermocouple array is horizontally arranged on the upper surface of the U-shaped groove in the middle of the U-shaped hollow slot block, the U-shaped hollow slot block contains an ADC converter, an MCU microcontroller and a capacitor, a green indicator light and a red indicator light are respectively arranged on the top of the left and right ends of the U-shaped hollow slot block and are respectively connected to the MCU microcontroller for communication, the thin film thermocouple array, the ADC converter and the MCU microcontroller are connected for communication in sequence, and the thin film thermocouple array, the ADC converter, the MCU microcontroller, the green indicator light and the red indicator light are all electrically connected to the capacitor.

[0006] As a preferred embodiment, the thin-film thermocouple array has 8 contacts with a spacing of 0.8 mm, and each contact consists of 4 thin-film thermocouple sensors arranged in a rectangle.

[0007] As a preferred option, the resolution of the ADC converter is 0.1℃.

[0008] As a preferred option, the capacitance is 0.5F.

[0009] As a preferred option, the U-shaped hollow slot block also has a Bluetooth chip inside, which communicates with the MCU microcontroller and is electrically connected to the capacitor.

[0010] Furthermore, the Bluetooth chip is a Bluetooth BLE 5.1 ​​chip.

[0011] As a preferred option, the MCU microcontroller adopts a package size of 2mm×2mm and an operating current of ≤8μA.

[0012] The present invention, by adopting the above technical solutions, has the following beneficial effects compared with the prior art: The miniature FFC embedded intelligent temperature monitoring module device provided by the present invention achieves a temperature resolution of ±0.1℃ through a thin-film thermocouple array and an ADC converter, which can observe the overheating of the FFC cable in real time, significantly reducing the risk of connector failure caused by abnormal temperature rise of the FFC cable in micro devices, and taking into account miniaturization, high precision and long-term stability.

[0013] Additional aspects and advantages of this invention will become apparent in the following description or may be learned by practice of this invention. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the temperature measurement system of this utility model;

[0017] Figure 3 This is a top view of the structure of this utility model;

[0018] in, Figures 1 to 3 The correspondence between the reference numerals and components in the attached drawings is as follows:

[0019] 1. FFC connector, 2. U-shaped hollow slot block, 3. U-shaped groove, 4. Thin film thermocouple array, 5. Thin film thermocouple sensor, 6. ADC converter, 7. MCU microcontroller, 8. Capacitor, 9. Bluetooth chip, 10. Green indicator light, 11. Red indicator light. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0022] The following is combined with Figures 1 to 3 The miniature FFC embedded intelligent module of the present invention will be described in detail below.

[0023] like Figure 1 , Figure 2 As shown, this utility model proposes a miniature FFC embedded intelligent module, including an FFC connector 1. A U-shaped hollow slot block 2 is fixedly installed at the interface of the FFC connector 1. A thin-film thermocouple array 4 is horizontally arranged on the upper surface of the U-shaped groove 3 in the middle of the U-shaped hollow slot block 2. The thin-film thermocouple array 4 has 8 contacts with a spacing of 0.8mm. Each contact consists of 4 thin-film thermocouple sensors 5 arranged in a rectangle. The U-shaped hollow slot block 2 internally houses an ADC converter 6, an MCU microcontroller 7, and a capacitor 8. The MCU microcontroller 7 is an ultra-low power MCU with a package size of 2mm×2mm and an operating current ≤8μA. The ADC converter 6 has a resolution of 0.1℃ and a built-in thermal anomaly location algorithm, which triggers an alarm by setting a gradient threshold ΔT ≥ 5℃ / mm. The capacitor 8 has a capacitance of 0.5F and is used to power the various components. Green indicator lights 10 and red indicator lights 11 are respectively installed on the top of the left and right ends of the U-shaped hollow slot block 2, and are respectively connected to the MCU microcontroller 7 for communication. The thin-film thermocouple array 4, ADC converter 6, and MCU microcontroller 7 are sequentially connected for communication. The thin-film thermocouple array 4, ADC converter 6, MCU microcontroller 7, green indicator lights 10, and red indicator lights 11 are all electrically connected to capacitor 8. The U-shaped hollow slot block 2 also houses a Bluetooth chip 9 that transmits temperature data to a mobile terminal, and is connected to the MCU microcontroller 7 for communication and is electrically connected to capacitor 8. The Bluetooth chip is a Bluetooth BLE 5.1 ​​chip. The MCU microcontroller has a package size of 2mm × 2mm and an operating current ≤8μA.

[0024] Working process: After the FFC cable is inserted, this device collects the temperature data of each contact in real time through a thin-film thermocouple array. After high-precision ADC conversion, the temperature gradient is analyzed by the MCU. When the temperature rise of a local contact exceeds the threshold (e.g., ΔT≥5℃), an overheat alarm is immediately sent to the terminal device through the BLE chip. At the same time, the overheating is indicated by green and red indicator lights, i.e., red indicates overheating and green indicates normal operation. This effectively prevents the failure of micro electronic devices due to abnormal temperature rise of the connector caused by overheating of the FFC cable.

[0025] In the description of this utility model, the term "multiple" refers to two or more. Unless otherwise explicitly defined, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. The terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0026] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A miniature FFC embedded smart module, comprising an FFC connector (1), characterized in that... A U-shaped hollow slot block (2) is fixedly installed at the interface of the FFC connector (1). A thin film thermocouple array (4) is horizontally arranged on the upper surface of the U-shaped groove (3) in the middle of the U-shaped hollow slot block (2). The U-shaped hollow slot block (2) is equipped with an ADC converter (6), an MCU microcontroller (7) and a capacitor (8). Green indicator lights (10) and red indicator lights (11) are respectively arranged on the top of the left and right ends of the U-shaped hollow slot block (2) and are respectively connected to the MCU microcontroller (7). The thin film thermocouple array (4), ADC converter (6) and MCU microcontroller (7) are connected to each other in sequence. The thin film thermocouple array (4), ADC converter (6), MCU microcontroller (7), green indicator light (10) and red indicator light (11) are all electrically connected to the capacitor (8).

2. A miniature FFC embedded intelligent module according to claim 1, characterized in that... The thin-film thermocouple array (4) has 8 contacts with a spacing of 0.8 mm. Each contact consists of 4 thin-film thermocouple sensors (5) arranged in a rectangular shape.

3. A miniature FFC embedded intelligent module according to claim 1, characterized in that... The resolution of the ADC converter (6) is 0.1℃.

4. A miniature FFC embedded intelligent module according to claim 1, characterized in that... The capacitance of the capacitor (8) is 0.5F.

5. A miniature FFC embedded intelligent module according to claim 1, characterized in that... The U-shaped hollow slot block (2) is also equipped with a Bluetooth chip (9) and is connected to the MCU microcontroller (7) and an electrical connection capacitor (8).

6. A miniature FFC embedded intelligent module according to claim 5, characterized in that... The Bluetooth chip (9) is a Bluetooth BLE 5.1 ​​chip.

7. A miniature FFC embedded intelligent module according to claim 1, characterized in that... The MCU (7) has a package size of 2mm×2mm and an operating current of ≤8μA.

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