Wafer post-processing apparatus

Abstract

The application discloses a wafer post-processing device, which comprises a box body, a clamping assembly arranged in the box body to horizontally clamp a wafer to be cleaned, and a brushing assembly arranged in the box body and provided with a brush body capable of abutting against the wafer and moving above the wafer. The brushing assembly further comprises a rotating shaft arranged at a side of the clamping assembly and a swing arm connected to the rotating shaft, and the brush body is arranged at an end of the swing arm. The rotating shaft is vertically movable to control the acting force of the brush body on the wafer. A pressure sensor is arranged between the brush body and the swing arm to monitor the acting force of the brush body on the wafer.

Description

Technical Field

[0001] This invention belongs to the field of wafer post-processing technology, and more specifically, relates to a wafer post-processing apparatus. Background Technology

[0002] The integrated circuit industry is the core of the information technology industry, playing a crucial role in promoting the digital and intelligent transformation and upgrading of the manufacturing industry. Chips are the carriers of integrated circuits, and chip manufacturing involves processes such as integrated circuit design, wafer fabrication, wafer processing, electrical measurement, dicing, packaging, and testing. Among these, chemical mechanical polishing (CMP) is one of the five core processes in wafer fabrication.

[0003] To maintain wafer surface cleanliness and eliminate particulate matter remaining on the wafer surface during the manufacturing process, wafers need to be cleaned and / or dried after each process step; this is also known as wafer post-processing. Among these processes, horizontal cleaning technology is widely used because it is not affected by gravity.

[0004] Horizontal brushing is a type of horizontal cleaning technology where a rotating brush contacts a rotating wafer to remove particles from its surface. To ensure controllable brush pressure and rotation speed, a relatively complex structure is required. However, this complex structure increases frictional resistance, causing the brush to jam or become unstable in its downward pressure, which negatively impacts the wafer cleaning effect.

[0005] Furthermore, in existing technologies, the downward pressure of the brush can only be calibrated before wafer cleaning. The specific calibration process involves determining the brush's downward pressure height based on the relationship between brush height variation and downward pressure to obtain a pressure that meets process requirements. Since the brush height changes with wear and tear, the existing calibration method has significant errors. In addition, the downward pressure determined through calibration is relatively fixed and cannot be adjusted in real time, failing to achieve closed-loop control of the downward pressure. This means that on-site process personnel cannot flexibly adjust the load applied to the wafer by the brush according to operating conditions, resulting in the wafer surface cleanliness failing to meet process requirements. Summary of the Invention

[0006] This invention provides a wafer post-processing apparatus, which aims to at least solve one of the technical problems existing in the prior art.

[0007] A first aspect of the present invention provides a wafer post-processing apparatus, comprising:

[0008] Box;

[0009] A clamping assembly, which is disposed in the housing, horizontally clamps the wafer to be cleaned;

[0010] A washing assembly is disposed in a housing, the washing assembly being equipped with a brush body capable of contacting and moving above the wafer;

[0011] The brushing assembly also includes a rotating shaft and a swing arm. The rotating shaft is located on the side of the clamping assembly, the swing arm is connected to the rotating shaft, and the brush body is located at the end of the swing arm. The rotating shaft can move vertically to control the force exerted by the brush body on the wafer.

[0012] A pressure sensor is installed between the brush body and the swing arm to monitor the force exerted by the brush body on the wafer.

[0013] In some embodiments, a rotary motor is disposed outside the housing, and the drive shaft of the rotary motor is connected to the rotating shaft to drive the rotating shaft and its connected components to swing around the central axis.

[0014] In some embodiments, the brush body is rotatable along a central axis, and a drive motor that drives the brush body to rotate is disposed on a support member; an adapter is disposed at the end of the swing arm, and the support member is slidably connected to the adapter; the pressure sensor is disposed between the support member and the adapter.

[0015] In some embodiments, a linear module is provided between the support member and the adapter member, with the fixed end of the linear module located on the adapter member and the movable end of the linear module connected to the support member.

[0016] In some embodiments, the support member is disposed to the side of the adapter, the brush body is disposed adjacent to the swing arm, and the brush body is located on the extension line of the center line of the swing arm.

[0017] In some embodiments, the pressure sensor is arranged vertically, with one end connected to the support and the other end connected to the adapter.

[0018] In some embodiments, the wafer post-processing apparatus further includes a linear drive module disposed below the housing; the linear drive module is capable of driving the rotary motor, the rotating shaft and the components thereon to move in the vertical direction.

[0019] In some embodiments, the linear drive module is an electric cylinder, which is vertically disposed below the housing; the slide plate of the electric cylinder is connected to the base of the rotary motor.

[0020] In some embodiments, the pressure sensor is disposed on one side of the centerline of the swing arm.

[0021] In some embodiments, the pressure sensor is disposed along the length of the swing arm and cantilevered along the extension line of the swing arm; one end of the pressure sensor is disposed below the swing arm and the other end is disposed above the brush body.

[0022] The beneficial effects of this invention include:

[0023] a. The linear drive module drives the rotating shaft, swing arm, and brush body set at the end of the swing arm to move vertically. The structure is simplified, reducing the impact of frictional resistance caused by complex mechanisms on the downward pressure of the brush body, and effectively improving the accuracy of the load applied by the brush body.

[0024] b. A pressure sensor is installed between the swing arm and the brush body to measure the load applied by the brush body to the wafer surface in real time and adjust the load applied by the brush body according to the on-site working conditions, which effectively improves the effect of wafer post-processing.

[0025] c. An S-type tension / compression sensor is selected as the pressure sensor, and the pressure sensor is set vertically to monitor the load on the wafer by the rotating brush in real time;

[0026] d. The pressure sensor is set on the center line of the swing arm or its extension line, which effectively eliminates the measurement error caused by improper setting and improves the accuracy of pressure sensor monitoring. Attached Figure Description

[0027] The advantages of the present invention will become clearer and easier to understand through the following detailed description in conjunction with the accompanying drawings, which are merely illustrative and do not limit the scope of protection of the present invention, wherein:

[0028] Figure 1 This is a schematic diagram of a wafer post-processing apparatus provided in an embodiment of the present invention;

[0029] Figure 2 This is a schematic diagram of the wafer post-processing device after the upper components of the housing have been removed.

[0030] Figure 3 This is a schematic diagram of a pressure sensor connected to the end of a swing arm according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of an adapter provided in an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of a support member provided in an embodiment of the present invention;

[0033] Figure 6 This is a connection diagram of a linear drive module provided in an embodiment of the present invention;

[0034] Figure 7 This is a schematic diagram of a wafer post-processing apparatus provided in another embodiment of the present invention;

[0035] Figure 8 yes Figure 7 A schematic diagram of the end of the swing arm in the embodiment;

[0036] Figure 9 yes Figure 8 Disassembly diagram of the component corresponding to the end of the swing arm in the Chinese embodiment;

[0037] Figure 10 This is a schematic diagram of the end of the swing arm corresponding to another embodiment of the present invention;

[0038] Figure 11 This is a schematic diagram of a wafer post-processing apparatus provided in another embodiment of the present invention;

[0039] Figure 12 yes Figure 11 Disassembly diagram of the component corresponding to the end of the swing arm in the embodiment. Detailed Implementation

[0040] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0041] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of the invention and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of the invention, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0042] In this invention, a wafer (W) is also called a substrate, with the same meaning and practical function. The term "comprising" and similar expressions should be understood as open-ended inclusion, i.e., "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "one embodiment" or "this embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc., may refer to different or the same objects and are used only to distinguish the objects referred to, without implying a specific spatial order, temporal order, order of importance, etc., of the objects referred to. In some embodiments, values, processes, selected items, determined items, devices, apparatuses, means, parts, components, etc., are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made from a number of available functional options, and that such selection is not necessarily better, lower, higher, smaller, larger, or otherwise preferred than other options in any other respect or in all respects.

[0043] Figure 1 This is a schematic diagram of a wafer post-processing apparatus 100 provided in an embodiment of the present invention. The wafer post-processing apparatus 100 includes:

[0044] The housing 10 has a switch door (not shown) on its side to allow a wafer handling robot to move wafers in or out.

[0045] A clamping assembly 20 is disposed in the housing 10 to horizontally clamp the wafer W to be cleaned; a driving mechanism is also disposed below the clamping assembly 20 to drive the clamping assembly 20 and the wafer W on it to rotate around the central axis; the clamping assembly 20 includes a clamping disk, on which a plurality of opening and closing claws are disposed to horizontally clamp the wafer W to be cleaned.

[0046] The brushing assembly 30 is disposed in the housing 10. The brushing assembly 30 is equipped with a brush body 33. The brush body 33 can abut against the upper surface of the wafer W and can move above the wafer W, so that the brush body 33 can move on the surface of the wafer W to brush away residual particles on the wafer surface.

[0047] The brushing assembly 30 also includes a rotating shaft 31 and a swing arm 32. The rotating shaft 31 is located on the side of the clamping assembly 20, the swing arm 32 is connected to the rotating shaft 31, and the brush body 33 is located at the end of the swing arm 32. The rotating shaft 31 can move in the vertical direction to control the force exerted by the brush body 33 on the wafer.

[0048] Furthermore, the brush body 33 is made of a flexible material, such as non-metallic materials like polyurethane. When the brush body 33 is vertically pressed onto the wafer W, it can deform along the height direction to ensure the stability of the pressure application and avoid damage to the wafer surface.

[0049] Furthermore, the wafer post-processing apparatus 100 also includes a spraying assembly (not shown) disposed inside the housing 10 to spray cleaning fluid toward the rotating wafer W.

[0050] During wafer cleaning, the spraying assembly can spray cleaning fluid toward the wafer surface, and the brush 33 moves on the wafer surface covered by the cleaning fluid. Under the action of friction, it removes residual particles on the wafer surface, thereby cleaning the wafer surface.

[0051] To better demonstrate the internal structure of the wafer post-processing unit 100, the upper components of the housing 10 have been removed, such as... Figure 2 As shown, a pressure sensor 34 is provided between the brush body 33 and the swing arm 32 to monitor the force exerted by the brush body 33 on the wafer W.

[0052] Furthermore, a rotary motor 31a is disposed outside the housing 10, located below the housing 10. Its drive shaft is connected to the rotating shaft 31, causing the rotating shaft 31 and its connected components to swing around the central axis. Specifically, the drive shaft of the rotary motor 31a is connected to the lower end of the rotating shaft 31 via a coupling. The rotating drive shaft can cause the rotating shaft 31, the swing arm 32, and the brush body 33 disposed at the end of the swing arm 32 to swing, allowing the brush body 33 to cover the entire surface of the wafer W.

[0053] Figure 3 This is a schematic diagram of a pressure sensor 34 connected to the end of a swing arm 32 according to an embodiment of the present invention. The brush body 33 is equipped with a drive motor 33a to rotate the brush body 33 around its central axis, thereby enhancing the cleaning effect on the wafer. Specifically, the drive motor 33a is vertically positioned above the support member 35, and the drive shaft of the drive motor 33a vertically passes through the support member 35 and is integrated with the brush body 33.

[0054] In this embodiment, the brush body 33 is a cylindrical component with an outer diameter controlled between 10-100 mm; preferably, the outer diameter of the brush body 33 is 20-80 mm.

[0055] Furthermore, the end of the swing arm 32 is provided with an adapter 36, which is slidably connected to the support 35, and the pressure sensor 34 is disposed between the support 35 and the adapter 36.

[0056] Specifically, a linear module 37 is provided between the support member 35 and the adapter 36. The fixed end of the linear module 37 is located on the adapter 36, and the movable end of the linear module 37 is connected to the support member 35.

[0057] Figure 3In the illustrated embodiment, the fixed end of the linear module 37 is positioned towards the location of the brush body 33 and is a vertically arranged slide rail; the moving end of the linear module 37 is a slider, which is slidably connected to the slide rail on the side of the adapter 36. Therefore, the support 35 and the adapter 36 can slide relative to each other to accommodate the slight deformation of the pressure sensor 34 disposed between them, ensuring the stability of the pressure sensor 34's operation. Simultaneously, the linear module 37 itself has low friction, reducing frictional resistance in traditional complex structures and ensuring the accuracy of the load measurement applied by the brush body 33 to the wafer.

[0058] Furthermore, the support member 35 is disposed to the side of the adapter 36, and the brush body 33 is disposed adjacent to the swing arm 32; specifically, the brush body 33 is disposed on the front side of the swing arm 32. Moreover, the brush body 33 is located on the extension line of the center line of the swing arm 32, so as to precisely control the position of the brush body 33 according to the rotation angle of the swing arm 32. By placing the brush body 33 on the extension line of the center line of the swing arm 32, the overall structure of the brushing assembly 30 is a symmetrical structure based on the vertical center line of the rotating shaft 31. This helps to control the rotational inertia of the brushing assembly 30 and ensures the smooth operation of the brushing assembly 30.

[0059] In this invention, the adapter 36 includes a horizontal adapter plate 36a and a vertical adapter plate 36b, as shown below. Figure 4 As shown, the adapter vertical plate 36b is positioned above the adapter horizontal plate 36a. The two can be integrally formed or processed and assembled separately. A notch 36c is provided on the side of the adapter vertical plate 36b to provide installation space for the pressure sensor 34.

[0060] Support member 35 includes a horizontal support plate 35a and a vertical support plate 35b, such as Figure 5 As shown, the vertical support plate 35b is vertically arranged to the side of the horizontal support plate 35a. The two can be integrally formed or processed and assembled separately. The horizontal support plate 35a is also provided with a circular hole (not shown), so that the drive shaft of the drive motor 33a can be connected to the brush body 33 below the horizontal support plate 35a through the circular hole, so as to drive the brush body 33 to rotate along its central axis during wafer cleaning.

[0061] Furthermore, a protrusion 35c is provided on the side of the supporting vertical plate 35b for mounting the pressure sensor 34. Specifically, the protrusion 35c of the support member 35 is horizontally arranged and is inserted into the notch 36c of the adapter 36, while one end of the pressure sensor 34 is disposed on the top surface of the notch 36c and the other end is connected to the upper surface of the protrusion 35c.

[0062] Figure 3 In the embodiment shown, the protrusion 35c of the support member 35 ( Figure 5 (shown) and the notch 36c of the adapter 36 ( Figure 4Corresponding to the setting position shown, the protrusion 35c is horizontally positioned between the notches 36c to divide the notches 36c into an upper space and a lower space, and the pressure sensor 34 can be set in either the upper space or the lower space.

[0063] Figure 3 The pressure sensor 34 shown is located on the front side (facing the paper side) of the centerline of the swing arm 32. As a variation of this embodiment, the pressure sensor 34 may also be located on the rear side of the centerline of the swing arm 32. Alternatively, more than one pressure sensor 34 may be provided between the support member 35 and the adapter 36; for example, pressure sensors 34 may be provided on both sides of the centerline of the swing arm 32 to ensure the accuracy of load measurement.

[0064] Specifically, the support member 35 can be configured with a pair of protruding plates 35c, which are horizontally set on the support vertical plate 35b; correspondingly, the adapter vertical plate 36b of the adapter member 36 can be symmetrically provided with a pair of notches 36c, the positions of the protruding plates 35c and the notches 36c are matched, and the two are connected and plugged in through the linear module 37 to form the installation space of the pressure sensor 34.

[0065] In this invention, the wafer post-processing apparatus 100 further includes a linear drive module 38, which is disposed below the housing 10 to drive the rotary motor 31a, the rotating shaft 31, and the components thereon to move vertically. Of course, the components connected to the rotating shaft 31 include a brush body 33, and the linear drive module 38 drives the brush body 33 to move vertically to apply a load to the wafer to be cleaned.

[0066] In this invention, the mechanism that drives the brush body 33 to move vertically is a linear drive module 38, which has a simplified structure, greatly reduces the frictional resistance caused by the complex transmission structure in the prior art, and effectively improves the accuracy of load application.

[0067] Figure 6 yes Figure 3 According to the connection diagram of the linear drive module 38 in the corresponding embodiment, a vertical plate 39 is provided below the housing 10, extending downwards in a vertical direction. The linear drive module 38 is located on the side of the vertical plate 39. The movable end of the linear drive module 38 is connected to the base of the rotary motor 31a to drive the rotary motor 31a, the rotating shaft 31, and the brush body 33 on it to move. The downward-moving brush body 33 can apply a load to the wafer to be cleaned.

[0068] In some embodiments, the linear drive module 38 can be an electric cylinder (servo electric cylinder) vertically disposed on the upright plate 39 below the housing 10. The sliding plate of the electric cylinder is connected to the base of the rotary motor 31a to realize the vertical movement of the rotating shaft 31, so that the brush body 33 can press the wafer vertically downward. That is, by controlling the linear drive module 38, the vertical movement of the rotating shaft 31 and its connected components can be adjusted to change the load on the brush body 33 on the wafer to be cleaned.

[0069] It should be noted that the servo electric cylinder is a modular product that integrates the servo motor and the lead screw to reduce its own frictional resistance and achieve high-precision linear motion. Understandably, the linear drive module 38 can also use other linear modules to control the module's own frictional resistance and ensure the accuracy of the load applied by the brush body 33.

[0070] In this invention, the pressure sensor 34 is arranged vertically, with one end connected to the support member 35 and the other end connected to the adapter member 36; the pressure sensor 34 can detect the load applied to the wafer surface by the brush body 33.

[0071] Figure 3 In the illustrated embodiment, the pressure sensor 34 is an S-type tension / compression dual-purpose sensor to detect the load applied to the wafer by the brush body 33. Specifically, when the brush body 33 is not in contact with the wafer, the displayed value of the pressure sensor 34 is the force generated by the total weight of the brush body 33, the drive motor 33a, and the moving end of the linear module 37. In field use, the pressure sensor 34 can be zeroed to calculate the load applied to the wafer surface by the brush body 33.

[0072] Figure 7 This is a schematic diagram of a wafer post-processing apparatus 100 provided in another embodiment of the present invention. The wafer post-processing apparatus 100 includes a housing 10, a clamping assembly 20, and a brushing assembly 30, the positions and connections of which are the same as those of the present invention. Figure 2 The illustrated embodiments are similar and will not be described again here. The key difference between the two embodiments is the different placement of the pressure sensor 34.

[0073] Figure 8 yes Figure 7 In the partial enlarged view of the front end of the swing arm 32 in the embodiment, the pressure sensor 34 is disposed above the support member 35, and the pressure sensor 34 is located on the extension line of the center line of the swing arm 32 to prevent the position of the pressure sensor 34 from deviating from the center line of the swing arm 32 and affecting the accuracy of the measurement.

[0074] Furthermore, the support member 35 has an L-shaped structure, which includes a first support plate 35d and a second support plate 35f. The first support plate 35d is horizontally arranged, and the second support plate 35f is vertically arranged along the edge of the first support plate 35d. The two can be integrally formed or processed and assembled separately.

[0075] The first support plate 35d is used to set the drive motor 33a, and a brush body 33 is set below the first support plate 35d; a pressure sensor 34 is set above the second support plate 35f. Figure 9 yes Figure 8 Disassembly diagram or exploded view of the front end component of the middle swing arm 32.

[0076] The adapter 36 has a Z-shaped structure. Specifically, the adapter 36 includes a first horizontal plate 36d, a vertical plate 36e, and a second horizontal plate 36f, which can be integrally formed. The first horizontal plate 36d is fixed above the swing arm 32, and the vertical plate 36e is disposed between the first horizontal plate 36d and the second horizontal plate 36f. Furthermore, the second horizontal plate 36f is disposed facing the outside of the swing arm 32.

[0077] Furthermore, the support member 35 is disposed on the outside of the adapter 36 to form a space between them for mounting the pressure sensor 34. Specifically, the fixed end of the linear module 37 is disposed on the side of the vertical plate 36e, and the movable end of the linear module 37 is disposed on the side of the support member 35 and slidably connected to the fixed end of the linear module 37.

[0078] One end of the pressure sensor 34 is connected to the top of the second support plate 35f of the support member 35, and the other end is connected to the bottom of the second horizontal plate 36f; and the extension line of the center line of the swing arm 32 of the pressure sensor 34 effectively eliminates the measurement error caused by improper setting position and improves the accuracy of pressure sensor monitoring.

[0079] Figure 10 This is a fixing scheme for the pressure sensor 34 provided in another embodiment of the present invention, which is consistent with... Figure 8 The illustrated schemes are similar; the differences between the two will be emphasized below. In this embodiment, the pressure sensor 34 is positioned directly above the swing arm 32. Specifically, the downward projection of the pressure sensor 34 is located on the swing arm 32.

[0080] Furthermore, the support member 35 has a Z-shaped structure, which includes two horizontal plates, one of which is used to fix the drive motor 33a, and the other horizontal plate is used to connect the pressure sensor 34.

[0081] The adapter 36 has a U-shaped structure, with the opening of the U-shape facing the rotation reference line of the swing arm 32. The fixed end of the linear module 37 is located on the back of the opening of the adapter 36, and the pressure sensor 34 is located on the top surface of the adapter 36. That is, the pressure sensor 34 is located directly above the end of the swing arm 32 to improve the compactness of the end structure of the swing arm 32, improve the rotational inertia of the swing arm assembly 30, and enhance the reliability of the brushing assembly 30.

[0082] Figure 11This is a schematic diagram of a wafer post-processing apparatus 100 provided in an embodiment of the present invention. The wafer post-processing apparatus 100 includes:

[0083] The housing 10 has a switch door (not shown) on its side to allow a wafer handling robot to move wafers in or out.

[0084] A clamping assembly 20 is disposed in the housing 10 to horizontally clamp the wafer W to be cleaned; a driving mechanism is also disposed below the clamping assembly 20 to drive the clamping assembly 20 and the wafer W on it to rotate around the central axis.

[0085] The brushing assembly 30 is disposed in the housing 10. The brushing assembly 30 is equipped with a brush body 33. The brush body 33 can abut against the upper surface of the wafer W and can move above the wafer W, so that the brush body 33 can move on the surface of the wafer W to brush away residual particles on the wafer surface.

[0086] The brushing assembly 30 also includes a rotating shaft 31 and a swing arm 32. The rotating shaft 31 is located on the side of the clamping assembly 20, the swing arm 32 is connected to the rotating shaft 31, and the brush body 33 is located at the end of the swing arm 32. The rotating shaft 31 is connected to the linear drive module 38. The moving end of the linear drive module 38 can drive the rotating shaft 31 to move in the vertical direction to control the force exerted by the brush body 33 on the wafer.

[0087] Furthermore, the wafer post-processing apparatus 100 also includes a spraying assembly (not shown), which is disposed inside the housing 10 to spray cleaning fluid toward the rotating wafer W. During wafer cleaning, the spraying assembly can spray cleaning fluid toward the wafer surface, and the brush 33 moves on the wafer surface covered by the cleaning fluid. Under the action of friction, it removes residual particles on the wafer surface, thereby achieving wafer surface cleaning.

[0088] Figure 11 In the embodiment shown, the pressure sensor 34 is arranged along the length of the swing arm 32 and cantilevered on the extension line of the swing arm 32 to further simplify the structure, reduce the frictional resistance caused by the traditional complex structure, and ensure the accuracy of the pressure sensor 34 detection.

[0089] Furthermore, one end of the pressure sensor 34 is positioned below the swing arm 32, such as... Figure 12 As shown, the other end of the pressure sensor 34 is positioned above the brush body 33 to monitor in real time the load applied to the wafer to be cleaned through the brush body 33.

[0090] This invention eliminates the complex transmission structure in traditional horizontal cleaning devices and uses a linear drive module to drive the rotating shaft 31 and brush body 33 to move in the vertical direction, thereby reducing the frictional resistance caused by the transmission structure and ensuring the accuracy of the load applied to the brush body 33.

[0091] Furthermore, the wafer post-processing apparatus provided by the present invention does not require calibration of the load applied to the wafer by the brush body 33 before use. It can monitor the downward pressure of the brush body 33 in real time through the pressure sensor 34, which is beneficial for flexibly and accurately adjusting the wafer cleaning process and improving the wafer cleaning effect. At the same time, the operator does not need to perform cleaning calibration operations, which is beneficial for improving the practicality of the wafer post-processing apparatus.

[0092] In some embodiments, the wafer post-processing apparatus is equipped with sensors, such as an image acquisition unit, to detect the wafer cleaning status in real time, thereby acquiring the cleaning status of the wafer surface. If the downward pressure of the brush body 33 needs to be increased or decreased in a certain area, the linear drive module 38 controls the movement of the rotating shaft 31 to adjust the load applied by the brush body 33, ensuring the cleaning effect of the wafer. In some embodiments, to avoid the brush body 33 causing wafer bias when moving to the wafer edge area, the linear drive module 38 can control the rotating shaft 31 to move upward when the swing arm 32 moves to the wafer edge area, thereby reducing the load applied to the wafer by the brush body 33.

[0093] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0094] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer post-processing apparatus, characterized in that, include: A housing; a clamping assembly disposed within the housing to horizontally clamp a wafer to be cleaned; a brushing assembly disposed within the housing, the brushing assembly being equipped with a brush body capable of contacting and moving above the wafer; the brushing assembly further includes a rotating shaft and a swing arm, the rotating shaft being disposed to the side of the clamping assembly, the swing arm being connected to the rotating shaft, and the brush body being disposed at the end of the swing arm; the rotating shaft is capable of vertical movement to control the force exerted by the brush body on the wafer; a pressure sensor is disposed between the brush body and the swing arm to monitor the force exerted by the brush body on the wafer; an adapter is disposed at the end of the swing arm, a support member is slidably connected to the adapter, and the pressure sensor is disposed between the support member and the adapter; the brush body is capable of rotating along a central axis, and a drive motor for rotating the brush body is disposed on the support member; the pressure sensor is disposed vertically, one end of which is connected to the support member, and the other end of which is connected to the adapter.

2. The wafer post-processing apparatus as described in claim 1, characterized in that, A rotary motor is configured on the outside of the housing. The drive shaft of the rotary motor is connected to the rotating shaft to drive the rotating shaft and its connected components to swing around the central axis.

3. The wafer post-processing apparatus as described in claim 1, characterized in that, A linear module is provided between the support member and the adapter member. The fixed end of the linear module is located on the adapter member, and the movable end of the linear module is connected to the support member.

4. The wafer post-processing apparatus as described in claim 3, characterized in that, The support member is disposed on the side of the adapter, the brush body is disposed adjacent to the swing arm, and the brush body is located on the extension line of the center line of the swing arm.

5. The wafer post-processing apparatus as described in claim 2, characterized in that, It also includes a linear drive module, which is located below the housing; the linear drive module can drive the rotary motor, the shaft and its components to move in the vertical direction.

6. The wafer post-processing apparatus as described in claim 5, characterized in that, The linear drive module is an electric cylinder, which is vertically positioned below the housing; the sliding plate of the electric cylinder is connected to the base of the rotary motor.

7. The wafer post-processing apparatus as described in claim 1, characterized in that, The pressure sensor is located on one side of the center line of the swing arm.

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